Industrial machinery and wiring methods in industrial machinery

Abstract

To provide a space-saving wiring structure and wiring method for industrial machinery.SOLUTION: The injection molding machine 100 has a servo amplifier 143, motors 151-154, and wiring 180 disposed in at least part of the path connecting the servo amplifier and the motors. The wiring 180 has a substrate structure in which conductive portions 182 are arranged on at least one insulating layer 181.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to industrial machines and wiring methods in industrial machines, and more particularly, to wiring methods between devices provided in industrial machines.

Background Art

[0002] Japanese Patent Application Laid-Open No. 2018-008397 (Patent Document 1) discloses an electric injection molding machine in which each device such as a mold clamping device for clamping a mold and an injection device for melting a resin and injecting it into the mold is configured to be operated by a servo motor. In the injection molding machine disclosed in Japanese Patent Application Laid-Open No. 2018-008397 (Patent Document 1), the servo motors that drive each device are driven by a servo amplifier.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Motors used in electric injection molding machines as described above may be supplied with a relatively large drive current from a servo amplifier in order to output a large driving force. Therefore, in the power supply path from the servo amplifier to the motor, generally, a heat-resistant cable such as a flame-retardant polyplex wire (MLFC), or a bus bar formed of copper or aluminum is used so as to withstand the heat generated by the drive current.

[0005] On the other hand, MLFC and bus bars have a relatively large volume in order to ensure heat resistance. Therefore, when the power supply path is configured with MLFC or a bus bar, etc., a large space is required for arranging these members in the device and / or control panel, and the arrangement of devices or the laying of cables may be restricted.

[0006] This disclosure was made to solve these problems, and its purpose is to provide a wiring structure and wiring method that can be laid in a space-saving manner in industrial machinery. [Means for solving the problem]

[0007] An industrial machine relating to a certain aspect of this disclosure comprises a first device, a second device, and wiring arranged in at least part of a path connecting the first and second devices. The wiring has a substrate structure in which conductive parts are arranged on at least one insulating layer.

[0008] A wiring method relating to another aspect of this disclosure relates to a wiring method within an industrial machine including a first device and a second device. The wiring method includes (a) preparing a wiring having a substrate structure in which conductive parts are arranged on at least one insulating layer; (b) arranging the wiring on a structural member of the industrial machine; and (c) connecting the first device and the second device using the wiring. [Effects of the Invention]

[0009] In the industrial machine according to this disclosure, wiring having a circuit board structure is used for some of the connections between devices installed in the industrial machine. This reduces the space occupied by wiring within the industrial machine, thereby freeing up space for other devices. [Brief explanation of the drawing]

[0010] [Figure 1] This is a diagram illustrating the configuration of an injection molding machine, which is an example of an industrial machine according to the embodiment. [Figure 2] This is a diagram illustrating the wiring path for a motor in an injection molding machine. [Figure 3] This is a diagram showing the cross-sectional structure of the circuit board wiring. [Figure 4] This figure shows a plan view of the circuit board wiring in a modified example. [Figure 5]This figure shows the first example of a method for laying circuit board wiring. [Figure 6] This figure shows a second example of a method for laying circuit board wiring. [Figure 7] This is a flowchart illustrating wiring methods in industrial machinery. [Figure 8] This figure shows an example of applying circuit board wiring to the wiring inside a servo amplifier. [Modes for carrying out the invention]

[0011] The embodiments of this disclosure will be described in detail below with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated.

[0012] [Embodiment] (Configuration of an injection molding machine) Figure 1 is a diagram illustrating the configuration of an injection molding machine 100, which is an example of an industrial machine according to the embodiment. For convenience of explanation, the floor surface on which the injection molding machine 100 is placed is defined as the XY plane, and the direction perpendicular to the floor surface is defined as the Z axis direction. The positive direction of the Z axis may be referred to as the upper side or upward, and the negative direction as the lower side or downward. In Embodiment 1, the injection molding machine 100 is shown as a horizontal injection molding machine, but it is not limited to a horizontal type and may be a vertical injection molding machine. Furthermore, in the following description, an example where the industrial machine is an injection molding machine will be described, but the features of this disclosure are also applicable to other industrial machines such as machine tools, presses, extrusion molding machines, laser processing machines, and / or industrial robots.

[0013] Referring to Figure 1, the injection molding machine 100 comprises a mold clamping device 110 for clamping the mold, an injection device 120 for melting and injecting the injection material, an operation panel 130, and a control device 140. In Figure 1, the mold clamping device 110 is positioned on the negative side of the X-axis relative to the injection device 120.

[0014] The clamping device 110 includes a bed 111, a fixed platen 112, a clamping housing 113, a movable platen 114, tie bars 115, a clamping mechanism 116, molds 117, 118, and ball screws 119. The bed 111 is arranged on the floor surface, and equipment such as the fixed platen 112, the clamping housing 113, and the movable platen 114 are mounted on its upper surface.

[0015] The fixed platen 112 is fixed to the end of the bed 111 on the side closer to the injection device 120 (i.e., the positive direction of the X-axis). The clamping housing 113 is arranged at the end of the bed 111 in the negative direction of the X-axis. The fixed platen 112 and the clamping housing 113 are connected by tie bars 115 including a plurality of bars. The clamping housing 113 is movable in the X-axis direction on the bed 111.

[0016] The movable platen 114 is arranged between the fixed platen 112 and the clamping housing 113 on the bed 111. The movable platen 114 is configured to be movable in the X-axis direction. The clamping housing 113 and the movable platen 114 are connected by a clamping mechanism 116. The clamping mechanism 116 has a toggle mechanism. A ball screw 119 is connected to the toggle mechanism, and by driving a servo motor 151 arranged in the clamping housing 113 to rotate the ball screw 119, the movable platen 114 can be relatively moved in the X-axis direction with respect to the clamping housing 113. Note that as the clamping mechanism 116, a direct-acting cylinder driven by hydraulic pressure may also be used.

[0017] The movable platen 114 and the fixed platen 112 are respectively provided with molds 117 and 118. The molds 117 and 118 are arranged to face each other between the movable platen 114 and the fixed platen 112. By moving the mold 117 in the X-axis direction using the mold clamping mechanism 116, the mold 117 and the mold 118 can be brought into close contact with each other or the mold 117 can be separated from the mold 118. In the following description, the process of shifting from the state where the molds 117 and 118 are separated to the state where they are in close contact is referred to as "mold clamping". Also, the process of shifting from the state where the molds 117 and 118 are in close contact to the state where they are separated is referred to as "mold opening".

[0018] In the state where the mold 117 and the mold 118 are brought into close contact with each other by the mold clamping process, a molten material (resin) is filled into the mold and cooled and solidified, whereby a product with a desired shape can be molded. After the product is molded, in the state where the mold 117 is separated from the mold 118 by the mold opening process, the molded product can be taken out from the mold 117 by operating a protruding mechanism (not shown) arranged on the movable platen 114. The protruding mechanism is driven by a servo motor 15a arranged on the movable platen 114. Incidentally, the process of taking out the product using the protruding mechanism is referred to as the "protruding" process.

[0019] The injection device 120 includes a base 121, a heating cylinder 122, a drive device 124, a hopper 125, a nozzle touch device 127, and a temperature sensor 128. The base 121 is arranged on the floor surface on the positive X-axis side of the bed 111, and the drive device 124 is mounted on its upper surface. Servo motors 153 and 154 are arranged on the drive device 124.

[0020] The drive unit 124 is equipped with a heating cylinder 122 that extends in the X-axis direction. The heating cylinder 122 includes a heater (not shown) for heating the inside, a screw 123, and an injection nozzle 126. The screw 123 is driven by a servo motor 153 in the drive unit 124 and is configured to rotate with the X-axis direction as its axis of rotation. The screw 123 is also configured to move in the X-axis direction by a servo motor 154. The injection nozzle 126 is located at the end of the heating cylinder 122 on the clamping device 110 side (i.e., the end in the negative direction of the X-axis). The heating cylinder 122 heats and melts the bead-shaped resin material fed from the hopper 125 and generates molten material by kneading it using the screw 123. This process of melting the resin material is called the "plasticization" process.

[0021] The nozzle touch device 127 is configured, for example, by a mechanism using a hydraulic cylinder or a mechanism using a ball screw, and connects the drive unit 124 to the fixed platen 112 of the clamping device 110. When the nozzle touch device 127 is configured by a mechanism using a ball screw, the nozzle touch device 127 is driven by the drive unit 124, which moves the drive unit 124 and the heating cylinder 122 in the X-axis direction. The nozzle touch device 127 brings the injection nozzle 126 into contact with the sprue bush of the mold 118 in the clamping device 110, and the molten material is injected from the injection nozzle 126, filling the cavities of the molds 117 and 118 with molten material. The servo motor 154 applies pressure to the molten material by moving the screw 123 in the heating cylinder 122 in the negative direction of the X-axis, injecting the molten material into the molds 117 and 118 and maintaining a constant pressure of the molten material after injection.

[0022] Furthermore, the configuration of the nozzle touch mechanism is not limited to the configuration in which the entire injection device is moved by a ball screw positioned between the fixed platen 112 and the drive device 124 as described above; other configurations are also possible. For example, the device frame and the fixing member at the rear of the heating cylinder may be connected using a ball screw, and the heating cylinder itself may be moved toward the mold. Alternatively, the slide base on which the injection device is mounted may be connected to the device frame using a ball screw, and the injection device may be moved together with the slide base to bring the injection nozzle into contact with the mold.

[0023] The process of injecting molten material into molds 117 and 118 is called the "injection" process. Furthermore, the process of holding the molten material filled into molds 117 and 118 at a constant pressure and cooling it after the injection process is called the "holding pressure" process.

[0024] The temperature sensor 128 is located near the injection nozzle 126 in the heating cylinder 122. The temperature sensor 128 detects the temperature of the molten material inside the heating cylinder 122 and outputs it to the control device 140. The control device 140 controls the heater based on the value detected by the temperature sensor 128 to adjust the temperature of the molten material to a desired temperature.

[0025] Once the holding pressure process is complete, the mold opening and ejection processes are performed to remove the molded product.

[0026] The injection molding machine 100 can continuously form products by cyclically repeating the processes of mold clamping, injection, holding pressure, plasticization, mold opening, and ejection.

[0027] The control device 140 is housed inside the base 121. The control device 140 includes a CPU (Central Processing Unit) 141, a memory 142, and a servo amplifier 143 for driving servo motors 151 to 154. The control device 140 acquires detection values ​​from various sensors located on the injection molding machine 100 and comprehensively controls the injection molding machine 100.

[0028] The control panel 130 is equipment for an operator to operate the injection molding machine 100, and includes a display device such as a liquid crystal display and an input device such as a keyboard. The control panel 130 is connected to the control device 140 and can acquire and display the status of the injection molding machine 100, and output user operation signals from the input device to the control device 140. The control panel 130 may be a touch panel in which the display device and input device are integrated. The control panel 130 may also be attached to the bed 111 or base 121 of the injection molding machine 100, or it may be located in a position independent of the injection molding machine 100.

[0029] Figure 2 is a diagram illustrating the motor wiring paths in the injection molding machine 100. As described above, the injection molding machine 100 is equipped with a servo motor 151 for driving the toggle mechanism, a servo motor 152 for driving the ejection mechanism, a servo motor 153 for rotating the screw 123, and a servo motor 154 for moving the screw 123 in the X-axis direction. These servo motors 151 to 154 are each supplied with drive power from a servo amplifier 143 located in the control device 140 via power supply paths 171 to 174.

[0030] Since servo amplifiers sometimes supply relatively large drive currents of several tens of amperes or more to servo motors, heat-resistant cables such as MLFCs, or busbars made of copper or aluminum, are commonly used in this power supply path to withstand the heat generated by the drive current.

[0031] On the other hand, MLFCs and busbars have a relatively large volume to ensure heat resistance. Therefore, when a power supply path is configured using MLFCs or busbars, a large space is required to accommodate these components within the device and / or control panel, which may restrict the placement of equipment or the laying of cables. Alternatively, the size of the injection molding machine itself may need to be increased to accommodate the space required for cable laying.

[0032] Therefore, in this embodiment, a configuration is adopted that reduces the space required for the power supply path by using thin wiring with a substrate structure (hereinafter also referred to as "substrate wiring") in part of the power supply path. Here, even when using substrate wiring, the problem of heat generation arises, but by laying the substrate wiring in contact with structural members such as the frame that supports the main body of the injection molding machine, the housing that covers the equipment, and / or a cooler for cooling other equipment, Joule heat generated by the drive current is dissipated. With this configuration, it is possible to construct a power supply path in a space-saving manner while efficiently dissipating heat.

[0033] (Circuit board wiring structure) Figure 3 shows a cross-sectional view of a substrate wiring 180 used in this embodiment. The substrate wiring 180 has a strip-shaped structure including at least two insulating layers 181 and at least one conductive portion 182 disposed between the insulating layers 181. In the example in Figure 3, the stacking direction of the insulating layers 181 and conductive portions 182 is the Z-axis direction, and the extension direction of the substrate wiring 180 is the X-axis direction. In the substrate wiring 180 shown in Figure 3, a configuration is shown in which five insulating layers 181 and four conductive portions 182 are stacked alternately in the Z-axis direction in the figure, but the number of insulating layers 181 and conductive portions 182 is not limited to this.

[0034] The insulating layer 181 is formed of a resin such as phenol, epoxy, glass epoxy, polyimide, or polyester. The insulating layer 181 may be a rigid substrate that does not have flexibility, or a flexible substrate that is flexible and can be bent. The conductive part 182 may be made of a metal such as copper or aluminum.

[0035] While AC or DC motors are used as servo motors, the circuit board wiring 180 may be used individually for each phase of the power supply path, or each phase may be assigned to an insulated conductive portion 182 within a single circuit board wiring 180. Furthermore, in order to ensure current capacity, multiple layers of conductive portions 182 within the circuit board wiring 180 may be assigned as paths for the same phase.

[0036] Furthermore, the circuit board wiring 180 has a heat transfer member 183 with a heat transfer coefficient greater than that of the insulating layer 181 placed on the outer surface of the outermost insulating layer 181. The heat transfer member 183 can be made of a metal such as copper, but it is electrically insulated from the conductive parts 182 inside the circuit board wiring 180. By providing the heat transfer member 183, when the circuit board wiring 180 is placed on a structural member, the heat generated in the conductive parts 182 can be efficiently transferred to the structural member. Note that the heat transfer member 183 is not a mandatory component; if the amount of heat generated is small, the heat transfer member 183 may be omitted, and the insulating layer 181 may be in direct contact with the structural member. Also, if the heat transfer member 183 is provided, it only needs to be placed on the insulating layer of the outermost insulating layer 181 that is in contact with the structural member.

[0037] Furthermore, when a conductive material such as metal is used as the heat transfer member 183, the heat transfer member 183 can be made to function as an electromagnetic shield by connecting it to the ground potential. In this way, the external impact caused by electromagnetic waves resulting from the drive current can be reduced. In addition, the impact on the servo motor from external electromagnetic noise can also be reduced.

[0038] Although not shown in Figure 3, the ends of the circuit board wiring 180 are provided with connection terminals or lead wires for making electrical connections between the internal conductive parts 182 and the outside. Connections to the connection terminals of the servo amplifier 143 and servo motors 151-154 (Figures 1 and 2), as well as connections between different circuit board wirings, are made using the aforementioned lead wires, or between the connection terminals using other cables such as MLFC.

[0039] In the example shown in Figure 3, insulating layers 181 are arranged on both sides of the conductive portion 182 in the lamination direction, and the conductive portion 182 is covered with insulating layers 181. However, one of the outermost insulating layers 181 may be absent, leaving the conductive portion 182 exposed. In this case, the surface on which the outermost insulating layer 181 is arranged is mounted in contact with a structural member or the like. In other words, the substrate wiring 180 only needs to have at least one insulating layer 181.

[0040] In the above example, the "servo amplifier 143" corresponds to the "first device" of this disclosure, and each of the "servo motors 151 to 154" corresponds to the "second device" of this disclosure.

[0041] Figure 4 is a plan view of a modified circuit board wiring 180A. In circuit board wiring 180A, two conductive parts 182A and 182B are arranged parallel to each other within the same layer, along the direction of wiring extension (the X-axis direction in the figure). Although conductive parts 182A and 182B are located within the same layer, they are electrically insulated from each other.

[0042] (Example of circuit board wiring installation) Figures 5 and 6 illustrate examples of the installation of the circuit board wiring 180 as described above. Figure 5 shows an example of the installation of circuit board wiring 180 on the structural members of an injection molding machine 100. In Figure 5, the structural members are exemplified as the channel base 200 of the base portion of the frame of the injection molding machine 100, and the post 210 extending vertically from the channel base 200. Since the circuit board wiring 180 basically has a flat plate shape, it is placed in contact with the flat portions of the channel base 200 and the post 210. When there is a step, and / or when the extension direction bends from the vertical to the horizontal direction as in Figure 5, the two circuit board wirings 180 are connected using a flexible cable 185 or busbar. If the circuit board wiring 180 is formed from a flexible circuit board, the same wiring may be used for the stepped portion and the bent portion.

[0043] Figure 6 shows an example of a case where the circuit board wiring 180 is laid in the cooling pipe 250 inside the injection molding machine 100. The injection molding machine 100 may be provided with cooling pipes 250 through which a cooling medium such as cooling water flows, for example, to reduce the influence of heat from the heating cylinder 122 (Figure 1) or to cool the molds 117, 118 (Figure 1). When such cooling pipes 250 are provided, the heat dissipation effect can be further improved by positioning the circuit board wiring 180 in contact with the cooling pipes 250. The circuit board wiring 180 is connected at its ends to other circuit board wiring or to various devices such as servo amplifiers or servo motors using flexible cables 186 or busbars.

[0044] (Wiring method) Figure 7 is a flowchart illustrating the wiring method of the injection molding machine 100 using the circuit board wiring 180 according to this embodiment. In Figure 7, the case in which the circuit board wiring 180 is used as part of the wiring path connecting the servo amplifier and the servo motor is explained as an example.

[0045] Referring to Figure 7, in step S10, a circuit board wiring 180 is prepared that conforms to the specifications such as the rated current that can be output from the servo amplifier. Next, in step S20, the wiring route is considered based on the arrangement of the equipment (servo amplifier / servo motor) placed inside the injection molding machine 100, and the circuit board wiring 180 is laid on the structural members, housing and / or cooling pipes of the injection molding machine 100. Then, in step S30, the servo amplifier and servo motor are connected using the circuit board wiring 180 for part of the wiring route and cables and / or busbars for the remaining parts.

[0046] In the above explanation, the use of PCB wiring 180 as part of the power wiring for connecting a servo amplifier and a servo motor was described as an example. However, PCB wiring 180 may also be used as part of other power wiring, such as power supply wiring to a hydraulic pump unit (not shown) or power supply wiring to a heating element. Furthermore, PCB wiring 180 may be used not only for power wiring but also for control wiring that transmits control signals between sensors and / or devices.

[0047] The circuit board wiring of this embodiment can be used not only as wiring to connect equipment within an injection molding machine, but also as wiring used within the equipment itself. Figure 8 shows an example in which the circuit board wiring 180 is applied to the wiring within a servo amplifier 143. In Figure 8, an example is shown in which the circuit board wiring 180 is used as a wiring path connecting the power semiconductor and the connection terminals within the servo amplifier 143.

[0048] (Example of application to internal wiring of equipment) Referring to Figure 8, the circuit board wiring 180 is positioned on the cooling fins 350 for heat dissipation within the servo amplifier 143. The semiconductor 300 is then positioned via a heat spreader 310 made of a metal plate such as a copper or aluminum plate. Although not shown in Figure 8, the semiconductor 300 and the circuit board wiring 180 are electrically connected by wire bonding or the like. Connection terminals 190 are also provided on the circuit board wiring 180, and the semiconductor 300 is connected to other components within the servo amplifier 143 using cables 187 or busbars.

[0049] With this configuration, instantaneous heat generation from the semiconductor 300 is absorbed by the heat spreader 310, and heat from the semiconductor 300 and the substrate wiring 180 can be dissipated by the cooling fins 350. Furthermore, by using the substrate wiring 180, some of the cables and busbars inside the servo amplifier 143 can be reduced, thereby freeing up space inside the servo amplifier 143.

[0050] In the example shown in Figure 8, "semiconductor 300" corresponds to the "first device" in this disclosure, and "connection terminal 190" corresponds to the "second device" in this disclosure. Also, "cooling fin 350" corresponds to the "cooling section" in this disclosure. [Aspect] (Article 1) An industrial machine according to one embodiment comprises a first device, a second device, and wiring arranged in at least part of a path connecting the first device and the second device. The wiring has a substrate structure in which conductive parts are arranged on at least one insulating layer.

[0051] (Article 2) In the industrial machinery described in Article 1, the wiring is power wiring that transmits power using conductive parts.

[0052] (Clause 3) In the industrial machine described in paragraph 1 or 2, the wiring further includes a heat transfer member disposed outside the outermost insulating layer of at least one insulating layer. The heat transfer member has a heat transfer coefficient greater than that of the at least one insulating layer.

[0053] (Article 4) In the industrial machinery described in Article 3, the heat transfer member is connected to the ground potential.

[0054] (Article 5) In the industrial machinery described in any one of paragraphs 1 to 4, the wiring is arranged in contact with the structural members inside the industrial machinery.

[0055] (Section 6) The industrial machinery described in any one of paragraphs 1 to 4 further comprises cooling pipes through which a cooling medium for cooling the inside of the apparatus flows. The wiring is arranged in contact with the cooling pipes.

[0056] (Article 7) In the industrial machine described in any one of paragraphs 1 to 6, the first component is a servo amplifier, and the second component is a motor driven by power supplied from the servo amplifier.

[0057] (Section 8) The industrial machine described in any one of paragraphs 1 to 5 further comprises a servo amplifier including a semiconductor, a connector, and a cooling unit for cooling the semiconductor. The first component is the semiconductor, and the second component is the connector. The wiring is arranged in contact with the cooling unit.

[0058] (Section 9) The industrial machinery described in any one of paragraphs 1 to 8 is an injection molding machine. (Paragraph 10) In the industrial machinery described in paragraph 9, the wiring is arranged in contact with structural members within the industrial machinery.

[0059] (Section 11) The industrial machinery described in Section 9 further comprises cooling pipes through which a cooling medium flows for cooling the inside of the apparatus. The wiring is arranged in contact with the cooling pipes.

[0060] (Section 12) In the industrial machine described in Section 9, the first component is a servo amplifier, and the second component is a motor driven by power supplied from the servo amplifier.

[0061] (Section 13) The industrial machine described in Section 9 further comprises a servo amplifier including a semiconductor, a connector, and a cooling unit for cooling the semiconductor. The first component is the semiconductor, and the second component is the connector. The wiring is arranged in contact with the cooling unit.

[0062] (Clause 14) One aspect of a wiring method relates to a wiring method within an industrial machine including a first device and a second device. The wiring method includes the following steps: (a) A step of preparing a wiring having a substrate structure in which a conductive portion is arranged on at least one insulating layer; (b) The step of arranging the wiring in the structural members of the industrial machine; (c) A step of connecting the first device and the second device using wiring.

[0063] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. [Explanation of Symbols]

[0064] 100 Injection molding machine, 110 Clamping device, 111 Bed, 112 Fixed platen, 113 Clamping housing, 114 Movable platen, 115 Tie bar, 116 Clamping mechanism, 117,118 Mold, 119 Ball screw, 120 Injection device, 121 Base, 122 Heating cylinder, 123 Screw, 124 Drive device, 125 Hopper, 126 Injection nozzle, 127 Nozzle touch device, 128 Temperature sensor, 130 Control panel, 140 Control device, 141 CPU, 142 Memory, 143 Servo amplifier, 151~154 Servo motor, 171~174 Power supply path, 180,180A Circuit board wiring, 181 Insulating layer, 182,182A,182B Conductive part, 183 Heat transfer components, 185-187 cables, 190 connectors, 200 channel bases, 210 posts, 250 cooling piping, 300 semiconductors, 310 heat spreaders, 350 cooling fins.

Claims

1. Industrial machinery, The first device and The second device and The system includes wiring laid in at least a portion of the path connecting the first device and the second device, The aforementioned wiring has a substrate structure in which a conductive portion is arranged on at least one insulating layer. The aforementioned wiring is laid so as to be in contact with and extend along the structural members within the industrial machine. The industrial machine further includes a heat transfer member having a heat transfer coefficient greater than that of the at least one insulating layer, which is located outside the outermost insulating layer of the at least one insulating layer.

2. The industrial machine according to claim 1, wherein the wiring is power wiring that transmits power for power using the conductive part.

3. The industrial machine according to claim 1, wherein the heat transfer member is connected to the ground potential.

4. The structural member includes cooling pipes through which a cooling medium for cooling the inside of the device flows. The industrial machine according to any one of claims 1 to 3, wherein the wiring is laid in contact with the cooling pipe.

5. The first device is a servo amplifier, The industrial machine according to any one of claims 1 to 3, wherein the second device is a motor driven by power supplied from the servo amplifier.

6. The industrial machine according to any one of claims 1 to 3, wherein the industrial machine is an injection molding machine.

7. The structural member includes cooling pipes through which a cooling medium for cooling the inside of the device flows. The industrial machine according to claim 6, wherein the wiring is laid in contact with the cooling pipe.

8. The first device is a servo amplifier, The industrial machine according to claim 6, wherein the second device is a motor driven by power supplied from the servo amplifier.

9. A wiring method within an industrial machine, including the first and second pieces of equipment, including the following steps: (a) A step of preparing wiring having a substrate structure in which a conductive portion is arranged on at least one insulating layer, and including a heat transfer member which is located outside the outermost insulating layer of the at least one insulating layer and has a heat transfer coefficient greater than that of the at least one insulating layer; (b) The step of bringing the wiring into contact with the structural member of the industrial machine and laying it so as to extend along the structural member; (c) The step of connecting the first device and the second device using the wiring.

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