Electromagnetic wave irradiation device and electromagnetic wave irradiation method

Abstract

To provide an electromagnetic wave irradiation device and an electromagnetic wave irradiation method, capable of preventing the formation of a solubilized part and a non-solubilized part in an irradiation object.SOLUTION: An electromagnetic wave irradiation device EA includes: spraying means 10 for spraying gas NG to an irradiation object AS; and irradiation means 20 for irradiating the irradiation object AS with an electromagnetic wave EW, the irradiation object being sprayed with the gas NG. The electromagnetic wave irradiation device also includes solubilization means 30 for solubilizing a gas spray area where the gas NG is sprayed in the irradiation object AS, before the spray means 10 sprays the gas NG to the irradiation object AS.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electromagnetic wave irradiation device and an electromagnetic wave irradiation method.

Background Art

[0002] An electromagnetic wave irradiation device that irradiates an object to be irradiated with electromagnetic waves is known (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the ultraviolet irradiation device (electromagnetic wave irradiation device) described in Patent Document 1, while blowing an inert gas G (gas) from a gas diffusion hole 17a onto an adhesive sheet through a semiconductor wafer A attached to the adhesive tape B (adhesive sheet), the adhesive sheet is irradiated with ultraviolet rays (electromagnetic waves). Therefore, in the gas blowing region where the gas is blown onto the object to be irradiated, the temperature of the object to be irradiated decreases and melting does not occur, and in other regions, melting occurs due to the irradiated electromagnetic waves. As a result, there is a disadvantage that a melted part and an unmelted part occur in the object to be irradiated.

[0005] An object of the present invention is to provide an electromagnetic wave irradiation device and an electromagnetic wave irradiation method capable of preventing the occurrence of a melted part and an unmelted part in an object to be irradiated.

Means for Solving the Problems

[0006] The present invention employs the configuration described in the claims.

Effects of the Invention

[0007] According to the present invention, since the gas-blow area of ​​the object to be irradiated is dissolved before the gas is blown onto the object to be irradiated, it is possible to prevent the formation of dissolved and undissolved areas on the object to be irradiated. Furthermore, if the dissolution means is also used as the irradiation means, there is no need to provide a separate dissolution means in addition to the irradiation means, thus preventing the device from becoming larger. [Brief explanation of the drawing]

[0008] [Figure 1] An explanatory diagram of an electromagnetic wave irradiation device according to one embodiment of the present invention. [Modes for carrying out the invention]

[0009] One embodiment of the present invention will be described below with reference to the drawings. In this embodiment, the X, Y, and Z axes are orthogonal to each other. The X and Y axes are axes within a predetermined plane, and the Z axis is an axis perpendicular to the predetermined plane. Furthermore, in this embodiment, when directions are indicated based on a view from the front direction of Figure 1, which is parallel to the Y axis, "up" is the direction of the Z-axis arrow and "down" is the opposite direction, "left" is the direction of the X-axis arrow and "right" is the opposite direction, and "front" is the front direction in Figure 1, which is parallel to the Y axis and "back" is the opposite direction.

[0010] The electromagnetic wave irradiation device EA includes a spraying means 10 that performs a spraying process in which nitrogen gas NG is sprayed onto an adhesive sheet AS which is the object to be irradiated; an irradiation means 20 that performs an irradiation process in which electromagnetic waves EW are irradiated onto the adhesive sheet AS to which nitrogen gas NG has been sprayed; and a dissolution means 30 that performs a dissolution process in which the nitrogen gas spraying area on the adhesive sheet AS to which nitrogen gas NG is sprayed is dissolved before the spraying means 10 sprays nitrogen gas NG onto the adhesive sheet AS. In this embodiment, the adhesive sheet AS is made by integrating a semiconductor wafer (hereinafter also simply referred to as "wafer") WF, which is the adherend placed in the opening RF1 of the ring frame RF as a frame member, with the ring frame RF to form a single unit UP, and nitrogen gas NG is blown onto the adhesive sheet AS via the wafer WF. Furthermore, the adhesive sheet AS has the characteristic of its adhesive strength decreasing due to ultraviolet light, which is the main electromagnetic wave contained in the electromagnetic wave EW irradiated by the irradiation means 20, and the characteristic of dissolving due to infrared light, which is the secondary electromagnetic wave contained in the electromagnetic wave EW.

[0011] The spraying means 10 prevents the reaction in which the adhesive strength of the adhesive sheet AS decreases when ultraviolet light is irradiated onto the adhesive sheet AS from being inhibited by inhibiting substances such as oxygen and suspended particles in the atmosphere, and comprises a linear motor 11 as a drive device, a lid member 12 supported on the output shaft 11A of the linear motor 11 and having a spray hole 12A formed on its lower surface, and a gas supply means 13 such as a pressurized pump or turbine that supplies nitrogen gas NG from a nitrogen gas tank (not shown) to the spray hole 12A via piping 13A.

[0012] The irradiation means 20 comprises a housing 21, an electromagnetic wave irradiation means 22 for irradiating the adhesive sheet AS with electromagnetic waves EW, and a support means 23 for supporting the adhesive sheet AS. The electromagnetic wave irradiation means 22 includes a linear motor 22A as a drive device supported on the bottom surface 21B of a recess 21A of the housing 21, a cover 22C supported on the slider 22B of the linear motor 22A, a high-pressure mercury lamp 22D as an electromagnetic wave emission means housed inside the cover 22C and emitting electromagnetic waves EW, and a focusing means 22E such as a reflector or lens for focusing the electromagnetic waves EW emitted by the high-pressure mercury lamp 22D. The support means 23 is supported on the upper surface 21C of the housing 21 and includes a table 23A with a through hole 23D formed in the support surface 23C which is the bottom surface of the recess 23B, and a depressurization means 23F such as a depressurization pump or ejector that sucks gas from inside the recess 23B via piping 23E.

[0013] In this embodiment, the dissolution means 30 is also used as the irradiation means 20 and includes an electromagnetic wave irradiation means 22.

[0014] The operation of the electromagnetic wave irradiation device EA described above will now be explained. First, the user of the electromagnetic wave irradiation device EA (hereinafter simply referred to as "user") inputs first irradiation conditions, such as the illuminance required to dissolve the adhesive sheet AS and the movement speed of the high-pressure mercury lamp 22D, and second irradiation conditions, such as the illuminance required to reduce the adhesive strength of the adhesive sheet AS and the movement speed of the high-pressure mercury lamp 22D, via an operation panel or personal computer (not shown) and an operation means (not shown) (not shown), as well as a signal to start automatic operation. Next, when the user or a transport means (not shown), such as an articulated robot or a belt conveyor, places the integrated object UP at a predetermined position on the support surface 23C as shown in Figure 1, the spraying means 10 drives the linear motor 11 and lowers the lid member 12 as shown by the dashed line in Figure 1, forming a space SP with the lid member 12, the recess 23B and the integrated object UP.

[0015] Subsequently, the dissolution means 30 drives the linear motor 22A and the high-pressure mercury lamp 22D based on the first irradiation conditions, causing the high-pressure mercury lamp 22D to reciprocate left and right at the input illuminance and movement speed, thereby irradiating the adhesive sheet AS with electromagnetic waves EW. As a result, the adhesive sheet AS is heated, and the nitrogen gas blown area of ​​the adhesive sheet AS dissolves. Next, when the high-pressure mercury lamp 22D returns to its initial position, the irradiation means 20 stops driving the linear motor 22A and the high-pressure mercury lamp 22D. Then, the irradiation means 20 drives the depressurization means 23F to draw air into the space SP, and the blowing means 10 drives the gas supply means 13, supplying nitrogen gas NG into the space SP while blowing it onto the adhesive sheet AS through the wafer WF from the ejection hole 12A. Next, when a detection means (not shown) such as a concentration meter or concentration sensor detects that the concentration of nitrogen gas NG in the space SP has reached a predetermined concentration, the irradiation means 20 stops driving the depressurization means 23F, and the spraying means 10 stops driving the gas supply means 13. Subsequently, the irradiation means 20 drives the linear motor 22A and the high-pressure mercury lamp 22D based on the second irradiation conditions, and moves the high-pressure mercury lamp 22D back and forth again at the input illuminance and movement speed, irradiating the adhesive sheet AS with electromagnetic waves EW. As a result, the adhesive strength of the adhesive sheet AS is reduced by the ultraviolet rays contained in the electromagnetic waves EW.

[0016] Next, when the high-pressure mercury lamp 22D returns to its initial position, the irradiation means 20 stops driving the linear motor 22A and the high-pressure mercury lamp 22D, and then the spraying means 10 drives the linear motor 11 to return the lid member 12 to its initial position. Then, the user or a transport means (not shown) transports the integrated object UP to the next process, and the same operation as described above is repeated thereafter.

[0017] According to the above embodiment, since the nitrogen gas spraying area of ​​the adhesive sheet AS is dissolved before the nitrogen gas NG is sprayed onto the adhesive sheet AS, it is possible to prevent the formation of dissolved and undissolved areas in the nitrogen gas spraying area of ​​the adhesive sheet AS.

[0018] As described above, the best configuration, method, etc. for implementing the present invention are disclosed in the above description, but the present invention is not limited thereto. That is, although the present invention has been particularly illustrated and described mainly with respect to specific embodiments, without departing from the scope of the technical idea and object of the present invention, those skilled in the art can make various modifications to the above-described embodiments in terms of shape, material, quantity, and other detailed configurations. In addition, the descriptions that limit the shape, material, etc. disclosed above are exemplary descriptions for facilitating the understanding of the present invention and do not limit the present invention. Therefore, the description using the names of members with some or all of the limitations on those shapes, materials, etc. removed is included in the present invention.

[0019] For example, the blowing means 10 may blow gas onto the adhesive sheet AS without lowering the lid member 12, may blow gas directly onto the adhesive sheet AS without passing through the wafer WF, may blow gas onto the adhesive sheet AS from the side of the high-pressure mercury lamp 22D, may not stop blowing gas before the irradiation means 20 irradiates the adhesive sheet AS with electromagnetic waves EW, or may form the space SP by moving the support means 23 with or without moving the lid member 12. The gas blown by the blowing means 10 is not particularly limited, and may be, for example, cold air, air, a single gas such as nitrogen gas or argon gas, a mixed gas, etc. Or, for example, any gas may be adopted as long as it can prevent the reaction of the adhesive sheet AS from being inhibited according to the characteristics, properties, nature, material, and composition, etc. of the adhesive sheet AS.

[0020] The irradiation means 20 may not be provided with the housing 21. As the electromagnetic wave emitting means, for example, an LED (Light Emitting Diode) lamp, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, a xenon lamp, a halogen lamp, etc. may be adopted, or those appropriately combined may be adopted. Also, the electromagnetic wave EW may be irradiated onto the adhesive sheet AS by moving the support means 23 with or without moving the electromagnetic wave emitting means. The electromagnetic wave EW may include visible light, sound waves, microwaves, X-rays, gamma rays, infrared rays, etc. as the main electromagnetic waves, and any electromagnetic wave may be irradiated as long as it can cause the necessary reaction in the irradiation object according to the characteristics, properties, nature, material, composition, etc. of the irradiation object. The sub-electromagnetic waves included in the electromagnetic wave EW irradiated by the irradiation means 20 may be any electromagnetic waves as long as they can melt the irradiation object, such as visible light, sound waves, microwaves, X-rays, gamma rays, ultraviolet rays, etc. The irradiation means 20 does not have to be combined with the melting means 30. In this case, the electromagnetic wave EW necessary for reducing the adhesive force of the adhesive sheet AS may be adopted and irradiated onto the adhesive sheet AS.

[0021] The melting means 30 may melt the adhesive sheet AS before placing the integrated object UP on the support surface 23C, or may be combined with the irradiation means 20, or may not be combined with the irradiation means 20. When not combined with the irradiation means 20, for example, as shown by the two-dot chain line in FIG. 1, heating means 32 such as a coil heater or the heating side of a heat pipe supported by the slider 31A of the linear motor 31 as a driving device may be provided, and the adhesive sheet AS may be heated and melted by the heating means 32. When combined with the irradiation means 20, the heating means 32 may be supported by the slider 22B, and the linear motor 22A may be combined with the irradiation means 20.

[0022] The irradiation object may be an adherend or a ring frame RF, or may be composed of a single member or a plurality of members. The adhesive sheet AS may have properties such as reduced adhesive strength due to primary electromagnetic waves other than ultraviolet rays, such as visible light, sound waves, microwaves, X-rays, gamma rays, and infrared rays, or it may have properties that cause dissolution due to secondary electromagnetic waves other than infrared rays, such as visible light, sound waves, microwaves, X-rays, gamma rays, and ultraviolet rays. For integrated UP, a substrate or ring frame RF is not required. The frame members may be other than the ring frame RF, including non-annular (without a connected outer circumference), circular, elliptical, polygonal, or other shapes. The adhesive sheet AS does not need to be subject to the inhibition of its reaction by airborne inhibitors.

[0023] The material, type, shape, etc., of the object to be irradiated, the adhesive sheet AS, the adherend, and the frame members are not particularly limited. For example, the object to be irradiated, the adhesive sheet AS, the adherend, and the frame members may be circular, elliptical, polygonal (triangle or square, etc.), or have other shapes. The adhesive sheet AS may be of a pressure-sensitive adhesive type, a heat-sensitive adhesive type, etc. If a heat-sensitive adhesive sheet AS is used, it should be bonded by an appropriate method, such as providing a suitable heating means such as a suitable coil heater or the heating side of a heat pipe to heat the adhesive sheet AS. Furthermore, the adhesive sheet AS may be any type, such as a single layer of only an adhesive layer, a two-layer sheet with a substrate and an adhesive layer laminated together, a three-layer or three-or-more-layer sheet with one or more intermediate layers laminated between the substrate and the adhesive layer, a three-layer or three-or-more-layer sheet with one or more cover layers laminated on the upper surface of the substrate, a sheet in which the substrate, intermediate layer, or cover layer is peelably provided, a single-layer double-sided adhesive sheet consisting only of an adhesive layer, or a double-sided adhesive sheet with adhesive layers laminated on both outermost surfaces of one or more intermediate layers. Furthermore, the adherend may be a single object such as food, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, a circuit board, an information recording substrate such as an optical disc, a glass plate, a steel plate, a ceramic, a wooden board, or a resin, or a composite object formed from two or more of these, and any form of component or article can also be targeted. Note that the adhesive sheet AS may be replaced with any sheet, film, tape, etc., such as an information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, or recording layer forming resin sheet, based on its functional and application-based reading.

[0024] The means and processes in this invention are not limited in any way as long as they can perform the operations, functions, or processes described for those means and processes, and are certainly not limited at all to the components or processes of a single embodiment shown in the above-mentioned embodiments. For example, the spraying means can be any means that sprays gas onto the object to be irradiated, and is not limited in any way as long as it is within the scope of the art in light of the common technical knowledge at the time of filing (the same applies to other means and processes).

[0025] The drive equipment in the above embodiment can be electric equipment such as rotary motors, linear motors, single-axis robots, articulated robots with two or more axes, actuators such as air cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders, or a combination of these directly or indirectly. In the above embodiment, if a support (holding) means or support (holding) member or other means for supporting (holding) the supported member (held member) is employed, a configuration may be adopted in which the supported member is supported (held) by gripping means such as a mechanical chuck or chuck cylinder, Coulomb force, adhesive (adhesive sheet, adhesive tape), adhesive agent (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, drive equipment, etc. [Explanation of symbols]

[0026] EA…Electromagnetic wave irradiation device 10... Spraying method 20…Irradiation means 30...Solution means AS... Adhesive sheet (object to be irradiated) NG... Nitrogen gas (gas) EW... Electromagnetic waves

Claims

1. An electromagnetic wave irradiation device for irradiating an object to be irradiated that has the property of dissolving when subjected to electromagnetic waves, A blowing means for blowing gas onto the object to be irradiated, The system comprises an irradiation means for irradiating the object to be irradiated with the electromagnetic waves onto which the gas has been blown, An electromagnetic wave irradiation device characterized by comprising a dissolution means for dissolving the gas-blowing region on the irradiated object to be blown with the gas, by irradiating the irradiated object with electromagnetic waves or heating the irradiated object before blowing the gas onto the irradiated object with the blowing means.

2. The electromagnetic wave irradiation device according to claim 1, characterized in that the dissolution means is also used as the irradiation means.

3. An electromagnetic wave irradiation method for irradiating an object to be irradiated, which has the property of dissolving when subjected to electromagnetic waves, A blowing step in which gas is blown onto the object to be irradiated, The process involves irradiating the object to be irradiated with the aforementioned gas with the aforementioned electromagnetic waves, An electromagnetic wave irradiation method characterized in that, before blowing the gas onto the object to be irradiated in the blowing step, a dissolution step is performed in which the object to be irradiated is irradiated with electromagnetic waves or heated to dissolve the gas-blowing area on the object to be irradiated.

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