Connector device

Abstract

To readily release heat generated by an IC built-in a connector.SOLUTION: A connector device 1 comprises a circuit board 10, a connector 20 mounted on the circuit board 10, and a housing 70 storing at least a portion of each of the circuit board 10 and the connector 20. The connector 20 comprises a sub-board 35, and an IC 36 mounted on the sub-board 35, and a heat transfer part (for example, a heat dissipation sheet 39 and a shield cover 38) transmitting heat generated by the IC 36 to the housing 70.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] This disclosure relates to a connector device.

Background Art

[0002] Patent Document 1 discloses a connector for a substrate installed on a substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When incorporating an IC (Integrated Circuit) into this type of connector, heat generation of the IC becomes a problem.

[0005] An object of this disclosure is to provide a technique for easily releasing heat of an IC incorporated in a connector.

Means for Solving the Problems

[0006] The connector device of this disclosure includes a circuit board, a connector installed on the circuit board, and a housing that houses at least a part of the circuit board and the connector. The connector has a sub-board, an IC mounted on the sub-board, and a heat transfer part that transmits heat of the IC to the housing.

Effects of the Invention

[0007] According to the connector device of this disclosure, heat of an IC incorporated in the connector can be easily released.

Brief Description of the Drawings

[0008] [Figure 1] Figure 1 is a perspective view of the connector device according to the first embodiment. [Figure 2] Figure 2 is an exploded perspective view of a partially cut connector device. [Figure 3] Figure 3 is an exploded perspective view of the relay connector section. [Figure 4] Figure 4 is an exploded perspective view of the housing. [Figure 5] Figure 5 is a plan cross-sectional view of a connector device cut through a plane passing through the bolted fastening portion. [Figure 6] Figure 6 is a cross-sectional view taken along line AA in Figure 5. [Figure 7] Figure 7 is a cross-sectional view along line BB in Figure 5. [Figure 8] Figure 8 is a plan cross-sectional view of the connector device in the second embodiment, cut through a plane passing through the bolted fastening portion. [Figure 9] Figure 9 is a diagram corresponding to Figure 7 of the connector device in the third embodiment. [Figure 10] Figure 10 is a cross-sectional view along the CC line in Figure 9. [Figure 11] Figure 11 is a diagram corresponding to Figure 7 of the connector device in the fourth embodiment. [Figure 12] Figure 12 is a cross-sectional view along the DD line in Figure 11. [Figure 13] Figure 13 is a diagram corresponding to Figure 6 of the connector device in the fifth embodiment. [Figure 14] Figure 14 is a cross-sectional view along the EE line in Figure 13. [Modes for carrying out the invention]

[0009] [Description of Embodiments in this Disclosure] First, the embodiments of this disclosure will be listed and described.

[0010] [1] Circuit board and A connector installed on the circuit board, A housing that houses at least a part of the circuit board and the connector. The connector is a connector device having a sub-board, an IC mounted on the sub-board, and a heat transfer portion that transfers heat of the IC to the housing.

[0011] According to this configuration, the heat of the IC can be released to the housing through the heat transfer portion.

[0012] 〔2〕The connector has a shield cover that covers the IC. The shield cover is the connector device according to 〔1〕 that constitutes at least a part of the heat transfer portion.

[0013] According to this configuration, the heat of the IC can be released to the housing by using the shield cover that covers the IC.

[0014] 〔3〕The housing has an opening. The shield cover has an extended portion that extends to the outside of the housing through the opening, and a cover side overhanging portion that extends along the outer surface of the housing from the tip of the extended portion. The cover side overhanging portion is the connector device according to 〔2〕 that is fixed to the outer surface of the housing using bolts.

[0015] According to this configuration, the cover side overhanging portion can be fixed to the housing from the outside of the housing using bolts. As a result, the cover side overhanging portion is pressed against the housing, and heat is more easily transferred from the shield cover to the housing.

[0016] 〔4〕The connector has an outer conductor fixed to the outer surface of the housing. The outer conductor and the cover side overhanging portion are the connector device according to 〔3〕 that are fastened together to the outer surface of the housing using the bolts.

[0017] With this configuration, the shield cover can be pressed against the housing by utilizing the configuration that secures the outer conductor to the housing.

[0018] [5] The connector device according to [2], wherein the shield cover has an elastic contact piece that is elastically deformable and is positioned in a state pressed against the housing by the elastic force of the elastic contact piece.

[0019] In this configuration, the shield cover is pressed against the housing, making it easier for heat to transfer from the shield cover to the housing.

[0020] [6] The connector device according to [1], wherein the connector has an outer conductor that constitutes at least a part of the heat transfer section.

[0021] With this configuration, the outer conductor of the connector can be used to dissipate heat from the IC into the housing.

[0022] [7] The connector device according to any one of [1] to [6], wherein the heat transfer part is made of metal.

[0023] With this configuration, the heat from the IC is more easily transferred to the housing.

[0024] [8] The connector has a mounting connector portion that is mounted on the circuit board and a relay connector portion that is connected to the mounting connector portion, The connector device according to any one of [1] to [7], wherein the sub-board and the IC are provided in the relay connector section.

[0025] With this configuration, by preparing multiple relay connector sections with different types of ICs, it is possible to configure connectors that support multiple types of communication specifications depending on the type of relay connector section connected to the mounting connector section.

[0026] [Details of the embodiments of this disclosure] Specific examples of the present disclosure will be described below with reference to the drawings. However, the present invention is not limited to these examples and is intended to include all modifications within the meaning and scope equivalent to the claims as shown in the claims.

[0027] <First Embodiment> (Overview of Connector Device 1) Figure 1 discloses a connector device 1 according to a first embodiment. The connector device 1 is mounted, for example, on a vehicle. As shown in Figure 2, the connector device 1 comprises a circuit board 10, a connector 20 installed on the circuit board 10, and a housing 70 that houses at least a portion of the circuit board 10 and the connector 20.

[0028] In this embodiment, the side of the circuit board 10 on which the connector 20 is installed is defined as the upper side. The side to which a mating connector (not shown) is fitted to the connector 20 is defined as the front side. The direction perpendicular to the vertical and front-to-back directions is defined as the width direction. In the drawings, the upper, lower, front, and rear are denoted as "U," "L," "F," and "B," respectively.

[0029] (Circuit board 10) As shown in Figure 2, the circuit board 10 is plate-shaped. The thickness direction of the circuit board 10 is vertical. A mounting surface 11 is formed on the circuit board 10. The mounting surface 11 is formed on the upper surface of the circuit board 10.

[0030] (Connector 20) Connector 20 is a board connector installed on the circuit board 10. As shown in Figure 2, connector 20 has a mounting connector section 21 that is mounted on the circuit board 10 and a relay connector section 22 that is connected to the mounting connector section 21.

[0031] As shown in Figure 2, the mounting connector section 21 is configured, for example, as a card edge connector. A relay connector section 22 is detachably connected to the mounting connector section 21. An insertion groove is formed on the front surface of the mounting connector section 21. The relay connector section 22 is connected to the mounting connector section 21 by being inserted into this insertion groove from the front.

[0032] A mating connector (not shown) is connected to the relay connector section 22. Multiple types of relay connector sections 22 are prepared in advance, depending on factors such as the number of devices mounted on the vehicle and the communication specifications (e.g., communication speed). By connecting the relay connector section 22 corresponding to the specifications of the vehicle to be mounted to the mounting connector section 21, the connector device 1 becomes compatible with multiple types of vehicles.

[0033] As shown in Figure 3, the relay connector section 22 includes a mating member 31, an inner conductor 32, an outer conductor 33, a dielectric 34, a sub-board 35, an IC (Integrated Circuit) 36, a relay section 37, a shield cover 38, a heat dissipation sheet 39, a first fixing member 40A, and a second fixing member 40B.

[0034] As shown in Figure 3, the mating member 31 mates with a mating connector (not shown). The mating member 31 is insulating and is made of, for example, resin. The mating member 31 has a rectangular tubular hood portion 31A and a rear wall portion 31B that covers the rear surface of the hood portion 31A.

[0035] The inner conductor 32 is conductive and, for example, made of metal. As shown in Figure 3, the inner conductor 32 has a shape that extends in the front-rear direction. Multiple inner conductors 32 are provided at intervals in a direction perpendicular to the front-rear direction. As shown in Figure 6, the front end of the inner conductor 32 protrudes into the hood portion 31A, and the rear end of the inner conductor 32 protrudes behind the rear wall portion 31B. The inner conductor 32 is electrically connected to the conductive path of the sub-board 35 via the relay portion 37.

[0036] The outer conductor 33 is conductive and, for example, made of metal. As shown in Figure 3, the outer conductor 33 has a first outer conductor member 41 and a second outer conductor member 42. The second outer conductor member 42 is connected to the first outer conductor member 41 by being locked to it.

[0037] The first outer conductor member 41 covers the outer circumference of the inner conductor 32. The first outer conductor member 41 has a wall portion 43 that has thickness in the front-rear direction. An inner conductor insertion hole 44 is formed in the wall portion 43 through which the inner conductor 32 is inserted. The first outer conductor member 41 has a cylindrical portion 45 that protrudes forward in a cylindrical shape from the peripheral edge of the inner conductor insertion hole 44. The cylindrical portion 45 penetrates the rear wall portion 31B of the fitting member 31 and protrudes into the hood portion 31A. As shown in Figure 5, the first outer conductor member 41 has an outer conductor side overhang 46 that is fixed to the housing 70. The outer conductor side overhang 46 protrudes from the upper and lower centers on both sides in the width direction of the wall portion 43 to both sides in the width direction. The outer conductor side overhang 46 spreads along the outer surface 70A of the housing 70. A through hole 46A is formed in the outer conductor side overhang 46 through which a bolt 80 passes. The outer conductor side protrusion 46 is fixed to the housing 70 using bolts 80. As shown in Figure 3, the first outer conductor member 41 has a locking portion 47 that locks the second outer conductor member 42. The locking portion 47 is located behind the wall portion 43.

[0038] The second outer conductor member 42 is locked to the locking portion 47 and positioned behind the first outer conductor member 41. As shown in Figures 3 and 6, the second outer conductor member 42 has an outer conductor bottom portion 48 and mounting portions 49 that rise upward from both sides of the outer conductor bottom portion 48 in the width direction. The outer conductor bottom portion 48 is plate-shaped. The thickness direction of the outer conductor bottom portion 48 is vertical. The sub-substrate 35 is mounted so as to be supported by the mounting portions 49 on both sides in the width direction. The second outer conductor member 42 and the sub-substrate 35 are fixed to the circuit board 10 by the first fixing member 40A described above. The first fixing member 40A includes a male screw portion 40C, a head portion 40D provided at the base end of the male screw portion 40C, and a female screw portion 40E recessed at the base end of the head portion 40D. The male threaded portion 40C is inserted from above into the insertion hole 35A of the sub-board 35 and the insertion hole 48A of the bottom portion 48 of the outer conductor, and is screwed into the mounting hole 10A of the circuit board 10 and tightened. This fixes the sub-board 35 and the second outer conductor member 42 to the circuit board 10.

[0039] As shown in Figure 6, the dielectric 34 is positioned between the inner conductor 32 and the outer conductor 33.

[0040] As shown in Figure 6, the sub-board 35 is plate-shaped. The sub-board 35 is arranged in parallel with the circuit board 10. The thickness direction of the sub-board 35 is vertical. The sub-board 35 is a board built into the connector 20. The sub-board 35 is detachably connected to the mounting connector section 21. As shown in Figure 5, the sub-board 35 has a sub-board body 51 and a sub-ground circuit 52.

[0041] The sub-board body 51 is, Figures 5 and 6 As shown, it is plate-shaped. The sub-sub-substrate body 51 is insulating and is made of, for example, resin. A sub-mounting surface 53 is formed on the sub-sub-substrate body 51. The sub-mounting surface 53 is formed on the upper surface of the sub-substrate body 51.

[0042] As shown in Figures 5 and 7, the sub-ground circuit 52 is provided on the sub-board body 51 (more specifically, the sub-mounting surface 53). The IC 36 mounted on the sub-mounting surface 53 is electrically connected to the sub-ground circuit 52. The sub-ground circuit 52 has sub-extension circuits 54 that extend in the front-to-back direction along the sub-mounting surface 53. Multiple sub-extension circuits 54 are provided at intervals in the width direction.

[0043] IC36 has a structure in which the IC chip is molded in resin. As shown in Figure 6, IC36 is mounted on the sub-mounting surface 53 (top surface) of the sub-board 35.

[0044] The shield cover 38 is conductive and, for example, made of metal. The shield cover 38 is formed, for example, by bending a metal plate. As shown in Figures 3 and 5, the shield cover 38 has a cover body 38A, a pair of extensions 38B, and a pair of cover-side overhangs 38C. The cover body 38A covers the IC 36 from above. The cover body 38A also covers the IC 36 in the front-rear and width directions. The pair of extensions 38B extend forward from both sides of the cover body 38A in the width direction. The pair of cover-side overhangs 38C extend outwards from the front ends of the pair of extensions 38B in the width direction.

[0045] The heat dissipation sheet 39 is made of a resin such as silicone or acrylic. As shown in Figure 6, the heat dissipation sheet 39 is positioned sandwiched between the IC 36 and the shield cover 38, one above the other. The heat dissipation sheet 39 is positioned in contact with the IC 36 and the shield cover 38.

[0046] As shown in Figure 3, the second fixing member 40B includes a male threaded portion 40F and a head 40G provided at the base end of the male threaded portion 40F. As shown in Figure 6, the male threaded portion 40F is inserted from above into the insertion hole 38D of the shield cover 38 and screwed into the female threaded portion 40E of the first fixing member 40A and tightened. This fixes the shield cover 38 to the sub-substrate 35.

[0047] (Housing 70) The housing 70 is conductive and, for example, made of metal. The housing 70 is box-shaped, as shown in Figure 1. The housing 70 houses a portion of the circuit board 10 and the connector 20, as shown in Figures 2 and 6. The housing 70 has an opening 71. The relay connector portion 22 is inserted into the housing 70 through the opening 71 and connected to the mounted connector portion 21 mounted on the circuit board 10.

[0048] As shown in Figure 4, the housing 70 has a housing body 72 and a cover 73. The housing body 72 houses the circuit board 10 and a portion of the connector 20. A board insertion opening 74 is formed in the housing body 72. The circuit board 10 is inserted into the housing body 72 through the board insertion opening 74.

[0049] As shown in Figures 1 and 4, the cover 73 covers the substrate insertion opening 74. The cover 73 is fixed to the housing body 72. The cover 73 is fixed to the housing body 72 using housing bolts 75. Multiple (four in this embodiment) housing bolts 75 are inserted through multiple (four in this embodiment) insertion holes 76 in the cover 73 and screwed into housing-side mounting holes 77 in the housing body 72 and tightened. The cover 73 is provided with the aforementioned opening 71.

[0050] The relay connector portion 22, inserted through the opening 71, is fixed to the outer surface 70A of the housing 70 using bolts 80, as shown in Figure 5. Mounting holes 78 are formed in the outer surface 70A of the housing 70. The mounting holes 78 are provided on both sides in the width direction of the opening 71. A pair of cover-side protrusions 38C of the shield cover 38 are positioned behind a pair of outer conductor-side protrusions 46. Each cover-side protrusion 38C has a through hole 38E that penetrates the cover-side protrusion 38C in the front-rear direction. Each outer conductor-side protrusion 46 has a through hole 46A that penetrates the outer conductor-side protrusion 46 in the front-rear direction. The through holes 38E and 46A are positioned side by side in the front-rear direction. The bolts 80 pass through the through holes 46A and 38E and are screwed into the mounting holes 78 and tightened. As a result, the outer conductor 33 and the cover-side protrusion 38C are fastened together to the outer surface 70A of the housing 70.

[0051] (Operation and effects of connector device 1) As shown in Figure 6, the heat dissipation sheet 39 is in contact with the IC 36, and the shield cover 38 is in contact with the heat dissipation sheet 39. As shown in Figure 5, the extended portion 38B of the shield cover 38 extends to the outside of the housing 70 through the opening 71. The cover-side overhang 38C that protrudes from the extended portion 38B is fixed to the outer surface of the housing 70 using bolts 80. As a result, the heat from the IC 36 is transferred to the housing 70 via the heat dissipation sheet 39 and the shield cover 38. Therefore, with this configuration, the heat from the IC 36 can be dissipated to the housing 70 via the heat dissipation sheet 39 and the shield cover 38. In addition, because the cover-side overhang 38C is fixed to the housing 70 using bolts 80, the cover-side overhang 38C is pressed against the housing 70. As a result, heat is more easily transferred from the shield cover 38 to the housing 70. Moreover, the cover-side overhang 38C is fastened together with the outer conductor 33 to the housing 70. In other words, with this configuration, the shield cover 38 can be pressed against the housing 70 by utilizing the configuration that fixes the outer conductor 33 to the housing 70.

[0052] Furthermore, IC36 is electrically connected to the sub-ground circuit 52. As shown in Figure 7, the sub-extension circuit 54 of the sub-ground circuit 52 is electrically connected to the cover body 38A of the shield cover 38. As shown in Figure 6, the shield cover 38 is electrically connected to the housing 70 by fixing the cover-side protrusion 38C to the housing 70 using bolts 80. Therefore, the heat from IC36 is transferred to the housing 70 via the sub-ground circuit 52 and the shield cover 38. Thus, with this configuration, the heat from IC36 can be dissipated to the housing 70 via the sub-ground circuit 52 and the shield cover 38. Moreover, the sub-ground circuit 52 and the shield cover 38 are made of metal. Therefore, the heat from IC36 is transferred to the housing 70 even more easily.

[0053] <Second Embodiment> In the second embodiment, a configuration in which the shield cover is in contact with the inner surface of the housing will be described. In the description of the second embodiment, the same reference numerals will be used for the same components as in the first embodiment, and detailed explanations will be omitted.

[0054] As shown in Figure 8, the connector device 201 of the second embodiment includes a shield cover 238 instead of the shield cover 38 of the first embodiment. The connector device 201 of the second embodiment is otherwise the same as the connector device 1 of the first embodiment.

[0055] The shield cover 238 is conductive and, for example, made of metal. The shield cover 238 is formed, for example, by bending a metal plate. The shield cover 238 has a cover body 38A, a pair of arm portions 238B, and a pair of elastic contact pieces 238C. The pair of arm portions 238B extend forward from both sides in the width direction of the cover body 38A. The pair of elastic contact pieces 238C are folded outward in the width direction from the tips of the pair of arm portions 238B. Each elastic contact piece 238C is cantilevered to each arm portion 238B and deforms by bending in the width direction with each arm portion 238B as a fulcrum.

[0056] The shield cover 238 is inserted into the opening 71 of the housing 70 with a pair of elastic contact pieces 238C bent inward in the width direction. When the shield cover 238 is inserted into the opening 71, the pair of elastic contact pieces 238C deform by elastic force to spread outward in the width direction, pressing against the inner circumferential surface of the opening 71. In other words, the elastic contact pieces 238C are pressed against the inner surface 70B of the housing 70.

[0057] As described above, in the connector device 201 of the second embodiment, the elastic contact piece 238C of the shield cover 238 is in contact with the inner surface 70B of the housing 70. With this configuration, the heat from the IC 36 transmitted to the shield cover 238 can be dissipated to the housing 70. Moreover, the elastic contact piece 238C is positioned in a state where it is pressed against the housing 70 by the elastic force of the elastic contact piece 238C. With this configuration, heat is more easily transferred from the shield cover 238 to the housing 70.

[0058] <Third Embodiment> In the third embodiment, other configurations for bringing the shield cover into contact with the inner surface of the housing will be described. In the description of the third embodiment, the same reference numerals will be used for the same components as in the first embodiment, and detailed explanations will be omitted.

[0059] The connector device 301 of the third embodiment, as shown in Figure 9, comprises a circuit board 10, a connector 320 installed on the circuit board 10, and a housing 370 that accommodates the circuit board 10 and a part of the connector 320. The connector 320 differs from the connector 20 of the first embodiment in that it has a shield cover 338 instead of a shield cover 38, but is otherwise common. The housing 370 differs from the housing 70 of the first embodiment in that its top wall 371 is stepped, but is otherwise common.

[0060] The shield cover 338 is conductive and, for example, made of metal. The shield cover 338 is formed, for example, by bending a metal plate. The shield cover 338 covers the IC 36 from above, as shown in Figures 9 and 10. The shield cover 338 has a front plate portion 340, a rear plate portion 341, a pair of side plate portions 342, a top plate portion 343, and a protruding portion 344. The front plate portion 340 covers the front side of the IC 36. The rear plate portion 341 covers the rear side of the IC 36. The pair of side plate portions 342 cover the IC 36 It covers both sides in the width direction. The top plate portion 343 covers the upper side of IC36. The top plate portion 343 is connected to the upper ends of the front plate portion 340, the rear plate portion 341, and the pair of side plate portions 342. The protrusions 344 protrude upward from the top plate portion 343. The protrusions 344 are provided on both sides in the width direction of the top plate portion 343. The protrusions 344 are formed, for example, by cutting and bending a metal plate.

[0061] The top wall 371 of the housing 370 has a first top wall portion 372, a second top wall portion 373, and a stepped portion 374. The second top wall portion 373 is connected to the first top wall portion 372 via the stepped portion 374 and is positioned lower than the first top wall portion 372. A protruding portion 344 is in contact with the lower surface of the second top wall portion 373. In other words, the shield cover 338 is in contact with the inner surface 370B of the housing 370.

[0062] As shown in Figure 9, a heat dissipation sheet 39 is sandwiched between the top plate portion 343 of the shield cover 338 and the IC 36. The heat dissipation sheet 39 is positioned in contact with the top plate portion 343 of the shield cover 338 and the IC 36. Heat from the IC 36 is transferred to the shield cover 338 via the heat dissipation sheet 39.

[0063] As shown in Figure 9, the front plate portion 340 of the shield cover 338 is electrically connected to the sub-ground circuit 52. Therefore, the heat from IC 36 is transferred to the shield cover 338 via the sub-ground circuit 52.

[0064] The heat transferred to the shield cover 338 is then transferred to the housing 370 from the protrusion 344. In other words, according to the connector device 301 of the third embodiment, the heat can be dissipated to the inner surface 370B of the housing 370 using the shield cover 338.

[0065] <Fourth Embodiment> In the fourth embodiment, a configuration is described that allows heat from the IC to be dissipated to the housing without using a shield cover. In the description of the fourth embodiment, the same reference numerals are used for the same components as in the first embodiment, and detailed explanations are omitted.

[0066] The connector device 401 of the fourth embodiment, as shown in Figure 11, comprises a circuit board 10, a connector 420 installed on the circuit board 10, and a housing 470 that accommodates the circuit board 10 and a part of the connector 420. The connector 420 differs from the connector 20 of the first embodiment in that it has a conductive member 440 instead of a shield cover 38, but is otherwise common. The housing 470 differs from the housing 70 of the first embodiment in that its top wall 471 is stepped, but is otherwise common.

[0067] The top wall 471 of the housing 470 has a first top wall section 472, a second top wall section 473, and a stepped section 474. The second top wall section 473 is connected to the first top wall section 472 via the stepped section 474 and is positioned lower than the first top wall section 472.

[0068] As shown in Figure 12, the conductive members 440 are provided on each of the sub-extension circuits 54 on both sides in the width direction. Each conductive member 440 is positioned between the sub-ground circuit 52 of the sub-substrate 35 and the second top wall portion 473, and is electrically connected to the sub-ground circuit 52 and the second top wall portion 473. The conductive member 440 has a contact conductive portion 441 that contacts the second top wall portion 473, a biasing member 442 positioned between the contact conductive portion 441 and the sub-ground circuit 52, and a guide portion 443 that guides the contact conductive portion 441 in the vertical direction. The biasing member 442 is, for example, a spring member, and biases the contact conductive portion 441 away from the sub-ground circuit 52. The contact conductive portion 441 is pressed against the second top wall portion 473. In other words, the conductive member 440 is pressed against the sub-ground circuit 52 and the inner surface 470B of the housing 470.

[0069] As described above, in the connector device 401 of the fourth embodiment, IC36 is electrically connected to the sub-ground circuit 52. A conductive member 440 is in contact with the sub-ground circuit 52, and the housing 70 is in contact with the conductive member 440. With this configuration, the heat from IC36 can be dissipated to the housing 470 via the sub-ground circuit 52 and the conductive member 440. Moreover, the conductive member 440 is pressed against the sub-ground circuit 52 and the housing 470. With this configuration, the heat from IC36 is more easily transferred to the housing 470 via the sub-ground circuit 52 and the conductive member 440.

[0070] <Fifth Embodiment> In the fifth embodiment, a configuration is described in which the heat of the IC can be dissipated to the housing using the outer conductor of the connector. In the description of the fifth embodiment, the same reference numerals are used for the same components as in the first embodiment, and detailed explanations are omitted.

[0071] As shown in Figure 13, the connector device 501 of the fifth embodiment comprises a circuit board 10, a connector 520 installed on the circuit board 10, and a housing 70 that accommodates the circuit board 10 and a part of the connector 520.

[0072] Connector 520 differs from connector 20 of the first embodiment in that it includes a sub-board 535 instead of sub-board 35, a heat dissipation sheet 539 instead of heat dissipation sheet 39, and the outer conductor side protrusion 46 of the outer conductor 33 is fixed to the housing 70 independently. different Connector 520 is otherwise identical to connector 20 of the first embodiment.

[0073] As shown in Figures 13 and 14, the sub-board 535 has a sub-board body 51 and a sub-ground circuit 552. The sub-ground circuit 552 is provided on the sub-board body 51 (more specifically, on the sub-mounting surface 53). The IC 36 mounted on the sub-mounting surface 53 is electrically connected to the sub-ground circuit 552. The sub-ground circuit 552 has sub-extension circuits 554 that extend in the front-to-back direction along the sub-mounting surface 53. Multiple sub-extension circuits 554 are provided at intervals in the width direction. The sub-extension circuits 554 are provided on both the upper and lower surfaces of the sub-board body 51. The sub-extension circuits 554 on both the upper and lower surfaces are electrically connected via vias 555 that penetrate the sub-board body 51 in the thickness direction.

[0074] The heat dissipation sheet 539 is provided between the sub-extension circuit 554, which is located on the lower surface of the sub-board body 51, and the upper surface of the outer conductor bottom 48 of the outer conductor 33, and is in contact with the sub-extension circuit 554 and the outer conductor bottom 48.

[0075] The outer conductor side protruding portion 46 of the outer conductor 33 is fixed to the housing 70 using bolts 80 (see Figure 8). As a result, the outer conductor 33 is pressed against the housing 70 and in contact with the housing 70.

[0076] As described above, in the connector device 501 of the fifth embodiment, IC36 is electrically connected to the sub-ground circuit 552. The sub-ground circuit 552 is in contact with the heat dissipation sheet 539, and the heat dissipation sheet 539 is in contact with the outer conductor 33. The outer conductor 33 is in contact with the housing 70. With this configuration, the heat from IC36 can be dissipated to the housing 70 via the sub-ground circuit 552, the heat dissipation sheet 539, and the outer conductor 33. Moreover, the outer conductor side protrusion 46 of the outer conductor 33 is pressed against the housing 70. With this configuration, the heat from the outer conductor 33 is more easily transferred to the housing 70.

[0077] [Other embodiments of this disclosure] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. (1) In each of the above embodiments, the connector was configured with a mounting connector section and a relay connector section as separate components, but it may also be configured with the mounting connector section and the relay connector section as an integrated unit. [Explanation of Symbols]

[0078] 1…Connector device 10... Circuit board 10A…Mounting hole 11…Implementation aspects 20… Connector 21…Implementation connector section 22…Relay connector section 31… Fitting member 31A... Hood section 31B…Rear wall part 32...Inner conductor 33…Outer conductor 34… Dielectric 35…Sub-board 35A…Through hole 37…Relay section 38...Shield cover 38A...Cover body 38B…Extension part 38C...Cover side protrusion 38D…Through hole 38E…Through hole 39… Heat dissipation sheet 40A…First fixing member 40B...Second fixing member 40C...Male threaded section 40D…Head 40E...Female thread section 40F...Male threaded section 40G…Head 41…First outer conductor member 42...Second outer conductor member 43...Wall part 44…Inner conductor insertion hole 45...Cylinder part 46... Outer conductor side overhang 46A...Through hole 47... Locking part 48...Bottom of the outer conductor 48A…Through hole 49… Mounting section 51…Sub-board main unit 52... Subground circuit 53…Sub-implementation aspects 54... Sub-extension circuit 70… Housing 70A…External surface 70B...Inner 71…Opening 72… Housing body 73...cover 74... Circuit board insertion slot 75… Housing bolts 76…Through hole 77…Mounting holes on the housing side 78…Mounting holes 80 volts 201…Connector device 238... Shield cover 238B...Arm section 238C...Elastic contact piece 301…Connector device 320… Connector 338... Shield cover 340…Front plate part 341...Rear plate part 342...Side plate part 343... Top panel 344...Protrusion 370… Housing 370B...Inner surface 371...Ceiling 372...First ceiling section 373...Second ceiling section 374... Step section 401…Connector device 420… Connector 440... Conductive material 441...Contact conductive part 442… Biasing member 443... Guide Section 470… Housing 470B...Inner surface 471...Ceiling 472...First ceiling section 473...Second ceiling section 474... Step section 501…Connector device 520… Connector 535... Sub-board 539... Heat dissipation sheet 552... Sub-ground circuit 554...Sub-extension circuit 555... Beer

Claims

1. Circuit board and A connector installed on the circuit board, The system comprises a housing that accommodates at least a portion of the circuit board and the connector, The connector comprises a sub-board, an IC mounted on the sub-board, a heat transfer unit that transmits heat from the IC to the housing, and a shield cover that covers the IC. The shield cover constitutes at least a part of the heat transfer section, The housing has an opening, The shield cover has an extension portion that extends to the outside of the housing through the opening, and a cover-side overhang portion that extends from the tip of the extension portion along the outer surface of the housing, The cover-side protrusion is a connector device fixed to the outer surface of the housing using bolts.

2. The connector has an outer conductor fixed to the outer surface of the housing, The connector device according to claim 1, wherein the outer conductor and the cover-side protrusion are fastened together with the outer surface of the housing using the bolt.

3. The connector device according to claim 1, wherein the shield cover has an elastically deformable elastic contact piece and is positioned in a state pressed against the housing by the elastic force of the elastic contact piece.

4. A circuit board and A connector installed on the circuit board, The system comprises a housing that accommodates at least a portion of the circuit board and the connector, The connector comprises a sub-board, an IC mounted on the sub-board, a heat transfer unit that transmits heat from the IC to the housing, and a shield cover that covers the IC. The shield cover constitutes at least a part of the heat transfer section, Furthermore, the shield cover has a top plate portion that covers the side of the IC opposite to the sub-board side, and a protruding portion that extends from the top plate portion toward the side opposite to the IC side. The aforementioned protrusion is a connector device that contacts the top wall of the housing.

5. A circuit board and A connector installed on the circuit board, The system comprises a housing that accommodates at least a portion of the circuit board and the connector, The connector comprises a sub-board, an IC mounted on the sub-board, a heat transfer unit that transmits heat from the IC to the housing, and a conductive member disposed between the sub-ground circuit of the sub-board and the top wall of the housing, and in contact with the sub-ground circuit and the top wall. The conductive member has a contact conductive portion that contacts the top wall portion, a biasing member disposed between the contact conductive portion and the sub-ground circuit, and a guide portion that guides the contact conductive portion. The biasing member is a connector device that biases the contact conductive portion away from the sub-ground circuit.

6. The connector device according to any one of claims 1 to 5, wherein the connector has an outer conductor that constitutes at least a part of the heat transfer section.

7. The connector device according to any one of claims 1 to 5, wherein the heat transfer section is made of metal.

8. The connector comprises a mounting connector portion that is mounted on the circuit board and a relay connector portion that is connected to the mounting connector portion. The connector device according to any one of claims 1 to 5, wherein the sub-board and the IC are provided in the relay connector portion.

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