Substrate processing equipment

Abstract

To provide a substrate processing device with improved throughput by increasing the number of single wafer chambers arranged while suppressing the size of the device.SOLUTION: In a substrate processing device 1, since single wafer chambers can be stacked vertically, more single wafer chambers can be installed in the substrate processing device even with the same floor space as a conventional device, when a mechanism for loading a substrate W into a single-wafer chamber (drying chamber 37) and a mechanism for loading the substrate W from the drying chamber 37 are provided independently, the structure can be configured such that substrate transportation around the drying chamber 37 is smooth. According to the present invention, the throughput is high despite the small size.SELECTED DRAWING: Figure 1

Description

Technical Field

[0003]

[0001] The present invention relates to a substrate processing apparatus that performs predetermined processing on various substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs.

Background Art

[0002] Conventionally, as this type of apparatus, there is one equipped with a batch module and a single wafer module (see, for example, Patent Document 1). The batch module performs predetermined processing on a plurality of substrates at once. The single wafer module performs predetermined processing on each substrate one by one. The batch module and the single wafer module each have their own advantages. For example, the single wafer module has higher particle performance in the drying process than the batch module. Therefore, as an apparatus equipped with a batch module and a single wafer module, a configuration in which liquid processing is performed in the batch module and then drying processing is performed in the single wafer module is conceivable.

[0003] In the apparatus described in Patent Document 1, single wafer chambers for performing drying processing are arranged in a row in the horizontal direction. After batch processing, the substrate is subjected to drying processing in any one of the plurality of single wafer chambers provided. That is, the substrate after batch processing is transported by a transport mechanism that can move in the arrangement direction of the single wafer chambers and is introduced into a single wafer chamber capable of receiving the substrate. When the batch processing is completed, a plurality of substrates are in a state waiting for drying processing. The single wafer chamber can only perform drying processing on one substrate at a time. Therefore, the apparatus described in Patent Document 1 mounts a plurality of single wafer chambers on the apparatus for the purpose of increasing throughput and performs drying processing on different substrates simultaneously. In the apparatus described in Patent Document 1, in order to quickly finish drying processing on a plurality of substrates, as many single wafer chambers as possible should be arranged in a row in the horizontal direction.

Prior Art Documents

[0004] [Patent Document 1] Special Publication No. 2016-502275 [Overview of the project] [Problems that the invention aims to solve]

[0005] However, conventional devices with such a configuration have the following problems. In other words, in conventional equipment, adding single-wafer chambers increases the size of the equipment. With conventional configurations, if you want to add single-wafer chambers, you have no choice but to arrange them in a single row horizontally, so the length of the substrate processing equipment increases by the number of single-wafer chambers. There is a limit to the length that can be tolerated in a substrate processing equipment. To adhere to that limit, with conventional configurations, the only option is to limit the number of single-wafer chambers. With such equipment, the processing speed of the single-wafer chambers becomes a bottleneck in the overall processing speed of the equipment, resulting in low overall throughput.

[0006] The present invention has been made in view of these circumstances, and aims to provide a substrate processing apparatus with improved throughput by increasing the number of single-wafer chambers while keeping the size of the apparatus down. [Means for solving the problem]

[0007] To achieve these objectives, the present invention adopts the following configuration. A substrate processing apparatus that continuously performs batch processing, which processes multiple substrates at once, and single-wafer processing, which processes substrates one by one, comprising a supply block for supplying multiple substrates, a transfer block adjacent to the supply block, and a processing block adjacent to the transfer block, wherein the supply block unloads multiple substrates arranged horizontally and at predetermined intervals in the vertical direction from a carrier and sends them to the forward substrate transfer position in the transfer block, and the multiple substrates arranged horizontally and at predetermined intervals in the vertical direction are sent to the return substrate transfer position in the transfer block The system includes a batch transport mechanism that receives boards from a board transfer position and stores them in the carrier, and the transfer block includes a first attitude conversion mechanism that holds multiple boards waiting at the forward board transfer position and converts the attitude of the multiple boards from a horizontal attitude to a vertical attitude all at once, and a vertical board support member that holds the multiple boards in a vertical attitude at a vertical board transfer position in the transfer block, and the processing block includes a batch processing area that extends in a direction away from the transfer block with one end adjacent to the transfer block and the other end adjacent to the transfer block The processing block comprises: a single-wafer processing area adjacent to the block, with the other end extending away from the transfer block; a single-wafer substrate transport area interposed between the batch processing area and the single-wafer processing area, with one end adjacent to the transfer block and the other end extending away from the transfer block; and a batch substrate transport area provided along the batch processing area, with one end adjacent to the transfer block and the other end extending away from the transfer block. The batch processing area in the processing block includes a plurality of batches for immersing a plurality of substrates in the direction in which the area extends. A batch processing tank is arranged in a row, and further, at the position furthest from the transfer block, a second orientation conversion mechanism is provided for collectively changing the orientation of multiple substrates from a vertical orientation to a horizontal orientation, and a horizontal substrate support member is provided for holding the multiple substrates in a horizontal orientation at a horizontal substrate transfer position in the batch processing area, and in the single-wafer processing area of ​​the processing block, a plurality of drying chambers for drying the substrates are arranged vertically, and further, a substrate loading mechanism is provided for loading the substrates into the drying chambers before drying, and in the single-wafer processing area of ​​the processing block,A substrate processing apparatus characterized by comprising: a plurality of drying chambers arranged vertically for drying substrates; a substrate loading mechanism for loading substrates into the drying chambers before drying; a single-wafer substrate transport area in the processing block equipped with a single-wafer substrate transfer mechanism for receiving horizontally oriented substrates from a horizontal substrate transfer position and transferring them to the single-wafer processing area; a substrate transport mechanism for transporting dried substrates from the drying chambers to a return-path substrate transfer position in the transfer block; and a batch substrate transport area in the processing block equipped with a vertical substrate transfer position defined within the transfer block and a batch substrate transport mechanism for transporting multiple substrates simultaneously between each of the batch processing tanks and the second orientation conversion mechanism.

[0008] [Function and Effects] According to the invention described in (1) above, multiple substrates are removed in a single batch from a carrier that stores multiple substrates in a horizontal position, and the orientation of the substrates is changed from a horizontal position to a vertical position in a single batch by a first orientation conversion mechanism. Then, while maintaining the vertical position, the multiple substrates are batch processed in a batch processing area. After batch processing, the orientation of the substrates is changed in a single batch by a second orientation conversion mechanism. After that, while maintaining the horizontal position, the substrates are processed one by one in a single-wafer processing area. The single-wafer processing specifically includes substrate drying. The single-wafer substrate processing area of ​​the present invention is equipped with a substrate loading mechanism for transporting wet substrates to be dried into a drying chamber, and a substrate unloading mechanism for unloading the dried substrates from the drying chamber after drying. With this configuration, the loading and unloading of substrates into and out of the drying chamber can be achieved by different mechanisms, so that substrate transport does not become congested around the drying chamber. According to the present invention, the drying chambers are stacked vertically, and the substrate transport around the drying chambers is also configured to be smooth. Therefore, it is possible to provide a substrate processing apparatus that can accommodate many drying chambers in the same floor area as conventional apparatus.

[0009] The present invention also has the following features.

[0010] (2) A substrate processing apparatus according to (1), wherein the substrate loading mechanism receives a substrate from the single-wafer substrate transfer mechanism.

[0011] [Function and Effects] According to the invention of (2) described above, the substrate loading mechanism that loads substrates into the drying chamber receives the substrates from a single-wafer substrate transfer mechanism located in the batch processing area. With this configuration, the substrate loading mechanism can be placed at a location away from the batch processing area. Therefore, according to the invention of (2), multiple laminates of drying chambers can be provided around the substrate loading mechanism, and a substrate processing apparatus with high throughput can be provided.

[0012] (3) A substrate processing apparatus according to (1), wherein the single-wafer processing area is provided with a substrate pre-drying processing chamber for performing pre-drying processing, the single-wafer substrate transfer mechanism sends a substrate to the substrate pre-drying processing chamber, and the substrate loading mechanism receives a substrate from the substrate pre-drying processing chamber.

[0013] [Function and Effects] According to the invention described in (3) above, the single-wafer substrate transfer mechanism sends the substrate to the substrate pre-drying treatment chamber, and the substrate loading mechanism receives the substrate from the substrate pre-drying treatment chamber. With this configuration, there is no need to transfer the substrate between the substrate loading mechanism and the single-wafer substrate transfer mechanism, so a substrate processing apparatus can be provided that can transport the substrate more reliably and reliably perform the pre-treatment of the substrate to be dried.

[0014] (4)(2) The substrate processing apparatus described above, wherein the single-wafer substrate transfer mechanism is composed of a robot that also serves as the substrate unloading mechanism, the single-wafer substrate transfer mechanism has a transfer arm that supports the substrate before drying, and the substrate unloading mechanism has an unloading arm that supports the substrate after drying, and the unloading arm is provided above the transfer arm.

[0015] [Function and Effects] According to the invention described in (4) above, the single-wafer substrate transfer mechanism is composed of a robot that also serves as a substrate unloading mechanism, and the unloading arm that supports the substrate after drying is provided above the transfer arm that supports the substrate before drying. With this configuration, liquid from the transfer arm that transports wet substrates will not drip onto the unloading arm that transports dry substrates and adversely affect the substrates.

[0016] (5) A substrate processing apparatus according to (1), wherein the drying chamber is characterized in that it dries the substrate with a supercritical fluid.

[0017] [Effects] According to the invention described in (5) above, the substrate is dried in a state where the surface tension is 0, so the circuit patterns provided on the substrate surface do not collapse.

[0018] (6)(3) The substrate processing apparatus described above, wherein the substrate pre-drying chamber pre-dries the substrate with isopropyl alcohol.

[0019] [Effects] According to the invention described in (6) above, the substrate drying pretreatment can be reliably performed with isopropyl alcohol.

[0020] (7)(1) A substrate processing apparatus characterized in that the single-wafer processing area in the processing block is provided with a laminate of the drying chamber on both sides of the substrate loading mechanism.

[0021] [Function and Effects] According to the invention described in (7) above, a stack of drying chambers is provided on both sides of the substrate loading mechanism in the single-wafer processing area. With this configuration, the number of drying chambers facing the substrate loading mechanism can be increased, so that drying can be performed on more substrates in parallel. With this configuration, a substrate processing apparatus with high throughput can be provided.

[0022] In the substrate processing apparatus described in (8)(1), in the batch substrate transfer region in the processing block, there are provided a first substrate unloading mechanism for unloading a substrate in the upper layer of the laminate of the drying chamber, and a second substrate unloading mechanism for unloading a substrate in the lower layer of the laminate of the drying chamber. In the transfer block, a first return path substrate transfer position where the first substrate unloading mechanism unloads the substrate is set, and a second return path substrate transfer position where the second substrate unloading mechanism unloads the substrate is set. A substrate processing apparatus characterized by this.

[0023] [Operation and Effect] According to the invention related to (8) described above, there are a plurality of paths for the dried substrate to return to the carrier. The first substrate unloading mechanism and the second substrate unloading mechanism correspond to each of the different paths. The first substrate unloading mechanism performs substrate transfer for the first path, and the second substrate unloading mechanism performs substrate transfer for the second path. With such a configuration, a substrate processing apparatus with high throughput can be provided.

Effect of the Invention

[0024] According to the present invention, it is possible to provide a substrate processing apparatus with improved throughput by increasing the number of single wafer chambers to be arranged while suppressing the size of the apparatus. In the conventional configuration, when trying to add single wafer chambers, there is no choice but to arrange the single wafer chambers in a row horizontally, so the length of the substrate processing apparatus extends by the number of single wafer chambers. In contrast, according to the present invention, since the single wafer chambers can be stacked in the vertical direction, it is possible to provide a substrate processing apparatus equipped with more single wafer chambers even with the same floor area as the conventional apparatus. Furthermore, if the configuration is such that the mechanism for loading the substrate into the single wafer chamber (substrate drying processing chamber) and the mechanism for unloading the substrate from the substrate drying processing chamber are provided independently, the substrate transfer around the drying chamber can be configured to be smooth. According to the present invention, it is possible to provide a substrate processing apparatus that is small and has high throughput.

Brief Explanation of the Drawings

[0025] [Figure 1]This is a plan view illustrating the overall configuration of the substrate processing apparatus according to Example 1. [Figure 2] This is a functional block diagram illustrating the configuration of the batch transport mechanism according to Example 1. [Figure 3] This is a perspective view illustrating the configuration of the bulk gripping hand according to Example 1. [Figure 4] This is a functional block diagram illustrating the configuration of the first attitude change mechanism according to Embodiment 1. [Figure 5] This is a functional block diagram illustrating the configuration of the substrate pickup mechanism according to Example 1. [Figure 6] This is a schematic diagram illustrating the transport of a substrate in the transfer block according to Example 1. [Figure 7] This is a schematic diagram illustrating the transport of a substrate in the transfer block according to Example 1. [Figure 8] This is a schematic diagram illustrating the transport of a substrate in the transfer block according to Example 1. [Figure 9] This is a schematic diagram illustrating the transport of a substrate in the transfer block according to Example 1. [Figure 10] This is a schematic diagram illustrating the transport of a substrate in the transfer block according to Example 1. [Figure 11] This is a schematic diagram illustrating the operation of the substrate pickup mechanism in the transfer block according to Example 1. [Figure 12] This is a perspective view illustrating the operation of the substrate pickup mechanism in the transfer block according to Example 1. [Figure 13] This is a schematic diagram illustrating the operation of the substrate pickup mechanism in the transfer block according to Example 1. [Figure 14] This is a schematic diagram illustrating the transport of a substrate in the transfer block according to Example 1. [Figure 15] This is a schematic diagram illustrating the operation of the substrate pickup mechanism in the transfer block according to Example 1. [Figure 16] This is a schematic diagram illustrating the operation of the pusher mechanism in the transfer block according to Example 1. [Figure 17]This is a perspective view illustrating the configuration of the second attitude change mechanism according to Example 1. [Figure 18] This is a schematic diagram illustrating the operation of the second attitude changing mechanism according to Example 1. [Figure 19] This is a side view illustrating the configuration of the single-wafer processing area according to Example 1. [Figure 20] This is a plan view illustrating the configuration of the drying chamber according to Example 1. [Figure 21] This is a functional block diagram illustrating the configuration of the wet transport mechanism according to Example 1. [Figure 22] This is a functional block diagram illustrating the configuration of the single-wafer substrate transport area according to Example 1. [Figure 23] This is a plan view illustrating the configuration of the substrate loading mechanism according to Example 1. [Figure 24] This is a plan view illustrating the transfer of the substrate according to Example 1. [Figure 25] This is a flowchart illustrating the operation of the substrate processing according to Example 1. [Figure 26] This is a plan view illustrating the flow of the substrate according to Example 1. [Figure 27] This is a plan view illustrating the flow of the substrate according to Example 1. [Figure 28] This is a plan view illustrating the flow of the substrate according to Example 1. [Figure 29] This is a plan view illustrating the overall configuration of the substrate processing apparatus according to Example 2. [Figure 30] This is a side view illustrating the configuration of the single-wafer processing area according to Example 2. [Figure 31] This is a side view illustrating the configuration of the single-wafer substrate transport area according to Example 2. [Figure 32] This is a flowchart illustrating the operation of the substrate processing according to Example 2. [Figure 33] This is a plan view illustrating the flow of the substrate according to Example 2. [Figure 34] This is a plan view illustrating the flow of the substrate according to Example 2. [Figure 35] This is a plan view illustrating the flow of the substrate according to Example 2. [Modes for carrying out the invention]

[0026] The embodiments of the present invention will be described below with reference to the drawings. The substrate processing apparatus of the present invention is an apparatus that performs batch processing, which processes multiple substrates W at once, followed by single-wafer processing, which processes the substrates W one by one. [Examples]

[0027] <1. Overall Structure> As shown in Figure 1, the substrate processing apparatus 1 has blocks separated by partitions. Specifically, the substrate processing apparatus 1 includes an loading / unloading block 3 on which a carrier for storing substrates is placed, a supply block 5 adjacent to the loading / unloading block 3, a transfer block 7 adjacent to the supply block 5, and a processing block 9 adjacent to the transfer block 7. The supply block 5 corresponds to the supply block of the present invention, the transfer block 7 corresponds to the transfer block 7 of the present invention, and the processing block 9 corresponds to the processing block of the present invention.

[0028] The substrate processing apparatus 1 performs predetermined processes on the substrate W, such as chemical treatment, cleaning, and drying. The substrate processing apparatus 1 employs a processing method (a so-called hybrid method) that combines both a batch processing method, which processes multiple substrates W at once, and a single-wafer processing method, which processes substrates W one at a time. The batch processing method is a method for processing multiple substrates W arranged in a vertical position at once. The single-wafer processing method is a method for processing substrates W in a horizontal position one at a time.

[0029] In this specification, for convenience, the direction in which the loading / unloading block 3, supply block 5, transfer block 7, and processing block 9 are arranged is referred to as the "front-to-back direction X". This front-to-back direction X extends horizontally. Within the front-to-back direction X, the direction from the supply block 5 toward the loading / unloading block 3 is referred to as the "front". The direction opposite to the front is referred to as the "rear". The direction perpendicular to the front-to-back direction X is referred to as the "width direction Y". This width direction Y extends horizontally. For convenience, one direction in the width direction Y is referred to as the "right", and the opposite direction is referred to as the "left". For convenience, the direction perpendicular to the front-to-back direction X and the width direction Y (height direction) is referred to as the "vertical direction Z". In each figure, front, rear, right, left, up, and down are indicated as appropriate for reference.

[0030] <2. Loading / Unloading Block> The loading / unloading block 3 includes a carrier holding section 11 that holds a carrier C for storing multiple substrates W arranged vertically at predetermined intervals in a horizontal position. The carrier holding section 11 is provided on the outer wall of the loading / unloading block 3, which extends in the width direction (Y direction). There are two types of carrier holding sections 11: one provided on the right side when viewed from the center of the substrate processing apparatus 1 in the width direction (Y direction), and another provided on the left side. The two carrier holding sections 11 are called a single load port.

[0031] Multiple substrates W (for example, 25) are stacked and stored horizontally in a single carrier C at regular intervals. The carrier C containing the substrates W to be processed, which are to be brought into the substrate processing apparatus 1, is first placed on one of the carrier holding sections 11. The carrier holding section 11 includes, for example, two mounting tables 15 on which the carrier C is placed. The carrier C has multiple horizontally extending grooves (not shown) that accommodate the substrates W with their surfaces separated from each other. The multiple grooves are spaced apart to form a comb-like shape overall. One substrate W is inserted into each of the grooves. As a carrier C, for example, there is a sealed type FOUP (Front Opening Unify Pod). In the present invention, an open type container may be used as the carrier C.

[0032] <3. Supply Block> The supply block 5 has the function of supplying multiple substrates to the subsequent transfer block 7. That is, the supply block 5 is located between the loading / unloading block 3 and the transfer block 7. The supply block 5 has a batch transport mechanism 19 that takes out multiple substrates at once from the carrier C held by the carrier holding part 11 in the loading / unloading block 3 and passes them to the transfer block 7. The support column 81 of the batch transport mechanism 19, which extends in the vertical direction Z, is located at the center of the supply block 5, that is, at the center in both the X and Y directions, and the batch transport hand 71 moves in the up / down, left / right, and front / back directions with respect to this support column 81. The supply block 5 has a space of sufficient size so as not to interfere with the operation of the batch transport hand 71.

[0033] The batch transport mechanism 19 has two functions: to remove multiple substrates W from the carrier C held by the carrier holding section 11 in the loading / unloading block 3 and place them at the forward substrate transfer position P1 of the transfer block 7; and to receive multiple substrates W from the return substrate transfer position P4 of the transfer block 7 and return them to the carrier C held by the carrier holding section 11 in the loading / unloading block 3. The batch transport mechanism 19 transports the multiple substrates W from the carrier C to the forward substrate transfer position P1 while maintaining the relative positions of each substrate W stored in the carrier C. Similarly, the batch transport mechanism 19 transports the multiple substrates W from the return substrate transfer position P4 to the carrier C while maintaining the relative positions of each substrate W arranged at the return substrate transfer position P4. Through this transport by the batch transport mechanism 19, the substrates W to be processed stored in the carrier C are subjected to various processes by the substrate processing device 1 and then returned to the original carrier C. The batch transport mechanism 19 does not necessarily need to have a mechanism to change the orientation of multiple substrates W. In this example, the batch transport mechanism 19 transports multiple substrates W from the carrier C to the forward substrate handover position P1 while maintaining their orientation and arrangement pitch. Therefore, the multiple substrates W are transported by the batch transport mechanism 19 in a horizontal orientation and arranged at full pitch. The same applies to the transport of substrates from the return substrate handover position P4 to the carrier C by the batch transport mechanism 19.

[0034] The configuration of the batch transport mechanism 19 will be explained with reference to Figure 2. Figure 2 is a functional block diagram illustrating the configuration of the batch transport mechanism 19. As shown in Figure 2, the batch transport mechanism 19 has support columns 81 extending in the vertical direction (Z direction) that support each mechanism. The batch transport mechanism 19 is also equipped with a lifting mechanism 82 that can move up and down. The lifting mechanism 82 is supported by the support columns 81 so that it can move up and down. The lifting mechanism 82 supports a rotating member 83 so that it can rotate. The rotating member 83 can rotate around a rotation axis AX3 parallel to the extension direction (Z direction) of the support columns 81 while being supported by the lifting mechanism 82. The rotation axis AX3 is a hypothetical straight line located at the center of the support columns 81.

[0035] The rotating member 83 supports an extendable arm 85a. The arm 85a comprises a first arm 84 connected to the rotating member 83 and a second arm 85 connected to the first arm 84. The connecting portion of the first arm 84 on the rotating member 83 is a projection that extends away from the rotation center of the rotating member 83, and the first arm 84 is configured to extend over this projection. The second arm 85 is configured to extend over the first arm 84. The rotating member 83 supports the first arm 84 so that it is movable in the extension direction of the first arm 84, and the first arm 84 supports the second arm 85 so that it is movable in the extension direction of the second arm 85. Therefore, the arm 85a is extendable in the extension direction of the first arm 84 and the second arm 85.

[0036] The tip of the second arm 85 is equipped with a rotatable direction-changing member 86. The direction-changing member 86 supports a rail 87 that extends horizontally. Therefore, the bulk transport mechanism 19 is configured to change the extension direction of the rail 87 by rotating to change direction. The direction-changing member 86 rotates around a virtual line that is at the center of the direction-changing member 86 and extends vertically (Z direction). This rotation allows the bulk transport hand 71 to be directed either towards the loading / unloading block 3 or towards the transfer block 7.

[0037] The rail 87 supports a bulk transport hand 71 that grips multiple substrates W at once, allowing it to move in the direction of extension of the rail 87. Therefore, the bulk transport hand 71 can move forward and backward along the rail 87. The vertical position of the rail 87 can be changed by the lifting mechanism 82. The horizontal position of the rail 87 can be changed by the arm and the rotating member 83. Therefore, the bulk transport hand 71 can move freely within the space of the supply block 5. The orientation of the rail 87 can be changed by the direction changing member 86. Therefore, the bulk transport hand 71 can move in the forward and backward direction (X direction) at any position within the space of the supply block 5. Therefore, the bulk transport hand 71 can move to the carrier C held by the carrier holding part 11 in the loading / unloading block 3, and by moving forward on the rail 87, the bulk transport hand 71 can move into the interior of the carrier C. Then, by moving backward on the rail 87, the bulk transport hand 71 can remove the multiple substrates W it has gripped from the carrier C. By reversing these operations, the bulk transport hand 71 can return the multiple substrates W it is holding to the carrier C. Although the above example concerned the carrier C, the bulk transport hand 71 can also take out or transfer multiple substrates W at the substrate transfer position using similar operations.

[0038] The following describes the various mechanisms provided in the bulk transport mechanism 19 and the control units that control them. The lifting control unit 82a controls the lifting mechanism 82. The rotation mechanism 83a rotates the rotating member 83 relative to the lifting mechanism 82, and the rotation control unit 83b controls the rotation mechanism 83a. The telescopic mechanism 84a extends and retracts the arm 85a in the extension direction, and the telescopic control unit 84b controls the telescopic mechanism 84a. The direction changing mechanism 86a rotates the direction changing member 86 relative to the second arm 85, and the direction changing control unit 86b controls the direction changing mechanism 86a. The shift mechanism 87a moves the bulk transport hand 71 forward and backward relative to the rail 87, and the shift control unit 87b controls the shift mechanism 87a. The hand drive mechanism 71c is a mechanism that drives the batch transport hand 71 to grip multiple substrates W with the batch transport hand 71, and to release the gripped multiple substrates W. The hand control unit 71d is configured to control the hand drive mechanism 71c.

[0039] Figure 3 illustrates the configuration of the bulk transport hand 71. The bulk transport hand 71 is composed of a pair of hand pieces 71a arranged vertically (Z direction). Each of the pair of hand pieces 71a is connected together to a hand base 71e. The hand base 71e is configured to move back and forth on a rail 87. The number of hand pieces 71a in the bulk transport hand 71 is equal to the number of substrates W stored in the carrier C. Therefore, the bulk transport hand 71 is provided with a total of 25 pairs of hand pieces 71a. In this regard, the number of hand pieces 71a is reduced in Figure 3 for ease of drawing.

[0040] <4. Transfer Block> The transfer block 7 is positioned adjacent to the rear of the supply block 5. The transfer block 7 has a forward board transfer position P1 where the boards W to be processed are placed, and multiple boards W are transported to this position all at once from the supply block 5. The transfer block 7 is equipped with a first attitude change mechanism PCR that can access the forward board transfer position P1, a board pickup mechanism WDB that receives the vertically oriented boards W from the first attitude change mechanism PCR and arranges the boards W at half-pitch, and a pusher mechanism 22 that receives multiple boards W from the board pickup mechanism WDB and transports the multiple boards W to the vertical board transfer position P2.

[0041] Figure 4 illustrates the configuration of the first posture change mechanism PCR in this example. As shown in Figure 4, the first posture change mechanism PCR has a batch hand consisting of a pair of gripping hands 69 that grip the substrate W. The gripping hands 69 are configured to grip the substrate W from both sides, one end and the other, so that even if the batch hand is rotated, multiple substrates W will not slip off the batch hand. The batch hand is configured with a pair of gripping hands 69 arranged vertically (Z direction). Each of the pair of gripping hands 69 is connected collectively to a hand base 69a. The hand base 69a can be rotated -90° and 90° to change the orientation of multiple substrates W, which are in a horizontal position, to a vertical position. The batch hand is provided with a number of gripping hands 69 equal to the number of substrates W stored in the carrier C. Therefore, the batch hand is provided with 25 pairs of gripping hands 69. In this regard, for the sake of ease of drawing, the number of gripping hands 69 has been reduced in Figure 4.

[0042] In addition, the first attitude change mechanism PCR can also move in the width direction (Y direction). That is, the first attitude change mechanism PCR can access the forward substrate transfer position P1 when it is in an attitude that can hold the substrate W in a horizontal position (attitude on the left in Figure 4), and can access the substrate pickup mechanism WDB when it is in an attitude that can hold the substrate W in a vertical position (attitude on the right in Figure 4).

[0043] The following describes the various mechanisms provided in the first posture change mechanism PCR and the control unit that controls them. The batch hand drive mechanism 79a is a mechanism that operates each of the gripping hands 69 together, changing the state of the gripping hands 69 between a gripping state in which multiple substrates W are gripped and a release state in which the multiple substrates W are released. The batch hand control unit 79b controls the batch hand drive mechanism 79a. The hand base rotation mechanism 79c is a mechanism that rotates the hand base 69a. The posture of the multiple substrates is changed from a horizontal posture to a vertical posture by this mechanism. The hand base rotation control unit 79d controls the hand base rotation mechanism 79c.

[0044] Figure 5 illustrates the substrate pickup mechanism WDB in this example. As shown in Figure 5, the substrate pickup mechanism WDB has two support rods 70 extending in the width direction (Y direction). Each support rod 70 is provided with 50 grooves 70c, into which the periphery of the substrate W is fitted. The arrangement pitch of the grooves 70c is half pitch. Half pitch refers to half the arrangement pitch (full pitch) of the substrates W in multiple substrates W housed in the carrier C. In Figure 5, one groove 70c on each of the two support rods 70 is highlighted. The grooves 70c on one support rod 70 correspond to the grooves 70c on the paired support rods 70, and a pair of grooves 70c are configured to clamp a single substrate W. The clamped substrate W has its front and back surfaces perpendicular to the width direction (Y direction). Therefore, the distance from the groove 70c into which one end of the substrate W is fitted to the support body 70a that supports the support rod 70 is equal to the distance from the groove 70c into which the other end of the substrate W is fitted to the support body 70a. Furthermore, the pair of support rods 70 can extend and retract by a distance equivalent to half a pitch without changing the direction in which the substrate W being clamped faces. In addition, the support body 70a itself can move up and down. The pair of support rods 70 and the substrate W clamped between the support rods 70 move up and down in conjunction with the up and down movement of the support body 70a.

[0045] The following describes the various mechanisms provided in the substrate pickup mechanism WDB and the control units that control them. The support lifting mechanism 90a is a mechanism that moves the support 70a up and down in the Z direction. The support lifting control unit 90b controls the support lifting mechanism 90a. The support rod extension mechanism 90c is a mechanism that extends and retracts the support rod 70. The support rod extension control unit 90d controls the support rod extension mechanism 90c.

[0046] Based on Figures 6 to 16, the process of transferring multiple substrates W within the transfer block 7 will be explained. Figure 6 shows multiple substrates W being held by the bulk transfer hand 71 of the bulk transfer mechanism 19 in the supply block 5. At this time, the arrangement pitch of the substrates W is full pitch. This arrangement pitch is the same as the arrangement pitch when the multiple substrates W were stored in the carrier C. Subsequently, as shown in Figure 7, the bulk transfer mechanism 19 transports the held multiple substrates W to the forward substrate transfer position P1 in the transfer block 7. The forward substrate transfer position P1 is provided with a path that can hold 25 substrates W at once. Figure 8 shows the multiple substrates W being transferred to the forward substrate transfer position P1 by the bulk transfer mechanism 19.

[0047] Figure 9 shows the first attitude change mechanism PCR receiving multiple substrates W from the path at the forward substrate transfer position P1. Figure 10 shows the state when the first attitude change mechanism PCR moves away from the forward substrate transfer position P1 in the width direction (Y direction) from the state in Figure 9. When the first attitude change mechanism PCR moves away from the forward substrate transfer position P1 while holding multiple substrates W in this way, the hand base 69a of the first attitude change mechanism PCR becomes able to rotate by 90°.

[0048] When the hand base 69a rotates 90°, the batch hand and the multiple substrates W also rotate 90° as shown in Figure 11(a). As a result, the orientation of the multiple substrates W, which was previously in a horizontal position, becomes vertical. At this time, the support rod 70 of the substrate pickup mechanism WDB is located below the batch hand of the first orientation conversion mechanism PCR.

[0049] Figure 11(b) shows the state when the support 70a in the substrate pickup mechanism WDB is raised. When the support 70a rises from the state in Figure 11(a), the pair of support rods 70 also rise along with it. The distance between the support rods 70 in the front-rear direction (X direction) is made sufficiently larger than the width of the gripping hand 69 of the first attitude changing mechanism PCR. Therefore, the gripping hand 69 passes through the gap between the pair of support rods 70 and does not collide with the support rods 70. However, the distance between the support rods 70 in the front-rear direction (X direction) is made sufficiently smaller than the diameter of the substrate W. Therefore, the pair of support rods 70 that have passed through the gripping hand 69 each come into contact with different ends of the multiple substrates W. At this time, the periphery of the substrate W is fitted into the groove 70c provided in the support rods 70.

[0050] Figure 12 shows the state when multiple substrates W, which are in a vertical position and supported by the gripping hand 69 of the first posture changing mechanism PCR, come into contact with a pair of support rods 70. If the gripping hand 69 is released from its gripping state at this time, the multiple substrates W are transferred all at once from the first posture changing mechanism PCR to the substrate pickup mechanism WDB.

[0051] Figure 13(a) shows the state when the support 70a in the substrate pickup mechanism WDB rises further from the state shown in Figure 12. Considering that the first posture change mechanism PCR passed multiple substrates W with a full-pitch arrangement to the substrate pickup mechanism WDB, multiple substrates W are arranged on the pair of support rods 70 with a full pitch. Since the pair of support rods 70 in the substrate pickup mechanism WDB are provided with 50 grooves 70c at half pitch, the pair of support rods 70 have alternating arrangements of grooves 70c into which substrates W are fitted and empty grooves 70c that do not contain substrates W.

[0052] Figure 13(b) shows the state when the pair of support rods 70 are extended by a distance equivalent to half a pitch relative to the support 70a of the substrate pickup mechanism WDB, from the state shown in Figure 13(a). This movement causes the grooves 70c provided on the pair of support rods 70 and the gripping hand 69 of the first attitude change mechanism PCR to shift by a distance equivalent to half a pitch. In this state, the gripping hand 69 of the first attitude change mechanism PCR returns to the state shown in Figure 6 by moving in the width direction (Y direction) and rotating by 90°. The support 70a of the substrate pickup mechanism WDB then returns to the position shown in Figure 6 while supporting the multiple substrates W in a vertical position. The batch transport mechanism 19 then takes the multiple substrates W from a carrier C different from the carrier C that housed the multiple substrates W supported by the substrate pickup mechanism WDB and transports them to the forward substrate transfer position P1. Figure 14 shows how the gripping hand 69 of the first attitude change mechanism PCR supports multiple substrates W that were located at the forward substrate transfer position P1.

[0053] When the hand base 69a in the state shown in Figure 14 rotates 90° in the opposite direction to the rotation described in Figure 11(a), the batch hand and the multiple substrates W rotate -90° accordingly. As a result, the orientation of the multiple substrates W, which was horizontal, becomes vertical. At this time, the support rod 70 of the substrate pickup mechanism WDB is positioned below the batch hand of the first orientation conversion mechanism PCR while holding the multiple substrates W.

[0054] In this state, when the support 70a of the substrate pickup mechanism WDB rises, as shown in Figure 15(a), the multiple substrates W held by the gripping hand 69 of the first attitude change mechanism PCR fit into the empty grooves 70c located on the support rod 70 of the substrate pickup mechanism WDB. This is because the support 70a of the substrate pickup mechanism WDB and the gripping hand 69 of the first attitude change mechanism PCR are offset by a distance equivalent to half a pitch. If the gripping hand 69, which was in a gripping state at this time, is released, the multiple substrates W are transferred from the first attitude change mechanism PCR to the substrate pickup mechanism WDB all at once.

[0055] Figure 15(b) shows the state after the gripping hand 69 of the first attitude change mechanism PCR moves upward and separates from the substrate pickup mechanism WDB from the state shown in Figure 15(a). As can be seen from this figure, multiple substrates W are arranged in the substrate pickup mechanism WDB at half-pitch. The substrate pickup mechanism WDB has substrates W for two carriers (50 substrates W) arranged in it. This arrangement operation of substrates W is called batch assembly. The arrangement of substrates W at this time is a face-to-back method in which the device side on the substrate W and the back side of the adjacent substrate W (the back side relative to the device side on the adjacent substrate W) face each other. After that, the gripping hand 69 of the first attitude change mechanism PCR retracts from the top of the substrate pickup mechanism WDB and returns to its original position as shown in Figure 6.

[0056] Figure 16(a) shows the pusher mechanism 22 located further below the support 70a of the substrate pickup mechanism WDB shown in Figure 6. The pusher mechanism 22 is equipped with a pusher having parallel grooves arranged at half-pitch on its upper surface, and the pusher can move up and down. Figure 16(b) shows the state when the pusher in the pusher mechanism 22 is raised. When the pusher rises from the state in Figure 16(a), the pusher approaches the support rod 70. The distance between the support rods 70 of the substrate pickup mechanism WDB in the front-rear direction (X direction) is sufficiently larger than the width of the pusher in the pusher mechanism 22. Therefore, the pusher passes through the gap between the pair of support rods 70 and does not collide with the support rods 70. As the pusher is raised further, the multiple substrates W that were positioned in the grooves 70c of the support rod 70 fit into the multiple grooves engraved on the pusher and move away from the substrate pickup mechanism WDB together with the pusher. The pusher then rises further, transporting the multiple substrates W to the vertical substrate transfer position P2 set in the transfer block 7. The pusher mechanism 22 corresponds to the vertical substrate support member of the present invention. In this example, the pusher mechanism 22 is configured to move the pusher up and down, but the pusher may be made movable in the front-to-back direction (X direction) in addition to the up-and-down direction (Z direction), and the vertical substrate transfer position P2 may be set at different positions in the front-to-back direction (X direction) from the substrate pickup mechanism WDB.

[0057] <5. Processing Block> Processing block 9 performs various processes on multiple substrates W. Processing block 9 is divided into batch processing area R1, single-wafer processing area R2, single-wafer substrate transport area R3, and batch substrate transport area R4, each extending in the front-to-back direction (X direction). In detail, batch processing area R1 is located on the left side of processing block 9. Single-wafer processing area R2 is located on the right side of processing block 9. Single-wafer substrate transport area R3 is located between batch processing area R1 and single-wafer processing area R2, that is, in the center of processing block 9. Batch substrate transport area R4 is located on the far left of processing block 9.

[0058] <5.1. Batch Processing Area> The batch processing area R1 in processing block 9 is a rectangular area extending in the front-to-back direction (X direction). One end of the batch processing area R1 (the front side) is adjacent to the transfer block 7. The other end of the batch processing area R1 extends away from the transfer block 7 (towards the rear).

[0059] The batch processing area R1 is equipped with a batch processing unit that primarily performs batch processing. Specifically, the batch processing area R1 has multiple batch processing units BPU1 to BPU3 arranged in the direction in which the batch processing area R1 extends, which are used to immerse multiple substrates W at once. The first batch processing unit BPU1 is adjacent to the transfer block 7 from the rear. The second batch processing unit BPU2 is adjacent to the first batch processing unit BPU1 from the rear. The third batch processing unit BPU3 is adjacent to the second batch processing unit BPU2 from the rear. Furthermore, a posture conversion unit VHU is provided at the position furthest from the transfer block 7 than the batch processing units BPU1 to BPU3, which converts the posture of multiple substrates W that are in a vertical position to a horizontal position at once. Thus, the first batch processing unit BPU1, the second batch processing unit BPU2, the third batch processing unit BPU3, and the posture conversion unit VHU are arranged in this order in the direction in which the batch processing area R1 extends (X direction).

[0060] The first batch processing unit BPU1 specifically comprises a batch chemical treatment tank CHB1 for treating a lot (a set of 50 substrates W arranged in half-pitch) with a chemical solution all at once, and a lifter LF1 for raising and lowering the lot. The batch chemical treatment tank CHB1 performs an acid treatment on the lot. Specifically, the acid treatment may be phosphoric acid treatment, but other acids may also be used. The phosphoric acid treatment etches the multiple substrates W that make up the lot. The etching treatment, for example, chemically engraves the nitride film on the surface of the substrates W.

[0061] The first batch chemical treatment tank CHB1 contains chemical solutions such as phosphoric acid solution. The batch chemical treatment tank CHB1 supplies the chemical solution, for example, from below upwards to create convection within the tank. The lifter LF1 is movable up and down in the vertical direction (Z direction). Specifically, the lifter LF1 moves up and down between a treatment position located inside the batch chemical treatment tank CHB1 and a transfer position located above the batch chemical treatment tank CHB1. The lifter LF1 holds a lot composed of vertical substrates W. At the transfer position, the lifter LF1 transfers the lot to the transport mechanism WTR. When the lifter LF1 lowers from the transfer position to the treatment position while holding the lot, the entire substrate W is located below the liquid surface of the chemical solution. When the lifter LF1 rises from the treatment position to the transfer position while holding the lot, the entire substrate W is located above the liquid surface of the chemical solution.

[0062] The second batch processing unit BPU2 specifically comprises a batch chemical treatment tank CHB2 and a lifter LF2 for raising and lowering the lot. The batch chemical treatment tank CHB2 has the same configuration as the batch chemical treatment tank CHB1 described above. That is, the batch chemical treatment tank CHB2 contains the chemical solution described above and is equipped with a lifter LF2 that moves up and down between the processing position and the transfer position. The batch chemical treatment tank CHB2 performs the same processing on the lot as the batch chemical treatment tank CHB1. The substrate processing apparatus 1 in this example is equipped with multiple processing tanks capable of performing the same chemical treatment. This is because phosphoric acid treatment takes longer than other treatments. Phosphoric acid treatment takes a long time (for example, 60 minutes). Therefore, the apparatus in this example is designed so that acid treatment can be performed in parallel using multiple batch chemical treatment tanks. Accordingly, the lot to be processed is acid-treated in either the batch chemical treatment tank CHB1 or the batch chemical treatment tank CHB2. This configuration increases the throughput of the apparatus.

[0063] The third batch processing unit BPU3 specifically comprises a batch rinsing tank ONB for containing the rinsing solution and a lifter LF3 for raising and lowering the batch. The batch rinsing tank ONB has the same configuration as the batch chemical treatment tank CHB1 described above. In other words, the batch rinsing tank ONB contains the rinsing solution and is equipped with a lifter LF3. Unlike the other treatment tanks, the batch rinsing tank ONB contains pure water and is provided for the purpose of washing the chemical solution adhering to multiple substrates W. In the batch rinsing tank ONB, the chemical treatment is completed when the resistivity of the pure water in the tank rises to a predetermined value.

[0064] Thus, in Example 1, batch chemical treatment tanks CHB1 and CHB2 are located closer to the transfer block 7 than the batch rinsing tank ONB.

[0065] The attitude change unit VHU includes a VHU pusher mechanism 23 that receives a lot of substrates W in a vertical orientation from the transport mechanism WTR, and a second attitude change mechanism 20 that receives the lot from the VHU pusher mechanism 23 and changes the orientation of multiple substrates W from a vertical orientation to a horizontal orientation.

[0066] The VHU pusher mechanism 23 has the same configuration as the pusher mechanism 22 described above and includes a pusher that moves up and down. The pusher has 50 grooves arranged in parallel at half-pitch. The transport mechanism WTR can insert one substrate W into each of the grooves provided in the pusher.

[0067] Figure 17 illustrates the second attitude change mechanism 20 of this example. The second attitude change mechanism 20 comprises a pair of horizontal holding parts 20B extending in the vertical direction (Z direction) and a pair of vertical holding parts 20C extending in the same direction. The support base 20A has a support surface that extends in the XY plane and supports the horizontal holding parts 20B and the vertical holding parts 20C. The rotation drive mechanism 20D is configured to rotate the support base 20A by 90°. As the support base 20A rotates, the horizontal holding parts 20B and the vertical holding parts 20C also rotate by 90° to become members extending in the horizontal direction. Figure 18 is a schematic diagram illustrating the operation of the second attitude change mechanism 20. Hereafter, the configuration of each part will be described with reference to Figures 17 and 18.

[0068] The horizontal support section 20B supports multiple substrates W in a horizontal position from below. Specifically, the horizontal support section 20B has a comb-like structure with multiple recesses corresponding to the substrates W being supported. These recesses are parallel to each other and have an elongated structure where the peripheral edges of the substrates W are located. Furthermore, these recesses are arranged at half-pitch intervals.

[0069] The vertical support section 20C supports multiple substrates W in a vertical position. Specifically, the vertical support section 20C has a comb-shaped structure with multiple V-grooves corresponding to the substrates W to be supported. These V-grooves are parallel to each other and have an elongated structure into which the peripheral edges of the substrates W are fitted. Furthermore, these V-grooves are arranged at a hazel pitch.

[0070] A pair of horizontal holding parts 20B and a pair of vertical holding parts 20C, extending in the vertical direction (Z direction), are provided along a virtual circle corresponding to the horizontal orientation of the substrate W to be held, surrounding the substrate W to be held. The pair of horizontal holding parts 20B are spaced apart by the diameter of the substrate W and hold one end of the substrate W and the other end furthest from that end. In this way, the pair of horizontal holding parts 20B support the substrate W in a horizontal orientation. On the other hand, the pair of vertical holding parts 20C are spaced apart by a distance shorter than the diameter of the substrate W and support a predetermined part of the substrate W and a specific part located near that predetermined part. In this way, the pair of vertical holding parts 20C support the substrate in a vertical orientation. The pair of horizontal holding parts 20B are in the same position in the left-right direction (Y direction), and the pair of vertical holding parts 20C are also in the same position in the left-right direction (Y direction). The pair of vertical holding parts 20C are provided on the side of the support base 20A that rotates and falls over (left direction) that is closer to the horizontal holding parts 20B.

[0071] The rotational drive mechanism 20D supports the support base 20A so that it can rotate at least 90° around a horizontal axis AX2 extending in the front-rear direction (X direction). When the vertical support base 20A rotates 90°, the support base 20A becomes horizontal, and the orientation of the multiple substrates W located on the support base 20A is changed from a vertical orientation to a horizontal orientation.

[0072] The operation of the second attitude change mechanism 20 and the VHU pusher mechanism 23 will be explained with reference to Figure 18. Figure 18(a) shows the state in which the transport mechanism WTR has passed the lot to the VHU pusher mechanism 23. At this time, the vertical support base 20A of the second attitude change mechanism 20 has a horizontally extending vertical holding part 20C, and the horizontal holding part 20B and the vertical holding part 20C are located below the pusher of the VHU pusher mechanism 23. In this state, when the pusher of the VHU pusher mechanism 23 descends, each vertically oriented substrate W that was held on the pusher fits into each V groove provided in the vertical holding part 20C. In this way, multiple substrates W are passed from the VHU pusher mechanism 23 to the second attitude change mechanism 20. Figure 18(b) shows how the multiple substrates W are supported by the vertical holding part 20C of the second attitude change mechanism 20.

[0073] When the support base 20A rotates 90° from the state shown in Figure 18(b), the support base 20A becomes horizontal, and consequently, the vertical holding part 20C extends vertically. As a result, each substrate W fitted into each V-groove of the vertical holding part 20C rotates 90° while maintaining its relative position. Figure 18(c) shows how multiple substrates W are supported by a pair of horizontal holding parts 20B located on the horizontally positioned support base 20A. Figure 18(c) also shows how the second attitude change mechanism 20 has multiple substrates W waiting at the horizontal substrate transfer position P3. The horizontal substrate transfer position P3 is the position where the first robot CR1, described later, receives the substrates W in the horizontal position.

[0074] <5.2. Single-wafer processing area> The single-wafer processing area R2 in processing block 9 is a rectangular area extending in the front-to-back direction (X direction). One end (front side) of the single-wafer processing area R2 is adjacent to the transfer block 7. The other end of the single-wafer processing area R2 extends away from the transfer block 7 (rear side).

[0075] The single-wafer processing area R2 in processing block 9 is equipped with a drying chamber 37 mainly for drying and a wet transport mechanism WR for transporting substrates W (in a horizontal position) to each of the drying chambers 37 before drying. First, the positional relationship between the wet transport mechanism WR and the drying chambers 37 will be explained with reference to Figure 1. As can be seen from Figure 1, the drying chamber 37 is located adjacent to the transfer block 7 in the single-wafer processing area R2, and the wet transport mechanism WR is located adjacent to the rear of the drying chamber 37. Furthermore, another drying chamber 37 is provided in the single-wafer processing area R2. This drying chamber 37 is located adjacent to the rear of the wet transport mechanism WR. Therefore, the wet transport mechanism WR is positioned between the two drying chambers 37. The wet transport mechanism WR has access to these drying chambers 37.

[0076] The drying chamber 37 will now be described. The drying chamber 37 is a supercritical fluid chamber, and specifically, it dries the substrate W using carbon dioxide that has become a supercritical fluid. Substances other than carbon dioxide may be used as the supercritical fluid. The supercritical state is obtained by placing carbon dioxide under specific critical pressure and critical temperature. The specific pressure is 7.38 MPa and the temperature is 31°C. In the supercritical state, the surface tension of the fluid becomes zero, so the circuit pattern on the substrate surface is not affected by the gas-liquid interface. Therefore, by drying the substrate W with a supercritical fluid, it is possible to prevent the collapse of the circuit pattern on the substrate, so-called pattern collapse.

[0077] The configuration of the drying chamber 37 will be further described. As shown in Figure 1, the drying chamber 37 has an inlet 37a for introducing the substrate W into the chamber and an outlet 37b for discharging the substrate W out of the chamber. The inlet 37a is provided on the side wall of the drying chamber 37 facing the wet transport mechanism WR. The outlet 37b is provided on the side wall of the drying chamber 37 facing the single-wafer substrate transport area R3. Both the inlet 37a and the outlet 37b are provided with shutters that can close the passage openings of the substrate W, and during the substrate drying process, each shutter closes the corresponding passage opening.

[0078] Inside the drying chamber 37 is a circular support member 37c that supports the substrate W via pins 37d that the substrate W contacts. The support member 37c has three pins 37d, which contact three different points on the periphery of the substrate W introduced into the drying chamber 37. In this way, the substrate W is supported at three points inside the drying chamber 37. When the drying chamber 37 dries the substrate W, a supercritical fluid is generated inside the chamber. The drying chamber 37 is configured to have sufficient pressure resistance to create a critical pressure inside the chamber.

[0079] Figure 19 is a side view of the single-wafer processing area R2 as seen from the single-wafer substrate transport area R3. The single-wafer processing area R2 is provided with two laminates, each consisting of three drying chambers 37 stacked on top of each other. The wet transport mechanism WR is positioned between the two laminates and can transport substrates W into each of the drying chambers 37 that make up each laminate. The substrates W are transported through the entrance 37a provided in the drying chamber 37.

[0080] A wet substrate transport region is provided between the two laminates to ensure the range of motion of the wet transport mechanism WR. The wet transport mechanism WR is configured to move within this transport region.

[0081] Figure 20(a) shows the wet transport mechanism WR transporting a substrate W to be dried into the drying chamber 37. As shown in Figure 20, the wet transport mechanism WR is equipped with a pair of wet arms 74 for gripping the substrate W before drying. The wet arms 74 can enter the chamber through the entrance 37a of the drying chamber 37 while gripping the substrate W, and are configured to pass the substrate W to the support member 37c. The wet arm base 74a is configured to support the pair of wet arms 74.

[0082] As can be seen in Figure 20(a), the pin 37d on the support member 37c is positioned to avoid the wet arm 74. Therefore, the pin 37d will not collide with the wet arm 74 when it comes to pass the substrate W inside the chamber.

[0083] The wet transport mechanism WR related to the wet arm 74 is provided for the purpose of transporting the substrate W into the drying chamber 37 before drying. Therefore, the substrate processing apparatus 1 in this example has a different mechanism from the wet transport mechanism WR which is intended for transporting the substrate W out of the drying chamber 37 after drying. The position of the pin 37d on the support member 37c is optimized for transporting the substrate W by the wet arm 74, so when transporting the substrate W out of the chamber after drying, there is a possibility that the arm holding the substrate W will collide with the pin 37d. In the apparatus in this example, as shown in Figure 20(b), a support member rotation mechanism 36a that rotates the support member 37c and a support member rotation control unit 36b that controls the support member rotation mechanism 36a are provided so that the substrate W can be reliably transported out of the chamber. When the support member 37c is rotated by the support member rotation mechanism 36a, the pin 37d on the support member 37c moves around the center of the circular support member 37c. Therefore, when the substrate W is removed from the chamber, the pins 37d can be moved to a position that does not obstruct the removal.

[0084] Figure 21 is a functional block diagram illustrating the configuration of the wet transport mechanism WR. The wet transport mechanism WR is a mechanism that receives substrates W before drying from the single-wafer substrate transport area R3 (described later) and passes them to the drying chamber 37. As shown in Figure 21, the wet transport mechanism WR has WR support columns 101 that extend vertically (Z direction) and support each mechanism. The wet transport mechanism WR also includes a WR lifting mechanism 102 that can move up and down. The WR lifting mechanism 102 is supported by the WR support columns 101 so that it can move up and down. The WR lifting mechanism 102 rotatably supports the WR rotating member 183. The WR rotating member 183 is rotatable around a rotation axis AX4 parallel to the extension direction (Z direction) of the WR support columns 101 while supported by the WR lifting mechanism 102. The rotation axis AX4 is a hypothetical straight line located at the center of the WR support columns 101.

[0085] The wet conveying mechanism WR supports a retractable WR arm 185a. The WR arm 185a has a first arm 184 connected to the WR rotating member 183 and a base (second arm) 74a connected to the first arm 184. The connection portion of the first arm 184 on the WR rotating member 183 is a projection that extends away from the rotation center of the WR rotating member 183, and the first arm 184 is configured to extend over this projection. The wet arm base 74a is configured to extend over the first arm 184. The WR rotating member 183 supports the first arm 184 so that it is movable in the extension direction of the first arm 184, and the first arm 184 supports the wet arm base 74a so that it is movable in the extension direction of the wet arm base 74a. Therefore, the WR arm 185a is extendable and retractable in the extension direction of the first arm 184 and the wet arm base 74a.

[0086] The following describes the various mechanisms provided in the wet transport mechanism WR and the control units that control them. The WR lifting control unit 182a controls the WR lifting mechanism 102. The WR rotation mechanism 183a rotates the WR rotation member 183 relative to the WR lifting mechanism 102, and the WR rotation control unit 183b controls the WR rotation mechanism 183a. The telescopic mechanism 184a extends and retracts the WR arm 185a in the extension direction, and the telescopic control unit 184b controls the telescopic mechanism 184a. The WR hand drive mechanism 171c drives the wet arm 74 to grip a single substrate W in a horizontal position or to release the substrate W from gripping. The hand control unit 171d controls the WR hand drive mechanism 171c.

[0087] Thus, the wet transport mechanism WR in this example simplifies the aforementioned bulk transport mechanism 19 by omitting the rail 87, the direction changing member 86, and the various mechanisms and control units related to its operation. The present invention is not limited to this configuration, and may also include these members and the various mechanisms and control units related thereto.

[0088] The wet transport mechanism WR is configured to be able to access any of the six drying chambers 37 that make up the stack of chambers located on its left and right sides, and to be able to load the substrate W to be dried into any of the drying chambers 37.

[0089] <5.3. Single-wafer substrate transport area> The single-wafer substrate transport area R3 in processing block 9 is a rectangular area extending in the front-to-back direction (X direction). The single-wafer substrate transport area R3 is interposed between the batch processing area R1 and the single-wafer processing area R2, with one end adjacent to the transfer block 7 and the other end extending away from the transfer block 7.

[0090] As shown in Figure 22, the single-wafer substrate transport area R3 includes a first robot CR1 that can access the second attitude change mechanism 20 located at the horizontal substrate transfer position P3 in the batch processing area R1, and a second robot CR2 located above the first robot CR1.

[0091] The single-wafer substrate transport area R3 is divided into upper and lower sections by a partition wall. The first robot CR1 is located in the lower section, and the second robot is located in the upper section. In this way, the first robot CR1 and the second robot CR2 are located in different sections, so that one robot does not interfere with the substrate transport of the other robot.

[0092] The configuration of the lower section in the single-wafer substrate transport area R3 will now be described. This section faces the second attitude change mechanism 20 located at the horizontal substrate transfer position P3 in the batch processing area R1, the lowest drying chamber 37 (more specifically, the discharge port 37b of the chamber) among the drying chambers 37 that constitute the laminate, the wet transport mechanism WR, and the return-path substrate transfer position (more precisely, the first return-path substrate transfer position P4a). The first robot CR1 transports the substrate W between the second attitude change mechanism 20 at the horizontal substrate transfer position P3, the lowest drying chamber 37, the wet transport mechanism WR, and the first return-path substrate transfer position P4a in the transfer block 7. The first return-path substrate transfer position P4a, like the forward-path substrate transfer position P1, is a path capable of holding multiple substrates W at full pitch. The first return-path substrate transfer position P4a is located below the forward-path substrate transfer position P1.

[0093] The first robot CR1 is equipped with a CR wet arm 72 that supports the substrate W (horizontal orientation) before drying and a dry arm 73a that grips the substrate W (horizontal orientation) after drying. The CR wet arm 72 and dry arm 73a are mounted on a single robot, and the CR wet arm 72 is always positioned below the dry arm 73a. This configuration prevents the CR wet arm 72, which supports the wet substrate W, from dripping liquid onto the dry arm 73a, ensuring that the dry state of the dry arm 73a is reliably maintained. The first robot CR1 uses the CR wet arm 72 when transporting the substrate W from the second orientation change mechanism 20 at the horizontal substrate transfer position P3 to the wet transport mechanism WR. The first robot CR1 uses the dry arm 73a when transporting the substrate W from the lowest drying chamber 37 to the first return-path substrate transfer position P4a.

[0094] A robot guide rail 97a is provided on the floor surface of the lower section in the single-wafer substrate transport area R3, which can guide the first robot CR1. Since this rail extends in the front-to-back direction (X direction), the first robot CR1 can also move along it in the front-to-back direction (X direction).

[0095] The following describes each mechanism and control unit of the first robot CR1. The dry arm drive mechanism 92a is a mechanism that drives the dry arm 73a, and the dry arm drive control unit 92b controls the dry arm drive mechanism 92a. The CR wet arm drive mechanism 93a is a mechanism that drives the CR wet arm 72, and the CR wet arm drive control unit 93b controls the CR wet arm drive mechanism 93a. The slide mechanism 94a is a mechanism that moves the first robot CR1 along the robot guide rail 97a, and the slide control unit 94b controls the slide mechanism 94a.

[0096] The configuration of the upper section in the single-wafer substrate transport area R3 will now be described. This section faces the uppermost and middle drying chambers 37 (more specifically, the exit port 37b of the chamber) of the drying chambers 37 that make up the laminate, and faces the return substrate transfer position (more precisely, the second return substrate transfer position P4b). The second robot CR2 transports the substrate W between the drying chamber 37 located in the uppermost or middle layer and the second return substrate transfer position P4b in the transfer block 7. The second return substrate transfer position P4b, like the forward substrate transfer position P1, is a path capable of holding multiple substrates W at full pitch. The second return substrate transfer position P4b is located above the forward substrate transfer position P1.

[0097] The second robot CR2 is equipped with a dry arm 73b for gripping the substrate W (in a horizontal position) after drying. A robot guide rail 97b is provided on the floor surface of the upper section of the single-wafer substrate transport area R3, which can guide the second robot CR2. Since this rail extends in the front-rear direction (X direction), the second robot CR2 can also move along it in the front-rear direction (X direction).

[0098] The following describes each mechanism and control unit of the second robot CR2. The dry arm drive mechanism 95a is a mechanism that drives the dry arm 73b, and the dry arm drive control unit 95b controls the dry arm drive mechanism 95a. The slide mechanism 96a is a mechanism that moves the second robot CR2 along the robot guide rail 97b, and the slide control unit 96b controls the slide mechanism 96a.

[0099] Figure 23 shows the first robot CR1 unloading the substrate W after drying from the lowest drying chamber 37. The dry arm 73a is able to enter the chamber through the outlet 37b in the drying chamber 37 and is configured to acquire the substrate W from the support member 37c. The base 73m supports a pair of dry arms 73a.

[0100] As can be seen in Figure 23, the pin 37d on the support member 37c is positioned to avoid the dry arm 73a. Therefore, the pin 37d will not collide with the dry arm 73a when it comes to acquire the substrate W inside the chamber. Furthermore, since the pin 37d can be rotated by the support member rotation mechanism 36a, if the pin 37d is in a position where it would collide with the dry arm 73a, the position of the pin 37d can be appropriately changed before introducing the dry arm 73a to the discharge port 37b to prevent the pin 37d from colliding with the dry arm 73a.

[0101] Figure 23 also illustrates the CR wet arm 72 provided on the first robot CR1. The CR wet arm 72 can rotate relative to the dry arm 73a by the CR wet arm drive mechanism 93a. In Figure 23, the CR wet arm 72 is rotated 90° relative to the dry arm 73a so as not to interfere with the transport of the substrate W by the dry arm 73a.

[0102] Figure 24(a) illustrates the case where the CR wet arm 72, provided on the first robot CR1, is in a position overlapping with the dry arm 73a. While the dry arm 73a is configured to grip both ends of the substrate W, the CR wet arm 72 is a single plate-shaped structure. Therefore, the substrate W is transported while resting on the CR wet arm 72.

[0103] Figure 24(b) illustrates the process when the first robot CR1 is transferring a substrate W to the wet transport mechanism WR for drying. The CR wet arm 72 has tabs 72a at three locations on its plate-shaped component. The tabs 72a are configured to temporarily fix the peripheral edge of the substrate W when the CR wet arm 72 is transporting the substrate W. When the substrate W is transferred from the first robot CR1 to the wet transport mechanism WR, the CR wet arm 72 holding the substrate W is positioned in a space surrounded by a pair of wet arms 74. In this state, the wet transport mechanism WR grips the substrate W, and the CR wet arm 72 releases its grip on the substrate W. The substrate W is then transferred from the first robot CR1 to the wet transport mechanism WR.

[0104] Figure 24(b) also illustrates the dry arm 73a provided on the first robot CR1. The dry arm 73a can rotate relative to the CR wet arm 72 by the dry arm drive mechanism 92a. In Figure 24(b), the dry arm 73a is rotated 90° relative to the CR wet arm 72 so as not to interfere with the transport of the substrate W by the CR wet arm 72.

[0105] Figure 23 describes the first robot CR1, and therefore has a configuration with a CR wet arm 72. When the second robot CR2 unloads the substrate W after drying from the top layer or middle layer drying chamber 37, the second robot CR2, which does not have a CR wet arm 72, uses a dry arm 73b to unload the substrate W after drying from the drying chamber 37. In other words, the second robot CR2 differs from the first robot CR1 in that it does not have a CR wet arm 72, but the operation of the dry arm 73b is the same as that of the dry arm 73a in the first robot CR1. Also, the way the pin 37d in the top layer or middle layer drying chamber 37 rotates to avoid the dry arm 73b is the same as that of the bottom layer drying chamber 37.

[0106] <5.4. Batch substrate transport area> The batch substrate transport area R4 in processing block 9 is a rectangular area extending in the front-to-back direction (X direction). The batch substrate transport area R4 is provided along the outer edge of the batch processing area R1, with one end extending to the transfer block 7 and the other end extending away from the transfer block 7.

[0107] The batch substrate transport area R4 is provided with a transport mechanism WTR that transports multiple substrates W (vertical orientation) in a single unit. The transport mechanism WTR transports multiple substrates W (lots) arranged at half-pitch between the vertical substrate transfer position P2 defined within the transfer block 7, each batch processing unit BPU1 to BPU3, and the orientation conversion unit VHU. The transport mechanism WTR is configured to reciprocate in the front-to-back direction (X direction) across the transfer block 7 and the processing block 9. That is, the transport mechanism WTR can move not only within the processing block 9 but also within the vertical substrate transfer position P2 in the transfer block 7. The transport mechanism WTR corresponds to the batch substrate transport mechanism of the present invention.

[0108] The transport mechanism WTR is equipped with a pair of hands 23 for gripping a lot. The pair of hands 23 have, for example, a rotation axis oriented in the width direction (Y direction), and swing around this rotation axis. The pair of hands 23 grip both ends of the multiple substrates W that make up the lot. The transport mechanism WTR transfers the lot between the vertical substrate transfer position P2 in the transfer block 7, the lifters LF1 to LF3 belonging to the batch processing units BPU1 to BPU3, and the VHU pusher 23a in the attitude change unit VHU.

[0109] The substrate processing apparatus 1 in this example includes, in addition to the parts described above, a CPU (Central Processing Unit) 89a that controls each mechanism and each processing unit, and a storage unit 89b that stores various data necessary for the processing process, such as programs and setting values. The specific configuration of the CPU is not particularly limited. The entire apparatus may have one CPU, or each block may have one or more CPUs. The same applies to the storage unit 89b. The control performed by the CPU includes, for example, control of the operation of the batch transport mechanism 19, the first attitude change mechanism PCR, the substrate pickup mechanism WDB, each batch processing unit BPU1 to BPU3, the attitude change unit VHU, the wet transport mechanism WR, the first robot CR1, the second robot CR2, the transport mechanism WTR, etc.

[0110] <Circuit board processing flow> Figure 25 is a flowchart illustrating the substrate processing flow in this example. The substrate processing in this example involves, for example, the surface etching processes related to the semiconductor device manufacturing process. The substrate processing flow will now be explained in detail, following the flowchart.

[0111] Step S11: A carrier C containing the substrates W to be processed is set in the carrier holding unit 11. Multiple substrates W are removed from the carrier C by the batch transport mechanism 19 and transported to the forward substrate handover position P1.

[0112] Step S12: Multiple substrates W are passed to the first orientation change mechanism PCR. The first orientation change mechanism PCR changes the orientation of the substrates W from horizontal to vertical.

[0113] Step S13: Multiple substrates W, whose orientation has been converted to a vertical orientation, are passed to the pusher mechanism 22. The pusher mechanism 22 works in cooperation with the substrate pickup mechanism WDB to perform batch assembly by changing the arrangement pitch of the full-pitch substrates W to half-pitch.

[0114] Step S14: Multiple substrates W, transported to the vertical substrate transfer position P2, are transported to the batch processing area R1 by the substrate transport mechanism WTR. The multiple substrates W, in a lot configuration, undergo various liquid treatments.

[0115] Step S15: The multiple substrates W transported to the attitude change unit VHU by the substrate transport mechanism WTR are passed to the second attitude change mechanism 20. The second attitude change mechanism 20 changes the attitude of the substrates W from a vertical attitude to a horizontal attitude and places the multiple substrates W waiting at the horizontal substrate transfer position P3.

[0116] Figure 26 illustrates the substrate transport process in steps S11 to S15. In each process shown in Figure 26, multiple substrates W are transported together.

[0117] Step S16: In the single-wafer substrate transport area R3, the first robot CR1 receives one substrate W from the second posture change mechanism 20 using the CR wet arm 72 and passes it to the wet transport mechanism WR in the single-wafer processing area R2 (see Figure 24(b)).

[0118] Step S17: The wet transport mechanism WR transports the substrate W to be dried into one of the empty drying chambers 37 located in the uppermost, middle, or lowermost layer (a drying chamber 37 that is not currently undergoing drying). The drying chamber 37 then performs the drying process on the transported substrate W.

[0119] Step S18: After drying, the substrates W are removed from the chamber by the first robot CR1 or the second robot CR2. Specifically, the substrates W in the drying chamber 37 located in the lowest layer are transported to the first return substrate transfer position P4a by the dry arm 73a of the first robot CR1. The substrates W in the drying chambers 37 located in the uppermost and middle layers are transported to the second return substrate transfer position P4b by the second robot CR2.

[0120] Figure 27 illustrates the substrate transport process in steps S16 to S18. In each process shown in Figure 27, one substrate W is transported at a time. Figure 27 illustrates how the substrate W in the drying chamber 37 located at the bottom layer is transported to the first return substrate transfer position P4a.

[0121] Step S19: Steps S16 to 18 described above are repeated several times until a predetermined number of substrates W are filled into the path located at the first return-path substrate transfer position P4a or the second return-path substrate transfer position P4b. In this case, the substrates W in the path are grasped by the batch transport mechanism 19 and returned to the original carrier C.

[0122] Figure 28 shows how multiple substrates W are transported together in step S19. Figure 28 illustrates how multiple substrates W are transported from the first return-path substrate transfer position P4a. In this manner, the substrate processing by the substrate processing apparatus 1 according to this example is completed.

[0123] As described above, in this example, multiple substrates W are removed from a carrier C that stores multiple substrates W in a horizontal position, and the orientation of the substrates W is changed from horizontal to vertical in a single operation by the first orientation change mechanism PCR. Then, while maintaining the vertical orientation, the multiple substrates W are processed in batch processing area R1, and the orientation of the substrates W is changed from vertical to horizontal in a single operation by the second orientation change mechanism 20. After that, while maintaining the horizontal orientation, the substrates W are processed individually in single-wafer processing area R2. Specifically, single-wafer processing is substrate drying. The single-wafer processing area R2 of this invention is equipped with a wet transport mechanism WR for transporting wet substrates W to be dried to the drying chamber 37, and a first robot CR1 and a second robot CR2 for transporting dried substrates W to the drying chamber 37 after drying. With this configuration, the loading and unloading of substrates W to and from the drying chamber 37 can be achieved by different mechanisms, so that substrate transport does not become congested around the drying chamber 37. According to the present invention, the drying chambers 37 are stacked vertically, and furthermore, the substrate transport around the drying chambers 37 is configured to be smooth. Therefore, it is possible to provide a substrate processing apparatus that can mount many drying chambers in the same floor area as conventional apparatus. [Examples]

[0124] Next, we will describe the substrate processing apparatus 2 according to Example 2. The substrate processing apparatus 2 according to this example differs from the apparatus of Example 1 in that a third robot CR3 and a fourth robot CR4 are provided in the lower section of the single-wafer substrate transport area R3. The specific apparatus configuration will be described later.

[0125] Figure 29 illustrates the overall configuration of the substrate processing apparatus 2. The loading / unloading block 3, supply block 5, and transfer block 7 in the substrate processing apparatus 2 are the same as those in the apparatus of Example 1. Furthermore, the batch processing area R1 and batch substrate transport area R4 in the processing block 9 of this example are also the same as those in Example 1.

[0126] <Single-wafer substrate processing area> Figure 30 is a side view illustrating the single-wafer processing area R2 of this example. The single-wafer processing area R2 of this example is equipped with six single-wafer substrate processing chambers. In this example, the fact that three substrate processing chambers are stacked to form a laminate, that there are two laminates, and that a wet transport mechanism WR is provided between the two laminates is the same as in Example 1.

[0127] In this example, among the laminates provided in the single-wafer processing area R2, the laminate located away from the transfer block 7 is provided with a substrate drying pretreatment chamber 38 for performing a pretreatment before drying, unlike in Example 1. The substrate drying pretreatment chamber 38 supplies IPA (isopropyl alcohol) to the substrate surface to be dried to perform a preliminary drying process. The liquid supplied is not limited to IPA; a mixture of IPA and water may also be used. The substrate drying pretreatment chamber 38 is located at the bottom layer of the laminate. The plan view in Figure 29 illustrates the single-wafer processing chamber located at the bottom layer of the laminate in the single-wafer processing area R2. Therefore, the wet transport mechanism WR in Figure 29 is located between the drying chamber 37 provided on the transfer block 7 side and the substrate drying pretreatment chamber 38 located away from the transfer block 7.

[0128] The substrate drying pretreatment chamber 38 is located in the same position as the second attitude changing mechanism 20 in the front-to-back direction (X direction).

[0129] The substrate pre-drying treatment chamber 38, like the drying chamber 37, is equipped with an inlet 38a and an outlet 38b, both with shutters. During the pre-drying treatment, the shutters of the inlet 38a and outlet 38b are closed to prevent the IPA inside the chamber from splashing out. Unlike the drying chamber 37, the substrate pre-drying treatment chamber 38 does not necessarily need to have pressure resistance.

[0130] The substrate drying pretreatment chamber 38 includes a rotation processing unit 33 that rotates the substrate W in a horizontal position, and a nozzle 35 that supplies a processing liquid (IPA) toward the substrate W. The rotation processing unit 33 rotates the substrate W in the XY plane (horizontal plane). The nozzle 35 is rotatable between a standby position away from the rotation processing unit 33 and a supply position located above the rotation processing unit 33.

[0131] <Single-wafer substrate transport area> Figure 31 is a side view illustrating the single-wafer substrate transport area R3 of this example. The single-wafer substrate transport area R3 of this example is provided with an upper section and a lower section formed by a partition wall, and the upper section is configured the same as in Embodiment 1. That is, this section is provided with a second robot CR2 that receives dried substrates from the drying chambers 37 located in the uppermost and middle layers of the stack of chambers provided in the single-wafer processing area R2 and passes them to the second return-path substrate transfer position P4b. The second robot CR2 is movable in the front-rear direction (X direction) and is equipped with a dry arm 73b that grips the dried substrate W.

[0132] In this example, two robots are provided in the lower region of the single-wafer substrate transport area R3. Specifically, the lower region is equipped with a third robot CR3 for transporting substrates W after drying and a fourth robot CR4 for transporting wet substrates W that are to be dried. The third robot CR3 is equipped with a dry arm 73c similar to the dry arm 73b of the second robot CR2, and the fourth robot CR4 is equipped with a CR wet arm 75 similar to the CR wet arm 72 of the first robot CR1 in Embodiment 1.

[0133] The third robot CR3 is located on the transfer block 7 side compared to the fourth robot CR4, and transports the dried substrates W (in a horizontal position) from the drying chamber 37 adjacent to the transfer block 7 in the single-wafer processing area R2 to the first return substrate handover position P4a. There is one drying chamber 37 adjacent to the transfer block 7 for each of the uppermost, middle, and lowermost layers, but the third robot CR3 can access the drying chamber 37 located in the lowermost layer. At the first return substrate handover position P4a, the substrates W are arranged vertically (Z direction) with full-pitch spacing between them. Therefore, the dry arm 73c of the third robot CR3 can move up and down so that the substrates W can be stacked at the first return substrate handover position P4a.

[0134] The fourth robot CR4 is positioned further from the transfer block 7 than the third robot CR3. The fourth robot CR4 can receive substrates W (horizontal orientation) from the horizontal substrate transfer position P3 in the batch processing area R1 and load the substrates W (horizontal orientation) into the substrate drying pre-treatment chamber 38 in the single-wafer processing area R2 from the entrance 38a of the substrate drying pre-treatment chamber 38. At the horizontal substrate transfer position P3, the substrates W are arranged vertically (Z direction) at half-pitch intervals. Therefore, the CR wet arm 75 of the fourth robot CR4 can move up and down to acquire the substrates W stacked at the horizontal substrate transfer position P3.

[0135] The fourth robot CR4 is located in the same position as the substrate drying pre-treatment chamber 38 and the second posture change mechanism 20 in the front-to-back direction (X direction). Therefore, the fourth robot CR4 faces both the substrate drying pre-treatment chamber 38 and the second posture change mechanism 20. In this way, the fourth robot CR4 is positioned in a location suitable for transporting the substrate W between the second posture change mechanism 20 and the substrate drying pre-treatment chamber 38.

[0136] The third robot CR3, the wet transport mechanism WR, and the fourth robot CR4 are located in different positions relative to each other in the front-to-back direction (X direction).

[0137] The third robot CR3 only needs to be able to access one of the five drying chambers 37 provided in the single-wafer processing area R2, and does not necessarily need to move in the forward / backward direction (X direction). Therefore, the apparatus in this example can be configured without a mechanism for horizontally moving the third robot CR3 and a control unit. Similarly, the fourth robot CR4 only needs to be able to access one of the substrate pre-drying chambers 38 provided in the single-wafer processing area R2, and does not necessarily need to move in the forward / backward direction (X direction). Therefore, the apparatus in this example can be configured without a mechanism for horizontally moving the fourth robot CR4 and a control unit.

[0138] In Embodiment 2, the CPU implements the functions of the CPU 89a in Embodiment 1, as well as control units for the third robot CR3 and the fourth robot CR4. The memory unit 89b in Embodiment 2 stores information related to the control of the third robot CR3 and the fourth robot CR4, in addition to the functions of Embodiment 1. As with Embodiment 1, the specific configuration of the CPU is not particularly limited. The entire device may have one CPU, or each block may have one or more CPUs. The same applies to the memory unit 89b.

[0139] <Circuit board processing flow> Figure 32 is a flowchart illustrating the substrate processing flow in this example. Similar to Example 1, the substrate processing in this example involves, for example, various processes related to surface etching of the substrate W in the semiconductor device manufacturing process. The substrate processing flow will now be specifically explained in accordance with the flowchart.

[0140] Step S21: Similar to step S11 of Embodiment 1, a carrier C containing the substrates W to be processed is set in the carrier holding unit 11. Multiple substrates W are removed from the carrier C by the batch transport mechanism 19 and transported to the forward substrate transfer position P1.

[0141] Step S22: Similar to step S12 of Example 1, multiple substrates W are passed to the first attitude change mechanism PCR. The first attitude change mechanism PCR changes the attitude of the substrates W from horizontal to vertical.

[0142] Step S23: Similar to step S13 of Embodiment 1, the multiple substrates W whose orientation has been converted to a vertical orientation are passed to the pusher mechanism 22. The pusher mechanism 22 works in cooperation with the substrate pickup mechanism WDB to change the arrangement pitch of the full-pitch substrates W to half-pitch.

[0143] Step S24: Similar to step S14 of Example 1, the multiple substrates W transported to the vertical substrate transfer position P2 are transported to the batch processing area R1 by the substrate transport mechanism WTR. The multiple substrates W, in a lot configuration, undergo various liquid treatments.

[0144] Step S25: Similar to step S15 of Embodiment 1, the multiple substrates W transported to the attitude change unit VHU by the substrate transport mechanism WTR are passed to the second attitude change mechanism 20. The second attitude change mechanism 20 changes the attitude of the substrates W from a vertical attitude to a horizontal attitude and has the multiple substrates W waiting at the horizontal substrate transfer position P3.

[0145] Figure 33 illustrates the substrate transport process in steps S21 to S25. In each process shown in Figure 33, multiple substrates W are transported together.

[0146] Step S26: Multiple substrates W waiting at the horizontal substrate transfer position P3 are transported one by one to the substrate pre-drying chamber 38 by the fourth robot CR4. That is, the substrates W at the horizontal substrate transfer position P3 are grasped by the CR wet arm 75 of the fourth robot CR4 and transported to an empty substrate pre-drying chamber 38 (a substrate pre-drying chamber 38 that is not currently undergoing pre-drying treatment). When the substrate pre-drying chamber 38 is undergoing pre-drying treatment, the fourth robot CR4 waits without grasping any substrates W until the substrate pre-drying chamber 38 becomes empty. When the substrate pre-drying chamber 38 becomes empty, the robot CR4 acquires one substrate W from the horizontal substrate transfer position P3 and transports it to the substrate pre-drying chamber 38.

[0147] Step S27: When the substrate W is loaded into the substrate pre-drying treatment chamber 38, the shutters at the entrance 38a and exit 38b are closed, and pre-drying treatment is performed inside the chamber. This process supplies IPA to the surface of the substrate W.

[0148] Step S28: Similar to step S17 of Example 1, the wet transport mechanism WR transports the substrate W to be dried into one of the empty drying chambers 37 located in the uppermost, middle, or lowermost layer (a drying chamber 37 that is not currently undergoing drying). The drying chamber 37 then performs the drying process on the transported substrate W.

[0149] Step S29: Similar to step S18 of Example 1, the substrate W after drying is removed from the chamber by the second robot CR2 or the third robot CR3. Specifically, the substrate W in the drying chamber 37 located in the lowest layer is transported to the first return-path substrate transfer position P4a by the dry arm 73c of the third robot CR3. The substrate W in the drying chambers 37 located in the uppermost and middle layers is transported to the second return-path substrate transfer position P4b by the second robot CR2.

[0150] Figure 34 illustrates the substrate transport process in steps S26 to S29. In each step shown in Figure 34, one substrate W in a horizontal position is transported at a time. Figure 34 illustrates how the substrate W in the drying chamber 37 located at the lowest level is transported by the third robot CR3 to the first return substrate transfer position P4a.

[0151] Step S30: Steps S26 to 29 described above are repeated several times until a predetermined number of substrates W are filled into the path located at the first return-path substrate transfer position P4a or the second return-path substrate transfer position P4b. In this step, the substrates W in the path are grasped by the batch transport mechanism 19 and returned to the original carrier C. This step is the same as step 19 in Embodiment 1.

[0152] Figure 35 shows how multiple substrates W are transported together in step S30. Figure 35 exemplifies how multiple substrates W are transported from the first return-path substrate transfer position P4a. In this way, the substrate processing by the substrate processing apparatus 2 according to this example is completed.

[0153] As described above, this example provides the same effects as in Example 1, as well as the following effects. Specifically, the fourth robot CR4 in this example sends the substrate W to the substrate drying pretreatment chamber 38, and the wet transport mechanism WR receives the substrate W from the substrate drying pretreatment chamber 38. With this configuration, there is no need to transfer the substrate W between the wet transport mechanism WR and the fourth robot CR4, so a substrate processing apparatus 2 can be provided that can transport the substrate W more reliably and reliably perform the pretreatment of the substrate W to be dried.

[0154] The present invention is not limited to the above-described configuration, and can be modified and implemented as follows.

[0155] <Example 1> Although the drying chamber 37 described above was a supercritical fluid chamber, the present invention is not limited to this configuration. The drying chamber 37 may be configured as a chamber capable of spin-drying.

[0156] <Modification 2> In the aforementioned single-wafer processing region R2, the drying chambers 37 were stacked in three in the vertical direction (Z direction) to form a laminate. However, the present invention is not limited to this configuration, and the number of drying chambers 37 constituting the laminate can be increased or decreased as appropriate.

[0157] <Variation 3> In the single-wafer processing region R2 described above, multiple laminates were provided in which a predetermined number of drying chambers 37 were stacked vertically (Z direction). However, the present invention is not limited to this configuration and can also be applied to devices having a single laminate. In such a device, the laminate on the right or left side of the wet conveying mechanism WR in Figure 19 is omitted.

[0158] <Modification 4> The single-wafer substrate transport area R3 described above was divided into upper and lower sections, with independent robots in the upper and lower sections. However, the present invention is not limited to this configuration. The single-wafer substrate transport area R3 may not be divided by a partition wall, and instead of the first robot CR1 and the second robot CR2, a single robot may be provided that performs the transport operations of each robot together.

[0159] <Modification 5> In the above-mentioned configuration, the first robot CR1 in the single-wafer substrate transport area R3 is able to access the chamber located at the bottom of the single-wafer processing area R2, and the second robot CR2 is able to access the chambers located at the top and middle of the single-wafer processing area R2. However, the present invention is not limited to this configuration. The first robot CR1 may be able to access the chambers located at the middle and bottom of the single-wafer processing area R2, and accordingly, the second robot CR2 may be able to access the chamber located at the bottom of the single-wafer processing area R2. [Explanation of Symbols]

[0160] 5. Supply Block 7 Transfer Block 9 Processing Blocks 19. Batch transport mechanism 20. Second attitude change mechanism 20B Horizontal holding section (horizontal substrate support member) 22 Pusher mechanism (vertical substrate support member) 37 Drying Chamber 38 Substrate drying pretreatment chamber 72 CR Wet Arm (Transfer Arm) 73a Dry arm (export arm) C Career CR1 First Robot (Single-wafer substrate transfer mechanism, substrate unloading mechanism, first substrate unloading mechanism) CR2 Second Robot (Second Substrate Dispensing Mechanism) P1 Outbound circuit board handover position P2 Vertical board transfer position P3 Horizontal board handover position P4 Return circuit board handover position P4a First return circuit board handover position P4b Second return circuit board handover position PCR First Posture Change Mechanism R1 Batch Processing Area R2 Single-wafer processing area R3 Single-wafer substrate transport area R4 Batch substrate transport area W board WR Wet Transport Mechanism (Substrate Loading Mechanism) WTR substrate transport mechanism (batch substrate transport mechanism)

Claims

1. A substrate processing apparatus that continuously performs batch processing, which processes multiple substrates at once, and single-wafer processing, which processes substrates one by one, It comprises a supply block for supplying multiple substrates, a transfer block adjacent to the supply block, and a processing block adjacent to the transfer block, The aforementioned supply block is The system includes a batch transport mechanism that transports multiple substrates arranged horizontally and at predetermined intervals in the vertical direction from a carrier and sends them to a forward substrate transfer position in the transfer block, and receives the multiple substrates arranged horizontally and at predetermined intervals in the vertical direction from a return substrate transfer position in the transfer block and stores them in the carrier. The aforementioned transfer block is, The system comprises a first attitude conversion mechanism that holds multiple boards waiting at the forward board transfer position and converts the orientation of the multiple boards from a horizontal to a vertical orientation, and a vertical board support member that holds the multiple boards in a vertical orientation at the vertical board transfer position in the transfer block, The aforementioned processing block is, A batch processing area having one end adjacent to the transfer block and the other end extending away from the transfer block, A sheet-wafer processing area having one end adjacent to the transfer block and the other end extending away from the transfer block, Interposed between the batch processing area and the single-wafer processing area is a single-wafer substrate transport area, with one end adjacent to the transfer block and the other end extending away from the transfer block; The batch substrate transport area is provided along the batch processing area, with one end adjacent to the transfer block and the other end extending away from the transfer block, The batch processing area in the processing block is provided with multiple batch processing tanks arranged in the direction extending over the area for immersing multiple substrates simultaneously, and further, at the position furthest from the transfer block, is a second orientation conversion mechanism that converts the orientation of multiple substrates simultaneously from a vertical orientation to a horizontal orientation, and a horizontal substrate support member that holds the multiple substrates in a horizontal orientation at a horizontal substrate transfer position in the batch processing area. The single-wafer processing area in the processing block is provided with a plurality of drying chambers arranged vertically for drying the substrates, and a substrate loading mechanism for loading the substrates into the drying chambers before drying. The single-wafer substrate transport area in the processing block is equipped with a single-wafer substrate transfer mechanism that receives a horizontally oriented substrate from the horizontal substrate transfer position and transfers the substrate to the single-wafer processing area, and a substrate discharge mechanism that discharges the dried substrate from the drying chamber to the return-path substrate transfer position in the transfer block. The batch substrate transport area in the processing block is provided with a vertical substrate transfer position defined within the transfer block, and a batch substrate transport mechanism that transports multiple substrates simultaneously between each of the batch processing tanks and the second attitude conversion mechanism. A substrate processing apparatus characterized by the following:

2. In the substrate processing apparatus according to claim 1, The substrate loading mechanism receives the substrate from the single-wafer substrate transfer mechanism. A substrate processing apparatus characterized by the following:

3. In the substrate processing apparatus according to claim 1, The aforementioned single-wafer processing area is equipped with a substrate pre-drying treatment chamber for pre-drying treatment, The single-wafer substrate transfer mechanism sends the substrate to the substrate pre-drying treatment chamber, The substrate loading mechanism receives the substrate from the substrate pre-drying chamber. A substrate processing apparatus characterized by the following:

4. In the substrate processing apparatus according to claim 2, The single-wafer substrate transfer mechanism is composed of a robot that also serves as the substrate unloading mechanism. The single-wafer substrate transfer mechanism has a transfer arm that supports the substrate before drying, The substrate unloading mechanism has an unloading arm that supports the substrate after drying, The aforementioned unloading arm is provided on the upper part of the transfer arm. A substrate processing apparatus characterized by the following:

5. In the substrate processing apparatus according to claim 1, The drying chamber dries the substrate using a supercritical fluid. A substrate processing apparatus characterized by the following:

6. In the substrate processing apparatus according to claim 3, The substrate pre-drying chamber pre-dries the substrate with isopropyl alcohol. A substrate processing apparatus characterized by the following:

7. In the substrate processing apparatus according to claim 1, In the processing block, the single-wafer processing area includes: The laminated structure of the drying chamber is provided on both sides of the substrate loading mechanism. A substrate processing apparatus characterized by the following:

8. In the substrate processing apparatus according to claim 1, In the batch substrate transport area of ​​the processing block, A first substrate unloading mechanism for unloading substrates from the upper layer of the laminate in the drying chamber, The drying chamber is equipped with a second substrate unloading mechanism for unloading substrates from the lower layer of the laminate, The aforementioned transfer block includes: A first return-path substrate transfer position is set for the first substrate discharge mechanism to discharge the substrate. The second return-path substrate transfer position is set, where the second substrate ejection mechanism ejects the substrate. A substrate processing apparatus characterized by the following:

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