Circuit board manufacturing apparatus and circuit board manufacturing method

Abstract

This circuit board manufacturing device manufactures circuit boards having a board, an insulating layer, and a circuit section. The circuit board manufacturing device comprises a plurality of heating / pressurizing parts, each having: a receiving jig in which a board is set; a lower mold to which the receiving jig is fixed; an upper mold that presses the insulating layer or the circuit section toward the board by engaging with the lower mold; and a heater that warms each of the upper mold and the lower mold. Further, the circuit board manufacturing device comprises a heating / pressurizing part transport unit that sequentially moves the plurality of heating / pressurizing parts between a pressurizing position where the upper mold can be pressurized toward the lower mold and a setup position where the board can be removed from the board receiving jig and the board can be set in the receiving jig.

Description

Technical Field

[0001] The present disclosure relates to a manufacturing apparatus for a circuit board and a method for manufacturing a circuit board.

Background Art

[0002] Japanese Patent Application Laid-Open No. 2003-48249 discloses an apparatus for continuously pressure-bonding and laminating two or more sheets having irregularities formed thereon, such as bonding a printed circuit board sheet having an uneven surface and its cover sheet, under a high vacuum. When bonding two sheets using the apparatus described in this document, first, the two sheets are placed between upper and lower pressure contact members and sandwiched therebetween. At this time, the portions of the upper and lower pressure contact members that sandwich the two sheets are completely sealed. While the two sheets are clamped and fixed by the upper and lower pressure contact members, when the lower surface of the sliding frame body is in close contact with the upper surface of the receiving base over the entire surface with high airtightness, an airtight compartment surrounded by the inner peripheral surface of the frame body and the lower surface of the pressing block is formed on the receiving base. Then, by evacuating the inside of this compartment, it is possible to remove the air bubbles existing between the two sheets. Further, the two sheets are sandwiched between the receiving base and the pressing block and are thermocompression-bonded under a high vacuum by being heated and pressurized.

Summary of the Invention

Problems to be Solved by the Invention

[0003] By the way, in a circuit board in which a circuit portion is provided via an insulating layer on a metal substrate, it is desirable to be able to suppress an increase in the waiting time before going through the process of fixing the substrate and the insulating layer and the process of fixing the insulating layer and the circuit portion. However, the apparatus described in Japanese Patent Application Laid-Open No. 2003-48249 does not consider the manufacture of such a circuit board.

[0004] This disclosure, taking the above facts into consideration, aims to provide a circuit board manufacturing apparatus and a circuit board manufacturing method that can suppress the length of waiting time before the steps of fixing the substrate and the insulating layer, and fixing the insulating layer and the circuit part, in the manufacturing process of a circuit board in which a circuit part is provided on a metal substrate via an insulating layer. [Means for solving the problem]

[0005] A circuit board manufacturing apparatus according to the first embodiment is a circuit board manufacturing apparatus having a substrate formed using a metal material, an insulating layer formed in sheet form using an insulating material and fixed on the substrate, and a circuit portion formed using a conductive material and fixed on the insulating layer, comprising a plurality of heating and pressing units having a receiving jig on which the substrate is set, a lower die to which the receiving jig is fixed, an upper die positioned above the lower die and engaging with the lower die to press the insulating layer or the circuit portion toward the substrate, and heaters for heating the upper die and the lower die respectively, and a heating and pressing unit transport unit that moves the plurality of heating and pressing units sequentially between a pressing position where the upper die can be pressed toward the lower die and a setup position where the substrate can be removed from the receiving jig and the substrate can be set on the receiving jig.

[0006] The circuit board manufacturing apparatus of the second embodiment further comprises an air suction unit for drawing air from the sealed space between the upper mold and the lower mold, in addition to the circuit board manufacturing apparatus of the first embodiment.

[0007] A third embodiment of a circuit board manufacturing method includes, using the circuit board manufacturing apparatus of the first embodiment, setting the board with the insulating layer already set on it onto the receiving jig of one of the heating and pressing units positioned at the setup position, and engaging the upper mold with the lower mold in one of the heating and pressing units; a second insulating layer fixing step of moving one of the heating and pressing units to the pressurizing position using the heating and pressing unit transport unit, and moving the other heating and pressing unit to the setup position using the heating and pressing unit transport unit; a third insulating layer fixing step of fixing the insulating layer to the board by pressing the insulating layer toward the board in one of the heating and pressing units; and simultaneously with the third insulating layer fixing step, the insulating layer on the board in the other heating and pressing unit. The system includes: a fourth insulating layer fixing step of setting the substrate in the set state onto the receiving jig and engaging the upper mold with the lower mold in the other heating and pressing section; a fifth insulating layer fixing step of moving one of the heating and pressing sections to the setup position by the heating and pressing section transport section and moving the other heating and pressing section to the pressing position by the heating and pressing section transport section; a sixth insulating layer fixing step of fixing the insulating layer to the substrate by pressing the insulating layer toward the substrate in the other heating and pressing section; and a seventh insulating layer fixing step of simultaneously removing the substrate with the insulating layer fixed from the receiving jig in one of the heating and pressing sections and setting the substrate with the insulating layer set on it onto the receiving jig.

[0008] A fourth embodiment of a circuit board manufacturing method includes, using the circuit board manufacturing apparatus of the first embodiment, a first circuit section fixing step in which the board with the circuit section set on the insulating layer is set in the receiving jig of one of the heating and pressing sections located at the setup position and the upper mold is engaged with the lower mold; a second circuit section fixing step in which one of the heating and pressing sections is moved to the pressing position by the heating and pressing section transport section and the other heating and pressing section is moved to the setup position by the heating and pressing section transport section; a third circuit section fixing step in which the circuit section is fixed to the insulating layer by pressing the circuit section toward the board side in one of the heating and pressing sections; and simultaneously with the third circuit section fixing step, the circuit section is set on the insulating layer in the other heating and pressing section. The process includes: a fourth circuit section fixing step of setting the substrate in the prepared state into the receiving jig and engaging the upper mold with the lower mold; a fifth circuit section fixing step of moving one of the heating and pressing sections to the setup position by the heating and pressing section transport section and moving the other heating and pressing section to the pressurizing position by the heating and pressing section transport section; a sixth circuit section fixing step of fixing the circuit section to the insulating layer by pressing the other heating and pressing section toward the substrate; and a seventh circuit section fixing step of simultaneously with the sixth circuit section fixing step of removing the substrate from the receiving jig with the circuit section fixed on the insulating layer by one of the heating and pressing sections and setting the substrate with the circuit section set on the insulating layer into the receiving jig.

[0009] A fifth embodiment of the method for manufacturing a circuit board uses the circuit board manufacturing apparatus of the second embodiment, wherein in the first insulating layer fixing step, after engaging the upper mold with the lower mold, the air in the sealed space between the upper mold and the lower mold is sucked out by the air suction unit, and in the fourth insulating layer fixing step, after engaging the upper mold with the lower mold, the air in the sealed space between the upper mold and the lower mold is sucked out by the air suction unit.

[0010] The sixth embodiment of the method for manufacturing a circuit board uses the circuit board manufacturing apparatus of the second embodiment, wherein in the first circuit section fixing step, after engaging the upper mold with the lower mold, the air in the sealed space between the upper mold and the lower mold is sucked out by the air suction unit, and in the fourth circuit section fixing step, after engaging the upper mold with the lower mold, the air in the sealed space between the upper mold and the lower mold is sucked out by the air suction unit.

[0011] According to the circuit board manufacturing apparatus of the first embodiment, for example, the manufacturing method of the third embodiment or the manufacturing method of the fourth embodiment can be applied.

[0012] In the third embodiment of the manufacturing method, first, the substrate with the insulating layer set on it is set in a receiving jig of one heating and pressing unit located at the setup position, and the upper mold is engaged with the lower mold (first insulating layer fixing step). Next, one heating and pressing unit is moved to the pressurizing position by the heating and pressing unit transport unit, and the other heating and pressing unit is moved to the setup position by the heating and pressing unit transport unit (second insulating layer fixing step). Next, the insulating layer is fixed to the substrate by pressing it toward the substrate side in one heating and pressing unit (third insulating layer fixing step). Next, simultaneously with the third insulating layer fixing step, the substrate with the insulating layer set on it is set in a receiving jig in the other heating and pressing unit, and the upper mold is engaged with the lower mold (fourth insulating layer fixing step). Next, one heating and pressing unit is moved to the setup position by the heating and pressing unit transport unit, and the other heating and pressing unit is moved to the pressurizing position by the heating and pressing unit transport unit (fifth insulating layer fixing step). Next, the insulating layer is fixed to the substrate by pressing it toward the substrate in another heating and pressing section (sixth insulating layer fixing step). Then, simultaneously with the sixth insulating layer fixing step, the substrate with the insulating layer fixed in one heating and pressing section is removed from the receiving jig and the substrate with the insulating layer set on it is set into the receiving jig (seventh insulating layer fixing step). Here, in the circuit board manufacturing apparatus of the first embodiment, the fourth insulating layer fixing step can be performed simultaneously with the third insulating layer fixing step. Also, the seventh insulating layer fixing step can be performed simultaneously with the sixth insulating layer fixing step. This makes it possible to suppress the waiting time before going through the process of fixing the substrate and the insulating layer.

[0013] In the manufacturing method of the fourth embodiment, first, a substrate with the circuit section set on the insulating layer is set in a receiving jig of one heating and pressing section located at the setup position, and the upper mold is engaged with the lower mold (first circuit section fixing step). Next, one heating and pressing section is moved to the pressing position by the heating and pressing section transport section, and the other heating and pressing section is moved to the setup position by the heating and pressing section transport section (second circuit section fixing step). Next, the circuit section is fixed to the insulating layer by pressing the circuit section toward the substrate side in one heating and pressing section (third circuit section fixing step). Next, simultaneously with the third circuit section fixing step, the substrate with the circuit section set on the insulating layer is set in a receiving jig in the other heating and pressing section, and the upper mold is engaged with the lower mold (fourth circuit section fixing step). Next, one heating and pressing section is moved to the setup position by the heating and pressing section transport section, and the other heating and pressing section is moved to the pressing position by the heating and pressing section transport section (fifth circuit section fixing step). Next, the circuit section is fixed to the insulating layer by pressing it toward the substrate in another heating and pressing section (sixth circuit section fixing step). Then, simultaneously with the sixth circuit section fixing step, the substrate with the circuit section fixed to the insulating layer is removed from the receiving jig in one of the heating and pressing sections, and the substrate with the circuit section set on the insulating layer is set in the receiving jig (seventh circuit section fixing step). Here, in the circuit board manufacturing apparatus of the first embodiment, the fourth circuit section fixing step can be performed simultaneously with the third circuit section fixing step. Also, the seventh circuit section fixing step can be performed simultaneously with the sixth circuit section fixing step. This makes it possible to suppress the waiting time before going through the process of fixing the insulating layer and the circuit section.

[0014] According to the circuit board manufacturing apparatus of the second embodiment, for example, the manufacturing method of the fifth embodiment or the manufacturing method of the sixth embodiment can be applied.

[0015] In the manufacturing method of the fifth embodiment, in the first insulating layer fixing step and the fourth insulating layer fixing step, air is sucked out of the sealed space between the upper and lower molds by an air suction unit. Here, in the circuit board manufacturing apparatus of the second embodiment, the air in the sealed space between the upper and lower molds can be pre-suctioned in the first insulating layer fixing step before the third insulating layer fixing step. Also, the air in the sealed space between the upper and lower molds can be pre-suctioned in the fourth insulating layer fixing step before the sixth insulating layer fixing step. This makes it possible to suppress the waiting time before going through the process of fixing the substrate and the insulating layer.

[0016] In the manufacturing method of the sixth embodiment, in the first circuit section fixing step and the fourth circuit section fixing step, air is sucked out of the sealed space between the upper and lower molds by an air suction unit. Here, in the circuit board manufacturing apparatus of the second embodiment, the air in the sealed space between the upper and lower molds can be pre-suctioned in the first circuit section fixing step before the third circuit section fixing step. Also, the air in the sealed space between the upper and lower molds can be pre-suctioned in the fourth circuit section fixing step before the sixth circuit section fixing step. This makes it possible to suppress the waiting time before going through the process of fixing the insulating layer and the circuit section. [Effects of the Invention]

[0017] The circuit board manufacturing apparatus and circuit board manufacturing method according to this disclosure have the excellent effect of suppressing the long waiting time before the steps of fixing the substrate and the insulating layer, and fixing the insulating layer and the circuit part. [Brief explanation of the drawing]

[0018] [Figure 1] This is a perspective view showing a circuit board. [Figure 2] This is a cross-sectional view showing a circuit board. [Figure 3] This is a block diagram showing a part of the circuit board manufacturing equipment. [Figure 4] This is a block diagram showing other parts of the circuit board manufacturing equipment. [Figure 5]It is a perspective view showing an insulating layer formed on a PET film. [Figure 6] It is a perspective view for explaining the process in the insulating layer cutting part. [Figure 7] It is a perspective view showing a common transfer jig and a positioning jig, [Figure 8] It is a perspective view for explaining the process in the first set part, showing the state where the substrate is set on the common transfer jig. [Figure 9] It is a perspective view for explaining the process in the first set part, showing the process of setting an insulating layer etc. on the substrate. [Figure 10] It is a side view for explaining the process by the first preheating part. [Figure 11] It is a side view showing the device used in the first pressing part. [Figure 12] It is a plan view showing the heating and pressing part transfer part. [Figure 13] It is a side sectional view showing the heating and pressing part etc. [Figure 14] It is a plan view showing the receiving jig. [Figure 15] It is a side sectional view showing the process of pressing the insulating layer set on the substrate toward the substrate side. [Figure 16] It is a side view for explaining the first insulating layer fixing process. [Figure 17] It is a side view for explaining the first insulating layer fixing process. [[ID=3८]] [Figure 18] It is a side view for explaining the second insulating layer fixing process. [[ID=५०]] [[ID=५१]] [Figure 19] [[ID=५२]]It is a side view for explaining the third insulating layer fixing process and the fourth insulating layer fixing process. [[ID=५३]] [[ID=५४]] [Figure 20] [[ID=५५]]It is a side view for explaining the third insulating layer fixing process and the fourth insulating layer fixing process. [[ID=५६]] [[ID=५७]] [Figure 21] [[ID=५८]]It is a side view for explaining the fifth insulating layer fixing process. [[ID=५९]] [[ID=६०]] [Figure 22] [[ID=६१]]It is a side view for explaining the sixth insulating layer fixing process and the seventh insulating layer fixing process. [[ID=६२]] [[ID=६३]] [Figure 23] It should be noted that in the above translation, for the tags like etc., they are preserved as they are because they are required to be unchanged according to the rules. Also, the line breaks are maintained as in the original text. And the text within the [[ID=]] and tags is translated as accurately as possible while following the given guidelines.This is a side view illustrating the process using the first removal section. [Figure 24] This is a side view illustrating the process using the first cooling unit. [Figure 25] This is a perspective view illustrating the process involving the first peeling section. [Figure 26] This is a perspective view illustrating the process by the First Inspection Department. [Figure 27] This is a perspective view illustrating the process involving the attachment of the circuit board. [Figure 28] This is a perspective view illustrating the process in the second setting section, showing the process of setting the circuit board and other components onto the substrate. [Figure 29] This is a side cross-sectional view showing the process in which a circuit board set on a substrate is pressed toward the substrate. [Figure 30] This is a side view illustrating the process involving the second removal section. [Figure 31] This is a side view illustrating the process using the second cooling section. [Figure 32] This is a perspective view illustrating the process involving the second peeling section. [Figure 33] This is a perspective view illustrating the process by the Second Inspection Department. [Modes for carrying out the invention]

[0019] Figures 1 to 33 will be used to describe the circuit board manufacturing apparatus 10 and the circuit board manufacturing method according to the present disclosure. The arrow UP in the figures indicates the upper side of the circuit board manufacturing apparatus 10. First, the general configuration of the circuit board 12 will be described, and then the configuration of the circuit board manufacturing apparatus 10 will be described together with the circuit board manufacturing method.

[0020] (Outline configuration of circuit board 12) As shown in Figures 1 and 2, the circuit board 12 comprises a substrate 12, an insulating layer 16 fixed on the substrate 12, and a circuit portion 18 fixed on the insulating layer 16.

[0021] The substrate 12 is formed using a metal material. The substrate 12 comprises a rectangular plate-shaped portion 14A and a plurality of heat dissipation portions 14B protruding from the plate-shaped portion 14A. An insulating layer 16 and a circuit portion 18 are fixed to one side of the plate-shaped portion 14A in the thickness direction. From the other side of the plate-shaped portion 14A in the thickness direction, the plurality of heat dissipation portions 14B protrude toward the opposite side from the plate-shaped portion 14A. The plurality of heat dissipation portions 14B are formed in a cylindrical shape as an example and are arranged regularly with predetermined intervals between them.

[0022] The insulating layer 16 is formed in a sheet shape using an insulating material. This insulating layer 16 is interposed between the plate-shaped portion 14A and the circuit portion 18 of the substrate 12 to ensure insulation between them.

[0023] The circuit section 18 is formed in the shape of a rectangular plate using a conductive material. In this embodiment, a plurality of circuit sections 18 formed in a predetermined pattern are fixed on the insulating layer 16.

[0024] (Circuit board manufacturing apparatus 10 and method for manufacturing a circuit board) Figures 3 and 4 show schematic block diagrams of a circuit board manufacturing apparatus 10 (hereinafter simply referred to as "manufacturing apparatus 10") used in the manufacture of the above-mentioned circuit board 12. As shown in Figure 3, the manufacturing apparatus 10 includes an insulating layer cutting section 20, a first setting section 22, a first preheating section 24, a first pressing section 26, a first removal section 28, a first cooling section 30, a first peeling section 32, and a first inspection section 34. Also, as shown in Figure 4, the manufacturing apparatus 10 includes a circuit section attachment section 36, a second setting section 38, a second preheating section 40, a second pressing section 42, a second removal section 44, a second cooling section 46, a second peeling section 48, and a second inspection section 50.

[0025] As shown in Figures 3, 5, and 6, the insulating layer cutting unit 20 cuts the insulating layer 16 to a predetermined shape and dimensions. Here, as shown in Figure 5, the insulating layer 16 is formed in a sheet shape along a film 52 (hereinafter referred to as PET film 52) made of polyethylene terephthalate. As shown in Figure 6, the insulating layer cutting unit 20 comprises a cutting table 54 on which the insulating layer 16 is placed together with the PET film 52, and a cutter 56 that cuts the insulating layer 16 placed on the cutting table 54 together with the PET film 52. In the process at the insulating layer cutting unit 20, first, the insulating layer 16 is placed (set) on the cutting table 54 together with the PET film 52, with the insulating layer 16 facing downwards relative to the PET film 52. Next, the cutter 56 moves along a predetermined trajectory on the cutting table 54, cutting the insulating layer 16 together with the PET film 52 to a predetermined shape and dimensions. Note that in Figure 6, the cutting locations are indicated by dashed lines. In this embodiment, by cutting the insulating layer 16 together with the PET film 52, crumbling of the insulating layer 16 near the cut portion is suppressed compared to when the insulating layer 16 is cut alone. Note that all steps in the insulating layer cutting section 20 may be performed automatically, or some or all steps in the insulating layer cutting section 20 may be performed manually.

[0026] As shown in Figures 3, 7, 8, and 9, the first setting section 22 sets the insulating layer 16, which has been cut to the shape and dimensions determined by the insulating layer cutting section 20, onto the substrate 12. As shown in Figure 7, the first setting section 22 uses a common transport jig 58, which is transported by a transport section 66 (see Figure 10) described later, and a positioning jig 60 that engages with the common transport jig 58. The common transport jig 58 has a substrate setting section 58A into which the substrate 12 is set. The positioning jig 60 is made of a metal material, similar to the common transport jig 58. This positioning jig 60 has a rectangular positioning hole 60A that penetrates vertically. The positioning jig 60 engages with the common transport jig 58 from above, thereby restricting the horizontal movement of the positioning jig 60 relative to the common transport jig 58 (in a direction perpendicular to the vertical direction). Then, in the process in the first set section 22, first, as shown in Figure 8, the substrate 12 is set in the substrate set section 58A of the common transport jig 58 in a position where the multiple heat dissipation sections 14B are facing downwards. Next, as shown in Figure 9, the positioning jig 60 is engaged with the common transport jig 58 from above. When the positioning jig 60 is engaged with the common transport jig 58, the portion of the plate-shaped part 14A of the substrate 12 to which the insulating layer 16 is fixed is exposed upwards through the positioning hole 60A. Next, adhesive is applied to the side of the insulating layer 16 opposite to the PET film 52. Next, with the side of the insulating layer 16 to which the adhesive is applied facing downwards, the insulating layer 16 is placed in the positioning hole 60A of the positioning jig 60, and the insulating layer 16 is set on the plate-shaped part 14A of the substrate 12 together with the PET film 52. Next, the metal plate 62 and cardboard 64, whose shapes and dimensions when viewed from above correspond to those of the insulating layer 16, are placed in the positioning holes 60A of the positioning jig 60, thereby setting the metal plate 62 and cardboard 64 on the insulating layer 16 (on the PET film 52). Note that all of the steps in the first setting section 22 may be performed automatically, or some or all of the steps in the first setting section 22 may be performed manually.

[0027] As shown in Figures 3 and 10, the first preheating section 24 heats the substrate 12 and the insulating layer 16. As shown in Figure 10, the first preheating section 24 is equipped with a heating furnace 68 that surrounds a transport section 66 that transports the common transport jig 58. The temperature inside this heating furnace 68 is maintained at a predetermined temperature. In the process in the first preheating section 24, the common transport jig 58 is transported by the transport section 66, thereby moving the common transport jig 58 within the heating furnace 68. This heats the substrate 12 set on the common transport jig 58 and the insulating layer 16 set on the substrate 12.

[0028] As shown in Figures 3 and 11 to 22, the first press section 26 presses the insulating layer 16 set on the substrate 12 toward the substrate 12. As shown in Figures 11 and 12, the first press section 26 includes a press section body 70 having a mechanism for pressing the upper die 86 (described later) toward the lower die 84, a setup section 72 provided adjacent to the press section body 70, and a heating and pressing section transport section 73 that moves the heating and pressing section 74 (described later) between the press section body 70 and the setup section 72. Also, as shown in Figure 13, the first press section 26 includes two heating and pressing sections 74 on which the substrate 12 is set, and an air suction section 76.

[0029] As shown in Figure 11, the press body 70 comprises a hydraulic cylinder 78 and an upper die engaging portion 80 supported by the hydraulic cylinder 78. The upper die 86, which will be described later, is detachably engaged with the upper die engaging portion 80. When the hydraulic cylinder 78 is operated, the upper die engaging portion 80 presses the upper die 86 downward. In this embodiment, the hydraulic cylinder 78 has a configuration in which a high-pressure cylinder 78A and a low-pressure cylinder 78B are stacked in the vertical direction.

[0030] The setup unit 72 is equipped with an upper die lifting unit 82 that raises and lowers the upper die 86, which will be described later. When this upper die lifting unit 82 is operated, the upper die 86 can be raised and lowered relative to the lower die 84.

[0031] As shown in Figures 11 and 12, the heating and pressing unit transport unit 73 comprises a rotating unit 73A that is rotatable in the vertical direction as an axial direction, and two lower die engaging units 73B fixed to the upper part of the rotating unit 73A. Two heating and pressing units 74, which will be described later, engage with the two lower die engaging units 73B, respectively. When the rotating unit 73A rotates, one of the lower die engaging units 73B moves from the press unit body 70 to the setup unit 72, and the other lower die engaging unit 73B moves from the setup unit 72 to the press unit body 70. As a result, the heating and pressing unit 74 on one of the lower die engaging units 73B moves from the press unit body 70 to the setup unit 72, and the heating and pressing unit 74 on the other lower die engaging unit 73B moves from the setup unit 72 to the press unit body 70. The position on the lower die engagement portion 73B located in the setup section 72 will be referred to as "setup position P1," and the position on the lower die engagement portion 73B located in the press section body 70 will be referred to as "pressure position P2."

[0032] As shown in Figure 13, the two heating and pressing sections 74 have similar configurations. Note that Figure 13 only shows the heating and pressing section 74 located on the press body 70 side. The heating and pressing section 74 comprises a lower die 84, an upper die 86 that engages with the lower die 84, and a receiving jig 88 fixed to the lower die 84.

[0033] The lower mold 84 comprises a lower plate portion 84A fixed to the lower mold engagement portion 73B, and a central projection portion 84B projecting upward from the horizontal center of the lower plate portion 84A. A receiving jig 88, described later, is fixed to the upper surface of the central projection portion 84B. A heater 90 for warming the lower mold 84 is provided on the lower plate portion 84A. Furthermore, an O-ring 92 is attached to the central projection portion 84B. A vacuum path 84C is formed in the lower plate portion 84A and the central projection portion 84B, with one end open to the upper surface of the central projection portion 84B and the other end connected to an air suction portion 76 such as a vacuum pump.

[0034] The upper mold 86 is positioned above the lower mold 84. The upper mold 86 includes an upper plate portion 86A that detachably engages with the upper mold engagement portion 80 and the upper mold lifting portion 82 (see Figure 11), and a peripheral wall portion 86B that protrudes downward from the horizontal end of the upper plate portion 86A. When the upper mold 86 moves toward the lower mold 84, the upper mold 86 engages with the lower mold 84. When the upper mold 86 is engaged with the lower mold 84, the central protrusion 84B of the lower mold 84 is positioned inside the peripheral wall portion 86B of the upper mold 86. As a result, a sealed space 94 surrounding the receiving jig 88 is formed between the upper mold 86 and the lower mold 84. When the upper mold 86 is engaged with the lower mold 84, the gap between the central protrusion 84B of the lower mold 84 and the peripheral wall portion 86B of the upper mold 86 is sealed by an O-ring 92. Furthermore, the upper plate portion 86A is provided with a heater 90 for warming the upper mold 86. In addition, the upper mold 86 has a concentrated pressing portion 86 that protrudes downward from the horizontal center of the upper plate portion 86A.

[0035] Figure 14 shows a plan view of the receiving jig 88 as seen from above. This receiving jig 88 is formed in the shape of a rectangular block. The receiving jig 88 also has a plurality of insertion holes 88A that are open on the top. These plurality of insertion holes 88A correspond to the plurality of heat dissipation parts 14B (see Figure 1) of the substrate 12 and are arranged regularly with predetermined intervals between them. As shown in Figure 15, the substrate 12 is set into the receiving jig 88 with the plurality of heat dissipation parts 14B of the substrate 12 inserted into the plurality of insertion holes 88A. When the substrate 12 is set into the receiving jig 88, the lower surface of the plate-shaped part 14A (the surface that constitutes the bottom surface of the plurality of heat dissipation parts 14B on the substrate 12) is in contact with the upper surface of the receiving jig 88.

[0036] Then, as shown in Figure 16, in the process in the first pressing section 26, first, the substrate 12 that has completed the process in the first preheating section 24 (passed through the heating furnace 68) is set in the heating and pressing section 74 located at the setup position P1. Here, a manipulator (not shown) is activated to move the substrate 12 together with the positioning jig 60, etc., and set the substrate 12 in the receiving jig 88 located at the setup position P1. Next, as shown in Figure 17, the upper die lifting section 82 is activated to engage the upper die 86 with the lower die 84 at the setup position P1 (first insulating layer fixing process). Here, the upper die 86 and the lower die 84 are heated to the temperature determined by the heater 90 mentioned above. Also, in the first insulating layer fixing process, when the upper die 86 is engaged with the lower die 84 at the setup position P1, the air suction section 76 is activated and the air in the sealed space 94 between the upper die 86 and the lower die 84 is sucked out. In other words, a vacuum is drawn from the sealed space 94 between the upper mold 86 and the lower mold 84.

[0037] Next, as shown in Figure 18, the heating and pressurizing unit 74, which is located at the setup position P1, is moved to the pressurizing position P2 by rotating the rotating unit 73A. At this time, the heating and pressurizing unit 74, which is located at the pressurizing position P2, moves to the setup position P1 (second insulating layer fixing step).

[0038] Next, as shown in Figure 19, the upper mold engagement portion 80 is engaged with the upper mold 86, and the upper mold 86 is pressed toward the lower mold 84 at the pressurized position P2, thereby pressing the insulating layer 16 toward the substrate 12. This fixes the insulating layer 16 to the substrate 12 (third insulating layer fixing step). In the third insulating layer fixing step, the state in which the insulating layer 16 is pressed toward the substrate 12 is maintained for a predetermined time. In addition, during the third insulating layer fixing step, the upper mold 86 and the lower mold 84 are heated by the heater 90, and the sealed space 94 between the upper mold 86 and the lower mold 84 is evacuated.

[0039] Simultaneously with (in parallel with) the third insulating layer fixing process, the substrate 12, which has completed the process by the first preheating unit 24 (passed through the heating furnace 68), is set in the heating and pressurizing unit 74 located at the setup position P1. Next, as shown in Figure 20, the upper mold lifting unit 82 is operated to engage the upper mold 86 with the lower mold 84 at the setup position P1 (fourth insulating layer fixing process). In the fourth insulating layer fixing process, when the upper mold 86 is engaged with the lower mold 84 at the setup position P1, the air suction unit 76 is activated to create a vacuum in the sealed space 94 between the upper mold 86 and the lower mold 84.

[0040] Next, as shown in Figure 21, after disengaging the upper mold engagement portion 80 and the upper mold 86, the heating and pressurizing portion 74, which has completed the third insulating layer fixing step, is moved from the pressurizing position P2 to the setup position by rotating the rotating portion 73A. At this time, the heating and pressurizing portion 74, which has completed the fourth insulating layer fixing step, moves from the setup position P1 to the pressurizing position P2 (fifth insulating layer fixing step).

[0041] Next, as shown in Figure 22, the upper mold engagement portion 80 is engaged with the upper mold 86, and the upper mold 86 is pressed toward the lower mold 84 at the pressurized position P2, thereby pressing the insulating layer 16 toward the substrate 12. This fixes the insulating layer 16 to the substrate 12 (sixth insulating layer fixing step).

[0042] Simultaneously with (in parallel with) the sixth insulating layer fixing process, the substrate 12 with the insulating layer 16 fixed is removed from the heating and pressing unit 74 located at the setup position P1. Here, a manipulator (not shown) operates to move the substrate 12 together with the positioning jig 60, etc., and remove the substrate 12 from the receiving jig 88 located at the setup position P1. The substrate 12 removed from the receiving jig 88 is returned together with the positioning jig 60, etc. to the common transport jig 58 on the transport unit 66. Next, the substrate 12 that has completed the process in the first preheating unit 24 (passed through the heating furnace 68) is set in the heating and pressing unit 74 located at the setup position P1 (seventh insulating layer fixing process). In this way, by repeating the first insulating layer fixing process to the seventh insulating layer fixing process, the substrates 12, etc. that have completed the process in the first preheating unit 24 are successively fed into the first press unit 26. The substrates 12, etc. that have been fed into the first press unit 26 are successively sent out for the next process.

[0043] In this embodiment, the first press section 26 of the manufacturing apparatus 10 can perform the fourth insulating layer fixing process simultaneously with the third insulating layer fixing process. Furthermore, the seventh insulating layer fixing process can be performed simultaneously with the sixth insulating layer fixing process. This reduces the waiting time before the process of fixing the substrate 12 and the insulating layer 16. More specifically, when the insulating layer 16 is pressed toward the substrate 12 at the pressurizing position P2, the substrate 12 with the insulating layer 16 fixed can be removed from the heating and pressing section 74 at the setup position P1. Also, when the insulating layer 16 is pressed toward the substrate 12 at the pressurizing position P2, the substrate 12 before the insulating layer 16 is fixed can be set in the heating and pressing section 74 at the setup position P1. Furthermore, when the insulating layer 16 is pressed toward the substrate 12 at pressurized position P2, the substrate 12, etc., before the insulating layer 16 is fixed can be heated by the heaters 90 provided on the upper die 86 and lower die 84, respectively, at the setup position P1. Also, when the insulating layer 16 is pressed toward the substrate 12 at pressurized position P2, vacuum can be drawn from the sealed space 94 formed between the upper die 86 and the lower die 84 at the setup position P1. In this way, in this embodiment, the time during which the substrate 12, etc., which has completed the process in the first preheating section 24 is left waiting before being fed into the first pressing section 26 can be reduced.

[0044] Furthermore, in this embodiment, as shown in Figure 15, the substrate 12 is set in the receiving jig 88 with each of the multiple heat dissipation portions 14B of the substrate 12 inserted into the multiple insertion holes 88A of the receiving jig 88. When the substrate 12 is set in the receiving jig 88, the lower surface of the plate-shaped portion 14A (the surface that constitutes the bottom surface of the multiple heat dissipation portions 14B on the substrate 12) is in contact with the upper surface of the receiving jig 88. As a result, the bottom surfaces of the multiple heat dissipation portions 14B on the substrate 12 can be supported by the upper surface of the receiving jig 88. Consequently, even if a metal substrate 12 having multiple convexly formed heat dissipation portions 14B is used, pressure can be applied to the fixing points of the insulating layer 16.

[0045] Furthermore, in this embodiment, the concentrated pressing portion 86 of the upper mold 86 is inserted into the positioning hole 60A of the positioning jig 60, thereby concentrating pressure on the portion of the plate-shaped portion 14A of the substrate 12 where the insulating layer 16 is placed. This makes it possible to pinpoint and press the portion of the plate-shaped portion 14A of the substrate 12 where the insulating layer 16 is placed.

[0046] Furthermore, in this embodiment, the concentrated pressing portion 86 of the upper mold 86 presses the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed, via the cardboard 64 and the metal plate 62. This makes it possible to uniformly press the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed. In addition, by providing the metal plate 62 between the cardboard 64 and the insulating layer 16 (PET film 52), it is possible to prevent the unevenness of the cardboard 64 from being transferred to the insulating layer 16.

[0047] Furthermore, in this embodiment, the air in the sealed space 94 formed between the lower mold 84 and the upper mold 86 can be sucked out by the air suction unit 76. This allows for faster vacuuming around the fixing points of the insulating layer 16 compared to a configuration in which air from the space outside the lower mold 84 and the upper mold 86 is also sucked out in order to suck out the air in the sealed space 94 formed between the lower mold 84 and the upper mold 86.

[0048] Furthermore, in this embodiment, the substrate 12 and the like are heated during the process in the first preheating section 24. This makes it possible to shorten the time required to heat the substrate 12 and the like during the process in the first pressing section 26.

[0049] Furthermore, all of the processes in the first press section 26 described above may be performed automatically, or some of the processes in the first press section 26 may be performed manually.

[0050] As shown in Figures 3 and 23, the first removal unit 28 removes the positioning jig 60 from the common transport jig 58 that has been sent from the first pressing unit 26. The first removal unit 28 also removes the metal plate 62 and cardboard 64 that are set on the insulating layer 16. All of the processes in the first removal unit 28 may be performed automatically, or some or all of the processes in the first removal unit 28 may be performed manually.

[0051] As shown in Figures 3 and 24, the first cooling unit 30 cools the substrate 12 and the insulating layer 16. As shown in Figure 24, the first cooling unit 30 is equipped with fans 96 located above and below the transport unit 66 that transports the common transport jig 58. In the process in the first cooling unit 30, the common transport jig 58 is transported by the transport unit 66, causing the common transport jig 58 to pass between the upper and lower fans 96. This cools the substrate 12 set on the common transport jig 58 and the insulating layer 16 fixed on the substrate 12.

[0052] As shown in Figures 3 and 25, the first peeling unit 32 removes the PET film 52 from the insulating layer 16. As shown in Figure 25, the first peeling unit 32 includes an adsorption unit 98 for adsorbing the PET film 52 and a nozzle 100 for injecting compressed air between the PET film 52 and the insulating layer 16. In the process in the first peeling unit 32, first, the horizontal center of the PET film 52 is adsorbed by the adsorption unit 98. Next, the adsorption unit 98 is moved while compressed air is injected from the nozzle 100 between the PET film 52 and the insulating layer 16. This peels the PET film 52 from the insulating layer 16. The PET film 52 peeled from the insulating layer 16 is carried by the adsorption unit 98 and discarded in a predetermined container. The entire process in the first peeling unit 32 may be performed automatically, or some or all of the processes in the first peeling unit 32 may be performed manually.

[0053] As shown in Figures 3 and 26, the first inspection unit 34 inspects whether the insulating layer 16 is fixed in a predetermined position on the substrate 12. As shown in Figure 26, the first inspection unit 34 is equipped with a camera 102. In the process in the first inspection unit 34, the images of the substrate 12 and the insulating layer 16 captured by the camera 102 are compared with inspection data to inspect whether the insulating layer 16 is fixed in a predetermined position on the substrate 12. If the inspection result indicates that the insulating layer 16 is fixed in a predetermined position on the substrate 12, the substrate 12 with the insulating layer 16 fixed is transported to the next process. On the other hand, if the inspection result indicates that the insulating layer 16 is not fixed in a predetermined position on the substrate 12, the substrate 12 with the insulating layer 16 fixed is discarded without proceeding to the next process. Note that all processes in the first inspection unit 34 may be performed automatically, or some or all of the processes in the first inspection unit 34 may be performed manually.

[0054] As shown in Figures 4 and 27, the circuit section 18 is attached to the urethane sheet 104 in the circuit section attachment section 36. As shown in Figure 27, the shape and dimensions of the urethane sheet 104 when viewed from the thickness direction are set to correspond to the shape and dimensions of the insulating layer 16. An adhesive layer is formed on one side of the urethane sheet 104 to which the circuit section 18 can be attached. In the process in the circuit section attachment section 36, the circuit section 18 is attached to a predetermined position on the side of the urethane sheet 104 where the adhesive layer is formed. This fixes the circuit section 18 to the urethane sheet 104. Note that all of the processes in the circuit section attachment section 36 may be performed automatically, or some or all of the processes in the circuit section attachment section 36 may be performed manually.

[0055] As shown in Figures 4 and 28, in the second set section 38, the circuit section 18 fixed to the urethane sheet 104 is set on the insulating layer 16 fixed to the substrate 12.

[0056] In the process in the second setting section 38, adhesive is applied to the side of the circuit section 18 opposite to the urethane sheet 104. Alternatively, adhesive is applied to the part of the insulating layer 16 where the circuit section 18 will be fixed. Next, with the side of the circuit section 18 opposite to the urethane sheet 104 facing downwards, the circuit section 18 is set on the insulating layer 16 together with the urethane sheet 104. Next, the cardboard 64 is set on the urethane sheet 104. Note that all of the processes in the second setting section 38 may be performed automatically, or some or all of the processes in the second setting section 38 may be performed manually.

[0057] As shown in Figure 4, the second preheating section 40 heats the substrate 12, the insulating layer 16, and the circuit section 18. The process in the second preheating section 40 is the same as the process in the first preheating section 24. That is, in the process in the second preheating section 40, the common transport jig 58 is transported by the transport section 66, thereby moving the common transport jig 58 within the heating furnace 68 (see Figure 10). This heats the substrate 12, the insulating layer 16, and the circuit section 18, etc., that are set on the common transport jig 58.

[0058] As shown in Figure 4, the second press section 42 presses the circuit section 18, which is set on the insulating layer 16, toward the substrate 12. The process in the second press section 42 uses the press section body 70, setup section 72, heating and pressurizing section transport section 73, two heating and pressurizing sections 74, and air suction section 76 shown in Figures 11 to 14, similar to the process in the first press section 26. Here, each step in the second press section 42 is similar to each step in the first press section 26. Therefore, in explaining each step in the second press section 42, we will use the same diagrams that were used when explaining each step in the first press section 26.

[0059] As shown in Figure 16, in the process in the second press section 42, first, the substrate 12 that has completed the process in the second preheat section 40 (passed through the heating furnace 68) is set in the heating and pressing section 74 located at the setup position P1. Here, a manipulator (not shown) is activated to set the substrate 12 in the receiving jig 88 located at the setup position P1. Next, as shown in Figure 17, the upper die lifting section 82 is activated to engage the upper die 86 with the lower die 84 at the setup position P1 (first circuit section fixing process). Here, the upper die 86 and the lower die 84 are heated to the temperature determined by the heater 90 mentioned above. Also, when the upper die 86 is engaged with the lower die 84 at the setup position P1, the air suction section 76 is activated and the air in the sealed space 94 between the upper die 86 and the lower die 84 is sucked out. That is, a vacuum is created in the sealed space 94 between the upper die 86 and the lower die 84.

[0060] Next, as shown in Figure 18, the heating and pressurizing unit 74, which is located at the setup position P1, is moved to the pressurizing position P2 by rotating the rotating unit 73A. At this time, the heating and pressurizing unit 74, which is located at the pressurizing position P2, moves to the setup position P1 (second circuit unit fixing step).

[0061] Next, as shown in Figure 19, the upper mold engagement portion 80 is engaged with the upper mold 86, and the upper mold 86 is pressed toward the lower mold 84 at the pressurized position P2, thereby pressing the circuit portion 18 set on the insulating layer 16 toward the substrate 12. This fixes the circuit portion 18 to the insulating layer 16 (third circuit portion fixing step). In the third circuit portion fixing step, the state in which the circuit portion 18 is pressed toward the substrate 12 is maintained for a predetermined time. Furthermore, in the third circuit portion fixing step, the circuit portion 18 is pressed toward the substrate 12 at a lower pressure than in the third insulating layer fixing step described above. For example, in the third insulating layer fixing step, only the high-pressure cylinder 78A may be operated, and in the third circuit portion fixing step, only the low-pressure cylinder 78B may be operated. Furthermore, during the third circuit section fixing process, the upper mold 86 and the lower mold 84 are heated by the heater 90, and the sealed space 94 between the upper mold 86 and the lower mold 84 is evacuated.

[0062] Simultaneously with (in parallel with) the third circuit section fixing process, the substrate 12, which has completed the process in the second preheating section 40 (passed through the heating furnace 68), is set in the heating and pressurizing section 74 located at the setup position P1. Next, as shown in Figure 20, the upper mold lifting section 82 is operated to engage the upper mold 86 with the lower mold 84 at the setup position P1 (fourth circuit section fixing process). When the upper mold 86 is engaged with the lower mold 84 at the setup position P1, the air suction section 76 is activated to create a vacuum in the sealed space 94 between the upper mold 86 and the lower mold 84.

[0063] Next, as shown in Figure 21, after disengaging the upper mold engagement portion 80 and the upper mold 86, the heating and pressurizing unit 74, which has completed the third circuit section fixing step, is moved from the pressurizing position P2 to the setup position by rotating the rotating portion 73A. At this time, the heating and pressurizing unit 74, which has completed the fourth circuit section fixing step, moves from the setup position P1 to the pressurizing position P2 (fifth circuit section fixing step).

[0064] Next, as shown in Figure 22, the upper mold engagement portion 80 is engaged with the upper mold 86, and the upper mold 86 is pressed toward the lower mold 84 at the pressurized position P2, thereby pressing the circuit portion 18 set on the insulating layer 16 toward the substrate 12. This fixes the circuit portion 18 to the insulating layer 16 (sixth circuit portion fixing step).

[0065] Simultaneously with (in parallel with) the sixth circuit section fixing process, the substrate 12 with the circuit section 18 fixed on the insulating layer 16 is removed from the heating and pressing section 74 located at the setup position P1. Here, a manipulator (not shown) operates to remove the substrate 12 from the receiving jig 88 located at the setup position P1. The substrate 12 removed from the receiving jig 88 is returned to the common transport jig 58 on the transport section 66. Next, the substrate 12 that has completed the process in the second preheat section 40 (passed through the heating furnace 68) is set in the heating and pressing section 74 located at the setup position P1 (seventh circuit section fixing process). In this way, by repeating the first to seventh circuit section fixing processes, the substrates 12 that have completed the process in the second preheat section 40 are successively fed into the second press section 42. The substrates 12 that have been fed into the second press section 42 are successively sent out for the next process.

[0066] In this embodiment, the second press section 42 of the manufacturing apparatus 10 can perform the fourth circuit section fixing process simultaneously with the third circuit section fixing process. Furthermore, the seventh circuit section fixing process can be performed simultaneously with the sixth circuit section fixing process. This reduces the waiting time before the process of fixing the circuit section 18 and the insulating layer 16. More specifically, when the circuit section 18 is pressed toward the substrate 12 at the pressurizing position P2, the substrate 12 with the circuit section 18 fixed to the insulating layer 16 can be removed from the heating and pressing section 74 at the setup position P1. Also, when the circuit section 18 is pressed toward the substrate 12 at the pressurizing position P2, the substrate 12 with the circuit section 18 set on the insulating layer 16 can be set in the heating and pressing section 74 at the setup position P1. Furthermore, when the circuit section 18 is pressed toward the substrate 12 at pressurized position P2, the substrate 12 with the circuit section 18 set on the insulating layer 16 can be heated by the heaters 90 provided on the upper die 86 and lower die 84, respectively, at the setup position P1. Also, when the circuit section 18 is pressed toward the substrate 12 at pressurized position P2, vacuuming can be performed in the sealed space 94 formed between the upper die 86 and the lower die 84 at the setup position P1. In this way, in this embodiment, the time during which the substrate 12, etc., which has completed the process in the second preheating section 40, is left waiting before being fed into the second pressing section 42 can be reduced.

[0067] Furthermore, in this embodiment, as shown in Figure 29, the substrate 12 is set in the receiving jig 88 with each of the multiple heat dissipation parts 14B of the substrate 12 inserted into the multiple insertion holes 88A of the receiving jig 88. When the substrate 12 is set in the receiving jig 88, the lower surface of the plate-shaped part 14A (the surface that constitutes the bottom surface of the multiple heat dissipation parts 14B on the substrate 12) is in contact with the upper surface of the receiving jig 88. As a result, the bottom surfaces of the multiple heat dissipation parts 14B on the substrate 12 can be supported by the upper surface of the receiving jig 88. Consequently, even if a metal substrate 12 having multiple convexly formed heat dissipation parts 14B is used, pressure can be applied to the fixing points of the circuit part 18.

[0068] Furthermore, in this embodiment, the concentrated pressing portion 86 of the upper mold 86 concentrates its pressure on the portion where the circuit portion 18 is set. This allows for pinpoint pressure on the portion where the circuit portion 18 is set.

[0069] Furthermore, in this embodiment, the concentrated pressing portion 86 of the upper mold 86 presses the portion where the circuit portion 18 is set via the cardboard 64 and the urethane sheet 104. When the urethane sheet 104 is pressed toward the substrate 12 side via the cardboard 64, a part of the urethane sheet 104 comes into contact with the insulating layer 16 and presses the insulating layer 16 toward the downward side. This makes it possible to suppress the bulging of the insulating layer 16 in areas where the circuit portion 18 is not fixed. In addition, any adhesive that seeps out from between the insulating layer 16 and the circuit portion 18 can be absorbed by the urethane sheet 104.

[0070] Furthermore, in this embodiment, the air in the sealed space 94 formed between the lower mold 84 and the upper mold 86 can be sucked out by the air suction unit 76. This allows for faster vacuuming around the fixing points of the circuit unit 18 compared to a configuration in which air from the space outside the lower mold 84 and the upper mold 86 is also sucked out in order to suck out the air in the sealed space 94 formed between the lower mold 84 and the upper mold 86.

[0071] Furthermore, in this embodiment, the substrate 12 and the like are heated during the process in the second preheating section 40. This makes it possible to shorten the time required to heat the substrate 12 and the like during the process in the second pressing section 42.

[0072] Furthermore, all of the processes in the second press section 42 described above may be performed automatically, or some of the processes in the second press section 42 may be performed manually.

[0073] As shown in Figures 4 and 30, the second removal section 44 removes the cardboard 64 set on the urethane sheet 104. Note that all steps in the second removal section 44 may be performed automatically, or some or all steps in the second removal section 44 may be performed manually.

[0074] As shown in Figures 4 and 31, the second cooling section 46 cools the substrate 12, the insulating layer 16, and the circuit section 18. As shown in Figure 31, in the process in the second cooling section 46, the common transport jig 58 is transported by the transport section 66, causing the common transport jig 58 to pass between the upper and lower fans 96. This cools the substrate 12 set on the common transport jig 58, the insulating layer 16 fixed on the substrate 12, and the circuit section 18 fixed on the insulating layer 16.

[0075] As shown in Figures 4 and 32, the second peeling section 48 removes the urethane sheet 104. As shown in Figure 32, the second peeling section 48 is equipped with a gripping section 106 for gripping the urethane sheet 104. In the process in the second peeling section 48, first, the gripping section 106 grips the end of the urethane sheet 104. Next, the gripping section 106, which is gripping the end of the urethane sheet 104, is moved. This peels the urethane sheet 104 away from the circuit section 18 and the insulating layer 16. The urethane sheet 104 that has been peeled away from the circuit section 18 and the insulating layer 16 is carried by the gripping section 106 and discarded in a predetermined container. The entire process in the second peeling section 48 may be performed automatically, or some or all of the processes in the second peeling section 48 may be performed manually.

[0076] As shown in Figures 4 and 33, the second inspection unit 50 inspects whether the circuit unit 18 is fixed in a predetermined position on the substrate 12. As shown in Figure 33, in the process in the second inspection unit 50, the images of the substrate 12, insulating layer 16, and circuit unit 18 captured by the camera 102 are compared with inspection data to inspect whether the circuit unit 18 is fixed in a predetermined position on the substrate 12. If the inspection result indicates that the circuit unit 18 is fixed in a predetermined position on the substrate 12, the substrate 12 with the circuit unit 18 fixed to the insulating layer 16 (circuit board 12) is shipped as a product. On the other hand, if the inspection result indicates that the circuit unit 18 is not fixed in a predetermined position on the substrate 12, the substrate 12 with the circuit unit 18 fixed to the insulating layer 16 (circuit board 12) is discarded without being shipped as a product. Note that all processes in the second inspection unit 50 may be performed automatically, or some or all of the processes in the second inspection unit 50 may be performed manually.

[0077] By going through the processes described above, the circuit board 12 shown in Figures 1 and 2 is manufactured.

[0078] Depending on the configuration of the circuit board 12, the details of the manufacturing apparatus 10 and each process described above may be modified.

[0079] Furthermore, the insulating layer cutting section 20, first setting section 22, first preheating section 24, first pressing section 26, first removal section 28, first cooling section 30, first peeling section 32, and first inspection section 34 shown in Figure 3, and the circuit section attachment section 36, second setting section 38, second preheating section 40, second pressing section 42, second removal section 44, second cooling section 46, second peeling section 48, and second inspection section 50 shown in Figure 4 may be shared equipment, or they may each be provided as independently operated equipment.

[0080] Although one embodiment of the present disclosure has been described above, the present disclosure is not limited to the above, and it is of course possible to implement it in various other forms without departing from its spirit.

[0081] The disclosure of Japanese Patent Application No. 2023-001920, filed on 10 January 2023, is incorporated herein by reference in its entirety.

Claims

1. A manufacturing apparatus for a circuit board, comprising a substrate formed using a metal material, an insulating layer formed in sheet form using an insulating material and fixed on the substrate, and a circuit portion formed using a conductive material and fixed on the insulating layer, A plurality of heating and pressing units, each having a receiving jig on which the substrate is set, a lower mold to which the receiving jig is fixed, an upper mold positioned above the lower mold and engaging with the lower mold to press the insulating layer or the circuit portion toward the substrate, and heaters for heating the upper mold and the lower mold respectively. A heating and pressing unit transport unit moves a plurality of heating and pressing units sequentially between a pressing position in which the upper mold can be pressed toward the lower mold and a setup position in which the substrate can be removed from the receiving jig and the substrate can be set in the receiving jig. A circuit board manufacturing apparatus equipped with the necessary components.

2. The circuit board manufacturing apparatus according to claim 1, further comprising an air suction unit for sucking air from the sealed space between the upper mold and the lower mold.

3. Using the circuit board manufacturing apparatus described in claim 1, The first insulating layer fixing step involves setting the substrate with the insulating layer on it onto the receiving jig of one of the heating and pressing units positioned at the setup position, and engaging the upper mold with the lower mold in the heating and pressing unit. A second insulating layer fixing step involves moving one of the heating and pressing sections to the pressurizing position by the heating and pressing section transport section, and moving the other heating and pressing section to the setup position by the heating and pressing section transport section. A third insulating layer fixing step involves fixing the insulating layer to the substrate by pressing the insulating layer toward the substrate side in the heating and pressurizing section, Simultaneously with the third insulating layer fixing step, a fourth insulating layer fixing step is performed in which the substrate with the insulating layer set on it is set in the receiving jig in another heating and pressing unit, and the upper mold is engaged with the lower mold in another heating and pressing unit. A fifth insulating layer fixing step involves moving one of the heating and pressing sections to the setup position by the heating and pressing section transport section, and moving the other heating and pressing section to the pressurized position by the heating and pressing section transport section. A sixth insulating layer fixing step involves fixing the insulating layer to the substrate by pressing the insulating layer toward the substrate side in another heating and pressurizing section, Simultaneously with the sixth insulating layer fixing step, the seventh insulating layer fixing step involves removing the substrate with the insulating layer fixed in one of the heating and pressing sections from the receiving jig, and setting the substrate with the insulating layer set on it into the receiving jig. A method for manufacturing a circuit board having the following characteristics.

4. Using the circuit board manufacturing apparatus described in claim 1, The first circuit section fixing step involves setting the substrate, with the circuit section set on the insulating layer, onto the receiving jig of one of the heating and pressing sections positioned at the setup location, and engaging the upper mold with the lower mold. A second circuit fixing step involves moving one of the heating and pressing sections to the pressurizing position by the heating and pressing section transport section, and moving the other heating and pressing section to the setup position by the heating and pressing section transport section. A third circuit fixing step involves fixing the circuit to the insulating layer by pressing the circuit towards the substrate side in the heating and pressurizing section, Simultaneously with the third circuit section fixing step, a fourth circuit section fixing step is performed in which the substrate, with the circuit section set on the insulating layer in another heating and pressing section, is set in the receiving jig, and the upper mold is engaged with the lower mold. A fifth circuit section fixing step involves moving one of the heating and pressing sections to the setup position by the heating and pressing section transport section, and moving the other heating and pressing section to the pressurized position by the heating and pressing section transport section. A sixth circuit fixing step involves fixing the circuit to the insulating layer by pressing the circuit towards the substrate side in another heating and pressing section, Simultaneously with the sixth circuit section fixing step, the seventh circuit section fixing step involves removing the substrate, in which the circuit section is fixed on the insulating layer, from the receiving jig in one of the heating and pressing sections, and setting the substrate, in which the circuit section is set on the insulating layer, back into the receiving jig. A method for manufacturing a circuit board having the following characteristics.

5. Using the circuit board manufacturing apparatus described in claim 2, In the first insulating layer fixing step, after engaging the upper mold with the lower mold, the air in the sealed space between the upper mold and the lower mold is sucked out by the air suction unit. The method for manufacturing a circuit board according to claim 3, wherein, after engaging the upper mold with the lower mold in the fourth insulating layer fixing step, the air in the sealed space between the upper mold and the lower mold is sucked out by the air suction unit.

6. Using the circuit board manufacturing apparatus described in claim 2, In the first circuit section fixing step, after engaging the upper mold with the lower mold, the air in the sealed space between the upper mold and the lower mold is sucked out by the air suction unit. The method for manufacturing a circuit board according to claim 4, wherein, after engaging the upper mold with the lower mold in the fourth circuit section fixing step, the air in the sealed space between the upper mold and the lower mold is sucked out by the air suction unit.

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