Chemical sensor module and method for manufacturing the same

Abstract

To provide a chemical sensor module capable of reducing characteristic variation and a method for manufacturing the same.SOLUTION: A chemical sensor module comprises: a wiring member; a first chip including a first substrate, a sensor element, a first wiring electrically connected to the sensor element, and a second wiring electrically connected to the first substrate; and a second chip having a second substrate, a nonpolarizable electrode, and a third wiring electrically connected to the nonpolarizable electrode. The wiring member includes fourth wiring electrically connected to the first wiring, fifth wiring electrically connected to the second wiring, sixth wiring electrically connected to the third wiring, a first external terminal electrically connected to the fourth wiring, a second external terminal electrically connected to the fifth wiring, and a third external terminal electrically connected to the sixth wiring.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] Embodiments of the present invention relate to a chemical sensor module and a method for manufacturing the same.

Background Art

[0002] There is a chemical sensor that detects a specimen in a solution using a graphene FET (Field Effect Transistor).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Embodiments of the present invention aim to provide a chemical sensor module capable of reducing characteristic variations and a method for manufacturing the same.

Means for Solving the Problems

[0005] According to an embodiment of the present invention, the chemical sensor module comprises a wiring member having a wiring board, a first substrate having a first surface and a second surface located opposite to the first surface, a first chip provided on the wiring member with its second surface facing the wiring member, having a sensor element provided on the first surface, a first wiring provided on the first surface and electrically connected to the sensor element, and a second wiring electrically connected to the first substrate, having its second surface facing the wiring member, a second substrate having a third surface and a fourth surface located opposite to the third surface, a non-polarizing electrode provided on the third surface, and a third wiring provided on the third surface and electrically connected to the non-polarizing electrode, having its fourth surface facing the wiring member. The wiring member includes a fourth wiring electrically connected to the first wiring, a fifth wiring electrically connected to the second wiring, a sixth wiring electrically connected to the third wiring, a first external terminal electrically connected to the fourth wiring, a second external terminal electrically connected to the fifth wiring, and a third external terminal electrically connected to the sixth wiring. [Brief explanation of the drawing]

[0006] [Figure 1] This is a schematic plan view showing the configuration of the chemical sensor module of the embodiment. [Figure 2] Figure 1 is a schematic cross-sectional view of the portion where the second wiring of the first chip and the fifth wiring of the wiring member are connected in the chemical sensor module shown. [Figure 3] This is a schematic plan view showing the configuration of a chemical sensor module according to a modified embodiment. [Figure 4] Figure 3 is a schematic cross-sectional view of the portion where the second wiring of the first chip and the fifth wiring of the wiring member are connected in the chemical sensor module shown. [Figure 5] This is a schematic diagram showing an example of a sensor element and probe molecule. [Figure 6] This is a schematic diagram showing the chemical sensor module of the embodiment attached to a pipe through which the sample solution flows. [Figure 7]This is a circuit diagram showing an example of a potential difference setting circuit according to an embodiment. [Figure 8] This is a graph showing the experimental results. [Modes for carrying out the invention]

[0007] Each embodiment will be described below with reference to the drawings. Drawings are schematic or conceptual, and the relationships between the thickness and width of each part, as well as the ratios of the sizes of different parts, are not necessarily identical to those of reality. Even when representing the same part, the dimensions and ratios may be depicted differently in different drawings. Furthermore, identical or similar elements are assigned the same symbol.

[0008] As shown in Figure 1, the chemical sensor module of this embodiment comprises a first chip 100, a second chip 200, and a wiring member 300.

[0009] [Wiring components] Figure 2 is a schematic cross-sectional view of the portion of the chemical sensor module shown in Figure 1 where the second wiring 112 of the first chip 100 and the fifth wiring 315 of the wiring member 300 are connected. As shown in Figure 2, the wiring member 300 has a wiring substrate 301. The wiring substrate 301 is, for example, a silicon substrate. An insulating film 302 is provided on the upper surface of the wiring substrate 301, and an insulating film 303 is provided on the lower surface of the wiring substrate 301. The insulating films 302 and 303 are, for example, silicon oxide films. The wiring substrate 301 may also be a ceramic substrate such as aluminum nitride.

[0010] [First chip] The first chip 100 includes a first substrate 101, a sensor element 110, a first wiring 111, and a second wiring 112.

[0011] The first substrate 101 has a first surface 101A and a second surface 101B located on the opposite side of the first surface 101A. The first substrate 101 is, for example, a silicon substrate. An insulating film 102 (first insulating film) is provided on the first surface 101A, and an insulating film 103 is provided on the second surface 101B. The insulating films 102 and 103 are, for example, silicon oxide films.

[0012] With its second surface 101B facing the wiring member 300, the first chip 100 is provided on the wiring member 300, i.e., mounted. For example, the first chip 100 is joined to the wiring member 300 by a die bond member 120.

[0013] As shown in Figure 1, the sensor element 110 is provided on the first surface 101A of the first substrate 101. The sensor element 110 includes, for example, graphene. The first chip 100 also has a drain electrode 11D and a source electrode 11S. The drain electrode 11D and the source electrode 11S are provided on the first surface 101A via, for example, an insulating film 102. The drain electrode 11D and the source electrode 11S are electrically connected to the sensor element 110 (graphene). The sensor element 110 (graphene) is located between the drain electrode 11D and the source electrode 11S, and an electric current (drain current) flows between the drain electrode 11D and the source electrode 11S through the sensor element 110 (graphene).

[0014] As described later, a sample solution containing the sample atmosphere is supplied to the surface of the sensor element 110. When a target molecule that may be contained in the sample solution comes into close proximity to the surface of the sensor element 110, the electronic state of the sensor element 110 (graphene) changes. By detecting this as a change in drain current, the presence and concentration of the target molecule in the sample atmosphere can be determined.

[0015] As shown in FIG. 5, the first chip 100 may have probe molecules 150 located on the surface of the sensor element 110 (graphene). The fact that the probe molecules 150 are located on the surface of the sensor element 110 means that the probe molecules 150 are bonded, adsorbed, or in proximity to the surface of the sensor element 110 by chemical, charge-based attraction, π-π interaction, cation-π interaction, or hydrophobic interaction. The probe molecules 150 include, for example, at least any one of protein, peptide, antibody, DNA aptamer, or derivatives of these biomolecules. The probe molecules 150 can be located on the surface of the sensor element 110 via, for example, a linker molecule. As the linker molecule, for example, pyrene can be used.

[0016] The probe molecules 150 can specifically bind or interact with target molecules. When the probe molecules 150 bind or interact with the target molecules, the target molecules approach the surface of the sensor element 110, so the electronic state of the sensor element 110 changes due to the charge of the target molecules or the structural change of the probe molecules 150 caused by binding or interacting with the target molecules. This can be detected as a change in the drain current.

[0017] The first wiring 111 is provided on the first surface 101A of the first substrate 101 via, for example, an insulating film 102. The first wiring 111 has a first drain wiring 111D connected to the drain electrode 11D and a first source wiring 111S connected to the source electrode 11S. The first drain wiring 111D is electrically connected to the sensor element 110 via the drain electrode 11D. The first source wiring 111S is electrically connected to the sensor element 110 via the source electrode 11S.

[0018] The second wiring 112 is provided on the first surface 101A of the first substrate 101 via, for example, an insulating film 102. In the example shown in FIG. 2, the first chip 100 has a first contact portion 113 that penetrates the insulating film 102 and contacts the first surface 101A. The second wiring 112 is connected to the first contact portion 113 on the insulating film 102 and is electrically connected to the first substrate 101 via the first contact portion 113.

[0019] The second wiring 112 has, for example, a first layer 112A and a second layer 112B provided on the first layer 112A and covering the first layer 112A. The second layer 112B is exposed on the outermost surface (upper surface and side surfaces) of the second wiring 112 and contains, for example, gold (Au). The second layer 112B functions as an adhesion layer and a barrier metal and contains, for example, titanium (Ti).

[0020] [Second Chip] The second chip 200 has a second substrate 201, a non-polarizing electrode 210, and a third wiring 213.

[0021] The second substrate 201 has a third surface 201A and a fourth surface located on the opposite side of the third surface 201A. The second substrate 201 is, for example, a silicon substrate. Similar to the first chip 100, an insulating film 202 (second insulating film) is provided on the third surface 201A, and an insulating film is provided on the fourth surface. The insulating film 202 provided on the third surface 201A and the insulating film provided on the fourth surface are, for example, silicon oxide films.

[0022] With the fourth surface facing the wiring member 300, the second chip 200 is provided on the wiring member 300, that is, mounted. Similar to the first chip 100, the second chip 200 is joined to the wiring member 300 by, for example, a die bonding member.

[0023] The nonpolar electrode 210 has the characteristic of generating an oxidation-reduction reaction at its surface and producing an electric current when the voltage is changed. Therefore, this property allows the potential difference between the nonpolar electrode 210 and the solution to be kept constant, and the solution potential can be controlled or stabilized by an external power source. For the nonpolar electrode 210, for example, silver-silver chloride electrodes, hydrogen electrodes, calomel electrodes, etc., can be used. Silver-silver chloride electrodes are preferred because they have a simple structure, can be miniaturized, and have a low environmental impact.

[0024] The non-polarizable electrode 210 is provided on the third surface 201A of the second substrate 201. The non-polarizable electrode 210 is exposed in the piping through which the sample solution flows and is in contact with the sample solution. The sample solution contains chloride ions, and the non-polarizable electrode 210 is a silver-silver chloride electrode having silver chloride on its surface. The silver-silver chloride electrode (non-polarizable electrode 210) comes into contact with the sample solution containing chloride ions and imparts a potential to the sample solution by causing an oxidation-reduction reaction. This reduces the noise of the drain current in the sensor element 110. The potential of the sample solution is controlled to a constant potential difference with respect to the potential of the silver-silver chloride electrode according to the Nernst equation. Oxidation-reduction reaction with silver chloride (AgCl) (AgCl + e - → Ag + Cl - ) causes chloride ions (Cl) in the sample solution. - The ) moves between the sample solution and the surface of the silver-silver chloride electrode until the potential of the sample solution stabilizes.

[0025] The third wiring 213 is provided on the third surface 201A of the second substrate 201, for example, via an insulating film 202. The third wiring 213 is electrically connected to the non-polarizing electrode 210.

[0026] The second chip 200 further has a seventh wiring 217. The seventh wiring 217 is provided on the third surface 201A of the second substrate 201, for example, via an insulating film 202. The second chip 200 has a second contact portion 218 that penetrates the insulating film 202 and contacts the third surface 201A. The seventh wiring 217 is connected to the second contact portion 218 on the insulating film 202 and is electrically connected to the second substrate 201 via the second contact portion 218.

[0027] The wiring member 300 further includes a fourth wiring 314, a fifth wiring 315, and a sixth wiring 316.

[0028] The fourth wiring 314 is provided on the wiring board 301, for example, via an insulating film 302. The fourth wiring 314 has a fourth drain wiring 314D electrically connected to the first drain wiring 111D, and a fourth source wiring 314S electrically connected to the first source wiring 111S. The first drain wiring 111D and the fourth drain wiring 314D are electrically connected, for example, via a gold wire w1. The first source wiring 111S and the fourth source wiring 314S are electrically connected, for example, via a gold wire w2.

[0029] The fifth wiring 315 is provided on the wiring board 301, for example, via an insulating film 302. The fifth wiring 315 is electrically connected to the second wiring 112, for example, via a gold wire w3.

[0030] Similar to the second wiring 112 described above, as shown in Figure 2, the fifth wiring 315 has, for example, a first layer 315A and a second layer 315B provided on and covering the first layer 315A. The second layer 315B is exposed on the outermost surface (top and side) of the fifth wiring 315 and contains, for example, gold (Au). The second layer 315B functions as an adhesion layer and barrier metal and contains, for example, titanium (Ti).

[0031] Furthermore, it is preferable that the wiring other than the second wiring 112 and the fifth wiring 315 also have the same laminated structure of the first and second layers.

[0032] Furthermore, the fifth wiring 315 is electrically connected to the seventh wiring 217 of the second chip 200, for example, via a gold wire w5.

[0033] The sixth wiring 316 is electrically connected to the third wiring 213 of the second chip 200, for example, via a gold wire w4.

[0034] As shown in Figure 1, the wiring member 300 further includes a first external terminal 321, a second external terminal 322, and a third external terminal 323. The outermost surfaces of the first external terminal 321, the second external terminal 322, and the third external terminal 323 are made of, for example, gold. The first external terminal 321, the second external terminal 322, and the third external terminal 323 are provided on the insulating film 302 on the outer periphery of the wiring member 300, or on the back surface of the wiring member 300.

[0035] On the upper surface of the wiring member 300, the area enclosed by the seal region 400, shown by the dashed line in Figure 1, is exposed into the piping through which the sample solution flows, as will be described later. The first external terminal 321, the second external terminal 322, and the third external terminal 323 are located outside the area enclosed by the seal region 400. The first external terminal 321, the second external terminal 322, and the third external terminal 323 are electrically connected to an external circuit, for example, via conductive elastic pins.

[0036] The first external terminal 321 has a first drain terminal 321D electrically connected to the fourth drain wiring 314D, and a first source terminal 321S electrically connected to the fourth source wiring 314S. The sensor element 110 is electrically connected to the first drain terminal 321D via the drain electrode 11D, the first drain wiring 111D, the gold wire w1, and the fourth drain wiring 314D. The sensor element 110 is electrically connected to the first source terminal 321S via the source electrode 11S, the first source wiring 111S, the gold wire w2, and the fourth source wiring 314S.

[0037] The second external terminal 322 is electrically connected to the fifth wiring 315. The first substrate 101 of the first chip 100 is electrically connected to the second external terminal 322 via the second wiring 112, the gold wire w3, and the fifth wiring 315. The second substrate 201 of the second chip 200 is electrically connected to the second external terminal 322 via the seventh wiring 217, the gold wire w5, and the fifth wiring 315.

[0038] The third external terminal 323 is electrically connected to the sixth wiring 316. The non-polarizing electrode 210 of the second chip 200 is electrically connected to the third external terminal 323 via the third wiring 213, the gold wire w4, and the sixth wiring 316.

[0039] As shown in Figure 6, the chemical sensor module of this embodiment can be attached to an opening 601 formed in the piping 600. An annular sealing member 401 is positioned between the sealing region 400 shown in Figure 1, which is formed on the mounting surface of the wiring member 300 on which the first chip 100 and the second chip 200 are mounted, and the outer circumferential surface of the piping 600 near the opening 601. The sealing member 401 hermetically seals the inner and outer circumferential regions of the sealing member 401.

[0040] The surface of the sensor element 110 of the first chip 100 and the non-polarizing electrode 210 of the second chip 200 are exposed into the piping 600 through the opening 601 on the inner circumference side of the sealing member 401. The sample solution flows through the piping 600, and the surface of the sensor element 110 and the non-polarizing electrode 210 come into contact with the sample solution. As a result, the sensor element 110 can react with the target substance in the sample solution, and the potential of the sample solution is fixed by the non-polarizing electrode 210. The potential difference between the non-polarizing electrode 210 and the sample solution is controlled to remain constant.

[0041] The sealing member 401 may be attached to the piping 600 side, or the sealing area 400 on the chemical sensor module side may be configured to include a sealing member 401 surrounding the first chip 100 and the second chip 200.

[0042] The chemical sensor module is detachable from and replaceable at the opening 601 of the piping 600. By making the chemical sensor module replaceable, contamination from the sample solution does not accumulate on the sensor element 110 and the non-polarizing electrode 210, reducing noise and enabling reliable detection of the target substance.

[0043] Furthermore, in this embodiment, the potential difference between the second wiring 112, which is electrically connected to the first substrate 101, and the third wiring 213, which is electrically connected to the non-polarizing electrode 210, is controlled to be constant. That is, the potential difference between the first substrate 101 and the non-polarizing electrode 210 (sample solution) is controlled to be constant. For example, in an external device of the chemical sensor module, the second external terminal 322, which is electrically connected to the second wiring 112, and the third external terminal 323, which is electrically connected to the third wiring 213, are electrically connected.

[0044] Furthermore, the chemical sensor module of this embodiment may further include a potential difference setting circuit that controls the potential difference between the second wiring 112 and the third wiring 213. Figure 7 shows a switching regulator as an example of the potential difference setting circuit 500.

[0045] The potential difference setting circuit 500 includes a switch element 502 connected to an input terminal 503 to which an input voltage is input, and a control unit 501 that controls the on / off state of the switch element 502. By turning the switch element 502 on or off, an output voltage is output to the output terminal 504 connected to the second wiring 112. The third wiring 213 is connected to ground. A capacitor C is connected between the line between the switch element 502 and the output terminal 504 and the line to which the third wiring 213 is connected to ground. A resistor R is connected between the line between the output terminal 504 and the second wiring 112 and the line to which the third wiring 213 is connected to ground.

[0046] The control unit 501 monitors the output voltage of the output terminal 504 and controls the on / off state of the switch element 502 so that the potential difference between the second wiring 112 and the third wiring 213 remains constant.

[0047] If the potential of the first substrate 101 on which the sensor element 110 is mounted is floating, noise may be generated in the drain current due to variations in the back gate potential from the first substrate 101 to the sensor element 110. In this embodiment, for example, the side surface of the first substrate 101 is exposed and in contact with the sample solution. When the first substrate 101 is in contact with the sample solution, depending on the potential difference between the first substrate 101 and the sample solution, noise may be generated in the drain current due to electrochemical reactions between the first substrate 101 and the sample solution.

[0048] According to this embodiment, by keeping the potential difference between the potential of the first substrate 101 and the potential of the non-polarizing electrode 210, i.e., the potential of the sample solution, constant, the back gate potential from the first substrate 101 to the sensor element 110 can be kept constant, and the potential of the first substrate 101 can always be kept within a range where electrochemical reactions do not occur or are unlikely to occur. Furthermore, even if there is a slight electrochemical reaction between the first substrate 101 and the sample solution, the potential fluctuation of the first substrate 101 can be reduced. This makes it possible to reduce noise in the drain current.

[0049] Multiple first chips 100, each having different types of probe molecules 150 on the surface of a sensor element 110, may be mounted on a wiring member 300. In this case as well, the potential difference between the potential of the first substrate 101 of each of the multiple first chips 100 and the potential of the non-polarizing electrode 210, i.e., the potential of the sample solution, is controlled to be constant. This reduces variations in drain current caused by variations in the potential of the first substrate 101 among the multiple first chips 100.

[0050] For example, when the first substrate 101 is resin-encapsulated, it is necessary to keep the sensor element 110 sufficiently away from the resin in order to suppress the effect of resin bleeding on the sensor element 110 on the first surface 101A. This hinders the reduction of the chip size of the first chip 100. According to this embodiment, as described above, the electrochemical reaction between the first substrate 101 and the sample solution can be reduced, making resin encapsulation of the side surface of the first substrate 101 unnecessary. This allows for a reduction in the chip size of the first chip 100.

[0051] Furthermore, if the resin is formed so that it rises from the side surface of the first substrate 101 onto the outer periphery of the first surface 101A, a bulge of resin will be formed on the outer periphery of the first surface 101A. This bulge of resin on the first surface 101A may cause the sample solution to have difficulty flowing onto the surface of the sensor element 110. According to this embodiment, since resin sealing of the side surface of the first substrate 101 is unnecessary, the sample solution can flow more easily onto the surface of the sensor element 110, thereby improving the detection sensitivity of the target substance.

[0052] As shown in Figures 3 and 4, the first chip 100 may be provided on the wiring member 300 via the first conductive member 130, i.e., mounted. The first conductive member 130 is, for example, a conductive paste containing metal particles in a resin that has been cured.

[0053] Figure 4 is a schematic cross-sectional view of the portion where the second wiring 112 of the first chip 100 and the fifth wiring 315 of the wiring member 300 are connected in the chemical sensor module shown in Figure 3. As shown in Figure 4, the second wiring 112 is provided on the second surface 101B of the first substrate 101 and is in contact with the second surface 101B. The second wiring 112 has, for example, a first layer 112A and a second layer 112B. The first layer 112A is provided between the second surface 101B and the second layer 112B, is in contact with the second surface 101B, and contains, for example, titanium (Ti). The second layer 112B contains, for example, gold (Au).

[0054] The first conductive member 130 is provided between the second wiring 112 and the insulating film 302 of the wiring member 300. The first conductive member 130 is also provided between the first layer 112A of the second wiring 112 and the first layer 315A of the fifth wiring 315, and electrically connects the second wiring 112 and the fifth wiring 315.

[0055] Similarly, for the second chip 200, the configuration can be changed by replacing the first chip 100 in Figure 4 with the second chip 200, the first conductive member 130 with the second conductive member 230, and the second wiring 112 with the seventh wiring 217. The second chip 200 may be provided on the wiring member 300 via the second conductive member 230, i.e., mounted. The second conductive member 230 is, for example, a conductive paste containing metal particles in a resin that has been cured.

[0056] The seventh wiring 217 is provided on the fourth surface of the second substrate 201 and is in contact with the fourth surface. The second conductive member 230 is provided between the seventh wiring 217 and the insulating film 302 of the wiring member 300. The second conductive member 230 is also provided between the seventh wiring 217 and the fifth wiring 315 and electrically connects the seventh wiring 217 and the fifth wiring 315.

[0057] Figure 8 shows the experimental results of measuring the time evolution of the drain current while varying the distance between the silver chloride electrode and graphene in the test solution (HEPES 1mM + KCl 1mM) to 0.5 mm, 1.0 mm, and 2.0 mm.

[0058] When the distance between the silver-silver chloride electrode and graphene is 0.5 mm and 1.0 mm, the drain current value is unstable and drifts upward, whereas when the distance is 2.0 mm, the drain current is stable and no drift is observed. Note that the spike-like peaks in the figure are noise caused by experimental procedures such as switching of solution potential and oscillations during solution renewal, and can be ignored here.

[0059] Based on the above results, it is preferable to increase the distance between the silver chloride electrode and the graphene, specifically to 2.0 mm or more. However, increasing the distance between the silver chloride electrode and the graphene within the same chip increases the chip size. According to this embodiment, by making the first chip 100 on which graphene (sensor element 110) is formed and the second chip 200 on which silver chloride electrode (non-polarizing electrode 210) is formed into separate chips, the chip size of each chip can be reduced, thereby reducing chip costs, while increasing the distance between the silver chloride electrode and the graphene can reduce noise generated in the drain current.

[0060] Next, a method for manufacturing the chemical sensor module of the embodiment will be described.

[0061] The method for manufacturing the chemical sensor module of the embodiment includes a step of preparing a first chip 100. As described above, the first chip 100 has a first substrate 101, a sensor element 110, a first wiring 111, and a second wiring 112. In addition, in the step of preparing the first chip 100, the first chip 100 further has a first protective film that covers the sensor element 110.

[0062] In the process of preparing the first chip 100, a sensor element 110 (e.g., graphene), a first wiring 111, a second wiring 112, and a first protective film covering the sensor element 110 are formed on the first substrate 101 in wafer form. After this, the wafer is diced to separate it into multiple first chips 100. Since the sensor element 110 is covered and protected by the first protective film, the sensor element 110 (graphene) is not contaminated during dicing. For example, polyvinyl alcohol (PVA) can be used as the first protective film.

[0063] The method for manufacturing the chemical sensor module of the embodiment includes a step of preparing the second chip 200. As described above, the second chip 200 has a second substrate 201, a non-polarizing electrode 210, a third wiring 213, and a seventh wiring 217.

[0064] In the process of preparing the second chip 200, a non-polarizing electrode 210 (for example, a silver-silver chloride electrode), a third wiring 213, a seventh wiring 217, etc., are formed on the second substrate 201 in wafer form. After this, the wafer is diced to separate it into multiple second chips 200.

[0065] The manufacturing method for the chemical sensor module of the embodiment includes a step of mounting the first chip 100 and the second chip 200 on a wiring member 300. The wiring member 300 has the aforementioned wiring board 301, fourth wiring 314, fifth wiring 315, sixth wiring 316, first external terminal 321, second external terminal 322, third external terminal 323, etc.

[0066] After mounting the first chip 100 and the second chip 200 onto the wiring member 300, each chip 100 and 200 is connected to the wiring member 300 with gold wires w1 to w5.

[0067] The manufacturing method of the chemical sensor module of this embodiment includes the steps of removing the first protective film on the first chip 100 mounted on the wiring member 300, exposing the surface of the sensor element 110, and forming probe molecules 150 on the surface of the sensor element 110. For example, the first protective film, which is PVA, is removed by washing with hot water.

[0068] The step of forming the probe molecule 150 includes a step of supplying an organic solvent in which the probe molecule 150 is dissolved to the surface of the sensor element 110, for example, by an inkjet method. By using an organic solvent, the drying is made less likely compared to when an aqueous solution is used. For example, dimethyl sulfoxide (DMSO) and dimethylformamide (DMF) can be used as the organic solvent.

[0069] Organic solvents have lower surface tension than aqueous solutions and tend to spread easily on the surface to which they are supplied. According to this embodiment, by making the first chip 100 on which the sensor element 110 is formed and the second chip 200 on which the nonpolar electrode 210 is formed into separate chips, the organic solvent supplied to the surface of the sensor element 110 does not spread to the nonpolar electrode 210, thereby preventing contamination of the nonpolar electrode 210. Furthermore, when attempting to integrate sensor elements that form multiple different probe molecules, if these sensor elements for forming different probe molecules are integrated onto the same chip, the sensor elements must be spaced apart by the distance that inkjet droplets spread, which increases the chip size. Therefore, by forming sensor elements that create different probe molecules on separate chips and mixing them onto a wiring component, it becomes unnecessary to consider the spread of droplets. In the case of typical electronic devices that do not form probe molecules, it is generally the case that the total chip area is smaller when integrated into a single chip rather than divided into multiple chips. However, this is an exception when sensor elements with multiple different probe molecules are mixed together, as in this case, in which case the total chip area can be reduced by dividing them into multiple chips.

[0070] The step of forming the probe molecule 150 includes supplying an organic solvent in which the probe molecule 150 is dissolved to the surface of the sensor element 110, followed by a step of removing the organic solvent. For example, if it is DMSO or DMF, it can be easily removed using pure water or an aqueous electrolyte solution. At this time, it is preferable that the nonpolar electrode 210 is covered with a third protective film. This prevents contamination of the nonpolar electrode 210 by the cleaning solution used to remove the organic solvent. For example, in the step of preparing the second tip 200, the nonpolar electrode 210 can be covered with the third protective film.

[0071] The method for manufacturing the chemical sensor module of the embodiment includes a step of forming a second protective film that covers the surfaces of the probe molecule 150 and the sensor element 110. After this, the chemical sensor module is packaged in a package with a moisture-proof or moisture-retaining structure, for example, and shipped. To allow the user of the chemical sensor module to easily wash and remove the second protective film with water when using it, an ionic liquid, for example, can be used as the second protective film.

[0072] In the process of mounting the first chip 100 onto the wiring member 300, multiple first chips 100 may be mounted onto the wiring member 300. Furthermore, in the process of forming the probe molecules 150, an organic solvent containing probe molecules 150 of different types can be supplied to the surface of each sensor element 110 of the multiple first chips 100.

[0073] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols]

[0074] 11D...Drain electrode, 11S...Source electrode, 100...First chip, 101...First substrate, 101A...First surface, 101B...Second surface, 110...Sensor element, 111...First wiring, 112...Second wiring, 113...First contact part, 130...First conductive member, 150...Probe molecule, 200...Second chip, 201...Second substrate, 201A...Third surface, 210...Non-polarizable electrode, 213...Third wiring, 217 ...7th wiring, 218...2nd contact part, 230...2nd conductive member, 300...Wiring member, 301...Wiring board, 314...4th wiring, 315...5th wiring, 316...6th wiring, 321...1st external terminal, 322...2nd external terminal, 323...3rd external terminal, 400...Seal area, 401...Seal member, 500...Potential difference setting circuit, 501...Control unit, 502...Switch element, 600...Piping, 601...Opening

Claims

1. A wiring member having a wiring board, A first substrate having a first surface and a second surface located opposite the first surface; a sensor element provided on the first surface; a first wiring provided on the first surface and electrically connected to the sensor element; and a second wiring electrically connected to the first substrate; a first chip provided on the wiring member with the second surface facing the wiring member; A second substrate having a third surface and a fourth surface located opposite to the third surface, a non-polarizing electrode provided on the third surface, and a third wiring provided on the third surface and electrically connected to the non-polarizing electrode, wherein the fourth surface is facing the wiring member and the second chip is provided on the wiring member, Equipped with, The aforementioned wiring member is A fourth wiring which is electrically connected to the first wiring, A fifth wiring which is electrically connected to the second wiring, The sixth wiring is electrically connected to the third wiring, The first external terminal is electrically connected to the fourth wiring, The second external terminal is electrically connected to the fifth wiring, The third external terminal is electrically connected to the sixth wiring, A chemical sensor module having [a certain feature].

2. The chemical sensor module according to claim 1, wherein the non-polarizing electrode is a silver-silver chloride electrode.

3. The first chip further comprises a first insulating film provided on the first surface of the first substrate, and a first contact portion that penetrates the first insulating film and contacts the first surface. The chemical sensor module according to claim 1 or 2, wherein the second wiring is provided on the first insulating film and is electrically connected to the first substrate via the first contact portion.

4. The device further comprises a first conductive member that electrically connects the second wiring and the fifth wiring, The second wiring is provided on the second surface of the first substrate and is in contact with the second surface. The chemical sensor module according to claim 1 or 2, wherein the first chip is provided on the wiring member via the first conductive member.

5. The chemical sensor module according to claim 1 or 2, wherein the second chip further comprises a seventh wiring that electrically connects the second substrate and the fifth wiring.

6. The second chip further comprises a second insulating film provided on the third surface of the second substrate, and a second contact portion that penetrates the second insulating film and contacts the third surface. The chemical sensor module according to claim 5, wherein the seventh wiring is provided on the second insulating film and is electrically connected to the second substrate via the second contact portion.

7. The device further comprises a second conductive member that electrically connects the seventh wiring and the fifth wiring, The seventh wiring is provided on the fourth surface of the second substrate and is in contact with the fourth surface. The chemical sensor module according to claim 5, wherein the second chip is provided on the wiring member via the second conductive member.

8. The chemical sensor module according to claim 1 or 2, further comprising a sealing member provided on the surface of the wiring member on which the first chip and the second chip are provided, and surrounding the first chip and the second chip.

9. The chemical sensor module according to claim 1 or 2, wherein the first substrate and the second substrate are silicon substrates.

10. The chemical sensor module according to claim 1 or 2, wherein the sensor element includes graphene.

11. The chemical sensor module according to claim 1 or 2, further comprising a potential difference setting circuit for controlling the potential difference between the second wiring and the third wiring.

12. A step of preparing a first chip having a sensor element and a first protective film covering the sensor element, A step of preparing a second chip having a nonpolarizing electrode, The steps include providing the first chip on a wiring member, The steps include providing the second chip on the wiring member, The steps include removing the first protective film on the first chip provided on the wiring member and forming probe molecules on the surface of the sensor element, A step of forming a second protective film that covers the probe molecule and the surface of the sensor element, A method for manufacturing a chemical sensor module, comprising the following:

13. The method for manufacturing a chemical sensor module according to claim 12, wherein in the step of forming the probe molecule, the nonpolarizing electrode is covered with a third protective film.

14. The step of forming the probe molecule is, A step of supplying the organic solvent in which the probe molecules are dissolved to the surface of the sensor element, The process of removing the aforementioned organic solvent, A method for manufacturing a chemical sensor module according to claim 12 or 13, comprising the above.

15. Multiple first chips are provided on the wiring member, A method for manufacturing a chemical sensor module according to claim 14, wherein the organic solvent in which probe molecules of different types are dissolved is supplied to the surface of each of the sensor elements of the plurality of first chips.

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