Vertical probe, probe head, and method for manufacturing a vertical probe

Abstract

To provide a vertical probe that can contact small conductive contacts with good current resistance, structural strength, lifespan, and processing accuracy and when applied to a probe head, breaking or shifting position of the tip portion due to vertical movement can be avoided.SOLUTION: A vertical probe includes opposite first and third sides, and opposite second and fourth sides. The third and fourth sides extend in a planar manner from a body to a tip portion. The first and second sides include first and second upper plane segments at the body, first and second transition segments at the tip portion, and first and second lower plane segments closer to the third and fourth sides than the first and second upper plane segments are, respectively. The first and second transition segments gradually approach the third and fourth sides as they extend from the first and second upper plane segments to the first and second lower plane segments. The first transition and lower plane segments are realized by laser processing.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to probes and probe heads of a probe card, and more particularly to vertical probes, probe heads having such vertical probes, and methods for manufacturing vertical probes.

Background Art

[0002] Conventional vertical probes have an elongated columnar shape with a square or rectangular cross-section. Such vertical probes are made by micro-machine processes or by cutting a plate material, and can form the required probe width and thickness according to the usage requirements. With the miniaturization of electronic components, if the width and thickness of such vertical probes are not reduced accordingly, they cannot contact the minute conductive contacts on the object to be measured (including but not limited to objects having micro bumps).

[0003] However, when the overall width and thickness of the probe are reduced, the resistance value increases significantly and the structural strength decreases significantly. The higher the probe resistance value, the lower the current-carrying capacity. If the current-carrying capacity of the probe is too low, the probe is likely to burn out during energization. Also, if the structural strength of the probe is too low, it is likely to wear, break, or even fracture due to the force during measurement, resulting in a short probe life and the need for frequent replacement. Therefore, under the premise of giving the probe sufficient current-carrying capacity, enabling the probe to contact minute conductive contacts and improving the probe life are very important issues in the art.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present invention provides a vertical probe that reduces the width and thickness only at the probe tip to meet the demand for point contact with minute conductive contacts, while the other sections have relatively large widths and thicknesses, thereby ensuring the probe has good current resistance and structural strength. Such a vertical probe comprises a body and a probe tip, the probe tip including a probe tip contact portion that is smaller in both width and thickness than the body, and a probe tip gradual reduction portion located between the body and the probe tip contact portion. The reduction in the width of the probe tip can be achieved by a micromachining process or by laser cutting of a plate material, and the reduction in the thickness of the probe tip can be achieved by machining or etching using a micromachining process.

[0005] In the process of attaching the vertical probe to the probe holder, the vertical probe is first positioned by penetrating the upper and lower guide plate units of the probe holder, and then the upper and lower guide plate units move relative to each other horizontally before being fixed together to form the probe holder. At this time, the horizontal displacement of the upper and lower guide plate units causes the body of the vertical probe to elastically curve and deform. For example, if the lower guide plate unit moves relative to the upper guide plate unit to the left, the body of the vertical probe will curve from top to bottom to the left. In this case, the right side of the vertical probe will contact the inner surface of the lower guide hole. The contact position is located close to the gradually retracting part of the probe tip on the body. When the probe tip contact point contacts the object to be measured and receives an upward reaction force, the probe tip elastically retracts slightly into the lower guide hole. Therefore, if there is a step between the part of the right side of a vertical probe located at the gradually tapering tip and the part located on the main body, and they are not on the same plane, the structural strength of this part will be weakened. Also, when the probe tip moves up and down, the right side will not be able to make complete contact with the inner surface of the lower guide hole. In other words, there will be a step where the right side makes contact with the inner surface of the lower guide hole while moving up and down. This will easily lead to the probe breaking. In addition, misalignment of the probe tip contact area will easily occur, making it impossible to align with the conductive contact of the object being measured. Furthermore, if the thickness of the probe tip is reduced by machining or etching using a micromachining process, tolerances that do not meet the demand will easily occur, and the manufacturing yield rate of the probe card will decrease.

[0006] The present invention has been made in view of the above, and aims to provide a vertical probe, a probe head, and a method for manufacturing a vertical probe. This is based on the premise that the vertical probe will meet the demand for point contact with minute conductive contacts, and will have good current resistance, structural strength, and service life. Furthermore, good processing accuracy can be achieved. Moreover, when the vertical probe is applied to a probe head, the probe tip becomes less prone to breakage due to its vertical movement when making point contact with the object being measured. Furthermore, the probe tip becomes less likely to shift, allowing it to align with the conductive contacts of the object being measured. [Means for solving the problem]

[0007] To achieve the above objective, the present invention provides a vertical probe comprising a long body extending in the vertical axis direction and a probe tip connected to the body and extending from the body in the vertical axis direction. The vertical probe includes a first side, a second side, a third side facing the opposite direction to the direction the first side faces, and a fourth side facing the opposite direction to the direction the second side faces, with the third and fourth sides extending planarly from the main body to the tip of the probe. The first side surface includes a first upper planar region located on the main body, a first transition region located at the tip of the probe, and a first lower planar region located at the tip of the probe, wherein the first transition region is located between the first upper planar region and the first lower planar region, a first upper connecting line is formed between the first transition region and the first upper planar region, a first lower connecting line is formed between the first transition region and the first lower planar region, the first lower planar region is closer to the third side surface than the first upper planar region, and the first transition region extends from the first upper connecting line to the first lower connecting line while approaching the third side surface. The second side surface includes a second upper planar region located on the main body, a second transition region located at the tip of the probe, and a second lower planar region located at the tip of the probe, wherein the second transition region is located between the second upper planar region and the second lower planar region, a second upper connecting line is formed between the second transition region and the second upper planar region, a second lower connecting line is formed between the second transition region and the second lower planar region, the second lower planar region is closer to the fourth side surface than the second upper planar region, and the second transition region extends from the second upper connecting line to the second lower connecting line while approaching the fourth side surface. The first transition region and the first lower planar region of the first side surface are realized by a laser processing method.

[0008] As a result, the probe tip of the vertical probe of the present invention is designed not to be coplanar with the body only on the first and second sides. That is, the thickness of the probe tip is reduced by forming a first transition region and a first lower planar region on the first side. On the third side, located opposite the first side, the body and the probe tip are coplanar. Similarly, the width of the probe tip is reduced by forming a second transition region and a second lower planar region on the second side. On the fourth side, located opposite the second side, the body and the probe tip are coplanar. As a result, the portion of the probe tip including the first and second transition regions becomes the gradually narrowing probe tip portion, and the portion including the first and second lower planar regions becomes the probe tip contact portion. The gradually narrowing probe tip portion is reduced to the required width and thickness, so that the width and thickness of the probe tip contact portion meet the demand for point contact with minute conductive contacts. The body has a relatively large width and thickness, so that the vertical probe has good current resistance, structural strength, and service life. The vertical probe is mounted on the probe holder, above the lower guide plate unit, and within the lower guide hole. When the body of the vertical probe elastically bends and deforms due to the relative horizontal movement of the upper and lower guide plate units, the third and / or fourth planar sides of the vertical probe contact the inner surface of the lower guide hole. Since there is no step between the body and the probe tip on the third and fourth sides, the structural strength of this part is relatively good. Even if the probe tip moves up and down and retracts into the lower guide hole when making point contact with the object to be measured, it will not easily break. Furthermore, misalignment of the probe tip can be avoided, preventing misalignment with the conductive contacts of the object to be measured. In addition, the first side of the vertical probe is formed by a laser processing method to create a first transition region and a first lower planar region. Therefore, the dimensional accuracy of the probe tip can be improved. Furthermore, on the second side, a second transition region and a second lower planar region are also formed by a laser processing method. Therefore, the dimensional accuracy of the probe tip can be further improved.This allows the tolerances of vertical probes to meet demand, thereby increasing the manufacturing yield rate of probe cards.

[0009] Preferably, the probe tip has a contact end that is furthest from the body, and the distance between the first lower connecting line and the contact end in the vertical axis direction is defined as the first height, and the distance between the second lower connecting line and the contact end in the vertical axis direction is defined as the second height, wherein the first height and the second height are not substantially equal.

[0010] When the probe tip makes point contact with the object being measured, stress concentrates in the first and second transition regions and the first and second lower planar regions, making these areas relatively prone to fracture. In this invention, the heights of the first and second lower connection lines are designed to be different. That is, the heights of the first and second lower planar regions are different. This improves the problem of stress concentration and further suppresses the easy fracture of the vertical probe.

[0011] Preferably, the probe tip has a contact end that is furthest from the body, and if the distance between the first upper connecting line and the contact end in the vertical axis direction is defined as the third height, and the distance between the second upper connecting line and the contact end in the vertical axis direction is defined as the fourth height, then the third height and the fourth height are not substantially equal.

[0012] As a result, the heights of the first upper connection line and the second upper connection line are designed to be different. That is, the overall height of the first lower plane region and the first transition region is different from the overall height of the second lower plane region and the second transition region. This improves the problem of stress concentration and further suppresses the easy fracture of the vertical probe. In this invention, the heights of the first and second lower connection lines may be designed to be different, and at the same time, the heights of the first and second upper connection lines may be designed to be different. This further improves the problem of stress concentration and further suppresses the easy fracture of the vertical probe.

[0013] Preferably, the distance between the second upper connecting wire and the second lower connecting wire is greater than the distance between the first upper connecting wire and the first lower connecting wire.

[0014] As a result, the length of the second transition region is greater than the length of the first transition region. Therefore, stress can be distributed more evenly between the first and second transition regions. In the probe holder, when the upper and lower guide plate units move relative to each other along one lateral axis, or when the upper and lower guide plate units move relative to each other along two lateral axes and the relative displacement amounts in the two lateral axes are different, the vertical probe experiences relatively large stress in the lateral axis direction where the relative displacement is larger. Therefore, by positioning the relatively longer second transition region to face the lateral axis direction where the relative displacement is larger, a good stress distribution effect can be achieved. Furthermore, by designing the lengths of the first and second transition regions of the vertical probe based on predetermined relative displacement amounts in the two lateral axes of the upper and lower guide plate units, the problem of stress concentration can be further improved, and the ease with which the vertical probe breaks can be further suppressed.

[0015] Preferably, the first side, the second side, the third side, and the fourth side all have a width of 30 micrometers to 100 micrometers on the main body.

[0016] As a result, when the thickness and width of the probe tip have not yet been reduced (i.e., when the first and second transition regions and the first and second lower planar regions have not yet been formed), the width of a single side of the vertical probe is 30 μm to 100 μm. Such dimensions are suitable for reducing the thickness and width of the probe tip by creating the first and second transition regions and the first and second lower planar regions.

[0017] Preferably, the probe tip includes a probe tip gradual reduction portion and a probe tip contact portion, the probe tip gradual reduction portion includes the first transition region and the second transition region, the probe tip contact portion includes the first lower planar region and the second lower planar region, the cross-section of the probe tip contact portion is square, and the cross-section of the main body is square.

[0018] As a result, the vertical probe has the same reduction in thickness and width at the probe tip. This helps to suppress the concentration of relatively large stresses in one of the lateral axes.

[0019] Preferably, the probe tip includes a probe tip gradual reduction portion and a probe tip contact portion, the probe tip gradual reduction portion includes the first transition region and the second transition region, the probe tip contact portion includes the first lower plane region and the second lower plane region, the second upper plane region and the second lower plane region of the second side surface are perpendicular to the first horizontal axis direction, the first upper plane region and the first lower plane region of the first side surface are perpendicular to the second horizontal axis direction, and the distance between the first upper plane region and the first lower plane region of the first side surface in the second horizontal axis direction is greater than the distance between the second upper plane region and the second lower plane region of the second side surface in the first horizontal axis direction.

[0020] As a result, the cross-section of the main body is rectangular, with the shorter side located on the first side and the longer side on the second side. The probe tip experiences a greater reduction in size on the first side than on the second side. Therefore, the degree of stress concentration at the probe tip on the second side is small. The second side faces the lateral axis direction, where the relative displacement of the upper and lower guide plate units is relatively large, thus preventing the vertical probe from easily breaking. The shorter side of the cross-section of the main body is parallel to the lateral axis direction, where the relative displacement is relatively large, thus producing an excellent elastic deformation effect.

[0021] To achieve the above objective, the probe head according to the present invention comprises an upper guide plate unit, a lower guide plate unit, and the vertical probe described above. The upper guide plate unit includes an upper guide hole. The lower guide plate unit includes an upper surface, a lower surface, and a lower guide hole that penetrates the upper surface and the lower surface. The body of the vertical probe includes an upper mounting portion and a lower mounting portion, the upper mounting portion and the lower mounting portion being provided to penetrate the upper guide hole and the lower guide hole, respectively. The probe tip of the vertical probe is located below the lower surface of the lower guide plate unit.

[0022] As a result, the vertical probe of the probe head according to the present invention has the above-described characteristic configuration and, assuming it is designed to meet the demand for point contact with minute conductive contacts, it can achieve good current resistance, structural strength, and service life, as well as good machining accuracy. Furthermore, the lower mounting portion of the vertical probe can abut against the inner surface of the lower guide hole by a third and / or fourth flat surface. This makes the probe tip less likely to break due to vertical movement. It also prevents misalignment of the probe tip, which could prevent alignment with the conductive contacts of the object being measured.

[0023] Preferably, the probe head has a first transverse axis direction and a second transverse axis direction defined that are perpendicular to each other. The upper guide hole and the lower guide hole are offset from each other along the first transverse axis direction so that the fourth side of the vertical probe contacts the inner surface of one of the lower guide holes.

[0024] As a result, when the upper and lower guide plate units move relative to each other along the first horizontal axis direction, causing the upper and lower guide holes to be displaced from each other in the first horizontal axis direction, the vertical probe abuts against the inner surface of the lower guide hole by means of the fourth side surface that presents a planar shape. Thereby, even when the probe tip moves up and down and retracts into the lower guide hole when making point contact with the object to be measured, it is not easily broken thereby. Also, it is possible to avoid the situation where the conductive contact point of the object to be measured cannot be aligned due to the displacement of the position of the probe tip.

[0025] More preferably, the upper guide hole and the lower guide hole are arranged such that they are displaced from each other along the second horizontal axis direction, causing the third side surface of the vertical probe to abut against another inner surface of the lower guide hole.

[0026] As a result, when the upper and lower guide plate units are displaced relative to each other in the first and second horizontal axis directions, causing the upper and lower guide holes to be displaced from each other in the first and second horizontal axis directions, the vertical probe has the planar third and fourth side surfaces abut against the inner surface of the lower guide hole. Thereby, even when the probe tip moves up and down and retracts into the lower guide hole when making point contact with the object to be measured, it is not easily broken thereby. Also, it is possible to avoid the situation where the conductive contact point of the object to be measured cannot be aligned due to the displacement of the position of the probe tip.

[0027] More preferably, the distance by which the upper guide hole and the lower guide hole are displaced from each other along the first horizontal axis direction is greater than the distance by which they are displaced from each other along the second horizontal axis direction.

[0028] As a result, the relative displacement of the upper and lower guide plate units in the first lateral axis direction is large, and the distance by which the upper and lower guide holes are offset from each other in the first lateral axis direction is relatively large, causing the body of the vertical probe to elastically bend and deform mainly in the first lateral axis direction. Based on this, the design of the first and second transition regions of the vertical probe can be carried out. For example, by designing the length of the second transition region to be longer than the length of the first transition region, the problem of stress concentration can be further improved, and the vertical probe can be made even less prone to fracture.

[0029] Preferably, the probe head further comprises another vertical probe. The other vertical probe includes an elongated body extending in the longitudinal direction, and a probe tip connected to the body and extending from the body in the longitudinal direction. The other vertical probe includes a first side, a second side, a third side facing the opposite direction to the direction the first side faces, and a fourth side facing the opposite direction to the direction the second side faces, wherein the first side, the second side, the third side, and the fourth side of the other vertical probe extend planarly from the body of the other vertical probe to the probe tip of the other vertical probe. The body of the other vertical probe includes an upper mounting portion and a lower mounting portion, which are provided through another upper guide hole of the upper guide plate unit and another lower guide hole of the lower guide plate unit, respectively. The tip of the aforementioned other vertical probe is located below the lower side of the lower surface of the lower guide plate unit.

[0030] In other words, this other vertical probe (hereinafter also referred to as the second vertical probe) has the same thickness and width at the probe tip as the main body, without any reduction in thickness or width. Compared to the aforementioned vertical probe with reduced thickness and width at the probe tip (hereinafter also referred to as the first vertical probe), the second vertical probe has a larger contact area at the probe tip. Such a probe head is suitable for measuring objects that have microbumps. The contact end of the probe tip of the second vertical probe can simultaneously contact multiple microbumps used to transmit power or ground signals. On the other hand, the contact end of the probe tip of the first vertical probe can contact a single microbump used to transmit a test signal. As a result, even if the dimensions of the probe tips of the first and second vertical probes are different, the dimensions of the main body are the same. Therefore, it is easy to control the amount of deformation of the main body of the first and second vertical probes to match, resulting in uniform probe test results. In addition, the amount of wear of the first and second vertical probes can be matched. The microbumps of the object being measured are usually arranged in a matrix. The method of reducing the thickness and width of the probe tip of the first vertical probe ensures that the probe tip of the first vertical probe corresponds to a single microbump, thus aligning the bodies of the first and second vertical probes. Consequently, the lower guide holes for the first and second vertical probes are aligned. This eliminates the need to design different arrangements of lower guide holes for the first and second vertical probes. This simplifies the design of the lower guide holes, avoids the complexity of the lower guide hole arrangement, and prevents damage to the plate body of the lower guide plate unit due to variations in spacing.

[0031] Preferably, the probe head has a first transverse axis direction and a second transverse axis direction defined that are perpendicular to each other. The upper guide hole and the lower guide hole are offset from each other along the first transverse axis direction so that the fourth side surface of the vertical probe and the other vertical probe contacts one inner surface of the lower guide hole. The upper guide hole and the lower guide hole are offset from each other along the second transverse axis direction so that the third side surface of the vertical probe and the other vertical probe contacts another inner surface of the lower guide hole. The distance that the upper guide hole and the lower guide hole are offset from each other along the first transverse axis direction is greater than the distance that they are offset from each other along the second transverse axis direction.

[0032] As a result, when the upper and lower guide holes are misaligned in the first and second lateral directions, the vertical probe's planar third and fourth sides contact the inner surface of the lower guide hole. This prevents the probe tip from easily breaking, even if it moves up and down and retracts into the lower guide hole when making point contact with the object being measured. Furthermore, misalignment of the probe tip can be avoided, preventing misalignment with the conductive contacts of the object being measured. Additionally, the distance by which the upper and lower guide holes are misaligned in the first lateral direction is relatively large, causing the body of the vertical probe to elastically curve and deform mainly in the first lateral direction. Based on this, the design of the first and second transition regions of the vertical probe can be carried out. For example, by designing the length of the second transition region to be longer than the length of the first transition region, the problem of stress concentration can be further improved, making the vertical probe even more resistant to breakage.

[0033] To achieve the above-mentioned objective, the method for manufacturing a vertical probe according to the present invention is a method for manufacturing a vertical probe used to manufacture the above-mentioned vertical probe. The first transition region is formed by performing laser processing (e.g., laser ablation) between a first position and a second position on the top surface of a substrate made of a conductive material. The first lower planar region is formed by performing laser processing between a second position and a third position on the substrate using the laser processing method.

[0034] As a result, the first side surface of the vertical probe is formed by the laser processing method, creating a first transition region and a first lower planar region. This allows for improved dimensional accuracy of the probe tip, enabling the tolerances of the vertical probe to meet demand and increasing the manufacturing yield rate of probe cards.

[0035] Preferably, in the manufacturing method of the vertical probe described above, the second transition region of the second side surface is formed by laser processing the substrate using a laser processing method (e.g., laser cutting). This further improves the dimensional accuracy of the probe tip and increases the manufacturing yield of the probe card.

[0036] In one embodiment of the present invention, a method for manufacturing a vertical probe includes the following steps. A base material is provided. The base material is a plate (plate-like body) and has a top surface and a bottom surface facing the opposite direction from the direction the top surface faces. By performing laser processing between a first position and a second position on the top surface of the substrate using a laser processing method, a transition surface is formed, and the transition surface gradually extends from the first position to the second position as it approaches the bottom surface. By performing laser processing between a second position and a third position on the top surface of the substrate using a laser processing method, a single processed plane is formed. A cutting process is performed to cut the substrate into at least one vertical probe, such that the first upper planar region of the first side of the vertical probe originates from an un-laser-treated portion of the top surface of the substrate, the first transition region originates from a transition surface in the substrate, the first lower planar region originates from a processed plane in the substrate, and the second and fourth sides are generated by the cutting process.

[0037] As a result, the vertical probe according to the present invention described above can be manufactured by a plate body undergoing laser processing (e.g., laser ablation) and a cutting process. By applying laser processing to the top surface of the plate body, a transition surface and a processed plane are formed, thereby reducing the thickness of the probe tip of the cut vertical probe, maintaining the flatness of the bottom surface of the plate body, and allowing the bottom surface of the plate body to become the third side surface of the vertical probe. Such a manufacturing method can produce a vertical probe having the effects described above, and after laser processing the same plate body, it can be cut into multiple probes, making the manufacturing process convenient and rapid.

[0038] Preferably, the cutting process is carried out by a laser processing method (e.g., laser cutting). This further improves the dimensional accuracy of the vertical probe and further increases the manufacturing yield rate of the probe cards.

[0039] Preferably, in the vertical axis direction, the distance between the position of the second upper connection line on the second side surface generated by the cutting process and the third position is not substantially equal to the distance between the first position and the third position. Alternatively, in the vertical axis direction, the distance between the position of the second upper connection line on the second side surface generated by the cutting process and the third position is not substantially equal to the distance between the second position and the third position. This prevents the second upper connection line on the second side surface from aligning with the first upper connection line on the first side surface. Alternatively, it prevents the second lower connection line on the second side surface from aligning with the first lower connection line on the first side surface. This makes the vertical probe more resistant to fracture by improving the problem of stress concentration in the first and second transition regions and the first and second lower planar regions.

[0040] Another embodiment of the present invention, a method for manufacturing a vertical probe, includes the following steps: A base material is provided. The base material is a long needle body and includes a second side of a vertical probe. By performing laser processing between a first position and a second position on the top surface of the substrate using a laser processing method, a first transition region is formed, and by performing laser processing between a second position and a third position on the top surface of the substrate using a laser processing method, a first lower planar region is formed, so that the top surface of the substrate becomes the first side surface of the vertical probe.

[0041] As a result, the vertical probe described above can be manufactured by laser processing a long needle body. The needle body is formed by a microcomputer process or by other methods. At this time, the side contour required for the vertical probe is formed, so the needle body can include a second upper planar region, a second transition region, and a second lower planar region on the second side surface of the vertical probe. The top and bottom surfaces of the needle body are planar. The above manufacturing method achieves a reduction in the thickness of the probe tip by forming a first transition region and a first lower planar region on the top surface of the needle body. The bottom surface, located opposite the top surface, remains planar and becomes the third side surface of the vertical probe. By such a manufacturing method, a vertical probe having the effects described above can be manufactured.

[0042] Preferably, in the vertical axis direction, the distance between the first position and the third position is not substantially equal to the distance between the second upper connecting line of the second side surface and the third position. Alternatively, in the vertical axis direction, the distance between the second position and the third position is not substantially equal to the distance between the second lower connecting line of the second side surface and the third position.

[0043] As a result, the starting position of the first transition region formed by laser processing on the top surface of the needle body is different from the starting position of the second transition region on the second side surface. Therefore, the connection line between the first transition region and the first upper planar region, and the connection line between the second transition region and the second upper planar region, cannot be aligned with each other. Alternatively, the ending position of the first transition region is different from the ending position of the second transition region on the second side surface. Therefore, the connection line between the first transition region and the first lower planar region, and the connection line between the second transition region and the second lower planar region, cannot be aligned with each other. This improves the stress concentration problem in the first and second transition regions and the first and second lower planar regions, making the vertical probe less prone to fracture. In this invention, the connection line between the first transition region and the first upper planar region, and the connection line between the second transition region and the second upper planar region, can be made so as not to be aligned with each other, and the connection line between the first transition region and the first lower planar region, and the connection line between the second transition region and the second lower planar region, can be made so as not to be aligned with each other. This further improves the stress concentration problem and makes the vertical probe even less prone to fracture.

[0044] The detailed structure, features, assembly, and usage of the vertical probe, probe head, and method for manufacturing the vertical probe according to the present invention will be described in the detailed description of the embodiments below. However, a person with general technical knowledge of the present invention should understand that such detailed descriptions and the implementation of the specific embodiments enumerated herein are merely for illustrative purposes and not to limit the scope of the claims of the present invention. [Brief explanation of the drawing]

[0045] [Figure 1] This is a schematic cross-sectional view showing a probe head according to the first embodiment of the present invention. [Figure 2] This is a schematic plan view showing a vertical probe according to the first embodiment of the present invention. [Figure 3]This is a schematic diagram showing a cross-section along line 3-3 in Figure 1 of a probe head according to the first embodiment of the present invention. [Figure 4] This is a schematic three-dimensional diagram showing a vertical probe according to the first embodiment of the present invention. [Figure 5] This is a flowchart illustrating a method for manufacturing a vertical probe according to the first embodiment of the present invention. [Figure 6] This is a schematic three-dimensional diagram showing the manufacturing process of a vertical probe according to the first embodiment of the present invention. [Figure 7] This is a schematic three-dimensional diagram showing the manufacturing process of a vertical probe according to the first embodiment of the present invention. [Figure 8] This is a schematic three-dimensional diagram showing the manufacturing process of a vertical probe according to the first embodiment of the present invention. [Figure 9] This is a schematic diagram similar to Figure 3, showing a configuration in which the cross-section of the body of the vertical probe is rectangular. [Figure 10] This is a schematic plan view showing a vertical probe according to a second embodiment of the present invention. [Figure 11] This diagram is similar to Figure 8 and shows a schematic diagram illustrating the cutting process of a vertical probe according to the second embodiment of the present invention. [Figure 12] This is a schematic plan view illustrating another method for manufacturing a vertical probe according to the present invention. [Figure 13] Figure 12 is a schematic three-dimensional diagram illustrating the manufacturing method shown. [Figure 14] This is a schematic cross-sectional view showing a probe head according to a third embodiment of the present invention. [Figure 15] This is a schematic diagram showing that two vertical probes of a probe head according to a third embodiment of the present invention are in contact with a microbump. [Modes for carrying out the invention]

[0046] The applicant hereby states that in the embodiments and drawings described below, the same reference numerals represent the same or similar components or their structural features. It should be noted that the components and structures in the drawings are not illustrated based on actual proportions and quantities for illustrative purposes, and that features of different embodiments may be interchangeable where applicable. Furthermore, when referring to one component being mounted on another, it means either the aforementioned component is directly mounted on the other component, or it is indirectly mounted on the other component, i.e., one or more other components are located between the two components. When a component is "directly" mounted on another component, it means that no other components are located between the two components.

[0047] As shown in Figure 1, the probe head 10 according to the first embodiment of the present invention comprises an upper guide plate unit 20, a lower guide plate unit 30, and a vertical probe 40 (there is no limit on the quantity).

[0048] In this embodiment, the upper and lower guide plate units 20 and 30 are each composed of only one plate, however, the upper guide plate unit 20 and / or the lower guide plate unit 30 may be composed of multiple stacked plates. The edges of the upper and lower guide plate units 20 and 30 may be directly connected to each other by having a convex structure, or a hollow guide plate (not shown) may be connected between the upper and lower guide plate units 20 and 30. The upper guide plate unit 20 includes an upper surface 21, a lower surface 22, and upper guide holes 23 (there is no limit to the number) that penetrate the upper surface 21 and the lower surface 22. The lower guide plate unit 30 includes an upper surface 31, a lower surface 32, and lower guide holes 33 that penetrate the upper surface 31 and the lower surface 32.

[0049] In the assembly process of the probe head 10, initially, the upper and lower guide plate units 20 and 30 face each other and are not fixed, with the upper surface 31 of the lower guide plate unit 30 facing the lower surface 22 of the upper guide plate unit 20, and the upper guide hole 23 corresponding coaxially with the lower guide hole 33. As shown in Figure 2, the vertical probe 40 initially exhibits a straight shape, passing vertically through the coaxially corresponding upper guide hole 23 and lower guide hole 33. Subsequently, the upper and lower guide plate units 20 and 30 move relative to each other in the first horizontal axis direction (Y-axis direction), causing the upper guide hole 23 and lower guide hole 33 to shift in the Y-axis direction, resulting in the vertical probe 40 exhibiting a curved shape as shown in Figure 1. Furthermore, the upper and lower guide plate units 20 and 30 may also move relative to each other in the second horizontal axis direction (X-axis direction), causing the upper guide hole 23 and lower guide hole 33 to shift in the X-axis direction. In this embodiment, the distance by which the upper and lower guide holes 23 and 33 are shifted in the Y-axis direction is greater than the distance by which the upper and lower guide holes 23 and 33 are shifted in the X-axis direction, so the vertical probe 40 is mainly curved in the Y-axis direction. Subsequently, the upper and lower guide plate units 20 and 30 are fixed to each other, and the vertical probe 40 inside the probe head 10 maintains the curved shape shown in Figure 1.

[0050] As shown in Figure 2, the vertical probe 40 includes a long body 41 extending along the vertical axis (Z axis), a probe rear end 42 integrally connected to the body 41 and extending upward from the body 41 along the Z axis, and a probe tip 43 integrally connected to the body 41 and extending downward from the body 41 along the Z axis. As shown in Figure 1, the portion where the body 41 and the probe rear end 42 are connected is the upper mounting portion 411, which is provided through the upper guide hole 23. The portion where the body 41 and the probe tip 43 are connected is the lower mounting portion 412, which is provided through the lower guide hole 33. The lower mounting portion 412 partially protrudes from the lower surface 32 of the lower guide plate unit 30, so that the probe tip 43 is located below the lower surface 32 of the lower guide plate unit 30.

[0051] As shown in Figures 2 to 4, the vertical probe 40 includes one first side surface 44, one second side surface 45, one third side surface 46 facing the opposite direction from the direction the first side surface 44 faces, and one fourth side surface 47 facing the opposite direction from the direction the second side surface 45 faces. Both the third side surface 46 and the fourth side surface 47 extend planarly from the main body 41 to the probe tip 43. More specifically, the portion of the third side surface 46 located on the main body 41 and the portion of the third side surface 46 located on the probe tip 43 are on the same plane and parallel to the Y and Z axes, forming the YZ plane. The portion of the fourth side surface 47 located on the main body 41 and the portion of the fourth side surface 47 located on the probe tip 43 are on the same plane and parallel to the X and Z axes, forming the XZ plane. To explain in more detail, on the third side 46 and the fourth side 47, not all parts of the main body 41 are coplanar with the probe tip 43; only the parts where the main body 41 and the probe tip 43 are connected are coplanar. Therefore, on both the third side 46 and the fourth side 47, only the part where the main body 41 and the probe tip 43 are connected extends planarly from the main body 41 to the probe tip 43. As shown in Figure 1, typically, the part where the main body 41 and the probe tip 43 are connected is the lower mounting part 412 of the main body 41, or a part of the lower mounting part 412 of the main body 41 that protrudes from the lower side surface 32 of the lower guide plate unit 30. In contrast, the first side 44 and the second side 45 extend in an incomplete planar manner from the main body 41 to the probe tip 43. This will be explained in more detail below.

[0052] The first side surface 44 includes a first upper planar region 441 located on the main body 41, a first transition region 442 located on the probe tip 43, and a first lower planar region 443. The first transition region 442 is located between the first upper planar region 441 and the first lower planar region 443. The first upper planar region 441 and the first lower planar region 443 are perpendicular to the X-axis. The first transition region 442 is inclined with respect to the first upper planar region 441 and the first lower planar region 443. A first upper connecting line 444 is formed between the first transition region 442 and the first upper planar region 441. A first lower connecting line 445 is formed between the first transition region 442 and the first lower planar region 443. The first lower planar region 443 is closer to the third side surface 46 than the first upper planar region 441. The first transition region 442 extends from the first upper connecting line 444 to the first lower connecting line 445 while approaching the third side surface 46. In other words, if the distance on the X-axis between the first side surface 44 and the third side surface 46 is defined as the thickness, the thickness of the main body 41 is greater than the thickness of the probe tip 43. The thickness of the probe tip 43 gradually decreases within the first transition region 442, and is uniform within the first lower planar region 443.

[0053] The second side surface 45 includes a second upper planar region 451 located on the main body 41, a second transition region 452 located on the probe tip 43, and a second lower planar region 453 located on the probe tip 43. The second transition region 452 is located between the second upper planar region 451 and the second lower planar region 453. The second upper planar region 451 and the second lower planar region 453 are perpendicular to the Y-axis. The second transition region 452 is inclined with respect to the second upper planar region 451 and the second lower planar region 453. A second upper connecting line 454 is formed between the second transition region 452 and the second upper planar region 451. A second lower connecting line 455 is formed between the second transition region 452 and the second lower planar region 453. The second lower planar region 453 is closer to the fourth side surface 47 than the second upper planar region 451. The second transition region 452 extends from the second upper connecting line 454 to the second lower connecting line 455, approaching the fourth side surface 47. In other words, if the distance on the Y-axis between the second side surface 45 and the fourth side surface 47 is defined as the width, the width of the main body 41 is greater than the width of the probe tip 43. The width of the probe tip 43 gradually decreases within the range of the second transition region 452, and its width is uniform within the range of the second lower planar region 453.

[0054] In this configuration, the portion of the probe tip 43 that includes the first and second transition regions 442 and 452 becomes the probe tip gradual reduction portion 431, and the portion that includes the first and second lower planar regions 443 and 453 becomes the probe tip contact portion 432. The probe tip gradual reduction portion 431 is located between the main body 41 and the probe tip contact portion 432, and the cross-sectional area of ​​the probe tip gradual reduction portion 431 gradually decreases from the main body 41 toward the probe tip contact portion 432. The end of the probe tip contact portion 432 is a single contact end 433, which is the point on the probe tip 43 furthest from the main body 41. The contact end 433 is used to contact the conductive contacts of the object to be measured. The probe tip gradual reduction portion 431 can be gradually reduced to the required thickness and width, so that the thickness and width of the probe tip contact portion 432 can meet the demand for point contact with minute conductive contacts. The main body 41 has a relatively large thickness and width, so that the vertical probe 40 has good current resistance, structural strength, and service life. In this embodiment, the first and second transition regions 442 and 452 are inclined planes, respectively. The first and second transition regions 442 and 452 are not limited to inclined planes; they can be made by gradually reducing their thickness and width, and may be, for example, stepped.

[0055] As shown in Figures 5-8, the method for manufacturing the vertical probe 40 includes the following steps S11-S14.

[0056] In step S11, a base material 50A is provided (see Figure 6). The base material 50A is a plate made of a conductive material. The base material 50A has a top surface 51 and a bottom surface 52 facing the opposite direction from the top surface 51. More specifically, the base material 50A can be made of an alloy plate or a plated plate, and a long-shaped material can be used. For example, the plate may be made by microelectronic molding or metal hot rolling.

[0057] In step S12, a laser ablation method is used to perform laser processing between a first position P1 and a second position P2 on the top surface 51 of the substrate 50A, thereby forming a transition surface 511, which gradually extends from the first position P1 to the second position P2 as it approaches the bottom surface 52. The transition surface 511 is not limited to an inclined plane, but can be any shape that can gradually reduce the thickness of the substrate 50A, such as a stepped shape.

[0058] In step S13, a laser processing method is used to form a processed surface 512 between a second position P2 and a third position P3 on the top surface 51 of the substrate 50A. In other words, after step S12 is completed, step S13 is performed using the same laser processing method to form the processed surface 512. As a result, the starting position for forming the processed surface 512 becomes the ending position (second position P2) for forming the transition surface 511, and the ending position (third position P3) for forming the processed surface 512 becomes one end surface 53 of the substrate 50A. The laser processing method described in steps S12 and S13 (for example, laser ablation) involves directly irradiating the substrate 50A with laser light and ablating the substrate 50A with the energy of the laser light to reduce the thickness of the substrate 50A.

[0059] In step S14, a cutting process is performed to cut the substrate 50A into at least one vertical probe 40. For example, a vertical probe 40 as shown in Figure 2 is cut along two cutting paths 54 and 55 as shown in Figure 8, such that the first upper planar region 441 of the first side surface 44 of the vertical probe 40 originates from the un-laser-treated portion of the top surface 51 of the substrate 50A (the plane 513 shown in Figures 7 and 8), the first transition region 442 originates from the transition surface 511 on the substrate 50A, the first lower planar region 443 originates from the processed plane 512 on the substrate 50A, and the second side surface 45 and the fourth side surface 47 are generated by the cutting process. More specifically, the cutting paths 54 and 55 shown in Figure 8 form the fourth side surface 47 and the second side surface 45 of the vertical probe 40, respectively. The cutting path 55 cuts out a second upper planar region 451, a second transition region 452, and a second upper planar region 453 of the second side surface 45 at two transition positions 551 and 552.

[0060] In this invention, the probe tip 43 of the vertical probe 40 is designed so that only the first side surface 44 and the second side surface 45 are not coplanar with the main body 41. The probe tip 43 is coplanar with the main body 41 on the third side surface 46 and the fourth side surface 47. Therefore, as shown in Figures 1 and 3, the vertical probe 40 is attached to the lower guide plate unit 30 such that the second side surface 45 faces in the direction in which the lower guide hole 33 is offset along the first horizontal axis relative to the upper guide hole 23 (i.e., the negative direction of the Y axis). The fourth side surface 47 abuts against the inner surface 331 of the lower guide hole 33 that faces the negative direction of the Y axis. Furthermore, if the upper guide hole 23 and the lower guide hole 33 are also offset in the second horizontal axis direction, the first side surface 44 faces the direction in which the lower guide hole 33 is offset relative to the upper guide hole 23 in the second horizontal axis direction (i.e., the positive direction of the X axis), and the third side surface 46 abuts against another inner surface 332 of the lower guide hole 33 that faces the positive direction of the X axis.

[0061] As a result, the vertical probe 40 has a third side surface 46 and / or a fourth side surface 47 that are planar, which contact the inner surface 332 and / or inner surface 331 of the lower guide 33. The third side surface 46 and the fourth side surface 47 are not stepped between the main body 41 and the probe tip 43. The structural strength of this part is relatively good. As a result, when the contact end 433 of the probe tip 43 makes point contact with the object to be measured, even if the probe tip 43 moves up and down and retracts into the lower guide hole 33, the probe tip 43 will not easily break as a result. In addition, it is possible to avoid the contact end 433 not being able to align with the conductive contact of the object to be measured due to the position of the probe tip 43 being misaligned. Furthermore, the first side surface 44 of the vertical probe 40 has a first transition region 442 and a first lower planar region 443 formed by a laser processing method. Therefore, the dimensional accuracy of the probe tip 43 can be improved. Furthermore, in the second side surface 45, the second transition region 452 and the second lower planar region 453 are also formed by the laser processing method. Thus, the dimensional accuracy of the probe tip 43 can be further improved. This allows the tolerances of the vertical probe 40 to meet demand and increases the manufacturing yield rate of probe cards.

[0062] In this embodiment, the probe head 10 includes the lower guide plate units 20 and 30, through which the vertical probe 40 is provided; however, the probe head 10 does not necessarily include the upper guide plate unit 20. The vertical probe 40 is provided through the lower guide hole 33 of the lower guide plate unit 30, and the effects of the vertical probe 40 of the present invention described above can be achieved when the third side surface 46 and / or the fourth side surface 47 abut against the inner surface 332 and / or the inner surface 331 of the lower guide hole 33.

[0063] Preferably, as shown in Figure 3, the first side 44 and third side 46 of the vertical probe 40 have a width W1 of 30 to 100 micrometers in the body 41. The second side 45 and fourth side 47 also have a width W2 of 30 to 100 micrometers in the body 41. In other words, in the manufacturing process described above, the thickness (corresponding to the width W2) of the base material 50A is 30 to 100 micrometers, as shown in Figure 6. The maximum distance (corresponding to the width W1) in the Y-axis of the two cutting paths 54 and 55 shown in Figure 8 is also 30 micrometers and 100 micrometers. Such dimensions are suitable for reducing the thickness and width of the probe tip by machining the first and second transition regions 442 and 452 and the first and second lower planar regions 443 and 453.

[0064] In this embodiment, the cross-section of the main body 41 is square. That is, the widths W1 and W2 shown in Figure 3 are equal. The probe tip contact portion 432 has a square cross-section, and the widths W3 and W4 are equal. In this way, the reduction in the probe tip width of the vertical probe 40 (i.e., the difference between W1 and W3) is equal to the reduction in the probe tip thickness (i.e., the difference between W2 and W4), thus avoiding the occurrence of a large stress concentration in one of the lateral axes. However, as shown in Figure 9, the cross-sectional shape of the main body 41 may be rectangular, and the cross-sectional shape of the probe tip contact portion 432 may still be square. Also, in the cross-section of the main body 41, the short sides are located at the first side 44 and the third side 46, and the long sides are located at the second side 45 and the fourth side 47. Therefore, at the probe tip 43, the reduction at the first side 44 is greater than the reduction at the second side 45. In other words, the distance D1 on the X-axis between the first upper planar region 441 and the first lower planar region 443 of the first side surface 44 is greater than the distance D2 on the Y-axis between the second upper planar region 451 and the second lower planar region 453 of the second side surface 45. To put it another way, the reduction in the cross-sectional area of ​​the probe tip 43 is relatively large on the first side surface 44 and relatively small on the second side surface 45. Such a probe tip 43 experiences less stress concentration on the second side surface 45. Therefore, by orienting the second side surface 45 in the horizontal axis direction (i.e., the Y-axis) where the relative displacement of the upper and lower guide plate units 20 and 30 is large, the vertical probe 40 becomes less prone to fracture. Furthermore, since the short side of the cross-section of the main body 41 is parallel to this horizontal axis direction (i.e., the Y-axis) where the relative displacement is large, a good elastic deformation effect is obtained. In addition, the main body 41 may further include a slit (not shown) that penetrates at least the first side surface 44 and the third side surface 46. This allows for a higher elastic deformation effect. In this invention, the cross-sectional shape of the probe tip contact portion 432 is square, and the cross-sectional shape of the main body 41 is square or rectangular. The square or rectangular shape is not limited to a perfect square or rectangle, and includes cases where the four corners of the square or rectangle are not perfect right angles due to machining errors or lead angles.

[0065] As shown in Figures 2 and 4, in the present invention, the distance on the Z-axis between the first lower connecting line 445 and the contact end 433 is defined as the first height H1, and the distance on the Z-axis between the second lower connecting line 455 and the contact end 433 is defined as the second height H2. In the first embodiment, the first height H1 is greater than the second height H2. When the probe tip 43 makes point contact with the object to be measured, stress is concentrated in the first and second transition regions 442, 452 and the first and second lower planar regions 443, 453, so this part is prone to fracture relatively easily. By designing the first and second lower connecting lines 445, 455 to be at different heights, i.e., by making the heights of the first and second lower planar regions 443, 453 different, the problem of stress concentration can be improved, and the vertical probe 40 can be made less prone to fracture. In other words, the second height H2 may be greater than the first height H1, and the above effect can be achieved as long as the first height H1 and the second height H2 are not equal. To achieve these structural features, in the manufacturing method of the vertical probe 40, the distance D3 on the Z-axis between the position of the second lower connecting line 455 (i.e., the transition position 552 of the cutting path 55) and the third position P3 is not equal to the distance D4 on the Z-axis between the second position P2 and the third position P3, as shown in Figure 8.

[0066] The aforementioned effects can be achieved by designing the first and second upper connecting lines 444 and 454 to be at different heights. For example, as shown in Figure 10, in the vertical probe according to the second embodiment of the present invention, the distance on the Z-axis between the first upper connecting line 444 and the contact end 433 is defined as the third height H3, and the distance on the Z-axis between the second upper connecting line 454 (i.e., the conversion point between the second upper planar region 451 and the second transition region 452 on the second side surface 45) and the contact end 433 is defined as the fourth height H4, where the fourth height H4 is greater than the third height H3, or the third height H3 is greater than the fourth height H4. In other words, the overall height of the first lower planar region 443 and the first transition region 442 is different from the overall height of the second lower planar region 453 and the second transition region 452. This can further improve the problem of stress concentration and make the vertical probe more resistant to fracture. To achieve these structural features, the cutting process in the manufacturing method of the vertical probe is such that the distance D5 on the Z-axis between the position of the second upper connecting line 454 (i.e., the transition position 551 of the cutting diameter 55) and the third position P3 is not equal to the distance D6 on the Z-axis between the first position P1 and the third position P3, as shown in Figure 11. Furthermore, in this invention, the first and second lower connecting lines 445 and 455 are located at different heights, and at the same time, the first and second upper connecting lines 444 and 454 are also located at different heights. This further improves the problem of stress concentration and makes the vertical probe more resistant to fracture.

[0067] In the first and second embodiments described above, the distance D7 between the second upper connecting line 454 and the second lower connecting line 455 is greater than the distance D8 between the first upper connecting line 444 and the first lower connecting line 445. As shown in Figure 4, that is, the length of the second transition region 452 is longer than the length of the first transition region 442, and the second transition region 452 has a better stress distribution effect than the first transition region 442. When the upper and lower guide plate units 20 and 30 are displaced relative only in the Y-axis direction, or when the relative displacement of the upper and lower guide plate units 20 and 30 in the Y-axis direction is greater than the relative displacement of the upper and lower guide plate units 20 and 30 in the X-axis direction, the vertical probe 40 experiences a large stress in the Y-axis direction where the relative displacement is large. The second transition region 452 faces the Y-axis, is relatively long, and can effectively distribute the relatively large stress that the vertical probe 40 experiences in the Y-axis direction. Furthermore, these distances D7 and D8 can be designed according to predetermined relative displacements of the upper and lower guide plate units 20 and 30 on the X and Y axes. This can further improve the problem of stress concentration and make the vertical probe less prone to failure.

[0068] As shown in Figures 12 to 13, the vertical probe 40 of the present invention is manufactured by a different manufacturing method, which includes the following steps S21 to S23.

[0069] Step S21 provides a base material 50B (as shown in Figure 13). The base material 50B is a long needle made of a conductive material. The base material 50B has a top surface 51, a bottom surface 52 facing the opposite side of the top surface 51, and two sides 56 and 57 facing opposite sides. For example, the needle is formed by a micromachine process. Typically, multiple needles are formed simultaneously on a single substrate (not shown), and post-processing is performed on these multiple needles simultaneously to manufacture multiple vertical probes. Figure 13 schematically shows only one needle. At this time, the side contour required for the vertical probe 40 is formed. Thus, the sides 56 and 57 of the needle 50B become the fourth side 47 and the second side 45 (shown in Figure 4) of the vertical probe 40, respectively. In other words, the needle body 50B provided by step S21 already includes the second upper planar region 451, the second transition region 452, the second lower planar region 453, the second upper connecting line 454, and the second lower connecting line 455 of the second side surface 45 of the vertical probe 40. The maximum width and thickness of the base material 50B provided by step S21 will be equal to the width and thickness of the body 41 of the vertical probe 40 after the manufacturing is completed, i.e., W1 and W2 as shown in Figure 3.

[0070] In other embodiments, the aforementioned needle bodies may be formed by a laser processing method (e.g., laser cutting). Typically, multiple needle bodies are formed simultaneously on a single substrate (not shown) to form the side contours required for the vertical probe 40. Thus, the sides 56 and 57 of the needle body 50B become the fourth side 47 and the second side 45 of the vertical probe 40, respectively (as shown in Figure 4).

[0071] In step S22, a laser processing method (e.g., laser ablation) is used to form a first transition region 442 of the vertical probe 40 between a first position P1 and a second position P2 on the top surface 51 of the substrate 50B (as shown in Figure 4).

[0072] In step S23, the laser processing method forms a first lower planar region 443 of the vertical probe 40 between the second position P2 and the third position P3 on the top surface 51 of the substrate 50B (as shown in Figure 4).

[0073] In other words, following step S22, step S23 is performed using the same laser processing method so that the top surface 51 of the substrate 50B becomes the first side surface 44 of the vertical probe 40. The starting position for forming the first lower planar region 443 is the ending position (second position P2) for forming the first transition region 442, and the starting position for forming the first lower planar region 443 (third position P3) is located at one end 58 of the substrate 50B.

[0074] In this manufacturing method, the distance D9 on the Z-axis between the first position P1 and the third position P3, and the distance D10 on the Z-axis between the second upper connecting line 454 and the third position P3 may be made different so that the first and second upper connecting lines 444 and 454 of the finally manufactured vertical probe 40 are not aligned with each other. That is, as shown in Figure 10, the third height H3 and the fourth height H4 are different. This can improve the problem of stress concentration and make the vertical probe more resistant to fracture. Alternatively, the distance D11 on the Z-axis between the second position P2 and the third position P3, and the distance D12 on the Z-axis between the second lower connecting line 455 and the third position P3, may be made different so that the first and second lower connecting lines 445 and 455 of the finally manufactured vertical probe 40 are not aligned with each other. That is, as shown in Figure 2, the first height H1 and the second height H2 are different. This can improve the problem of stress concentration and make the vertical probe more resistant to fracture.

[0075] As shown in Figure 14, the probe head according to the third embodiment of the present invention is similar to that of the first embodiment. However, in this embodiment, two types of vertical probes 40 and 40' are provided. The vertical probe 40 can be any of the above-described forms. The probe tip 43 is reduced in size at the first side surface 44 and the second side surface 45. The difference between the vertical probe 40 and the vertical probe 40' is that the probe tip 43 does not have the first and second transition regions 442 and 452 and the first and second lower planar regions 443 and 453. That is, the first to fourth side surfaces 44 to 47 of the vertical probe 40' all extend planarly from the main body 41 to the probe tip 43, so the thickness and width of the probe tip 43 of the vertical probe 40' are not reduced and are equal to those of the main body 41. For this reason, the area of ​​the contact end 433 of the probe tip 43 of the vertical probe 40' is larger than the area of ​​the contact end 433 of the probe tip 43 of the vertical probe 40.

[0076] This makes the probe head according to the embodiment shown in Figure 14 suitable for detecting an object having microbumps. For example, Figure 15 schematically shows nine microbumps 61, 62. The microbumps may be arranged in a matrix. Also, three or four microbumps for transmitting power signals or ground signals may be centrally arranged. In the embodiment shown in Figure 15, each microbump 61 is used to transmit power signals, or each is used to transmit ground signals. Microbumps 62 used to transmit test signals are arranged non-centrally. Figure 15 schematically shows the contact ends 433 and bodies 41 of two types of vertical probes 40, 40', as well as the lower guide holes 33 through which the vertical probes 40, 40' pass. The contact end 433 of the vertical probe 40' is used to contact four microbumps 61 simultaneously, and the contact end 433 of the vertical probe 40 is used to contact one microbump 62.

[0077] As a result, even if the dimensions of the probe tips 43 of the vertical probes 40 and 40' are not equal, the dimensions of the main body 41 are approximately equal. Therefore, it is easy to control the amount of deformation of the main body 41 of the vertical probes 40 and 40' to match, resulting in uniform probe test results. In addition, the amount of wear of the vertical probes 40 and 40' can be matched.

[0078] In particular, in the embodiment shown in Figure 15, the contact end 433 of the vertical probe 40 is configured to contact four microbumps 61 simultaneously. However, the contact end 433 of the vertical probe 40 may be configured to contact multiple microbumps 61 simultaneously. For example, there may be three, nine, or any other number. However, the contact end 433 of the probe tip 43 of the vertical probe 40 corresponds to a single microbump.

[0079] Those with ordinary skill in the art to which this invention belongs will understand that the thickness and width of the probe tip 43 of the vertical probe 40 can be reduced and proportionally adjusted so that the contact end 433 of the probe tip 43 of the vertical probe 40 corresponds to a single microbump 62. After the thickness and width of the probe tip 43 of the vertical probe 40 are reduced, the bodies 41 of the vertical probes 40, 40' still align with each other. Thus, the lower guide holes 33 for passing the vertical probes 40, 40' also align with each other. In other words, it is not necessary to design different arrangements of lower guide holes 33 for the vertical probes 40, 40'. This simplifies the design of the lower guide holes 33, avoids the complexity of designing the arrangement of the lower guide holes 33, and prevents damage to the plate body of the lower guide plate unit 30 due to variations in spacing.

[0080] An example will be given to describe how to attach the vertical probes 40 and 40' to the upper guide hole 23 and the lower guide hole 33. As shown in Figures 14, 15, and 1, 4, the method for attaching the vertical probes 40 and 40' to the lower guide plate unit 30 is as follows: The second side surface 45 is oriented in the direction in which the lower guide hole 33 is offset from the upper guide hole 23 in the first horizontal axis direction (i.e., the negative direction of the Y axis). The fourth side surface 47 is in contact with the inner surface 331 of the lower guide hole 33 that faces the negative direction of the Y axis. In the case where the upper guide hole 23 and the lower guide hole 33 are offset from each other, the first side surface 44 is oriented in the direction in which the lower guide hole 33 is offset from the upper guide hole 23 in the second horizontal axis direction (i.e., the positive direction of the X axis). The third side surface 46 is made to contact another inner surface 332 of the lower guide hole 33 that faces in the positive direction of the X axis.

[0081] Finally, it is reiterated that the components disclosed in embodiments of the present invention are for illustrative purposes only and do not limit the scope of the present invention, and substitutions or modifications of other equivalent components should be included within the scope of the claims of the present invention. [Explanation of symbols]

[0082] 10: Probe head 20: Upper guide plate unit 21:Top side 22: Lower side 23: Upper guide hole 30: Lower guide plate unit 31:Top side 32: Lower side 33: Lower guide hole 331, 332: Inner surface 40, 40': Vertical probe 41: Main unit 411: Upper mounting section 412: Lower mounting section 42: Probe rear end 43: Probe tip 431: Probe tip gradually shrinking section 432: Probe tip contact area 433: Contact end 44: First Aspect 441: First upper planar region 442: First transition region 443: First lower planar region 444: First upper connecting wire 445: First lower connecting wire 45: The second aspect 451: Second upper planar region 452: Second transition region 453: Second lower planar region 454: Second upper connecting wire 455: Second lower connecting wire 46: The Third Aspect 47: The Fourth Aspect 50A, 50B: Base material 51: Top surface 511: Transition surface 512: Machining plane 513: Plane 52: Bottom 53: End surface 54, 55: Cutting path 551, 552: Conversion points 56, 57: Side view 58:Terminal 61, 62: Fine protrusion D1, D2, D3, D4, D5, D6, D7, D8, D9, D10, D11, D12: Distance H1: First height H2: Second height H3: Third height H4: Fourth height P1: First position P2: Second position P3: Third Position P4: Fourth Position S11, S12, S13, S14, S21, S22, S23 Step W1, W2, W3, W4 width

Claims

1. A long, rectangular body extending in the vertical direction, A vertical probe comprising: a probe tip connected to the main body and extending from the main body in the vertical axis direction, The vertical probe includes a first side, a second side, a third side facing the opposite direction to the direction the first side faces, and a fourth side facing the opposite direction to the direction the second side faces, wherein the third and fourth sides extend planarly from the main body to the tip of the probe. The first side surface includes a first upper planar region located on the main body, a first transition region located at the tip of the probe, and a first lower planar region located at the tip of the probe, wherein the first transition region is located between the first upper planar region and the first lower planar region, a first upper connecting line is formed between the first transition region and the first upper planar region, a first lower connecting line is formed between the first transition region and the first lower planar region, the first lower planar region is closer to the third side surface than the first upper planar region, and the first transition region extends from the first upper connecting line to the first lower connecting line while approaching the third side surface. The second side surface includes a second upper planar region located on the main body, a second transition region located at the tip of the probe, and a second lower planar region located at the tip of the probe, wherein the second transition region is located between the second upper planar region and the second lower planar region, a second upper connecting line is formed between the second transition region and the second upper planar region, a second lower connecting line is formed between the second transition region and the second lower planar region, the second lower planar region is closer to the fourth side surface than the second upper planar region, and the second transition region extends from the second upper connecting line to the second lower connecting line while approaching the fourth side surface. A vertical probe characterized by the following features.

2. A vertical probe according to claim 1, If the probe tip has a contact end that is furthest from the main body, and the distance between the first lower connecting line and the contact end in the vertical axis direction is defined as the first height, and the distance between the second lower connecting line and the contact end in the vertical axis direction is defined as the second height, then the first height and the second height are not equal, or If the probe tip has a contact end that is furthest from the main body, and the distance between the first upper connecting line and the contact end in the vertical axis direction is defined as the third height, and the distance between the second upper connecting line and the contact end in the vertical axis direction is defined as the fourth height, then the third height and the fourth height are not equal, or The distance between the second upper connecting wire and the second lower connecting wire is greater than the distance between the first upper connecting wire and the first lower connecting wire. A vertical probe characterized by the following features.

3. A vertical probe according to claim 1, The first side, the second side, the third side, and the fourth side all have a width of 30 micrometers to 100 micrometers in the main body. A vertical probe characterized by the following features.

4. A vertical probe according to claim 1, The probe tip includes a gradually shrinking probe tip portion and a probe tip contact portion, the gradually shrinking probe tip portion includes the first transition region and the second transition region, the probe tip contact portion includes the first lower planar region and the second lower planar region, the cross-section of the probe tip contact portion is square, the cross-section of the main body is square, or The probe tip includes a probe tip gradual reduction portion and a probe tip contact portion, the probe tip gradual reduction portion includes the first transition region and the second transition region, the probe tip contact portion includes the first lower plane region and the second lower plane region, the second upper plane region and the second lower plane region of the second side surface are perpendicular to the first horizontal axis direction, the first upper plane region and the first lower plane region of the first side surface are perpendicular to the second horizontal axis direction, and the distance between the first upper plane region and the first lower plane region of the first side surface in the second horizontal axis direction is greater than the distance between the second upper plane region and the second lower plane region of the second side surface in the first horizontal axis direction. A vertical probe characterized by the following features.

5. An upper guide plate unit including an upper guide hole, A lower guide plate unit including an upper side surface, a lower side surface, and a lower guide hole that penetrates the upper side surface and the lower side surface, A vertical probe according to any one of claims 1 to 4, comprising: The main body of the vertical probe includes an upper mounting portion and a lower mounting portion, The upper mounting portion and the lower mounting portion are provided so as to penetrate the upper guide hole and the lower guide hole, respectively. The tip of the vertical probe is located below the lower side of the lower guide plate unit. A probe head characterized by the following features.

6. A probe head according to claim 5, The probe head has a first transverse axis and a second transverse axis defined which are perpendicular to each other. The upper guide hole and the lower guide hole are offset from each other along the first horizontal axis so that the fourth side surface of the vertical probe contacts the inner surface of one of the lower guide holes. The upper guide hole and the lower guide hole are offset from each other along the second transverse axis so that the third side of the vertical probe contacts another inner surface of the lower guide hole. The distance at which the upper guide hole and the lower guide hole are offset from each other along the first horizontal axis is greater than the distance at which they are offset from each other along the second horizontal axis. A probe head characterized by the following features.

7. A probe head according to claim 5, The probe head further comprises another vertical probe, The aforementioned other vertical probe is, A long, rectangular body extending in the vertical direction, It includes a probe tip connected to the main body and extending from the main body in the vertical direction, The other vertical probe includes a first side, a second side, a third side facing the opposite direction to the direction the first side faces, and a fourth side facing the opposite direction to the direction the second side faces, wherein the first side, the second side, the third side, and the fourth side of the other vertical probe extend planarly from the body of the other vertical probe to the probe tip of the other vertical probe. The body of the other vertical probe includes an upper mounting portion and a lower mounting portion, and the upper mounting portion and the lower mounting portion of the other vertical probe are provided to penetrate another upper guide hole of the upper guide plate unit and another lower guide hole of the lower guide plate unit, respectively. The tip of the aforementioned vertical probe is located below the lower side of the lower surface of the lower guide plate unit. A probe head characterized by the following features.

8. A method for manufacturing a vertical probe used to manufacture the vertical probe described in claim 1, The first step is to form the first transition region by performing laser processing between a first position and a second position on the top surface of a substrate made of a conductive material using a laser processing method, The laser processing method includes the step of forming the first lower planar region by performing laser processing between the second and third positions of the substrate. A method for manufacturing a vertical probe, characterized by the following:

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