Adjustment device and diaphragm vacuum gauge

Abstract

To obtain adjustment data that enables accurate temperature compensation in a diaphragm vacuum gauge.SOLUTION: An adjusting device 10 includes a first thermostatic chamber 11, a second thermostatic chamber 12, and a calculating unit 13. The first thermostatic chamber 11 has a sensor head 11a, and adjusts the temperature of the sensor head 11a by adjusting the temperature inside the thermostatic chamber. The second thermostatic chamber 12 has a measuring circuit 12a, and adjusts the temperature of the measuring circuit 12a by adjusting the temperature inside the thermostatic chamber. The calculating unit 13 calculates adjustment data relating to temperature correction based on measured values obtained by separately adjusting the temperature of the first thermostatic chamber 11 and the temperature of the second thermostatic chamber 12.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an adjustment device and a diaphragm vacuum gauge.

Background Art

[0002] Conventionally, a capacitance-type diaphragm vacuum gauge for semiconductor manufacturing equipment measures the vacuum pressure in a heated vacuum chamber. Since the surrounding of the vacuum chamber becomes high temperature when it is heated, as a conventional technique, only a sensor head with high heat resistance is installed near the vacuum chamber, and a measurement circuit with low heat resistance is separated by a cable and installed in a remote place with a low ambient temperature (see, for example, Patent Document 1).

[0003] In addition, in the measurement of vacuum pressure, it is required to perform accurate pressure measurement without being affected by temperature. However, since the measurement circuit and sensor head in the vacuum gauge vary among individual samples, it is necessary to adjust them in pairs. Furthermore, since the measurement circuit and the sensor head each have different temperature characteristics and the temperature environments in which they are used are also different, it is also necessary to separately change the temperature of each and obtain temperature correction data.

[0004] Therefore, in the adjustment process of manufacturing a vacuum gauge, there is a conventional technique in which temperature correction data for the measurement circuit and temperature correction data for the sensor head are obtained by changing the temperature of the measurement circuit and the sensor head using a thermostat and a heater, and adjustment data is created based on the measured values at each temperature.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, the conventional technology described above has the problem that, since the measurement circuit and the sensor head are placed in a single constant-temperature bath and a heating element is attached to the sensor head to adjust the temperature (see Figure 16), it is not possible to obtain measurement values ​​when the temperature of the sensor head is lower than that of the measurement circuit, and therefore it is not possible to obtain adjustment data that enables accurate temperature correction. [Means for solving the problem]

[0007] To solve the above-mentioned problems and achieve the objective, the adjustment device of the present invention is characterized by comprising: a first constant temperature bath on which a sensor head is installed; a second constant temperature bath on which a measurement circuit is installed; and a calculation unit that calculates adjustment data related to temperature correction based on measurements obtained by separately adjusting the temperature of the first constant temperature bath and the temperature of the second constant temperature bath. [Effects of the Invention]

[0008] According to the present invention, it is possible to obtain adjustment data that enables accurate temperature correction. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a diagram showing an overview of the adjustment device 10 according to Embodiment 1. [Figure 2] Figure 2 is a block diagram showing the configuration of the adjustment device 10 according to Embodiment 1. [Figure 3] Figure 3 shows a specific example of the adjustment device 10 according to Embodiment 1. [Figure 4] Figure 4 shows a specific example of the method for calculating adjustment data in the adjustment device 10 according to Embodiment 1. [Figure 5] Figure 5 shows a specific example of the method for calculating adjustment data in the adjustment device 10 according to Embodiment 1. [Figure 6] Figure 6 is a block diagram showing the configuration of the adjustment device 20 according to Embodiment 2. [Figure 7] Figure 7 shows a specific example of the adjustment device 20 according to Embodiment 2. [Figure 8] FIG. 8 is a diagram showing a specific example of a method for calculating adjustment data in the adjustment device 20 according to Embodiment 2. [Figure 9] FIG. 9 is a block diagram showing the configuration of the adjustment device 30 according to Embodiment 2. [Figure 10] FIG. 10 is a diagram showing a specific example of the adjustment device 30 according to Embodiment 2. [Figure 11] FIG. 11 is a diagram showing a specific example of a method for calculating adjustment data in the adjustment device 30 according to Embodiment 2. [Figure 12] FIG. 12 is a block diagram showing the configuration of the diaphragm vacuum gauge 40 according to Embodiment 3. [Figure 13] FIG. 13 is a diagram showing a specific example of the diaphragm vacuum gauge 40 according to Embodiment 3. [Figure 14] FIG. 14 is a block diagram showing the configuration of the diaphragm vacuum gauge 50 according to Embodiment 4. [Figure 15] FIG. 15 is a diagram showing a specific example of the diaphragm vacuum gauge 50 according to Embodiment 4. [Figure 16] FIG. 16 is a diagram showing an overview of an adjustment device in the prior art.

MODE FOR CARRYING OUT THE INVENTION

[0010] Hereinafter, embodiments of the adjustment device and the diaphragm vacuum gauge according to the present application will be described in detail based on the drawings. Note that the adjustment device and the diaphragm vacuum gauge according to the present application are not limited by this embodiment.

[0011] [Embodiment 1] In the following embodiments, the configuration and specific example of the adjustment device 10 according to Embodiment are described in order, and finally the effects according to Embodiment are described.

[0012] [1. Configuration example of the system] FIG. 1 is a diagram showing an overview of the adjustment device according to Embodiment 1. The adjustment device 10 has a first thermostatic chamber in which a sensor head is installed and a second thermostatic chamber in which a measurement circuit is installed, and calculates adjustment data regarding temperature correction using measurement values obtained by separately adjusting the temperatures of the respective thermostatic chambers.

[0013] Note that the sensor head installed in the first thermostatic chamber and the measurement circuit installed in the second thermostatic chamber are part of a diaphragm vacuum gauge, and the components of the diaphragm vacuum gauge that are the objects to be adjusted by the adjustment device 10 are not included in the configuration of the adjustment device 10.

[0014] The adjustment device 10 first sets the temperature of the first thermostatic chamber in which the sensor head is installed to a fixed temperature, changes the temperature of the second thermostatic chamber in which the measurement circuit is installed, and obtains measurement data at each temperature. Then, adjustment data regarding temperature correction is calculated so that the obtained measurement data matches the physical quantity of the measurement object 60 under each temperature condition. [[ID=,10]]

[0015] Next, the adjustment device 10 sets the temperature of the second thermostatic chamber in which the measurement circuit is installed to a fixed temperature, changes the temperature of the first thermostatic chamber in which the sensor head is installed, and obtains measurement data in which the temperature correction for the measurement circuit is performed by the above-described process for each temperature. Then, adjustment data regarding temperature correction is calculated so that the obtained measurement data matches the physical quantity of the measurement object 60 under each temperature condition.

[0016] In this way, the adjustment device 10 can obtain adjustment data that enables accurate temperature correction by separately changing the temperature of each of the sensor head and the measurement circuit with the respective thermostatic chambers and calculating the adjustment data from the measurement data at each temperature.

[0017] The measurement target 60 is a device that is measured by the sensor head and is installed together with the sensor head in the first constant temperature bath. For example, the measurement target 60 is a device such as a vacuum chamber used to measure the vacuum pressure required in a capacitive diaphragm vacuum gauge for semiconductor manufacturing equipment. This vacuum chamber is connected to a reference vacuum gauge located outside the constant temperature bath, and measurement data from the reference vacuum gauge is measured.

[0018] [2. Configuration of the adjustment device 10] Next, with reference to Figure 2, the configuration of the adjustment device 10 according to the embodiment shown in Figure 1 will be described. Figure 2 is a diagram showing an example of the configuration of the adjustment device according to Embodiment 1. As shown in Figure 2, the adjustment device 10 according to Embodiment 1 includes a first constant temperature bath 11, a second constant temperature bath 12, and a calculation unit 13.

[0019] A sensor head 11a, which is part of a diaphragm vacuum gauge, is installed in the first constant temperature bath 11. For example, the first constant temperature bath 11 is installed in a sensor head 11a, which is part of a diaphragm vacuum gauge and is used to measure vacuum pressure, and the temperature conditions of the sensor head 11a are changed by fixing or changing the temperature inside the constant temperature bath.

[0020] Furthermore, a heating element may be attached to the sensor head 11a installed in the first constant temperature bath. For example, a heating element may be attached to the sensor head 11a installed in the first constant temperature bath, which can change the temperature to an environment that cannot be changed by the first constant temperature bath.

[0021] The second constant temperature chamber 12 is equipped with a measurement circuit 12a, which is part of a diaphragm vacuum gauge. For example, the second constant temperature chamber 12 is equipped with a measurement circuit that performs temperature correction processing using adjustment data calculated by the adjustment device 10 on the data measured by the sensor head 11a, and changes the temperature conditions of the measurement circuit 12a by fixing or changing the temperature inside the constant temperature chamber.

[0022] The calculation unit 13 calculates adjustment data related to temperature correction based on measurements obtained by separately adjusting the temperature of the first constant temperature bath 11 and the temperature of the second constant temperature bath 12. The calculation unit 13 is, for example, an information processing terminal such as a computer.

[0023] The calculation unit 13, for example, separately adjusts the temperature of the first constant temperature bath 11 and the temperature of the second constant temperature bath 12, and calculates adjustment data for temperature correction for the sensor head 11a and the measurement circuit 12a from the measurement data obtained at each temperature and reference measurement data. The calculation unit 13 then stores the calculated adjustment data in the memory of the processing unit containing the measurement circuit. Polynomial correction and piecewise linear approximation correction using tables are used as methods for calculating the adjustment data.

[0024] Furthermore, the calculation unit 13 may calculate the adjustment data for the sensor head using measurements taken at a temperature lower than that of the measurement circuit 12a. For example, the calculation unit 13 calculates the adjustment data for the sensor head using measurement data when the temperature of the first constant temperature chamber 11, where the sensor head is installed, is lower than the temperature of the second constant temperature chamber 12, where the measurement circuit 12a is installed. The calculation unit 13 then stores the adjustment data corresponding to the sensor head in a memory within the processing unit having the measurement circuit.

[0025] As a result, the diaphragm vacuum gauge can obtain a temperature-corrected measurement with fewer temperature characteristics by using the adjustment data stored in the memory of the processing unit through the aforementioned process, within the control unit of the processing unit which has a measurement circuit.

[0026] [3. Specific examples of the adjustment device 10] Here, with reference to Figures 3 to 5, a specific example of the adjustment device 10 will be described. Figure 3 is a diagram showing a specific example of the adjustment device according to Embodiment 1. In the example of Figure 3, a sensor head is placed in the first constant temperature bath, and a heating element is attached to the sensor head. A vacuum chamber is also connected to the sensor head, and the sensor head measures the vacuum pressure of the vacuum chamber.

[0027] Furthermore, the second constant temperature bath is equipped with a processing unit that has a measurement circuit, and the processing unit is connected to the sensor head. In addition, a calculation unit equipped with a computer and measuring instruments is connected to a reference vacuum gauge that measures measurement data that serves as a reference for the vacuum pressure of the heating heater, the first constant temperature bath, the second constant temperature bath, the processing unit, and the vacuum chamber.

[0028] In the example shown in Figure 3, the temperature of the sensor head is first fixed using a heating element, and the temperature of the second constant-temperature bath is changed to alter the temperature of the processing unit, thereby obtaining pressure characteristic data at each temperature.

[0029] Here, referring to Figure 4, we will explain the method for calculating measurement data and adjustment data when the temperature of the sensor head is fixed and the temperature of the processing unit is changed. Figure 4 is a diagram showing a specific example of the method for calculating adjustment data in the adjustment device according to Embodiment 1. Figure 4 shows the measurement data when the sensor head is fixed at "200°C" by the heating heater and the temperature of the processing unit is set to "0°C", "25°C", and "50°C" by the second constant temperature bath.

[0030] The measurement data includes the pressure sensor output value "Vo" and the temperature sensor measurement value "CT" inside the circuit box. The obtained "Vo" and "CT" for each condition are substituted into equation (1) below, and a coefficient "aij" is determined so that "Vox" in equation (1) matches the measurement value of the reference pressure gauge for each condition. This coefficient "aij" is then stored in the memory of the processing unit as adjustment data for temperature correction in the processing unit.

[0031]

number

[0032] Next, the temperature of the processing unit is fixed using a second constant temperature bath, and the temperature of the sensor head is changed by varying the temperature of the first constant temperature bath and the temperature of the heating heater, thereby obtaining pressure characteristic data at each temperature.

[0033] Here, referring to Figure 5, we will explain the method for calculating measurement data and adjustment data when the temperature of the processing unit is fixed and the temperature of the sensor head is changed. Figure 5 is a diagram showing a specific example of the method for calculating adjustment data in the adjustment device according to Embodiment 1. Figure 5 shows the measurement data when the processing unit is fixed at "25°C" by the second constant temperature bath and the sensor head is set to "0°C", "100°C", and "200°C".

[0034] Here, by fixing the sensor head at "0°C" using the first constant temperature bath, it becomes possible to measure values ​​at temperatures lower than the processing unit temperature of "25°C," which could not be measured with conventional technology.

[0035] The measurement data includes the pressure sensor output value "Vox" and the temperature sensor measurement value "ST" inside the sensor head. The obtained "Vox" and "ST" for each condition are substituted into equation (2) below, and a coefficient "bij" is determined so that "Px" in equation (2) matches the measurement value of the reference pressure gauge for each condition. This coefficient "bij" is then stored in the memory of the processing unit as adjustment data for the temperature correction of the sensor head.

[0036]

number

[0037] Through the aforementioned series of processes, adjustment data for the temperature characteristics of the processing unit and the sensor head are created, enabling accurate pressure measurement without being affected by temperature during vacuum pressure measurement. Furthermore, by calculating adjustment data using measurement data when the sensor head temperature is lower than the processing unit temperature, more accurate adjustment data can be created than before.

[0038] [4. Effects of Embodiment 1] As described above, the adjustment device 10 according to Embodiment 1 comprises a first constant temperature bath 11 on which a sensor head 11a is installed, a second constant temperature bath 12 on which a measurement circuit 12a is installed, and a calculation unit 13 that calculates adjustment data related to temperature correction based on measured values ​​obtained by separately adjusting the temperature of the first constant temperature bath 11 and the temperature of the second constant temperature bath 12.

[0039] The first constant temperature bath 11 has a sensor head 11a installed in it, and the temperature of the sensor head 11a is fixed or changed by changing the temperature inside the constant temperature bath. The second constant temperature bath 12 has a measurement circuit 12a installed in it, and the temperature of the measurement circuit 12a is fixed or changed by changing the temperature inside the constant temperature bath. Furthermore, the calculation unit 13 calculates adjustment data related to temperature correction based on the measured values ​​obtained by separately adjusting the temperature of the first constant temperature bath 11 and the temperature of the second constant temperature bath 12.

[0040] As a result, the adjustment device 10 can obtain measurement data under various temperature conditions by separately adjusting the temperature of the first constant temperature bath 11 and the temperature of the second constant temperature bath 12, and calculate adjustment data that enables accurate temperature correction.

[0041] Furthermore, a heating element is attached to the sensor head 11a installed in the first constant temperature chamber 11 of the adjustment device 10. This allows the adjustment device 10 to fix or change the sensor head 11a to high-temperature conditions that cannot be changed in the first constant temperature chamber 11, and to obtain measurement data under high-temperature conditions. This has the effect of enabling the calculation of adjustment data that allows for more accurate temperature correction.

[0042] Furthermore, the calculation unit 13 calculates the sensor head adjustment data using measurements taken at a lower temperature for the sensor head than for the measurement circuit 12a. This allows the adjustment device 10 to calculate adjustment data that enables more accurate temperature compensation for the sensor head.

[0043] [Embodiment 2] In the above-described embodiment 1, a method was explained in which the adjustment device 10 is used to establish a one-to-one correspondence between the sensor head 11a and the measurement circuit 12a in order to calculate adjustment data. However, the method is not limited to this. For example, the sensor head 11a and the measurement circuit 12a may be adjusted separately, and adjustment data for each may be calculated.

[0044] Therefore, the following describes a method for separately adjusting the sensor head 11a and the measurement circuit 12a and calculating adjustment data using the adjustment device 20 and adjustment device 30 according to Embodiment 2. Note that the same configuration and processing as the adjustment device 10 according to Embodiment 1 will not be described.

[0045] In Embodiment 2, first, in order to obtain adjustment data for the measurement circuit 12a, an adjustment device 20 having a variable capacitor 21 is used instead of the first constant temperature bath in which the sensor head 11a is installed, and the adjustment data for the measurement circuit 12a is calculated. Next, in order to obtain adjustment data for the sensor head 11a, an adjustment device 30 having a reference measurement circuit 32 is used instead of the second constant temperature bath in which the measurement circuit 12a is installed, and the adjustment data for the sensor head 11a is calculated.

[0046] In Embodiment 2, by using normalized capacitance values ​​for both the output value of the sensor head 11a and the input value of the measurement circuit 12a, it becomes possible to calculate adjustment data separately.

[0047] [1. Configuration of the adjustment device 20] First, the configuration of the adjustment device 20 according to Embodiment 2 will be explained using Figure 6. Figure 6 is a block diagram showing the configuration of the adjustment device 20 according to Embodiment 2. As mentioned above, the adjustment device 20 is used when calculating adjustment data for the measurement circuit 12a, and differs from the adjustment device 10 according to Embodiment 1 shown in Figure 2 in that it has a variable capacitor 21 instead of the first constant temperature bath 11 on which the sensor head 11a is installed. The variable capacitor 21 is connected to the measurement circuit 12a and the calculation unit 13.

[0048] The variable capacitor 21 is, for example, a capacitor whose capacitance can be changed, and by being connected to the measurement circuit 12a, it inputs signals of various capacitance values ​​to the measurement circuit 12a. Furthermore, the input value of the variable capacitor 21 is used as a reference value in the calculation process of adjustment data by the calculation unit 13.

[0049] Furthermore, when multiple types of capacitance values ​​are input to the measurement circuit 12a, the number of variable capacitors 21 shall be increased according to the type of capacitance value. In addition, a variable capacitor 21 may be installed for each measurement circuit 12a and connected one-to-one, or a switch may be used to connect multiple measurement circuits 12a to a single variable capacitor 21. Moreover, the numerical value input to the measurement circuit 12a may not be a capacitance value, but a value proportional to the capacitance value, or a value obtained from a combination of multiple capacitance values ​​may be input.

[0050] [2. Specific examples of the adjustment device 20] Here, with reference to Figures 7 and 8, a specific example of the adjustment device 20 will be described. Figure 7 is a diagram showing a specific example of the adjustment device 20 according to Embodiment 2. In the example of Figure 7, a variable reference capacitor and a plurality of processing units installed in the second constant temperature bath are connected via a switch, and a calculation unit having a computer and measuring instruments is connected to the variable reference capacitor, the switch, and each of the processing units.

[0051] In the example shown in Figure 7, the temperature of the processing unit is changed by a second constant-temperature bath, and measurement data is obtained by inputting a variable reference capacitor. Now, referring to Figure 8, the method for calculating the measurement data and adjustment data measured in the example of Figure 7 will be explained. Figure 8 is a diagram showing a specific example of the method for calculating adjustment data in the adjustment device 20 according to Embodiment 2.

[0052] Figure 8 shows the measurement data when the processing unit is set to "0°C", "25°C", and "50°C" using the second constant temperature bath. Here, the measurement data and the coefficient "aij", which is the adjustment data for the measurement circuit of the processing unit, are the same as in the specific example of the adjustment device 10 according to Embodiment 1 described above. However, the adjustment device 20 according to Embodiment 2 differs from the adjustment device 10 according to Embodiment 1 in that it determines the coefficient "aij" to match the value of the variable reference capacitor instead of the measured value of the reference pressure gauge.

[0053] [3. Configuration of the adjustment device 30] Next, the configuration of the adjustment device 30 according to Embodiment 2 will be described using Figure 9. Figure 9 is a block diagram showing the configuration of the adjustment device 30 according to Embodiment 2. As mentioned above, the adjustment device 30 is used when calculating adjustment data for the sensor head 11a, and differs from the adjustment device 10 according to Embodiment 1 shown in Figure 2 in that it has a reference measurement circuit 32 instead of the second constant temperature bath 12 in which the measurement circuit 12a is installed. The reference measurement circuit 32 is connected to the sensor head 11a and the calculation unit 13.

[0054] The reference measurement circuit 32 is a measurement circuit adjusted using, for example, the adjustment data calculated by the adjustment device 20 according to the above-described embodiment 2, and is connected to the sensor head 11a to receive measurement data. Furthermore, since the reference measurement circuit 32 is adjusted using the above-described variable capacitor 21, the obtained measurement data is a normalized value.

[0055] The reference measurement circuit 32 may be installed for each sensor head 11a and connected one-to-one, or multiple sensor heads 11a may be connected to a single reference measurement circuit 32 using a switch. Alternatively, a capacity measuring instrument such as an LCR meter may be used instead of the reference measurement circuit 32.

[0056] [4. Specific examples of the adjustment device 30] Here, with reference to Figures 10 and 11, a specific example of the adjustment device 30 will be described. Figure 10 is a diagram showing a specific example of the adjustment device 30 according to Embodiment 2. In the example of Figure 10, a sensor head is placed in the first constant temperature bath, and a heating element is attached to the sensor head. A vacuum chamber is also connected to the sensor head, and the vacuum pressure of the vacuum chamber is measured.

[0057] A reference circuit box having a reference measurement circuit 32 and multiple sensor heads are connected via a switch, and a calculation unit having a computer and measuring instruments is connected to the reference processing unit, the switch, the reference vacuum gauge, the first constant temperature bath, and the heating heater.

[0058] In the example shown in Figure 10, the temperature of the sensor head is changed by a first constant temperature bath or heating heater to obtain vacuum pressure measurement data. Now, referring to Figure 11, the method for calculating the measurement data and adjustment data measured in the example in Figure 10 will be explained. Figure 11 is a diagram showing a specific example of the method for calculating adjustment data in the adjustment device 30 according to Embodiment 2.

[0059] Figure 11 shows the measurement data when the sensor head is set to "0°C", "100°C", and "200°C" by the first constant temperature bath or heating heater. Here, the measurement data and the coefficient "bij", which is the adjustment data for the sensor head, are obtained by the same method as in the specific example of the adjustment device 10 according to Embodiment 1 described above.

[0060] [5. Effects of Embodiment 2] As described above, the adjustment device 20 according to Embodiment 2 is used when calculating adjustment data for the measurement circuit 12a, and comprises a second constant temperature chamber 12 in which the measurement circuit 12a is installed, a variable capacitor 21, and a calculation unit 13 that calculates adjustment data related to temperature correction based on measured values ​​obtained by adjusting the temperature of the second constant temperature chamber 12.

[0061] The variable capacitor 21 inputs signals of various capacitance values ​​to the measurement circuit 12a, obtaining measurement data under various temperature conditions. The calculation unit 13 then calculates adjustment data for the measurement circuit 12a from the measurement data under each temperature condition and the reference value of the variable capacitor 21.

[0062] Furthermore, the adjustment device 30 according to Embodiment 2 is used when calculating adjustment data for the sensor head 11a, and comprises a first constant temperature bath 11 in which the sensor head 11a is installed, a reference measurement circuit 32, and a calculation unit 13 that calculates adjustment data related to temperature correction based on measured values ​​obtained by adjusting the temperature of the first constant temperature bath.

[0063] The reference measurement circuit 32 is a measurement circuit adjusted using adjustment data calculated by the adjustment device 30 according to the aforementioned embodiment 2. The calculation unit 13 then calculates adjustment data for the sensor head 11a from the measurement data under each temperature condition and the measurement data from the reference pressure gauge.

[0064] Therefore, in Embodiment 2, by sequentially performing the calculation of adjustment data for the measurement circuit 12a related to the adjustment device 20 and the calculation of adjustment data for the sensor head 11a related to the adjustment device 30, the sensor head 11a and the measurement circuit 12a are each adjusted individually, eliminating the need to use the sensor head 11a and the measurement circuit 12a as a pair.

[0065] Therefore, in Embodiment 2, if either the sensor head 11a or the measurement circuit 12a fails during use, the sensor head 11a and the measurement circuit 12a are each provided with memory to store their respective adjustment data, which has the effect of allowing only the faulty one to be replaced.

[0066] [Embodiment 3] In Embodiments 1 and 2 described above, a method for calculating adjustment data using adjustment device 10 or adjustment device 20, or adjustment device 30 was explained. Below, a diaphragm vacuum gauge having a non-volatile memory in which the adjustment data calculated by Embodiment 1 or Embodiment 2 is stored will be described.

[0067] The diaphragm vacuum gauge 40 according to Embodiment 3 includes a sensor head 11a, a processing unit 43, and a connection unit 42. The sensor head 11a is used to measure vacuum pressure. The processing unit 43 includes a non-volatile memory 43c for storing adjustment data obtained using the adjustment device of either Embodiment 1 or Embodiment 2, and a measurement circuit for performing correction calculations using the adjustment data stored in the non-volatile memory 43c. The connection unit 42 includes a connector or cable for connecting the sensor head 11a and the processing unit 43.

[0068] [1. Configuration of the diaphragm vacuum gauge 40] First, the configuration of the diaphragm vacuum gauge 40 according to Embodiment 3 will be described using Figure 12. Figure 12 is a block diagram showing the configuration of the diaphragm vacuum gauge 40 according to Embodiment 3. As shown in Figure 12, the diaphragm vacuum gauge 40 has a sensor head 11a, a connection part 42, and a processing unit 43.

[0069] The sensor head 11a is the same as the sensor head described in Embodiment 1 or Embodiment 2 above, and is used to measure the vacuum pressure of the object to be measured 60. For example, the sensor head 11a has a pressure sensor and a temperature sensor and is designed to operate normally even in high-temperature environments (150°C or higher).

[0070] The connection section 42 has a connector or cable that connects the sensor head 11a and the processing unit 43. For example, the connection section 42 has a coaxial composite connector or coaxial composite cable that connects the sensor head 11a and the processing unit 43.

[0071] The processing unit 43 includes a non-volatile memory 43c for storing adjustment data obtained using either the adjustment device described in Embodiment 1 or Embodiment 2 above, and a measurement circuit for performing correction calculations using the adjustment data stored in the non-volatile memory 43c.

[0072] For example, the processing unit 43 includes a communication unit 43a, a control unit 43b, and a non-volatile memory 43c. The communication unit 43a is implemented, for example, by a NIC (Network Interface Card) and is connected to external devices via wired or wireless means to enable communication.

[0073] The control unit 43b is realized by the execution of various programs stored in the internal memory of the processing unit 43 using RAM as the working area, by a CPU (Central Processing Unit) or MPU (Micro Processing Unit), etc.

[0074] Furthermore, the control unit 43b is implemented by an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array). In addition, the control unit 43b has a measurement circuit and performs correction calculations using adjustment data stored in the non-volatile memory 43c. For example, the control unit 43b uses the adjustment data for the sensor head 11a and the adjustment data for the measurement circuit, which are stored in the non-volatile memory 43c described later, to perform correction calculations on the measured value.

[0075] The non-volatile memory 43c is a storage device such as an EEPROM (Electrically Erasable and Programmable Read Only Memory) or flash memory. The non-volatile memory 43c stores the adjustment data obtained using either the adjustment device described in Embodiment 1 or Embodiment 2 above.

[0076] For example, the non-volatile memory 43c stores adjustment data for the sensor head and adjustment data for the measurement circuit, obtained using any of the adjustment devices 10, 20, or 30 described in Embodiment 1 or Embodiment 2 above.

[0077] [2. Specific examples of diaphragm vacuum gauge 40] Here, with reference to Figure 13, a specific example of the diaphragm vacuum gauge 40 will be described. Figure 13 is a diagram showing a specific example of the diaphragm vacuum gauge 40 according to Embodiment 3. In the example in Figure 13, a coaxial composite cable is fixed and connected to the sensor head, the coaxial composite cable is connected to a coaxial composite connector, and the coaxial composite connector is connected to a processing unit, thereby transmitting the measured value from the sensor head to the processing unit.

[0078] Furthermore, the memory of the processing unit stores adjustment data for the sensor head and adjustment data for the measurement circuit of the processing unit's CPU, both calculated using the adjustment device according to either Embodiment 1 or Embodiment 2. The measurement circuit then performs correction calculations on the transmitted measurement values ​​using the respective adjustment data stored in the memory, allowing the diaphragm vacuum gauge to calculate measurement values ​​with minimal temperature characteristics.

[0079] [3. Effects of Embodiment 3] As described above, the diaphragm vacuum gauge 40 according to Embodiment 1 has a sensor head 11a, a processing unit 43, and a connection unit 42. The sensor head 11a is used to measure vacuum pressure. The processing unit 43 has a non-volatile memory 43c in which adjustment data obtained using the adjustment device of either Embodiment 1 or Embodiment 2 is stored, and a measurement circuit that performs correction calculations using the adjustment data stored in the non-volatile memory 43c. The connection unit 42 has a connector or cable that connects the sensor head and the processing unit.

[0080] As a result, the diaphragm vacuum gauge 40 is stored in the non-volatile memory 43c of the processing unit 43, and by performing a correction calculation using adjustment data that enables accurate temperature correction calculated using the adjustment device according to either Embodiment 1 or Embodiment 2, it is possible to calculate a measurement value with fewer temperature characteristics.

[0081] [Embodiment 4] In the previously described embodiment 3, the adjustment data for the sensor head 11a and the adjustment data for the measurement circuit were stored in the non-volatile memory 43c of the processing unit 43 of the diaphragm vacuum gauge 40, but the invention is not limited to this. For example, a non-volatile memory 52a may be installed in the connector or cable of the connection part 52 of the diaphragm vacuum gauge 50, and the adjustment data for the sensor head 11a may be stored in the non-volatile memory 52a.

[0082] Therefore, the following description will focus on the case where a non-volatile memory 52a is installed in the connector or cable of the connection part 52 of the diaphragm vacuum gauge 50 according to Embodiment 4, and adjustment data for the sensor head 11a is stored in the non-volatile memory 52a. Note that the same configuration and processing as the diaphragm vacuum gauge 40 according to Embodiment 3 will not be described.

[0083] [1. Configuration of the diaphragm vacuum gauge 50] First, the configuration of the diaphragm vacuum gauge 50 according to Embodiment 4 will be described using Figure 14. Figure 14 is a block diagram showing the configuration of the diaphragm vacuum gauge 50 according to Embodiment 4. As shown in Figure 14, the diaphragm vacuum gauge 50 has a sensor head 11a, a connection part 52, and a processing unit 43.

[0084] Furthermore, the diaphragm vacuum gauge 50 according to Embodiment 4 differs from the diaphragm vacuum gauge 40 according to Embodiment 3 shown in Figure 12 in that the connection part 52 of the diaphragm vacuum gauge 50 has a non-volatile memory 52a, and adjustment data for the sensor head 11a is stored in the non-volatile memory 52a, while the non-volatile memory 43c of the processing unit 43 stores only adjustment data for the measurement circuit.

[0085] The connection section 52 has a non-volatile memory 52a in which adjustment data obtained using the adjustment device 30 of Embodiment 2 is stored, and has a connector or cable that connects the sensor head 11a and the processing unit 43. For example, the connection section 52 has a coaxial composite connector or coaxial composite cable having a non-volatile memory 52a in which adjustment data for the sensor head 11a calculated by the adjustment device 30 according to Embodiment 2 is stored.

[0086] The processing unit 43 includes a non-volatile memory 43c that stores adjustment data for the measurement circuit obtained using the adjustment device 20 of Embodiment 2, and a measurement circuit that performs correction calculations using the adjustment data stored in the non-volatile memory 43c and the non-volatile memory 52a.

[0087] Furthermore, the processing unit 43 has a communication unit 43a, a control unit 43b, and a non-volatile memory 43c, similar to the processing unit according to Embodiment 3 described above. However, compared to the processing unit 43 according to Embodiment 3, the non-volatile memory 43c stores adjustment data for the measurement circuit calculated by the adjustment device 20 according to Embodiment 1, and the measurement circuit of the control unit 43b uses the adjustment data stored in the non-volatile memory 43c and the non-volatile memory 52a, respectively, to perform correction calculations on the measured values.

[0088] [2. Specific example of a diaphragm vacuum gauge 50] Here, with reference to Figure 15, a specific example of the diaphragm vacuum gauge 50 will be described. Figure 15 is a diagram showing a specific example of the diaphragm vacuum gauge 50 according to Embodiment 4. In the example of Figure 15, the difference from the specific example of the diaphragm vacuum gauge 40 according to Embodiment 3 (see Figure 13) is that a non-volatile memory is installed in the coaxial composite connector on the sensor head side.

[0089] The non-volatile memory located in the coaxial composite connector on the sensor head side stores adjustment data for the sensor head, and the non-volatile memory in the processing unit stores adjustment data for the measurement circuit in the CPU. This allows the diaphragm vacuum gauge 50 to replace only the faulty component if either the sensor head or the processing unit fails.

[0090] [3. Effects of Embodiment 4] As described above, the diaphragm vacuum gauge 50 according to Embodiment 4 has a sensor head 11a, a processing unit 43, and a connection unit 52. The sensor head 11a is used to measure vacuum pressure, and the processing unit 43 has a non-volatile memory 43c that stores adjustment data for the measurement circuit obtained using the adjustment device 20 according to Embodiment 2, and a measurement circuit that performs correction calculations using the respective adjustment data stored in the non-volatile memory 43c and the non-volatile memory 52a.

[0091] Furthermore, the connection section 52 is equipped with a non-volatile memory 52a that stores adjustment data for the sensor head 11a obtained using the adjustment device 30 according to Embodiment 2, and has a connector or cable that connects the sensor head 11a and the processing unit 43.

[0092] As a result, the diaphragm vacuum gauge 50 can calculate measurement values ​​with fewer temperature characteristics by performing correction calculations using the adjustment data calculated by the adjustment devices 20 and 30 according to Embodiment 2.

[0093] Furthermore, the diaphragm vacuum gauge 50 stores the adjustment data for the measurement circuit calculated by the adjustment device 20 according to Embodiment 2 and the adjustment data for the sensor head calculated by the adjustment device 30 according to Embodiment 2 in separate non-volatile memories. This has the effect of allowing only the faulty component to be replaced if either the measurement circuit or the sensor head fails.

[0094] [others] Of the processes described in each of the embodiments described above, all or part of the processes described as being performed automatically can be performed manually, or all or part of the processes described as being performed manually can be performed automatically by known methods. In addition, the processing procedures, specific names, and information including various data and parameters shown in the above document and drawings can be changed at will unless otherwise specified. For example, the various information shown in each figure is not limited to the information shown.

[0095] Furthermore, the components of each illustrated device are functionally conceptual and do not necessarily need to be physically configured as shown. In other words, the specific forms of distribution and integration of each device are not limited to those illustrated, and all or part of them can be functionally or physically distributed and integrated in any unit according to various loads, usage conditions, etc.

[0096] The aforementioned components include those that can be easily conceived by a person skilled in the art, those that are substantially identical, and those that fall within the so-called equivalent range. Furthermore, the embodiments described above can be appropriately combined as long as the processing content is not contradictory.

[0097] Furthermore, the terms "section," "module," and "unit" mentioned above can be replaced with "means" or "circuit," etc. For example, a control unit can be replaced with a control means or a control circuit.

[0098] Although some embodiments of the present invention have been described in detail above with reference to the drawings, these are illustrative examples, and the present invention can be implemented in various other forms with modifications and improvements based on the knowledge of those skilled in the art, starting with the embodiments described in the disclosure section of the invention. [Explanation of Symbols]

[0099] 10, 20, 30 adjustment device 11. First constant temperature bath 11a Sensor head 12. Second constant temperature bath 12a Measurement Circuit 13 Calculation Section 21 Variable Capacitor 32. Reference measurement circuit 40, 50 diaphragm vacuum gauge 42, 52 Connection part 43 Processing Unit 43a Communications Department 43b Control Unit 43c, 52a Non-volatile memory 60 items to be measured

Claims

1. A first constant temperature chamber equipped with a sensor head used for measuring vacuum pressure, A second constant temperature chamber in which the measurement circuit is installed, A calculation unit calculates adjustment data related to temperature correction based on measurements obtained by separately adjusting the temperature of the first constant temperature bath and the temperature of the second constant temperature bath. An adjustment device characterized by comprising:

2. A heating element is attached to the aforementioned sensor head. The adjustment device according to feature 1.

3. The calculation unit calculates the adjustment data for the sensor head using measurements taken at a temperature lower than that of the measurement circuit. The adjustment device according to feature 1.

4. A second constant temperature chamber in which the measurement circuit is installed, A variable capacitor that changes capacitance, A calculation unit calculates adjustment data for temperature correction based on the measured value obtained by adjusting the temperature of the second constant temperature bath and the value input by the variable capacitor. An adjustment device characterized by comprising:

5. A first constant temperature chamber equipped with a sensor head used for measuring vacuum pressure, A reference measurement circuit with temperature correction adjusted based on adjustment data, A calculation unit calculates adjustment data for temperature correction based on the measurement value obtained by adjusting the temperature of the first constant temperature bath, using the capacity value of the sensor head or a measurement value normalized in proportion to the capacity value. An adjustment device characterized by comprising:

6. A diaphragm vacuum gauge having a sensor head, a processing unit, and a connection unit, The aforementioned sensor head is used to measure vacuum pressure. The aforementioned processing unit, A non-volatile memory in which adjustment data obtained using any of the adjustment devices described in claims 1 to 5 is stored, The system includes a measurement circuit that performs correction calculations using adjustment data stored in the non-volatile memory, The connection portion has a connector or cable that connects the sensor head and the processing unit. A diaphragm vacuum gauge characterized by the following features.

7. A diaphragm vacuum gauge having a sensor head, a connection part, and a processing part, The aforementioned sensor head is used to measure vacuum pressure. The connection portion is equipped with a first non-volatile memory in which adjustment data obtained using the adjustment device described in claim 5 is stored, and has a connector or cable connecting the sensor head and the processing unit. The aforementioned processing unit, A second non-volatile memory for storing adjustment data obtained using the adjustment device described in claim 4, The measurement circuit has a first non-volatile memory and a second non-volatile memory, respectively, which perform correction calculations using the adjustment data stored in the first and second non-volatile memories. A diaphragm vacuum gauge characterized by the following features.

Images