storage

Abstract

To provide a storage capable of allowing liquid to easily flow through a space between a flexible printed circuit board and an electronic component.SOLUTION: A storage according to an embodiment includes a flexible printed circuit board and an electronic component. The flexible printed circuit board has: a first insulating layer; a first conductive layer provided on a first surface of the first insulating layer; and a second conductive layer provided on a second surface of the first insulating layer located on an opposite side of the first surface; and a land is provided on the first conductive layer. The second conductive layer covers the land in a first direction in which the first surface faces through a first insulating layer. The electronic component includes a pin joined to the land.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] Embodiments of the present invention relate to storage.

Background Art

[0002] Storage such as a hard disk drive has a flexible printed circuit board (FPC) and electronic components mounted on the FPC. For example, pins of the electronic components are joined to lands provided on the FPC.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Liquid may be introduced inside the storage. For example, a cleaning liquid removes substances such as flux that can contaminate the storage. However, if there is a gap between the FPC and the electronic components, it becomes difficult for the liquid to flow, and there is a risk that the liquid or flux remains in the gap.

[0005] An example of the problem solved by the present invention is to provide a storage in which liquid can easily flow through the space between the flexible printed circuit board and the electronic components.

Means for Solving the Problems

[0006] A storage according to one embodiment comprises a flexible printed circuit board and an electronic component. The flexible printed circuit board has a first insulating layer, a first conductive layer provided on a first surface of the first insulating layer, and a second conductive layer provided on a second surface of the first insulating layer located opposite the first surface, with lands provided on the first conductive layer. The second conductive layer covers the lands in a first direction in which the first surface faces, via the first insulating layer. The electronic component has pins bonded to the lands. The land has two first lands spaced apart in a second direction along the first surface. The pin has two first pins spaced apart in the second direction and bonded to the two first lands. Between the first insulating layer and the electronic component, the first conductive layer is provided with a gap located between the two first lands. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is an illustrative perspective view showing a disassembled HDD according to the first embodiment. [Figure 2] Figure 2 is an illustrative plan view showing an FPC of the first embodiment. [Figure 3] Figure 3 is an exemplary plan view showing a part of the second connection portion of the first embodiment. [Figure 4] Figure 4 is an exemplary cross-sectional view showing a portion of the second connection of the first embodiment along the line F4-F4 in Figure 3. [Figure 5] Figure 5 is an exemplary bottom view showing a relay connector of the first embodiment. [Figure 6] Figure 6 is an exemplary cross-sectional view showing a part of the second connection portion according to the second embodiment. [Figure 7] Figure 7 is an exemplary cross-sectional view showing a part of the second connection portion according to the third embodiment. [Modes for carrying out the invention]

[0008] (First Embodiment) The first embodiment will be described below with reference to Figures 1 to 5. Note that in this specification, the components of the embodiment and their descriptions may be described using multiple expressions. The components and their descriptions are examples and are not limited by the expressions used herein. Components may also be identified by names different from those used herein. Furthermore, components may also be described using expressions different from those used herein.

[0009] Figure 1 is an exemplary perspective view showing a disassembled hard disk drive (HDD) 10 according to the first embodiment. The HDD 10 is an example of storage (auxiliary storage device) and may also be referred to as an electronic device, storage device, external storage device, or magnetic disk device. Note that storage is not limited to the HDD 10. For example, storage may be other devices such as a solid-state drive (SSD).

[0010] The HDD 10 comprises a housing 11, a plurality of magnetic disks 12, a spindle motor 13, a head stack assembly (HSA) 14, a voice coil motor (VCM) 15, a ramp load mechanism 16, a flexible printed circuit board (FPC) 17, and a printed circuit board (PCB) 18.

[0011] The housing 11 comprises a base 21, an inner cover 22, and an outer cover 23. The base 21 is a bottomed container and has a bottom wall 25 and side walls 26. The bottom wall 25 is formed in the shape of a roughly rectangular (square) plate. The side walls 26 protrude from the edge of the bottom wall 25. The bottom wall 25 and the side walls 26 are formed integrally.

[0012] The inner cover 22 is attached to the end of the side wall 26, for example, by screws. The outer cover 23 covers the inner cover 22 and is airtightly fixed to the end of the side wall 26, for example, by welding.

[0013] The inside of the enclosure 11 is sealed. Inside the enclosure 11 are the magnetic disk 12, spindle motor 13, HSA 14, VCM 15, ramp load mechanism 16, and FPC 17.

[0014] The inner cover 22 is provided with a vent hole 27. Further, the outer cover 23 is provided with a vent hole 28. After components are attached inside the base 21 and the inner cover 22 and the outer cover 23 are attached to the base 21, the air inside the housing 11 is exhausted from the vent holes 27 and 28. Further, a gas different from air is filled inside the housing 11.

[0015] The gas filled inside the housing 11 is, for example, a low-density gas having a lower density than air, an inert gas having low reactivity, or the like. For example, helium is filled inside the housing 11. Note that other fluids may be filled inside the housing 11. Also, the inside of the housing 11 may be maintained at a vacuum, a low pressure close to a vacuum, or a negative pressure lower than atmospheric pressure.

[0016] The vent hole 28 of the outer cover 23 is blocked by a seal 29. The seal 29 hermetically seals the vent hole 28 and suppresses the fluid filled inside the housing 11 from leaking from the vent hole 28. Note that the inside and the outside of the housing 11 may communicate with each other.

[0017] The magnetic disk 12 is, for example, a disk having magnetic recording layers provided on both surfaces of the magnetic disk 12. The diameter of the magnetic disk 12 is, for example, 3.5 inches, but is not limited to this example. A plurality of magnetic disks 12 are stacked with an interval therebetween.

[0018] The spindle motor 13 supports and rotates a plurality of stacked magnetic disks 12. The plurality of magnetic disks 12 are held, for example, by a clamp spring on the hub of the spindle motor 13.

[0019] The HSA 14 is rotatably supported by a support shaft 31 disposed at a position separated from the magnetic disk 12. The HSA 14 has a carriage 35 and a plurality of head gimbal assemblies (HGAs) 36.

[0020] The carriage 35 has an actuator block 41, a plurality of arms 42, and a holder 43. The actuator block 41 is rotatably supported on the support shaft 31 via a bearing, for example. The plurality of arms 42 protrude from the actuator block 41 in a direction substantially orthogonal to the support shaft 31.

[0021] The plurality of arms 42 are arranged at intervals in the direction in which the support shaft 31 extends. Each of the arms 42 is formed in a plate shape that can enter between adjacent magnetic disks 12. The plurality of arms 42 extend substantially parallel to each other.

[0022] The holder 43 protrudes from the actuator block 41 in the direction opposite to the direction in which the arms 42 protrude. The holder 43 holds the voice coil of the VCM 15. The VCM 15 has a pair of yokes, a voice coil disposed between the yokes, and a magnet provided on the yokes.

[0023] The HGA 36 is attached to the tip portion of the corresponding arm 42 and protrudes from the arm 42. As a result, the plurality of HGAs 36 are arranged at intervals in the direction in which the support shaft 31 extends. Each of the plurality of HGAs 36 has a base plate 51, a load beam 52, a flexure 53, and a magnetic head 54. The magnetic head 54 may also be referred to as a slider.

[0024] The base plate 51 is formed in a plate shape and attached to the tip portion of the arm 42. The load beam 52 is formed in a plate shape thinner than the base plate 51. The load beam 52 is attached to the tip portion of the base plate 51 and protrudes from the base plate 51.

[0025] The flexure 53 is formed in an elongated strip shape. Note that the shape of the flexure 53 is not limited to this example. The flexure 53 is a laminated plate having a metal plate (backing layer) such as stainless steel, an insulating layer formed on the metal plate, a conductive layer formed on the insulating layer and constituting a plurality of wirings (wiring patterns), and a protective layer (insulating layer) covering the conductive layer.

[0026] A gimbal section (elastic support section) is provided at one end of the flexure 53, which is positioned on the load beam 52 and is displaceable. The gimbal section is provided at the tip of the HGA 36, and the magnetic head 54 is mounted on it. The other end of the flexure 53 is connected to the FPC 17. As a result, the FPC 17 is electrically connected to the magnetic head 54 via the wiring of the flexure 53.

[0027] The magnetic head 54 records and reproduces information on the recording layer of the magnetic disk 12. In other words, the magnetic head 54 reads and writes information to the magnetic disk 12. The magnetic head 54 may have an element that generates microwaves or laser light.

[0028] The VCM15 rotates the HSA14 to position the magnetic head 54 in the desired location. Once the magnetic head 54 has moved to the outermost edge of the magnetic disk 12, the ramp load mechanism 16 holds the magnetic head 54 in an unloaded position, separated from the magnetic disk 12.

[0029] PCB18 is a rigid substrate, such as a glass epoxy substrate, and can be a multilayer substrate or a build-up substrate. PCB18 is located outside the housing 11 and is attached to the bottom wall 25 of the base 21. PCB18 is attached to the bottom wall 25 by, for example, multiple screws. Various electronic components, such as an interface (I / F) connector 61, a controller 62, a relay connector 63, and other components are mounted on PCB18.

[0030] The I / F connector 61 is a connector compliant with an interface standard such as Serial ATA (SATA) and is connected to the I / F connector of the host computer. The HDD 10 receives power from the host computer and sends and receives various data to and from the host computer through the I / F connector 61.

[0031] The controller 62 is, for example, a system-on-a-chip (SoC) and includes a read / write channel (RWC), a hard disk controller (HDC), and a processor. The controller 62 controls the entire HDD 10, including, for example, a spindle motor 13, a VCM 15, and a magnetic head 54.

[0032] The relay connector 63 is electrically connected to various components located inside the housing 11, for example, through a connector provided on the bottom wall 25. As a result, the PCB 18 is electrically connected to the VCM 15, FPC 17, flexi 53, and magnetic head 54 located inside the housing 11.

[0033] Figure 2 is an exemplary plan view showing the FPC17 of the first embodiment. As shown in Figure 2, the FPC17 is formed in a roughly L-shaped strip when removed from other parts and in a natural state where no external forces are acting on it. Note that the shape of the FPC17 is not limited to this example. The FPC17 has a first connecting portion 71, a second connecting portion 72, and an intermediate portion 73.

[0034] The first connector 71 is provided, for example, at one end of the FPC 17 in the direction in which the FPC 17 extends. The first connector 71 is attached to the actuator block 41, for example, by a screw. The first connector 71 is electrically connected to the VCM 15 and the flexure 53.

[0035] The second connector 72 is provided, for example, at the other end of the FPC 17 in the direction in which the FPC 17 extends. The second connector 72 is attached to the bottom wall 25, for example, by screws. The second connector 72 is electrically connected to the PCB 18, for example, through a connector provided on the bottom wall 25.

[0036] The intermediate section 73 is provided between the first connecting section 71 and the second connecting section 72. The intermediate section 73 extends in a strip shape and flexes between the first connecting section 71 and the second connecting section 72 in accordance with the rotation of the HSA 14.

[0037] As shown in each drawing, the X, Y, and Z axes are defined herein for convenience. The X, Y, and Z axes are orthogonal to each other. The X axis is provided along the width of the natural intermediate section 73. The Y axis is provided along the length of the natural intermediate section 73. The Z axis is provided along the thickness of the natural FPC 17.

[0038] Furthermore, the X, Y, and Z directions are defined herein. The X direction is a direction along the X axis and includes the +X direction indicated by the X-axis arrow and the -X direction which is the opposite direction of the X-axis arrow. The Y direction is a direction along the Y axis and includes the +Y direction indicated by the Y-axis arrow and the -Y direction which is the opposite direction of the Y-axis arrow. The Z direction is a direction along the Z axis and includes the +Z direction indicated by the Z-axis arrow and the -Z direction which is the opposite direction of the Z-axis arrow.

[0039] The first connecting portion 71 is connected to the end of the intermediate portion 73 in the +Y direction and extends from that end in the +Y direction. The second connecting portion 72 is connected to the end of the intermediate portion 73 in the -Y direction and extends from that end in the +X direction. Note that the first connecting portion 71 and the second connecting portion 72 are not limited to this example.

[0040] The HDD10 further includes multiple preamplifiers 75, intermediate connectors 76, and multiple reinforcing plates 77. The intermediate connectors 76 are an example of electronic components. Note that the electronic components are not limited to intermediate connectors 76, but may be other components. The reinforcing plates 77 are an example of walls.

[0041] The preamplifier 75 is mounted on the first connection section 71. The preamplifier 75 is electrically connected to the magnetic head 54, for example, via the FPC 17 and the flexure 53. The preamplifier 75 amplifies the write signal and transmits it to the magnetic head 54, and also amplifies the read signal received from the magnetic head 54.

[0042] The relay connector 76 is mounted on the second connection section 72. The relay connector 76 is electrically connected to the relay connector 63 of the PCB 18, for example, through a connector provided on the bottom wall 25. This connects the second connection section 72 to the PCB 18. Alternatively, the relay connector 76 may be directly connected to the relay connector 63 of the PCB 18.

[0043] The reinforcing plate 77 is made of a metal such as aluminum or a synthetic resin, and is formed in the shape of a plate. However, the reinforcing plate 77 is not limited to this example. Multiple reinforcing plates 77 are attached to the first connection part 71 and the second connection part 72.

[0044] The reinforcing plate 77 has higher rigidity than the FPC 17. Therefore, the reinforcing plate 77 improves the rigidity of the first connection part 71 and the second connection part 72. The intermediate part 73 is not attached to the reinforcing plate 77 and can bend.

[0045] Figure 3 is an exemplary plan view showing a portion of the second connection portion 72 of the first embodiment. Figure 4 is an exemplary cross-sectional view showing a portion of the second connection portion 72 of the first embodiment along the line F4-F4 in Figure 3.

[0046] As shown in Figure 4, the FPC 17 has a mounting surface 17a and a back surface 17b. The mounting surface 17a is one surface of the FPC 17. The preamplifier 75 and the relay connector 76 are mounted on the mounting surface 17a. Therefore, the mounting surface 17a faces the preamplifier 75 and the relay connector 76. The back surface 17b is located on the opposite side of the mounting surface 17a. The back surface 17b faces the reinforcing plate 77.

[0047] The FPC17 has a base layer 81, two conductive layers 82 and 83, two cover layers 84 and 85, and three adhesive layers 86, 87, and 88. The base layer 81 is an example of a first insulating layer. The conductive layer 82 is an example of a first conductive layer. The conductive layer 83 is an example of a second conductive layer. The cover layer 84 is an example of a second insulating layer.

[0048] The base layer 81 and the cover layers 84 and 85 are made of an insulating material such as polyimide and are insulating. In other words, the electrical resistance of the base layer 81 and the cover layers 84 and 85 is higher than the electrical resistance of the conductive layers 82 and 83.

[0049] The base layer 81 has an upper surface 81a and a lower surface 81b. In this specification, "upper" and "lower" are convenient terms based on the vertical direction in Figure 4 and do not limit the direction, position, or other conditions. The upper surface 81a is an example of a first surface. The lower surface 81b is an example of a second surface.

[0050] The upper surface 81a is the surface of the base layer 81 oriented approximately in the +Z direction. The lower surface 81b is located on the opposite side of the upper surface 81a and is the surface of the base layer 81 oriented approximately in the -Z direction. The upper surface 81a and the lower surface 81b may have irregularities.

[0051] Each of the two conductive layers 82 and 83 is made of a conductor, such as copper, and is conductive. Conductive layer 82 is provided on the upper surface 81a of the base layer 81. Conductive layer 83 is provided on the lower surface 81b of the base layer 81.

[0052] As shown in Figure 3, the conductive layer 82 is provided with a plurality of connection pads 91, a plurality of reinforcing pads 92, and a plurality of wirings 93. At least one of the connection pads 91 is an example of a third land. The plurality of reinforcing pads 92 are examples of lands and first lands.

[0053] Each of the multiple connection pads 91 is, for example, used to transmit an electrical signal, set to a power source, or set to ground potential. The multiple reinforcement pads 92 are, for example, set to ground potential.

[0054] Multiple pads, including multiple connecting pads 91 and multiple reinforcing pads 92, are arranged in two rows in the Y direction. Two corresponding connecting pads 91 are arranged with a gap between them in the X direction, and two corresponding reinforcing pads 92 are also arranged with a gap between them in the X direction. The X direction is the direction along the upper surface 81a of the base layer 81, and is an example of a second direction.

[0055] In this embodiment, the FPC17 has a portion between two reinforcing pads 92 arranged in the X direction where the conductive layer 82 is not provided. In other words, the conductive layer 82 has a gap (space, distance) located between the two reinforcing pads 92 arranged in the X direction.

[0056] The two reinforcing pads 92 are located at both ends of the row of connecting pads 91 and reinforcing pads 92. In other words, the multiple connecting pads 91 are arranged with a gap in the Y direction between the two reinforcing pads 92.

[0057] Multiple wires 93 extend from multiple connection pads 91. The multiple wires 93 electrically connect, for example, the multiple connection pads 91 to the preamplifier 75. Note that the wires 93 may also be connected to other wires, via holes, ground, or other conductors.

[0058] As shown in Figure 4, a plurality of support pads 95 are provided on the conductive layer 83. The support pads 95 are an example of a second land. Other parts, such as wiring, may also be provided on the conductive layer 83. The plurality of support pads 95 are electrically connected to a ground pattern, for example by wiring, and set to ground potential. Note that the support pads 95 are not limited to this example.

[0059] The number of support pads 95 is equal to the number of reinforcing pads 92. However, the number of reinforcing pads 92 and the number of support pads 95 may be different. In the projection plane viewed in the +Z direction, the support pads 95 are positioned at approximately the same locations as the reinforcing pads 92. Therefore, two support pads 95 are arranged in the X direction with a gap between them, just like two reinforcing pads 92.

[0060] The projection plane viewed in the +Z direction is, for example, the plane (projection plane) of the second connection part 72 as viewed from the opposite direction to the plane (projection plane) of the second connection part 72 shown in Figure 3. Therefore, the positions and shapes of the various elements on the projection plane viewed from the +Z direction are substantially the same as the positions and shapes of the various elements in Figure 3.

[0061] As shown in Figure 4, the FPC17 of this embodiment has a portion between two support pads 95 arranged in the X direction in which the conductive layer 83 is not provided. In other words, the conductive layer 83 has a gap (space, distance) located between the two support pads 95 arranged in the X direction.

[0062] Each of the support pads 95 covers a corresponding one of the reinforcing pads 92 in the +Z direction via the base layer 81. The +Z direction is an example of a first direction. In other words, the reinforcing pads 92 and the support pads 95 overlap each other via the base layer 81.

[0063] In this embodiment, the shapes of the multiple reinforcing pads 92 and the multiple support pads 95 are the same in the projection plane viewed in the +Z direction. Therefore, the multiple reinforcing pads 92 and the multiple support pads 95 overlap each other almost completely. However, the shapes of the multiple reinforcing pads 92 and the shapes of the multiple support pads 95 may differ from each other. In this case, each of the multiple reinforcing pads 92 has an almost identical shape to one of the corresponding support pads 95.

[0064] The conductive layer 83 may have a single large pattern, such as a ground plane, instead of multiple support pads 95. In this case, for example, the single pattern covers the multiple reinforcing pads 92 in the +Z direction via the base layer 81.

[0065] In the projection plane viewed in the +Z direction, each of the support pads 95 is spaced apart from the connection pads 91. In other words, the support pads 95 do not cover the connection pads 91. However, the conductive layer 83 may cover the connection pads 91 in the +Z direction via the base layer 81.

[0066] Multiple vias 96 are provided in the base layer 81. Each of the multiple vias 96 penetrates the base layer 81 and connects the corresponding reinforcing pads 92 and support pads 95. As a result, the reinforcing pads 92 and support pads 95 are set to approximately the same potential. In this embodiment, the reinforcing pads 92 and support pads 95 are set to ground potential.

[0067] The cover layer 84 covers at least a portion of the upper surface 81a of the base layer 81 and at least a portion of the conductive layer 82. Therefore, the conductive layer 82 is located between the base layer 81 and the cover layer 84. For example, the cover layer 84 covers a portion of the connection pad 91, a portion of the reinforcing pad 92, and the wiring 93.

[0068] Multiple exposure holes 101 are provided in the cover layer 84. Each of the multiple exposure holes 101 exposes at least one of the multiple connection pads 91 and multiple reinforcing pads 92 to the outside of the FPC 17.

[0069] The cover layer 84 and some of the multiple connection pads 91 and multiple reinforcing pads 92 exposed to the outside of the FPC 17 through the exposure holes 101 form the mounting surface 17a of the FPC 17. The mounting surface 17a may also include other parts, such as the upper surface 81a of the base layer 81 exposed to the outside of the FPC 17 through the exposure holes 101.

[0070] The cover layer 85 covers at least a portion of the lower surface 81b of the base layer 81 and the conductive layer 83. Therefore, the conductive layer 83 is located between the base layer 81 and the cover layer 85. The cover layer 85 may also expose a portion of the conductive layer 83 to the outside of the FPC 17. The cover layer 85 forms the back surface 17b of the FPC 17.

[0071] The adhesive layers 86, 87, and 88 are, for example, insulating adhesives. Adhesive layer 86 adheres the cover layer 84 to the upper surface 81a and conductive layer 82 of the base layer 81. Adhesive layer 87 adheres the cover layer 85 to the lower surface 81b of the base layer 81 and conductive layer 83. Adhesive layer 88 adheres the reinforcing plate 77 to the back surface 17b of the FPC 17.

[0072] Through holes 105 are provided in the FPC 17. The through holes 105 penetrate the FPC 17 in approximately the Z direction. That is, the through holes 105 are provided in the base layer 81, the cover layers 84, 85, and the adhesive layers 86, 87, 88. However, through holes 105 do not necessarily have to be provided in the base layer 81 and the cover layer 85.

[0073] As shown in Figure 3, the through hole 105 is located between two connecting pads 91 aligned in the X direction and between two reinforcing pads 92 aligned in the X direction. The through hole 105 extends approximately in the Y direction.

[0074] As shown in Figure 4, the reinforcing plate 77 covers the back surface 17b of the FPC 17. Therefore, the conductive layer 83 and the cover layer 85 are located between the base layer 81 and the reinforcing plate 77. The reinforcing plate 77 has a mounting surface 77a and a back surface 77b. The mounting surface 77a is an example of a third surface and a mounting surface.

[0075] The mounting surface 77a is formed to be substantially flat and oriented substantially in the +Z direction. The mounting surface 77a is attached to the back surface 17b of the FPC 17 by the adhesive layer 88. The back surface 77b is located on the opposite side of the mounting surface 77a. The back surface 77b is formed to be substantially flat and oriented substantially in the -Z direction.

[0076] The reinforcing plate 77 further has a plurality of protrusions 111. The protrusions 111 are examples of projections and projections. The plurality of protrusions 111 project from the mounting surface 77a of the reinforcing plate 77 in approximately the +Z direction.

[0077] The number of protrusions 111 is equal to the number of reinforcing pads 92. In the projection plane viewed in the +Z direction, the protrusions 111 are positioned approximately in the same location as the reinforcing pads 92. Therefore, two protrusions 111 are arranged side by side with a gap between them in the X direction.

[0078] The reinforcing plate 77 of this embodiment has a portion of the mounting surface 77a where no protrusions 111 are provided between two protrusions 111 arranged in the X direction. In other words, the reinforcing plate 77 is provided with a gap (space, distance) located between the two protrusions 111 arranged in the X direction.

[0079] Each of the multiple protrusions 111 covers one of the multiple reinforcing pads 92 in the +Z direction via the cover layer 85 and the base layer 81. In other words, the multiple reinforcing pads 92 and the multiple protrusions 111 overlap each other via the base layer 81 and the cover layer 85.

[0080] In the projection plane viewed in the +Z direction, the shapes of the multiple reinforcing pads 92 and the shapes of the multiple protrusions 111 are approximately equal. Each of the multiple reinforcing pads 92 has a shape that is approximately equal to one of the corresponding protrusions 111.

[0081] In the projection plane viewed in the +Z direction, each of the multiple protrusions 111 is spaced apart from the multiple connection pads 91. The protrusions 111 may also cover the multiple connection pads 91 in the +Z direction via the base layer 81.

[0082] Multiple through holes 115 are provided in the reinforcing plate 77. The multiple through holes 115 are spaced apart from the multiple protrusions 111. The multiple through holes 115 penetrate the reinforcing plate 77 in approximately the Z direction and communicate with the through holes 105 of the FPC 17.

[0083] As shown in Figure 3, the relay connector 76 has a case 121, a plurality of lead wires 122, and a plurality of reinforcing pins 123. The lead wires 122 are an example of a second pin. The reinforcing pins 123 are an example of a pin and a first pin.

[0084] Case 121 is, for example, a portion of the relay connector 76 formed from an insulator such as synthetic resin. Conductors, including lead wires 122 and reinforcing pins 123, are attached to case 121.

[0085] As shown in Figure 4, the case 121 has a bottom surface 121a and multiple sides 121b. The bottom surface 121a faces the mounting surface 17a of the FPC 17. The sides 121b face in directions intersecting the direction of the bottom surface 121a. For example, each of the multiple sides 121b faces either the X direction or the Y direction.

[0086] As shown in Figure 3, the multiple lead wires 122 and reinforcing pins 123 are provided on the side surface 121b facing the X direction. The multiple lead wires 122 and reinforcing pins 123 are arranged in two rows in the Y direction. Two corresponding lead wires 122 are arranged with a gap between them in the X direction, and two corresponding reinforcing pins 123 are arranged with a gap between them in the X direction.

[0087] Each of the multiple lead wires 122 is joined to a corresponding one of the multiple connection pads 91 via solder 125. This allows the relay connector 76 to be mounted on the FPC 17. Each of the multiple reinforcing pins 123 is joined to a corresponding one of the multiple reinforcing pads 92 via solder 126.

[0088] As shown in Figure 4, the FPC 17 is positioned between the relay connector 76 and the reinforcing plate 77. The reinforcing plate 77 covers the entire relay connector 76 in the +Z direction via the FPC 17. Thus, the reinforcing plate 77 can support the relay connector 76 via the FPC 17.

[0089] The gap between the two corresponding reinforcing pads 92 is located between the relay connector 76 and the base layer 81. Furthermore, the relay connector 76 covers the through-hole 105 of the FPC 17 and the through-hole 115 of the reinforcing plate 77 in the -Z direction.

[0090] As shown in Figure 3, the length of the through-hole 105 in the Y direction is longer than the length of the intermediate connector 76 in the Y direction. In the projection plane viewed in the +Z direction, both ends 105a of the through-hole 105 in the Y direction are located outside the intermediate connector 76. The Y direction is a direction that aligns with the upper surface 81a of the base layer 81 and is perpendicular to the X direction, and is an example of a third direction. In addition, in the projection plane viewed in the +Z direction, one of the ends 105a of the through-hole 105 in the +Y direction and the end 105a of the through-hole 105 in the -Y direction may be located inside the intermediate connector 76.

[0091] Figure 5 is an exemplary bottom view showing a relay connector 76 of the first embodiment. As shown in Figure 5, the case 121 is provided with a plurality of notches 131. Each of the plurality of notches 131 opens to a side 121b facing the X direction, a side 121b facing the Y direction, and a bottom surface 121a.

[0092] Case 121 further has a bottom surface 131a and an inner surface 131b of the notch 131. The bottom surface 131a faces approximately in the -Z direction. The inner surface 131b faces in a direction intersecting the direction of the bottom surface 131a. For example, the inner surface 131b faces approximately in the Y direction.

[0093] Case 121 further has a plurality of retaining protrusions 135, 136. Retaining protrusions 135 protrude from the bottom surface 131a in approximately the -Z direction at a position spaced apart from the inner surface 131b. Retaining protrusions 136 protrude from the inner surface 131b at a position spaced apart from the bottom surface 131a in the -Z direction.

[0094] The reinforcing pin 123 fits into the notch 131 of the case 121 and is attached to the case 121. A portion of the reinforcing pin 123 may be embedded in the case 121. A portion of the multiple reinforcing pins 123 protrudes from the side surface 121b of the case 121.

[0095] As shown in Figure 4, each of the multiple reinforcing pins 123 has a joint portion 141, a base portion 142, and an intermediate portion 143. The joint portion 141, the base portion 142, and the intermediate portion 143 are formed integrally.

[0096] The joint 141 extends approximately in the X direction. At least a portion of the joint 141 is located outside the notch 131. The joint 141 is joined to the reinforcing pad 92 via solder 126.

[0097] The base portion 142 is housed in the notch 131 and attached to the case 121. Therefore, the base portion 142 is provided between the joint portion 141 and the case 121. The base portion 142 may also be located outside the notch 131. The base portion 142 is spaced apart from the joint portion 141 in the X direction. Furthermore, in the Z direction, the base portion 142 is spaced further apart from the upper surface 81a than the joint portion 141.

[0098] The intermediate portion 143 is provided between the joint portion 141 and the base portion 142. The intermediate portion 143 extends diagonally with respect to the upper surface 81a between the end of the joint portion 141 in the X direction and the end of the base portion 142 in the X direction. The intermediate portion 143 extends away from the upper surface 81a as it approaches the base portion 142 from the joint portion 141.

[0099] As shown in Figure 5, a portion of the joint 141, a portion of the base 142, and the intermediate portion 143 are located between the inner surface 131b of the notch 131 and the retaining projection 135. Furthermore, the base 142 is located between the bottom surface 131a of the notch 131 and the retaining projection 136. As a result, the retaining projections 135 and 136 hold the reinforcing pin 123.

[0100] As shown in Figure 4, the multiple protrusions 111 of the reinforcing plate 77 overlap with the multiple reinforcing pads 92 and multiple support pads 95 of the FPC 17. The portion of the FPC 17 that is spaced apart from the protrusions 111 is attached to the mounting surface 77a of the reinforcing plate 77, which is recessed from the protrusions 111, by an adhesive layer 88. As a result, the portion of the FPC 17 on which the reinforcing pads 92 and support pads 95 are provided protrudes in the +Z direction from the other portions.

[0101] Furthermore, the multiple support pads 95 overlap with the multiple reinforcing pads 92. As a result, the portion of the FPC 17 where the multiple support pads 95 are provided becomes thicker due to the multiple reinforcing pads 92 and protrudes in the +Z direction from the other portions.

[0102] As described above, the portion of the FPC17 on which the reinforcing pad 92 is provided is made to protrude in the +Z direction by the projection 111 and the support pad 95. Therefore, the relay connector 76 is lifted in the +Z direction by the projection 111 and the support pad 95.

[0103] The FPC17 described above has multiple raised portions P and flat portions F. The multiple raised portions P are the parts of the FPC17 where the reinforcing pad 92, the support pad 95, and the projection 111 overlap. The flat portions F are the other parts of the FPC17.

[0104] The mounting surface 17a of the FPC 17 in the raised portion P protrudes in the +Z direction from the mounting surface 17a of the FPC 17 in the flat portion F. In this embodiment, the FPC 17 has four raised portions P.

[0105] The lower surface 121a of the case 121 of the relay connector 76 faces the mounting surface 17a of the flat portion F. A space S is provided between the lower surface 121a of the case 121 and the mounting surface 17a of the flat portion F. The projection 111 and the support pad 95 lift the relay connector 76 to form or expand the space S.

[0106] The through-hole 105 of the FPC17 communicates with space S. Therefore, space S communicates with the outside through the end 105a of the through-hole 105. Furthermore, the through-hole 115 of the reinforcing plate 77 communicates with space S via the through-hole 105. Therefore, space S communicates with the outside through both the through-hole 105 and the through-hole 115.

[0107] As shown in Figure 3, a gap G is provided between the four raised portions P, between the case 121 of the relay connector 76 and the mounting surface 17a of the flat portion F. The projections 111 and support pads 95 lift the relay connector 76, thereby forming or expanding the gap G. The space S communicates with the outside through the gap G.

[0108] The following is an example of a method for mounting the relay connector 76 to the FPC 17. Note that the method for mounting the relay connector 76 to the FPC 17 is not limited to the method described below, and other methods may be used. First, solder paste (solder 125, 126) is supplied to the connection pad 91 and the reinforcing pad 92, for example, by printing or coating.

[0109] Next, the relay connector 76 is mounted on the connection pad 91 and the reinforcing pad 92. The reinforcing plate 77 supports the relay connector 76 via the FPC 17, thereby preventing deformation of the FPC 17 during mounting.

[0110] Next, the FPC 17 is heated in a reflow oven, and the solder paste melts. This joins the lead wires 122 to the connection pads 91 and the reinforcing pins 123 to the reinforcing pads 92. At this time, flux mixed with or separately supplied to the solder 125 and 126 may leak out from the solder 125 and 126.

[0111] Next, the FPC17 is cleaned, for example, by ultrasonic cleaning. For example, the FPC17 is placed in a tank filled with cleaning solution C. As shown by the arrows in Figure 4, the cleaning solution C flows into space S through the through holes 115 and 105. The cleaning solution C can also be discharged from space S to the outside of the FPC17 through the through holes 105 and 115. Furthermore, the cleaning solution C flows into space S through the gap G. The cleaning solution C can also be discharged from space S to the outside of the FPC17 through the gap G.

[0112] The cleaning solution C flows into space S and is discharged from space S. In other words, the cleaning solution C flows through space S. This allows the cleaning solution C to remove substances that could contaminate the HDD 10, such as flux, from space S.

[0113] Once ultrasonic cleaning is complete, the FPC17 is removed from the cleaning solution C. At this time, the cleaning solution C in the space S is discharged through at least one of the through-holes 105, 115 and the gap G.

[0114] For example, the cleaning fluid C that flows into space S transmits ultrasonic waves. These ultrasonic waves lift the flux present in space S away from the FPC17. Subsequently, the cleaning fluid C, along with the flux, is discharged from space S as described above. With this, the mounting of components onto the FPC17 is completed.

[0115] The cleaning fluid C also flows into the notch 131. The notch 131 is provided with retaining protrusions 135 and 136 and accommodates a reinforcing pin 123, which may create a tiny gap where the cleaning fluid C and flux tend to remain. However, this tiny gap communicates with the space S enlarged by the raised portion P, making it easy for the cleaning fluid C to flow in. Therefore, the cleaning fluid C and flux in the tiny gap can be easily discharged.

[0116] Furthermore, a dead end D may be provided between the joint portion 141 and the intermediate portion 143 of the reinforcing pin 123 and the FPC 17. However, this dead end D communicates with the space S enlarged by the raised portion P, allowing the cleaning fluid C to flow in easily. Moreover, the dead end D can be enlarged by lifting the relay connector 76 in the +Z direction by the raised portion P. Therefore, the cleaning fluid C and flux in the dead end D can be easily discharged.

[0117] Note that the liquid flowing into space S is not limited to cleaning solution C. For example, if the storage is an SSD, a cooling liquid such as purified water may flow into space S. The formation of raised sections P and flat sections F in the FPC 17 allows the cooling liquid to flow efficiently through space S.

[0118] In the HDD 10 according to the first embodiment described above, the FPC 17 has a base layer 81, a conductive layer 82, and a conductive layer 83. The conductive layer 82 is provided on the upper surface 81a of the base layer 81. The conductive layer 83 is provided on the lower surface 81b of the base layer 81, which is located on the opposite side of the upper surface 81a. A reinforcing pad 92 is provided on the conductive layer 82. The conductive layer 83 covers the reinforcing pad 92 in the +Z direction, with the upper surface 81a facing the base layer 81. The relay connector 76 has reinforcing pins 123 joined to the reinforcing pad 92. The reinforcing pad 92 is pushed out in the +Z direction by the conductive layer 83 compared to when it is not covered by the conductive layer 83. As a result, the relay connector 76 joined to the reinforcing pad 92 also moves in the +Z direction, and the distance between the FPC 17 and the case 121 of the relay connector 76 can be increased. Consequently, the space S between the FPC 17 and the case 121 of the relay connector 76 becomes larger, allowing liquid to flow easily through this space S. For example, by making it easier for the cleaning fluid C to flow through this space S, the HDD 10 can suppress the accumulation of contaminating substances such as flux residue between the FPC 17 and the relay connector 76. Therefore, the HDD 10 of this embodiment can suppress contamination of the HDD 10, and consequently, it can suppress substances that could contaminate the HDD 10 from causing malfunctions such as head crashes. In addition, by making it easier for the cooling fluid to flow through this space S, the relay connector 76 can be cooled efficiently.

[0119] Two reinforcing pads 92 are arranged with a gap between them in the X direction along the upper surface 81a. Two reinforcing pins 123 are arranged with a gap between them in the X direction and are joined to the two reinforcing pads 92. Between the base layer 81 and the intermediate connector 76, a gap is provided in the conductive layer 82 located between the two reinforcing pads 92. In other words, there is a portion between the two reinforcing pads 92 where the conductive layer 82 is not provided. As a result, a recess is provided in the FPC 17 located between the base layer 81 and the intermediate connector 76. The reinforcing pads 92 are pushed out in the +Z direction by the conductive layer 83 compared to when they are not covered by the conductive layer 83. This enlarges the recess provided in the FPC 17. Consequently, the space S between the FPC 17 including the recess and the case 121 of the intermediate connector 76 becomes larger, and liquid can easily flow through this space S.

[0120] The conductive layer 83 is provided with two support pads 95 spaced apart in the X direction, and a gap between the two support pads 95. The two support pads 95 cover two reinforcing pads 92 in the +Z direction via the base layer 81. In other words, there is a portion between the two support pads 95 where the conductive layer 83 is not provided. As a result, the support pads 95 push the reinforcing pads 92 in the +Z direction, deepening the recess provided in the FPC 17. Consequently, the space S between the FPC 17 including the recess and the case 121 of the relay connector 76 becomes larger, allowing liquid to flow easily through the space S.

[0121] In the projection plane viewed in the +Z direction, the shapes of the two reinforcing pads 92 and the shapes of the two support pads 95 are equal. This allows for a larger recess in the FPC 17 and a larger space S containing the recess.

[0122] A connection pad 91 for transmitting electrical signals is provided on the conductive layer 82. The relay connector 76 further has lead wires 122 that are joined to the connection pad 91. The two support pads 95 are set to ground potential and are spaced apart from the connection pad 91 in the projection plane viewed in the +Z direction. This suppresses the support pads 95 from having a noise-like effect on the electrical signals flowing through the connection pad 91.

[0123] The FPC 17 further has a cover layer 84 that covers the upper surface 81a. The cover layer 84 is provided with a through hole 105 that is covered by the intermediate connector 76. In the projection plane viewed in the +Z direction, the end 105a of the through hole 105 in the Y direction, which is along the upper surface 81a and perpendicular to the X direction, is located outside the intermediate connector 76. This allows the liquid to easily flow through the through hole 105 into the space S between the FPC 17 and the case 121 of the intermediate connector 76.

[0124] The reinforcing plate 77 has a mounting surface 77a attached to the FPC 17 and a projection 111 protruding from the mounting surface 77a. The FPC 17 is located between the relay connector 76 and the reinforcing plate 77. The projection 111 covers two reinforcing pads 92 in the +Z direction via the base layer 81. The reinforcing pads 92 are pushed out in the +Z direction by the projection 111 compared to when they are not covered by the projection 111. As a result, the space S between the FPC 17 and the case 121 of the relay connector 76 is increased, allowing liquid to flow easily through the space S.

[0125] Two protrusions 111 are arranged side by side with a gap between them in the X direction. A gap is provided in the reinforcing plate 77 between the two protrusions 111. In other words, there is a portion between the two protrusions 111 where no protrusions 111 are provided. As a result, the protrusions 111 push the reinforcing pad 92 in the +Z direction, deepening the recess provided in the FPC 17. Consequently, the space S between the FPC 17 including the recess and the case 121 of the relay connector 76 becomes larger, allowing liquid to flow easily through this space S.

[0126] (Second embodiment) A second embodiment will be described below with reference to Figure 6. In the following descriptions of multiple embodiments, components having the same function as those already described will be denoted by the same reference numerals as those previously described, and their descriptions may be omitted. Furthermore, multiple components denoted by the same reference numerals do not necessarily share all functions and properties; they may have different functions and properties depending on the embodiment.

[0127] Figure 6 is an exemplary cross-sectional view showing a portion of the second connecting portion 72 according to the second embodiment. As shown in Figure 6, the reinforcing plate 77 of the second embodiment has a projection 201 instead of a plurality of protrusions 111.

[0128] The protrusion 201 extends approximately in the +Z direction from the mounting surface 77a of the reinforcing plate 77. In the projected plane viewed in the +Z direction, the protrusion 201 is larger than the relay connector 76. The protrusion 201 covers the entire relay connector 76 in the +Z direction via the base layer 81.

[0129] The protrusion 201 lifts the entire intermediate connector 76 in the +Z direction. As a result, the intermediate connector 76 protrudes beyond other components located around it, making it more easily exposed to the cleaning solution C and ultrasound during ultrasonic cleaning. Because the cleaning solution C and ultrasound reach the intermediate connector 76 directly, the intermediate connector 76 is cleaned more efficiently.

[0130] In the HDD 10 of the second embodiment described above, the protrusion 201 covers the entire relay connector 76 in the +Z direction via the base layer 81. As a result, the entire relay connector 76 moves in the +Z direction relative to other parts not covered by the protrusion 201. Therefore, the relay connector 76 is more easily exposed to liquid than other parts not covered by the protrusion 201. For example, the protrusion 201 can be more reliably cleaned by being more easily exposed to the cleaning solution C.

[0131] (Third embodiment) A third embodiment will be described below with reference to Figure 7. Figure 7 is an exemplary cross-sectional view showing a part of the second connection portion 72 according to the third embodiment. As shown in Figure 7, the conductive layer 83 of the third embodiment is provided with a plurality of support pads 301 instead of a plurality of support pads 95. The plurality of support pads 301 are substantially equivalent to the plurality of support pads 95, except as described below.

[0132] Each of the multiple support pads 301 is smaller than one of the multiple reinforcing pads 92. At a minimum, the length of the support pad 301 in the X direction is shorter than the length of the support pad 95 in the X direction.

[0133] Each of the multiple reinforcing pads 92 has ends 92a and 92b in the X direction. End 92a is an example of an inner end of the first land. End 92b is an example of an outer end of the first land.

[0134] End portion 92a is the end of the reinforcing pad 92 in the direction toward the center of the relay connector 76 in the X direction (hereinafter referred to as the inward direction). End portion 92b is the end of the reinforcing pad 92 in the opposite direction to the inward direction (hereinafter referred to as the outward direction).

[0135] Each of the support pads 301 covers a corresponding end 92a of the reinforcing pads 92 in the +Z direction via the base layer 81. On the other hand, the support pads 301 do not cover the ends 92b of the reinforcing pads 92. In other words, in the projected plane viewed in the +Z direction, the support pads 301 are spaced apart from the ends 92b of the reinforcing pads 92.

[0136] The support pad 301 described above lifts the end 92a of the reinforcing pad 92 in the +Z direction, but does not lift the end 92b of the reinforcing pad 92. For this reason, the reinforcing pad 92 extends diagonally with respect to the upper surface 81a of the base layer 81 so as to move outward toward the base layer 81.

[0137] In the HDD 10 of the third embodiment described above, the two support pads 301 cover the inner ends 92a of the two reinforcing pads 92 in the +Z direction via the base layer 81. Furthermore, the two support pads 301 are spaced apart from the outer ends 92b of the reinforcing pads 92 in the projection plane viewed in the +Z direction. That is, the inner ends 92a of the reinforcing pads 92 are pushed out in the +Z direction by the support pads 301, but the outer ends 92b of the reinforcing pads 92 are not pushed out. As a result, the two reinforcing pads 92 are inclined to taper in the +Z direction, making it easier to drain liquid to the outside.

[0138] In the above explanation, "suppress" is defined, for example, as preventing the occurrence of an event, effect, or influence, or reducing the degree of an event, effect, or influence.

[0139] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. The contents of the claims as originally filed are listed below. [1] A flexible printed circuit board comprising: a first insulating layer; a first conductive layer provided on a first surface of the first insulating layer; and a second conductive layer provided on a second surface of the first insulating layer located opposite the first surface, wherein lands are provided on the first conductive layer, and the second conductive layer covers the lands in a first direction facing the first surface via the first insulating layer, An electronic component having a pin joined to the aforementioned land, A storage device equipped with [the following features]. [2] The land has two first lands arranged with a gap between them in a second direction along the first surface, The pins are arranged with a gap between them in the second direction and have two first pins bonded to the two first lands, Between the first insulating layer and the electronic component, the first conductive layer is provided with a gap located between the two first lands. [1] Storage. [3] The second conductive layer is provided with two second lands arranged with a gap between them in the second direction, and a gap located between the two second lands. The two second lands cover the two first lands in the first direction via the first insulating layer. [2] Storage. [4] In the projection plane viewed in the first direction, the shapes of the two first lands and the shapes of the two second lands are equal. [3] Storage. [5] The two second lands cover the inner ends of the two first lands in the first direction via the first insulating layer, and are spaced apart from the outer ends of the two first lands in the projected plane viewed in the first direction. [3] Storage. [6] A third land for transmitting electrical signals is provided in the first conductive layer. The electronic component further has a second pin which is bonded to the third land, The two second lands are set to ground potential and are spaced apart from the third land in the projection plane viewed in the first direction. [3] Storage. [7] The flexible printed circuit board further comprises a second insulating layer covering the first surface, The second insulating layer is provided with through holes covered by the electronic components, In the projection plane viewed in the first direction, the end of the through-hole in the third direction, which is along the first plane and perpendicular to the second direction, is located outside the electronic component. [2] Storage. [8] A wall having a third surface attached to the flexible printed circuit board and a protrusion projecting from the third surface, Furthermore, it is equipped with, The flexible printed circuit board is located between the electronic component and the wall. The protrusion covers the two first lands in the first direction via the first insulating layer. [2] Storage. [9] The aforementioned protrusion has two projections arranged with a gap between them in the second direction, A gap is provided in the wall between the two protrusions. [8] Storage.

[10] The protruding portion covers the entire electronic component in the first direction via the first insulating layer. [8] Storage.

[11] A flexible printed circuit board having a first insulating layer and a first conductive layer provided on a first surface of the first insulating layer, wherein lands are provided on the first conductive layer, An electronic component having a pin joined to the aforementioned land, A wall having a mounting surface attached to the flexible printed circuit board, and a projection that protrudes from the mounting surface and covers the land in a first direction in which the first surface faces via the first insulating layer, A storage device equipped with [the following features]. [Explanation of Symbols]

[0140] 10...Hard disk drive (HDD), 17...Flexible printed circuit board (FPC), 76...Intermediate connector, 77...Reinforcement plate, 77a...Mounting surface, 81...Base layer, 81a...Top surface, 81b...Bottom surface, 82,83...Conductive layer, 84...Cover layer, 91...Connection pad, 92...Reinforcement pad, 92a,92b...Ends, 95,301...Support pads, 105...Through hole, 111...Protrusion, 123...Reinforcement pin, 201...Protruding part.

Claims

1. A flexible printed circuit board comprising: a first insulating layer; a first conductive layer provided on a first surface of the first insulating layer; and a second conductive layer provided on a second surface of the first insulating layer located opposite the first surface, wherein lands are provided on the first conductive layer, and the second conductive layer covers the lands in a first direction facing the first surface via the first insulating layer, An electronic component having a pin joined to the aforementioned land, It is equipped with, The land has two first lands spaced apart in a second direction along the first surface, The pins are arranged with a gap between them in the second direction and have two first pins joined to the two first lands, Between the first insulating layer and the electronic component, the first conductive layer is provided with a gap located between the two first lands. Storage.

2. The second conductive layer is provided with two second lands arranged with a gap between them in the second direction, and a gap located between the two second lands. The two second lands cover the two first lands in the first direction via the first insulating layer. The storage according to claim 1.

3. In the projection plane viewed in the first direction, the shapes of the two first lands and the shapes of the two second lands are equal. The storage according to claim 2.

4. The two second lands cover the inner ends of the two first lands in the first direction via the first insulating layer, and are spaced apart from the outer ends of the two first lands in the projection plane viewed in the first direction. The storage according to claim 2.

5. A third land for transmitting electrical signals is provided in the first conductive layer. The electronic component further has a second pin that is bonded to the third land, The two second lands are set to ground potential and are spaced apart from the third land in the projection plane viewed in the first direction. The storage according to claim 2.

6. The flexible printed circuit board further has a second insulating layer covering the first surface, The second insulating layer is provided with through holes covered by the electronic components. In the projection plane viewed in the first direction, the end of the through-hole in the third direction, which is along the first plane and perpendicular to the second direction, is located outside the electronic component. The storage according to claim 1.

7. A wall having a third surface attached to the flexible printed circuit board and a protrusion projecting from the third surface, Furthermore, it is equipped with, The flexible printed circuit board is located between the electronic component and the wall. The protruding portion covers the two first lands in the first direction via the first insulating layer. The storage according to claim 1.

8. The aforementioned protrusion has two projections arranged with a gap between them in the second direction, A gap is provided in the wall between the two protrusions. The storage according to claim 7.

9. The protruding portion covers the entire electronic component in the first direction via the first insulating layer. The storage according to claim 7.

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