Cooler and method for manufacturing a cooler

Abstract

To provide a cooler which can enhance airtight reliability between a metal base and a resin cover while suppressing increase in manufacturing cost, and a method for manufacturing a cooler.SOLUTION: A cooler 1 includes a metal base 2 for cooling a cooled body, a resin cover 3 which is overlapped on the metal base 2 and forms a flow channel 5 for circulating a coolant between the metal base 2 and the resin cover 3, and a seal member 4 arranged between the metal base 2 and the resin cover 3. The metal base 2 has a plate part 21 formed in a flat plate shape, a heat exchange part 22 arranged on the plate part 21, and a through hole 24 formed on the plate part 21. The resin cover 3 has a caulking part 34 which is inserted to the through hole 24 and fixes the resin cover 3 to the metal base 2.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] One aspect of the present invention relates to a cooler for cooling a heat-generating body such as a CPU and a method for manufacturing the cooler.

Background Art

[0002] Patent Document 1 describes a cooler in which a metal base and a resin cover are stacked. In the cooler described in Patent Document 1, a roughened portion is formed on the surface of the metal base, and the resin cover is fused to the roughened portion.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when used for CPUs (Central Processing Units) such as HPC (High Performance Computing) and base station devices, airtight reliability is a very important factor. However, in a structure in which a resin cover is fused to the surface of a metal base as in the cooler described in Patent Document 1, there is a possibility that the airtight reliability between the metal base and the resin cover cannot be sufficiently maintained. For example, the airtightness between the metal base and the resin cover may be lost due to thermal expansion of the metal base or shrinkage of the resin cover. In addition, in order to enhance the airtight reliability between the metal base and the resin cover, it is necessary to increase the dimensional accuracy of the metal base and the resin cover, which also causes a problem of increased manufacturing cost. There is also a method of fixing the metal base and the resin cover by bolt fastening, but this method has problems of increased weight and size.

[0005] Therefore, one aspect of the present invention aims to provide a cooler and a method for manufacturing a cooler that can improve the airtightness reliability between a metal base and a resin cover while suppressing an increase in manufacturing costs. [Means for solving the problem]

[0006] A cooler relating to one aspect of the present invention is as follows:

[0007] [1] A cooler according to one aspect of the present invention comprises a metal base for cooling an object to be cooled, a resin cover superimposed on the metal base to form a flow path for a refrigerant to flow between it and the metal base, and a sealing member disposed between the metal base and the resin cover, wherein the metal base has a plate portion formed in the shape of a flat plate, a heat exchange portion disposed on the plate portion, and through holes formed in the plate portion, and the resin cover has a crimping portion that is inserted into the through holes and fixed to the metal base.

[0008] In this cooler, a sealing member is placed between the metal base and the resin cover, and the resin cover is fixed to the metal base by a crimped portion of the resin cover inserted into a through hole formed in the plate portion of the metal base. Therefore, sufficient airtightness reliability between the metal base and the resin cover can be maintained even without high dimensional accuracy of the metal base and the resin cover. This makes it possible to improve the airtightness reliability between the metal base and the resin cover while suppressing an increase in manufacturing costs.

[0009] [2] In the cooler described in [1], the crimped portion may have a boss portion that is inserted into the through hole and a hat portion that extends from the tip of the boss portion and engages with the plate portion from the opposite side of the heat exchange portion relative to the plate portion. In this cooler, having a boss portion that is inserted into the through hole and a hat portion that extends from the tip of the boss portion and engages with the plate portion from the opposite side of the heat exchange portion relative to the plate portion makes it possible to appropriately suppress the detachment of the resin cover from the metal base.

[0010] [3] In the cooler described in [2], the hat portion may be in contact with the first surface of the plate portion opposite to the heat exchange portion. In this cooler, the hat portion is in contact with the first surface of the plate portion opposite to the heat exchange portion, which allows the hat portion to be locked to the plate portion with a simple configuration.

[0011] [4] In the cooler described in [2], the plate portion has a recess that extends from the first surface of the plate portion opposite to the heat exchange portion toward the second surface of the plate portion toward the heat exchange portion along the through hole, and the hat portion may be embedded in the recess. In this cooler, the hat portion being embedded in the recess of the plate portion makes it possible to flatten the first surface of the plate portion opposite to the heat exchange portion. This makes it easier to attach the plate portion to the object to be cooled and increases the contact area between the plate portion and the object to be cooled.

[0012] In the cooler described in any one of [5] [2] to [4], the resin cover has a housing for housing the heat exchanger, and the resin cover may have a shape such that the heat exchanger does not come into contact with the housing even when the boss moves through the through hole. In this cooler, the resin cover has a shape such that the heat exchanger does not come into contact with the housing even when the boss moves through the through hole, thereby suppressing the deformation of the heat exchanger caused by the housing coming into contact with the heat exchanger.

[0013] In the cooler described in any one of [6] [2] to [5], the resin cover has a housing for housing a heat exchanger, and the maximum clearance between the boss and the through hole may be smaller than the minimum clearance between the heat exchanger and the housing in a direction perpendicular to the axis of the boss. In this cooler, the maximum clearance between the boss and the through hole in a direction perpendicular to the axis of the boss is smaller than the minimum clearance between the heat exchanger and the housing, so that the heat exchanger does not come into contact with the housing even if the boss moves in the through hole. This prevents the housing from coming into contact with the heat exchanger and causing deformation of the heat exchanger.

[0014] [7] In any one of the coolers described in [1] to [6], the heat exchange section may be composed of fins. In this cooler, high heat exchange performance can be obtained by having the heat exchange section composed of fins.

[0015] [8] A method for manufacturing a cooler according to one aspect of the present invention comprises a preparation step of preparing a metal base for cooling an object to be cooled, a resin cover that forms a flow path for a refrigerant to flow between the metal base and the resin cover, and a sealing member, and a crimping step of arranging the sealing member between the metal base and the resin cover, and fixing the resin cover to the metal base by crimping while the sealing member is pressed between the metal base and the resin cover.

[0016] In this method of manufacturing a cooler, a sealing member is placed between a metal base and a resin cover, and the resin cover is fixed to the metal base by crimping while the sealing member is pressed between the metal base and the resin cover. Therefore, sufficient airtightness reliability between the metal base and the resin cover can be maintained even without high dimensional accuracy of the metal base and the resin cover. This makes it possible to improve the airtightness reliability between the metal base and the resin cover while suppressing an increase in manufacturing costs.

[0017] In the method for manufacturing a cooler described in [9] and [8], the resin cover may be fixed to the metal base by ultrasonic crimping or heat crimping during the crimping process. In this method for manufacturing a cooler, the resin cover can be properly fixed to the metal base by ultrasonic crimping or heat crimping.

[0018] In the method for manufacturing a cooler described in

[10] [8] or [9], the metal base prepared in the preparation step has a plate portion formed in the shape of a flat plate, a heat exchange portion disposed on the plate portion, and a through hole formed in the plate portion, and the resin cover prepared in the preparation step has a boss portion that can be inserted into the through hole, and in the crimping method, the boss portion may be inserted into the through hole, and the tip of the boss portion protruding from the plate portion may be melted and widened so that it engages with the plate portion from the opposite side of the heat exchange portion relative to the plate portion. In this method for manufacturing a cooler, the resin cover can be firmly fixed to the metal base by inserting the boss portion of the resin cover into the through hole of the plate portion of the metal base, and melting the tip of the boss portion protruding from the plate portion and widening it so that it engages with the plate portion from the opposite side of the heat exchange portion relative to the plate portion.

[0019] In the method for manufacturing the cooler described in

[11]

[10] , in the crimping step, the tip of the boss portion may be melted and brought into contact with the first surface of the plate portion opposite to the heat exchange portion. In this method for manufacturing the cooler, by melting the tip of the boss portion and bringing it into contact with the first surface of the plate portion opposite to the heat exchange portion, the cooler can be locked to the plate portion with a simple configuration.

[0020] In the method for manufacturing a cooler described in

[12]

[10] , the metal base prepared in the preparation step has a plate portion having a recess that extends from the first surface of the plate portion opposite to the heat exchange portion along the through hole toward the second surface of the plate portion toward the heat exchange portion, and in the crimping step, the tip of the boss portion may be melted and embedded in the recess. In this method for manufacturing a cooler, by melting the tip of the boss portion in the crimping step and embedding it in the recess, the first surface of the plate portion opposite to the heat exchange portion can be flattened. This makes it easier to attach the plate portion to the object to be cooled and increases the contact area between the plate portion and the object to be cooled.

[0021]

[13] In the method for manufacturing a cooler described in any one of

[10] to

[12] , the length of the boss portion of the resin cover prepared in the preparation step may be such that the resin cover does not come into contact with the heat exchange portion when the boss portion comes into contact with the second surface of the resin cover on the plate portion. In this method for manufacturing a cooler, the length of the boss portion of the resin cover prepared in the preparation step is such that the resin cover does not come into contact with the heat exchange portion when the boss portion comes into contact with the second surface of the resin cover on the plate portion. This prevents the resin cover from coming into contact with the heat exchange portion and deforming the heat exchange portion when the position of the resin cover relative to the metal base is misaligned and the boss portion does not enter the through hole.

[0022] In the method for manufacturing a cooler described in any one of

[10] to

[13] , the length of the boss portion of the resin cover prepared in the preparation step may be longer than the height of the heat exchange portion relative to the plate portion. In this method for manufacturing a cooler, if the position of the resin cover relative to the metal base is misaligned and the boss portion does not fit into the through hole, even if the boss portion contacts the second surface of the plate portion on the resin cover side, it is possible to suppress the resin cover from contacting the heat exchange portion. This makes it possible to suppress the resin cover from contacting the heat exchange portion and deforming the heat exchange portion when the position of the resin cover relative to the metal base is misaligned and the boss portion does not fit into the through hole.

[0023] In the method for manufacturing a cooler described in any one of

[10] to

[14] , the resin cover prepared in the preparation step may have a housing portion for housing the heat exchange portion, and may have a shape such that the heat exchange portion does not come into contact with the housing portion even if the boss portion moves in a direction perpendicular to the axis of the boss portion in the through hole when the boss portion is inserted into the through hole. In this method for manufacturing a cooler, the resin cover prepared in the preparation step has a shape such that the heat exchange portion does not come into contact with the housing portion even if the boss portion moves in a direction perpendicular to the axis of the boss portion in the through hole when the boss portion is inserted into the through hole, thereby suppressing the deformation of the heat exchange portion due to the housing portion coming into contact with the heat exchange portion when the boss portion is inserted into the through hole.

[0024]

[16] In the method for manufacturing a cooler according to any one of

[10] to

[15] , the resin cover prepared in the preparation step has a housing portion for housing the heat exchange portion. When the boss portion is inserted into the through hole, the metal base and the resin cover prepared in the preparation step may have a relationship in which the maximum gap dimension between the boss portion and the through hole is smaller than the minimum gap dimension between the heat exchange portion and the housing portion in a direction perpendicular to the axis of the boss portion. In this method for manufacturing a cooler, when the metal base and the resin cover prepared in the preparation step have a relationship in which the maximum gap dimension between the boss portion and the through hole is smaller than the minimum gap dimension between the heat exchange portion and the housing portion in a direction perpendicular to the axis of the boss portion when the boss portion is inserted into the through hole, it is possible to suppress the heat exchange portion from contacting the housing portion even when the boss portion moves in a direction perpendicular to the axis of the boss portion through the through hole when the boss portion is inserted into the through hole. Thereby, it is possible to suppress the housing portion from contacting the heat exchange portion and deforming the heat exchange portion when the boss portion is inserted into the through hole. [[ID=२]]

Advantages of the Invention

[0025] According to one aspect of the present invention, it is possible to enhance the airtight reliability between the metal base and the resin cover while suppressing an increase in the manufacturing cost.

Brief Description of the Drawings

[0026] [Figure 1] It is a plan view showing the cooler of the present embodiment. [Figure 2] It is a front view showing the cooler of the present embodiment. [Figure 3] It is a side view showing the cooler of the present embodiment. [Figure 4] It is a bottom view showing the cooler of the present embodiment. [Figure 5] It is an exploded perspective view showing the cooler of the present embodiment. [Figure 6] It is a cross-sectional view taken along line VI-VI shown in FIG. 1. [Figure 7] It is a cross-sectional view taken along line VII-VII shown in FIG. 1. [Figure 8] It is a cross-sectional view taken along line VIII-VIII shown in FIG. 1. [Figure 9] Figure 2 shows a cross-sectional view of the IX-IX line. [Figure 10] These are enlarged cross-sectional views of parts of Figures 7 and 8. [Figure 11] This is a perspective view showing the preparation steps in the manufacturing method of the cooler according to this embodiment. [Figure 12] This is a plan view showing the crimping process in the manufacturing method of the cooler according to this embodiment. [Figure 13] Figure 12 shows a cross-sectional view along the line XIII-XIII. [Figure 14] Figure 12 shows a cross-sectional view along the XIV-XIV line. [Figure 15] This is a cross-sectional view showing the boss portion inserted into the through hole. [Figure 16] Figure 16(a) is a cross-sectional view showing a modified boss section, and Figure 16(b) is a cross-sectional view showing another modified boss section. [Figure 17] Figure 17(a) is a cross-sectional view showing another modified example of the boss section, and Figure 17(b) is a cross-sectional view showing another modified example of the boss section. [Figure 18] This is a plan view showing a modified condenser. [Figure 19] This is a plan view showing a cooler of another modified form. [Modes for carrying out the invention]

[0027] The cooler and the method for manufacturing the cooler according to the embodiment will be described below with reference to the drawings. The cooler according to this embodiment cools the object to be cooled by being placed on top of it. The cooler according to this embodiment may be placed directly on top of the object to be cooled, or it may be placed indirectly on top of the object to be cooled via other components. The object to be cooled is not particularly limited and can be, for example, a CPU used in HPC, base station equipment, etc. In each figure, the same or corresponding elements are denoted by the same reference numerals, and redundant explanations are omitted.

[0028] Figure 1 is a plan view showing the cooler of this embodiment. Figure 2 is a front view showing the cooler of this embodiment. Figure 3 is a side view showing the cooler of this embodiment. Figure 4 is a bottom view showing the cooler of this embodiment. Figure 5 is an exploded perspective view showing the cooler of this embodiment. Figure 6 is a cross-sectional view taken along line VI-VI in Figure 1. Figure 7 is a cross-sectional view taken along line VII-VII in Figure 1. Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 1. Figure 9 is a cross-sectional view taken along line IX-IX in Figure 2. As shown in Figures 1 to 9, the cooler 1 according to this embodiment comprises a metal base 2 for cooling an object to be cooled, a resin cover 3 superimposed on the metal base 2 to form a flow path 5 through which a refrigerant flows between the metal base 2 and the resin cover 3, and a sealing member 4 disposed between the metal base 2 and the resin cover 3. Here, the direction in which the resin cover 3 is superimposed on the metal base 2 is called the superimposition direction D1. The superimposition direction D1 is also the direction in which the cooler 1 is superimposed on the object to be cooled. Furthermore, the direction intersecting the overlapping direction D1 is called the width direction D2, and the direction intersecting both the overlapping direction D1 and the width direction D2 is called the length direction D3. In this embodiment, as an example, the direction perpendicular to the overlapping direction D1 is called the width direction D2, and the direction perpendicular to both the overlapping direction D1 and the width direction D2 is called the length direction D3.

[0029] The metal base 2 is a metal component placed on top of the object to be cooled in order to cool the object to be cooled. For example, metals with high thermal conductivity such as copper, copper alloys, aluminum, and aluminum alloys can be used as the material for the metal base 2. The metal base 2 comprises a plate portion 21 formed in a flat plate shape and a heat exchange portion 22 positioned on the plate portion 21.

[0030] The plate portion 21 has thickness in the overlapping direction D1 and extends in directions along the width direction D2 and the length direction D3. Of the front and back surfaces of the plate portion 21, the surface opposite to the heat exchange portion 22 is called the first surface 21a, and the surface on the heat exchange portion 22 side is called the second surface 21b. The plate portion 21 has a plurality of through holes 23 for fixing the plate portion 21 to the object to be cooled, and a plurality of through holes 24 for fixing the resin cover 3 to the metal base 2. The plurality of through holes 23 and the plurality of through holes 24 penetrate from the second surface 21b to the first surface 21a in the overlapping direction D1, which is the thickness direction of the plate portion 21.

[0031] The heat exchange section 22 is located in the center of the plate section 21. The heat exchange section 22 is the part that cools the object to be cooled by exchanging heat with the refrigerant. The heat exchange section 22 is composed of, for example, fins. Examples of fins that make up the heat exchange section 22 include a plate type made of a bent metal sheet, a wave type made of a plurality of corrugated metal sheets, a pin type made of a plurality of upright pins, and a laminated type made of a plurality of stacked metal sheets. The heat exchange section 22 as a whole is formed in the shape of a rectangular flat plate. The heat exchange section 22 as a whole has thickness in the overlapping direction D1 and extends in the direction along the width direction D2 and the length direction D3. The heat exchange section 22 may be formed integrally with the plate section 21, or it may be fixed to the plate section 21.

[0032] The resin cover 3 is a resin component for forming a flow path 5 between itself and the metal base 2. The resin cover 3 is fixed to the metal base 2. As the material for the resin cover 3, for example, a resin with high heat resistance and strength can be used, such as polyamide (PA), aromatic polyamide resin, fluororesin such as ethylene-tetrafluoroethylene copolymer (ETFE), or polyolefin resin such as polyphenylene sulfide (PPS) or polypropylene (PP). The resin cover 3 comprises a cover body 31, a supply pipe section 32, a discharge pipe section 33, and a crimped section 34.

[0033] The cover body 31 is the part that forms the flow path 5 between itself and the plate portion 21 of the metal base 2. The cover body 31 has an inlet 35 for supplying refrigerant to the flow path 5, an outlet 36 for discharging refrigerant from the flow path 5, and a seal groove 39 into which the seal member 4 is fitted.

[0034] The inlet 35 and outlet 36 are formed in a circular shape (for example, a perfect circle). Furthermore, the inlet 35 and outlet 36 are formed at a distance from the metal base 2. The flow path 5 includes a heat exchange region 51, an inlet region 52, an outlet region 53, a supply-side chamber region 54, and a discharge-side chamber region 55. In the flow path 5, the inlet 35, supply-side chamber region 54, inlet region 52, heat exchange region 51, outlet region 53, discharge-side chamber region 55, and outlet 36 are arranged in this order along the length direction D3.

[0035] The heat exchange region 51 is the region where the heat exchange unit 22 is located. In other words, the heat exchange unit 22 is positioned in the heat exchange region 51 so as to be in contact with the refrigerant in the heat exchange region 51. The cover body 31 has a housing portion 31a that houses the heat exchange unit 22 by forming the heat exchange region 51 between itself and the plate portion 21. The housing portion 31a is, for example, the inner wall surface of the cover body 31 surrounding the heat exchange region 51. The housing portion 31a is formed such that the heat exchange region 51 is larger than the heat exchange unit 22 in all directions: overlap direction D1, width direction D2, and length direction D3. The housing portion 31a is spaced apart from the heat exchange unit 22, creating a gap between it and the heat exchange unit 22. In other words, the inner wall surface of the cover body 31 surrounding the heat exchange region 51 is spaced apart from the heat exchange unit 22, creating a gap between it and the heat exchange unit 22.

[0036] The inlet region 52 is located on the inlet 35 side of the heat exchange region 51. In other words, the inlet region 52 is adjacent to the heat exchange region 51 and serves as the inlet to the heat exchange region 51. The inlet region 52 extends in the width direction D2. The height of the inlet region 52 in the overlapping direction D1 is less than or equal to the height of the heat exchange section 22 in the overlapping direction D1, or less than the height of the heat exchange section 22 in the overlapping direction D1.

[0037] The outlet region 53 is located on the outlet 36 side of the heat exchange region 51. In other words, the outlet region 53 is adjacent to the heat exchange region 51 and serves as its outlet. The outlet region 53 extends in the width direction D2. The outlet region 53 is formed to be symmetrical with the inlet region 52 in the length direction D3.

[0038] The supply-side chamber region 54 is located between the inlet 35 and the inlet region 52. The supply-side chamber region 54 is adjacent to the inlet 35 and the inlet region 52, and is a region that temporarily stores the refrigerant supplied from the inlet 35 before supplying it to the inlet region 52. The supply-side chamber region 54 extends in the overlapping direction D1. The inlet 35 is located on the opposite side of the metal base 2 in the overlapping direction D1 from the inlet region 52. In other words, in the overlapping direction D1, the inlet 35 is located at a higher position than the inlet region 52.

[0039] The discharge-side chamber region 55 is located between the outlet region 53 and the outlet 36. The discharge-side chamber region 55 is adjacent to the outlet region 53 and the outlet 36, and is a region that temporarily stores the refrigerant discharged from the outlet region 53 before discharging it to the outlet 36. The discharge-side chamber region 55 is formed to be symmetrical with the supply-side chamber region 54 in the length direction D3.

[0040] The seal groove 39 is formed on the end face 31b of the cover body 31 on the plate portion 21 side. The end face 31b is the surface facing the second surface 21b of the cover body 31. The seal groove 39 is formed on the end face 31b so as to surround the flow path 5. It is preferable that the end face 31b of the cover body 31 is in contact with the second surface 21b of the plate portion 21. However, as long as airtightness between the cover body 31 and the plate portion 21 is maintained, the end face 31b of the cover body 31 does not need to be in contact with the second surface 21b of the plate portion 21.

[0041] The supply pipe section 32 is the portion that extends from the cover body 31 in the longitudinal direction D3. The supply pipe section 32 is formed in a cylindrical (pipe-like) shape and extends in a straight line so that a supply-side refrigerant pipe (not shown) for circulating refrigerant can be connected to it. The supply pipe section 32 has a bulge (a bulge extending in the circumferential direction of the supply pipe section 32) to prevent the supply-side refrigerant pipe connected to the supply pipe section 32 from easily coming out of the supply pipe section 32. A supply passage 37 that communicates with the inlet 35 is formed in the supply pipe section 32. The supply passage 37 is formed by the inner circumferential surface of the supply pipe section 32.

[0042] The discharge pipe section 33 is the portion that extends from the cover body 31 in the direction opposite to the supply pipe section 32 in the longitudinal direction D3. The discharge pipe section 33 is formed in a cylindrical (pipe-like) shape and extends in a straight line so that a discharge-side refrigerant pipe (not shown) for circulating refrigerant can be connected to it. A bulge is formed in the discharge pipe section 33 to prevent the discharge-side refrigerant pipe connected to the discharge pipe section 33 from easily coming out of the discharge pipe section 33. A discharge passage 38 that communicates with the outlet 36 is formed in the discharge pipe section 33. The discharge passage 38 is formed by the inner circumferential surface of the discharge pipe section 33.

[0043] Figure 10 is an enlarged cross-sectional view of parts of Figures 7 and 8. As shown in Figures 1 to 10, the crimping portion 34 is inserted into a through hole 24 formed in the plate portion 21 of the metal base 2, and is the part that fixes the resin cover 3 to the metal base 2. In other words, the resin cover 3 is fixed to the metal base 2 by the crimping portion 34. The crimping portion 34 has a boss portion 34a that is inserted into the through hole 24, and a hat portion 34b that extends from the tip of the boss portion 34a and engages with the plate portion 21 from the opposite side of the heat exchange portion 22 to the plate portion 21.

[0044] The boss portion 34a is formed in a rod shape and extends from the end face 31b of the cover body 31 toward the plate portion 21 in the overlapping direction D1. The outer diameter of the boss portion 34a is less than or equal to the hole diameter (inner diameter) of the through hole 24. The hat portion 34b widens from the tip of the boss portion 34a along the first surface 21a of the plate portion 21. The direction in which the hat portion 34b widens is perpendicular to the axis of the boss portion 34a, or along the width direction D2 and the length direction D3. The hat portion 34b is locked to the plate portion 21 from the opposite side of the heat exchange portion 22 relative to the plate portion 21 by contacting the second surface 21b of the plate portion 21. The hat portion 34b is formed in a dome shape (approximately hemispherical), for example, like the head of a round screw.

[0045] The crimped portion 34 restricts the movement of the resin cover 3 in the width direction D2 and length direction D3 relative to the metal base 2, as the boss portion 34a is inserted into the through hole 24. The crimped portion 34 also fixes the resin cover 3 to the metal base 2 by engaging with the plate portion 21 from the opposite side of the heat exchange portion 22 relative to the plate portion 21. The crimped portion 34 is formed by a crimping method such as ultrasonic crimping or thermal crimping.

[0046] As shown in Figures 1 to 9, the sealing member 4 is a member for sealing the space between the cover body 31 and the plate portion 21. The sealing member 4 is formed in an endless shape. The sealing member 4 is, for example, a rectangular ring made of an elastic material. The sealing member 4 is fitted into a sealing groove 39 formed in the cover body 31 and surrounds the flow path 5 at the end face 31b of the cover body 31. The sealing member 4 has an outer diameter larger than the depth of the sealing groove 39 and is compressed between the cover body 31 and the plate portion 21 because the resin cover 3 is fixed to the metal base 2 by the crimping portion 34.

[0047] In the cooler 1 configured in this way, a supply-side refrigerant pipe is connected to the supply pipe section 32, and a discharge-side refrigerant pipe is connected to the discharge pipe section 33. Refrigerant is supplied from the supply-side refrigerant pipe to the supply channel 37 of the supply pipe section 32, and discharged from the discharge channel 38 of the discharge pipe section 33 to the discharge-side refrigerant pipe. The refrigerant supplied to the supply channel 37 of the supply pipe section 32 is supplied to the channel 5 from the inlet 35. The refrigerant supplied to the channel 5 from the inlet 35 flows through the inlet 35, the supply-side chamber region 54, the inlet region 52, the heat exchange region 51, the outlet region 53, the discharge-side chamber region 55, and the outlet 36, and is discharged from the outlet 36 to the discharge channel 38 of the discharge pipe section 33. At this time, the refrigerant supplied to the channel 5 from the inlet 35 temporarily accumulates in the supply-side chamber region 54, suppressing uneven flow in the width direction D2, and is then supplied from the inlet region 52 to the heat exchange region 51. Then, in the heat exchange region 51, the refrigerant exchanges heat with the heat exchange section 22, thereby cooling the object to be cooled.

[0048] As described above, the housing portion 31a of the resin cover 3 that houses the heat exchange portion 22 is spaced apart from the heat exchange portion 22, creating a gap between the housing portion 31a and the heat exchange portion 22. However, if there is a gap between the through hole 24 and the boss portion 34a, the boss portion 34a may move in the through hole 24, potentially changing the positional relationship between the housing portion 31a and the heat exchange portion 22. Such movements include, for example, the movement of the resin cover 3 sliding uniaxially relative to the metal base 2, the movement of the resin cover 3 rotating relative to the metal base 2, and movements that combine such sliding and rotation. Uniaxial sliding includes, for example, sliding in the width direction D2, sliding in the length direction D3, and sliding in a direction inclined with respect to the width direction D2 and the length direction D3. Rotation is, for example, rotation around an axis parallel to the overlapping direction D1. Furthermore, if the gap between the through-hole 24 and the boss portion 34a is large, during the manufacturing of the cooler 1, the movement of the boss portion 34a in the through-hole 24 may cause the housing portion 31a to come into contact with the heat exchange portion 22, potentially causing deformation of the heat exchange portion 22. Also, even in the manufactured cooler 1, if the gap between the through-hole 24 and the boss portion 34a is large, the movement of the boss portion 34a in the through-hole 24 may cause the housing portion 31a to come into contact with the heat exchange portion 22, potentially causing deformation of the heat exchange portion 22. The heat exchange portion 22 is designed to efficiently exchange heat with the refrigerant, but if the heat exchange portion 22 deforms, the heat exchange efficiency with the refrigerant may decrease, potentially reducing the cooling efficiency of the object being cooled.

[0049] Therefore, as shown in Figures 7 and 8, the resin cover 3 has a shape that prevents the heat exchange section 22 from contacting the housing section 31a even when the boss section 34a moves through the through hole 24. Furthermore, the maximum gap dimension A between the boss section 34a and the through hole 24 is smaller than the minimum gap dimension B between the heat exchange section 22 and the housing section 31a in the width direction D2 and the length direction D3, which are directions perpendicular to the axis of the boss section 34a. The maximum gap dimension A between the boss section 34a and the through hole 24 can be, for example, the value obtained by subtracting the outer diameter of the boss section 34a from the diameter of the through hole 24. As shown in Figure 9, if the gap between the heat exchange section 22 and the housing section 31a differs depending on the location, the minimum gap dimension B between the heat exchange section 22 and the housing section 31a is, for example, the dimension (distance) of the gap between the heat exchange section 22 and the housing section 31a at the position where the heat exchange section 22 and the housing section 31a are closest to each other.

[0050] Next, the method for manufacturing the cooler according to this embodiment will be described. The method for manufacturing the cooler according to this embodiment is the method for manufacturing the cooler 1 described above.

[0051] In the method for manufacturing a cooler according to this embodiment, a preparation step is performed first. Figure 11 is a perspective view showing the preparation step in the method for manufacturing a cooler according to this embodiment. As shown in Figure 11, in the preparation step, a metal base 2 for cooling the object to be cooled, a resin cover 103 that forms a flow path 5 through which a refrigerant flows between the metal base 2 and the resin cover 103, and a sealing member 4 are prepared.

[0052] The metal base 2 prepared in the preparation step is the same as the metal base 2 of the cooler 1 described above, and has a plate portion 21 formed in the shape of a flat plate and a heat exchange portion 22 arranged on the plate portion 21. The plate portion 21 has a plurality of through holes 23 for fixing the plate portion 21 to the object to be cooled, and a plurality of through holes 24 for fixing the resin cover 103 to the metal base 2.

[0053] The resin cover 103 prepared in the preparation step is basically the same as the resin cover 3 of the cooler 1 described above, but differs from the resin cover 3 of the cooler 1 described above only in that it has multiple boss portions 134 that can be inserted into multiple through holes 24 instead of multiple crimping portions 34.

[0054] The boss portion 134 is the part that becomes the crimped portion 34 of the cooler 1. The boss portion 134 is basically the same as the boss portion 34a of the crimped portion 34, except that it is longer than the boss portion 34a of the crimped portion 34. In other words, the boss portion 134 extends in a rod shape from the end face 31b of the cover body 31, just like the boss portion 34a. Also, the outer diameter of the boss portion 134 is less than or equal to the hole diameter (inner diameter) of the through hole 24, just like the boss portion 34a.

[0055] The sealing member 4 prepared in the preparation step is the same as the sealing member 4 of the cooler 1 described above, and is formed in an endless shape.

[0056] In the method for manufacturing the cooler according to this embodiment, a crimping process is performed next. Figure 12 is a plan view showing the crimping process in the method for manufacturing the cooler according to this embodiment. Figure 13 is a cross-sectional view taken along the line XIII-XIII shown in Figure 12. Figure 14 is a cross-sectional view taken along the line XIV-XIV shown in Figure 12. As shown in Figures 12 to 14, in the crimping process, first, the sealing member 4 is fitted into the sealing groove 39 of the resin cover 103. Then, the end face 31b of the resin cover 103 and the second face 21b of the metal base 2 are brought into opposition, and each of the multiple boss portions 134 of the resin cover 103 is inserted into each of the multiple through holes 24 of the metal base 2. This results in the sealing member 4 being positioned between the metal base 2 and the resin cover 103.

[0057] In the crimping process, the sealing member 4 is then pressed between the metal base 2 and the resin cover 103. The pressing of the sealing member 4 by the metal base 2 and the resin cover 103 can be done, for example, by pressing the metal base 2 and the resin cover 103 toward each other in the overlapping direction D1 using a pressing jig (not shown). At this time, it is preferable to press the metal base 2 and the resin cover 103 toward each other in the overlapping direction D1 until the second surface 21b of the metal base 2 and the end surface 31b of the resin cover 103 come into contact.

[0058] In the crimping process, the resin cover 103 is then fixed to the metal base 2 by crimping while the sealing member 4 is pressed between the metal base 2 and the resin cover 103. Figure 15 is a cross-sectional view showing the boss portion inserted into the through hole. As shown in Figure 15, when the boss portion 134 is inserted into the through hole 24, the tip portion 134a of the boss portion 134 protrudes from the first surface 21a of the plate portion 21. In the crimping process, the tip portion 134a of the boss portion 134 that protrudes from the first surface 21a of the plate portion 21 is melted and widened so that it locks onto the plate portion 21 from the side opposite to the first surface 21a of the plate portion 21. In other words, by melting the tip portion 134a of the plate portion 21, the tip portion 13 is widened in the width direction D2 and the length direction D3 so that it contacts the first surface 21a of the plate portion 21. This forms the crimped portion 34 of the cooler 1. In other words, the portion inserted into the through hole 24 of the boss portion 134 becomes the boss portion 34a of the cooler 1, and the portion that protrudes and spreads out from the first surface 21a of the plate portion 21 of the boss portion 134 becomes the hat portion 34b of the cooler 1. Such crimping can be carried out by, for example, ultrasonic crimping or thermal crimping. Note that the crimping of the resin cover 103 to the metal base 2 may be performed after the pressing of the sealing member 4 by the metal base 2 and the resin cover 103, or it may be performed at the same time as the pressing of the sealing member 4 by the metal base 2 and the resin cover 103.

[0059] Here, when attempting to insert the boss portion 134 into the through hole 24, if the position of the resin cover 103 is misaligned with respect to the metal base 2, the boss portion 134 will not be inserted into the through hole 24 and will instead rest on the first surface 21a of the plate portion 21. In this case, if the boss portion 134 is short, when the boss portion 134 rests on the first surface 21a of the plate portion 21, the housing portion 31a may come into contact with the heat exchange portion 22, potentially causing the heat exchange portion 22 to deform.

[0060] Therefore, as shown in Figures 13 and 14, the resin cover 103 prepared in the preparation step has a boss portion 134 with a length C such that when the boss portion 134 contacts the second surface 21b of the plate portion 21, the resin cover 103 does not contact the heat exchange portion 22. Also, the resin cover 103 prepared in the preparation step has a boss portion 134 with a length C that is longer than the height D of the heat exchange portion 22 relative to the plate portion 21. The height D of the heat exchange portion 22 relative to the plate portion 21 is the dimension (height) in the overlapping direction D1 from the second surface 21b of the plate portion 21 to the maximum height position of the heat exchange portion 22.

[0061] Furthermore, similar to the cooler 1, the resin cover 103 prepared in the preparation step has a shape such that when the boss portion 34a is inserted into the through hole 24, the heat exchange portion 22 does not come into contact with the housing portion 31a even if the boss portion 34a moves in a direction perpendicular to the axis of the boss portion within the through hole 24. Also, similar to the cooler 1, the metal base 2 and the resin cover 103 prepared in the preparation step have a relationship such that the maximum gap dimension E between the boss portion 134 and the through hole 24 is smaller than the minimum gap dimension F between the heat exchange portion 22 and the housing portion 31a in the width direction D2 and length direction D3, which are directions perpendicular to the axis of the boss portion 134.

[0062] As described above, in the cooler 1 according to this embodiment, a sealing member 4 is placed between the metal base 2 and the resin cover 3, and the resin cover 3 is fixed to the metal base 2 by a crimped portion 34 of the resin cover 3 which is inserted into a through hole 24 formed in the plate portion 21 of the metal base 2. Therefore, even without high dimensional accuracy of the metal base 2 and the resin cover 3, sufficient airtightness reliability between the metal base 2 and the resin cover 3 can be maintained. This makes it possible to improve the airtightness reliability between the metal base 2 and the resin cover 3 while suppressing an increase in manufacturing costs.

[0063] Furthermore, in this cooler 1, the crimping portion 34 has a boss portion 34a that is inserted into the through hole 24 and a hat portion 34b that extends from the tip of the boss portion 34a and engages with the plate portion 21 from the opposite side of the heat exchange portion 22 relative to the plate portion 21, thereby effectively preventing the resin cover 3 from falling off the metal base 2.

[0064] Furthermore, in this cooler 1, the hat portion 34b is in contact with the first surface 21a of the plate portion 21 that is opposite to the heat exchange portion 22, allowing the hat portion 34b to be locked to the plate portion 21 with a simple configuration.

[0065] Furthermore, in this cooler 1, the resin cover 3 has a shape that prevents the heat exchange section 22 from contacting the housing section 31a even when the boss section 34a moves through the through hole 24. This prevents the housing section 31a from contacting the heat exchange section 22 and causing deformation of the heat exchange section 22. Therefore, even if the resin cover 3 slides uniaxially relative to the metal base 2, rotates relative to the metal base 2, or undergoes a combination of such sliding and rotating movements, the housing section 31a can contact the heat exchange section 22 and prevent deformation of the heat exchange section 22.

[0066] Furthermore, in this cooler 1, in the width direction D2 and length direction D3, which are perpendicular to the axis of the boss portion 34a, the maximum gap dimension A between the boss portion 34a and the through hole 24 is smaller than the minimum gap dimension B between the heat exchange portion 22 and the housing portion 31a. This prevents the heat exchange portion 22 from coming into contact with the housing portion 31a even when the boss portion 34a moves in the through hole 24. As a result, it is possible to prevent the housing portion 31a from coming into contact with the heat exchange portion 22 and causing the heat exchange portion 22 to deform.

[0067] Furthermore, in this cooler 1, the heat exchange section 22 is composed of fins, which allows for high heat exchange performance.

[0068] In the manufacturing method of the cooler according to this embodiment, a sealing member 4 is placed between the metal base 2 and the resin cover 103, and the resin cover 103 is fixed to the metal base 2 by crimping while the sealing member 4 is pressed between the metal base 2 and the resin cover 103. Therefore, even without high dimensional accuracy of the metal base 2 and the resin cover 103, sufficient airtightness reliability between the metal base 2 and the resin cover 103 can be maintained. This makes it possible to improve the airtightness reliability between the metal base 2 and the resin cover 103 while suppressing an increase in manufacturing costs.

[0069] Furthermore, in this method of manufacturing the cooler, the resin cover 103 can be properly fixed to the metal base 2 by ultrasonic crimping or heat crimping.

[0070] Furthermore, in this method of manufacturing the cooler, the boss portion 134 of the resin cover 103 is inserted into the through hole 24 of the plate portion 21 of the metal base 2, and the tip portion 134a of the boss portion 134 protruding from the plate portion 21 is melted and expanded so that it locks onto the plate portion 21 from the opposite side of the heat exchange portion 22 relative to the plate portion 21, thereby firmly fixing the resin cover 103 to the metal base 2.

[0071] Furthermore, in this method of manufacturing the cooler, the tip portion 134a of the boss portion 134 is melted and brought into contact with the first surface 21a of the plate portion 21 opposite to the heat exchange portion 22, thereby allowing it to be locked to the plate portion 21 with a simple configuration.

[0072] Furthermore, in this method of manufacturing the cooler, the resin cover 103 prepared in the preparation step has a boss portion 134 of such length C that when the boss portion 134 contacts the second surface 21b of the plate portion 21 on the resin cover 103 side, the resin cover 103 does not come into contact with the heat exchange portion 22. This prevents the resin cover 103 from coming into contact with the heat exchange portion 22 and deforming the heat exchange portion 22 when the position of the resin cover 3 relative to the metal base 2 shifts and the boss portion 134 does not enter the through hole 24.

[0073] Furthermore, in this method of manufacturing the cooler, the length C of the boss portion 134 is longer than the height D of the heat exchange portion 22 relative to the plate portion 21. This prevents the resin cover 103 from contacting the heat exchange portion 22 even if the position of the resin cover 3 relative to the metal base 2 is misaligned and the boss portion 134 does not fit into the through hole 24, and the boss portion 134 contacts the second surface 21b of the plate portion 21 on the resin cover 3 side. As a result, when the position of the resin cover 3 relative to the metal base 2 is misaligned and the boss portion 134 does not fit into the through hole 24, it is possible to prevent the resin cover 103 from contacting the heat exchange portion 22 and causing deformation of the heat exchange portion 22.

[0074] Furthermore, in this method of manufacturing the cooler, the resin cover 103 prepared in the preparation step has a shape such that even if the boss portion 134 moves in a direction perpendicular to the axis of the boss portion 134 within the through hole 24 when the boss portion 134 is inserted into the through hole 24, the heat exchange portion 22 does not come into contact with the housing portion 31a. This prevents the housing portion 31a from coming into contact with the heat exchange portion 22 and causing deformation of the heat exchange portion 22 when the boss portion 134 is inserted into the through hole 24. For this reason, even if the resin cover 103 slides uniaxially relative to the metal base 2, rotates relative to the metal base 2, or undergoes a combination of such sliding and rotating movements, it is possible to prevent the housing portion 31a from coming into contact with the heat exchange portion 22 and causing deformation of the heat exchange portion 22 when the boss portion 134 is inserted into the through hole 24.

[0075] Furthermore, in this method of manufacturing the cooler, the metal base 2 and resin cover 103 prepared in the preparation step have a relationship such that when the boss portion 134 is inserted into the through hole 24, the maximum gap dimension E between the boss portion 134 and the through hole 24 is smaller than the minimum gap dimension F between the heat exchange portion 22 and the housing portion 31a in a direction perpendicular to the axis of the boss portion 134. As a result, when the boss portion 134 is inserted into the through hole 24, even if the boss portion 134 moves in a direction perpendicular to the axis of the boss portion within the through hole 24, it is possible to suppress the heat exchange portion 22 from coming into contact with the housing portion 31a. This prevents the housing portion 31a from coming into contact with the heat exchange portion 22 and deforming the heat exchange portion 22 when the boss portion 134 is inserted into the through hole 24.

[0076] Although embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above.

[0077] For example, in the above embodiment, the hat portion of the crimping part was described as being formed in a dome shape. However, the hat portion of the crimping part may be formed in any shape as long as it extends from the tip of the boss portion and contacts the first surface of the plate portion opposite to the heat exchange portion. For example, it may be formed in a dome shape with a concave center, as shown in the hat portion 34b of Figure 16(a), or it may be formed in a disc shape, as shown in the hat portion 34b of Figure 16(b).

[0078] Furthermore, in the above embodiment, as an example, it was described that the hat portion of the crimped portion contacts the first surface of the plate portion opposite to the heat exchange portion, thereby locking the hat portion to the plate portion from the opposite side of the heat exchange portion relative to the plate portion. However, as long as the hat portion locks to the plate portion from the opposite side of the heat exchange portion relative to the plate portion, the shape of the metal base and the resin cover, the contact position between the hat portion and the plate portion, etc., are not particularly limited. For example, as shown in Figures 17(a) and 17(b), the plate portion 21 of the metal base 2 has a recess 21c that is recessed along the through hole 24 from the first surface 21a of the plate portion 21 opposite to the heat exchange portion 22 toward the second surface 21b of the plate portion 21 on the heat exchange portion 22 side, and the hat portion 34b of the crimped portion 34 may be embedded in the recess 21c. The recess 21c shown in Figure 17(a) is a disc-shaped recess that is recessed with the same diameter in the overlapping direction D1. In this case, the hat portion 34b is locked to the plate portion 21 from the opposite side of the heat exchange portion 22 relative to the plate portion 21 by contacting the bottom surface of the recess 21c. The recess 21c shown in Figure 17(b) is a conical (tapered) recess that is recessed while decreasing in diameter in the overlapping direction D1. In this case, the hat portion 34b is locked to the plate portion 21 from the opposite side of the heat exchange portion 22 relative to the plate portion 21 by contacting the conical surface (tapered surface) of the recess 21c.

[0079] In the manufacturing method of such a cooler, the metal base 2 prepared in the preparation step has a plate portion 21 that has a recess 21c that extends from the first surface 21a of the plate portion 21 opposite to the heat exchange portion 22 towards the second surface 21b of the plate portion 21 on the heat exchange portion 22 side, along the through hole 24. Then, in the crimping step, the tip portion 134a of the boss portion 134 is melted and embedded in the recess 21c.

[0080] In such a cooler, the hat portion 34b is embedded in the recess 21c of the plate portion 21, which allows the first surface 21a of the plate portion 21 opposite to the heat exchange portion 22 to be flattened. This makes it easier to attach the plate portion 21 to the object to be cooled and increases the contact area between the plate portion 21 and the object to be cooled. Similarly, in the manufacturing method of such a cooler, the tip portion 134a of the boss portion 134 is melted in the crimping process and embedded in the recess 21c, which allows the first surface 21a of the plate portion 21 opposite to the heat exchange portion 22 to be flattened. This makes it easier to attach the plate portion 21 to the object to be cooled and increases the contact area between the plate portion 21 and the object to be cooled.

[0081] Furthermore, the supply pipe section and the discharge pipe section may be modified as appropriate depending on the shape of the refrigerant pipe to which they are connected and the connection structure to the refrigerant pipe.

[0082] Figure 18 is a plan view showing a modified cooler. The modified cooler 1A shown in Figure 18 is equipped with a resin cover 3A instead of the resin cover 3 of the above embodiment. The resin cover 3A is provided with a supply pipe section 32A and a discharge pipe section 33A instead of the supply pipe section 32 and discharge pipe section 33 of the above embodiment. The supply pipe section 32A and the discharge pipe section 33A are formed in a cylindrical (pipe-like) shape and extend in a straight line, similar to the supply pipe section 32 and the discharge pipe section 33 of the above embodiment. In addition, the supply pipe section 32A and the discharge pipe section 33A are formed with a supply channel 37 that communicates with the inlet 35 and a discharge channel 38 that communicates with the outlet 36, similar to the supply pipe section 32 and the discharge pipe section 33 of the above embodiment. The tips of the supply pipe section 32A and the discharge pipe section 33A are tapered to facilitate connection of the supply-side refrigerant pipe and the discharge-side refrigerant pipe. Furthermore, the supply pipe section 32A and the discharge pipe section 33A have two bulges formed to prevent the connected supply-side refrigerant pipe and discharge-side refrigerant pipe from easily coming loose.

[0083] Figure 19 is a plan view showing another modified cooler. The cooler 1B of the other modified cooler shown in Figure 19 is equipped with a resin cover 3B instead of the resin cover 3 of the above embodiment. The resin cover 3B is provided with a supply pipe section 32B similar to the supply pipe section 32 of the above embodiment, and a discharge pipe section 33B similar to the discharge pipe section 33A of the cooler 1A shown in Figure 18.

[0084] Furthermore, although the above embodiment was described as having the supply pipe section 32 and the discharge pipe section 33 arranged to extend in opposite directions in the longitudinal direction D3, the supply pipe section and the discharge pipe section may be arranged to face any direction. For example, the supply pipe section and the discharge pipe section may be arranged in parallel so as to face the same direction in the width direction, or they may be arranged so as to face directions inclined with respect to the width direction and the length direction. [Explanation of Symbols]

[0085] 1...Cooler, 1A...Cooler, 1B...Cooler, 2...Metal base, 3,3A,3B...Resin cover, 103...Resin cover, 4...Sealing member, 5...Flow path, 21...Plate section, 21a...First surface, 21b...Second surface, 21c...Recess, 22...Heat exchange section, 23...Through hole, 24...Through hole, 31...Cover body, 31a...Housing section, 31b...End face, 32...Supply pipe section, 32A...Supply pipe section, 32B...Supply pipe section, 33...Discharge pipe section, 33A...Discharge pipe section, 33B...Discharge pipe section, 34...Crimped section, 34 a...Boss section, 34b...Hat section, 35...Inlet, 36...Outlet, 37...Supply channel, 38...Discharge channel, 39...Seal groove, 51...Heat exchange area, 52...Inlet area, 53...Outlet area, 54...Supply side chamber area, 54...Supply side chamber area, 55...Discharge side chamber area, 134...Boss section, 134a...Tip section, D1...Overlap direction, D2...Width direction, D3...Length direction, A...Maximum clearance dimension, B...Minimum clearance dimension, C...Length of boss section, D...Height of heat exchange section, E...Maximum clearance dimension, F...Minimum clearance dimension.

Claims

1. A metal base for cooling the object to be cooled, A resin cover is superimposed on the metal base to form a flow path between it and the metal base through which the refrigerant flows, The system comprises a sealing member disposed between the metal base and the resin cover, The metal base comprises a plate portion formed in the shape of a flat plate, a heat exchange portion disposed on the plate portion, and a through hole formed in the plate portion. The resin cover has a crimping portion that is inserted into the through hole and secures the resin cover to the metal base, and a housing portion that houses the heat exchanger. The crimping portion has a boss portion that is inserted into the through hole, and a hat portion that extends from the tip of the boss portion and engages with the plate portion from the opposite side of the heat exchange portion relative to the plate portion. The maximum clearance dimension between the boss portion and the through hole is smaller than the minimum clearance dimension between the heat exchange portion and the housing portion in a direction perpendicular to the axis of the boss portion. cooler.

2. The hat portion is in contact with the first surface of the plate portion opposite to the heat exchange portion. The cooler according to claim 1.

3. The plate portion has a recess that extends along the through hole from the first surface of the plate portion opposite to the heat exchange portion toward the second surface of the plate portion toward the heat exchange portion. The hat portion is embedded in the recess, The cooler according to claim 1.

4. The heat exchange section is composed of fins. The cooler according to claim 1.

5. Preparation steps include preparing a metal base for cooling the object to be cooled, a resin cover that forms a flow path for refrigerant to flow between the metal base and the base, and a sealing member. The system includes a crimping step in which the sealing member is placed between the metal base and the resin cover, and the resin cover is fixed to the metal base by crimping while the sealing member is pressed between the metal base and the resin cover, The metal base prepared in the above preparation step has a plate portion formed in the shape of a flat plate, a heat exchange portion disposed on the plate portion, and a through hole formed in the plate portion. The resin cover prepared in the above preparation step has a boss portion that can be inserted into the through hole, and the length of the boss portion is longer than the height of the heat exchange portion relative to the plate portion. In the crimping process described above, the boss portion is inserted into the through hole, and the tip of the boss portion protruding from the plate portion is melted and expanded so that it engages with the plate portion from the opposite side of the heat exchange portion relative to the plate portion. A method for manufacturing a cooler.

6. Preparation steps include preparing a metal base for cooling the object to be cooled, a resin cover that forms a flow path for refrigerant to flow between the metal base and the base, and a sealing member. The system includes a crimping step in which the sealing member is placed between the metal base and the resin cover, and the resin cover is fixed to the metal base by crimping while the sealing member is pressed between the metal base and the resin cover, The metal base prepared in the above preparation step has a plate portion formed in the shape of a flat plate, a heat exchange portion disposed on the plate portion, and a through hole formed in the plate portion. The resin cover prepared in the above preparation step has a boss portion that can be inserted into the through hole and a housing portion that houses the heat exchange portion. The metal base and the resin cover prepared in the above preparation step are such that, when the boss portion is inserted into the through hole, the maximum gap between the boss portion and the through hole is smaller than the minimum gap between the heat exchange portion and the housing portion in a direction perpendicular to the axis of the boss portion. In the crimping process described above, the boss portion is inserted into the through hole, and the tip of the boss portion protruding from the plate portion is melted and expanded so that it engages with the plate portion from the opposite side of the heat exchange portion relative to the plate portion. A method for manufacturing a cooler.

7. In the crimping process, the resin cover is fixed to the metal base by ultrasonic crimping or heat crimping. A method for manufacturing a cooler according to claim 5 or 6.

8. In the crimping process, the tip of the boss portion is melted and brought into contact with the first surface of the plate portion opposite to the heat exchange portion. A method for manufacturing a cooler according to claim 5 or 6.

9. The metal base prepared in the above preparation step has a plate portion having a recess that extends from the first surface of the plate portion opposite to the heat exchange portion toward the second surface of the plate portion toward the heat exchange portion along the through hole, In the crimping process, the tip of the boss portion is melted and embedded in the recess. A method for manufacturing a cooler according to claim 5 or 6.

10. The resin cover prepared in the above preparation step has a boss portion of such length that the resin cover does not come into contact with the heat exchange portion when the boss portion comes into contact with the second surface of the plate portion on the resin cover side. A method for manufacturing a cooler according to claim 5 or 6.

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