Detection device

Abstract

A detection device (1) comprises: a board (21) having a cutout part (22) between both ends in a first direction; a terminal part provided at one end of the board (21) in the first direction; a first optical sensor (10A) provided on the board (21) between the cutout part (22) and the terminal part; a second optical sensor (10B) provided on the board (21) between the cutout part (22) and the other end of the board (21); and a flexible printed circuit board (70) on which a light source (60) and a plurality of electronic components are mounted. A lower electrode of each of the first optical sensor (10A) and the second optical sensor (10B) is electrically connected to the terminal part. The terminal part is connected to a first end of the flexible printed circuit board (70). The board (21) is disposed at a position where the flexible printed circuit board (70) is bent and the cutout part (22) of the board (21) overlaps the light source (60).

Description

Technical Field

[0001] The present invention relates to a detection device.

Background Art

[0002] Devices for detecting information related to a living body from a human body are known. Patent Document 1 discloses a pulse wave sensor capable of measuring a pulse wave without restricting the behavior of a subject.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When a substrate having a plurality of optical sensors, a light source, and a battery are separately fixed and housed inside an annular housing, the housing becomes large.

[0005] An object of the present invention is to provide a detection device that can be miniaturized even when housing a substrate having an optical sensor and a member connected to the substrate.

Means for Solving the Problems

[0006] A detection device according to one aspect of the present invention comprises a substrate having a notch between its two ends in a first direction, a terminal portion provided at one end of the substrate in the first direction, a first photosensor provided on the substrate between the notch and the terminal portion, a second photosensor provided on the substrate between the notch and the other end of the substrate, a light source and a flexible printed circuit board on which a plurality of electronic components are mounted, wherein each of the first and second photosensors is laminated on the substrate in the order of a lower electrode, a lower buffer layer, an active layer, an upper buffer layer, an upper electrode and a sealing film, the lower electrodes of the first and second photosensors are electrically connected to the terminal portion, the terminal portion is connected to the first end of the flexible printed circuit board, and the substrate is positioned such that the flexible printed circuit board is bent and the notch of the substrate overlaps with the light source.

[0007] A detection device according to one aspect of the present invention comprises a substrate having a light sensor, a terminal portion provided at one end of the substrate in a first direction, and a flexible printed circuit board on which a light source and a plurality of electronic components are mounted. The light sensor is laminated on the substrate in the order of a lower electrode, a lower buffer layer, an active layer, an upper buffer layer, an upper electrode, and a sealing film. The lower electrode and the upper electrode of the light sensor are electrically connected to the terminal portion, the terminal portion is connected to the first end of the flexible printed circuit board, and the substrate is bent so that the other end of the substrate in the first direction is positioned adjacent to the light source. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic diagram showing an example of the external appearance of the detection device according to Embodiment 1, when a finger is placed inside the device and viewed from the side of the housing. [Figure 2] Figure 2 is a schematic cross-sectional view of the AA section shown in Figure 1. [Figure 3] Figure 3 is an exploded view showing the surface side of the substrate shown in Figure 2 and an example of a flexible printed circuit board. [Figure 4]Figure 4 is an exploded view showing the back side of the substrate shown in Figure 2 and an example of the exploded view of a flexible printed circuit board. [Figure 5] Figure 5 is an unfolded view showing the flexible printed circuit board shown in Figure 4 in a folded state. [Figure 6] Figure 6 is a side view of the substrate and flexible printed circuit board shown in Figure 5. [Figure 7] Figure 7 is a schematic cross-sectional diagram showing an example of a stacked optical sensor configuration in the BB cross-section shown in Figure 3. [Figure 8] Figure 8 is a schematic cross-sectional diagram showing an example of a stacked optical sensor configuration in the CC cross-section shown in Figure 3. [Figure 9] Figure 9 is an exploded view showing the surface side of the substrate and an example of the flexible printed circuit board of Embodiment 2. [Figure 10] Figure 10 is an exploded view showing the back side of the substrate and an example of the flexible printed circuit board according to Embodiment 2. [Figure 11] Figure 11 is an unfolded view showing the flexible printed circuit board shown in Figure 10 in a folded state. [Figure 12] Figure 12 is a side view of the substrate and flexible printed circuit board shown in Figure 11. [Figure 13] Figure 13 is an exploded view showing the surface side of the substrate and an example of the flexible printed circuit board of Embodiment 3. [Figure 14] Figure 14 is an exploded view showing the back side of the substrate and an example of the exploded view of the flexible printed circuit board according to Embodiment 3. [Figure 15] Figure 15 is an unfolded view showing the flexible printed circuit board shown in Figure 14 in a folded state. [Figure 16] Figure 16 is a side view of the substrate and flexible printed circuit board shown in Figure 15. [Modes for carrying out the invention]

[0009] Embodiments for carrying out the invention will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below. Furthermore, the components described below include those that can be easily conceived by a person skilled in the art, and those that are substantially the same. Moreover, the components described below can be combined as appropriate. Note that the disclosure is merely an example, and any modifications that can be easily conceived by a person skilled in the art while maintaining the spirit of the invention are naturally included within the scope of the present invention. In addition, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual embodiment in order to make the explanation clearer, but these are merely examples and do not limit the interpretation of the present invention. Furthermore, in this specification and each drawing, elements similar to those described above with respect to previously shown drawings are denoted by the same reference numerals, and detailed explanations may be omitted as appropriate.

[0010] In this specification and the claims, when describing a configuration in which one structure is placed on top of another structure, unless otherwise specified, the term "on top of" includes both cases: one in which the other structure is placed directly on top of the other structure so as to be in contact with it, and another in which the other structure is placed above the other structure via yet another structure.

[0011] (Embodiment 1) Figure 1 is a schematic diagram showing an example of the external appearance of the detection device according to Embodiment 1, when a finger is placed inside, as viewed from the side of the housing. Figure 2 is a schematic cross-sectional view of the AA cross-section shown in Figure 1. Figure 3 is Figure 2 Figure 4 shows an unfolded view illustrating the surface side of the substrate and an example of a flexible printed circuit board. Figure 2 Figure 4 shows the back side of the substrate and an unfolded view of a flexible printed circuit board. Figure 5 is an unfolded view showing the flexible printed circuit board shown in Figure 4 in a folded state. Figure 6 is a side view of the substrate and flexible printed circuit board shown in Figure 5. Figure 7 is a schematic cross-sectional view showing an example of a stacked optical sensor configuration in the BB cross-section shown in Figure 3. Figure 8 is a schematic cross-sectional view showing an example of a stacked optical sensor configuration in the CC cross-section shown in Figure 3.

[0012] The detection device 1 shown in FIG. 1 is a ring-shaped device that can be attached to and detached from the human body, and is worn on the finger Fg of the human body. The finger Fg includes the thumb, index finger, middle finger, ring finger, little finger, and the like. The human body is the subject to be authenticated for whom the detection device 1 performs identity verification. The detection device 1 can detect biometric information related to the living body from the worn finger Fg. The finger Fg is an example of a measurement object. The measurement object is a living body or a part of a living body and is a measurement object. The detection device 1 is made into a ring or a wristband to make it easy for the user to carry. In the following description, it is assumed that the detection device 1 is used as a ring.

[0013] As shown in FIG. 2, the detection device 1 includes a housing 200, a substrate 21, a light source 60, a first photosensor 10A, a second photosensor 10B, and a flexible printed board 70. The detection device 1 includes a battery 300 connected to the flexible printed board 70 inside the housing 200 and is a device that operates using the power of the battery 300. The substrate 21 and the flexible printed board 70 are electrically connected.

[0014] The housing 200 is formed in a ring shape that can be worn on the finger Fg and is a wearing member for wearing on the living body. In an example shown in FIG. 2, the housing 200 includes a first housing 210 and a second housing 220. The housing 200 is formed in a ring shape with the first housing 210 and the second housing 220 integrated. The first housing 210 is a member that contacts the human body on which the housing 200 is worn. The first housing 210 houses the light source 60, the first photosensor 10A, the second photosensor 10B, etc. inside. The first housing 210 is formed in a ring shape, for example, by a housing material such as a transparent synthetic resin or silicon. The first housing 210 has a light irradiation portion 60R that protrudes inward and is configured to irradiate the finger Fg with the light of the light source 60 from the light irradiation portion 60R. The light irradiation portion 60R is, for example, a convex lens having translucency.

[0015] The second housing 220 has a surface of housing 200 that covers a portion of the outer peripheral surface 210A of the first housing 210. The second housing 220 is formed in a ring shape from a material such as metal or an impermeable synthetic resin. In this embodiment, the second housing 220 is provided on the upper surface of the first housing 210, that is, on the surface of the fingers Fg on the back of the hand, but it may also be configured to cover the entire upper surface of the first housing 210.

[0016] The housing 200 houses a flexible printed circuit board 70 on which a light source 60, a first light sensor 10A, a second light sensor 10B, etc., and a battery 300 inside the first housing 210. The flexible printed circuit board 70 is housed inside the first housing 210 with its first end 71 bent at a bending portion 73. Bending portion 73 bent A substrate 21, on which the first light sensor 10A and the second light sensor 10B are mounted, is connected to the first end 71. The flexible printed circuit board 70 is housed inside the housing 200, for example, by forming it in a ring shape in a mold and filling the surrounding area with a filling material. The detection device 1 is positioned inside the housing 200, inward of the flexible printed circuit board 70, so that the light from the finger Fg can be received by the first light sensor 10A and the second light sensor 10B.

[0017] As shown in Figures 2 to 4, the flexible printed circuit board 70 is formed in a deformable strip shape, extending from a first end 71 to a second end 72. The flexible printed circuit board 70 has mounting areas 73A, 73B, 73C, 73D, and 73E provided between the first end 71 and the second end 72. On the first surface 70A of the flexible printed circuit board 70, the light source 60 is mounted in the central mounting area 73C among the mounting areas 73A, 73B, 73C, 73D, and 73E, while the other areas are left unmounted. In other words, the first surface 70A of the flexible printed circuit board 70 is the surface on which the light source 60 is mounted, and the second surface 70B is the surface on which the light source 60 is not mounted.

[0018] On the second side 70B of the flexible printed circuit board 70, opposite to the first side 70A, electronic components are mounted in each of the mounting areas 73A, 73B, 73C, 73D, and 73E. The electronic components include, for example, a control circuit 122 in mounting area 73A, a detection circuit 123 in mounting area 73B, a control circuit 124 in mounting area 73C, a control circuit 125 in mounting area 73D, and a power supply circuit 126 in mounting area 73E.

[0019] As shown in Figure 2, the flexible printed circuit board 70 has a substrate 21 having a cutout portion 22 as shown in Figures 3 and 4, which straddles the vicinity of the light source 60 in the mounting area 73C. As shown in Figure 3, the substrate 21 is a substrate on which the first light sensor 10A, the second light sensor 10B, etc. are mounted on its surface 21H. As shown in Figures 3 and 4, the flexible printed circuit board 70 electrically connects the light source 60, the first light sensor 10A, the second light sensor 10B, etc. to the electronic equipment. The substrate 21 is connected to the first end portion 71 of the flexible printed circuit board 70 such that the surface 21H on which the first light sensor 10A, the second light sensor 10B, etc. are mounted is a continuous surface with the second surface 70B of the flexible printed circuit board 70.

[0020] In this embodiment, as shown in Figure 2, the first light sensor 10A and the second light sensor 10B are arranged so as to sandwich the light source 60 in the circumferential direction 200C. That is, the detection device 1 is arranged in the order of the first light sensor 10A, the light source 60, and the second light sensor 10B in the circumferential direction 200C. By arranging the first light sensor 10A and the second light sensor 10B so as to sandwich the light source 60 in the circumferential direction 200C, the light emitted by the light source 60 can be detected around the light source 60.

[0021] As shown in Figures 2 to 4, the detection device 1 further comprises a substrate 21 and a terminal portion 40. The substrate 21 is an insulating substrate, formed in a strip shape from, for example, a film-like resin. The substrate 21 has a first light sensor 10A and a second light sensor 10B mounted on its surface 21H and is a deformable substrate. The terminal portion 40 is provided on one end 21A of the surface 21H of the substrate 21. As shown in Figure 4, the substrate 21 is electrically connected to the flexible printed circuit board 70 by being mounted on the flexible printed circuit board 70 via the terminal portion 40. That is, in a plan view, the back surface 21R of the substrate 21 is a continuous surface with the first surface 70A of the flexible printed circuit board 70. The flexible printed circuit board 70 has a battery charging coil 127 provided at its second end 72. The battery charging coil 127 is formed by winding a conductor inside the flexible printed circuit board 70.

[0022] In the following explanation, the first direction Dx is one direction in the plane parallel to the substrate 21 and the flexible printed circuit board 70, and is the same direction as the circumferential direction 200C. The second direction Dy is one direction in the plane parallel to the substrate 21, and is perpendicular to the first direction Dx. The second direction Dy may intersect the first direction Dx without being perpendicular to it. The third direction Dz is perpendicular to the first direction Dx and the second direction Dy. The third direction Dz is the normal direction of the substrate 21. Furthermore, "plan view" refers to the positional relationship when viewed from a direction perpendicular to the substrate 21.

[0023] As shown in Figures 2 to 4, the battery 300 is a film-type lithium-ion battery and is flexible. The battery 300 is electrically connected to the power supply circuit 126 on the mounting area 73E of the second surface 70B of the flexible printed circuit board 70 via the connection part 310. 2nd direction Dy The width of the battery is less than or equal to the width of the flexible printed circuit board 70 in the second direction Dy, and the length of the battery 300 in the first direction Dx is smaller than the length of the flexible printed circuit board 70 in the first direction Dx. As a result, the detection device 1 can mount the battery 300 onto the flexible printed circuit board 70 so that it does not protrude from the flexible printed circuit board 70.

[0024] As shown in Figures 5 and 6, the substrate 21 is positioned such that the first photosensor 10A and the second photosensor 10B are on either side of the light source 60 in the circumferential direction 200C of the housing 200, by bending the first end 71 of the flexible printed circuit board 70 at the bending portion 73. The substrate 21 has a notch 22 between both ends in the circumferential direction 200C of the housing 200, i.e., the first direction Dx (longitudinal direction) of the substrate 21. The first photosensor 10A is positioned on one end 21A side of the notch 22, and the second photosensor 10B is positioned on the other end 21B side. The substrate 21 is positioned such that the notch 22 overlaps with the light source 60 when the flexible printed circuit board 70 is bent at the bending portion 73. The position in which the notch 22 overlaps with the light source 60 means that the light source 60 is positioned within the area of ​​the notch 22 of the substrate 21 when it is mounted on the flexible printed circuit board 70. The substrate 21 may or may not be fixed to the flexible printed circuit board 70 by an adhesive member.

[0025] The terminal section 40 is a component for electrically connecting the first optical sensor 10A and the second optical sensor 10B on the substrate 21 with the control circuit 122 and the power supply circuit 126 of the flexible printed circuit board 70. The terminal section 40 supplies power signals (power) from the power supply circuit 126 to the first optical sensor 10A and the second optical sensor 10B via wiring. The terminal section 40 has a plurality of terminals (not shown) and is configured to be electrically connectable to a plurality of wires.

[0026] The terminal section 40 is provided on one end 21A of the substrate 21 in the first direction Dx. As shown in Figure 4, the terminal section 40 is connected to a connection section (not shown) on the first end 71 of the first surface 70A of the flexible printed circuit board 70. The terminal section 40 is sandwiched between the first surfaces 70A of the flexible printed circuit board 70 as the electrically connected flexible printed circuit board 70 is bent at the bending section 73, as shown in Figure 6, and is housed inside the housing 200 in this state. The terminal section 40 supplies power from the power supply circuit 126 to the first light sensor 10A and the second light sensor 10B.

[0027] In this embodiment, as shown in Figure 2, the flexible printed circuit board 70 is housed inside the housing 200 such that the first surface 70A on which the first light sensor 10A, the second light sensor 10B, and the light source 60 are mounted faces the inner surface 200B of the housing 200. If the flexible printed circuit board 70 is light-transmitting, the first light sensor 10A, the second light sensor 10B, and the light source 60 may be mounted on the second surface 70B opposite to the first surface 70A. In this case, the light source 60 should be positioned to emit light toward the flexible printed circuit board 70, and the light that has passed through the flexible printed circuit board 70 should be emitted toward the outside of the housing 200.

[0028] As shown in Figure 2, the light source 60 is installed inside the first housing 210 of the housing 200 and is configured to emit light toward the finger Fg to which the housing 200 is attached. For example, the light source 60 can be an inorganic LED (Light Emitting Diode) or an organic EL (OLED: Organic Light Emitting Diode). The light source 60 emits light of a predetermined wavelength. In one example shown in Figures 4 and 5, the light source 60 consists of a first light source 61 that emits red light, a second light source 62 that emits near-infrared light, and a light source that emits green light. Third It has a light source 63.

[0029] Light emitted from the light source 60 is reflected by the surface of the object to be detected, such as a finger Fg, and enters the first light sensor 10A and the second light sensor 10B. This allows the detection device 1 to detect fingerprints by detecting the shape of the irregularities on the surface of the finger Fg. Alternatively, the light emitted from the light source 60 may be reflected inside the finger Fg or pass through the finger Fg before entering the first light sensor 10A and the second light sensor 10B. This allows the detection device 1 to detect biological information inside the finger Fg. This biological information includes, for example, pulse waves, pulse rate, and vascular patterns of the fingers or palm. That is, the detection device 1 may be configured as a fingerprint detection device for detecting fingerprints, or as a vein detection device for detecting vascular patterns such as veins.

[0030] The first light sensor 10A and the second light sensor 10B each detect light reflected by a finger Fg or the like from light irradiated by the light source 60, directly incident light, etc. The first light sensor 10A and the second light sensor 10B are organic photodiodes (OPDs). The first light sensor 10A is provided in the housing 200 so as to be adjacent to one end of the light source 60 in the circumferential direction 200C of the housing 200. The second light sensor 10B is provided in the housing 200 so as to be adjacent to the other end of the light source 60 in the circumferential direction 200C of the housing 200.

[0031] As shown in Figure 7, the first light sensor 10A includes a substrate 21 and a photodiode PD. In this embodiment, the first light sensor 10A further includes wiring 26 and an insulating layer 27.

[0032] The region of the substrate 21 corresponding to the first light sensor 10A has wiring 26 provided on its upper surface. The wiring 26 is a shielding layer and is formed of a material having better conductivity than the lower electrode 11 of the photodiode PD, for example, metal wiring. The wiring 26 is provided in the layer between the substrate 21 and the photodiode PD in the third direction Dz. The wiring 26 is electrically connected to the terminal portion 40 on the substrate 21. The wiring 26 may be formed in the same layer as the lower electrode 11, for example, or it may be made of metal. An insulating layer 27 is provided on the substrate 21, covering the wiring 26. The insulating layer 27 may be an inorganic insulating film or an organic insulating film.

[0033] The photodiode PD is provided on an insulating layer 27. The photodiode PD has a lower electrode 11, a lower buffer layer 12, an active layer 13, an upper buffer layer 14, and an upper electrode 15 (upper electrode 15A). The photodiode PD is stacked in the following order in a third direction Dz perpendicular to the substrate 21: lower electrode 11, lower buffer layer 12 (hole transport layer), active layer 13, upper buffer layer 14 (electron transport layer), and upper electrode 15A.

[0034] The lower electrode 11 is the anode electrode of the photodiode PD and is formed of a light-transmitting conductive material such as ITO (Indium Tin Oxide). The active layer 13 changes its properties (e.g., voltage-current characteristics and resistance) depending on the light it is irradiated with. An organic material is used as the material for the active layer 13. Specifically, the active layer 13 is a bulk heterostructure in which a p-type organic semiconductor and an n-type organic semiconductor, an n-type fullerene derivative (PCBM), are mixed. As the active layer 13, for example, low molecular weight organic materials such as C60 (fullerene), PCBM (phenyl C61-butyric acid methyl ester), CuPc (copper phthalocyanine), F16CuPc (fluorinated copper phthalocyanine), rubrene (5,6,11,12-tetraphenyltetracene), and PDI (derivative of perylene) can be used.

[0035] The active layer 13 can be formed by vapor deposition (Dry Process) using these low-molecular-weight organic materials. In this case, the active layer 13 may be, for example, a laminated film of CuPc and F16CuPc, or a laminated film of rubrene and C60. The active layer 13 can also be formed by coating (Wet Process). In this case, the active layer 13 uses a material that combines the low-molecular-weight organic material and the polymeric organic material described above. As the polymeric organic material, for example, P3HT (poly(3-hexylthiophene)), F8BT (F8-alt-benzothiadiazole), etc. can be used. The active layer 13 can be a film in which P3HT and PCBM are mixed, or a film in which F8BT and PDI are mixed.

[0036] The lower buffer layer 12 is a hole transport layer. The upper buffer layer 14 is an electron transport layer. The lower buffer layer 12 and the upper buffer layer 14 are provided to facilitate the arrival of holes and electrons generated in the active layer 13 at the lower electrode 11 or the upper electrode 15. The lower buffer layer 12 (hole transport layer) is in direct contact with the lower electrode 11 and is also provided in the region between adjacent lower electrodes 11. The active layer 13 is in direct contact with the lower buffer layer 12. The material of the hole transport layer is a metal oxide layer. Examples of metal oxide layers used include tungsten oxide (WO3) and molybdenum oxide.

[0037] The upper buffer layer 14 (electron transport layer) is in direct contact with the active layer 13, and the upper electrode 15 is in direct contact with the upper buffer layer 14. The electron transport layer is made of ethoxylated polyethyleneimine (PEIE).

[0038] The materials and manufacturing methods for the lower buffer layer 12, the active layer 13, and the upper buffer layer 14 are merely examples, and other materials and manufacturing methods may be used. For example, the lower buffer layer 12 and the upper buffer layer 14 are not limited to single layers, but may be formed as laminated films including an electron blocking layer and a hole blocking layer.

[0039] The upper electrode 15 is provided on the upper buffer layer 14. The upper electrode 15 is the cathode electrode of the photodiode PD and is formed continuously over the entirety of the first photosensor 10A and the second photosensor 10B. In other words, the upper electrode 15 is provided continuously over multiple photodiodes PD. The upper electrode 15 faces multiple lower electrodes 11, with the lower buffer layer 12, the active layer 13, and the upper buffer layer 14 in between. The upper electrode 15 is formed of a light-transmitting conductive material such as ITO or IZO. A portion of the end of the upper surface 150 of the upper electrode 15 is electrically connected to a conductive material 24, and is electrically connected to the power supply electrode 211 via the conductive material 24. The power supply electrode 211 is electrically connected to a battery 300 and is configured to be able to receive power from the battery 300. In the first photosensor 10A, a sealing film 160 is provided on the upper electrode 15, etc. The sealing film 160 can be an inorganic film such as a silicon nitride film or an aluminum oxide film, or a resin film such as acrylic. The sealing film 160 is not limited to a single layer, but may be a laminated film of two or more layers combining the above-mentioned inorganic films and resin films. The detection device 1 can effectively seal the photodiode PD with the sealing film 160, thereby suppressing the intrusion of moisture from the top side.

[0040] As shown in Figure 8, the second photosensor 10B has its lower electrode 11 in a different region of the substrate 21 from the lower electrode 11 of the first photosensor 10A. The lower electrode 11 is covered by a lower buffer layer 12, an active layer 13, an upper buffer layer 14, and an upper electrode 15 (upper electrode 15B). In this embodiment, the second photosensor 10B has a substrate 21, a photodiode PD, wiring 26, and an insulating layer 27. The photodiode PD, wiring 26, and insulating layer 27 have the same configuration as the photodiode PD, wiring 26, and insulating layer 27 of the first photosensor 10A. That is, the photodiode PD of the second photosensor 10B has a lower electrode 11, a lower buffer layer 12, an active layer 13, an upper buffer layer 14, and an upper electrode 15B. In the second light sensor 10B, the photodiode PD is well sealed by providing a sealing film 160 on top of the upper electrode 15B, etc.

[0041] As shown in Figure 4, the substrate 21 is a single, integrally formed common substrate having regions for the first photosensor 10A and the second photosensor 10B. In the first direction Dx, the substrate 21 has a notch 22 between the region of the first photosensor 10A and the region of the second photosensor 10B. The substrate 21 has the notch 22 between the first photosensor 10A and the second photosensor 10B, and a connecting portion 23 that is in contact with the notch 22 and is located between the first photosensor 10A and the second photosensor 10B.

[0042] The notch 22 is formed in the first direction Dx over a distance longer than the length of the light source 60. The notch 22 is formed in the second direction Dy over a distance longer than the length of the light source 60 and shorter than the length (width) of the substrate 21. The substrate 21 is integrally formed by connecting the first photosensor 10A and the second photosensor 10B at a connecting portion 23 along the notch 22. The connecting portion 23 contains a lower buffer layer 12, an active layer 13, an upper buffer layer 14, and an electrode connecting portion 151 of the upper electrode 15. Thus, the connecting portion 23 integrally forms the upper electrodes 15A and 15B of the first photosensor 10A and the second photosensor 10B. The first photosensor 10A and the second photosensor 10B are connected at the connecting portion 23 and operate using power supplied from the power supply electrode 211 to the common upper electrode 15.

[0043] The notch 22 is formed in a shape that allows the light source 60 to be placed. In this embodiment, the notch 22 is formed in a substantially rectangular shape in plan view, but it may be in the shape of a semicircle, triangle, polygon, etc. The notch 22 may also be a through hole through which light from the light source 60 can pass. The electrode connecting portion 151 is provided on the connecting portion 23 of the substrate 21 so as to be laminated on the upper buffer layer 14, the active layer 13, and the lower buffer layer 12.

[0044] Multiple wirings 26 on the substrate 21 are connected to the control circuit 122 via multiple signal lines (not shown) on the flexible printed circuit board 70. In other words, the control circuit 122 is electrically connected to the lower electrodes 11 of the first light sensor 10A and the second light sensor 10B via multiple signal lines.

[0045] The control circuit 122 is a circuit that controls the detection operation by supplying control signals to multiple photodiodes PD. Each of the multiple photodiodes PD outputs an electrical signal corresponding to the light irradiated upon it as a detection signal Vdet to the detection circuit 123. The detection circuit 123 is a detection circuit for the detection signal Vdet. The detection circuit 123 is, for example, an analog front-end circuit (AFE). The detection circuit 123 is a signal processing circuit that has at least the functions of a detection signal amplification circuit and an A / D conversion circuit. The detection signal amplification circuit amplifies the detection signal Vdet. The A / D conversion circuit converts the analog signal output from the detection signal amplification circuit into a digital signal.

[0046] The charging control circuit 124 controls the power of wireless power transmission, which occurs when electrical energy reaches the battery charging coil 127 via electromagnetic means from an external source. The coupling method for wireless power transmission can be selected from one of the following: electromagnetic induction, electromagnetic resonance, or radio wave. The control circuit 124 charges the battery 300 using the wirelessly transmitted power.

[0047] The control circuit 125 supplies a control signal to the light source 60 to control whether the light source 60 is lit or not. The power supply circuit 126 supplies a power signal (power) from the battery 300 to the first light sensor 10A and the second light sensor 10B via the terminal section 40.

[0048] The above describes an example of the configuration of the detection device 1 according to this embodiment. Note that the above configuration described with reference to Figures 1 to 8 is merely an example, and the configuration of the detection device 1 according to this embodiment is not limited to this example. The configuration of the detection device 1 according to this embodiment can be flexibly modified according to specifications and operation.

[0049] [Example of detection device assembly] Next, an example of the assembly of the detection device 1 will be described. As shown in Figures 3 and 4, the flexible printed circuit board 70 has a light source 60 mounted on its first surface 70A, and the control circuit 122, detection circuit 123, control circuit 124, control circuit 125, and power supply circuit 126 mounted on its second surface 70B. The substrate 21 has the first light sensor 10A and the second light sensor 10B formed on it, and the terminal portion 40 is mounted on it. The substrate 21 is connected to the first end portion 71 of the flexible printed circuit board 70 by connecting the connection portion on the first surface 70A of the flexible printed circuit board 70 to the terminal portion 40. As shown in Figure 5, the substrate 21 is bent at the bending portion 73 of the flexible printed circuit board 70, and the other end portion 21B of the substrate 21 is brought close to the first surface 70A of the flexible printed circuit board 70, and the substrate 21 is positioned on the first surface 70A of the flexible printed circuit board 70 so that the notch portion 22 of the substrate 21 overlaps with the light source 60. The flexible printed circuit board 70 is electrically connected to the battery 300 at its second end 72. The substrate 21, the flexible printed circuit board 70, and the battery 300 are housed in a mold in a ring shape, and a filling material is filled around them to form a housing 200, which then houses the components inside. As a result, the detection device 1 is formed as a device in which the substrate 21, the flexible printed circuit board 70, and the battery 300 are housed in the housing 200, with the flexible printed circuit board 70 bent and the notch 22 positioned to overlap with the light source 60.

[0050] [Example of detection device operation] Next, we will describe an example of detection by the detection device 1 attached to finger Fg. In the example shown in Figure 2, the detection device 1 is located on the inner circumferential surface of the first housing 210 of the housing 200. 200B The sensor is in contact with or close to the finger Fg. The detection device 1 operates the first light sensor 10A and the second light sensor 10B by supplying power from the battery 300 to the common upper electrode 15 via the terminal 40. The detection device 1 turns on the light source 60 so that the light source 60 is directed towards the finger Fg. LightThe light source 60 irradiates light to one side and the other side in the circumferential direction 200C. The detection device 1 receives the light reflected by the finger Fg, etc., with the first photosensor 10A and the second photosensor 10B. The detection device 1 detects biological information about the finger Fg based on the amount of light received by each of the two photodiodes PD of the first photosensor 10A and the second photosensor 10B.

[0051] In this way, the detection device 1 connects a substrate 21 having a first light sensor 10A and a second light sensor 10B to a flexible printed circuit board 70 via a terminal section 40. By bending the flexible printed circuit board 70, the notch 22 of the substrate 21 is positioned to overlap with the light source 60 of the flexible printed circuit board 70. As a result, even if the detection device 1 connects the substrate 21 and the flexible printed circuit board 70 with the light source 60 as separate components in series, the flexible printed circuit board 70 can be bent in the connection direction to position the substrate 21, thereby reducing the size of the housing space. Consequently, the detection device 1 can prevent the size of the components that house the substrate 21 having multiple light sensors and the flexible printed circuit board 70 having the light source 60 from increasing.

[0052] In the detection device 1, the lower buffer layer 12, active layer 13, upper buffer layer 14, and upper electrode 15 of the first photosensor 10A and the second photosensor 10B can be common. As a result, the detection device 1 only needs to supply power to the integrated upper electrode 15 for the first photosensor 10A and the second photosensor 10B, thus simplifying the configuration of the substrate 21. Consequently, even if multiple photosensors are arranged on the substrate 21, the size of the substrate 21 can be suppressed.

[0053] The detection device 1 has multiple electronic components mounted on the second side 70B of the flexible printed circuit board 70, opposite to the light source 60. This allows the detection device 1 to simplify the configuration of the flexible printed circuit board 70 and further reduce the size of the housing space by mounting multiple electronic components on the second side 70B of the flexible printed circuit board 70 and mounting the light source 60 on the first side 70A on the opposite side.

[0054] In the detection device 1, the substrate 21 and the flexible printed circuit board 70 are housed in a ring-shaped housing 200. This allows the detection device 1 to detect light emitted by the light source 60 with high accuracy over a wide area of ​​the housing 200 using multiple photosensors without increasing the size of the ring-shaped housing 200.

[0055] (Embodiment 2) Figure 9 is an exploded view showing the front side of the substrate and an example of the flexible printed circuit board of Embodiment 2. Figure 10 is an exploded view showing the back side of the substrate and an example of the flexible printed circuit board of Embodiment 2. Figure 11 is an exploded view showing the flexible printed circuit board shown in Figure 10 in a folded state. Figure 12 is a side view of the substrate and flexible printed circuit board shown in Figure 11.

[0056] In Embodiment 2, the detection device 1 comprises the housing 200, terminal section 40, light source 60, first light sensor 10A, flexible printed circuit board 70, and board 21-1. The detection device 1 has a battery 300 connected to the flexible printed circuit board 70 located inside the housing 200, and is powered by the battery 300. The flexible printed circuit board 70 has multiple electronic components mounted on it. The electronic components include the control circuit 122 for mounting area 73A, the detection circuit 123 for mounting area 73B, the control circuit 124 for mounting area 73C, the control circuit 125 for mounting area 73D, and the power supply circuit 126 for mounting area 73E. In Embodiment 2, similar to Embodiment 1, the detection device 1 houses the terminal section 40, light source 60, first light sensor 10A, flexible printed circuit board 70, and board 21-1 in a ring-shaped housing 200.

[0057] The substrate 21-1 is an insulating substrate, formed in a strip shape from, for example, a film-like resin. The substrate 21-1 is a deformable substrate, with the first optical sensor 10A mounted on the surface 21H near the other end 21B. The substrate 21-1 has a terminal portion 40 provided on one end 21A of the surface 21H. As shown in Figure 10, the substrate 21-1 is electrically connected to the flexible printed circuit board 70 by being mounted on the flexible printed circuit board 70 via the terminal portion 40. That is, in a plan view, the back surface 21R of the substrate 21-1 is a continuous surface with the first surface 70A of the flexible printed circuit board 70.

[0058] In the substrate 21-1, the number of light sensors is reduced compared to Embodiment 1, and the length in the first direction Dx is shortened. Therefore, in the first surface 70A of the flexible printed circuit board 70, the light source 60 is located on the substrate, not in the mounting area 73C. 21-1 The difference from Embodiment 1 is that the components are mounted in the mounting area 73B based on the length of the components, the length of the bent portion, etc. In Embodiment 2, the flexible printed circuit board 70 has a change in the length of the board 21 in the first direction Dx (circumferential direction 200C), causing the position of the light source 60 to move towards the first end 71.

[0059] The substrate 21-1 shown in Figures 9 and 10 is positioned adjacent to the light source 60 in the circumferential direction 200C of the housing 200 by bending the first end 71 of the flexible printed circuit board 70 at the bending portion 73. As shown in Figure 11, the substrate 21-1 is positioned near the light source 60 by bending the flexible printed circuit board 70 at the bending portion 73. The substrate 21-1 shown in Figure 12 may or may not be fixed to the flexible printed circuit board 70 by an adhesive member.

[0060] The terminal section 40 shown in Figure 10 is a component for electrically connecting the first optical sensor 10A on the substrate 21 with the control circuit 122 and power supply circuit 126 of the flexible printed circuit board 70. The terminal section 40 supplies a power signal (power) from the power supply circuit 126 to the first optical sensor 10A via wiring. The terminal section 40 has multiple terminals (not shown) and is configured to be electrically connectable to multiple wires.

[0061] The flexible printed circuit board 70 shown in Figure 12 is housed inside the housing 200 such that the first surface 70A on which the first light sensor 10A and light source 60 are mounted faces the inner surface 200B of the housing 200. If the flexible printed circuit board 70 is light-transmitting, the first light sensor 10A and light source 60 may be mounted on the second surface 70B opposite to the first surface 70A. In this case, the light source 60 should be positioned to emit light toward the flexible printed circuit board 70, and the light transmitted through the flexible printed circuit board 70 should be emitted toward the outside of the housing 200.

[0062] Light emitted from the light source 60 is reflected by the surface of the object to be detected, such as a finger Fg, and enters the first light sensor 10A. This allows the detection device 1 to detect fingerprints by detecting the shape of the surface irregularities of the finger Fg. Alternatively, the light emitted from the light source 60 may be reflected inside the finger Fg or pass through the finger Fg before entering the first light sensor 10A. This allows the detection device 1 to detect biological information inside the finger Fg. This biological information includes, for example, pulse waves, pulse rate, and vascular patterns of the fingers or palm. In other words, the detection device 1 may be configured as a fingerprint detection device for detecting fingerprints, or as a vein detection device for detecting vascular patterns such as veins.

[0063] The first light sensor 10A detects light reflected by a finger Fg or the like from the light source 60, as well as light that is directly incident on the sensor. The first light sensor 10A is an organic photodiode (OPD). The first light sensor 10A is installed in the housing 200 so as to be adjacent to one end of the light source 60 in the circumferential direction 200C of the housing 200.

[0064] The above describes an example configuration of the detection device 1 according to Embodiment 2. Note that the above configuration described using Figures 9 to 12 is merely an example, and the configuration of the detection device 1 according to Embodiment 2 is not limited to this example. The configuration of the detection device 1 according to Embodiment 2 can be flexibly modified according to specifications and operation.

[0065] [Example of detection device assembly] Next, an assembly example of the detection device 1 according to Embodiment 2 will be described. As shown in Figures 9 and 10, the flexible printed circuit board 70 has a light source 60 mounted on its first surface 70A, and a control circuit 122, detection circuit 123, control circuit 124, control circuit 125, and power supply circuit 126 mounted on its second surface 70B. The substrate 21-1 has a first light sensor 10A formed on it and a terminal portion 40 mounted on it. The substrate 21-1 is connected to the first end portion 71 of the flexible printed circuit board 70 by connecting the connection portion on the first surface 70A of the flexible printed circuit board 70 to the terminal portion 40. As shown in Figure 11, the flexible printed circuit board 70 is bent at the bending portion 73, and the other end portion 21B of the substrate 21-1 is brought closer to the light source 60, and the first light sensor 10A of the substrate 21-1 is positioned on the first surface 70A of the flexible printed circuit board 70 so that it is adjacent to the light source 60. In the example shown in Figure 11, the substrate 21-1 covers the mounting area 73A on the first surface 70A of the flexible printed circuit board 70, and the other end 21B is positioned adjacent to the light source 60. The battery 300 is electrically connected to the flexible printed circuit board 70 at its second end 72. The substrate 21-1, the flexible printed circuit board 70, and the battery 300 are housed in a mold in a ring shape, and a filling material is filled around them to form a housing 200, thus housing them inside the housing 200. As a result, the detection device 1 is formed as a device in which the flexible printed circuit board 70 is bent and the substrate 21-1, in which the first light sensor 10A is positioned adjacent to the light source 60, the flexible printed circuit board 70, and the battery 300 are housed in the housing 200.

[0066] [Example of detection device operation] Next, an example of detection by the detection device 1 attached to finger Fg will be described. The detection device 1 is located on the inner surface of the first housing 210 of the housing 200. 200B The first light sensor 10A is in contact with or close to the finger Fg. The detection device 1 operates the first light sensor 10A by supplying power from the battery 300 to the upper electrode 15 of the first light sensor 10A via the terminal 40. The detection device 1 turns on the light source 60 so that the light source 60 is directed towards the finger Fg. Light The light source 60 irradiates light to one side and the other side in the circumferential direction 200C. The detection device 1 receives the light reflected by the finger Fg, etc., with the first light sensor 10A. The detection device 1 detects biological information about the finger Fg based on the amount of light received detected by each of the photodiodes PD of the first light sensor 10A.

[0067] In this way, the detection device 1 is connected to a substrate 21-1 having a first light sensor 10A and a flexible printed circuit board 70 via a terminal section 40. By bending the flexible printed circuit board 70, the first light sensor 10A on the substrate 21-1 is positioned adjacent to the light source 60 on the flexible printed circuit board 70. As a result, even if the detection device 1 connects the substrate 21-1 and the flexible printed circuit board 70 having a light source 60 as separate components in series, the size of the housing can be reduced by bending the flexible printed circuit board 70 to position the substrate 21-1. Consequently, the detection device 1 can easily mount multiple electronic components on the flexible printed circuit board 70 and improve the degree of freedom in the placement of the first light sensor 10A and the light source 60. Furthermore, even if multiple electronic components are mounted on the flexible printed circuit board 70, the detection device 1 can accommodate the first light sensor 10A and the light source 60 in an adjacent position without increasing the size of the housing 200.

[0068] (Embodiment 3) Figure 13 is an exploded view showing the front side of the substrate and an example of the flexible printed circuit board of Embodiment 3. Figure 14 is an exploded view showing the back side of the substrate and an example of the flexible printed circuit board of Embodiment 3. Figure 15 is an exploded view showing the flexible printed circuit board shown in Figure 14 in a folded state. Figure 16 is a side view of the substrate and flexible printed circuit board shown in Figure 15.

[0069] In Embodiment 3, the detection device 1 comprises the housing 200, substrate 21-1, terminal section 40, light source 60, first optical sensor 10A, and flexible printed circuit board 70 described above. The detection device 1 has a battery 300 connected to the flexible printed circuit board 70 located inside the housing 200, and is a device that operates using the power of the battery 300. The first optical sensor 10A and substrate 21-1 have the same configuration as the first optical sensor 10A and substrate 21-1 in Embodiment 2. The flexible printed circuit board 70 has a plurality of electronic components mounted on it. The electronic components include the control circuit 122 and power supply circuit 126 and control circuit 128 described above. In Embodiment 3, similar to Embodiments 1 and 2, the detection device 1 houses the terminal section 40, light source 60, first optical sensor 10A, flexible printed circuit board 70, and substrate 21-1 in a ring-shaped housing 200.

[0070] In Embodiment 3, as shown in Figures 13 and 14, the flexible printed circuit board 70 has the control circuit 122, power supply circuit 126, and control circuit 128 mounted on the first surface 70A on which the light source 60 is mounted, and no electronic components are mounted on the second surface 70B. On the first surface 70A of the flexible printed circuit board 70, nothing is mounted on the mounting area 73A, the light source 60 is mounted on the mounting area 73B, the control circuit 122 is mounted on the mounting area 73C, the control circuit 128 is mounted on the mounting area 73D, and the power supply circuit 126 is mounted on the mounting area 73E. The control circuit 128 includes a single circuit that combines the detection circuit 123, control circuit 124, and control circuit 125 described above.

[0071] The substrate 21-1 shown in Figures 13 and 14 is positioned adjacent to the light source 60, with the first end 71 of the flexible printed circuit board 70 being bent at the bending portion 73, thereby bringing the other end 21B of the substrate 21-1 closer to the light source 60 in the circumferential direction 200C of the housing 200. As shown in Figure 15, the substrate 21-1 is positioned near the light source 60 by bending the flexible printed circuit board 70 at the bending portion 73. The substrate 21-1 shown in Figure 16 may or may not be fixed to the flexible printed circuit board 70 by an adhesive member.

[0072] The flexible printed circuit board 70 shown in Figure 16 is housed inside the housing 200 such that the first surface 70A, on which the first light sensor 10A, light source 60, and electronic components are mounted, faces the inner surface 200B of the housing 200. If the flexible printed circuit board 70 is light-transmitting, it may also be mounted on the second surface 70B opposite to the first surface 70A on which the first light sensor 10A, light source 60, and electronic components are mounted. In this case, the light source 60 should be positioned to emit light toward the flexible printed circuit board 70, and the light transmitted through the flexible printed circuit board 70 should be emitted toward the outside of the housing 200.

[0073] Light emitted from the light source 60 is reflected by the surface of the object to be detected, such as a finger Fg, and enters the first light sensor 10A. This allows the detection device 1 to detect fingerprints by detecting the shape of the surface irregularities of the finger Fg. Alternatively, the light emitted from the light source 60 may be reflected inside the finger Fg or pass through the finger Fg before entering the first light sensor 10A. This allows the detection device 1 to detect biological information inside the finger Fg. This biological information includes, for example, pulse waves, pulse rate, and vascular patterns of the fingers or palm. In other words, the detection device 1 may be configured as a fingerprint detection device for detecting fingerprints, or as a vein detection device for detecting vascular patterns such as veins.

[0074] The above describes an example configuration of the detection device 1 according to Embodiment 3. Note that the above configuration described using Figures 13 to 16 is merely an example, and the configuration of the detection device 1 according to Embodiment 3 is not limited to this example. The configuration of the detection device 1 according to Embodiment 3 can be flexibly modified according to specifications and operation.

[0075] [Example of detection device assembly] Next, an assembly example of the detection device 1 according to Embodiment 3 will be described. As shown in Figures 13 and 14, the flexible printed circuit board 70 has a light source 60, a control circuit 122, a control circuit 128, and a power supply circuit 126 mounted on its first surface 70A. The substrate 21-1 has a first light sensor 10A formed on it and a terminal portion 40 mounted on it. The substrate 21-1 is connected to the first end portion 71 of the flexible printed circuit board 70 by connecting the connection portion on the first surface 70A of the flexible printed circuit board 70 to the terminal portion 40. As shown in Figure 15, the flexible printed circuit board 70 is bent at the bending portion 73, and the substrate 21-1 is positioned on the first surface 70A of the flexible printed circuit board 70 such that the first light sensor 10A of the substrate 21-1 is adjacent to the light source 60. In the example shown in Figure 15, the substrate 21-1 is positioned so that it covers the mounting area 73A on the first surface 70A of the flexible printed circuit board 70, and the other end portion 21B is adjacent to the light source 60. The flexible printed circuit board 70 is electrically connected to the battery 300 at its second end 72. The substrate 21-1, the flexible printed circuit board 70, and the battery 300 are housed in a mold in a ring shape, and a filling material is filled around them to form a housing 200, which then houses the components inside. As a result, the detection device 1 is formed as a device in which the flexible printed circuit board 70 is bent, the substrate 21-1 with the first light sensor 10A positioned adjacent to the light source 60, the flexible printed circuit board 70, and the battery 300 are housed in the housing 200.

[0076] [Example of detection device operation] Next, an example of detection by the detection device 1 attached to finger Fg will be described. The detection device 1 is located on the inner surface of the first housing 210 of the housing 200. 200BThe first light sensor 10A is in contact with or close to the finger Fg. The detection device 1 operates the first light sensor 10A by supplying power from the battery 300 to the upper electrode 15 of the first light sensor 10A via the terminal 40. The detection device 1 turns on the light source 60 so that the light source 60 is directed towards the finger Fg. Light The light source 60 irradiates light to one side and the other side in the circumferential direction 200C. The detection device 1 receives the light reflected by the finger Fg, etc., with the first light sensor 10A. The detection device 1 detects biological information about the finger Fg based on the amount of light received detected by each of the photodiodes PD of the first light sensor 10A.

[0077] In this way, the detection device 1 is connected to a substrate 21-1 having a first light sensor 10A via a terminal section 40, and the flexible printed circuit board 70 is bent so that the first light sensor 10A on the substrate 21-1 is positioned adjacent to the light source 60 on the flexible printed circuit board 70. As a result, even if the detection device 1 connects the separate components of the substrate 21-1 and the flexible printed circuit board 70 having the light source 60 in series, the size of the housing can be reduced by bending the flexible printed circuit board 70 to position the substrate 21-1. As a result, the detection device 1 can easily mount multiple electronic components and the light source 60 on the flexible printed circuit board 70, and the degree of freedom in the arrangement of the first light sensor 10A and the light source 60 can be increased. Furthermore, even if multiple electronic components are mounted on the flexible printed circuit board 70, the detection device 1 can house the first light sensor 10A and the light source 60 adjacent to each other without increasing the size of the housing 200.

[0078] Detection device 1 So multiple electronic components teeth The light source 60 is mounted on the first surface 70A of the flexible printed circuit board 70 on which the light source 60 is mounted. This allows the detection device 1 to further simplify the mounting of the flexible printed circuit board 70 by mounting the light source 60 and multiple electronic components on the first surface 70A of the flexible printed circuit board 70.

[0079] In the embodiments described above, the detection device 1 was described as housing the substrate 21, substrate 21-1, flexible printed circuit board 70, battery 300, etc., inside a ring-shaped housing 200, but it is not limited to this. The detection device 1 may also be configured to be housed in a rectangular housing, or to be attached to the object to be measured without being housed in a housing.

[0080] Each of the embodiments described above can be combined as appropriate. Furthermore, any other effects and advantages brought about by the embodiments described herein that are obvious from this specification or that can be appropriately conceived by those skilled in the art are naturally considered to be brought about by the present invention. [Explanation of Symbols]

[0081] 1. Detection device 10A First Light Sensor 10B Second Optical Sensor 11 Lower electrode 12. Lower buffer layer 13 Active layer 14. Upper buffer layer 15 Upper electrode 21,21-1 substrate 21A One end 21B The other end 22 Notch 23 Connecting part 24 Conductive materials 27 Insulating layer 40 Terminal section 60 light source 70 Flexible Printed Circuit Boards 70A 1st page 70B 2nd side 71 First end 72 Second end 73 Folding section 122, 124, 125 Control circuits 123 Detection Circuit 126 Power supply circuit 160 Encapsulation film 200 cabinets 200C Circumferential direction 210 First cabinet 220 Second enclosure 300 batteries Dx 1st direction Dy 2nd direction Fg finger PD photodiode

Claims

1. A substrate having a notch between both ends in the first direction, A terminal portion provided at one end of the substrate in the first direction, A first light sensor is provided on the substrate between the notch and the terminal portion, A second light sensor is provided on the substrate between the notch and the other end of the substrate, A flexible printed circuit board on which a light source and multiple electronic components are mounted, Equipped with, Each of the first and second optical sensors is constructed by laminating a lower electrode, a lower buffer layer, an active layer, an upper buffer layer, an upper electrode, and a sealing film on the substrate in that order. The lower electrodes of the first and second light sensors are electrically connected to the terminal portion. The terminal portion is connected to the first end of the flexible printed circuit board. The substrate is a flexible printed circuit board that has been bent, and is positioned so that the notch of the substrate overlaps with the light source. Detection device.

2. The first and second optical sensors share the same lower buffer layer, active layer, upper buffer layer, and upper electrode. The detection device according to claim 1.

3. A substrate having a light sensor, A terminal portion provided at one end of the substrate in the first direction, A flexible printed circuit board on which a light source and multiple electronic components are mounted, Equipped with, The aforementioned light sensor is constructed by stacking a lower electrode, a lower buffer layer, an active layer, an upper buffer layer, an upper electrode, and a sealing film on the substrate in that order. Each of the lower electrode and the upper electrode of the light sensor is electrically connected to the terminal portion. The terminal portion is connected to the first end of the flexible printed circuit board. The substrate is formed by bending the flexible printed circuit board, with the other end of the substrate in the first direction positioned adjacent to the light source. Detection device.

4. Multiple of the aforementioned electronic components are mounted on the side of the flexible printed circuit board opposite to the light source. The detection device according to claim 1 or 3.

5. Multiple of the aforementioned electronic components are mounted on the surface of the flexible printed circuit board on which the light source is mounted. The detection device according to claim 1 or 3.

6. The substrate and the flexible printed circuit board are housed in a ring-shaped enclosure. The detection device according to claim 1 or 3.

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