Method for manufacturing a chuck table, chuck table, and method for manufacturing a workpiece

Abstract

To provide a chuck table manufacturing method that does not individually manufacture a porous plate in a desired shape, so as to improve productivity of the chuck table.SOLUTION: A chuck table manufacturing method, which can switch shapes of a holding surface 46 depending on at least two work-pieces having different areas and shapes, is constituted of: a porous plate adhesion step of storing a porous plate 4 in a recessed part 21 of a frame body 2 while exposing an upper surface of the plate to make the frame body 2 adhere to the porous plate 4; a groove formation step of forming, on the porous plate 4, a groove 9 extending to a bottom surface 21 of the recessed part 3; and a resin filling step of filling the groove 9 with fluid resin 91 and curing the resin.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a chuck table. Chuck table and workpiece manufacturing method It relates thereto.

Background Art

[0002] In a grinding apparatus used for semiconductor manufacturing, a rotating grinding wheel is brought into contact with a workpiece (wafer) sucked and held by a chuck table to grind it to a predetermined thickness. In the chuck tables described in Patent Documents 1 and 2, the holding surface is communicated with a suction source to hold the wafer on the holding surface.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, the chuck table sucks and holds a workpiece (wafer) that matches the target size and shape by changing the area of the holding surface communicated with the suction source. For example, it sucks and holds a 12-inch wafer or a 6-inch wafer.

[0005] A chuck table that holds wafers of a desired size and shape by suction consists of a disc-shaped porous disk for suctioning 6-inch wafers, a porous annular plate positioned to surround the outside of the porous disk and connected to a suction source together with the porous disk to suction 12-inch wafers, an annular dense barrier positioned between the porous disk and the porous annular plate, and a frame having recesses that accommodate the porous disk, the barrier, and the porous annular plate. The chuck table is manufactured by applying adhesive to the outer surface of the porous disk and the inner surface of the barrier, the outer surface of the barrier and the inner surface of the porous annular plate, and the bottom and inner surface of the recesses, and then bonding the porous disk, the barrier, and the porous annular plate to the frame.

[0006] Manufacturing such a chuck table requires individually manufacturing a porous disk for suctioning 6-inch wafers, a porous annular plate for suctioning 12-inch wafers, and a dense barrier. The barrier is then positioned to surround the outside of the porous disk, and the porous annular plate is positioned to surround the outside of the barrier, and these components are bonded together. However, this manufacturing method increases the number of steps in the manufacturing process and reduces productivity because the porous disk, porous annular plate, and barrier are manufactured individually according to their purpose and then bonded together.

[0007] This invention has been made in view of the above, and aims to provide a method for manufacturing a chuck table that improves productivity by eliminating the need to individually manufacture porous plates of desired shapes. Furthermore, the present invention aims to provide a chuck table manufactured by a manufacturing method that improves productivity, and a method for manufacturing a workpiece held by the chuck table. [Means for solving the problem]

[0008] A method for manufacturing a chuck table according to one aspect of the present invention is a method for manufacturing a chuck table capable of switching the shape of the holding surface to correspond to at least two workpieces with different areas or shapes, comprising: a porous plate bonding step of housing a porous plate in a recess of a frame with the upper surface of the porous plate exposed and bonding the frame and the porous plate; a groove forming step of forming grooves that penetrate the upper and lower surfaces of the porous plate and reach the bottom surface of the recess; and filling the grooves with liquid resin. When the liquid resin hardens, it will rise up on the upper surface of the porous plate. Fill and harden can The resin filling process, including .

[0009] moreover, After the resin filling process, the upper surface of the frame and Applicable The process includes a retaining surface forming step, in which the upper surface of the porous plate and the upper surface of the resin are ground with a grinding wheel to form a retaining surface. nothing .

[0010] Furthermore, the groove forming process is performed on the porous plate. , circular grooves and It is preferable to form straight grooves.

[0011] One aspect of the present invention is a chuck table manufactured by the above-described manufacturing method. One aspect of the present invention is a method for manufacturing a workpiece by processing a workpiece held on a chuck table with a processing tool, comprising: a holding step of holding the workpiece on the chuck table manufactured by the above manufacturing method; and a processing step of processing the workpiece held on the chuck table with a processing tool. [Effects of the Invention]

[0012] The present invention provides a method for manufacturing a chuck table that improves the productivity of the chuck table by eliminating the need to individually manufacture porous plates of a desired shape. Furthermore, according to the present invention, a chuck table manufactured by a manufacturing method that improves productivity and a method for manufacturing a workpiece held by the chuck table are obtained. [Brief explanation of the drawing]

[0013] [Figure 1] Figure 1 is a perspective view showing the state of the chuck table before it is subjected to the manufacturing process in this embodiment. [Figure 2] Figure 2A is a perspective view showing the state after bonding in the porous bonding process of this embodiment. Figure 2B is a cross-sectional view showing the state after bonding in the porous bonding process of this embodiment. [Figure 3] Figure 3A is a perspective view showing the groove formation process of this embodiment. Figure 3B is a cross-sectional view showing the groove formation process of this embodiment. [Figure 4] Figure 4A is a perspective view showing the resin filling process of this embodiment. Figure 4B is a cross-sectional view showing the resin filling process of this embodiment. [Figure 5] Figure 5A is a cross-sectional view showing the state during grinding in the retaining surface formation process of this embodiment. Figure 5B is a cross-sectional view showing the state after grinding in the retaining surface formation process of this embodiment. [Figure 6] FIG. 6 is a perspective view showing a manufactured chuck table in the method for manufacturing a chuck table according to the present embodiment. MODE FOR CARRYING OUT THE INVENTION

[0014] Hereinafter, a method for manufacturing a chuck table according to the present embodiment will be described with reference to the accompanying drawings. FIGS. 1 to 5 show the method for manufacturing a chuck table according to the present embodiment.

[0015] FIG. 1 is a perspective view showing a state before being subjected to a manufacturing process in the method for manufacturing a chuck table according to the present embodiment. The method for manufacturing a chuck table according to the present embodiment is capable of switching the shape of a holding surface corresponding to at least two workpieces having different areas or shapes.

[0016] The chuck table 1 is formed by attaching a porous porous plate 4 inside a recess 3 provided in an upper portion of a frame body 2 to the frame body 2. The upper surface 41 of the porous plate 4 becomes a holding surface 46 described later, and the holding surface 46 holds a workpiece.

[0017] At the center of the recess 3, there is a first suction hole 5 communicating with a suction source (not shown). The first suction hole 5 is provided so that a suction force acts on a first holding surface 47 described later.

[0018] The recess 3 has a suction groove 7. The suction groove 7 is provided at an arbitrary position in the recess 3, and it is preferable that the suction groove 7 is provided so that a suction force acts on a second holding surface 48 described later. For example, as shown in FIG. 1A, it is preferable to have a circular suction groove 7 centered on the first suction hole 5. The suction groove 7 has a second suction hole 6 communicating with a suction source (not shown). The recess 3 has a bottom surface 21 and a side wall surface 22.

[0019] In addition, the workpiece held by the holding surface 46 of the chuck table 1 is an as-cut wafer before device formation, and is formed by slicing a columnar ingot with a wire saw.

[0020] The manufacturing process for the chuck table of this embodiment will now be described.

[0021] [Porous board adhesion process] Figure 2A is a perspective view showing the state after bonding in the porous bonding process of this embodiment. Figure 2B is a cross-sectional view showing the state after bonding in the porous bonding process of this embodiment.

[0022] The adhesive 8 is applied to the recess 3. The adhesive 8 is applied to the bottom surface 21 and side wall surface 22 of the recess 3, excluding the first suction hole 5, the second suction hole 6, and the suction groove 7.

[0023] As shown in Figure 2A, the porous plate 4 is housed and bonded to the frame 2 with its upper surface 41 exposed in the recess 3 of the frame 2.

[0024] As shown in Figure 2B, it is preferable that the recess 3 and the porous plate 4 are bonded together so that they are in complete contact with each other except for the first suction hole 5 and the suction groove 7. [Groove formation process] Figure 3A is a perspective view showing the groove formation process of this embodiment. Figure 3B is a cross-sectional view showing the groove formation process of this embodiment.

[0025] As shown in Figure 3A, a groove 9 is formed in the porous plate 4. As shown in Figure 3B, the groove 9 is formed by cutting to reach the bottom surface 21 of the recess 3, according to the desired shape and size of the workpiece.

[0026] By forming the groove 9, a first porous portion 42 having a first suction hole 5 at its lower end and an annular second porous portion 43 having a second suction hole 6 (suction groove 7) at its lower end are formed.

[0027] As shown in Figure 3A, when the purpose is to hold a circular workpiece, it is preferable to form a circular groove 9. On the other hand, when the purpose is to hold a rectangular plate-shaped workpiece, or a circular plate-shaped workpiece with an orientation flat formed thereon, it is preferable to form a straight groove 9.

[0028] When forming the groove 9 in a straight line, a first suction hole 5 is formed on one side of the bottom surface 21 separated by the groove 9, and a second suction hole 6 is formed on the other side of the bottom surface 21.

[0029] In this embodiment, after bonding a single porous plate 4 to the frame 2 in the bonding process, grooves 9 are formed in the groove forming process. Compared to the conventional chuck table manufacturing process, this reduces the number of steps required and makes it possible to form a holding surface that matches the desired workpiece shape, without individually manufacturing porous plates of the desired shape.

[0030] [Resin filling process] As shown in Figure 4A, liquid resin 91 is filled into the groove 9 and cured to form a barrier portion 92. As shown in Figure 4B, the liquid resin 91 is filled so that it reaches the bottom surface 21 of the recess 3 and then cured. Furthermore, when the liquid resin 91 hardens and shrinks, it is preferable to fill it to an amount that will rise above the upper surfaces of the first porous portion 42 and the second porous portion 43, from the viewpoint of forming a flat retaining surface 46 in the retaining surface formation process described later.

[0031] The liquid resin 91 is preferably a thermosetting resin or an ultraviolet curing resin. When using a thermosetting resin, it is preferable to heat it to around 100°C to cure it. Furthermore, the liquid resin 91 preferably contains granular aggregate. The aggregate may also be in powder form. The inclusion of aggregate suppresses shrinkage when the liquid resin is cured. In addition, to prevent thermal deformation due to processing heat during grinding by making the thermal conductivity equivalent to that of the porous disc and porous annular plate, the aggregate is preferably alumina powder, silicon powder, or zirconia powder.

[0032] The barrier portion 92 seals the space between the first porous portion 42 and the second porous portion 43. This makes it possible to efficiently transmit the suction force generated from a suction source (not shown) to the first porous portion 42 and the second porous portion 43 through the first suction hole 5 and the second suction hole 7.

[0033] [Holding surface forming process] Figure 5A is a cross-sectional view showing the state before grinding in the retaining surface formation process of this embodiment. Figure 5B is a perspective view showing the state after grinding in the retaining surface formation process of this embodiment.

[0034] As shown in Figure 4B, the upper surface of the resin-cured barrier portion 92 and the upper surface of the frame 2 are often not on the same plane as the upper surface 41 of the porous plate 4, so it is necessary to make them on the same plane.

[0035] As shown in Figure 5A, after the resin filling process, the upper surfaces of the first porous portion 42, the second porous portion 43, and the barrier portion 92 are ground with the grinding wheel 101 of the grinding mechanism 100 to form the retaining surface 46.

[0036] The grinding mechanism 100 includes a grinding wheel 102 located at the bottom of the mount 103. By rotating a spindle 104 located at the top of the mount 103, the grinding mechanism 100 is lowered by a lifting mechanism (not shown), and the grinding wheel 102 is pressed against the workpiece. The workpiece here is the upper surface of the first porous section 42, the second porous section 43, the barrier section 92, and the frame 2. Furthermore, the upper surface of the workpiece is ground by a mechanism holding a chuck table 1 (not shown) or by horizontally moving the grinding mechanism 100. The upper surface of the workpiece is ground so that it is a single plane.

[0037] As shown in Figure 5B, the ground surface forms a retaining surface 46. The upper surface of the first porous portion 42 becomes the first retaining surface 47, and the upper surface of the second porous portion 43 becomes the second retaining surface 48.

[0038] Grinding makes the first holding surface 47, the second holding surface 48, the barrier portion 92, and the upper surface of the frame 2 all on the same plane, allowing the workpiece to be held tightly against the holding surface 46 without any gaps when it is held by suction.

[0039] The manufacturing process for the chuck table of this embodiment is completed in the holding surface formation step.

[0040] In this embodiment, as shown in Figure 6, the chuck table 1 has a first holding surface 47 and a second holding surface 48 separated by a barrier portion 92. This configuration makes it possible to switch the shape of the holding surface to correspond to at least two workpieces with different areas or shapes. For example, a wafer with a small area, such as a 6-inch wafer, can be held by suction using the first holding surface 47 provided in the first porous portion 42, and a wafer with a large area, such as a 12-inch wafer, can be held by suction using the second holding surface 48 provided in the second porous portion 43 in conjunction with the first holding surface 47. Therefore, it is possible to form a holding surface 46 that matches the shape and size according to the purpose.

[0041] The first porous section 42 is a porous disc manufactured using a conventional method, the second porous section 43 is a porous annular plate manufactured using a conventional method, and the barrier section 92 is a dense barrier manufactured using a conventional method.

[0042] Furthermore, in this embodiment, after bonding one porous plate 4 to the frame 2 in the porous plate bonding process, grooves 9 are formed in the groove forming process. Compared to the conventional chuck table manufacturing process, this eliminates the need to individually manufacture porous plates of the desired shape, reducing the number of steps and allowing for the formation of a holding surface 46 that matches the desired workpiece shape. As a result, the time required to form the chuck table is shortened, and the productivity of the chuck table is improved. [Industrial applicability]

[0043] As described above, the method for manufacturing a chuck table according to this embodiment can improve the productivity of chuck tables by eliminating the need to individually manufacture porous plates of the desired shape. Therefore, it is extremely useful in fields that produce processing equipment such as precision instruments that use workpieces as materials. [Explanation of symbols]

[0044] 1: Chuck Table 2:Frame body 3: Recess 4: Porous board 5: First suction port 6: Second suction port 7: Suction groove 8: Adhesive 9: Groove 21: Bottom 22: Side wall surface 41:Top surface 42: First porous section 43: Second porous section 46: Holding surface 47: First retaining surface 48: Second retaining surface 91: Liquid resin 92: Barrier section 100: Grinding mechanism 102: Sharpening stone 103: Mount 104: Spindle

Claims

1. A method for manufacturing a chuck table capable of switching the shape of the holding surface to accommodate at least two workpieces with different areas or shapes, A porous plate bonding step involves placing the porous plate in the recess of the frame with its upper surface exposed, and bonding the frame and the porous plate together. A groove forming step is to form grooves that penetrate the upper and lower surfaces of the porous plate and reach the bottom surface of the recess, A resin filling step in which liquid resin is filled into the groove and hardened so that it rises up on the upper surface of the porous plate when it hardens, The process includes, after the resin filling step, a retaining surface forming step in which the upper surface of the frame, the upper surface of the porous plate, and the upper surface of the hardened liquid resin are ground with a grinding wheel to form a retaining surface. A method for manufacturing a chuck table.

2. The method for manufacturing a chuck table according to claim 1, wherein the groove forming step involves forming a circular groove in the porous plate.

3. The method for manufacturing a chuck table according to claim 1, wherein the groove forming step involves forming a straight groove in the porous plate.

4. A chuck table manufactured by the method for manufacturing a chuck table described in claim 1.

5. A method for manufacturing a workpiece by processing a workpiece held on a chuck table with a machining tool, A holding step of holding a workpiece in a chuck table manufactured by the method for manufacturing a chuck table according to claim 1, A machining process in which a workpiece held on the chuck table is machined with a machining tool, A method for manufacturing a workpiece, consisting of the following:

Images