Curable composition for inkjet printing and air cavity formation, electronic component, and method for manufacturing electronic component

Abstract

Provided is a curable composition for an inkjet and air cavity formation from which a cured material layer having a high aspect ratio can be formed, and with which adhesiveness and sealing properties can be enhanced.　A curable composition for an inkjet and air cavity formation according to the present invention contains: a photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group; and a thermosetting compound not having a (meth)acryloyl group and having a cyclic ether group, wherein the content of the thermosetting compound is at least 5 wt% with respect to 100 wt% of the curable composition for an inkjet and air cavity formation, and when a B-staged product is obtained by irradiating the curable composition for an inkjet and air cavity formation with light having a wavelength of 365 nm so that the illuminance is 2,000 mW / cm2, the viscosity of the B-staged product at 40ºC is 2.5×102 Pa∙s to 3.0×106 Pa∙s.

Description

[Technical Field]

[0001] The present invention relates to a curable composition for inkjet applications and air cavity formation, which is applied using an inkjet device. The present invention also relates to an electronic component and a method for manufacturing an electronic component using the above-mentioned curable composition. [Background technology]

[0002] Communication filters contain an RDL layer and an air cavity (space) formed of metal or the like. Conventionally, the air cavity has been formed using sheet materials such as photosensitive polyimide resin sheets and epoxy resin sheets (for example, Patent Document 1 below). [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2010-278971 [Overview of the project] [Problems that the invention aims to solve]

[0004] Conventional methods for forming air cavities using sheet materials have high manufacturing costs and complex manufacturing processes. Furthermore, in conventional methods using sheet materials, when the periphery of the filter structure is molded with resin, the resin can penetrate the sheet material and enter the air cavity. To ensure the reliability of communication filters, it is necessary to prevent resin from entering the air cavity; therefore, superior sealing performance is required. If air cavities can be formed effectively using methods other than those involving sheet materials, this would contribute to lower manufacturing costs and simplify the manufacturing process.

[0005] One possible method involves using an inkjet device to apply a curable composition to a predetermined area and curing the applied curable composition to form an air cavity. For example, if the upper surface of a first member (lower member) and the side or lower surface of a second member (upper member) can be bonded together by a cured layer of the curable composition, an air cavity can be formed by the first member, the second member, and the cured layer. The performance of an inkjet-compatible curable composition used for air cavity applications requires the ability to increase the aspect ratio of the cured layer, to enhance the adhesion between the first and second members and the cured layer, and to enhance sealing performance.

[0006] However, conventional inkjet curable compositions make it difficult to form a cured layer with a large aspect ratio. Furthermore, conventional inkjet curable compositions make it difficult to increase the adhesion between the cured layer of the curable composition and the component. In addition, with conventional inkjet curable compositions, the curable composition may come into contact with electronic components placed around the component, such as a communication filter, which can reduce the sealing performance. For these reasons, it is difficult to use conventional inkjet curable compositions to form air cavities.

[0007] The object of the present invention is to provide an inkjet and air cavity forming curable composition that can form a cured layer with a large aspect ratio and can improve adhesion and sealing properties. The object of the present invention is also to provide an electronic component and a method for manufacturing an electronic component using the above curable composition. [Means for solving the problem]

[0008] According to a broad aspect of the present invention, a photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group, and a thermosetting compound not having a (meth)acryloyl group and having a cyclic ether group are included. In the curable composition for inkjet and air cavity formation, the content of the thermosetting compound is 5% by weight or more in 100% by weight of the curable composition. When the curable composition for inkjet and air cavity formation is irradiated with light having a wavelength of 365 nm at an illuminance of 2000 mW / cm 2 so as to obtain a B-stage product, when the viscosity of the B-stage product at 40 °C is 2.5×10 2 Pa·s or more and 3.0×10 6 Pa·s or less, a curable composition for inkjet and air cavity formation (hereinafter, may be abbreviated as "curable composition") is provided.

[0009] In a specific aspect of the curable composition according to the present invention, the photocurable compound includes a first photocurable compound having a total of 1 (meth)acryloyl group and vinyl group, and a second photocurable compound having a total of 2 or more (meth)acryloyl groups and vinyl groups.

[0010] In a specific aspect of the curable composition according to the present invention, the first photocurable compound is a photocurable compound having 1 (meth)acryloyl group, and the second photocurable compound is a photocurable compound having 2 or more (meth)acryloyl groups.

[0011] In a specific aspect of the curable composition according to the present invention, it does not contain or contains a photo- and thermosetting compound having a (meth)acryloyl group and a cyclic ether group. When it does not contain the photo- and thermosetting compound, the content of the second photocurable compound is 5% by weight or more and 25% by weight or less in 100% by weight of the photocurable compound. When it contains the photo- and thermosetting compound, the content of the second photocurable compound is 4% by weight or more and 20% by weight or less in 100% by weight of the total content of the photocurable compound and the photo- and thermosetting compound.

[0012] In a specific aspect of the curable composition according to the present invention, the curable composition contains a thermosetting agent.

[0013] In a specific aspect of the curable composition according to the present invention, the thermosetting agent contains an amine compound.

[0014] According to a broad aspect of the present invention, there are provided an electronic component including a first member, a second member, and an adhesive portion bonding an upper surface of the first member and a side surface or a lower surface of the second member, wherein an air cavity is formed by the first member, the second member, and the adhesive portion, and the adhesive portion is a cured product of the curable composition for inkjet and air cavity formation described above.

[0015] In a specific aspect of the electronic component according to the present invention, a ratio of a height of the adhesive portion to a width of the adhesive portion is 1.0 or more.

[0016] According to a broad aspect of the present invention, there is provided a method for manufacturing an electronic component, including: a coating step of forming a curable composition layer by applying the curable composition described above on a surface of a first member using an inkjet device; a photocuring step of advancing curing of the curable composition layer by irradiation with light to form a B-staged product layer; and a thermocuring step of thermally curing the B-staged product layer by heating, wherein in the coating step and the photocuring step, coating and photocuring are repeated in a thickness direction of the curable composition layer to form a B-staged product layer in contact with a side surface or a lower surface of a second member.

Advantages of the Invention

[0017] The inkjet and air cavity forming curable composition according to the present invention comprises a photocurable compound having a (meth)acryloyl group or a vinyl group and no cyclic ether group, and a thermosetting compound having a cyclic ether group but no (meth)acryloyl group. The content of the above thermosetting compound is 5% by weight or more in 100% by weight of the inkjet and air cavity forming curable composition according to the present invention. In the inkjet and air cavity forming curable composition according to the present invention, light with a wavelength of 365 nm and an illuminance of 2000 mW / cm 2 When a curable composition for inkjet printing and air cavity formation is irradiated to obtain a B-stage product, the viscosity of the B-stage product at 40°C is 2.5 × 10⁻⁶. 2 Pa·s or more 3.0×10 6 The Pa·s is less than or equal to the curable composition for inkjet printing and air cavity formation according to the present invention has the above configuration, so that a cured layer with a large aspect ratio can be formed and adhesion and sealing properties can be improved. [Brief explanation of the drawing]

[0018] [Figure 1] Figure 1 is a schematic cross-sectional view showing an electronic component obtained using the inkjet and air cavity forming curable composition according to the first embodiment of the present invention. [Figure 2] Figures 2(a) to 2(c) are cross-sectional views illustrating each step in the manufacturing process of the electronic component shown in Figure 1. [Figure 3] Figures 3(d) to 3(g) are cross-sectional views illustrating each step in the manufacturing process of the electronic component shown in Figure 1. [Modes for carrying out the invention]

[0019] The present invention will be described in detail below.

[0020] (Curable composition for inkjet printing and air cavity formation) The curable composition for inkjet and air cavity formation according to the present invention (hereinafter sometimes abbreviated as "curable composition") is applied and used by an inkjet device. The curable composition according to the present invention is different from the curable composition applied by screen printing and different from the curable composition applied by a dispenser.

[0021] The curable composition according to the present invention contains a photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group, and a thermosetting compound not having a (meth)acryloyl group and having a cyclic ether group. In 100% by weight of the curable composition according to the present invention, the content of the thermosetting compound is 5% by weight or more.

[0022] In this specification, the above-mentioned "photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group" may be referred to as "(A) photocurable compound".

[0023] In this specification, the above-mentioned "thermosetting compound not having a (meth)acryloyl group and having a cyclic ether group" may be referred to as "(B) thermosetting compound".

[0024] Therefore, the curable composition according to the present invention contains (A) photocurable compound and (B) thermosetting compound, and in 100% by weight of the curable composition according to the present invention, the content of (B) thermosetting compound is 5% by weight or more.

[0025] In the curable composition according to the present invention, when the curable composition is irradiated with light having a wavelength of 365 nm at an illuminance of 2000 mW / cm 2 so as to obtain a B-stage product, the viscosity of the B-stage product at 40 °C is 2 2.5×10 6 Pa·s or more and 3.0×10

[0026] The curable composition according to the present invention has the above-described configuration, which allows for the formation of a cured layer with a large aspect ratio and enhances adhesion and sealing properties. The curable composition according to the present invention allows for the formation of a cured layer with a large height-to-width ratio. Because the curable composition according to the present invention allows for the formation of a cured layer with a large aspect ratio, the distance between the members to be bonded (the distance between the first member and the second member) can be controlled to a desired distance. Furthermore, the curable composition according to the present invention can further enhance the adhesive strength between the members to be bonded (the first member and the second member) and the cured product (adhesive portion) of the curable composition. For this reason, the curable composition according to the present invention allows for the formation of a good air cavity between, for example, the first member (lower member), the second member (upper member), and the adhesive portion formed by the cured product of the curable composition. In addition, in electronic components in which an air cavity has been formed using the curable composition according to the present invention, delamination is less likely to occur between the first and second members and the adhesive portion even when a reflow process is performed.

[0027] The curable composition according to the present invention may or may not contain a photo- and thermosetting compound having a (meth)acryloyl group and a cyclic ether group.

[0028] In this specification, the above-mentioned "(meth)acryloyl group and cyclic ether group having photo and thermosetting compounds" may be referred to as "(C) photo and thermosetting compounds".

[0029] The above curable composition contains (A) a photocurable compound and (B) a thermosetting compound, and is therefore a photo- and thermosetting composition. The above curable composition is preferably used after curing by irradiation with light and then curing by heating.

[0030] Light with a wavelength of 365 nm and an illuminance of 2000 mW / cm² 2 The curable compositions for inkjet printing and air cavity formation are irradiated to obtain a B-stage compound. The viscosity of the above B-stage compound at 40°C is 2.5 × 10⁻⁶. 2Pa·s or more 3.0×10 6 The viscosity of the above B-stage compound at 40°C is 2.5 × 10⁻⁶. 2 If the viscosity is less than Pa·s, it becomes difficult to form a cured layer with a large aspect ratio, or to improve sealing performance. The viscosity of the above B-stage compound at 40°C is 3.0 × 10⁻⁶. 6 Beyond a certain point, it becomes difficult to improve adhesion or sealing properties.

[0031] The viscosity of the above B-stage compound at 40°C is preferably 3.0 × 10⁻⁶. 3 Pa·s or higher, more preferably 4.0 × 10 3 Pa·s or more, more preferably 5.0 × 10 3 Pa·s or more, more preferably 7.5 × 10 3 Pa·s or higher, particularly preferably 1.0 × 10 4 Pa·s or higher, most preferably 2.0 × 10 4 The viscosity is Pa·s or higher. The viscosity of the above B-stage compound at 40°C is preferably 1.0 × 10⁻⁶. 6 Pa·s or less, more preferably 3.0 × 10 5 Pa·s or less, more preferably 1.0 × 10 5 The viscosity is less than or equal to Pa·s. If the viscosity of the above B-stage compound at 40°C is above the above lower limit, a cured layer with a large aspect ratio can be formed more effectively, and the sealing properties can be further improved. If the viscosity of the above B-stage compound at 40°C is below the above upper limit, the adhesion and sealing properties can be further improved. The viscosity of the above B-stage compound at 40°C is 7.5 × 10⁻⁶. 3 It may be less than or equal to Pa·s, 6.5 × 10 3 Pa·s may be used below.

[0032] The B-stage compound used to measure viscosity at 40°C is, more specifically, measured at an illuminance of 2000 mW / cm² at a wavelength of 365 nm. 2 The cumulative light intensity is 20,000 mJ / cm². 2 This is obtained by irradiating a curable composition for inkjet printing and air cavity formation with light.

[0033] The viscosity of the above B-stage compound at 40°C is measured using a viscoelasticity measuring device (e.g., "ARES" viscoelasticity measuring device manufactured by T.A. Instruments) under the conditions of 40°C, a measuring plate: a parallel plate with a diameter of 8 mm, and a frequency of 1 Hz. In this specification, the viscosity of the above B-stage compound refers to the complex viscosity (η*).

[0034] Methods for adjusting the viscosity of the above B-stage compound at 40°C to a preferred range include, for example, (A) appropriately selecting the type of photocurable compound, and adjusting the content of the first photocurable compound and the second photocurable compound described later. In particular, from the viewpoint of making the viscosity of the above B-stage compound at 40°C above the lower limit, it is preferable to increase the content of the second photocurable compound.

[0035] The details of each component contained in the above curable composition are described below. In this specification, "(meth)acryloyl" means either or both "acryloyl" and "methacryloyl," and "(meth)acrylate" means either or both "acrylate" and "methacrylate." In this specification, the CH2=CH group of the (meth)acryloyl group is not included in the vinyl group.

[0036] <(A) Photocurable compound> The above curable composition contains (A) a photocurable compound. (A) is a photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group. (A) may have a (meth)acryloyl group, may have a vinyl group, or may have both a (meth)acryloyl group and a vinyl group. The (meth)acryloyl group and the vinyl group are photocurable functional groups. (A) does not have, for example, an epoxy group (cyclic ether group). (A) may be used alone or in combination of two or more.

[0037] From the viewpoint of exhibiting the effects of the present invention more effectively, (A) the photocurable compound preferably includes a first photocurable compound having a total of one (meth)acryloyl group and one vinyl group, and preferably includes a second photocurable compound having a total of two or more (meth)acryloyl groups and one vinyl group. The first photocurable compound may have one (meth)acryloyl group and no vinyl group, or it may have one vinyl group and no (meth)acryloyl group. The second photocurable compound may have a total of two (meth)acryloyl groups and one vinyl group, or three or more.

[0038] From the viewpoint of exhibiting the effects of the present invention even more effectively, it is more preferable that (A) the photocurable compound comprises a first photocurable compound having a total of one (meth)acryloyl group and one vinyl group, and a second photocurable compound having a total of two or more (meth)acryloyl groups and one vinyl group. The first photocurable compound and the second photocurable compound may be used individually, or two or more may be used in combination.

[0039] From the viewpoint of exhibiting the effects of the present invention more effectively and forming a curable composition layer with high precision, (A) the photocurable compound preferably has a (meth)acryloyl group. (A) The photocurable compound preferably is a (meth)acrylate compound. From the viewpoint of exhibiting the effects of the present invention more effectively and forming a curable composition layer with high precision, the first photocurable compound is preferably a photocurable compound having one (meth)acryloyl group, and the second photocurable compound is preferably a photocurable compound having two or more (meth)acryloyl groups. That is, the first photocurable compound is preferably a monofunctional (meth)acrylate compound, and the second photocurable compound is preferably a polyfunctional (meth)acrylate compound.

[0040] The monofunctional (meth)acrylate compounds that are the first photocurable compounds mentioned above include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, and methoxy Examples include diethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypropylene glycol (meth)acrylate, methoxydipropylene glycol (meth)acrylate, isodecyl (meth)acrylate, isononyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentadienyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycerol mono (meth)acrylate, 2-ethylhexyl (meth)acrylate, dihydroxycyclopentadienyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate, and stearyl (meth)acrylate.

[0041] The second photocurable compound described above may be a bifunctional (meth)acrylate compound or a trifunctional (meth)acrylate compound. The second photocurable compound described above may be a trifunctional or more functional (meth)acrylate compound or a tetrafunctional or more functional (meth)acrylate compound. The second photocurable compound described above may be a (meth)acrylate compound having two (meth)acryloyl groups or a (meth)acrylate compound having three (meth)acryloyl groups. The second photocurable compound described above may be a (meth)acrylate compound having three or more (meth)acryloyl groups or a (meth)acrylate compound having four or more (meth)acryloyl groups. The second photocurable compound described above may be a (meth)acrylate compound having ten or fewer (meth)acryloyl groups.

[0042] Examples of the above-mentioned difunctional (meth)acrylate compounds include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butylethylpropanediol (meth)acrylate, ethoxylated cyclohexanemethanol di(meth)acrylate, and ethoxylated bisphenol. Examples include ol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, tricyclodecane di(meth)acrylate, tricyclodecanedimethanol di(meth)acrylate, urethane (meth)acrylate, and dipropylene glycol di(meth)acrylate.

[0043] Examples of the above trifunctional (meth)acrylate compounds include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, alkylene oxide-modified trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl) ether, alkylene oxide-modified isocyanuric acid tri(meth)acrylate, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl) isocyanurate, and sorbitol tri(meth)acrylate.

[0044] Examples of the above-mentioned tetrafunctional (meth)acrylate compounds include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol tetra(meth)acrylate propionate.

[0045] Examples of the five-functional (meth)acrylate compounds mentioned above include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.

[0046] Examples of the hexafunctional (meth)acrylate compounds mentioned above include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.

[0047] Examples of photocurable compounds (A) having a vinyl group include vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, α-methylstyrene, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, and N-vinylformamide.

[0048] In 100% by weight of the above curable composition, the content of (A) photocurable compound is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and particularly preferably 15% by weight or more. In 100% by weight of the above curable composition, the content of (A) photocurable compound is preferably 80% by weight or less, more preferably 70% by weight or less, even more preferably 65% ​​by weight or less, even more preferably 60% by weight or less, even more preferably 50% by weight or less, and particularly preferably 40% by weight or less. When the content of (A) photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0049] In 100% by weight of the above curable composition, the content of the first photocurable compound is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, preferably 55% by weight or less, more preferably 45% by weight or less, and even more preferably 35% by weight or less. When the content of the first photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0050] If the curable composition does not contain (C) a photocurable compound, the content of the first photocurable compound in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 20% by weight or more, preferably 55% by weight or less, more preferably 45% by weight or less, and even more preferably 35% by weight or less. When the content of the first photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0051] If the curable composition contains (C) a photocurable compound, the content of the first photocurable compound in 100% by weight of the curable composition is preferably 2% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, preferably 65% ​​by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less. When the content of the first photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0052] In 100% by weight of the above curable composition, the content of the second photocurable compound is preferably 1% by weight or more, more preferably 2% by weight or more, even more preferably 3% by weight or more, preferably 25% by weight or less, more preferably 15% by weight or less, and even more preferably 10% by weight or less. When the content of the second photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0053] If the curable composition does not contain (C) a photocurable compound, the content of the second photocurable compound in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 6% by weight or more, even more preferably 7% by weight or more, preferably 25% by weight or less, more preferably 20% by weight or less, and even more preferably 15% by weight or less. When the content of the second photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0054] If the curable composition contains (C) a photocurable and thermocurable compound, the content of the second photocurable compound in 100% by weight of the curable composition is preferably 4% by weight or more, more preferably 5% by weight or more, even more preferably 6% by weight or more, preferably 20% by weight or less, more preferably 18% by weight or less, and even more preferably 16% by weight or less. When the content of the second photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0055] In 100% by weight of the above curable composition, the total content of the first photocurable compound and the second photocurable compound is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 60% by weight or less. When the total content is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0056] If the curable composition does not contain (C) photocurable compounds, the total content of the first photocurable compound and the second photocurable compound in 100% by weight of the curable composition is preferably 10% by weight or more, more preferably 15% by weight or more, and even more preferably 20% by weight or more. If the curable composition does not contain (C) photocurable compounds, the total content of the first photocurable compound and the second photocurable compound in 100% by weight of the curable composition is preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 60% by weight or less. When the total content is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0057] If the curable composition contains (C) a photo- and thermosetting compound, the total content of the first photo-curable compound and the second photo-curable compound in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 10% by weight or more, and even more preferably 15% by weight or more. If the curable composition contains (C) a photo- and thermosetting compound, the total content of the first photo-curable compound and the second photo-curable compound in 100% by weight of the curable composition is preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 60% by weight or less. When the total content is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0058] (A) The content of the first photocurable compound in 100% by weight of the photocurable compound is preferably 25% by weight or more, more preferably 30% by weight or more, even more preferably 35% by weight or more, preferably 90% by weight or less, more preferably 80% by weight or less, and even more preferably 75% by weight or less. When the content of the first photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0059] (A) The content of the second photocurable compound in 100% by weight of the photocurable compound is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, preferably 60% by weight or less, more preferably 55% by weight or less, and even more preferably 50% by weight or less. When the content of the second photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0060] If the above curable composition does not contain (C) a photocurable compound, the content of the second photocurable compound in 100% by weight of the (A) photocurable compound is preferably 5% by weight or more, more preferably 10% by weight or more, preferably 25% by weight or less, and more preferably 20% by weight or less. When the content of the second photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0061] If the curable composition contains (C) a photo- and thermosetting compound, the content of the second photocurable compound is preferably 4% by weight or more, more preferably 10% by weight or more, preferably 20% by weight or less, and more preferably 15% by weight or less, in the total content of (A) the photocurable compound and (C) the photo- and thermosetting compound as a whole (100% by weight). When the content of the second photocurable compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0062] <(B) Thermosetting compound> The above curable composition contains (B) a thermosetting compound. (B) is a thermosetting compound that does not have a (meth)acryloyl group and has a cyclic ether group. The cyclic ether group is a thermosetting functional group. Only one of (B) thermosetting compounds may be used, or two or more may be used in combination.

[0063] (B) Examples of the cyclic ether group possessed by the thermosetting compound include epoxy groups. (B) The thermosetting compound may have only one type of cyclic ether group, or it may have two or more types.

[0064] From the viewpoint of exhibiting the effects of the present invention more effectively and forming a curable composition layer with high precision, (B) the cyclic ether group of the thermosetting compound is preferably an epoxy group. (B) The thermosetting compound is preferably an epoxy group. (B) The thermosetting compound is preferably an epoxy compound.

[0065] (B) The thermosetting compound may include a first thermosetting compound having one cyclic ether group, or a second thermosetting compound having two or more cyclic ether groups. (B) The thermosetting compound may include an epoxy compound having one epoxy group (a monofunctional epoxy compound), or an epoxy compound having two or more epoxy groups (a polyfunctional epoxy compound). The first thermosetting compound and the second thermosetting compound may each be used individually, or two or more may be used in combination.

[0066] From the viewpoint of exhibiting the effects of the present invention more effectively, (B) the thermosetting compound preferably includes an epoxy compound having two or more epoxy groups, and more preferably is an epoxy compound having two or more epoxy groups.

[0067] From the viewpoint of exhibiting the effects of the present invention even more effectively, (B) the thermosetting compound preferably includes an epoxy compound having two epoxy groups, and more preferably is an epoxy compound having two epoxy groups.

[0068] Examples of the epoxy compounds mentioned above include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine core as their skeleton.

[0069] From the viewpoint of achieving the effects of the present invention, and in particular from the viewpoint of increasing the adhesive strength between the member to be bonded and the cured product (adhesive portion) of the curable composition, the content of (B) thermosetting compound is 5% by weight or more in 100% by weight of the curable composition.

[0070] In 100% by weight of the above curable composition, the content of (B) thermosetting compound is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, preferably 50% by weight or less, more preferably 40% by weight or less, and even more preferably 35% by weight or less. When the content of (B) thermosetting compound is above the lower limit and below the upper limit, the effects of the present invention can be exhibited more effectively, and the adhesive strength between the member to be bonded and the cured product (adhesive portion) of the curable composition can be further increased.

[0071] In 100% by weight of the above curable composition, the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 7% by weight or more, more preferably 12% by weight or more, even more preferably 17% by weight or more, particularly preferably 20% by weight or more, and most preferably 30% by weight or more. In 100% by weight of the above curable composition, the total content of (A) the photocurable compound and (B) the thermosetting compound is preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the above total content is above the lower limit and below the upper limit, the effects of the present invention can be exhibited even more effectively.

[0072] <(C) Photo and thermosetting compounds> The above curable composition may or may not contain (C) a photo- and thermosetting compound. The (C) photo- and thermosetting compound is a photo- and thermosetting compound having a (meth)acryloyl group and a cyclic ether group. From the viewpoint of further increasing the adhesive strength between the member to be bonded and the cured product (adhesive part) of the curable composition, it is preferable that the above curable composition contains (C) a photo- and thermosetting compound. The (meth)acryloyl group is a photocurable functional group, and the cyclic ether group is a thermosetting functional group. Only one type of (C) photo- and thermosetting compound may be used, or two or more types may be used in combination.

[0073] (C) The photo- and thermosetting compounds may have one (meth)acryloyl group or two or more.

[0074] (C) Examples of the cyclic ether groups that the photo- and thermosetting compounds may have include epoxy groups. (C) The photo- and thermosetting compounds may have only one type of cyclic ether group, or two or more types.

[0075] From the viewpoint of exhibiting the effects of the present invention more effectively and further increasing the adhesive strength between the member to be bonded and the cured product (adhesive portion) of the curable composition, it is preferable that the cyclic ether group of (C) the photo- and thermosetting compound is an epoxy group. It is preferable that (C) the photo- and thermosetting compound has a (meth)acryloyl group and an epoxy group.

[0076] (C) The photo- and thermosetting compounds may have one, two, or more cyclic ether groups. (C) The photo- and thermosetting compounds may have one, two, or more epoxy groups.

[0077] (C) Examples of photo- and thermosetting compounds include glycidyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glycidyl ether.

[0078] (C) The photo- and thermosetting compound preferably contains glycidyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate glycidyl ether, and more preferably contains 4-hydroxybutyl (meth)acrylate glycidyl ether. (C) The photo- and thermosetting compound is even more preferably contains 4-hydroxybutyl acrylate glycidyl ether. In this case, the effects of the present invention can be exhibited more effectively, and the adhesive strength between the member to be bonded and the cured product (adhesive portion) of the curable composition can be further increased.

[0079] In 100% by weight of the above curable composition, the content of (C) photo- and thermosetting compounds is preferably 5% by weight or more, more preferably 10% by weight or more, preferably 70% by weight or less, more preferably 65% ​​by weight or less, and even more preferably 60% by weight or less. When the content of (C) photo- and thermosetting compounds is above the lower limit and below the upper limit, the effects of the present invention can be exhibited more effectively, and the adhesive strength between the member to be bonded and the cured product (adhesive portion) of the curable composition can be further increased.

[0080] In 100% by weight of the above curable composition, the total content of (A) the photocurable compound and (C) the photo and thermocurable compound is preferably 15% by weight or more, more preferably 20% by weight or more, even more preferably 30% by weight or more, preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the total content is above the lower limit and below the upper limit, the effects of the present invention can be exhibited more effectively, and the adhesive strength between the member to be bonded and the cured product (adhesive portion) of the curable composition can be further increased.

[0081] In 100% by weight of the above curable composition, the total content of (B) thermosetting compound and (C) light and thermosetting compound is preferably 17% by weight or more, more preferably 20% by weight or more, even more preferably 25% by weight or more, preferably 70% by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less. When the above total content is above the lower limit and below the upper limit, the effects of the present invention can be exhibited more effectively, and the adhesive strength between the member to be bonded and the cured product (adhesive part) of the curable composition can be further increased.

[0082] <Photopolymerization initiator> The above curable composition preferably contains a photopolymerization initiator. The photopolymerization initiator may be used alone or in combination of two or more.

[0083] Examples of the above-mentioned photopolymerization initiators include photoradical polymerization initiators and photocationic polymerization initiators. The above-mentioned photopolymerization initiator is preferably a photoradical polymerization initiator.

[0084] The above-mentioned photoradical polymerization initiator is a compound that generates radicals upon irradiation with light and initiates a radical polymerization reaction.Examples of the above photoradical polymerization initiators include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 2-hydroxy-2-methyl-1-phenyl-propan-1-one; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1 -one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, N,N-dimethylaminoacetophenone and other aminoacetophenone compounds; anthraquinone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone; 2,4-dimethyl Thioxanthone compounds such as thioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyloxime)], ethano Examples include oxime ester compounds such as 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(o-acetyloxime); and titanocene compounds such as bis(cyclopentadienyl)-di-phenyl-titanium, bis(cyclopentadienyl)-dichloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, and bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrole-1-yl)phenyl)titanium.The above-mentioned photoradical polymerization initiator may be used alone or in combination of two or more types.

[0085] Along with the above-mentioned photoradical polymerization initiator, a photopolymerization initiator aid may also be used. Examples of such photopolymerization initiator aids include ethyl N,N-dimethylaminobenzoate, isoamyl N,N-dimethylaminobenzoate, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. Other photopolymerization initiator aids may also be used. The above-mentioned photopolymerization initiator aids may be used individually or in combination of two or more.

[0086] Additionally, titaniumene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals), which have absorption in the visible light region, may be used to promote the photoreaction.

[0087] Examples of the above-mentioned photocationic polymerization initiators include sulfonium salts, iodonium salts, metallocene compounds, and benzointosylates. One of these photocationic polymerization initiators may be used, or two or more may be used in combination.

[0088] In 100% by weight of the above curable composition, the content of the above photopolymerization initiator is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, even more preferably 1% by weight or more, preferably 30% by weight or less, more preferably 20% by weight or less, and even more preferably 10% by weight or less.

[0089] <Thermosetting agent> The above curable composition preferably contains a thermosetting agent. The thermosetting agent may be used alone or in combination of two or more types.

[0090] Examples of the above-mentioned thermosetting agents include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. Modified polyamine compounds such as amine-epoxy adducts may also be used as the above-mentioned thermosetting agent. Other thermosetting agents may also be used.

[0091] The above-mentioned amine compounds refer to compounds having one or more primary to tertiary amino groups. Examples of the above-mentioned amine compounds include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, hydrazides, and guanidine derivatives. In addition, adduct forms such as epoxy compound-added polyamines (reaction products of epoxy compounds and polyamines), Michael-added polyamines (reaction products of α,β-unsaturated ketones and polyamines), Mannich-added polyamines (condensates of polyamines, formalin, and phenol), thiourea-added polyamines (reaction products of thiourea and polyamines), and ketone-blocked polyamines (reaction products of ketone compounds and polyamines [ketimines]) may be used as the above-mentioned amine compounds.

[0092] Examples of the above-mentioned aliphatic polyamines include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

[0093] Examples of the above-mentioned alicyclic polyamines include mensendiamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.

[0094] Examples of the above aromatic polyamines include m-phenylenediamine, p-phenylenediamine, o-xylenediamine, m-xylenediamine, p-xylenediamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, 1,3-bis(4-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline), and 4,4-diaminodiphenylsulfone.

[0095] Examples of the above-mentioned hydrazides include carbodihydrazide, adipic acid dihydrazide, sebacate acid dihydrazide, dodecanediic acid dihydrazide, and isophthalic acid dihydrazide.

[0096] Examples of the above guanidine derivatives include dicyandiamide, 1-o-tolyl diguanide, α-2,5-dimethylguanide, α,ω-diphenyl diguanidide, α,α-bisguanylguanidinodiphenyl ether, p-chlorophenyl diguanide, α,α-hexamethylenebis[ω-(p-chlorophenol)] diguanide, phenyl diguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.

[0097] Examples of the above-mentioned phenol compounds include polyhydric phenol compounds. Examples of the above-mentioned polyhydric phenol compounds include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabrombisphenol A, bisphenol F, bisphenol S, 4,4'-biphenylphenol, naphthalene skeleton-containing phenol novolac resin, xylylene skeleton-containing phenol novolac resin, dicyclopentadiene skeleton-containing phenol novolac resin, and fluorene skeleton-containing phenol novolac resin.

[0098] Examples of the above-mentioned acid anhydrides include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecyl succinic anhydride, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.

[0099] The above-mentioned thermosetting agent is preferably a thermosetting agent other than an acid anhydride. Acid anhydrides are relatively volatile compounds. Therefore, by using a thermosetting agent other than an acid anhydride, contamination of electronic components due to the volatilization of the thermosetting agent can be suppressed. Furthermore, by using a thermosetting agent other than an acid anhydride, the adhesive strength between the member to be bonded and the cured product (adhesive part) of the curable composition can be further increased.

[0100] The above-mentioned thermosetting agent preferably contains an amine compound, and more preferably is an amine compound. The above-mentioned amine compound is preferably an aromatic amine compound. In this case, the adhesive strength between the member to be bonded and the cured product (adhesive portion) of the curable composition can be further increased.

[0101] In 100% by weight of the above curable composition, the content of the above thermosetting agent is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, preferably 40% by weight or less, more preferably 30% by weight or less, and even more preferably 25% by weight or less.

[0102] <Curing accelerator> The above-mentioned curable composition may or may not contain a curing accelerator. The curing accelerator may be used alone or in combination of two or more types.

[0103] Examples of the curing accelerators mentioned above include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, and urea compounds.

[0104] In 100% by weight of the above curable composition, the content of the above curing accelerator is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, preferably 10% by weight or less, and more preferably 5% by weight or less.

[0105] <Solvent> The above curable composition may or may not contain a solvent. The above solvent may be used alone or in combination of two or more types.

[0106] Examples of the solvents mentioned above include water and organic solvents.

[0107] From the viewpoint of further improving the ability to remove residues, the above solvent is preferably an organic solvent.

[0108] Examples of the above-mentioned organic solvents include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum-based solvents such as petroleum ether and naphtha.

[0109] From the viewpoint of further improving the thickness accuracy of the curable composition layer, it is preferable to have a lower solvent content in the curable composition.

[0110] When the curable composition contains the solvent, the content of the solvent in 100% by weight of the curable composition is preferably 5% by weight or less, more preferably 1% by weight or less, and even more preferably 0.5% by weight or less. It is most preferable that the curable composition does not contain the solvent.

[0111] <Other ingredients> The above-mentioned curable composition may contain other components besides those described above. These other components are not particularly limited, but may include adhesive aids such as coupling agents, fillers, leveling agents, defoamers, and polymerization inhibitors.

[0112] (Further details on the curable composition) The above curable composition is applied using an inkjet device and is generally liquid at 25°C. The viscosity of the above curable composition at 25°C and 10 rpm is preferably 3 mPa·s or more, more preferably 5 mPa·s or more, even more preferably 10 mPa·s or more, still more preferably 160 mPa·s or more, preferably 2000 mPa·s or less, more preferably 1600 mPa·s or less, and still more preferably 1500 mPa·s or less. From the viewpoint of further improving the thickness accuracy of the curable composition layer and further making it less likely for voids to occur in the curable composition layer, it is particularly preferable that the viscosity of the above curable composition at 25°C and 10 rpm is 160 mPa·s or more and 1600 mPa·s or less.

[0113] The above viscosity is measured at 25°C using an E-type viscometer (for example, "TVE22L" manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.

[0114] The above curable composition is exposed to light with a wavelength of 365 nm at an irradiance of 2000 mW / cm². 2It is preferable that the above-mentioned inkjet and air cavity forming curable composition is irradiated to obtain a B-stage product such that the B-stage product has a height-to-width ratio (height / width) (aspect ratio) of 1.0 or more. It is preferable that the above-mentioned curable composition is capable of forming a B-stage product with a height-to-width ratio of 1.5 or more, more preferably capable of forming a B-stage product with a height-to-width ratio of 2.0 or more, and even more preferably capable of forming a B-stage product with a height-to-width ratio of 2.5 or more. If the above-mentioned curable composition is capable of forming a B-stage product with a height-to-width ratio of 1.0 or more, it is possible to form a cured layer with a large height-to-width ratio (aspect ratio), and the adhesion and sealing properties can be further improved. The height-to-width ratio may be 100 or less, 50 or less, 10 or less, or 5.0 or less.

[0115] The B-stage material for measuring the above ratio (height / width) can be formed by the following method: Apply the curable composition using an inkjet device to form a curable composition layer (coating step). Then, an illuminance of 2000 mW / cm at a wavelength of 365 nm is applied. 2 The cumulative light intensity is 200 mJ / cm². 2 The curable composition layer is irradiated with light to promote the curing of the curable composition layer and form a B-stage compound (B-stage compound layer) (photocuring step). In the above coating step and the above photocuring step, coating and photocuring are repeated in the thickness direction of the curable composition layer to form a B-stage compound (B-stage compound layer).

[0116] The curable composition according to the present invention can form a cured layer with a large ratio of height to width. The curable composition according to the present invention can be suitably used to form a cured layer with a height-to-width ratio (height / width) (aspect ratio) of 1.0 or more (use of the curable composition for forming a cured layer with a height-to-width ratio (height / width) (aspect ratio) of 1.0 or more). The above ratio (height / width) of the cured layer is preferably 1.5 or more, more preferably 2.0 or more, even more preferably 2.5 or more, and may be 100 or less, 50 or less, 10 or less, or 5.0 or less.

[0117] Using the above curable composition, a first member and a second member can be bonded together, and an air cavity can be formed. Using the above curable composition, an electronic component having an air cavity can be manufactured. Preferably, the above curable composition is used to bond the upper surface of the first member to the side or lower surface of the second member, and more preferably, it is used to bond the upper surface of the first member to the side surface of the second member. In this case, the above curable composition may also be used to bond the upper surface of the first member to the side and upper surface of the second member.

[0118] Further details regarding the first and second components will be described later.

[0119] (Electronic components and methods for manufacturing electronic components) The electronic component according to the present invention comprises a first member, a second member, and an adhesive portion that bonds the upper surface of the first member to the side or lower surface of the second member, and an air cavity is formed by the first member, the second member, and the adhesive portion. In the electronic component according to the present invention, the adhesive portion is a cured product of the inkjet and air cavity forming curable composition described above.

[0120] The manufacturing method for the above electronic component preferably comprises the following steps (1) to (3): (1) A coating step in which the above-mentioned curable composition is applied to the surface of the first member using an inkjet device to form a curable composition layer. (2) A photocuring step in which the curing of the curable composition layer is advanced by irradiation with light to form a B-stage compound layer. (3) A thermocuring step in which the B-stage compound layer is heat-cured.

[0121] In the above-described method for manufacturing electronic components, it is preferable to form a B-stage compound layer in contact with the side or bottom surface of the second member by repeating the coating step and the photocuring step in the thickness direction of the curable composition layer.

[0122] Specific embodiments of the present invention will be described below with reference to the drawings. Note that the size, thickness, and shape shown in the following drawings may differ from the actual size, thickness, and shape for illustrative purposes.

[0123] Figure 1 is a schematic cross-sectional view showing an electronic component obtained using the inkjet and air cavity forming curable composition according to the first embodiment of the present invention.

[0124] The electronic component 10 shown in Figure 1 comprises a first member 1, a second member 2, an adhesive portion 3, a solder ball 41, a resin sheet 42, a connection terminal 43, and a molded resin portion 44. The adhesive portion 3 is a cured product of the curable composition described above. The adhesive portion 3 is a photocured and thermocured product of the curable composition described above. The adhesive portion 3 adheres the upper surface of the first member 1 to the side and upper surface of the second member 2. The adhesive portion 3 is located on the upper surface of the first member 1. The adhesive portion 3 is located on the side of the second member 2 and on the upper surface of the second member 2. The adhesive portion 3 is located on a part of the upper surface of the first member 1 and on a part of the side and the entire upper surface of the second member 2. The adhesive portion 3 is not located on the lower surface of the second member 2. An air cavity R is formed by the first member 1, the second member 2 and the adhesive portion 3. The molded resin part 44 is positioned on the outer surface of the adhesive part 3.

[0125] In the electronic component 10, the first component 1 is a circuit board, and the second component 2 is a semiconductor chip. The electronic component 10 is a communication filter.

[0126] Furthermore, in the above electronic component, the adhesive portion may or may not be located on the upper surface of the second member. Also, in the above electronic component, the adhesive portion may or may not be located on the lower surface of the second member. In the above electronic component, the adhesive portion may be located on the lower surface of the second member but not on the side surface.

[0127] Referring to Figures 2(a) to (c) and Figures 3(d) to (g), an example of a manufacturing method for the electronic component shown in Figure 1 will be described.

[0128] First, as shown in Figure 2(a), a curable composition is applied to the surface of the first member 1 using an inkjet device to form a curable composition layer 3A (coating step). A curable composition is applied to the upper surface of the first member 1 to form a curable composition layer 3A. The curable composition is ejected from the ejection section 51 of the inkjet device.

[0129] Next, as shown in Figure 2(b), light is irradiated onto the curable composition layer 3A from the light irradiation unit 52 of the inkjet device to advance the curing of the curable composition layer 3A and form the B-stage compound layer 3B (photocuring process). The B-stage compound layer 3B is a pre-cured layer of the curable composition.

[0130] Furthermore, in the above method for manufacturing electronic components, after applying the curable composition to a specific area, the entire applied curable composition may be irradiated with light to form a B-stage compound layer. In the above method for manufacturing electronic components, the applied curable composition may be irradiated with light each time multiple drops of the curable composition are applied to form a B-stage compound layer. In the above method for manufacturing electronic components, the applied curable composition may be irradiated with light each time one drop of the curable composition is applied to form a B-stage compound layer.

[0131] After the above photocuring step, it is determined whether or not to repeat the above coating step and the above photocuring step. If the above coating step and the above photocuring step are repeated, the curable composition is applied to the surface side of the formed B-stage compound layer opposite to the first member side.

[0132] Figures 2(c) and 3(d) show the second coating process and the second photocuring process, respectively. As shown in Figure 2(c), a curable composition is applied to the surface of the B-stage material layer 3B opposite to the first member 1 side using an inkjet device, forming a curable composition layer 3A on the surface of the B-stage material layer 3B. Next, as shown in Figure 3(d), light is irradiated onto the applied curable composition layer 3A from the light irradiation unit 52 of the inkjet device to form the B-stage material layer 3B.

[0133] In Figures 2 and 3, the coating process and the photocuring process are performed twice in the thickness direction of the curable composition layer, as shown in Figures 2(a) and 2(b), and Figures 2(c) and 3(d). By performing the coating process and the photocuring process multiple times in the thickness direction of the curable composition layer, the thickness of the B-stage compound layer can be increased, and the ratio (height (thickness) / width) (aspect ratio) of the B-stage compound layer can be increased. The coating process and the photocuring process may be performed two or more times, or three or more times.

[0134] In the above coating and photocuring processes, by repeating the coating and photocuring, a B-stage material layer 3B is formed in contact with the side surface of the second member 2, as shown in Figure 3(e). In Figure 3(e), the B-stage material layer 3B is formed in contact with the side surface and top surface of the second member 2.

[0135] Next, the B-stage phosphate layer 3B is heat-cured (thermo-curing step). By heating the laminated structure obtained in Figure 3(e), which comprises the first member 1, the second member 2, and the B-stage phosphate layer 3B, the B-stage phosphate layer 3B is heat-cured. As a result, the adhesive portion 3 is formed, as shown in Figure 3(f). The adhesive portion 3 is a photo-cured and thermo-cured layer of the curable composition.

[0136] Next, as shown in Figure 3(g), resin is placed on the outside of the adhesive portion 3 to form the molded resin portion 44.

[0137] In this way, the electronic component 10 shown in Figure 1 can be obtained.

[0138] In the above photocuring process, it is preferable to irradiate with ultraviolet light. The irradiance and irradiation time of the ultraviolet light in the above photocuring process can be appropriately changed depending on the composition of the curable composition and the coating thickness of the curable composition. For example, the irradiance of the ultraviolet light in the above photocuring process is 1000 mW / cm². 2 It may be greater than or equal to 5000 mW / cm². 2 It may be greater than or equal to 10,000 mW / cm². 2 It may also be less than 8000 mW / cm². 2 The following is also possible: The irradiation time of ultraviolet light in the above photocuring process may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less.

[0139] The heating temperature and heating time in the above-mentioned thermosetting process can be appropriately changed depending on the composition of the curable composition and the thickness of the B-stage compound layer. The heating temperature in the above-mentioned thermosetting process may be, for example, 100°C or higher, 120°C or higher, 250°C or lower, or 200°C or lower. The heating time in the above-mentioned thermosetting process may be, for example, 5 minutes or more, 30 minutes or more, 600 minutes or lower, or 300 minutes or lower.

[0140] The ratio of the height of the adhesive portion to the width of the adhesive portion (height / width) is preferably 1.0 or more, more preferably 1.5 or more, even more preferably 2.0 or more, and particularly preferably 2.5 or more. When the above ratio (height / width) is above the above lower limit, the adhesiveness and sealing performance can be further improved. There is no particular upper limit to the above ratio (height / width). The above ratio (height / width) of the adhesive portion may be 100 or less, 50 or less, 10 or less, or 5.0 or less. From the viewpoint of miniaturizing the resulting electronic component, it is preferable that the above ratio (height / width) is 5.0 or less.

[0141] The width, height, and shape of the above-mentioned adhesive area can be changed as appropriate.

[0142] The width of the adhesive portion is preferably the width of the adhesive portion at the contact surface between the surface of the first member and the adhesive portion. At the contact surface between the surface of the first member and the adhesive portion, the width of the adhesive portion may be 50 μm or more, 100 μm or more, 150 μm or more, 250 μm or less, 230 μm or less, or 200 μm or less.

[0143] Preferably, the height of the adhesive portion is the distance from the contact surface between the surface of the first member and the adhesive portion to the maximum height position of the adhesive portion. The distance from the contact surface between the surface of the first member and the adhesive portion to the maximum height position of the adhesive portion may be 100 μm or more, 200 μm or more, 300 μm or more, 500 μm or less, 450 μm or less, or 400 μm or less.

[0144] Examples of the first component mentioned above include circuit boards and the like.

[0145] Examples of the second component mentioned above include semiconductor chips and the like.

[0146] The present invention will be described in more detail below with reference to examples. The present invention is not limited to the following examples.

[0147] The following materials were prepared.

[0148] ((A) Photocurable compound) Monofunctional (meth)acrylate compound 1:2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd., "AEH") Monofunctional (meth)acrylate compound 2: Isobornyl acrylate (IBOA, manufactured by Nippon Shokubai Co., Ltd.) Bifunctional (meth)acrylate compound 1: Ethoxylated bisphenol diacrylate A (ABE-300, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) Bifunctional (meth)acrylate compound 2: Tricyclodecanedimethanol diacrylate ("IRR-214K" manufactured by Daicel Ornex) Difunctional (meth)acrylate compound 3: Polyester-based urethane acrylate (UA4400, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) Trifunctional (meth)acrylate compound: Trimethylolpropane triacrylate (Daicel Ornex "TMPTA") Hexafunctional (meth)acrylate compound: Dipentaerythritol hexaacrylate (Daicel Ornex "DPHA")

[0149] ((B) Thermosetting compound) Bifunctional epoxy compound 1: Bisphenol A type epoxy compound (YD127, manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.) Bifunctional epoxy compound 2: Glycidylamine-type epoxy compound (JER630, manufactured by Mitsubishi Chemical Corporation) Bifunctional epoxy compound 3: Bisphenol F type epoxy compound (YDF-170, manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.) Bifunctional epoxy compound 4: Dicyclopentadiene dimethanol diglycidyl ether (ADEKA "EP-4088S")

[0150] ((C) Photo and thermosetting compound) 4-Hydroxybutyl acrylate glycidyl ether (manufactured by Nippon Chemical Corporation, "4HBAGE")

[0151] (Photopolymerization initiator) Photopolymerization initiator 1: 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one (BASF "Irgacure 379") Photopolymerization initiator 2: 2-(dimethylamino)-1-(4-morpholinophenyl)-2-benzyl-1-butanone (BASF "Irgacure 369")

[0152] (Thermosetting agent) Thermosetting agent 1: 1,3-bis(3-aminophenoxy)benzene ("APBN" manufactured by Mitsui Chemicals, Inc.) Thermosetting agent 2: 4,4'-diaminodiphenyl ether ("4,4'-DADPE" manufactured by Mitsui Chemicals Fine Co., Ltd.)

[0153] (Coupling agent) 3-Methacryloxypropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd. "KBM503")

[0154] (Examples 1-22 and Comparative Examples 1-5) The components shown in Tables 1 to 5 were blended in the amounts shown in Tables 1 to 5 and uniformly mixed to obtain a curable composition for inkjet printing and air cavity formation (curable composition).

[0155] (evaluation) (1) Viscosity of B-stage compound at 40°C The resulting curable composition was measured using an illuminometer (UIT-201, manufactured by Ushio Inc.) and the illuminance at a wavelength of 365 nm was 2000 mW / cm². 2 Light was shone for 10 seconds using an exposure device (ultra-high pressure mercury lamp, Oak Manufacturing Co., Ltd. "JL-4300-3") adjusted to achieve the following (cumulative light intensity 20,000 mJ / cm²). 2 The viscosity of the obtained B-stage compound at 40°C was measured using a viscoelasticity measuring device (ARES viscoelasticity measuring device, manufactured by T.A. Instruments Co., Ltd.) under the conditions of 40°C, a measuring plate: a parallel plate with a diameter of 8 mm, and a frequency of 1 Hz.

[0156] (2) Formation of a hardened layer with a large aspect ratio A semiconductor wafer (0.7 mm thick) was prepared. The curable composition obtained was applied to the surface of this semiconductor wafer using an inkjet device to form a curable composition layer (coating step). Next, the curable composition layer was irradiated with light to cure it and form a B-stage compound layer (photocuring step). The light irradiation in the photocuring step was performed using a UV-LED lamp with a main wavelength of 365 nm at 2000 mW / cm². 2 ×0.1 seconds (integrated light intensity 200 mJ / cm²) 2 The process was carried out under the following conditions. In the above coating step and photocuring step, coating and photocuring were repeated in the thickness direction of the curable composition layer to form a B-stage compound layer. The obtained B-stage compound layer was observed at 20x magnification using a laser microscope (Olympus "OLS4000") and its ratio (height / width) (aspect ratio) was determined. The formation rate of a cured layer with a large aspect ratio was evaluated according to the following criteria. The width of the formed B-stage compound layer was 100 μm. Therefore, for example, a B-stage compound layer with an aspect ratio of 2.5 means a B-stage compound layer with a height of 250 μm and a width of 100 μm.

[0157] <Criteria for determining the formation of a hardened layer with a large aspect ratio> ○○: Capable of forming a B-stage ionized layer with an aspect ratio of 2.5 or higher. ○: Can form a B-stage ionized layer with an aspect ratio of 2.0 or more and less than 2.5. △: Can form a B-stage ionized layer with an aspect ratio of 1.0 or more and less than 2.0. ×: Can form a B-stage ionized layer with an aspect ratio of less than 1.0.

[0158] (3) Adhesion (die shear strength at 260°C) The obtained curable composition was applied to the surface of a silicon wafer using a spin coater to form a curable composition layer with a thickness of 20 μm. At 25°C, the illuminance at 365 nm measured with an illuminometer (UIT-201, manufactured by Ushio Inc.) was 2000 mW / cm² relative to the curable composition layer. 2Using an exposure apparatus (ultra-high pressure mercury lamp, Oak Manufacturing Co., Ltd. "JL-4300-3") adjusted to achieve the following, light was irradiated for 10 seconds (cumulative light intensity 20,000 mJ / cm²). 2 ). In this way, a B-stage material layer was formed on the surface of the silicon wafer. Next, a silicon bare chip, simulating a semiconductor chip (3 mm long × 3 mm wide × 750 μm thick), was placed on the B-stage material layer using a die bonding apparatus, and pressurized at 0.1 MPa at 40°C for 1 second to obtain a laminate (1) of the silicon wafer, the B-stage material layer, and the silicon bare chip. Next, the laminate (1) was placed in an oven at 170°C and heated for 1 hour to thermally cure the B-stage material layer. In this way, a laminate (2) of the silicon wafer, the adhesive portion (photo- and thermo-cured material layer of the curable composition), and the silicon bare chip was obtained. The die shear strength of the laminate (2) was measured using a die shear strength measuring device (Dage Series 4000, manufactured by Dage Corporation) at a test temperature of 260°C.

[0159] <Criteria for determining adhesiveness (die shear strength at 260°C)> ○: Die shear strength of 20N or more at 260℃ △: Die shear strength at 260℃ is between 11N and 20N. ×: Die shear strength less than 11N at 260℃

[0160] (4) Sealing performance (moisture absorption reflow test and mold test) A structure was prepared on a BGA substrate (0.3 mm thick, organic substrate) with 40 electronic components (semiconductor chips) measuring 1 mm x 1 mm x 0.25 mm mounted in a 4x10 grid. A commercially available solder resist was applied to the surface of the above structure. The BGA substrate corresponds to the first component described below, and the electronic components correspond to the second component described below.

[0161] Fabrication of evaluation electronic components: The curable composition obtained was applied to the surface of the first component using an inkjet device to form a curable composition layer (coating step). Next, the curable composition layer was irradiated with light to advance the curing of the curable composition layer and form a B-stage compound layer (photocuring step). In the photocuring step, the light irradiation was performed using a UV-LED lamp with a main wavelength of 365 nm at 2000 mW / cm². 2 The process was carried out under the condition of ×0.1 seconds. The above coating step and the above photocuring step were repeated in the thickness direction of the curable composition layer to form a B-stage material layer in contact with the side surface of the second member. In this way, a laminated structure comprising the first member, the second member, and the B-stage material layer was obtained. Next, the obtained laminated structure was placed in an oven at 170°C and heated for 1 hour to heat-cur the B-stage material layer (thermocuring step). In this way, a laminated structure comprising the first member, the second member, and an adhesive portion (photocured and thermocured material layer of the curable composition) was obtained. Next, resin was placed outside the adhesive portion and a molded resin portion was formed under the conditions of 150°C, 3 MPa, and 300 seconds to obtain an electronic component for evaluation.

[0162] Moisture absorption reflow test and mold test: The obtained evaluation electronic components were left to absorb moisture for 168 hours under conditions of 85°C and 85RH% humidity. Next, the evaluation electronic components were passed through a solder reflow oven (preheat 150°C x 100 seconds, reflow [maximum temperature 260°C]) for 5 cycles. Then, the evaluation electronic components were observed using an ultrasonic imaging device (Hitachi Construction Machinery Finetech Co., Ltd. "mi-scope hyper II") to confirm whether or not molding resin had penetrated into the air cavity of the evaluation electronic component. The sealing performance (moisture absorption reflow test and molding test) was evaluated according to the following criteria.

[0163] <Criteria for determining sealing performance (moisture absorption reflow test and mold test)> ○: Out of 40 evaluation electronic components, 0 had mold resin seeping into the air cavity. △: Out of 40 evaluation electronic components, the number of evaluation electronic components in which molded resin had seeped into the air cavity was between 1 and 10. ×: Out of 40 evaluation electronic components, 11 or more had mold resin seeping into the air cavity.

[0164] The composition and results are shown in Tables 1-5 below.

[0165] [Table 1]

[0166] [Table 2]

[0167] [Table 3]

[0168] [Table 4]

[0169] [Table 5] [Explanation of Symbols]

[0170] 1...First component 2…Second component 3...Adhesive part 3A…Curable composition layer 3B...B Stage Monster Layer 10…Electronic components 41... Solder ball 42… Resin sheet 43…Connection terminals 44…Mold resin part 51...Discharge part 52…Light-irradiating section R...Air Cavity

Claims

1. A photocurable compound having a (meth)acryloyl group or a vinyl group and not having a cyclic ether group, A thermosetting compound that does not have a (meth)acryloyl group and has a cyclic ether group, In a curable composition for inkjet printing and air cavity formation, the content of the thermosetting compound is 5% by weight or more and 50% by weight or less in 100% by weight. Light with a wavelength of 365 nm and an illuminance of 2000 mW / cm ２ When a curable composition for inkjet printing and air cavity formation is irradiated to obtain a B-stage product, the viscosity of the B-stage product at 40°C is 2.5 × 10⁻⁶. ２ Pa・s or more 3.0×10 ６ A curable composition for inkjet printing and air cavity formation, having a density of Pa·s or less.

2. The curable composition for inkjet printing and air cavity formation according to claim 1, wherein the photocurable compound comprises a first photocurable compound having a total of one (meth)acryloyl group and one vinyl group, and a second photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups.

3. The first photocurable compound is a photocurable compound having one (meth)acryloyl group, The curable composition for inkjet printing and air cavity formation according to claim 2, wherein the second photocurable compound is a photocurable compound having two or more (meth)acryloyl groups.

4. It does not contain or contains photo- and thermosetting compounds having a (meth)acryloyl group and a cyclic ether group, If the aforementioned photocurable and thermosetting compounds are not included, the content of the second photocurable compound is 5% by weight or more and 25% by weight or less in 100% by weight of the photocurable compound. The curable composition for inkjet printing and air cavity formation according to claim 2 or 3, wherein, in the case where the photocurable compound is included, the content of the second photocurable compound is 4% by weight or more and 20% by weight or less of the total content of the photocurable compound and the photocurable compound.

5. A curable composition for inkjet printing and air cavity formation according to any one of claims 1 to 3, comprising a thermosetting agent.

6. A curable composition for inkjet printing and air cavity formation according to claim 4, comprising a thermosetting agent.

7. The curable composition for inkjet printing and air cavity formation according to claim 5, wherein the thermosetting agent comprises an amine compound.

8. The curable composition for inkjet printing and air cavity formation according to claim 6, wherein the thermosetting agent comprises an amine compound.

9. The first member and The second component, The first member comprises an adhesive portion that bondes the upper surface of the first member to the side or lower surface of the second member, The first member, the second member, and the adhesive portion form an air cavity. An electronic component in which the adhesive portion is a cured product of the inkjet and air cavity forming curable composition described in any one of claims 1 to 3.

10. The electronic component according to claim 9, wherein the ratio of the height of the adhesive portion to the width of the adhesive portion is 1.0 or more.

11. A coating step of applying a curable composition according to any one of claims 1 to 3 onto the surface of a first member using an inkjet device to form a curable composition layer, A photocuring step in which the curable composition layer is cured by irradiation with light to form a B-stage compound layer, The process includes a thermosetting step in which the above-mentioned B-stage compound layer is heat-cured. A method for manufacturing an electronic component, comprising the steps of the coating step and the photocuring step, wherein the coating and photocuring are repeated in the thickness direction of the curable composition layer to form a B-stage material layer in contact with the side or bottom surface of a second member.

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