Display device and method for manufacturing a display device

Abstract

To provide a display device.SOLUTION: A display device comprises: a plurality of display modules; and a frame for supporting the plurality of display modules, in which the plurality of display modules are arranged in the frame in the form of an M*N matrix. The frame includes a frame panel having a first side and a second side opposite the first side. The frame panel includes: an insertion portion which penetrates the frame panel and includes a first opening formed on the first side and a second opening formed on the second side, and in which the size of the first opening is greater than the size of the second opening; and a stud provided in the insertion portion.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a display device that combines modules with light-emitting elements mounted on a substrate to display images, and a method for manufacturing the display device.

Background Art

[0002] A display device is a type of output device that visually displays data information such as characters and graphics, and images.

[0003] Generally, as display devices, a liquid crystal panel (Liquidcrystal panel) that requires a backlight, and an OLED (Organic Light-Emitting Diode) panel made of a film of an organic compound that emits light by itself in response to an electric current have been mainly used. However, a liquid crystal panel has problems such as a slow response time, high power consumption, inability to emit light by itself, and difficulty in downsizing due to the need for a backlight. In addition, an OLED panel can emit light by itself, so it does not require a backlight and can be made thin. However, if the same screen is displayed for a long time, it is vulnerable to the burn-in (deterioration) phenomenon in which a specific part of the previous screen remains as it is even if the sub-pixels reach the end of their lifespan and the screen changes.

[0004] Therefore, as a new panel to replace these, a micro light-emitting diode (micro LED or μLED) display panel that mounts inorganic light-emitting elements on a substrate and uses the inorganic light-emitting elements themselves as pixels has been studied.

[0005] A micro light-emitting diode display panel (hereinafter, micro LED panel) is one of flat display panels, and is composed of a plurality of inorganic light-emitting diodes (inorganic LED) each having a size of 100 μm or less.

[0006] These LED panels are also self-emissive, but because they are inorganic light-emitting elements, they do not experience the burn-in phenomenon seen in OLEDs, and they excel in brightness, resolution, power consumption, and durability. [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] Compared to liquid crystal display (LCD) panels that require a backlight, micro-LED display panels offer better contrast, response time, and energy efficiency. Both organic light-emitting diodes (organic LEDs) and micro-LEDs (inorganic light-emitting diodes) are energy-efficient, but micro-LEDs have higher brightness, luminous efficiency, and a longer lifespan than OLEDs.

[0008] Furthermore, by arranging LEDs on a circuit board at a pixel-by-pixel level, it becomes possible to manufacture display modules on a board-by-board basis, making it easy to produce them in a variety of resolutions and screen sizes to meet consumer orders. [Means for solving the problem]

[0009] A display device according to the concept of the present invention includes a plurality of display modules and a frame supporting the plurality of display modules, wherein the plurality of display modules are arranged in an M*N matrix on the frame, the frame includes a frame panel having a first side and a second side opposite to the first side, the frame panel includes an insertion portion that penetrates the frame panel and includes a first opening formed on the first side and a second opening formed on the second side, the size of the first opening being larger than the size of the second opening, and a stud provided in the insertion portion.

[0010] The insertion portion may be provided such that the first opening and the second opening form a step.

[0011] The insertion portion may be provided in a tapered shape from the first side to the second side.

[0012] The stud may include a coupling portion having an opening toward the second opening, and the coupling portion may include threads formed on its inner circumferential surface.

[0013] The display device may further include a bracket detachably coupled to the stud through the second opening, the bracket including at least one of a mounting bracket, a chassis bracket, a reinforcing bracket, and a board bracket.

[0014] The frame may further include reinforcing members attached to the first side of the frame panel and provided to cover the first opening.

[0015] The plurality of display modules can be attached to the reinforcing member.

[0016] The frame panel may further include a first metal layer forming the first side of the frame panel, a second metal layer forming the second side of the frame panel, and a resin layer disposed between the first metal layer and the second metal layer.

[0017] The size of a portion of the insertion part formed in the resin layer may be the same as the size of another portion of the insertion part formed in the first metal layer.

[0018] The surface formed on the first side and the surface formed on the second side may each be flat.

[0019] In another embodiment, a method for manufacturing a display device according to the concept of the present invention provides a frame panel having a first side and a second side opposite to the first side, and includes an insertion portion that penetrates the frame panel, which includes a first opening formed on the first side and a second opening formed on the second side, wherein the size of the first opening is larger than the size of the second opening, a stud is inserted into the insertion portion through the first opening, and a bracket is detachably coupled to the stud through the second opening.

[0020] Forming the insertion portion may include forming the insertion portion such that the first opening and the second opening are stepped.

[0021] The formation of the insertion portion may include forming the insertion portion in a tapered shape from the first side to the second side.

[0022] The stud includes a coupling portion having an opening toward the second opening, and the coupling portion may include threads formed on the inner circumferential surface of the coupling portion.

[0023] The method for manufacturing the display device allows for the attachment of a reinforcing member to the first side of the frame panel after inserting the stud into the insertion portion.

[0024] The method for manufacturing the display device allows for the formation of module openings in the frame panel and the reinforcing member after attaching the reinforcing member to the first side of the frame panel.

[0025] The method for manufacturing the display device allows for the attachment of multiple display modules to the reinforcing member after the module opening has been formed.

[0026] The bracket may include at least one of a mounting bracket, a chassis bracket, a reinforcing bracket, and a board bracket.

[0027] Forming the insertion part can include forming the insertion part from the first side using at least one of a shaping device, a water jet, and a laser.

[0028] Each of the surface formed on the first side and the surface formed on the second side may be flat.

Advantages of the Invention

[0029] According to various embodiments, the display device can improve the pulling force or torque resistance of the frame for a plurality of display modules.

[0030] According to various embodiments, since the surface formed on the first side of the frame panel is flat without protruding portions, a flat surface for tiling a plurality of display modules attached to the front surface of the frame can be secured.

Brief Description of the Drawings

[0031] [Figure 1] A display device according to an embodiment of the present invention is shown.

[0032] [Figure 2] The main configuration of the display device shown in FIG. 1 is shown disassembled.

[0033] [Figure 3] An enlarged cross-section of a partial configuration of one display module of the display device shown in FIG. 1 is shown.

[0034] [Figure 4] The rear surface of one display module of the display device shown in FIG. 1 is shown.

[0035] [Figure 5] The frame shown in FIG. 2 and a bracket coupled to the rear side of the frame are shown.

[0036] [Figure 6] Figure 5 shows a cross-section along the line A-A'.

[0037] [Figure 7] A magnified view of section E shown in Figure 6 is provided.

[0038] [Figure 8] Figure 5 shows a cross-section along the line B-B'.

[0039] [Figure 9] Figure 5 shows a cross-section along the line C-C'.

[0040] [Figure 10] Figure 5 shows a cross-section along the line D-D'.

[0041] [Figure 11] Figure 5 shows the frame panel installed.

[0042] [Figure 12] Figure 11 shows the state in which a stud is inserted into the insertion part of the frame panel shown.

[0043] [Figure 13] Another embodiment of the frame panel insertion section shown in Figure 12 is presented.

[0044] [Figure 14] Figure 12 shows the frame panel with the reinforcing members attached.

[0045] [Figure 15] Figure 14 shows the frame with a module opening formed in it.

[0046] [Figure 16] Figure 15 shows the bracket attached to the frame shown. [Modes for carrying out the invention]

[0047] Additional aspects of this disclosure are partially described in the following description, partially evident from the description, or can be learned through the implementation of this disclosure.

[0048] The embodiments described herein are merely the most preferred embodiments of the present invention and do not represent the entire technical concept of the invention. It should be understood that a variety of equivalents or modifications that can substitute for them at the time of filing are also included within the scope of the present invention.

[0049] A singular expression used in a description may include multiple expressions unless the context clearly indicates otherwise. In drawings, the shape and size of elements may be exaggerated for illustrative purposes.

[0050] In this specification, terms such as "includes" or "has" are intended to indicate the presence of features, numbers, stages, operations, components, parts, or combinations thereof as described in the specification, and should be understood not to preemptively exclude the existence or possibility of adding one or more other features, numbers, stages, operations, components, parts, or combinations thereof.

[0051] Furthermore, in this specification, the term "identical" includes items that are similar in attributes or similar within a certain range. Additionally, "identical" means "substantial identical." The meaning of "substantial identical" should be understood as including numerical values ​​that fall within the manufacturing tolerance range or numerical values ​​that differ from a standard value within a range that has no meaning.

[0052] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0053] Figure 1 shows a display device according to one embodiment of the present invention. Figure 2 shows an exploded view of the main components of the display device shown in Figure 1. Figure 3 shows an enlarged cross-section of a part of one display module of the display device shown in Figure 1. Figure 4 shows the rear view of one display module of the display device shown in Figure 1.

[0054] The multiple inorganic light-emitting elements 50 and some components of the display device 1 shown in the drawings are micro-scale components with sizes ranging from a few micrometers to several hundred micrometers. For the sake of explanation, the scale of some components (multiple inorganic light-emitting elements 50, black matrix 48, etc.) has been exaggerated.

[0055] Display device 1 is a device that displays information, materials, data, etc., in the form of characters, figures, graphs, images, etc., and can be implemented as a TV, PC, mobile device, or digital signage.

[0056] According to embodiments of the present invention, as shown in Figures 1 and 2, the display device 1 may include a display panel 20 for displaying images, a power supply device (not shown) for supplying power to the display panel 20, a main board 25 for controlling the overall operation of the display panel 20, a frame 100 for supporting the display panel 20, and a rear cover 10 for covering the rear surface of the frame 100.

[0057] The display panel 20 may include a plurality of display modules 30A-30w, a drive board (not shown) for driving each of the display modules 30A-30w, and a TOCN board (Timing controller board) for generating timing signals necessary for controlling each of the display modules 30A-30w.

[0058] The rear cover 10 can support the display panel 20. The rear cover 10 can be mounted on the floor via a stand (not shown) or mounted on a wall via a hanger (not shown) or the like.

[0059] Multiple display modules 30A-30w can be arranged vertically and horizontally so as to be adjacent to each other. Multiple display modules 30A-30w can be arranged in an M*N matrix configuration. In this embodiment, 16 multiple display modules 30A-30w are provided and arranged in a 7*7 matrix configuration, but there are no restrictions on the number of multiple display modules 30A-30w or the arrangement method.

[0060] Multiple display modules 30A-30w can be mounted on the frame 100. The multiple display modules 30A-30w can be mounted on the frame 100 by various known methods such as magnetic force using magnets, mechanical clamping structures, or adhesive bonding. A rear cover 10 is attached to the rear of the frame 100, and the rear cover 10 can form the rear view of the display device 1.

[0061] The rear cover 10 may be made of a metal material. This allows heat generated from the multiple display modules 30A-30w and the frame 100 to be easily conducted to the rear cover 10, thereby increasing the heat dissipation efficiency of the display device 1.

[0062] Thus, the display device 1 according to the embodiment of the present invention can realize a large screen by tiling a plurality of display modules 30A-30w.

[0063] Unlike the embodiments of the present invention, in the plurality of display modules 30A-30w, each individual display module can be applied to a display device. That is, the display modules 30A-30w can be installed and applied as a single unit to wearable devices, portable devices, handheld devices, and various electronic products and electrical equipment that require displays, and can be applied to display devices such as PC (personal computer) monitors, high-resolution TVs and signage, and electronic display boards through multiple assembly arrangements in a matrix type, as in the embodiments of the present invention.

[0064] Multiple display modules 30A-30w can have identical configurations. Therefore, the description of any one of the display modules described below can be applied equally to all the other display modules.

[0065] Taking the first display module 30A as an example among the multiple display modules 30A-30w, the first display module 30A may be formed in a quadrangular (quadrangle type) shape. The first display module 30A may be provided in a rectangular (rectangle type) or square (square type) shape.

[0066] Therefore, the first display module 30A can include edges 31, 32, 33, and 34 formed in the up, down, left, and right directions with respect to the first direction X, which is forward.

[0067] As shown in Figure 3, each of the multiple display modules 30A-30w may include a substrate 40 and multiple inorganic light-emitting elements 50 mounted on the substrate 40. The multiple inorganic light-emitting elements 50 may be mounted on the mounting surface 41 of the substrate 40 facing the first direction X. In Figure 3, the thickness of the substrate 40 in the first direction X is exaggerated for illustrative purposes.

[0068] The substrate 40 can be formed in a quadrangular shape. As described above, the multiple display modules 30A-30w can each be provided in a quadrangular shape, and the substrate 40 can be formed in a quadrangular shape to correspond to them.

[0069] The substrate 40 may be provided in a rectangular or square shape.

[0070] Therefore, taking the first display module 30A as an example, the substrate 40 can include four edges corresponding to the edges 31, 32, 33, and 34 of the first display module 30A, which are formed in the up, down, left, and right directions with respect to the first direction X, which is forward.

[0071] The substrate 40 may include a base substrate 42, a mounting surface 41 forming one side of the base substrate 42, a rear surface 43 forming the other side of the base substrate 42 and positioned opposite the mounting surface 41, and a side surface 45 positioned between the mounting surface 41 and the rear surface 43.

[0072] The substrate 40 may include a TFT layer (Thin Film Transistor, 44) formed on a base substrate 42 to drive the inorganic light-emitting element 50. The base substrate 42 may include a glass substrate. That is, the substrate 40 may include a COG (Chip on Glass) type substrate. The substrate 40 may have first and second pad electrodes 44a and 44b formed thereon, which are provided so that the inorganic light-emitting element 50 is electrically connected to the TFT layer 44.

[0073] The TFTs (Thin Film Transistors) constituting the TFT layer 44 are not limited to a specific structure or type, but can be composed of a variety of embodiments. That is, the TFTs in the TFT layer 44 according to one embodiment of the present invention can be made not only of LTPS (Low Temperature Poly Silicon) TFTs, oxide TFTs, and Si (polysilicon or a-silicon) TFTs, but also of organic TFTs, graphene TFTs, and the like.

[0074] Furthermore, when the base substrate 42 of the substrate 40 is made of a silicon wafer, the TFT layer 44 can be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type, n-type MOSFET, or p-type MOSFET transistor.

[0075] Multiple inorganic light-emitting elements 50 are formed from inorganic materials and may include inorganic light-emitting elements having dimensions of several μm to tens of μm in width, length, and height. Micro-inorganic light-emitting elements may have a shorter side of 100 μm or less. That is, the inorganic light-emitting elements 50 can be picked up from a wafer made of sapphire or silicon and directly transferred onto the substrate 40. Multiple inorganic light-emitting elements 50 can be picked up and transferred using an electrostatic method with an electrostatic head or a stamping method using an elastic polymer material such as PDMS or silicone as the head.

[0076] The multiple inorganic light-emitting elements 50 may be light-emitting structures comprising an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57b.

[0077] Although not shown in the drawings, one of the first contact electrode 57a and the second contact electrode 57b may be electrically connected to the n-type semiconductor 58a, and the other may be electrically connected to the p-type semiconductor 58b.

[0078] The first contact electrode 57a and the second contact electrode 57b may be arranged horizontally and in the same direction (opposite direction to the direction of light emission) in a flip-chip configuration.

[0079] When the inorganic light-emitting element 50 is mounted on the mounting surface 41, it has a light-emitting surface 54 facing a first direction X, a side surface 55, and a bottom surface 56 facing the opposite side of the light-emitting surface 54, and a first contact electrode 57a and a second contact electrode 57b may be formed on the bottom surface 56.

[0080] In other words, the first and second contact electrodes 57a and 57b of the inorganic light-emitting element 50 are positioned on the opposite side of the light-emitting surface 54, thereby being positioned on the opposite side of the direction in which light is irradiated.

[0081] The first and second contact electrodes 57a and 57b are arranged facing the mounting surface 41 and are provided to be electrically connected to the TFT layer 44. A light-emitting surface 54 may be provided that irradiates light in the direction opposite to the direction in which the first and second contact electrodes 57a and 57b are arranged.

[0082] Therefore, when light generated from the active layer 58c is irradiated in the first direction X through the light-emitting surface 54, the light can be irradiated in the first direction X without interference from the first contact electrode 57a or the second contact electrode 57b.

[0083] In other words, the first direction X can be defined as the direction in which the light-emitting surface 54 is positioned to emit light.

[0084] The first contact electrode 57a and the second contact electrode 57b can be electrically connected to the first pad electrode 44a and the second pad electrode 44b formed on the mounting surface 41 of the substrate 40, respectively.

[0085] The inorganic light-emitting element 50 can be directly connected to the pad electrodes 44a and 44b through an anisotropic conductive layer 47 or a junction configuration such as solder.

[0086] An anisotropic conductive layer 47 may be formed on the substrate 40 to mediate the electrical connection between the contact electrodes 57a, 57b and the pad electrodes 44a, 44b. The anisotropic conductive layer 47 may have a structure in which anisotropic conductive adhesive is attached to a protective film and conductive balls 47a are scattered in the adhesive resin. The conductive balls 47a are conductive spheres surrounded by a thin insulating film, and under pressure, the insulating film cracks, allowing the conductors to be electrically connected to each other.

[0087] The anisotropic conductive layer 47 may include an anisotropic conductive film (ACF) in film form and an anisotropic conductive paste (ACP) in paste form.

[0088] Therefore, when multiple inorganic light-emitting elements 50 are mounted on a substrate 40, if pressure is applied to the anisotropic conductive layer 47, the insulating film of the conductive ball 47a may crack, allowing the contact electrodes 57a and 57b of the inorganic light-emitting elements 50 to be electrically connected to the pad electrodes 44a and 44b of the substrate 40.

[0089] However, although not shown in the drawings, multiple inorganic light-emitting elements 50 may be mounted on the substrate 40 via solder (not shown) instead of the anisotropic conductive layer 47. After the inorganic light-emitting elements 50 are aligned on the substrate 40, they can be bonded to the substrate 40 through a reflow process.

[0090] Multiple inorganic light-emitting elements 50 may include a red light-emitting element 51, a green light-emitting element 52, and a blue light-emitting element 53. The inorganic light-emitting elements 50 can be mounted on the mounting surface 41 of the substrate 40 as a single unit consisting of a series of red light-emitting elements 51, green light-emitting elements 52, and blue light-emitting elements 53. The series of red light-emitting elements 51, green light-emitting elements 52, and blue light-emitting elements 53 can form a single pixel. In this case, the red light-emitting element 51, green light-emitting element 52, and blue light-emitting element 53 can each form a subpixel.

[0091] The red light-emitting element 51, the green light-emitting element 52, and the blue light-emitting element 53 may be arranged in a line at predetermined intervals as in the embodiment of the present invention, or they may be arranged in a different shape, such as a triangular shape.

[0092] The substrate 40 may include a light-absorbing layer 44c to absorb ambient light and improve contrast. The light-absorbing layer 44c may be formed on the overall mounting surface 41 side of the substrate 40. The light-absorbing layer 44c may be formed between the TFT layer 44 and the anisotropic conductive layer 47.

[0093] Multiple display modules 30A-30w may further include a black matrix 48 formed between multiple inorganic light-emitting elements 50.

[0094] The black matrix 48 can complement the light-absorbing layer 44c formed on the mounting surface 41 of the substrate 40. That is, the black matrix 48 can improve screen contrast by absorbing ambient light, making the substrate 40 appear black.

[0095] Black Matrix 48 can have the color black.

[0096] In this embodiment, the black matrix 48 is formed to be positioned between pixels formed by a series of red light-emitting elements 51, green light-emitting elements 52, and blue light-emitting elements 53. However, unlike this embodiment, the black matrix may be formed more densely to demarcate each of the subpixel light-emitting elements 51, 52, and 53.

[0097] The black matrix 48 can be formed in a grid shape having horizontal and vertical patterns arranged between pixels.

[0098] The black matrix 48 can be formed by applying a light-absorbing ink onto the anisotropic conductive layer 47 through an inkjet process and then curing it, or by coating the anisotropic conductive layer 47 with a light-absorbing film.

[0099] In other words, in the anisotropic conductive layer 47 formed on the entire mounting surface 41, a black matrix 48 can be formed between multiple inorganic light-emitting elements 50 that are not mounted.

[0100] Each of the multiple display modules 30A-30w may include a front cover 49 positioned on the mounting surface 41 in a first direction X so as to cover the mounting surface 41 of each of the multiple display modules 30A-30w.

[0101] The front cover 49 may be provided in multiple configurations such that it is formed on each of the multiple display modules 30A-30w in a first direction X.

[0102] The front cover 49 may include a film (not shown).

[0103] The film (not shown) of the front cover 49 may be provided with a functional film having optical properties.

[0104] The front cover 49 is provided to cover the substrate 40 and protect the substrate 40 from external forces.

[0105] Typically, the adhesive layer (not shown) of the front cover 49 may be provided to have a height of a predetermined or greater in the first direction X toward the mounting surface 41 or the light-emitting surface 54. This is to sufficiently fill any gaps that may be formed between the front cover 49 and the plurality of inorganic light-emitting elements 50 when the front cover 49 is placed on the substrate 40.

[0106] Each of the multiple display modules 30A-30w may include a heat dissipation member 60 on the rear surface 43 of the substrate 40 to dissipate heat generated from the substrate 40.

[0107] The heat generated from the substrate 40 may include heat generated from various components. Of the various types of heat generated from the substrate 40 and transferred to the rear surface 43, the heat that accounts for the largest proportion is the heat generated when the multiple inorganic light-emitting elements 50 emit light. However, in addition to this, heat is also generated from multiple components placed on the mounting surface 41 of the substrate 40, such as the TFT layer 44, and the heat generated from these multiple components may flow into the substrate 40.

[0108] Furthermore, heat can be transferred to the substrate 40 from the outside of the substrate 40, and heat can be transferred to the substrate 40 through the external structure of the substrate 40, allowing heat to be generated from the substrate 40.

[0109] The heat generated from the substrate 40 described below refers to the heat that flows into the substrate 40 from multiple components arranged on the substrate 40, which includes multiple inorganic light-emitting elements 50.

[0110] In particular, as described above, the heat generated from the multiple inorganic light-emitting elements 50 flows most heavily into the substrate 40, and the heat that accounts for the largest proportion of the heat generated from the substrate 40 is the heat generated from the multiple inorganic light-emitting elements 50. However, as described above, it can also be said that heat is generated from the substrate 40 due to various components other than the multiple inorganic light-emitting elements 50 and heat generated from outside the substrate 40. Furthermore, each of the multiple display modules 30A-30w may include adhesive tape 70 that is placed between the rear surface 43 of the substrate 40 and the heat dissipation member 60 so as to bond the rear surface 43 of the substrate 40 to the heat dissipation member 60.

[0111] Multiple inorganic light-emitting elements 50 can be electrically connected to pixel drive wiring (not shown) formed on the mounting surface 41 and to an upper wiring layer (not shown) that extends through the side surface 45 of the substrate 40 and is formed by pixel drive wiring (not shown).

[0112] The top wiring layer (not shown) can be electrically connected to side wiring (not shown) formed on the side surface 45 of the substrate 40. The side wiring (not shown) can be provided in the form of a thin film.

[0113] The top wiring layer (not shown) can be connected to the side wiring (not shown) by top connecting pads (not shown) formed on the edge side of the substrate 40.

[0114] Side wiring (not shown) can be extended along the side surface 45 of the substrate 40 and connected to a rear wiring layer 43b formed on the rear surface 43.

[0115] An insulating layer 43c covering the rear wiring layer 43b may be formed on the rear wiring layer 43b in the direction facing the rear surface of the substrate 40.

[0116] In other words, multiple inorganic light-emitting elements 50 can be sequentially electrically connected to an upper wiring layer (not shown), a side wiring layer (not shown), and a rear wiring layer 43b.

[0117] Furthermore, as shown in Figure 4, the display module 30A may include a drive circuit board 80 provided for electrically controlling a plurality of inorganic light-emitting elements 50 mounted on the mounting surface 41. The drive circuit board 80 may be formed from a printed circuit board. The drive circuit board 80 may be positioned on the rear surface 43 of the substrate 40 in a first direction X. It may be positioned on a heat dissipation member 60 bonded to the rear surface 43 of the substrate 40.

[0118] The display module 30A may include a flexible film 81 that connects the drive circuit board 80 to the rear wiring layer 43b so that the drive circuit board 80 is electrically connected to the plurality of inorganic light-emitting elements 50.

[0119] One end of the flexible film 81 can be connected to a rear connecting pad 43d, which is positioned on the rear surface 43 of the substrate 40 and electrically connected to a plurality of inorganic light-emitting elements 50.

[0120] The rear connecting pad 43d can be electrically connected to the rear wiring layer 43b. This allows the rear connecting pad 43d to electrically connect the rear wiring layer 43b to the flexible film 81.

[0121] The flexible film 81 is electrically connected to the rear connecting pad 43d, thereby enabling it to transmit power and electrical signals from the drive circuit board 80 to the multiple inorganic light-emitting elements 50.

[0122] The flexible film 81 may be formed from FFC (Flexible Flat Cable) or COF (Chip On Film), etc.

[0123] The flexible film 81 may include a first flexible film 81a and a second flexible film 81b, which are positioned vertically with respect to a first direction X which is forward.

[0124] The first and second flexible films 81a and 81b are not limited to those provided herein and may be arranged in the left-right direction with respect to the first direction X, or they may be arranged in at least two of the up, down, left, and right directions, respectively.

[0125] The second flexible film 81b may be provided in multiple units. However, it is not limited to this, and the second flexible film 81b may be provided as a single unit, and the first flexible film 81a may also be provided in multiple units.

[0126] The first flexible film 81a can transmit data signals from the drive circuit board 80 to the substrate 40. The first flexible film 81a may be provided as COF.

[0127] The second flexible film 81b can transmit power from the drive circuit board 80 to the board 40. The second flexible film 81b may be provided as an FFC.

[0128] However, the first and second flexible films 81a and 81b may be formed opposite to each other, without limitation.

[0129] The drive circuit board 80, although not shown in the drawings, can be electrically connected to the main board 25 (see Figure 2). The main board 25 may be located on the rear side of the frame 100, and the main board 25 can be connected to the drive circuit board 80 from the rear of the frame 100 via a cable (not shown).

[0130] As described above, the heat dissipation member 60 may be provided so as to be in contact with the substrate 40. The heat dissipation member 60 and the substrate 40 can be bonded together by adhesive tape 70 placed between the rear surface 43 of the substrate 40 and the heat dissipation member 60.

[0131] The heat dissipation member 60 may be made of a material with high thermal conductivity, or it may be implemented in a configuration with high thermal conductivity. For example, the heat dissipation member 60 may be made of aluminum.

[0132] The heat generated from the multiple inorganic light-emitting elements 50 and the TFT layer 44 mounted on the substrate 40 can be transferred to the heat dissipation member 60 via the adhesive tape 70 along the rear surface 43 of the substrate 40.

[0133] This allows heat generated from the substrate 40 to be easily transferred to the heat dissipation member 60, preventing the substrate 40 from rising above a certain temperature.

[0134] Multiple display modules 30A-30w can be arranged in various positions in an M*N matrix configuration. Each display module 30A-30w is provided to be individually movable. In this case, each display module 30A-30w can maintain a constant level of heat dissipation performance regardless of its position by individually including a heat dissipation member 60.

[0135] Multiple display modules 30A-30w can form screens of various sizes for the display device 1 in a matrix configuration of various M*N. This allows each display module 30A-30w to include an independent heat dissipation member 60, as in one embodiment of the present invention, to dissipate heat individually, rather than through a single heat dissipation member provided for heat dissipation, thereby improving the overall heat dissipation performance of the display device 1.

[0136] When a single heat dissipation member is placed inside the display device 1, a portion of the heat dissipation member does not necessarily have to be placed in a position corresponding to the position where some display modules are placed, with reference to the front-to-back direction, and the heat dissipation member may be placed in a position where no display modules are placed, which can reduce the heat dissipation efficiency of the display device 1.

[0137] In other words, since each display module 30A-30w can dissipate heat through its own heat dissipation member 60, regardless of its position, the overall heat dissipation performance of the display device 1 can be improved.

[0138] The heat dissipation member 60 may be provided in a rectangular shape that generally corresponds to the shape of the substrate 40.

[0139] The area of ​​the substrate 40 may be at least the same as or larger than the area of ​​the heat dissipation member 60. When the substrate 40 and the heat dissipation member 60 are arranged side by side in the first direction X, the four edges of the rectangular substrate 40 may be formed to correspond to the four edges of the heat dissipation member 60 with respect to the centers of the substrate 40 and the heat dissipation member 60, or they may be positioned further outward than the four edges of the heat dissipation member 60 with respect to the centers of the substrate 40 and the heat dissipation member 60.

[0140] The four edges of the substrate 40 may be positioned outside the four edges of the heat dissipation member 60. In other words, the area of ​​the substrate 40 may be larger than the area of ​​the heat dissipation member 60.

[0141] This is because, when heat is transferred to each of the display modules 30A-30w, the substrate 40 and the heat dissipation member 60 may expand due to heat. However, since the heat dissipation member 60 has a higher thermal expansion rate than the substrate 40, the amount by which the heat dissipation member 60 expands is higher than the amount by which the substrate 40 expands.

[0142] In this case, when the four edges of the substrate 40 are positioned inward or inward from the four edges of the heat dissipation member 60, the edges of the heat dissipation member 60 may protrude outward from the substrate 40.

[0143] As a result, the gap length formed between each display module 30A-30w may be irregularly formed due to the thermal expansion of the heat dissipation member 60 of each display module 30A-30w, which may increase the visibility of some seams and reduce the sense of unity of the display panel 20 screen.

[0144] However, when the four edges of the substrate 40 are positioned outside the four edges of the heat dissipation member 60, even if the substrate 40 and the heat dissipation member 60 expand due to heat, the heat dissipation member 60 will not protrude beyond the four edges of the substrate 40, thereby maintaining a constant gap length between each of the display modules 30A-30w.

[0145] According to one embodiment of the present invention, the area of ​​the substrate 40 and the area of ​​the heat dissipation member 60 can be arranged to be roughly corresponding. This allows the heat generated from the substrate 40 to be dissipated uniformly over the entire area of ​​the substrate 40, rather than being isolated in a part of the substrate 40.

[0146] The heat dissipation member 60 may be provided so as to be adhered to the rear surface 43 of the substrate 40 by adhesive tape 70.

[0147] The adhesive tape 70 may be provided in a size corresponding to the heat dissipation member 60. That is, the area of ​​the adhesive tape 70 may be provided to correspond to the area of ​​the heat dissipation member 60. The heat dissipation member 60 may be provided in a roughly rectangular shape, and the adhesive tape 70 may be provided in a rectangular shape to correspond to it.

[0148] The edges of the rectangular heat dissipation member 60 and the adhesive tape 70 can be formed to correspond to each other, with the center of the heat dissipation member 60 and the adhesive tape 70 as the reference point.

[0149] As a result, the heat dissipation member 60 and the adhesive tape 70 can be easily manufactured with a single bonding configuration, which can increase the overall manufacturing efficiency of the display device 1.

[0150] In other words, when the heat dissipation members 60 are cut in unit quantities from a single plate, the adhesive tape 70 is first adhered to the plate before the heat dissipation members 60 are cut, and the adhesive tape 70 and the heat dissipation members 60 are cut simultaneously in unit quantities, resulting in a reduction in the number of steps involved.

[0151] The heat generated from the substrate 40 can be transferred to the heat dissipation member 60 through the adhesive tape 70. Thus, the adhesive tape 70 can be configured to adhere the heat dissipation member 60 to the substrate 40 while simultaneously transferring the heat generated from the substrate 40 to the heat dissipation member 60.

[0152] This allows the adhesive tape 70 to contain a material with high heat dissipation performance.

[0153] The adhesive tape 70 may include an adhesive material for bonding the substrate 40 and the heat dissipation member 60.

[0154] The adhesive tape 70 may include a material with higher heat dissipation performance than materials with general adhesive properties. This allows heat to be efficiently transferred between the substrate 40 and the heat dissipation member 60 to their respective components.

[0155] Furthermore, the adhesive material of the adhesive tape 70 can be made of a material with higher heat dissipation performance than the adhesive material that makes up a general adhesive.

[0156] Materials with high heat dissipation performance are those that have high thermal conductivity, high heat transfer properties, and low specific heat, allowing them to effectively transfer heat.

[0157] For example, the adhesive tape 70 may include graphite material. However, it is not limited to this, and the adhesive tape 70 may be made of a material that generally has high heat dissipation performance.

[0158] The flexibility of the adhesive tape 70 can be set to be greater than the flexibility of the substrate 40 and the flexibility of the heat dissipation member 60. Therefore, the adhesive tape 70 can be made of a material that has adhesive properties, heat dissipation properties, and high flexibility. The adhesive tape 70 can be formed as an inorganic double-sided tape. When the adhesive tape 70 is formed as an inorganic double-sided tape, it can be formed as a single layer between one side that adheres to the substrate 40 and the other side that adheres to the heat dissipation member 60, without a substrate supporting the one side and the other side.

[0159] Since the adhesive tape 70 does not contain a base material, it does not contain any material that hinders heat conduction, which can improve heat dissipation performance. However, the adhesive tape 70 is not limited to inorganic double-sided tape, and can be provided with a heat dissipation tape that has better heat dissipation performance than general double-sided tape.

[0160] The substrate 40 is made up of glass material, and the heat dissipation member 60 is made up of metal material. However, the material properties of the glass material and the metal material are different, so the degree to which the materials deform under the same heat may differ. In other words, when heat is generated from the substrate 40, the substrate 40 and the heat dissipation member 60 may expand to different sizes due to the heat. This may cause damage to the display module 30A.

[0161] This is because, with the substrate 40 and the heat dissipation member 60 fixed to each other, the substrate 40 and the heat dissipation member 60 expand to different sizes at the same temperature, which can cause stress to be generated in their respective structures as they expand to different sizes.

[0162] In particular, the thermal expansion coefficients of the substrate 40 and the heat dissipation member 60 differ, resulting in different degrees of physical deformation due to heat. In particular, since the thermal expansion coefficient of metal materials is generally larger than that of glass, when the same amount of heat is transferred to both the substrate 40 and the heat dissipation member 60, the heat dissipation member 60 may expand and deform more than the substrate 40.

[0163] Conversely, when heat generation in the substrate 40 ends and the substrate 40 and the heat dissipation member 60 are cooled, the heat dissipation member 60 may contract and deform even more than the substrate 40.

[0164] Since the substrate 40 and the heat dissipation member 60 are bonded to each other by adhesive tape 70, when the heat dissipation member 60 is deformed more than the substrate 40, an external force can be transmitted to the substrate 40.

[0165] Conversely, external forces can also be transmitted to the heat dissipation member 60 by the substrate 40, but since the rigidity of the glass substrate 40 is less than that of the metal heat dissipation member 60, the substrate 40 may be damaged.

[0166] The adhesive tape 70 may be provided between the substrate 40 and the heat dissipation member 60 so as the substrate 40 and the heat dissipation member 60 expand to different sizes from each other and absorb external forces transmitted from each other's different configurations.

[0167] This prevents external forces from being transmitted to the substrate 40 and the heat dissipation member 60, and in particular, prevents damage to the substrate 40.

[0168] The adhesive tape 70 may be made of a highly flexible material so as to absorb the external forces transmitted to the substrate 40 and the heat dissipation member 60. More specifically, the flexibility of the adhesive tape 70 may be made greater than the flexibility of the substrate 40 and the flexibility of the heat dissipation member 60.

[0169] This prevents the external forces generated from size changes between the substrate 40 and the heat dissipation member 60 from being transmitted to the adhesive tape 70 by causing the adhesive tape 70 itself to deform.

[0170] The adhesive tape 70 may have a predetermined thickness in the first direction X. When heat is transferred to the heat dissipation member 60 and it expands due to heat, or when it cools and contracts, the heat dissipation member 60 may expand or contract not only in the first direction X but also in directions perpendicular to the first direction X, thereby transmitting an external force to the substrate 40.

[0171] As described above, the display panel 20 can display an image using multiple display modules 30A-30w. In this case, the integrity of the screen may be reduced due to seams formed by gaps between the multiple display modules 30A-30w.

[0172] This allows multiple display modules 30A-30w to be arranged on the frame 100 so as to form a constant gap between them, in order to minimize the perception of the seams of the display panel 20. This is because if the gap formed by the multiple display modules 30A-30w is not constant, the perception of seams due to some gaps may be amplified.

[0173] In conventional display devices, the frame supporting the display panel is made of metal. Multiple display modules can be tiled on this metal frame.

[0174] While the display device is in operation, the heat generated from the display panel can cause the substrate forming the multiple display modules 30A-30w to expand due to heat. However, as mentioned above, since the multiple display modules 30A-30w are supported by a metal frame, the thermal expansion of the substrate and the frame can cause irregular gaps to form between the multiple display modules 30A-30w, which can amplify the perception of seams.

[0175] In other words, the substrates of the multiple display modules 30A-30w are all made of glass, and each substrate can expand by a certain amount due to thermal expansion. However, due to the thermal expansion of the metal frames that support each substrate, the gaps between the multiple display modules 30A-30w may become irregularly wide. This is because the physical properties of the metal material and the glass material are different.

[0176] The material properties of the materials may differ depending on factors such as the coefficient of thermal expansion, specific heat, and thermal conductivity. In particular, the degree of thermal expansion between the substrate and the frame may differ depending on the difference between the coefficient of thermal expansion of the metal material and the coefficient of thermal expansion of the glass.

[0177] In addition to the thermal expansion of the substrates of the multiple display modules 30A-30w, the frame to which the multiple display modules 30A-30w are bonded also expands due to thermal expansion, which can cause the spacing between the multiple display modules 30A-30w to change irregularly.

[0178] Thus, in order to prevent irregular gaps from being formed between the multiple display modules 30A-30w due to thermal expansion when multiple display modules 30A-30w are arranged on a metal frame, the frame 100 of the display device 1 according to one embodiment of the present invention may be made of a material to which the multiple display modules 30A-30w are bonded and which has material properties similar to those of the substrate 40 of the multiple display modules 30A-30w.

[0179] In other words, the frame 100 may be provided to have material properties similar to those of the substrate 40 in order to maintain a constant gap length between each of the display modules 30A-30w.

[0180] The meaning of forming the substrate 40 with material properties similar to those of the substrate 40 described above can include the meaning that the thermal expansion coefficient, specific heat, and thermal conductivity of the substrate 40 are similar. In particular, according to one embodiment of the present invention, it can be interpreted as meaning that the thermal expansion coefficient of the substrate 40 and the thermal expansion coefficient of the frame 100 correspond to each other.

[0181] The frame 100 may be formed from a material whose material properties are generally similar to those of the substrate 40, or it may be made of a material having a similar coefficient of thermal expansion. The frame 100 may be formed from a material having the same coefficient of thermal expansion as the substrate 40.

[0182] The frame 100 may include a front layer (not shown) formed of a material having material properties corresponding to those of the substrate 40.

[0183] The substrate 40 may be arranged to expand by a corresponding length when the same heat is transferred to the substrate 40 and the front layer (not shown) in a second direction Y or a third direction Z that is orthogonal to the first direction X, by bonding the substrate 40 to the front layer (not shown) in a first direction X.

[0184] In other words, whether the frame 100 as a whole is made of a material having material properties corresponding to those of the substrate 40, or whether only the front layer (not shown) constituting the front surface of the frame 100 is made of a material having material properties corresponding to those of the substrate 40, in either embodiment, the front surface of the frame 100 to which the substrates 40 of the display modules 30A-30w are bonded can expand by the same magnitude as the substrates 40 when the substrates 40 of the multiple display modules 30A-30w expand due to the heat generated while the display device 1 is in operation.

[0185] By causing the front surface of the frame 100, which is the base surface to which the multiple display modules 30A-30w are bonded, to thermally expand by the same amount as the substrates 40 of the multiple display modules 30A-30w, the spacing of the gaps formed between the multiple display modules 30A-30w can be maintained at the same level.

[0186] As a result, the gaps formed between the multiple display modules 30A-30w can maintain the same separation distance as when the substrate 40 does not undergo thermal expansion, thus maintaining a certain level of seam and preserving the screen integrity of the display panel 20.

[0187] Therefore, even if the heat generated by the operation of the display device 1 is supplied to the substrates 40 of the multiple display modules 30A-30w, the distance of the gap between the multiple display modules 30A-30w is kept constant, thereby preventing the phenomenon in which some seams are amplified and the integrity of the screen is reduced.

[0188] The frame 100 is configured to support the display panel 20 and may be provided to have a rigidity of a predetermined size or greater. Thus, the frame 100 may be formed from a metal material having a certain level of rigidity or greater, and the front surface of the frame 100 may be formed from a glass material corresponding to the substrate 40. However, it is not limited to this, and the frame 100 may be formed from a material having a different coefficient of thermal expansion than that of the substrate 40.

[0189] The following describes in detail a frame 100 according to one embodiment of the present invention.

[0190] Figure 5 shows the frame shown in Figure 2 and the bracket attached to the rear of the frame. Figure 6 shows a cross-section along the line A-A' shown in Figure 5. Figure 7 shows a magnified view of section E shown in Figure 6. Figure 8 shows a cross-section along the line B-B' shown in Figure 5. Figure 9 shows a cross-section along the line C-C' shown in Figure 5. Figure 10 shows a cross-section along the line D-D' shown in Figure 5.

[0191] Referring to Figures 5 to 10, a frame 100 according to one embodiment of the present invention may include a frame panel 110. The frame panel 110 may have a first side 110a facing a plurality of display modules 30A-30w, and a second side 110b opposite to the first side 110a. The first side 110a may face forward, and the second side 110b may face backward.

[0192] Referring to Figures 6 and 7, the frame panel 110 may include insertion portions 111 formed through it along the front-rear direction. The insertion portions 111 may be provided so that the studs 120 can be inserted into them. The insertion portions 111 may be provided in positions and in numbers corresponding to the brackets 160, 172, 180, and 190 that are coupled to the frame 100.

[0193] A first opening 111a may be formed on the first side 110a of the frame panel 110. A second opening 111b may be formed on the second side 110b of the frame panel 110. The first opening 111a may be formed to a different size from the second opening 111b. The first opening 111a may be larger in size than the second opening 111b. The insertion portion 111 may be provided such that the first opening 111a and the second opening 111b form a step.

[0194] By forming the second opening 111b smaller than the first opening 111a, when the stud 120 is inserted into the insertion portion 111 and the brackets 160, 172, 180, and 190 are connected to the stud 120, a portion of the frame panel 110 forming the second opening 111b can support the stud 120, thereby improving the pull-out force or torque resistance applied to the frame 100.

[0195] Furthermore, by making the second opening 111b smaller than the first opening 111a and pushing the stud 120 into the insertion portion 111, the surfaces formed on the first side 110a and the second side 110b of the frame panel 110 can be formed flat without any protruding portions.

[0196] In particular, by forming the surface on the first side 110a of the frame panel 110 flat without any protruding portions, the display device 1 according to one embodiment of the present invention can secure a flat surface for tiling a plurality of display modules 30A-30w attached to the front surface of the frame 100.

[0197] Furthermore, by forming the surface on the second side 110b of the frame panel 110 flat without any protruding parts, it is possible to prevent the thickness of the display device 1 from increasing unnecessarily.

[0198] Referring to Figure 7, the frame panel 110 may include a first metal layer 116 forming a first side 110a, a second metal layer 117 forming a second side 110b, and a resin layer 118 positioned between the first metal layer 116 and the second metal layer 117. With such a configuration, the frame panel 110 can have excellent flatness and improved rigidity relative to its weight.

[0199] The size of a portion of the insertion portion 111 formed in the resin layer 118 may be approximately the same as the size of another portion of the insertion portion 111 formed in the first metal layer 116. That is, the size of a portion of the insertion portion 111 formed in the resin layer 118 may be larger than the size of yet another portion of the insertion portion 111 formed in the second metal layer 117.

[0200] The first opening 111a may be formed in the first metal layer 116, and the second opening 111b may be formed in the second metal layer 117.

[0201] Referring to Figure 7, the stud 120 can be inserted into the insertion portion 111 through the first opening 111a. The stud 120 may include a coupling portion 120a that opens toward the second opening 111b. Threads 121 may be formed on the inner surface of the coupling portion 120a. The coupling portion 120a may also open toward the first opening 111a. The stud 120 may be supported by a portion of the frame panel 110 that forms the second opening 111b.

[0202] The frame 100 may include multiple module openings 101 formed to accommodate multiple display modules 30A-30w.

[0203] Brackets 160, 172, 180, and 190 can be detachably mounted on the rear of the frame panel 110. Brackets 160, 172, 180, and 190 can be detachably coupled to the studs 120. Brackets 160, 172, 180, and 190 may include at least one of the following: board bracket 160, chassis bracket 172, mounting bracket 180, and reinforcing bracket 190.

[0204] Referring to Figures 5 and 6, a circuit board (not shown) for driving the display device 1 may be mounted on the board bracket 160. Multiple board brackets 160 may be provided. The board bracket 160 may include board bracket holes 161. The board bracket holes 161 may be formed to correspond to the second opening 111b of the frame panel 110. The board bracket 160 may be fixed to the frame 100 by fastening members (not shown) passing through the board bracket holes 161 and connecting to the threads 121 of the studs 120.

[0205] Referring to Figures 5 and 8, the chassis bracket 172 may be provided to secure a front chassis 171, which is provided to cover the edge of the frame 100, to the frame 100. Multiple chassis brackets 172 may be provided. The chassis bracket 172 may include chassis bracket holes 173. The chassis bracket holes 173 may be formed to correspond to a second opening 111b of the frame panel 110. The chassis bracket 172 may be secured to the frame 100 by fastening members (not shown) passing through the chassis bracket holes 173 and coupling to the threads 121 of a stud 120. The front chassis 171 may be secured to the chassis bracket 172 which is secured to the frame 100.

[0206] Referring to Figures 5 and 9, the mounting bracket 180 may be provided to be coupled with a wall mount (not shown) when fixing the display device 1 to a wall. The mounting bracket 180 may include a mounting bracket hole 181. The mounting bracket hole 181 may be formed to correspond to a second opening 111b of the frame panel 110. The mounting bracket 180 may be fixed to the frame 100 by fastening members (not shown) passing through the mounting bracket hole 181 and coupling with the threads 121 of the stud 120.

[0207] Referring to Figures 5 and 10, the reinforcing bracket 190 may be provided to reinforce the strength of the frame 100. The reinforcing bracket 190 may extend substantially horizontally. The reinforcing bracket 190 may include a reinforcing bracket hole 191. The reinforcing bracket hole 191 may be formed to correspond to a second opening 111b of the frame panel 110. The reinforcing bracket 190 may be fixed to the frame 100 by fastening members (not shown) passing through the reinforcing bracket hole 191 and connecting to the threads 121 of the stud 120.

[0208] Although not shown in the figures, the display device 1 may include a stand. An insertion portion 111 may be formed in the frame 100 into which a stud 120 for a bracket to which the stand is attached can be inserted.

[0209] The frame 100 may include a reinforcing member 130 attached to the first side 110a of the frame panel 110. The reinforcing member 130 may be provided to cover the first opening 111a. Multiple display modules 30A-30w may be installed on the reinforcing member 130. The reinforcing member 130 may be made up of CFRP (carbon fiber reinforced plastics).

[0210] Figure 11 shows the frame panel shown in Figure 5 installed. Figure 12 shows the stud being inserted into the insertion part of the frame panel shown in Figure 11. Figure 13 shows another embodiment of the insertion part of the frame panel shown in Figure 12. Figure 14 shows the reinforcing member being bonded to the frame panel shown in Figure 12. Figure 15 shows the module opening being formed in the frame shown in Figure 14. Figure 16 shows the bracket being attached to the frame shown in Figure 15.

[0211] The process of manufacturing a display device 1 according to one embodiment of the present invention will be described with reference to Figures 11 to 16.

[0212] Referring to Figure 11, a frame panel 110 having a first metal layer 116, a second metal layer 117, and a resin layer 118 may be provided. An insertion portion 111 may be formed in the frame panel 110. The insertion portion 111 can be formed on the first side 110a of the frame panel 110. The insertion portion 111 can be formed penetrating from the first side 110a to the second side 110b of the frame panel 110. The insertion portion 111 can be formed in various positions considering the types of brackets 160, 172, 180, and 190 that are attached to the frame 100.

[0213] The insertion portion 111 can be formed in various ways. The insertion portion 111 can be formed on the first side 110a of the frame panel 110 using at least one of a shaping device, a water jet, and a laser.

[0214] The insertion portion 111 can be formed through a shaping device (not shown). The shaping device may include a router. When the insertion portion 111 is formed by a shaping device, the insertion portion 111 may be formed such that the first opening 111a and the second opening 111b have a stepped shape, as shown in Figure 12.

[0215] The insertion portion 211 may be formed by a water jet and / or laser. When the insertion portion 211 is formed by a water jet and / or laser, the insertion portion 211 may be tapered from the first opening 211a to the second opening 211b, as shown in Figure 13. The insertion portion 211 may be formed such that its size decreases from the first metal layer 116 to the second metal layer 117.

[0216] Referring to Figure 12, a stud 120 can be inserted into the frame panel 110 in which the insertion portion 111 is formed. The stud 120 can be pushed in from the first side 110a. The stud 120 can be inserted into the insertion portion 111 through the first opening 111a in a direction toward the second opening 111b. In this way, when the stud 120 is inserted into the insertion portion 111, it can be supported by the portion of the frame panel 110 that forms the second opening 111b.

[0217] Referring to Figure 14, after inserting the stud 120 into the insertion portion 111 of the frame panel 110, the reinforcing member 130 can be attached to the first side 110a of the frame panel 110. In this way, the first opening 111a of the insertion portion 111 can be covered by the reinforcing member 130.

[0218] Referring to Figure 15, after attaching the reinforcing member 130 to the frame panel 110, the module opening 101 can be formed in both the frame panel 110 and the reinforcing member 130. By forming the module opening 101 after attaching the reinforcing member 130 to the frame panel 110, the manufacturing process can be simplified.

[0219] Referring to Figure 16, brackets 160, 172, 180, and 190 can be attached to the frame 100 forming the module opening 101. Specifically, the board bracket 160 can be attached to the frame 100 by coupling to the first stud on the second side 110b of the frame panel 110. The chassis bracket 172 can be attached to the frame 100 by coupling to the second stud on the second side 110b of the frame panel 110. The mounting bracket 180 can be attached to the frame 100 by coupling to the third stud on the second side 110b of the frame panel 110. The reinforcing bracket 190 can be attached to the frame 100 by coupling to the fourth stud on the second side 110b of the frame panel 110. Brackets 160, 172, 180, and 190 can be detachably coupled to the first to fourth studs through the second opening 111b of the frame panel 110. Each of the first to fourth studs may have a shape corresponding to the shape of stud 120.

[0220] After attaching brackets 160, 172, 180, and 190 to frame 100, multiple display modules 30A-30w can be installed on the front of frame 100.

[0221] According to the concept of the present invention, the display device and the method for manufacturing the display device are formed such that the size of the first opening formed on the first side and the size of the second opening formed on the second side of the frame, into which the studs into which the brackets are detachably coupled are inserted, are different from each other, thereby improving the pull-out force or torque resistance of the frame supporting multiple display modules.

[0222] The embodiments disclosed above have been described with reference to the attached drawings. Those with ordinary skill in the art to which the embodiments belong will understand that the embodiments may be carried out in different forms without altering the technical concept or essential features of the embodiments. The disclosed embodiments are illustrative and should not be construed restrictively.

Claims

1. Multiple display modules; A frame supporting the plurality of display modules, wherein the plurality of display modules are arranged in an M*N matrix within the frame; and Includes a bracket detachably coupled to the frame; The frame includes a frame panel having a first side and a second side opposite to the first side. The aforementioned frame panel is An insertion portion that penetrates the frame panel and includes a first opening formed on the first side and a second opening formed on the second side, wherein the size of the first opening is larger than the size of the second opening; and Includes a stud provided in the insertion portion; The plurality of display modules are attached to the first side of the frame panel, and the bracket is connected to the stud through the second opening formed on the second side of the frame panel. The insertion portion is provided in a tapered shape, where the size decreases from the size of the first opening to the size of the second opening as you move from the first side to the second side, in a display device.

2. Multiple display modules; A frame supporting the plurality of display modules, wherein the plurality of display modules are arranged in an M*N matrix within the frame; and Includes a bracket detachably coupled to the frame; The frame includes a frame panel having a first side and a second side opposite to the first side. The aforementioned frame panel is An insertion portion that penetrates the frame panel and includes a first opening formed on the first side and a second opening formed on the second side, wherein the size of the first opening is larger than the size of the second opening; and Includes a stud provided in the insertion portion; The plurality of display modules are attached to the first side of the frame panel, and the bracket is connected to the stud through the second opening formed on the second side of the frame panel. The display device further includes a reinforcing member attached to the first side of the frame panel and provided to cover the first opening.

3. The display device according to claim 2, wherein the insertion portion is provided such that the first opening and the second opening form a step.

4. The display device according to claim 2, wherein the insertion portion is provided in a tapered shape, where the size decreases from the size of the first opening to the size of the second opening as you move from the first side to the second side.

5. The stud includes a connecting portion having an opening toward the second opening, The display device according to claim 1 or 2, wherein the connecting portion includes screw threads formed on the inner circumferential surface.

6. The display device according to claim 1 or 2, wherein the bracket includes at least one of a mounting bracket, a chassis bracket, a reinforcing bracket, and a board bracket.

7. The display device according to claim 1, wherein the frame further includes a reinforcing member attached to the first side of the frame panel and provided to cover the first opening.

8. The display device according to claim 7, wherein the plurality of display modules are attached to the reinforcing member.

9. The aforementioned frame panel is A first metal layer forming the first side of the frame panel; A second metal layer forming the second side of the frame panel; and The display apparatus according to claim 1 or 2, further comprising a resin layer disposed between the first metal layer and the second metal layer.

10. The display device according to claim 9, wherein the size of a portion of the insertion portion formed in the resin layer is the same as the size of another portion of the insertion portion formed in the first metal layer.

Images