Immersion cooling platform with localized cooling and fluid quality detection

Abstract

A liquid immersion cooling system and a method of operating the system are described. The system can include a management system including a processor and memory; a tank configured to hold a thermally conductive dielectric fluid; a computer component configured to be at least partially immersed in the dielectric fluid; and a fluid circulation system having a pump and valve system. In one exemplary embodiment, the management system is configured to instruct the pump and valve system to draw the dielectric fluid from the tank, pass the dielectric fluid through a heat exchanger, and return the dielectric fluid to the tank.

Description

Technical Field

[0001] Cross - Reference to Related Applications This application claims priority to U.S. Provisional Application No. 63 / 346,061, filed May 26, 2022, the entire disclosure of which is incorporated herein by reference.

[0002] This application is related to PCT Publication WO200 / 102090, filed Nov. 11, 2019, titled "Liquid Immersion Cooling Platform", owned by TMGCore, LLC, which is incorporated herein by reference.

[0003] Field of Disclosure The present disclosure relates to a liquid immersion cooling system adapted for a home computing device, for example, a liquid immersion cooling system including a control system for optimizing the temperature of the system.

Background Art

[0004] Conventional computing and / or server systems utilize air to cool various components of these systems. Conventional liquid - cooled or water - cooled computers utilize a flowing liquid to draw heat away from computer components, but avoid direct contact between the computer components and the liquid itself. The development of non - conductive and / or dielectric fluids enables the use of immersion cooling, where computer components and other electronic devices can be submerged in a dielectric or non - conductive liquid to directly draw heat from the components to the liquid. Immersion cooling can be used to reduce the total energy required to cool computer components and can also reduce the amount of space and equipment required for adequate cooling.

Summary of the Invention

[0005] Liquid immersion cooling systems are being implemented for a variety of computing needs. Therefore, it is beneficial to describe immersion cooling systems that can be easily adapted for localized cooling and on-demand filtration of dielectric fluids.

[0006] Advantageously, this application relates to an exemplary immersion cooling system and a method for operating the system. In one exemplary embodiment, the system includes a management system including a processor and memory; a tank capable of holding a thermally conductive dielectric fluid; a computer component that can be at least partially submerged in the dielectric fluid; and a fluid circulation system including a pump and valve system. In this example, the management system can instruct the pump and valve system to draw the dielectric fluid from the tank, pass the dielectric fluid through a heat exchanger, and return the dielectric fluid to the tank.

[0007] In one example, the system may include sensors, and the management system can receive sensor data from the sensors and instruct the pump and valve systems based on the data. In one example, the sensor data is the fluid level in the tank. In one example, the management system can add dielectric fluid to the tank when the sensor data falls below a threshold amount. In one example, the system includes a chassis, and the computer components are located within the chassis. In one example, the system includes RFID tags on the chassis or computer components. In one example, the tank includes an RFID scanner configured to transmit or receive radio frequency waves and detect the RFID tags. In one example, the management system is configured to determine the inventory of multiple computer components in the tank based on the data detected by the RFID scanner.

[0008] In one example, the chassis further includes a fan or pump for circulating a dielectric fluid within the chassis. In one example, sensor data includes the tank temperature of the dielectric fluid in the tank, the chassis temperature of the dielectric fluid in the chassis, and the computer component temperature of the computer components. In one example, the management system can instruct the pump and valve systems to circulate the dielectric fluid based on the tank temperature, chassis temperature, and computer component temperature. In one example, the fluid circulation system is configured to circulate the dielectric fluid in at least one of the following circuits: a first circuit that can draw the dielectric fluid out of the tank and return it to the tank; a second circuit that can draw the dielectric fluid out of the chassis and return it to the tank; and a third circuit that can draw the dielectric fluid from the vicinity of the computer components and return it to the tank.

[0009] In one example, the fluid circulation system is configured to circulate dielectric fluid in a first, second, and third circuit when the tank temperature exceeds a first threshold. In another example, the fluid circulation system is configured to circulate dielectric fluid in a second circuit when the chassis temperature exceeds a second threshold. In yet another example, the fluid circulation system is configured to circulate dielectric fluid in a third circuit when the computer component temperature exceeds a third threshold.

[0010] In one example, the system has an overflow pan that extends below the tank. In one example, the overflow pan can collect dielectric fluid overflowing from the tank. In one example, the system includes a fluid sensor (or label sensor) within the overflow pan. In one example, the control sensor is configured to shut down the system when the fluid sensor detects an increase in the dielectric fluid level in the overflow tank below a threshold level.

[0011] In one example, the fluid circulation system further includes a plurality of filters, and the valve system is configured to connect or disconnect each filter to a pump. In one example, the plurality of filters include a coarse filter, a particle filter, or an adsorption filter. In one example, the system has a sensor system that includes a conductivity sensor, a resistivity sensor, a dielectric sensor, a relative humidity sensor, or a pressure transducer. In one example, the management system is configured to connect or disconnect at least one of the plurality of filters based on sensor data received from the sensor system. In one example, the management system can determine a pressure difference for at least one of the plurality of filters based on sensor data received from the sensor system. In one example, the management system can determine, based on the pressure difference, that at least one of the plurality of filters is not functioning properly.

[0012] This summary is provided to introduce a selection of concepts in a simplified form, which will be further explained in the detailed description below. This summary is not intended to identify the main or essential features of the subject matter described in the claims, nor is it intended to be used as an aid in determining the scope of the subject matter described in the claims. [Brief explanation of the drawing]

[0013] To illustrate how the above and other advantages and features can be obtained, a more specific description of the subject matter briefly described above will be made by reference to specific embodiments shown in the accompanying drawings. It is understood that these drawings only show typical embodiments and are therefore not intended to limit the scope, and the embodiments will be described and explained with additional specificity and detail by using the accompanying drawings.

[0014] [Figure 1] This disclosure shows an exemplary embodiment of a liquid immersion cooling system.

[0015] [Figure 2] Another liquid immersion cooling system according to an exemplary embodiment of the present disclosure is shown.

[0016] [Figure 3] Another liquid immersion cooling system according to an exemplary embodiment of the present disclosure is shown.

[0017] [Figure 4] An exemplary computer component according to an exemplary embodiment of the present disclosure is shown.

[0018] [Figure 5] An exemplary heat transfer system according to an exemplary embodiment is shown.

[0019] [Figure 6] Another liquid immersion cooling system according to an exemplary embodiment of the present disclosure is shown.

[0020] Throughout the drawings, unless otherwise specified, the same reference numbers and characters are used to indicate similar features, elements, components, or parts of the illustrated embodiments. Further, the present disclosure is described herein in detail with reference to the figures, which are made in connection with exemplary embodiments and are not limited by the specific embodiments shown in the figures and the claims. [[ID=3I]]

Mode for Carrying Out the Invention

[0021] Here, to illustrate the various features of the present invention, exemplary embodiments of the present invention will be described. The embodiments described herein are not intended to limit the scope of the present invention, but rather are intended to provide examples of components, uses, and operations of the present invention.

[0022] Immersion Cooling System

[0023] In one exemplary embodiment, the immersion cooling system or container can include a bath area, a sample area, a weir (e.g., between the bath area and the sample area), a computing device, an optional robot, an optional pressure control system, and a management system. In one example, the container can be a pressure control tank maintained at atmospheric pressure (or within a range thereof) that can be cooled using a heat exchanger. In another example, the container is not pressure controlled. The computing device can be immersed in the dielectric fluid within the bath area of the container. The computing device can be connected to a network and can perform various processing and computing tasks while immersed in the dielectric fluid (or "fluid"). The container can include a lid for accessing the bath area, the computing device, and the sample area.

[0024] In one example, the heat exchanger can be a fluid-to-fluid heat exchanger. For example, the heat exchanger can receive warm dielectric fluid from the container and, at the same time, receive a cold working medium. The heat exchanger can transfer heat from the dielectric fluid to the working medium. In one example, the working medium can be transferred to a cooling device (which can be on-site or remote). In another example, the heat exchanger can be a cooling device, such as a fanless or fan-equipped heatsink, a refrigerator, a chiller, etc.. In this example, since the heat exchanger can cool the dielectric fluid without the need to transfer the working medium to another facility, there may be no need to cool the working medium. In one example, the heat exchanger can be disposed within the tank. In another example, the heat exchanger can be disposed outside the tank.

[0025] In one example, the robot can lift a computing device from the bus area of ​​the container when the lid is open. The robot can then place the lifted computing device into a magazine or vehicle provided for storing the computing device. The robot can also lift the computing device from the magazine (or vehicle) and place it in the location where the computing device was lifted from the bus area. The robot can be mounted on the container, the vehicle, or elsewhere. In this exemplary embodiment, the container may be a two-phase cooling system. In other exemplary embodiments, the container may be a single-phase cooling system, which may or may not have one or more of the components described above.

[0026] In one exemplary embodiment, the pump can circulate fluid within a container. For example, the pump can draw dielectric fluid from a sump area and transfer the fluid to a bath area. The fluid can then flow over a weir and return to the sump area. The pump can circulate the fluid through, for example, a heat exchanger, a filter, various pipes and valves before transferring it to the bath area. The pump can circulate the fluid upon receiving instructions from a management system. In one example, the pump can draw fluid from a sump area and transfer it to a bath area. In another example, the pump can draw fluid from a bath area and transfer it to a sump area.

[0027] In one example, the management system may receive data generated by sensors included in the immersion cooling system. In another example, the management system may provide an alarm and / or take another appropriate action, such as shutting down the container based on sensor readings. For example, the management system may adjust or control heating elements, fluid flow or temperature, pressure in the tank, fluid level, fluid purity and / or any number of other system parameters. Such adjustments are often based on one or more sensing parameters of the immersion cooling system (e.g., detected by sensors). Sensing parameters may include, for example, temperature (inside or outside the container), pressure, fluid level (in the bath area or sump area), or power consumption of the system. In one example, the management system may instruct the tank's pump and / or valve system to allow dielectric fluid to be added to the tank when the fluid level falls below a threshold level. The dielectric fluid may be from an external tank or reservoir.

[0028] In one exemplary embodiment, the immersion cooling system may be a single-phase immersion cooling system. In this example, the dielectric fluid may remain in liquid form throughout the operation of the immersion cooling system. This may differ from a two-phase system in which the dielectric fluid may evaporate and condense while cooling, for example, computer components.

[0029] In one example, the immersion cooling system may include a tank that holds a certain amount of dielectric fluid. The tank may also be configured to hold computer components. A pump can draw the dielectric fluid from the sump area and transfer it to the tank. In this exemplary embodiment, the pump can allow the fluid to flow into the sump area across a weir. In one exemplary embodiment, the immersion cooling system may include a bath area without a sump area. A pump can draw the fluid from the bath area and transfer it to, for example, a heat exchanger, a filter, and / or other components. The fluid can then be returned to the bath area after losing heat, for example, in the heat exchanger, or after being cleaned by the filter. In this exemplary embodiment, it may not be necessary for the fluid to flow into the sump area across a weir, but in other embodiments, the immersion cooling system may include a weir.

[0030] Figure 1 shows an immersion cooling system 100 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 100 may include a container 105 and a vehicle 130. The container 105 may have a tank 110 including a bath area 111, a sump area 112, a weir 140, a fluid 113, a computer component 114, a pump 115, a filter 118, a door 116, a management system 117, and a heat exchanger 119. The computer component 114 can be immersed in the fluid 113. The vehicle 130 may include a robot 131. The robot 131 can lift the computer component 114 when the door 116 is open and place the computer component 114 in the vehicle 130. The fluid 113 can flow over the weir 140 and accumulate in the sump area 112. In one example, the pump 115 can draw fluid 113 from the sump area 112, pass it through the filter 118 and heat exchanger 119, and then transfer it to the bus area 111. Those skilled in the art will recognize that embodiments may include other components or arrangements of components within the fluid transfer and circulation system, such as valves, pipes, etc., which may not be shown in the exemplary embodiment of Figure 1.

[0031] Figure 2 shows an immersion cooling system 200 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 200 may include a tank 210 containing a bath area 211, fluid 213, computer components 214, a pump 215, a heat exchanger 219, a door 216, and a management system 217. The computer components 214 may be immersed in the fluid 213. In this exemplary embodiment, the tank 210 may not be pressure-controlled, but in some other exemplary embodiments, the tank may be pressure-controlled. In this exemplary embodiment, the immersion cooling system may be a single-phase system, but in some other exemplary embodiments, the immersion cooling system may be a two-phase system.

[0032] In this exemplary embodiment, the pump 215 may receive instructions from the management system 217 to draw fluid 213 from the bus area 211 and send it to a heat exchanger, for example, to maintain the temperature of the fluid 213 below a threshold temperature or to cool computer components 214. In response, the pump 215 may draw the fluid 213 from the bus area 211 and pass the fluid 213 through the heat exchanger 219. The fluid 213 can then be transferred back to the bus area 211. Those skilled in the art will recognize that other embodiments may include additional or fewer components for drawing the fluid 213 from the bus area 211, and these components may have different arrangements in different embodiments, for example, the heat exchanger may be placed in front of the pump 215.

[0033] In one exemplary embodiment, the immersion cooling system 200 may include a fluid level sensor 251 and an external reservoir 250. In this exemplary embodiment, the fluid level sensor can detect the fluid level in the tank 210 and transmit the data to a management system 217. When the fluid level falls below a threshold level, the management system 217 can instruct a pump 215 to draw fluid from the external reservoir 250. In one example, when the fluid level exceeds a threshold level, the management system 217 can instruct a pump 215 to return the fluid to the external reservoir 250. In one example, the chassis may include a fluid level sensor, and the management system can instruct a pump to draw fluid from (or return) fluid to the external reservoir based on data relayed by a sensor located within the chassis.

[0034] Localized heat dissipation

[0035] In one exemplary embodiment, in addition to or instead of circulating fluid within the bus area, various devices may be provided for drawing fluid from the vicinity of one or more computer components (such as servers, chassis, and CPUs) and transferring the fluid to a heat exchanger. In one example, each computer component may be located within a chassis, which may include an input for receiving dielectric fluid and an output for transferring the fluid outside the chassis. In this example, the chassis output may be fluid-coupled (e.g., through hoses or pipes) to a heat exchanger or heat sink, and optionally, there may be a pump for drawing fluid from the chassis. In this example, the computer components may heat fluid in their vicinity or within the chassis, and the pump can draw the fluid. Because the fluid is drawn from an area close to the heat-generating component, the pump can draw the warmest fluid and effectively cool the fluid.

[0036] In another example, each computer component (e.g., a CPU) may include a component for drawing fluid (e.g., an input valve, a heat sink, or a metal plate with liquid inlet and outlet). The component can be coupled to a heat exchanger using a pump and various pipes or hoses. Thus, the pump can draw warm fluid from the vicinity of the computer component.

[0037] In yet another example, heat from computer components can be transferred using heat pipes. In one example, the heat receiving component can be placed on or near the computer component (for example, the heat receiving component can be thermodynamically coupled to the computer component). The heat receiving component can also be coupled to various heat pipes that can transfer heat from the computer component to a heat sink or radiator located separately from the computer component. In this example, the heat from the computer component can be dissipated to the location of the heat sink or radiator.

[0038] Figure 3 shows an immersion cooling system 300 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 300 may include a tank 310, a fluid 213, a door 316, a management system 217, a pump 215, and a heat exchanger 219. The tank 310 may further include a chassis 323 for housing computer components 314. The chassis 323 may include an input 321 and an output 322. The fluid 213 may enter the chassis 323, for example, through the input 321, and reside in the chassis through the output 322. In this example, the output is connected to the pump 215, for example, using a pipe. The pump 215 may draw the fluid from the tank 310 and transfer it to the heat exchanger 219 to cool the fluid 213. The fluid can then be returned to the tank 310. In this exemplary embodiment, the pump 215 may draw the fluid 213 from the vicinity of the computer components 314, thereby enabling the cooling of the warmest fluid 213 in the tank 310.

[0039] In one exemplary embodiment, the chassis may include one or more secondary pumps, fans, or any other means that can improve the flow (e.g., an air stone bubbler with or without a pump) for transferring fluid in and out of the chassis. In another example, the pump or fan may be installed on or near the computer components. For example, in the immersion cooling system 300 of Figure 3, the chassis 323 may include a secondary pump 324 that facilitates the movement and / or movement of fluid 213 within the chassis 323. The pump 324 can draw fluid from the input 321 and / or push fluid within the chassis 323 so that the fluid 213 moves from outside the chassis 323 to the output 322. In this example, the pump 324 can quickly transfer heat generated by the computer components 314 to the outside of the chassis 323.

[0040] In one exemplary embodiment, the immersion cooling system 300 may include an overflow pan 360. If there is an overflow of fluid 213, the fluid can be directed to the overflow pan 360. The overflow pan 360 can prevent the fluid 213 from flowing onto the floor. In one example, the overflow pan 360 may include a fluid sensor 361. The fluid sensor 361 can detect the presence of fluid 213 in the overflow pan 360. The fluid sensor 361 can transmit data to the management system 217. In one example, the fluid sensor 361 may be a continuous float level sensor, a miniature continuous float level sensor, a miniature side-mounted 90-degree float switch, a high-level float switch, a low-level float switch, a combination of high-level and low-level float switches, an oil-water interface, an adjustable float switch, a side-mounted, multi-point float switch, a visual level indicator, an underwater suspended float switch, an optical liquid level sensor, an oil level sensor, an oil pressure sensor, a conductivity sensor, or a point level sensor.

[0041] If the fluid sensor 361 detects fluid in the overflow pan 360, the management system 217 can send a message to the central server indicating a potential leak in the immersion cooling system 300. For example, if the fluid sensor 361 detects fluid in the overflow pan 360 and the fluid level exceeds a threshold, the management system 217 can send a message indicating that the overflow pan 360 should be emptied or replaced. If the fluid level exceeds a threshold level or increases above the threshold level over a given period of time, the management system can detect an active leak. In this case, for example, the management system can shut down the operation of the immersion cooling system 300. For example, if the management system 217 detects an active leak, the management system 217 can instruct the pump 215 to return the fluid 213 to the reservoir 250.

[0042] Figure 4 shows an exemplary computer component 414 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, in addition to or instead of circulating the fluid in a tank and / or in addition to or instead of circulating the fluid in a chassis, the fluid can be circulated within a component attached to the computer component 414. In this exemplary embodiment, the component may be a heatsink 430 that includes an input 421 and an output 422. The fluid 213 can enter the heatsink 430 from the input 421 and exit the heatsink 430 through the output 422. The fluid 213 can be drawn from the output 422, for example, by a pump and various pipes and supplied to a heat exchanger for cooling. In one example, the component attached to the computer component 414 may be an input valve or a housing having an input and an output. In one exemplary embodiment, a fan 415 can be placed on the heatsink 430 to provide further cooling of the computer component 414. In one example, a heat spreader 416 (or a steam chamber, cold plate, heat pipe, or heat sink) can be provided to transfer heat from the computer component 414 to the fluid 213.

[0043] In one example, a fluid can be drawn from the vicinity of the computer components and cooled in a heat exchanger within a tank or chassis. For example, a tank may include a primary heat exchanger inside the tank (or the primary heat exchanger may be outside the tank, while the secondary heat exchanger is inside the tank). A pump can draw fluid from the vicinity of the computer components and send it to a heat exchanger in the tank. The heat exchanger in the tank may be located, for example, near the input point within the tank for the cooled dielectric fluid.

[0044] In one exemplary embodiment, the immersion cooling system can circulate fluid in various operating modes. For example, in one mode of operation, the pump can circulate fluid within a tank. In another optional mode, the pump can circulate fluid within one or more chassis. In this mode, the fluid can circulate within a selected number of chassis, while other chassis may be excluded from this fluid circulation. Furthermore, in yet another optional mode, the pump can circulate fluid within one or more components attached to one or more computer components. In this mode, the fluid can circulate within a selected number of computer components (or components attached to computer components), while other computer components may be excluded from this fluid circulation. In this example, the management system can, for example, switch valves between a first circuit, a second circuit, and / or a third circuit to enable the immersion cooling system to operate in one or more of the aforementioned operating modes, instructing the valve system and / or pumps so that each circuit enables fluid circulation within a specific chassis and / or computer component, and / or multiple chassis and / or computer components. In this example, the management system can circulate fluid within a selected group of individual chassis and / or computer components. In another example, the management system may direct the circulation of fluids within all or more chassis and / or computer components. In one example, the management system may circulate fluids in a combination of a first circuit, a second circuit, and a third circuit.

[0045] In one example, the management system may receive sensor data indicating that one or more of the aforementioned operating modes must be activated. For example, the sensor data may include the temperature of the dielectric fluid in the tank, the temperature of one or more chassis, and the temperature of one or more computer components. If the management system detects a temperature or temperature rise exceeding an acceptable threshold amount, it may instruct the pumps and valves to activate one or more circuits. For example, if the temperature of a chassis rises above an acceptable temperature or the ambient temperature of the chassis, the management system may activate fluid circulation in that chassis to maintain the chassis temperature at an acceptable level. In another example, if the temperature of a computer component rises above an acceptable temperature or the ambient temperature of the computer component, the management system may activate fluid circulation in that computer component to maintain the computer component temperature at an acceptable level. In one example, if the temperature of the fluid in the tank rises above a first threshold amount, the management system may activate fluid circulation throughout the tank. If the temperature of the fluid in the tank still rises above a second threshold, the management system may activate fluid circulation in one or more chassis and / or one or more computer components in addition to the fluid circulation in the tank.

[0046] In one exemplary embodiment, the management system may activate secondary pumps located within the chassis or attached to computer components based on the temperature of the chassis or computer components. For example, if the temperature of the chassis or computer components exceeds a threshold, the management system may activate one or more secondary pumps to facilitate rapid heat transfer from the chassis or computer components.

[0047] Figure 5 shows an exemplary heat transfer system 500 according to one exemplary embodiment. In this exemplary embodiment, the heat transfer system 500 may include a heat receiving component 510 that can be thermodynamically coupled to a computer component 514. The heat receiving component 510 may be a thermal interface material, a heat spreader, a cold plate with or without minichannels or microchannels, a steam chamber, or a combination of one or more of the above.

[0048] The heat transfer system 500 may also include a heat pipe 515 and a heat sink 520 (or radiator 520). In this example, the heat receiving component 510 can receive heat from the computer component 514 and transfer that heat to the heat sink 520 using the heat pipe 515. The heat sink 520 may be located within the chassis housing the computer component 514. The heat sink 520 may also be located within the tank, for example, near the fluid inlet or near the fluid outlet. The heat transfer system 500 can be used to dissipate the heat generated by the computer component 514 to another location within the tank.

[0049] In one exemplary embodiment, the liquid immersion cooling system may include one or more of the local heat dissipation systems described above. For example, the chassis may include a pump, a heat transfer system, and a heat sink for dissipating heat.

[0050] RFID tags

[0051] In one exemplary embodiment, a management system and / or secondary system can track components installed in or operating within an immersion cooling system. In this exemplary embodiment, the management system and / or secondary system can scan components using, for example, a robot or other scanner. In one exemplary embodiment, each traceable component, for example, a chassis or a computer component, may have an RFID tag. For example, the management system and / or secondary system can transmit a radio frequency within the tank to determine which RFID tags are present in the tank. In another example, each traceable component may include a visual barcode, for example, a QR code®, and the management system and / or secondary system can scan the visual barcode. In one example, the RFID tag may be placed on a computer component. In another example, the RFID tag may be placed on a chassis.

[0052] In one exemplary embodiment, the tank may include a robot that can move inside or outside the tank and scan each traceable component within the tank. For example, the robot may be a gantry robot or robotic arm on a vehicle that can move near each traceable component and scan the component, for example, by transmitting or receiving RF signals. The robot can then transmit the data to a management system. In another example, the tank may include one or more scanners inside the tank, for example, each scanner may be located within distance of another scanner. Each scanner may be configured to detect traceable components within its scan range.

[0053] In one exemplary embodiment, the management system can receive data regarding the temperature of the chassis and / or computer components. If the chassis or computer components operate above a threshold temperature for a longer period than a threshold, the management system can infer that the chassis and / or computer components require maintenance and / or replacement. In one example, the management system can infer that the chassis and / or computer components require maintenance if they operate below a threshold temperature, for example, significantly below the operating temperature of the chassis and / or computer components.

[0054] If the management system infers that the chassis and / or computer components require maintenance, it can, for example, send a message to a central server to dispatch a service robot. The management system can also send a message if the chassis or computer components require maintenance, for example, monthly or annually, even if they are not broken. In this exemplary embodiment, the service robot can approach the tank and communicate with the management system, for example, directly or via a central server. The management system can provide data regarding the chassis and / or computer components requiring maintenance. The data may include identification information (e.g., RFID tags) of the chassis or computer components and / or their location within the tank. In this exemplary embodiment, the service robot can identify a broken component, for example, by using the identification information or location information or by scanning the RFID tags of the components. The service robot can further be configured to lift the components out of the tank.

[0055] Fluid filter

[0056] In one exemplary embodiment, the immersion cooling system may include one or more filters. The immersion cooling system may also include one or more sensors (e.g., a sensor system including multiple sensors) that can detect whether filtration of the fluid is desired. In one exemplary embodiment, each filter may be connected to or disconnected from the fluid line on demand by a management system. For example, each filter may be connected or disconnected based on sensor readings. On-demand filtration can offer several advantages. For example, if filters can be connected on demand, the pump does not need to always pass the dielectric fluid through all filters. This selective connection of filters can save electricity because lower pressure is required to circulate the fluid in the fluid circulation system. As another example, each filter can be isolated so that the pressure difference across each filter, the temperature of the filter, and / or the conductivity of the filter can be detected over time. This information can indicate whether a filter has lost its effectiveness and therefore requires replacement or maintenance.

[0057] Figure 6 shows an immersion cooling system 600 according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the immersion cooling system 600 may include a sensor system 671, a plurality of filters 672-674, and a plurality of valves 675. During the operation of the system 600, the sensor system 671 may detect conditions that may require filtration of the fluid. For example, the sensor system 671 may detect particulate matter, whiskers, plasticizers, or moisture in the fluid 213. The sensor system 671 may transmit this information to a management system 217. In this example, the management system 217 may decide to activate or connect one or more of the filters 672-674 to improve the conditions detected by the sensor system 671. Thus, the management system 217 may instruct one or more of the valves 675 to open or close in order to direct the fluid 213 in the appropriate direction. In one example, the filters may include a coarse filter, a particulate filter, an adsorption filter, and / or a water separator. In one example, the sensor system may include a conductivity sensor, a resistivity sensor, a dielectric constant sensor, a relative humidity sensor, and / or a pressure transducer.

[0058] In one example, when an adsorption filter (e.g., a carbon or aluminum filter) is operating suboptimally, the conductivity of the filter can be reduced. In this example, a conductivity sensor can be used to determine when the filter requires maintenance and / or replacement. In one exemplary embodiment, the sensor system can be installed inside the tank. The sensor system may include, for example, a Raman spectrometer, a humidity sensor, and / or a conductivity sensor. The sensor system in this example can trigger filtration in the tank.

[0059] In the exemplary embodiment shown in Figure 6, the management system 217 can isolate each of the filters 672-674. In one example, the management system 217 can record the pressure difference and / or temperature of each filter over time. For example, once each filter is installed, the management system can record the pressure difference and / or temperature of the filters while they are operating. If the pressure difference and / or temperature of a filter changes by more than a threshold amount, this can indicate that the filter is not functioning as intended, for example, that the filter is not working properly. In this exemplary embodiment, the management system can send a message to the central server indicating that the filter must be replaced and / or requires maintenance. In a particular embodiment, if a particular filter is not working properly, the management system can shut down the system to prevent damage to the computer components 214. In one exemplary embodiment, if the pressure difference and / or temperature of a filter changes by less than another threshold amount, this can indicate that the filter is not functioning as intended.

[0060] In one exemplary embodiment, the immersion cooling system may include one or more filter circuits. Each filter circuit may draw fluid from a tank and circulate the fluid through one or more filters and / or other components, such as a pump, heat exchanger, sensors, etc. In the exemplary embodiment of Figure 6, there are two exemplary filter circuits. One exemplary filter circuit may include filters 672-674. This filter circuit may also include a pump 215, a heat exchanger 219, and various sensors such as temperature and pressure sensors. A second filter circuit may include filter 681. In this exemplary embodiment, the second filter circuit may also include a valve 682, various pipes, a pump, and sensors (not shown in Figure 6). The control system 217 may operate each filter circuit individually and / or in combination with other filters. For example, the control system 217 may instruct the pump of the second circuit to draw fluid from the tank, for example, if one of the filters 672-674 of the first circuit fails to function properly or if another condition is met. By using multiple filter circuits, a liquid immersion cooling system can provide redundancy. For example, even if a filter fails, the system can still operate while the faulty filter is being replaced, as the filters are located in separate circuits.

[0061] In the above specification, various embodiments have been described with reference to the accompanying drawings. However, it is clear that various modifications and changes can be made and additional embodiments can be implemented without departing from the broader scope of the invention as described in the following claims. Therefore, the specification and drawings should be considered illustrative rather than restrictive.

Claims

1. A management system having a processor and memory; A tank configured to hold a thermally conductive dielectric fluid; Computer components configured to be at least partially immersed in the dielectric fluid; A fluid circulation system having a pump and valve system; An overflow pan extending below the tank; and Fluid sensor in the overflow pan; It has, The management system is configured to instruct the pump and valve system to draw the dielectric fluid from the tank, pass the dielectric fluid through a heat exchanger, and return the dielectric fluid to the tank. system.

2. The system further includes sensors, and the management system is configured to receive sensor data from the sensors and to instruct the pump and valve systems based on the sensor data. The system according to claim 1.

3. The sensor data is the fluid level in the tank. The system according to claim 2.

4. The management system is configured to add the dielectric fluid to the tank when the sensor data falls below a threshold amount. The system according to claim 3.

5. The system further comprises a chassis, and the computer components are located within the chassis. The system according to claim 2.

6. The chassis or computer component further has an RFID tag, The system according to claim 5.

7. The tank includes an RFID scanner configured to transmit or receive radio frequency waves and detect the RFID tag. The system according to claim 6.

8. The management system is configured to determine the inventory of multiple computer components in the tank based on the data detected by the RFID scanner. The system according to claim 7.

9. The chassis further comprises a heat transfer system having a heat receiving component, heat pipes, and a heat sink, wherein the heat receiving component is thermodynamically coupled to the computer component and configured to transfer heat from the computer component to the heat sink using the heat pipes. The system according to claim 5.

10. The chassis further includes a fan or pump for circulating the dielectric fluid within the chassis. The system according to claim 5.

11. The sensor data includes the tank temperature of the dielectric fluid in the tank, the chassis temperature of the dielectric fluid in the chassis, and the computer component temperature of the computer component. The system according to claim 5.

12. The management system is configured to instruct the pump and valve systems to circulate the dielectric fluid based on the tank temperature, the chassis temperature, and the computer component temperature. The system according to claim 11.

13. The aforementioned fluid circulation system has the following circuit: A first circuit through which the dielectric fluid is drawn from the tank and returned to the tank; A second circuit through which the dielectric fluid is drawn from the chassis and returned to the tank; and A third circuit through which the dielectric fluid is drawn from the vicinity of the computer component and returned to the tank; At least one of these is configured to circulate the dielectric fluid, The system according to claim 11.

14. The fluid circulation system is configured to circulate the dielectric fluid within the first circuit, the second circuit, and the third circuit when the tank temperature exceeds a first threshold. The system according to claim 13.

15. The fluid circulation system is configured to circulate the dielectric fluid within the second circuit when the chassis temperature exceeds a second threshold. The system according to claim 13.

16. The fluid circulation system is configured to circulate the dielectric fluid within the third circuit when the computer component temperature exceeds a third threshold. The system according to claim 13.

17. The overflow pan is configured to collect dielectric fluid overflowing from the tank. The system according to claim 1.

18. The management system is configured to shut down when the fluid sensor detects an increase in the dielectric fluid level in the overflow pan that exceeds a threshold level. The system according to claim 1.

19. The fluid circulation system further includes a plurality of filters, and the valve system is configured to connect or disconnect each of the filters to the pump. The system according to claim 1.

20. The plurality of filters include a coarse filter, a particle filter, or an adsorption filter. The system according to claim 19.

21. The sensor system further includes a conductivity sensor, a resistivity sensor, a dielectric constant sensor, a relative humidity sensor, or a pressure transducer. The system according to claim 19.

22. The management system is configured to connect or disconnect at least one of the plurality of filters based on sensor data received from the sensor system. The system according to claim 21.

23. The management system is configured to determine the pressure difference for at least one of the plurality of filters based on the sensor data received from the sensor system. The system according to claim 21.

24. The management system is configured to determine, based on the pressure difference, that at least one of the plurality of filters is not functioning properly. The system according to claim 23.

25. The management system is configured to determine the conductivity across at least one of the plurality of filters based on sensor data received from the sensor system. The system according to claim 21.

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