Multi-die interconnection

Abstract

An apparatus is disclosed that includes a molded multi-die high density interconnect including a bridge die having a first plurality of interconnects and a second plurality of interconnects. The apparatus also includes a first die having a first plurality of contacts and a second plurality of contacts, the second plurality of contacts being coupled to the first plurality of interconnects of the bridge die. The apparatus also includes a second die having a first plurality of contacts and a second plurality of contacts, the second plurality of contacts being coupled to the second plurality of interconnects of the bridge die. The coupled second plurality of contacts and interconnects have a height that is smaller than the first plurality of contacts of the first die and the second die.

Description

Technical Field

[0003]

[0001] The present disclosure generally relates to semiconductor devices including multi-die interconnects, and more particularly, but not limited to, multi-die high-density interconnects and multi-die high-density interconnect package devices, and manufacturing techniques therefor.

Background Art

[0002] Integrated circuit technology has achieved great progress in improving computing power by miniaturizing active components. Various packaging techniques such as multi-die packages can be seen in many electronic devices including processors, servers, radio frequency (RF) integrated circuits, etc. High-density interconnect technology is cost-effective in high pin-count devices. Advanced packaging and processing techniques including high-density interconnects are suitable for system-on-chip (SOC) devices, which may include multiple functional blocks, and each functional block is designed to perform specific functions such as, for example, microprocessor functions, graphics processing unit (GPU) functions, communication functions (such as Wi-Fi, Bluetooth®, and other communications).

[0003] In the industry, two main technologies enabling high-density interconnects in package design are provided: (1) Chip-on-Wafer-on-Substrate (CoWoS) and (2) Embedded Multi-die Interconnect Bridge (EMIB). Generally, the CoWoS configuration provides an interposer that enables good Si (silicon)-Si bonding. However, the use of interposers and through-silicon vias increases the manufacturing cost and package size. The EMIB configuration provides limited high density and fine pitch portions, but has a low yield due to surface conditions (surface undulations) in the fine pitch region. <​​​[Problems that the invention aims to solve]

[0004] Therefore, there is a need for systems, apparatus, and methods that overcome the shortcomings of conventional interconnect designs, including the methods, systems, and apparatus provided herein in the following disclosures. [Means for solving the problem]

[0005] The following is a simplified overview of one or more embodiments and / or examples relating to the apparatus and methods disclosed herein. Therefore, the following overview should not be considered a comprehensive overview of all intended embodiments and / or examples, nor should it be considered to identify the main or important elements relating to all intended embodiments and / or examples, or to define the scope relating to any particular embodiment and / or example. Accordingly, the sole purpose of the following overview is to provide a simplified overview of certain concepts relating to one or more embodiments and / or examples of the apparatus and methods disclosed herein, prior to the detailed description presented below.

[0006] According to various embodiments disclosed herein, at least one embodiment includes a device including a multi-die interconnection. The device also includes a bridge die having a first plurality of interconnectors and a second plurality of interconnectors. The device also includes a first die having a first plurality of contacts and a second plurality of contacts, wherein the second plurality of contacts of the first die are coupled to the first plurality of interconnectors of the bridge die, and both of the second plurality of contacts of the first die are smaller in height than the first plurality of contacts of the first die; and a second die having a first plurality of contacts and a second plurality of contacts, wherein the second plurality of contacts of the second die are coupled to the second plurality of interconnectors of the bridge die, and both of the second plurality of contacts of the second die are smaller in height than the first plurality of contacts of the second die.

[0007] According to various embodiments disclosed herein, at least one embodiment includes a method for manufacturing a device having a multi-die interconnection. The method also includes the steps of providing a bridge die having a first plurality of interconnectors and a second plurality of interconnectors, and providing a bridge die having a first plurality of interconnectors and a second plurality of interconnectors. The method also includes the step of coupling a first die having a first plurality of contacts and a second plurality of contacts to the first plurality of interconnectors of a bridge die using the second plurality of contacts of the first die, wherein both the second plurality of contacts and the first plurality of interconnectors of the first die are smaller in height than the first plurality of contacts of the first die. The method also includes the step of coupling a second die having a first plurality of contacts and a second plurality of contacts to a second plurality of interconnectors of a bridge die using the second plurality of contacts of the second die, wherein both the second plurality of contacts and the second plurality of interconnectors of the second die are smaller in height than the first plurality of contacts of the second die.

[0008] Other features and advantages relating to the apparatus and methods disclosed herein will become apparent to those skilled in the art based on the accompanying drawings and detailed description.

[0009] Many aspects of this disclosure and their associated advantages will be better understood, and a more complete understanding will be easily obtained, by referring to the following detailed description and considering it together with the accompanying drawings, which are presented merely for illustrative purposes and not to limit this disclosure. [Brief explanation of the drawing]

[0010] [Figure 1] This is a partial cross-sectional view of a multi-die high-density interconnection according to at least one aspect of the present disclosure. [Figure 2] This is a partial diagram of a multi-die package according to at least one aspect of the present disclosure. [Figure 3A] This figure shows part of a process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 3B] This figure shows part of a process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 3C] This figure shows part of a process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 3D] This figure shows part of a process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 3E] This figure shows part of a process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 3F] This figure shows part of a process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 3G] This figure shows part of a process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 3H] This figure shows part of a process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 4A] This figure shows part of another process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 4B] This figure shows part of another process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 4C] This figure shows part of another process for manufacturing a multi-die package according to at least one aspect of the present disclosure. [Figure 5] This figure shows the components of an integrated device according to one or more embodiments of the present disclosure. [Figure 6] This figure shows an exemplary mobile device according to one or more aspects of the present disclosure. [Figure 7] This figure shows various electronic devices that can be integrated with any of the above devices according to one or more aspects of the present disclosure. [Figure 8] This figure shows a flowchart of a method for manufacturing a device according to one or more embodiments of the present disclosure. [Modes for carrying out the invention]

[0011] By convention, features shown in the drawings may not be depicted to a fixed scale. Therefore, the dimensions of the illustrated features may be arbitrarily enlarged or reduced for clarity. By convention, some of the drawings are simplified for clarity. Therefore, the drawings do not necessarily show all components of a particular apparatus or method. Furthermore, similar reference numbers indicate similar features throughout this specification and the drawings.

[0012] Aspects of the Disclosure are illustrated in the following description and related drawings, which cover specific embodiments. Alternative embodiments or designs may be devised without departing from the scope of the teachings herein. In addition, well-known elements of the exemplary embodiments herein may not be described in detail or may be omitted so as not to obscure the relevant details of the teachings herein.

[0013] In some of the described exemplary implementations, instances are identified where the structure and operation of various components are derived from known prior art and can be configured according to one or more exemplary embodiments. In such instances, internal details of the structure and / or operation of some of the known prior art components may be omitted to help avoid obscuring the concepts illustrated in the exemplary embodiments disclosed herein.

[0014] The terms used in this specification are for the purpose of describing particular embodiments only and are not intended to be limiting. The singular forms "a", "an", and "the" as used in this specification are to be construed to include the plural forms as well, unless the context clearly dictates otherwise. The terms "comprises", "comprising", "includes", and / or "including" when used in this specification, specify the presence of the stated feature, integer, step, operation, element, and / or component, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0015] Various aspects disclose a molding process that accurately secures an active / logic die (e.g., using a reusable silicon or glass carrier) without causing significant movement (x-axis movement, y-axis movement, and tilt) of the active / logic die during the bridge die attach process. This can thereby easily increase the yield when attaching the bridge die to multiple dies in a multi-die package. One or more bridge dies can be attached onto the molded and accurately secured multi-die component to facilitate high-density die-to-die interconnects. According to the various aspects disclosed, a process / packaging architecture can be utilized to improve the die attach yield when using a fine bump pitch (e.g., 55 μm). The various aspects improve die interconnect and fixation and enable reducing misalignment, thereby improving the yield during the fine bump pitch die attach process.

[0016] In various aspects disclosed, the formed multi-die configuration is utilized in a bridge die attach procedure to form the formed multi-die high density interconnect packaging architecture described herein. The formed and precisely fixed multi-die configuration facilitates attaching the bridge die to the high density interconnects. However, it should be understood that the forming process is provided only to aid in the description, and the various aspects disclosed should not be construed as limited to these values or exemplary uses.

[0017] In various aspects disclosed, a bridge die having a fine bump pitch is attached directly to the die to form the formed multi-die high density interconnect packaging architecture described herein. The bridge die having a fine bump pitch may be used in various applications such as high bandwidth memory. In some aspects, the fine bump pitch may be in the range of 40 μm to 55 μm. However, it should be understood that the exemplary ranges are provided only to aid in the description, and the various aspects disclosed and claimed should not be construed as limited to these values or exemplary uses.

[0018] At least some of the advantages of the proposed packaging architecture include the following. As will be appreciated from the disclosure provided herein, among numerous other advantages, in particular, (1) accurate Si-Si bonding / attachment with minimal misalignment (x-axis, y-axis, and tilt) that causes yield loss, (2) high density interconnects (bridges) provided only in a limited area of the bridge, and (3) absence of through-silicon vias.

[0019] Figure 1 shows an apparatus having a molded multi-die high-density interconnect 100 according to one or more embodiments of the present disclosure. In some embodiments, the molded multi-die high-density interconnect 100 includes a bridge die 140 having a first plurality of interconnects 141 and a second plurality of interconnects 142. In some embodiments, the plurality of interconnects may be bonded to at least one metallization layer of the bridge die. The at least one metallization layer may include traces according to an application-specific routing pattern. The first plurality of interconnects 141 and the second plurality of interconnects 142 may be formed from any highly conductive material such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive materials, alloys, or combinations thereof. Alternatively or additionally, the first plurality of interconnects 141 and the second plurality of interconnects 142 may be formed as die bumps, including, for example, wire stud bumps, plating bumps, and solder bumps.

[0020] The first die 110 has a first plurality of contacts 112 and a second plurality of contacts 114. The second plurality of contacts 114 of the first die 110 may have a smaller height than the first plurality of contacts 112. In some embodiments, the first plurality of contacts 112 may be copper pillar bumps. In some embodiments, the second plurality of contacts 114 may be pads. In other embodiments, the first plurality of contacts 112 may be solder bumps and the second plurality of contacts 114 may be wire stud bumps. The second plurality of contacts 114 are coupled to the first plurality of interconnectors 141 of the bridge die 140. It will be understood that the various embodiments disclosed are not limited to any particular configuration of the first die 110 contacts (112, 114) or the bridge die 140.

[0021] The second die 120 has a first plurality of contacts 122 and a second plurality of contacts 124. The second plurality of contacts 124 may have a smaller height than the first plurality of contacts 122. In some embodiments, the first plurality of contacts 122 may be copper pillar bumps. In some embodiments, the second plurality of contacts 124 may be pads. In other embodiments, the first plurality of contacts 122 may be solder bumps and the second plurality of contacts 124 may be wire stud bumps. The second plurality of contacts 124 are coupled to a second plurality of interconnectors 142 of the bridge die 140. It will be understood that the various embodiments disclosed are not limited to any particular configuration of the second die 120 contacts (122, 124) or the bridge die 140 interconnectors 142.

[0022] In some embodiments, the first plurality of interconnections 141 of the bridge die 140 have a height smaller than the first plurality of contacts 112 of the first die 110. Also, the first plurality of interconnections 141 of the bridge die 140 have a height smaller than the first plurality of contacts 122 of the second die 120.

[0023] In some embodiments, the first plurality of contacts 112 of the first die 110 and the first plurality of contacts 122 of the second die 120 are coupled to a plurality of (invisible) connectors on the outside of the multi-die package 100. In some embodiments, the first plurality of contacts 112 and 122 may be coupled to the package substrate to the connectors on the outside of the multi-die package 100. In other embodiments, the first plurality of contacts 112 and 122 may be coupled to an (intermediate) interposer before coupling to the connectors on the outside of the multi-die package 100. In further embodiments, the first plurality of contacts 112 and 122 may be coupled to the connectors on the outside of the multi-die package 100 via a passive network (e.g., resistors, capacitances, and / or inductors).

[0024] The first die 110 and the second die 120 are embedded in the molding compound 130 to prevent displacement of the bridge die 140. This is done before mounting the bridge die (see the description of the manufacturing process below for details). The first plurality of interconnects 141 and the second plurality of interconnects 142 of the bridge die 140 may be configured as die bumps (e.g., small copper pillars with solder pads) having a fine pitch in the range of approximately 40 μm to 55 μm. Generally, it will be understood that the pitch of the interconnects (141, 142) and associated (logic) die contacts (114, 124) of the bridge die 140 is finer (i.e., smaller) than the pitch of the contacts (112, 122) not coupled to the bridge die (140).

[0025] Figure 2 shows an apparatus having a molded multi-die high-density interconnect package 200 according to one or more embodiments of the present disclosure. After the bridge die 140 is mounted on the first die 110 and the second die 120, the first plurality of interconnects 141 (invisible) and the second plurality of interconnects 142 (invisible) of the bridge die 140 may be embedded in the first underfill 148. In some embodiments, the first plurality of contacts 112 of the first die 110 are copper pillars, which may have solder bumps 113, and the second plurality of contacts 114 of the first die 110 are bumps having a fine pitch that matches the pitch of the bridge die interconnects (also embedded in the first underfill 148). Similarly, the first plurality of contacts 122 of the second die 120 are copper pillars, which may have solder bumps 123, and the second plurality of contacts 124 of the second die 120 are bumps having a fine pitch that matches the pitch of the bridge die interconnects (also embedded in the first underfill 148). As described above, in an alternative embodiment, the second plurality of contacts 114 and the second plurality of contacts 124 may be pads having a fine pitch that matches the pitch of the bridge die interconnects 141, 142.

[0026] The package 200 may further include a package substrate 160 having a cavity 165 and a plurality of contact pads 162. A bridge die 140 may be embedded in the cavity 165 and attached using an adhesive 166. The plurality of contact pads 162 are coupled to a first plurality of contacts 112 of a first die 110 and a first plurality of contacts 122 of a second die 120. An optional second underfill 150 may be disposed between the molding compound 130 and the package substrate 160. In some embodiments, as shown, the second underfill 150 encapsulates the plurality of contact pads 162, the first plurality of contacts 112 of the first die 110, the first plurality of contacts 122 of the second die 120, and at least a portion of the first underfill 148.

[0027] It will be understood that the multi-die package 200 has a plurality of connectors 170 on the outside of the multi-die package 200 that enable coupling the package 200 to an external device. The plurality of connectors 170 are illustrated as a ball grid array (BGA) having a plurality of solder balls. Furthermore, it will be understood that at least some of the plurality of contact pads 162 are electrically coupled to some of the connectors 170 (through internal package routing which is not shown for the sake of simplicity in the figure). Furthermore, it will be understood that the plurality of contact pads 162 are electrically coupled to both the first die 110 and the second die 120, and electrically coupled to the bridge die 140 through the first die 110 and the second die 120. Specifically, the plurality of contact pads 162 can be coupled to a first plurality of contacts 112 of the first die 110 using solder pads / bumps 113, and can be coupled to a first plurality of contacts 122 of the second die 120 using solder pads / bumps 123. The first plurality of contacts 112 of the first die 110 are coupled to pads 111, which may be electrically coupled to a conductive layer within the first die 110 (e.g., through internal package routing) and / or to a bridge die 140 through internal package routing within the multi-die package 200 (not shown for simplification of the figure). Similarly, the second plurality of contacts 122 of the second die 120 are coupled to pads 121, which may be electrically coupled to a conductive layer within the second die 120 and / or to a bridge die 140 through internal package routing within the multi-die package 200 (not shown for simplification of the figure). Thus, the multi-die package 200 configuration allows signaling and power to be distributed within the multi-die package 200 and to external devices as needed. However, it should be understood that the various embodiments provided herein are for illustrative purposes only and should not be construed as limiting the various embodiments disclosed and claimed.

[0028] The contact pad 162, contacts 112 and 122, and pads 111 and 121 may be formed from any highly conductive material such as copper (Cu), aluminum (Al), silver (Ag), gold (Au), or other conductive materials, alloys, or combinations thereof. For example, different types of connectors and / or contacts, materials, and configurations may be used as known, insofar as their configuration allows for the functional electrical coupling of the die to internal and external devices of the package.

[0029] To fully illustrate the design aspects of this disclosure, a method of fabrication is presented. Other methods of fabrication are possible, and the methods described are presented solely for the purpose of aiding the understanding of the concepts disclosed herein.

[0030] Figure 3A shows part of the process for manufacturing a multi-die package 300 having a molded multi-die high-density interconnect package 300 according to at least one aspect of the present disclosure. The process first involves die placement and mounting of a first die 310 and a second die 320 attached to a temporary support film 302 disposed on a carrier 301.

[0031] Figure 3B shows part of the process for producing a multi-die package 300 having a molded multi-die high-density interconnect according to at least one aspect of the present disclosure. The process then involves attaching the first die 310 and the second die 320 to a temporary support film 302 disposed on a carrier 301. In this part, a molding process is performed to embed the first die 310 and the second die 320 in a molding compound 330 to prevent die displacement during further processing.

[0032] Figure 3C shows part of the process for manufacturing a multi-die package 300 having a molded multi-die high-density interconnect according to at least one aspect of the present disclosure. The process then involves embedding a first die 310 and a second die 320 into a molding compound 330. In this part, the first die 310 and the second die 320 are inverted and attached to a temporary support film 302' disposed on a carrier 301'. In this process, the pads 311 of the first die 310 and the pads 321 of the second die 320 are exposed for further processing.

[0033] Figure 3D shows part of the process for fabricating a multi-die package 300 having a molded multi-die high-density interconnect according to at least one aspect of the present disclosure. The process then involves inverting the first die 310 and the second die 320, which are embedded in a molding compound 330, and attaching them to a temporary support film 302' disposed on a carrier 301'. In this part, a photoresist 345 is deposited on the pad 311 of the first die 310 and the pad 321 of the second die 320 and patterned to provide access to the pad 311 of the first die 310 and the pad 321 of the second die 320 for further processing.

[0034] Figure 3E shows part of the process for fabricating a multi-die package 300 having a molded multi-die high-density interconnect according to at least one aspect of the present disclosure. The process then involves inverting the first die 310 and the second die 320, which are embedded in a molding compound 330, and attaching them to a temporary support film 302' disposed on a carrier 301'. In this part, a first plurality of contacts 312 of the first die 310 are formed in the openings of the photoresist 345 on the pad 311. Similarly, a first plurality of contacts 322 of the second die 320 are formed in the openings of the photoresist 345 on the pad 321. In some aspects, the first plurality of contacts 312 of the first die 310 are copper pillars, and the copper pillars may have solder bumps 313. Likewise, the first plurality of contacts 322 of the second die 320 are copper pillars, and the copper pillars may have solder bumps 323. In some embodiments, the first plurality of contacts 312 of the first die 310 are formed in the openings of the photoresist 345, so that the second plurality of contacts of the first die 310 (e.g., pads of the first die 310 not exposed by the photoresist 345) are ensured to have a height smaller than the first plurality of contacts 312. Similarly, the first plurality of contacts 322 of the second die 320 are (likewise) formed in the openings of the photoresist 345, so that the second plurality of contacts of the second die 320 (e.g., pads of the second die 320 not exposed by the photoresist 345) are ensured to have a height smaller than the first plurality of contacts 312.

[0035] Figure 3F shows part of the process for fabricating a multi-die package 300 having a molded multi-die high-density interconnect according to at least one aspect of the present disclosure. The process then involves inverting the first die 310 and the second die 320, which are embedded in a molding compound 330, and attaching them to a temporary support film 302' disposed on a carrier 301'. In this part, the photoresist is removed, exposing the first plurality of contacts 312 of the first die 310 and the first plurality of contacts 322 of the second die 320. A bridge die 340 having the first plurality of interconnects 341 and the second plurality of interconnects 342 is coupled to the first die 310 and the second die 320. In some aspects, the first plurality of interconnects 341 and the second plurality of interconnects 342 may be wire stud bumps, copper pillars which may have solder bumps, or any suitable bumping / connection configuration. In this configuration, the second plurality of contacts 314 of the first die 310 and the second plurality of contacts 324 of the second die 320 may be pads. The coupling of the interconnectors 341 and contacts 314 and the interconnectors 342 and contacts 324 may be carried out by solder reflow, a thermal compression process, or any other suitable process. However, the various embodiments disclosed herein are not limited to the illustrated configuration. The first plurality of interconnectors 341 may be coupled to the second plurality of contacts 314 of the first die 310 and the second plurality of interconnectors 342 may be coupled to the second plurality of contacts 324 of the second die 320 using any suitable electrical coupling technique. Furthermore, the first underfill 348 is applied to fill the electrical couplings and provide additional mechanical stability to the die bridge 340 so that it can be further processed. In some embodiments, the first plurality of interconnections 341 of the bridge die 340 are formed using separate machining steps (using yet another type of coupling technique), so that the first plurality of interconnections 341 can have a smaller height than the first plurality of contacts 312 of the first die 310 (for example, copper pillars which may have solder bumps 313).Similarly, since the second plurality of interconnections 342 of the bridge die 340 are formed using (likewise) separate machining steps (using yet another different type of bonding technique), it is possible for the second plurality of interconnections 342 to have a smaller height than the first plurality of contacts 322 of the second die 320 (for example, copper pillars which may have solder bumps 323).

[0036] Figure 3G shows part of the process for fabricating a multi-die package 300 having a molded multi-die high-density interconnect according to at least one aspect of the present disclosure. The process then involves inverting the first die 310 and the second die 320, which are embedded in a molding compound 330, and attaching them to a temporary support film 302' disposed on a carrier 301'. A bridge die 340 is coupled to the first die 310 and the second die 320. A package substrate 360 ​​having a cavity 365 is provided in this area. The package substrate 360 ​​is bonded to the bridge die 340 using an adhesive 366. The package substrate 360 ​​is also bonded to a first plurality of contacts 312 of the first die 310 and a first plurality of contacts 322 of the second die 320 using pads 362. The bonding of the pads 362 to the contacts 312 and 322 may be performed by a solder reflow process or any other suitable process. It will be understood that the various embodiments disclosed herein are not limited to the illustrated configurations. The adhesive and pad bonding sections described above are given only as examples, and it will be understood that other bonding techniques may be used according to the various embodiments disclosed.

[0037] Figure 3H shows part of the process for manufacturing a multi-die package 300 having a molded multi-die high-density interconnect according to at least one aspect of the present disclosure. The process then involves embedding the first die 310 and the second die 320 inverted into the molding compound 330. A bridge die 340 is coupled to the first die 310 and the second die 320. The package substrate 360 ​​has a cavity 365 into which the bridge die 340 is embedded. The package substrate 360 ​​is coupled to a first plurality of contacts 312 of the first die 310 and a first plurality of contacts 322 of the second die 320. In this part, an optional second underfill 350 is provided between the package substrate 360 ​​and the first die 310 and the second die 320 embedded in the molding compound 330. In this part of the process, an optional second underfill 350, together with the first underfill 348, embeds the contacts (312 and 322) and the bridge die 340. Using the ball attachment process, an external connector 370 (solder ball, BGA, etc.) can be formed attached to the package substrate 360 ​​using conventional techniques. However, it should be understood that other external connectors 370 may be used, and various embodiments are not limited to the illustrated example. Furthermore, the temporary support film 302' and carrier 301' (not shown) are removed. It should be understood that the resulting multi-die package 300 is similar to the multi-die package 200 in Figure 2, except that it is inverted.

[0038] Figure 4A shows part of another process for fabricating a multi-die package 400 having a molded multi-die high-density interconnect according to at least one aspect of the present disclosure. The initial fabrication process is the same as the part described above with respect to Figures 3A to 3E, and therefore will not be repeated. The process then proceeds to invert the first die 410 and the second die 420, which are embedded in the molding compound 430, and attach them to a temporary support film 402 disposed on a carrier 401. In this part, the photoresist (not shown) is removed to expose the first plurality of contacts 412 of the first die 410 and the first plurality of contacts 422 of the second die 420. A bridge die 440 having the first plurality of interconnects 441 is coupled to the first die 410, and the second plurality of interconnects 442 of the bridge die 440 is coupled to the second die 420. In some embodiments, the first plurality of interconnectors 441 and the second plurality of interconnectors 442 may be wire stud bumps, copper pillars which may have solder bumps, or any suitable bumping / connection configuration. In this configuration, the second plurality of contacts 414 of the first die 410 and the second plurality of contacts 424 of the second die may be pads that enable coupling to the interconnectors 441 and 442. The coupling of the interconnectors 441 and contacts 414 and the interconnectors 442 and contacts 424 may be performed by solder reflow, a thermal compression process, or any other suitable process. However, the various embodiments disclosed herein are not limited to the illustrated configuration. In this configuration, it will be understood that no underfill is applied. In some embodiments, the first plurality of interconnects 441 of the bridge die 440 are formed using separate machining steps (using yet another type of coupling technique), so that the first plurality of interconnects 441 can have a smaller height than the first plurality of contacts 412 of the first die 410 (for example, copper pillars which may have solder bumps).Similarly, since the second plurality of interconnects 442 of the bridge die 440 are formed using (likewise) separate machining steps (using yet another different type of bonding technique), it is possible for the second plurality of interconnects 442 to have a smaller height than the first plurality of contacts 422 of the second die 420 (for example, copper pillars which may have solder bumps).

[0039] Figure 4B shows part of the process for fabricating a multi-die package 400 having a molded multi-die high-density interconnect according to at least one aspect of the present disclosure. The process then involves inverting the first die 410 and the second die 420, which are embedded in a molding compound 430, and attaching them to a temporary support film 402 disposed on a carrier 401. A bridge die 440 is coupled to the first die 410 and the second die 420. A package substrate 460 having a cavity 465 is provided in this area. The package substrate 460 is bonded to the bridge die 440 using adhesive 466. The package substrate 460 is also bonded to a first plurality of contacts 412 of the first die 410 and a first plurality of contacts 422 of the second die 420 using pads 462. The bonding of the pads 462 to the contacts 412 and 422 may be carried out by a solder reflow process or any other suitable process. Thus, the various aspects disclosed herein are not limited to the illustrated configuration. The adhesive and pad joints described above are given only as examples, and it should be understood that other bonding techniques may be used according to the various embodiments disclosed.

[0040] Figure 4C shows part of the process for fabricating a multi-die package 400 having a molded multi-die high-density interconnect according to at least one aspect of the present disclosure. The process then involves embedding a first die 410 and a second die 420 inverted into a molding compound 430. A bridge die 440 is coupled to the first die 410 and the second die 420. The package substrate 460 has a cavity 465 into which the bridge die 440 is embedded. The package substrate 460 is coupled to a first plurality of contacts 412 of the first die 410 and a first plurality of contacts 422 of the second die 420. In this part, an underfill 450 is provided between the package substrate 460 and the first die 410 and the second die 420 embedded in the molding compound 430. The underfill 450 also embeds the contacts (412 and 422) and the bridge die 440. Using conventional techniques, the solder balls of the BGA470 are attached to the package substrate on the outside of the multi-die package 400. Furthermore, the temporary support film 402 and carrier 401 are removed. It will be understood that the resulting multi-die package 400 is similar to the multi-die package 200 in Figure 2, except that the bridge die 440 does not have a separate underfill 150 applied and the package is inverted.

[0041] It will be understood that the above-described manufacturing processes are given only as some schematic examples of aspects of the present disclosure and do not limit the scope of the present disclosure or the attached claims. Furthermore, many details of manufacturing processes known to those skilled in the art may be omitted or combined in the outline process section to facilitate understanding of the various aspects disclosed without detailed representation of each detail and / or all possible process modifications.

[0042] Figure 5 shows components of an integrated device 500 according to one or more embodiments of the present disclosure. Despite the various configurations of the packages described above (e.g., packages 200, 300, and 400), it will be understood that package 501 has similar characteristics and therefore details are not given here. Package 501 may be configured to be coupled to PCB 590. PCB 590 is also coupled to a power supply 580 (e.g., a power management integrated circuit (PMIC)), which allows package 501 to be electrically coupled to PMIC 580. Specifically, one or more power (VDD) lines 591 and one or more ground (GND) lines 592 may be coupled to PMIC 580 to distribute power to PCB 590 and then to PCB 590 and package 501 via VDD BGA pin 525 and GND BGA pin 527. Each of the VDD line 591 and GND line 592 may be formed from traces, shapes, or patterns in one or more metal layers (e.g., layers 1-6) of PCB 590, coupled via one or more vias that penetrate an insulating layer separating the metal layers 1-6 in PCB 590. PCB 590 may have one or more PCB capacitors (PCB caps) 595, which can be used to modulate power signals as is known to those skilled in the art. Additional connections and devices may be coupled to package 501 via one or more additional BGA pins on package 501, and / or additional connections and devices may penetrate PCB 590 and reach package 501 via one or more additional BGA pins. It will be understood that the illustrated configurations and descriptions are provided only to aid in illustrating the various embodiments disclosed herein. For example, PCB 590 may have more or fewer metal and insulating layers, and may have multiple lines supplying power to various components. Therefore, the above-described examples and related figures should not be construed as being limited to the various embodiments disclosed and claimed herein.

[0043] Figure 6 shows an exemplary mobile device according to several examples of the present disclosure. Referring now to Figure 6, a block diagram of a mobile device configured according to an exemplary embodiment is shown, the whole being designated as mobile device 600. In some embodiments, mobile device 600 may be configured as a wireless communication device. As shown, mobile device 600 includes a processor 601. The processor 601 is communicatively coupled to memory 632 via a link, which may be a die-to-die link or a chip-to-chip link. Mobile device 600 also includes a display 628 and a display controller 626, the display controller 626 being coupled to the processor 601 and the display 628.

[0044] In some embodiments, Figure 6 may include a coder / decoder (codec) 634 (e.g., an audio and / or voice codec) coupled to the processor 601, a speaker 636 and a microphone 638 coupled to the codec 634, and a wireless antenna 642 and a wireless controller 640 (which may include a modem, RF circuitry, filters, etc.) coupled to the processor 601.

[0045] In certain embodiments where one or more of the aforementioned blocks exist, the processor 601, display controller 626, memory 632, codec 634, and wireless circuitry 640 may be contained within a system-in-package device or system-on-chip device 622, which may be implemented in whole or in part using molded multi-die high-density interconnect packages (e.g., 200, 300, 400) and techniques disclosed herein. The input device 630 (e.g., a physical or virtual keyboard), power supply 644 (e.g., a battery), display 628, input device 630, speaker 636, microphone 638, wireless antenna 642, and power supply 644 may be outside the system-on-chip device 622 and may be coupled to components of the system-on-chip device 622, such as interfaces or controllers.

[0046] Figure 6 shows a mobile device 600, but it should be noted that the processor 601 and memory 632 may also be incorporated into a set-top box, music player, video player, entertainment unit, navigation device, personal digital assistant (PDA), stationary data unit, computer, laptop, tablet, communication device, mobile phone, or other similar device.

[0047] Figure 7 shows various electronic devices that may be integrated with any of the above-described integrated devices, packages, or semiconductor devices, according to various examples of the present disclosure. For example, the mobile phone device 702, the laptop computer device 704, and the stationary terminal device 706 may each be generally considered user equipment (UE) and may include a multi-die package 700 as described herein, the multi-die package 700 may be similar to the molded multi-die packages 200, 300, and 400 as described herein. The devices 702, 704, and 706 shown in Figure 7 are merely examples. Furthermore, the molded multi-die high-density interconnect device 700 may feature a group of devices (e.g., electronic devices) that include, but are not limited to, mobile devices, portable data units such as handheld personal communication system (PCS) units and personal digital assistants, GPS-enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, stationary data units such as meter reading devices, communication devices, smartphones, tablet computers, computers, wearable devices, servers, routers, electronic devices implemented in automobiles (e.g., autonomous vehicles), Internet of Things (IoT) devices, or any other devices that store or retrieve data or computer instructions, or any combination thereof.

[0048] The devices and functions disclosed above may be designed and configured in computer files (e.g., Register Transfer Level (RTL), Geometric Data Stream (GDS), Gerber, etc.) stored on a computer-readable medium. Some or all of such files may be provided to a manufacturer that manufactures a device based on such files. The resulting product may include a semiconductor wafer, which is then cut into semiconductor dies and packaged as a semiconductor package, an integrated device, a system-on-a-chip device, etc., which may then be used in the various devices described herein.

[0049] It will be understood that the various embodiments disclosed herein can be described as functional equivalents of structures, materials, and / or devices described and / or recognized by those skilled in the art. For example, in one embodiment, the apparatus may include means for performing the various functions described above. It will be understood that the above embodiments are provided merely as examples, and that the various embodiments claimed are not limited to the specific content and / or figures cited as examples.

[0050] According to various embodiments disclosed herein, at least one embodiment includes a device comprising a bridge die (e.g., 140, 340, 440) having a first plurality of interconnectors (e.g., 141, 341, 441) and a second plurality of interconnectors (e.g., 142, 342, 442), and a molded multi-die high-density interconnector (e.g., 100, 200, 300, 400, and 501) including a first die (e.g., 110, 310, 410) having a first plurality of contacts (e.g., 112, 312, 412) and a second plurality of contacts (e.g., 114, 314, 414). The second plurality of contacts are coupled to the first plurality of interconnectors of the bridge die. The coupled second plurality of contacts and first plurality of interconnectors have a height smaller than the first plurality of contacts of the first die. A second die (e.g., 120, 320, 420) having a first set of multiple contacts (e.g., 122, 322, 422) and a second set of multiple contacts (e.g., 124, 324, 424). The second set of multiple contacts is coupled to a second set of multiple interconnects of the bridge die. The coupled second set of multiple contacts and the second set of multiple interconnects have a height smaller than the first set of multiple contacts of the second die.

[0051] Among the many technical advantages, in at least some embodiments, directly coupling the bridge die to the first and second dies reduces the height of the connection between the bridge die and the first and second dies. Furthermore, precise positioning of the bridge die, first die, and second die allows for a finer pitch of the connection. Moreover, embedding the bridge die (e.g., 140, 340, 440) in the substrate cavity further reduces the package height. Other technical advantages will be recognized from the various embodiments disclosed herein. These technical advantages are given only as examples and should not be construed as limiting the various embodiments disclosed herein.

[0052] From the above, it will be understood that there are various methods for manufacturing the multi-die packages disclosed herein. Figure 8 shows a flowchart of method 800 for manufacturing a device having a molded multi-die high-density interconnect package. This method includes, in block 802, providing a bridge die (e.g., 140) having a first plurality of interconnects (e.g., 141) and a second plurality of interconnects (e.g., 142). In block 804, the process subsequently couples a first die (e.g., 110) having a first plurality of contacts (e.g., 112) and a second plurality of contacts (e.g., 114) to the first plurality of interconnects of the bridge die. The coupled second plurality of contacts and first plurality of interconnects have a height smaller than the first plurality of contacts of the first die. In block 806, the process subsequently couples a second die (e.g., 120) having a first plurality of contacts (e.g., 122) and a second plurality of contacts (e.g., 124) to a second plurality of interconnects of the bridge die. The coupled second plurality of contacts and second plurality of interconnects have a height smaller than the first plurality of contacts of the second die.

[0053] Accordingly, from the above disclosure, those skilled in the art will understand that additional processes for manufacturing the various embodiments disclosed herein are apparent, and that a literal representation of the above processes is neither presented nor illustrated in the accompanying drawings.

[0054] One or more of the components, processes, features, and / or functions shown in Figures 1 to 8 may be rearranged and / or combined as a single component, process, feature, or function, or incorporated as several components, processes, or functions. Additional elements, components, processes, and / or functions may be added without departing from this disclosure. Note that Figures 1 to 8 and their corresponding descriptions in this disclosure are not limited to dies and / or ICs. In some implementations, Figures 1 to 8 and their corresponding descriptions may be used to manufacture, fabricate, provide, and / or produce integrated devices. In some implementations, the device may include a die, an integrated device, a die package, an integrated circuit (IC), a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, or a package-on-package (PoP) device.

[0055] In this specification, terms such as “User Equipment” (or “UE”), “User Device,” “User Terminal,” “Client Device,” “Communication Device,” “Wireless Device,” “Wireless Communication Device,” “Handheld Device,” “Mobile Device,” “Mobile Terminal,” “Mobile Station,” “Handset,” “Access Terminal,” “Subscriber Device,” “Subscriber Terminal,” “Subscriber Station,” “Terminal,” and variations thereof may interchangeably refer to any suitable mobile or fixed device capable of receiving wireless communications and / or navigation signals. These terms include, but are not limited to, music players, video players, entertainment units, navigation devices, communication devices, smartphones, personal digital assistants, fixed terminals, tablet computers, computers, wearable devices, laptop computers, servers, automotive devices in motor vehicles, and / or other types of portable electronic devices that are typically carried by a person and / or have communication capabilities (e.g., wireless, cellular, infrared, short-range radio, etc.). These terms also include devices that communicate with other devices capable of receiving wireless communications and / or navigation signals via short-range wireless connections, infrared connections, wired connections, or other connections, regardless of whether satellite signal reception, support data reception, and / or location-related processing are performed in that device or in another device. UEs may be embodied by any of several types of devices, including, but not limited to, printed circuit (PC) cards, CompactFlash® devices, external or internal modems, wireless or wired telephones, smartphones, tablets, consumer tracking devices, and asset tags.

[0056] Wireless communication between electronic devices may be based on a variety of technologies, including Code Division Multiple Access (CDMA), W-CDMA, Time Division Multiple Access (TDMA), Frequency Division Multiple Access (FDMA), Orthogonal Frequency Division Multiplexing (OFDM), Global System for Mobile Communications (GSM), 3GPP Long Term Evolution (LTE), 5G New Radio, Bluetooth (BT), Bluetooth Low Energy (BLE), IEEE 802.11 (WiFi), and IEEE 802.15.4 (Zigbee / Thread), or other protocols that may be used within a wireless communication network or data communication network. Bluetooth Low Energy (also known as Bluetooth LE, BLE, and Bluetooth Smart).

[0057] The term “exemplary” is used herein to mean “acting as an example, case, or illustration.” No detail described herein as “exemplary” should be construed to be more favorable than other examples. Similarly, the term “example” does not mean that all examples include the features, advantages, or modes of operation described. Furthermore, certain features and / or structures may be combined with one or more other features and / or structures. Moreover, at least a portion of the apparatus described herein may be configured to perform at least a portion of the methods described herein.

[0058] It should be noted that the terms “connected,” “joined,” or any variation thereof, mean any direct or indirect connection or joining between elements unless the connection is expressly disclosed as a direct connection, and may include the presence of intermediate elements between two elements that are “connected” or “joined” together through an intermediary element.

[0059] Any reference in this specification to elements using designations such as “first,” “second,” etc., does not limit the number and / or order of these elements. Rather, these designations are used as a convenient way to distinguish two or more elements, and / or examples of elements. Also, unless otherwise stated, a set of elements may consist of one or more elements.

[0060] Those skilled in the art will understand that information and signals can be represented using any of the various different techniques and methods. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referred to throughout the above description may be represented by voltage, electric current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.

[0061] Nothing described, illustrated, or shown in this application is intended to make public any component, act, feature, benefit, advantage, or equivalent, whether such component, act, feature, benefit, advantage, or equivalent is described in the claims.

[0062] Furthermore, it will be understood by those skilled in the art that various exemplary logic blocks, modules, circuits, and algorithmic actions described in connection with the examples disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly demonstrate this hardware and software compatibility, various exemplary components, blocks, modules, circuits, and actions are generally described above in relation to their functions. Whether such functions are implemented as hardware or as software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art may implement the described functions in various ways for each specific application, but such decisions should not be construed as causing a departure from the scope of this disclosure.

[0063] We have described several aspects of a device, and it goes without saying that these aspects also constitute descriptions of corresponding methods, and therefore blocks or components of a device should also be understood as corresponding method actions or features of method actions. Similarly, aspects described with respect to or as method actions also constitute descriptions of corresponding blocks, details, or features of the corresponding device. Some or all method actions can be performed by (or using) hardware devices, such as microprocessors, programmable computers, or electronic circuits. In some examples, some or more of the most important method actions can be performed by such devices.

[0064] In the embodiments for carrying out the above invention, it will be found that various features are grouped together in the examples. This manner of disclosure should not be understood as an intention that the exemplary clauses have more features than are explicitly stated within each clause. Rather, the various embodiments of this disclosure may contain fewer features than all features of the individual exemplary clauses disclosed. Accordingly, the following clauses should be considered as incorporated into the description, and each clause may be valid on its own as a separate example. Each dependent clause may refer within itself to a particular combination with one of the other clauses, but the embodiments of that dependent clause are not limited to that particular combination. It will be understood that other exemplary clauses may also contain combinations of embodiments of the dependent clause with the subject matter of any other dependent clause or independent clause, or any combination of features with other dependent clauses and independent clauses. Unless it is not explicitly stated or easily inferred that a particular combination is not intended (for example, a contradictory embodiment such as defining an element as both an insulator and a conductor), the various embodiments disclosed herein explicitly include these combinations. Furthermore, even if a clause is not directly subordinate to an independent clause, it is intended that the form of the clause may be included in any other independent clause.

[0065] Implementation examples are described in the following numbered clauses. Clause 1. A device having a multi-die interconnection, the multi-die interconnection comprising: a bridge die having a first plurality of interconnection parts and a second plurality of interconnection parts; a first die having a first plurality of contacts and a second plurality of contacts, wherein the second plurality of contacts of the first die are coupled to the first plurality of interconnection parts of the bridge die, and both of the second plurality of contacts of the first die are smaller in height than the first plurality of contacts of the first die; and a second die having a first plurality of contacts and a second plurality of contacts, wherein the second plurality of contacts of the second die are coupled to the second plurality of interconnection parts of the bridge die, and both of the second plurality of contacts of the second die are smaller in height than the first plurality of contacts of the second die. Clause 2 The apparatus described in Clause 1, wherein the first die and the second die are embedded in the molding compound. Clause 3 The apparatus according to Clause 1 or 2, wherein the first plurality of interconnectors and the second plurality of interconnectors of the bridge die have a smaller pitch than the first plurality of contacts of the first die and the first plurality of contacts of the second die. Clause 4 The apparatus according to Clause 3, wherein the first plurality of interconnections and the second plurality of interconnections of the bridge die are configured as die bumps with a pitch in the range of 40 μm to 55 μm. Clause 5 The apparatus according to Clause 4, wherein the second plurality of contacts of the first die are pads, and the second plurality of contacts of the second die are pads. Clause 6 The apparatus according to any one of Clauses 1 to 5, wherein the first plurality of interconnects and the second plurality of interconnects of the bridge die are embedded in the first underfill. The apparatus according to any one of the clauses 1 to 6, further comprising a package substrate having a cavity and a plurality of pads, wherein a bridge die is at least partially disposed within the cavity, and the plurality of pads are coupled to a first plurality of contacts of a first die and a first plurality of contacts of a second die. The apparatus according to Clause 8, further comprising a second underfill, wherein the first plurality of contacts of the first die and the first plurality of contacts of the second die are embedded in the second underfill. Clause 9 The apparatus according to Clause 7 or 8, further comprising a plurality of connectors on the outside of the package substrate, and at least one of the plurality of pads being Clause 10 The apparatus according to any one of Clauses 1 to 9, wherein the total height of the first plurality of interconnectors of the bridge die and the second plurality of contacts of the first die is less than the height of the first plurality of contacts of the first die. Clause 11 The apparatus according to any one of Clauses 1 to 10, wherein the total height of the second plurality of interconnections of the bridge die and the second plurality of contacts of the second die is less than the height of the first plurality of contacts of the second die. Clause 12 The device is one of the devices described in any of Clauses 1 to 11, selected from the group consisting of music players, video players, entertainment units, navigation devices, communication devices, mobile devices, cell phones, smartphones, personal digital assistants, access points, stationary terminals, tablet computers, computers, wearable devices, Internet of Things (IoT) devices, laptop computers, servers, base stations, and devices in automobile vehicles. Clause 13 A method for manufacturing a device having a multi-die interconnection, comprising the steps of: providing a bridge die having a first plurality of interconnectors and a second plurality of interconnectors; providing a bridge die having a first plurality of interconnectors and a second plurality of interconnectors; coupling a first die having a first plurality of contacts and a second plurality of contacts to the first plurality of interconnectors of a bridge die using the second plurality of contacts of the first die, wherein both the second plurality of contacts and the first plurality of interconnectors of the first die are smaller in height than the first plurality of contacts of the first die; and coupling a second die having a first plurality of contacts and a second plurality of contacts to the second plurality of interconnectors of a bridge die using the second plurality of contacts of the second die, wherein both the second plurality of contacts and the second plurality of interconnectors of the second die are smaller in height than the first plurality of contacts of the second die. Clause 14 The method according to Clause 13, further comprising the step of embedding the first die and the second die into the molding compound. Clause 15 The method according to Clause 13 or 14, wherein the first plurality of interconnects and the second plurality of interconnects of the bridge die have a smaller pitch than the first plurality of contacts of the first die and the first plurality of contacts of the second die. Clause 16 The method according to Clause 15, wherein the first plurality of interconnections and the second plurality of interconnections of the bridge die are configured as die bumps with a pitch in the range of 40 μm to 55 μm. Clause 17 The method according to Clause 16, wherein the second plurality of contacts of the first die are pads, and the second plurality of contacts of the second die are pads. The method according to any one of the clauses 13 to 17, further comprising the step of embedding a first plurality of interconnects and a second plurality of interconnects of a bridge die into a first underfill. The method according to any one of the claims 13 to 18, further comprising the steps of: providing a package substrate having a cavity and a plurality of pads; embedding a bridge die at least partially in the cavity; and coupling the plurality of pads to a first plurality of contacts of a first die and a first plurality of contacts of a second die. Clause 20 The method according to Clause 19, further comprising the step of embedding a first plurality of contacts of a first die and a first plurality of contacts of a second die into a second underfill. The method according to Clause 21 of Clause 19 or 20, further comprising the step of forming multiple connectors on opposite sides of multiple pads on a package substrate. Clause 22 The method according to any one of Clauses 13 to 21, wherein the first plurality of interconnects of the bridge die have a height less than the first plurality of contacts of the first die. Clause 23 The method according to any one of Clauses 13 to 22, wherein the second plurality of contacts of the coupled first die and the first plurality of interconnects of the bridge die have a height smaller than the first plurality of contacts of the first die, and the second plurality of contacts of the coupled second die and the second plurality of interconnects of the bridge die have a height smaller than the first plurality of contacts of the second die. Clause 24 The device is selected from the group consisting of music players, video players, entertainment units, navigation devices, communication devices, mobile devices, cell phones, smartphones, personal digital assistants, access points, stationary terminals, tablet computers, computers, wearable devices, Internet of Things (IoT) devices, laptop computers, servers, base stations, and devices in automobile vehicles, as described in any of Clauses 13 to 23.

[0066] Furthermore, in some examples, individual actions may be subdivided into multiple sub-actions or may contain multiple sub-actions. Such sub-actions can be included in the disclosure of individual actions and may be part of the disclosure of individual actions.

[0067] The above disclosures illustrate examples of the present disclosure, but it should be noted that various modifications and changes can be made herein without departing from the scope of the present disclosure as defined by the attached claims. The functions and / or actions of the method claims in the examples of the present disclosure described herein do not need to be performed in any particular order. In addition, well-known elements may not be described in detail or may be omitted so as not to obscure the relevant details of the embodiments and examples disclosed herein. Furthermore, elements of the present disclosure may be described or claimed in the singular, but the plural is intended unless it is expressly stated that they are limited to the singular. [Explanation of symbols]

[0068] 100, 200 molded multi-die high-density interconnects 110 The first die 111 pads 112 First Multiple Contacts 113 Solder pads / bumps 114 Second Multiple Contact Points 120 The second die 121 pads 122 First Multiple Contacts 123 Solder bump 124 Second set of multiple contacts 130 Molding Compound 140 Bridge Dies 141 First Multiple Interconnection Sections 142 Second set of interconnections 148 First underfill 150 Second underfill 160 Package Substrates 162 Contact Pads 165 Cavity 166 Adhesive 170 connectors 300, 400 multi-die packages 301, 301' Carrier 302, 302' Temporary support membrane 310 The first die 311 pad 312 First Multiple Contacts 313 Solder Bump 314 Second set of multiple contacts 320 The second die 321 pad 322 First Multiple Contacts 323 Solder Bump 324 Second set of multiple contacts 330 Molding Compound 340 Bridge Die 341 First Multiple Interconnection Sections 342 Second Multiple Interconnection Sections 345 Photoresist 348 First underfill 350 Second underfill 360 Package Substrate 362 pads 365 Cavity 370 External Connectors 401 Carrier 402 Temporary support membrane 410 The first die 412 First Multiple Contacts 414 Second set of multiple contacts 420 Second Die 422 First Multiple Contacts 424 Second set of multiple contacts 430 Molding Compound 440 Bridge Die 441 First Multiple Interconnection Sections 442 Second set of interconnections 460 Package Substrates 462 pads 465 Cavity 466 Adhesive 470 BGA 500 Integrated Devices 501 Package 525 VDD BGA pins 527 GND BGA pin 580 PMIC 590 PCB 591 Power supply (VDD) line 592 Ground (GND) wire 600 mobile devices 601 Processor 622 System-on-a-Chip Devices 626 Display Controller 628 displays 632 memory 634 Coder / Decoder (Codec) 636 speakers 638 Microphone 640 Wireless Circuits 644 Power supply 702 Mobile phone devices 704 Laptop Computer Devices 706 Stationary terminal devices 800 ways

Claims

1. A device equipped with a multi-die interconnect, wherein the multi-die interconnect is A bridge die having a first plurality of interconnection parts and a second plurality of interconnection parts, A first die having a first plurality of contacts and a second plurality of contacts, wherein the second plurality of contacts of the first die are coupled to the first plurality of interconnections of the bridge die, and both of the second plurality of contacts of the first die have a height smaller than the first plurality of contacts of the first die, A second die having a first plurality of contacts and a second plurality of contacts, wherein the second plurality of contacts of the second die are coupled to the second plurality of interconnections of the bridge die, and both of the second plurality of contacts of the second die have a height smaller than the first plurality of contacts of the second die, The first plurality of interconnections and the second plurality of interconnections of the bridge die, the second plurality of contacts of the first die, and the first underfill in which the second plurality of contacts of the second die are embedded, A second underfill in which the first plurality of contacts of the first die and the first plurality of contacts of the second die are embedded, Equipped with, The apparatus comprising the first die and the second die, which are embedded in a molding compound.

2. A method for manufacturing a device having a multi-die interconnection as described in Claim 1, The steps of providing a bridge die having a first plurality of interconnection parts and a second plurality of interconnection parts, A step of coupling a first die having a first plurality of contacts and a second plurality of contacts to a first plurality of interconnectors of a bridge die using the second plurality of contacts of the first die, wherein both the second plurality of contacts and the first plurality of interconnectors of the first die have a height smaller than the first plurality of contacts of the first die. A step of coupling a second die having a first plurality of contacts and a second plurality of contacts to a second plurality of interconnectors of a bridge die using the second plurality of contacts of the second die, wherein both the second plurality of contacts and the second plurality of interconnectors of the second die have a height smaller than the first plurality of contacts of the second die. The steps include embedding the first plurality of interconnections and the second plurality of interconnections of the bridge die into the first underfill, The steps include embedding the first plurality of contacts of the first die and the first plurality of contacts of the second die into the second underfill, The steps include embedding the first die and the second die into a molding compound, A method that includes this.

3. The method according to claim 2, wherein the first plurality of interconnections and the second plurality of interconnections of the bridge die have a pitch smaller than the first plurality of contacts of the first die and the first plurality of contacts of the second die.

4. The method according to claim 3, wherein the first plurality of interconnections and the second plurality of interconnections of the bridge die are configured as die bumps having a pitch in the range of 40 μm to 55 μm.

5. The method according to claim 4, wherein the second plurality of contacts of the first die are pads, and the second plurality of contacts of the second die are pads.

6. The steps include providing a package substrate having a cavity and multiple pads, The steps include embedding the bridge die at least partially into the cavity, The method according to claim 2, further comprising the step of coupling the plurality of pads to the first plurality of contacts of the first die and the first plurality of contacts of the second die.

7. The method according to claim 6, further comprising the step of forming a plurality of connectors on the opposite side of the plurality of pads of the package substrate.

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