Deformable suction cup for die bonding and die bonding method using deformable suction cup

Abstract

This invention provides a deformable suction cup for die bonding that precisely positions the die in the die mounting area. [Solution] A deformable suction cup for die bonding comprises a main body 10, a gasket 20, and a die bonding device 30. The neck portion 12 of the main body is connected to the top portion 11 and the bottom portion 13 of the main body. A chamber 14 is jointly formed between the bottom surface of the top portion of the main body, the outer surface of the neck portion of the main body, and the top surface of the bottom portion of the main body. A first passage 151 is jointly opened in the top portion, neck portion, and bottom portion of the main body. A perforation 111 communicating with the chamber is opened in the top portion of the main body. The gasket is provided on the outside of the chamber, with its top portion in contact with the bottom surface of the top portion of the main body and its bottom portion in contact with the top surface of the bottom portion of the main body. The die bonding device is provided on the bottom surface of the bottom portion of the main body, with a through hole 31 communicating with the first passage, and the die and the die mounting area are brought into central contact by the negative pressure supplied from the perforation.

Description

Technical Field

[0001] The present invention relates to an adsorption chuck and a die bonding method, and particularly to a modified adsorption chuck for die bonding and a die bonding method using the modified adsorption chuck.

Background Art

[0002] Integrated circuits are manufactured on semiconductor wafers through a plurality of processes in a batch manner, and the wafers are further divided into a plurality of dies. In other words, a die is a small, unpackage integrated circuit body made of semiconductor material. The plurality of divided dies are aligned and attached to a placement device, and then the placement frame is responsible for transporting the placement device and sequentially transfers the dies to a plurality of die placement areas on the substrate for subsequent processing processes.

[0003] The wafer-to-wafer direct bonding technology has been carried out for many years, belongs to the previous process, and the cleanliness and accuracy can be easily controlled. Also, the size of the wafer is usually 6 to 12 inches, and when the size is large, it is relatively easy to control the generation of the bonding wave. The problem with wafer-to-wafer direct bonding is that it is not easy to apply to system-on-a-chip. The reason is that system-on-a-chip is generally formed by combining different chips of each company, and different logic circuits are manufactured with the same photomask from the beginning, so the manufacturing cost is very high.

[0004] The die-to-wafer bonding technology is a technology developed to integrate different chiplets of each company, which can save a large amount of development costs, can directly apply existing chiplet solutions of other companies in the system-on-a-chip process, and there is no need to develop a dedicated logic circuit separately. Therefore, the die-to-wafer bonding technology is the current development trend.

[0005] Conventional soldering bonding technology is already nearing its limits, and in order to reduce the size of the die and contacts, direct copper contact bonding technology (i.e., mixed bonding technology) is a preferred solution for die-to-wafer bonding technology.

[0006] However, regarding wafer-to-wafer direct bonding technology, the small die size and the extreme difficulty in controlling bonding waves have prevented the development of die-to-wafer mixed bonding technology. Below, we introduce three commonly used die-to-wafer bonding technologies.

[0007] The first die-to-wafer bonding technology involves a die bonding apparatus first adsorbing the die from a mounting device, then moving the die to the substrate to bring it into direct contact with the substrate, and finally detaching the die bonding apparatus from the die to fix it to the substrate. The problem with this technology is that the die, along with the substrate, is prone to trapping air bubbles and generating voids. Because the die and substrate are not in complete contact, subsequent processing of the die is susceptible to the effects of these air bubbles, resulting in a decrease in the yield of products manufactured in subsequent processing.

[0008] The second die-to-wafer bonding technology involves a die bonding apparatus transferring the die to the substrate using a throwing method. The problems with this technology are: firstly, because the die has a certain mass, when it falls onto the die placement area with acceleration due to gravity, a relatively large impact force is generated, increasing the contact force between the die and the substrate and causing damage; and secondly, it is difficult to accurately place the die onto the die placement area.

[0009] The third die-to-wafer bonding technology has three elastic members inside the die bonding apparatus, which are located on the opposite side of the fixed surface. The K values ​​of the two peripheral elastic members are smaller than the K value of the centrally positioning elastic member, and the K value is the spring constant. When the die bonding apparatus moves toward the substrate, the elastic members with different K values ​​inside and out deform due to inertia, and the center of the die contacts the substrate first, after which a bonding wave is generated, precisely transferring the die to the die mounting area. The problems with this technology are, firstly, that when the die bonding apparatus moves toward the substrate, these elastic members impart a large mass inertia to the die, resulting in a large impact force when the die contacts the substrate and can cause damage; and secondly, because the die bonding apparatus itself has a small volume, the elastic members are also very small, making assembly difficult and resulting in high manufacturing costs.

[0010] Furthermore, in the three die bonding methods described above, the bonding speed of the die to the substrate is too fast, making the die prone to damage, distortion, or bending. [Overview of the Initiative] [Problems that the invention aims to solve]

[0011] The main objective of the present invention is to provide a deformable suction cup for die bonding and a die bonding method using the deformable suction cup that can ensure that the die and the die mounting area are in central contact.

[0012] Another object of the present invention is to provide a deformable suction cup for die bonding and a die bonding method using the deformable suction cup, which can accurately position a die in a die mounting area.

[0013] Another object of the present invention is to provide a deformable suction cup for die bonding that can be bonded to a die mounting area at an appropriate bonding speed, and a die bonding method using the deformable suction cup. [Means for solving the problem]

[0014] To achieve the above objective, the present invention provides a deformable suction cup for die bonding comprising a body, a gasket, and a die bonding device. The body comprises a body including a top portion, a neck portion, and a bottom portion, wherein the neck portion of the body is connected to the top portion and the bottom portion of the body, a chamber is jointly formed between the bottom surface of the top portion of the body, the outer surface of the neck portion of the body, and the top surface of the bottom portion of the body, a first passage is jointly opened in the top portion, the neck portion, and the bottom portion of the body, and a perforation communicating with the chamber is opened in the top portion of the body; a gasket provided on the outside of the chamber, the top portion of which abuts the bottom surface of the top portion of the body, and the bottom portion of which abuts the top surface of the bottom portion of the body; and a die bonding device provided on the bottom surface of the bottom portion of the body, with a through hole communicating with the first passage.

[0015] To achieve the above objective, the present invention provides a die bonding method using a deformable suction cup, comprising the following steps: The second passages in the top, neck, and bottom portions of the body of the deformable suction cup for die bonding, and a plurality of through holes in the bottom portion of the body, jointly supply negative pressure, so that the bottom portion of the body adheres to the die bonding device of the deformable suction cup for die bonding due to the negative pressure of the second passages and the through holes; The first passages in the top, neck, and bottom portions of the body, and the through holes of the die bonding device jointly supply negative pressure, so that the die bonding device adheres to the negative pressure of the first passages and the through holes. Therefore, in the step of adsorbing the die, the perforation in the top part of the main body supplies negative pressure, and the chamber between the bottom surface of the top part of the main body, the outer surface of the neck part of the main body, and the top surface of the bottom part of the main body cooperates with the gasket of the deformable suction cup for die bonding provided on the outside of the chamber by the negative pressure of the perforation to create a vacuum state, so that the outside of the bottom part of the main body, the outside of the die bonding apparatus, and the outside of the die are synchronously bent upward, and the deformable suction cup for die bonding A die bonding method using a deformable suction cup, comprising the steps of: compressing the gasket of the suction cup by the top and bottom portions of the main body; moving the deformable suction cup for die bonding downward until the center of the die contacts the center of the die mounting area of ​​the substrate, and after the center of the die contacts the center of the die mounting area, forming a bonding wave; gradually restoring the shape of the bottom portion of the main body, the gasket, the die bonding apparatus and the die, and gradually fixing the die to the die mounting area, as the negative pressure in the first passage, the second passage, the through hole, the through hole and the perforation gradually decreases synchronously and the bonding wave gradually propagates from the center of the die toward the periphery of the die; and completely fixing the die to the die mounting area, with the first passage, the second passage, the through hole, the through hole and the perforation ceasing to supply negative pressure; and moving the deformable suction cup for die bonding upward to separate from the die and the substrate.

Brief Description of the Drawings

[0016] [Figure 1] It is a perspective view of the main body of the deformable suction cup of the present invention. [Figure 2] It is a cross-sectional view of the deformable suction cup of the present invention. [Figure 3] It is a flowchart of the first embodiment of the method of the present invention. [Figure 4] It is a schematic view of step S10 of the first embodiment of the method of the present invention. [Figure 5] It is a schematic view of step S20 of the first embodiment of the method of the present invention. [Figure 6] It is a schematic view of step S30 of the first embodiment of the method of the present invention. [Figure 7] It is a schematic view of step S40 of the first embodiment of the method of the present invention. [Figure 8] It is a schematic view of step S50 of the first embodiment of the method of the present invention. [Figure 9] It is a schematic view of step S60 of the first embodiment of the method of the present invention. [Figure 10] It is a flowchart of the second embodiment of the method of the present invention. [Figure 11] It is a schematic view of step S40A of the second embodiment of the method of the present invention. [Figure 12] It is a schematic view of step S50A of the second embodiment of the method of the present invention. [Figure 13] It is a schematic view of step S60A of the second embodiment of the method of the present invention. [Figure 14] It is a flowchart of the third embodiment of the method of the present invention. <所 [Figure 15] It is a schematic view of step S40B of the third embodiment of the method of the present invention. [Figure 16] It is a schematic view of step S50B of the third embodiment of the method of the present invention. [Figure 17] It is a schematic view of step S60B of the third embodiment of the method of the present invention. [Figure 18]This is a schematic diagram of a die bonding apparatus of different sizes according to the present invention adsorbing dies of different sizes.

Embodiments for Carrying Out the Invention

[0017] As shown in FIGS. 1 and 2, the present invention provides a modified adsorption chuck for die bonding, which includes a main body 10, a gasket 20, and a die bonding apparatus 30. The main body 10 includes a top portion 11, a neck portion 12, and a bottom portion 13. The neck portion 12 is connected to the top portion 11 and the bottom portion 13. A chamber 14 is jointly formed between the bottom surface of the top portion 11, the outer surface of the neck portion 12, and the top surface of the bottom portion 13. A first passage 151 and a second passage 152 are jointly opened in the top portion 11, the neck portion 12, and the bottom portion 13. A through hole 111 communicating with the chamber 14 is opened in the top portion 11. A plurality of through holes 131, 132, 133 are opened in the bottom portion 13, and the through holes 131, 132, 133 communicate with the first passage 151 and the second passage 152. The gasket 20 is provided outside the chamber 14. The top portion of the gasket 20 abuts against the bottom surface of the top portion 11, and the bottom portion of the gasket 20 abuts against the top surface of the bottom portion 13. The die bonding apparatus 30 is provided on the bottom surface of the bottom portion 13, and a through hole 31 communicating with the first passage 151 is opened.

[0018] The present invention provides a die bonding method using a modified adsorption chuck including the following steps.

[0019] Step S10: As shown in FIGS. 3 and 4, the second passage 152 and the through holes 131, 132, 133 jointly supply a negative pressure 16, and the bottom portion 13 adsorbs the die bonding apparatus 30 by the negative pressure 16 of the second passage 152 and the through holes 131, 132, 133. The first passage 151 and the through hole 31 jointly supply a negative pressure 17, and the die bonding apparatus 30 adsorbs the die 40 by the negative pressure 17 of the first passage 151 and the through hole 31.

[0020] In step S20, as shown in Figures 3 and 5, the perforation 111 supplies negative pressure 18, and the chamber 14 cooperates with the gasket 20 due to the negative pressure 18 from the perforation 111 to create a vacuum, causing the outside of the bottom portion 13, the outside of the die bonding apparatus 30, and the outside of the die 40 to bend upward synchronously, and the gasket 20 to be compressed by the top portion 11 and the bottom portion 13.

[0021] Step S30: As shown in Figures 3 and 6, the deformable suction cup for die bonding of the present invention moves downward until the center of the die 40 contacts the center of the die mounting area 51 on the substrate 50, and after the center of the die 40 contacts the center of the die mounting area 51, a bonding wave 60 is formed.

[0022] In step S40, as shown in Figures 3 and 7, the negative pressures 16, 17, and 18 in the first passage 151, the second passage 152, the through holes 131, 132, 133, the through hole 31, and the perforation 111 gradually decrease synchronously, and the bonding wave 60 gradually propagates from the center of the die 40 toward the periphery of the die 40, gradually restoring the shape of the bottom portion 13, the gasket 20, the die bonding apparatus 30, and the die 40, and gradually fixing the die 40 in the die mounting area 51.

[0023] In step S50, as shown in Figures 3 and 8, the die 40 is completely fixed in the die mounting area 51, and the first passage 151, the second passage 152, the through holes 131, 132, 133, the through hole 31, and the perforation 111 stop supplying negative pressure 16, 17, 18.

[0024] In step S60, as shown in Figures 3 and 9, the deformable suction cup for die bonding of the present invention moves upward and separates from the die 40 and the substrate 50.

[0025] As a result, the present invention can attract the die bonding apparatus 30 by the negative pressure 16 of the second passage 152 and the through holes 131, 132, and 133, and attract the die 40 by the negative pressure 17 of the first passage 151 and the through hole 31. Thus, the present invention controls the outside of the bottom portion 13, the outside of the die bonding apparatus 30, and the outside of the die 40 to bend upward synchronously by the negative pressure 18 supplied by the perforation 111, ensuring that the die 40 and the die mounting area 51 are in central contact. The force with which the die 40 contacts the substrate 50 is limited only to the mass of the die 40, resulting in an extremely small force that does not damage the die 40, and there is no need to attach an elastic member, resulting in low manufacturing costs.

[0026] Furthermore, the present invention controls the negative pressures 16, 17, and 18 of the first passage 151, the second passage 152, the through holes 131, 132, 133, the through hole 31, and the perforation 111 to decrease synchronously, thereby gradually restoring the shape of the main body 10, the gasket 20, the die bonding device 30, and the die 40, and working in cooperation with the bonding wave 60 to completely fix the die 40 in the die mounting area 51, and has the following two effects: First, the die 40 The objectives are: firstly, to ensure that the die 40 is precisely placed in the die placement area 51, that the die 40 is tightly bonded to the substrate 50, completely eliminating any situation where air bubbles are trapped between the die 40 and the substrate 50, and that there are no voids between the die 40 and the substrate 50, thereby improving the yield of products manufactured by subsequent processing of the die 40; secondly, to control the die 40 so that it is bonded to the die placement area 51 at an appropriate bonding speed, thereby avoiding damage, distortion, or bending of the die 40.

[0027] As shown in Figures 1 and 2, in a preferred embodiment, the passage 15 is located in the center of the main body 10, the through hole 31 is located in the center of the die bonding apparatus 30, and the die bonding apparatus 30 attracts the center of the die 40. As a result, the die bonding apparatus 30 attracts the center of the die 40 and provides a center-fixing effect, making the outside of the die 40 easier to bend upward together with the outside of the die bonding apparatus 30.

[0028] As shown in Figures 1 and 2, in a preferred embodiment, the bottom portion 13 is dish-shaped, the through holes 131, 132, and 133 are annular and spaced apart, and the bottom portion 13 is provided with a plurality of connecting passages 134, the connecting passages 134 extending radially and spaced apart, and communicating with the through holes 131, 132, and 133. As a result, the negative pressure 16 of the second passage 152 diffuses to the through holes 131, 132, and 133 via the connecting passages 134, and the through holes 131, 132, and 133 supply a uniform negative pressure 16 to the bottom portion 13, so that the bottom portion 13 can attract the die bonding device 30 with a uniform negative pressure 16.

[0029] As shown in Figures 1 and 2, in a preferred embodiment, the thickness of the bottom portion 13 gradually decreases from its center outward. As a result, the curvature of the bottom portion 13 increases as it approaches its outer edge, and the curvature of the die bonding apparatus 30 and the die 40 also increases as they approach their outer edges, ensuring better contact between the die 40 and the die mounting area 51 at the center.

[0030] Preferably, the material of the gasket 20 is rubber, which has excellent elastic deformation ability, shape recovery ability and sealing ability, but the present invention is not limited thereto. Any soft material having elastic deformation ability, shape recovery ability and sealing ability is suitable as the material of the gasket 20.

[0031] Preferably, the material of the die bonding apparatus 30 is rubber, which has excellent elastic deformation ability, shape recovery ability and sealing ability, but the present invention is not limited thereto. Any soft material having elastic deformation ability, shape recovery ability and sealing ability is suitable as the material of the die bonding apparatus 30.

[0032] The differences between the method of the second embodiment and the method of the first embodiment are: firstly, in step S40A, as shown in Figures 10 and 11, the negative pressure 17 in the first passage 151 and through hole 31 gradually decreases, while the negative pressures 16 and 18 in the second passage 152, the through holes 131, 132, 133 and perforation 111 remain unchanged, and the bonding wave 60 gradually propagates from the center of the die 40 to the periphery of the die 40, gradually restoring the shape of the die 40, and the die 40 is gradually fixed in the die mounting area 51, maintaining the state in which the outside of the bottom portion 13 and the outside of the die bonding device 30 are bent upward, and the gasket 20 is continuously compressed by the top portion 11 and the bottom portion 13; secondly, in step S50A, as shown in Figures 10 and 12, the die 40 is completely fixed in the die mounting area 51, and the first passage 151 and through hole The third is that, in step S60A, as shown in Figures 10 and 13, the deformable suction cup for die bonding of the present invention moves upward and away from the die 40 and the substrate 50, and the second passage 152, the through holes 131, 132, 133 and the perforation 111 continue to supply negative pressure 16 and 18, thereby maintaining the state in which the outside of the bottom portion 13 and the outside of the die bonding device 30 are folded upward, and the gasket 20 is continuously compressed by the top portion 11 and the bottom portion 13.

[0033] The difference between the effects of the second embodiment and the first embodiment is that the present invention can gradually restore the shape of the die 40 by controlling the negative pressure 16 in the first passage 151 and the through hole 31 to gradually decrease.

[0034] The differences between the method of the third embodiment and the method of the first embodiment are: firstly, in step S40B, as shown in Figures 14 and 15, the negative pressures 16 and 17 in the first passage 151, the second passage 152, the through holes 131, 132, 133 and the through hole 31 decrease synchronously, the negative pressure 18 in the perforation 111 is maintained, and the bonding wave 60 propagates gradually from the center of the die 40 to the periphery of the die 40, gradually restoring the shape of the die bonding apparatus 30 and the die 40, and the die 40 is gradually fixed in the die mounting area 51, the outer part of the bottom portion 13 is kept folded upward, and the gasket 20 is continuously compressed by the top portion 11 and the bottom portion 13; secondly, in step S50B, as shown in Figures 14 and 16, the die 4 The first step is to fully fix the die in the die mounting area 51, and the first passage 151, the second passage 152, the through holes 131, 132, 133 and the through hole 31 stop supplying negative pressure 16, 17, while the perforation 111 continues to supply negative pressure 18, thereby maintaining the outer side of the bottom portion 13 in an upward-folded state and the gasket 20 being continuously compressed by the top portion 11 and the bottom portion 13; third, in step S60B, as shown in Figures 14 and 17, the deformable suction cup for die bonding of the present invention moves upward away from the die 40 and the substrate 50, and the perforation 111 continues to supply negative pressure 18, thereby maintaining the outer side of the bottom portion 13 in an upward-folded state and the gasket 20 being continuously compressed by the top portion 11 and the bottom portion 13.

[0035] The difference between the effects of the third embodiment and the first embodiment is that the present invention can gradually restore the shape of the die bonding apparatus 30 and the die 40 by controlling the negative pressures 16 and 17 of the first passage 151, the second passage 152, the through holes 131, 132, 133 and the through hole 31 to decrease synchronously.

[0036] As shown in Figure 18, different sized die bonding apparatuses 30A can adsorb dies 40A of different sizes. [Explanation of Symbols]

[0037] 10: Main unit 11: Top section 111: Perforation 12: Neck section 13: Bottom section 131,132,133:Through hole 134: Communication path 14: Chamber 151: 1st aisle 152:Second aisle 16,17,18: Negative pressure 20: Gasket 30,30A: Die bonding equipment 31: Through hole 40,40A: Die 50: Circuit board 51: Die mounting area 60: Bonding Wave S10~S60, S40A, S40B, S50A, S50B, S60A, S60B: Step

Claims

1. A deformable suction cup for die bonding, A body comprising a top portion, a neck portion, and a bottom portion, wherein the neck portion of the body is connected to the top portion and the bottom portion of the body, a chamber is jointly formed between the bottom surface of the top portion of the body, the outer surface of the neck portion of the body, and the top surface of the bottom portion of the body, a first passage is jointly opened in the top portion, the neck portion, and the bottom portion of the body, and a perforation communicating with the chamber is opened in the top portion of the body, A gasket provided on the outside of the chamber, the top portion of which abuts against the bottom surface of the top portion of the main body, and the bottom portion of which abuts against the top surface of the bottom portion of the main body, A die bonding device provided on the bottom surface of the bottom portion of the main body, having a through hole that communicates with the first passage, A deformable suction cup for die bonding, equipped with a die bonding mechanism.

2. A deformable suction cup according to claim 1, wherein a second passage is jointly provided in the top portion, neck portion, and bottom portion of the main body, a plurality of through holes are provided in the bottom portion of the main body, the through holes communicate with the first passage and the second passage, the first passage, the second passage and the through holes jointly supply negative pressure, and the bottom portion of the main body adsorbs the die bonding device by the negative pressure of the second passage and the through holes.

3. The deformable suction cup according to claim 2, wherein the first passage and the through hole jointly supply negative pressure, and the die bonding apparatus adsorbs the die by the negative pressure of the first passage and the through hole.

4. The deformable suction cup according to claim 3, wherein the perforation supplies negative pressure, and the chamber, in cooperation with the gasket by the negative pressure of the perforation, exhibits a vacuum state, causing the outside of the bottom portion of the main body, the outside of the die bonding apparatus, and the outside of the die to bend upward synchronously, and the gasket is compressed by the top portion and the bottom portion of the main body.

5. The deformable suction cup for die bonding moves downward until the center of the die contacts the center of the die mounting area on the substrate, and after the center of the die contacts the center of the die mounting area, it forms a bonding wave. As the negative pressure in the first passage, the second passage, the through hole, the through hole, and the perforation decreases synchronously, and the bonding wave gradually propagates from the center of the die toward the periphery of the die, the shape of the bottom portion of the main body, the gasket, the die bonding apparatus, and the die is gradually restored, and the die is gradually fixed in the die mounting area, The die is completely fixed in the die mounting area, and the first passage, the second passage, the through hole, the through hole and the perforation are stopped from supplying negative pressure. The deformable suction cup for die bonding according to claim 4, wherein the deformable suction cup moves upward and separates from the die and the substrate.

6. The deformable suction cup for die bonding moves downward until the center of the die contacts the center of the die mounting area on the substrate, and after the center of the die contacts the center of the die mounting area, it forms a bonding wave. As the negative pressure in the first passage and the through hole gradually decreases, and the negative pressure in the second passage, the through hole and the perforation remains unchanged, and as the bonding wave gradually propagates from the center of the die to the periphery of the die, the shape of the die is gradually restored, the die is gradually fixed in the die mounting area, the outer side of the bottom portion of the main body and the outer side of the die bonding device are kept bent upward, and the gasket is continuously compressed by the top portion and the bottom portion of the main body, The die is completely fixed in the die mounting area, the first passage and the through hole stop supplying negative pressure, and the second passage, the through hole and the perforation continue to supply negative pressure, thereby maintaining the outer side of the bottom portion of the main body and the outer side of the die bonding device in an upwardly bent state, and the gasket is continuously compressed by the top portion and the bottom portion of the main body. The deformable suction cup for die bonding moves upward and separates from the die and the substrate, and the second passage, the through hole and the perforation continuously supply negative pressure, thereby maintaining the outer side of the bottom portion of the main body and the outer side of the die bonding device in an upwardly bent state, and the gasket is continuously compressed by the top portion and the bottom portion of the main body, according to claim 4.

7. The deformable suction cup for die bonding moves downward until the center of the die contacts the center of the die mounting area on the substrate, and after the center of the die contacts the center of the die mounting area, it forms a bonding wave. The negative pressure in the first passage, the second passage, the through-hole, and the through-hole decreases synchronously and gradually, the negative pressure in the perforation is maintained, and the bonding wave gradually propagates from the center of the die to the periphery of the die, thereby gradually restoring the shape of the die bonding apparatus and the die, and the die is gradually fixed in the die mounting area, the outer part of the bottom portion of the main body is kept bent upward, and the gasket is continuously compressed by the top portion and the bottom portion of the main body. The die is completely fixed in the die mounting area, the first passage, the second passage, the through hole and the through-hole stop supplying negative pressure, and the perforation continues to supply negative pressure, thereby maintaining the outer side of the bottom portion of the body in an upwardly folded state, and the gasket is continuously compressed by the top portion and the bottom portion of the body. The deformable suction cup for die bonding moves upward and separates from the die and the substrate, and the perforation continuously supplies negative pressure, thereby maintaining the outer side of the bottom portion of the main body in an upwardly folded state, and the gasket is continuously compressed by the top portion and the bottom portion of the main body, according to claim 4.

8. A die bonding method using a deformable suction cup, The first step is to supply negative pressure to the die bonding device of the deformable suction cup for die bonding by the negative pressure of the second passage in the top, neck, and bottom of the main body and the multiple through holes in the bottom of the main body, and the first passage in the top, neck, and bottom of the main body and the through holes in the die bonding device, thereby supplying negative pressure to the die bonding device by the negative pressure of the first passage and the through holes, and the second step is to supply negative pressure to the die bonding device by the negative pressure of the first passage and the through holes, The perforation in the top portion of the main body supplies negative pressure, and the chamber between the bottom surface of the top portion of the main body, the outer surface of the neck portion of the main body, and the top surface of the bottom portion of the main body, cooperates with the gasket of the deformable suction cup for die bonding provided on the outside of the chamber due to the negative pressure from the perforation to create a vacuum, thereby causing the outside of the bottom portion of the main body, the outside of the die bonding apparatus, and the outside of the die to bend upward synchronously, and the gasket of the deformable suction cup for die bonding to be compressed by the top portion and the bottom portion of the main body. The deformable suction cup for die bonding moves downward until the center of the die contacts the center of the die mounting area on the substrate, and after the center of the die contacts the center of the die mounting area, a bonding wave is formed. The negative pressure in the first passage, the second passage, the through hole, the through hole, and the perforation decreases synchronously, and the bonding wave propagates gradually from the center of the die towards the periphery of the die, thereby gradually restoring the shape of the bottom portion of the main body, the gasket, the die bonding apparatus, and the die, and gradually fixing the die in the die mounting area. The die is completely fixed in the die mounting area, and the first passage, the second passage, the through hole, the through hole and the perforation stop supplying negative pressure, The deformable suction cup for die bonding moves upward and separates from the die and the substrate, A die bonding method using a deformable suction cup, including a suction cup.

9. A die bonding method using a deformable suction cup, The first step is to supply negative pressure to the die bonding device by the negative pressure from the first passage and the through-holes, and the second passage in the top, neck, and bottom portions of the main body of the deformable suction cup for die bonding, and the through-holes of the die bonding device by the negative pressure from the second passage and the through-holes, and the first passage in the top, neck, and bottom portions of the main body and the through-holes of the die bonding device by the negative pressure from the first passage and the through-holes, The perforation in the top portion of the main body supplies negative pressure, and the chamber between the bottom surface of the top portion of the main body, the outer surface of the neck portion of the main body, and the top surface of the bottom portion of the main body, cooperates with the gasket of the deformable suction cup for die bonding provided on the outside of the chamber due to the negative pressure from the perforation to create a vacuum, thereby causing the outside of the bottom portion of the main body, the outside of the die bonding apparatus, and the outside of the die to bend upward synchronously, and the gasket of the deformable suction cup for die bonding to be compressed by the top portion and the bottom portion of the main body. The deformable suction cup for die bonding moves downward until the center of the die contacts the center of the die mounting area on the substrate, and after the center of the die contacts the center of the die mounting area, a bonding wave is formed. The negative pressure in the first passage and the through hole is gradually reduced, the negative pressure in the second passage, the through hole and the perforation is maintained, and the bonding wave gradually propagates from the center of the die to the periphery of the die, thereby gradually restoring the shape of the die, and the die is gradually fixed in the die mounting area, the outside of the bottom portion of the main body and the outside of the die bonding device are kept bent upward, and the gasket is continuously compressed by the top portion and the bottom portion of the main body; The die is completely fixed in the die mounting area, the first passage and the through hole stop supplying negative pressure, and the second passage, the through hole and the perforation continue to supply negative pressure, thereby maintaining the outer side of the bottom portion of the main body and the outer side of the die bonding device in an upwardly bent state, and the gasket is continuously compressed by the top portion and the bottom portion of the main body. The deformable suction cup for die bonding moves upward and separates from the die and the substrate, and the second passage, the through hole and the perforation continue to supply negative pressure, thereby maintaining the outer side of the bottom portion of the main body and the outer side of the die bonding device in an upwardly bent state, and the gasket is continuously compressed by the top portion and the bottom portion of the main body. A die bonding method using a deformable suction cup, including a suction cup.

10. A die bonding method using a deformable suction cup, The first step is to supply negative pressure to the die bonding device by the negative pressure from the first passage and the through-holes, and the second passage in the top, neck, and bottom portions of the main body of the deformable suction cup for die bonding, and the through-holes of the die bonding device by the negative pressure from the second passage and the through-holes, and the first passage in the top, neck, and bottom portions of the main body and the through-holes of the die bonding device by the negative pressure from the first passage and the through-holes, The perforation in the top portion of the main body supplies negative pressure, and the chamber between the bottom surface of the top portion of the main body, the outer surface of the neck portion of the main body, and the top surface of the bottom portion of the main body, cooperates with the gasket of the deformable suction cup for die bonding provided on the outside of the chamber due to the negative pressure from the perforation to create a vacuum, thereby causing the outside of the bottom portion of the main body, the outside of the die bonding apparatus, and the outside of the die to bend upward synchronously, and the gasket of the deformable suction cup for die bonding to be compressed by the top portion and the bottom portion of the main body. The deformable suction cup for die bonding moves downward until the center of the die contacts the center of the die mounting area on the substrate, and after the center of the die contacts the center of the die mounting area, a bonding wave is formed. The negative pressure in the first passage, the second passage, the through hole, and the through hole decreases synchronously, the negative pressure in the perforation is maintained, and the bonding wave gradually propagates from the center of the die to the periphery of the die, thereby gradually restoring the shape of the die bonding apparatus and the die, and the die is gradually fixed in the die mounting area, the outer part of the bottom portion of the main body is kept bent upward, and the gasket is continuously compressed by the top portion and the bottom portion of the main body; The die is completely fixed in the die mounting area, the first passage, the second passage, the through hole and the through hole stop supplying negative pressure, and the perforation continues to supply negative pressure, thereby maintaining the outer side of the bottom portion of the body in an upwardly folded state, and the gasket is continuously compressed by the top portion and the bottom portion of the body. The deformable suction cup for die bonding moves upward and separates from the die and the substrate, and the perforation continues to supply negative pressure, thereby maintaining the outer part of the bottom portion of the main body in an upwardly folded state, and the gasket is continuously compressed by the top portion and the bottom portion of the main body. A die bonding method using a deformable suction cup, including a suction cup.

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