Substrate processing apparatus and substrate processing method

Abstract

To make the thickness of a processing liquid supplied to a substrate processing surface uniform while suppressing the consumption amount of the processing liquid.SOLUTION: A substrate processing apparatus 100 includes a substrate support portion that supports a substrate W having at least a circular outer circumference, a processing liquid nozzle having a slit-shaped discharge port 151a, a nozzle moving portion configured to be able to move the processing liquid nozzle while discharging the processing liquid in a state where the discharge port 151a is parallel to the substrate processing surface Wp of the substrate supported by the substrate support portion, a first movable member having a first side inner edge that is accessible to a first side outer edge, a second movable member having a second side inner edge that is accessible to a second side outer edge, and a drive portion that moves the first and second movable members such that the first and second side inner edges are close to the first and second side outer edges, respectively.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method.

Background Art

[0002] A substrate processing apparatus is used to perform various processes on substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates. As an example of a substrate processing apparatus, Patent Document 1 describes a rotary substrate processing apparatus for forming a resist film on a substrate.

[0003] In a rotary substrate processing apparatus, a resist film is formed on a substrate by utilizing the centrifugal force of the rotating substrate (hereinafter referred to as spin coating). In this case, since the resist liquid supplied onto the substrate scatters outward, it is known that the amount of the resist film actually formed on the substrate is about 30% of the resist liquid supplied onto the substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Therefore, in order to efficiently use processing liquids such as resist liquids, a method has been proposed that uses a processing liquid nozzle (slit nozzle) having a slit-shaped discharge port. In this method, the processing liquid is supplied to the substrate by discharging the processing liquid from the slit-shaped discharge port of the processing liquid nozzle while the processing liquid nozzle moves parallel to the upper surface of the substrate (hereinafter referred to as slit coating). However, with slit coating, the thickness of the processing liquid supplied to the upper surface of the substrate (hereinafter referred to as the substrate processing surface) may be uneven in some cases.

[0006] The object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can reduce the consumption of processing liquid while making the thickness of the processing liquid supplied to the substrate processing surface uniform. [Means for solving the problem]

[0007] (1) The substrate processing apparatus is A substrate support portion that supports a substrate having at least a part of a circular outer periphery; a processing liquid nozzle having a slit-shaped discharge port for discharging processing liquid; a nozzle moving portion configured to move the processing liquid nozzle so that, in a first view perpendicular to the substrate processing surface, the discharge port reaches a second outer position on the other side of the substrate, passing from a first outer position on one side of the substrate, through a first end of the substrate, the center of the substrate, and a second end of the substrate opposite to the first end of the substrate; a first movable member having a first inner edge of a side that can approach the outer edge of a first side, which includes a first side that is the intersection of a virtual line perpendicular to the direction of movement of the processing liquid nozzle and passing through the center of the substrate processing surface and the outer periphery; and a second side, which is disposed separately from the first movable member and includes a second side, which is the other intersection of the virtual line and the outer periphery on the substrate processing surface. The first movable member comprises a second movable member having a second inner side edge that can approach the outer edge of the part, and a drive unit that moves the first and second movable members such that the inner side edges of the first and second side edges approach the outer side edges of the first and second side, respectively, during the period when the discharge port of the processing liquid nozzle passes the outer side edges of the first and second side of the substrate, wherein the upper surface of the first movable member has a first region extending from a position that can approach the first side to a position that can approach the first end, and the first The upper surface of the second movable member includes a second region extending from a position accessible to the side toward a position accessible to the second end, and the upper surface of the second movable member includes a third region extending from a position accessible to the second side toward a position accessible to the first end, and a fourth region extending from a position accessible to the second side toward a position accessible to the second end, the first and third regions being formed of a water-repellent material, and the second and fourth regions being formed of a hydrophilic material. .

[0008] According to this substrate processing apparatus, with the substrate supported by the substrate support, the processing liquid nozzle moves from a first outer position, passing through the first edge of the substrate, the center of the substrate, and the second edge opposite the first edge of the substrate, while discharging processing liquid from a slit-shaped discharge port, to a second outer position. As the processing liquid nozzle moves with the processing liquid held in a strip between the discharge port of the processing liquid nozzle and the substrate processing surface, a film of processing liquid is formed on the substrate processing surface. If the above-mentioned first and second movable members are not provided, as the processing liquid nozzle progresses from the first edge of the substrate to the center of the substrate, the length of the portion of the discharge port that overlaps with the substrate processing surface gradually increases. Therefore, as the length of the strip of processing liquid held between the slit-shaped discharge port of the processing liquid nozzle and the substrate processing surface increases, a shortage of processing liquid occurs at both ends of the strip of processing liquid. As a result, the thickness of the processing liquid in the region along the outer periphery of the substrate decreases. Subsequently, as the processing liquid nozzle progresses from the center of the substrate to the first edge, the length of the portion of the discharge port that overlaps with the substrate processing surface gradually decreases. Therefore, when the length of the strip-shaped processing liquid held between the slit-shaped discharge port of the processing liquid nozzle and the substrate processing surface decreases, excess processing liquid occurs at both ends of the strip-shaped processing liquid. As a result, the thickness of the processing liquid in the region along the outer periphery of the substrate increases.

[0009] In contrast, with the above configuration, during the period when the processing liquid nozzle passes the first and second outer side edges of the substrate, the first and second inner side edges of the first and second movable members come into close proximity to the first and second outer side edges of the substrate. As a result, the slit-shaped discharge port of the processing liquid nozzle overlaps the first movable member, the substrate processing surface, and the second movable member. In this case, both ends of the strip-shaped processing liquid held between the first movable member, the substrate processing surface, the second movable member, and the slit-shaped discharge port of the processing liquid nozzle are located on the first movable member and the second movable member, respectively. As a result, even if the thickness of the processing liquid on the first and second movable members becomes uneven, the thickness of the processing liquid in the region along the first and second outer side edges of the substrate processing surface becomes uniform.

[0010] Furthermore, since the substrate is stationary, the processing solution does not splash into the surrounding area. This makes it possible to reduce the consumption of the processing solution while making the thickness of the processing solution supplied to the substrate processing surface more uniform. Furthermore, as the processing liquid nozzle advances, the length of the discharge port portion overlapping the substrate processing surface gradually increases, making it easier for the processing liquid on the first and third regions of the first and second movable members to flow onto the substrate processing surface. This compensates for any shortage of processing liquid on the substrate processing surface. Also, as the processing liquid nozzle advances, the length of the discharge port portion overlapping the substrate processing surface gradually decreases, making it easier for the processing liquid on the substrate processing surface to flow onto the second and fourth regions of the first and second movable members. This suppresses the generation of excess processing liquid on the substrate processing surface. As a result, it becomes possible to make the thickness of the processing liquid supplied to the substrate processing surface more uniform.

[0011] (2) The drive unit may move the first and second movable members such that the inner edges of the first and second sides are separated from the outer edges of the first and second sides after the discharge port has passed the outer edges of the first and second sides.

[0012] In this case, the processing liquid supplied to the substrate processing surface is sufficiently prevented from flowing into the space between the first inner edge and the first outer edge of the side and between the second inner edge and the second outer edge of the side due to capillary action.

[0013] (3) The distance between the first inner edge of the side and the first outer edge of the side, and the distance between the second inner edge of the side and the second outer edge of the side, when the first and second inner edges of the side are in close proximity to the first and second outer edges of the side, may be set so that the processing liquid does not flow between the first inner edge of the side and the first outer edge of the side, and between the second inner edge of the side and the second outer edge of the side, due to capillary action.

[0014] In this case, inflow between the first inner edge and the first outer edge of the side and between the second inner edge and the second outer edge of the side is further prevented.

[0015] (4) The first inner side edge of the first movable member may extend to a position where it can approach the first end of the substrate, and the second inner side edge of the second movable member may extend to a position where it can approach the first end of the substrate.

[0016] In this case, the thickness of the processing liquid in the region along the first and second outer edges of the substrate processing surface, starting from the first edge, can be made sufficiently uniform.

[0017] (5) The inner edge of the first side portion of the first movable member may extend to a position close to the second end portion of the substrate, and the inner edge of the second side portion of the second movable member may extend to a position close to the second end portion of the substrate.

[0018] In this case, the thickness of the processing liquid on the region along the first and second side outer edges of the substrate processing surface to the second end portion can be made sufficiently uniform.

[0019] (6) The inner edge of the first side portion of the first movable member may extend from a position close to the first end portion of the substrate to a position close to the second end portion of the substrate, and the inner edge of the second side portion of the second movable member may extend from a position close to the first end portion of the substrate to a position close to the second end portion of the substrate.

[0020] In this case, the thickness of the processing liquid on the region of the substrate processing surface along the entire circumference of the substrate can be made sufficiently uniform.

[0023] ( 7 ) The inner edge of the first side portion includes a plurality of first partial inner edges formed intermittently, the first movable member includes a plurality of first partial movable portions having the plurality of first partial inner edges, the inner edge of the second side portion includes a plurality of second partial inner edges formed intermittently, and the second movable member may include a plurality of second partial movable portions having the plurality of second partial inner edges.

[0024] In this case, it becomes possible to separately space apart the first partial inner edges of the plurality of first partial movable portions and the second partial inner edges of the plurality of second partial movable portions.

Advantages of the Invention

[0031] According to the present invention, it becomes possible to equalize the thickness of the processing liquid supplied to the substrate processing surface while suppressing the consumption amount of the processing liquid.

Brief Description of the Drawings

[0032] [Figure 1]It is a schematic external perspective view of a substrate processing apparatus. [Figure 2] It is a plan view for explaining the supply of a processing liquid to the substrate processing surface of a nozzle device. [Figure 3] It is a plan view for explaining the supply of a processing liquid to the substrate processing surface of a nozzle device. [Figure 4] It is a schematic diagram for explaining an operation example of a substrate processing apparatus. [Figure 5] It is a schematic diagram for explaining an operation example of a substrate processing apparatus. [Figure 6] It is a schematic diagram for explaining an operation example of a substrate processing apparatus. [Figure 7] It is a schematic diagram for explaining an operation example of a substrate processing apparatus. [Figure 8] It is a schematic diagram for explaining an operation example of a substrate processing apparatus. [Figure 9] It is a schematic diagram for explaining an operation example of a substrate processing apparatus. [Figure 10] It is a schematic diagram for explaining an operation example of a substrate processing apparatus. [Figure 11] It is a schematic diagram for explaining an operation example of a substrate processing apparatus. [Figure 12] It is a plan view showing a modified example of a dummy coating plate. [Figure 13] It is a plan view showing a modified example of a dummy coating plate. [Figure 14] It is a plan view showing a modified example of a dummy coating plate. [Figure 15] It is a plan view showing a modified example of a dummy coating plate. [Figure 16] It is a plan view showing a modified example of a dummy coating plate. [Figure 17] It is a plan view showing a modified example of a dummy coating plate.

Embodiments for Carrying Out the Invention

[0033] Hereinafter, a substrate processing apparatus according to one embodiment of the present invention will be described with reference to the drawings. In the following description, "substrate" refers to a substrate for a Flat Panel Display (FPD), semiconductor substrate, optical disk substrate, magnetic disk substrate, magneto-optical disk substrate, photomask substrate, ceramic substrate, or solar cell substrate used in liquid crystal display devices or organic EL (Electro-Luminescence) display devices. Furthermore, the substrate described below has a circular shape in plan view, except for the notch formation portion.

[0034] (1) Configuration of the substrate processing apparatus 100 Figure 1 is a schematic external perspective view of the substrate processing apparatus 100. In this embodiment, the substrate processing apparatus 100 supplies a coating liquid, such as a resist solution, as a processing liquid onto the substrate W.

[0035] As shown in Figure 1, the substrate processing apparatus 100 includes a control unit 110, a pair of stage supports 120, a stage apparatus 130, a pair of nozzle supports 140, and a nozzle apparatus 150. In Figure 1 and in other figures described later, arrows indicating the mutually orthogonal X, Y, and Z directions are provided to clarify the positional relationships. The X and Y directions are mutually orthogonal in the horizontal plane, and the Z direction corresponds to the vertical direction. In the following description, with respect to the X and Y directions, the directions in which the arrows point are referred to as the +X direction and the +Y direction, respectively, and the directions opposite to the arrows are referred to as the -X direction and the -Y direction, respectively.

[0036] Each of the pair of stage supports 120 has a rectangular parallelepiped shape and is mounted on the bottom surface of a housing (not shown) so as to extend along the X direction. The pair of stage supports 120 are arranged to face each other in the Y direction. A guide rail 121 extending along the X direction is provided on the upper surface of each stage support 120.

[0037] The stage device 130 is located between a pair of stage supports 120 in the Y direction and is supported by the pair of stage supports 120. The stage device 130 includes a plate member 131, a plate adjustment unit 132, a plurality (three in this example) of support pins 133, a pin lifting drive unit 134, a suction drive unit 135, dummy coating plates 136, 137 and dummy coating plate drive units 138, 139.

[0038] The plate member 131 is formed from a rectangular, flat stone material and constitutes the upper surface portion of the stage device 130. A substrate W to be processed is placed on a part of the plate member 131. The portion of the plate member 131 on which the substrate W is placed (hereinafter referred to as the substrate placement portion) has a plurality of intake holes and a plurality of pin insertion holes (not shown) that penetrate the plate member 131 in the Z direction.

[0039] The plate adjustment unit 132, multiple support pins 133, pin lifting drive unit 134, suction drive unit 135, and dummy coating plate drive units 138 and 139 are located at the bottom of the plate member 131. The plate adjustment unit 132 adjusts the temperature of the substrate mounting portion of the plate member 131.

[0040] Multiple support pins 133 are supported by a pin lifting drive unit 134 so as to be movable in the vertical direction and insertable into multiple pin insertion holes. The pin lifting drive unit 134 moves the multiple support pins 133 in the vertical direction based on the control of the control unit 110. As a result, the upper ends of the multiple support pins 133 move between a pin-up position above the plate member 131 and a pin-down position below the plate member 131.

[0041] As a result, when a substrate W is brought in, the unprocessed substrate W, held by a transport device (not shown), is placed on the support pins 133 with the upper ends of the support pins 133 in the pin-up position. When a substrate W is unloaded, the processed substrate W, supported on the support pins 133, is received by a transport device (not shown) with the upper ends of the support pins 133 in the pin-up position. Furthermore, when processing the substrate W in the substrate processing device 100, the processing liquid is supplied to the substrate W, which is placed on the substrate mounting portion of the plate member 131, by a nozzle device 150 (described later), with the upper ends of the support pins 133 in the pin-down position.

[0042] Multiple intake holes (not shown) formed in the plate member 131 are connected to the factory's exhaust equipment, etc., through an intake system including a suction drive unit 135 and an ejector (not shown). Based on the control of the control unit 110 (described later), the suction drive unit 135 switches the intake path connecting the multiple intake holes and the intake system between a connected state and a blocked state. With this configuration, when a substrate W is placed on the substrate mounting portion of the plate member 131, the suction drive unit 135 can hold the substrate W by adsorption to the substrate mounting portion by connecting the intake path. Also, when the substrate W is held by adsorption to the substrate mounting portion, the suction drive unit 135 can release the substrate W from the plate member 131 by blocking the intake path.

[0043] Dummy coating plates 136 and 137 are provided on the upper surface of the plate member 131. The dummy coating plates 136 and 137 are positioned on both sides of the substrate mounting portion of the plate member 131 in the Y direction. The dummy coating plate 136, the substrate mounting portion, and the dummy coating plate 137 are aligned in the Y direction. A gap is formed between the lower surfaces of the dummy coating plates 136 and 137 and the upper surface of the plate member 131. The dummy coating plate 136 includes partial coating plates 136a to 136d, and the dummy coating plate 137 includes partial coating plates 137a to 137d. The partial coating plates 136a, 136b and partial coating plates 137a and 137b are formed from a water-repellent material (for example, a resin material). In this embodiment, the partial coating plates 136a, 136b and partial coating plates 137a and 137b are formed from plastic. The partially coated plates 136c, 136d and 137c, 137d are formed from hydrophilic materials (for example, metal and silicon). In this embodiment, the partially coated plates 136c, 136d and 137c, 137d are formed from silicon.

[0044] Here, when the substrate W is placed on the plate member 131, the portion where a virtual straight line ax in the Y direction passing through the center WC of the substrate W intersects with the outer periphery of the substrate W is called the first side portion s1 and the second side portion s2. Also, the portion where a straight line in the X direction passing through the center WC of the substrate W intersects with the outer periphery of the substrate W is called the first end portion e1 and the second end portion e2. Furthermore, as shown in Figure 4 described later, the outer periphery of the substrate W from the first side portion s1 to the first end portion e1 is called the partial outer edge OE1, and the outer periphery of the substrate W from the first side portion s1 to the second end portion e2 is called the partial outer edge OE2. In addition, the outer periphery of the substrate W from the second side portion s2 to the first end portion e1 is called the partial outer edge OE3, and the outer periphery of the substrate W from the second side portion s2 to the second end portion e2 is called the partial outer edge OE4.

[0045] The partially coated plates 136a and 136b have arc-shaped partial inner edges 6A and 6B corresponding to the partial outer edge OE1 of the substrate W, and the partially coated plates 136c and 136d have arc-shaped partial inner edges 6C and 6D corresponding to the partial outer edge OE2 of the substrate W. The partial inner edges 6A to 6D face the partial outer edges OE1 and OE2 of the substrate W in the +Y direction.

[0046] The partially coated plates 137a and 137b have arc-shaped partial inner edges 7A and 7B corresponding to the partial outer edge OE3 of the substrate W, and the partially coated plates 137c and 137d have arc-shaped partial inner edges 7C and 7D corresponding to the partial outer edge OE4 of the substrate W. The partial inner edges 7A to 7D face the partial outer edges OE3 and OE4 of the substrate W in the -Y direction. In this embodiment, the outer circumference of the partially coated plates 136a to 136d has an arc shape corresponding to the partial inner edges 6A to 6D.

[0047] In Figure 1, rectangular openings 13a and 13b are formed in the plate member 131 below the dummy coating plates 136 and 137, respectively. The dummy coating plate drive units 138 and 139 are located below the plate member 131.

[0048] The dummy coating plate drive unit 138 includes partial drive units 138a to 138d. The partial coating plates 136a to 136d are connected to the partial drive units 138a to 138d, respectively, through a rectangular opening 13a by connecting members.

[0049] Each of the partial drive units 138a to 138d includes an actuator such as a motor, and moves each of the partial coating plates 136a to 136d in the +Y and -Y directions between a first separated position and a first close position, based on the control of the control unit 110. The first separated position is the position where the partial outer edge OE1 and the partial inner edges 6A and 6B of the substrate W are separated, and the position where the partial outer edge OE2 and the partial inner edges 6C and 6D of the substrate W are separated. The first close position is the position where the partial outer edge OE1 and the partial inner edges 6A and 6B of the substrate W are close together, and the position where the partial outer edge OE2 and the partial inner edges 6C and 6D of the substrate W are close together (see Figure 4).

[0050] The dummy coating plate drive unit 139 includes partial drive units 139a to 139d. The partial coating plates 137a to 137d are connected to the partial drive units 139a to 139d, respectively, by connecting members through a rectangular opening 13b.

[0051] Each of the partial drive units 139a to 139d includes an actuator such as a motor, and moves each of the partial coating plates 137a to 137d in the +Y and -Y directions between a second separated position and a second close position, based on the control of the control unit 110. The second separated position is the position where the partial outer edge OE3 of the substrate W is separated from the partial inner edges 7A and 7B, and the position where the partial outer edge OE4 of the substrate W is separated from the partial inner edges 7C and 7D, respectively. The second close position is the position where the partial outer edge OE3 of the substrate W is close to the second partial inner edges 7A and 7B, respectively, and the second close position is the position where the partial outer edge OE4 of the substrate W is close to the second partial inner edges 7C and 7D, respectively (see Figure 5).

[0052] Hereinafter, the upper surface of the substrate W will be referred to as the substrate processing surface Wp. When the partial coating plates 136a to 136d are in the first proximity position, the partial drive units 138a to 138d move the partial coating plates 136a to 136d so that their respective upper surfaces are flush with the substrate processing surface Wp in the Z direction. Also, when the partial coating plates 137a to 137d are in the second proximity position, the partial drive units 139a to 139d move the partial coating plates 137a to 137d so that their respective upper surfaces are flush with the substrate processing surface Wp in the Z direction. Note that the state in which the upper surfaces of the partially coated plates 136a-136d and 137a-137d and the substrate processing surface Wp are flush includes cases where the height of the upper surfaces of the partially coated plates 136a-136d and 137a-137d and the height of the substrate processing surface Wp are slightly different, within the range in which the effects described later can be obtained.

[0053] A pair of nozzle supports 140 are provided on the upper surfaces of the pair of stage supports 120, each movably positioned along the guide rail 121 in the X direction. The pair of nozzle supports 140 are arranged to face each other in the Y direction.

[0054] The nozzle device 150 is supported in the Y direction by a pair of nozzle supports 140 between a pair of nozzle supports 140. At least one of the pair of nozzle supports 140 houses an X-direction drive unit 141, a Z-direction drive unit 142, and a liquid supply unit 143.

[0055] The nozzle device 150 includes a nozzle block 151 extending in the Y direction. The nozzle block 151 has a top surface, a front surface, a rear surface, a front inclined surface, a rear inclined surface, a bottom surface, and both sides. The bottom surface of the nozzle block 151 is formed flat and is positioned parallel to the substrate processing surface Wp. The front end of the bottom surface connects to the lower end of the front inclined surface, and the upper end of the front inclined surface connects to the front surface. The rear end of the bottom surface connects to the lower end of the rear inclined surface, and the upper end of the rear inclined surface connects to the rear surface. The upper end of the front surface and the upper end of the rear surface connect to the top surface. Both ends of the top surface, front surface, rear surface, front inclined surface, rear inclined surface, and bottom surface are each connected to both sides. A slit-shaped discharge port 151a extending in the Y direction is formed on the bottom surface of the nozzle block 151. The length of the slit-shaped discharge port 151a in the Y direction is greater than or equal to the diameter of the substrate W.

[0056] Furthermore, the nozzle block 151 is connected to a processing liquid supply system (not shown) via a liquid supply unit 143 provided on the nozzle support 140. Inside the nozzle block 151, a processing liquid flow path (not shown) leading to the discharge port 151a is formed. The liquid supply unit 143 of the nozzle support 140 includes, for example, a pump and a valve, and, based on the control of the control unit 110, further supplies the processing liquid supplied from the processing liquid supply system to the nozzle block 151. As a result, in the nozzle block 151, the processing liquid supplied from the liquid supply unit 143 is discharged from the discharge port 151a through the processing liquid flow path (not shown). The liquid supply unit 143 also stops the discharge of the processing liquid from the discharge port 151a of the nozzle block 151 based on the control of the control unit 110.

[0057] The X-direction drive unit 141 includes an actuator such as a motor and, based on the control of the control unit 110, moves the pair of nozzle supports 140 along the guide rails 121 of the pair of stage supports 120 in the +X and -X directions. The Z-direction drive unit 142 includes an actuator such as a motor and, based on the control of the control unit 110, moves the nozzle device 150, supported by the pair of nozzle supports 140, in the Z direction and its opposite direction (up and down). As a result, in the substrate processing apparatus 100, as shown by the white arrows AX and AZ in Figure 1, the nozzle device 150 can be moved in the ±X direction and up and down (±Z direction) on the substrate W placed on the plate member 131 of the stage device 130.

[0058] During the coating process of the processing liquid, the nozzle device 150 moves in the +X direction in the space above the substrate W while the substrate W is adsorbed and held on the plate member 131. At this time, the bottom surface of the nozzle device 150 is close to the substrate processing surface Wp. The position (height) of the nozzle device 150 in the Z direction is set so that, for example, the processing liquid in the nozzle block 151 is drawn out by capillary action from the discharge port 151a into the gap between the bottom surface of the nozzle block 151 and the substrate processing surface Wp. This method of supplying the processing liquid onto the substrate W using capillary action from the discharge port 151a of the nozzle device 150 is called capillary coating.

[0059] Figures 2 and 3 are plan views illustrating the supply of processing liquid to the substrate processing surface Wp by the nozzle device 150. As shown in Figures 2 and 3, the nozzle block 151 advances from its first end e1 toward the center WC of the substrate W. At this time, processing liquid is supplied from the discharge port 151a between the bottom surface of the nozzle block 151 and the substrate processing surface Wp by capillary action. As the nozzle block 151 approaches the center WC of the substrate W, the length L1 of the portion of the discharge port 151a that overlaps with the substrate processing surface Wp gradually increases. That is, the area of ​​the portion of the bottom surface of the nozzle block 151 that overlaps with the substrate processing surface Wp gradually increases. As a result, a shortage of processing liquid occurs in the portion of the overlap between the substrate processing surface Wp and the bottom surface of the nozzle block 151 due to capillary action from the discharge port 151a. Consequently, areas of processing liquid deficiency SR1 and SR2 occur at both ends in the Y direction on the substrate processing surface Wp. As a result, the thickness of the processing solution gradually decreases near the outer edges OE1 and OE3 of the substrate processing surface Wp.

[0060] Subsequently, as shown in Figure 3, the nozzle block 151 moves from the center WC of the substrate W toward the second edge e2. As the nozzle block 151 approaches the second edge e2 of the substrate W, the length L1 of the portion of the discharge port 151a that overlaps with the substrate processing surface Wp gradually decreases. That is, the area of ​​the bottom surface portion of the nozzle block 151 that overlaps with the substrate processing surface Wp gradually decreases. As a result, excess processing liquid is supplied from the discharge port 151a to the overlapping portion between the substrate processing surface Wp and the bottom surface of the nozzle block 151 due to capillary action. This creates excess processing liquid regions ER1 and ER2 at both ends in the Y direction on the substrate processing surface Wp. Consequently, the thickness of the processing liquid gradually increases near the outer edges OE2 and OE4 of the substrate processing surface Wp.

[0061] Thus, in capillary coating, when a liquid film is formed on the substrate W using a processing solution, the outer periphery of the substrate W becomes a singularity (singular portion) with respect to the thickness of the processing solution on the substrate processing surface Wp of the substrate W. As a result, abnormal film thickness occurs in the processing solution applied on the substrate processing surface Wp of the substrate W. In the substrate processing apparatus 100 of this embodiment, it is possible to avoid the occurrence of abnormal film thickness by using dummy coating plates 136 and 137 during capillary coating.

[0062] As shown in Figures 2 and 3, when the discharge port 151a of the nozzle block 151 moves in the +X direction, the first end e1 is the supply start position and the second end e2 is the supply end position.

[0063] (2) Example of operation of the substrate processing device 100 The control unit 110 in Figure 1 controls the operation of the plate adjustment unit 132, the pin lifting / lowering drive unit 134, the suction drive unit 135, the dummy coating plate drive units 138 and 139, the X-direction drive unit 141, the Z-direction drive unit 142, and the liquid supply unit 143. The control unit 110 includes a CPU, RAM (random access memory), ROM (read-only memory), and a storage device. The RAM is used as the CPU's workspace. The CPU executes processing programs stored in the storage device on the RAM, thereby controlling the operation of each part of the substrate processing device 100.

[0064] Figures 4 to 11 are schematic diagrams illustrating an example of the operation of the substrate processing apparatus 100. The lower part of Figures 4 to 11 shows a plan view of the substrate processing apparatus 100. The upper part of Figures 4 to 11 shows a cross-sectional view of the substrate processing apparatus 100 shown at the bottom of Figure 4, along line AA.

[0065] The top of Figure 4 shows the bottom surface 152, front inclined surface 153, and rear inclined surface 154 of the nozzle block 151. First, as shown in Figure 4, before the supply of the processing liquid is started, the nozzle block 151 of the nozzle device 150 is waiting at a first outer position of the substrate W. The first outer position is a position shifted in the -X direction from the first edge e1 of the substrate W.

[0066] Next, the dummy coating plates 136 and 137 move from their first and second separated positions to their first and second close positions in the +Y and -Y directions, respectively. As a result, as shown in Figure 5, the partial inner edges 6A and 6B of the partial coating plates 136a and 136b move closer to the partial outer edge OE1 of the substrate W, and the partial inner edges 6C and 6D of the partial coating plates 136c and 136d move closer to the partial outer edge OE2 of the substrate W. Also, the partial inner edges 7A and 7B of the partial coating plates 137a and 137b move closer to the partial outer edge OE3 of the substrate W, and the partial inner edges 7C and 7D of the partial coating plates 137c and 137d move closer to the partial outer edge OE4 of the substrate W.

[0067] In the first and second proximity positions of this example, a gap t is set between the partial inner edges 6A to 6D of the partial coated plates 136a to 136d and the partial outer edges OE1 and OE2 of the substrate W, and between the partial inner edges 7A to 7D of the partial coated plates 137a to 137d and the partial outer edges OE3 and OE4 of the substrate W. For example, the gap t is set to be greater than 0 mm and 0.5 mm or less, and in this example it is set to 0.3 mm.

[0068] This prevents the processing liquid supplied to the substrate processing surface Wp from flowing in by capillary action between the partial inner edges 6A to 6D of the partial coating plates 136a to 136d and the partial outer edges OE1 and OE2 of the substrate W, and between the partial inner edges 7A to 7D of the partial coating plates 137a to 137d and the partial outer edges OE3 and OE4 of the substrate W. Note that the spacing t is not limited to a value within the above range, but is set to an appropriate value according to the size of the substrate W, etc.

[0069] Next, the nozzle block 151 of the nozzle device 150 moves in the +X direction. When the nozzle block 151 reaches a position just before the dummy coating plates 136, 137 and the first edge e1 of the substrate W, the nozzle device 150 discharges the processing liquid from the discharge port 151a. As shown in Figure 6, when the discharge port 151a reaches the partial coating plate 136a, the substrate processing surface Wp of the substrate W, and the partial coating plate 137a, the processing liquid discharged from the discharge port 151a is supplied to the upper surfaces of the partial coating plate 136a, the substrate processing surface Wp of the substrate W, and the partial coating plate 137a. In this state, the nozzle block 151 moves in the +X direction.

[0070] Next, as shown in Figure 7, the discharge port 151a of the nozzle block 151 passes through the partial coating plates 136a and 137a and reaches the partial coating plates 136b and 137b. As a result, processing liquid is supplied to the area of ​​the substrate processing surface Wp between the partial coating plates 136a and 137a. At this point, the partial coating plate 136a begins to move in the -Y direction, and the partial coating plate 137a begins to move in the +Y direction. As a result, as shown in Figure 8, the partial coating plate 136a moves to a first separated position, and the partial coating plate 137a moves to a second separated position. In this case, the processing liquid supplied to the substrate processing surface Wp is prevented from flowing into the space between the partial coating plate 136a and the partial outer edge OE1 of the substrate W, and between the partial coating plate 137a and the partial outer edge OE3 of the substrate W, due to capillary action.

[0071] Next, as shown in Figure 8, the discharge port 151a of the nozzle block 151 passes through the partial coating plates 136b and 137b and reaches the partial coating plates 136c and 137c. As a result, processing liquid is supplied to the area of ​​the substrate processing surface Wp between the partial coating plates 136b and 137b. At this point, the partial coating plate 136b begins to move in the -Y direction, and the partial coating plate 137b begins to move in the +Y direction. As a result, as shown in Figure 9, the partial coating plate 136b moves to a first separated position, and the partial coating plate 137b moves to a second separated position. In this case, the processing liquid supplied to the substrate processing surface Wp is prevented from flowing into the space between the partial coating plate 136b and the partial outer edge OE1 of the substrate W, and between the partial coating plate 137b and the partial outer edge OE3 of the substrate W, due to capillary action.

[0072] Next, as shown in Figure 9, the discharge port 151a of the nozzle block 151 passes through the partial coating plates 136c and 137c and reaches the partial coating plates 136d and 137d. As a result, processing liquid is supplied to the region of the substrate processing surface Wp between the partial coating plates 136c and 137c. At this point, the partial coating plate 136c begins to move toward the first separated position in the -Y direction, and the partial coating plate 137c begins to move toward the +Y direction. As a result, as shown in Figure 10, the partial coating plate 136c moves toward the first separated position, and the partial coating plate 137c moves toward the second separated position. In this case, the processing liquid supplied to the substrate processing surface Wp is prevented from flowing into the space between the partial coating plate 136c and the partial outer edge OE2 of the substrate W, and between the partial coating plate 137c and the partial outer edge OE4 of the substrate W, due to capillary action.

[0073] Next, as shown in Figure 10, the discharge port 151a of the nozzle block 151 passes through the partial coating plates 136d and 137d and reaches the second edge e2 of the substrate W. As a result, processing liquid is supplied to the area of ​​the substrate processing surface Wp between the partial coating plates 136d and 137d. At this point, the partial coating plate 136d begins to move in the -Y direction, and the partial coating plate 137d begins to move in the +Y direction. As a result, as shown in Figure 11, the partial coating plate 136d moves to the first separated position, and the partial coating plate 137d moves to the second separated position. In this case, the processing liquid supplied to the substrate processing surface Wp is prevented from flowing into the space between the partial coating plate 136d and the partial outer edge OE2 of the substrate W, and between the partial coating plate 137d and the partial outer edge OE4 of the substrate W, due to capillary action.

[0074] The discharge of the processing liquid from the nozzle port 151a of the nozzle block 151 ends immediately after the nozzle port 151a passes the second edge e2 of the substrate W. As shown in Figure 11, the nozzle block 151 moves to a second outer position of the substrate W. This second outer position is shifted in the +X direction from the second edge e2 of the substrate W. At this point, the supply of processing liquid to the substrate W by the substrate processing apparatus 100 ends.

[0075] (3) Effects of the embodiment In the substrate processing apparatus 100 of this embodiment, with the substrate W supported by the plate member 131, the nozzle block 151 moves on the substrate W in the +X direction. During the period when the discharge port 151a of the nozzle block 151 passes the outer periphery (partial outer edge OE1 to OE4) of the substrate W, the dummy coating plates 136 and 137 come into close proximity to the outer periphery of the substrate W. As a result, the discharge port 151a of the nozzle block 151 overlaps the upper surface of the dummy coating plate 137, the substrate processing surface Wp, and the upper surface of the dummy coating plate drive unit 138. In this case, the upper surface of the dummy coating plate 136, the substrate processing surface, and both ends of the strip-shaped processing liquid held between the upper surface of the dummy coating plate 137 and the bottom surface 152 of the nozzle block 151 are located on the upper surfaces of the dummy coating plates 136 and 137, respectively. As a result, the deficient region SR1 in Figure 2 is formed on the upper surfaces of the partially coated plates 136a and 136b, and the deficient region SR2 is formed on the upper surfaces of the partially coated plates 137a and 137b. In addition, the excess region ER1 in Figure 3 is formed on the upper surfaces of the partially coated plates 136c and 136d, and the excess region ER2 is formed on the upper surfaces of the partially coated plates 137c and 137d. This makes it possible to make the thickness of the processing liquid uniform in the region along the outer periphery of the substrate processing surface Wp. Therefore, even if the thickness of the processing liquid on the upper surfaces of the dummy coated plates 136 and 137 is uneven, the thickness of the processing liquid in the region along the partial outer edge OE1 to OE4 of the substrate processing surface Wp will be uniform.

[0076] Furthermore, since the processing solution is applied while the substrate W is stationary, the processing solution does not splatter into the surrounding area. This makes it possible to reduce the amount of processing solution consumed while making the thickness of the processing solution supplied to the substrate processing surface Wp more uniform.

[0077] Furthermore, in this embodiment, the partial coating plates 136a, 136b, 137a, and 137b are formed of a water-repellent material. As a result, when the length of the portion of the discharge port 151a that overlaps with the substrate processing surface Wp gradually increases as the nozzle block 151 advances, the processing liquid on the upper surfaces of the partial coating plates 136a, 136b, 137a, and 137b flows more easily onto the substrate processing surface Wp. This suppresses the occurrence of areas on the substrate processing surface Wp that lack processing liquid. Additionally, the partial coating plates 136c, 136d, 137c, and 137d are formed of a hydrophilic material. As a result, when the length of the portion of the discharge port 151a that overlaps with the substrate processing surface Wp gradually decreases as the nozzle block 151 advances, the processing liquid on the substrate processing surface Wp flows more easily onto the upper surfaces of the partial coating plates 136c, 136d, 137c, and 137d. This suppresses the occurrence of excess processing solution on the substrate processing surface Wp. As a result, it becomes possible to make the thickness of the processing solution supplied to the substrate processing surface Wp more uniform.

[0078] Furthermore, the outer periphery of the partial coating plates 136a to 136d has an arc shape corresponding to the partial inner edges 6A to 6D. This reduces the amount of processing liquid supplied to the upper surface of the partial coating plates 136a to 136d. Also, the outer periphery of the partial coating plates 137a to 137d has an arc shape corresponding to the partial inner edges 7A to 7D. This reduces the amount of processing liquid supplied to the upper surface of the partial coating plates 137a to 137d. As a result, it becomes possible to suppress the consumption of processing liquid used in the supply operation of the processing liquid to the substrate W by the substrate processing apparatus 100.

[0079] (4) Other embodiments (4-1) In the above embodiment, as the nozzle block 151 advances, the partial coating plates 136a to 136d and the partial coating plates 137a to 137d sequentially move from the first and second proximity positions to the first and second proximity positions, but the present invention is not limited thereto. If the processing liquid does not flow between the dummy coating plate 136 and the dummy coating plate 137 and the substrate W due to capillary action, the dummy coating plates 136 and 137 do not need to move apart as the nozzle block 151 advances. Alternatively, after the nozzle block 151 has passed over the substrate processing surface Wp, the partial coating plates 136a to 136d and the partial coating plates 137a to 137d may move simultaneously from the first and second proximity positions to the first and second proximity positions.

[0080] (4-2) In the above embodiment, the partial coating plates 136a to 136d and the partial coating plates 137a to 137d are spaced apart from the substrate W in the -Y direction or the +Y direction, but the present invention is not limited thereto. For example, the partial coating plates 136a to 136d and the partial coating plates 137a to 137d may be spaced apart in the upward direction or the downward direction.

[0081] (4-3) In the above embodiment, the dummy coating plate 136 is composed of partial coating plates 136a to 136d, and the dummy coating plate 137 is composed of partial coating plates 137a to 137d. As a result, the dummy coating plates 136 and 137 are each divided into four parts, but the present invention is not limited thereto. The dummy coating plate 136 may be composed of two or more partial coating plates, and the dummy coating plate 137 may be composed of two or more partial coating plates. In this case, the substrate processing apparatus 100 includes a plurality of drive units that can individually move the plurality of partial coating plates of the dummy coating plates 136 and 137 in the ±Y direction, thereby sufficiently preventing the processing liquid supplied between the dummy coating plates 136 and 137 and the substrate processing surface Wp from flowing in by capillary action.

[0082] (5) Modification of dummy coating plate Figures 12 to 17 are plan views showing modified dummy coating plates. In Figures 12 to 17, the dummy coating plates 136 and 137 are shown in the first and second proximity positions to the substrate W.

[0083] In the example shown in Figure 12, the dummy coating plate 136 is divided into partial coating plates 136e and 136f by a virtual straight line ax passing through the center of the substrate W, and the dummy coating plate 137 is divided into partial coating plates 137e and 137f by a virtual straight line ax. Partial coating plate 136e has a partial inner edge 6E corresponding to the shape of the partial outer edge OE1 of the substrate W, and partial coating plate 136f has a partial inner edge 6F corresponding to the shape of the partial outer edge OE2 of the substrate W. Furthermore, partial coating plate 137e has a partial inner edge 7E corresponding to the shape of the partial outer edge OE3 of the substrate W, and partial coating plate 137f has a partial inner edge 7F corresponding to the shape of the partial outer edge OE4 of the substrate W. In addition, the substrate processing apparatus 100 includes a drive unit that moves the partial coating plates 136e, 136f, 137e, and 137f independently in the ±Y directions.

[0084] In this example, when the processing liquid is supplied to the substrate processing surface Wp, the partial coating plates 136e and 137e are moved to the first and second separated positions when the discharge port 151a of the nozzle block 151 passes the first and second sides s1 and s2 of the substrate W. Also, the partial coating plates 136f and 137f are moved to the first and second separated positions when the discharge port 151a of the nozzle block 151 passes the second end e2 of the substrate W.

[0085] In the example in Figure 13, the dummy coating plate 136 includes a single partial coating plate 136g, and the dummy coating plate 137 includes a single partial coating plate 137g. The partial coating plate 136g includes a partial inner edge 6G corresponding to the shapes of the partial outer edges OE1 and OE2 of the substrate W. The partial coating plate 137g also includes a partial inner edge 7G corresponding to the shapes of the partial outer edges OE3 and OE4 of the substrate W.

[0086] In this example, the substrate processing apparatus 100 may include a drive unit that moves the partial coating plates 136g and 137g in the ±Y directions, or it may include a drive unit that can move the partial coating plates 136g and 137g in the ±Y directions. When the processing liquid is supplied to the substrate processing surface Wp of the substrate W, the partial coating plates 136g and 137g are moved to separated positions when the discharge port 151a of the nozzle block 151 passes the second end e2 of the substrate W.

[0087] In the example shown in Figure 14, the dummy coating plate 136 includes a partial coating plate 136h, and the dummy coating plate 137 includes a partial coating plate 137h. The partial coating plates 136h and 137h are integrally formed with each other at a position opposite the first edge e1 of the substrate W. The dummy coating plates 136 and 137 are spaced apart at a portion opposite the second edge e2 of the substrate W. The partial coating plate 136h includes a partial inner edge 6H corresponding to the shapes of the partial outer edges OE1 and OE2 of the substrate W. The partial coating plate 137h includes a partial inner edge 7H corresponding to the shapes of the partial outer edges OE3 and OE4 of the substrate W.

[0088] In this example, the substrate processing apparatus 100 includes a drive unit that moves the integrated partial coating plates 136h and 137h in the vertical (±Z) direction. When processing liquid is supplied to the substrate processing surface Wp of the substrate W, the partial coating plates 136h and 137h are moved, for example, downward when the discharge port 151a of the nozzle block 151 passes the second end e2 of the substrate W.

[0089] In the example shown in Figure 15, the dummy coating plate 136 includes a partial coating plate 136i, and the dummy coating plate 137 includes a partial coating plate 137i. The partial coating plates 136i and 137i are integrally formed with each other at a position opposite the second edge e2 of the substrate W. The dummy coating plates 136 and 137 are spaced apart at a portion opposite the first edge e1 of the substrate W. The partial coating plate 136i includes a partial inner edge 6I corresponding to the shapes of the partial outer edges OE1 and OE2 of the substrate W. The partial coating plate 137i includes a partial inner edge 7I corresponding to the shapes of the partial outer edges OE3 and OE4 of the substrate W.

[0090] In this example, the substrate processing apparatus 100 includes a drive unit that moves the integrated partial coating plates 136i and 137i in the vertical (±Z) direction. When processing liquid is supplied to the substrate processing surface Wp of the substrate W, the partial coating plates 136i and 137i are moved, for example, downward when the discharge port 151a of the nozzle block 151 passes the second edge e2 of the substrate W.

[0091] Furthermore, as shown in Figure 16, the dummy coating plate 136 includes a partial coating plate 136j, and the dummy coating plate 137 includes a partial coating plate 137j, with the partial coating plates 136j and 137j integrally formed at positions corresponding to the first and second edges e1 and e2 of the substrate W, respectively. In this case, the dummy coating plates 136 and 137 have a ring shape. The partial coating plate 136j includes a partial inner edge 6J corresponding to the shapes of the partial outer edges OE1 and OE2 of the substrate W. The partial coating plate 137j includes a partial inner edge 7J corresponding to the shapes of the partial outer edges OE3 and OE4 of the substrate W.

[0092] In this example, the substrate processing apparatus 100 includes a drive unit that moves the integrated partial coating plates 136j and 137j in the vertical (±Z) direction. When processing liquid is supplied to the substrate processing surface Wp of the substrate W, the partial coating plates 136j and 137j are moved, for example, downward when the discharge port 151a of the nozzle block 151 passes the second end e2 of the substrate W.

[0093] In the example shown in Figure 17, the dummy coating plate 136 includes a partial coating plate 136k, and the dummy coating plate 137 includes a partial coating plate 137k, with the partial coating plates 136k and 137k integrally formed at positions opposite the first and second edges e1 and e2 of the substrate W, respectively. The partial coating plate 136k includes a partial inner edge 6K corresponding to the shapes of the partial outer edges OE1 and OE2 of the substrate W. The partial coating plate 137k includes a partial inner edge 7K corresponding to the shapes of the partial outer edges OE3 and OE4 of the substrate W. In this example, the outer periphery of the partial coating plates 136k and 137k is rectangular.

[0094] In this example, the substrate processing apparatus 100 includes a drive unit that moves the integrated partial coating plates 136k and 137k in the vertical (±Z) direction. When processing liquid is supplied to the substrate processing surface Wp of the substrate W, the partial coating plates 136k and 137k may move downward when the discharge port 151a of the nozzle block 151 passes the second edge e2 of the substrate W.

[0095] In this case, the length of the portion of the nozzle 151a that overlaps with the upper surfaces of the substrate processing surface Wp and the partial coating plates 136k and 137k does not change during the period when the nozzle 151a of the nozzle block 151 is moving on the substrate processing surface Wp. As a result, no areas of insufficient or excess processing liquid occur at either end of the strip-shaped processing liquid held between the substrate processing surface Wp and the partial coating plates 136k and 137k and the nozzle 151a. Furthermore, it becomes possible to increase the area of ​​processing liquid supplied to the upper surfaces of the partial coating plates 136k and 137k. As a result, it becomes possible to further suppress the non-uniformity of the processing liquid on the substrate processing surface Wp.

[0096] (6) Example of treatment of the upper surface of a dummy coating plate In the examples shown in Figures 12 to 17, the upper surfaces of the dummy coating plates 136 and 137 are divided into two regions by a virtual straight line ax passing through the center of the substrate W. Here, the region close to the starting position of the nozzle block 151 is called the first half region, and the region close to the stopping position of the nozzle block 151 is called the second half region.

[0097] In the examples shown in Figures 12 to 17, the front half of the dummy coating plates 136 and 137 may be formed from a water-repellent material, or the front half of the dummy coating plates 136 and 137 may be formed from a hydrophilic material.

[0098] Furthermore, in the examples shown in Figures 1 to 17, the dummy coating plates 136 and 137 may be surface-treated such that the surface roughness of the front half of the dummy coating plates 136 and 137 is greater than that of the substrate treatment surface Wp, and the surface roughness of the back half of the dummy coating plates 136 and 137 is smaller than that of the substrate treatment surface Wp. In this case, the adhesion of the treatment liquid to the front half of the dummy coating plates 136 and 137 is reduced, and the adhesion of the treatment liquid to the back half is increased. As a result, the treatment liquid flows more easily from the front half of the dummy coating plates 136 and 137 to the substrate treatment surface Wp, and from the substrate treatment surface Wp to the back half of the dummy coating plates 136 and 137. This results in a more uniform thickness of the treatment liquid on the substrate treatment surface Wp.

[0099] (7) Adjustment of the height of the nozzle block 151 and the dummy coating plates 136 and 137 In the examples shown in Figures 1 to 17, the heights of the nozzle block 151 and the dummy coating plates 136 and 137 may be adjusted as the nozzle block 151 passes over the substrate processing surface Wp and the dummy coating plates 136 and 137. For example, the heights of the nozzle block 151 and the dummy coating plates 136 and 137 may be adjusted so that when the nozzle block 151 passes over the first half of the dummy coating plates 136 and 137, the amount of processing liquid supplied to the area along the outer periphery of the substrate W increases, and the amount of processing liquid supplied to the area along the outer periphery of the substrate W decreases. This makes the thickness of the processing liquid on the substrate processing surface Wp more uniform.

[0100] (8) Correspondence between each component of the claim and each part of the embodiment The following describes an example of the correspondence between each component of the claims and each element of the embodiment. In the above embodiment, the plate member 131 is an example of a substrate support, the nozzle block 151 is an example of a processing liquid nozzle, and the X-direction drive unit 141 and the Z-direction drive unit 142 are examples of nozzle moving units. Also, the dummy coating plate 136 is an example of a first movable member, the dummy coating plate drive unit 138 is an example of a first drive unit, the dummy coating plate 137 is an example of a second movable member, and the dummy coating plate drive unit 139 is an example of a second drive unit. Furthermore, the partial outer edge OE1 and partial outer edge OE2 are examples of a first side outer edge, and the partial outer edge OE3 and partial outer edge OE4 are examples of a second side outer edge. Furthermore, partial coating plates 136a to 136d or partial coating plates 136e, 136f are examples of the first partial movable parts, partial inner edges 6A to 6D, partial inner edges 6E, 6F, partial inner edge 6G, partial inner edge 6H, partial inner edge 6I, partial inner edge 6J, or partial inner edge 6K are examples of the first side inner edge, and partial inner edges 6A to 6D or partial inner edges 6E, 6F are examples of the first partial inner edge. Also, partial coating plates 137a to 137d or partial coating plates 137e, 137f are examples of the second partial movable parts, partial inner edges 7A to 7D, partial inner edges 7E, 7F, partial inner edge 7G, partial inner edge 7H, partial inner edge 7I, partial inner edge 7J, or partial inner edge 7K are examples of the second side inner edge, and partial inner edges 7A to 7D or partial inner edges 7E, 7F are examples of the second partial inner edge.

[0101] Furthermore, the upper surfaces of the partially coated plates 136a, 136b and 136e are examples of the first region, the upper surfaces of the partially coated plates 136c, 136d and 136f are examples of the second region, the upper surfaces of the partially coated plates 137a, 137b and 137e are examples of the third region, and the upper surfaces of the partially coated plates 137c, 137d and 137f are examples of the fourth region. [Explanation of symbols]

[0102] 6A~6K...Partial inner edge, 7A~7K...Partial inner edge, 13a,13b...Rectangular opening, 100...Substrate processing device, 110...Control unit, 120...Stage support, 121...Guide rail, 130...Stage device, 131...Plate member, 132...Plate adjustment unit, 133...Support pin, 134...Pin lifting drive unit, 135...Suction drive unit, 136...Dummy coating plate, 136a~136k...Partial coating plate, 137...Dummy coating plate, 137a~137k...Partial coating plate, 138...Dummy coating plate drive unit, 138a~138d...Partial drive unit, 13 9…Dummy coating plate drive unit, 139a~139d…Partial drive unit, 140…Nozzle support, 141…X-direction drive unit, 142…Z-direction drive unit, 143…Liquid supply unit, 150…Nozzle device, 151…Nozzle block, 151a…Discharge port, 152…Bottom surface, 153…Front inclined surface, 154…Rear inclined surface, ER1, ER2…Excess area, OE1~OE4…Partial outer edge, SR1, SR2…Deficient area, W…Substrate, WC…Center, Wp…Substrate processing surface, ax…Virtual line, e1…First end, e2…Second end, s1…First side, s2…Second side

Claims

1. A substrate support portion that supports a substrate having at least a part of a circular outer periphery, A processing liquid nozzle having a slit-shaped discharge port for discharging the processing liquid, The nozzle moving unit is configured to move the processing liquid nozzle so that, in a first view perpendicular to the substrate processing surface, the discharge port discharges the processing liquid parallel to the substrate processing surface, which is the upper surface of the substrate supported by the substrate support, and the discharge port passes through a first outer position on one side of the substrate, a first edge of the substrate, the center of the substrate, and a second edge of the substrate opposite to the first edge, to reach a second outer position on the other side of the substrate. A first movable member having a first inner side edge that can approach the outer edge of a first side portion, which includes a first side portion that is the intersection point of a virtual line perpendicular to the direction of movement of the processing liquid nozzle and passing through the center of the substrate processing surface and the outer periphery, A second movable member is positioned separately from the first movable member and has a second inner side edge that can approach the second outer edge of the side, which includes the second side that is the other intersection point of the virtual straight line and the outer periphery on the substrate processing surface, The system includes a drive unit that moves the first and second movable members such that the inner edges of the first and second sides approach the outer edges of the first and second sides, respectively, during the period when the discharge port of the processing liquid nozzle passes the outer edges of the first and second sides of the substrate, The upper surface of the first movable member includes a first region extending from a position accessible to the first side to a position accessible to the first end, and a second region extending from a position accessible to the first side to a position accessible to the second end. The upper surface of the second movable member includes a third region extending from a position where it can approach the second side to a position where it can approach the first end, and a fourth region extending from a position where it can approach the second side to a position where it can approach the second end. The first and third regions are formed of a water-repellent material. The second and fourth regions are formed of a hydrophilic material, and the substrate processing apparatus is a substrate processing apparatus.

2. The substrate processing apparatus according to claim 1, wherein the drive unit moves the first and second movable members such that the inner edges of the first and second sides separate from the outer edges of the first and second sides after the discharge port has passed the outer edges of the first and second sides.

3. The substrate processing apparatus according to claim 1 or 2, wherein the distance between the first inner edge and the first outer edge and the distance between the second inner edge and the second outer edge are set so that the processing liquid does not flow between the first inner edge and the first outer edge and between the second inner edge and the second outer edge due to capillary action.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein the first inner side edge of the first movable member extends to a position where it can approach the first end of the substrate, and the second inner side edge of the second movable member extends to a position where it can approach the first end of the substrate.

5. The substrate processing apparatus according to any one of claims 1 to 4, wherein the first inner side edge of the first movable member extends to a position where it can approach the second end of the substrate, and the second inner side edge of the second movable member extends to a position where it can approach the second end of the substrate.

6. The substrate processing apparatus according to any one of claims 1 to 5, wherein the first inner side edge of the first movable member extends from a position where it can approach the first end of the substrate to a position where it can approach the second end, and the second inner side edge of the second movable member extends from a position where it can approach the first end of the substrate to a position where it can approach the second end of the substrate.

7. The first lateral inner edge includes a plurality of intermittently formed first partial inner edges, The first movable member includes a plurality of first partially movable parts having the plurality of first partially inner edges, The second lateral inner edge includes a plurality of second partial inner edges that are formed intermittently. The substrate processing apparatus according to any one of claims 1 to 6, wherein the second movable member includes a plurality of second partially movable parts having a plurality of second partially inner edges.

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