Pressing device and resin sealing device

Abstract

To provide a press device and a resin encapsulation device capable of adjusting a tilt of a movable platen.SOLUTION: A press device includes a link mechanism 280 that connects a drive unit 260 and a movable platen 258. The drive unit 260 is configured to be able to individually control a plurality of drive mechanisms 262, and the link mechanism 280 is configured to connect the movable platen 258 to the drive mechanisms 262 so that the movable platen 258 can tilt three-dimensionally within a predetermined range.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a press device and a resin sealing device.

Background Art

[0002] As an example of a resin sealing device and a resin sealing method for sealing a work in which an electronic component is mounted on a base material with a sealing resin and processing it into a molded product, those using a transfer molding method or a compression molding method are known.

[0003] The transfer molding method is provided with a pot for supplying a predetermined amount of resin to a pair of sealing regions (cavities) provided in a sealing mold configured with an upper mold and a lower mold, and the work is placed at a position corresponding to each of the sealing regions and clamped with the upper mold and the lower mold, and it is a technique for resin sealing by an operation of pouring resin from the pot into the cavity. Further, the compression molding method is a technique for resin sealing by supplying a predetermined amount of sealing resin to a sealing region (cavity) provided in a sealing mold configured with an upper mold and a lower mold, placing a work in the sealing region, and clamping with the upper mold and the lower mold (see Patent Document 1: Japanese Unexamined Patent Application Publication No. 2023-176518).

[0004] In any method, a press device that closes the mold of the sealing mold to perform resin sealing of the work is used. In the press device, the sealing mold is fixed to a pair of movable platens and a fixed platen, and a configuration in which a mold closing force (pressing force) is applied to the sealing mold by driving (pushing) the movable platen toward the fixed platen by a driving device is common.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] To reduce the TTV (Total Thickness Variation) of a molded product, it is necessary to precisely adjust the distance between the fixed platen and the movable platen during mold closing so that the upper and lower dies are parallel. Therefore, there is a demand for adjusting the tilt of the movable platen in press machines. In this case, the movable platen needs to be connected to a drive device (drive shaft) so that it can tilt in three dimensions (X (left and right), Y (front and back), and Z (up and down)). [Means for solving the problem]

[0007] The present invention has been made in view of the above circumstances, and aims to provide a press device and a resin sealing device that can adjust the tilt of a movable platen.

[0008] The present invention solves the above problem by a solution described below as one embodiment.

[0009] A press apparatus according to one embodiment comprises a base, tie bars erected on the base, a fixed platen fixed to the tie bars, a movable platen that moves vertically, a drive unit that drives the movable platen, and a link mechanism that connects the drive unit and the movable platen, wherein the drive unit is configured to individually control a plurality of drive mechanisms, and the link mechanism is The system comprises a bearing unit that supports the movable platen with a self-aligning bearing, a pin attached to the bearing unit, a first connecting member that connects the drive mechanism and the pin, and a second connecting member that connects the movable platen and the pin. The requirement is that the movable platen is connected to the drive mechanism so that it can be tilted three-dimensionally within a predetermined range.

[0011] Furthermore, it is preferable that the drive unit is composed of three drive mechanisms.

[0012] Furthermore, the resin sealing apparatus according to one embodiment is required to include the aforementioned press apparatus. [Effects of the Invention]

[0013] According to the press apparatus and resin sealing apparatus of the present invention, the tilt of the movable platen can be adjusted. Therefore, high-precision (small TTV) molded products can be processed. [Brief explanation of the drawing]

[0014] [Figure 1] This is a plan view showing an example of a resin encapsulation apparatus according to an embodiment of the present invention. [Figure 2] This is a side view showing an example of a press device for a resin sealing apparatus according to an embodiment of the present invention. [Figure 3] This is a cross-sectional view taken along line III-III in Figure 2. [Figure 4] This is a schematic diagram showing a magnified portion of the cross-section of line IV-IV in Figure 2. [Figure 5] This is an enlarged view of section V in Figure 2. [Modes for carrying out the invention]

[0015] Embodiments of the present invention will be described in detail below with reference to the drawings. Figure 1 is a plan view (schematic diagram) showing an example of a resin encapsulation device 1 according to this embodiment. For convenience of explanation, arrows in the figure indicate the left-right direction (X direction), front-back direction (Y direction), and up-down direction (Z direction) of the resin encapsulation device 1. In addition, in all figures used to explain each embodiment, components having the same function are denoted by the same reference numeral, and repeated explanations may be omitted.

[0016] The resin sealing apparatus 1 according to this embodiment is a device that performs resin sealing of a workpiece (molded product) using a sealing mold 202 comprising an upper mold 204 and a lower mold 206. Hereinafter, the resin sealing apparatus 1 will be described using as an example a compression molding apparatus in which the workpiece is held by a workpiece holding section 205 provided in the lower mold 206, and the cavity 208 (including a part of the mold surface) provided in the upper mold 204 in a corresponding arrangement is covered with a release film (hereinafter sometimes simply referred to as "film"), and the upper mold 204 and lower mold 206 are clamped to seal the workpiece with sealing resin. However, it is not limited to this.

[0017] First, the workpiece to be molded has a configuration in which electronic components are mounted on a base material (both are not shown). More specifically, examples of the base material include plate-like members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, wafers, etc. Examples of the electronic components include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, spacers, coil sheets, etc. Note that the shape of the base material is rectangular (strip-shaped), square, circular, etc. Also, the number of electronic components mounted on one base material is set to one or a plurality (for example, in a matrix form, etc.).

[0018] Examples of methods for mounting electronic components on the base material include methods such as wire bonding mounting and flip chip mounting. Alternatively, in the case of a configuration in which the base material (glass or metal carrier plate) is peeled off from the molded product after resin encapsulation, there is also a method of attaching the electronic components using an adhesive tape having thermal peelability or an ultraviolet curable resin that cures by ultraviolet irradiation.

[0019] On the other hand, as an example of the encapsulation resin, a granular thermosetting resin (for example, a filler-containing epoxy resin, etc.) is used. Note that the encapsulation resin is not limited to the above granular resin, and may be a powder resin (powdered resin), crushed resin, solid resin, liquid resin, or a resin combined with a plurality of them, and may also be a resin other than an epoxy-based thermosetting resin.

[0020] Also, as an example of the film, a film material excellent in heat resistance, ease of peeling, flexibility, and stretchability, for example, PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, etc. are preferably used.

[0021] <000009\2>Next, the outline of the resin sealing device 1 according to the present embodiment will be described. As shown in FIG. 1, the resin sealing device 1 mainly includes a supply unit 100A that supplies a workpiece and a sealing resin, a press unit 100B that resin-seals the workpiece with the sealing resin and processes it into a molded product, and a storage unit 100C that stores the molded product. As an example, along the X direction in FIG. 1, the supply unit 100A, the press unit 100B, and the storage unit 100C are arranged in this order. However, it is not limited to the above configuration, and the device configuration within the unit, the number of units (particularly the number of press units), the arrangement order of the units, etc. can be changed. Also, a configuration including units other than the above can be adopted (all not shown).

[0022] Further, in the resin sealing device 1, a guide rail 300 is linearly provided across the units, and a transfer device (first loader) 302 that transfers the workpiece and the sealing resin, and a transfer device (second loader) 304 that transfers the molded product are provided so as to be movable between predetermined units along the guide rail 300. However, it is not limited to the above configuration, and a configuration including a common (one) transfer device (loader) that transfers the workpiece and the molded product may be adopted (not shown). Also, the transfer device may be configured to include a robot hand or the like instead of a loader.

[0023] Further, in the resin sealing device 1, a control unit 150 that controls the operation of each mechanism in each unit is arranged in the supply unit 100A (it may be arranged in other units).

[0024] (Supply Unit) The supply unit 100A includes a workpiece supply magazine 102 that stores a plurality of workpieces. Known stack magazines, slit magazines, etc. are used for the workpiece supply magazine 102. Incidentally, a workpiece table (not shown) for placing the workpiece taken out from the workpiece supply magazine 102 may be provided.

[0025] Furthermore, the supply unit 100A (or other units) is equipped with a resin supply mechanism 104 consisting of a hopper, a feeder, etc. In this embodiment, the resin supply mechanism 104 supplies sealing resin to the upper surface of a workpiece taken out of the workpiece supply magazine 102. The workpiece on which the sealing resin has been supplied (placed) is held by the first loader 302 and transported from the supply unit 100A to the press unit 100B and set in a predetermined position on the sealing mold 202.

[0026] (Storage unit) The storage unit 100C is equipped with a storage magazine 112 that stores multiple molded products. Known stack magazines, slit magazines, etc., can be used for the storage magazine 112. Molded products formed in the press unit 100B are held by the second loader 304 and transported from the press unit 100B to the storage unit 100C and stored in the storage magazine 112.

[0027] (Press Unit) The press unit 100B includes a sealing die 202 having a pair of dies that open and close (for example, an assembly of multiple die blocks, die plates, and other components made of alloy tool steel). It also includes a press device 250 that drives the sealing die 202 to open and close to seal the workpiece with resin. As an example, the unit is configured to have one press device 250, but it may also be configured to have multiple units (not shown).

[0028] The sealing die 202 comprises an upper die 204 and a lower die 206 as a pair of dies positioned between a pair of platens 256 and 258 in the press machine 250. The upper die 204 is assembled to the upper platen 256 in the vertical direction, and a cavity 208 is provided on the lower surface of the upper die 204 (the surface facing the lower die 206). The lower die 206 is assembled to the lower platen 258, and a workpiece holding section 205 is provided on the upper surface of the lower die 206 (the surface facing the upper die 204) to hold the workpiece at a predetermined position. The workpiece transported from the supply unit 100A is held in the workpiece holding section 205 of the lower die 206, and is sealed with sealing resin and formed into a molded product by a clamping operation between the upper die 204 and the lower die 206.

[0029] Furthermore, in this embodiment, as an example, a film supply mechanism (not shown) is provided for transporting (supplying) a roll of film into the sealing mold 202. Depending on the configuration of the workpiece, the film may be used in strip form instead of a roll.

[0030] Next, the press device 250 will be described in detail. Figure 2 is a side view of the press device 250. Figure 3 is a cross-sectional view taken along line III-III in Figure 2. Figure 4 is a schematic diagram showing an enlarged portion of the cross-section taken along line IV-IV in Figure 2. Figure 5 is an enlarged view of section V in Figure 2.

[0031] The press device 250 comprises a base 252, a plurality of tie bars 254 erected on the base 252, a platen 256 mounted on the plurality of tie bars 254, a platen 258 positioned opposite the platen 256, and a drive unit 260 for driving the platen 258. In this embodiment, the upper platen 256 in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 254), and the lower platen 258 is set as a movable platen (a platen that moves in the axial direction (up and down direction) of the tie bars 254). However, it is not limited to this, and the top and bottom may be reversed, that is, the upper side may be a movable platen and the lower side a fixed platen (not shown).

[0032] The drive unit 260 is composed of a plurality of drive mechanisms 262. Each drive mechanism 262 includes a drive source 264 individually controlled by the control unit 150, a nut 268 rotatably mounted on the base 252 via a bearing 266, and a ball screw 270 screwed onto the nut 268 and protruding from the base 252 so as to be parallel to the axial direction (vertical direction) of the tie bar 254. A pulley 272 is attached to the drive source 264, and a pulley 274 is attached to the nut 268, with a belt (not shown) stretched between the pulleys 272 and 274. When the drive source 264 is activated, the driving force (rotation) is transmitted to the nut 268 via the belt, causing the nut 268 to rotate. As the nut 268 rotates, the ball screw 270 moves linearly in the axial direction (vertical direction) of the tie bar 254. In other words, the drive unit 260 is configured to drive the movable platen 258 in multiple axes by individually controlling the height of a plurality of ball screws 270 connected in parallel to the movable platen 258.

[0033] In this embodiment, the drive unit 260 is composed of three drive mechanisms 262A, 262B, and 262C, and the plane direction of the movable platen 258 can be defined by supporting the movable platen 258 at three points and controlling the height at each point. It is also possible to support the movable platen 258 at four or more points and control the plane direction of the movable platen 258 by controlling the height at each point. However, in the case of three-point support, it is easy to control the tilt of the movable platen 258, and there is an advantage in that the number of parts can be reduced, making the press device 250 lighter and less expensive.

[0034] In conventional press machines, in order to precisely adjust the distance between the fixed platen and the movable platen when closing the die so that the upper and lower dies are parallel, a configuration is employed in which the movable platen can slide along the tie bar, that is, a configuration in which the movable platen is guided by the tie bar. Consequently, the clearance between the movable platen and the tie bar is minimal, making it almost impossible (or difficult) to adjust the tilt of the movable platen. In contrast, with the drive unit 260 according to this embodiment, the movable platen 258 can be driven with high precision, so a configuration in which the movable platen 258 is not guided by the tie bar 254 can be realized. Furthermore, by using a servo motor (not shown) as the drive source 264, the movable platen 258 can be driven with extremely high precision.

[0035] Furthermore, the press device 250 is equipped with a plurality of link mechanisms 280 (the number corresponding to each drive mechanism 262) that connect each drive mechanism 262 (ball screw 270) of the drive unit 260 to the movable platen 258. Each link mechanism 280 includes a bearing unit 282 that supports the movable platen 258, a pin (rotating shaft) 284 attached to the bearing unit 282, a first link member 286 that connects the ball screw 270 and the pin 284, and a second link member 288 that connects the movable platen 258 and the pin 284. In this embodiment, the bearing unit 282 is configured by fitting a case 282B onto a self-aligning roller bearing 282A. The pin 284 is provided so as to be perpendicular to the axial direction of the tie bar 254. The first link member 286 is a U-shaped member in cross-section having a bottom portion 286A and two side walls 286B, and through holes 286b are formed in the two side walls 286B through which a pin 284 is inserted. The second link member 288 is a plate-shaped member with a notch 288a formed therein into which a pin 284 is fitted. In other words, each link mechanism 280 is configured such that a bearing unit 282 is positioned inside the first link member 286, and a second link member 288 is positioned outside the first link member 286, with a pin 284 passing through the hole 282a of the bearing unit 282 (self-aligning roller bearing 282A), the through holes 286b in the two side walls 286B of the first link member 286, and the notch 288a of the second link member 288.

[0036] According to this, the first link member 286 restricts the rotation of the ball screw 270, while the bearing unit 282 allows the tilt of the movable platen 258 (specifically, the circumferential direction of the pin 284 (arrow A) and the tilt in all directions within the allowable alignment angle θ of the self-aligning roller bearing 282A). Therefore, the movable platen 258 can be connected to each drive mechanism 262 so that it can follow the ball screw 270 set at different heights, that is, so that the movable platen 258 can tilt three-dimensionally (in the three axis directions of X (left and right), Y (front and back), and Z (up and down)) within a predetermined range. Furthermore, by reducing the number of parts and minimizing the gaps between each part, the transmission error of the driving force can be suppressed, allowing the movable platen 258 to be driven with high precision, and the press device 250 can be made lighter.

[0037] The press apparatus 250 according to this embodiment, by having the above configuration, allows for adjustment of the tilt of the movable platen 258. This allows for adjustment of the tilt of the movable platen 258, and consequently the parallelism between the upper die 204 and the lower die 206, in the process of adjusting the molding after the step of assembling the sealing die 202 to the fixed platen 256 and the movable platen 258 and performing a test press, according to the results. Therefore, it is possible to process molded products with high precision (small TTV). In addition, the number of repetitions between the test press process and the adjustment process can be reduced, significantly shortening the lead time.

[0038] As an example, the press device 250 may be configured to include tilt detection means (not shown) for detecting the tilt state of the movable platen 258. The tilt detection means is connected to the control unit 150, which individually controls each drive source 264 based on the signal output from the tilt detection means. This makes it possible to detect the tilt state of the movable platen 258 and adjust the tilt of the movable platen 258 during the mold closing process in which the sealing die 202 is closed (however, the tilt state may be detected at all times, or the tilt may be adjusted during processes other than the mold closing process). The tilt detection means may include multiple sets of linear scales and measuring probes for measuring the amount of drive of the movable platen 258, or load sensors for measuring the load distribution of the movable platen 258 (none of which are shown).

[0039] As described above, the press apparatus and resin sealing apparatus according to the present invention allow for adjustment of the tilt of the movable platen. Therefore, high-precision (small TTV) molded products can be processed.

[0040] In this embodiment, the press apparatus 250 was described using as an example a case in which a sealing die 202 for a resin sealing apparatus using a compression molding method (with a cavity 208 in the upper die 204) is attached. However, it is not limited to this, and the same can be applied to sealing dies for resin sealing apparatuses using a compression molding method (with a cavity in the lower die 206), sealing dies for resin sealing using a transfer molding method, etc. (none of which are shown). [Explanation of Symbols]

[0041] 1. Resin encapsulation device 202 Sealing mold 250 Pressing device 252 base 254 Tie Bar 256 Fixed platen 258 Movable platen 260 Drive unit 280 Link Mechanism

Claims

1. The apparatus comprises a base, tie bars erected on the base, a fixed platen fixed to the tie bars, a movable platen that moves vertically, a drive unit that drives the movable platen, and a link mechanism that connects the drive unit and the movable platen. The drive unit is configured to allow individual control of multiple drive mechanisms. The link mechanism comprises a bearing unit that supports the movable platen and is equipped with a self-aligning bearing, a pin attached to the bearing unit, a first connecting member that connects the drive mechanism and the pin, and a second connecting member that connects the movable platen and the pin, and is configured to connect the movable platen to the drive mechanism so that it can tilt three-dimensionally within a predetermined range. A press device characterized by the following.

2. The drive unit is composed of three drive mechanisms. The press apparatus according to claim 1, characterized by the following:

3. The press device is provided according to claim 1 or claim 2. A resin encapsulation device characterized by the following.

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