Processing Engineering Monitoring Device

Abstract

To provide a processing step monitoring device in which the number of devices of a system configuration is not proportional to the number of sensors even if the number of sensors is increased, and which can acquire a signal output from each sensor in the same system configuration.SOLUTION: A processing step monitoring device for monitoring a processing step by a manufacturing device comprises: a plurality of sensors which are attached to the manufacturing device; a plurality of selectors which have one input unit and a plurality of output units and are the same number as the number of sensors; a plurality of signal lines which are the same number as the number of output units of the respective selectors; and a controller. The respective sensors are connected to the input units of the plurality of corresponding selectors. The controller performs selection control so as to connect the input unit of each of the plurality of selectors to one end of the corresponding output unit and to open the other end, and connects the plurality of output units of the respective selectors to any of the plurality of corresponding signal lines.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an apparatus for monitoring the state of a processing step by measuring a plurality of loads.

Background Art

[0002] In press working, injection molding, etc., an operation of repeating the same processing with a relatively short cycle is performed. A method has been conventionally proposed for determining a processing state or an abnormality by analyzing a plurality of processing sensing data, which is time-series data sensed by a plurality of sensors, regarding the processing state in such an apparatus. In particular, a method for determining a processing state or an abnormality by measuring a load has been proposed.

[0003] The press production condition collection system described in Patent Document 1 is provided with a sensor plate on which a plurality of pressure sensors are arranged, digitizes all signals received from those plurality of sensors simultaneously, and estimates a defective event by analyzing the data.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the press production condition collection system described in Patent Document 1, when trying to measure a more detailed load and pressure distribution, there is a problem that the system configuration becomes large-scale. For example, in this system, depending on the number of sensors, a cable for transmitting an analog signal from the sensor, an A / D converter for digitizing the analog signal, and a processor for processing digital data are required.

[0006] This disclosure aims to provide a processing step monitoring device that can acquire signals output by each sensor using the same system configuration, while suppressing an increase in the number of elements in the system configuration, even when the number of sensors is increased. [Means for solving the problem]

[0007] The processing process monitoring device of this disclosure is a processing process monitoring device for monitoring a processing process by a manufacturing apparatus, and is characterized by comprising: a plurality of sensors attached to the manufacturing apparatus; a plurality of selectors provided in the same number as the plurality of sensors, each of which has one input and a plurality of output units, and selectively outputs a signal input to the one input unit from one of the plurality of output units; a plurality of signal lines connected to each of the plurality of output units for each of the plurality of selectors; and a controller that controls each of the plurality of selectors to selectively connect the input unit to one of the plurality of output units and selectively disconnect the input unit and the remaining plurality of output units. [Effects of the Invention]

[0008] According to this disclosure, even if the number of sensors is increased, it is possible to suppress the increase in the number of elements in the system configuration and provide a processing process monitoring device that can acquire signals output by each sensor with the same system configuration. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic diagram showing a machining process monitoring device according to Embodiment 1 of this disclosure. [Figure 2] This figure shows the portion of the device for detecting load in the processing step monitoring device according to Embodiment 1 of this disclosure that is installed on the mold. [Figure 3] Diagram showing the circuit configuration of the selector switch. [Figure 4] This circuit diagram shows a state where the digital selection signal is connected in a daisy-chain configuration to each flip-flop (FF) of the selector. [Figure 5] Circuit diagram showing the section where a group of signal lines are treated as a single signal and connected to the selector block. [Figure 6] This chart, with time on the horizontal axis, shows how the connection status of each selector connected in a daisy-chain configuration changes over time with each cycle in which the press machine repeatedly operates. [Figure 7] Flowchart showing details of the data processing unit. [Figure 8] This figure shows an example of performing abnormality detection using the full load waveform. [Figure 9] This figure shows an example of state detection using individual waveforms. [Figure 10] Block diagram showing multiple selector blocks connected by a single multi-core cable according to Embodiment 2. [Figure 11] Block diagram showing the connection between sensor blocks, where the load sensor and selector block are integrated, according to Embodiment 3. [Figure 12] This figure shows the state in which the mold according to Embodiment 4 is installed in the press machine. [Figure 13] Diagram showing the structure of the mold according to Embodiment 5 [Figure 14] Block diagram for serial data transfer of digitized data according to Embodiment 6 [Figure 15] Block diagram for wirelessly transferring digitized data according to Embodiment 7 [Figure 16] Diagram showing the vertical cross-sectional structure when a load sensor is attached to a conventional mold. [Figure 17] Block diagram showing a circuit that digitizes conventional analog signals and performs data processing. [Figure 18] Circuit diagram showing the internal configuration of a charge amplifier [Modes for carrying out the invention]

[0010] (Challenges in conventional technology) First, we will explain in detail the problem that, in conventional technology, increasing the number of sensors in order to perform more detailed judgments results in a large-scale system configuration.

[0011] For example, in press working where a die incorporating tools such as punches and dies is set in a press machine and a material such as metal is punched, in order to grasp a more detailed state, it is effective to increase the number of sensors installed in the press machine and monitor the states of various device configurations. In punching where processing is performed by applying a load with a press machine, it is important to measure the load on the die, particularly the load inside the die.

[0012] In particular, not only abnormal detection for determining whether an abnormality has occurred inside the die, but also state detection for determining the states of tools such as punches and dies requires directly capturing smaller changes. In order to capture smaller changes, for example, by attaching a load sensor to the punch, the punching load applied to the punch, that is, the load of the processing itself, can be measured. This measurement leads to grasping more detailed states such as the wear state of the tool.

[0013] However, when load sensors are provided for all punches, in a die where a large number of punches are arranged, even if sensors are installed, cables or the like for transmitting signals from the sensors are required, and it is necessary to pass such cables inside the die. As a result, grooves or the like for passing cables proportional to the number of sensors are required, and in a die that needs to achieve high accuracy by having high rigidity, there is a problem that distortion, deflection, etc. occur and the positional accuracy required for processing cannot be maintained.

[0014] Figure 16 shows the structure of a vertical cross-section of a conventional mold with load sensors attached. More specifically, Figure 16 shows a state in which load sensors are installed on all punches in the mold, and the signal lines from each sensor are wired outside the mold. There are various types of molds, but Figure 16 shows an example in which load sensors are installed on all 10 punches installed inside the mold. Actual molds also require bolts to fix each part, guides such as posts, springs to hold down plates, lifting mechanisms, and guides for positioning relative to the non-processed material. However, Figure 16 omits such parts in order to simplify the explanation of the structure.

[0015] Each of the multiple punches 901 is positioned in the mold to punch out the workpiece 911, facing its corresponding die 902. The punches 901 are guided by the stripper plate 903 to align with the horizontal (left-right and depth directions in the drawing) position of their respective die 902s, and are each gripped by the punch plate 904.

[0016] Each die 902 is fitted into a die plate 905 and secured on top of a die backing plate 906.

[0017] 908a, 908b, 908c, 908d, 908e, 908f, 908g, 908h, 908i, and 908j are load sensors that utilize the piezoelectric effect (hereinafter collectively referred to as load sensors 908). Each load sensor 908 is installed between each punch 901 and the punch backing plate 907. This allows each load sensor 908 to measure the load applied between the punch backing plate 907 and each individual punch 901, that is, the load of each individual punch 901 that punches the workpiece 911 during processing. A load sensor that utilizes the piezoelectric effect has the characteristic of outputting an electric charge corresponding to the load it receives.

[0018] 909A, 909B, 909C, 909D, 909E, 909F, 909G, 909H, 909I, and 909J are terminals connected to cables that transmit signals from sensors (hereinafter collectively referred to as signal line terminals 909). Additionally, 909Aa, 909Ba, 909Ca, 909Da, 909Ea, 909Fa, 909Ga, 909Ha, 909Ia, and 909Ja are signal lines indicating the cables connected to each signal line terminal (hereinafter collectively referred to as signal lines 909a). The signal line group 910, representing all signal lines, has the same number of cables as the load sensors 908. Signal lines 909a are routed outwards from the outer edge of the mold 900.

[0019] During production, the mold 900 is installed in the press machine, and as the slider moves up and down, the workpiece 911 is punched out into a predetermined shape, and the punching load applied to the punch 901 is output from the load sensor 908 via the signal line 909a.

[0020] Figure 17 is a block diagram showing a circuit that digitizes and processes data from a conventional analog signal. Figure 17 also shows a circuit that digitizes and processes data from an analog signal from signal line 909a.

[0021] 121a, 121b, 121c, 121d, 121e, 121f, 121g, 121h, 121i, and 121j are charge amplifiers (CA, hereafter collectively referred to as charge amplifiers 121). A charge amplifier 121 is an integrating circuit that receives the charge output according to the load received by the corresponding load sensor 108 and converts it into a voltage.

[0022] The status signal output from the status signal terminal 125 indicates which phase of a repetitive process the press machine is in. The status signal is input to the controller 124. The status signal is, for example, a signal indicating the rotation angle in the case of a clamp-type press machine, or a signal indicating the slider position in the case of a servo-type press machine. The status signal terminal 125 is, for example, an output terminal for these devices. Based on the status signal, the controller 124 can determine which phase of a process the machine is in, that is, whether the slider is near the bottom dead center and processing is in progress, or whether it is near the top dead center and non-processing is in progress, such as feeding the workpiece 111. The controller 124 outputs a reset control signal that sets the charge amplifier 121 to operation mode when processing is in progress, and to reset mode when non-processing is in progress.

[0023] The charge amplifier 121 resets the integration circuit when not processing and operates in operating mode when processing is performed, based on the reset control signal.

[0024] 122a, 122b, 122c, 122d, 122e, 122f, 122g, 122h, 122i, and 122j are level adjustment amplifiers (hereinafter collectively referred to as level adjustment amplifiers 122). When each level adjustment amplifier 122 receives a corresponding signal from the charge amplifier 121, it amplifies the signal at a set amplification factor so that it reaches a voltage level suitable for the subsequent A / D converter.

[0025] 123a, 123b, 123c, 123d, 123e, 123f, 123g, 123h, 123i, and 123j are A / D converters (hereinafter collectively referred to as A / D converters 123). When each A / D converter 123 receives a signal from the corresponding level adjustment amplifier 122, it converts the signal into digital time-series data and outputs it to the data processing unit 126.

[0026] The data processing unit 126 receives digital time-series data from all load sensors 108, detects the detailed state of each tool, and determines whether or not there is an abnormal state.

[0027] Figure 18 is a circuit diagram showing the internal configuration of one of the charge amplifiers 121. The charge amplifier 121 has an input terminal IN into which the charge from the load sensor 108 is input, a reset input terminal RST, and an output terminal OUT as input and output terminals. The charge amplifier 121 also includes an operational amplifier (hereinafter referred to as an op-amp) OP, a capacitive element C0, and a reset switch SW0.

[0028] The input terminal IN is connected to the two differential input terminals of the operational amplifier OP via a signal line that transmits a common signal COM and a signal line that transmits a charge input signal CIN, which is input with respect to the common signal COM. The output terminal of the operational amplifier OP is connected to the output terminal OUT. The signal line that transmits the common signal COM is connected to ground or another point in the system.

[0029] Capacitive element C0 is placed between the signal line that transmits the charge input signal CIN and the output terminal OUT. The charge input by the charge input signal CIN is amplified so that the potential difference between the two differential inputs of the operational amplifier OP becomes zero, thereby charging the capacitive element C0. Due to the accumulation of charge in the capacitive element C0, a voltage signal corresponding to the amount of charge is output from the output terminal OUT.

[0030] The reset switch SW0 is connected in parallel with the capacitive element C0. When the reset switch SW0 receives a reset signal from the reset input terminal RST, it turns ON, shorting the terminals of the capacitive element C0. As a result, the charge of the capacitive element C0 is discharged during reset. When the signal output from the reset input terminal RST is changed to a reset release signal, the reset switch SW0 turns OFF, and the capacitive element C0 begins to charge.

[0031] However, if the number of load sensors is increased to individually detect the state of each tool, there is a challenge in that the routing of cables from the sensors and the need for electrical circuits such as charge amplifiers, level adjustment amplifiers, and A / D converters will increase proportionally.

[0032] In particular, when the mold is small and the number of tools is large relative to the size of the mold, it is necessary to run cables from load sensors corresponding to these tools from inside to outside the mold, and it becomes necessary to provide space for the cables along all of them. However, since the mold needs to have space for many mechanisms such as bolts, guides, springs, and positioning guides, if space is also to be provided along all of these, it becomes difficult to achieve the high precision required for the high rigidity of the mold.

[0033] In addition, the electrical circuits, which are proportional to the number of load sensors, consume a large amount of power and generate a lot of heat due to their large number. Therefore, it is difficult to place electrical circuits inside or near the mold, where it becomes difficult to maintain high accuracy due to thermal expansion as the temperature rises. For this reason, the electrical circuits must be installed outside the mold and connected to the sensors inside the mold with numerous cables. However, even if the mold is not in an abnormal state, it needs to be removed from the press machine periodically for maintenance such as resharpening the tools. Therefore, the increase in the number of electrical components, such as cables, leads to the problem of reduced maintainability.

[0034] The present disclosure aims to provide a machining process monitoring device that can acquire signals output by each sensor using the same system configuration, while suppressing an increase in the number of elements in the system configuration, even when the number of sensors is increased. To achieve the above objective, the machining process monitoring device of this disclosure is characterized in that, for example, the output from the sensors is branched by a selector to classify it into the sensor of interest and the other sensors, and the signal lines connected to each sensor are connected in a daisy-chain configuration.

[0035] The following describes the best embodiment for implementing the processing using the processing monitoring device relating to this disclosure.

[0036] (Embodiment 1) Figure 1 is a schematic diagram of the processing process monitoring device 1000 according to this disclosure. More specifically, Figure 1 is a block diagram showing a mold 100 included in a press machine 2000, which is an example of a manufacturing apparatus, and a circuit that inputs and outputs signals to the mold 100 and performs data processing. The press machine 2000 includes the processing process monitoring device 1000. The processing process monitoring device 1000 comprises the mold 100, a display device 200, and the circuit. Specifically, the circuit shows a circuit that generates a digital selection output signal which is output as a digital selection signal, and processes data of the total load signal and the target load signal from the total load signal terminal 3A and the target load signal terminal 3B. Since the total load signal and the target load signal are analog signals, they are digitized and processed. The display device 200 is, for example, a display. The display device 200 can display the processing results of the processing process monitoring device 1000 (for example, the results of state detection and abnormality detection described later). The display device 200 may display the operating status of the press machine 2000, or it may be the same as an input / output device (not shown) for operating the press machine 2000. As shown in Figure 1, the circuit includes charge amplifiers 12A and 12B, level adjustment amplifiers 13A and 13B, A / D converters 14A and 14B, a controller 15, and a data processing unit 16.

[0037] Charge amplifiers 12A and 12B are integrating circuits that receive charge from analog signals from the corresponding total load signal terminal 3A and the load of interest signal terminal 3B, and convert it into voltage.

[0038] When level adjustment amplifiers 13A and 13B receive signals (i.e., voltages) from their respective charge amplifiers 12A and 12B, they amplify them at a set amplification factor to achieve a voltage level suitable for the subsequent A / D converter.

[0039] The controller 15, like in the prior art, receives a signal from the status signal terminal 125 and has the function of determining whether the press machine 2000 is in the process of processing or not. The controller 15 outputs a reset control signal to the charge amplifiers 12A and 12B to set them to reset mode when not processing and to the operation mode when processing. The controller 15 includes, for example, a processor (not shown).

[0040] The processor includes general-purpose processors such as CPUs or MPUs that perform predetermined functions by executing programs. The processor performs various processes, such as signal output processing by a controller, by calling and executing arithmetic programs stored in a memory device (not shown), for example. The processor is not limited to a configuration in which hardware resources and software cooperate to perform predetermined functions, but may also be a hardware circuit specifically designed to perform predetermined functions. In other words, the processor can be implemented with various processors other than CPUs and MPUs, such as GPUs, FPGAs, DSPs, and ASICs. Such a processor may be composed of, for example, a signal processing circuit which is a semiconductor integrated circuit. The processing by the data processing unit 16, described later, can also be performed by the processor in the same way.

[0041] Furthermore, the controller 15 changes the selected state of the selector 1, described later, by outputting a digital selection signal containing information about the load sensor 108 to be focused on in the next machining process to the digital selection signal terminal 5 while the device is not being machined. The controller 15 also outputs a gain control signal to the level adjustment amplifier 13B and changes the gain setting of the level adjustment amplifier 13B to match the load sensor 108 of focus. In this embodiment, the gain setting of the level adjustment amplifier 13A is fixed, and the gain setting of the level adjustment amplifier 13B is dynamically changed by the gain control signal from the controller 15. However, the gain setting is not limited to this. For example, if a good voltage level can be obtained without falling outside the input range of the subsequent A / D converter, the gain setting of the level adjustment amplifier 13B may be fixed even if the gain setting of the level adjustment amplifier 13A is dynamically controlled by the controller 15.

[0042] The A / D converters 14A and 14B each receive signals from the corresponding level adjustment amplifiers 13A and 13B, convert them into digital time-series data, and output the data to the data processing unit 16.

[0043] The data processing unit 16 receives signals from the A / D converters 14A and 14B, which are signals related to the overall load signal and the load signal of interest. The data processing unit 16 also receives from the controller 15 a load sensor information signal indicating which load sensor is of interest during machining, and a gain control signal for the level adjustment amplifier 13B. The data processing unit 16 performs data processing based on these signals. The data processing unit 16 is composed of a processor or a digital hardware circuit such as an FPGA, and performs data processing. For data from the load sensor of interest, the data processing unit 16 performs an analysis of the load applied to the punch 101 of interest. For data from load sensors other than the load sensor of interest, the data processing unit 16 combines the data from the load sensor of interest with the data from the load sensor of interest and performs an analysis of the overall load applied to the punch 101. The load sensors and punch will be described later.

[0044] Figure 2 shows a device for detecting load in the processing monitoring device 1000 according to this disclosure. More specifically, Figure 2 shows the part of the device that is installed on the mold 100.

[0045] Actual molds also require bolts to secure each component, guides such as posts, springs to hold down plates, lifting mechanisms, and guides for positioning relative to the workpiece. However, Figure 2 omits such components to simplify the explanation of the structure.

[0046] The mold 100 comprises a plurality of punches 101, a plurality of dies 102, a stripper plate 103, a punch plate 104, a die plate 105, a die backing plate 106, and a punch backing plate 107. The mold 100 also comprises a plurality of load sensors 108 and a plurality of selector blocks 2, each having a selector 1. The workpiece 111, which is the material to be processed, is placed inside the mold 100. Signal lines 3Aa, 3Ba, and 5a are connected to the selector blocks 2.

[0047] Each of the multiple punches 101 is positioned in the mold 100 so as to face its corresponding die 102 among the multiple dies 102, and punches the workpiece 111. The punches 101 are guided by the stripper plate 103 to align with the horizontal position (left and right and depth direction in the drawing) of their respective dies 102, and are each gripped by the punch plate 104.

[0048] Each die 102 is fitted into a die plate 105 and fixed on top of a die backing plate 106.

[0049] 108a, 108b, 108c, 108d, 108e, 108f, 108g, 108h, 108i, and 108j are load sensors that utilize the piezoelectric effect (hereinafter collectively referred to as load sensors 108). Each load sensor 108 is equipped with a piezoelectric element. Each load sensor 108 is installed between each punch 101 and the punch backing plate 107. As a result, each load sensor 108 can output a charge corresponding to the load applied between the punch backing plate 107 and each individual punch 101, that is, the load of each individual punch 101 that punches the workpiece 111 during processing.

[0050] 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, and 1j are selectors (hereinafter collectively referred to as selector 1). Each selector 1 has the function of selectively connecting the analog signal output from the corresponding load sensor 108 to either the first signal line or the second signal line, which are two signal lines, that is, the function of connecting to one of the two signal lines. The mold 100 is equipped with the same number of selectors 1 as there are load sensors 108.

[0051] 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, and 2j are selector blocks (hereinafter collectively referred to as selector block 2). Each selector block 2 has a corresponding selector 1. Each selector 1 electrically connects the corresponding load sensor 108 to either the first signal line, signal line 3Aa, or the second signal line, signal line 3Ba, based on the digital switching signal of its respective selector. Thus, each selector 1 has the function of selectively electrically connecting the corresponding load sensor 108 to either the overall load signal terminal 3A or the load of interest signal terminal 3B. The load sensor 108 outputs an analog signal to either the overall load signal terminal 3A or the load of interest signal terminal 3B. The overall load signal refers to the signal output to the overall load signal terminal 3A. The load of interest signal refers to the signal output to the load of interest signal terminal 3B.

[0052] In the processing of a single cycle operation in which the press machine 2000 performs repeated operations, the load sensors 108 are divided into a sensor of interest and other sensors. The selector 1 connects at least one of the load sensors of interest 108 to the signal line 3Ba of the load signal terminal 3B, and the other load sensors 108 to the signal line 3Aa of the overall load signal terminal 3A. According to the best embodiment, there is one load sensor of interest, and one of the load sensors 108 is connected to the signal line 3Ba, while the other load sensors 108 are connected to the signal line 3Aa.

[0053] Selector 1 also receives a digital selection input signal and transmits a digital selection output signal. In the best embodiment, one selector 1 is daisy-chained with other adjacent selectors 1. In Figure 2, selectors 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, and 1i receive digital selection output signals from selectors 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, and 1j, respectively, as digital selection input signals. Selector 1j receives a digital selection signal from the digital selection signal terminal 5 via signal line 5a, as a digital selection input signal. Details of these daisy-chain connections will be described later.

[0054] With these configurations, the signal line group 6 provided on the mold 100 has three signal lines, 3Aa, 3Ba, and 5a, regardless of the number of load sensors 108. Therefore, the signal line group 6 is connected to three types of interface devices: the overall load signal terminal 3A, the load of interest signal terminal 3B, and the digital selection signal terminal 5. Even if the number of load sensors 108 increases, the mold can use the same signal lines and interface devices, so the number of signal lines constituting the signal line group 6 does not increase.

[0055] Figure 3 shows the circuit configuration of selector 1j, which is one of the selectors 1. All selectors 1 have the same circuit configuration, and only selector 1j will be explained here.

[0056] The selector 1j includes an input section to which the signal from the load sensor 108j is input, and a first output section and a second output section to output the signal input to the sensor signal C. The selector 1j has output terminal A as the first output section, output terminal B as the second output section, and sensor signal terminal C as the input section. The selector 1j is configured to selectively output the signal input to sensor signal terminal C from either output terminal A or output terminal B.

[0057] Selector 1j performs connection switching operations via a selector control signal transmitted through the selector control circuit Sa. Selector 1j has a digital selection input signal terminal CHAININ, which receives a digital selection input signal as a control signal to control the selector control signal, and a digital selection output signal terminal CHAINOUT, which outputs a digital selection output signal.

[0058] Each selector 1 is daisy-chained by a digital selection input signal terminal CHAININ and a digital selection output signal terminal CHAINOUT. Selector 1j also has an analog selector SEL, and based on the digital logic signal included in the selector control signal, it selectively electrically connects a sensor signal terminal C, which receives the sensor signal from the corresponding load sensor 108j, to output terminal A or output terminal B via a sensor signal circuit Ca. Output terminal A is electrically connected to the overall load signal terminal 3A. Output terminal B is electrically connected to the load of interest signal terminal 3B.

[0059] The analog selector SEL has switches SWA and SWB, which close when they receive a high signal in the digital logic signal and open when they receive a low signal. Switch SWA is located between sensor signal terminal C and output terminal A, and switch SWB is located between sensor signal terminal C and output terminal B. The analog selector SEL also has an inverter INV. The inverter INV is located between the selector control circuit Sa and switch SWA, and outputs an inverted logic signal when it receives a digital logic signal included in the selector control signal.

[0060] Switch SWA is controlled by an inverting logic signal output from inverter INV. Switch SWB is controlled by a digital logic signal included in the selector control signal. As a result, when the selector control signal is a low signal, the analog selector SEL is in a closed state where sensor signal terminal C and output terminal A are electrically connected, and in an open state where sensor signal terminal C and output terminal B are electrically disconnected. On the other hand, when the selector control signal is a high signal, the analog selector SEL is in an open state where sensor signal terminal C and output terminal A are electrically disconnected, and in a closed state where sensor signal terminal C and output terminal B are electrically connected.

[0061] The digital selection input signal terminal CHAININ has a data input terminal DINt, a clock input terminal CKINt, and a power line (not shown). The digital selection output signal terminal CHAINOUT has a data output terminal DOUTt, a clock output terminal CKOUTt, and a power line (not shown). Selector 1j has a flip-flop FF that functions as a register for holding the digital selection signal transmitted by the selector control circuit Sa. The flip-flop FF has a data input terminal D, a clock input terminal CK, and an output terminal Q. The data input terminal D of the flip-flop FF is connected to the data input terminal DINt, and the clock input terminal CK is connected to the clock input terminal CKINt. The flip-flop FF performs a latch operation, capturing the logic state of the data input terminal D when the rising edge of the clock signal from the clock input terminal CK changes, outputting it from the output terminal Q, and holding that logic state until the next rising edge of the clock signal. The data output terminal Q controls the analog selector SEL by being connected to the selector control circuit Sa.

[0062] Furthermore, the power line from the digital selection input signal terminal CHAININ supplies power to selector 1j for use as a power source, and also supplies power to the power line of the digital selection output signal terminal CHAINOUT.

[0063] The output from data output terminal Q is buffered by buffer BUFD, delayed to ensure that the flip-flop FF of selector 1i (the next flip-flop connected in a daisy-chain configuration) is properly latched, and then output from data output terminal DOUTt. The clock input terminal CK is buffered by buffer BUFCK, delayed to ensure that the flip-flop FF of selector 1i (the next flip-flop connected in a daisy-chain configuration) is properly latched, and then output from clock output terminal CKOUTt. Note that buffers BUFD and BUFCK may be omitted if they do not affect the operation of the destination flip-flop FF.

[0064] In this way, the controller 15 can control each selector 1 to selectively connect the input section (i.e., input terminal C) to one of the multiple output sections (i.e., output terminal A or output terminal B), and selectively disconnect the input section and the remaining multiple output sections.

[0065] Switches SWA and SWB are switched during the non-processing phase of each cycle in the relatively short, repetitive operation of the press machine 2000. Therefore, the switching operation of the switches is extremely frequent, and in some cases may exceed several hundred million times, considering the lifespan of the mold 100, it is desirable that switches SWA and SWB be composed of semiconductor switches that do not have mechanical contacts.

[0066] Even when a semiconductor switch is in the ON state with both ends closed, it still possesses some on-resistance. However, the operational amplifier OP, which constitutes charge amplifiers 12A and 12B, amplifies so that the voltage difference between the two inputs becomes zero, thus working to make the voltage difference between the sensor signal terminal C and the output terminal A or B zero. In other words, the operational amplifier OP amplifies so that the output voltage from the load sensor, which is a piezoelectric element that outputs a charge when subjected to a load, becomes zero, and so that the voltage difference across switches SWA and SWB becomes zero, thereby minimizing the effect of on-resistance.

[0067] Figure 4 is a circuit diagram showing the state in which the signal lines connected to the digital selection signal terminal 5 are daisy-chained with each flip-flop FF of selector 1. Buffers BUFD and BUFCK, which are not related to the digital logic values ​​for the purpose of this explanation, are omitted from the diagram.

[0068] The signal output from the digital selection signal terminal 5 consists of a data signal DIN and a clock signal CKIN. The digital selection signal terminal 5 is connected to two signal lines, one of which transmits the data signal DIN and the other transmits the clock signal CKIN. The two signal lines connected to the digital selection signal terminal 5 are connected to the digital selection input signal terminal CHAININ of selector 1j, which in turn connects to the data input terminal D and clock input terminal CK of the flip-flop FF, respectively. The data signal DIN and clock signal CKIN are input to the data input terminal D and clock input terminal CK of the flip-flop FF by being input to the digital selection input signal terminal CHAININ of selector 1j. Furthermore, the digital selection output signal terminals CHAINOUT of selectors 1j, 1i, 1h, 1g, 1f, 1e, 1d, 1c, and 1b are connected to the digital selection input signal terminals CHAININ of selectors 1i, 1h, 1g, 1f, 1e, 1d, 1c, 1b, and 1a, respectively. In this way, the data from the digital selection signal terminals 5 of the controller 15 propagates between the daisy-chained flip-flops FF in accordance with the rising edge of the clock signal, i.e., performs a shift operation.

[0069] With this daisy-chain configuration, the signal from the digital selection signal terminal 5 is transmitted solely through the connection between the digital selection signal input terminal CHAININ and the digital selection signal output terminal CHAINOUT, regardless of the number of load sensors 108. Therefore, even if the number of load sensors 108 increases, it is only necessary to connect the nearest digital selection input signal terminal CHAININ to the digital selection output signal terminal CHAINOUT, eliminating the need to prepare new signal lines for placement outside the mold.

[0070] Figure 5 shows the circuit diagram of the connection between the signal line group 6 and selector blocks 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, and 2j. In Figure 5, the signals from the digital selection signal terminal 5, the overall load signal terminal 3A, and the target load signal terminal 3B, which are output to the signal lines constituting the signal line group 6, are input to or output from each selector block 2 as a set of signals.

[0071] The connection of each selector block 2 to the signal lines relating to the overall load signal terminal 3A and the load of interest signal terminal 3B can be made together with the connection of the signal lines to the digital selection input signal terminal CHAININ and the digital selection output signal terminal CHAINOUT of each selector block 2. This allows the user to connect each selector block 2 to the signal lines in an area within the mold through which the same cable passes. Furthermore, the user can connect the signal lines between selector blocks 2 located near each other within the mold 100, where each load sensor 108 is located. This configuration has the advantage that it does not require cables from all load sensors 108 to be routed from inside to outside the mold, and only an area needs to be provided between nearby selector blocks 2 for the cables connecting the selector blocks 2 to each other to pass through. Therefore, this configuration greatly reduces interference between the area for passing cables and the area for numerous mechanisms within the mold, such as bolts, guides, springs, and positioning guides, and prevents a significant decrease in the rigidity of the mold.

[0072] Furthermore, the circuit built into selector block 2 is a digital circuit with only a few components, so its power consumption is very low. When the digital selection signal does not change, power consumption is generated only by leakage current and is therefore practically negligible. Consequently, the mold is not affected by temperature rise even if this circuit is installed inside. In addition, the components that make up these digital circuits are about the size of a grain of rice, and since there are only a few components, they require only a very small area, thus minimizing the impact on the mold design.

[0073] Figure 6 is a chart showing how the connection state of each selector 1 connected in a daisy-chain configuration changes over time with each cycle in which the press machine 2000 repeatedly operates. The horizontal axis represents time. Hereafter, the hatched area in Figure 6 will be referred to as the ON state.

[0074] The period when "Non-Processing State" is ON indicates the period between a specific processing step and the next processing step within a single cycle in which the press machine 2000 performs repeated operations (hereinafter also referred to as "non-processing"). During the non-processing period, for example, the slider is near the top dead center and the workpiece 111 is advanced. The period when "Non-Processing State" is not ON indicates processing. During the processing period, for example, the slider is near the bottom dead center and the workpiece is punched out. The period when the digital logic state of the digital selection signal and the digital logic output by the flip-flop FF are ON indicates high logic, and the period when they are not ON indicates low logic.

[0075] The data signal DIN and clock signal CKIN included in the digital selection signal are sent during the unprocessed phase. At the timing when the digital logic of the clock signal CKIN rises from low to high, the flip-flop FF captures the digital logic of its respective data input terminal D. As shown in Figure 4, the flip-flop FFs are connected in a daisy-chain configuration. Therefore, at the timing of the rising edge of the clock signal CKIN, the digital logic of the flip-flop FFs along the daisy-chain connection shifts as the data logic of the data signal DIN propagates through the flip-flop FFs. By performing multiple shift operations, the digital logic of all flip-flop FFs can be controlled by the digital selection signal. Furthermore, as explained in Figure 3, the sensor signal terminal C of the analog selector SEL is controlled to be connected to one of the output terminals A and B, and disconnected from the other, depending on the digital logic of the flip-flop FFs.

[0076] In a good embodiment, the shift operation is performed only once during a non-processing cycle. To determine in detail the state of each punch 101 on which the load sensor 108 is installed, it is desirable that the controller 15 be controlled to focus on only one of the punches 101. To individually focus on and determine all the punches 101, the controller 15 can shift the punch 101 to focus on, i.e., the number of load sensors 108, as one detailed determination unit, i.e., by shifting the flip-flop FF.

[0077] Figure 7 is a block diagram showing the details of the data processing unit 16. The data processing performed by the data processing unit 16 is carried out by a processor and the like (not shown) as described above. The data processing unit 16 includes unit conversion units 51A and 51B, an addition unit 52, a channel distribution unit 53, a total load waveform storage unit 56, one or more channel load waveform storage units 59, a total load determination processing unit 60, and a channel of interest determination processing unit.

[0078] The digital data from the A / D converters 14A and 14B are converted into values ​​of physical quantities such as Newtons representing load by the unit conversion units 51A and 51B, respectively. In this process, the unit conversion unit 51A converts to an appropriate value of the physical quantity, taking into account the characteristics of the load sensor 108, the capacitive element C0 of the charge amplifier 12A, and the gain setting of the level adjustment amplifier 13A. The unit conversion unit 51B converts to an appropriate value of the physical quantity, taking into account the characteristics of the load sensor 108, the capacitive element C0 of the charge amplifier 12B, and the gain setting of the level adjustment amplifier 13B, based on the gain control signal from the controller 15.

[0079] The addition unit 52 receives data from the unit conversion units 51A and 51B and performs an addition operation to determine the load applied to all load sensors 108, that is, the load applied to all punches 101 to which the load sensors 108 are attached. The addition unit 52 outputs the data obtained from the addition operation to the total load waveform buffer 54 of the total load waveform storage unit 56. The total load waveform buffer 54 receives data from the addition unit 52 and buffers the latest waveform from the waveform data extracted into waveforms for a single processing cycle, that is, it temporarily stores the waveform data.

[0080] The full load waveform storage unit 56 includes a full load waveform buffer 54 and a full load waveform history buffer 55. The full load waveform history buffer 55 buffers the waveform history by receiving and storing waveform data from the full load waveform buffer 54. The full load waveform storage unit 56 may be provided in the storage device described above.

[0081] The total load determination processing unit 60 refers to the total load waveform storage unit 56 and uses the waveform history and the latest waveform to perform an abnormality determination regarding the occurrence of an abnormality that would require an emergency stop, and outputs the total load determination result. For example, if the total load determination processing unit 60 determines whether an abnormality has occurred, it may display the determination result on the display device 200. Alternatively, or in addition to the above, if the total load determination processing unit 60 determines that an abnormality has occurred, it may send a stop signal to a controller (not shown) that controls the press machine 2000 to stop the press machine 2000. This controller may be the controller 15 of the processing process monitoring device 1000.

[0082] The channel distribution unit 53 receives data from the unit conversion unit 51B and the focus sensor information signal from the controller 15, and outputs channel waveform data to the channel waveform buffer 57 corresponding to the multiple channels assigned to each of the load sensors 108. The channel waveform data is distributed to the channel waveform buffer 57 of each channel load waveform storage unit 59 based on the focus sensor information signal. Therefore, the channel waveform buffer 57 buffers the latest waveform measured by the corresponding load sensor 108.

[0083] The channel-loaded waveform storage unit 59 includes a channel waveform buffer 57 and a channel waveform history buffer 58. The channel waveform history buffer 58 buffers the waveform history by receiving and storing channel waveform data from the channel waveform buffer 57. The channel-loaded waveform storage unit 59 may be provided in the storage device described above.

[0084] The channel of interest determination processing unit 62 refers to the channel load waveform storage unit 59 and focuses on the updated channel that has received the sensor of interest information signal from the controller 15. Using the waveform history and the latest waveform, the channel of interest determination processing unit 62 performs a state determination, mainly for the tool wear state described later, which requires detailed analysis, and outputs the channel determination result. For example, after performing a state determination, the channel of interest determination processing unit 62 may display the channel determination result on the display device 200. Alternatively, or in addition to the above, the channel of interest determination processing unit 62 may, based on the result of the state determination (for example, if it determines that the tool is significantly worn), send a stop signal to the controller (not shown) to stop the press machine 2000.

[0085] Figure 8 shows the waveform diagram used when detecting abnormalities based on the full load waveform. Figure 8 compares a normal waveform with an abnormal waveform that occurs when debris buildup occurs.

[0086] The normal waveform 31 is buffered in the full load waveform history buffer 55, etc. When a load increase occurs, the abnormal waveform 32 is buffered in the full load waveform buffer 54.

[0087] If a significant change occurs, such as a sludge buildup, that requires the press machine 2000 to be stopped, the waveform obtained by measuring the entire load applied to the load sensor 108 and digitizing it will show a large waveform change. Therefore, in such cases, the total load determination processing unit 60 can detect the presence or absence of an abnormal condition from the waveform stored in the total load waveform storage unit 56, without having to measure each of the load sensors 108 individually and make a determination based on the digitized waveforms.

[0088] Furthermore, determining whether or not there are anomalies in a waveform can be done using common anomaly detection methods, such as setting upper and lower limits for the waveform, calculating the cosine similarity between waveforms, or calculating similarity based on statistical data such as the Mahalanobis distance.

[0089] In mold maintenance, it is difficult to repeat the exact same conditions. For example, slight differences may occur in the length of each punch 101. If there are differences in the length of each punch 101, the total load waveform history buffer 55, which is obtained by summing the loads applied to all punches 101, will have some differences each time the mold is maintained. Therefore, in order to avoid determining an abnormal condition when it is actually normal, it is desirable for the data processing unit 16 to determine whether or not a sudden waveform change is occurring.

[0090] Figure 9 shows the waveform diagrams used when performing state detection using individual waveforms. Figures 9(a) and 9(b) compare the waveforms in the initial state when the tool is not worn and the waveforms in a state where some wear has progressed, such as after 100,000 punching cycles. Figures 9(a) and 9(b) also show the waveforms of different individual tools.

[0091] Waveforms 41a and 41b are channel waveforms buffered in the channel waveform buffer 57, measured focusing on load sensors 108a and 108b, respectively. These channel waveforms represent the initial state before tool wear. Similarly, waveforms 42a and 42b are channel waveforms buffered in the channel waveform buffer 57, measured focusing on load sensors 108a and 108b, respectively. These channel waveforms represent the state as tool wear progresses.

[0092] In progressive dies that perform complex machining, the multiple tools attached to the die 100 have different shapes. Although cemented carbide is commonly used as the material for the tools, the type of cemented carbide and design values ​​such as clearance may be intentionally different depending on the shape and the required machining accuracy. Therefore, since the rate of wear progresses differently depending on the shape and type of cemented carbide, the shape and manner of change of the waveform may differ even after the same 100,000 punching cycles.

[0093] Therefore, minute changes due to wear, such as the change from waveform 41a to waveform 42a, and the change from waveform 41b to waveform 42b, differ depending on the corresponding punch 101 and die 102. For this reason, the channel of interest determination processing unit 62 can perform state detection, such as detecting wear on each tool, by making a determination to detect minute changes appropriate for each. In addition, because the minute changes due to the progression of wear are minute, the channel of interest determination processing unit 62 does not need to make a determination in every cycle of the repeatedly operating press machine 2000, but only at a frequency that is sufficient for the channel of interest to complete one cycle. The processor resources required for state detection can be kept constant and do not increase in proportion to the number of load sensors 108.

[0094] Furthermore, even if slight differences occur each time the mold is maintained, such as a minute difference in the length of each punch 101, the channel load waveform storage unit 59 stores the waveform obtained by focusing on the load applied to each individual punch 101. Since this waveform is not affected by the influence of multiple tools, it is less susceptible to the influence of differences in maintenance.

[0095] Therefore, unlike the total load determination processing unit 60, it is desirable for the channel of interest determination processing unit 62 to perform state detection by quantitative waveform changes.

[0096] In this embodiment, a configuration using 10 load sensors is shown, but the number is not limited to 10. As long as the selector blocks 2 are connected in a daisy-chain configuration, it is possible to scalably handle both anomaly detection and state detection.

[0097] As configured as described above, the machining process monitoring device 1000 according to this disclosure can perform the same machining operation by repeating relatively short cycles, and even if the number of sensors for detecting the machining state is increased, the number of cables will not be proportional to the number of sensors. Similarly, the number of A / D converters and processor resources of the machining process monitoring device 1000 will not be proportional to the number of sensors. Therefore, the machining process monitoring device 1000 according to this disclosure can improve the ease of connection between sensors and maintain the rigidity of the mold. In this way, the machining process monitoring device 1000 according to this disclosure can perform both state detection, which estimates the details of the machining state, and anomaly detection, which determines whether or not there is an overall abnormality, while suppressing an increase in the number of cables, etc.

[0098] In this embodiment, the signal from the load sensor 108 is shown as being transmitted to the charge amplifier 12A or 12B via the overall load signal terminal 3A or the load of interest signal terminal 3B, but it is not limited to this. The signal from the load sensor 108 may also be transmitted to the charge amplifier 12A or 12B by a single signal line, without going through terminals 3A and 3B. The same applies to the signals from the digital selection signal and status signal terminal 125.

[0099] Furthermore, in this embodiment, the selector 1 has two output units, but is not limited to this, and may have three or more output units. For example, if the selector 1 has three output units, the data processing unit 16 can acquire the total load waveform and the waveforms related to the two load sensors 108 under consideration, and can determine whether or not there is an abnormality in the mold and detect its state. By increasing the number of load sensors 108 that can be considered simultaneously to two, it is possible to increase the number of state detections for tools that require more frequent state checks.

[0100] (Embodiment 2) Embodiment 2 differs from Embodiment 1 in that the signal line group 6 is composed of a multi-core cable, and the analog signal and digital signal are connected by a single multi-core cable. Unless otherwise specified, the configuration is the same as in Embodiment 1.

[0101] Figure 10 is a block diagram showing how multiple selector blocks 2 are connected by a single multi-core cable.

[0102] Selector block 71 contains one of the selector blocks 2. Selector block 71 includes an input connector 72 and an output connector 73. The input connector 72 and output connector 73 have terminals for sending and receiving a total load signal, a load of interest signal, and a digital selection signal transmitted via the signal line group 6. The input connector 72 and output connector 73 are connected by a multi-core cable 6A.

[0103] Generally, analog signals need to be shielded with a common signal such as ground to prevent them from being affected by noise from digital signals. However, in this embodiment, the digital signal changes only during the non-processing period when charge amplifiers 12A and 12B are in reset mode, and does not change during processing when charge amplifiers 12A and 12B are in operating mode. Therefore, noise from changes in the digital signal does not enter the analog signal, and even if analog and digital signals are mixed in a multi-core cable 6A, no problems due to digital noise will occur.

[0104] When performing mold maintenance, the mold is disassembled, and in some cases, the selector blocks 2, which are installed in multiple locations, and the cables between the selector blocks 2 are disconnected. However, if the selector blocks 71 are connected by only one cable, a multi-core cable 6A, the cable can be connected or disconnected simply by connecting or disconnecting the input connector 72 or output connector 73 to the multi-core cable 6A. This eliminates the need to connect and disconnect multiple cables, potentially improving maintainability.

[0105] (Embodiment 3) Embodiment 3 differs from Embodiment 2 in that each of the multiple selector blocks 71 is integrated with the corresponding load sensor 108. Unless otherwise specified, the configuration is the same as in Embodiment 2.

[0106] Figure 11 is a block diagram showing the connections between sensor blocks, each integrating a load sensor and a selector block.

[0107] The sensor block 74 contains the selector block 71 and the corresponding load sensors 108. The sensor block 74 incorporates and integrates load sensors to measure the load acting between one surface, surface 75, and the surface 76 opposite surface 75. By integrating them into the sensor block 74, the wiring connecting the selector block 71 and the corresponding load sensors 108 is eliminated, which can further improve maintainability compared to embodiments 1 and 2.

[0108] In this embodiment, all selector blocks 71 and their corresponding load sensors 108 are enclosed within the sensor block 74, but are not limited to this. For example, if the size of the load sensors differs due to the shape of the punch 101 or the measurement range, the integration by the sensor block 74 may be limited to only a portion of them.

[0109] (Embodiment 4) Embodiment 4 differs from Embodiment 3 in that some of the daisy-chain connected sensor blocks 74 contain sensors that measure strain, rather than sensors that measure load. Unless otherwise specified, the configuration is the same as in Embodiment 3.

[0110] Figure 12 shows the die 100 installed in the press machine 2000. Specifically, Figure 12 shows the die 100 and a part of the frame of the press machine 2000 in a way that shows where the sensors are installed. Frames 77L and 77R are part of the frame that supports the press machine 2000, and are part of the structure of the press machine 2000 that supports the upper die of the die 100, and also receive the punching load when the punching operation is performed.

[0111] In this embodiment, two of the sensor blocks 74 are replaced with sensor blocks 74S that incorporate strain sensors. The sensor blocks 74S are installed on frames 77L and 77R, respectively. Each sensor block 74S measures strain using a piezoelectric element. The sensor block 74S is similar to the load sensor in that it outputs an electric charge according to the amount of strain. Therefore, the sensor block 74S can measure the strains occurring in frames 77L and 77R as part of the sensor blocks 74 connected in the same daisy-chain configuration. The circuit that digitizes the analog signal shown in Figure 1 can be used to monitor changes in strain applied to the press machine 2000 without any modifications.

[0112] In this embodiment, we have described the case in which the load sensor contained in the sensor block 74 is replaced with a strain sensor, but similar effects can be obtained by replacing the load sensor 108 in Embodiments 1 and 2 with a strain sensor.

[0113] (Embodiment 5) Embodiment 5 differs from Embodiment 3 in that multiple sensor blocks 74 are enclosed within a single plate. Unless otherwise specified, the configuration is the same as in Embodiment 3.

[0114] Figure 13 shows the structure of the mold. Specifically, Figure 13 shows a state in which a single sensor plate 78 containing multiple sensor blocks 74 is incorporated into the mold.

[0115] The sensor plate 78 has been shaped to allow it to be incorporated into the mold 100, with areas for numerous mechanisms within the mold, such as bolts, guides, springs, and positioning guides, removed as needed.

[0116] Multiple sensor blocks 74P are installed on the sensor plate 78, corresponding to the punch 101, and are attached to the mold 100. The sensor block 74P has a structure in which the connectors that are no longer needed for inclusion in the sensor plate 78 have been removed, and there is no functional difference between them.

[0117] Furthermore, the end face of the sensor plate 78 is provided with input connector 72P and output connector 73P, which have the same functions as input connector 72 and output connector 73, respectively. Inside the sensor plate 78, all sensor blocks 74P are connected in a daisy-chain configuration between input connector 72 and output connector 73P by signal line group 6, as in Embodiment 1.

[0118] In this embodiment, during mold maintenance, only the attachment and removal of the plate is required, which can further improve maintainability compared to embodiments 1, 2, and 3.

[0119] (Embodiment 6) Embodiment 6 differs from Embodiments 1, 2, 3, 4, or 5 in that the data digitized by the A / D converter is transferred via serial data transfer before data processing. Unless otherwise specified, the configuration is the same as in Embodiments 1, 2, 3, 4, or 5.

[0120] Figure 14 is a block diagram showing a circuit that performs serial data transfer and data processing on the data digitized by an A / D converter in Figure 1.

[0121] The serial interface device 81A communicates with the serial interface device 82A by transferring data via the serial cable 83A. The serial interface device 81A receives data from the A / D converters 14A and 14B, gain control signals from the controller 15, and focus sensor information signals required by the data processing unit 16, and transmits them to the serial interface device 82A.

[0122] Furthermore, the serial interface device 82A can supply power. The serial interface device 82A supplies power to the serial interface device 81A and the circuit from the load sensor 108 to the serial interface device 81A.

[0123] Furthermore, the serial interface device 81A and the circuit from the load sensor 108 to the serial interface device 81A are installed inside the mold. The circuits related to the charge amplifiers 12A and 12B, the level adjustment amplifiers 13A and 13B, the A / D converters 14A and 14B, etc., generate heat due to power consumption. However, as already mentioned, these circuits only need to consist of two systems, not proportional to the number of load sensors 108, and the heat generation is kept low compared to conventional embodiments. Therefore, although these circuits generate heat, they can be installed inside or near the mold by devising their placement.

[0124] Furthermore, when raising or lowering the mold 100 from the press machine 2000, only the serial cable 83 needs to be disconnected, improving maintainability.

[0125] For serial communication, it is preferable to use USB (Universal Serial Bus) or PoE (Power over Ethernet), a type of LAN standard that also provides power.

[0126] (Embodiment 7)

[0127] Embodiment 7 differs from Embodiment 6 in that the data digitized by the A / D converter is transmitted to the data processing unit via wireless communication rather than serial data communication. Unless otherwise specified, the configuration is the same as in Embodiment 6.

[0128] Figure 15 is a block diagram showing a circuit that wirelessly transmits and processes data digitized by an A / D converter, compared to Figure 14. In the circuit shown in Figure 15, the serial interface devices 81A and 82A are replaced by wireless transceivers 81B and 82B, respectively, and the serial cable 83A is replaced by the antenna 83B of the wireless transceivers 81B and 82B. Power to the wireless transceiver 81B is supplied by a battery installed in the mold, or by wireless power transmission provided between the press machine 2000 and the mold 100.

[0129] Various devices, such as material feeding mechanisms and processing oil application systems, are installed around the press machine 2000 and the die 100. However, in this embodiment, no new cables are required to install the data processing unit 16, which not only improves maintenance compared to Embodiment 6, but also eliminates the need to run cables that would interfere with the equipment around the die.

[0130] (summary) As previously stated, the processing process monitoring device 1000 according to this disclosure can perform both state detection and abnormality detection in the processing process of a manufacturing device that performs cyclic processing that repeats the same operation. Furthermore, the processing process monitoring device 1000 is suitable for monitoring the state of a tool incorporated into a press machine 2000, where it is necessary to perform both state detection and abnormality detection by sensing the load.

[0131] Furthermore, the machining process monitoring device 1000 becomes more effective as the number of load sensors 108 installed on the manufacturing equipment increases. In other words, even if the number of sensors 108 increases, the machining process monitoring device 1000 only needs to connect nearby sensors 108 in a daisy-chain configuration, thus minimizing interference with components incorporated into the mold. In addition, the machining process monitoring device 1000 can be expanded without changing the hardware or software configuration, for example, by arranging interface devices that are connected in a daisy-chain configuration, which can connect to strain sensors installed outside the mold.

[0132] In addition, the processing monitoring device 1000 can bundle each wire into a single daisy-chain connection, thereby improving maintainability.

[0133] (Summary of characteristics) As is clear from the above description, this disclosure includes the following embodiments. In the following, reference numerals are enclosed in parentheses solely to indicate their correspondence with the embodiments.

[0134] (Aspect 1) A processing process monitoring device (1000) that monitors the processing process by a manufacturing apparatus (2000) comprises a plurality of sensors (108) attached to the manufacturing apparatus (2000), a plurality of selectors (1) provided in the same number as the plurality of sensors (108), each of which has one input unit (C) and a plurality of output units (A, B), and selectively outputs a signal input to the single input unit (C) from one of the plurality of output units (A, B), a plurality of signal lines (3Aa, 3Ba) connected to each of the plurality of output units (A, B), and a controller (15) that controls each of the plurality of selectors (1) to selectively connect the input unit (C) to one of the plurality of output units (A, B) and selectively disconnect the input unit (C) from the remaining plurality of output units (A, B). According to this embodiment, even if the number of sensors increases, the processing monitoring device (1000) can suppress an increase in the number of system configuration elements, such as the number of cables, and acquire signals output by each sensor (108) with the same system configuration.

[0135] (Aspect 2) In the processing process monitoring device (1000) of Aspect 1, each of the plurality of sensors (108) may measure load. According to this aspect, the processing process monitoring device (1000) can acquire signals output from the sensors (108) based on the detected load.

[0136] (Aspect 3) In the machining process monitoring device (1000) of aspect 2, each of the plurality of sensors (108) may be equipped with a piezoelectric element that generates a voltage representing the load. According to this aspect, the machining process monitoring device (1000) can acquire the charge output from the sensors (108) as a signal.

[0137] (Aspect 4) In any one of the machining process monitoring devices (1000) from aspects 1 to 3, each of the multiple sensors (108) may measure strain. According to this aspect, the machining process monitoring device (1000) can acquire signals output from the sensors (108) based on the detected strain.

[0138] (Aspect 5) In any one of the machining process monitoring devices (1000) from aspects 1 to 4, the controller (15) may control the multiple selectors (1) by transmitting signals to registers (FF) corresponding to each of the multiple selectors (1). According to this aspect, the machining process monitoring device (1000) can acquire signals output from the controlled sensors.

[0139] (Aspect 6) In the machining process monitoring device (1000) of Aspect 5, the registers (FF) may be daisy-chained to perform a shift operation. According to this aspect, even if the number of sensors is increased, the machining process monitoring device (1000) can suppress an increase in the number of elements in the system configuration and acquire the signals output by each sensor with the same system configuration.

[0140] (Aspect 7) In the processing process monitoring device (1000) of aspect 6, the multiple signal lines (3Aa, 3Ba) may be arranged within the device along the wiring (5a) that constitutes the daisy-chain connection of the registers (FF). According to this aspect, even if the number of sensors is increased, the processing process monitoring device (1000) can suppress the expansion of the area where the system configuration elements are arranged and can minimize the impact on the manufacturing equipment due to the arrangement of the signal lines.

[0141] (Aspect 8) In the processing process monitoring device (1000) of Aspect 7, the multiple signal lines and the wiring (5a) that constitutes the daisy-chain connection of the registers (FF) may be arranged in the device as a multi-core cable (6A). According to this aspect, even if the number of sensors in the processing process monitoring device (1000) is increased, the expansion of the area where the system configuration elements are arranged can be suppressed, and the impact of the arrangement of signal lines on the manufacturing equipment can be suppressed. In addition, the maintainability of the processing process monitoring device (1000) can be improved.

[0142] (Aspect 9) The processing process monitoring device (1000) of aspect 7 includes a sensor plate (78), the sensor plate (78) may contain a plurality of selectors (1), a plurality of signal lines (3Aa, 3Ba) connecting the plurality of selectors (1), and wiring (5a) that constitutes a daisy-chain connection of registers (FF). According to this aspect, even if the number of sensors in the processing process monitoring device (1000) is increased, the expansion of the area for arranging the system components can be suppressed, and the impact of the signal line arrangement on the manufacturing equipment can be suppressed. In addition, the maintainability of the processing process monitoring device (1000) can be improved.

[0143] (Aspect 10) In the machining process monitoring device (1000) of aspect 9, the sensor plate (78) may contain at least a portion of the plurality of sensors (108). According to this aspect, the maintainability of the machining process monitoring device (1000) can be improved.

[0144] (Aspect 11) In any one of the processing process monitoring devices (1000) from aspects 1 to 10, each of the multiple selectors (1) may be configured with a semiconductor switch. According to this aspect, the durability of the processing process monitoring device (1000) can be improved.

[0145] (Aspect 12) In any one of the machining process monitoring devices (1000) from aspects 6 to 11, the manufacturing device (2000) performs cycle machining, which involves repeating the same operation, and the controller (15) may control the shift operation of the register (FF) during the non-machining period between cycles in the cycle machining. According to this aspect, even if the number of sensors increases, the machining process monitoring device (1000) can suppress an increase in the number of elements in the system configuration and acquire the signals output by each sensor with the same system configuration.

[0146] (Aspect 13) In the machining process monitoring device (1000) of aspect 12, the number of output units of the plurality of selectors (1) and the number of plurality of signal lines are 2, and each of the plurality of selectors has a first output unit (B) connected to a first signal line (3Ba) and a second output unit (A) connected to a second signal line (3Aa), and the controller (15) may select only one of the plurality of selectors (1) and control the plurality of selectors (1) so that the input unit (C) of the selected selector (1) is connected to the first output unit (B), and the input unit (C) of the other selectors (1) is connected to the second output unit (A). According to this aspect, even if the number of sensors increases, the machining process monitoring device (1000) can suppress an increase in the number of elements of the system configuration and acquire signals output by each sensor with the same system configuration.

[0147] (Aspect 14) The machining process monitoring device (1000) of aspect 12 or aspect 13 includes charge amplifiers (12A, 12B) corresponding to each of the multiple signal lines (3Aa, 3Ba), and the charge amplifiers (12A, 12B) may be controlled by a controller (15) to discharge the charge of the capacitive element (C0) when not machining and to charge the charge when machining. According to this aspect, the machining process monitoring device (1000) can acquire the signal output from each sensor for each machining operation.

[0148] (Aspect 15) The machining process monitoring device (1000) of aspect 12 or aspect 13 comprises charge amplifiers (12A, 12B) corresponding to each of a plurality of signal lines (3Aa, 3Ba), and amplifiers (13A, 13B) that receive and amplify the output of the charge amplifiers (12A, 12B). The charge amplifiers (12A, 12B) are set to discharge the charge of capacitive elements when not machining and charge the charge when machining, based on control signals received from the controller (15). The amplification factor of the amplifiers (13A, 13B) may be controlled by the controller (15). According to this aspect, the machining process monitoring device (1000) can acquire the signal output from each sensor for each machining operation.

[0149] (Aspect 16) A machining process monitoring device (1000) according to any one of aspects 1 to 15 comprises a plurality of A / D converters (14A, 14B) corresponding to a plurality of signal lines (3Aa, 3Ba), and a data processing unit (16) that receives the outputs of the plurality of A / D converters (14A, 14B). Each of the plurality of A / D converters (14A, 14B) may convert the analog signal propagating through the corresponding signal line (3Aa, 3Ba) into a digital signal. According to this aspect, the machining process monitoring device (1000) can acquire signals output from each sensor for each machining process and perform data processing.

[0150] (Aspect 17) The machining process monitoring device (1000) of aspect 16 includes a first serial interface device (81A) that receives signals from a plurality of A / D converters (14A, 14B) and a controller (15) and transmits and receives data, and a second serial interface device (82A) that transmits and receives data with a data processing unit (16). The data may be transferred between the first serial interface device (81A) and the second serial interface device (82A) by serial communication. According to this aspect, the machining process monitoring device (1000) can have some of its elements placed inside the mold. Furthermore, the maintainability of the machining process monitoring device (1000) can be improved.

[0151] (Aspect 18) In the machining process monitoring device (1000) of aspect 17, the first serial interface device (81A) may receive power from a cable (83A) used for serial communication and supply power to the circuits from the multiple sensors (108) to the first serial interface device (81A). According to this aspect, the maintainability of the machining process monitoring device (1000) can be improved.

[0152] (Aspect 19) In the processing process monitoring device (1000) of aspect 18, the circuit from the multiple sensors (108) to the first serial interface device (81A) may be installed in the mold (100) attached to the press machine (2000). According to this aspect, some of the elements of the processing process monitoring device (1000) can be placed inside the mold. In addition, the maintainability of the processing process monitoring device (1000) may be improved.

[0153] (Aspect 20) The machining process monitoring device (1000) of aspect 16 includes a first wireless transceiver unit (81B) that receives signals from a plurality of A / D converters (14A, 14B) and a controller (15) and transmits and receives data, and a second wireless transceiver unit (82B) that transmits and receives data with a data processing unit (16). The data may be transmitted wirelessly between the first wireless transceiver unit (81B) and the second wireless transceiver unit (82B). According to this aspect, a part of the machining process monitoring device (1000) can be placed inside the mold. In addition, the maintainability of the machining process monitoring device (1000) may be improved.

[0154] (Aspect 21) In the processing process monitoring device (1000) of aspect 20, the circuit from the multiple sensors (108) to the first wireless transceiver unit (81B) may be installed in a mold (100) attached to a press machine (2000). According to this aspect, some of the elements can be placed inside the mold. In addition, the maintainability of the processing process monitoring device (1000) may be improved.

[0155] (Aspect 22) The processing process monitoring device (1000) of Aspect 2 or Aspect 3 comprises a plurality of A / D converters (14A, 14B) corresponding to each of a plurality of signal lines (3Aa, 3Ba), and a data processing unit (16) that receives the output of the plurality of A / D converters (14A, 14B), each of the plurality of sensors (108) measures the load, each of the plurality of A / D converters (14A, 14B) converts the analog signal propagating through the corresponding signal line (3Aa, 3Ba) into a digital signal, and the data processing unit (16) receives all of the plurality The system may perform a total load determination process, which involves summing the load values ​​from the sensors (108) to obtain waveform data, accumulating the history of waveforms in a cycle of repeated operations, and performing a determination process; and a channel load determination process, which, when one of the multiple selectors (1) is selected, acquires waveform data of load values ​​from only the corresponding sensor (108) among the multiple sensors (108), stores it as waveform data for the channel corresponding to the selected selector (1), and accumulates the history of waveforms for the corresponding channel to perform a determination process. According to this embodiment, the machining process monitoring device (1000) can acquire signals output from each sensor for each machining operation, and perform a determination of whether there is an abnormality based on the signals from all sensors, and a determination of the state of the device based on the signal from the selected sensor.

[0156] (Aspect 23) In the machining process monitoring device (1000) of aspect 22, the channel load determination process may be performed in a different manner from the total load determination process. According to this aspect, the machining process monitoring device (1000) can acquire signals output from each sensor for each machining operation and perform a determination of whether or not there is an abnormality based on the signals from all sensors, and a determination of the state of the device based on the signals from the selected sensors.

[0157] (Aspect 24) Any one of the processing process monitoring devices (1000) from aspects 1 to 23 may be attached to a press machine (2000). According to this aspect, the processing process monitoring device (1000) can detect abnormalities in each punch of the press machine. [Industrial applicability]

[0158] According to this disclosure, in a machining process that involves repeating the same machining operation in relatively short cycles, even if the number of sensors for detecting the machining state is increased, it is possible to provide a machining process monitoring device that improves the ease of connection between sensors, maintains the rigidity of the mold, and performs both state detection to estimate the details of the machining state and anomaly detection to determine whether or not there is an overall anomaly, without increasing the number of cables, A / D converters, and processor resources proportionally to the number of sensors. [Explanation of symbols]

[0159] 1000 Process monitoring device 2000 Press Machine 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i, 1j Selector 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h, 2i, 2j Selector Block 3A Total Load Signal Terminal 3B Target load signal terminal 5 Digital Select Signal Terminal 6. Signal line group 12A, 12B Charge Amplifier 13A, 13B Level Adjustment Amplifier 14A, 14B A / D converter 15 Controllers 16 Data Processing Unit A and B output terminals C Sensor signal terminal Sa selector control circuit CHAININ Digital Select Signal Input Terminal CHAINOUT Digital Select Signal Output Terminal SEL Analog Selector SWA, SWB switches INV Inverter DINt Data Input Terminal CKINt Clock Input Terminal DOUTt Data output terminal CKOUTt Clock output terminal FF Flip-Flop D Data input terminal Q Data output terminal CK Clock Input Terminal BUFD, BUFCK buffer 31 Normal waveform 32 Abnormal waveform 41a, 41b, 42a, 42b waveform 51A, 51B Unit Conversion Section 52 Addition section 53 Channel distribution section 54 Full Load Waveform Buffer 55. Full load waveform history buffer 56 Full load waveform storage section 57-channel waveform buffer 58-channel waveform history buffer 59 Channel Loaded Waveform Storage Unit 60. Full load determination processing unit 62. Target channel determination processing unit 71 Selector Block 72, 72P input connector 73, 73P output connector 6A multi-core cable 74, 74S, 74P Sensor Blocks 75, 75 sides 77L, 77R frame 78 Sensor Plate 81A, 82A Serial Interface Device 81B, 82B Wireless Transceiver Unit 83A Serial Cable 83B antenna 100 molds 101 Punch 102 Die 103 Stripper Plate 104 Punch Plate 105 Die Plate 106 Die Backing Plate 107 Punch backing plate 108, 108a, 108b, 108c, 108d, 108e, 108f, 108g, 108h, 108i, 108j Load Sensors 111 Work material 121, 121a, 121b, 121c, 121d, 121e, 121f, 121g, 121h, 121i, 121j Charge Amplifier 122, 122a, 122b, 122c, 122d, 122e, 122f, 122g, 122h, 122i, 122j Level Adjustment Amplifier 123, 123a, 123b, 123c, 123d, 123e, 123f, 123g, 123h, 123i, 123j A / D converter 124 Controllers 125 Status signal terminal 126 Data Processing Unit 200 Display device IN input terminal R Reset input terminal OUT output terminal CIN charge input signal COM Common Signal C0 Capacitive element SW0 Reset Switch RST Reset Input Terminal

Claims

1. A processing process monitoring device that monitors the processing process by manufacturing equipment, Multiple sensors attached to the manufacturing apparatus, A plurality of selectors, the same number as the number of sensors, each of the plurality of selectors having one input and multiple output units, and selectively outputting a signal input to the one input unit from one of the multiple output units, Each of them is connected to a plurality of signal lines which are connected to each of the plurality of output units, A controller that controls each of the plurality of selectors to selectively connect the input unit to one of the plurality of output units, and selectively disconnect the input unit to the remaining output units, A processing step monitoring device characterized by comprising the following features.

2. Each of the aforementioned multiple sensors measures the load. The processing process monitoring device according to feature 1.

3. Each of the aforementioned multiple sensors is equipped with a piezoelectric element that generates a voltage representing the load. The processing process monitoring device according to feature 2.

4. Each of the aforementioned multiple sensors measures strain. The processing process monitoring device according to feature 1.

5. The controller controls the plurality of selectors by transmitting signals to the registers corresponding to each of the plurality of selectors. The processing process monitoring device according to feature 1.

6. The aforementioned registers are daisy-chained to perform shift operations. The processing process monitoring device according to feature 5.

7. The aforementioned plurality of signal lines are arranged within the device along the wiring that constitutes the daisy-chain connection of the registers. The processing process monitoring device according to feature 6.

8. The aforementioned plurality of signal lines and the wiring that constitutes the daisy-chain connection of the registers are arranged within the device as a multi-core cable. The processing process monitoring device according to feature 7.

9. The aforementioned processing step monitoring device is Equipped with a sensor plate, The sensor plate contains the plurality of selectors, the plurality of signal lines connecting the plurality of selectors, and the wiring that constitutes a daisy-chain connection of the registers. The processing process monitoring device according to feature 7.

10. The sensor plate contains at least a portion of the plurality of sensors. The processing process monitoring device according to feature 9.

11. Each of the aforementioned selectors is composed of a semiconductor switch. The processing process monitoring device according to feature 1.

12. The aforementioned manufacturing apparatus performs cyclical processing, repeating the same operation. The controller controls the shift operation of the register during the non-machining period between cycles in the cycle machining process. The processing process monitoring device according to feature 6.

13. The number of output units for the plurality of selectors and the number of signal lines are 2. Each of the plurality of selectors has a first output unit connected to a first signal line and a second output unit connected to a second signal line. The controller selects only one of the plurality of selectors and controls the plurality of selectors such that the input and first output of the selected selector are connected, and the input and second output of the other selectors are connected. The processing process monitoring device according to feature 12.

14. The aforementioned processing step monitoring device is Each of the aforementioned multiple signal lines is equipped with a charge amplifier corresponding to it, The charge amplifier is controlled by the controller to discharge the charge of the capacitive element when not processing and to charge the element when processing is in progress. The processing process monitoring device according to feature 12.

15. The aforementioned processing step monitoring device is The system comprises a charge amplifier corresponding to each of the aforementioned plurality of signal lines, and an amplifier that receives and amplifies the output of the charge amplifier, The charge amplifier is configured to discharge the charge of the capacitive element during non-processing and charge it during processing, based on the control signal received from the controller. The amplification factor of the amplifier is controlled by the controller. The processing process monitoring device according to feature 12.

16. The aforementioned processing step monitoring device is A plurality of A / D converters corresponding to each of the plurality of signal lines, The system comprises a data processing unit that receives the output of the plurality of A / D converters, Each of the aforementioned A / D converters converts the analog signal propagating through the corresponding signal line into a digital signal. A processing process monitoring device according to any one of claims 1 to 15.

17. The aforementioned processing step monitoring device is A first serial interface device that receives signals from the aforementioned multiple A / D converters and the controller and transmits and receives data, The system comprises the data processing unit and a second serial interface device for transmitting and receiving the data, The aforementioned data is transferred between the first serial interface device and the second serial interface device by serial communication. The processing process monitoring device according to feature 16.

18. The first serial interface device receives power from the cable used for serial communication and supplies power to the circuit from the plurality of sensors to the first serial interface device. The processing process monitoring device according to feature 17.

19. The aforementioned processing step monitoring device is The circuit from the multiple sensors to the first serial interface device is installed in a mold attached to a press machine. The processing process monitoring device according to feature 18.

20. The aforementioned processing step monitoring device is A first wireless transceiver unit that receives signals from the plurality of A / D converters and the controller and transmits and receives data, The system comprises the data processing unit and a second wireless transmission / reception unit that transmits and receives the data, The aforementioned data is transmitted wirelessly between the first wireless transceiver and the second wireless transceiver. The processing process monitoring device according to feature 16.

21. The aforementioned processing step monitoring device is The circuit from the multiple sensors to the first wireless transceiver is installed in a mold attached to a press machine. The processing process monitoring device according to feature 20.

22. The aforementioned processing step monitoring device is A plurality of A / D converters corresponding to each of the plurality of signal lines, The system comprises a data processing unit that receives the output of the plurality of A / D converters, Each of the aforementioned multiple sensors measures the load, Each of the aforementioned A / D converters converts an analog signal propagating through a corresponding signal line into a digital signal. The aforementioned data processing unit A total load determination process is performed by aggregating the load values ​​detected by all of the aforementioned sensors to obtain waveform data, accumulating the waveform history in a cycle of machining where the same operation is repeated, and performing a determination process. When one of the multiple selectors is selected, a channel load determination process is performed which acquires waveform data of the load value detected by the sensor corresponding to the selected selector from among the multiple sensors, stores it as waveform data of the channel corresponding to the selected selector, accumulates the waveform history of the corresponding channel, and performs a determination process. The processing process monitoring device according to claim 1, characterized by performing the following:

23. The channel load determination process is performed using a method different from the total load determination process. The processing process monitoring device according to feature 22.

24. The aforementioned processing monitoring device is attached to the press machine. The processing process monitoring device according to feature 1.

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