Manufacturing method and manufacturing apparatus

Abstract

This manufacturing method is for forming a plurality of terminal-equipped resin layers in which terminal parts to be connected to electric components are provided to a surface of a resin layer, by repeatedly executing resin layer formation steps and wiring forming steps. A mark pedestal is formed by laminating resin layers in a mark forming area in a stage, before a resin layer forming step for forming the resin layers of the terminal-equipped resin layers among a plurality of resin layer forming steps. In the wiring forming steps for forming wiring for the terminal-equipped resin layers, a reference mark is formed by discharging a first metallic liquid on the mark pedestal. When the plurality of terminal-equipped resin layers are formed at positions of different heights, mark pedestals in accordance with the heights of the plurality of terminal-equipped resin layers are formed in the mark forming area, and a reference mark is formed on each of the mark pedestals.

Description

Technical Field

[0001] The present disclosure relates to a technique for manufacturing a substrate using a three-dimensional lamination molding method.

Background Art

[0002] Conventionally, various methods have been proposed as methods for manufacturing a substrate. For example, Patent Document No. 1 below describes laminating and molding a substrate using a 3D printer. In the manufacturing method according to Patent Document No. 1, a plurality of resin layers formed with wirings and reference marks are formed by a 3D printer, and the plurality of formed resin layers are laminated to manufacture a substrate. When laminating, each resin layer is positioned and laminated based on the center coordinates of the reference mark of the lower layer.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, when an electronic component is mounted on a substrate after the substrate is formed by a three-dimensional lamination molding method, it is necessary to adjust the positions of the electrodes of the electronic component and the terminal portions of the wirings formed on the surface of the substrate. In addition, there are cases where a plurality of electronic components are mounted on wirings formed at different heights. In such a case, it is desirable that each of the plurality of electronic components connected to the terminal portions of the wirings at different heights can be accurately position-adjusted.

[0005] In view of such circumstances, the present disclosure has been made, and an object thereof is to provide a manufacturing method and a manufacturing apparatus capable of manufacturing a substrate that can improve the accuracy of position adjustment between an electronic component and a terminal portion even when the heights at which a plurality of electronic components are mounted are different in forming a substrate by a three-dimensional lamination molding method. [Means for solving the problem]

[0006] To solve the above problems, this disclosure includes a resin layer forming step of discharging a curable resin into a formation area on a stage to form a resin layer, and a wiring forming step of discharging a first metallic fluid containing metal fine particles onto the resin layer to form wiring, wherein by repeatedly performing the resin layer forming step and the wiring forming step, a plurality of terminalized resin layers are formed, each having a terminal portion on the surface of the resin layer that is part of the wiring and connects to an electronic component mounted on the wiring, and a mark base is formed by laminating the resin layer in a mark forming area, which is a different area from the formation area on the stage, up to the resin layer forming step of forming the resin layer of the terminalized resin layer, and in the wiring forming step of forming the wiring of the terminalized resin layer, a reference mark is formed by discharging the first metallic fluid onto the mark base, and when the plurality of terminalized resin layers are formed at different heights, a mark base corresponding to the height of the plurality of terminalized resin layers is formed in the mark forming area, and the reference mark is formed on each of the plurality of mark bases. The process further includes a mounting step of mounting the electronic component to the terminal portion of the terminal-equipped resin layer, wherein in the mounting step, the position in which the electronic component is mounted relative to the terminal portion is corrected using the reference marks provided on the mark base which is the same height as the terminal-equipped resin layer on which the electronic component is mounted, a second metallic fluid connecting the electrodes of the electronic component to the terminal portion is discharged to the terminal portion, and in adjusting the position in which the second metallic fluid is discharged, the correction is performed using the reference marks provided on the mark base which is the same height as the terminal-equipped resin layer on which the electronic component is mounted. The manufacturing method will be disclosed.

[0007] Furthermore, the contents of this disclosure are not limited to implementation as a manufacturing method, but are also extremely effective when implemented as a manufacturing apparatus comprising a stage, an ejection device, and a control device. [Effects of the Invention]

[0008] In this disclosure, mark bases are formed according to the height of multiple terminal-equipped insulating layers, and reference marks are formed on each of the multiple mark bases. When mounting electronic components on each terminal-equipped insulating layer, position adjustment is possible using the reference marks on the mark bases corresponding to the height of each terminal-equipped insulating layer. Therefore, even when multiple electronic components are mounted at different heights, it is possible to manufacture a substrate that improves the accuracy of position adjustment between electronic components and terminals. [Brief explanation of the drawing]

[0009] [Figure 1] This figure shows the substrate manufacturing apparatus related to this embodiment. [Figure 2] This is a block diagram of a circuit board manufacturing machine. [Figure 3] This is a plan view showing the area within the pallet. [Figure 4] This is a cross-sectional view showing the state in which the first resin layer is formed. [Figure 5] This is a cross-sectional view showing the state of forming wiring on the first resin layer. [Figure 6] This is a cross-sectional view showing the state in which the second resin layer is formed. [Figure 7] This is a cross-sectional view of the circuit board. [Figure 8] This is a plan view of the reference mark and the mark base. [Figure 9] This is a side view of the standard mark and mark base. [Figure 10] This is a cross-sectional view of a circuit board after electronic components have been mounted. [Figure 11] This is a cross-sectional view of a circuit board after electronic components have been mounted, as in another example. [Figure 12] This is a plan view showing an area within a pallet, as in another example. [Modes for carrying out the invention]

[0010] The following describes a substrate manufacturing apparatus, which is an embodiment of the manufacturing apparatus of this disclosure, with reference to the drawings. Figure 1 shows the substrate manufacturing apparatus 10 according to this embodiment. As shown in Figure 1, the substrate manufacturing apparatus 10 includes a transport device 20, a first molding unit 22, a second molding unit 24, a third molding unit 25, a mounting unit 27, and a control device 28 (see Figure 2). The substrate manufacturing apparatus 10 is an apparatus that additively manufactures substrates using the inkjet method as a three-dimensional additive manufacturing method and mounts electronic components on the manufactured substrates. Note that the three-dimensional additive manufacturing method used by the substrate manufacturing apparatus 10 is not limited to the inkjet method; other additive manufacturing methods such as fused deposition modeling and powder bed fusion may also be used.

[0011] The transport device 20, the first molding unit 22, the second molding unit 24, the third molding unit 25, and the mounting unit 27 are arranged on the base 29 of the substrate manufacturing apparatus 10. The base 29 is generally rectangular in shape. In the following description, as shown in Figure 1, the longitudinal direction of the base 29 will be referred to as the X-axis direction, the short direction of the base 29 as the Y-axis direction, and the direction perpendicular to both the X-axis and Y-axis directions will be referred to as the Z-axis direction.

[0012] The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is mounted on a base 29 and is arranged along the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Furthermore, the X-axis slide mechanism 30 has an electromagnetic motor 38 (see Figure 2), which drives the X-axis slider 36 to any position in the X-axis direction.

[0013] The Y-axis slide mechanism 32 also includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is mounted on the base 29 and is positioned along the Y-axis direction. One end of the Y-axis slide rail 50 (the upper end in Figure 1) is connected to the X-axis slider 36. This allows the Y-axis slide mechanism 32 to move in the X-axis direction together with the X-axis slider 36. The stage 52 is held in a slidable position in the Y-axis direction by the Y-axis slide rail 50. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor 56 (see Figure 2), which drives the stage 52 to any position in the Y-axis direction. Thus, the stage 52 can be moved to any position on the base 29 in the X-axis direction and the Y-axis direction by the driving of the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

[0014] The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and a substrate is placed on its upper surface. The holding device 62 is provided on both side portions of the base 60 in the X-axis direction. For example, a pallet 141 (see FIG. 3) for shaping the substrate is arranged on the base 60. The pallet 141 is, for example, a thin plate-like member made of metal. On this pallet 141, for example, a release film 143 (see FIG. 3) is pasted, and a substrate is manufactured on the release film 143. The release film 143 is, for example, a film-like member whose adhesive force decreases due to heat above a predetermined temperature, and is used to separate the substrate from the pallet 141 after the substrate is manufactured. The pallet 141 is placed on the base 60 and is fixedly held with respect to the base 60 by being sandwiched by the holding device 62 at both edge portions in the X-axis direction. Further, the lifting device 64 is provided below the base 60 and raises and lowers the base 60 in the Z-axis direction.

[0015] The first shaping unit 22 is a unit that shapes wiring on the base 60 of the stage 52, and has a first printing unit 72 and a firing unit 74. The first printing unit 72 has an inkjet head 76 (see FIG. 2), and the inkjet head 76 discharges metal ink linearly. The metal ink is one in which metal nanoparticles of nanometer size, for example, silver fine particles, are dispersed in an organic solvent. The surface of the metal fine particles is coated with, for example, a dispersant to prevent aggregation in the organic solvent. Incidentally, the inkjet head 76 discharges metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.

[0016] The firing unit 74 has an infrared irradiation device 78 (see FIG. 2). The infrared irradiation device 78 is, for example, an infrared heater, which is a device that irradiates infrared rays onto the ejected metal ink to heat it. The infrared irradiation device 78 can be switched, for example, to a state of being heated to a first temperature and a state of being heated to a second temperature higher than the first temperature based on the control of the control device 28 (see FIG. 2) of the substrate manufacturing apparatus 10. When the metal ink is heated by the infrared irradiation device 78 at the first temperature, for example, the organic solvent is vaporized and drying progresses. Also, when the metal ink is heated by the infrared irradiation device 78 at the high second temperature, it is fired to form the final wiring. The firing of the metal ink here refers to a phenomenon in which by applying thermal energy, the organic solvent is vaporized, and the protective film of the metal fine particles, that is, the dispersant is decomposed, etc., and the metal fine particles come into contact or fuse, resulting in an increase in conductivity. The substrate manufacturing apparatus 10 performs drying of the ejected metal ink at the first temperature, for example, and then performs firing at the second temperature to form the wiring. Note that the method of forming the wiring is not limited to the method described above. The control device 28 may perform firing by heating once without performing the drying process.

[0017] Also, the second shaping unit 24 is a unit that shapes a resin layer on the base 60 of the stage 52, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head 88 (see FIG. 2). The inkjet head 88 ejects an ultraviolet curable resin. The ultraviolet curable resin is, for example, a resin having insulating properties and curable by irradiation with ultraviolet rays. Note that the method by which the inkjet head 88 ejects the ultraviolet curable resin may be, for example, a piezo method using a piezoelectric element, or a thermal method in which the resin is heated to generate bubbles and ejected from a plurality of nozzles.

[0018] The curing unit 86 includes a planarizing device 90 (see Figure 2) and an irradiation device 92 (see Figure 2). The planarizing device 90 flattens the upper surface of the ultraviolet-curable resin ejected by the inkjet head 88. For example, it smooths the surface of the ultraviolet-curable resin and scrapes off excess resin with a roller or blade, thereby making the thickness of the ultraviolet-curable resin uniform. The irradiation device 92 is equipped with a mercury lamp or LED as a light source and irradiates the ejected ultraviolet-curable resin with ultraviolet light. As a result, the ejected ultraviolet-curable resin hardens and an insulating resin layer is formed.

[0019] The third molding unit 25 is a unit that molds a connector that connects the electrodes of an electronic component to the terminal portion of a wiring on the base 60, and has a third printing unit 100 and a first heating unit 102. The third printing unit 100 has a dispenser 106 (see Figure 2). The dispenser 106 dispenses conductive resin paste. The conductive resin paste is, for example, a resin that hardens when heated at a relatively low temperature, in which micrometer-sized metal particles (such as silver particles) are dispersed. The metal particles are, for example, in the form of flakes. In addition, the viscosity of the conductive resin paste is higher than that of, for example, metal ink.

[0020] The first heating unit 102 has, for example, a pair of heating plates 108 (see Figure 2) that face each other in the Z-axis direction. The pair of heating plates 108 is a device for heating the conductive resin paste applied by the dispenser 106. For example, the substrate to be manufactured is heated by being sandwiched between the pair of heating plates 108 after the conductive resin paste has been dispensed onto the terminal portions of the wiring. The conductive resin paste hardens due to this heating and is bonded to the terminal portions. Next, electronic components are mounted on the substrate, and the electrodes of the electronic components are placed on the conductive resin paste that has been bonded to the terminal portions. Then, with the electrodes of the electronic components placed on the terminal portions via the conductive resin paste, the substrate is heated while being sandwiched between the pair of heating plates 108. Due to this heating, the conductive resin paste hardens and shrinks, and flake-shaped metal particles dispersed in the resin come into contact. As a result, the conductive resin paste exhibits conductivity. The electronic components are electrically connected to the terminal portions via the conductive resin paste. Furthermore, the resin in the conductive resin paste is an organic adhesive that hardens upon heating, thereby exhibiting adhesive strength and physically joining the terminal (wiring) and the electrode.

[0021] The above-described heating methods for the metal ink and conductive resin paste are merely examples. For example, the conductive resin paste may be heated using an infrared heater. Alternatively, the metal ink may be fired using the heating plate 108. Furthermore, the substrate manufacturing apparatus 10 may also be equipped with heating means other than the infrared irradiation device 78 and the heating plate 108, such as an electric furnace for heating the object to be manufactured.

[0022] The mounting unit 27 also has a supply unit 120 and a mounting unit 122. The supply unit 120 is a device that supplies electronic components to be mounted on a substrate, and includes, for example, a tape feeder 124. The tape feeder 124 supplies electronic components to the supply position from a carrier tape on which the electronic components have been tape-formed. Note that the method of supplying electronic components is not limited to using the tape feeder 124; for example, a tray-type supply device that supplies electronic components by placing them on a tray may also be used. The supply unit 120 is also capable of supplying probe pins. These probe pins are made of a metal such as copper or gold and are used, for example, for electrical connections between wiring in one layer and wiring in another layer. Alternatively, probe pins are used for electrical connections between any substrate and another substrate. The method of supplying probe pins is not particularly limited, but for example, probe pins may be supplied by placing them on a tray.

[0023] The mounting unit 122 includes a mounting head 126 (see Figure 2) and a moving device 128 (see Figure 2). The mounting head 126 has a suction nozzle (not shown) for adsorbing and holding electronic components. The suction nozzle adsorbs and holds electronic components by air suction when negative pressure is supplied from a positive / negative pressure supply device (not shown). The suction nozzle releases the electronic components when a small amount of positive pressure is supplied from the positive / negative pressure supply device. The moving device 128 moves the mounting head 126 between the supply position of the tape feeder 124 and the substrate placed on the base 60. The mounting unit 122 drives the moving device 128 to hold the electronic components supplied from the tape feeder 124 with the suction nozzle of the mounting head 126, and mounts the electronic components held by the mounting head 126 onto the substrate.

[0024] Figure 2 shows a block diagram of the substrate manufacturing apparatus 10. As shown in Figure 2, the control device 28 comprises a controller 130, a plurality of drive circuits 132, a storage device 133, and an external IF (abbreviation for interface) 135. The controller 130 is a computer-based device equipped with a CPU and is connected to the plurality of drive circuits 132. The plurality of drive circuits 132 are motor amplifiers, etc., and are connected to the electromagnetic motors 38, 56, holding device 62, lifting device 64, inkjet head 76, infrared irradiation device 78, inkjet head 88, planarization device 90, irradiation device 92, dispenser 106, heating plate 108, tape feeder 124, mounting head 126, and moving device 128. The storage device 133 comprises, for example, RAM, ROM, flash memory, HDD, etc. The control program 133A is stored in the storage device 133. The controller 130 executes the control program 133A on its CPU and controls the operation of the transport device 20, the first molding unit 22, the second molding unit 24, the third molding unit 25, and the mounting unit 27 via the drive circuit 132. In the following description, the control device 28 that executes the control program 133A on the controller 130 may be referred to simply by its device name. For example, the statement "the control device 28 controls the X-axis sliding mechanism 30" means "the control device 28 executes the control program 133A on the CPU of the controller 130 and controls the X-axis sliding mechanism 30 via the drive circuit 132."

[0025] Furthermore, the external IF 135 is, for example, a LAN IF and is connected to the first management device 138 and the second management device 139 via the local network 137. The first management device 138 is, for example, a device that generates and stores 3D data of the object to be manufactured (such as a substrate) to be additively manufactured by the inkjet method. The control device 28 stores the 3D data 133B acquired from the first management device 138 in the storage device 133 and controls the first molding unit 22, etc., based on the 3D data 133B to manufacture the substrate. The 3D data 133B includes, for example, data of the substrate 161 (see Figure 9), which is the object to be manufactured, sliced ​​layer by layer. The 3D data 133B also includes data for each layer for manufacturing the reference mark M and mark base 173 (see Figure 9), which will be described later. Note that the 3D data for the substrate 161, the reference mark M, and the mark base 173 may be separate data.

[0026] The second management device 139 is a device that generates and stores job data (control data, so-called recipes) used in the mounting process of mounting electronic components onto the manufactured circuit board. The control device 28 stores the job data 133C acquired from the second management device 139 in the storage device 133, determines the type and position of the electronic components to be mounted based on the job data 133C, and controls the mounting unit 27. Note that the configuration shown in Figure 2 is just one example. The first management device 138 that generates the 3D data 133B and the second management device 139 that generates the job data 133C may be the same device. Also, the circuit board manufacturing apparatus 10 may have the function of generating the 3D data 133B and the job data 133C.

[0027] In this embodiment, the substrate manufacturing apparatus 10 laminates multiple resin layers on the base 60 using the configuration described above, and appropriately forms wiring on each resin layer. The substrate manufacturing apparatus 10 also connects the electrodes of electronic components to the terminals of the wiring via conductive resin paste, thereby manufacturing a substrate on which electronic components are mounted. Furthermore, the substrate manufacturing apparatus 10 performs corrections using reference marks to adjust the position where the conductive resin paste is dispensed and the position where the electronic components are mounted. These reference marks are so-called fiducial marks. The substrate manufacturing apparatus 10 also creates these fiducial marks using the inkjet method.

[0028] Specifically, Figure 3 is a plan view showing the area within the pallet 141 placed on the base 60. As shown in Figure 3, the pallet 141 is, for example, a metal plate member that forms a rectangular shape in plan view. When the pallet 141 is placed on the base 60, its longitudinal direction is aligned with the X-axis direction. Both ends of the pallet 141 in the X-axis direction are held by the holding device 62. Note that the shape, arrangement, number, etc. of the area shown in Figure 3 are just an example.

[0029] A release film 143 is attached to the pallet 141. The control device 28 sets a formation area 145 on the release film 143, for example, and manufactures the substrate within that formation area 145. The formation area 145 is, for example, a square area in plan view and is set in the center of the pallet 141. A first sacrificial area 147 is set on one side of the formation area 145 in the X-axis direction (the upper side in Figure 3). When the control device 28 ejects ink (such as metallic ink) from the inkjet heads 76 and 88, such as during nozzle cleaning, it ejects the ink in the first sacrificial area 147. A second sacrificial area 148 is set on the opposite side of the formation area 145 from the first sacrificial area 147 in the X-axis direction (the lower side in Figure 3). When the control device 28 ejects ink (conductive resin paste) from the dispenser 106, such as during cleaning the dispenser 106, it ejects the ink into the second sacrificial area 148. Furthermore, a temperature sensor measurement area 149 is set on one side (the right side in Figure 3) of the formation area 145 in the Y-axis direction. The temperature sensor measurement area 149 is a region for measuring the temperature of the release film 143 in order to confirm whether the temperature of the release film 143 has reached the temperature at which it will be released. The temperature measurement of the release film 143 may be performed by the control device 28 using a temperature sensor, or it may be performed manually by a person.

[0030] Furthermore, mark formation areas 150 and 151 are provided on both sides of the formation area 145 in the X-axis direction. Mark formation area 150 is set, for example, between the first sacrificial area 147 and the formation area 145 in the X-axis direction. Mark formation area 151 is set, for example, outside the formation area 145 in the X-axis direction and on both sides of the second sacrificial area 148 in the Y-axis direction. A reference mark M is formed in each of the pair of mark formation areas 150 and 151. Details of the reference mark M will be described later.

[0031] Next, an example of the substrate manufacturing process will be described. Figures 4 to 6 show the state in which the resin layer and wiring are formed. In the following description, as an example, the case of manufacturing a 5-layer substrate 161 shown in Figure 9 will be described. First, the control device 28 controls the X-axis slide mechanism 30 and the Y-axis slide mechanism 32 to move the stage 52 below the second molding unit 24. The control device 28 controls the second molding unit 24 and ejects a thin film of ultraviolet-curable resin from the inkjet head 88 of the second printing unit 84 onto the upper surface of the release film 143 of the stage 52. The control device 28 ejects the ultraviolet-curable resin to a position based on the 3D data 133B of the object to be manufactured. The control device 28 controls, for example, the planarization device 90 of the curing unit 86 to planarize the ultraviolet-curable resin ejected as a thin film so that the thin film is uniform. Furthermore, the control device 28 may, for example, extrude more UV-curable resin onto the flattened UV-curable resin to partially cure it, and then smooth out the surface irregularities created during flattening using the leveling effect of the partially cured UV-curable resin.

[0032] The control device 28 controls the irradiation device 92 to irradiate the flattened and smoothed UV-curable resin with ultraviolet light to cure it. As a result, a thin film resin layer 163 is formed on the release film 143 (within the formation area 145 shown in Figure 3), as shown in Figure 4. The control device 28 then repeatedly dispenses, flattens, smooths, and cures the UV-curable resin on top of the thin film resin layer 163. As a result, as shown in Figure 4, the thin film resin layer 163 is laminated to form the first resin layer 165 on top of the release film 143. Note that the control device 28 may perform flattening, smoothing, and curing after each dispensing, rather than after each scanning of the UV-curable resin.

[0033] Next, the control device 28 controls the X-axis slide mechanism 30 and the Y-axis slide mechanism 32 to move the stage 52 below the first molding unit 22. The control device 28 controls the first molding unit 22 to eject metallic ink from the inkjet head 76 of the first printing unit 72 onto the upper surface of the resin layer 165. The control device 28 ejects the metallic ink at a position based on the circuit pattern set in the 3D data 133B. Next, the control device 28 controls the firing unit 74 of the first molding unit 22 to irradiate the ejected metallic ink with infrared light from the infrared irradiation device 78. For example, after ejecting the metallic ink in one scan, the control device 28 sets the infrared irradiation device 78 to a first temperature to heat the ejected metallic ink. This causes part of the organic solvent in the metallic ink to vaporize and dry. The control device 28 repeatedly performs ejection and drying to build up to the desired thickness, then sets the infrared irradiation device 78 to a second temperature higher than the first temperature to perform firing of the built-up metallic ink. As a result, as shown in Figure 5, wiring 167 with a predetermined thickness and wiring pattern set in the 3D data 133B is formed on the resin layer 165.

[0034] Next, the control device 28 moves the stage 52 below the second molding unit 24. The control device 28 repeatedly performs extrusion, planarization, smoothing, and curing of the UV-curable resin, similar to the first resin layer 165, to form the second resin layer 165 on top of the first resin layer 165. The second resin layer 165 is formed to cover the wiring 167 on top of the first resin layer 165. Also, as shown in Figure 6, the control device 28 forms a cavity 169 in the second resin layer 165 that exposes a portion of the wiring 167 of the first layer. The portion of the wiring 167 exposed in this cavity 169 functions as a terminal portion 167A on which an electronic component 181 (see Figure 9) is mounted. Furthermore, the control device 28, for example, further dispenses metallic ink onto the first layer of wiring 167, forming interlayer wiring (vias) 171 at arbitrary positions in the second layer of resin 165 that connect the first layer of wiring 167 to the upper layer of wiring 167. Alternatively, instead of using interlayer wiring 171, probe pins 183 (see Figure 9) may be used to connect wiring 167 from different layers.

[0035] The control device 28 repeatedly performs the process of forming the resin layer 165 and the process of forming the wiring 167 to manufacture the five-layer substrate 161 shown in Figure 7. In the following description, each layer of the substrate 161 will be referred to as layer 1, layer 2, layer 3, ..., layer 5, in order from bottom to top. As shown in Figure 7, the substrate 161 has resin layers 165 (hereinafter sometimes referred to as terminal-equipped resin layers) with terminal portions 167A on their surface. In the example shown in Figure 7, all of layers 1 to 5 are terminal-equipped resin layers. A cavity 169 for mounting electronic components 181 (see Figure 10) is formed in each terminal-equipped resin layer.

[0036] Here, the substrate manufacturing apparatus 10 can perform the mounting of electronic components 181 within the same apparatus. Various types of electronic components 181 that can be supplied from the supply unit 120 can be used as the electronic components 181 to be mounted. Different types of electronic components 181 may have different circuit configurations for connection, and the number of circuit layers (mounting height) will also differ. That is, the number of layers of wiring 167 and resin layer 165 formed below the position where the electronic component 181 is mounted will differ. In other words, in a substrate 161 that is built by stacking, if there are multiple terminal-equipped resin layers on the surface with terminal portions 167A that connect to electronic components 181, the height of each of the multiple terminal-equipped resin layers will differ from one another. Furthermore, the height of the terminal-equipped resin layers will differ for various reasons, not limited to the type of electronic component 181, but also the size of the electronic component 181, the number of electrodes of the electronic component 181, or the overall shape of the manufactured object.

[0037] On the other hand, in a three-dimensional additive manufacturing method using resin as in this embodiment, for example, the UV-curable resin may shrink due to the curing process using ultraviolet light. Also, the UV-curable resin may shrink due to the heat generated during the curing process of metal ink or conductive resin paste. As a result, the position of the terminal portion 167A of each terminal-equipped resin layer may shift slightly depending on the number of layers below it. Therefore, in the manufacturing process of the substrate 161, the control device 28 additively manufactures a mark base 173 that is the same height as the terminal-equipped resin layer in parallel, and forms a reference mark M on the mark base 173.

[0038] In the example shown in Figure 7, terminal portions 167A are formed on each of the five layers. That is, electronic components 181 are mounted on all five terminal-equipped insulating layers (see Figure 10). In this case, the control device 28 forms mark bases 173 of a height corresponding to each of the five layers, and forms a reference mark M on each of the five types of mark bases 173. In the following explanation, when distinguishing and explaining the reference marks M corresponding to each of the five layers from layer 1 to layer 5, they will be written as reference marks M1, M2, M3, M4, M5, with the layer number added after the symbol. Also, when referring to reference marks M1 to M5 collectively, they will be written as reference mark M.

[0039] As shown in Figure 4, the control device 28, for example, in the resin layer formation process for forming the first resin layer 165, forms the first layer of the mark base 173 in the mark formation areas 150 and 151, respectively. The control device 28 forms the first layer of the mark base 173 in parallel with the resin layer 165, using the same procedure as the procedure for forming the resin layer 165 in the formation area 145. More specifically, the procedures for ejecting the UV-curable resin, planarizing, smoothing, and curing with UV light when forming the resin layer 165 are performed in the same procedure, and the first layer of the mark base 173 is formed with the UV-curable resin. For example, when the control device 28 ejects UV-curable resin using the inkjet head 88 to create a thin film resin layer 163 of any desired layer, it ejects it to the formation area 145 as well as to the mark formation areas 150 and 151. That is, thin film resin layers 163 of the same height for the resin layer 165 and the mark base 173 are created in parallel. Furthermore, when the control device 28 performs, for example, planarization of the extruded UV-curing resin, it uses the rollers of the planarization device 90 to planarize the UV-curing resin in the formation area 145, and also performs planarization of the UV-curing resin in the mark formation areas 150 and 151. The control device 28 forms the first layer of the mark base 173 for the reference marks M1 to M5. Note that the control device 28 does not have to form the resin layer 165 and the mark base 173 in parallel. For example, the control device 28 may form one layer of resin 165 in the formation area 145, and then later form the first layer of the mark base 173 in the mark formation areas 150 and 151.

[0040] Furthermore, as shown in Figure 5, the control device 28, for example, in the wiring formation process where wiring 167 is formed on the first resin layer 165, forms the reference mark M1 on the mark base 173 for the reference mark M1. The control device 28 forms the reference mark M1 in the same procedure as the procedure for forming the wiring 167 in the formation area 145, and in parallel with the wiring 167. More specifically, in the molding of the reference mark M1, the procedures for ejecting the metal ink, drying and firing are carried out in the same procedure as when forming the wiring 167, and the reference mark M1 is formed with metal ink. For example, when the control device 28 ejects metal ink by the inkjet head 76 to mold the wiring 167, it ejects metal ink to the formation area 145 while also ejecting metal ink to the mark formation areas 150 and 151. Note that the control device 28 does not mold the reference marks M for the other mark bases 173 for reference marks M2 to M5 at this stage.

[0041] The control device 28 executes the mark base 173 formation process described above during the resin layer formation process for forming the resin layer 165 of each layer. Each mark base 173 of the reference marks M1 to M5 is stacked in this order from highest to lowest. The control device 28 also forms a reference mark M (of the same layer) corresponding to its height during the wiring formation process for forming the wiring 167 of each layer. For example, the control device 28 forms a reference mark M2 during the wiring formation process for two layers of wiring 167, and a reference mark M3 during the wiring formation process for three layers of wiring 167. Therefore, when manufacturing the substrate 161 shown in Figure 10, five types of mark bases 173 and reference marks M1 to M5 corresponding to five layers from one to five are formed.

[0042] Figure 8 shows a plan view when the reference marks M for each of the five layers are formed, and shows the reference marks M on the upper side (first dummy area 147 side) in Figure 3. Figure 9 shows a side view when the reference marks M are formed, and shows the reference marks M on the upper side (first dummy area 147 side) in Figure 3. As shown in Figures 3, 8, and 9, the control device 28 forms, for example, reference marks M1 to M5 in each of the mark formation areas 150 and 151 along a direction parallel to the Y-axis direction. In the example in Figure 3, the control device 28 forms reference marks M1, M2, and M3 for layers 1, 2, and 3 on one side of the mark formation area 150 in the Y-axis direction (left side in Figure 3), and reference marks M4 and M5 for layers 4 and 5 on the other side. Furthermore, the control device 28 forms four and five layers of reference marks M4 and M5 on one side in the Y-axis direction (left side in Figure 3) and one, two, and three layers of reference marks M1, M2, and M3 on the other side in the mark formation area 151. In each of the reference marks M in the mark formation areas 150 and 151, the distance between each pair of reference marks M is the same. More specifically, as shown in Figure 3, for example, the distance 175 between a pair of reference marks M1 formed in the mark formation areas 150 and 151 is the same as the distance 176 between a pair of reference marks M2. Similarly, in other layers, the distance between a pair of reference marks M corresponding to any layer is the same as the distance between a pair of reference marks M corresponding to any other layer.

[0043] Furthermore, as shown in Figures 8 and 9, each mark base 173 of the reference marks M1 to M5 is raised by one layer in this order. In Figure 9, for convenience, dashed lines are shown at the boundaries so that each mark base 173 of the reference marks M1 to M5 can be distinguished. That is, the mark base in this disclosure corresponds to the lower resin layer laminated to form an arbitrary reference mark M, for example.

[0044] Furthermore, the mark bases 173 of adjacent reference marks M1 to M3 are connected to each other, and the mark bases 173 of adjacent reference marks M4 and M5 are also connected to each other. However, the mark bases 173 of adjacent reference marks M may be spaced apart. Also, the reference marks M are circular in shape in a plan view, for example, as shown in Figure 8. The thickness of the reference marks M along the Z-axis is the same as the thickness of the wiring 167. However, the thickness of the reference marks M may differ from the thickness of the wiring 167. For example, the reference marks M may be thinner than the wiring 167. In this case, the number of layers to be laminated in the formation of the reference marks M may be reduced compared to the formation process of the wiring 167.

[0045] The control device 28 uses the reference marks M of each layer formed in parallel with the manufacturing of the substrate 161 to correct the positions for dispensing the conductive resin paste, placing the electrodes 181A of the electronic component 181, and placing the probe pins 183. Specifically, as shown in Figure 7, the control device 28, for example, after forming a five-layer substrate 161, dispenses conductive resin paste 177 onto the terminal portions 167A of each layer. The control device 28 moves the stage 52 below the third molding unit 25. The control device 28 controls the third printing section 100 of the third molding unit 25 to dispense conductive resin paste 177 from the dispenser 106 onto the terminal portions 167A exposed in the cavity 169. The control device 28 also dispenses conductive resin paste 177 from the dispenser 106 onto the terminal portions 167A of the wiring 167 exposed in the insertion hole 179 into which the probe pins 183 (see Figure 10) are inserted.

[0046] The control device 28 performs correction using a reference mark M to adjust the position at which the conductive resin paste 177 is dispensed. Specifically, the control device 28 dispenses the conductive resin paste 177 in the order of, for example, 1st layer, 2nd layer, ... 5th layer. When the control device 28 dispenses the conductive resin paste 177 onto a terminal portion 167A provided on the 1st resin layer 165, it performs correction using the respective reference marks M1 in the mark formation areas 150 and 151. Known methods can be used for the correction process. For example, the control device 28 detects the center position (center of the circle) of the reference mark M1 in the mark formation area 150 and the center position of the reference mark M1 in the mark formation area 151. The control device 28 also detects the position of the terminal portion 167A from which the conductive resin paste 177 is dispensed. As a method for detecting the center position and the position of the terminal portion 167A, for example, a method can be used that detects them based on image data captured by a camera installed inside the substrate manufacturing apparatus 10, which captures the reference marks M1 and the terminal portion 167A. The camera's mounting position is not particularly limited, but it may be mounted on, for example, the dispenser 106 or the mounting head 126. Also, for example, the 3D data 133B contains the discharge positions of the conductive resin paste 177 for each layer. The control device 28 detects the error between the position of the terminal portion 167A (actual position) and the discharge position (position in the set data) based on the center positions of the two reference marks M1 and the position of the terminal portion 167A, and corrects the discharge position.

[0047] As described above, the control device 28 forms the mark base 173 in the same procedure as forming the resin layer 165 of the forming area 145, and in parallel with the resin layer 165 of the forming area 145, up to the resin layer formation step where the resin layer 165 of any terminal-attached resin layer is formed, and forms the mark base 173 at the same height as the terminal-attached resin layer. Furthermore, in the wiring formation step where the wiring 167 of the terminal-attached resin layer is formed, the control device 28 forms the reference mark M in the same procedure as forming the wiring 167, and in parallel with the wiring 167. This allows correction to be performed using the reference mark M and mark base 173, which were formed in the same procedure as the target member for position adjustment (terminal portion 167A and the resin layer 165 below it). In other words, by molding in the same way, the same changes (such as resin shrinkage) as the resin layer 165 and wiring 167 can be reproduced in the reference mark M and mark base 173. Therefore, the discharge position of the conductive resin paste 177 and the placement position of the electronic component 181, described later, can be accurately corrected using the reference mark M.

[0048] The control device 28 performs the same correction as for the first layer when dispensing conductive resin paste 177 in the resin layers 165 above the second layer. Specifically, when the control device 28 adjusts the position at which conductive resin paste 177 is dispensed to the terminal portion 167A of the second layer, it performs a correction using a pair of reference marks M2. Also, for example, when the control device 28 adjusts the position at which conductive resin paste 177 is dispensed to the terminal portion 167A of the fifth layer, it performs a correction using a pair of reference marks M5. Note that the control device 28 does not have to dispense the conductive resin paste 177 in order for each layer. For example, when viewing the substrate 161 from a plan view, the control device 28 may dispense the conductive resin paste 177 in order from the terminal portion 167A that is closer in distance to any angle in the X-axis and Y-axis directions.

[0049] Therefore, in adjusting the position from which the conductive resin paste 177 is dispensed, the control device 28 performs a correction using a reference mark M on a mark base 173 that is at the same height as the resin layer with terminals on which the electronic components 181 to be joined by the dispensed conductive resin paste 177 are mounted. This ensures that even if the errors due to resin shrinkage differ in each layer, the conductive resin paste 177 can be dispensed accurately onto the terminal portions 167A of each layer.

[0050] Once the dispensing of the conductive resin paste 177 is complete, the control device 28 heats the conductive resin paste 177 with the first heating unit 102. The control device 28, for example, places the pallet 141 on which the substrate 161 is placed between a pair of heating plates 108 that are opposite each other in the Z-axis direction, and heats the conductive resin paste 177 with the heating plates 108. This causes the conductive resin paste 177 to adhere to the terminal portion 167A in the cavity 169 and the terminal portion 167A in the insertion hole 179. The operation of placing the pallet 141 between the pair of heating plates 108 may be performed by a machine using, for example, a robot or a conveyor device, or it may be performed by a person manually.

[0051] Next, the control device 28 moves the stage 52 on which the substrate 161 is placed to the mounting unit 27. The control device 28 controls the mounting unit 27 to perform the mounting of electronic components 181. The control device 28 supplies an arbitrary electronic component 181 from the tape feeder 124 to the supply position and places the electronic component 181 on the conductive resin paste 177 of the substrate 161 using the suction nozzle of the mounting head 126. The control device 28 controls the moving device 128 of the mounting section 122 to place the electronic component 181 held by the mounting head 126 into the cavity 169. At this time, the control device 28 positions the electronic component 181 so that its electrodes 181A contact the conductive resin paste 177 discharged onto the terminal section 167A. The electrodes 181A of the electronic component 181 are leads or balls.

[0052] The control device 28 also performs correction using the reference mark M when adjusting the position where the electronic components 181 are placed. The control device 28 controls the mounting unit 27 based on the job data 133C. The job data 133C contains, for example, the XYZ coordinates of the positions where the electronic components 181 are mounted, and the XYZ coordinates are set for each group of electronic components 181 in layers. When mounting one layer of electronic components 181, the control device 28 performs the mounting using the data for the one-layer group. Similar to the discharge position of the conductive resin paste 177 described above, the control device 28 corrects the error between the position of the conductive resin paste 177 (actual position) and the position set in the job data 133C (coordinates of the set data) based on, for example, the center position of the reference mark M and the position of the conductive resin paste 177 (terminal portion 167A) on which the electronic components 181 are mounted. Once the correction and mounting are complete for all electronic components 181 to be mounted in one layer, the control device 28 starts mounting the second layer. The control device 28 uses the reference mark M1 for position correction of the electronic components 181 mounted on the first layer, and the reference mark M2 for position correction of the electronic components 181 mounted on the second layer. The control device 28 operates in the order of the first, second, ..., fifth layers, and performs correction using the reference mark M on the mark base 173 of the same height for mounting each layer.

[0053] Therefore, in the mounting process of mounting the electronic component 181 to the terminal portion 167A, the control device 28 corrects the mounting position of the electronic component 181 relative to the terminal portion 167A using a reference mark M provided on a mark base 173 that is the same height as the resin layer with terminals on which the electronic component 181 is mounted. As a result, even if the error due to resin shrinkage etc. differs for each layer, the electronic component 181 can be mounted with high accuracy by using the mark base 173 and reference mark M corresponding to each layer.

[0054] Furthermore, when mounting layers 1 through 5, the control device 28, for example, starts mounting the electronic components 181 of the next layer only after all the electronic components 181 of any given layer have been mounted. Therefore, the control device 28 selects a terminal-equipped resin layer from among multiple terminal-equipped resin layers to which the electronic components 181 will be mounted, performs correction using the reference mark M, and mounts all the electronic components 181 to be mounted on the selected terminal-equipped resin layer before proceeding with mounting to the other terminal-equipped resin layers. This allows for the simultaneous mounting of electronic components 181 for which correction is performed using the same reference mark M1. Since correction using a different reference mark M is not required each time an electronic component 181 is mounted, the electronic components 181 can be mounted efficiently.

[0055] Once the mounting of the electronic components 181 is complete for all five layers, the control device 28 executes the mounting of the probe pins 183. The control device 28 controls the mounting unit 27 and inserts the probe pins 183, held by the suction nozzle of the mounting section 122, into the insertion holes 179. At this time, the control device 28 positions the probe pins 183 so that their lower ends contact the conductive resin paste 177 dispensed onto the terminal section 167A. The control device 28 also performs correction using the reference mark M when adjusting the position in which the probe pins 183 are placed. Similar to the case of the electronic components 181, for example, when mounting the probe pins 183 to the five layers, the control device 28 corrects the position in which the probe pins 183 are placed using the reference mark M5 and then places the probe pins 183. This allows the probe pins 183 to be accurately placed in the conductive resin paste 177. The control device 28 may also execute the mounting of the probe pins 183 before mounting the electronic components 181.

[0056] As shown in Figure 10, once the placement of the electronic components 181 and probe pins 183 is complete, the control device 28 moves the stage 52 to the first heating unit 102 and performs heating of the conductive resin paste 177. For example, with the electronic components 181 and probe pins 183 placed on the terminal portion 167A via the conductive resin paste 177, the control device 28 heats the substrate 161 by sandwiching it from both sides in the Z-axis direction with a pair of heating plates 108. The conductive resin paste 177 hardens, electrically connecting the electrodes 181A of the electronic components 181 to the terminal portion 167A, or the probe pins 183 to the terminal portion 167A. This makes it possible to manufacture the desired molded object. The release temperature of the release film 143 is set to, for example, the final heating temperature of the conductive resin paste 177 described above. Therefore, once the heating of the conductive resin paste 177 is complete, the release film 143 will be partially or completely peeled off from the pallet 141 and substrate 161. This allows the user to easily remove the completed circuit board 161 from the stage 52.

[0057] Incidentally, in the above embodiment, the substrate manufacturing apparatus 10 is an example of a manufacturing apparatus. The inkjet heads 76, 88 and the dispenser 106 are examples of ejection devices. The ultraviolet curing resin is an example of a curable resin. The metallic ink is an example of a first metallic fluid. The conductive resin paste 177 is an example of a second metallic fluid. The steps in Figures 4 and 6 are examples of resin layer formation steps and resin layer formation processes. The steps in Figure 5 are examples of wiring formation steps and wiring formation processes. Figure 9 is an example of a mounting step.

[0058] As described above, the above embodiment provides the following effects. In one embodiment of this system, the control device 28 forms a mark base 173 by laminating the resin layer 165 in the mark formation areas 150 and 151 up to the resin layer formation step where the resin layer 165 of the terminal-attached resin layer is formed. In the wiring formation step where the wiring 167 of the terminal-attached resin layer is formed, the control device 28 forms a reference mark M on the mark base 173. The control device 28 then forms mark bases 173 in the mark formation areas 150 and 151 according to the height of the multiple terminal-attached resin layers, and forms reference marks M1 to M5 on the multiple mark bases 173. This makes it possible to form a mark base 173 with the resin layer 165 laminated to the same height as the terminal-attached resin layer, and to place the reference mark M on it. The shrinkage of the resin that occurs in the terminal-attached insulating layer and the lower resin layer 165 can be similarly generated (reproduced) in the mark base 173. Therefore, by using a reference mark M on a mark base 173 formed in the same manner as the terminal-attached resin layer, corrections that take into account resin shrinkage and other factors can be performed, enabling accurate position correction.

[0059] Furthermore, this disclosure is not limited to the above embodiments, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, the above embodiment described a case in which electronic components 181 are mounted on all layers of a five-layer substrate 161. That is, in the above embodiment, all layers were insulating layers with terminals, but this is not limited to this. For example, as shown in the substrate 161A in Figure 11, electronic components 181 may be mounted only on layers 3, 4, and 5. In the case of substrate 161A, layers 3, 4, and 5 are resin layers with terminals. The control device 28 forms only the reference marks M3, M4, and M5 corresponding to layers 3 to 5 and performs correction using the reference marks M3 to M5. In addition, the control device 28 may form all of the reference marks M1 to M5 when manufacturing the substrate 161A in which layers 3 to 5 are resin layers with terminals. Furthermore, the substrate 161 is not limited to 5 layers; it may consist of two or more layers.

[0060] Furthermore, the arrangement of the reference marks M shown in Figure 3 is just one example. For example, as shown in Figure 12, three reference marks M may be provided for one layer. The control device 28 may then perform corrections using the three reference marks M when adjusting the position for dispensing the conductive resin paste 177, the position for placing the electronic components 181, and the position for placing the probe pins 183 in each layer. Also, one reference mark M may be provided per layer, or four or more may be provided per layer. Therefore, there may be one mark formation area or three or more. The formation procedures for the mark base 173 and the resin layer 165 do not have to be the same. For example, in the formation of the mark base 173, flattening and smoothing may be omitted. The formation procedures for the reference mark M and wiring 167 do not have to be the same. For example, the thickness of the reference mark M may be thinner or thicker than that of wiring 167.

[0061] The circuit board manufacturing apparatus 10 is equipped with a mounting unit 27 and is configured to perform the mounting of electronic components 181, but it is not necessary to include the mounting unit 27. In this case, the circuit board manufacturing apparatus 10 may perform the manufacturing up to the state of the circuit board 161 before the mounting of electronic components 181 (such as the circuit board 161 in the state shown in Figure 7). Alternatively, the mounting of electronic components 181 may be performed by a separate device. The control device 28 may perform position correction using the reference mark M for at least one of the following: the discharge position of the conductive resin paste 177, the placement position of the electronic component 181, and the placement position of the probe pin 183. The control device 28 mounted the electronic components 181 of each layer in order from the bottom up, starting with the components 181 of the 2nd layer, then the 3rd layer, and so on. However, it is not limited to this order. For example, the control device 28 may mount the electronic components 181 in the order of 5th layer, 4th layer...1st layer, or in any order such as 2nd layer, 4th layer, 3rd layer, 5th layer, 1st layer. Furthermore, the control device 28 does not have to mount the electronic components 181 of each layer all at once. The control device 28 may mount the first electronic component 181 of the 1st layer, then the first electronic component 181 of the 2nd layer, and then the second electronic component 181 of the 1st layer. For example, when viewing the substrate 161 from a plan view, the control device 28 may mount the electronic components 181 in order from those closest to any angle in the X-axis and Y-axis directions. Furthermore, the curable resin in this disclosure is not limited to ultraviolet-curable resins; various resins that cure by light, heat, etc., can be used.

[0062] Furthermore, the contents of this disclosure are not limited to the dependencies described in the claims. For example, this specification also discloses a technical concept in which "the manufacturing method described in claim 3" is changed to "the manufacturing method described in claim 3 or 4" in claim 5. [Explanation of symbols]

[0063] 10 PCB manufacturing equipment (manufacturing equipment), 28 control device, 52 stage, 76, 88 inkjet head (dispenser), 106 dispenser (dispenser), 145 forming area, 150, 151 mark forming area, 165 resin layer, 167 wiring, 167A terminal section, 173 mark base, 177 conductive resin paste (second metallic fluid), 181 electronic component, 181A electrode, M, M1~M5 reference marks.

Claims

1. A resin layer formation step involves extruding a curable resin into a formation area on a stage to form a resin layer, A wiring formation step involves discharging a first metallic fluid containing metal fine particles onto the resin layer to form wiring, Includes, By repeatedly performing the resin layer formation step and the wiring formation step, multiple resin layers with terminals are formed, each having a terminal portion on the surface of the resin layer that is part of the wiring and connects to an electronic component mounted on the wiring. Among the multiple resin layer forming steps, up to the resin layer forming step for forming the resin layer of the terminal-attached resin layer, the resin layer is laminated in a mark forming area, which is a different area from the forming area on the stage, to form a mark base. In the wiring formation step of forming the wiring of the resin layer with terminals, the first metallic fluid is discharged onto the mark base to form a reference mark, When multiple terminal-equipped resin layers are formed at different heights, mark bases corresponding to the heights of the multiple terminal-equipped resin layers are formed in the mark-forming area, and reference marks are formed on each of the multiple mark bases. The mounting process involves mounting the electronic components on the terminal portion of the terminal-equipped resin layer, Furthermore, In the aforementioned implementation process, Using the reference marks provided on the mark base, which is at the same height as the resin layer with terminals on which the electronic components are mounted, the position in which the electronic components are mounted relative to the terminal portion is corrected. A manufacturing method comprising: discharging a second metallic fluid connecting the electrodes of the electronic component to the terminal portion to the terminal portion; and performing a correction in adjusting the position from which the second metallic fluid is discharged, using the reference mark provided on the mark base which is at the same height as the resin layer with terminals on which the electronic component is mounted.

2. A resin layer forming step of discharging a curable resin into a forming area on a stage to form a resin layer, A wiring formation step involves discharging a first metallic fluid containing metal fine particles onto the resin layer to form wiring, Includes, By repeatedly performing the resin layer formation step and the wiring formation step, multiple resin layers with terminals are formed, each having a terminal portion on the surface of the resin layer that is part of the wiring and connects to an electronic component mounted on the wiring. Among the multiple resin layer forming steps, up to the resin layer forming step for forming the resin layer of the terminal-attached resin layer, the resin layer is laminated in a mark forming area, which is a different area from the forming area on the stage, to form a mark base. In the wiring formation step of forming the wiring of the resin layer with terminals, the first metallic fluid is discharged onto the mark base to form a reference mark, When multiple terminal-equipped resin layers are formed at different heights, mark bases corresponding to the heights of the multiple terminal-equipped resin layers are formed in the mark-forming area, and reference marks are formed on each of the multiple mark bases. The mounting process involves mounting the electronic components on the terminal portion of the terminal-equipped resin layer, Furthermore, In the aforementioned implementation process, Using the reference marks provided on the mark base, which is at the same height as the resin layer with terminals on which the electronic components are mounted, the position in which the electronic components are mounted relative to the terminal portion is corrected. A manufacturing method in which, when performing the mounting process on each of a plurality of terminal-equipped resin layers, a terminal-equipped resin layer on which the mounting process is to be performed is selected from among the plurality of terminal-equipped resin layers, correction using the reference marks is performed, and after all the electronic components to be mounted on the selected terminal-equipped resin layer are mounted, the mounting process is performed on the other terminal-equipped resin layers.

3. Up to the resin layer forming step of forming the resin layer of the terminal-attached resin layer, The mark base is formed in the same procedure as the procedure for forming the resin layer in the formation area, and in parallel with the resin layer in the formation area, and the mark base is formed to be the same height as the resin layer with terminals. In the wiring formation step of forming the wiring of the terminal-equipped resin layer, The manufacturing method according to claim 1 or claim 2, wherein the reference mark is formed in the same procedure as the procedure for forming the wiring, and in parallel with the wiring.

4. The stage and, Discharge device and Control device and Equipped with, The control device is A resin layer formation process in which a curable resin is discharged into a formation area on a stage by the discharge device to form a resin layer, A wiring formation process is performed by discharging a first metallic fluid containing metal fine particles onto the resin layer using the discharge device to form wiring, Execute, By repeatedly performing the resin layer formation process and the wiring formation process, multiple resin layers with terminals are formed, each having a terminal portion on the surface of the resin layer that is part of the wiring and connects to an electronic component mounted on the wiring. Among the multiple resin layer forming processes, up to the resin layer forming process for the terminal-attached resin layer, the resin layer is laminated in a mark forming area, which is a different area from the formation area on the stage, to form a mark base. In the wiring formation process for forming the wiring of the terminal-equipped resin layer, the first metallic fluid is discharged onto the mark base by the discharge device to form a reference mark. When multiple terminal-equipped resin layers are formed at different heights, mark bases corresponding to the heights of the multiple terminal-equipped resin layers are formed in the mark-forming area, and reference marks are formed on each of the multiple mark bases. The control device is The mounting process involves mounting the electronic component on the terminal portion of the terminal-equipped resin layer, Furthermore, In the aforementioned implementation process, Using the reference marks provided on the mark base, which is at the same height as the resin layer with terminals on which the electronic components are mounted, the position in which the electronic components are mounted relative to the terminal portion is corrected. A manufacturing apparatus that discharges a second metallic fluid connecting the electrodes of the electronic component to the terminal portion using the discharge device to the terminal portion, and performs correction in adjusting the position from which the second metallic fluid is discharged using the reference marks provided on the mark base, which is at the same height as the resin layer with terminals on which the electronic component is mounted.

5. A stage and Discharge device and Control device and Equipped with, The control device is A resin layer formation process in which a curable resin is discharged into a formation area on a stage by the discharge device to form a resin layer, A wiring formation process is performed by discharging a first metallic fluid containing metal fine particles onto the resin layer using the discharge device to form wiring, Execute, By repeatedly performing the resin layer formation process and the wiring formation process, multiple resin layers with terminals are formed, each having a terminal portion on the surface of the resin layer that is part of the wiring and connects to an electronic component mounted on the wiring. Among the multiple resin layer forming processes, up to the resin layer forming process for the terminal-attached resin layer, the resin layer is laminated in a mark forming area, which is a different area from the formation area on the stage, to form a mark base. In the wiring formation process for forming the wiring of the terminal-equipped resin layer, the first metallic fluid is discharged onto the mark base by the discharge device to form a reference mark. When multiple terminal-equipped resin layers are formed at different heights, mark bases corresponding to the heights of the multiple terminal-equipped resin layers are formed in the mark-forming area, and reference marks are formed on each of the multiple mark bases. The control device is The mounting process involves mounting the electronic component on the terminal portion of the terminal-equipped resin layer, Furthermore, In the aforementioned implementation process, Using the reference marks provided on the mark base, which is at the same height as the resin layer with terminals on which the electronic components are mounted, the position in which the electronic components are mounted relative to the terminal portion is corrected. A manufacturing apparatus that, when performing the mounting process on each of a plurality of terminal-equipped resin layers, selects a terminal-equipped resin layer from among the plurality of terminal-equipped resin layers to perform the mounting process on, performs correction using the reference marks, mounts all of the electronic components to be mounted on the selected terminal-equipped resin layer, and then performs the mounting process on the other terminal-equipped resin layers.

Images