Array-type image detection device

Abstract

The present application provides an array-type image detection device, comprising two rows of imaging arrays spaced apart along a first direction, each row of the imaging arrays comprising a plurality of imaging modules spaced apart along a second direction, each imaging module comprising a magnifying lens and an imaging chip arranged in sequence along its optical axis, each imaging module magnifies and captures an image to be detected located in its detection area within its imaging area, and acquires it by the imaging chip located in its imaging area, and each detection area, except for the detection areas located on both sides in the second direction, has a portion overlapping with another detection area at both ends along the second direction. The array-type image detection device provided by the present invention can effectively solve the problem that the resolution of the conventional contact image sensor is low, it is difficult to detect a high-resolution image, and there is a detection blind spot when performing magnification detection, and a clear magnified image of the image to be detected can be acquired within the full width range.

Description

Technical Field

[0001] This application belongs to the field of optical imaging technology, and specifically relates to an array-type image detection device.

Background Art

[0002] Image detection technology relates to many technical fields such as optical imaging, photoelectric conversion, signal processing, etc., and can be widely applied in the industrial production manufacturing process. By obtaining the detailed features such as the structure and texture of the product surface and / or interior, the detection of product quality is realized. Obviously, since there are differences in multiple digits in size between the products waiting to be detected and the image features to be identified, it is necessary to determine image detection schemes using different detection accuracies / resolutions for different products waiting to be detected and detection scenes. In particular, when it is necessary to detect the micron-level image features, defects, and flaws on the product surface, further design of specialized image detection schemes is required.

[0003] In the manufacturing process of lithium batteries, detecting micron-level burrs between the positive and negative electrode sheets and the separator is a typical image detection scenario where it is necessary to acquire such micron-level characteristics of the product. With the expansion of China's new energy vehicle market, the demand for power lithium batteries has increased significantly. At the same time, the rapid development of industries such as mobile phones, electric vehicles, power tools, and digital cameras has led to a constant increase in demand for lithium batteries, and the rapid development of the lithium battery industry has already become a new investment focus in the manufacturing sector. However, at the same time, various news reports about lithium battery fires and explosions frequently appear in the media, making consumers hesitant to make a choice. Research has shown that micron-level burrs, which are only clearly visible under a microscope between the positive and negative electrode sheets and the separator of lithium batteries, are one of the main causes of lithium battery explosions and fires. Whether through hardware die cutting or laser cutting, it is difficult to avoid the occurrence of burrs in the aforementioned areas, so comprehensive and accurate inspection of these micron-level burrs has become an important measure to ensure the safety of lithium battery products.

[0004] Performing real-time, high-resolution detection across the entire width of the aforementioned micron-level image features using existing image detection means is usually difficult to achieve ideal results. For example, when acquiring images using a CCD or CMOS camera, the device volume is large and the scanning distance is long, making it generally unsuitable for installation in actual production line environments. On the other hand, using conventional contact image sensors presents the problem of not being able to accurately achieve high-resolution image detection due to their low imaging resolution. Therefore, there is an urgent need for a technology that can effectively enlarge images of products awaiting inspection, enabling accurate acquisition of high-resolution image features using low-resolution chips, and that can ensure close-range, full-width image detection to meet the needs of synchronous and comprehensive inspection in the production process. [Overview of the project] [Problems that the invention aims to solve]

[0005] To solve the aforementioned conventional technical problems, the present invention aims to provide an array-type image detection device that achieves high resolution, short-range, and full-width image detection using a low-resolution imaging chip. [Means for solving the problem]

[0006] The embodiments of this application can be realized by the following technical solutions.

[0007] An array-type image detection device comprising two rows of imaging arrays spaced apart along a first direction, each row of the imaging array comprising a plurality of imaging modules spaced apart along a second direction, each imaging module comprising a magnifying lens and an imaging chip arranged sequentially along its optical axis, each imaging module magnifying and capturing a pending detection image located within its detection area, and acquiring the image with an imaging chip located within its detection area, and each detection area having portions that overlap with other detection areas at both ends along the second direction, except for detection areas located at the front and rear of the second direction.

[0008] Furthermore, the magnifying lens is a meniscus lens in which the incident surface is concave and the exit surface is convex, the radius of the incident surface is 15 mm or less, the radius of the exit surface is 8 mm or less, and the distance between the intersection of the incident surface and the exit surface and their optical axis is 3 mm or less.

[0009] Preferably, the magnifying lens is further cut along its optical axis so that its projection onto a plane perpendicular to the optical axis is rectangular, with a length of 9 to 11 mm and a width of 2 to 6 mm.

[0010] Preferably, the distance from the detection area to the imaging area of ​​each imaging module is 90 mm or less, and the image magnification is 1 to 6 times.

[0011] Furthermore, in the two rows of imaging arrays, each imaging module in one row of the imaging array has a first optical axis in the same direction, and each imaging module in the other row of the imaging array has a second optical axis in the same direction, and both the first and second optical axes are perpendicular to the second direction.

[0012] Preferably, the angle between the first optical axis and the second optical axis is in the range of 8° to 12°, and the angle bisector extends along a third direction perpendicular to the first and second directions.

[0013] Preferably, the detection areas of each imaging module are at the same height in the third direction.

[0014] Furthermore, each imaging module further includes an aperture diaphragm located on its optical axis, the aperture diaphragm positioned between the detection area of ​​the imaging module and the magnifying lens.

[0015] Preferably, the distance from the aperture diaphragm of each imaging module to the detection area is 25 mm or less.

[0016] Preferably, the imaging surface of each imaging chip is perpendicular to the optical axis of the imaging module in which it is located.

[0017] Preferably, the array-type image detection device further comprises a hollow outer frame that permanently houses each imaging module.

[0018] Preferably, the array-type image detection device further comprises a light-blocking baffle located between the two rows of imaging arrays.

[0019] Preferably, the array-type image detection device further comprises a light source module that generates a light ray directed toward the detection area.

[0020] Preferably, the array-type image detection device is A data conversion module for converting the analog signals acquired by each imaging chip into digital signals, and a data processing module for processing the digital signals to generate a digitized enlarged image of the image to be detected.

Advantages of the Invention

[0021] The array-type image detection device provided by the embodiment of the present application realizes miniaturization of the device while satisfying close-range magnified imaging through the magnifying lens provided in each imaging module and the design for the structural parameters of the magnifying lens, solves the problem that the mounting space of the device is too large, and thereby realizes the need to scan a high-resolution object surface at a close range using a low-resolution imaging chip.

[0022] At the same time, in a method of arranging two columns of imaging arrays with a shift and an interval therebetween, each detection area is overlapped with each other along the scanning direction. And it is preferable that the optical axes of the two columns of imaging arrays form a certain angle, effectively solving the problem that there are detection dead angles when a single column of imaging arrays performs magnified detection, and ensuring that the scanning information of the full width of the image to be detected within a certain error range can be read.

Brief Description of the Drawings

[0023] [Figure 1] It is a structural schematic diagram of a lithium battery film. [Figure 2] It is an arrangement schematic diagram of an array-type image detection device integrated into an existing production line environment. [Figure 3] It is a side cross-sectional view of an array-type image detection device according to one embodiment of the present application along a first direction. [Figure 4] It is a side cross-sectional view of one column of imaging arrays of an array-type image detection device according to one embodiment of the present application along a second direction. [Figure 5a] It is a three-dimensional schematic diagram of one magnifying lens of an array-type image detection device according to one embodiment of the present application. [Figure 5b] It is a side cross-sectional view of the magnifying lens shown in FIG. 5a. [Figure 5c]It is a top view of an enlarged lens shown in Fig. 5a. [Figure 6] It is an optical path diagram of an enlarged lens of an array type image detection device according to one embodiment of the present application. [Figure 7] It is a top view of a plurality of first imaging regions and second imaging regions of an array type image detection device according to one embodiment of the present application. [Figure 8] It is a top view of a plurality of first detection regions and second detection regions corresponding to Fig. 7. [Figure 9] It is a side cross-sectional view along the first direction of an array type image detection device according to another embodiment of the present invention.

Mode for Carrying Out the Invention

[0024] Hereinafter, based on the preferred embodiments, the present application will be further described with reference to the accompanying drawings.

[0025] In addition, various members on the drawings are enlarged or reduced for easy understanding, but such a way is not for limiting the protection scope of the present application.

[0026] The vocabulary in the singular form also includes the meaning in the plural form, and vice versa.

[0027] In the description of the embodiments of the present application, if the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "outer", etc. is the orientation or positional relationship based on the drawings, or the orientation or positional relationship in which the product according to the embodiments of the present application is always placed when in use, it is merely for the ease and simplification of the description of the present application, and does not indicate or imply that the device or element pointed to must have a specific orientation, be configured and operated in a specific orientation, so it cannot be understood as a limitation of the present application. Also, in the description of the present application, in order to distinguish different units, vocabulary such as the first and the second is used in this specification, but these are not limited by the manufacturing order, and it cannot be understood that they indicate or imply relative importance, and in the detailed description and claims of the present application, their names may be different.

[0028] The terminology used herein is for the purpose of describing the embodiments of the present application, but is not intended to limit the present application. Furthermore, unless otherwise explicitly defined and limited, the terms “setting,” “connecting,” and “connection” should be understood in a broad sense, for example, being a fixed connection, a detachable connection, an integral connection, a mechanical connection, a direct connection, an indirect connection via an intermediate medium, or internal communication between two elements. The specific meanings of the above terms in this application will be concretely understood by those skilled in the art.

[0029] To more clearly explain the proposed technology, we will first describe in detail the technical difficulties faced in real-time detection of micrometer-level image features in current production and manufacturing processes.

[0030] Figure 1 shows a schematic diagram of the battery film structure of a lithium battery. As shown in Figure 1, this battery film comprises a core material 700 made of a material such as copper or aluminum, and coatings 701 and 702 applied to both sides thereof. Generally, the thickness of the core material 700 and the coatings 701 and 702 is about several tens of micrometers. During the manufacturing and cutting process of the battery film, various burrs 703 often appear on the surface of the core material and coatings. These burrs 703 create minute defects on the surface of the battery film, significantly increasing the probability of leakage, explosion, and other dangers occurring in the lithium battery. Therefore, detecting the presence of burrs 703 is an essential step in the manufacturing process of the battery film.

[0031] Statistical analysis of the size of the aforementioned burrs 703 using devices such as microscopes revealed that their size is generally around 20 μm, and that burrs 703 can appear at various positions on the battery film. This led to the conclusion that real-time detection of micron-level image features within a range corresponding to the entire width of the battery film is necessary without affecting the normal operation of the production line.

[0032] One possible image detection scheme involves continuously scanning the product using a linear scan camera (e.g., a CCD or CMOS camera). However, while linear scan cameras can achieve high-resolution dynamic scanning, they are generally bulky, require long scanning distances, and are often limited by device space constraints, making installation difficult. At the same time, excessively long scanning distances lead to a sharp increase in the cost of hardware devices that meet the performance metrics required to detect the aforementioned micron-level burrs.

[0033] Another optional scheme involves using a Contact Image Sensor (CIS) or CIS array to dynamically scan the battery film at close range. CIS is a common sensor used for image acquisition, and it can convert the optical signal of an image into an electrical signal using an array of multiple photosensitive elements and a corresponding photoelectric conversion chip. Its small size and high integration make it particularly suitable for acquiring and obtaining product images in various production line environments.

[0034] Figure 2 shows the arrangement and image detection scheme of an image detection device integrated into a production line environment. As shown in Figure 2, the surface of the object 900 awaiting detection has a constant width along the Y direction (usually referred to as the scanning direction) and moves continuously along the X direction (usually referred to as the secondary scanning direction) under normal operating conditions of the production line. This image detection device comprises multiple CIS sensors 800 spaced apart along the Y direction (usually, the number of CIS sensors 800 needs to be determined according to the size of the object 900 to be detected so as to cover the entire width), and each CIS sensor 800 comprises a photoelectric conversion chip consisting of an array of linearly spaced photosensitive elements 811 for converting light rays emitted from the surface of the object 900 to an analog signal (electrical signal), and obviously the number of photosensitive elements 811 contained per unit length is equal to the resolution of the CIS sensor (in units of DPI), and the above-mentioned photoelectric conversion chip is generally mounted on a photoelectric conversion chip substrate 810, and the CIS sensor generally further comprises structures such as an interface circuit that serially outputs the analog signal after photoelectric conversion.

[0035] Once this arrangement is complete, the image detection device can continuously scan across its entire width at regular time intervals while the object 900 awaiting detection continues to move. With each scan, one sequence of image signals converted photoelectrically by each photosensitive element 811 can be obtained. By joining multiple sequences of image signals obtained from multiple scans, a two-dimensional detection image of the object 900 awaiting detection can be obtained.

[0036] While the aforementioned image detection device can perform image detection on objects of conventional sizes, it is difficult to directly apply it to the detection of micron-level burrs on battery films. This is because conventional contact image sensors have low imaging resolution. For example, a CIS sensor with a resolution of 1200 DPI has a pixel dot size of 25.4 mm / 1200 ≈ 21 μm, meaning the minimum resolution of its imaging surface is 21 μm. Clearly, for burrs of about 20 μm, the above-mentioned standard contact image sensor alone cannot capture and recognize them clearly, and its structure needs to be improved to meet the need for high-resolution image recognition.

[0037] However, simply using a single magnifying lens cannot simultaneously meet the needs of clear imaging covering the entire detection width and close-range contact detection. Therefore, it is necessary to rationally design the optical path of the image magnification portion and its cooperation with the imaging portion, taking into account the actual production line environment and the characteristics of the selected image sensor, thereby achieving close-range, full-width detection of image features at the micron level.

[0038] To achieve the above objective, the present invention provides an array-type image detection device by embodiment, comprising two rows of imaging arrays spaced apart along a first direction, each row of the imaging arrays comprising a plurality of imaging modules spaced apart along a second direction, each imaging module comprising a magnifying lens and an imaging chip arranged sequentially along its optical axis, each imaging module magnifying and capturing a pending detection image located within its detection area within its imaging area, and acquiring the image with an imaging chip located within its imaging area, and each detection area having portions that overlap with other detection areas at both ends along the second direction, except for detection areas located at the front and rear of the second direction.

[0039] The array-type image detection device provided by the embodiment of this application includes two rows of imaging arrays arranged at predetermined intervals in a first direction, each row of imaging arrays comprising a plurality of magnification imaging modules arranged at intervals along a second direction, and the detection areas of the two rows of imaging arrays are arranged to overlap along the second direction. By setting the two rows of imaging arrays to be arranged with a gap and offset, multiple detection areas can cover the entire width in the second direction, thereby ensuring that images within the coverage area of ​​the multiple detection areas are magnified and captured clearly and without omission.

[0040] The array-type image detection device provided in this application will be described in detail below with reference to specific examples.

[0041] [Example 1] Figure 3 shows a side cross-sectional view along the X-axis of an array-type image detection device according to a preferred embodiment 1 of the present invention. As shown in Figure 3, this array-type image detection device comprises a first imaging array 1 and a second imaging array 2, which are provided at predetermined intervals along a first direction (shown as the X-axis in Figure 3).

[0042] Figure 4 further shows a side cross-sectional view of the first imaging array 1 along a second direction (indicated as the Y-axis in Figure 4, where the Y-axis has a different direction from the X-axis, preferably perpendicular to the X-axis). As shown in Figures 3 and 4, the first imaging array 1 comprises a plurality of first imaging modules 10 arranged at intervals of length H along the Y-axis direction. The Y-axis direction is generally called the scanning direction, and it is clear that the number of first imaging modules 10 can be determined according to the length over which each first imaging module 10 can effectively detect along the scanning direction and the length over which detection is required overall along the scanning direction, in order to ensure that the entire detection width is covered. Note that the interval H of each first imaging module 10 in the figures is merely a schematicly preferred setting method and does not limit the technical proposal of this application.

[0043] Furthermore, this array-type image detection device further includes a hollow outer frame 31 that permanently houses each of the above-mentioned imaging modules, and the outer frame 31 may be made of metallic aluminum to further enhance structural stability. By methods such as bonding or insertion, each of the above-mentioned imaging modules can be fixed inside the outer frame 31 according to its respective optical path parameters, and the inner wall of the outer frame 31 can be coated with a black oxide coating to effectively eliminate the influence of stray light on image detection.

[0044] In this embodiment, preferably as shown in Figure 3, the array-type image detection device further includes a light source module 4 whose emitted light rays are directed towards the detection waiting area, increasing the light rays from the object surface in the detection waiting area, thereby being advantageous for subsequent image detection. This light source module 4 is a linear light source whose effective light emission area extends along the Y-axis direction and covers the entire width to be detected. A light source chip 43 is mounted on the light source substrate 42.

[0045] Preferably, as shown in Figure 3, the light source substrate 42 is made of aluminum to enhance heat dissipation, and at the same time, a light scattering film 41 is provided to provide a uniform light distribution effect. To further enhance the illumination effect, the number of light source modules 4 may be two or more, and a system that illuminates both sides with light sources may be adopted.

[0046] In this embodiment, preferably, the array-type image detection device further includes a data conversion module for converting analog signals acquired by the imaging chip in each imaging module into digital signals. Specifically, as shown in Figure 3, the data conversion module comprises a relay board 51 and a data transmission and conversion circuit (not shown) mounted thereon. Data transfer between the relay board 51 and each imaging chip is realized via a corresponding signal interface, that is, data transfer is realized by soldering the pads of the relay board 51 and the back surface pads of the imaging chips using processes such as pins or reflow soldering.

[0047] In this embodiment, preferably, the array image detection device further comprises a data processing module, specifically, as shown in Figure 3, the data processing module comprises a data processing board 52 on which a data processing chip 602 and a serial port circuit 604 are mounted. The data processing chip 602 has an image preprocessing function, processes the digital signal received from the data conversion module and synthesizes it into a detection image, transmits it to the external display module PC via the serial port circuit 604, and completes the display of the full width of the image. Those skilled in the art can select an appropriate data chip and serial circuit board, for example, an FPGA chip and a CAMRALINK serial circuit board, or other selectable data chips and serial circuits, according to their specific needs.

[0048] Furthermore, the data processing chip 602 controls the timing period by setting internal registers to control the light source module 4, thereby achieving the objective of synchronizing the light emission frequency of the light source module 4 with the scanning frame rate of each imaging module within the scanning cycle.

[0049] Preferably, as shown in Figure 3, the array image detection device further comprises a second outer frame 32, the data conversion module is fixedly housed inside the outer frame 31, and the data processing module is fixedly housed inside the second outer frame 32. The second outer frame 32 and the outer frame 31 are fixedly connected by insertion, bonding, integral molding, or any other suitable method. Digital signals output from the data conversion module are connected via socket 601 and socket 603 of the data processing module to realize signal conversion and transmission.

[0050] Preferably, a heat sink 33 is provided on the side of the second outer frame 32 opposite to the outer frame 31, and the heat sink 33 is preferably made of a material such as metal that has excellent heat dissipation properties in order to dissipate the heat generated when the data processing chip 602 is in operation.

[0051] Having described the overall configuration of the array-type image detection device of this embodiment, the operating principle of this array-type image detection device will now be explained in detail.

[0052] Taking the first imaging array 1 as an example, as shown in Figures 3 and 4, each first imaging module 10 in the first imaging array 1 comprises a first magnifying lens 11 and a first imaging chip 12 arranged sequentially along its optical axis (indicated by the first optical axis 14).

[0053] Furthermore, due to the magnification effect of the first magnifying lens 11, each first imaging module 10 has a first detection area 16 and a first imaging area 15 on both sides of the first magnifying lens 11. The image awaiting detection located within the first detection area 16 can be magnified and captured within the first imaging area 15, and is acquired by the first imaging chip 12 located within the first imaging area 15.

[0054] Figures 5a to 5c show perspective views, side cross-sectional views, and top views, respectively, of the first magnifying lens 11 included in the first imaging module 10 in several preferred embodiments. As shown in Figure 5a, preferably, the first magnifying lens 11 is a meniscus lens, with the incident surface 11A facing the object side, which is a concave surface and exerts a certain focusing effect on light, and the exit surface 11B facing the image side, which is a convex surface and exerts a certain diverging effect on light.

[0055] Those skilled in the art know that the object distance, image distance, and magnification of a lens can be determined by designing the radii of the incident surface, the exit surface, and the pitch between the incident and exit surfaces. In this embodiment, preferably, as shown in Figure 5b, the radius of the incident surface 11A is R11A ≤ 15 mm, the radius of the exit surface 11B is R11B ≤ 8 mm, and the distance between the intersection points of the incident surface 11A and the exit surface 11B and the first optical axis 14 is H11 ≤ 3 mm. By setting the above preferred configuration parameters, the image awaiting detection can be magnified 1 to 6 times under the condition that the distance between the first detection area 16 and the first imaging area 15 is 90 mm or less, thereby enabling magnified detection of the image awaiting detection while maintaining device miniaturization.

[0056] In this embodiment, the first magnifying lens 11 is preferably made of a material such as glass that has good optical properties and is easy to process. Furthermore, by employing processes such as plating on the lens, reflected light from the lens surface can be reduced and light transmittance can be improved. In addition, in order to facilitate the attachment of the lens and to miniaturize the device, the lens may be cut into a long shape around the optical axis of the lens, as shown in Figures 5a and 5c. Preferably, the first magnifying lens 11 after cutting has a length of 9-11 mm along the Y-axis and a width of 2-6 mm along the X-axis.

[0057] In this embodiment, optionally, the first imaging chip 12 of the first imaging module 10 is the linear CIS sensor described above, and specifically comprises a first chip substrate 122 on which the first photoelectric conversion chip 121 is mounted, and corresponding connection lines and interface circuits (not shown). In some other embodiments, other sensors having image scanning capabilities may be selected depending on the actual image detection needs.

[0058] In this embodiment, as shown in Figure 3, preferably, the first imaging module 10 further comprises a first aperture diaphragm 13 provided along the first optical axis 14, and the first magnifying lens 11 is located between the first aperture diaphragm 13 and the first imaging chip 12. By utilizing the first aperture diaphragm 13, light rays that are relatively off-center from the first optical axis 14 of the light beam can be blocked, directly affecting the clarity, accuracy, brightness, depth of field, etc. of the image. The first aperture diaphragm 13 has a circular hole structure with a hole diameter of 1.4 mm to 1.6 mm, and may be formed by making a hole in the middle of light-shielding paper, or it may be directly processed by making a hole at the intersection of the outer frame 31 and the first optical axis 14.

[0059] Preferably, the working distance from the first aperture diaphragm 13 to the first detection area 15 is ≤ 25 mm. This allows for the effect of short-range scanning imaging, is advantageous for miniaturizing the device, and solves the problem of mounting space for the device.

[0060] Figure 6 further shows a semi-field optical path diagram of the first imaging module 10. As shown in Figure 6, the magnification of the first magnifying lens 11 and the object distance and image distance to be clearly imaged can be determined by designing the size parameters of the first magnifying lens 11, including the radii of the incident and exit surfaces and the distance between the incident / exit surfaces and the first optical axis, based on the specific needs of close-range magnification imaging. At the same time, by combining the first aperture diaphragm 13 and the outer frame to restrict rays that are deviated from the first optical axis 14, a first detection region 16 and a first imaging region 15 capable of magnifying and imaging images of awaiting detection located in the first detection region 16 are formed on both sides of the first optical axis 14, respectively. The lengths of the first imaging region 15 and the first detection region 16 along the Y-axis are L' and L, respectively, where L' / L is the magnification of the first magnifying lens 11.

[0061] As shown in Figure 6, the enlarged image awaiting detection is an inverted real image, and further signal inversion operations are required in subsequent image processing processes.

[0062] In the actual image detection process, the object 900 awaiting detection (the battery film described above) is placed within the first detection area 16, and the first imaging chip 12 is placed within the first imaging area 15. Generally, the first imaging module 10 achieves image acquisition using the first imaging chip 12, so the effective scanning length of the first imaging chip 12 can be considered equal to L'. In this case, the image of the surface of the object awaiting detection (the image awaiting detection) can be enlarged and clearly imaged within the first imaging area 15 and acquired by the first imaging chip 12.

[0063] Table 1 below schematically shows one set of preferred design parameters for the first imaging module 10, and it is clear that those skilled in the art can also determine the corresponding design parameters based on actual image detection metrics.

[0064] [Table 1] The configuration and magnified imaging principle of the first imaging module 10 have been described in detail above. Furthermore, multiple first imaging modules 10 are arranged at intervals along the Y-axis with a pitch H, that is, to form the first imaging array 1.

[0065] The first imaging array 1 described above uses multiple magnifying lenses arranged at intervals and an imaging chip that corresponds to each lens one-to-one. Based on the premise of securing a specific magnification and wide-width scanning, it is possible to effectively shorten the distance between objects and images, thereby realizing short-range scanning and miniaturization of the device. Thus, when using a single magnifying lens, it is necessary to increase the distance between objects and images in order to cover a relatively large image detection area and avoid imaging distortion, which effectively eliminates the disadvantage of a significant increase in device size. However, when using a single row of imaging arrays, the problem of detection failure in specific areas within the entire detection width still exists, and the reason for this can be explained by Figure 4.

[0066] As shown in Figure 4, in the multiple first imaging modules 10 of the first imaging array 1, each first imaging region 15 expands the first detection region 16 along the Y direction. Therefore, even if each first imaging chip 12 is connected to each other as close together as possible so that each first imaging region 15 is consistently connected, multiple detection blind spots still exist along the Y direction in each corresponding first detection region 16. The length of each detection blind spot is HL, and the existence of the above-mentioned detection blind spots is determined by the characteristics of the multiple expansion optical path structures themselves, which are provided at intervals, and causes detection leakage phenomena on the surface of objects awaiting detection. Therefore, further improvement of the single-row expansion imaging method is required.

[0067] Therefore, as shown in Figure 3, in this embodiment, in addition to the first imaging array 1, a second imaging array 2 is further provided, which is spaced at a certain distance from the first imaging array 1 along the X-axis. Specifically, the second imaging array 2 comprises a plurality of second imaging modules 20 arranged at intervals along the Y-axis, and each second imaging module 20 comprises a second magnifying lens 21 and a second imaging chip 22 arranged sequentially along its optical axis (indicated by the second optical axis 24). Accordingly, a second detection region 26 and a second imaging region 25 for magnified imaging are formed on both sides of the second optical axis 24, and the second imaging chip 22 is placed within the second imaging region 25.

[0068] The second imaging module 20 may include a second aperture diaphragm 23, similar to the first imaging module 10, and the second imaging chip 22 comprises a second chip substrate 222 and a second photoelectric conversion chip 221 mounted thereon.

[0069] In some preferred embodiments, the configuration parameters of each first imaging module 10 included in the first imaging array 1 and each second imaging module 20 included in the second imaging array 2 are the same, that is, completely identical imaging modules may be used. At the same time, the pitch of each second imaging module 20 along the Y-axis is the same as the pitch of each first imaging module 10 along the Y-axis (both denoted by H). Therefore, Figure 4 can also be used to illustrate the configuration of the second imaging array 2, and for brevity, it will not be explained again here.

[0070] In this embodiment, preferably, as shown in Figure 3, the first detection region 16 and the second detection region 26 are at the same height in the Z-axis direction, and the Z-axis is perpendicular to the X-axis and Y-axis.

[0071] Figure 7 shows a top view of a plurality of first imaging regions 15 and second imaging regions 25 in this preferred embodiment (three first imaging regions 15 and three second imaging regions 25 are schematically shown in the figure), where each of the first imaging chip 12 and the second imaging chip 22 is located within the respective imaging regions, and Figure 8 shows a top view of a plurality of first detection regions 16 and second detection regions 26 corresponding to Figure 7. As shown by combining Figures 3, 4 and 7, 8, in a preferred embodiment of the present invention, the first imaging module 10 and the second imaging module 20 are arranged offset from each other along the Y-axis, and the arrangement is designed such that, with the exception of the first detection regions 16 and / or second detection regions 26 located on both the front and rear sides of the Y-axis, each first detection region 16 has portions at both ends that overlap with the second detection region 26 along the Y-axis, and each second detection region 26 has portions at both ends that overlap with the first detection region 16 along the Y-axis. With the above configuration, the first imaging array 1 and the second imaging array 2 achieve blind spot coverage of the entire detection waiting area, thereby achieving full-width expanded detection for image features at the micrometer level.

[0072] In this embodiment, preferably, as shown in Figure 7, the center of each first imaging region 15 is aligned exactly to the midpoint of the line connecting the centers of two adjacent second imaging regions 25, and accordingly, as shown in Figure 8, the center of each first detection region 16 is aligned exactly to the midpoint of the line connecting the centers of two adjacent second detection regions 26, and both ends of each first detection region 16 have an overlapping portion of ΔZ with the two adjacent second detection regions 26, and the same applies to the second imaging region 25 and the second detection region 26, which will not be repeated here.

[0073] Specifically, taking the parameters shown in Table 1 as an example, it is preferable to design the design parameters of the first imaging module 10 and the second imaging module 20 described above with H set to 21 mm, and therefore ΔZ = 0.5 mm.

[0074] Furthermore, those skilled in the art can flexibly adjust the pitch of each imaging module in the first imaging array 1 and the second imaging array 2, the method of staggering their arrangement, the size of the overlapping portion, etc., to meet the actual image detection needs, and none of the above adjustments deviate from the technical concept of the present invention.

[0075] As shown in Figure 3, preferably, the direction of the first optical axis 14 of each first imaging module 10 is the same, the direction of the second optical axis 24 of each second imaging module 20 is the same, both the first optical axis 14 and the second optical axis 24 are perpendicular to the Y-axis direction, and the angle bisector of the angle θ between the first optical axis 14 and the second optical axis 24 points in the Z-axis direction.

[0076] In this embodiment, the preferred range for θ is 8° to 12°. As shown in Figures 3 and 8, when the depth of field of each magnifying lens is Δl, the effective width in the scanning subdirection, i.e., the X direction, of each detection region is ΔD = 4Δl * Sin(θ / 2), as can be seen by the Law of Sines. This effective width represents the allowable tolerance range ΔD in the X direction of the detection region, meaning that a clear image can be scanned within this depth of field tolerance range. Objects awaiting detection within the ΔD range described above are continuously scanned as they move along the X direction. The optical signals from their surfaces are acquired by the first imaging array 1 and the second imaging array 2 and converted into electrical signals. These signals are then converted from analog to digital via a data conversion module and finally synthesized into a surface image by a data processing module. Specifically, the processing procedures of the data processing module include signal inversion, position calibration, duplicate removal, image stitching, and corrective synthesis. The above operations are already known to those skilled in the art.

[0077] When the first imaging array 1 and the second imaging array 2 are close together in the X direction, the optical paths of their imaging modules may affect each other. This is because, when a light ray enters the magnifying lens on one side, it normally illuminates the respective imaging chips. However, because the exit surface of the magnifying lens has a convex structure, the light diverges at a certain angle before exiting. At the same time, because the distance between the imaging chips on both sides is small, the light ray from one side enters the imaging chip on the other side, causing interference.

[0078] Therefore, preferably, as shown in Figure 3, the array-type image detection device further includes a baffle 34. In this embodiment, the baffle 34 is located between the first imaging array 1 and the second imaging array 2, extends parallel to the Z-axis and along the Y-axis, and is fixedly connected to the outer frame 31 by means of insertion, bonding, or other methods, and serves to separate the magnifying lenses and imaging chips on both sides. Preferably, the baffle 34 is made of black PC material or other relatively light-absorbing material in order to absorb stray light due to wall reflection, further increase the effective optical signal, and present a clearer image.

[0079] [Example 2] Figure 9 shows a side cross-sectional view along the X-axis of an array-type image detection device according to a preferred embodiment 2 of the present invention. This embodiment differs from embodiment 1 in that the first imaging chip 12 and the second imaging chip 22 also rotate in correspondence with the first optical axis 14 and the second optical axis 24, respectively, and the imaging surface of each imaging chip is set to be perpendicular to the optical axis of the imaging module in which they are located.

[0080] Specifically, as shown in Figure 9, by rotating the first chip substrate 122 so that its surface is perpendicular to the first optical axis 14, and aligning the first optical axis 14 with the center of the first photoelectric conversion chip 121, the imaging surface of the first imaging chip 12 becomes perpendicular to the first optical axis 14, and at the same time, the principal ray can pass precisely through the center of the first magnifying lens 11 and illuminate the center of the first photoelectric conversion chip 121, thereby making it easier to achieve optical symmetry and allowing for a wider range of scanning deviations.

[0081] The same operation can be performed on the second imaging chip 22, and will not be explained again here.

[0082] In this embodiment, as shown in Figure 9, the first photoelectric conversion chip 121 and the second photoelectric conversion chip 221 convert the optical signal of the image awaiting detection into an analog signal, and then connect to corresponding sockets 605 provided on the relay board 51 via sockets 600 provided on the first chip board 122 and the second chip board 222, respectively. The connection method may be an FFC cable or the like. This enables data transfer between the imaging chip and the data conversion module.

[0083] Although specific embodiments of the present application have been described in detail above, those skilled in the art may make some further improvements and modifications to the present application, provided that they do not deviate from the principles of the present application, and these improvements and modifications also fall within the scope of the claims of the present application. [Explanation of symbols]

[0084] 1: First imaging array 10: First imaging module 11: First magnifying lens 11A:Incidence surface 11B: Output surface 12: First imaging chip 121: First photoelectric conversion chip 122: First chip substrate 13: First aperture diaphragm 14: First optical axis 15: First imaging region 16: First detection region 2: Second imaging array 20: Second imaging module 21: Second magnifying lens 22: Second imaging chip 221: Second photoelectric conversion chip 222: Second chip substrate 23: Second aperture diaphragm 24: Second optical axis 25: Second imaging area 26: Second detection area 31: Outer frame 32: Second outer frame 33: Heat sink 34: Baffle 4: Light source module 41: Light scattering film 42: Light source substrate 43: Light source chip 51: Relay board 52: Data Processing Board 600: Socket 601: Socket 602: Data processing chip 603: Socket 604: Serial port circuit 605: Socket 700: Core material 701: Coating 702: Coating 703: Bali 800: CIS sensor 810: Photoelectric conversion chip substrate 811: Photosensitive element 900: Object awaiting detection

Claims

1. An array-type image detection device comprising two rows of imaging arrays spaced apart along a first direction, Each row of the imaging array comprises multiple imaging modules arranged at intervals along a second direction, and each imaging module comprises a magnifying lens and an imaging chip arranged sequentially along its optical axis. Each imaging module captures the image awaiting detection, located within its detection area, by enlarging it within that area, and then acquires it using the imaging chip located within that area. Except for the detection regions located on both sides of the second direction, each detection region has an overlapping portion with another detection region at both ends along the second direction. The aforementioned magnifying lens is cut into a long shape with respect to the optical axis of the magnifying lens, and the cut The projection of the magnifying lens onto a plane perpendicular to the optical axis is rectangular. Array-type image detection device.

2. The magnifying lens is a meniscus lens in which the incident surface is concave and the exit surface is convex. The radius of the incident surface is 15 mm or less, and the radius of the exit surface is 8 mm or less. The distance between the intersection point of the incident surface and the exit surface and their optical axes is 3 mm or less. The array-type image detection device according to claim 1.

3. The length of the rectangle is in the range of 9 to 11 mm, and the width is in the range of 2 to 6 mm. The array-type image detection device according to claim 1.

4. The distance from the detection area to the imaging area of ​​each imaging module is 90 mm or less, and the image magnification is greater than 1x and less than or equal to 6x. The array-type image detection device according to claim 1.

5. In the two rows of imaging arrays, each imaging module in one row of the imaging array has a first optical axis in the same direction, and each imaging module in the other row of the imaging array has a second optical axis in the same direction, and both the first and second optical axes are perpendicular to the second direction. The array-type image detection device according to claim 1.

6. The angle between the first optical axis and the second optical axis is between 8° and 12°, and the angle bisector extends along a third direction perpendicular to the first and second directions. The array-type image detection device according to claim 5.

7. The detection area of ​​each imaging module is at the same height in the third direction. The array-type image detection device according to claim 6.

8. Each imaging module further includes an aperture diaphragm located on its optical axis, the aperture diaphragm being positioned between the detection area of ​​the imaging module and the magnifying lens, The array-type image detection device according to claim 1.

9. The distance from the aperture diaphragm of each imaging module to the detection area is 25 mm or less. The array-type image detection device according to claim 8.

10. The imaging surface of each imaging chip is perpendicular to the optical axis of the imaging module in which it is located. The array-type image detection device according to claim 1.

11. The array-type image detection device further comprises a hollow outer frame that permanently houses each imaging module. The array-type image detection device according to claim 1.

12. The array-type image detection device further comprises a light-impermeable baffle located between the two rows of imaging arrays. The array-type image detection device according to claim 1.

13. The array-type image detection device further comprises a light source module that generates a light ray directed toward the detection area. The array-type image detection device according to claim 1.

14. A data conversion module for converting analog signals acquired by each imaging chip into digital signals, The system further comprises a data processing module for processing the aforementioned digital signal and generating a digitized, enlarged image of the image awaiting detection. The array-type image detection device according to claim 1.

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