Circuit board cleaning apparatus and circuit board cleaning method

Abstract

To provide a substrate cleaning device and a substrate cleaning method, each enabling uniform cleaning of a substrate.SOLUTION: A substrate cleaning device includes: a lower surface brush 51; a support member 140; a first actuator; and a weight detection portion 200. The lower surface brush 51 cleans a lower surface of a substrate. The support member 140 supports the lower surface brush 51. The first actuator ascends and descends the support member 140 to adjust a weight acting on the substrate from the lower surface brush 51. The weight detection portion 200 is provided between the support member 140 and the first actuator, and detects weight between the support member 140 and the first actuator. Or, the substrate cleaning device includes, instead of the detection portion 200, a weight detection portion 300 which is provided between a brush main body 51a of the lower surface brush 51 and a brush base 51b and detects distribution of a two-dimensional weight between the brush main body 51a and the brush base 51b.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a substrate.

Background Art

[0002] In order to perform various processes on various substrates such as a substrate for a flat panel display (FPD) used in a liquid crystal display device or an organic EL (Electro Luminescence) display device, a semiconductor substrate, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, a substrate processing apparatus is used. To clean a substrate, a substrate cleaning apparatus is used.

[0003] For example, Patent Document 1 describes a substrate cleaning apparatus for cleaning the lower surface of a substrate. In this substrate cleaning apparatus, a horizontally extending lower surface brush holding member is supported by an air cylinder. A rotating shaft extending upward is provided at one end of the lower surface brush holding member. A lower surface brush is attached to the upper end of the rotating shaft. The air cylinder applies an upward force to the lower surface brush holding member. In this case, the lower surface brush rises and contacts the lower surface of the substrate. Thereby, the lower surface of the substrate is cleaned.

[0004] Above the other end of the lower surface brush holding member, a load sensor is attached. When the air cylinder applies a force exceeding the total weight of a plurality of supported components to the lower surface brush holding member, the other end of the lower surface brush holding member abuts against the load sensor. At this time, the load sensor outputs a signal indicating a force obtained by subtracting the above total weight from the force applied to the lower surface brush holding member by the air cylinder. Based on the signal output from the load sensor, the force applied by the air cylinder to the lower surface brush holding member is adjusted.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

[0006] Patent Document 1 describes that the above-described substrate cleaning apparatus makes it possible to press the bottom brush against the bottom surface of the substrate with a predetermined force. However, the weight of the bottom brush fluctuates depending on the condition of the bottom brush, such as the amount of moisture it holds or its dryness. In this case, the force with which the bottom brush is pressed against the bottom surface of the substrate may fluctuate in the substrate cleaning apparatus described in Patent Document 1. As a result, the cleaning of the substrate may become uneven.

[0007] The object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method capable of uniformly cleaning substrates. [Means for solving the problem]

[0008] A substrate cleaning apparatus according to one aspect of the present invention includes a bottom brush for cleaning the bottom surface of a substrate, a support part for supporting the bottom brush, a first actuator for adjusting the load from the bottom brush to the substrate by raising and lowering the support part, and a load detection unit provided between the support part and the first actuator for detecting the load between the support part and the first actuator. A second actuator raises and lowers the lower brush between a standby position where the lower brush is kept in standby position when the substrate is not being cleaned, and a processing position closer to the substrate than the standby position. Equipped with The first actuator raises and lowers the support portion within a range smaller than the range of raising and lowering of the lower brush by the second actuator, thereby bringing the lower brush in the processing position into contact with the substrate. ru.

[0009] A substrate cleaning apparatus according to another aspect of the present invention comprises a bottom brush including a brush body for cleaning the bottom surface of a substrate and a brush base to which the brush body is attached; a support portion for supporting the brush base of the bottom brush; a first actuator for adjusting the load from the bottom brush to the substrate by raising and lowering the support portion; a load detection unit provided between the brush body and the brush base for detecting a two-dimensional load distribution between the brush body and the brush base; and a load control unit for controlling the operation of the first actuator based on the load distribution detected by the load detection unit.

[0010] A substrate cleaning method according to another aspect of the present invention includes cleaning the lower surface of a substrate with the brush body of a lower surface brush, raising and lowering a support portion that supports the brush base of the lower surface brush with a first actuator, and detecting a two-dimensional load distribution between the brush body and the brush base with a load detection unit, wherein raising and lowering the support portion includes adjusting the load from the brush body to the substrate based on the load distribution detected by the load detection unit. [Effects of the Invention]

[0011] According to the present invention, substrates can be cleaned uniformly. [Brief explanation of the drawing]

[0012] [Figure 1] This is a schematic plan view of a substrate cleaning apparatus according to the first embodiment of the present invention. [Figure 2] Figure 1 is a perspective view showing the internal configuration of the substrate cleaning apparatus. [Figure 3] Figure 1 is a schematic diagram illustrating the configuration of the lower brush drive unit. [Figure 4] This is a diagram illustrating the operation of the bottom cleaning device. [Figure 5] This is a schematic diagram illustrating the details of cleaning the outer region of the lower surface of the circuit board. [Figure 6] This is a block diagram showing the configuration of the control system for a circuit board cleaning device. [Figure 7] It is a flowchart showing the substrate cleaning process by the control device of FIG. 6. [Figure 8] It is a flowchart showing the central cleaning process of FIG. 7. [Figure 9] It is a flowchart showing the outer cleaning process of FIG. 7. [Figure 10] It is a schematic diagram for explaining the configuration of the lower surface brush driving unit in the second embodiment. [Figure 11] It is a flowchart showing an example of the algorithm of the central cleaning process in the second embodiment. [Figure 12] It is a flowchart showing the outer cleaning process in the second embodiment.

Embodiments for Carrying Out the Invention

[0013] Hereinafter, a substrate cleaning apparatus and a substrate processing method according to embodiments of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate (wafer), a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, etc. Also, in the following description, the upper surface of the substrate is the circuit formation surface (front surface), and the lower surface of the substrate is the surface on the opposite side of the circuit formation surface (back surface). Also, the substrate has a circular shape except for the notch.

[0014] 1. First Embodiment (1) Configuration of the Substrate Cleaning Apparatus FIG. 1 is a schematic plan view of a substrate cleaning apparatus according to a first embodiment of the present invention. FIG. 2 is a perspective view showing the internal configuration of the substrate cleaning apparatus 1 of FIG. 1. In the substrate cleaning apparatus 1 according to the present embodiment, for the sake of clarity of the positional relationship, an X direction, a Y direction, and a Z direction that are orthogonal to each other are defined. In predetermined figures after FIG. 1 and FIG. 2, the X direction, the Y direction, and the Z direction are appropriately indicated by arrows. The X direction and the Y direction are orthogonal to each other within a horizontal plane, and the Z direction corresponds to the vertical direction (the up-and-down direction).

[0015] As shown in FIGS. 1 and 2, the substrate cleaning apparatus 1 has a configuration in which an upper holding device 10A, 10B, a lower holding device 20, a pedestal device 30, a delivery device 40, a bottom surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an end surface cleaning device 80, and an opening / closing device 90 are accommodated in a unit housing 2. In FIG. 2, the unit housing 2 is shown by a dotted line.

[0016] The unit housing 2 has a rectangular parallelepiped shape and includes a rectangular bottom surface portion and four side wall portions extending upward from the four sides of the bottom surface portion. Two of the four side wall portions face each other in the Y direction. The other two of the four side wall portions face each other in the X direction. A carry-in / carry-out port 2x for the substrate W is formed at the center of one of the four side wall portions. An opening / closing device 90 is provided in the vicinity of the carry-in / carry-out port 2x. The opening / closing device 90 includes a shutter 91, and the carry-in / carry-out port 2x can be opened and closed by the shutter 91.

[0017] The pedestal device 30 is provided on the bottom surface portion of the unit housing 2. The pedestal device 30 includes a linear guide 31 and a movable pedestal 32. The linear guide 31 includes two rails arranged in the X direction and extends in the Y direction so as to cross the central portion of the bottom surface portion in the X direction. The pedestal device 30 is configured to be able to move the movable pedestal 32 to a plurality of positions in the Y direction on the two rails of the linear guide 31.

[0018] The lower holding device 20 and the lower surface cleaning device 50 are arranged on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 is provided on the upper surface of the movable base 32 and includes a suction holding part 21. The suction holding part 21 is a so-called spin chuck and has a circular suction surface capable of adsorbing and holding the lower surface of the substrate W. The suction holding part 21 is also configured to be rotatable around an axis extending in the vertical direction (the axis in the Z direction). The lower holding device 20 adsorbs the lower surface of the substrate W using the suction holding part 21. As a result, the substrate W is held in a substantially horizontal position. The suction holding part 21 also rotates the held substrate W around the axis extending in the vertical direction.

[0019] In the following explanation, when the substrate W is held by the adsorption holding unit 21, the area of ​​the substrate W's lower surface that is held by the adsorption surface of the adsorption holding unit 21 is referred to as the lower central region. The area of ​​the substrate W's lower surface that surrounds the lower central region is referred to as the lower outer region.

[0020] A transfer device 40 is provided on the movable base 32 near the lower holding device 20. The transfer device 40 has a plurality of support pins 41 (three in this example) that surround the suction holding part 21 in a plan view and extend in the vertical direction. The plurality of support pins 41 are provided so as to be able to move up and down between a plurality of predetermined height positions.

[0021] As described later, the upper holding devices 10A and 10B are configured to hold the substrate W in a substantially horizontal position at a position above the lower holding device 20. The transfer device 40 can receive the substrate W held by the lower holding device 20 and transfer it to the upper holding devices 10A and 10B by raising and lowering a plurality of support pins 41. The transfer device 40 can also receive the substrate W held by the upper holding devices 10A and 10B and transfer it to the lower holding device 20.

[0022] The bottom cleaning device 50 includes a bottom brush 51, two liquid nozzles 52, a gas ejection unit 53, and a bottom brush drive unit 100. The bottom brush drive unit 100 is provided on the upper surface of the movable base 32 so as to be adjacent to the lower holding device 20 in the Y direction. The bottom brush 51 includes a brush body 51a and a brush base 51b. The brush body 51a is attached to the upper part of the brush base 51b. The brush body 51a of the bottom brush 51 has a circular cleaning surface that can contact the bottom surface of the substrate W.

[0023] The brush base 51b of the lower brush 51 is attached to the lower brush drive unit 100 such that the cleaning surface of the brush body 51a faces upward and the cleaning surface is rotatable around an axis that passes through the center of the cleaning surface and extends vertically. The area of ​​the cleaning surface of the brush body 51a is larger than the area of ​​the suction surface of the suction holding unit 21. The brush body 51a is formed from, for example, a PVA (polyvinyl alcohol) sponge or a PVA sponge with abrasive particles dispersed in it.

[0024] The lower brush drive unit 100 includes a lifting mechanism for raising and lowering the lower brush 51 and a brush drive mechanism for rotating the lower brush 51. The lower brush drive unit 100 moves up and down while the substrate W is held by the lower holding device 20 or the upper holding devices 10A, 10B, using its lifting mechanism. As a result, the lower brush drive unit 100 moves the lower brush 51 between a height position that contacts the lower surface of the substrate W and a height position that is a certain distance below the substrate W.

[0025] Furthermore, the lower brush drive unit 100 rotates the lower brush 51 using its brush drive mechanism. As a result, the lower brush 51 rotates while at a height position that contacts the lower surface of the substrate W, and the contact portion of the lower surface of the substrate W with the lower brush 51 is cleaned. Details of the lower brush drive unit 100 will be described later.

[0026] Each of the two liquid nozzles 52 is mounted in a casing-like housing of the lower brush drive unit 100, described later, so as to be located near the lower brush 51 and with the liquid discharge port facing upward. A cleaning liquid supply system (not shown) is connected to the liquid nozzles 52. When the substrate W is being cleaned by the lower brush 51, the liquid nozzles 52 discharge the cleaning liquid supplied from the cleaning liquid supply system onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzles 52.

[0027] The gas ejection unit 53 is a slit-shaped gas injection nozzle having a gas outlet extending in one direction. The gas ejection unit 53 is mounted in the housing of the lower brush drive unit 100 so that it is located between the lower brush 51 and the adsorption holding unit 21 in a plan view and the gas injection port faces upward. A gas injection supply system (not shown) is connected to the gas ejection unit 53. In this embodiment, nitrogen gas is used as the gas supplied to the gas ejection unit 53. The gas ejection unit 53 injects the gas supplied from the gas injection supply system onto the lower surface of the substrate W when the substrate W is being cleaned by the lower brush 51 and when the lower surface of the substrate W is being dried, as described later. As a result, a band-shaped gas curtain extending in the X direction is formed between the lower brush 51 and the adsorption holding unit 21.

[0028] The cup device 60 is located approximately in the center of the unit housing 2 and includes a cup 61. The cup 61 is positioned to surround the lower holding device 20 and the base device 30 in a plan view and is vertically movable. In Figure 2, the cup 61 is shown by a dotted line. The cup 61 moves between predetermined lower and upper cup positions depending on which part of the lower surface of the substrate W the lower brush 51 is cleaning. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W that is held by the suction holding part 21. The upper cup position is a height position where the upper end of the cup 61 is above the suction holding part 21.

[0029] The upper holding devices 10A and 10B are positioned at a height above the cup 61. In a plan view, the upper holding devices 10A and 10B face each other with the base device 30 in between. The upper holding device 10A includes a lower chuck 11A and an upper chuck 12A. The upper holding device 10B includes a lower chuck 11B and an upper chuck 12B.

[0030] The lower chucks 11A and 11B are arranged symmetrically with respect to a vertical plane extending in the Y direction through the center of the suction holding portion 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support pieces capable of supporting the lower outer region of the substrate W from below the substrate W. The upper chucks 12A and 12B are arranged symmetrically with respect to a vertical plane extending in the Y direction through the center of the suction holding portion 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane, similar to the lower chucks 11A and 11B. Each of the upper chucks 12A and 12B has two holding pieces configured to contact two portions of the outer peripheral edge of the substrate W and to hold the outer peripheral edge of the substrate W.

[0031] In the upper holding devices 10A and 10B, the distance between the lower chuck 11A and upper chuck 12A and the lower chuck 11B and upper chuck 12B is adjusted. This allows the upper holding devices 10A and 10B to hold the substrate W above the lower holding device 20 by sandwiching the substrate W between the lower chuck 11A and upper chuck 12A and the lower chuck 11B and upper chuck 12B. Furthermore, in the upper holding devices 10A and 10B, the held substrate W can be released by moving the lower chuck 11A and upper chuck 12A and the lower chuck 11B and upper chuck 12B further apart from each other.

[0032] As shown in Figure 1, a top surface cleaning device 70 is provided on one side of the cup 61 in the X direction. As shown in Figure 2, the top surface cleaning device 70 includes a rotating support shaft 71, an arm 72, and a spray nozzle 73. The rotating support shaft 71 is provided to extend vertically, be vertically movable, and rotatable. The arm 72 is provided to extend horizontally from the upper end of the rotating support shaft 71 at a position above the upper holding devices 10A and 10B. A spray nozzle 73 is attached to the tip of the arm 72.

[0033] A fluid supply system (not shown) is connected to the spray nozzle 73. Cleaning fluid is supplied to the spray nozzle 73 from the fluid supply system (not shown). Gas is also supplied to the spray nozzle 73 from the fluid supply system. As a result, the cleaning fluid and gas are mixed in the spray nozzle 73 to produce a mixed fluid. The produced mixed fluid is sprayed downward from the spray nozzle 73.

[0034] In the top surface cleaning device 70, for example, with the substrate W held and rotated by the lower holding device 20, the height position of the rotation support shaft 71 is adjusted so that the spray nozzle 73 moves above the substrate W, and the rotation support shaft 71 rotates. In this state, the mixed fluid is sprayed from the spray nozzle 73 onto the substrate W. As a result, the entire top surface of the substrate W is cleaned.

[0035] As shown in Figure 1, an end cleaning device 80 is provided on the other side of the cup 61 in the X direction. As shown in Figure 2, the end cleaning device 80 includes a rotating support shaft 81, an arm 82, and a bevel brush 83. The rotating support shaft 81 is provided to extend vertically, be vertically movable, and rotatable. The arm 82 is provided to extend horizontally from the upper end of the rotating support shaft 81 at a position above the upper holding devices 10A and 10B. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and be rotatable around a vertical axis.

[0036] In the edge cleaning device 80, for example, with the substrate W held and rotated by the lower holding device 20, the height position of the rotation support shaft 81 is adjusted so that the bevel brush 83 contacts the outer edge of the substrate W, and the rotation support shaft 81 rotates. Furthermore, the bevel brush 83 provided at the tip of the arm 82 rotates around the vertical axis. As a result, the entire outer edge of the substrate W is cleaned.

[0037] As shown in Figure 1, the substrate cleaning apparatus 1 further includes a control device 9. The control device 9 includes, for example, a CPU (Central Processing Unit) 9a and a memory 9b. The control device 9 may be implemented by a microcomputer. The memory 9b stores a substrate cleaning program. The CPU 9a controls the operation of each of the above components (10A, 10B, 20, 30, 40, 50, 60, 70, 80, 90) by executing the substrate cleaning program stored in the memory 9b.

[0038] (2) Lower brush drive unit Figure 3 is a schematic diagram illustrating the configuration of the lower brush drive unit 100 shown in Figure 1. In Figure 3, the configuration of the lower brush 51 and its surrounding components is shown in a schematic side view. As shown in Figure 3, the lower brush drive unit 100 includes a housing 110, an air cylinder 120, an electro-pneumatic regulator 130, a support member 140, a rotating shaft 150, a rotating motor 160, a motor drive unit 170, a linear guide 180, a lifting motor 190, and a load detection unit 200.

[0039] The housing section 110 is, for example, a casing member and is provided on the upper surface of the movable base 32. The liquid nozzle 52 and gas ejection section 53 shown in Figure 1 are provided on the upper surface of the housing section 110, but the liquid nozzle 52 and gas ejection section 53 are not shown in Figure 3. The housing section 110 houses the components of the lower brush drive unit 100, excluding the electro-pneumatic regulator 130, the motor drive unit 170, and the lifting motor 190. This prevents particles generated by driving the lower brush 51 from scattering inside the unit housing 2. The electro-pneumatic regulator 130 and the motor drive unit 170 may also be housed in the housing section 110.

[0040] The air cylinder 120 is provided on the bottom surface of the housing 110. The support member 140 is a rod member or plate member extending horizontally and has one end and the other end. The load detection unit 200 is attached to the lower part of the support member 140. The air cylinder 120 supports the approximately central portion of the support member 140 between the one end and the other end via the load detection unit 200.

[0041] An electro-pneumatic regulator 130 is connected to the air cylinder 120. The air cylinder 120 raises and lowers the support member 140 within a predetermined range by supplying air through the electro-pneumatic regulator 130. As the amount of air supplied to the air cylinder 120 changes, the load applied from the air cylinder 120 to the support member 140 changes.

[0042] The rotating shaft 150 is provided at one end of the support member 140 so as to extend upward and be rotatable. The upper end of the rotating shaft 150 protrudes upward from the housing portion 110. The brush base 51b of the lower brush 51 is attached to the upper end of the rotating shaft 150 that protrudes from the housing portion 110. By changing the load applied to the support member 140, it is possible to adjust the load applied from the brush body 51a of the lower brush 51 to the substrate W.

[0043] The load detection unit 200 is, for example, a load cell, and detects the load between the air cylinder 120 and the support member 140. Hereinafter, the load detected by the load detection unit 200 will be referred to as the detected load. Here, when the lower brush 51 is not in contact with the substrate W, the load applied to the air cylinder 120 due to the total weight of the support member 140 and the members supported by the support member 140 (hereinafter referred to as the basic load) becomes the detected load. The members supported by the support member 140 include the rotating shaft 150 and the lower brush 51. Furthermore, the above total weight includes the weight of moisture such as cleaning fluid held in the lower brush 51 and changes depending on the degree of dryness of the lower brush 51.

[0044] On the other hand, when the lower brush 51 is in contact with the substrate W, the detected load is the sum of the basic load and the load applied to the support member 140 from the air cylinder 120 (hereinafter referred to as the applied load). The load applied to the substrate W from the lower brush 51 is equal to the applied load applied to the support member 140 from the air cylinder 120. Therefore, by subtracting the detected load when the lower brush 51 is not in contact with the substrate W (basic load) from the detected load when the lower brush 51 is in contact with the substrate W, it is possible to determine the applied load applied to the substrate W from the lower brush 51.

[0045] The rotary motor 160 is mounted near the other end of the support member 140 with its rotating shaft extending in the vertical direction. A motor drive unit 170 is connected to the rotary motor 160. A power transmission member 101 is provided between the rotating shaft 150 and the rotating shaft of the rotary motor 160. The power transmission member 101 includes two pulleys attached to the rotating shaft 150 and the rotating shaft of the rotary motor 160, respectively, and a belt connecting the two pulleys, and transmits the rotational force generated by the rotary motor 160 to the rotating shaft 150. As a result, the lower brush 51 rotates.

[0046] The linear guide 180 is provided on the bottom surface of the housing 110 so as to extend in the vertical direction. The end of the support member 140 (the other end in the example of Figure 3) is connected to the linear guide 180. The linear guide 180 restricts the movement direction of the support member 140 in the vertical direction.

[0047] The lifting motor 190 has a drive shaft that can move up and down in the vertical direction and is located outside the housing 110. A power transmission member 102 is provided between the drive shaft of the lifting motor 190 and the housing 110. The power transmission member 102 transmits the driving force generated by the lifting motor 190 to the housing 110. As a result, the lower brush 51 moves up and down together with the housing 110 and its contents. The range of movement of the lower brush 51 by the lifting motor 190 is greater than the range of movement of the lower brush 51 by the air cylinder 120.

[0048] Before cleaning the substrate W, the lower brush 51 is lowered by the lifting motor 190. The position of the lower brush 51 at this time is called the standby position. The standby position is below the substrate W held by the suction holding unit 21 in Figure 1, and in the standby position, the lower brush 51 is far away from the substrate W. On the other hand, when cleaning the underside of the substrate W, the lower brush 51 is raised by the lifting motor 190. The position of the lower brush 51 at this time is called the processing position. In the processing position, the lower brush 51 is close to the substrate W. The cleaning of the central and outer underside regions of the substrate W by the underside cleaning device 50 will be described below.

[0049] (3) Operation of the bottom cleaning device Figure 4 is a diagram illustrating the operation of the bottom surface cleaning device 50. When cleaning the central area of ​​the bottom surface of the substrate W, as shown in the upper part of Figure 4, the cleaning surface of the bottom brush 51 comes into contact with the central area of ​​the bottom surface of the substrate W, which is held by the upper holding devices 10A and 10B in Figure 1. In this state, the bottom brush 51 is rotated to remove contaminants adhering to the central area of ​​the bottom surface of the substrate W. In this example, the substrate W is not rotated when cleaning the central area of ​​the bottom surface of the substrate W, but the substrate W may be rotated.

[0050] When cleaning the lower outer region of the substrate W, as shown in the lower part of Figure 4, the lower brush 51 comes into contact with the lower outer region of the substrate W held by the suction holding part 21 in Figure 1. At this time, a part of the lower brush 51 may protrude slightly outward from the substrate W. In this state, the substrate W is rotated to remove contaminants adhering to the lower outer region of the substrate W. In this example, the lower brush 51 is not rotated when cleaning the lower outer region of the substrate W, but the lower brush 51 may be rotated.

[0051] In this example, the diameter of the bottom brush 51 is greater than 1 / 3 and less than 1 / 2 of the diameter of the substrate W. In this case, the entire bottom surface of the substrate W is efficiently cleaned by the cleaning surface of the bottom brush 51 sequentially contacting the lower part of the central region and the lower part of the outer region of the bottom surface of the substrate W. Therefore, there is no need to make the bottom brush 51 excessively large. The diameter of the substrate W is, for example, 300 mm. As shown by the dashed line in Figure 4, the area that can be cleaned when the cleaning surface of the bottom brush 51 contacts the central region of the bottom surface of the substrate W and the area that can be cleaned when the cleaning surface of the bottom brush 51 contacts the outer region of the bottom surface of the substrate W may slightly overlap.

[0052] When cleaning the underside of the substrate W, cleaning fluid is supplied to the underside of the substrate W by the liquid nozzle 52 shown in Figure 1. In this case, contaminants adhering to the underside of the substrate W can be removed more efficiently. Furthermore, when cleaning the central region of the underside of the substrate W, the top surface of the substrate W and the outer edges of the substrate W are also cleaned simultaneously.

[0053] Figure 5 is a schematic diagram illustrating the details of cleaning the lower outer region of the substrate W. As shown in the upper part of Figure 5, when cleaning the lower outer region of the substrate W, the groove with a substantially U-shaped cross-section provided on the outer surface of the bevel brush 83 comes into contact with the outer edge of the rotating substrate W. This cleans the outer edge of the substrate W.

[0054] Next, the spray nozzle 73 is moved to approximately above the center of the substrate W. In this state, a mixed fluid of cleaning solution and gas is sprayed from the spray nozzle 73 onto the upper surface of the substrate W. Then, as shown in the middle section of Figure 5, the spray nozzle 73 is moved outward above the rotating substrate W. This movement of the spray nozzle 73 continues until it reaches above the outer periphery of the substrate W, as shown in the lower section of Figure 5. This cleans the upper surface of the substrate W. The spray nozzle 73 may also be moved from above the outer periphery of the substrate W towards approximately above the center of the substrate W.

[0055] (4) Configuration of the control unit Figure 6 is a block diagram showing the configuration of the control system of the substrate cleaning apparatus 1. As shown in Figure 6, the control device 9 includes, as functional units, a chuck control unit 9A, a suction control unit 9B, a base control unit 9C, a transfer control unit 9D, a rotation control unit 9E, a lifting control unit 9F, a load specification unit 9G, a load control unit 9H, a cleaning liquid control unit 9I, a discharge gas control unit 9J, a cup control unit 9K, a top surface cleaning control unit 9L, an end surface cleaning control unit 9M, and a loading / unloading control unit 9N.

[0056] The CPU 9a (Figure 1) of the control device 9 executes the circuit board cleaning program stored in the memory 9b (Figure 1), thereby realizing the above-described functional unit of the control device 9. Some or all of the functional unit of the control device 9 may be realized by hardware such as electronic circuits.

[0057] The chuck control unit 9A controls the upper holding devices 10A, 10B so that the lower chucks 11A, 11B and upper chucks 12A, 12B hold the substrate W. The suction control unit 9B controls the lower holding device 20 so that the suction holding unit 21 suction and holds the substrate W and rotates the suction-held substrate W. The base control unit 9C controls the base device 30 so that the movable base 32 moves to multiple positions in the Y direction. The transfer control unit 9D controls the transfer device 40 so that multiple support pins 41 move the substrate W between the upper holding devices 10A, 10B and the lower holding device 20.

[0058] The rotation control unit 9E controls the motor drive unit 170 of the bottom cleaning device 50 so that the bottom brush 51 rotates. The lifting control unit 9F controls the lifting motor 190 of the bottom cleaning device 50 so that the bottom brush 51 moves between the standby position and the processing position. The load identification unit 9G identifies the load to be applied to the substrate W based on the load detected by the load detection unit 200 of the bottom cleaning device 50.

[0059] The load control unit 9H controls the electro-pneumatic regulator 130 of the bottom cleaning device 50 so that the load specified by the load specification unit 9G, i.e., the load applied to the substrate W, reaches a predetermined reference value. The cleaning liquid control unit 9I controls the bottom cleaning device 50 so that the liquid nozzle 52 discharges cleaning liquid. The discharge gas control unit 9J controls the bottom cleaning device 50 so that the gas ejection unit 53 ejects gas.

[0060] The cup control unit 9K controls the cup device 60 so that the cup 61 moves between the lower cup position and the upper cup position. The top surface cleaning control unit 9L controls the top surface cleaning device 70 so that the spray nozzle 73 cleans the top surface of the substrate W. The edge cleaning control unit 9M controls the edge cleaning device 80 so that the bevel brush 83 cleans the outer edge of the substrate W. The loading / unloading control unit 9N controls the opening / closing device 90 so that the shutter 91 opens and closes the loading / unloading opening / closing opening 2x of the unit housing 2.

[0061] (5) Circuit board cleaning process Figure 7 is a flowchart showing the substrate cleaning process performed by the control device 9 in Figure 6. The substrate cleaning process is performed by the CPU 9a of the control device 9 executing the substrate cleaning program stored in the memory 9b. In the initial state, the movable base 32 of the base device 30 is positioned such that the suction holding part 21 of the lower holding device 20 is located in the center of the cup 61 in a plan view.

[0062] First, the loading / unloading control unit 9N controls the opening / closing device 90 to open the loading / unloading port 2x and accept the substrate W loaded from outside the substrate cleaning device 1 into the unit housing 2 (step S1).

[0063] Next, the transfer control unit 9D controls the transfer device 40 to receive the substrate W with the support pins 41 and transfer the received substrate W to the upper holding devices 10A and 10B (step S2). At this time, the chuck control unit 9A controls the upper holding devices 10A and 10B to hold the outer edge of the substrate W above the lower holding device 20 (step S3). Note that if the substrate W brought in from outside the substrate cleaning device 1 can be placed on the lower chucks 11A and 11B, the process in step S2 may be omitted. The input / output port 2x, which was opened in step S1, is closed by the shutter 91 after the substrate W has been received by the transfer device 40.

[0064] Subsequently, the rotation control unit 9E, the lifting control unit 9F, and the load control unit 9H control the motor drive unit 170, the lifting motor 190, and the electro-pneumatic regulator 130, respectively, while the cleaning fluid control unit 9I controls the bottom surface cleaning device 50. This executes a central cleaning process to clean the central region of the bottom surface of the substrate W (step S4). Details of the central cleaning process will be described later.

[0065] During the central cleaning process in step S4, cleaning fluid adheres to the central region of the lower surface of the substrate W. Therefore, the base control unit 9C controls the base device 30, and the discharge gas control unit 9J controls the lower surface cleaning device 50 to dry the central region of the lower surface of the substrate W (step S5). Specifically, gas is sprayed from the gas ejection unit 53 toward the lower surface of the substrate W, creating a gas curtain, and the gas ejection unit 53 moves relative to the lower surface of the substrate W so as to pass through the central region of the lower surface in a plan view. As a result, the cleaning fluid adhering to the central region of the lower surface of the substrate W is pushed away by the gas curtain to a position away from the central region of the lower surface of the substrate W, and the central region of the lower surface is dried.

[0066] After step S5 is completed, the lower brush 51 is lowered from the processing position to the standby position. Next, the transfer control unit 9D controls the transfer device 40 to receive the substrate W held by the upper holding devices 10A and 10B with the multiple support pins 41 and transfer the received substrate W to the lower holding device 20 (step S6).

[0067] Next, the suction control unit 9B controls the lower holding device 20 to hold the central region of the lower surface of the substrate W with the suction holding unit 21 (step S7). During steps S6 and S7, the base device 30 is positioned so that the center of the substrate W is located at the center of the suction holding unit 21 in a plan view. As a result, the substrate W is held by the suction holding unit 21 with its center located on the rotation center (rotation axis) of the suction holding unit 21. The suction control unit 9B also controls the lower holding device 20 to rotate the substrate W held by the suction holding unit 21 (step S8).

[0068] Here, the lifting control unit 9F and the load control unit 9H control the lifting motor 190 and the electro-pneumatic regulator 130, respectively, while the cleaning fluid control unit 9I controls the bottom surface cleaning device 50. This executes an external cleaning process to clean the outer region of the bottom surface of the substrate W (step S9). Details of the external cleaning process will be described later.

[0069] Furthermore, the edge cleaning control unit 9M cleans the outer edge of the substrate W by controlling the edge cleaning device 80 to bring the bevel brush 83 into contact with the outer edge of the substrate W (step S10). After the cleaning of the outer edge of the substrate W is completed, the bevel brush 83 is returned to its initial position in the edge cleaning device 80.

[0070] Furthermore, the top surface cleaning control unit 9L controls the top surface cleaning device 70 to move the spray nozzle 73 from above the center of the substrate W to above the outer periphery of the substrate W while spraying the mixed fluid from the spray nozzle 73, thereby cleaning the entire top surface of the substrate W (step S11). After the cleaning of the entire top surface of the substrate W is completed, the spraying of the mixed fluid from the spray nozzle 73 is stopped, and the spray nozzle 73 is returned to its initial position in the top surface cleaning device 70.

[0071] Steps S9 to S11 are performed almost simultaneously and in parallel. After the completion of steps S9 to S11, the adsorption control unit 9B controls the lower holding device 20 to rotate the substrate W at high speed and dry the entire substrate W (step S12). This drying method, in which the entire substrate W is dried by rotating it at high speed, is called spin drying.

[0072] Finally, the loading / unloading control unit 9N opens the loading / unloading port 2x by controlling the opening / closing device 90. As a result, the substrate W is unloaded from the substrate cleaning device 1 (step S13), and the substrate cleaning process is completed. After the substrate W has been unloaded, the loading / unloading port 2x, which was opened in step S10, is closed by the shutter 91.

[0073] Furthermore, during steps S9 to S12 of the above series of processes, the cup control unit 9K controls the cup device 60 to hold the cup 61 in the upper cup position. As a result, when cleaning the lower outer region, outer edge, and the entire upper surface of the substrate W, and when spin-drying the substrate W, droplets scattered from the substrate W are caught by the cup 61 and discharged to the outside of the substrate cleaning device 1. In addition, during the processes other than steps S9 to S12 of the above series of processes (steps S1 to S8, S13), the cup control unit 9K controls the cup device 60 to hold the cup 61 in the lower cup position.

[0074] (6) Central washing process Figure 8 is a flowchart of the central cleaning process shown in Figure 7. The central cleaning process will now be described with reference to the lower brush drive unit 100 in Figure 3 and the control device 9 in Figure 6. First, the lifting control unit 9F controls the lifting motor 190 to raise the lower brush 51 from the standby position to the processing position (step S21).

[0075] At the time step S21 is performed, the lower brush 51 is not in contact with the substrate W. The load identification unit 9G acquires the detected load detected by the load detection unit 200 at this point as the basic load (step S22). Step S22 may be performed before step S21.

[0076] Next, the rotation control unit 9E rotates the lower brush 51 by controlling the motor drive unit 170 (step S23). Subsequently, the load control unit 9H raises the lower brush 51 by controlling the electro-pneumatic regulator 130 to bring it into contact with the central region of the lower surface of the substrate W (step S24). This initiates cleaning of the central region of the lower surface of the substrate W.

[0077] Here, the load identification unit 9G acquires the detected load detected by the load detection unit 200 (step S25). The load identification unit 9G also identifies the applied load applied to the substrate W by the lower brush 51 based on the basic load acquired in step S22 and the detected load acquired in step S25 (step S26).

[0078] The load control unit 9H determines whether the applied load identified in step S26 is a reference value (step S27). If the applied load is not a reference value, the load control unit 9H adjusts the load applied by the air cylinder 120 to the support member 140 by controlling the electro-pneumatic regulator 130 (step S28). After that, the load control unit 9H returns to step S25.

[0079] If the applied load in step S27 is at the reference value, the load control unit 9H determines whether a predetermined time has elapsed since step S24 (step S29). If the predetermined time has not elapsed, the load control unit 9H returns to step S25. Steps S25 to S29 are repeated until the predetermined time has elapsed. Once the predetermined time has elapsed, the load control unit 9H terminates the central cleaning process. As a result, the rotation of the lower brush 51 stops and the lower brush 51 is separated from the substrate W.

[0080] (7) External cleaning treatment Figure 9 is a flowchart of the external cleaning process shown in Figure 7. As shown in Figure 9, the external cleaning process includes steps S31 to S38. Steps S31 and S32 are the same as steps S21 and S22 of the central cleaning process shown in Figure 8, respectively. Note that the processing position in step S31 of the external cleaning process is different from the processing position in step S21 of the central cleaning process. Specifically, the processing position in step S31 is lower than the processing position in step S21.

[0081] Step S33 is the same as step S24 of the central cleaning process, except that the lower brush 51 is brought into contact with the outer region of the lower surface of the substrate W instead of the central region. Between step S32 and step S33, a process of rotating the lower brush 51 may be performed. In this case, the outer region of the lower surface of the substrate W can be cleaned by the rotating lower brush 51.

[0082] Steps S34 to S38 are the same as steps S25 to S29 of the central cleaning process, respectively. The predetermined time in step S38 may be different from the predetermined time in step S29. For example, the predetermined time in step S38 may be the time in step S11 until the spray nozzle 73 of the top surface cleaning device 70 moves from above the center of the substrate W to above the outer periphery of the substrate W. In this case, cleaning of the outer lower surface region of the substrate W is completed when cleaning of the entire top surface of the substrate W is completed. After cleaning of the outer lower surface region of the substrate W is completed, the bottom brush 51 is lowered from the processing position to the standby position.

[0083] (8) Effects In the substrate cleaning apparatus 1 according to this embodiment, the lower surface of the substrate W is cleaned by the lower brush 51. In addition, the load from the lower brush 51 to the substrate W is adjusted by raising and lowering the support member 140 that supports the lower brush 51 by the air cylinder 120. Here, the load between the support member 140 and the air cylinder 120 is detected by a load detection unit 200 provided between the support member 140 and the air cylinder 120. With this configuration, it is possible to more accurately determine the load from the lower brush 51 to the substrate W. As a result, the substrate W can be cleaned uniformly.

[0084] In this example, the load applied to the substrate W from the lower brush 51 is determined by the load determination unit 9G based on the load detected when the lower brush 51 is not in contact with the substrate W (basic load) and the load detected when the lower brush 51 is in contact with the substrate W. The operation of the air cylinder 120 is controlled by the load control unit 9H so that the applied load determined by the load determination unit 9G becomes a reference value. With this configuration, the applied load can be accurately determined even when the state of the lower brush 51 changes. This allows for more uniform cleaning of the substrate W.

[0085] Furthermore, the lower brush 51 remains in a standby position when the substrate W is not being cleaned, and is raised from the standby position to a processing position closer to the substrate W when the substrate W is being cleaned. The raising and lowering of the lower brush 51 between the standby position and the processing position is performed by a lifting motor 190. On the other hand, the support member 140 is raised and lowered by an air cylinder 120 within a range smaller than the lifting and lowering range of the lower brush 51 by the lifting motor 190. As a result, the cleaning surface of the lower brush 51 in the processing position comes into contact with the lower surface of the substrate W.

[0086] With this configuration, the lifting motor 190 allows the lower brush 51 to be raised and lowered relatively large between the standby position and the processing position, and the air cylinder 120 allows the lower brush 51 to be raised and lowered within a small range at the processing position. Therefore, when the substrate W is not being cleaned, the lower brush 51 can be kept in a standby position away from the processing position, and when the substrate W is being cleaned, the load applied to the substrate W at the processing position can be precisely adjusted.

[0087] 2. Second Embodiment (1) Lower brush drive unit The following describes the differences between the substrate cleaning apparatus 1 according to the second embodiment and the substrate cleaning apparatus 1 according to the first embodiment. Figure 10 is a schematic diagram illustrating the configuration of the lower brush drive unit 100 in the second embodiment. As shown in Figure 10, in this embodiment, the lower brush drive unit 100 does not include the load detection unit 200. Therefore, the air cylinder 120 supports the support member 140 without going through the load detection unit 200.

[0088] Furthermore, the lower brush drive unit 100 includes a load detection unit 300. The load detection unit 300 is, for example, a pressure sensor capable of detecting a two-dimensional load distribution. The load detection unit 300 is positioned between the brush body 51a and the brush base 51b of the lower brush 51. Therefore, the load detection unit 200 detects the load distribution between the brush body 51a and the brush base 51b. This makes it possible to obtain the distribution of detected load.

[0089] (2) Central cleaning process Figure 11 is a flowchart showing an example of the central cleaning process algorithm in the second embodiment. As shown in Figure 11, the central cleaning process in this embodiment includes step S22a instead of step S22, step S25a instead of step S25, and step S26a instead of step S26. Furthermore, the same central cleaning process includes steps S27a and S27b instead of step S27, and steps S28a and S28b instead of step S28.

[0090] Specifically, after the lower brush 51 is raised from the standby position to the processing position in step S21, the load identification unit 9G acquires the distribution of detected loads detected by the load detection unit 300 as the distribution of the basic load (step S22a). After that, the load identification unit 9G proceeds to step S23. Step S22a may be performed before step S21.

[0091] Furthermore, after the lower brush 51 makes contact with the central region of the lower surface of the substrate W in step S24, the load identification unit 9G acquires the distribution of detected loads detected by the load detection unit 300 (step S25a). Next, the load identification unit 9G identifies the distribution of applied loads applied to the substrate W by the lower brush 51 based on the distribution of basic loads acquired in step S22a and the distribution of detected loads acquired in step S25a (step S26a).

[0092] The load control unit 9H determines whether the minimum value in the applied load distribution identified in step S26a is greater than or equal to a predetermined lower limit reference value (step S27a). If the minimum value of the applied load is not greater than or equal to the lower limit reference value, the load control unit 9H increases the load applied by the air cylinder 120 to the support member 140 by controlling the electro-pneumatic regulator 130 (step S28a). After that, the load control unit 9H returns to step S25a.

[0093] If the minimum value of the applied load in step S27a is greater than or equal to the lower limit reference value, the load control unit 9H determines whether the maximum value in the applied load distribution identified in step S26a is less than or equal to a predetermined upper limit reference value (step S27b). If the maximum value of the applied load is not less than or equal to the upper limit reference value, the load control unit 9H reduces the load applied by the air cylinder 120 to the support member 140 by controlling the electro-pneumatic regulator 130 (step S28b). After that, the load control unit 9H returns to step S25a.

[0094] If the maximum applied load in step S27b is less than or equal to the upper limit reference value, the load control unit 9H proceeds to step S29. As a result, the lower central region of the substrate W is cleaned with a load within an appropriate range, greater than or equal to the lower limit reference value and less than or equal to the upper limit reference value, applied to the lower central region of the substrate W by the lower surface brush 51.

[0095] If the process is returned to step S25a from steps S28a and S28b a predetermined number of times, or if the state of returning to step S25a from steps S28a and S28b continues for a certain period of time, a warning may be issued to the user. In this case, the user can recognize that it is difficult to clean the central area of ​​the lower surface of the substrate W with an appropriate load. This allows the user to take appropriate measures such as maintenance of the lower surface brush 51.

[0096] As an example of the above warning, if the circuit board cleaning device 1 includes a display device, a string of characters prompting the user to confirm may be displayed. If the circuit board cleaning device 1 includes an audio output device, an audio message indicating the same content may be output, or a warning sound such as a buzzer may be output. If the circuit board cleaning device 1 includes an indicator light such as a lamp, the indicator light may be turned on, turned off, or blinked in a manner corresponding to the content of the warning.

[0097] (3) External cleaning treatment Figure 12 is a flowchart showing the external cleaning process in the second embodiment. As shown in Figure 12, the external cleaning process in this embodiment includes step S32a instead of step S32, step S34a instead of step S34, and step S35a instead of step S35. Furthermore, the external cleaning process includes steps S36a and S36b instead of step S36, and steps S37a and S37b instead of step S37.

[0098] Step S32a is the same as step S22a of the central cleaning process in Figure 11. Steps S34a and S35a are the same as steps S25a and S26a of the central cleaning process, respectively. Steps S36a and S37a are the same as steps S27a and S28a of the central cleaning process, respectively. Steps S36b and S37b are the same as steps S27b and S28b of the central cleaning process, respectively.

[0099] This process cleans the lower outer region of the substrate W with a load within an appropriate range, above the lower limit and below the upper limit, applied by the lower brush 51. Similar to the central cleaning process, if the process is returned to step S34a from steps S37a and S37b a predetermined number of times, or if the state of returning to step S37a and S37b from step S34a continues for a certain period of time, the user may be warned.

[0100] (4) Effects In the substrate cleaning apparatus 1 according to this embodiment, the lower surface of the substrate W is cleaned by the brush body 51a of the lower brush 51. In addition, the support member 140 that supports the brush base 51b of the lower brush 51 is raised and lowered by the air cylinder 120. Here, the two-dimensional load distribution between the brush body 51a and the brush base 51b is detected by the load detection unit 300 provided between the brush body 51a and the brush base 51b. Based on the load distribution detected by the load detection unit 300, the load from the brush body 51a to the substrate W is adjusted. With this configuration, it is possible to more accurately determine the load distribution from the lower brush 51 to the substrate W. As a result, the substrate W can be cleaned uniformly.

[0101] In this example, the operation of the air cylinder 120 is controlled by the load control unit 9H so that the minimum value in the load distribution detected by the load detection unit 300 is equal to or greater than the lower limit reference value. Alternatively, the operation of the air cylinder 120 may be controlled by the load control unit 9H so that the maximum value in the load distribution detected by the load detection unit 300 is equal to or less than the upper limit reference value.

[0102] With this configuration, even if deformation such as warping or bending occurs in the substrate W, it is prevented that a portion of the lower brush 51 will contact the substrate W excessively weakly, and that a portion of the lower brush 51 will not contact the substrate W. Furthermore, even if deformation occurs in the substrate W, it is prevented that a portion of the lower brush 51 will contact the substrate W excessively strongly. As a result, the substrate W can be cleaned more uniformly.

[0103] In this example, the load distribution from the brush body 51a to the substrate W (applied load) is determined by the load identification unit 9G based on the load distribution detected by the load detection unit 300 when the brush body 51a is not in contact with the substrate W (basic load) and the load distribution detected by the load detection unit 300 when the brush body 51a is in contact with the substrate W. Based on the applied load distribution determined by the load identification unit 9G, the operation of the air cylinder 120 is controlled by the load control unit 9H. With this configuration, the applied load distribution can be accurately determined even when the state of the lower brush 51 changes. This allows for more uniform cleaning of the substrate W.

[0104] 3. Other Embodiments (1) In the above embodiment, the raising and lowering of the lower brush 51 between the standby position and the processing position is performed by the lifting motor 190, and minute raising and lowering of the lower brush 51 in the processing position is performed by the air cylinder 120, but the embodiment is not limited thereto. The raising and lowering of the lower brush 51 between the standby position and the processing position, and minute raising and lowering of the lower brush 51 in the processing position may be performed by a common actuator.

[0105] (2) In the above embodiment, the substrate cleaning apparatus 1 includes a top surface cleaning apparatus 70 and an edge cleaning apparatus 80, but the embodiment is not limited thereto. If the top surface of the substrate W is not to be cleaned, the substrate cleaning apparatus 1 does not need to include the top surface cleaning apparatus 70. Also, if the outer edges of the substrate W are not to be cleaned, the substrate cleaning apparatus 1 does not need to include the edge cleaning apparatus 80.

[0106] (3) In the above embodiment, both central cleaning and external cleaning are performed, but the embodiment is not limited thereto. Either the central cleaning or external cleaning is not required. If central cleaning is not performed, the substrate cleaning apparatus 1 does not need to include the upper holding devices 10A and 10B. Also, if external cleaning is not performed, the substrate cleaning apparatus 1 does not need to include the lower holding device 20.

[0107] (4) In the above embodiment, the substrate cleaning apparatus 1 includes a transfer device 40, but the embodiment is not limited thereto. If the substrate W can be directly transferred between the upper holding devices 10A, 10B and the lower holding device 20, the transfer device 40 may not be included. Also, if the substrate cleaning apparatus 1 does not include either the upper holding devices 10A, 10B or the lower holding device 20, the transfer device 40 may not be included.

[0108] (5) In the above embodiment, the substrate cleaning apparatus 1 includes a control device 9 that controls the operation of each component, but the embodiment is not limited thereto. If each component of the substrate cleaning apparatus 1 is configured to be controllable by an information processing device outside the substrate cleaning apparatus 1, the substrate cleaning apparatus 1 does not need to include the control device 9.

[0109] (6) In the second embodiment, both a process to determine whether the minimum value of the applied load is equal to or greater than the lower limit reference value (step S36a) and a process to determine whether the maximum value of the applied load is equal to or less than the upper limit reference value (step S36b) are performed, but the embodiment is not limited thereto. Either step S36a or step S36b may be performed, and the other may not be performed.

[0110] 4. Correspondence between each component of the claim and each part of the embodiment The following describes examples of the correspondence between each component of the claims and each element of the embodiments, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0111] In the above embodiment, substrate W is an example of a substrate, bottom brush 51 is an example of a bottom brush, support member 140 is an example of a support part, air cylinder 120 is an example of a first actuator, and load detection unit 200 or load detection unit 300 is an example of a load detection unit. Substrate cleaning device 1 is an example of a substrate cleaning device, load specification unit 9G is an example of a load specification unit, load control unit 9H is an example of a load control unit, lifting motor 190 is an example of a second actuator, brush body 51a is an example of a brush body, and brush base 51b is an example of a brush base.

[0112] 5. Summary of the Embodiments (Paragraph 1) The substrate cleaning apparatus relating to Paragraph 1 is A bottom brush for cleaning the underside of the circuit board, A support portion that supports the lower brush, A first actuator adjusts the load from the lower brush to the substrate by raising and lowering the support portion, The system includes a load detection unit provided between the support portion and the first actuator, which detects the load between the support portion and the first actuator.

[0113] In this substrate cleaning apparatus, the underside of the substrate is cleaned by a bottom brush. Furthermore, the support portion that supports the bottom brush is raised and lowered by a first actuator, thereby adjusting the load from the bottom brush to the substrate. Here, the load between the support portion and the first actuator is detected by a load detection unit provided between the support portion and the first actuator. This configuration allows for more accurate determination of the load from the bottom brush to the substrate, enabling uniform cleaning of the substrate.

[0114] (Article 2) The substrate cleaning apparatus described in Article 1 is A load identification unit that identifies the load from the lower brush to the substrate based on the load detected by the load detection unit when the lower brush is not in contact with the substrate and the load detected by the load detection unit when the lower brush is in contact with the substrate, The system may further include a load control unit that controls the operation of the first actuator so that the load identified by the load identification unit reaches a predetermined reference value.

[0115] This configuration allows for accurate identification of the load from the bottom brush to the substrate, even when the condition of the bottom brush changes. This enables more uniform cleaning of the substrate.

[0116] (Article 3) The substrate cleaning apparatus described in Article 1 or Article 2 is: The system further includes a second actuator that raises and lowers the lower brush between a standby position where the lower brush is kept in standby position when the substrate is not being cleaned, and a processing position closer to the substrate than the standby position. The first actuator may bring the lower brush in the processing position into contact with the substrate by raising and lowering the support portion within a range smaller than the range of raising and lowering of the lower brush by the second actuator.

[0117] In this case, the second actuator allows the lower brush to be raised and lowered relatively large between the standby position and the processing position, while the first actuator allows the lower brush to be raised and lowered within a small range at the processing position. This makes it possible to keep the lower brush in a standby position away from the processing position when the substrate is not being cleaned, and to precisely adjust the load applied to the substrate at the processing position when the substrate is being cleaned.

[0118] (Article 4) The substrate cleaning apparatus relating to Article 4 is A bottom brush including a brush body for cleaning the underside of a circuit board and a brush base to which the brush body is attached, The lower brush has a support portion that supports the brush base, A first actuator adjusts the load from the lower brush to the substrate by raising and lowering the support portion, A load detection unit is provided between the brush body and the brush base to detect the two-dimensional load distribution between the brush body and the brush base, The system includes a load control unit that controls the operation of the first actuator based on the load distribution detected by the load detection unit.

[0119] In this substrate cleaning apparatus, the underside of the substrate is cleaned by the brush body of the underside brush. Furthermore, a support portion that supports the brush base of the underside brush is raised and lowered by a first actuator. Here, the two-dimensional load distribution between the brush body and the brush base is detected by a load detection unit provided between the brush body and the brush base. Based on the load distribution detected by the load detection unit, the load from the brush body to the substrate is adjusted. This configuration makes it possible to more accurately determine the load distribution from the underside brush to the substrate. This allows for uniform cleaning of the substrate.

[0120] (Item 5) In the substrate cleaning apparatus described in Item 4, The load control unit may control the operation of the first actuator so that the minimum value in the load distribution detected by the load detection unit is equal to or greater than a predetermined lower limit reference value.

[0121] This configuration prevents excessively weak contact between the lower brush and the substrate, as well as preventing non-contact between the lower brush and the substrate, even if the substrate is deformed, such as warping or bending. This allows for more uniform cleaning of the substrate.

[0122] (Article 6) In the substrate cleaning apparatus described in Article 4 or Article 5, The load control unit may control the operation of the first actuator so that the maximum value in the load distribution detected by the load detection unit is less than or equal to a predetermined upper limit reference value.

[0123] This configuration prevents excessive contact between the substrate and the lower brush, even if the substrate is deformed, such as warping or bending. This allows for more uniform cleaning of the substrate.

[0124] (Section 7) The substrate cleaning apparatus described in any one of paragraphs 4 to 6 is: The system further includes a load identification unit that identifies the load distribution from the brush body to the substrate based on the load distribution detected by the load detection unit when the brush body is not in contact with the substrate and the load distribution detected by the load detection unit when the brush body is in contact with the substrate. The load control unit may control the operation of the first actuator based on the load distribution identified by the load identification unit.

[0125] This configuration allows for accurate identification of the load distribution from the bottom brush to the substrate, even when the condition of the bottom brush changes. This enables more uniform cleaning of the substrate.

[0126] (Item 8) The substrate cleaning apparatus described in any one of items 4 to 7 is: The system further includes a second actuator that raises and lowers the lower brush between a standby position where the lower brush is kept in standby position when the substrate is not being cleaned, and a processing position closer to the substrate than the standby position. The first actuator may raise and lower the support portion within a range smaller than the range of raising and lowering of the lower brush by the second actuator, thereby bringing the brush body of the lower brush in the processing position into contact with the substrate.

[0127] In this case, the second actuator allows the lower brush to be raised and lowered relatively large between the standby position and the processing position, while the first actuator allows the lower brush to be raised and lowered within a small range at the processing position. This makes it possible to keep the lower brush in a standby position away from the processing position when the substrate is not being cleaned, and to precisely adjust the load applied to the substrate at the processing position when the substrate is being cleaned.

[0128] (Paragraph 9) The substrate cleaning method relating to Paragraph 9 is: The brush body of the bottom brush cleans the bottom surface of the circuit board, The first actuator raises and lowers the support portion that supports the brush base of the lower brush, This includes detecting a two-dimensional load distribution between the brush body and the brush base using a load detection unit. Raising and lowering the support portion includes adjusting the load from the brush body to the substrate based on the load distribution detected by the load detection unit.

[0129] In this substrate cleaning method, the underside of the substrate is cleaned by the brush body of the underside brush. Furthermore, a support portion that supports the brush base of the underside brush is raised and lowered by a first actuator. Here, the two-dimensional load distribution between the brush body and the brush base is detected by a load detection unit. Based on the load distribution detected by the load detection unit, the load from the brush body to the substrate is adjusted. This method makes it possible to more accurately determine the load distribution from the underside brush to the substrate. This allows for uniform cleaning of the substrate.

[0130] (Item 10) In the substrate cleaning method described in Item 9, Adjusting the load may include adjusting the load from the brush body to the substrate so that the minimum value in the load distribution detected by the load detection unit is equal to or greater than a predetermined lower limit standard value.

[0131] This method prevents excessively weak contact between the bottom brush and the substrate, as well as preventing non-contact between the bottom brush and the substrate, even if the substrate is deformed, such as warping or bending. This allows for more uniform cleaning of the substrate.

[0132] (Paragraph 11) In the substrate cleaning method described in paragraph 9 or 10, Adjusting the load may include adjusting the load from the brush body to the substrate so that the maximum value in the load distribution detected by the load detection unit is less than or equal to a predetermined upper limit reference value.

[0133] This method prevents excessive contact between the lower brush and the substrate, even if the substrate is deformed, such as warping or bending. This allows for more uniform cleaning of the substrate.

[0134] (Section 12) The substrate cleaning method described in any one of Sections 9 to 11 is: The method further includes determining the load distribution from the brush body to the substrate based on the load distribution detected by the load detection unit when the brush body is not in contact with the substrate and the load distribution detected by the load detection unit when the brush body is in contact with the substrate. Adjusting the load may include adjusting the load from the brush body to the substrate based on a specified load distribution from the brush body to the substrate.

[0135] This method allows for accurate identification of the load distribution from the bottom brush to the substrate, even when the condition of the bottom brush changes. This enables more uniform cleaning of the substrate. [Explanation of Symbols]

[0136] 1...Substrate cleaning device, 2...Unit housing, 2x...Loading / unloading port, 9...Control device, 9a...CPU, 9A...Chuck control unit, 9b...Memory, 9B...Suction control unit, 9C...Base control unit, 9D...Transfer control unit, 9E...Rotation control unit, 9F...Lifting / lowering control unit, 9G...Load specification unit, 9H...Load control unit, 9I...Cleaning fluid control unit, 9J...Discharge gas control unit, 9K...Cup control unit, 9L...Top surface cleaning control unit, 9M...End cleaning control unit, 9N...Loading / unloading control unit, 10A, 10B...Upper holding device, 11A, 11B...Lower chuck, 12A, 12B...Upper chuck, 20...Lower holding device, 21...Suction holding unit, 30...Base device, 31...Linear guide, 32...Movable base, 40...Transfer device, 41...Support pin, 5 0...Bottom cleaning device, 51...Bottom brush, 51a...Brush body, 51b...Brush base, 52...Liquid nozzle, 53...Gas ejection part, 60...Cup device, 61...Cup, 70...Top cleaning device, 71, 81...Rotating support shaft, 72, 82...Arm, 73...Spray nozzle, 80...End cleaning device, 83...Bevel brush, 90...Opening / closing device, 91...Shutter, 100...Bottom brush drive unit, 101, 102...Power transmission member, 150...110...Housing unit, 120...Air cylinder, 130...Electro-pneumatic regulator, 140...Support member, 150...Rotating shaft, 160...Rotating motor, 170...Motor drive unit, 180...Linear guide, 190...Lifting motor, 200, 300...Load detection unit, W...Substrate

Claims

1. A bottom brush for cleaning the underside of the circuit board, A support portion that supports the lower brush, A first actuator adjusts the load from the lower brush to the substrate by raising and lowering the support portion, A load detection unit is provided between the support portion and the first actuator to detect the load between the support portion and the first actuator, The system includes a standby position for the lower brush when the substrate is not being cleaned, and a second actuator for raising and lowering the lower brush between a standby position and a processing position closer to the substrate than the standby position. A substrate cleaning apparatus wherein the first actuator raises and lowers the support portion within a range smaller than the range of raising and lowering of the lower brush by the second actuator, thereby bringing the lower brush in the processing position into contact with the substrate.

2. A load identification unit that identifies the load from the lower brush to the substrate based on the load detected by the load detection unit when the lower brush is not in contact with the substrate and the load detected by the load detection unit when the lower brush is in contact with the substrate, The substrate cleaning apparatus according to claim 1, further comprising a load control unit that controls the operation of the first actuator so that the load specified by the load specification unit becomes a predetermined reference value.

3. A bottom brush including a brush body for cleaning the underside of a circuit board and a brush base to which the brush body is attached, The lower brush has a support portion that supports the brush base, A first actuator adjusts the load from the lower brush to the substrate by raising and lowering the support portion, A load detection unit is provided between the brush body and the brush base to detect the two-dimensional load distribution between the brush body and the brush base, A substrate cleaning apparatus comprising a load control unit that controls the operation of the first actuator based on the load distribution detected by the load detection unit.

4. The substrate cleaning apparatus according to claim 3, wherein the load control unit controls the operation of the first actuator so that the minimum value in the load distribution detected by the load detection unit is equal to or greater than a predetermined lower limit reference value.

5. The substrate cleaning apparatus according to claim 3 or 4, wherein the load control unit controls the operation of the first actuator so that the maximum value in the load distribution detected by the load detection unit is less than or equal to a predetermined upper limit reference value.

6. The system further includes a load identification unit that identifies the load distribution from the brush body to the substrate based on the load distribution detected by the load detection unit when the brush body is not in contact with the substrate and the load distribution detected by the load detection unit when the brush body is in contact with the substrate. The substrate cleaning apparatus according to claim 3 or 4, wherein the load control unit controls the operation of the first actuator based on the load distribution identified by the load identification unit.

7. The system further includes a second actuator that raises and lowers the lower brush between a standby position where the lower brush is kept in standby position when the substrate is not being cleaned, and a processing position closer to the substrate than the standby position. The substrate cleaning apparatus according to claim 3 or 4, wherein the first actuator raises and lowers the support portion within a range smaller than the raising and lowering range of the lower brush by the second actuator, thereby bringing the brush body of the lower brush in the processing position into contact with the substrate.

8. The brush body of the bottom brush cleans the bottom surface of the circuit board, The first actuator raises and lowers the support portion that supports the brush base of the lower brush, This includes detecting a two-dimensional load distribution between the brush body and the brush base using a load detection unit. A method for cleaning a substrate, comprising raising and lowering the support portion, which includes adjusting the load from the brush body to the substrate based on the load distribution detected by the load detection unit.

9. The substrate cleaning method according to claim 8, wherein adjusting the load includes adjusting the load from the brush body to the substrate so that the minimum value in the load distribution detected by the load detection unit is equal to or greater than a predetermined lower limit reference value.

10. The substrate cleaning method according to claim 8 or 9, wherein adjusting the load includes adjusting the load from the brush body to the substrate so that the maximum value in the load distribution detected by the load detection unit is less than or equal to a predetermined upper limit reference value.

11. The method further includes determining the load distribution from the brush body to the substrate based on the load distribution detected by the load detection unit when the brush body is not in contact with the substrate and the load distribution detected by the load detection unit when the brush body is in contact with the substrate. The substrate cleaning method according to claim 8 or 9, wherein adjusting the load includes adjusting the load from the brush body to the substrate based on a specified load distribution from the brush body to the substrate.

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