Electronic components

Abstract

To an electronic component which can prevent generation of a contact failure.SOLUTION: An electronic component 1 includes: a chip component 10b having a terminal electrode 11; a case 20 having a container recessed part 22 for containing a capacitor chip 10b; a separate conductive terminal 40b attached to the case 20 and connected to the terminal electrode 11; and a case cover 60 arranged in an opening edge surface 24 of the case 20 to cover the container recessed part 22. In the opening edge surface 24, an opening edge recessed part 240 covered by the case cover 60 is formed. Between the opening edge recessed part 240 and the case cover 60, a gap 70 is formed. The gap 70 is filled with a resin 30.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present disclosure relates to an electronic component having a case capable of accommodating chip components.

Background Art

[0002] [[ID=]11] For example, as described in Patent Document 1, an electronic component having a case capable of accommodating chip components is known. In the electronic component described in Patent Document 1, metal terminals are attached to the case, and the terminal electrodes of the chip components are connected to the metal terminals.

[0003] However, according to the investigation by the present inventors, it has been clarified that there is a possibility that the contact between the metal terminal and the terminal electrode may be insufficient during the reflow of the electronic component.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In view of such a situation, the present disclosure has been made, and an object thereof is to provide an electronic component capable of preventing the occurrence of poor contact.

Means for Solving the Problems

[0006] As a result of investigation and research, the present inventors have newly found the following facts. Inside the case, for example, in order to ensure the moisture resistance or impact resistance of the chip component, a potting resin is filled. However, during the reflow of the electronic component, for example, due to the expansion of the potting resin, the contact point between the metal terminal and the terminal electrode may shift, and there is a possibility that poor contact may occur between them. Therefore, as a result of intensive studies, the present inventors have found a technique for preventing the occurrence of such problems.

[0007] To achieve the above objectives, the electronic components of this disclosure are: A chip component having terminal electrodes, A case having a housing recess for housing the aforementioned chip component, A conductive terminal attached to the case and connected to the terminal electrode, The case has a case cover that is positioned on the opening edge surface of the case so as to cover the aforementioned housing recess, The aforementioned opening edge surface has an opening edge recess that is covered by the case cover. A gap is formed between the aforementioned opening edge recess and the case cover. The gap is filled with resin.

[0008] In the electronic component of this disclosure, a gap is formed between the opening edge recess and the case cover, and the gap is filled with resin. Therefore, the case cover is connected to the opening edge recess (opening edge surface) via the resin filling the gap. As a result, the housing recess located inside the opening edge surface is sealed by the case cover, improving the moisture resistance inside the housing recess. Therefore, the moisture resistance inside the housing recess in which the chip component is housed can be improved without resin sealing the inside of the housing recess.

[0009] Furthermore, since there is no need to fill the recessed area with resin, it is possible to prevent misalignment of the contact between the conductive terminal and the terminal electrode due to resin expansion, thereby avoiding poor contact between them.

[0010] The opening edge recess may extend around the housing recess, surrounding it. In this case, the case cover is connected to the opening edge recess (opening edge surface) via resin, surrounding the housing recess. This improves the airtightness of the housing recess and further enhances the moisture resistance inside the housing recess.

[0011] The opening edge surface has an inner opening edge surface and an outer opening edge surface located outside the inner opening edge surface, and the case cover may be positioned on the inner opening edge surface. By forming the case cover so that it is positioned on the inner opening edge surface, the case cover can be made more compact, and consequently, the electronic components can be made more compact.

[0012] The inner opening edge surface may be closer to the bottom of the case than the outer opening edge surface. In this case, when the case cover is placed on the inner opening edge surface, it is possible to prevent the case cover from protruding from the opening surface of the case.

[0013] The conductive terminal has an opening edge electrode portion disposed on the opening edge surface, and the opening edge electrode portion may have an inner fixing portion disposed between the inner opening edge surface and the case cover, and an outer exposed portion disposed on the outer opening edge surface and exposed to the outside. In this case, the inner fixing portion is sandwiched between the inner opening edge surface and the case cover, so that the inner fixing portion can be fixed to the inner opening edge surface. Also, for example, the conductive terminal can be connected to an external substrate via the outer exposed portion.

[0014] The case may have a wall surrounding the housing recess, the wall having an outer wall portion that rises outside the opening edge recess, and the case cover may be housed in a case cover housing portion surrounded by the outer wall portion. In this case, since the case cover is surrounded by the outer wall portion, displacement or detachment of the case cover can be prevented.

[0015] The outer edge of the case cover is provided with legs, which may engage with the recessed opening edge. In this case, the legs are fixed to the recessed opening edge, preventing the case cover from shifting or detaching.

[0016] A gap may be formed between the leg portion and the bottom of the opening edge recess. In this case, resin can be filled into the gap between the leg portion and the bottom of the opening edge recess. This allows the leg portion and the opening edge recess to be connected via the resin filled in the gap, thereby enabling the case cover to airtightly seal the inside of the housing recess.

[0017] The conductive terminal has an opening edge electrode portion that is positioned on the opening edge surface, and the opening edge electrode portion has a bent portion that bends toward the bottom of the opening edge recess, and the bent portion may be positioned between the bottom of the opening edge recess and the leg portion. In this case, the bent portion can be connected to the opening edge recess via resin filled in the gap between the bottom of the opening edge recess and the leg portion. Furthermore, since the bent portion is sandwiched between the bottom of the opening edge recess and the leg portion, the bent portion can be fixed to the opening edge recess.

[0018] The case has a wall surrounding the accommodating recess, and the wall may have an outer wall portion that rises outside the opening edge recess and an inner wall portion that rises inside the opening edge recess. In this case, the opening edge recess is formed on the opening edge surface so as to be sandwiched between the outer wall portion and the inner wall portion. This makes it easier to accumulate resin in the gap surrounded by the opening edge recess and the case cover.

[0019] The opening edge surface has an inner opening edge surface and an outer opening edge surface located outside the inner opening edge surface, and the inner opening edge surface may have an opening edge inclined portion that slopes toward the bottom of the case as it moves toward the outside of the case. In this case, an opening edge recess that is recessed along the opening edge inclined portion can be formed on the opening edge surface. This prevents resin from leaking out from the gap surrounded by the opening edge recess and the case cover.

[0020] The outer edge of the case cover may have legs formed on it, and the legs may have inclined cover portions that are inclined along the inclined opening edge. By positioning the inclined cover portion on the inclined opening edge, the recessed opening edge and the legs can be brought into close contact, improving the airtightness between the recessed opening edge and the case cover.

Brief Description of the Drawings

[0021] [Figure 1] Figure 1 is a perspective view of an electronic component according to the first embodiment. [Figure 2] Figure 2 is a perspective view for explaining the internal structure of the electronic component shown in Figure 1. [Figure 3] Figure 3 is a cross-sectional view taken along line III-III of the electronic component shown in Figure 2. [Figure 4] Figure 4 is a perspective view of the case shown in Figure 1. [Figure 5] Figure 5 is a perspective view of the conductive terminal shown in Figure 1. [Figure 6] Figure 6 is a perspective view of the case cover shown in Figure 1. [Figure 7] Figure 7 is a cross-sectional view taken along line VII-VII of the electronic component shown in Figure 1. [Figure 8] Figure 8 is a perspective view for explaining the internal structure of the electronic component according to the second embodiment. [Figure 9] Figure 9 is a perspective view of the case shown in Figure 8. [Figure 10] Figure 10 is a perspective view of the case cover attached to the case shown in Figure 9. [Figure 11] Figure 11 is a perspective view of the conductive terminal shown in Figure 8. [Figure 12] Figure 12 is a cross-sectional view taken along line XII-XII of the electronic component shown in Figure 8.

Modes for Carrying Out the Invention

[0022] Embodiments of the present disclosure will be described with reference to the drawings. Although the description will be made with reference to the drawings as necessary, the content shown in the drawings is only schematically and exemplarily shown for the understanding of the present disclosure, and the appearance and dimensional ratios may be different from the actual ones. Further, although the embodiments will be specifically described below, the present disclosure is not limited to these embodiments.

[0023] First Embodiment As shown in Figures 1 and 2, the electronic component 1 of this embodiment includes capacitor chips 10a and 10b, a case 20, resin 30 (Figure 3), individual conductive terminals 40a and 40b, a common conductive terminal 50, and a case cover 60.

[0024] In the diagram, the XYZ coordinate system is a coordinate system based on Case 20. When Case 20 is viewed from above, the axis parallel to one of the two orthogonal sides of Case 20 is the X-axis, and the axis parallel to the other side is the Y-axis. The Z-axis is perpendicular to the base of Case 20. The origin of the XYZ coordinate system is set to the center of the base of Case 20.

[0025] In the following, the positive Z-axis direction will be referred to as "upward," and the negative Z-axis direction as "downward." Furthermore, for both the X and Y axes, the direction toward the center of Case 20 will be referred to as "inward," and the direction away from the center of Case 20 will be referred to as "outward."

[0026] As shown in Figures 2 and 3, capacitor chips 10a and 10b each have a substantially rectangular parallelepiped shape and are identical in shape and size to each other. In this embodiment, "identical" means not only completely identical, but also allowing for variations within ±10% of the error. In the following, to avoid redundant descriptions, only capacitor chip 10a will be described regarding the configuration common to capacitor chips 10a and 10b.

[0027] The outer surface of the capacitor chip 10a has multiple (six in this embodiment) surfaces. Of these surfaces, two surfaces located opposite each other along the X-axis are the end faces 13 and 14 (Figure 3). The remaining four surfaces are the side faces 15.

[0028] As shown in Figure 3, the capacitor chip 10a has a plurality of internal electrode layers 16 and a plurality of dielectric layers 17. The plurality of internal electrode layers 16 and the plurality of dielectric layers 17 are stacked along the Y-axis. Terminal electrodes 11 and 12 are formed on the end faces 13 and 14, respectively. The plurality of internal electrode layers 16 are connected to the terminal electrodes 11 or 12. A portion of the terminal electrode 11 wraps around to the side surface 15, and a portion of the terminal electrode 12 wraps around to the side surface 15.

[0029] The shape and size of the capacitor chip 10a are not particularly limited. The X-axis dimension of the capacitor chip 10a is, for example, 1.0 to 6.5 mm, the Y-axis dimension is, for example, 0.3 to 5.5 mm, and the Z-axis dimension is, for example, 0.3 to 5.5 mm.

[0030] As shown in Figure 4, the case 20 has a housing recess 22 for housing the capacitor chips 10a and 10b, and an opening edge surface 24 formed on the opening edge of the housing recess 22. The case 20 may also have a wall 21, a bottom surface 23, and a partition 25. The case 20 is made of an insulator such as ceramic, glass, or synthetic resin.

[0031] The bottom surface 23 constitutes the bottom of the case 20. At least one side surface 15 of the capacitor chip 10a is positioned on the bottom surface 23 so as to face it. Also, at least one side surface 15 of the capacitor chip 10b is positioned on the bottom surface 23 so as to face it.

[0032] The wall 21 is cylindrical and formed along the outer edge of the bottom surface 23. The wall 21 surrounds the receiving recess 22. The wall 21 rises perpendicularly to the bottom surface 23 from the outer edge of the bottom surface 23. In this embodiment, perpendicular means allowing an error of ±10 degrees. Similarly, parallel means allowing an error of ±10 degrees.

[0033] The wall 21 has a first side wall portion 21a, a second side wall portion 21b, a third side wall portion 21c, and a fourth side wall portion 21d. The first side wall portion 21a is the portion of the wall 21 located on the positive Y-axis side. The second side wall portion 21b is the portion of the wall 21 located on the positive X-axis side. The third side wall portion 21c is the portion of the wall 21 located on the negative Y-axis side. The fourth side wall portion 21d is the portion of the wall 21 located on the negative X-axis side.

[0034] The wall 21 has an inner wall portion 211 and an outer wall portion 212 located outside the inner wall portion 211. The inner wall portion 211 and the outer wall portion 212 are formed in the first side wall portion 21a, the second side wall portion 21b, the third side wall portion 21c, and the fourth side wall portion 21d, respectively. The inner wall portion 211 and the outer wall portion 212 each have a rectangular tubular shape and protrude upward. The protruding length of the outer wall portion 212 is greater than the protruding length of the inner wall portion 211.

[0035] The difference between the protruding length of the outer wall portion 212 and the protruding length of the inner wall portion 211 is equal to the thickness of the case cover 60 (Figure 1). In this embodiment, "equal" means not only when the values ​​being compared are exactly equal, but also when a predetermined error is included. For example, even if the values ​​being compared have an error of ±10%, the values ​​being compared are considered equal.

[0036] The inner wall portion 211 is positioned closer to the receiving recess 22 than the outer wall portion 212. The outer wall portion 212 surrounds the inner wall portion 211. A gap (an opening edge recess 240, described later) is formed between the inner wall portion 211 and the outer wall portion 212, and the inner wall portion 211 and the outer wall portion 212 are discontinuously connected via this gap.

[0037] The housing recess 22 is a space enclosed by the inner wall portion 211 and opens upward. The housing recess 22 has a housing space 22a for housing the capacitor chip 10a and a housing space 22b for housing the capacitor chip 10b. The height of the housing space 22a may be greater than the length of the capacitor chip 10a along the Z axis, and the height of the housing space 22b may be greater than the length of the capacitor chip 10b along the Z axis.

[0038] By housing the capacitor chips 10a and 10b in the housing space 22a and housing space 22b, respectively, the capacitor chips 10a and 10b can be effectively protected from impacts and other damage.

[0039] The partition portion 25 is formed inside the housing recess 22. The partition portion 25 rises perpendicularly to the bottom surface 23 from the center of the bottom surface 23 in the X-axis direction and extends along the Y-axis. The partition portion 25 separates the housing space 22a and the housing space 22b. The upper end of the partition portion 25 is located below the opening surface of the housing recess 22.

[0040] The opening edge surface 24 is the upper end surface of the wall 21. The opening edge surface 24 has an opening edge recess 240. The opening edge recess 240 may have an inner opening edge surface 241 which is the upper end surface of the inner wall portion 211 and an outer opening edge surface 242 which is the upper end surface of the outer wall portion 212.

[0041] The opening edge recess 240 is a recess that extends downward from the opening edge surface 24. The opening edge recess 240 extends around the receiving recess 22, surrounding the receiving recess 22. The opening edge recess 240 is formed across the first side wall portion 21a, the second side wall portion 21b, the third side wall portion 21c, and the fourth side wall portion 21d of the wall 21, but it may be formed in only one of these portions.

[0042] Alternatively, the opening edge recess 240 may be formed in any two of the first side wall portion 21a, the second side wall portion 21b, the third side wall portion 21c, and the fourth side wall portion 21d. For example, the opening edge recess 240 may be formed only in the first side wall portion 21a and the third side wall portion 21c. Alternatively, the opening edge recess 240 may be formed only in the second side wall portion 21b and the fourth side wall portion 21d. Furthermore, the opening edge recess 240 may be formed in any three of the first side wall portion 21a, the second side wall portion 21b, the third side wall portion 21c, and the fourth side wall portion 21d.

[0043] The opening edge recess 240 is formed in the center of the wall 21 in the thickness direction. Specifically, the opening edge recess 240 is formed in the center of the first side wall portion 21a and the third side wall portion 21c in the Y-axis direction. Furthermore, the opening edge recess 240 is formed in the center of the second side wall portion 21b and the fourth side wall portion 21d in the X-axis direction.

[0044] The aforementioned inner wall portion 211 rises on the inside of the opening edge recess 240. The outer wall portion 212 rises on the outside of the opening edge recess 240.

[0045] The inner opening edge surface 241 is positioned closer to the housing recess 22 than the outer opening edge surface 242. The inner opening edge surface 241 is formed in a square ring shape along the opening edge of the housing recess 22. The inner opening edge surface 241 is closer to the bottom of the case 20 than the outer opening edge surface 242. The difference between the height position of the inner opening edge surface 241 in the Z-axis direction and the height position of the outer opening edge surface 242 in the Z-axis direction (i.e., the step width between the inner opening edge surface 241 and the outer opening edge surface 242) is equal to the thickness of the case cover 60 (Figure 1).

[0046] The outer opening edge surface 242 is located outside the inner opening edge surface 241 via the opening edge recess 240. The outer opening edge surface 242 is formed in a square ring shape along the inner opening edge surface 241. The inner opening edge surface 241 and the outer opening edge surface 242 are discontinuously connected via the opening edge recess 240.

[0047] As shown in Figure 2, the individual conductive terminals 40a and 40b are mounted on the case 20. The individual conductive terminal 40a is electrically connected to the terminal electrode 11 of the capacitor chip 10a, and the individual conductive terminal 40b is electrically connected to the terminal electrode 11 of the capacitor chip 10b.

[0048] As shown in Figure 5, the individual conductive terminals 40a and 40b have the same shape, but their shapes may be different. In the following, to avoid redundant descriptions, the configuration common to both the individual conductive terminals 40a and 40b will only be described for the individual conductive terminal 40a.

[0049] The individual conductive terminals 40a are formed from a conductive material such as metal. Examples of metals that make up the individual conductive terminals 40a include iron, nickel, copper, silver, or alloys containing these materials. A metal coating may be formed on the surface of the individual conductive terminals 40a by plating, for example, using Ni, Sn, Cu, etc.

[0050] The width of the individual conductive terminals 40a along the Y-axis is approximately the same as the width of the capacitor chip 10a (Figure 1) along the Y-axis, but may be different. The thickness of the individual conductive terminals 40a is, for example, 0.01 to 2.0 mm.

[0051] Each individual conductive terminal 40a has an open edge electrode portion 42. Each individual conductive terminal 40a may also have an inner electrode portion 41 and a side electrode portion 43. As shown in Figure 2, the side electrode portion 43 faces the outer surface of the outer wall portion 212. The side electrode portion 43 is spaced apart from the outer surface of the outer wall portion 212 along the X axis, but may be in contact with the outer surface.

[0052] The inner electrode portion 41 is positioned inside the housing recess 22 and is physically and electrically connected to the terminal electrode 11 of the capacitor chip 10a. The inner electrode portion 41 may have a curved portion 410 (Figure 5) formed thereon. The curved portion 410 is curved (bent) in a substantially C-shape or substantially semicircular shape so as to protrude toward the terminal electrode 11. The curved portion 410 is elastic, and due to the elasticity of the curved portion 410, the inner electrode portion 41 can be fixed to the terminal electrode 11 without using, for example, solder or conductive adhesive.

[0053] The opening edge electrode portion 42 is located between the inner electrode portion 41 and the side electrode portion 43, and is continuous with them. The opening edge electrode portion 42 is positioned on the opening edge surface 24. As shown in Figure 5, the opening edge electrode portion 42 has a bent portion 420. The opening edge electrode portion 42 may also have an inner fixed portion 421 and an outer exposed portion 422.

[0054] As shown in Figure 2, the inner fixing portion 421 is positioned on the inner opening edge surface 241. The inner fixing portion 421 is continuous with the inner electrode portion 41 and extends in a direction perpendicular to the inner electrode portion 41. The inner fixing portion 421 is in contact with the inner opening edge surface 241, but may be spaced apart.

[0055] The outer exposed portion 422 is positioned on the outer opening edge surface 242. The outer exposed portion 422 is continuous with the side electrode portion 43 and extends in a direction perpendicular to the side electrode portion 43. The outer exposed portion 422 is in contact with the outer opening edge surface 242, but may be spaced apart.

[0056] As shown in Figure 7, the inner fixing portion 421 is positioned between the inner opening edge surface 241 and the case cover 60, and is sandwiched between them. On the other hand, the outer exposed portion 422 is exposed to the space outside the case 20.

[0057] The bent portion 420 is located between the inner fixing portion 421 and the outer exposed portion 422, and is continuous with them. The bent portion 420 has a roughly U-shape and extends while bending toward the bottom of the opening edge recess 240.

[0058] The bent portion 420 has a direction-changing portion 423 that bends in a U-turn from the bottom of the opening edge recess 240. Above the direction-changing portion 423 are the legs 62 of the case cover 60, which will be described later. The direction-changing portion 423 does not abut the bottom of the opening edge recess 240, but is positioned at a location spaced above the bottom of the opening edge recess 240. The direction-changing portion 423 is positioned between the bottom of the opening edge recess 240 and the legs 62.

[0059] The bent portion 420 is in contact with the inner wall of the opening edge recess 240, but may be spaced apart. A portion (side portion) of the bent portion 420 extends along the outer surface of the inner wall portion 211 (Figure 4) and is sandwiched between the leg portion 62 and the outer surface of the inner wall portion 211. Another portion (side portion) of the bent portion 420 extends along the inner surface of the outer wall portion 212 (Figure 4) and is sandwiched between the leg portion 62 and the inner surface of the outer wall portion 212.

[0060] As shown in Figure 2, the common conductive terminal 50 is mounted on the case 20. The common conductive terminal 50 is electrically connected to the terminal electrodes 12 of capacitor chip 10a and capacitor chip 10b. The common conductive terminal 50 is made of the same material as the individual conductive terminals 40a.

[0061] As shown in Figure 5, the common conductive terminal 50 has an open edge electrode portion 52. The common conductive terminal 50 may also have inner electrode portions 51a and 51b, a side electrode portion 53, and a connecting portion 54. As shown in Figures 5 and 2, the side electrode portion 53 faces the outer surface of the outer wall portion 212. The side electrode portion 53 is spaced apart from the outer surface of the outer wall portion 212 along the X axis, but may be in contact with the outer surface.

[0062] The inner electrode portion 51a is located inside the housing recess 22 and is physically and electrically connected to the terminal electrode 12 of the capacitor chip 10a. The inner electrode portion 51b is located inside the housing recess 22 and is electrically connected to the terminal electrode 12 of the capacitor chip 10b.

[0063] The inner electrode portions 51a and 51b have the same shape, although their shapes may differ. The inner electrode portions 51a and 51b extend along the Z-axis and are arranged along the inner wall of the housing recess 22. In addition, similar to the individual conductive terminals 40a and 40b, the inner electrode portions 51a and 51b may be provided with curved portions.

[0064] The connecting portion 54 is continuous with the inner electrode portions 51a and 51b and extends in a direction parallel to the inner electrode portions 51a and 51b. The connecting portion 54 has the role of connecting the inner electrode portion 51a and the inner electrode portion 51b along the Y axis.

[0065] The opening edge electrode portion 52 is located between the side electrode portion 53 and the connecting portion 54, and is continuous with them. The opening edge electrode portion 52 is positioned on the opening edge surface 24. As shown in Figure 5, the opening edge electrode portion 52 has a bent portion 520. The opening edge electrode portion 52 may also have an inner fixing portion 521 and an outer exposed portion 522.

[0066] As shown in Figure 2, the inner fixing portion 521 is positioned on the inner opening edge surface 241. The inner fixing portion 521 is continuous with the connecting portion 54 and extends in a direction perpendicular to the connecting portion 54. The inner fixing portion 521 is in contact with the inner opening edge surface 241, but may be spaced apart.

[0067] The outer exposed portion 522 is positioned on the outer opening edge surface 242. The outer exposed portion 522 is continuous with the side electrode portion 53 and extends in a direction perpendicular to the side electrode portion 53. The outer exposed portion 522 is in contact with the outer opening edge surface 242, but may be spaced apart.

[0068] As shown in Figure 7, the inner fixing portion 521 is positioned between the inner opening edge surface 241 and the case cover 60, and is sandwiched between them. On the other hand, the outer exposed portion 522 is exposed to the space outside the case 20.

[0069] The bent portion 520 is located between the inner fixing portion 521 and the outer exposed portion 522, and is continuous with them. The bent portion 520 has a substantially U-shape and extends while bending toward the bottom of the opening edge recess 240. The shape of the bent portion 520 is the same as the shape of the bent portion 420, but may be different.

[0070] The bent portion 520 has a direction-changing portion 523 that bends in a U-turn from the bottom of the opening edge recess 240. Above the direction-changing portion 523 are the legs 62 of the case cover 60, which will be described later. The direction-changing portion 523 does not abut the bottom of the opening edge recess 240, but is positioned at a location spaced above the bottom of the opening edge recess 240.

[0071] The bent portion 520 is in contact with the inner wall of the opening edge recess 240, but may be spaced apart. A portion (side portion) of the bent portion 520 extends along the outer surface of the inner wall portion 211 (Figure 4) and is sandwiched between the leg portion 62 and the outer surface of the inner wall portion 211. Another portion (side portion) of the bent portion 520 extends along the inner surface of the outer wall portion 212 (Figure 4) and is sandwiched between the leg portion 62 and the inner surface of the outer wall portion 212.

[0072] As shown in Figure 6, the case cover 60 has a cover body 61 and legs 62. The case cover 60 is made of, for example, resin. The case cover 60 may be made of a resin with a higher thermal conductivity than the case 20. Examples of resins that make up the case cover 60 include liquid crystal polymer plastic (LCP) and polyphenyl sulfide (PPS).

[0073] As shown in Figure 7, the cover body 61 is positioned on the opening edge surface 24 of the case 20 so as to cover the housing recess 22. The cover body 61 is positioned on the inner opening edge surface 241, and the inside of the housing recess 22 is closed off by the inner wall portion 211 and the cover body 61.

[0074] The cover body 61 is housed in a case cover housing section 26 (Figure 4) surrounded by an outer wall section 212. The case cover housing section 26 is a space located inside the outer wall section 212 and above the inner opening edge surface 241. The upper surface of the cover body 61 is flush with the outer opening edge surface 242. The outer edge of the cover body 61 covers the opening edge recess 240 outside the inner opening edge surface 241 in the X-axis or Y-axis direction. In this embodiment, "flush" does not mean strictly flush, but also allows for variations of ±10% or less.

[0075] The legs 62 are formed on the outer edge of the cover body 61 and protrude perpendicularly to the cover body 61. The protruding length of the legs 62 is less than the depth of the opening edge recess 240 along the Z axis (the height from the bottom of the opening edge recess 240 to the inner opening edge surface 241). As shown in Figure 6, four legs 62 are formed on the cover body 61, but the number of legs 62 is not limited to this. No legs 62 are positioned at each of the four corners of the cover body 61, but parts of the legs 62 may be positioned at these corners.

[0076] As shown in Figure 7, the leg portion 62 protrudes toward the bottom of the case 20 and is fitted into the opening edge recess 240. A gap 70 is formed between the opening edge recess 240 and the case cover 60. More specifically, the gap 70 is formed between the tip of the leg portion 62 and the bottom of the opening edge recess 240. Parts of the bent portions 420 of the individual conductive terminals 40a and 40b (such as the direction changing portion 423) are located in the gap 70. The height of the gap 70 along the Z axis is greater than, for example, half the depth of the opening edge recess 240 along the Z axis (the height from the bottom of the opening edge recess 240 to the inner opening edge surface 241).

[0077] The gap 70 is filled with resin 30. The resin 30 is an insulating resin, such as a thermosetting resin like an epoxy resin or a phenolic resin. The resin 30 may completely fill the inside of the gap 70. Inside the gap 70, at least a portion of the bent portion 420 (such as the direction changing portion 423) is covered with resin 30. Also, inside the gap 70, at least a portion of the bent portion 520 (such as the direction changing portion 523) is covered with resin 30.

[0078] The leg portion 62 is coated with resin 30, and the leg portion 62 is connected to the opening edge recess 240 via the resin 30. The resin 30 may also be present between the leg portion 62 and the outer surface of the inner wall portion 211. Furthermore, the resin 30 may be present between the leg portion 62 and the inner surface of the outer wall portion 212.

[0079] As the resin 30 fills the gap 70, the gap 70 is isolated from the external atmosphere of the case 20 and also from the internal atmosphere of the housing recess 22. As a result, the housing recess 22, which is located on the inside of the opening edge recess 240 in the X-axis or Y-axis direction, is also isolated from the external atmosphere of the case 20.

[0080] The electronic component 1 can be manufactured as follows. First, prepare the case 20 shown in Figure 4, and attach the individual conductive terminals 40a and 40b and the common conductive terminal 50 to the case 20 as shown in Figure 2. Next, house the capacitor chip 10a in the housing space 22a (Figure 4) and house the capacitor chip 10b in the housing space 22b (Figure 4). Next, fill the inside of the opening edge recess 240 with resin 30 as shown in Figure 7. Next, fit the legs 62 of the case cover 60 shown in Figure 6 into the opening edge recess 240 and house the case cover 60 in the case cover housing section 26 (Figure 4). At this time, it is preferable to adjust the amount of resin 30 to fill the inside of the opening edge recess 240 so that the inside of the gap 70 (Figure 7) is completely (without gaps) filled with resin 30. However, a space without resin 30 may be formed inside the gap 70. Furthermore, it is preferable to adjust the amount of resin 30 to fill the opening edge recess 240 so that the resin 30 does not overflow into the containment spaces 22a and 22b. In this manner, the electronic component 1 can be manufactured.

[0081] The manufacturing method for the electronic component 1 is not limited to the method described above. For example, the timing of filling the opening edge recess 240 with resin 30 may be changed as appropriate. Specifically, the resin 30 may be filled into the opening edge recess 240 before attaching the individual conductive terminals 40a and 40b and the common conductive terminal 50 to the case 20. Alternatively, the resin 30 may be filled into the opening edge recess 240 after attaching the individual conductive terminals 40a and 40b and the common conductive terminal 50 to the case 20, and before housing the capacitor chips 10a and 10b in the housing spaces 22a and 22b.

[0082] As shown in Figure 7, in the electronic component 1 of this embodiment, resin 30 is filled into the gap 70 between the opening edge recess 240 and the case cover 60. Therefore, the case cover 60 is connected to the opening edge recess 240 via the resin 30 filled into the gap 70. As a result, the housing recess 22 is sealed (sealed) by the case cover 60 and the resin 30, improving the moisture resistance inside the housing recess 22. Therefore, the moisture resistance inside the housing recess 22 in which the capacitor chips 10a and 10b are housed can be improved without resin sealing. Furthermore, the flame retardancy, vibration resistance, shock resistance, dust resistance, and heat dissipation of the electronic component 1 can be improved.

[0083] Furthermore, since it is not necessary to fill the housing recess 22 with resin 30, misalignment of the contacts between the individual conductive terminals 40a or 40b and the terminal electrode 11 due to expansion of the resin 30 can be prevented, thus avoiding poor contact (open-circuit failure) between them. Similarly, poor contact (open-circuit failure) between the common conductive terminal 50 and the terminal electrode 12 can be prevented. It is preferable that the inside of the housing recess 22 is not filled with resin 30, but it is acceptable if some resin 30 is present.

[0084] Furthermore, as shown in Figure 3, the opening edge recess 240 extends around the housing recess 22, enclosing it. Therefore, the case cover 60 (Figure 6) is connected to the opening edge recess 240 via the resin 30, enclosing the housing recess 22. This improves the airtightness of the housing recess 22 and further enhances the moisture resistance inside the housing recess 22.

[0085] Furthermore, as shown in Figure 7, the cover body 61 has a shape and size that allows it to be positioned on the inner opening edge surface 241. This makes the case cover 60 more compact, and consequently, the electronic component 1 more compact.

[0086] Furthermore, the inner opening edge surface 241 is closer to the bottom of the case 20 than the outer opening edge surface 242. Therefore, when the cover body 61 is placed on the inner opening edge surface 241, it is possible to prevent the cover body 61 from protruding from the opening surface of the case 20.

[0087] Furthermore, the inner fixing portion 421 is positioned between the inner opening edge surface 241 and the cover body 61. Therefore, the inner fixing portion 421 is sandwiched between the inner opening edge surface 241 and the cover body 61, and the inner fixing portion 421 can be fixed to the inner opening edge surface 241. In addition, the outer exposed portion 422 is positioned on the outer opening edge surface 242 and is exposed to the outside. Therefore, for example, the individual conductive terminals 40a and 40b can be connected to an external substrate (not shown) via the outer exposed portion 422.

[0088] Furthermore, individual conductive terminals 40a and 40b and a common conductive terminal 50 are attached to the case 20, and the capacitor chips 10a and 10b are electrically connected through these terminals. This allows the capacitor chips 10a and 10b to be connected in series.

[0089] The following are examples of how the electronic component 1 can be mounted on the external substrate. For example, by connecting the individual conductive terminals 40a and 40b shown in Figure 2 to the external substrate and making the common conductive terminal 50 floating, a capacitor circuit consisting of two capacitor chips 10a and 10b in series can be configured.

[0090] Furthermore, by connecting both the individual conductive terminals 40a and 40b and the common conductive terminal 50 to an external substrate, a capacitor circuit consisting of two capacitor chips 10a and 10b in parallel can be constructed.

[0091] The orientation in which the electronic component 1 is mounted on the external circuit is not particularly limited. For example, with the opening surface of the case 20 shown in Figure 2 facing the external substrate, the outer exposed portions 422 of the individual conductive terminals 40a and 40b and / or the outer exposed portion 522 of the common conductive terminal 50 may be connected to the external substrate. Alternatively, with the wall 21 of the case 20 (for example, the fourth side wall portion 21d of the case 20 shown in Figure 4) facing the external substrate, the side electrode portions 43 of the individual conductive terminals 40a and 40b may be connected to the external circuit.

[0092] Furthermore, the case cover 60 is housed in the case cover housing section 26 (Figure 4). As a result, the cover body 61 is surrounded by the outer wall section 212 (Figure 4), which prevents the case cover 60 from shifting position or becoming detached.

[0093] Furthermore, the leg portion 62 is fitted into the opening edge recess 240. As a result, the leg portion 62 is fixed to the opening edge recess 240, preventing the case cover 60 from shifting position or becoming detached.

[0094] Furthermore, a gap 70 is formed between the leg portion 62 and the bottom of the opening edge recess 240. Therefore, the leg portion 62 and the opening edge recess 240 are connected via the resin 30 filled in the gap 70, thereby allowing the case cover 60 to airtightly seal the inside of the housing recess 22.

[0095] Furthermore, the direction changing section 423 is positioned between the bottom of the opening edge recess 240 and the leg portion 62. Therefore, the direction changing section 423 can be connected to the opening edge recess 240 via the resin 30 filled in the gap 70. Also, since the direction changing section 423 is sandwiched between the bottom of the opening edge recess 240 and the leg portion 62, the direction changing section 423 can be fixed to the opening edge recess 240.

[0096] Furthermore, the wall 21 has an inner wall portion 211 and an outer wall portion 212. Therefore, it is possible to form an opening edge recess 240 on the opening edge surface 24 so as to be sandwiched between the inner wall portion 211 and the outer wall portion 212, making it easier to accumulate resin 30 in the gap 70 surrounded by the opening edge recess 240 and the case cover 60.

[0097] Second Embodiment The electronic component 1A of this embodiment, shown in Figure 8, has the same configuration as the electronic component 1 of the first embodiment, except for the points described below. Components common to both the first embodiment and this embodiment are denoted by the same reference numerals, and their descriptions are omitted.

[0098] As shown in Figure 8, the electronic component 1A includes a case 20A, individual conductive terminals 40aA and 40bA, a common conductive terminal 50A, and a case cover 60A (Figure 10). As shown in Figure 9, the case 20A has an opening edge surface 24A. The opening edge surface 24A has an opening edge recess 240A and an inner opening edge surface 241A.

[0099] An opening edge inclined portion 243 is formed on the inner opening edge surface 241A. The opening edge inclined portion 243 is inclined toward the bottom of the case 20A (towards the negative Z-axis direction) as it extends toward the outside of the case 20A. The inner opening edge surface 241A may be inclined at, for example, 5 degrees or more with respect to the XY plane (or the outer opening edge surface 242).

[0100] In this embodiment, the opening edge recess 240A is formed at the position where the inner opening edge surface 241A and the inner surface 212i of the outer wall portion 212 intersect, and is defined by the inner opening edge surface 241A and the inner surface 212i of the outer wall portion 212. The inner opening edge surface 241A and the outer opening edge surface 242 are formed non-parallel and are discontinuously connected via the inner surface 212i of the outer wall portion 212.

[0101] As shown in Figure 10, the case cover 60A has legs 62A. The legs 62A are formed in a square ring shape and continuously surround the outer edge of the cover body 61. A cover inclined portion 620 may be formed on the legs 62A. The cover inclined portion 620 is inclined along the opening edge inclined portion 243 (Figure 9) and is inclined toward the negative Z-axis direction as it moves toward the outside of the case cover 60A. As shown in Figure 12, the legs 62A are positioned on the inner opening edge surface 241A so as to engage with the opening edge recess 240A.

[0102] As shown in Figure 11, the individual conductive terminals 40aA and 40bA have an opening edge electrode portion 42A. The opening edge electrode portion 42A has a bent portion 420A. As shown in Figure 12, the bent portion 420A has a substantially L-shape and bends toward the bottom of the opening edge recess 240A. The bent portion 420A is positioned along the inner surface 212i and the inner opening edge surface 241A of the outer wall portion 212. The bent portion 420A is in contact with the inner surface 212i and the inner opening edge surface 241A of the outer wall portion 212, but may be spaced apart.

[0103] The bent portion 420A is positioned so as to be sandwiched between the opening edge recess 240A and the leg portion 62A. A portion of the bent portion 420A is sandwiched between the leg portion 62A and the inner opening edge surface 241A. Another portion of the bent portion 420A is sandwiched between the leg portion 62A and the inner surface 212i of the outer wall portion 212.

[0104] A gap 70 is formed between the opening edge recess 240A (the bottom of the opening edge recess 240A) and the leg portion 62A, and the gap 70 is filled with resin 30. In the example shown in Figure 12, the resin 30 is filled between the leg portion 62A and the bent portion 420A. However, the resin 30 may also be filled below the bent portion 420A. In addition, the resin 30 may be filled between the leg portion 62A and the inner surface 212i of the outer wall portion 212.

[0105] In this embodiment as well, the same effects as in the first embodiment can be obtained. That is, in this embodiment, the leg portion 62A is connected to the opening edge recess 240A via the resin 30 filled in the gap 70. As a result, the housing recess 22 is sealed (airtight) by the case cover 60A and the resin 30, and the moisture resistance inside the housing recess 22 can be improved.

[0106] In addition, in this embodiment, an inclined opening edge portion 243 (Figure 9) is formed on the inner opening edge surface 241A. Therefore, an opening edge recess 240A that is recessed along the inclined opening edge portion 243 can be formed on the inner opening edge surface 241A. This prevents the resin 30 from leaking out of the gap 70 surrounded by the inner opening edge surface 241A and the case cover 60A.

[0107] Furthermore, a cover inclined portion 620 (Figure 10) is formed on the leg portion 62A. By positioning the cover inclined portion 620 on the opening edge inclined portion 243, the opening edge recess 240A and the leg portion 62A can be brought into close contact, improving the airtightness between the opening edge recess 240A and the case cover 60A.

[0108] This disclosure is not limited to the embodiments described above, and can be modified in various ways within the scope of this disclosure.

[0109] In each of the embodiments described above, the chip component is not limited to a capacitor chip, but may be a chip inductor, chip resistor, or the like.

[0110] In each of the above embodiments, the electronic component 1 may be equipped with only individual conductive terminals, or it may be equipped with only common conductive terminals. For example, the case 20 shown in Figure 1 may be provided with four individual conductive terminals, or it may be provided with two common conductive terminals.

[0111] In the first embodiment described above, the case 20 shown in Figure 4 may be constructed by combining multiple cases. For example, a case having a receiving recess 22 (inner case) and a case that houses the inner case (outer case) may be prepared, and the inner case may be housed inside the outer case to construct the case 20 having the opening edge recess 240 shown in Figure 4.

[0112] In the first embodiment described above, the legs 62 may be omitted from the case cover 60 shown in Figure 6. In this case, a gap 70 can be formed between the cover body 61 and the opening edge recess 240 (Figure 7). The same applies to the second embodiment described above. [Explanation of Symbols]

[0113] 1.1A…Electronic components 10a, 10b... Capacitor chips 11,12...terminal electrode 13,14...end face 15…Side 16...Internal electrode layer 17…Dielectric layer 20,20A…case 21... Wall 211...Interior wall section 212...Outer wall part 212i...Inner 22…Accommodation recess 22a, 22b… Containment space 23...Bottom 24,24A…Opening edge surface 240, 240A… Opening edge recess 241,241A…Inner opening edge surface 242…Outer opening edge surface 243... Opening edge inclined section 25... Partition 26…Case cover storage compartment 30… Resin 40a, 40b, 40aA, 40bA… Individual conductive terminals 41...Inner electrode part 410... Curved section 42, 42A... Aperture edge electrode section 420, 420A... Bent section 421…Inner fixed part 422...Outer exposed part 423... Direction change section 43…Side electrode part 50,50A…Common conductive terminal 51a, 51b...Inner electrode part 52, 52A... Aperture edge electrode section 520, 520A... Bent section 521…Inner fixed part 522...Outer exposed part 53…Side electrode part 54...Connection part 60…Case cover 61...Cover body 62,62A…legs 620... Cover inclined section 70... Gap

Claims

1. A chip component having terminal electrodes, A case having a housing recess for housing the aforementioned chip component, A conductive terminal attached to the case and connected to the terminal electrode, The case has a case cover that is positioned on the opening edge surface of the case so as to cover the aforementioned housing recess, The aforementioned opening edge surface has an opening edge recess that is covered by the case cover. A gap is formed between the aforementioned opening edge recess and the case cover. The gap is filled with resin. The aforementioned opening edge surface has an inner opening edge surface and an outer opening edge surface located outside the inner opening edge surface. The case cover is positioned on the inner opening edge surface, The inner opening edge surface is an electronic component that is closer to the bottom of the case than the outer opening edge surface.

2. The electronic component according to claim 1, wherein the opening edge recess extends around the housing recess so as to surround the housing recess.

3. A chip component having terminal electrodes, A case having a housing recess for housing the aforementioned chip component, A conductive terminal attached to the case and connected to the terminal electrode, The case has a case cover that is positioned on the opening edge surface of the case so as to cover the aforementioned housing recess, The aforementioned opening edge surface has an opening edge recess that is covered by the case cover. A gap is formed between the aforementioned opening edge recess and the case cover. The gap is filled with resin. The aforementioned opening edge surface has an inner opening edge surface and an outer opening edge surface located outside the inner opening edge surface. The case cover is positioned on the inner opening edge surface, The conductive terminal has an opening edge electrode portion arranged on the opening edge surface, The aforementioned opening edge electrode portion is an electronic component having an inner fixing portion disposed between the inner opening edge surface and the case cover, and an outer exposed portion disposed on the outer opening edge surface and exposed to the outside.

4. A chip component having terminal electrodes, A case having a housing recess for housing the aforementioned chip component, A conductive terminal attached to the case and connected to the terminal electrode, The case has a case cover that is positioned on the opening edge surface of the case so as to cover the aforementioned housing recess, The aforementioned opening edge surface has an opening edge recess that is covered by the case cover. A gap is formed between the aforementioned opening edge recess and the case cover. The gap is filled with resin. The case has a wall surrounding the housing recess, The wall has an outer wall portion that rises outside the recess of the opening edge, The case cover comprises electronic components housed in a case cover housing surrounded by the outer wall portion.

5. A chip component having terminal electrodes, A case having a housing recess for housing the aforementioned chip component, A conductive terminal attached to the case and connected to the terminal electrode, The case has a case cover that is positioned on the opening edge surface of the case so as to cover the aforementioned housing recess, The aforementioned opening edge surface has an opening edge recess that is covered by the case cover. A gap is formed between the aforementioned opening edge recess and the case cover. The gap is filled with resin. Legs are formed on the outer edge of the case cover. The aforementioned leg portion is an electronic component that engages with the recess in the opening edge.

6. The electronic component according to claim 5, wherein the gap is formed between the leg portion and the bottom of the opening edge recess.

7. The conductive terminal has an opening edge electrode portion arranged on the opening edge surface, The aforementioned opening edge electrode portion has a bent portion that bends toward the bottom of the opening edge recess, The electronic component according to claim 5, wherein the bent portion is positioned between the bottom of the opening edge recess and the leg portion.

8. A chip component having terminal electrodes, A case having a housing recess for housing the aforementioned chip component, A conductive terminal attached to the case and connected to the terminal electrode, The case has a case cover that is positioned on the opening edge surface of the case so as to cover the aforementioned housing recess, The aforementioned opening edge surface has an opening edge recess that is covered by the case cover. A gap is formed between the aforementioned opening edge recess and the case cover. The gap is filled with resin. The case has a wall surrounding the housing recess, The wall is an electronic component having an outer wall portion that rises outward from the opening edge recess and an inner wall portion that rises inward from the opening edge recess.

9. A chip component having terminal electrodes, A case having a housing recess for housing the aforementioned chip component, A conductive terminal attached to the case and connected to the terminal electrode, The case has a case cover that is positioned on the opening edge surface of the case so as to cover the aforementioned housing recess, The aforementioned opening edge surface has an opening edge recess that is covered by the case cover. A gap is formed between the aforementioned opening edge recess and the case cover. The gap is filled with resin. The aforementioned opening edge surface has an inner opening edge surface and an outer opening edge surface located outside the inner opening edge surface. The inner opening edge surface, as it moves outward from the case, moves toward the bottom of the case. An electronic component that has a sloping opening edge formed on it.

10. Legs are formed on the outer edge of the case cover. The electronic component according to claim 9, wherein the leg portion has a cover inclined portion that slopes along the opening edge inclined portion.

11. A chip component having terminal electrodes, A case having a housing recess for housing the aforementioned chip component, A conductive terminal attached to the case and connected to the terminal electrode, The case has a case cover that is positioned on the opening edge surface of the case so as to cover the aforementioned housing recess, The aforementioned opening edge surface has an opening edge recess that is covered by the case cover. The aforementioned opening edge surface has an outer opening edge surface located outside the opening edge recess, The legs provided on the outer circumference of the case cover are positioned within the recess of the opening edge. A gap is formed between the bottom of the opening edge recess and the leg portion of the case cover. The gap is filled with resin. The conductive terminal has an opening edge electrode portion arranged on the opening edge surface, The opening edge electrode portion has an outer exposed portion that is arranged on the outer opening edge surface and exposed to the outside, and a bent portion formed on the inside of the outer exposed portion. The bent portion is positioned between the bottom of the opening edge recess and the leg portion. The aforementioned resin is an electronic component filled between the leg portion and the bent portion.

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