Information processing device

Abstract

To provide electronic equipment including a large display region and with improved portability, and to provide electronic equipment with improved reliability.SOLUTION: An information processing device comprises a first film, a panel substrate, and at least a first housing. The panel substrate has flexibility and includes a display region. The first film has permeability to visible light and flexibility. The first housing includes a first slit. The panel substrate includes a region sandwiched between the first film and a second film. The first slit has a function to store this region. Either or both of the panel substrate and the first film are slidable along the first slit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One aspect of the present invention relates to an information processing device, a display device, and an electronic device.

[0002] Furthermore, one aspect of the present invention is not limited to the above-mentioned technical field. One aspect of the technical field relates to a product, method, or method of manufacture. Or, the present invention. One aspect of this is a process, machine, manufacture, or composition. This relates to matter. Therefore, the invention disclosed more specifically in this specification One aspect of the technical field is semiconductor devices, display devices, light-emitting devices, energy storage devices, memory devices, Examples of their driving methods or manufacturing methods can be given. [Background technology]

[0003] In recent years, electronic devices equipped with display devices have become increasingly diverse. One example is mobile phones and smartphones. Information processing devices include smartphones, tablet devices, and wearable devices.

[0004] As a display device, a typical example is organic EL (Electro-Luminescence). Light emission from elements such as LEDs (Light Emitting Diodes) Electronic paper displays information using light-emitting devices equipped with elements, liquid crystal displays, electrophoretic methods, etc. Examples include the following. Patent documents 1 and 2 describe flexible devices to which organic EL elements are applied. A light-emitting device is disclosed. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2014-197522 [Patent Document 2] Japanese Patent Publication No. 2015-064570 [Overview of the project] [Problems that the invention aims to solve]

[0006] In recent years, there has been a growing demand for information processing devices, display devices, and electronic devices with large display areas. By increasing the display area, the ability to see everything at a glance improves, and the amount of information that can be displayed increases. These are some of the advantages. On the other hand, in portable electronic devices, increasing the display area... Portability is reduced. Therefore, improving the overview of the display and portability Achieving both improvement and success was difficult.

[0007] One aspect of the present invention aims to provide an electronic device having a large display area. Alternatively, one of the challenges is to improve the portability of electronic devices. Alternatively, the ease of viewing displays. One of the challenges is to achieve both improved performance and increased portability. Alternatively, to provide novel electronic devices. One of the challenges is to do the following. Alternatively, one of the challenges is to improve the reliability of electronic devices. ru.

[0008] Furthermore, the description of these problems does not preclude the existence of other problems. The approach does not need to solve all of these problems. This will become clear from the description in the specification, drawings, claims, etc., and the specification, drawings It is possible to extract other issues from the descriptions in the surfaces, claims, etc. [Means for solving the problem]

[0009] An information processing apparatus according to one aspect of the present invention includes a hinge, a first housing, a second housing, and a panel substrate. It also includes a first film and a second film. The hinge has a rotation axis, and the first housing is connected to the second housing via the hinge so as to be rotatable about the rotation axis. The first housing has a first slit, and the second housing has a second slit. The panel substrate has a region that overlaps with the first film, and this region is housed in either or both of the first slit and the second slit. Either or both of the panel substrate and the first film are slidable along the second slit.

[0010] Also, an information processing apparatus according to one aspect of the present invention is the above information processing apparatus having a second film. The panel substrate has a region sandwiched between the first film and the second film.

[0011] Also, an information processing apparatus according to one aspect of the present invention is the above information processing apparatus in which the first film has flexibility and transparency to visible light. The panel substrate has flexibility and a display region. The first housing has a first part and a second part. The first part overlaps with the display region, and the second part overlaps with the peripheral part of the first part. Also, the second film is sandwiched between the display region and the first part, and the second film has flexibility.

[0012] Also, an information processing apparatus according to one aspect of the present invention is such that the first film is fixed to a part of the first housing. The first film, the second film, and the panel substrate are slidable along the second slit by rotating the second housing about the rotation axis with respect to the first housing.

[0013] Furthermore, in one embodiment of the present invention, an information processing device is provided in which a first film is fixed to a first housing, and The film rotates the second housing, and the second housing rotates relative to the first housing around the rotation axis. By doing so, the second film can slide along the second slit, and the second film is in the first housing It is fixed to the body and the second housing.

[0014] Furthermore, in one embodiment of the present invention, the information processing apparatus has a second housing with an end parallel to the axis of rotation, and the first The film and panel substrate slide within the second slit, and the first film moves from its edge. The panel substrate is separated from the edges.

[0015] Furthermore, in one embodiment of the present invention, the information processing apparatus comprises a second housing positioned relative to the first housing around a rotation axis. By rotating it, the first film is positioned in a planar or convex shape relative to the panel substrate. It will become.

[0016] Furthermore, an information processing device according to one aspect of the present invention has a circuit board. The circuit board is a panel substrate and an electric The circuit board is electrically connected and housed in the first enclosure.

[0017] Furthermore, an information processing device according to one embodiment of the present invention has at least one drive circuit. The drive circuit is The panel substrate is provided on the panel substrate, and the panel substrate has a curved section between the drive circuit and the display area. .

[0018] Furthermore, in one embodiment of the present invention, the information processing apparatus includes a panel substrate which comprises an image signal line driving circuit and a display The region includes a curved section between the areas.

[0019] Furthermore, an information processing device according to one embodiment of the present invention has an input unit. The input unit is equipped with a touch sensor. The touch sensor has an area that overlaps with the display area.

[0020] Furthermore, an information processing device according to one aspect of the present invention includes a first flexible printed circuit board and a second flexible printed circuit board. The first housing has a flexible printed circuit board. It houses the second flexible printed circuit board. The first flexible printed circuit board is front The second flexible printed circuit board supplies control signals to the touch sensor. An information processing device that supplies information.

[0021] Furthermore, an information processing device according to one aspect of the present invention includes a keyboard, hardware buttons, and a pointing Lighting devices, illuminance sensors, imaging devices, voice input devices, eye-tracking devices, posture detection devices, This includes one or more of these. [Effects of the Invention]

[0022] According to one aspect of the present invention, a novel information processing device with excellent portability and reliability can be provided. Alternatively, a novel information processing device with excellent operability can be provided. This allows us to provide novel display devices and the like. Note that the description of these effects does not preclude the existence of other effects. This does not mean that all of these effects are necessarily achieved. Furthermore, one aspect of the present invention does not necessarily have all of these effects. It is not necessary. Furthermore, any other effects will become clear from the description in the specification, drawings, claims, etc. This will be the case, and other effects will be extracted from the description in the specification, drawings, claims, etc. It is possible to do so. [Brief explanation of the drawing]

[0023] [Figure 1] A diagram illustrating a cross-section of an information processing device according to an embodiment. [Figure 2] A diagram illustrating a cross-section of an information processing device according to an embodiment. [Figure 3]A diagram illustrating the configuration of a touch panel that can be used in the information processing device according to the embodiment. [Figure 4] A diagram illustrating the housing of an information processing device according to an embodiment. [Figure 5] A diagram illustrating the configuration of a touch panel that can be used in the information processing device according to the embodiment. [Figure 6] A diagram illustrating the configuration of a touch panel that can be used in the information processing device according to the embodiment. [Figure 7] A diagram illustrating the configuration of a touch panel that can be used in the information processing device according to the embodiment. [Figure 8] A diagram illustrating the configuration of a touch panel that can be used in the information processing device according to the embodiment. [Figure 9] A diagram illustrating a method for manufacturing a bendable device according to an embodiment. [Figure 10] A diagram illustrating a method for manufacturing a bendable device according to an embodiment. [Figure 11] A diagram illustrating a method for manufacturing a bendable device according to an embodiment. [Figure 12] A diagram illustrating the bending of a touch panel according to an embodiment. [Figure 13] A diagram illustrating an electronic device having an input / output device according to an embodiment. [Modes for carrying out the invention]

[0024] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. It will be easily understood by those skilled in the art to obtain this. Therefore, the present invention is as shown in the embodiments below. The description is not to be interpreted as being limited to the stated content. The same reference numeral is used in common across different drawings for parts that are identical or have similar functions. I will omit the explanation of that repetition.

[0025] (Embodiment 1) In this embodiment, the information processing device is a foldable touch panel, which is an information processing device according to one aspect of the present invention. This will be explained with reference to Figures 1 to 4. The touch panel consists of a display unit and a touch sensor. Sa has.

[0026] <Explanation of the cross-section> Figure 1(A) shows a cross-sectional view of one state of a foldable touch panel according to one embodiment of the present invention. Figure 1(B) shows another state of a foldable touch panel according to one embodiment of the present invention. ru.

[0027] In one aspect of the present invention, a foldable touch panel comprises a panel substrate 101, a first film Mu 102, second film 103, first housing 104-1, second housing 104-2, Hin Panel substrate 1 has a 105-1, a circuit board 106, and a flexible printed circuit board (FPC) 107. 01, the first film 102 and the second film 103 are all flexible. With the rotation axis of the 105-1 as the center, the first housing 104-1 is positioned relative to the second housing 104-2. It can rotate. The state shown in Figure 1(A) is around the axis of rotation of hinge 105-1. It can be said that the information processing device is in a folded state.

[0028] In Figure 1(A), the first housing 104-1 is divided into a first part 104-1A and a second part 104- Including 1B and end 111. The second housing 104-2 includes the first part 104-2A and the second Including part 104-2B and end 110. First part 104-1A and first part 104-2A is connected to hinge 105-1, and the first part 104-1A has a circuit The circuit board 106 and the FPC 107 are housed in the second part included in the first enclosure 104-1. Section 104-1B overlaps with the peripheral portion of the first section 104-1A. Also, the second section 104 A gap is formed between -1B and the periphery of the first part 104-1A. Second housing The second part 104-2B included in 104-2 overlaps with the peripheral part of the first part 104-2A. Yes. Also, between the peripheral portions of the second portion 104-2B and the first portion 104-2A, Another void is formed. End portion 111 is first portion 104-1A and second portion 104-1 It is located between B. Also, end 110 is between the first part 104-2A and the second part 104 -Located between 2B. For example, in the first housing 104-1, the first part 104- In the region enclosed by 1A, the second portion 104-1B and the end portion 111, there is a gap (slit 10 8-1) is formed. Also, in the second housing 104-2, the first part 104-2A In the region surrounded by the second portion 104-2B and end portion 110, there is a gap (slit 108- 2) is formed. That is, a slit 108-1 is provided in the first housing 104-1, A slit 108-2 is provided in the second housing 104-2.

[0029] The first film 102, the panel substrate 101, and the second film 103 are stacked, It is housed in slot 108-1 and slit 108-2.

[0030] When providing a drive circuit on a panel substrate, even if it is provided as an in-cell type, COG (Chip On It may also be installed using the Glass method or the COF (Chip On Film) method. Figures 1(A) and 1(B) show the socket 109 when installed using the COG method.

[0031] An information processing apparatus according to one aspect of the present invention comprises a foldable panel substrate 101 and a transparent and thickness A first film having a thickness of 50 μm or more and 500 μm or less, preferably 80 μm or more and 150 μm or less. It has 102. By having the first film 102 the surface of the panel substrate 101 To prevent mechanical damage, and the panel substrate 101 is connected to the first housing 104-1 and the second housing 10 This prevents the panel substrate 101 from lifting up from 4-2. The second film 103 is housed between 104-1 and the second housing 104-2. Yes, it is possible. The panel substrate 101 is placed between the first film 102 and the second film 103. It is slidably clamped. This allows the panel substrate 101 to be held between the first housing 104-1 and the second housing It can be supported using the housing 104-2. Also, the pressure associated with operating the touch panel The second film 103 can reduce the amount of deformation of the panel substrate 101. However, Furthermore, in one embodiment of the present invention, the information processing apparatus can perform mechanical surface processing even in a configuration without the second film 103. A configuration that prevents damage can be implemented.

[0032] In one aspect of the present invention, the first film 102 and the second film 103 are each the first It is fixed and supported in the part that contacts the housing 104-1. As shown in Figure 1(A), the first The film 102 is fixed to the first housing 104-1 by the support part 116. The component 103 is fixed to the first housing 104-1 by the support portion 117.

[0033] In one aspect of the present invention, the FPC 107 connects the panel substrate 101 to the circuit board 106. The circuit board 106 is fixed to the first housing 104-1. The folded panel board 101 The frictional force generated between the portion and the first housing 104-1 near the end 111, and the FPC 107 And using the connection with the circuit board 106, the panel board 101 is connected to the first housing 104-1. To gain support.

[0034] In the slit 108-1 of the first housing 104-1, the first film 102 and The flannel substrates 101 may be fixed to each other, and the panel substrate 101 and the second film 10 3 may be fixed to each other. This allows the panel substrate 101 and the first film 10 2. The second film 103 is located within the slit 108-2 of the second housing 104-2. It can slide smoothly. Alternatively, it can slide along the panel substrate in conjunction with the bending operation of the information processing device. The applied stress can be alleviated, or the panel substrate can be prevented from being damaged by stress. can.

[0035] The first film 102 has a region that is not fixed to the panel substrate 101. With the film 102 and the panel substrate 101 fixed together, the information processing device is folded. If this happens, the panel substrate 101 becomes more susceptible to damage due to stress. In one aspect of the present invention, When the information processing device is folded, the first film 102 and the panel substrate 101 The sliding action of these parts reduces damage to the panel substrate 101 due to stress.

[0036] An information processing device according to one aspect of the present invention allows viewing of the display unit through the first film 102. This is possible. In other words, the first film 102 is transparent to light of wavelengths in the visible light region. Figure 2(A) shows the information processing device folded so that the display surface is concave. In this state, the first film 102 has a larger end 110 than the second film 103. It is approaching that. Also, Figure 2(B) shows the information processing device folded so that the displayed surface is convex. It is in a bent state. In this state, the second film 103 is more than the first film 1 It is closer to the end 110 than 02. Thus the first film 102, the second film As 103 and the panel substrate 101 slide against each other, the bending of the panel substrate 101 occurs. This can reduce compressive stress, tensile stress, and other stresses.

[0037] <Explanation of the top view of the panel substrate> In this embodiment, for example, a touch panel 300 can be used as the panel substrate 101. (See Figure 3(A)). Alternatively, the touch panel 400 can be used (Figure 3( See B). Touch panel 300 and touch panel 400 each have a display unit 301. .

[0038] The touch panel 300 or touch panel 400 has a touch sensor, and the touch sensor It includes an area that overlaps with the display unit 301. For example, a sheet-like capacitance that overlaps with the display panel. A type of touch sensor can be used. Alternatively, a so-called in-cell type touch panel can be used. It can be used. In-cell type touch panels have the functionality of touch sensors. For example Alternatively, a capacitive touch sensor may be applied, or an optical touch sensor using a photoelectric conversion element may be used. A touch sensor may be applied. Specifically, a photoelectric conversion element can be used in an optical touch sensor. This is possible (see Figure 3(A) or Figure 3(B)). For example, an optical touch sensor It includes a display unit 301, which comprises multiple pixels 302 and multiple imaging pixels 308. The imaging pixel 308 detects a finger touching the display unit 301 or a finger held over the display unit 301. It is possible to know.

[0039] Pixel 302 comprises multiple sub-pixels (e.g., sub-pixel 302R), and the sub-pixels are light-emitting elements and It is equipped with a pixel circuit.

[0040] The pixel circuit can supply selection signals and image signals. The wiring is electrically connected, and the pixel circuit supplies power to drive the light-emitting elements.

[0041] The touch panel 300 shown in Figure 3(A) includes a scan line drive circuit 303g(1) and an image sensor. It has a signal line drive circuit 303s(1). The scan line drive circuit 303g(1) selects a signal It can be supplied to pixel 302. The image signal line driving circuit 303s(1) drives the image signal. It can be supplied to element 302. Also, the touch panel 400 shown in Figure 3(B) is a scan line drive. It has a motion circuit and an image signal line driving circuit. The scan line driving circuit provides a selection signal to the pixel 302. The image signal line drive circuit can supply the image signal to the pixel 302. In the case where it is provided, the touch panel 400 is located in the area 401 where the socket 109 is positioned. (1) and region 401(2) are provided, and a drive circuit is provided for each using the COG method.

[0042] The imaging pixel 308 comprises a photoelectric conversion element and an imaging pixel circuit, and the imaging pixel circuit comprises a photoelectric conversion element Drive the child.

[0043] The imaging pixel circuit has wiring that can supply control signals and power supply potential. It is electrically connected to the available wiring.

[0044] For example, a signal to select a predetermined imaging pixel circuit and read out the recorded imaging signal, imaging pixel cycle Control signals include signals to initialize the path and signals to determine the time for the imaging pixel circuit to detect light. It can be used as a number.

[0045] The touch panel 300 or touch panel 400 is an image pixel driving circuit 303g(2) and It also includes an imaging signal line drive circuit 303s(2). The imaging pixel drive circuit 303g(2) controls The signal can be supplied to the imaging pixel 308. The imaging signal line drive circuit 303s(2) The imaging signal can be read out.

[0046] Touch panel 300 or touch panel 400 is the area indicated by line segment 406 or line segment 407. It can be folded in a region. For example, a region indicated by line segment 406 is placed near end 111. A region indicated by line segment 407 is placed near hinge 105-1, and the touch panel 300 or The Touch Panel 400 can be folded.

[0047] The touch panel 300 can be folded in the area indicated by line segment 406. For example, scan line The region where the motion circuit 303g(1) and the image signal line drive circuit 303s(1) are located, and the table The touch panel 300 can be folded between the area where the display unit is located. Area 4 Between the area where 01(1) and area 401(2) are located and the area where the display unit is located Then, the touch panel 400 can be folded. This allows the second part 104-1B The area can be reduced. Alternatively, the scan line driving circuit 303 of the touch panel 300 The area of ​​the region where g(1) and the image signal line driving circuit 303s(1) are arranged is the second part It can be made larger than the area of ​​part 104-1B. Or, the area of ​​touch panel 400. The area of ​​the region in which 401(1) and region 401(2) are located is the second part 104-1 It can be made larger than the area of ​​B.

[0048] <Explanation of the top view of the enclosure> First housing 104-1, second housing 104-2, hinge 105-1, slit 108-1 The slit 108-2 and end portion 110 are shown in Figure 4.

[0049] A hinge 105-1 is connected to one side of the second housing 104-2, and the other side of the second housing 104-2 Slits 108-2 are provided on three sides. The end portion 110 is parallel to the axis of rotation of the hinge 105-1. It is provided in the first housing 104-1. A hinge 105-1 is connected to one side of the first housing Slits 108-1 are provided on the other three sides of 104-1. End 111 has a hinge 105- It is positioned parallel to the axis of rotation of 1.

[0050] The panel substrate 101, the first film 102, and the second film 103 are connected to the first housing 1 It is fixed at 04-1. As a result, the information processing device folds at hinge 105-1. Even when bent, the distance between the end 111 and the panel substrate 101, and the distance between the end 111 and the first film The distance between 102 and the distance between end 111 and the second film 103 remain unchanged. On the other hand, The panel substrate 101, the first film 102, and the second film 103 are connected to the second housing 1 It is not fixed to 04-2. As a result, the information processing device folds at hinge 105-1. When bent, the distance between the end 110 and the panel substrate 101, and the distance between the end 110 and the first fill The distance between the 102 segments and the distance between the end 110 and the second film 103 will vary. The distance between the end 110 and the panel substrate 101 is the axis of rotation of the hinge 105-1 and the panel The longer the distance between the substrates 101, the greater the change.

[0051] Furthermore, even if the information processing device is bent at hinge 105-1, the second film 103 If strong bending stress, compressive stress, and tensile stress are not applied, the second film 10 3 may be fixed to the first housing 104-1 and the second housing 104-2.

[0052] Figures 1(A), 1(B), and 4 show a simplified representation of hinge 105-1. Figure 1(B) In the state shown, the axis of rotation of the hinge 105-1 overlaps with the panel substrate 101. As a result of the bending operation of the information processing device, the distance the panel substrate 101 slides, The distance over which film 102 slides and the distance over which film 103 slides are reduced. It is possible.

[0053] The panel substrate 101 separates from the end 110, and the first film 102 separates from the end 110. The second film 103 is separated from the end 110. This allows the information processing device to be folded. As the movement progresses, the panel substrate 101, the first film 102, and the second film 103 slide against each other. However, the panel substrate 101, the first film 102, or the second film 103 are Neither contacts the end portion 110. Also, the end of the first film 102 is always in contact with the second portion 1 This overlaps with 04-2B. As a result, the panel substrate 101, the first film 102, and the second film The end of film 103 falls out of slit 108-2, or the second part 104-2 This prevents collision with the edge of B. Alternatively, the panel substrate 101 and the first film 10 2 or the second film 103 does not come into contact with the end 110. From bending, deterioration, and damage caused by contact, the panel substrate 101, the first film 102, or the second This can prevent the film 103 from being blocked.

[0054] For example, a display unit is provided on the panel substrate 101, and a touch panel is provided on the first film 102. This is possible. The first film 102 and the panel substrate 101 slide against each other, and the sliding action Consequently, the position of the touch panel relative to the display may become misaligned. Also, in the state of misalignment... When location information is entered into a touch panel, unintended information may be entered. For example... Then, a touch panel and a display unit can be provided on the panel substrate 101. This allows, It is preferable that the position of the touch panel relative to the display unit does not shift.

[0055] An information processing apparatus according to one aspect of the present invention consists only of a first film 102 and a panel substrate 101. But that's fine too. At this time, the panel substrate 101 is in slidable contact with the first film 102, and It is supported by the first enclosure 104-1 and the second enclosure 104-2.

[0056] An information processing device according to one aspect of the present invention can also be configured with only three or more films and a panel substrate 101. Good. At this time, the panel substrate 101 has a film that contacts one side and a film that contacts the opposite side. The film is slidably in contact with the first housing 104-1 and the second housing 104-2, and is supported by the first housing 104-1 and the second housing 104-2. It will be done.

[0057] An information processing device according to one aspect of the present invention has a configuration in which multiple hinges are provided and three or more housings are provided That is also good. When one of the connected enclosures that constitute the information processing device is called the first enclosure, Within the slits other than the housing, the first film 102 and the panel substrate 101 are slidable. It's fine to accept it.

[0058] (Embodiment 2) In this embodiment, the information processing device of one aspect of the present invention has a foldable touch panel The configuration of the unit will be explained with reference to Figure 5.

[0059] Figure 5(A) illustrates the structure of a touch panel applicable to an information processing device according to one embodiment of the present invention. This is a top view. In Figure 5(A), each part corresponds to Figure 3(A).

[0060] Figure 5(B) is a cross-sectional view of Figure 5(A) along cutting lines AB and CD.

[0061] Figure 5(C) is a cross-sectional view of Figure 5(A) along the cutting line EF.

[0062] <Explanation of the cross-section> The touch panel 300 has a substrate 310 and a counter substrate 370 facing the substrate 310. (See Figure 5(B)).

[0063] By applying a flexible material to the substrate 310 and the opposing substrate 370, flexibility is achieved. It can be added to the touch panel 300.

[0064] Furthermore, when the flexible touch panel 300 is deformed, the touch panel 300 is provided The functional element is subjected to stress. The functional element is positioned approximately in the center of the substrate 310 and the opposing substrate 370. This is preferable because it suppresses deformation of the functional element.

[0065] Furthermore, it is preferable to use materials with approximately equal differences in coefficient of thermal expansion for the substrate 310 and the opposing substrate 370. It seems so. The coefficient of thermal expansion of the material is 1 × 10⁻⁶. -3 / K or less, preferably 5 × 10 -5 / K or less, yo Preferably 1 x 10 -5It is good if it is less than or equal to / K.

[0066] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), poly Mido, polycarbonate, polyurethane, acrylic resin, epoxy resin, or silicone A material containing a resin having siloxane bonds, such as ester, is applied to the substrate 310 and the opposing substrate 370. It can be used.

[0067] The substrate 310 is a flexible substrate 310b, and a barrier film is provided to prevent the diffusion of impurities to the light-emitting element. A resin layer 310c is laminated to bond 310a and the substrate 310b to the barrier film 310a. It is a laminated structure.

[0068] The opposing substrate 370 consists of a flexible base material 370b and burrs to prevent the diffusion of impurities to the light-emitting element. The total area of ​​the film 370a and the resin layer 370c that bonds the substrate 370b and the barrier film 370a. It is a layered structure (see Figure 5(B)).

[0069] The sealing material 360 bonds the opposing substrate 370 and the substrate 310 together. Also, the sealing material 360 It has a refractive index higher than air and also serves as a layer that provides optical bonding. Pixel circuits and The light-emitting element (for example, the first light-emitting element 350R) is located between the substrate 310 and the opposing substrate 370. .

[0070] <Pixel configuration> Pixel 302 has sub-pixels 302R, 302G, and 302B (Figure 5) See C). In addition, sub-pixel 302R is equipped with light-emitting module 380R, and sub-pixel 302G is Each sub-pixel 302B is equipped with a light-emitting module 380G, and each sub-pixel 302B is equipped with a light-emitting module 380B.

[0071] For example, the sub-pixel 302R powers the first light-emitting element 350R and the first light-emitting element 350R. The pixel circuit includes a transistor 302t that can supply power (see Figure 5(B)). ). In addition, the light-emitting module 380R has a first light-emitting element 350R and an optical element (for example, the first It comprises one colored layer (367R).

[0072] The first light-emitting element 350R consists of a first lower electrode 351R, an upper electrode 352, and a first lower electrode A layer 353 containing a luminescent organic compound is located between 351R and the upper electrode 352 (Figure 5(C) )reference).

[0073] The layer 353 containing a luminescent organic compound includes luminescent unit 353a, luminescent unit 353b, An intermediate layer 354 is provided between the light-emitting unit 353a and the light-emitting unit 353b.

[0074] The light-emitting module 380R has a first colored layer 367R on the opposing substrate 370. The colored layer is Any material that transmits light of a specific wavelength is acceptable, for example, exhibiting red, green, or blue light. A material that selectively transmits the light emitted by the light-emitting element can be used. Alternatively, the light emitted by the light-emitting element can be filtered. A region that remains transparent may be provided.

[0075] For example, the light-emitting module 380R has a first light-emitting element 350R and a first colored layer 367R. It has a sealing material 360 in contact with it.

[0076] The first colored layer 367R is located in a position that overlaps with the first light-emitting element 350R. A portion of the light emitted by the light-emitting element 350R acts as a sealing layer that also serves as an optical bonding layer. The material 360 and the first colored layer 367R are transmitted through the light-emitting module as shown by the arrows in the figure. It is ejected to the outside of the 380R. An information processing device in one aspect of the present invention, in the direction of this arrow, It has a first film 102.

[0077] <Display Panel Configuration> The touch panel 300 has a light-shielding layer 367BM on the opposing substrate 370. It is provided so as to surround the colored layer (for example, the first colored layer 367R).

[0078] The touch panel 300 is equipped with an anti-reflective layer 367p in a position that overlaps with the display unit 301. For example, a circular polarizing plate can be used as the protective layer 367p.

[0079] The touch panel 300 includes an insulating film 321. In Figure 5(B), the insulating film 321 is transient It covers the star 302t. The insulating film 321 flattens the irregularities caused by the pixel circuit. It can be used as a layer for this purpose. Also, it can help diffuse impurities into transistors such as transistor 302t. An insulating film having a layer that can suppress noise can be applied to the insulating film 321.

[0080] The touch panel 300 has light-emitting elements (for example, a first light-emitting element 350R) on an insulating film 321. To possess.

[0081] The touch panel 300 has a partition wall 328 that overlaps the end of the first lower electrode 351R, and an insulating film 32 1. It is located on (see Figure 5(C)). It also controls the distance between substrate 310 and opposing substrate 370. A spacer 329 is provided on the partition wall 328.

[0082] <Configuration of the image signal line driving circuit> The image signal line driving circuit 303s(1) includes a transistor 303t and a capacitor 303c. Furthermore, the drive circuit can be formed on the same substrate using the same process as the pixel circuit.

[0083] <Image Pixel Configuration> The imaging pixel 308 receives light from the photoelectric conversion element 308p and the light irradiated onto the photoelectric conversion element 308p. It is equipped with an imaging pixel circuit for detection. The imaging pixel circuit also uses a transistor 308t. include.

[0084] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0085] <Other configurations> The touch panel 300 is equipped with wiring 311 that can supply signals, and terminal 319 is provided. It is located on line 311. It can also supply signals such as image signals and synchronization signals. The FPC309(1) is electrically connected to terminal 319. It is also possible to connect them by splitting them into 309(1) and FPC309(2), or FPC309 and A single-connection configuration is also acceptable.

[0086] Note that a printed circuit board (PWB) may be attached to FPC309(1). .

[0087] Transistors formed in the same process are referred to as transistor 302t, transistor 303t, and It can be applied to transistors such as the 308t transistor.

[0088] Transistors with structures such as bottom-gate and top-gate types can be applied.

[0089] Various semiconductors can be applied to transistors. For example, oxide semiconductors, single-crystal silicon, and Resilience or amorphous silicon can be applied.

[0090] This embodiment can be appropriately combined with other embodiments shown herein. .

[0091] (Embodiment 3) In this embodiment, it is applied to a panel substrate of an information processing device according to one aspect of the present invention. The configuration of a foldable touch panel will be explained with reference to Figures 6 and 7. ru.

[0092] Figure 6(A) is a perspective view of the touch panel 500 illustrated in this embodiment. Therefore, typical components are shown in Figure 6. Figure 6(B) is a perspective view of the touch panel 500. be.

[0093] Figure 7(A) is a cross-sectional view of the touch panel 500 shown in Figure 6(A) at X1-X2. .

[0094] The touch panel 500 includes a display unit 501 and a touch sensor 595 (see Figure 6(B)). Furthermore, the touch panel 500 has substrates 510, 570, and 590. Substrates 510, 570, and 590 are all flexible.

[0095] The display unit 501 consists of a substrate 510, a plurality of pixels on the substrate 510, and a unit that supplies signals to these pixels. It includes multiple wirings 511 that can be operated, and an image signal line driving circuit 503s(1). Multiple wires 511 are routed to the outer periphery of the circuit board 510, and some of them form terminals 519. It is working. Terminal 519 is electrically connected to FPC509(1).

[0096] <Touch sensor> The circuit board 590 includes a touch sensor 595 and multiple devices that are electrically connected to the touch sensor 595. It is equipped with wiring 598. Multiple wirings 598 are routed around the outer periphery of the circuit board 590, and some of them are This constitutes a terminal. This terminal is then electrically connected to FPC509(2). In Figure 6(B), for clarity, it is provided on the back side of substrate 590 (the side facing substrate 510). The electrodes and wiring of the touch sensor 595 are shown with solid lines.

[0097] For example, a capacitive touch sensor can be used as the touch sensor 595. Methods include surface capacitance and projected capacitance.

[0098] Projected capacitance systems are mainly categorized into self-capacitance systems and mutual-capacitance systems, based on differences in their driving methods. There is a mutual capacitance method, which is preferable because it enables simultaneous multi-point detection.

[0099] In the following section, we will use Figure 6(B) to illustrate the case where a projected capacitive touch sensor is applied. I will explain.

[0100] Furthermore, various sensors capable of detecting proximity or contact with objects such as fingers can be applied. It is possible.

[0101] The projected capacitive touch sensor 595 has electrodes 591 and 592. 91 is electrically connected to one of the multiple wires 598, and electrode 592 is connected to one of the multiple wires 598 Connect electrically to one of the others.

[0102] As shown in Figures 6(A) and (B), the electrode 592 consists of multiple quadrilaterals arranged repeatedly in one direction. It has a shape in which the sides are connected at the corners.

[0103] Electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which electrode 592 extends. It is being done.

[0104] The wiring 594 electrically connects the two electrodes 591 that sandwich electrode 592. A shape that minimizes the area of ​​the intersection between 592 and wiring 594 is preferable. This reduces the area of ​​regions where electrodes are not provided, thereby reducing unevenness in transmittance. This reduces brightness unevenness of light transmitted through the touch sensor 595.

[0105] Note that the shapes of electrodes 591 and 592 are not limited to these and can take on various shapes. For example Multiple electrodes 591 are arranged so that there are as few gaps as possible, and the electrodes 59 are separated by an insulating layer. Multiple units 2 may be provided spaced apart so that there is a region that does not overlap with electrode 591. At this time, a dummy electrode, electrically insulated from the two adjacent electrodes 592, is placed between them. Providing poles is preferable because it reduces the area of ​​regions with different transmittances.

[0106] The configuration of the touch sensor 595 will be explained using Figure 7.

[0107] The touch sensor 595 includes a substrate 590, electrodes 591 arranged in a staggered pattern on the substrate 590, and Electrode 592, electrode 591 and the insulating layer 593 covering electrode 592 and adjacent electrode 591 It is equipped with electrical wiring 594.

[0108] The resin layer 597 is positioned so that the touch sensor 595 overlaps the display unit 501, and the substrate 590 is positioned on the substrate It is attached to 570.

[0109] Electrodes 591 and 592 are formed using a light-transmitting conductive material. Examples of conductive materials include indium oxide, indium tin oxide, indium zinc oxide, Conductive oxides such as zinc oxide and zinc oxide with added gallium can be used. Alternatively, a film containing graphene can be used. The film containing graphene can be formed, for example, in a film-like structure. A film containing graphene oxide can be formed by reduction. Methods of reduction include: Methods such as applying heat can be cited.

[0110] After depositing a light-transmitting conductive material onto a substrate 590 by sputtering, a photo By using various patterning techniques such as lithography, unnecessary parts are removed, and electrode 591 And electrode 592 can be formed.

[0111] Furthermore, the materials used for the insulating layer 593 include, for example, acrylic resin, epoxy resin, etc. In addition to resins containing siloxane bonds such as resins and silicones, silicon oxide and silicon nitride are also included. Inorganic insulating materials such as condensate and aluminum oxide can also be used.

[0112] Furthermore, an opening reaching electrode 591 is provided in the insulating layer 593, and the wiring 594 is adjacent to electrode 5 91 is electrically connected. Translucent conductive material can increase the aperture ratio of the touch panel. Therefore, it can be suitably used in the wiring 594. Also, electrodes 591 and 592 Materials with higher conductivity can reduce electrical resistance and are therefore suitable for use in wiring 594. Cut.

[0113] One electrode 592 extends in one direction, and multiple electrodes 592 are arranged in a stripe pattern.

[0114] Wiring 594 is provided so as to intersect with electrode 592.

[0115] A pair of electrodes 591 are provided flanking one electrode 592, and the wiring 594 connects the pair of electrodes 591. They are electrically connected.

[0116] Furthermore, the multiple electrodes 591 do not necessarily need to be arranged in a direction perpendicular to one electrode 592. Alternatively, they may be arranged to form an angle of less than 90 degrees.

[0117] One wire 598 is electrically connected to electrode 591 or electrode 592. It functions as a terminal. Wiring 598 can be, for example, aluminum, gold, platinum, silver, Nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or paraben Metallic materials such as um, or alloy materials containing such metallic materials, can be used.

[0118] Furthermore, an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0119] Although not shown in Figure 7, the connecting layer 599 connects the wiring 598 and FPC 509(2) electrically. Connect to the target.

[0120] The connecting layer 599 can be any anisotropic conductive film (ACF: Anisotropic Conductive film, or anisotropic conductive paste (ACP: Anisotropic Conductive Film) You can use pic (Practical Conductive Paste), etc.

[0121] The resin layer 597 is translucent. For example, a thermosetting resin or an ultraviolet curing resin can be used. Specifically, this can be done using acrylic resin, polyurethane, epoxy resin, or silicone. Any resin containing siloxane bonds can be used.

[0122] <Display section> The display unit 501 comprises multiple pixels arranged in a matrix. The pixels are display elements and display It is equipped with a pixel circuit that drives the elements.

[0123] In this embodiment, an organic electroluminescent element that emits white light is used as the display element. The following explains the cases in which this can be applied, but the display elements are not limited to these.

[0124] For example, organic electroluminescent materials with different emission colors may emit light in a way that the color of light emitted differs for each subpixel. A Nessence element may be applied to each sub-pixel.

[0125] In addition to organic electroluminescent elements, electrophoresis and electrowetting are also used. Display elements (also called electronic ink) that display information using methods such as the MEM (Memory Device) S-display elements, optical interference MEMS display elements, liquid crystal elements, and various other display elements are used as display elements. It can be used in transmissive liquid crystal displays, semi-transmissive liquid crystal displays, and It can also be applied to injection-type liquid crystal displays, direct-view liquid crystal displays, etc. When realizing a crystal display or a reflective liquid crystal display, a part of the pixel electrode, or The entire system should function as a reflective electrode. For example, a part of the pixel electrode, Alternatively, all of them could be made of aluminum, silver, etc. Furthermore, in that case... Furthermore, it is possible to install memory circuits such as SRAM beneath the reflective electrode. Furthermore, power consumption can be reduced. In addition, various configurations suitable for the display element to be applied can be used. It can be selected and used from the pixel circuits.

[0126] Furthermore, in the display unit, an active matrix system having active elements in the pixels, or a picture A passive matrix system that does not inherently contain active elements can be used.

[0127] In the active matrix system, the active elements (active elements, nonlinear elements) are, In addition to transistors, various active elements (active elements, nonlinear elements) are used. This is possible. For example, MIM (Metal Insulator Metal) or TF It is also possible to use elements such as D (Thin Film Diode). Because the manufacturing process is simplified, it is possible to reduce manufacturing costs or improve yield. Alternatively, these elements can improve the aperture ratio due to their small size. This allows for lower power consumption and higher brightness.

[0128] Other than the active matrix method, there are active elements (active elements, nonlinear elements). It is also possible to use a passive matrix type that does not use active elements. Because it does not use nonlinear elements, the manufacturing process is simpler, resulting in reduced manufacturing costs or lower yield. This can improve performance. Alternatively, by using active elements (active elements, nonlinear elements) Therefore, the aperture ratio can be improved, leading to lower power consumption or higher brightness. It is possible.

[0129] Flexible materials can be suitably used for substrates 510 and 570.

[0130] Materials with suppressed impurity permeation can be suitably used for substrates 510 and 570. For example, if the water vapor transmission rate is 10 -5 g / (m 2 (day) or less, preferably 10 -6 g / (m 2· Materials described below can be preferably used.

[0131] Materials with approximately equal linear expansion coefficients can be preferably used for the substrate 510 and the substrate 570. For example, materials with a linear expansion coefficient of 1×10 -3 / K or less, preferably 5×10 -5 / K or less, more preferably 1×10 -5 / K or less can be preferably used.

[0132] The substrate 510 is a laminate in which a flexible substrate 510b, a barrier film 510a that prevents diffusion of impurities into the light-emitting element, and a resin layer 510c that bonds the substrate 510b and the barrier film 510a are laminated. That is.

[0133] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate, acrylic resin, polyurethane, epoxy resin, or a resin having a siloxane bond such as silicone can be used for the resin layer 510c.

[0134] The substrate 570 is a laminate of a flexible substrate 570b, a barrier film 570a that prevents diffusion of impurities into the light-emitting element, and a resin layer 570c that bonds the substrate 570b and the barrier film 570a. That is.

[0135] The sealing material 560 bonds the substrate 570 and the substrate 510. The sealing material 560 has a refractive index larger than that of air. When extracting light from the sealing material 560 side, the sealing material 560 also serves as a layer having an optically bonding function. The pixel circuit and the light-emitting element (e.g., the first light-emitting element 550R) are located between the substrate 510 and the substrate 570. That is.

[0136] <Configuration of Pixel> Each pixel includes a sub-pixel 502R, which in turn includes a light-emitting module 580R.

[0137] The sub-pixel 502R supplies power to the first light-emitting element 550R and the first light-emitting element 550R. It includes a pixel circuit containing a transistor 502t that can perform the following: Also, a light-emitting module 580R comprises a first light-emitting element 550R and an optical element (e.g., a first colored layer 567R). El.

[0138] The first light-emitting element 550R has a lower electrode, an upper electrode, and a light-emitting element between the lower electrode and the upper electrode. It has a layer containing a compound.

[0139] The light-emitting module 580R has a first colored layer 567R in the direction from which light is extracted. It is sufficient if it transmits light of a specific wavelength, for example, red, green, or blue. A material that selectively transmits the emitted light can be used. A region that allows the light emitted by the optical element to pass through directly may be provided.

[0140] Furthermore, if the sealing material 560 is provided on the side from which light is extracted, the sealing material 560 is the first The optical element 550R is in contact with the first colored layer 567R.

[0141] The first colored layer 567R is located in a position that overlaps with the first light-emitting element 550R. A portion of the light emitted by the light-emitting element 550R passes through the first colored layer 567R, as shown by the arrow in the figure. The light is emitted to the outside of the light-emitting module 580R in the direction of the mark. Information processing apparatus according to one embodiment of the present invention It has the first film 102 in the direction of this arrow.

[0142] <Display Unit Configuration> The display unit 501 has a light-shielding layer 567BM in the direction of light emission. The light-shielding layer 567BM is provided so as to surround a colored layer (for example, the first colored layer 567R).

[0143] The display unit 501 includes an antireflection layer 567p at a position overlapping the pixel. The antireflection layer 567p can be, for example, a circular polarizing plate.

[0144] The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t and is. Note that the insulating film 521 can be used as a layer for flattening the unevenness caused by the pixel circuit. In addition, a laminated film including a layer that can suppress the diffusion of impurities can be applied to the insulating film 521. Thereby, a decrease in the reliability of the transistor 502t or the like due to the diffusion of impurities can be suppressed.

[0145] The display unit 501 has a light-emitting element (for example, the first light-emitting element 550R) on the insulating film 521. .

[0146] The display unit 501 has a partition wall 528 overlapping the end of the lower electrode on the insulating film 521. Also, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528.

[0147] <Configuration of scanning line drive circuit> The scanning line drive circuit 503g(1) includes a transistor 503t and a capacitor 503c. And the drive circuit can be formed on the same substrate in the same process as the pixel circuit.

[0148] <Other configurations> The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is provided on the wiring 51 1. Note that an F capable of supplying signals such as an image signal and a synchronization signal PC509(1) is electrically connected to terminal 519.

[0149] Note that a printed circuit board (PWB) may be attached to FPC509(1). .

[0150] The display unit 501 has wiring such as scan lines, signal lines, and power lines. Various conductive films are used for the wiring. It is possible to be there.

[0151] Specifically, aluminum, chromium, copper, tantalum, titanium, molybdenum, tungsten , a metallic element selected from nickel, yttrium, zirconium, silver or manganese, Use an alloy containing the aforementioned metal elements or an alloy combining the aforementioned metal elements. It is possible. In particular, aluminum, chromium, copper, tantalum, titanium, molybdenum, t Preferably, it contains one or more elements selected from among ngsten. In particular, a compound of copper and manganese. Gold is suitable for microfabrication using the wet etching method.

[0152] Specifically, a two-layer structure in which a titanium film is laminated on an aluminum film, and titanium on a titanium nitride film. Two-layer structure with stacked films, two-layer structure with a tungsten film stacked on top of a titanium nitride film, tungsten nitride A two-layer structure consisting of a tungsten film laminated on a tungsten film or tungsten nitride film, and a titanium film, A three-layer structure is formed by laminating an aluminum film on top of the titanium film, and then forming another titanium film on top of that. The following can be used.

[0153] Specifically, titanium, tantalum, tungsten, molybdenum, and chromium are layered on an aluminum film. An alloy film combining one or more selected from neodymium, scandium, or nitrogen A laminated structure in which multiple coatings are stacked can be used.

[0154] Furthermore, even when using a light-transmitting conductive material containing indium oxide, tin oxide, or zinc oxide... good.

[0155] <Example of display unit modification 1> Various transistors can be applied to the display unit 501.

[0156] The configuration when a bottom-gate type transistor is applied to the display unit 501 is shown in Figure 7(A) and This is illustrated in Figure 7(B).

[0157] For example, a semiconductor layer containing oxide semiconductors, amorphous silicon, etc., is shown in Figure 7(A). This can be applied to transistors 502t and 503t.

[0158] For example, at least indium (In), zinc (Zn), and M(Al, Ga, Ge, Y, It is represented as an In-M-Zn oxide containing metals such as Zr, Sn, La, Ce, or Hf. It is preferable that the film is included. Alternatively, it is preferable that both In and Zn are included.

[0159] Stabilizers include gallium (Ga), tin (Sn), hafnium (Hf), and aluminum. Examples include aluminum (Al) or zirconium (Zr). Also, other stabilizers... These are lanthanides: lanthanum (La), cerium (Ce), and praseodymium (P). r), neodymium (Nd), samarium (Sm), europium (Eu), gadolinium ( Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium Examples include rhodium (Er), thulium (Tm), ytterbium (Yb), and lutetium (Lu). .

[0160] As the oxide semiconductor constituting the oxide semiconductor film, for example, In-Ga-Zn-based oxide, I n-Al-Zn-based oxide, In-Sn-Zn-based oxide, In-Hf-Zn-based oxide, In -La-Zn-based oxide, In-Ce-Zn-based oxide, In-Pr-Zn-based oxide, In- Nd-Zn-based oxide, In-Sm-Zn-based oxide, In-Eu-Zn-based oxide, In-G d-Zn-based oxide, In-Tb-Zn-based oxide, In-Dy-Zn-based oxide, In-Ho -Zn-based oxide, In-Er-Zn-based oxide, In-Tm-Zn-based oxide, In-Yb- Zn-based oxide, In-Lu-Zn-based oxide, In-Sn-Ga-Zn-based oxide, In-H f-Ga-Zn-based oxide, In-Al-Ga-Zn-based oxide, In-Sn-Al-Zn-based oxide, In-Sn-Hf-Zn-based oxide, In-Hf-Al-Zn-based oxide, In-G a-based oxide can be used.

[0161] Here, the In-Ga-Zn-based oxide means an oxide having In, Ga, and Zn as main components, and the ratio of In, Ga, and Zn is not limited. Also, other metal elements may be contained in addition to In, Ga, and Zn.

[0162] For example, a semiconductor layer containing polycrystalline silicon crystallized by treatment such as laser annealing can be applied to the transistors 502t and 503t illustrated in FIG. 7(B).

[0163] The configuration when applying a top-gate type transistor to the display unit 501 is illustrated in FIG. 7(C).

[0164] For example, a single crystal silicon film or the like transferred from a polycrystalline silicon or single crystal silicon substrate or the like The semiconductor layer containing the transistor 502t and transistor 50 shown in Figure 7(C) It can be applied to 3t vehicles.

[0165] This embodiment can be appropriately combined with other embodiments shown herein. .

[0166] (Embodiment 4) In this embodiment, a foldable information processing device that can be applied to an information processing device according to one aspect of the present invention is available. The configuration of the touch panel will be explained with reference to Figure 8.

[0167] Figure 8 is a cross-sectional view of the touch panel 500B.

[0168] The touch panel 500B described in this embodiment uses transistors to process the supplied image information. The display unit 501 is provided on the side where it is located, and the touch sensor is on the substrate of the display unit. The fact that it is located on the 510 side is different from the touch panel 500 described in Embodiment 3. Here, we will explain different configurations in detail, and where similar configurations can be used, The above explanation will be used as a reference.

[0169] <Display section> The display unit 501 comprises multiple pixels arranged in a matrix. The pixels are display elements and display It is equipped with a pixel circuit that drives the elements.

[0170] <Pixel configuration> Each pixel includes a sub-pixel 502R, which in turn includes a light-emitting module 580R.

[0171] The sub-pixel 502R supplies power to the first light-emitting element 550R and the first light-emitting element 550R. It includes a pixel circuit containing transistor 502t, which can perform the following actions.

[0172] The light-emitting module 580R consists of a first light-emitting element 550R and an optical element (e.g., a first colored layer). It is equipped with 567R.

[0173] The first light-emitting element 550R has a lower electrode, an upper electrode, and a light-emitting element between the lower electrode and the upper electrode. It has a layer containing a compound.

[0174] The light-emitting module 580R has a first colored layer 567R in the direction from which light is extracted. It is sufficient if it transmits light of a specific wavelength, for example, red, green, or blue. A material that selectively transmits the emitted light can be used. A region that allows the light emitted by the optical element to pass through directly may be provided.

[0175] The first colored layer 567R is located in a position that overlaps with the first light-emitting element 550R. Also, see Figure 8(A) The first light-emitting element 550R shown emits light towards the side where the transistor 502t is located. This allows some of the light emitted by the first light-emitting element 550R to reach the first colored layer 567R. The light is transmitted and emitted to the outside of the light-emitting module 580R in the direction of the arrow shown in the figure. One embodiment of the information processing device has a first film 102 in the direction of this arrow.

[0176] <Display Unit Configuration> The display unit 501 has a light-shielding layer 567BM in the direction from which light is emitted. The light-shielding layer 567BM is It is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0177] The display unit 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. It is used. Furthermore, the insulating film 521 is used as a layer to flatten the irregularities caused by the pixel circuit. This is possible. Furthermore, a laminated film containing a layer that can suppress the diffusion of impurities can be applied to the insulating film 521. This can be achieved, for example, by impurities diffusing from the first colored layer 567R. This can suppress the decrease in reliability of transistors such as the 502t.

[0178] <Touch sensor> The touch sensor 595 is located on the circuit board 510 side of the display unit 501 (see Figure 8(A)). ).

[0179] The resin layer 597 is located between the substrate 510 and the substrate 590, and connects the display unit 501 and the touch sensor 59 Glue together 5.

[0180] <Example of display unit modification 1> Various transistors can be applied to the display unit 501.

[0181] The configuration when a bottom-gate type transistor is applied to the display unit 501 is shown in Figure 8(A) and This is illustrated in Figure 8(B).

[0182] For example, a semiconductor layer containing oxide semiconductors, amorphous silicon, etc., is shown in Figure 8(A). This can be applied to transistors 502t and 503t. Even if the pair of gate electrodes are positioned so as to sandwich the region where the transistor channel is formed from above and below, Good. This helps to suppress variations in transistor characteristics and improve reliability.

[0183] For example, a semiconductor layer containing polycrystalline silicon, etc., is used in the transistor 502 shown in Figure 8(B). It can be applied to transistor t and transistor 503t.

[0184] Figure 8(C) shows the configuration when a top-gate type transistor is applied to the display unit 501. To show.

[0185] For example, a semiconductor layer including polycrystalline silicon or a transferred single-crystal silicon film, etc., is shown in Figure 8. This can be applied to transistors 502t and 503t shown in C). ru.

[0186] This embodiment can be appropriately combined with other embodiments shown herein. .

[0187] (Embodiment 5) In this embodiment, the rotational direction of the housing, as described in other embodiments, will be explained.

[0188] The panel substrate in one aspect of the present invention is preferably a touch panel. The display portion of the touch panel. It is equipped with a touch sensor and the first fill is activated by a thin object such as a pen or pencil, or by a finger. By touching the mu 102, the touch position is detected. That is, the panel substrate 101 is the first It is protected by film 102.

[0189] When the thin tip of the member touches the first film 102, the first film 102 is destroyed. To prevent this, the hardness of the first film 102 is required. The hardness of 02 can be evaluated by a pencil hardness test. The hardness of the first film 102 is To improve this, the first film 102 must have sufficient thickness and sufficient hardness. It is preferable that it be formed from a material.

[0190] The panel substrate 101 may have cracks, wiring, and insulating films due to contact with the tip of a thin component. Multiple weak points 600A exist, such as at the interface. Also, the first film 102 has a thin tip. There are multiple weak points 600B that arise due to contact between components, etc.

[0191] The panel substrate 101 consists of a flexible substrate 601, a flexible substrate 602, and element formation between them. It has a region 603. The element formation region 603 has wiring and inorganic insulating films made of metal layers. These are formed, and their interfaces exist. These interfaces, steps, grain boundaries, etc. are weak areas 600A This is likely to happen. Therefore, vulnerable areas 600A are abundant in the element formation region 603. Element shape When the fragile portion 600A of the formed region 603 breaks, the elements included in the element formation region 603 (for example) However, transistors, capacitive elements, wiring, etc. may be damaged.

[0192] For example, within the range of motion of the enclosure, with the circuit board 602 facing inward, the bending moment 604 is... Bend the substrate 101 so that a curve is formed (see Figure 12(A)).

[0193] When the panel substrate 101 is bent by a bending moment 604, the bending moment 604 In response, tensile stress is generated in the substrate 601 on the convexly bent side of the panel substrate 101. Furthermore, compressive stress is generated in the substrate 602 on the side that is bent into a concave shape. Near the center of 101, there is a surface where neither tensile nor compressive stress occurs; this is called the neutral surface 605. cormorant.

[0194] The magnitude of the stress is 0 at the neutral surface 605 of the panel substrate 101, and the tensile stress is 1 The compressive stress increases linearly toward the surface of substrate 601, and the compressive stress is at the base of panel substrate 101. It increases linearly toward the surface of the board 602. Note that each is on the surface of the panel substrate 101. The stress on the surface of the panel substrate 101 is maximized at the surface of the panel substrate 101. This is called bending stress.

[0195] When tensile stress is applied to the weak point 600A, a crack will start from the weak point 600A, and the weak point 600A becomes the starting point of fracture. On the other hand, when compressive stress is applied to the weak point 6 Because 00A is crushed, it is unlikely to become the starting point for fracture.

[0196] Since the element formation region 603 has thickness, the element formation region 603 is formed only on the neutral plane 605. It is not possible to do so, but if formed near the neutral plane 605, it will occur in the element formation region 603. Bending stress can be reduced. Also, the stress applied to the element formation region 603 is 0 or It is desirable that the direction is compression. That is, the panel substrate has the element formation region 603 in the neutral plane. A configuration with 605 on the inside is preferable. This allows the panel substrate 101 to be bent inward. However, cracks are less likely to occur in the film formed in the element formation region 603.

[0197] The information processing apparatus of the present invention comprises a first film 102 (see Figure 12(B)). The film 102 is not fixed to the panel substrate 101. Also, the first film 10 The panel substrate 101 is bent so that 2 is on the concave side. This causes the front of the touch panel The display can be protected. Alternatively, for example, the panel base from the side of the first film 102. When an external force 606 is applied to the plate 101, the neutral surface 605 on the panel substrate 101 is It moves towards the first film 102, but by reducing the external force 606, the element formation region The tensile stress applied to 603 can be suppressed. Alternatively, in the element formation region 603 This can prevent breakage and cracking.

[0198] Alternatively, the first film 102 is flexible and has a surface other than the surface in contact with the panel substrate 101. It is equipped with a hard coat layer. This allows for the thin tip of a pen or pencil to be removed from the panel base. The board 101 can be protected. Alternatively, the panel base can be made so that the hard coat layer is on the inside. Even when the plate 101 is bent, the stress on the hard coat layer is always zero or in the compressive direction. It is possible.

[0199] The information processing apparatus of the present invention comprises a first housing, a second housing, a panel substrate 101, and a first F The first housing is rotatably connected to the second housing, and the first FI The sheet 102 has a surface that contacts the panel substrate 101, and this surface is bent so that it is convex. In this state, the panel substrate 101 has an element formation region 603 from the neutral plane, and the first film 102 It is provided on the side. In addition, the first film 102 has a hard coat layer on the panel substrate 101 side. ru.

[0200] Furthermore, in one embodiment of the present invention, the information processing apparatus has a first housing that moves within a predetermined range of motion around a rotation axis. It is rotatably connected to the second housing, and a predetermined range of motion is the panel of the first film 102. The rotation is restricted so that the surface on the substrate 101 side becomes flat or convex. When the housing is rotated around the axis of rotation, the element formation region 603 or the hard coat layer This can prevent the generation of tensile stress, or prevent the destruction of the element formation region 603. This can be done. Or, it can prevent the hard court layer from being damaged.

[0201] The first film 102 uses a material that is flexible and transparent to visible light. This is possible. For example, polyethylene terephthalate (PET), polyethylene naphthalate Polyester resins such as PEN, polyacrylonitrile resin, polyimide resin, Methyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (P ES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamide Examples include ion resin, polyvinyl chloride resin, and polytetrafluoroethylene (PTFE) resin. It is preferable to use a material with a low coefficient of thermal expansion, for example, a material with a coefficient of thermal expansion of 3 0 x 10 -6 Polyamide-imide resins, polyimide resins, PET, etc. with a K of / K or less are preferred. It can be used. In addition, a substrate made of glass fiber impregnated with organic resin, or an inorganic filler can be used. It is also possible to use substrates in which the thermal expansion coefficient has been reduced by mixing with a resin. Because the circuit board is lightweight, the display panel using this circuit board can also be made lightweight.

[0202] A thermosetting resin or the like can be used as the material for the hard coat layer of the first film 102. Yes, it is possible. For example, epoxy resin, phenolic resin, unsaturated polyester resin, urea resin Melamine resin, diallyl phthalate resin, silicon resin, vinyl ester resin, polyimi Materials such as polyurethane can be used. These materials are hard and resistant to heat and solvents. It is effective from the viewpoint of surface protection. As the material for the hard coat layer of the first film 102, For example, it is preferable to use urethane acrylate.

[0203] Furthermore, the hard coat layer of the first film 102 may contain silica particles, alumina particles, etc. It is preferable that the first film 102 contains alumina It is preferable that it is coated with a first film 102 made of multiple different materials. A layered structure is also acceptable. For example, a 75 μm thick PE layer on top of a 27 μm thick hard coat layer. A film with a structure in which T films are layered can be used.

[0204] Furthermore, the surface of the first film 102 generates an appropriate amount of frictional force against the finger or other object that comes into contact with it. It is preferable that the first film 102 has been processed to create a certain degree of unevenness. (Textures) may be provided.

[0205] When moving a finger that is in contact with the first film 102, the finger and the first film 102 If the friction is too great, the fingertips can become deformed. This can hinder the delicate movements of the fingertips. Input becomes difficult. Materials that cause excessive friction include those with sufficiently polished surfaces. One example is a flat piece of glass. On the other hand, the friction between the finger and the first film 102 is small. If this happens, the sense of touch on the surface of the fingers is lost.

[0206] As a means of generating appropriate friction on the surface of the first film 102, silica particles and the like are used. The film arranged on the surface can be used as the first film 102. The friction between the finger and the first film 102 can be adjusted to an appropriate level.

[0207] This embodiment can be appropriately combined with other embodiments shown herein. .

[0208] (Embodiment 6) In this embodiment, the present invention can be applied to information processing devices, electronic devices, and the like according to one aspect of the present invention. A method for manufacturing a bendable device will be explained with reference to Figures 9 to 11. Examples of foldable devices include display devices, light-emitting devices, and input devices. Examples of input devices include touch sensors and touch panels. Examples of light-emitting devices. Examples include organic EL panels and lighting devices. Examples include L-panels and liquid crystal displays. Furthermore, touch input is available inside the display and light-emitting devices. In some cases, input devices such as sensors may be included. For example, display devices or light-emitting devices. A touch sensor is located on the opposing substrate (for example, a substrate without a transistor) that the sensor has It may be provided. Or, the element substrate of the display device or light-emitting device (for example, A touch sensor may be provided on the circuit board on which the transistor is located. This involves a counter substrate of the display device or light-emitting device and an element substrate of the display device or light-emitting device. A touch sensor may be provided.

[0209] First, a release layer 703 is formed on the fabricated substrate 701, and a layer to be released 705 is formed on the release layer 703. This is achieved (Figure 9(A)). Furthermore, a release layer 723 is formed on the fabricated substrate 721, and the release layer 723 A peelable layer 725 is formed on top (Figure 9(B)).

[0210] For example, when a tungsten film is used as the release layer, N2O and other substances are added to the tungsten film. Plasma treatment using an oxygen-containing gas, or annealing in an oxygen-containing gas atmosphere. This involves forming a tungsten oxide film in an oxygen-containing gas atmosphere using methods such as sputtering. Using oxidation methods such as the above, a tungsten oxide film is formed between the tungsten film and the layer to be stripped. It is possible.

[0211] At the time of the peeling and transposition process, the tungsten oxide film has a composition of tungsten oxide. It is preferable to include a large amount of compositions in which the ratio of oxygen to tungsten is less than 3. For Sten, when n is a natural number greater than or equal to 1, W n O(3n-1) ,W n O (3n-2) In the case of this homologous series, a crystal optical shear surface exists, and shear occurs when overheated. It becomes cheaper. By performing N2O plasma treatment and forming a tungsten oxide film, The peelable layer can be removed from the substrate by force.

[0212] Alternatively, a tungsten oxide film can be formed directly without forming a tungsten film. For example, a sufficiently thin tungsten film can be subjected to plasma treatment using an oxygen-containing gas. For example, performing annealing in an oxygen-containing gas atmosphere, or in an oxygen-containing gas atmosphere By forming a tungsten oxide film using methods such as sputtering, only the tungsten oxide film can be removed. It may also form as an abscission layer.

[0213] At this time, the interface between the tungsten film and the tungsten oxide film or the interior of the tungsten oxide film By separating them, a tungsten oxide film may remain on the stripped layer side. Then, acid The presence of residual tungsten oxide film can negatively affect the characteristics of the transistor. Therefore, after the separation step of the peeled layer and the layer to be peeled, a step to remove the tungsten oxide film is performed. It is preferable to have it. Note that the above-described method of peeling from the substrate does not necessarily require N2O plasma. Since no processing is required, the step of removing the tungsten oxide film can also be reduced. Therefore, in this case, the device can be manufactured more easily.

[0214] Furthermore, in one aspect of the present invention, tungsten with a thickness of 0.1 nm or more and less than 200 nm is placed on a substrate. A membrane is used.

[0215] The delamination layer contains, in addition to the tungsten film, molybdenum, titanium, vanadium, tantalum, and cinnabar. Films containing ricon, aluminum, or alloys thereof may be used. Furthermore, these films may be used in combination with... A laminated structure with the oxide film may also be used. The release layer is not limited to an inorganic film, but may also be polyimide, etc. Organic films may also be used.

[0216] When using an organic resin for the release layer, if you want to use low-temperature polysilicon as the semiconductor layer... Therefore, the process must be carried out at temperatures below 350°C. Hydrogen baking, hydrogenation for defect termination in silicon, activation of doped regions, etc. This cannot be done sufficiently, and performance is limited. On the other hand, when using an inorganic film, The film temperature is not limited to 350°C, allowing for the development of superior properties.

[0217] When an organic resin is used in the release layer, laser irradiation during crystallization can damage the organic resin and functional elements. Although some images may appear, this problem does not occur when an inorganic film is used as the release layer. This is preferable because it does not occur.

[0218] Furthermore, if an organic resin is used in the release layer, the organic resin will be removed by laser irradiation for resin release. Because it shrinks, it can cause poor contact at the terminals of FPCs, etc. It is difficult to peel and transpose functional elements with a large number of terminals, such as high-resolution displays, with a high yield. There are cases where this is not possible. However, when an inorganic film is used as the release layer, there are no such limitations, and high-definition displays can be produced. Even for functional elements with a large number of terminals, such as sprays, it is possible to peel and transfer them with a high yield. be.

[0219] In one embodiment of the present invention, a method for removing a functional element from a substrate involves applying an insulating layer or a transistor to the fabricated substrate. The layer can be formed at temperatures below 600°C. In this case, high-temperature polysilicon is used for the semiconductor layer. It is possible. In this case, using the conventional high-temperature polysilicon line, the device operation It is possible to mass-produce semiconductor devices that are fast, have high gas barrier properties, and are highly reliable. In this case, an insulating layer and transistor formed by a process at 600°C or below are used. Then, a highly gas-barrier insulating layer is formed above and below the organic EL element under film deposition conditions of 600°C or less. This allows for the placement of impurities such as water into the organic EL element or semiconductor layer. This suppresses the process and, compared to cases where organic resins are used in the release layer, it offers significantly higher reliability. This makes it possible to realize a light-emitting device.

[0220] Alternatively, insulating layers and transistors can be formed on the fabricated substrate at temperatures below 500°C. In this case, low-temperature polysilicon or oxide semiconductors can be used as semiconductor layers, unlike conventional low-temperature polysilicon Mass production is possible using the Risilicon production line. In this case as well, the process is below 500°C. By using an insulating layer and transistor formed with the above and below the organic EL element, temperatures of 500°C or less can be maintained. A highly gas-barrier insulating layer formed under the following film deposition conditions can be placed. This suppresses the incorporation of impurities such as moisture into the organic EL element and semiconductor layer, and the release layer contains organic resin. Compared to methods using other techniques, this method enables the creation of a highly reliable light-emitting device.

[0221] Alternatively, it is possible to form insulating layers or transistors on the fabricated substrate at temperatures below 400°C. In this case, amorphous silicon or oxide grain semiconductors can be used as semiconductor layers, unlike conventional methods. Mass production is possible using the amorphous silicon production line. In this case as well, 400°C By using an insulating layer and transistor formed by the following process, on top of an organic EL element, A highly gas-barrier insulating layer formed under film deposition conditions of 400°C or less can be placed underneath. This suppresses the incorporation of impurities such as moisture into the organic EL element and semiconductor layer, and prevents peeling. Compared to cases where organic resins are used in the abscission layer, a highly reliable light-emitting device can be realized. Cut.

[0222] Next, the fabricated substrate 701 and the fabricated substrate 721 are placed so that the surfaces on which the peel-off layers are formed face each other. To that end, the bonding layers 707 and the frame-shaped bonding layer 711 are used to bond the layers together, and The frame-shaped bonding layer 711 is cured (Figure 9(C)). Here, the frame-shaped bonding layer 711 is formed on the peel-off layer 725. After providing the bonding layer 711 and the bonding layer 707 inside the frame-shaped bonding layer 711, the manufactured substrate 7 Place 01 and the fabricated substrate 721 opposite each other and bond them together.

[0223] Furthermore, it is preferable to perform the bonding of the fabricated substrate 701 and the fabricated substrate 721 under reduced pressure. stomach.

[0224] Note that Figure 9(C) shows the case where the size of the peeling layer 723 is different from that of the peeling layer 703. Alternatively, as shown in Figure 9(D), peel layers of the same size may be used.

[0225] The bonding layer 707 overlaps with the release layer 703, the layer to be released 705, the layer to be released 725, and the release layer 723. Arrange them so that they are in place. The end of the bonding layer 707 is the same as the release layer 703 or the release layer 723. It is preferable that it be located at least one end (the one you want to peel off from the substrate first) inward. This prevents the fabricated substrate 701 and the fabricated substrate 721 from adhering too tightly to each other, and prevents the subsequent This can suppress a decrease in the yield of the peeling process.

[0226] Next, the first peeling point 741 from the substrate is formed by irradiation with laser light (Figure 10( A), (B).

[0227] The fabricated substrate 701 and the fabricated substrate 721 may be peeled off from either side. The size of the peeling layer is different. In this case, the large release layer may be formed on the substrate, or the small release layer may be formed on the substrate. It may be peeled off from the board. Semiconductor elements, light-emitting elements, display elements, etc., are placed on only one of the substrates. When fabricated, the element may be peeled off from the substrate on the side where it was formed, or peeled off from the other substrate. This is also acceptable. Here, we show an example in which the fabricated substrate 701 is peeled off first.

[0228] The laser beam hits the hardened bonding layer 707 or the hardened frame-shaped bonding layer 711 and the peelable layer 7 The region where 05 and the release layer 703 overlap is irradiated. Here, the bonding layer 707 hardens. The following is an example of a state where the frame-shaped bonding layer 711 is not in a hardened state, and the bonded layer 7 in a hardened state. Laser light is shone onto point 07 (see arrow P3 in Figure 10(A)).

[0229] By removing a portion of the peeled layer 705, a first peeling starting point 741 from the substrate can be formed. (See the area enclosed by the dotted line in Figure 10(B)). At this time, not only the peeled layer 705, but also Other layers of the release layer 705, or parts of the release layer 703 and bonding layer 707 may be removed.

[0230] It is preferable to irradiate the substrate with the peeling layer to be peeled off from the substrate side. When irradiating the region where 703 and the peeling layer 723 overlap with laser light, the peeling layer 705 and By introducing cracks only in the peelable layer 705 of the peelable layer 725, a selectively fabricated substrate can be created. 701 and the release layer 703 can be peeled off (see the area enclosed by the dotted line in Figure 10(B)). ).

[0231] When irradiating the region where the peeling layer 703 and the peeling layer 723 overlap with laser light, the peeling layer 703 side A starting point for peeling from the substrate is formed on both the peeled layer 705 and the peeled layer 725 on the peeling layer 723 side. If this happens, it may become difficult to selectively peel off one of the fabricated substrates. Therefore, the laser irradiation conditions are restricted so that cracks can be created only in one of the peeled layers. In some cases, the method for forming the first peeling starting point 741 from the substrate is limited to irradiation with laser light. It may not be formed by cutting, but rather by using a sharp blade such as a cutter.

[0232] Then, from the first peeling starting point 741 from the formed substrate, the peeled layer 705 and the fabricated substrate 7 01 is separated (Figure 10(C), (D)). This allows the peelable layer 705 to be fabricated on the substrate 7 01 can be transferred to the fabricated substrate 721.

[0233] The peelable layer 705 separated from the fabricated substrate 701 in the process shown in Figure 10(D), and the substrate 731 and The materials are bonded together using the bonding layer 733, and the bonding layer 733 is cured (Figure 11(A)).

[0234] Next, a sharp cutting tool such as a cutter is used to form a second peeling point 743 from the substrate. (Figure 11(B), (C)). The method for forming the second peeling starting point 743 from the substrate is a cutter. It is not limited to any sharp blade, and may also be formed by laser light irradiation or other means.

[0235] If the substrate 731 on the side where the release layer 723 is not provided can be cut with a blade or the like, the substrate 731 Incisions may be made in the bonding layer 733 and the peel-off layer 725 (arrow P in Figure 11(B)). (See 5). This removes a portion of the peeled layer 725 and creates a starting point for the second peel from the substrate 7 43 can be formed (see the area enclosed by the dotted line in Figure 11(C)).

[0236] As shown in Figures 11(B) and (C), the fabricated substrate 721 and substrate 731 overlap the release layer 723. If the bonded area is bonded by the bonding layer 733, the fabricated substrate 721 and the substrate The high adhesion of the 731 side reduces the yield in the subsequent peeling process from the substrate. Therefore, a frame-shaped cut is made in the region where the hardened bonding layer 733 and the release layer 723 overlap. It is preferable to make an indentation and form a second peeling starting point 743 from the substrate in the shape of a solid line. This makes it possible to improve the yield in the peeling process from the substrate.

[0237] Then, from the second peeling starting point 743 from the formed substrate, the peeled layer 725 and the fabricated substrate 7 21 is separated (Figure 11(D)). This separates the peelable layer 725 from the fabricated substrate 721. It can be transferred to substrate 731.

[0238] For example, an inorganic film such as a tungsten film that is firmly anchored with N2O plasma, etc. When forming a tungsten oxide film, it is possible to achieve relatively high adhesion during film formation. Subsequently, once a point of delamination is formed, cleavage occurs from that point, easily separating the layer to be delaminated. It becomes possible to transfer the substrate from the fabricated substrate to the new substrate.

[0239] Furthermore, a liquid such as water is permeated into the interface between the release layer 723 and the layer to be released 725 to produce the substrate 72 1 and the peeled layer 725 may be separated. Due to capillary action, the liquid separates from the peeled layer 723. By seeping between layers 725, the static electricity generated during delamination from the substrate is absorbed into the delamination layer 725. It can adversely affect functional elements such as FETs (semiconductor elements can be destroyed by static electricity). It can suppress (such as).

[0240] Furthermore, when applying a physical force to a MOW bond (where M is any element) to break the bond... As the liquid seeps into the gap, the M-OH and HO-W bonds are formed. Because the distance between them increases, separation can be promoted.

[0241] The liquid may also be sprayed in the form of a mist or vapor. Examples of liquids include pure water and organic solvents. It can be used in neutral, alkaline, or acidic aqueous solutions, or in aqueous solutions containing dissolved salts. Liquids or other substances may also be used.

[0242] Furthermore, the temperature of the liquid and substrate during mechanical delamination is preferably between room temperature and 120°C. It is best to keep the temperature between 60°C and 90°C.

[0243] In the method for peeling from a substrate according to one aspect of the present invention described above, a sharp blade or the like is used to peel from the substrate. A second delamination starting point 743 is formed, and the delamination layer and the layer to be delaminated are made easier to separate. The fabricated substrate is peeled off. This improves the yield of the peeling process from the substrate. can.

[0244] Furthermore, after bonding together a pair of fabricated substrates, each having a peelable layer formed on it, Each fabricated substrate can be peeled off, and the substrates that make up the device to be fabricated can be bonded together. Therefore, when bonding the peel-off layers, bond together fabricated substrates with low flexibility. This allows for a higher alignment accuracy of the bonded substrates compared to when flexible substrates are bonded together. It can be improved.

[0245] A method for peeling from a substrate according to one aspect of the present invention involves heating the layer to be peeled, which is provided on top of the oxide layer. A first layer and a second layer are provided that release hydrogen. Furthermore, the peeling is performed by heat treatment. Hydrogen released from the abscission layer reduces WO3 in the oxide layer, resulting in an acid rich in WO2. A fused layer can be formed. As a result, the peelability from the substrate can be improved. .

[0246] This embodiment may be appropriately combined with other embodiments and examples described herein. It can be done.

[0247] (Embodiment 7) In this embodiment, the configuration of an electronic device according to one aspect of the present invention will be described with reference to Figure 13. I will reveal it.

[0248] <Electronic equipment> Figure 13 shows a foldable electronic device 920. (Figure 13 shows electronic device 920) It has a housing 921a, a housing 921b, a display unit 922, a hinge 923, etc. Unit 22 is incorporated into enclosures 921a and 921b.

[0249] Housings 921a and 921b are rotatably connected by hinges 923. (Electronic device) 920 is a closed state of housing 921a and housing 921b, and as shown in Figure 13, it is open. It can be transformed between its original state and its other state. This makes it highly portable when carrying it around and easy to use. When using it, the large display area provides excellent visibility.

[0250] Furthermore, the hinge 923 opens the housing 921a and the housing 921b, and these corners It is preferable to have a locking mechanism to prevent the angle from becoming greater than a predetermined angle. For example, the angle at which it locks (cannot be opened any further) is between 90 degrees and 180 degrees. It is preferable to do so, and typically, angles such as 90 degrees, 120 degrees, 135 degrees, 150 degrees, and 175 degrees are used. This can be done, thereby improving convenience, safety, and reliability.

[0251] Furthermore, the electronic device 920 spans across housings 921a and 921b, which are connected by a hinge 923. A flexible display unit 922 is provided.

[0252] Furthermore, when the housing 921a and housing 921b of the electronic device 920 are opened, the display unit 922 is It is held in a greatly curved shape. For example, the radius of curvature is between 1 mm and 50 mm. The display unit 922 is held in a state of being between 5 mm and 30 mm. Yes, it is possible. A portion of the display unit 922 has pixels that extend continuously from the housing 921a to the housing 921b. These elements are arranged to enable curved surface displays.

[0253] Because the hinge 923 has the locking mechanism described above, excessive force is not applied to the display unit 922. This prevents damage to the display unit 922. Therefore, it is highly reliable. It can be made possible to create electronic devices.

[0254] The display unit 922 functions as a touch panel and can be operated with a finger or stylus. can.

[0255] Either housing 921a or housing 921b is provided with a wireless communication module, and the interface - Internet, LAN (Local Area Network), Wi-Fi (Wireless Data is collected via computer networks such as ess Fidelity (registered trademark). It is possible to send and receive data. Also, either housing 921a or housing 921b is Keyboard, hardware buttons, pointing device, light sensor, imaging device, sound Voice input devices, eye-tracking input devices, and posture detection devices may be provided.

[0256] An electronic device according to one aspect of the present invention can be applied to various things by appropriately changing the size of the display unit 922. This is possible. An example of an electronic device is a portable information terminal, which is easy to carry around.

[0257] For example, the display unit 922 can display document information, and it can also be used as an e-book terminal. It is possible to have it. For example, the display unit can be configured as an A4 size folded in half, like a textbook. It can be used in this way. Furthermore, still images and moving images can be displayed on the display unit 922. ru.

[0258] This embodiment can be appropriately combined with other embodiments described herein, at least in part. They can be implemented together. [Explanation of Symbols]

[0259] 101 Panel substrate 102 film 103 film 104-1 Cabinet 104-1A Part 1 104-1B Part 2 104-2 Cabinet 104-2A Part 1 104-2B Part 2 105-1 Hinge 106 Circuit board 107 FPC 108-1 Slit 108-2 Slit 109 Sockets 110 End 111 End 116 Support part 117 Support part 300 Touch Panels 301 Display section 302 pixels 302B subpixels 302G sub-pixels 302R sub-pixel 302t transistor 303c capacity 303g(1) Scan line drive circuit 303g(2) Image Pixel Driving Circuit 303s(1) Image signal line driving circuit 303s(2) Imaging signal line drive circuit 303t transistor 308 image pixels 308p Photoelectric element 308t transistor 309 FPC 310 circuit board 310a Barrier film 310b board 310c resin layer 311 Wiring 319 terminals 321 Insulating film 328 Bulkhead 329 Spacer 350R light-emitting element 351R lower electrode 352 Upper electrode 353 layers 353a Light-emitting unit 353b Light-emitting unit 354 Middle Class 360 sealing material 367BM light shielding layer 367p anti-reflection layer 367R colored layer 370 Opposing substrate 370a Barrier film 370b base material 370c resin layer 380B Light-Emitting Module 380G Light-Emitting Module 380R Light-Emitting Module 400 Touch Panel 401(1) area 401(2) area 406 line segments 407 line segments 500 Touch Panels 500B Touch Panel 501 Display section 502R sub-pixel 502t transistor 503c capacity 503g scan line drive circuit 503t transistor 509 FPC 510 circuit board 510a Barrier film 510b circuit board 510c resin layer 511 Wiring 519 terminals 521 Insulating film 528 Bulkhead 550R luminescent element 560 Sealing material 567BM light shielding layer 567p anti-reflection layer 567R colored layer 570 circuit boards 570a Barrier film 570b circuit board 570c ​​resin layer 580R Light-Emitting Module 590 circuit boards 591 Electrode 592 Electrode 593 Insulating layer 594 Wiring 595 Touch Sensor 597 Resin layer 598 Wiring 599 Connectivity Layer 600A Vulnerable part 600B Weak part 601 circuit board 602 circuit board 603 Element formation region 604 Bending moment 605 Neutral plane 701 Fabricated substrate 703 Delamination layer 705 Peeling layer 707 Bonding layer 711 Frame-shaped bonding layer 721 Fabricated substrate 723 Exfoliation layer 725 Peeling layer 731 circuit board 733 Bonding layer 741 Starting point of the first detachment 743 Starting point of the second detachment 920 Electronic equipment 921a enclosure 921b enclosure 922 Display section 923 Hinge

Claims

1. Hinges and, The first enclosure and The second enclosure, Panel substrate and Having a first film, The first housing has a first portion, a second portion that overlaps with the peripheral portion of the first portion, and a first end portion located between the first portion and the second portion. The second housing has a third portion, a fourth portion that overlaps with the peripheral portion of the third portion, and a second end portion located between the third portion and the fourth portion. The first housing is provided with a first slit in the region enclosed by the first portion, the second portion, and the first end, The second housing is provided with a second slit in the region enclosed by the third portion, the fourth portion, and the second end, The aforementioned hinge is equipped with a pivot shaft, The first part is connected to the third part via the hinge, The panel substrate has a display area, The first film is positioned on the viewing side of the display area. The panel substrate and the first film are housed in the first slit and the second slit, The panel substrate and the first film are slidable along the second slit. The panel substrate is slidable with respect to the first film, and the information processing apparatus is provided with this panel substrate.

2. In claim 1, Furthermore, it has a second film, The panel substrate is an information processing device having a region located between the first film and the second film.

3. In claim 2, The first film is flexible, The panel substrate is flexible, The second film is a flexible information processing device.

4. In claim 3, The first film is fixed to a part of the first housing, An information processing device in which the first film, the second film, and the panel substrate are slidable along the second slit by rotating the second housing relative to the first housing about the rotation axis.

Images