Electronic equipment and cooling structures

Abstract

This invention provides electronic equipment that ensures cooling performance and allows for the independent replacement of the fan. [Solution] The electronic device comprises a housing, a substrate on which a heating element is mounted and supported by the housing, a heat diffusion member having a metal plate and capable of diffusing heat from the heating element, a fan housing having an opening on one side, and a fan blade supported within the fan housing, wherein the heat diffusion member is fixed to at least one of the housing and the substrate with a first screw, the fan housing is fixed to the metal plate with a second screw, and the opening is closed by the metal plate.

Description

Technical Field

[0001] The present invention relates to an electronic device equipped with a fan. and cooling structure

Background Art

[0002] An electronic device such as a notebook PC mounts a heat generating body such as a CPU. Such an electronic device can mount a thermal module in the housing, absorb the heat of the heat generating body, and dissipate the heat to the outside. The applicant of the present application has proposed a configuration in Patent Document 1 in which the cover plate of the fan housing is also used as a vapor chamber to improve the cooling performance. Further, the applicant of the present application has proposed a configuration in Patent Document 2 in which a heat pipe fixed to the vapor chamber is connected to a heat sink fixed to the fan.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the thermal module as described above, it is rare for a vapor chamber or a heat pipe to fail. On the other hand, the fan may fail and need to be replaced. However, in the configuration of Patent Document 1, the fan is integrally fixed to the vapor chamber. In the configuration of Patent Document 2, the fan is integrally fixed to the vapor chamber via the heat sink and the heat pipe. Therefore, in these conventional configurations, it was necessary to replace the entire thermal module in order to replace the fan.

[0005] ​If a faulty fan can be easily replaced independently, it would not only reduce repair costs but also be desirable from an ESG (Environment, Social, Governance) perspective. While the configuration in Patent Document 2 allows for independent fan replacement by fixing the heat pipe and fan separately, it reduces the overall cooling performance of the module.

[0006] This invention was made in consideration of the problems of the prior art described above, and is an electronic device that can ensure cooling performance and further allows the fan to be replaced independently. and cooling structure The purpose is to provide. [Means for solving the problem]

[0007] An electronic device according to one aspect of the present invention comprises a housing, a substrate on which a heating element is mounted and supported by the housing, a heat diffusion member having a metal plate and capable of diffusing heat from the heating element, a fan housing having an opening on one side, and a fan blade supported within the fan housing, wherein the heat diffusion member is fixed to at least one of the housing and the substrate with first screws, the fan housing is fixed to the metal plate with second screws, and the opening is closed by the metal plate. [Effects of the Invention]

[0008] According to one aspect of the present invention, cooling performance can be ensured, and the fan can be replaced independently. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic plan view of an electronic device according to one embodiment, viewed from above. [Figure 2] Figure 2 is a schematic plan view showing the internal structure of the enclosure. [Figure 3] Figure 3 is a schematic perspective view of the thermal module. [Figure 4] Figure 4 is a schematic perspective view of the fan. [Figure 5]Figure 5 is a schematic side cross-sectional view of the thermal module and its surrounding enclosure. [Figure 6] Figure 6 is a side cross-sectional view showing the fan replacement operation shown in Figure 5. [Modes for carrying out the invention]

[0010] Hereinafter, preferred embodiments of the electronic device according to the present invention will be described in detail with reference to the attached drawings.

[0011] Figure 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in Figure 1, the electronic device 10 in this embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, a notebook PC electronic device 10 is used as an example, but the electronic device may be other than a notebook PC, for example, a desktop PC, a tablet PC, a smartphone, or a portable game console.

[0012] The lid 11 is a thin, flat, box-shaped enclosure. The lid 11 houses a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0013] The enclosure 12 is a thin, flat box. The keyboard device 18 and touchpad 19 face the top surface (surface 12a) of the enclosure 12. Hereinafter, the enclosure 12 and each component mounted thereon will be described using the operator's posture when operating the keyboard device 18 as the reference point, with the width direction (left and right) of the enclosure 12 being referred to as the X1 and X2 directions, the depth direction (front and back) of the enclosure 12 being referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the enclosure 12 being referred to as the Z1 and Z2 directions. The X1 and X2 directions may also be collectively referred to as the X direction, and similarly, the Y1 and Y2 directions and the Z1 and Z2 directions may be referred to as the Y direction and Z direction. These directions are defined for the convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0014] The housing 12 may have a structure in which a first cover member 20, a frame member 21, and a second cover member 22 are laminated in order from top to bottom (see also FIG. 5). In the housing 12, the cover members 20 and 22 are detachably connected to the intermediate frame member 21 using screws, a hook structure, or the like, respectively.

[0015] The first cover member 20 is a plate-like member that forms the surface 12a of the housing 12. The keyboard device 18 is fixed to the first cover member 20. The touch pad 19 may be fixed to the first cover member 20 or may be fixed to the frame member 21. The second cover member 22 is a plate-like member that forms the lower surface (bottom surface 12b) of the housing 12. The cover members 20 and 22 can be formed of, for example, a metal material, a resin material, or a fiber-reinforced resin material. The cover members 20 and 22 may be formed of, for example, press-molded products such as aluminum.

[0016] The frame member 21 is an intermediate frame that serves as the skeleton of the housing 12. The frame member 21 serves as a mounting frame for components mounted inside the housing 12. These components include mechanical components such as the hinge 14, as well as electrical components such as the thermal module 24, the substrate 25, and the battery device 26, which will be described later.

[0017] The frame member 21 has, for example, vertical walls 21A that form the four peripheral side surfaces of the housing 12 and a component support portion 21B to which the above-described components are attached (see also FIG. 2). A part of the four peripheral vertical walls 21A may be provided on the cover members 20 and 22. The component support portion 21B extends substantially in a grid-like or substantially mesh-like manner inside the vertical walls 21A. As a result, openings 21C are formed to penetrate in the Z direction at various locations of the component support portion 21B. The component support portion 21B may have, for example, a step 21D in the Z direction substantially at the center in the Y direction. As a result, the inside of the housing 12 is partitioned into a first space S1 with an enlarged height between the first cover member 20 and the frame member 21 and a second space S2 with an enlarged height between the second cover member 22 and the frame member 21 (see FIG. 5).

[0018] <000009The housing 12 is not limited to the three-layer structure described above. For example, the frame member 21 may be omitted. In this case, it is preferable to support the above-described components on the inner surface of one of the cover members 20 and 22.

[0019] The hinge 14 is installed in a concave hinge arrangement groove 12c formed at the rear edge of the housing 12, and connects the housing 12 and the lid 11. The hinge 14 has, for example, a structure in which a hinge shaft serving as a rotation axis is supported at both ends in the longitudinal direction of the hinge housing.

[0020] FIG. 2 is a plan view schematically showing the internal structure of the housing 12. FIG. 2 is a view of the internal structure of the housing 12 seen from above with the first cover member 20 removed. As shown in FIG. 2, a thermal module 24, a substrate 25, and a battery device 26 are housed inside the housing 12. Various electronic components, mechanical components, etc. are further provided inside the housing 12.

[0021] The substrate 25 is a circuit board that serves as the motherboard of the electronic device 10. The substrate 25 is disposed near the Y2 side of the housing 12 and extends in the X direction. The substrate 25 is attached to a support surface 21B1 facing the Z1 side of the component support portion 21B and is housed in the first space S1. The substrate 25 is placed on the support surface 21B1, and each part is fixed to the frame member 21 with screws 27. FIG. 2 illustrates a configuration in which the four corners of the substrate 25 are fastened to the frame member 21 with screws 27 from the Z1 side. The screws 27 may fasten the substrate 25 to the frame member 21 from the Z2 side (see FIG. 5). The screws 27 may also be provided near the center (portion 25A) of the substrate 25.

[0022] The substrate 25 mounts a CPU (Central Processing Unit) 28. In addition to the CPU 28, the substrate 25 can mount various electronic components, such as a GPU (Graphics Processing Unit), a memory, a communication module, etc. For example, the surface (Z2 side surface) facing the support surface 21B1 side of the substrate 25 becomes a mounting surface 25a for the CPU 28, etc. (see FIG. 5).

[0023] The battery device 26 is a rechargeable battery that powers the electronic device 10. The battery device 26 is positioned closer to the Y1 side of the circuit board 25 and extends in the X direction. The battery device 26 is attached to the support surface 21B2 of the component support portion 21B facing the Z2 side by screws, a hook structure, etc., and is housed in the second space S2 (see also Figure 5).

[0024] Next, we will describe an example configuration of the thermal module 24.

[0025] The CPU 28 is one of the largest heat-generating electronic components mounted within the chassis 12. The thermal module 24 absorbs and dissipates the heat generated by the CPU 28 and expels it outside the chassis 12. The circuit board 25 also mounts other heat-generating components around the CPU 28, such as the GPU, memory components, and power supply components. The thermal module 24 can also cool these other heat-generating components besides the CPU 28.

[0026] Figure 3 is a schematic perspective view of the thermal module 24. Figure 4 is a schematic perspective view of the fan 30. Figure 5 is a schematic side cross-sectional view of the housing 12 around the thermal module 24. As shown in Figures 2 to 5, the thermal module 24 may include a pair of fans 30, 30, a heat diffusion member 32 including a metal plate 31, and heat sinks 34 to 36.

[0027] The fans 30, 30 are arranged side by side in the X direction, with a portion (part 25A) of the substrate 25 between them. The left and right fans 30, 30 can be identical or similarly configured, except that they have a symmetrical structure. Therefore, in this embodiment, each fan 30 is given the same reference numeral and described together without any particular distinction. The left and right fans 30, 30 do not necessarily have a symmetrical structure. Only one fan 30 may be mounted.

[0028] In the plan view shown in Figure 2, the substrate 25 has notches 25B on the left and right sides of portion 25A. The left and right notches 25B are shaped to conform to the outer contours of the left and right fans 30. As a result, the fans 30 are inserted into the notches 25B (see also Figure 5) and are positioned adjacent to the substrate 25 in the X and Y directions.

[0029] As shown in Figures 3 to 5, the fan 30 has a fan housing 38, fan blades 39, and a motor 40. The fan 30 is configured by assembling the fan blades 39 and the motor 40 into the fan housing 38. The fan 30 can be configured as a centrifugal fan in which the fan blades 39 housed inside the fan housing 38 are rotated by the motor 40.

[0030] The fan housing 38 is a box-shaped body with an opening 38a on one side facing Z2. The fan housing 38 has a base plate 38b that forms the other side facing Z1 and a side wall material 38c that forms the outer peripheral side.

[0031] The base plate 38b forms the surface opposite to the opening surface 38a of the fan housing 38 in the axial direction of the fan blades 39 which are aligned in the Z direction. The base plate 38b is a metal plate made of, for example, stainless steel. Since the fan 30 in this embodiment does not have an intake port on the Z1 side, no opening for an intake port is formed in the base plate 38b. An opening similar to the intake port 31c described later may also be formed in the base plate 38b.

[0032] The side wall material 38c rises from the outer peripheral edge of the base plate 38b in the Z2 direction. The side wall material 38c can be made of, for example, a resin material or a metal material. The side wall material 38c has discharge ports 30a and 30b opening on the side facing the Y2 direction and on the side facing the X1 or X2 direction, respectively. In Figure 2, the discharge port 30b is formed on the X1 side of the left fan 30 and on the X2 side of the right fan 30. As a result, the discharge ports 30b, 30b of the left and right fans 30 face each other across section 25A. The fan 30 may have only one of the discharge ports 30a or 30b.

[0033] The fan blade 39 is an impeller with multiple blades arranged in the circumferential direction. The fan blade 39 rotates due to the driving force of the motor 40, drawing air into the fan housing 38 from the intake port 31c, compressing it, and discharging it from the discharge ports 30a and 30b.

[0034] As shown in Figures 2 to 5, the heat diffusion member 32 is a member that absorbs and diffuses heat from the CPU 28 and the heat-generating elements around it. A portion of the heat diffused by the heat diffusion member 32 is transferred to the heat sinks 34 to 36. The heat diffusion member 32 is provided together with the CPU 28 to cover portion 25A of the substrate 25 from the Z1 side.

[0035] The metal plate 31 is a thin, metal plate-shaped member made of a material with high thermal conductivity, such as copper or aluminum. In this embodiment, the metal plate 31 is a copper plate. As shown in Figure 3, the metal plate 31 in this embodiment has a substantially spectacle shape. The metal plate 31 has a base plate portion 31a and a pair of extension plate portions 31b. The base plate portion 31a has a substantially strip shape extending in the X direction. The extension plate portions 31b protrude in the Y1 direction from both ends in the longitudinal direction of the base plate portion 31a. The outer shape of the extension plate portions 31b corresponds to the outer shape of the fan 30. Each extension plate portion 31b has a circular hole portion 31c formed therein. In the configuration example shown in Figure 2, a part of the hole portion 31c extends into the base plate portion 31a.

[0036] The metal plate 31 also serves as a cover plate that closes the opening 38a of the fan 30 (see Figures 3 and 5). The hole 31c becomes the intake port 31c of the fan 30. In other words, the metal plate 31 closes the opening 38a of the fan 30, thereby creating an air compression space within the fan housing 38 for the fan blades 39. The intake port 31c may be formed on the base plate 38b of the fan housing 38 instead of the metal plate 31.

[0037] The heat diffusion member 32 may further have a vapor chamber 42. The vapor chamber 42 is a plate-type heat transport device. The vapor chamber 42 forms a sealed space 42a between two metal plates in which a working fluid is sealed. In this embodiment, the vapor chamber 42 forms a sealed space 42a between a metal plate 41 and a plate 44.

[0038] Plate 44 is a thin, metal plate-like member made of copper or aluminum, similar to metal plate 41. In this embodiment, plate 44 is a copper plate. Plate 44 has substantially the same external shape as the base plate portion 31a of metal plate 31. In other words, the sealed space 42a is formed between plate 44 and the base plate portion 31a (see Figure 5). The sealed space 42a becomes a flow path through which the sealed working fluid flows while undergoing phase changes. Examples of working fluids include water, alternative fluorocarbons, acetone, or butane. A wick is provided in the sealed space 42a to deliver the condensed working fluid by capillary action. The wick is formed of a porous material such as a mesh made of fine metal wires woven into a cotton-like structure or a microchannel.

[0039] The vapor chamber 42 may form a sealed space 42a using two plates 44, 44 instead of the metal plate 31. In this case, the plate 44 on the Z1 side of the vapor chamber 42 may be joined to the base plate portion 31a of the metal plate 31. When the metal plate 31 and the vapor chamber 42 are separate structures in this way, a heat pipe may be used instead of the vapor chamber 42. A heat pipe is, for example, a copper pipe that has been flattened and whose internal space is formed as a sealed space in which a working fluid is sealed.

[0040] The heatsinks 34-36 have a structure in which multiple fins made of thin metal plates are arranged at equal intervals in the X direction. Each fin stands upright in the Z direction and extends in the Y direction. Gaps are formed between adjacent fins through which air supplied from the fan 30 passes. The heatsinks 34-36 are made of a metal with high thermal conductivity, such as aluminum or copper. The heatsinks 34-36 are fixed to the Z1 side surface 31d of the metal plate 31.

[0041] As shown in Figures 2 and 3, the left and right heatsinks 34 and 35 face the Y2 side outlet 30a of the fan 30, respectively. This allows air discharged from the outlet 30a to pass through the heatsinks 34 and 35. The central heatsink 36 faces portion 25A of the substrate 25. This allows air discharged from the outlets 30b of each fan 30 to pass through the heatsink 36. The dashed arrows in Figure 2 schematically show the airflow from the outlets 30a and 30b. Heatsinks 34-36 may be omitted.

[0042] In Figures 2 and 3, reference numeral 28a denotes a heat receiving plate connected to the surface 31d of the metal plate 31. The heat receiving plate 28a is, for example, a copper plate having an outer shape identical to or slightly larger than the outer shape of the CPU 28. The heat receiving plate 28a is thermally connected to the top surface of the CPU 28. The heat receiving plate 28a absorbs the height difference in the Z direction between the CPU 28 and the metal plate 31 and improves the contact between the two. In other words, the heat receiving plate 28a improves the efficiency of heat transfer from the CPU 28 to the heat diffusion member 32. Thermal conductive grease or the like may be applied between the heat receiving plate 28a and the CPU 28. The heat receiving plate 28a may be omitted.

[0043] Reference numeral 45 in Figure 3 indicates a reinforcing member. The reinforcing member 45 is, for example, a triangular frame material surrounding the heat receiving plate 28a and is fixed to the surface 31d of the metal plate 31. The reinforcing member 45 increases the rigidity of the heat diffusion member 32 (metal plate 31) which is pressed against the CPU 28 via the heat receiving plate 28a, thereby improving the adhesion between the CPU 28 and the metal plate 31. The reinforcing member 45 may be omitted or replaced with an elastic component or the like.

[0044] As shown in Figures 2, 3, and 5, the heat diffusion member 32 is fixed to the substrate 25 and the frame member 21 with screws (first screws) 46. In other words, the thermal module 24 is fastened to the substrate 25 and the frame member 21 with screws 46. The screws 46 may be tightened, for example, from the Z2 side to the Z1 side. The screws 46 fasten, for example, tongue-shaped plate pieces protruding from various points on the outer edge of the metal plate 31 to the substrate 25 and the frame member 21. Furthermore, the screws 46 may be provided in a position that penetrates the three corners of the reinforcing member 45 in the central part of the vapor chamber 42. The heat diffusion member 32 may be fixed only to the substrate 25 or only to the frame member 21. For example, if the housing 12 does not have a frame member 21, the heat diffusion member 32 may be fixed to the cover members 20 and 22 with screws 46. Even if the housing 12 has a frame member 21, the heat diffusion member 32 may be fixed to the cover members 20 and 22, or it may be fixed to the frame member 21 or the substrate 25 together with the cover members 20 and 22.

[0045] The screws 46 are fastened, for example, to screw holes in boss portions 46a provided on the mounting surface 25a of the substrate 25 or on the Z2 side surface of the heat diffusion member 32 (see Figure 5). In this way, the thermal module 24 (heat diffusion member 32) is detachably fixed to the frame member 21, either directly or indirectly via the substrate 25.

[0046] Each fan 30 is fixed to the heat diffusion member 32 with screws (second screws) 47. The screws 47 are tightened, for example, from the Z1 side to the Z2 side. The screws 47 may consist of, for example, two screws that pass through the fan housing 38 and one screw that passes through a tongue-shaped plate that protrudes to the outside of the fan housing 38.

[0047] The screws 47 are fastened, for example, into screw holes in boss portions 47a provided on the surface 31d of the metal plate 31. This allows each fan 30 to be detachably fixed to the metal plate 31. The two boss portions 47a that secure the screws 47 that pass through the fan housing 38 may also be inserted into holes 38c1 formed in the side wall material 38c (see Figures 4 and 5).

[0048] Next, we will explain the procedure for replacing fan 30.

[0049] Figure 6 is a side cross-sectional view showing the replacement operation of the fan 30 shown in Figure 5. In the electronic device 10, the fan 30 may fail while the thermal module 24 is mounted in the housing 12, as shown in Figure 5. In this case, the electronic device 10 can easily replace the failed fan 30 on its own.

[0050] As shown in Figure 6, first, remove the screws and hook structure and detach the first cover member 20 from the frame member 21. This exposes the fan 30 and the heads of the three screws 47. Then, remove the screws 47 and detach the fan 30 from the metal plate 31. This makes it easy to remove the faulty fan 30 from the surface 31d of the metal plate 31.

[0051] Next, the new fan 30 is installed. As shown in Figure 6, first, the replacement fan 30 is placed in the area where the faulty fan 30 was installed. That is, with the opening surface 38a facing downwards, the fan 30 is placed on the surface 31d of the metal plate 31. Next, the three screws 47 are tightened into the boss portions 47a. This secures the fan 30 to the metal plate 31. Finally, the first cover member 20 is attached to the frame member 21 via predetermined screws or hook structures. This completes the fan 30 replacement work.

[0052] As described above, the electronic device 10 of this embodiment comprises a housing 12, a substrate 25 on which a heat-generating element is mounted and supported by the housing 12, a heat-diffusing member 32 having a metal plate 31 and capable of diffusing heat from the heat-generating element, and a fan 30. The fan 30 has a fan housing 38 having an opening surface 38a on one side, and fan blades 39 supported within the fan housing 38. The heat-diffusing member 32 is fixed to at least one of the cover members 20, 22, the frame member 21, and the substrate 25 with screws 46. That is, the heat-diffusing member 32 may be fixed to the cover members 20, 22 together with the frame member 21 or the substrate 25 with screws 46, or it may be fixed to the cover members 20, 22 only with screws 46. In other words, the heat-diffusing member 32 may be fixed to the housing 12 or a member fixed to the housing 12. The fan housing 38 is fixed to the metal plate 31 with screws 47, and the opening surface 38a is closed by the metal plate 31.

[0053] Thus, the electronic device 10 uses the metal plate 31 that constitutes the heat diffusion member 32 as a cover plate (fan cover) that closes the opening surface 38a of the fan housing 38. Therefore, the electronic device 10 can directly cool the metal plate 31 that diffuses the heat from heat-generating elements such as the CPU 28 with the cool air inside the fan 30. As a result, the electronic device 10 can also achieve high cooling performance.

[0054] Furthermore, if the fan 30 of the electronic device 10 malfunctions, the casing 12 is opened to expose the interior, and then the screws 47 are removed. This alone allows the fan 30 to be removed from the metal plate 31 and replaced. In this way, the malfunctioning fan 30 of the electronic device 10 can be easily replaced independently. Therefore, when replacing the fan 30, the electronic device 10 does not need to replace the entire thermal module 24, including the heat diffusion member 32. As a result, the electronic device 10 can reduce the repair costs required for replacing the fan 30 and is also ESG compliant. Moreover, when replacing the fan 30, it is not necessary to replace the metal plate 31 that closes one side of the fan casing 38, so the cost of parts required for replacement can be further reduced.

[0055] The heat diffusion member 32 may have a vapor chamber 42 that forms a sealed space 42a between the metal plate 31 and the plate 44. Here, it is preferable that the metal plate 31 has an extended plate portion 31b that extends from the portion that forms the sealed space 42a. The fan housing 38 may be fixed to the extended plate portion 31b with screws 47. In this case, the cooling performance of the heat diffusion member 32 is further improved by the vapor chamber 42.

[0056] On the other hand, the opening surface 38a of the fan 30 is closed by only a thin extension plate portion 31b. This minimizes the effective height of the fan 30, specifically the height from the base plate portion 31a to the metal plate 31. In other words, the electronic device 10 can suppress the effective height of the fan 30 compared to a configuration in which the entire vapor chamber also serves as the fan cover, as in the configuration of Patent Document 1 described above. Furthermore, since the extension plate portion 31b is also a part that dissipates heat from the CPU 28, etc., the heat dissipation effect of the fan 30 on the metal plate 31 can be ensured. Moreover, the extension plate portion 31b does not have a sealed space 42a. For this reason, the fastening structure of the fan 30 to the extension plate portion 31b using screws 47 can also be simplified.

[0057] Furthermore, the vapor chamber 42 is integrally formed with the metal plate 31, maintaining high cooling performance, and does not need to be removed when replacing the fan 30. Therefore, even though the heat diffusion member 32 of the electronic device 10 is configured to include a vapor chamber 42, the fan 30 can be replaced independently. The same applies when a heat pipe is joined to the metal plate 31 instead of the vapor chamber 42, as described above. That is, the heat pipe can be integrally joined to the metal plate 31, maintaining high cooling performance. In the configuration of Patent Document 2 described above, the heat pipe and fan need to be fixed separately in order to replace the fan independently, which may reduce cooling performance.

[0058] In the electronic device 10, the circuit board 25 and the fan 30 are aligned on the same surface 31d side of the metal plate 31. This prevents the thicker circuit board 25 and fan 30 from overlapping in the Z direction on the surface 31d side of the metal plate 31, contributing to the thinning of the housing 12.

[0059] In this case, the metal plate 31 may be fixed to the circuit board 25 with screws 46 so as to cover a portion of the mounting surface 25a together with the CPU 28, etc. The fan housing 38 may be fixed to the surface 31d of the metal plate 31 on the side facing the mounting surface 25a with screws 47. This ensures that the metal plate 31 is reliably thermally connected to the heat-generating element, the CPU 28, etc. Furthermore, the fan 30 can be smoothly fixed in a position that does not overlap the circuit board 25 vertically.

[0060] The housing 12 may have a configuration comprising a first cover member 20 that forms one side of the housing in the thickness direction, a second cover member 22 that forms the other side of the housing, and a frame member 21 that detachably connects the cover members 20 and 22. In this case, the metal plate 31 is preferably placed between the frame member 21 and the first cover member 20, and a portion 25A of the substrate 25 and the fan 30 are preferably placed between the metal plate 31 and the first cover member 20. This would allow the fan 30 to be easily replaced simply by removing the first cover member 20 that forms one side of the housing 12.

[0061] In this case, screw 46 may be provided in a direction from the second cover member 22 towards the first cover member 20, and screw 47 may be provided in a direction from the first cover member 20 towards the second cover member 22. In this case, screws 46 and 47 will be facing opposite directions, so the circuit board 25 can be installed using the height of the fan 30. As a result, the height of the thermal module 24 and its surrounding components within the housing 12, including screws 46 and 47 and bosses 46a and 47a, can be suppressed. Also, when the first cover member 20 is removed when replacing the fan 30, the heads of screws 46, which do not need to be removed, will not be exposed. As a result, the screws 47 that need to be removed when replacing the fan 30 become clear, improving work efficiency.

[0062] It should be noted that the present invention is not limited to the embodiments described above, and can be freely modified without departing from the spirit of the invention. [Explanation of symbols]

[0063] 10 Electronic equipment 12 cabinets 20 First cover member 21 Frame members 22 Second cover member 24 Thermal Modules 25 circuit boards 27, 46, 47 screws 28 CPU 30 Fans 31 Metal plate 31b Extension plate section 32 Heat Diffusion Member 38 Fan Casing 38a Opening surface 39 Fanblade 42 Vapor Chamber 44 plates

Claims

1. It is an electronic device, The casing and A heating element is mounted on a circuit board supported by the aforementioned housing, A heat diffusion member having a metal plate and capable of diffusing the heat of the heating element, A fan comprising a fan housing having an opening on one side, and fan blades supported within the fan housing, Equipped with, The heat diffusion member is fixed to at least one of the housing and the substrate by a first screw, The fan housing is fixed to the metal plate with a second screw, and the opening is closed by the metal plate. An electronic device characterized by the following features.

2. The electronic device according to claim 1, The heat diffusion member has a vapor chamber in which a sealed space is formed between two metal plates, one of which is made of the metal plate. The metal plate has an extension plate portion that extends from the portion that forms the sealed space, The fan housing is fixed to the extension plate portion with the second screw. An electronic device characterized by the following features.

3. The electronic device according to claim 1 or 2, The substrate and the fan are arranged on the same surface side of the metal plate. An electronic device characterized by the following features.

4. The electronic device according to claim 3, The substrate has a mounting surface on which the heating element is mounted, The metal plate is fixed to the substrate with the first screw so as to cover a part of the mounting surface together with the heating element. The fan housing is fixed to the surface of the metal plate on the side facing the mounting surface with the second screw. An electronic device characterized by the following features.

5. The electronic device according to claim 1 or 2, The aforementioned enclosure is A first cover member that forms one side surface in the thickness direction, A second cover member forming the other side surface, A frame member is positioned between the first cover member and the second cover member, and the first cover member and the second cover member are detachably connected to each other, It has, The metal plate is positioned between the frame member and the first cover member. A portion of the substrate is placed between the metal plate and the first cover member. The fan is positioned between the metal plate and the first cover member. An electronic device characterized by the following features.

6. The electronic device according to claim 5, The first screw is provided in a direction from the second cover member side toward the first cover member side, The second screw is provided in a direction from the first cover member side toward the second cover member side. An electronic device characterized by the following features.

7. A cooling structure for mounting on an electronic device, A circuit board on which a heating element is mounted and which is supported by the housing of the electronic device, A heat diffusion member having a metal plate and capable of diffusing the heat of the heating element, A fan comprising a fan housing having an opening on one side, and fan blades supported within the fan housing, Equipped with, The heat diffusion member is fixed to at least one of the housing and the substrate by a first screw, The fan housing is fixed to the metal plate with a second screw, and the opening is closed by the metal plate. A cooling structure characterized by the following features.

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