Method for manufacturing a pixel definition layer

Abstract

To provide a photosensitive resin composition capable of improving recognizability by lowering reflectance around 550 nm wavelength that most influences on the recognizability.SOLUTION: A method for producing a pixel defining layer includes the steps of applying and coating a photosensitive composition, pre-baking, exposing, developing, and post-heat treatment, and after the post-heat treatment, the optical density (OD) is 0.8 to 1.5 / μm or less, preferably 0.83 to 1.4 / μm or less, more preferably 0.9 to 1.3 / μm or less, and the reflectance is more than 0.01% and less than 6.5%, preferably more than 0.01% and less than 6.3%.EFFECT: By realizing a colored pattern with high optical density on an electrode substrate, not only is the color vivid, but also the reliability and life of the display are improved.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a pixel definition layer for a light-emitting display device using a photosensitive composition. [Background technology]

[0002] Plane displays widely use liquid crystal display devices (LCDs) and organic light-emitting display devices (OLEDs). Of these, organic light-emitting display devices have advantages such as low power consumption, fast response speed, high color reproduction, high brightness, and wide viewing angle.

[0003] In the case of the aforementioned organic light-emitting display device, a polarizing film is used to block the light that is incident on the panel and reflected from it. However, a disadvantage of this polarizing film is that it is not suitable for use in flexible devices due to insufficient bending properties.

[0004] To address the aforementioned problems, methods have been proposed that involve forming an inorganic film for light blocking on the upper substrate in addition to the color filter and black matrix. However, these methods have limitations in obtaining the desired level of anti-reflective effect and do not offer a concrete alternative to polarizing film.

[0005] On the other hand, colored light-shielding layers, particularly black light-shielding layers, are used in liquid crystal display devices to prevent color interference between red, green, and blue color filters and improve image quality. Recently, the use of such colored light-shielding layers in organic light-emitting displays has been studied for the same purpose, as well as to improve image visibility through low reflectivity.

[0006] In the production of the aforementioned colored pattern, various types of organic pigments as well as carbon black and inorganic pigments are used as colorants, and a pigment dispersion containing these pigments is mixed with other compositions to form the pattern.

[0007] Such patterns offer superior visibility at higher optical density (OD) levels because they block light transmitted from the outside or reflected from below. Organic light-emitting displays made with pixels formed in this way can achieve more vivid colors. However, research is needed to effectively reduce reflectivity around 550 nm, which has the greatest impact on visibility. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Korean Published Patent No. 10-2022-0045744 [Patent Document 2] Korean Published Patent Publication No. 10-2022-0094479 [Overview of the project] [Problems that the invention aims to solve]

[0009] The present invention aims to provide a photosensitive resin composition that can improve visibility by reducing the reflectance around the 550 nm wavelength, which has the greatest impact on visibility.

[0010] Furthermore, the present invention aims to provide a light-shielding layer manufactured using the photosensitive resin composition and a display device containing the light-shielding layer. [Means for solving the problem]

[0011] The method for manufacturing a pixel definition layer according to the present invention comprises the steps of applying and coating a photosensitive composition; pre-baking; exposure; developing; and post-heat treatment, wherein after the post-heat treatment step the optical density (OD) is 0.8 to 1.5 / μm or less, preferably 0.83 to 1.4 / μm or less, more preferably 0.9 to 1.3 / μm or less; and the reflectance is greater than 0.01% but less than 6.5%, preferably greater than 0.01% but 6.3% or less.

[0012] It is more preferable that the oven temperature during the post-heat treatment step is 250-270°C.

[0013] It is more preferable that the aforementioned post-heat treatment step lasts for 60 to 120 minutes.

[0014] The aforementioned photosensitive composition preferably contains a coloring agent.

[0015] The coloring agent is preferably present in an amount of 17 to 35% by weight relative to the total amount of the photosensitive composition.

[0016] The coloring agent preferably contains one or more inorganic dyes, organic dyes, inorganic pigments, and organic pigments.

[0017] The coloring agent is preferably pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0018] The photosensitive composition preferably contains a patterning resin comprising an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0019] The weight-average molecular weight of the acrylic binder resin is preferably 3,000 g / mol to 150,000 g / mol.

[0020] The cardo-based binder resin preferably contains a repeating structure of the following chemical formula 1.

[0021] [ka]

[0022] In the aforementioned chemical formula 1,

[0023] 1) R 1 and R 2 These are hydrogen; deuterium; halogen; C6~C, independently of each other. 30 An aryl group; containing at least one heteroatom of O, N, S, Si, and P (C2-C2).30 heterocyclic group; C6-C 30 fused ring group of aliphatic ring and aromatic ring; C1-C 20 alkyl group; C2-C 20 alkenyl group; C2-C 20 alkynyl group; C1-C 20 alkoxy group: C6-C 30 aryloxy group; fluorenyl group: carbonyl group; ether group; or C1-C 20 alkoxycarbonyl group, and

[0024] 2) R 1 and R 2 can form a ring with adjacent groups,

[0025] 3) m or n is independently an integer from 0 to 4,

[0026] 4) A1 and A2 are independently the following Chemical Formula 2 or Chemical Formula 3,

[0027]

Chemical formula

[0028]

Chemical formula

[0029] In the Chemical Formula 2 and Chemical Formula 3,

[0030] 4-1) * indicates the connecting site,

[0031] 4-2) R 3 ~R 6 are independently hydrogen; deuterium; halogen; C6-C 30 aryl group; C2-C containing at least one heteroatom of O, N, S, Si and P 30 heterocyclic group; C6-C 30 fused ring group of aliphatic ring and aromatic ring; C1-C 20 alkyl group; C2-C 20alkenyl group; C2~C 20 Alkynyl group of C1~C 20 alkoxy group; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 It is an alkoxycarbonyl group,

[0032] 4-3)R 3 ~R 6 The adjacent groups can form rings,

[0033] 4-4)Y 1 and Y 2 These are independently of each other, and are either chemical formula 6 or chemical formula 7 below.

[0034] [ka]

[0035] [ka]

[0036] In the aforementioned chemical formulas 6 and 7,

[0037] 4-4-1)* indicates the bond position,

[0038] 4-4-2)R 9 is hydrogen or methyl,

[0039] 4-4-3)R 10 ~R 13 These are hydrogen; deuterium; halogens; C6~C, independently of each other. 30 An aryl group; containing at least one heteroatom of O, N, S, Si, and P (C2-C2). 30 heterocyclic group; C6~C 30 A fusion ring group of an aliphatic ring and an aromatic ring; C1~C 20 alkyl groups; C2~C 20 alkenyl group; C2~C 20 Alkynyl group of C1~C 20alkoxy group; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 It is an alkoxycarbonyl group.

[0040] 4-4-4)L 1 ~L 3 These are single bonds that are independent of each other; fluorenylene group; C2~C 30 Alkylene; C6~C 30 Allylene; C2~C 30 A heterocycle of C1~C 30 Alkoxylenes; C2~C 30 Alkylene oxy; C6~C 30 Aryloxy group; C2~C 30 It is a polyethylene oxy group,

[0041] 4-4-5) q and r are independent integers between 0 and 3; however, q + r = 3,

[0042] 5) The ratio of A1 to A2 in the polymer chain of the resin containing the repeating unit represented by chemical formula 1 is 9:1 or 1:9.

[0043] 6)X 1 It is a single bond; O; CO; SO2; CR'R”; SiR'R”; chemical formula 4; or chemical formula 5 below,

[0044] 6-1) R' and R'' are independently hydrogen; deuterium; halogen; C6~C 30 C2-C containing an aryl group and at least one heteroatom of O, N, S, Si, and P 30 heterocyclic group; C6~C 30 A fusion ring group of an aliphatic ring and an aromatic ring; C1~C 20 alkyl groups; C2~C 20 alkenyl group; C2~C 20 Alkynyl group of C1~C 20 alkoxy group; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 It is an alkoxycarbonyl group,

[0045] (6-2) R' and R'' can form a ring with adjacent groups,

[0046] [ka]

[0047] [ka]

[0048] In the aforementioned chemical formulas 4 and 5,

[0049] 6-3)* indicates the bond position,

[0050] 6-4)R 7 ~R 8 These are hydrogen; deuterium; halogens; C6~C, independently of each other. 30 An aryl group; containing at least one heteroatom of O, N, S, Si, and P (C2-C2). 30 heterocyclic group; C6~C 30 A fusion ring group of an aliphatic ring and an aromatic ring; C1~C 20 alkyl groups; C2~C 20 alkenyl group; C2~C 20 Alkynyl group of C1~C 20 alkoxy group; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 It is an alkoxycarbonyl group,

[0051] 6-5) o and p are integers between 0 and 4, independently of each other.

[0052] 7)X 2 C6~C 30 C2-C containing an aryl group and at least one heteroatom of O, N, S, Si, and P 30 heterocyclic group, C6~C 30 A fusion ring group of an aliphatic ring and an aromatic ring, C1~C 20an alkyl group, C2-C 20 an alkenyl group; C2-C 20 an alkynyl group; C1-C 20 an alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group: a carbonyl group; an ether group; or a C1-C 20 alkoxycarbonyl group,

[0053] (8) said R’, R”, X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 are each deuterium; a halogen; a C1-C 30 alkyl group or a C6-C 30 aryl group substituted or unsubstituted silane group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; a C1-C 30 alkylthio group; a C1-C 30 alkoxy group; a C6-C 30 arylalkoxy group; a C1-C 30 alkyl group, C2-C 30 alkenyl group; C2-C 30 alkynyl group; C6-C 30 aryl group; a C6-C 30 aryl group substituted with deuterium; a fluorenyl group; a C2-C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 heterocyclic group; C3-C 30 aliphatic ring group; C7-C 30 arylalkyl group; C8-C 30 arylalkenyl group; and can be further substituted with one or more substituents selected from the group consisting of combinations thereof, and adjacent substituents can form a ring with each other.

[0054] The weight average molecular weight of the cardo resin is preferably 1,000 to 100,000 g / mol.

[0055] The cardo resin is preferably included in an amount of 1 to 30% by weight relative to the total amount of the photosensitive composition.

[0056] The photosensitive composition preferably contains 1 to 40% by weight of a reactive unsaturated compound relative to its total amount.

[0057] The photosensitive composition preferably contains 0.01 to 10% by weight of a photoinitiator based on its total amount.

[0058] Another specific example is that the present invention preferably provides a pixel definition layer manufactured by the above manufacturing method.

[0059] Another specific example is that the present invention preferably provides an organic light-emitting display device including the pixel definition layer.

[0060] Another specific example is that the present invention preferably provides an electronic device including the display device and a control unit for driving the display device. [Effects of the Invention]

[0061] This invention aims to realize a highly optically dense colored pattern on an electrode substrate, resulting in not only vivid colors but also improved display reliability and lifespan. Polarizing plates used in OLED displays generally have a reflectivity of 0.01% to 6%, but they have the physical disadvantages of being inflexible and heavy. On the other hand, the pixel separation layer according to this invention enables the realization of a flexible display, reducing the thickness and weight of the display. Furthermore, it has the advantage of achieving a reflectivity of 6.5% or less by blocking and absorbing externally reflected light. [Modes for carrying out the invention]

[0062] Hereinafter, some embodiments of the present invention will be described in detail with reference to illustrative drawings. When assigning reference numerals to the components in each drawing, the same reference numerals will be used for the same components as much as possible, even if they are shown in other drawings.

[0063] In the description of the present invention, if a specific description of a related known structure or function is deemed likely to obscure the gist of the invention, such detailed description may be omitted. Where "includes," "has," "constitutes," etc., as used herein, other parts may be added, as long as "only" is not used. Unless otherwise explicitly stated, a singular representation of a component includes multiple components.

[0064] Furthermore, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. Such terms are used to distinguish a component from other components, and the terms do not limit the nature, order, sequence, or number of the component.

[0065] When describing the spatial relationships of components, if it is stated that two or more components are “linked,” “joined,” or “connected,” it should be understood that while two or more components may be directly “linked,” “joined,” or “connected,” they may also be “linked” or “connected” through further “intermediation” between two or more components and other components. Here, the other components may be included in one or more of the two or more components that are “linked,” “joined,” or “connected” to each other.

[0066] Furthermore, when we say that a component such as a layer, film, region, or plate is "on top of" or "on" another component, this should be understood to include not only the case where it is "directly on top of" another component, but also the case where there is another component in between. Conversely, when we say that one component is "directly on top of" another, this should be understood to mean that there is no other component in between.

[0067] In descriptions of temporal relationships related to components, methods of operation, or manufacturing methods, when describing temporal or sequential relationships using phrases such as "after," "following," "next," or "before," it includes cases that are not continuous unless "immediately" or "directly" is used.

[0068] On the other hand, if numerical values ​​or corresponding information for a component are mentioned, even without further explicit mention, these numerical values ​​or corresponding information can be interpreted as including a range of errors that may arise due to various factors (e.g., process factors, internal or external shocks, noise, etc.).

[0069] The terms used in this specification and the appended claims, unless otherwise specified, have the following meanings, without departing from the spirit of the invention.

[0070] As used in this application, the terms "halo" or "halogen" include fluorine (F), chlorine (Cl), bromine (Br), and iodine (I), unless otherwise specified.

[0071] As used in this application, the terms "alkyl" or "alkyl group" refer to a radical of a saturated aliphatic active group having 1 to 60 carbon atoms linked by a single bond, including linear alkyl groups, branched alkyl groups, cycloalkyl (alicyclic) groups, alkyl-substituted cycloalkyl groups, and cycloalkyl-substituted alkyl groups, unless otherwise specified.

[0072] As used in this application, the terms "haloalkyl group" or "halogen alkyl group" mean an alkyl group substituted with a halogen, unless otherwise specified.

[0073] As used in this application, the terms "alkenyl" or "alkynyl" each have a double or triple bond, include a linear or side-chain group, and have 2 to 60 carbon atoms, unless otherwise specified.

[0074] As used in this application, the term "cycloalkyl" means, but is not limited to, an alkyl group forming a ring having 3 to 60 carbon atoms, unless otherwise specified.

[0075] As used in this application, the terms "alkoxy group" or "alkyloxy group" refer to an alkyl group to which an oxygen radical is bonded, and unless otherwise stated, have between 1 and 60 carbon atoms, but are not limited thereto.

[0076] In this application, the terms "alkeneoxyl group," "alkenoxy group," "alkenyloxyl group," or "alkenyloxy group" refer to an alkenyl group to which an oxygen radical is attached, and unless otherwise stated, have 2 to 60 carbon atoms, but are not limited thereto.

[0077] In this application, the terms "aryl group" and "arylene group" refer to, but are not limited to, groups having 6 to 60 carbon atoms, unless otherwise specified. In this application, aryl groups and arylene groups include single rings, ring aggregates, and compound systems of multiple joined rings. For example, the aryl group includes a phenyl group, a monovalent activator of biphenyl, a monovalent activator of naphthalene, a fluorenyl group, and a substituted fluorenyl group, while the arylene group includes a fluorenylene group and a substituted fluorenylene group.

[0078] As used in this application, the term "ring assemblies" refers to two or more ring systems (single rings or joined ring systems) directly linked to each other by single or double bonds, where the number of such direct links between rings is one less than the total number of ring systems in the compound. Ring assemblies can consist of identical or different ring systems directly linked to each other by single or double bonds.

[0079] In this application, the aryl group includes ring assemblies, and therefore includes biphenyl and terphenyl, in which a single aromatic ring, such as a benzene ring, is linked by a single bond. Furthermore, the aryl group also includes compounds in which an aromatic ring system bonded to a single aromatic ring is linked by a single bond, such as compounds in which a single aromatic ring, such as a benzene ring, is bonded to a fluorene, which is an aromatic ring system, is linked by a single bond.

[0080] As used in this application, the term "fused ring system" refers to a fused ring form that shares at least two atoms, and includes forms in which two or more hydrocarbon ring systems are fused, and forms in which at least one heterocyclic system containing at least one heteroatom is fused. Such fused ring systems may be aromatic rings, heteroaromatic rings, aliphatic rings, or combinations thereof. For example, in the case of aryl groups, these may be naphthalenyl groups, phenantrenyl groups, fluorenyl groups, etc., but are not limited to these.

[0081] The term "spiro compound" as used in this application refers to a "spiro union," which is a linkage formed by two rings sharing only one atom. In this case, the atom shared by the two rings is called a "spiro atom," and these compounds are called "monospiro-," "dispiro-," and "trispiro-" compounds, respectively, depending on the number of spiro atoms contained in a single compound.

[0082] In this application, the terms “fluorenyl group,” “fluorenylene group,” and “fluorentryyl group” refer to monovalent, divalent, or trivalent working groups in the following structures, respectively, where R, R', R'', and R''' are all hydrogen atoms, unless otherwise specified. “Substitutable fluorenyl group,” “substituted fluorenylene group,” or “substituted fluorentryyl group” means that at least one of the substituents R, R', R'', and R''' is a substituent other than hydrogen, and includes cases where R and R' are bonded to each other to form a spiro compound with the carbon atom to which they are bonded. In this specification, regardless of their valency (monovalent, divalent, trivalent, etc.), fluorenyl groups, fluorenylene groups, and fluorentryyl groups may all be named fluorene groups.

[0083] [ka]

[0084] Furthermore, R, R', R'', and R'' are each independently an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, and a heterocyclic group having 2 to 30 carbon atoms. For example, the aryl group may be phenyl, biphenyl, naphthalene, anthracene, or phenanthrene, and the heterocyclic group may be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidine, pyridazine, pyrazine, triazine, indole, benzofuranquinazoline, or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group may be monovalent or divalent activators of 9,9-dimethylfluorene, 9,9-diphenylfluorene, and 9,9'-spirobi[9H-fluorene], respectively.

[0085] As used in this application, the term "heterocyclic group" includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group" but also non-aromatic rings, and unless otherwise specified, means a ring with 2 to 60 carbon atoms containing one or more heteroatoms, but is not limited thereto. As used in this application, the term "heteroatom" refers to N, O, S, P, or Si unless otherwise specified, and heterocyclic group means a single ring, ring aggregate, joined ring system, spiro compound, etc., containing a heteroatom.

[0086] For example, "heterocyclic group" may include compounds containing heteroatom groups such as SO2 and P=O, as shown in the compounds below, instead of carbon atoms forming a ring.

[0087] [ka]

[0088] The term "ring" as used in this application includes single rings and polyrings, and includes not only hydrocarbon rings but also heterorings containing at least one heteroatom, and includes aromatic and non-aromatic rings.

[0089] The term "polycyclic" as used in this application includes ring assemblies such as biphenyl and terphenyl, fused ring systems, and spiro compounds, and includes not only aromatic but also non-aromatic compounds, and includes not only hydrocarbon rings but also heterocycles containing at least one heteroatom.

[0090] The term "aliphatic ring group" as used in this application refers to cyclic hydrocarbons excluding aromatic hydrocarbons, and includes single rings, ring aggregates, joined ring systems, spiro compounds, etc. Unless otherwise specified, it refers to rings with 3 to 60 carbon atoms, but is not limited to these. For example, a fusion of the aromatic ring benzene and the non-aromatic ring cyclohexane also constitutes an aliphatic ring.

[0091] Furthermore, when prefixes are used consecutively, it means that the substituents are listed in the order they are listed. For example, an arylalkoxy group means an alkoxy group substituted with an aryl group, an alkoxycarbonyl group means a carbonyl group substituted with an alkoxy group, and an arylcarbonylalkenyl group means an alkenyl group substituted with an arylcarbonyl group, where an arylcarbonyl group is a carbonyl group substituted with an aryl group.

[0092] Furthermore, unless otherwise explicitly stated, in the terms "substituted or unsubstituted" used in this application, "substituted" refers to deuterium, halogens, amino groups, nitrile groups, nitro groups, and C1-C123 30 alkyl groups, C1-C 30 Alkoxy group of C1~C 30 alkylamine group, C1~C 30 alkylthiophene group, C6~C 30 The arylthiophene group, C2~C 30 alkenyl group, C2~C 30 Alkynyl group, C3~C 30 Cycloalkyl groups, C6~C 30 The aryl group, deuterium-substituted C6-C 30 The aryl group, C8~C 30C2-C2 containing an aryl alkenyl group, silane group, boron group, germanium group, and at least one heteroatom selected from the group consisting of O, N, S, Si, and P. 30 This means that the molecule is substituted with one or more substituents selected from the group consisting of heterocyclic groups, and is not limited to these substituents.

[0093] In this application, the "name of the active group" corresponding to each symbol and its substituent, such as aryl groups, arylene groups, and heterocyclic groups, can be described as the "name of the active group reflecting its valency," or as the "name of the parent compound." For example, in the case of "phenanthrene," a type of aryl group, the monovalent "group" can be described as "phenanthryl(group)" and the divalent group as "phenanthrylene(group)," distinguishing the group by its valency, but it can also be described as "phenanthrene," the name of the parent compound, regardless of its valency.

[0094] Similarly, in the case of pyrimidines, they can be described as "pyrimidine" regardless of their valency, or they can be described as the "name of the group" corresponding to their valency, such as pyrimidinyl (group) for monovalent compounds and pyrimidinylene (group) for divalent compounds. Therefore, when describing the type of substituent in the name of the parent compound in this application, it may refer to an n-valent "group" formed by the removal of a hydrogen atom bonded to the carbon atom and / or heteroatom of the parent compound.

[0095] Furthermore, in this specification, when describing compound names and substituent names, numbers or letters indicating position may be omitted. For example, pyrido[4,3-d]pyrimidine can be written as pyridopyrimidine, benzoflo[2,3-d]pyrimidine as benzoflopyrimidine, and 9,9-dimethyl-9H-fluorene as dimethylfluorene. Therefore, both benzo[g]quinoxaline and benzo[f]quinoxaline can be written as benzoquinoxaline.

[0096] Furthermore, unless otherwise explicitly stated, the chemical formulas used in this application shall be applied in the same manner as the substituent definitions by exponential definition of the chemical formulas below.

[0097] [ka]

[0098] Here, if a is an integer of 0, the substituent R 1 This means that there are no atoms; that is, if a is 0, it means that all the carbon atoms forming the benzene ring are bonded to hydrogen atoms, in which case the hydrogen atoms bonded to the carbon atoms can be omitted, and the chemical formula or compound can be written. Also, if a is an integer of 1, one substituent R 1 It bonds to any one of the carbons forming the benzene ring, and when a is an integer of 2 or 3, for example, it can bond as follows, and when a is an integer of 4 to 6, it bonds to the carbon of the benzene ring in a similar manner, and when a is an integer of 2 or more, R 1 They may be identical or different from one another.

[0099] [ka]

[0100] Unless otherwise stated in this application, forming a ring means that adjacent groups bond to each other to form a single ring or multiple joined rings, the single ring and the multiple joined rings formed include a hydrocarbon ring as well as a heteroring containing at least one heteroatom, and include aromatic and non-aromatic rings.

[0101] Furthermore, unless otherwise stated herein, when a fused ring is indicated, the number in "number-fused ring" indicates the number of rings being fused. For example, a form in which three rings are fused together, such as anthracene, phenanthrene, and benzoquinazoline, can be written as a 3-fused ring.

[0102] On the other hand, the term "bridged bicyclic compound" as used in this application, unless otherwise specified, refers to a compound in which two rings share three or more atoms to form a ring. In this case, the shared atoms include carbon or heteroatoms.

[0103] In this application, the term "organic electrical element" can mean a component(s) between a positive electrode and a negative electrode, or it can mean an organic light-emitting diode that includes a positive electrode, a negative electrode, and components(s) located between them.

[0104] Furthermore, in some cases, the term "display device" in this application may mean an organic electrical element, an organic light-emitting diode and a panel containing the same, or an electronic device including a panel and a circuit. Here, for example, the electronic device may include, but is not limited to, lighting devices, solar cells, mobile or portable devices (e.g., smartphones, tablets, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer monitors, etc., and may be any form of device as long as it includes the aforementioned components(s).

[0105] The following describes in detail some examples of the present invention. However, these are presented as examples only and do not limit the present invention; rather, the present invention is defined solely by the scope of the claims described below.

[0106] A composition comprising a colorant according to one embodiment of the present invention is used to produce a red pattern, a green pattern, a blue pattern, or a black matrix, or a pixel definition layer (PDL).

[0107] A black pixel-defining layer (PDL) according to one embodiment of the present invention may further contain an organic black pigment or black dye as an additional colorant in addition to the colorant contained in the aforementioned colorant. For example, an organic pigment can be used alone, or an organic pigment and a colorant can be mixed and used. In this case, because a colorant with insufficient light-shielding properties is mixed, there is an advantage that the strength of the film (layer) or adhesion to the substrate does not decrease even if the amount of colorant increases relatively. A negative pixel-defining layer (Negative PDL (Pixel define layer)) according to one embodiment of the present invention may contain a black pigment or black dye as an additional colorant instead of the colorant contained in the aforementioned colorant.

[0108] The following sections will provide a detailed explanation of each component.

[0109] 1. The manufacturing process for the negative pixel definition layer is as follows:

[0110] (1) Application and coating stage

[0111] Photosensitive compositions are low-viscosity liquid samples, and after application to a substrate, a spin coater or slit coater is used to coat them to a uniform thickness. Spin coaters have the advantage that the thickness decreases as the rotation speed increases, but the flatness deviation over area decreases. For coating large-area substrates, slit coaters are preferable to spin coaters. After coating, residual solvent causes the surface to become fluid, which has the disadvantage of poor flatness. To overcome this, a portion of the solvent is removed using VCD (vacuum chamber dry) to reduce fluidity on the surface.

[0112] (2) Pre-baking stage

[0113] This step involves heating the coated substrate on a hot plate or in an oven at a constant temperature and time to remove some of the solvent contained in the coating film. If the surface or depth of the coating film is not dried, contamination of the photomask will occur during exposure in the next step, preventing proper curing in the exposed area when irradiated with ultraviolet light, and the uncured material will be removed during the development step without forming a pattern.

[0114] (3) Exposure stage

[0115] After the pre-baking process is completed, the photomast with the pattern formed on it is used to cure the formed film by irradiating it with active rays (ultraviolet light). The lamps used to generate the active rays can be LED lamps or metal (mercury) lamps, and the wavelengths are g-line (436nm), h-line (405nm), i-line (365nm), and Deep UV (<260nm), which can be used individually or in combination.

[0116] (4) Development stage

[0117] In the exposure stage, the image is divided into exposed and unexposed areas by a photomask during active ray irradiation. In the case of a positive type, the exposed areas dissolve in the developer, while the unexposed areas withstand the developer and retain the pattern. In the case of a negative type, the exposed areas harden and become resistant to the developer, while the unexposed areas are developed. The black pixel definition layer (Black PDL) produced with the composition containing the colorant of the present invention is of the negative type, and is divided into exposed areas (hardened) and unexposed areas (developed) to form a pattern.

[0118] (5) Post-heat treatment stage

[0119] This step involves heating the developed substrate at a high temperature of 210°C or higher to remove any remaining solvent and moisture. If the solvent and moisture are not completely removed in this step, the remaining solvent and moisture will affect the element in subsequent heat treatment steps, thereby impacting the element's lifespan, such as causing dark spots or pixel shrinkage.

[0120] In the present invention, the oven temperature during the post-heat treatment stage is preferably 250 to 270°C. Furthermore, the post-heat treatment stage is preferably 60 to 120 minutes long.

[0121] 2. The composition for forming the negative pixel definition layer containing a colorant is as follows:

[0122] (1) Resin for patterning

[0123] A patterning resin according to one embodiment of the present invention includes a cardo-based binder resin.

[0124] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin containing one or more acrylic repeating units.

[0125] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxyl groups, and specific examples include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or combinations thereof. The first ethylenically unsaturated monomer may be included in an amount of 5% to 50% by weight, for example, 10% to 40% by weight, relative to the total amount of the acrylic binder resin.

[0126] The second ethylenically unsaturated monomers include aromatic vinyl compounds such as styrene, α-methylstyrene, vinyltoluene, and vinylbenzyl methyl ether; unsaturated carboxylate ester compounds such as methyl(meth)acrylate, ethyl(meth)acrylate, butyl(meth)acrylate, 2-hydroxyethyl(meth)acrylate, 2-hydroxybutyl(meth)acrylate, benzyl(meth)acrylate, cyclohexyl(meth)acrylate, and phenyl(meth)acrylate; unsaturated aminoalkyl carboxylate compounds such as 2-aminoethyl(meth)acrylate and 2-dimethylaminoethyl(meth)acrylate; vinyl carboxylate ester compounds such as vinyl acetate; unsaturated glycidyl carboxylate ester compounds such as glycidyl(meth)acrylate; vinyl cyanide compounds such as (meth)acrylonitrile; and unsaturated amide compounds such as (meth)acrylamide. These can be used individually or in combination of two or more.

[0127] Specific examples of the acrylic binder resin include, but are not limited to, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, and (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer. These may be used individually or in combination of two or more. The weight-average molecular weight of the acrylic binder resin may be 3,000 g / mol to 150,000 g / mol, for example, 5,000 g / mol to 50,000 g / mol, or for example, 20,000 g / mol to 30,000 g / mol.

[0128] Cardo resins contain a repeating structure as shown in Chemical Formula 1 below.

[0129] [ka]

[0130] In the aforementioned chemical formula 1,

[0131] 1) R 1 and R 2 These are hydrogen; deuterium; halogens; C6~C, independently of each other. 30 An aryl group; containing at least one heteroatom of O, N, S, Si, and P (C2-C2). 30 heterocyclic group; C6~C 30 A fusion ring group of an aliphatic ring and an aromatic ring; C1~C 20 alkyl groups; C2~C 20 alkenyl group; C2~C 20 Alkynyl group of C1~C 20 alkoxy group; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 It is an alkoxycarbonyl group,

[0132] 2) R' and R'' can form a ring with adjacent groups.

[0133] 3) m or n are integers between 0 and 4, independently of each other.

[0134] 4) A1 and A2 are independently of each other, and are chemical formula 2 or chemical formula 3 below.

[0135] [ka]

[0136] [ka]

[0137] In the aforementioned chemical formulas 2 and 3,

[0138] 4-1)* indicates the connecting part,

[0139] 4-2)R 3 ~R 6 These are hydrogen; deuterium; halogens; C6~C, independently of each other.30 An aryl group; containing at least one heteroatom of O, N, S, Si, and P (C2-C2). 30 heterocyclic group; C6~C 30 A fusion ring group of an aliphatic ring and an aromatic ring; C1~C 20 alkyl groups, C2~C 20 alkenyl group; C2~C 20 Alkynyl group of C1~C 20 alkoxy group; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 It is an alkoxycarbonyl group,

[0140] 4-3)R 3 ~R 6 The adjacent groups can form rings,

[0141] 4-4)Y 1 and Y 2 These are independently of each other, and are either chemical formula 6 or chemical formula 7 below.

[0142] [ka]

[0143] [ka]

[0144] In the aforementioned chemical formulas 6 and 7,

[0145] 4-4-1)* indicates the bond position,

[0146] 4-4-2)R 9 is hydrogen or methyl,

[0147] 4-4-3)R 10 ~R 13 These are hydrogen; deuterium; halogens; C6~C, independently of each other. 30 The aryl group; C2-C containing at least one heteroatomy of O, N, S, Si and P.30 heterocyclic group; C6~C 30 A fusion ring group of an aliphatic ring and an aromatic ring; C1~C 20 alkyl groups, C2~C 20 alkenyl group; C2~C 20 Alkynyl group of C1~C 20 alkoxy group; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 It is an alkoxycarbonyl group,

[0148] 4-4-4)L 1 ~L 3 These are single bonds that are independent of each other; fluorenylene group; C2~C 30 Alkylene; C6~C 30 Allylene; C2~C 30 A heterocycle of C1~C 30 Alkoxylenes; C2~C 30 Alkylene oxy; C6~C 30 aryloxy group; C2~C 20 It is a polyethylene oxy group,

[0149] 4-4-5) q and r are independent integers between 0 and 3, where q + r = 3.

[0150] 5) The ratio of A1 to A2 in the polymer chain of the resin containing the repeating unit represented by chemical formula 1 is 9:1 or 1:9.

[0151] 6)X 1 It is a single bond; O; CO; SO2; CR'R”; SiR'R”; chemical formula 4 below; or chemical formula 5,

[0152] 6-1) R' and R'' are independently hydrogen; deuterium; halogen; C6~C 30 An aryl group; containing at least one heteroatom of O, N, S, Si, and P (C2-C2). 30 heterocyclic group; C6~C 30 A fusion ring group of an aliphatic ring and an aromatic ring; C1~C 20 alkyl groups; C2~C 20alkenyl group; C2~C 20 Alkynyl group of C1~C 20 alkoxy group; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 It is an alkoxycarbonyl group,

[0153] 6-2) R' and R'' can form a ring with adjacent groups.

[0154] [ka]

[0155] [ka]

[0156] In the aforementioned chemical formulas 4 and 5,

[0157] 6-3)* indicates the bond position,

[0158] 6-4)R 7 ~R 8 These are hydrogen; deuterium; halogens; C6~C, independently of each other. 30 An aryl group; containing at least one heteroatom of O, N, S, Si, and P (C2-C2). 30 heterocyclic group; C6~C 30 A fusion ring group of an aliphatic ring and an aromatic ring; C1~C 20 alkyl groups; C2~C 20 alkenyl group; C2~C 20 Alkynyl group of C1~C 20 alkoxy group; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 It is an alkoxycarbonyl group,

[0159] 6-5) o and p are integers between 0 and 4, independently of each other.

[0160] 7)X2 is C6~C 30 An aryl group; containing at least one heteroatom of O, N, S, Si, and P (C2-C2). 30 heterocyclic group; C6~C 30 A fusion ring group of an aliphatic ring and an aromatic ring; C1~C 20 alkyl groups; C2~C 20 alkenyl group; C2~C 20 Alkynyl group of C1~C 20 alkoxy group; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 It is an alkoxycarbonyl group,

[0161] 8) The aforementioned R', R'', X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 These are deuterium; halogen; C1~C respectively. 30 Alkyl or C6-C 30 Silane groups substituted or unsubstituted with aryl groups; siloxane groups; boron groups; germanium groups; cyano groups; amino groups; nitro groups; C1-C 30 alkylthio group; C1~C 30 alkoxy group; C6~C 30 arylalkoxy group; C1~C 30 alkyl groups; C2~C 30 alkenyl group; C2~C 30 Alkynyl group; C6~C 30 aryl group; deuterium-substituted C6-C 30 aryl group; fluorenyl group; C2-C containing at least one heteroatom selected from the group consisting of O, N, S, Si, and P. 30 heterocyclic group; C3~C 30 aliphatic ring group; C7~C 30 Aryl alkyl groups; C8~C 30The aryl alkenyl group can be further substituted with one or more substituents selected from the group consisting of combinations thereof, and adjacent substituents can form a ring.

[0162] The aforementioned R', R'', X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 When is an aryl group, preferably C6-C 30 The aryl group, more preferably C6-C 18 The aryl group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0163] The aforementioned R', R'', X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 When is a heterocyclic group, preferably C2~C 30 A heterocyclic group, more preferably C2-C 18 The heterocyclic group may be, for example, dibenzofuran, dibenzothiophene, naphthobenzothiophene, naptobenzofuran, etc.

[0164] R', R'', R 1 ~R 8 and R 10 ~R 13 When the group is a fluorenyl group, it is preferably a 9,9-dimethyl-9H-fluorene, a 9,9-diphenyl-9H-fluorenyl group, or a 9,9'-spirobifluorene.

[0165] Said L 1 ~L 3 When is an arylene group, preferably C6~C 30 The arylene group, more preferably C6~C 18 The allerene group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0166] The aforementioned R', R'', X 2 , R 1 ~R 8 and R 10 ~R 13 If is an alkyl group, preferably C1-C 10 It is an alkyl group, which may be methyl, t-butyl, etc.

[0167] The aforementioned R', R'', X 2 , R 1 ~R 8 and R 10 ~R 13 When is an alkoxyl group, preferably C1-C 20 an alkoxyl group, more preferably C1-C 10 The alkoxy group may be, for example, methoxy, t-butoxy, etc.

[0168] The aforementioned R', R'', X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 The ring formed by the bonding of adjacent groups to each other is C6~C 60 Aromatic ring group; fluorenyl group; C2-C containing at least one heteroatom of O, N, S, Si and P. 60 heterocyclic group; or C3~C 60 It is an aliphatic ring group, and for example, when adjacent groups bond to each other to form an aromatic ring, preferably C6~C 20 Aromatic rings, more preferably C6-C 14 Aromatic rings, such as benzene, naphthalene, and phenanthrene, can be formed.

[0169] The aforementioned cardo-based resin can be produced by mixing two or more of the following: fluorene-containing compounds such as 9,9-bis(4-oxyranylmethoxyphenyl)fluorene; anhydride compounds such as benzenetetracarboxylate dianhydride, naphthalenetetracarboxylate dianhydride, biphenyltetracarboxylate dianhydride, benzophenone tetracarboxylate dianhydride, pyromeretic dianhydride, cyclobutanetetracarboxylate dianhydride, perylenetetracarboxylate dianhydride, tetrahydrofurantetracarboxylate dianhydride, and tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol methyl ethyl acetate and N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and amine or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyl diethylamine, triethylamine, and benzyltriethylammonium chloride.

[0170] The weight-average molecular weight of the cardo resin is 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. When the weight-average molecular weight of the resin is within the above range, pattern formation can be successfully performed without residue during the production of the light-shielding layer, and a good pattern can be obtained without loss of film thickness during development. The resin may be included in an amount of 1 to 30% by weight, more preferably 3 to 20% by weight, relative to the total amount of the photosensitive resin composition. When the resin is included within the above range, excellent sensitivity, developability, and adhesion (tightness) can be obtained.

[0171] (2) Reactive unsaturated compounds

[0172] The reactive unsaturated compounds that are essential for negative patterns have ethylenically unsaturated double bonds, which allows for sufficient polymerization during exposure in the pattern formation process, resulting in patterns with excellent heat resistance, light resistance, and chemical resistance.

[0173] Specific examples of the reactive unsaturated compounds include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, and tripentaerythritol octaacrylate.

[0174] Examples of commercially available products containing the aforementioned reactive unsaturated compounds are as follows:

[0175] Examples of the aforementioned (meth)acrylic acid difunctional esters include Aronix M-210, M-240, M-6200 from Toagosei Chemical Industry Co., Ltd.; KAYARAD HDDA, HX-220, R-604 from Nippon Kayaku Co., Ltd.; and V-260, V-312, V-335HP from Osaka Organic Chemical Industry Co., Ltd.

[0176] Examples of the aforementioned trifunctional esters of (meth)acrylic acid include Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. from Toagosei Chemical Industry Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. from Nippon Kayaku Co., Ltd.; and V-295, V-300, V-360, etc. from Osaka Organic Chemical Industry Co., Ltd.

[0177] The aforementioned products can be used individually or in combination of two or more types.

[0178] The reactive unsaturated compound can also be treated with an acid anhydride and used to impart better developability. The reactive unsaturated compound may be contained in an amount of 1 to 40% by weight, for example, 1 to 20% by weight based on the total amount of the photosensitive resin composition. When the reactive unsaturated compound is contained within the above range, sufficient curing occurs during exposure in the pattern forming process, resulting in excellent reliability, as well as excellent heat resistance, light resistance, and chemical resistance of the pattern, and also excellent resolution and adhesion.

[0179] (3) Photoinitiator

[0180] In order to realize a negative pattern in photolithography, a photo radical initiator must be used. The photoinitiator has a molar absorption coefficient in the range of 330 to 380 nm of 10,000 (L / mol·cm) or more, and is a photoinitiator in which a 5% weight loss occurs at 200 °C or lower. Here, the molar absorption coefficient can be calculated by the Beer-Lambert Law. Also, the weight loss was measured using TGA while raising the temperature to 300 °C at a rate of 5 °C per minute in a nitrogen atmosphere.

[0181] The photopolymerization initiator is an initiator generally used in the photosensitive resin composition. For example, acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, etc. can be used.

[0182] Examples of the acetophenone-based compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-(morpholinophenyl)-butan-1-one, and the like.

[0183] Examples of the aforementioned benzophenone compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylic benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0184] Examples of the thioxanthone compounds include thioxanthone, 2-chlorthioxanthone, 2-methyloxanthonone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone.

[0185] Examples of the aforementioned benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

[0186] Examples of the aforementioned triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(p-tolyl)-4,6-bis(trichloromethyl) Examples include )-s-triazine, 2-biphenyl4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho1-yl)4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, and 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine.

[0187] In addition to the aforementioned compound, the photoinitiator can also be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a non-imidazole compound, or the like.

[0188] The aforementioned photoinitiator can be a peroxide-based compound, an azobis-based compound, or the like, as a radical polymerization initiator.

[0189] Examples of the aforementioned peroxide compounds include ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, and acetylacetone peroxide; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and bis-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; and dicumyl peroxide and 2,5-dimethyl-2,5-di(t-butyl Examples include dialkyl peroxides such as peroxy)hexane, 1,3-bis(t-butyloxyisopropyl)benzene, and n-butyl t-butyl peroxyvalerate; alkyl peresters such as 2,4,4-trimethylpentyl peroxyphenoxyacetate, α-cumyl peroxyneodecanoate, t-butyl peroxybenzoate, and di-t-butyl peroxytrimethyl adipate; and peroxides such as di-3-methoxybutyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4-t-butylcyclohexyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetylcyclohexylsulfonyl peroxide, and t-butyl peroxyallyl carbonate.

[0190] Examples of the aforementioned azobis compounds include 1,1'-azobiscyclohexane-1-carbonitride, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutylnitrile), and 4,4'-azobis(4-cyanovaleric acid).

[0191] The photoinitiator may be used together with a photosensitizer that induces a chemical reaction by transferring energy after becoming excited by absorbing light. Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol tetrakis-3-mercaptopropionate.

[0192] The photoinitiator may be present in an amount of 0.01 to 10% by weight, for example, 0.1 to 5% by weight, relative to the total amount of the photosensitive composition. When the photoinitiator is present within this range, sufficient curing occurs during exposure in the pattern formation process, resulting in excellent reliability, excellent heat resistance, light resistance, and chemical resistance of the pattern, excellent resolution and adhesion, and prevention of a decrease in transmittance due to unreacted initiators.

[0193] (4) Colorants

[0194] As the coloring agent, all organic pigments, inorganic pigments, and dyes can be used.

[0195] As the aforementioned coloring agent, red pigment, green pigment, blue pigment, yellow pigment, black pigment, etc., can be used.

[0196] Examples of the aforementioned red pigments include CI red pigment 254, CI red pigment 255, CI red pigment 264, CI red pigment 270, CI red pigment 272, CI red pigment 177, and CI red pigment 89.

[0197] Examples of the aforementioned green pigments include halogen-substituted copper phthalocyanine pigments such as CI green pigment 36 and CI green pigment 7.

[0198] Examples of the cyan pigment include copper phthalocyanine pigments such as C.I. Pigment Blue 15:6, C.I. Pigment Blue 15, C.I. Pigment Blue 15:1, C.I. Pigment Blue 15:2, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:5, and C.I. Pigment Blue 16.

[0199] Examples of the yellow pigment include isoindoline-based pigments such as C.I. Pigment Yellow 139, quinophthalone-based pigments such as C.I. Pigment Yellow 138, nickel complex pigments such as C.I. Pigment Yellow 150, and the like.

[0200] Examples of the black pigment include lactam black, aniline black, perylene black, titanium black, carbon black, and the like.

[0201] In addition, the colorant in the photosensitive resin composition according to the embodiment may include a pigment, a dye, or a combination thereof. For example, the dye may include a phthalocyanine-based compound.

[0202] The pigments and dyes may be used alone or in combination of two or more, and are not limited to these examples.

[0203] Among these, the black pigment can be used to efficiently block light in the light-shielding layer. When using the black pigment, it can also be used together with a color corrector such as an anthraquinone-based pigment, a perylene-based pigment, a phthalocyanine-based pigment, or an azo-based pigment.

[0204] A dispersant can be used together to disperse the pigment in the photosensitive resin composition. Specifically, the pigment can be used after surface treatment with a dispersant in advance, or a dispersant can be added together with the pigment during the production of the photosensitive resin composition.

[0205] As the dispersant, nonionic dispersants, anionic dispersants, cationic dispersants, etc., can be used. Specific examples of the dispersant include polyalkylene glycol and its esters, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, carboxylic acid salts, alkylamide alkylene oxide adducts, alkylamines, etc., which can be used individually or in combination of two or more.

[0206] Examples of commercially available dispersant products include BYK's DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, Examples include DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc.; EFKA Chemical's EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc.; Zeneka's Solsperse5000, Solsperse12000, Solsperse13240, Solsperse13940, Solsperse17000, Solsperse20000, Solsperse24000GR, Solsperse27000, Solsperse28000, etc.; or Ajinomoto's PB711, PB821, etc.

[0207] The dispersant can be included in an amount of 0.1% to 15% by weight relative to the total amount of the photosensitive resin composition. When the dispersant is included within this range, the composition exhibits excellent dispersibility, resulting in excellent stability, developability, and patternability during the production of the light-shielding layer.

[0208] The aforementioned pigment can also be used after pretreatment using a water-soluble inorganic salt and a wetting agent. When the pigment is used after such pretreatment, the average particle size of the pigment can be made finer.

[0209] The aforementioned pretreatment is carried out by kneading the pigment together with a water-soluble inorganic salt and a wetting agent, and by filtering and washing the pigment obtained in the kneading step with water.

[0210] The kneading is performed at a temperature of 40°C to 100°C, and the filtration and washing are carried out by washing the inorganic salt with water and then filtering it.

[0211] Examples of the aforementioned water-soluble inorganic salts include, but are not limited to, sodium chloride and potassium chloride.

[0212] The wetting agent acts as a medium that allows the pigment and the water-soluble inorganic salt to be uniformly mixed and facilitates the pulverization of the pigment. Examples of such wetting agents include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; and alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol. These can be used individually or in combination of two or more.

[0213] The pigment that has undergone the kneading step may have an average particle size of 100 nm or less. When the average particle size of the pigment is within this range, it is possible to effectively form fine patterns while maintaining excellent heat resistance and light resistance.

[0214] The pigment may be present in an amount of 1 to 40% by weight, more specifically 17 to 35% by weight, relative to the total amount of the photosensitive resin composition. When the pigment is within this range, the color reproduction rate is excellent, and the curability and adhesion of the pattern are excellent.

[0215] (5) Solvent

[0216] The solvent used is a substance that is compatible with the cardo resin, the reactive unsaturated compound, the pigment, the cardo compound, and the initiator, but does not react with them.

[0217] Examples of the aforementioned solvents include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethyl glycol monomethyl ester, diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; methyl ethyl ketone, cyclohexanone, and 4-hydroxy-4- Ketones such as methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; saturated aliphatic monocarboxylate alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactate esters such as methyl lactate and ethyl lactate; alkyl oxyacetates such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; alkyl alkoxyacetates such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; alkyl 3-oxypropionates such as methyl 3-oxypropionate and ethyl 3-oxypropionate; alkyl 3-alkoxypropionates such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; alkyl 2-oxypropionates such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate;Examples include alkyl esters of 2-alkoxypropionates such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-oxy-2-methylpropionate esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; monooxymonocarboxylate alkyl esters of alkyl 2-alkoxy-2-methylpropionates such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyethyl acetate, and methyl 2-hydroxy-3-methylbutanoate; and ketone acid esters such as ethyl pyruvate.

[0218] In addition, high-boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate can also be used.

[0219] From the aforementioned solvents, considering their compatibility and reactivity, glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used.

[0220] The solvent may be included as a remainder of the total amount of the photosensitive resin composition, specifically in an amount of 40 to 90% by weight. When the solvent is included within this range, the photosensitive resin composition has an appropriate viscosity, resulting in excellent processability during the production of the pattern layer.

[0221] (6) Other additives

[0222] The photosensitive composition may further contain additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl group or a (meth)acrylooxy group; a leveling agent; a fluorine-based surfactant; and a radical polymerization initiator, in order to prevent stains and spots during application, improve leveling performance, and prevent the formation of residue due to undeveloped material.

[0223] For example, the photosensitive resin composition may further contain a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacrylate group, an isocyanate group, or an epoxy group in order to improve adhesion to the substrate.

[0224] Examples of the silane coupling agents include trimethoxysilylbenzoic acid, γ-methacrylateoxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatetopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, and β-epoxycyclohexylethyltrimethoxysilane, which may be used individually or in combination of two or more.

[0225] The silane coupling agent may be included in an amount of 0.01 to 10 parts by weight per 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is included within the above range, the adhesion, storage properties, etc., are excellent.

[0226] Furthermore, the photosensitive resin composition may further contain a surfactant, such as a fluorine-based surfactant, if necessary, to improve coating properties and prevent the formation of defects.

[0227] Examples of the aforementioned fluorine-based surfactants include BM-1000 (registered trademark), BM-1100 (registered trademark), etc. from BM Chemie; Megafac F142D (registered trademark), Megafac F172 (registered trademark), Megafac F173 (registered trademark), Megafac F183 (registered trademark), etc. from Dainippon Ink and Chemicals, Inc.; and Florard FC-135 (registered trademark), Florard FC-170C (registered trademark), Florard FC-430 (registered trademark), Florard FC- Fluorine-based surfactants that are commercially available under names such as 431 (registered trademark), Surflon S-112 (registered trademark), Surflon S-113 (registered trademark), Surflon S-131, Surflon S-141, Surflon S-145 from Asahi Glass Co., Ltd., or SH-28PA (registered trademark), SH-190 (registered trademark), SH-193 (registered trademark), SZ-6032 (registered trademark), SF-8428 (registered trademark) from Draysilicon Co., Ltd. may also be used.

[0228] The surfactant may be used in an amount of 0.001 to 5 parts by weight per 100 parts by weight of the photosensitive resin composition. When the surfactant is included within this range, coating uniformity is ensured, stains do not occur, and the wettability to the glass substrate is excellent. In addition, the photosensitive resin composition may also contain a certain amount of other additives such as antioxidants and stabilizers, as long as they do not impair its physical properties.

[0229] Another embodiment is that the aforementioned photosensitive resin composition can be used to pattern the pixel separation portion of an organic light-emitting element electrode.

[0230] The following describes specific examples of synthesis and embodiments of the present invention, but the examples of synthesis and embodiments of the present invention are not limited thereto.

[0231] (Manufacturing of black photosensitive composition)

[0232] Synthesis Example 1: (Preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene of chemical formula 8)

[0233] 20 g of 9,9'-bisphenol fluorene (Sigma Aldrich), 8.67 g of glycidyl chloride (Sigma Aldrich), and 30 g of anhydrous potassium carbonate were placed in a 300 ml three-necked round-bottom flask equipped with 100 ml of dimethylformamide and a distillation tube. The mixture was heated to 80°C and reacted for 4 hours. After lowering the temperature to 25°C and filtering the reaction solution, the filtrate was added dropwise to 1000 ml of water with stirring. The precipitated powder was filtered, washed with water, and dried under reduced pressure at 40°C to obtain 25 g of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene (chemical formula 8 shown below). Purity analysis of the obtained powder by HPLC showed a purity of 98%.

[0234] [ka]

[0235] Synthesis Example 2: Production of Cardo-type Binder Resin

[0236] 25 g (54 mmol) of compound 1 obtained from Synthesis Example 1, 8 g of acrylic acid (Daejung Chemicals & Metals), 0.2 g of benzyltriethylammonium chloride (Daejung Chemicals & Metals), and 0.2 g of hydroquinone (Daejung Chemicals & Metals) were placed in a 300 ml three-necked round-bottom flask equipped with a distillation tube, along with 52 g of propylene glycol methyl ether acetate (Sigma Aldrich), and the mixture was stirred at 110°C for 6 hours. After the reaction was complete, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas) and 1.8 g of tetrahydrophthalic acid (Sigma Aldrich) were added, and the mixture was stirred again at 110°C for 6 hours. After the reaction was complete, the reaction solution was collected and analyzed, and a cardo-type binder resin with a molecular weight of 4,580 and a solid content of 45% was obtained.

[0237] Manufacturing Example 1: Production of Black Pigment Dispersion

[0238] A dispersion was obtained by dispersing 15g of Irgaphor Black S 100 CF (black pigment / BASF), 8.5g of Disperbyk-163 (BYK), and 6.5g of SR-3613 (SMS) together with 70g of propylene glycol methyl ether acetate for 10 hours using a paint shaker (Asada Co.) containing 100g of 0.5mm diameter zirconia beads (Toray).

[0239] A photosensitive solution was prepared with the composition shown in Table 1 below.

[0240] Specifically, the initiator was dissolved in a solvent and stirred at room temperature. Then, the binder resin and polymerizable compound were added and stirred at room temperature. Subsequently, a coloring agent and other additives were added to the resulting reaction mixture and stirred at room temperature. The photosensitive resin composition was then produced by filtering the product three times to remove impurities.

[0241] [Table 1]

[0242] The method for manufacturing a negative pixel definition layer (negative PDL) using the aforementioned photosensitive composition is as follows:

[0243] (1) Application and coating stage

[0244] A photosensitive composition is applied to a cleaned 10cm x 10cm metal-deposited substrate to a specific thickness using a spin coater, and then a coating film is formed by removing part of the solvent using VCD (vacuum chamber dry). The coating thickness of the photosensitive composition after VCD is 2.0 micrometers to 1.7 micrometers.

[0245] (2) Pre-baking stage

[0246] To remove the solvent contained in the obtained coating film, it is heated on a hot plate at 80°C to 120°C for 50 to 200 seconds. By removing a certain amount of solvent in this step, pixel-shaped mask contamination can be reduced in the next step (exposure), and a clean pattern can be created.

[0247] (3) Exposure stage

[0248] After interposing a pixel-shaped mask to obtain the necessary pattern formation and a certain thickness for the obtained coating film, the pattern can be formed by irradiating it with an exposure machine using a light source of 190 nm to 600 nm active line, preferably a metal or LED lamp having a ghi-line. The exposure amount irradiated for pattern formation is 20 to 150 mJ / cm². 2 It is a negative-type photoresist material that is formed.

[0249] (4) Development stage

[0250] Following the exposure step, the material is developed using a 2.38 wt% TMAH (tetramethylammonium hydroxide) developer by dipping at 23±2°C for a set time (minutes). After rinsing with ultrapure water (DI water), the unexposed areas are dissolved and removed, leaving only the exposed areas to form an image pattern.

[0251] (5) Post-heat treatment stage

[0252] To obtain the image pattern obtained by the aforementioned development, post-baking is performed using an oven at 210-300°C for 30-120 minutes to completely remove the solvent and ultrapure water (DI water, moisture) absorbed by the coating during the development stage, thereby curing the pattern and forming a film.

[0253] (6) Optical density measurement

[0254] After forming a pattern on a substrate using the photosensitive composition through steps (1) to (5) described above, the optical density was measured. A 10cm x 10cm bare glass substrate was coated with the photosensitive composition and then heat-treated, and the optical density of the substrate was measured using an X-Rite 361T Transmission Densitometer.

[0255] (7)Reflectance measurement

[0256] An evaluation substrate was manufactured for reflectance measurement, which included a negative pixel definition layer formed by coating a glass surface with a composition containing a coloring agent, followed by exposure, development, and post-heat treatment. The physical properties of this evaluation substrate were measured by SCI reflectance at a wavelength of 550 nm using a reflectance meter (Konica Minolta CM-26d).

[0257] [Table 2]

[0258] The reflectance and transmittance of the photosensitive compositions prepared in Examples 1 to 3 and Comparative Examples 1 to 4 were measured and compared according to their optical density.

[0259] Referring to Comparative Examples 1 to 4 in Table 2, it can be seen that when the optical density is 0.8 / μm or less or 1.5 / μm or more, the reflectance exceeds 6.5%, and external reflected light cannot be sufficiently blocked. Also, referring to Comparative Examples 1 to 2 in Table 2, it can be seen that when the optical density is 0.8 / μm or less, the transmittance is too high, making it unsuitable for its role as a light-shielding film.

[0260] Referring to Examples 1 and 2, when the optical density falls within the preferred range of 0.8 to 1.50 / μm, it can be confirmed that external reflected light is prevented with a reflectance of 6.5% or less and a transmittance of 3.0% or less, thereby improving the visibility of the display and meeting the requirements for the light-shielding layer and pixel-defining layer.

[0261] The above description is merely illustrative, and any person with ordinary skill in the art to which the present invention pertains can make various modifications without departing from the essential characteristics of the present invention.

[0262] Accordingly, the examples disclosed herein are for illustrative purposes only, not to limit the invention, and such examples do not limit the spirit or scope of the invention. The scope of protection of the invention should be interpreted as defined in the claims, and all technologies within an equivalent scope should be interpreted as being included within the scope of the invention.

Claims

1. A method for manufacturing a pixel definition layer, comprising the steps of applying and coating a photosensitive composition comprising a cardo-type binder resin of the following chemical formula 1, a reactive unsaturated compound, a photoinitiator having a molar extinction coefficient of 10,000 (L / mol·cm) or more in the 330 to 380 nm region and generating at 200°C or less with a 5% weight loss, and a solvent; pre-baking; exposure; development; and post-heat treatment; The oven temperature in the aforementioned post-heat treatment step is 250 to 270°C, and the post-heat treatment step lasts for 60 to 120 minutes. A method for manufacturing a pixel definition layer, characterized in that, after the post-heat treatment stage, the optical density of the coating film is 0.80 / μm to 1.5 / μm, and the reflectance measured at a wavelength of 550 nm using a reflectance meter satisfies the condition of being greater than 0.01% and less than 6.5%: 【Chemistry 1】 In the aforementioned chemical formula 1, 1) R １ and R ２ are each independently hydrogen; deuterium; halogen; C ６ -C ３０ aryl group; a C ２ -C ３０ heterocyclic group containing at least one heteroatom of O, N, S, Si and P; C ６ -C ３０ alicyclic ring and C ６ [[ID=??]]-C ３０ fused ring group of an aromatic ring; C １ [[ID=??]]-C ２０ alkyl group; C ２ -C ２０ alkenyl group; C ２ -C ２０ alkynyl group; C １ -C ２０ alkoxy group: C ６ -C ３０ aryloxy group; fluorenyl group: carbonyl group; ether group; or C １ -C ２０ alkoxycarbonyl group, There seem to be some missing numbers in the original text which might be affecting the accuracy of the translation. Please check and correct if possible. 2) R １ and R ２ The adjacent groups can form a ring, 3) m or n are integers between 0 and 4, independently of each other. 4) A １ and A ２ These are independently of each other, and are either chemical formula 2 or chemical formula 3 below. 【Chemistry 2】 【Transformation 3】 In the aforementioned chemical formulas 2 and 3, 4-1) * indicates the connecting part. 4-2) R ３ ~R ６ These are hydrogen; deuterium; halogen; and C, which are independent of each other. ６ ~C ３０ The aryl group of; C containing at least one heteroatom of O, N, S, Si and P. ２ ~C ３０ heterocyclic group; C ６ ~C ３０ aliphatic ring and C ６ ~C ３０ Fusion ring group of an aromatic ring; C １ ~C ２０ alkyl group; C ２ ~C ２０ alkenyl group of C ２ ~C ２０ The alkynyl group of C １ ~C ２０ The alkoxy group of: C ６ ~C ３０ aryloxy group; fluorenyl group; carbonyl group; ether group; or C １ ~C ２０ It is an alkoxycarbonyl group, 4-3) R ３ ~R ６ The adjacent groups can form rings, 4-4) Y １ and Y ２ These are independently of each other, and are either chemical formula 6 or chemical formula 7 below. 【Chemistry 4】 【Transformation 5】 In the aforementioned chemical formulas 6 and 7, 4-4-1) * indicates the bonding position, 4-4-2) R ９ is hydrogen or methyl, 4-4-3) R １０ ~R １３ These are hydrogen; deuterium; halogen; and C, which are independent of each other. ６ ~C ３０ An aryl group of; a C containing at least one heteroatom of O, N, S, Si, and P. ２ ~C ３０ heterocyclic group; C ６ ~C ３０ aliphatic ring and C ６ ~C ３０ Fusion ring group with aromatic ring; C １ ~C ２０ alkyl group; C ２ ~C ２０ alkenyl group of C ２ ~C ２０ The alkynyl group of C １ ~C ２０ alkoxy group of; C ６ ~C ３０ aryloxy group; fluorenyl group; carbonyl group; ether group; or C １ ~C ２０ It is an alkoxycarbonyl group. 4-4-4) L １ ~L ３ are each independently a single bond; a fluorenylene group; C ２ ~C ３０ alkylene; C ６ ~C ３０ arylene; C ２ ~C ３０ heterocycle; C １ ~C ３０ alkoxylene; C ２ ~C< extraordinari ３０ alkyleneoxy; C ６ ~C ３０ aryloxy group; C ２ ~C ３０ polyethyleneoxy group, and 4-4-5) q and r are integers between 0 and 3, independently of each other; however, q + r = 3, 5) A within the polymer chain of a resin containing repeating units represented by chemical formula 1 １ and A ２ The ratio is 9:1 or 1:

9. 6) X １ is a single bond; O; CO; SO2; CR'R''; SiR'R''; chemical formula 4 below; or chemical formula 5, 6-1) R' and R" are each independently hydrogen; deuterium; halogen; C ６ ~C ３０ aryl group of; O, N, S, Si and P containing at least one heteroatom of C ２ ~C ３０ heterocyclic group; C ６ ~C ３０ aliphatic ring of and C ６ ~C ３０ fused ring group of aromatic ring; C １ ~C ２０ alkyl group of; C ２ ~C ２０ alkenyl group of; C ２ ~C ２０ alkynyl group of; C １ ~C ２０ alkoxy group of; C ６ ~C ３０ aryloxy group; fluorenyl group: carbonyl group; ether group; or C １ ~C ２０ alkoxycarbonyl group of, (6-2) R' and R'' can form a ring with adjacent groups, 【Transformation 6】 【Transformation 7】 In the aforementioned chemical formulas 4 and 5, 6-3) * indicates the bonding position. 6-4) R ７ ~R ８ These are hydrogen; deuterium; halogen; and C, which are independent of each other. ６ ~C ３０ The aryl group of; C containing at least one heteroatom of O, N, S, Si and P. ２ ~C ３０ heterocyclic group; C ６ ~C ３０ aliphatic ring and C ６ ~C ３０ Fusion ring group of an aromatic ring; C １ ~C ２０ alkyl group; C ２ ~C ２０ alkenyl group of C ２ ~C ２０ The alkynyl group of C １ ~C ２０ alkoxy group of; C ６ ~C ３０ aryloxy group; fluorenyl group; carbonyl group; ether group; or C １ ~C ２０ It is an alkoxycarbonyl group, 6-5) o and p are integers between 0 and 4, independently of each other. 7) X ２ C ６ ~C ３０ A C containing an aryl group and at least one heteroatom of O, N, S, Si, and P. ２ ~C ３０ heterocyclic group, C ６ ~C ３０ aliphatic ring and C ６ ~C ３０ Fusion ring group with aromatic ring, C １ ~C ２０ alkyl group, C ２ ~C ２０ alkenyl group of C ２ ~C ２０ The alkynyl group of C １ ~C ２０ alkoxy group of; C ６ ~C ３０ aryloxy group; fluorenylene group; carbonyl group; ether group; or C １ ~C ２０ It is an alkoxycarbonyl group, 8) The above R', R'', X ２ , L １ ~L ３ , R １ ~R ８ and R １０ ~R １３ These are deuterium; halogen; and C, respectively. １ ~C ３０ alkyl group or C ６ ~C ３０ Silane groups substituted or unsubstituted with aryl groups; siloxane groups; boron groups; germanium groups; cyano groups; amino groups; nitro groups; C １ ~C ３０ alkylthio group; C １ ~C ３０ alkoxy group of; C ６ ~C ３０ arylalkoxy group; C １ ~C ３０ alkyl group, C ２ ~C ３０ alkenyl group of C ２ ~C ３０ The alkynyl group of C ６ ~C ３０ aryl group; deuterium-substituted C ６ ~C ３０ An aryl group; a fluorenyl group; and a carbon atom containing at least one heteroatom selected from the group consisting of O, N, S, Si, and P. ２ ~C ３０ heterocyclic group; C ３ ~C ３０ aliphatic ring group of; C ７ ~C ３０ arylalkyl groups; C ８ ~C ３０ The aryl alkenyl group; and one or more substituents selected from the group consisting of combinations thereof, can be further substituted with adjacent substituents to form a ring.

2. The method for manufacturing a pixel definition layer according to claim 1, characterized in that the reflectance of the coating film after the post-heat treatment is greater than 0.01% and less than or equal to 6.3%.

3. The method for manufacturing a pixel definition layer according to claim 1, characterized in that the optical density of the coating film after the post-heat treatment is 0.83 / μm to 1.4 / μm.

4. The method for manufacturing a pixel definition layer according to claim 1, characterized in that the optical density of the coating film after the post-heat treatment is 0.9 / μm to 1.3 / μm.

5. The method for producing a pixel definition layer according to claim 1, characterized in that the photosensitive composition contains a coloring agent.

6. The method for manufacturing a pixel definition layer according to claim 5, characterized in that the coloring agent is contained in an amount of 17 to 35% by weight relative to the total amount of the photosensitive composition.

7. The method for manufacturing a pixel definition layer according to claim 5, characterized in that the coloring agent includes one or more inorganic dyes, organic dyes, inorganic pigments, and organic pigments.

8. The method for manufacturing a pixel definition layer according to claim 5, characterized in that the colorant is pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent.

9. The method for manufacturing a pixel definition layer according to claim 1, characterized in that the photosensitive composition includes an acrylic binder resin.

10. The method for manufacturing a pixel definition layer according to claim 9, characterized in that the weight-average molecular weight of the acrylic binder resin is 3,000 g / mol to 150,000 g / mol.

11. The method for manufacturing a pixel definition layer according to claim 9, characterized in that the weight-average molecular weight of the cardo resin is 1,000 to 100,000 g / mol.

12. The method for manufacturing a pixel definition layer according to claim 9, characterized in that the cardo resin is contained in an amount of 1 to 30% by weight relative to the total amount of the photosensitive composition.

13. The method for producing a pixel definition layer according to claim 1, characterized in that the photosensitive composition contains 1 to 40% by weight of a reactive unsaturated compound based on its total amount.

14. The method for producing a pixel-defining layer according to claim 1, characterized in that the photosensitive composition contains 0.01 to 10% by weight of a photoinitiator based on its total amount.

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