Electromagnetic wave irradiation device and electromagnetic wave irradiation method

JP7905213B2Active Publication Date: 2026-08-14LINTEC CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-06-14
Publication Date
2026-08-14

AI Technical Summary

Benefits of technology

【0007】 本発明によれば、接着シートの外縁側方を通過後、当該接着シートから遠ざかる方向に気体を通過させ、当該接着シートの外縁雰囲気を減圧状態にするので、接着シートの外縁雰囲気の酸素濃度が低下する。従って、接着シートの外縁部の接着力を確実に低下させることができる。

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Abstract

To surely deteriorate an adhesion force of an external edge part of an adhesion sheet.SOLUTION: An electromagnetic wave irradiation device EA comprises: support means 10 of supporting an adherend WK to which an adhesion sheet AS is adhered; and irradiation means 20 of irradiating an electromagnetic wave EW to the adhesion sheet AS to be adhered to the adherend WK, and further comprises outer edge pressure reduction means 30 of, after the passage on the outer end side direction of the adhesion sheet AS, making a gas NG pass to a direction where is far from the adhesion sheet AS, and making an outer edge atmosphere of the adhesion sheet AS to a pressure reduction state.SELECTED DRAWING: Figure 1
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Description

Technical Field

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[0001] The present invention relates to an electromagnetic wave irradiation device and an electromagnetic wave irradiation method.

Background Art

[0002] An electromagnetic wave irradiation device that irradiates an adhesive sheet attached to an adherend with electromagnetic waves is known (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the semiconductor wafer mounting device 1 (electromagnetic wave irradiation device) described in Patent Document 1, when irradiating ultraviolet rays (electromagnetic waves) on the protective tape PT (adhesive sheet) attached to the wafer W (adherend), if the outer edge portion of the adhesive sheet touches the atmosphere, there is a problem that the adhesive force of the outer edge portion is not reduced by oxygen in the atmosphere.

[0005] An object of the present invention is to provide an electromagnetic wave irradiation device and an electromagnetic wave irradiation method capable of surely reducing the adhesive force of the outer edge portion of an adhesive sheet.

Means for Solving the Problems

[0006] The present invention employs the configuration described in the claims.

Effects of the Invention

[0007] According to the present invention, a gas is passed through the side of the outer edge of the adhesive sheet and then away from the adhesive sheet, thereby reducing the pressure in the atmosphere around the outer edge of the adhesive sheet. This reduces the oxygen concentration in the atmosphere around the outer edge of the adhesive sheet. Therefore, the adhesive strength of the outer edge of the adhesive sheet can be reliably reduced. [Brief explanation of the drawing]

[0008] [Figure 1] (A) and (B) are explanatory diagrams of an electromagnetic wave irradiation device according to one embodiment of the present invention. [Modes for carrying out the invention]

[0009] One embodiment of the present invention will be described below with reference to the drawings. In this embodiment, the X, Y, and Z axes are orthogonal to each other. The X and Y axes are axes within a predetermined plane, and the Z axis is an axis perpendicular to the predetermined plane. Furthermore, in this embodiment, when directions are indicated based on a view from the front direction in Figure 1(A) parallel to the Y axis, "up" is the direction of the Z-axis arrow and "down" is the opposite direction, "left" is the direction of the X-axis arrow and "right" is the opposite direction, "front" is the front direction in Figure 1(A) parallel to the Y axis and "back" is the opposite direction.

[0010] The electromagnetic wave irradiation device EA comprises a support means 10 that performs a support process for supporting an object WK to which an adhesive sheet AS is attached, an irradiation means 20 that performs an irradiation process for irradiating the adhesive sheet AS attached to the object WK with electromagnetic waves EW, and an ejection means 30 as an outer edge depressurization means that performs an outer edge depressurization process by passing nitrogen gas NG as a gas in a direction away from the adhesive sheet AS after passing along the outer edge of the adhesive sheet AS, thereby creating a depressurized state of the outer edge atmosphere of the adhesive sheet AS, and is arranged inside the outer casing 40. Furthermore, the adhesive sheet AS of this embodiment has the characteristic that its adhesive strength decreases due to ultraviolet light, which is the main electromagnetic wave contained in the electromagnetic wave EW irradiated by the irradiation means 20.

[0011] The support means 10 includes a lower table 11 supported on the bottom surface 41A of the housing 41 in the exterior means 40, and an upper table 13 supported on the upper surface 11A of the lower table 11, which has a support surface 13A that can be held by suction using a depressurization means (holding means) 12 such as a depressurization pump or a vacuum ejector. The upper table 13 comprises a recess 13B provided in the support surface 13A and a porous member 13C positioned within the recess 13B, with its upper surface being the support surface 13A. A depressurization means 12 is connected to the porous member 13C via a pipe 12A.

[0012] The irradiation means 20 includes a linear motor 21 as a drive device supported by the housing 41 above the support surface 13A, a cover 22 supported by the slider 21A of the linear motor 21, a high-pressure mercury lamp 23 as an electromagnetic wave emitting means housed inside the cover 22 and emitting electromagnetic waves EW, and a focusing means 24 such as a reflector or lens for focusing the electromagnetic waves EW emitted by the high-pressure mercury lamp 23.

[0013] The ejection means 30 is configured to reduce the pressure of the atmosphere around the adhesive sheet AS by ejecting nitrogen gas NG from the adhesive sheet AS, by passing nitrogen gas NG from the adhesive sheet AS in a direction away from the adhesive sheet AS after passing through the groove 31 diagonally upward toward the outer edge of the upper table 13 toward its outer edge, and by passing nitrogen gas NG from the annular groove 31 formed in the upper surface 11A of the lower table 11 via a pipe 32A, and by ejecting nitrogen gas NG from the gas ejection means 30, which is connected to a gas supply means 32 such as a pressurized pump or turbine that supplies nitrogen gas NG from a nitrogen gas tank (not shown), and by passing through the groove 31 diagonally upward toward the outer edge of the upper table 13 toward its outer edge, and by passing nitrogen gas NG from the gas ejection means 30 in a direction away from the adhesive sheet AS after passing along the outer edge of the adhesive sheet AS. In this embodiment, multiple gas ejection holes 33 are provided and are arranged at equal intervals with predetermined spacing between them along the adherend support region WR on the support surface 13A where the adherend WK is supported (see Figure 1(B)).

[0014] The exterior means 40 includes a housing 41 having an opening 41B, and an opening / closing member 43 supported by the output shaft 42A of a linear motor 42, which serves as a drive device, for opening and closing the opening 41B.

[0015] The operation of the electromagnetic wave irradiation device EA described above will now be explained. First, the user of the electromagnetic wave irradiation device EA (hereinafter simply referred to as "user") inputs a signal to start automatic operation to the electromagnetic wave irradiation device EA, in which each component is positioned at the initial position shown by the solid line in Figure 1(A), via an operating means not shown, such as an operation panel or a personal computer. Next, when the user or a transport means not shown, such as an articulated robot or a belt conveyor, places the object WK to which the adhesive sheet AS is attached at a predetermined position on the support surface 13A, as shown in Figure 1(A), the exterior means 40 drives the linear motor 42 and lowers the opening / closing member 43 to close the opening 41B, as shown by the dashed line in Figure 1(A).

[0016] Subsequently, the support means 10 drives the depressurization means 12 to begin adsorption and holding of the adherend WK on the support surface 13A. Next, the ejection means 30 drives the gas supply means 32 to eject nitrogen gas NG into the housing 41 from the gas ejection hole 33. At this time, the nitrogen gas NG ejected from the gas ejection hole 33 passes along the outer edge of the adhesive sheet AS and flows away from the adhesive sheet AS, causing the atmosphere around the outer edge of the adhesive sheet AS to become depressurized and the oxygen concentration of the outer edge atmosphere to decrease. When a detection means (not shown), such as a concentration meter or concentration sensor, detects that the concentration of nitrogen gas NG inside the housing 41 has reached a predetermined concentration, the ejection means 30 ejects nitrogen gas NG from the gas ejection hole 33, while the irradiation means 20 drives the linear motor 21 and high-pressure mercury lamp 23, causing the high-pressure mercury lamp 23 to reciprocate from left to right, irradiating the adhesive sheet AS with electromagnetic waves EW. As a result, the ultraviolet rays contained in the electromagnetic waves EW reduce the adhesive strength of the adhesive sheet AS.

[0017] Next, when the high-pressure mercury lamp 23 returns to the initial position, the irradiation means 20 stops driving the linear motor 21 and the high-pressure mercury lamp 23, and the ejection means 30 stops driving the gas supply means 32. Then, the support means 10 stops driving the decompression means 12, releases the adsorption and holding of the adherend WK on the support surface 13A, and then the exterior means 40 drives the linear motor 42 to return the opening / closing member 43 to the initial position to open the opening 41B. Next, the user or a conveying means (not shown) conveys the adherend WK to the next process such as a peeling process of peeling the adhesive sheet AS from the adherend WK, and thereafter the same operations as described above are repeated.

[0018] According to the above-described embodiments, after passing through the outer edge side of the adhesive sheet AS, the nitrogen gas NG is passed in a direction away from the adhesive sheet AS, and the atmosphere at the outer edge of the adhesive sheet AS is decompressed, so that the oxygen concentration in the atmosphere at the outer edge of the adhesive sheet AS is reduced. Therefore, the adhesive force at the outer edge portion of the adhesive sheet AS can be surely reduced.

[0019] As described above, the best configurations, methods, etc. for implementing the present invention are disclosed in the above description, but the present invention is not limited thereto. That is, the present invention is mainly illustrated and described with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, those skilled in the art can make various modifications to the above-described embodiments in terms of shape, material, quantity, and other detailed configurations. In addition, the descriptions limiting the shape, material, etc. disclosed above are exemplified for facilitating the understanding of the present invention and do not limit the present invention. Therefore, the descriptions using the names of members with some or all of the limitations of those shapes, materials, etc. removed are included in the present invention.

[0020] For example, the support means 10 may be formed such that the lower table 11 and the upper table 13 are integrally formed, or instead of or in combination with the porous member 13C, a configuration may be adopted in which the adherend WK is adsorbed and held by suction holes or suction grooves formed in the adherend support region WR of the support surface 13A.

[0021] The irradiation means 20 may irradiate the adhesive sheet AS with electromagnetic waves EW from the side or from the support surface 13A side, or it may employ, for example, an LED (Light Emitting Diode) lamp, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, a xenon lamp, a halogen lamp, etc. as an electromagnetic wave emitting means, or a combination thereof as appropriate, or it may irradiate the adhesive sheet AS with electromagnetic waves EW by moving the support means 10 with or without moving the electromagnetic wave emitting means, or it may irradiate the adhesive sheet AS with electromagnetic waves EW that include visible light, sound waves, microwaves, X-rays, gamma rays, infrared rays, etc. as the main electromagnetic waves, and any electromagnetic waves EW may be irradiated as long as it can reduce the adhesive strength of the adhesive sheet AS depending on the characteristics, features, properties, material, composition, etc.

[0022] The ejection means 30 may supply air as a gas through the gas supply means 32 and eject the air from the gas ejection holes 33. Alternatively, multiple gas ejection holes 33 do not need to be arranged at equal intervals along the adherend support area WR of the support surface 13A. Alternatively, gas ejection holes 33 do not need to be provided around the entire circumference of the adherend support area WR. Alternatively, gas ejection holes 33 may be provided only around the adherend support area WR corresponding to the position of the peeling start point of the adhesive sheet AS when peeling the adhesive sheet AS from the adherend WK. Alternatively, there may be only one gas ejection hole 33. Alternatively, it may be formed integrally with the support means 10. Alternatively, it may be a separate component independent of the support means 10. Alternatively, gas may be ejected from a gas ejection member such as a nozzle or piping instead of or in combination with the gas ejection holes 33. The outer edge depressurization means may reduce the outer edge atmosphere of the adhesive sheet AS by sucking in gas, and a suction means for sucking in gas may be used instead of the ejection means 30. The suction means includes a decompression means such as a decompression pump or a vacuum ejector that communicates with the inside of the groove 31 via a pipe 32A, and a gas suction hole that penetrates obliquely upward from the groove 31 toward the upper table 13 on its central side and opens to the support surface 13A, and is inclined in a direction approaching the outer edge of the adhesive sheet AS toward the adhesive sheet AS. By sucking gas through the gas suction hole, after passing through the outer edge side of the adhesive sheet AS, the gas is passed in a direction away from the adhesive sheet AS, and the atmosphere around the outer edge of the adhesive sheet AS is configured to be in a decompressed state. The suction means may arrange a plurality of gas suction holes at equal intervals along the adherent support region WR of the support surface 13A, or may not arrange them at equal intervals. The gas suction holes may be provided over the entire circumference of the adherent support region WR, or may not be provided over the entire circumference of the adherent support region WR. The gas suction holes may be provided only around the adherent support region WR corresponding to the position of the peeling start portion of the adhesive sheet AS when peeling the adhesive sheet AS from the adherent WK. There may be only one gas suction hole, or it may be integrally formed with the support means 10, or may be configured as a separate body independent of the support means 10. Instead of or in combination with the gas suction holes, a gas suction member such as a nozzle or a pipe may be used to suck gas. The shapes of the gas ejection holes 33 and the gas suction holes are not particularly limited, and their cross-sectional shapes and opening shapes may be circular, elliptical, polygonal such as triangular or quadrangular, or other shapes. A gas ejection hole may be adopted that is composed of a hole or groove having a shape in which some or all of the plurality of gas ejection holes 33 are connected to each other. A gas suction hole may be adopted that is composed of a hole or groove having a shape in which some or all of the plurality of gas suction holes are connected to each other. The gas ejected by the ejection means 30 or the gas sucked by the suction means may be, for example, cold air, warm air, atmosphere, a single gas such as nitrogen gas or argon gas, a mixed gas, the atmosphere around the outer edge of the adhesive sheet AS, etc. As long as the atmosphere around the outer edge of the adhesive sheet AS can be decompressed to reduce the oxygen concentration in the outer edge atmosphere, any gas may be adopted.

[0023] The exterior means 40 does not have to close the opening 41B with the opening / closing member 43, or it may keep the opening 41B closed with the opening / closing member 43 until the concentration of nitrogen gas NG inside the housing 41 reaches a predetermined concentration, and then raise the opening / closing member 43 to partially or completely open the opening 41B, or it may be provided in the electromagnetic wave irradiation device EA of the present invention, or it may not be provided.

[0024] The adhesive sheet AS may have properties that reduce its adhesive strength due to major electromagnetic waves other than ultraviolet rays, such as visible light, sound waves, microwaves, X-rays, gamma rays, and infrared rays.

[0025] The material, type, shape, etc., of the adhesive sheet AS and the adherend WK are not particularly limited. For example, the adhesive sheet AS and adherend WK may be circular, elliptical, polygonal (triangle, square, etc.), or have other shapes. The adhesive sheet AS may also have pressure-sensitive or heat-sensitive adhesive properties. If a heat-sensitive adhesive sheet AS is used, it may be bonded by an appropriate method, such as providing a suitable heating means, such as a suitable coil heater or the heating side of a heat pipe, to heat the adhesive sheet AS. Furthermore, the adhesive sheet AS may be any type, such as a single layer of adhesive only, a two-layer sheet with a substrate and an adhesive layer laminated together, a three-layer or three-or-more-layer sheet with one or more intermediate layers laminated between the substrate and the adhesive layer, a three-layer or three-or-more-layer sheet with one or more cover layers laminated on the upper surface of the substrate, a sheet in which the substrate, intermediate layer, or cover layer is peelably provided, a single-layer double-sided adhesive sheet consisting only of an adhesive layer, or a double-sided adhesive sheet with adhesive layers laminated on both outermost surfaces of one or more intermediate layers. Furthermore, the adherend WK may be a single object such as food, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording substrate such as an optical disc, a glass plate, a steel plate, a ceramic, a wooden board, or a resin, or it may be a composite object formed from two or more of these, and any form of component or article can also be included. Note that the adhesive sheet AS may be replaced with any sheet, film, tape, etc., such as an information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, or recording layer forming resin sheet, based on its functional or functional reading.

[0026] The means and processes in this invention are not limited in any way as long as they can perform the operations, functions, or processes described for those means and processes, and are certainly not limited at all to the components or processes of a single embodiment shown in the above-mentioned embodiments. For example, the support means can be anything that supports the object to which the adhesive sheet is attached, and is not limited in any way as long as it is within the scope of the art in light of the common general knowledge at the time of filing (the same applies to other means and processes).

[0027] The drive equipment in the above embodiment can be electric equipment such as rotary motors, linear motors, single-axis robots, articulated robots with two or more axes, actuators such as air cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders, or a combination of these directly or indirectly. In the above embodiment, if a support (holding) means or support (holding) member or other means for supporting (holding) the supported member (held member) is employed, a configuration may be adopted in which the supported member is supported (held) by gripping means such as a mechanical chuck or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), adhesive agent (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, drive equipment, etc. [Explanation of Symbols]

[0028] EA…Electromagnetic wave irradiation device 10...Support means 20…Irradiation means 30…Ejection means (outer edge depressurization means) AS...Adhesive sheet NG... Nitrogen gas (gas) EW... Electromagnetic waves WK...Adherend

Claims

1. An electromagnetic wave irradiation device for irradiating an adhesive sheet having the characteristic of reduced adhesive strength due to electromagnetic waves, A support means for supporting the object to which the adhesive sheet is attached, The system comprises an irradiation means for irradiating the adhesive sheet attached to the object to be adhered with electromagnetic waves, An electromagnetic wave irradiation device further comprising an outer edge depressurization means that passes a gas in a direction away from the adhesive sheet after it has passed along the outer edge of the adhesive sheet, thereby reducing the pressure of the outer edge atmosphere of the adhesive sheet.

2. An electromagnetic wave irradiation method for irradiating an adhesive sheet having the characteristic of reduced adhesive strength due to electromagnetic waves, A support step of supporting the object to which the adhesive sheet is attached, The process involves irradiating the adhesive sheet attached to the object with electromagnetic waves, An electromagnetic wave irradiation method characterized by further performing an outer edge depressurization step, in which a gas is passed in a direction away from the adhesive sheet after passing along the outer edge of the adhesive sheet, thereby reducing the outer edge atmosphere of the adhesive sheet.

Citation Information

Patent Citations

  • JP1989050433U

  • Device for curing ultraviolet-curing resin film

    JP1994170855A

  • Substrate support and method of removing foreign matter from substrate

    JP1996031915A

  • Apparatus and method for actinic radiation irradiation

    JP2006328151A

  • Manufacturing method of semiconductor chip

    JP2008251934A