Soldering device and program

Abstract

This soldering device comprises: a solder joint part-forming device that has a soldering iron and forms a solder joint part in a soldering target area; an imaging device that images the solder joint part formed in the target area from a prescribed direction; an illumination device that illuminates the solder joint part formed in the target area from the prescribed direction; and a control device. The control device: causes the imaging device to perform imaging in a state in which the illumination device is providing illumination, thereby obtaining a first image of the solder joint part; causes the imaging device to perform imaging in a state where the illumination device has stopped illuminating, thereby obtaining a second image of the solder joint part; creates a brightness difference image which indicates a difference in brightness between the first image and the second image; and makes a determination about an excess failure and / or a shortage failure of the solder joint part, on the basis of the brightness difference image.

Description

Technical Field

[0001] The present invention relates to a soldering apparatus and a program.

Background Art

[0002] A soldering apparatus according to the background art is disclosed in Patent Document 1. The soldering apparatus acquires image data by imaging a target area where a soldering process is being performed, and determines the presence or absence of a defect in the soldering process by comparing the image data with image data representing a determination criterion through image processing.

[0003] Before solidification, solder has a gloss and a high light reflectance. Therefore, when imaging a solder joint before solidification, it is easy for a printed circuit board or surrounding mounted components, etc. to be reflected on the surface of the solder joint, making it difficult to accurately recognize the shape of the solder joint through image processing. Therefore, according to the soldering apparatus according to the background art, it is necessary to wait for imaging until the solder joint solidifies and loses its gloss, and the required time for defect determination processing becomes long.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

[0005] An object of the present invention is to obtain a soldering apparatus and a program capable of shortening the required time for defect determination processing of a solder joint.

[0006] A soldering apparatus according to one aspect of the present invention comprises: a solder joint forming apparatus having a soldering iron and forming a solder joint in a target area for soldering; an imaging apparatus for imaging the solder joint formed in the target area from a predetermined direction; an illumination apparatus for illuminating the solder joint formed in the target area from the predetermined direction; and a control device. The control device acquires a first image of the solder joint by causing the imaging apparatus to perform imaging while the illumination apparatus is performing illumination; acquires a second image of the solder joint by causing the imaging apparatus to perform imaging while the illumination apparatus is stopped; creates a luminance difference image showing the difference in luminance between the first image and the second image; and determines at least one of the over-defect and under-defect of the solder joint based on the luminance difference image.

[0007] A program according to another aspect of the present invention is a soldering apparatus comprising: a solder joint forming apparatus having a soldering iron and forming a solder joint in a target area for soldering; an imaging apparatus for imaging the solder joint formed in the target area from a predetermined direction; an illumination apparatus for illuminating the solder joint formed in the target area from the predetermined direction; and a control device, wherein the program causes an information processing apparatus mounted on the control device to execute processing, the processing being: obtaining a first image of the solder joint by causing the imaging apparatus to perform imaging while the illumination apparatus is performing illumination; obtaining a second image of the solder joint by causing the imaging apparatus to perform imaging while the illumination apparatus is stopped; creating a luminance difference image showing the difference in luminance between the first image and the second image; and determining at least one of the over-defect and under-defect of the solder joint based on the luminance difference image. [Brief explanation of the drawing]

[0008] [Figure 1] This is a simplified perspective view showing the configuration of a soldering machine. [Figure 2] This is a simplified side view showing the configuration of a soldering device. [Figure 3]This is a schematic side view showing the positional relationship between the solder joint forming apparatus, the imaging apparatus, and the illumination apparatus. [Figure 4] This diagram shows a simplified configuration of the control device. [Figure 5] This diagram shows a simplified representation of the processing unit's functional configuration. [Figure 6] This flowchart shows the processes that the processing unit executes. [Figure 7A] This is a schematic side view illustrating the processing performed by the processing unit. [Figure 7B] This is a schematic side view illustrating the processing performed by the processing unit. [Figure 7C] This is a schematic side view illustrating the processing performed by the processing unit. [Figure 7D] This is a schematic side view illustrating the processing performed by the processing unit. [Figure 8A] This figure shows the first example of the first image of a solder joint. [Figure 8B] This figure shows a second example of the first image of a solder joint. [Figure 9] This figure shows an example of a second image of a solder joint. [Figure 10A] This figure shows the first example of a luminance difference image. [Figure 10B] This figure shows a second example of a luminance difference image. [Figure 11A] This is a diagram showing an image of a solder joint. [Figure 11B] This is a diagram showing an image of a solder joint. [Figure 11C] This is a diagram showing an image of a solder joint. [Figure 11D] This is a diagram showing an image of a solder joint. [Figure 12] This figure shows an example of a solder joint where wetting defects have occurred (first image). [Figure 13] This figure shows an example of a color component image corresponding to the color component of land. [Modes for carrying out the invention]

[0009] Hereinafter, embodiments of the present invention will be described in detail while referring to the drawings. Note that elements denoted by the same reference numerals in different drawings indicate the same or corresponding elements.

[0010] FIG. 1 and FIG. 2 are respectively a perspective view and a side view schematically showing the configuration of a soldering apparatus 100 according to an embodiment of the present invention. The soldering apparatus 100 includes a solder joint forming apparatus 1, an imaging apparatus 2, a lighting apparatus 3, and a control apparatus 4. The solder joint forming apparatus 1 has a solder spatula 11 and a solder supply apparatus 12. The soldering apparatus 100 can be transported to a desired position by a transport mechanism. Further, the soldering apparatus 100 can be transported to a desired position by the transport mechanism for the imaging apparatus 2 and the lighting apparatus 3. The transport mechanism can execute a retraction operation for retracting the solder joint forming apparatus 1 from the target area 20 while maintaining the positional relationship between the imaging apparatus 2 and the lighting apparatus 3 and the solder joint forming apparatus 1. Note that the transport mechanism may be able to transport the imaging apparatus 2 and the lighting apparatus 3 and the solder joint forming apparatus 1 independently. In this case, the transport mechanism may be able to execute a retraction operation for retracting the solder joint forming apparatus 1 from the target area 20 while maintaining the positional relationship between the imaging apparatus 2 and the lighting apparatus 3 and the target area 20.

[0011] FIG. 3 is a side view schematically showing the positional relationship between the solder joint forming apparatus 1 and the imaging apparatus 2 and the lighting apparatus 3. The target area 20 is an area to be subjected to a soldering process by the solder joint forming apparatus 1. The target area 20 includes a land 22 and a lead 23 on a printed circuit board 21. As shown in FIG. 3, an axis Z0 extending along the extending direction of the lead 23 (or the normal direction of the upper surface of the printed circuit board 21) is defined, an axis Z1 extending along the optical axis direction of the imaging apparatus 2 is defined, and an axis Z2 extending along the length direction of the solder spatula 11 is defined.

[0012] The solder joint forming device 1 is arranged on the opposite side of the imaging device 2 and the lighting device 3 with the target area 20 interposed therebetween. The angle formed by the axis Z0 and the axis Z1 is, for example, 60 degrees. However, it is not limited to this example and may be other than 60 degrees. The angle formed by the axis Z0 and the axis Z2 is, for example, 45 degrees. However, it is not limited to this example and may be other than 45 degrees.

[0013] The lighting device 3 is a ring light coaxially arranged with the imaging device 2, and the imaging direction by the imaging device 2 and the lighting direction by the lighting device 3 are equal in the extending direction of the axis Z1. However, the lighting device 3 may be other than a ring light, and the imaging direction by the imaging device 2 and the lighting direction by the lighting device 3 may be offset within a predetermined range.

[0014] Referring to FIGS. 1 to 3, the soldering iron 11 forms a solder joint 32 (see, for example, FIG. 7A) on the target area 20 for soldering by heating the solder 31 supplied from the solder supply device 12. The control device 4 controls the operation of the solder joint forming device 1. The imaging device 2 is configured to include an image sensor such as a CMOS or a CCD and an optical system, and images the solder joint 32 formed on the target area 20 from a predetermined direction (the axis Z1 direction). The control device 4 controls the imaging operation of the imaging device 2. The lighting device 3 is configured to include a ring light or the like, and illuminates the solder joint 32 formed on the target area 20 from the above-mentioned predetermined direction (the axis Z1 direction). The control device 4 controls the operation (execution or stop of illumination) of the lighting device 3.

[0015] Figure 4 is a simplified diagram showing the configuration of the control device 4. The control device 4 comprises a processing unit 41, an input unit 42, a display unit 43, and a storage unit 44. The processing unit 41 is configured using a processor (information processing device) such as a CPU. The input unit 42 is configured using operation switches, etc. The display unit 43 is configured using a liquid crystal display or an organic EL display, etc. The input unit 42 and the display unit 43 may be integrated using a touch panel display, etc. The storage unit 44 is configured using an HDD, SSD, or semiconductor memory, etc. The storage unit 44 stores a program 51 and control data 52. The storage unit 44 has a computer-readable non-volatile storage medium such as ROM, and the program 51 is stored in the storage medium.

[0016] Figure 5 is a simplified diagram showing the functional configuration of the processing unit 41. The processing unit 41 comprises a control unit 61, an acquisition unit 62, an image processing unit 63, a determination unit 64, and an output unit 65, as functions realized by the processor executing the program 51 read from the storage unit 44. The processing content performed by each unit will be described later.

[0017] Figure 6 is a flowchart showing the processes executed by the processing unit 41. Figures 7A to 7D are schematic side views illustrating the processes executed by the processing unit 41.

[0018] As shown in Figure 7A, in step SP01, the control unit 61 first transports the solder joint forming device 1, the imaging device 2, and the illumination device 3 to the desired position by causing the transport mechanism to perform a transport process. The control unit 61 also causes the solder joint forming device 1 to perform a soldering process to form a solder joint 32 in the target area 20. The soldering iron 11 forms the solder joint 32 in the target area 20 by heating the solder 31 supplied from the solder supply device 12.

[0019] As shown in Figure 7B, in step SP02, the control unit 61 causes the transport mechanism to retract the solder joint forming device 1, thereby retracting the solder joint forming device 1 from the target area 20 while maintaining the positional relationship between the imaging device 2 and the illumination device 3 and the solder joint forming device 1. As a result, the imaging device 2 and the illumination device 3 transport the solder joint 32 to a desired position where it can be imaged and illuminated.

[0020] As shown in Figure 7C, in step SP03, the control unit 61 then causes the imaging device 2 to perform imaging while the illumination device 3 is activated (turned on). As a result, the acquisition unit 62 acquires the first image of the solder joint 32.

[0021] As shown in Figure 7D, in step SP04, the control unit 61 causes the lighting device 3 to stop (turn off) the lighting and the imaging device 2 to perform imaging. As a result, the acquisition unit 62 acquires a second image of the solder joint 32. Throughout steps SP03 and SP04, ambient lighting such as ceiling lights remains on without any changes.

[0022] Regarding steps SP03 and SP04, the control unit 61 retracts the solder joint forming apparatus 1 from the target area 20, and then controls the imaging device 2 and illumination device 3 before a predetermined time corresponding to the solidification time of the solder joint 32 has elapsed, causing the acquisition unit 62 to acquire the first and second images. In other words, the imaging device 2 images the solder joint 32 without waiting for the solder joint 32 to solidify.

[0023] Figure 8A shows the first image G1 as a first example of the first image of the solder joint 32. In the drawings of this application, the image of the solder joint 32 is shown as a monochrome image, but in reality it is a color image. For example, the solder joint 32 is silver, the printed circuit board 21 is green, and the land 22 is orange. Since the solder joint 32 has a glossy surface before solidification, when the solder joint 32 is imaged with the illumination device 3 turned on, overexposure and blown-out whites occur in the center of the solder joint 32 due to reflected light from the surface of the solder joint 32.

[0024] Figure 8B shows the first image G2 as a second example of the first image of the solder joint 32. When imaging the solder joint 32 with the illumination device 3 turned on, the control unit 61 reduces the sensitivity of the imaging device 2 to the extent that overexposure does not occur in the central part of the solder joint 32. As a result, the central part of the solder joint 32 is properly exposed, while the inclined parts of the solder joint 32 included in the left and right regions R1 of the central part are underexposed. In step SP03, the acquisition unit 62 acquires the first image G2.

[0025] Figure 9 shows the second image G3 as an example of a second image of the solder joint 32. When the solder joint 32 is imaged with the illumination device 3 turned off, the entire solder joint 32 is illuminated in a low-contrast state by ambient lighting such as ceiling lights, so the solder joint 32 is properly exposed overall. The control unit 61 appropriately sets the sensitivity of the imaging device 2 so that the entire solder joint 32 does not suffer from overexposure (blown-out highlights) or underexposure (crushed blacks). The sensitivity of the imaging device 2 when the solder joint 32 is imaged with the illumination device 3 turned off is set higher than the sensitivity of the imaging device 2 when the solder joint 32 is imaged with the illumination device 3 turned on. Note that even when the solder joint 32 is imaged with the illumination device 3 turned on, the solder joint 32 is illuminated by ambient lighting such as ceiling lights. In step SP04, the acquisition unit 62 acquires the second image G3.

[0026] Next, in step SP05, the image processing unit 63 performs image processing on the first image G2 acquired in step SP03 and the second image G3 acquired in step SP04 to create a luminance difference image showing the difference in luminance between the first image G2 and the second image G3.

[0027] Figure 10A shows a luminance difference image G4 as a first example of a luminance difference image. The luminance difference image G4 is a luminance difference image created based on the first image G2 and the second image G3. The image processing unit 63 calculates the luminance difference for each corresponding pixel by subtracting the luminance value of the first image G2 from the luminance value of the second image G3. The image processing unit 63 creates a binarized luminance difference image G4 by assigning a pixel value of "1" to pixels whose luminance difference is greater than or equal to a predetermined first threshold, and assigning a pixel value of "0" to pixels whose luminance difference is less than the first threshold. In the luminance difference image G4, pixels with a pixel value of "1" correspond to white pixels, and pixels with a pixel value of "0" correspond to black pixels. According to the luminance difference image G4, it can be seen that the shape of the inclined portion of the solder joint 32 included in region R1 is clearly visible. The luminance difference image G4 corresponds to the inspection target image for excessive defects and insufficient defects of the solder joint 32. An excess defect is a defect caused by an oversupply of solder 31, and an undersupply defect is a defect caused by an insufficient supply of solder 31. A first reference image corresponding to the brightness difference image of the allowable upper limit of the solder joint 32, and a second reference image corresponding to the brightness difference image of the allowable lower limit of the solder joint 32 are created in advance and stored in the storage unit 44 in the control data 52.

[0028] Figure 10B shows a second example of a luminance difference image, luminance difference image G5. Luminance difference image G5 is a binarized image of the first image G1. Region R2 of luminance difference image G5 contains white pixels that differ in shape from the sloping part of the solder joint 32. This is because the solder smoke that was present in the first image G1 has become visible in luminance difference image G5. The white pixels in region R2 do not appear in luminance difference image G4.

[0029] Furthermore, when creating the luminance difference image G4, the image processing unit 63 may exclude pixels corresponding to the color components of the printed circuit board 21 from the creation of the luminance difference image G4 from the first image G2 and the second image G3. For example, the image processing unit 63 converts the color space of the first image G2 and the second image G3 from RGB to HSV and excludes the green component (45≦H≦90) of the printed circuit board 21 from the calculation. This limits the scope of the creation of the luminance difference image G4, thereby reducing the processing load.

[0030] Furthermore, the image processing unit 63 may clip region R1, which is the image region corresponding to the inclined portion of the solder joint 32, from the first image G2 and the second image G3, and create a luminance difference image G4 with respect to the clipped region R1. The coordinate information of region R1 to be clipped is set in advance according to the position of the solder joint 32 within the printed circuit board 21 and is included in the control data 52 and stored in the storage unit 44. This makes it possible to limit the target for creating the luminance difference image G4, thereby reducing the processing load.

[0031] Furthermore, the soldering apparatus 100 is further equipped with a safety cover that covers the entire apparatus, and this safety cover may be made of a frosted or translucent material. The control device 4, which has an input unit 42 and a display unit 43 that require access by the operator, is located outside the safety cover. The solder joint forming apparatus 1, the imaging apparatus 2, and the illumination apparatus 3 are housed in the internal space of the safety cover. By providing a frosted or translucent cover material, it is possible to prevent operators and others around the soldering apparatus 100 from being reflected on the surface of the solder joint 32 before it solidifies, thereby improving the accuracy of defect detection.

[0032] Next, in step SP06, the determination unit 64 determines whether the solder joint 32 is defective (excess or deficiency) based on the brightness difference image G4, which is the image to be inspected, and the first reference image and the second reference image.

[0033] The determination unit 64 identifies pixels (hereinafter referred to as "excess pixels") for each corresponding pixel that have a pixel value of "1" in the luminance difference image G4 but a pixel value of "0" in the first reference image, and calculates a first evaluation value by counting the number of identified excess pixels. The determination unit 64 determines that an excess defect has occurred if the first evaluation value is equal to or greater than a predetermined first reference value. The first reference value is set in advance and stored in the storage unit 44 in the control data 52.

[0034] Furthermore, the determination unit 64 identifies pixels for each corresponding pixel that have a pixel value of "1" in the second reference image and a pixel value of "0" in the luminance difference image G4 (hereinafter referred to as "missing pixels"), and calculates a second evaluation value by counting the number of identified missing pixels. The determination unit 64 determines that a deficiency defect has occurred if the second evaluation value is equal to or greater than a predetermined second reference value. The second reference value is set in advance and stored in the storage unit 44 in the control data 52.

[0035] The determination unit 64 determines that neither excessive defects nor insufficient defects have occurred if the first evaluation value is less than the first reference value and the second evaluation value is less than the second reference value.

[0036] The determination unit 64 may determine only one of the two: an excess of defects or an deficiency. Alternatively, the determination unit 64 may determine an excess of defects or an deficiency by comparing the total number of pixels with a pixel value of "1" in the luminance difference image G4 with predetermined allowable upper and lower limits.

[0037] Furthermore, the determination unit 64 may determine over-defects and under-defects based on the average value of the pixel values. In determining over-defects, the determination unit 64 may identify pixels for each pixel whose pixel value is "1" in the luminance difference image G4 and whose pixel value is "0" in the first reference image (hereinafter referred to as "over-pixels"), and calculate a first average evaluation value by dividing the sum of the number of pixels of the identified over-pixels by the area of ​​the luminance difference image G4. The determination unit 64 determines that an over-defect has occurred if the first average evaluation value is equal to or greater than a predetermined first average reference value. In determining under-defects, the determination unit 64 may identify pixels for each pixel whose pixel value is "1" in the second reference image and whose pixel value is "0" in the luminance difference image G4 (hereinafter referred to as "under-pixels"), and calculate a second average evaluation value by dividing the sum of the number of pixels of the identified under-pixels by the area of ​​the luminance difference image G4. The determination unit 64 determines that an under-defect has occurred if the second average evaluation value is equal to or greater than a predetermined second average reference value. Here, the sizes of the luminance difference image G4, the first reference image, and the second reference image are predetermined to be the same. By making a determination based on the average value of the pixel values, the same criteria can be used even if the image size changes.

[0038] Furthermore, instead of creating the first and second reference images individually, a common third reference image may be created in advance. The determination unit 64 may use, for example, 120% of the pixel values ​​of the third reference image as the first reference value, and 80% of the pixel values ​​of the third reference image as the second reference value. The determination unit 64 may determine that there is an excess defect if the sum of the number of pixels in the luminance difference image G4 is greater than or equal to the first reference value, and that there is a deficiency defect if it is less than or equal to the second reference value. Since it is not necessary to determine excess defects and deficiencies individually, the determination time can be shortened. Note that the numerical values ​​of the first and second reference values ​​are not limited to the above examples; for example, the first reference value may be any value included in 101-130% of the pixel values ​​of the third reference image, and the second reference value may be any value included in 70-99% of the pixel values ​​of the third reference image. In addition, the determination unit 64 may use the third reference image and determine excess defects and deficiencies based on the average value of the pixel values. The method used by the determination unit 64 to determine excessive defects and insufficient defects is not limited to the above example and can be any method.

[0039] Figures 11A to 11D show images G6A to G6D of various solder joints 32 with different solder supply amounts 31. The first reference image, which corresponds to the brightness difference image of the upper limit of the allowable value of the solder joint 32, is created, for example, based on image G6C shown in Figure 11C. The second reference image, which corresponds to the brightness difference image of the lower limit of the allowable value of the solder joint 32, is created, for example, based on image G6B shown in Figure 11B. The first and second reference images can be arbitrarily set by the user using the soldering apparatus 100. Image G6D shown in Figure 11D corresponds to a solder joint 32 with excessive soldering and defects. Image G6A shown in Figure 11A corresponds to a solder joint 32 with insufficient soldering and defects.

[0040] Next, in step SP07, the determination unit 64 determines the wetting defect of the solder joint 32 based on the first image acquired in step SP03. Specifically, the image processing unit 63 creates a color component image corresponding to the color components of the land 22 based on the first image, and the determination unit 64 determines the wetting defect based on this color component image. The color component image is an image in which a specific range of color components are extracted and visualized from the various color components contained in the image.

[0041] Figure 12 shows the first image G7 as an example of a first image of a solder joint 32 where wetting defects have occurred. As described above, the solder joint forming apparatus 1 is located on the opposite side of the target area 20 from the imaging apparatus 2 and the illumination apparatus 3. Therefore, the imaging apparatus 2 cannot image the solder joint forming apparatus 1 side of the solder joint 32, but since the possibility of wetting defects occurring on the solder joint forming apparatus 1 side is low, it is sufficient to image only the side of the imaging apparatus 2 and illumination apparatus 3. In the first image G7, a part of the land 22 is exposed due to wetting defects.

[0042] Figure 13 shows a color component image G8 as an example of a color component image corresponding to the color component of land 22. The image processing unit 63 creates the color component image G8 by extracting pixels corresponding to the color component of land 22 from the first image G7 and binarizing them. For example, the image processing unit 63 converts the color space of the first image G2 from RGB to HSV and extracts the orange component (0≦H≦30) of land 22. The image processing unit 63 creates the binarized color component image G8 by assigning a pixel value of "1" to the pixels from which the color component of land 22 has been extracted, and assigning a pixel value of "0" to the other pixels. In the color component image G8, pixels with a pixel value of "1" correspond to white pixels, and pixels with a pixel value of "0" correspond to black pixels. According to the color component image G8, the shape of land 22 exposed due to wetting defects is clearly visible. The color component image G8 corresponds to the inspection target image for wetting defects of the solder joint 32.

[0043] The image processing unit 63 may, instead of using the first image acquired in step SP03, create a color component image corresponding to the color components of the land 22 based on the second image acquired in step SP04.

[0044] Furthermore, the image processing unit 63 may clip a region R3 in the first or second image that corresponds to the position of the land 22 (i.e., the position where the land 22 is located), and create a color component image for the clipped region R3. The coordinate information of the region R3 to be clipped is set in advance according to the position of the solder joint 32 within the printed circuit board 21 and is included in the control data 52 and stored in the storage unit 44. This makes it possible to limit the target for creating the color component image, thereby reducing the processing load.

[0045] The determination unit 64 calculates a third evaluation value by counting the number of pixels with a pixel value of "1" in the color component image G8. The determination unit 64 determines that a wetting defect has occurred if the third evaluation value is equal to or greater than a predetermined second threshold. The second threshold is set in advance and stored in the storage unit 44 in the control data 52.

[0046] Next, in step SP08, the output unit 65 outputs the judgment results of the judgment unit 64 regarding excess / deficient defects and wetting defects. The judgment results are provided to the user, for example, by being displayed on the display unit 43 of the control device 4.

[0047] Next, in step SP09, the control unit 61 determines whether or not there are any unformed soldering targets, that is, whether or not there are any solder joints to be formed next.

[0048] If there is another solder joint (step SP09: YES), the processing unit 41 updates the target soldering target and repeatedly executes the process from step SP01 onwards.

[0049] If there are no further solder joints (step SP09: NO), the processing unit 41 terminates the process.

[0050] In the above embodiment, all inspections for excessive soldering, insufficient soldering, and poor wetting of the solder joint 32 were performed, but it is also possible to perform only one of these inspections.

[0051] According to this embodiment, the control device 4 obtains a first image G2 of the solder joint 32 by having the imaging device 2 perform imaging while the illumination device 3 is performing illumination, and obtains a second image G3 of the solder joint 32 by having the imaging device 2 perform imaging while the illumination device 3 is stopped. The control device 4 also creates a luminance difference image G4 showing the difference in luminance between the first image G2 and the second image G3, and determines at least one of the solder joint 32 to be either excessively defective or insufficiently defective based on the created luminance difference image G4. As a result, there is no need to wait for imaging to start until the solder joint 32 has solidified and lost its gloss, thus shortening the time required for the defect determination process of the solder joint 32.

[0052] As described above, this invention discloses various aspects of technology, but the main technologies are summarized below.

[0053] A soldering apparatus according to a first aspect of the present invention comprises: a solder joint forming apparatus having a soldering iron and forming a solder joint in a target area for soldering; an imaging apparatus for imaging the solder joint formed in the target area from a predetermined direction; an illumination apparatus for illuminating the solder joint formed in the target area from the predetermined direction; and a control device. The control device acquires a first image of the solder joint by causing the imaging apparatus to perform imaging while the illumination apparatus is performing illumination; acquires a second image of the solder joint by causing the imaging apparatus to perform imaging while the illumination apparatus is stopped; creates a luminance difference image showing the difference in luminance between the first image and the second image; and determines at least one of the over-defect and under-defect of the solder joint based on the luminance difference image.

[0054] According to the first embodiment, since there is no need to wait for imaging to occur until the solder joint solidifies and loses its gloss, the time required for defect detection processing of the solder joint can be shortened.

[0055] In the soldering apparatus according to the second aspect of the present invention, in the first aspect, the solder joint forming apparatus forms the solder joint on a land included in the target area, and the control device further determines the wetting defects of the solder joint based on the first image or the second image.

[0056] According to the second embodiment, it becomes possible to determine not only excessive and insufficient solder joint defects, but also wetting defects.

[0057] In the soldering apparatus according to the third aspect of the present invention, in the second aspect, in determining the wetting defect, the control device creates a color component image corresponding to the color component of the land based on the first image or the second image, and determines the wetting defect based on the color component image.

[0058] According to the third embodiment, it becomes possible to easily and accurately determine wetting defects.

[0059] In the soldering apparatus according to the fourth aspect of the present invention, in the third aspect, in creating the color component image, the control device clips an image region from the first image or the second image that corresponds to the position of the land, and creates the color component image with respect to the clipped image region.

[0060] According to the fourth embodiment, the target for creating the color component image can be limited, thereby reducing the processing load.

[0061] In the soldering apparatus according to the fifth aspect of the present invention, in any one of the first to fourth aspects, when acquiring the first and second images, the control device retracts the solder joint forming apparatus from the target area and acquires the first and second images before a predetermined time corresponding to the solidification time of the solder joint has elapsed.

[0062] According to the fifth embodiment, since the first and second images are acquired before a predetermined time corresponding to the solidification time of the solder joint has elapsed, it is possible to shorten the time required for the defect detection process of the solder joint.

[0063] A soldering apparatus according to the sixth aspect of the present invention further comprises a frosted or translucent cover member that houses the solder joint forming apparatus, the imaging apparatus, and the illumination apparatus in an internal space, in any one of the first to fifth aspects.

[0064] According to the sixth embodiment, it is possible to prevent workers and others around the soldering device from being reflected on the surface of the solder joint before it solidifies, thereby further improving the accuracy of defect detection.

[0065] In the seventh aspect of the present invention, in any one of the first to sixth aspects, the solder joint forming apparatus forms the solder joint on a printed circuit board, and in creating the luminance difference image, the control device excludes pixels corresponding to the color components of the printed circuit board from the creation of the luminance difference image from the first image and the second image.

[0066] According to the seventh embodiment, the target for creating luminance difference images can be limited, thereby reducing the processing load.

[0067] In the soldering apparatus according to the eighth aspect of the present invention, in any one of the first to seventh aspects, when creating the luminance difference image, the control device clips an image region from the first image and the second image that corresponds to the inclined portion of the solder joint, and creates the luminance difference image with respect to the clipped image region.

[0068] According to the eighth aspect, the target for creating luminance difference images can be limited, thereby reducing the processing load.

[0069] A soldering apparatus according to a ninth aspect of the present invention comprises a solder joint forming apparatus having a soldering iron and forming a solder joint on a land included in a target area for soldering, an imaging apparatus that images the solder joint formed in the target area from a predetermined direction, and a control device, wherein the control device obtains an image of the solder joint by causing the imaging apparatus to perform the imaging after the solder joint forming apparatus has completed forming the solder joint and before it starts forming the next solder joint, and determines whether the solder joint is poorly wetted based on the image.

[0070] According to the ninth aspect, while a solder joint forming apparatus sequentially forms multiple solder joints, it becomes possible to sequentially determine the wetting defects of each solder joint in-line. Furthermore, since there is no need to wait for imaging until the solder joint solidifies and loses its gloss, the time required for determining the wetting defects of the solder joint can be shortened.

[0071] A program according to a tenth aspect of the present invention is a soldering apparatus comprising: a solder joint forming apparatus having a soldering iron and forming a solder joint in a target area for soldering; an imaging apparatus for imaging the solder joint formed in the target area from a predetermined direction; an illumination apparatus for illuminating the solder joint formed in the target area from the predetermined direction; and a control device, wherein the program causes an information processing apparatus mounted on the control device to execute processing, the processing being: obtaining a first image of the solder joint by causing the imaging apparatus to perform imaging while the illumination apparatus is performing illumination; obtaining a second image of the solder joint by causing the imaging apparatus to perform imaging while the illumination apparatus is stopped; creating a luminance difference image showing the difference in luminance between the first image and the second image; and determining at least one of the over-defect and under-defect of the solder joint based on the luminance difference image.

[0072] According to the tenth embodiment, since there is no need to wait for imaging to occur until the solder joint solidifies and loses its gloss, the time required for defect detection processing of the solder joint can be shortened.

Claims

1. A solder joint forming apparatus having a soldering iron, which forms a solder joint in the area to be soldered, An imaging device for imaging the solder joint formed in the target region from a predetermined direction, A lighting device that illuminates the solder joint formed in the target area from the predetermined direction, Control device and Equipped with, The control device is By having the lighting device perform the illumination and the imaging device perform the imaging, a first image of the solder joint is obtained. With the illumination device stopped, the imaging device is made to perform the imaging, thereby acquiring a second image of the solder joint. A luminance difference image is created that shows the difference in luminance between the first image and the second image. Based on the brightness difference image, at least one of the over-defect and under-defect of the solder joint is determined. In acquiring the first and second images, the control device retracts the solder joint forming apparatus from the target area and acquires the first and second images before a predetermined time corresponding to the solidification time of the solder joint has elapsed. Soldering machine.

2. The solder joint forming apparatus forms the solder joint on a land included in the target region. The control device further determines whether the solder joint is poorly wetted based on the first image or the second image. Soldering apparatus according to claim 1.

3. In determining the wetting defect, the control device, Based on the first image or the second image, a color component image corresponding to the color component of the land is created. Based on the aforementioned color component image, the wetting defect is determined. Soldering apparatus according to claim 2.

4. In creating the aforementioned color component image, the control device, Clip the image region of the first or second image that corresponds to the position of the land, A color component image is created with respect to the clipped image region. Soldering apparatus according to claim 3.

5. The device further comprises a frosted or translucent cover member that houses the solder joint forming apparatus, the imaging apparatus, and the illumination apparatus within its internal space. Soldering apparatus according to claim 1.

6. The solder joint forming apparatus forms the solder joint on a printed circuit board. In creating the luminance difference image, the control device excludes pixels corresponding to the color components of the printed circuit board from the creation of the luminance difference image, from the first image and the second image. Soldering apparatus according to claim 1.

7. In creating the luminance difference image, the control device, Of the first and second images, the image region corresponding to the inclined portion of the solder joint is clipped. A luminance difference image is created with respect to the clipped image region. Soldering apparatus according to claim 1.

8. A solder joint forming apparatus having a soldering iron, which forms a solder joint on a land included in the area to be soldered, An imaging device for imaging the solder joint formed in the target region from a predetermined direction, Control device and Equipped with, The control device is After the solder joint forming apparatus has completed forming the solder joint, and before starting to form the next solder joint, the imaging device is made to perform imaging to acquire an image of the solder joint. Based on the above image, the wetting defect of the solder joint is determined, In acquiring the aforementioned image, the control device retracts the solder joint forming apparatus from the target area and acquires the image before a predetermined time corresponding to the solidification time of the solder joint has elapsed. Soldering machine.

9. A soldering apparatus comprising: a solder joint forming apparatus having a soldering iron and forming a solder joint in a target area for soldering; an imaging apparatus for imaging the solder joint formed in the target area from a predetermined direction; an illumination apparatus for illuminating the solder joint formed in the target area from the predetermined direction; and a control device, wherein a program for causing an information processing apparatus mounted on the control device to execute processing, The aforementioned process is, By having the lighting device perform the illumination and the imaging device perform the imaging, a first image of the solder joint is obtained. With the illumination device stopped, the imaging device is made to perform the imaging, thereby acquiring a second image of the solder joint. A luminance difference image is created that shows the difference in luminance between the first image and the second image. Based on the brightness difference image, at least one of the over-defect and under-defect of the solder joint is determined. In acquiring the first and second images, the control device retracts the solder joint forming apparatus from the target area and acquires the first and second images before a predetermined time corresponding to the solidification time of the solder joint has elapsed. program.

Images