Laser device and method for manufacturing electronic devices

Abstract

To provide a laser device in which a bypass device is detachably constituted.SOLUTION: A bypass device 60 is attachable to and detachable from a laser apparatus that outputs a pulsed laser beam, is provided in a laser apparatus 2A, and forms a bypass optical path that bypasses a pulse width extension device 50 that extends a pulse width of an incident pulsed laser beam. The plurality of optical elements include the first high-reflection mirror 61 that reflects pulsed laser light incident on the pulse width extension device toward the outside of the pulse width extension device and guides the pulsed laser light to the bypass optical path, and the second high-reflection mirror 64 that reflects pulsed laser light reflected by the first high-reflection mirror and incident via the bypass optical path and returns the pulsed laser light to the emission optical path of the pulse width extension device.SELECTED DRAWING: Figure 2

Description

Technical Field

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[0003]

[0001] The present disclosure relates to a bypass device, a laser device, and a method for manufacturing an electronic device.

Background Art

[0002] In recent years, in semiconductor exposure apparatuses, as semiconductor integrated circuits are miniaturized and highly integrated, improvement in resolution has been demanded. For this reason, the wavelength of light emitted from an exposure light source has been shortened. For example, as a gas laser device for exposure, a KrF excimer laser device that outputs laser light with a wavelength of about 248 nm and an ArF excimer laser device that outputs laser light with a wavelength of about 193 nm are used.

[0003] The spectral linewidth of the spontaneous emission light of a KrF excimer laser device and an ArF excimer laser device is as wide as 350 to 400 pm. Therefore, when a projection lens is configured with a material that transmits ultraviolet light such as KrF and ArF laser light, chromatic aberration may occur. As a result, the resolution may decrease. Therefore, it is necessary to narrow the spectral linewidth of the laser light output from the gas laser device to such an extent that chromatic aberration can be ignored. For this reason, a line narrowing module (LNM) including a line narrowing element (etalon, grating, etc.) may be provided in the laser resonator of the gas laser device to narrow the spectral linewidth. Hereinafter, a gas laser device whose spectral linewidth is narrowed is referred to as a line-narrowed gas laser device.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

[0005] A bypass device according to one aspect of the present disclosure is a bypass device that is detachable from a laser device that outputs pulsed laser light, is provided within the laser device, and forms a bypass optical path that bypasses a pulse width expansion device that expands the pulse width of incident pulsed laser light, comprising a plurality of optical elements that form the bypass optical path and a housing that houses the plurality of optical elements, wherein the plurality of optical elements include a first high-reflection mirror that reflects the pulsed laser light incident on the pulse width expansion device outwards from the pulse width expansion device and guides it to the bypass optical path, and a second high-reflection mirror that reflects the pulsed laser light reflected by the first high-reflection mirror and incident through the bypass optical path and returns it to the output optical path of the pulse width expansion device.

[0006] A laser apparatus according to one aspect of the present disclosure comprises a laser oscillator that outputs pulsed laser light and a pulse width expansion device that expands the pulse width of incident pulsed laser light, and a bypass device that forms a bypass optical path that bypasses the pulse width expansion device is detachably attached to the laser apparatus, wherein the bypass device comprises a plurality of optical elements that form the bypass optical path and a housing that houses the plurality of optical elements, and the plurality of optical elements include a first high-reflection mirror that reflects the pulsed laser light incident on the pulse width expansion device outwards from the pulse width expansion device and guides it to the bypass optical path, and a second high-reflection mirror that reflects the pulsed laser light reflected by the first high-reflection mirror and incident through the bypass optical path and returns it to the output optical path of the pulse width expansion device.

[0007] A method for manufacturing an electronic device according to one aspect of the present disclosure includes a laser oscillator that outputs pulsed laser light and a pulse width expansion device that expands the pulse width of incident pulsed laser light, and a bypass device that forms a bypass optical path that bypasses the pulse width expansion device is detachably attached to a laser device, and the pulsed laser light output from the laser device is output to an exposure device, and the method for manufacturing an electronic device includes exposing a photosensitive substrate with pulsed laser light in the exposure device in order to manufacture an electronic device, wherein the bypass device comprises a plurality of optical elements that form a bypass optical path and a housing that houses the plurality of optical elements, and the plurality of optical elements include a first high-reflection mirror that guides the pulsed laser light to the bypass optical path by reflecting the pulsed laser light incident on the pulse width expansion device toward the outside of the pulse width expansion device, and a second high-reflection mirror that returns the pulsed laser light to the output optical path of the pulse width expansion device by reflecting the pulsed laser light that is reflected by the first high-reflection mirror and incident through the bypass optical path. [Brief explanation of the drawing]

[0008] Some embodiments of this disclosure are described below, merely as examples, with reference to the accompanying drawings. [Figure 1] Figure 1 is a schematic front view showing the configuration of a laser device according to a comparative example. [Figure 2] Figure 2 is a schematic front view showing an example of the configuration of a laser device according to the first embodiment. [Figure 3] Figure 3 is a front view showing the laser device according to the first embodiment with the bypass device attached. [Figure 4] Figure 4 is a schematic top view showing the configuration of the laser apparatus according to the second embodiment. [Figure 5] Figure 5 is a schematic front view showing the configuration of the laser device according to the second embodiment. [Figure 6] Figure 6 is a top view showing the laser device according to the second embodiment with the bypass device attached. [Figure 7] Figure 7 is a front view showing the laser device according to the second embodiment with the bypass device attached. [Figure 8] Figure 8 is a perspective view showing the laser apparatus according to the second embodiment with the bypass device removed. [Figure 9] Figure 9 is a perspective view showing the laser device according to the second embodiment with the bypass device attached. [Figure 10] Figure 10 is a schematic top view showing the configuration of a laser device according to the third embodiment. [Figure 11] Figure 11 is a schematic front view showing the configuration of a laser device according to the third embodiment. [Figure 12] Figure 12 is a top view showing the laser device according to the third embodiment with the bypass device attached. [Figure 13] Figure 13 is a front view showing the laser device according to the third embodiment with the bypass device attached. [Figure 14] Figure 14 is a perspective view showing the laser apparatus according to the third embodiment with the bypass device removed. [Figure 15] Figure 15 is a perspective view showing the laser device according to the third embodiment with the bypass device attached. [Figure 16] Figure 16 is a schematic diagram showing the configuration of a bypass device according to a first modified example of the first embodiment. [Figure 17] Figure 17 is a schematic diagram showing the configuration of a bypass device according to a second modified example of the first embodiment. [Figure 18] Figure 18 is a schematic diagram showing an example of the configuration of an exposure apparatus. Embodiment

[0009] <Contents> 1. Comparative Example 1.1 Configuration 1.2 Operation 1.3 Challenges 2. First Embodiment 2.1 Configuration 2.2 Operation 2.3 Effects 3. Second Embodiment 3.1 Configuration 3.2 Operation 3.3 Effect 4. Third Embodiment 4.1 Configuration 4.2 Operation 4.3 Effect 5. Modification Examples of Bypass Device 5.1 First Modification Example 5.2 Second Modification Example 5.3 Other Modification Examples 6. Manufacturing Method of Electronic Device

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments described below show some examples of the present disclosure and do not limit the content of the present disclosure. Also, not all of the configurations and operations described in each embodiment are essential as the configurations and operations of the present disclosure. In addition, the same reference numerals are assigned to the same components, and duplicate descriptions are omitted.

[0011] 1. Comparative Example 1.1 Configuration FIG. 1 schematically shows a configuration example of a laser device 2 according to a comparative example. The comparative example of the present disclosure is a form recognized by the applicant as being known only to the applicant and is not a known example recognized by the applicant.

[0012] In FIG. 1, the height direction of the laser device 2 is the V-axis direction, the length direction is the Z-axis direction, and the depth direction is the H-axis direction. The V-axis direction may be parallel to the gravitational direction, and the direction opposite to the gravitational direction is the “+V-axis direction”. Also, the emission direction of the pulsed laser light emitted from the laser device 2 is the “+Z-axis direction”. Also, the direction toward the front of the paper surface of FIG. 1 is the “+H-axis direction”.

[0013] The laser device 2 includes a master oscillator (MO) 10, an MO beam steering unit 20, a power oscillator (PO) 30, a PO beam steering unit 40, and an optical pulse stretcher (OPS) 50.

[0014] The master oscillator 10 includes a narrowband module (LNM) 11, a chamber 14, and an output coupler (OC) 17.

[0015] The LNM11 includes a prism beam expander 12 and a grating 13 for narrowing the spectral linewidth. The prism beam expander 12 and the grating 13 are arranged in a Littrow configuration such that the angle of incidence and the angle of diffraction coincide.

[0016] The output coupling mirror 17 is a reflective mirror with a reflectivity in the range of 40% to 60%. The output coupling mirror 17 and the LNM 11 are arranged to form an optical resonator.

[0017] Chamber 14 is positioned on the optical path of the optical resonator. Chamber 14 includes a pair of discharge electrodes 15a, 15b and two windows 16a, 16b through which pulsed laser light passes. Chamber 14 contains excimer laser gas. The excimer laser gas may include, for example, Ar gas or Kr gas as a rare gas, F2 gas as a halogen gas, and Ne gas as a buffer gas.

[0018] The MO beam steering unit 20 includes a high-reflection mirror 21a and a high-reflection mirror 21b. The high-reflection mirrors 21a and 21b are arranged so that pulsed laser light output from the master oscillator 10 is incident on the power oscillator 30. The high-reflection mirrors in this disclosure are planar mirrors in which a high-reflection film is formed on the surface of a substrate made of, for example, synthetic quartz or calcium fluoride (CaF2). The high-reflection film is a dielectric multilayer film, for example, a film containing fluoride.

[0019] The power oscillator 30 includes a rear mirror 31, a chamber 32, and an output coupling mirror 35. The rear mirror 31 and the output coupling mirror 35 are arranged to form an optical resonator.

[0020] Chamber 32 is positioned on the optical path of the optical resonator. Chamber 32 may have a configuration similar to that of chamber 14 of the master oscillator 10. That is, chamber 32 includes a pair of discharge electrodes 33a, 33b and two windows 34a, 34b through which pulsed laser light passes. Chamber 32 contains the excimer laser gas inside.

[0021] The rear mirror 31 is a reflective mirror with a reflectivity in the range of 50% to 90%. The output coupling mirror 35 is a reflective mirror with a reflectivity in the range of 10% to 30%.

[0022] The PO beam steering unit 40 includes a high-reflection mirror 40a and a high-reflection mirror 40b. The high-reflection mirrors 40a and 40b are positioned so that pulsed laser light output from the power oscillator 30 is incident on the OPS 50.

[0023] The OPS50 includes a beam splitter 52 and four concave mirrors 54a to 54d. The beam splitter 52 is positioned in the optical path of the pulsed laser light output from the PO beam steering unit 40. The beam splitter 52 is a reflective mirror that transmits some of the incident pulsed laser light and reflects the other pulsed laser light. The reflectivity of the beam splitter 52 is preferably in the range of 40% to 70%, and more preferably about 60%. The beam splitter 52 causes the pulsed laser light that has passed through the beam splitter 52 to be output from the laser device 2.

[0024] The four concave mirrors 54a to 54d constitute a delayed optical path 56 for the pulsed laser light reflected from the first surface of the beam splitter 52. The pulsed laser light reflected from the first surface of the beam splitter 52 is reflected by the four concave mirrors 54a to 54d and arranged so that the beam is imaged again by the beam splitter 52.

[0025] The four concave mirrors 54a to 54d may all be concave mirrors with approximately equal focal lengths. The focal length f of each concave mirror 54a to 54d may correspond, for example, to the distance from the beam splitter 52 to the concave mirror 54a.

[0026] The concave mirrors 54a and 54b are positioned such that the pulsed laser light reflected from the first surface of the beam splitter 52 is reflected by the concave mirror 54a and incident on the concave mirror 54b. The concave mirrors 54a and 54b are positioned such that the pulsed laser light reflected from the first surface of the beam splitter 52 forms a first image at a 1:1 magnification (1:1) of the image on the first surface of the beam splitter 52.

[0027] The concave mirrors 54c and 54d are positioned so that the pulsed laser light reflected by the concave mirror 54b is reflected by the concave mirror 54c and incident on the concave mirror 54d. Furthermore, the concave mirror 54d is positioned so that the pulsed laser light reflected by the concave mirror 54d is incident on the second surface of the beam splitter 52, which is opposite to the first surface. The concave mirrors 54c and 54d are positioned so that the first image is imaged as a second image on the second surface of the beam splitter 52 in a 1:1 ratio.

[0028] Furthermore, the OPS50 only needs to include a beam splitter and two or more high-reflectivity mirrors.

[0029] 1.2 Operation When a discharge occurs in the chamber 14 of the master oscillator 10, the laser gas is excited, and a pulsed laser beam, narrowed in bandwidth by an optical resonator consisting of the output coupling mirror 17 and the LNM 11, is output from the output coupling mirror 17. This pulsed laser beam is then incident on the rear mirror 31 of the power oscillator 30 as seed light by the MO beam steering unit 20.

[0030] A discharge occurs in the chamber 32 in synchronization with the timing of the seed light passing through the rear mirror 31. As a result, the laser gas is excited, and the seed light is amplified by a Fabry-Perot type optical resonator composed of the output coupling mirror 35 and the rear mirror 31, and the amplified pulsed laser light is output from the output coupling mirror 35. The pulsed laser light output from the output coupling mirror 35 is incident on the OPS 50 via the PO beam steering unit 40.

[0031] When pulsed laser light is incident on OPS50, a portion is transmitted through the beam splitter 52 and output, and a portion is reflected by the beam splitter 52. The pulsed laser light reflected by the beam splitter 52 circulates through the delayed optical path 56, which is composed of the first to fourth concave mirrors 54a to 54d, and is incident on the beam splitter 52 again. Then, a portion of the pulsed laser light incident on the beam splitter 52 is reflected and output from OPS50. The pulsed laser light that has passed through the beam splitter 52 circulates through the delayed optical path 56 again.

[0032] In this way, as the pulsed laser light repeatedly circulates through the delayed optical path 56, the OPS50 outputs pulsed laser light with 0 circulates, 1 circulate, 2 circulates, 3 circulates, and so on. The light intensity of the pulsed laser light output from the OPS50 decreases as the number of circulates in the delayed optical path 56 increases.

[0033] The pulsed laser beams from the first pulse onwards are combined and output with the pulsed laser beam of the first pulse onwards, each delayed by an integer multiple of the delay time determined by the optical path length of the delay path 56. In other words, the pulse waveforms of the pulsed laser beams from the first pulse onwards are sequentially superimposed on the pulse waveform of the pulsed laser beam of the first pulse onwards, each delayed by the delay time. In this way, the pulse width of the pulsed laser beam is extended by the OPS50.

[0034] By extending the pulse width of the pulsed laser light using OPS50, the coherence decreases. This suppresses the generation of speckle. Speckle refers to the light and dark spots that occur due to interference when laser light is scattered in a random medium.

[0035] 1.3 Challenges The laser device 2 in the comparative example may experience abnormalities in laser performance due to malfunctions or other issues. Examples of abnormalities in laser performance include a decrease in the power of the pulsed laser beam and a decrease in the beam characteristics of the pulsed laser beam. A decrease in beam characteristics refers to, for example, an increase in beam divergence.

[0036] If an abnormality occurs in the laser performance, it is advisable to remove the OPS50 and re-check the laser performance to identify the cause. This is to determine whether the cause lies in the laser oscillator (master oscillator 10 or power oscillator 30) or the OPS50. For example, if the power of the pulsed laser light decreases, the cause could be a decrease in the output of the laser oscillator or a decrease in the light transmittance of the OPS50. If the laser performance does not improve even after removing the OPS50, it can be concluded that the cause lies in the laser oscillator. Conversely, if the laser performance improves after removing the OPS50, it can be concluded that the cause lies in the OPS50.

[0037] However, the process of removing the OPS50 from the laser unit 2 and then reinstalling it can take, for example, half a day or more, which may necessitate stopping the factory's production line during that time. Furthermore, when reinstalling the OPS50 after it has been removed from the laser unit 2, the optical axis that was adjusted before removal may not be reproducible. In this case, optical axis adjustment will need to be performed again, which may take even more time.

[0038] Therefore, it is necessary to be able to quickly identify the cause of any abnormalities in laser performance.

[0039] 2. First Embodiment 2.1 Configuration Figure 2 schematically shows an example of the configuration of laser apparatus 2A according to the first embodiment of this disclosure. The differences between the configuration of laser apparatus 2A shown in Figure 2 and the comparative example laser apparatus 2 shown in Figure 1 will be explained. The laser apparatus 2A according to the first embodiment differs from the configuration of laser apparatus 2 according to the comparative example laser apparatus 2 in that the bypass device 60 is configured to be detachable.

[0040] Laser apparatus 2A comprises a master oscillator 10, an MO beam steering unit 20, a power oscillator 30, a PO beam steering unit 40, and an OPS 50. These elements may be the same as those in the configuration of laser apparatus 2 shown in Figure 1. The master oscillator 10, or a combination of the master oscillator 10 and the power oscillator 30, is an example of a “laser oscillator” in this disclosure. The OPS 50 is an example of a “pulse width extension device” in this disclosure. The PO beam steering unit 40 is an example of a “beam steering device” in this disclosure.

[0041] The bypass device 60 forms a bypass optical path that bypasses the delayed optical path 56 included in the OPS 50. The bypass device 60 includes four high-reflection mirrors 61 to 64. The high-reflection mirrors 61 to 64 are examples of the “multiple optical elements” in this disclosure. High-reflection mirror 61 is an example of the “first high-reflection mirror” in this disclosure. High-reflection mirror 64 is an example of the “second high-reflection mirror” in this disclosure.

[0042] The high-reflection mirrors 61-64 are housed in the housing 65 and held in predetermined positions within the housing 65. The high-reflection mirrors 61-64 form a bypass optical path that bypasses the OPS 50.

[0043] The laser device 2A has space on both the light incidence and light emission sides of the OPS 50 to allow for the insertion of a portion of the bypass device 60. The housing 65 of the bypass device 60 is configured to be detachable from the laser device 2A. In Figure 2, the position where the bypass device 60 is attached to the laser device 2A is shown by a dashed line. When the housing 65 is attached to the laser device 2A, it is positioned and fixed relative to the OPS 50. In Figure 2, the solid line shows the state in which the bypass device 60 has been removed from the laser device 2A.

[0044] Figure 3 shows the laser device 2A with the bypass device 60 attached. The high-reflection mirror 61 is positioned to reflect the pulsed laser light emitted from the PO beam steering unit 40 and direct it onto the high-reflection mirror 62 when the bypass device 60 is attached to the laser device 2A. For example, the high-reflection mirror 61 is positioned at a 45° angle with respect to the incident optical axis of the OPS 50, so as to reflect the pulsed laser light traveling along the incident optical axis at a 45° reflection angle.

[0045] The high-reflection mirrors 62 and 63 are positioned to guide the pulsed laser light reflected by the high-reflection mirror 61 to the high-reflection mirror 64. For example, the high-reflection mirror 62 is positioned to reflect the pulsed laser light incident from the high-reflection mirror 61 at a 45° reflection angle and direct it to the high-reflection mirror 63. The high-reflection mirror 63 is positioned to reflect the pulsed laser light incident from the high-reflection mirror 62 at a 45° reflection angle and direct it to the high-reflection mirror 64.

[0046] The high-reflection mirror 64 is positioned at a 45° angle with respect to the output optical axis of the OPS50, and is arranged to reflect the pulsed laser light incident from the high-reflection mirror 63 at a 45° reflection angle and return it to the output optical path of the OPS50. In other words, the high-reflection mirror 64 is positioned to emit pulsed laser light that has traveled through the bypass optical path into the optical path of the pulsed laser light emitted from the OPS50 when the bypass device 60 is not attached to the laser device 2A.

[0047] In other words, the high-reflectivity mirrors 61 to 64 are arranged such that the angle between the incident light and the reflected light is 90°.

[0048] The housing 65 of the bypass device 60 has an optical input window (not shown) for directing pulsed laser light emitted from the PO beam steering unit 40 onto a high-reflection mirror 61. The housing 65 also has an optical output window (not shown) for directing pulsed laser light reflected by the high-reflection mirror 64 out of the housing 65.

[0049] The high-reflection mirrors 61 to 64 may be arranged such that the angle between the incident light and the reflected light is an angle other than 90°. The first high-reflection mirror, 61, should be arranged to reflect the pulsed laser light incident on the OPS 50 outwards, thereby guiding the pulsed laser light to the bypass optical path. The second high-reflection mirror, 64, should be arranged to reflect the pulsed laser light that is reflected by the high-reflection mirror 61 and incident via the bypass optical path, thereby returning the pulsed laser light to the output optical path of the OPS 50.

[0050] 2.2 Operation If the bypass device 60 is not attached to the laser device 2A, the pulsed laser light emitted from the power oscillator 30 is incident on the OPS 50 via the PO beam steering unit 40. The pulsed laser light incident on the OPS 50 has its pulse width extended by the delay optical path 56 and is then emitted from the laser device 2A.

[0051] The bypass device 60 is attached to the laser device 2A, for example, when an abnormality occurs in the laser performance of the pulsed laser light emitted from the laser device 2A, during an investigation to identify the cause. When the bypass device 60 is attached to the laser device 2A, the pulsed laser light emitted from the PO beam steering unit 40 and traveling along the incident optical axis of the OPS 50 enters the bypass device 60, travels through the bypass optical path without passing through the OPS 50, and is then output along the exit optical axis of the OPS 50.

[0052] 2.3 Effects According to the laser device 2A and bypass device 60 of the first embodiment, by attaching the bypass device 60 to the laser device 2A, it is possible to bypass the OPS50 and output pulsed laser light without removing the OPS50 from the laser device 2A. Therefore, if an abnormality occurs in the laser performance of the laser device 2A, the cause can be easily identified by attaching and removing the bypass device 60.

[0053] The installation of the bypass device 60 does not change the angle of the mirrors such as the OPS50 located in the optical path, and removing the bypass device 60 returns the optical path to its original state, thus eliminating the need for optical axis adjustment. Therefore, the overall work time required to identify the cause can be shortened.

[0054] Since the bypass device 60 can be easily attached to and detached from the laser device 2A, the pulse width of the pulsed laser beam can be switched by attaching or detaching the bypass device 60. Furthermore, since the output of the pulsed laser beam decreases as it passes through the OPS 50, when the bypass device 60 is attached to the laser device 2A, the pulse width of the pulsed laser beam becomes shorter, while the output increases. Therefore, by attaching or detaching the bypass device 60, it becomes possible to select whether to prioritize the pulse width or the output of the pulsed laser beam, thereby expanding the practical performance of the laser device 2A.

[0055] 3. Second Embodiment Next, a laser apparatus 2B according to the second embodiment of this disclosure will be described. The differences from the configuration of the laser apparatus 2 in the comparative example will be explained below.

[0056] 3.1 Configuration Figure 4 is a schematic top view showing the configuration of the laser device 2B according to the second embodiment. Figure 5 is a schematic front view showing the configuration of the laser device 2B. Note that "front" in relation to the laser device 2B refers to the outer surface of the laser device 2B on the side where the outer cover panel (not shown) opens wide for maintenance of the laser device 2B. The "front" is the side on which the internal arrangement structure of the device, as shown in Figure 5, is visible when the outer cover panel of the laser device 2B is opened.

[0057] Laser device 2B comprises a master oscillator 10, an MO beam steering unit 20, a power oscillator 30, and an OPS 50. These elements may be the same as those in the configuration of laser device 2 shown in Figure 1.

[0058] The laser device 2B is equipped with a long optical pulse stretcher 100 (hereinafter referred to as "L-OPS100") for generating a long-distance optical path difference that extends the pulse width. The L-OPS100 is located on the back of the laser device 2B. The "back" is the side that is at the back when viewed from the front of the laser device 2B, and is the side opposite to the front. The L-OPS100 is an example of a "pulse width extension device" in this disclosure.

[0059] Laser device 2B includes a PO beam steering unit 42 instead of the PO beam steering unit 40 shown in Figure 1. The PO beam steering unit 42 includes a high-reflection mirror 44a, a high-reflection mirror 44b, and a high-reflection mirror 44c for light exchange with the L-OPS 100.

[0060] The high-reflection mirror 44a is positioned to reflect the pulsed laser light output from the power oscillator 30 and direct it onto the high-reflection mirror 44b. The high-reflection mirror 44b is positioned to reflect the pulsed laser light reflected by the high-reflection mirror 44a and direct it onto the L-OPS 100. The high-reflection mirror 44c is positioned to reflect the pulsed laser light output from the L-OPS 100 and direct it onto the OPS 50.

[0061] The L-OPS100 is composed of multiple concave mirrors, multiple high-reflection mirrors, and multiple beam splitters. Figure 4 shows only the multiple concave mirrors 102 and one beam splitter 104, which are components of the L-OPS100. The beam splitter 104 is positioned where the pulsed laser light reflected by the high-reflection mirror 44b of the PO beam steering unit 42 is incident. The L-OPS100 has a delayed optical path 106 formed by the above components. That is, the laser device 2B according to the second embodiment includes two pulse width extension devices, OPS50 and L-OPS100. Each of OPS50 and L-OPS100 only needs to include a beam splitter and two or more high-reflection mirrors.

[0062] The laser device 2B is configured to have a detachable bypass device 70. The bypass device 70 includes two high-reflection mirrors 72 and 74. The high-reflection mirrors 72 and 74 are examples of “multiple optical elements” in this disclosure. High-reflection mirror 72 is an example of “first high-reflection mirror” in this disclosure. High-reflection mirror 74 is an example of “second high-reflection mirror” in this disclosure.

[0063] The high-reflection mirrors 72 and 74 are housed in the housing 76 and held in predetermined positions within the housing 76. The high-reflection mirrors 72 and 74 form a bypass optical path that bypasses the L-OPS 100.

[0064] The laser device 2B has space between the L-OPS 100 and the PO beam steering unit 42 to allow the insertion of the bypass device 70. The housing 76 of the bypass device 70 is configured to be detachable from the laser device 2B. In Figures 4 and 5, the position where the bypass device 70 is attached to the laser device 2B is shown by a dashed line. When the housing 76 is attached to the laser device 2B, it is positioned and fixed relative to the PO beam steering unit 42. In Figures 4 and 5, the solid line shows the state in which the bypass device 70 has been removed from the laser device 2B.

[0065] Figures 6 and 7 show the laser device 2B with the bypass device 70 attached. The high-reflection mirror 72 is positioned to reflect the pulsed laser light emitted from the PO beam steering unit 42 and direct it onto the high-reflection mirror 74 when the bypass device 70 is attached to the laser device 2B. For example, the high-reflection mirror 72 is positioned at a 45° angle with respect to the incident optical axis of the L-OPS 100 and to reflect the pulsed laser light traveling along the incident optical axis at a 45° reflection angle.

[0066] The high-reflection mirror 74 is positioned to reflect the pulsed laser light incident from the high-reflection mirror 72 and direct it towards the high-reflection mirror 44c of the PO beam steering unit 42. For example, the high-reflection mirror 74 is positioned at a 45° angle with respect to the output optical axis of the L-OPS 100, so that it reflects the pulsed laser light incident from the high-reflection mirror 72 at a 45° reflection angle and returns it to the output optical path of the L-OPS 100. In other words, the high-reflection mirror 74 is positioned to emit pulsed laser light that has traveled through the bypass optical path into the optical path of the pulsed laser light emitted from the L-OPS 100 when the bypass device 70 is not attached to the laser device 2B.

[0067] In other words, the high-reflectivity mirrors 72 and 74 are positioned such that the angle between the incident light and the reflected light is 90°.

[0068] Figures 8 and 9 are schematic perspective views showing the configuration of the bypass device 70. Figure 8 shows the state with the bypass device 70 removed from the laser device 2B. Figure 9 shows the state with the bypass device 70 attached to the laser device 2B.

[0069] The housing 76 of the bypass device 70 has an optical input window 78A for directing pulsed laser light emitted from the PO beam steering unit 42 onto the high-reflection mirror 72. The housing 76 also has an optical output window 78B for directing pulsed laser light reflected by the high-reflection mirror 74 out of the housing 76.

[0070] The high-reflection mirrors 72 and 74 may be arranged such that the angle between the incident light and the reflected light is an angle other than 90°. The first high-reflection mirror, 72, should be arranged to guide the pulsed laser light to the bypass optical path by reflecting the pulsed laser light incident on the L-OPS 100 outwards from the L-OPS 100. The second high-reflection mirror, 74, should be arranged to return the pulsed laser light to the output optical path of the L-OPS 100 by reflecting the pulsed laser light that has been reflected by the high-reflection mirror 72 and is incident via the bypass optical path.

[0071] 3.2 Operation If the bypass device 70 is not installed on the laser device 2B, the pulsed laser beam emitted from the power oscillator 30 has its direction of travel changed by the high-reflection mirrors 44a and 44b of the PO beam steering unit 42. The pulsed laser beam, whose direction of travel has been changed by the high-reflection mirrors 44a and 44b, is incident on the L-OPS 100 located on the back of the laser device 2B.

[0072] The pulsed laser light incident on L-OPS100 has its pulse width extended by the delay optical path 106 and then returns to the PO beam steering unit 42. The pulsed laser light that returns to the PO beam steering unit 42 has its direction of travel changed by the high-reflection mirror 44c and is incident on OPS50. The pulsed laser light incident on OPS50 has its pulse width further extended by OPS50 and is emitted from the laser device 2B.

[0073] The bypass device 70 is attached to the laser device 2B, for example, when an abnormality occurs in the laser performance of the pulsed laser light emitted from the laser device 2B, during an investigation to identify the cause. When the bypass device 70 is attached to the laser device 2B, the pulsed laser light emitted from the high-reflection mirror 44b of the PO beam steering unit 42 and traveling along the incident optical axis of the L-OPS 100 is incident on the bypass device 70. The pulsed laser light incident on the bypass device 70 travels along the bypass optical path without passing through the L-OPS 100, and is then output along the output optical axis of the L-OPS 100. The pulsed laser light output from the bypass device 70 returns to the PO beam steering unit 42. The pulsed laser light that returns to the PO beam steering unit 42 has its direction of travel changed by the high-reflection mirror 44c and is incident on the OPS 50. The pulsed laser light incident on the OPS 50 has its pulse width extended by the OPS 50 and is emitted from the laser device 2B.

[0074] 3.3 Effects According to the laser device 2B and bypass device 70 of the second embodiment, by attaching the bypass device 70 to the laser device 2B, it becomes possible to bypass the L-OPS 100 and output pulsed laser light without removing the L-OPS 100 from the laser device 2B. Therefore, if an abnormality occurs in the laser performance of the laser device 2B, the cause can be easily identified by attaching and detaching the bypass device 70.

[0075] The installation of the bypass device 70 does not change the angle of the mirrors such as the L-OPS100 placed in the optical path, and removing the bypass device 70 returns the optical path to its original state, thus eliminating the need for optical axis adjustment. Therefore, the overall work time required to identify the cause can be shortened.

[0076] Similar to the first embodiment, the bypass device 70 can be easily attached to and detached from the laser device 2B. By attaching or detaching the bypass device 70, it becomes possible to select whether to prioritize the pulse width or output of the pulsed laser beam, thereby expanding the practical performance of the laser device 2B.

[0077] 4. Third Embodiment Next, a laser apparatus 2C according to the third embodiment of this disclosure will be described. Note that the differences from the configuration of the laser apparatus 2B according to the second embodiment will be explained below.

[0078] 4.1 Configuration Figure 10 is a schematic top view showing the configuration of the laser device 2C according to the third embodiment. Figure 11 is a schematic front view showing the configuration of the laser device 2C. The laser device 2C is configured to have a detachable bypass device 80 instead of the bypass device 70 of the second embodiment. The bypass device 80 is configured to be detachable from the front of the laser device 2C, i.e., the maintenance side. The other configurations of the laser device 2C are the same as those of the laser device 2B according to the second embodiment.

[0079] The bypass device 80 includes five high-reflection mirrors 81 to 85. The high-reflection mirrors 81 to 85 are examples of “multiple optical elements” in this disclosure. High-reflection mirror 81 is an example of “first high-reflection mirror” in this disclosure. High-reflection mirror 85 is an example of “second high-reflection mirror” in this disclosure.

[0080] The high-reflection mirrors 81-85 are housed in the housing 86 and held in predetermined positions within the housing 86. The high-reflection mirrors 81-85 form a bypass optical path that bypasses the L-OPS 100.

[0081] The laser device 2C has a space in the PO beam steering unit 42 that allows a portion of the bypass device 80 to be inserted. The housing 86 of the bypass device 80 is configured to be detachable from the laser device 2C. In Figures 10 and 11, the position where the bypass device 80 is attached to the laser device 2C is shown by a dashed line. When the housing 86 is attached to the laser device 2C, it is positioned and fixed relative to the PO beam steering unit 42. In Figures 10 and 11, the solid line shows the state in which the bypass device 80 has been removed from the laser device 2C.

[0082] Figures 12 and 13 show the laser device 2C with the bypass device 80 attached. The high-reflection mirrors 81 to 84 are positioned so that the pulsed laser light reflected by the high-reflection mirror 44a of the PO beam steering unit 42 is sequentially incident when the bypass device 80 is attached to the laser device 2C.

[0083] The high-reflection mirror 85 is positioned to reflect the pulsed laser light incident from the high-reflection mirror 84 and direct it into the OPS 50. In other words, the high-reflection mirror 85 is positioned to output pulsed laser light along the output optical axis of the PO beam steering unit 42.

[0084] Figures 14 and 15 are schematic perspective views showing the configuration of the bypass device 80. Figure 14 shows the state in which the bypass device 80 has been removed from the laser device 2C. Figure 15 shows the state in which the bypass device 80 has been installed on the laser device 2C.

[0085] The housing 86 of the bypass device 80 has an optical input window 87A formed therein for directing pulsed laser light reflected by the high-reflection mirror 44a of the PO beam steering unit 42 onto the high-reflection mirror 81. The housing 86 also has an optical output window 87B formed therein for directing pulsed laser light reflected by the high-reflection mirror 85 out of the housing 86.

[0086] As shown in Figure 15, the high-reflection mirror 81 is positioned to reflect the pulsed laser light that is reflected by the high-reflection mirror 44a of the PO beam steering unit 42 and propagates in the -V axis direction, and propagates in the +H axis direction. The high-reflection mirror 82 is positioned to reflect the pulsed laser light propagating in the +H axis direction and propagates in the +Z axis direction. The high-reflection mirror 83 is positioned to reflect the pulsed laser light propagating in the +Z axis direction and propagates in the -V axis direction. The high-reflection mirror 84 is positioned to reflect the pulsed laser light propagating in the -V axis direction and propagates in the -H axis direction. The high-reflection mirror 85 is positioned to reflect the pulsed laser light propagating in the -H axis direction and propagates in the +Z axis direction. In other words, the high-reflection mirrors 81 to 85 are positioned such that the angle between the incident light and the reflected light is 90°.

[0087] The high-reflection mirrors 81 to 85 may be arranged such that the angle between the incident light and the reflected light is an angle other than 90°. The first high-reflection mirror, high-reflection mirror 81, should be arranged to reflect the pulsed laser light incident on the L-OPS 100 outwards, thereby guiding the pulsed laser light to the bypass optical path. The second high-reflection mirror, high-reflection mirror 85, should be arranged to reflect the pulsed laser light that has been reflected by high-reflection mirror 81 and is incident via the bypass optical path, thereby returning the pulsed laser light to the output optical path of the L-OPS 100. The output optical path of the L-OPS 100 refers to the optical path from the pulsed laser light emitted from the L-OPS 100 until it is incident on the OPS 50.

[0088] 4.2 Operation When the bypass device 80 is not installed, the operation of the laser device 2C is the same as the operation of the laser device 2B according to the second embodiment. The pulsed laser light emitted from the power oscillator 30 has its direction of travel changed by the PO beam steering unit 42 and is incident on the L-OPS 100 located on the back of the laser device 2C. The pulsed laser light incident on the L-OPS 100 has its pulse width extended in the L-OPS 100, then returns to the PO beam steering unit 42, where its direction of travel is changed and it is incident on the OPS 50. The pulsed laser light incident on the OPS 50 has its pulse width further extended by the OPS 50 and is emitted from the laser device 2C.

[0089] The bypass device 80 is attached to the laser device 2C, for example, when an abnormality occurs in the laser performance of the pulsed laser light emitted from the laser device 2C, during an investigation to identify the cause. When the bypass device 80 is attached to the laser device 2C, the pulsed laser light emitted from the power oscillator 30 has its direction of travel changed by the high-reflection mirror 44a of the PO beam steering unit 42, and then enters the bypass device 80. The pulsed laser light that enters the bypass device 80 travels along the bypass optical path without passing through the L-OPS 100, and is output along the output optical axis of the PO beam steering unit 42. The pulsed laser light output from the bypass device 80 enters the OPS 50, where the pulse width is extended, and then it is emitted from the laser device 2C.

[0090] 4.3 Effects According to the laser device 2C and bypass device 80 of the third embodiment, by attaching the bypass device 80 to the laser device 2C, it is possible to bypass the L-OPS 100 and output pulsed laser light without removing the L-OPS 100 from the laser device 2C. In particular, since the bypass device 80 of the third embodiment can be attached and detached from the front of the laser device 2C, i.e., the maintenance side, the installation work is easy.

[0091] Furthermore, the laser device 2C and bypass device 80 according to the third embodiment provide the same effects as the laser device 2B and bypass device 70 according to the second embodiment.

[0092] 5. Modified Bypass Devices Next, a modified version of the bypass device will be described. The modified bypass device allows for adjustment of the optical axis of the bypass optical path.

[0093] 5.1 First Variation Figure 16 schematically shows the configuration of a bypass device 60A according to a first modification of the first embodiment. Similar to the bypass device 60 according to the first embodiment, the bypass device 60A includes four high-reflectivity mirrors 61 to 64 for forming a bypass optical path.

[0094] Of the high-reflection mirrors 61-64, high-reflection mirror 62 is held by a holder with a first actuator 90A, and high-reflection mirror 63 is held by a holder with a second actuator 90B. The first and second actuator holders 90A and 90B are housed together with the high-reflection mirrors 61-64 in a housing 65. The first and second actuator holders 90A and 90B are examples of the "optical axis adjustment mechanism" in this disclosure. High-reflection mirror 62 is an example of the "first optical element" in this disclosure. High-reflection mirror 63 is an example of the "second optical element" in this disclosure.

[0095] The first and second actuator-equipped holders 90A and 90B are each composed of, for example, a holder, a PZT (lead zirconate titanate) actuator, and an automatic micrometer.

[0096] The first actuator holder 90A holds the high-reflection mirror 62 and changes the attitude angle of the high-reflection mirror 62 with respect to two orthogonal axes. For example, the first actuator holder 90A rotates the high-reflection mirror 62 around the H-axis and around an axis parallel to the surface of the high-reflection mirror 62 and perpendicular to the H-axis.

[0097] Similarly, the holder 90B with the second actuator holds the high-reflection mirror 63 and changes the attitude angle of the high-reflection mirror 63 with respect to two orthogonal axes. For example, the holder 90B with the second actuator rotates the high-reflection mirror 63 around the H-axis and around an axis parallel to the surface of the high-reflection mirror 63 and perpendicular to the H-axis. The holders 90A and 90B with the first and second actuators are controlled by a controller (not shown).

[0098] The optical axis of the bypass optical path can be adjusted by changing the attitude angles of the high-reflectivity mirrors 62 and 63 with respect to two axes. Specifically, the direction and position of the pulsed laser light traveling through the bypass optical path can be adjusted.

[0099] When a bypass device 60A is attached to the laser device 2A according to the first embodiment, a misalignment may occur between the output optical axis of the OPS 50 and the output optical axis of the bypass device 60A. Even if such a misalignment occurs, the output optical axis of the bypass device 60A can be aligned with the output optical axis of the OPS 50 by controlling the holders 90A and 90B with the first and second actuators.

[0100] Furthermore, the example shown in Figure 16 is not limited to this; any two of the high-reflection mirrors 61-64 may be held by the first and second actuator-equipped holders 90A and 90B.

[0101] 5.2 Second Variation Figure 17 schematically shows the configuration of a bypass device 60B according to a second modification of the first embodiment. The bypass device 60B includes four high-reflection mirrors 61-64 and a translucent parallel plate substrate 66. The parallel plate substrate 66 is formed of, for example, synthetic quartz or calcium fluoride (CaF2). The high-reflection mirrors 61-64 and the parallel plate substrate 66 are examples of the "multiple optical elements" in this disclosure.

[0102] Of the high-reflection mirrors 61-64, high-reflection mirror 62 is held by a first actuator holder 90C. The first actuator holder 90C has the same configuration as the first actuator holder 90A described in the first modified example, and holds the high-reflection mirror 62 and changes the attitude angle of the high-reflection mirror 62 with respect to two orthogonal axes. The first and second actuator holders 90C and 90D are housed in the housing 65 together with the high-reflection mirrors 61-64 and the parallel plate substrate 66. The first and second actuator holders 90C and 90D are examples of the "optical axis adjustment mechanism" in this disclosure. The high-reflection mirror 62 is also an example of the "first optical element" in this disclosure.

[0103] The parallel plate substrate 66 is positioned at an angle on the optical path through which the pulsed laser light reflected by the high-reflection mirror 62 travels to the high-reflection mirror 63. The parallel plate substrate 66 transmits the pulsed laser light incident from the high-reflection mirror 62 and directs it to the high-reflection mirror 63. The parallel plate substrate 66 is an example of the "second optical element" in this disclosure.

[0104] The parallel plate substrate 66 is held by a second actuator holder 90D. The second actuator holder 90D has the same configuration as the first actuator holder 90A described in the first modified example, and holds the parallel plate substrate 66 and changes the orientation angle of the parallel plate substrate 66 with respect to two orthogonal axes. For example, the second actuator holder 90D rotates the parallel plate substrate 66 around the H axis and around an axis parallel to the surface of the parallel plate substrate 66 and perpendicular to the H axis. The first and second actuator holders 90C and 90D are controlled by a controller (not shown).

[0105] The optical axis of the bypass optical path can be adjusted by changing the attitude angle of the high-reflection mirror 62 and the parallel plate substrate 66 with respect to two axes. Specifically, by changing the attitude angle of the high-reflection mirror 62, the direction of propagation of the pulsed laser light traveling through the bypass optical path can be adjusted.

[0106] Furthermore, the position of the pulsed laser beam can be adjusted by changing the orientation angle of the parallel plate substrate 66. The amount of change in position due to the pulsed laser beam passing through the parallel plate substrate 66 depends on the angle of incidence to the parallel plate substrate 66, the thickness of the parallel plate substrate 66, and the refractive index of the parallel plate substrate 66. By changing the orientation angle of the parallel plate substrate 66, the position of the pulsed laser beam changes as the angle of incidence to the parallel plate substrate 66 changes.

[0107] In the example shown in Figure 17, the high-reflection mirror 62 is held by the holder 90C with the first actuator, which serves as an optical axis adjustment mechanism. However, any of the high-reflection mirrors 61 to 64 may be held by the holder 90C with the first actuator.

[0108] Furthermore, in the example shown in Figure 17, a parallel plate substrate 66 is placed between the high-reflection mirror 62 and the high-reflection mirror 63. Alternatively, the parallel plate substrate 66 may be placed between the high-reflection mirror 61 and the high-reflection mirror 62, or between the high-reflection mirror 63 and the high-reflection mirror 64. The parallel plate substrate 66 may also be placed on the light-incident side of the high-reflection mirror 61, or on the light-emitting side of the high-reflection mirror 64.

[0109] 5.3 Other variations In the bypass device 70 according to the second embodiment, each of the high-reflection mirrors 72 and 74 may be provided with an actuator-equipped holder as an optical axis adjustment mechanism. Alternatively, an actuator-equipped holder may be provided on one of the high-reflection mirrors 72 and 74, and a parallel plate substrate held by the actuator-equipped holder may be placed between the high-reflection mirror 72 and the high-reflection mirror 74. Furthermore, a parallel plate substrate held by the actuator-equipped holder may be placed on the light-incident side of the high-reflection mirror 72 or on the light-emitting side of the high-reflection mirror 74. In addition, the light-incident window 78A and the light-emitting window 78B are not essential and may simply be openings through which light passes.

[0110] Furthermore, actuator-equipped holders may be provided on any two high-reflection mirrors selected from the high-reflection mirrors 81 to 85 included in the bypass device 80 according to the third embodiment. Alternatively, actuator-equipped holders may be provided on one high-reflection mirror selected from the high-reflection mirrors 81 to 85, and parallel plate substrates held by actuator-equipped holders may be placed between two high-reflection mirrors selected from the high-reflection mirrors 81 to 85. Furthermore, parallel plate substrates held by actuator-equipped holders may be placed on the light-incident side of the high-reflection mirror 81 or on the light-emitting side of the high-reflection mirror 85. Moreover, the light-incident window 87A and the light-emitting window 87B are not essential and may simply be openings through which light passes.

[0111] Furthermore, the actuator-equipped holder, which serves as the optical axis adjustment mechanism, may be provided on three or more of the multiple optical elements that form the bypass optical path. Alternatively, two or more of the multiple optical elements that form the bypass optical path may be parallel plate substrates, and the actuator-equipped holder may be provided on each of the parallel plate substrates.

[0112] 6. Methods for Manufacturing Electronic Devices Figure 18 schematically shows an example configuration of the exposure apparatus 200. The exposure apparatus 200 includes an illumination optical system 204 and a projection optical system 206. The illumination optical system 204 illuminates the reticle pattern of a reticle (not shown) placed on a reticle stage RT with pulsed laser light incident from, for example, a laser apparatus 2A according to the first embodiment. The projection optical system 206 reduces and projects the pulsed laser light that has passed through the reticle onto a workpiece (not shown) placed on a workpiece table WT to form an image. The workpiece is a photosensitive substrate such as a semiconductor wafer coated with photoresist.

[0113] The exposure apparatus 200 exposes the workpiece to pulsed laser light reflecting the reticle pattern by synchronously moving the reticle stage RT and the workpiece table WT in parallel. After transferring the reticle pattern to the semiconductor wafer through the exposure process described above, a semiconductor device can be manufactured by going through several processes. The semiconductor device is an example of an "electronic device" in this disclosure.

[0114] Furthermore, the laser device 2A that injects pulsed laser light into the exposure apparatus 200 may or may not have a bypass device 60 attached. When exposing a wafer, the priority of either the pulse width or the output of the pulsed laser light can be selected by attaching or detaching the bypass device 60. Note that the laser device may be used not only as laser device 2A, but also as described above, such as laser device 2B or laser device 2C.

[0115] The above description is intended to be illustrative and not restrictive. It will therefore be apparent to those skilled in the art that modifications can be made to each embodiment of this disclosure without departing from the scope of the attached claims.

[0116] Terms used throughout this specification and the accompanying claims should be interpreted as “non-limiting.” For example, the terms “includes” or “contains” should be interpreted as “not limited to what is described as included.” The term “has” should be interpreted as “not limited to what is described as having.” Furthermore, the modifying phrase “one” as used throughout this specification and the accompanying claims should be interpreted as “at least one” or “one or more.”

Claims

1. A pulse width extension device for extending the pulse width of incident pulsed laser light, A space for inserting a part of a bypass device that forms a bypass optical path bypassing the pulse width extension device, Equipped with, The bypass device is configured to be detachable. Laser device.

2. A laser apparatus according to Claim 1, The bypass device is positioned and fixed relative to the pulse width expansion device when it is attached to the laser device.

3. A laser apparatus according to claim 1, A master oscillator that outputs seed light, A power oscillator that receives the aforementioned seed light and outputs it as amplified pulsed laser light, A beam steering device that guides the pulsed laser light output from the power oscillator to the pulse width expansion device, Equipped with, The bypass device is positioned and fixed relative to the beam steering device when it is attached to the laser device.

4. A laser apparatus according to claim 1, Equipped with an exterior cover panel, The bypass device is configured to be detachable from the maintenance side of the outer circumferential surface of the laser device, which is the side on which the outer cover panel opens.

5. A laser apparatus according to claim 1, The bypass device is Multiple optical elements forming the bypass optical path, A housing for housing the aforementioned plurality of optical elements, Equipped with, The aforementioned plurality of optical elements include: A first high-reflectivity mirror that reflects the pulsed laser light incident on the pulse width expansion device toward the outside of the pulse width expansion device and guides it toward the bypass optical path, A second high-reflectivity mirror reflects the pulsed laser light that is incident via the bypass optical path and returns it to the output optical path of the pulse width expansion device, which is reflected by the first high-reflectivity mirror. It includes.

6. A laser apparatus according to claim 5, The bypass device further includes an optical axis adjustment mechanism for adjusting the optical axis of the bypass optical path.

7. A laser apparatus according to claim 6, The optical axis adjustment mechanism includes a holder with a first actuator that holds a first optical element among the plurality of optical elements and changes its attitude angle, and a holder with a second actuator that holds a second optical element and changes its attitude angle.

8. A laser apparatus according to claim 7, The first optical element and the second optical element are high-reflectivity mirrors.

9. A laser apparatus according to claim 7, The first optical element is a high-reflectivity mirror, The second optical element is a light-transmitting parallel plate substrate.

10. A laser apparatus according to claim 5, The first high-reflectivity mirror reflects the pulsed laser light output from a beam steering device that changes the direction of propagation of the incident pulsed laser light. The second high-reflectivity mirror outputs the pulsed laser light, which has been incident through the bypass optical path, along the output optical axis of the pulse width expansion device and returns it to the output optical path.

11. A laser apparatus according to claim 5, The first high-reflection mirror reflects the pulsed laser light output from one high-reflection mirror included in a beam steering device that changes the direction of propagation of the incident pulsed laser light. The second high-reflectivity mirror outputs the pulsed laser light, which has been incident through the bypass optical path, along the output optical axis of the pulse width expansion device and returns it to the beam steering device.

12. A laser apparatus according to claim 5, The first high-reflection mirror reflects the pulsed laser light output from one high-reflection mirror included in a beam steering device that changes the direction of propagation of the incident pulsed laser light. The second high-reflectivity mirror outputs the pulsed laser light, which has been incident through the bypass optical path, along the output optical axis of the beam steering device and returns it to the output optical path.

13. A method for manufacturing an electronic device, A pulse width extension device that extends the pulse width of incident pulsed laser light, A space for inserting a part of a bypass device that forms a bypass optical path bypassing the pulse width extension device, Equipped with, The bypass device is configured to be detachable. A laser device generates pulsed laser light, The pulsed laser light is output to the exposure apparatus, To manufacture an electronic device, the process involves exposing a photosensitive substrate to pulsed laser light within the exposure apparatus, A method for manufacturing electronic devices.

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