Conveying mechanism, resin molding apparatus, and method for manufacturing resin molded products

Abstract

To efficiently suck gas generated by resin molding.SOLUTION: A conveyance mechanism 6 for conveying a conveyed article P from a mold-opened upper mold 3 or a lower mold 4 is provided with a main body portion 60 that enters a space between the mold-opened upper mold 3 and the lower mold 4. A leading end surface 60a in the main body portion 60 in an advancing direction is formed with suction ports 6x that suck gas.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a conveying mechanism, a resin molding apparatus, and a method for manufacturing a resin molded product.

Background Art

[0002] In conventional resin sealing devices, as shown in Patent Document 1, there are those that remove outgases (volatile gases) generated from resin components, additives, etc., to prevent soiling of the mold surface and molding defects caused by the outgases.

[0003] Specifically, in this resin sealing device, a clean air supply unit is provided on the top plate portion of the device housing, and an air suction duct is provided on the side opposite to the clean air supply unit side with the sealing mold sandwiched therebetween. Thereby, a clean air flow is formed that crosses between the upper and lower molds of the sealing mold, and outgases (volatile gases) generated in the sealing mold and foreign substances including resin components are suction-removed.

[0004] However, since clean air is supplied from the outside of the sealing mold and outgases are suction-removed from the outside of the sealing mold as described above, there is a possibility that outgases may stay near the lower surface of the upper mold or near the upper surface of the lower mold, resulting in insufficient removal of outgases.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] Therefore, the present invention has been made to solve the above problems, and its main problem is to efficiently suck the gas generated by resin molding.

Means for Solving the Problems

[0007] In other words, the conveying mechanism according to the present invention is a conveying mechanism for conveying a material from an open upper or lower mold, and is characterized by comprising a main body that enters the space between the open upper and lower molds, and having a suction port formed on the leading edge surface of the main body in the direction of entry for drawing in gas. [Effects of the Invention]

[0008] According to the present invention configured in this way, gas generated by resin molding can be efficiently aspirated. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic plan view showing the configuration of a resin molding apparatus according to one embodiment of the present invention. [Figure 2] This is a schematic cross-sectional view showing the configuration (mold open state) of the resin molding module in the same embodiment. [Figure 3] This is a schematic cross-sectional view showing the configuration (clammed state) of the resin molding module in the same embodiment. [Figure 4] This is a schematic plan view showing the configuration of the main body of the substrate transport mechanism in the same embodiment. [Figure 5] This is a schematic front view showing the configuration of the main body of the substrate transport mechanism in the same embodiment. [Figure 6] This is a schematic cross-sectional view along the KK line showing the configuration of the main body of the substrate transport mechanism in the same embodiment. [Figure 7] This is a schematic diagram showing the main body components separated in the same embodiment. [Figure 8] This is a schematic diagram showing a specific example of the gas suction operation in the same embodiment. [Figure 9] This is a schematic diagram showing a specific example of the gas suction operation in the same embodiment. [Figure 10] This is a schematic diagram showing a modified example of the gas suction operation in the same embodiment. [Figure 11] This is a schematic cross-sectional view showing the configuration of the resin material transport mechanism in a modified embodiment. [Figure 12] This is a schematic diagram showing the gas suction operation of the resin material transport mechanism in a modified embodiment. [Modes for carrying out the invention]

[0010] Next, the technology according to the present invention will be described in more detail with examples. However, the present invention is not limited to the following technologies.

[0011] The conveying mechanism of Technology 1 according to the present invention is a conveying mechanism for conveying an object from an open upper or lower mold, and is characterized in that it comprises a main body that enters the space between the open upper and lower molds, and a suction port for drawing in gas is formed on the leading edge of the main body in the direction of entry.

[0012] With this conveying mechanism, the main body, which enters the space between the opened upper and lower molds, has a suction port formed on its leading edge in the direction of entry, allowing for efficient suction of gases generated during resin molding. As a result, it is possible to prevent the upper mold, lower mold, and surrounding components from becoming contaminated by gases generated during resin molding. Furthermore, since the conveying mechanism enters the space between the upper and lower molds immediately after they are opened, it can efficiently suction the gases generated during mold opening. Moreover, because the main body of the conveying mechanism suctions the gas, its configuration can be simplified compared to configurations where suction mechanisms are provided on other components.

[0013] In addition to the configuration of the above-described technology 1, it is desirable that the transport mechanism of technology 2 according to the present invention has a suction port for drawing in gas formed on the upper surface of the main body facing the upper mold or the lower surface facing the lower mold. With this configuration, gases accumulating particularly near the mold surface of the upper mold or the lower mold can be efficiently suctioned out.

[0014] The transport mechanism of Technology 3 according to the present invention, in addition to the configuration of the above Technology 1 or 2, the suction port and the flow path connected to the suction port are composed of a plurality of components, and it is desirable that the plurality of components are configured to be detachable by being divided. With this configuration, since the plurality of components are configured to be detachable by being divided, maintenance such as replacement and cleaning of each component can be easily performed.

[0015] The transport mechanism of Technology 4 according to the present invention, in addition to any one of the configurations of the above Technologies 1 to 3, it is desirable that the main body portion has a holding main body that holds the transported object and a front suction member provided at an end portion in the entry direction of the holding main body, where the suction port is formed. With this configuration, by simply providing a front suction member on the holding main body, a suction port can be provided in the main body portion of the transport mechanism. For example, by externally attaching a front suction member to an existing transport mechanism, a gas suction function can be imparted to the transport mechanism without making a major design change to the existing transport mechanism.

[0016] The transport mechanism of Technology 5 according to the present invention, in addition to the configuration of the above Technology 4, the holding main body has a rectangular shape in plan view, the front suction member is provided on the front side portion thereof, and it is desirable that a side suction member having a suction port for sucking gas is provided on at least one of the left and right side portions of the holding main body. With this configuration, since it has not only a front suction member but also a side suction member, for example, gas that has not been sucked by the suction port of the front suction member can be sucked, and gas in the space between the upper mold and the lower mold can be sucked more efficiently.

[0017] The transport mechanism of Technology 6 according to the present invention, in addition to the configuration of the above Technology 5, it is desirable that the front suction member and the side suction member are connected to each other by a piping member. With this configuration, the piping configuration in the main body portion can be simplified, and the configuration for providing a suction function in the main body portion can be made more compact.

[0018] The transport mechanism of the technology 7 according to the present invention is preferably configured so that the amount of gas drawn in from the suction port can be adjusted. With this configuration, the amount of gas drawn in can be changed during the gas suction operation. For example, the amount of gas drawn can be changed to a predetermined amount at each of several intervals during the gas suction operation. Also, if a constant amount of gas is drawn in continuously, the mold surfaces of the upper and lower molds will cool down, which may change the molding conditions. By making the amount of gas drawn in adjustable, it is possible to prevent the mold surfaces of the upper and lower molds from cooling down. Furthermore, the amount of gas drawn in can be changed depending on the type of object to be molded or the type of material being conveyed, such as resin material.

[0019] Furthermore, the resin molding apparatus of Technology 8 according to the present invention includes a molding die having an upper mold and a lower mold, and the upper mold and lower mold Clamp the mold The invention is characterized by comprising a mold clamping mechanism and a transport mechanism having one of the configurations described in technologies 1 to 7 above. This resin molding apparatus allows for the efficient suction of gases generated during resin molding using a transport mechanism. As a result, it prevents the upper mold, lower mold, and surrounding components from becoming contaminated with gases generated during resin molding, thereby improving the quality of the molded resin products.

[0020] In addition to the configuration of the above-described technology 8, the resin molding apparatus of technology 9 according to the present invention preferably has walls covering the front, back and sides of the molding die, and opening and closing shutters for the transport mechanism to enter. With this configuration, the volume of the space in which the gas generated by resin molding spreads can be reduced, and the gas can be efficiently sucked out by the suction port of the transport mechanism.

[0021] In addition to the configuration of the above-described technology 8 or 9, it is desirable that the resin molding apparatus of technology 10 according to the present invention starts the suction operation by the suction port before the transport mechanism enters the space between the opened upper and lower molds. This configuration allows for efficient suction of gases generated during resin molding, while also reducing the time required for gas suction.

[0022] Furthermore, the method for manufacturing a resin molded product according to Technology 11 of the present invention is a method for manufacturing a resin molded product using any one of the resin molding apparatuses of the above technologies 8 to 10, and is characterized by including a resin molding step of performing resin molding on an object to be molded, and a discharge step of dischargeing the resin molded product from the mold using the conveying mechanism. This method of manufacturing resin molded products allows for the efficient removal of gases generated during resin molding using a transport mechanism. As a result, it is possible to prevent gases generated during resin molding from adhering to and contaminating the upper mold, lower mold, and surrounding components, thereby improving the quality of the resin molded products.

[0023] <One Hundred Ideas> An embodiment of the resin molding apparatus according to the present invention will be described below with reference to the drawings. Please note that all of the following diagrams are simplified and simplified for clarity. The same components are denoted by the same symbols, and explanations are omitted as appropriate.

[0024] <Basic configuration of resin molding apparatus 100> The resin molding apparatus 100 of this embodiment manufactures a resin molded product P by resin molding using a thermosetting resin material J to encase electronic components (not shown) fixed to a substrate W, which is the object to be molded.

[0025] Here, the substrate W can be, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit board, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc. The electronic component can be, for example, a semiconductor chip, a resistor, a capacitor, or an electronic component in which at least one of these electronic components is resin-encapsulated. Furthermore, the resin material J can be, for example, a liquid resin, a granular resin, a sheet resin, a tablet resin, a granular resin, etc. The resin material J may also be a thermoplastic material.

[0026] As shown in Figure 1, the resin molding apparatus 100 comprises a substrate supply / storage module A, a resin molding module B, a film cutting module C, and a resin material supply module D as its components. Each component (each module A to D) is detachable and interchangeable with respect to the other component.

[0027] The substrate supply and storage module A includes a pre-molded substrate supply unit 1 for supplying pre-molded substrates W, and a molded substrate storage unit 2 for storing molded substrates W (resin molded products P).

[0028] The resin molding module B includes an upper mold 3, which is a mold for holding the substrate W; a lower mold 4, which is a mold in which a cavity 4C is formed; and a clamping mechanism 5 for clamping the upper mold 3 and the lower mold 4. By clamping the upper mold 3 and the lower mold 4, the electronic components fixed to the substrate W are resin-encapsulated by resin molding using a resin material J. The specific configuration of the resin molding module B will be described later.

[0029] Here, the substrate supply and storage module A and the resin molding module B are provided with a substrate transport mechanism 6 for transporting the substrate W before molding and the resin molded product P.

[0030] This substrate transport mechanism 6 moves along a rail (not shown) that extends across the substrate supply / storage module A and the resin molding module B, and is configured to be movable in at least the X and Y directions within the substrate supply / storage module A and the resin molding module B.

[0031] Furthermore, the substrate transport mechanism 6 transports the unmolded substrate W from the substrate supply / storage module A to the resin molding module B, and in the resin molding module B, it supplies the unmolded substrate W to the molds 3 and 4. After the resin molding of the unmolded substrate W, the substrate transport mechanism 6 receives the resin molded product P from the molds 3 and 4 in the resin molding module B and transports it to the substrate supply / storage module A. The specific configuration of the substrate transport mechanism 6 will be described later.

[0032] The film cutting module C includes a film cutting section 7 for cutting the release film F and a film holding section 9 for holding the cut release film F in a film holding frame 8.

[0033] The resin material supply module D has a resin material supply unit 10, such as a dispenser, that supplies liquid resin to a film holding frame 8 that holds a release film F. The resin material supply unit 10 has a resin discharge unit 11 at its tip that discharges liquid resin. In addition to supplying liquid resin, the resin material supply module D may also supply other forms of resin material J, such as granular resin, sheet resin, tablet resin, or granular resin.

[0034] Here, the film cutting module C, the resin material supply module D, and the resin molding module B are provided with a film holding frame 8 and a resin material transport mechanism 12 for transporting the resin material J.

[0035] This resin material transport mechanism 12 moves along rails (not shown) that extend across the film cutting module C, the resin material supply module D, and the resin molding module B. The resin material transport mechanism 12 is configured to be movable in at least the X and Y directions within the film cutting module C, the resin material supply module D, and the resin molding module B.

[0036] Furthermore, the resin material transport mechanism 12 transports the film holding frame 8, which holds the release film F, from the film cutting module C to the resin material supply module D. Then, the resin material transport mechanism 12 transports the film holding frame 8, to which the resin material J has been supplied in the resin material supply module D, from the resin material supply module D to the resin molding module B, and in the resin molding module B, the release film F and resin material J are supplied to the molds 3 and 4. After resin molding of the substrate W before molding, the resin material transport mechanism 12 can also collect the used release film F from the molds 3 and 4 in the resin molding module B and dispose of the used release film F in the waste section (not shown) in the film cutting module C.

[0037] <Specific configuration of resin molding module B> Next, the specific configuration of the resin molding module B in this embodiment will be described below.

[0038] As described above, the resin molding module B, as shown in Figures 2 and 3, includes an upper mold 3 for holding the substrate W, a lower mold 4 in which a cavity 4C is formed, and a mold clamping mechanism 5 to which the upper mold 3 and lower mold 4 are attached and which clamps the upper mold 3 and lower mold 4.

[0039] The mold clamping mechanism 5 includes an upper fixed platen 51 to which the upper mold 3 is attached, a movable platen 52 to which the lower mold 4 is attached, and a drive mechanism 53 for moving the movable platen 52 up and down.

[0040] The upper fixing plate 51 has the upper mold 3 attached to its lower surface and is fixed to the upper ends of multiple support columns 55 that are erected on the lower fixing plate 54.

[0041] The movable platen 52 has the lower mold 4 attached to its upper surface and is supported by multiple support columns 55 so as to be able to move up and down so as to face the upper fixed platen 51. Alternatively, two plate-shaped members with opposing plate surfaces may be used instead of multiple support columns 55. The two plate-shaped members extend in the vertical direction, and the movable platen 52 is supported by the two plate-shaped members so as to be able to move up and down so as to face the upper fixed platen 51.

[0042] The drive mechanism 53 is located between the movable platen 52 and the lower fixed platen 54, and clamps the upper mold 3 and the lower mold 4 and applies a predetermined molding pressure by moving the movable platen 52 up and down. In this embodiment, the drive mechanism 53 is a linear motion type that transmits rotation from a servo motor or the like to the movable platen 52 using a ball screw mechanism 531 that converts rotation into linear motion, but it may also be a link type that transmits power from a power source such as a servo motor to the movable platen 52 using a link mechanism such as a toggle link.

[0043] A lower die holder 56 is provided between the lower die 4 and the movable platen 52. This lower die holder 56 is equipped with a heater plate or the like (not shown) for heating the lower die 4. A side wall member 561 surrounding the lower die 4 is provided on the upper surface of the lower die holder 56, and a sealing member 562 is provided at the upper end of the side wall member 561.

[0044] An upper mold holder 57 is provided between the upper mold 3 and the upper fixing plate 51. This upper mold holder 57 is equipped with a heater plate or the like (not shown) for heating the upper mold 3. A side wall member 571 surrounding the upper mold 3 is provided on the lower surface of the upper mold holder 57, and a sealing member 572 is provided at the lower end of the side wall member 571. When the mold is clamped by the drive mechanism 53, the sealing member 562 of the side wall member 561 and the sealing member 572 of the side wall member 571 come into close contact (see Figure 3), sealing the space housing the upper mold 3 and the lower mold 4 from the outside air, and creating a vacuum state by an exhaust mechanism (not shown). Note that the configuration may be made without either the sealing member 562 or the sealing member 572.

[0045] The upper mold 3 holds the back surface of the substrate W by suction. Suction holes (not shown) are formed on the lower surface of the upper mold 3, and a suction channel (not shown) is formed inside the upper mold 3. This internal channel is connected to an external suction device (not shown).

[0046] As shown in Figure 2, the lower mold 4 has a cavity 4C formed therein for housing electronic components and resin material J fixed to the substrate W. Specifically, the lower mold 4 has a bottom member 401 that forms the bottom surface of the cavity 4C and a side member 402 that surrounds the bottom member 401. The cavity 4C is formed by the upper surface of the bottom member 401 and the inner circumferential surface of the side member 402. In this embodiment, the bottom member 401 is a flat plate with a rectangular shape in plan view, and the side member 402 has a rectangular frame shape in plan view. The side member 402 is provided so as to be movable up and down relative to the bottom member 401. Specifically, it is supported by a plurality of elastic members 404 such as coil springs on the base plate 403 of the lower mold 4. In this embodiment, the lower mold 4 is covered with a release film F to improve the release properties of the resin molded product P.

[0047] <Specific configuration of the substrate transport mechanism 6> Next, the specific configuration of the substrate transport mechanism 6 in this embodiment will be described below.

[0048] In the resin molding apparatus 100 of this embodiment, a gas suction function is provided in the substrate transport mechanism 6 that transports the substrate W before molding and the resin molded product P.

[0049] The gas drawn in by the substrate transport mechanism 6 is the gas generated by resin molding, specifically the gas released to the outside when the mold opens from components contained in the materials supplied to the molds 3 and 4 (e.g., release film F, resin material J, or substrate W before molding). The materials supplied to the molds 3 and 4 are heated. When the resin material J is heated, its viscosity decreases, causing the gas contained in the resin material J to move and be released to the outside when the mold opens. Similarly, when the release film F and substrate W before molding are heated, the components contained in the release film F and substrate W before molding vaporize, and the gas is released to the outside when the mold opens.

[0050] Specifically, as shown in Figures 4 to 7, the substrate transport mechanism 6 includes a main body 60 that enters the space between the opened upper mold 3 and lower mold 4, and a suction port 6x for drawing in gas is formed on the leading edge surface 60a of the main body 60 in the direction of entry. The leading edge surface 60a is the surface that first passes through the space between the opened upper mold 3 and lower mold 4. In addition, in this substrate transport mechanism 6, suction ports 6y and 6z for drawing in gas are formed on the upper surface of the main body 60 facing the upper mold 3 or the lower surface facing the lower mold 4.

[0051] The main body 60 has a specific configuration consisting of a holding body 61 that holds the unmolded substrate W and the resin molded product P, and a front suction member 62 and two side suction members 63 and 64 provided on the holding body 61. The main body 60 is supported by a sliding member 601 that moves on a rail (see Figures 4 and 6).

[0052] As shown in Figures 4 to 7, the holding body 61 has a rectangular shape in plan view, and its upper surface has a first holding part 61a for transferring the substrate W before molding to the upper mold 3, and a second holding part 61b for receiving the resin molded product P from the upper mold 3.

[0053] In this embodiment, the holding body 61 is provided with a second holding portion 61b on the front side in the direction of entry and a first holding portion 61a on the rear side in the direction of entry (see Figures 4 and 6). With this configuration, when the holding body 61 enters the space between the opened upper mold 3 and lower mold 4, the second holding portion 61b first receives the resin molded product P from the upper mold 3, and then enters further to transfer the unmolded substrate W held by the first holding portion 61a to the upper mold 3.

[0054] As shown in Figures 4 to 7, the front suction member 62 is provided on the tip surface of the end (front edge) in the direction of entry of the holding body 61. The front suction member 62 is elongated and extends along the front edge of the holding body 61. Specifically, the front suction member 62 is rectangular parallelepiped and extends along the front edge of the holding body 61, and the side opposite to the mounting surface attached to the holding body 61 becomes the tip surface 60a in the direction of entry of the main body 60.

[0055] Front suction member 62 approach A gas intake port 6x (front intake port 6x) is formed on the leading edge surface 62a (60a) in the direction. In this embodiment, an example is shown in which multiple front intake ports 6x are formed along the longitudinal direction, but the front intake ports 6x may also be slit-shaped and extend in the longitudinal direction.

[0056] Furthermore, a gas intake port 6y (upper intake port 6y) is formed on the upper surface of the front suction member 62 facing the upper mold 3, and a gas intake port 6z (downward intake port 6z) is formed on the lower surface facing the lower mold 4. In this embodiment, an example is shown in which multiple upper intake ports 6y and lower intake ports 6z are formed along the longitudinal direction, but the upper intake ports 6y and lower intake ports 6z may also be slit-shaped and extend in the longitudinal direction.

[0057] Furthermore, a suction channel 62R for drawing gas through a front suction port 6x, an upper suction port 6y, and a lower suction port 6z is formed inside the front suction member 62. In this embodiment, a single suction channel 62R common to the front suction port 6x, the upper suction port 6y, and the lower suction port 6z is formed. This suction channel 62R is connected to a suction source (not shown).

[0058] As shown in Figures 4, 5, and 7, the side suction members 63 and 64 are provided on the left and right sides of the holding body 61 in the direction of entry. The side suction members 63 and 64 are elongated in shape, extending along the left and right sides of the holding body 61. Specifically, the side suction members 63 and 64 are rectangular parallelepipeds that extend along the left and right sides of the holding body 61.

[0059] Furthermore, a gas suction port 6y (upper suction port 6y) is formed on the upper surface of the side suction members 63 and 64 facing the upper mold 3, and a gas suction port 6z (downward suction port 6z) is formed on the lower surface facing the lower mold 4. In this embodiment, an example is shown in which multiple upper suction ports 6y and lower suction ports 6z are formed along the longitudinal direction, but the upper suction ports 6y and lower suction ports 6z may be slit-shaped and extend in the longitudinal direction. In addition, the suction ports may be formed on the side of the side suction members 63 and 64 opposite to the holding body 61.

[0060] Furthermore, suction channels 63R and 64R are formed inside the side suction members 63 and 64 for drawing gas through the upper suction port 6y and the lower suction port 6z. In this embodiment, one common suction channel 63R and 64R is formed for the upper suction port 6y and the lower suction port 6z. This suction channel 63R and 64R is connected to a suction source (not shown).

[0061] In this embodiment, the front suction member 62 and the side suction members 63 and 64 are connected to each other by piping members 65 and 66, as shown in Figures 4, 5, and 7. This connects the suction passage 62R of the front suction member 62 to the suction passages 63R and 64R of the side suction members 63 and 64 via piping members 65 and 66. Specifically, the right end of the front suction member 62 is connected to the tip of the side suction member 63, which is located on the right side, by piping member 65. Also, the left end of the front suction member 62 is connected to the tip of the side suction member 64, which is located on the left side, by piping member 66. Furthermore, connecting pipes 67 and 68, which are connected to a suction source (not shown), are connected to the rear ends of the two side suction members 63 and 64. The connecting pipes 67 and 68 are connected to a merging pipe 69, which is connected to a suction source (not shown). A dust collection filter 691 is also provided in the merging pipe 69.

[0062] In this embodiment, each suction port 6x~6z and the flow path connected to each suction port 6x~6z are composed of multiple components, and these multiple components are configured to be detachable individually by being separated, as shown in Figure 7. Here, the multiple components include a front suction member 62, side suction members 63, 64, piping members 65, 66, connecting pipes 67, 68, merging pipe 69, and dust collection filter 691, etc.

[0063] Furthermore, in this embodiment, in order to improve the gas suction efficiency of the substrate transport mechanism 6, the front, back and left and right sides of the upper mold 3 and lower mold 4 are covered with partition walls 13, as shown in Figures 2, 3, and 8 to 10, and an opening / closing shutter 14 is provided in a part of the partition wall 13 for the substrate transport mechanism 6 to enter.

[0064] Here, the partition wall 13 is the lower mold holding part 56 and upper mold holding part 57 It is provided so as to surround the upper mold 3 and lower mold 4 around it. In other words, the partition wall 13 is a side wall member that seals the space that houses the upper mold 3 and lower mold 4 during resin molding. 561、571It is located further outwards. This partition wall 13 covers not only the front, back, and sides of the upper mold 3 and lower mold 4 when they are clamped, but also the front, back, and sides of the upper mold 3 and lower mold 4 when they are open. The partition wall 13 is installed so as not to interfere with the clamping operation of the upper mold 3 and lower mold 4.

[0065] The opening / closing shutter 14 in this embodiment is provided on the rear partition wall 13x of the upper mold 3 and lower mold 4 (see Figures 8 to 10). This opening / closing shutter 14 is opened when the mold is opened, allowing the main body 60 of the substrate transport mechanism 6 to enter the space enclosed by the partition wall 13. The opening / closing shutter 14 is opened and closed by an actuator (not shown), such as an air cylinder.

[0066] <Gas suction operation by substrate transport mechanism 6> Here, we will explain the opening and closing operation of the shutter 14 along with the gas suction operation by the substrate transport mechanism 6.

[0067] <Specific examples of gas suction operation> After the resin molding is complete, and before opening the upper mold 3 and lower mold 4, the substrate transport mechanism 6 is positioned in front of the opening / closing shutter 14. In this state, the substrate transport mechanism 6 starts the gas suction operation (see Figure 8(a)).

[0068] Here, the gas suction operation begins when the substrate transport mechanism 6 moves in front of the opening / closing shutter 14, and the confluence pipe 69 of the substrate transport mechanism 6 is connected to a suction port (not shown) provided on the device side. Alternatively, the suction operation can also be started by activating a suction source (not shown) connected to the confluence pipe 69 of the substrate transport mechanism 6 when the substrate transport mechanism 6 moves in front of the opening / closing shutter 14.

[0069] Then, the mold clamping mechanism 5 starts the mold opening process, and after the mold opening allows the main body 60 of the substrate transport mechanism 6 to enter between the upper mold 3 and the lower mold 4 (see Figure 8(b)), the opening / closing shutter 14 is opened to allow the main body 60 of the substrate transport mechanism 6 to enter the space between the upper mold 3 and the lower mold 4 (see Figure 9(a)). As a result, the gas between the upper mold 3 and the lower mold 4 is drawn in by the substrate transport mechanism 6. Here, the upper mold 3 and the lower mold 4 may be in a state where the mold opening is complete, or they may be in a state where the mold opening is not complete but there is a gap that allows the main body 60 to enter.

[0070] Furthermore, the second holding portion 61b of the holding body 61 may receive the resin molded product P from the upper mold 3 during the gas suction operation of the substrate transport mechanism 6 (see Figure 9(b)), or the second holding portion 61b of the holding body 61 may receive the resin molded product P from the upper mold 3 after the gas suction operation of the substrate transport mechanism 6 has been completed.

[0071] <Variations of gas suction operation> After resin molding is complete, and before opening the upper mold 3 and lower mold 4, the substrate transport mechanism 6 is positioned in front of the opening / closing shutter 14. In this state, the substrate transport mechanism 6 starts the gas suction operation (see Figure 10(a)). The start of the gas suction operation is the same as described above.

[0072] Then, the mold clamping mechanism 5 starts the mold opening process, and the mold opening is temporarily paused when the upper mold 3 and lower mold 4 are separated by a predetermined distance. Here, the distance between the upper mold 3 and lower mold 4 is such that the main body 60 of the substrate transport mechanism 6 cannot enter. Also, the sealing member 562 of the side wall member 561 and the sealing member 572 of the side wall member 571 are separated. In this state, the opening / closing shutter 14 is opened, and the front suction member 62 of the main body 60 enters through the opening / closing shutter 14 (see Figure 10(b)). As a result, the front suction member 62 sucks gas from the outside of the upper mold 3 and lower mold 4. By sucking gas while the distance between the upper mold 3 and lower mold 4 is small in this way, the space in which the gas spreads can be narrowed, and the gas can be sucked efficiently.

[0073] Subsequently, the mold opening is resumed, and after the mold opening allows the main body 60 of the substrate transport mechanism 6 to enter the space between the upper mold 3 and the lower mold 4, the main body 60 of the substrate transport mechanism 6 is moved into the space between the upper mold 3 and the lower mold 4 (see Figure 9(a)). As a result, the gas between the upper mold 3 and the lower mold 4 is drawn in by the substrate transport mechanism 6. Here, the upper mold 3 and the lower mold 4 may be in the state where mold opening is complete, or they may be in the state before mold opening is complete, where there is a gap that allows the main body 60 to enter.

[0074] Furthermore, the second holding portion 61b of the holding body 61 may receive the resin molded product P from the upper mold 3 during the gas suction operation of the substrate transport mechanism 6 (see Figure 9(b)), or the second holding portion 61b of the holding body 61 may receive the resin molded product P from the upper mold 3 after the gas suction operation of the substrate transport mechanism 6 has been completed.

[0075] In addition, the substrate transport mechanism 6 has a function to adjust the amount of gas drawn in per unit time from each suction port 6x to 6z. The amount of gas drawn in from each suction port 6x to 6z can be adjusted, for example, by a flow control valve (not shown) provided in the flow path connected to each suction port 6x to 6z.

[0076] Furthermore, the substrate transport mechanism 6 can change the suction amount to a predetermined amount at multiple intervals during the gas suction operation described above. For example, the substrate transport mechanism 6 suctions gas at a first suction amount for a certain period of time after the suction starts. After the certain period of time has elapsed, the substrate transport mechanism 6 suctions gas at a second suction amount, which is smaller than the first suction amount. If a large suction amount is continuously applied during the gas suction operation, the mold surfaces of the upper mold 3 and the lower mold 4 may be cooled, potentially changing the molding conditions. By adjusting the suction amount per unit time as described above, cooling of the mold surfaces of the upper mold 3 and the lower mold 4 can be prevented.

[0077] Furthermore, the substrate transport mechanism 6 can change the suction amount of each suction port 6x to 6z depending on the type of transported material, such as the substrate W before molding or the resin material J. In addition, the suction amount may be adjustable in only one of the front suction member 62 or each of the side suction members 63, 64. Alternatively, the suction amount may be adjustable in any one of the front suction port 6x, the upper suction port 6y, or the lower suction port 6z. Note that the amount of gas suctioned per unit time from each suction port 6x to 6z may be constant.

[0078] <Resin molding operation of resin molding apparatus 100> Next, an example of the operation of the resin molding apparatus 100 will be described with reference to Figures 1 to 3, 8 and 9. The operation described below is performed by a control unit CTL provided in the substrate supply and storage module A, for example, by controlling each part of the resin molding apparatus 100. The control unit CTL is a dedicated or general-purpose computer having a CPU, internal memory, input / output interface, AD converter, etc.

[0079] (1) Substrate supply process before molding In the substrate supply and storage module A, the first holding unit 61a of the substrate transport mechanism 6 receives the unmolded substrate W from the unmolded substrate supply unit 1 and transports it to the resin molding module B. The unmolded substrate W is then handed over to the opened upper mold 3 (see Figure 2). After that, the substrate transport mechanism 6 returns to a predetermined standby position.

[0080] (2) Resin supply process In the film cutting module C, the resin material transport mechanism 12 receives the film holding frame 8 holding the release film F and transports it to the resin material supply module D. In the resin material supply module D, the resin material supply unit 10 supplies resin material J onto the release film F held in the film holding frame 8. Subsequently, the resin material transport mechanism 12 transports the film holding frame 8 to the resin molding module B and supplies resin material J together with the release film F to the cavity 4C of the opened lower mold 4 (see Figure 2). Then, the resin material transport mechanism 12 returns to a predetermined standby position.

[0081] (3) Resin molding process After the above process, in the resin molding module B, the upper mold 3 and lower mold 4 are clamped by the clamping mechanism 5 with a predetermined clamping pressure (see Figure 3) and heated. In this clamped state, the upper mold holding part 57 sealing member 572 and lower mold holding part 56 sealing member 562 The two parts come into close contact to form a sealed space, and the sealed space is made into a vacuum by an exhaust mechanism (not shown). After a predetermined time has elapsed, the clamping mechanism 5 lowers the lower mold 4, and the upper mold 3 and lower mold 4 are opened.

[0082] (4) Process for unloading molded substrates In the process of unloading the molded substrate, the first holding part 61a of the substrate transport mechanism 6 is in a state where it has received the unmolded substrate W from the unmolded substrate supply unit 1 (see Figure 8(a)). Then, the substrate transport mechanism 6 is moved so that the second holding part 61b of the holding body 61 receives the resin molded product P from the opened upper mold 3 (see Figure 9(b)). At this time, the substrate transport mechanism 6 performs the gas suction operation described in <Specific Example of Gas Suction Operation> or <Modified Example of Gas Suction Operation> above. Then, the first holding part 61a of the holding body 61 hands over the unmolded substrate W to the upper mold 3 (see Figure 9(b)). After that, the substrate transport mechanism 6, which has received the resin molded product P, is moved to the substrate supply and storage module A, and the resin molded product P is handed over from the second holding part 61b of the substrate transport mechanism 6 to the molded substrate storage unit 2 for storage.

[0083] (5) Used release film collection process In the used release film recovery process, the resin material transport mechanism 12 is in a state of holding the film holding frame 8 to which the resin material J has been supplied. The resin material transport mechanism 12 is then moved to recover the used release film F from the opened lower mold 4, and the release film F and resin material J are supplied to the cavity 4C of the opened lower mold 4. The resin material transport mechanism 12, having recovered the used release film F, is then moved to the film cutting module C, and the used release film F is disposed of in the waste section.

[0084] In this embodiment, the "(1) Pre-molded substrate supply process" is performed in the "(4) Molded substrate removal process" and the "(2) Resin supply process" is performed in the "(5) Used release film recovery process," but these may be separate processes.

[0085] <Effects of this embodiment> In the resin molding apparatus 100 of this embodiment, a suction port 6x for drawing in gas is formed on the leading edge surface 60a in the direction of entry of the main body 60 that enters the space between the upper mold 3 and the lower mold 4, so that gas in the space between the upper mold 3 and the lower mold 4 can be efficiently drawn in. In other words, since the suction port 6x is formed on the leading edge surface 60a, which is the surface that first passes through the space between the upper mold 3 and the lower mold 4, gas in the space between the upper mold 3 and the lower mold 4 can be efficiently drawn in. As a result, it is possible to prevent gas generated by resin molding from adhering to and contaminating the upper mold 3, the lower mold 4 and their surrounding members. Furthermore, since the substrate transport mechanism 6 enters between the upper mold 3 and the lower mold 4 immediately after the molds are opened, it can efficiently draw in gas generated during mold opening. Moreover, since the substrate transport mechanism 6 is equipped with a gas suction function, the configuration can be simplified compared to a configuration in which a suction mechanism is provided on other members.

[0086] <Other modified embodiments> However, the present invention is not limited to the embodiments described above.

[0087] For example, although the substrate transport mechanism 6 in the above embodiment transported both the unmolded substrate W and the resin molded product P, it may be configured as a pre-molded substrate loading mechanism (loader) that transports the pre-molded substrate W and a resin molded product unloading mechanism (unloader) that transports the resin molded product P. In this configuration, it is conceivable to provide the resin molded product unloading mechanism (unloader), which enters between the upper mold 3 and the lower mold 4 immediately after mold opening, with a gas suction function similar to that in the above embodiment.

[0088] Furthermore, although the substrate transport mechanism 6 is provided with a gas suction function in the above embodiment, as shown in Figure 11, the resin material transport mechanism 12 may also be provided with a gas suction function similar to that in the above embodiment. Alternatively, both the substrate transport mechanism 6 and the resin material transport mechanism 12 may be provided with a gas suction function similar to that in the above embodiment.

[0089] Specifically, as shown in Figure 11, the resin material transport mechanism 12 includes a main body 120 that enters the space between the opened upper mold 3 and lower mold 4, and a suction port 12x for drawing in gas is formed on the leading edge surface 120a of the main body 120 in the direction of entry. In addition, the resin material transport mechanism 12 has suction ports 12y and 12z formed on the upper surface of the main body 120 facing the upper mold 3 or the lower surface facing the lower mold 4 for drawing in gas.

[0090] The main body 60 has a specific configuration including a holding body 121 for holding the film holding frame 8 and the used release film F, and a front suction member 122 provided on the holding body 121. The front suction member 122 has the same configuration as the front suction member 62 in the above embodiment. Side suction members may also be provided as in the above embodiment.

[0091] Then, as shown in Figure 12(a), after the mold opening allows the main body 120 of the resin material transport mechanism 12 to enter between the upper mold 3 and the lower mold 4, the opening / closing shutter 14 is opened to allow the main body 120 of the resin material transport mechanism 12 to enter the space between the upper mold 3 and the lower mold 4. As a result, the gas between the upper mold 3 and the lower mold 4 is drawn in by the resin material transport mechanism 12. Here, the upper mold 3 and the lower mold 4 may be in a state where the mold opening is complete, or even before the mold opening is complete, when there is a gap between them that allows the main body 120 to enter.

[0092] Furthermore, the holding body 121 may perform an operation to receive the used release film F from the lower mold 4 or to supply the release film F and resin material J to the lower mold 4 during the gas suction operation of the resin material transport mechanism 12 (see Figure 12(b)), or the holding body 121 may perform an operation to receive the used release film F from the lower mold 4 or to supply the release film F and resin material J to the lower mold 4 after the gas suction operation of the resin material transport mechanism 12 has finished. Also, if the operation to receive the used release film F or to supply the release film F and resin material J to the lower mold 4 is performed during the gas suction operation, the suction operation may be temporarily stopped during the receiving or supply operation.

[0093] Furthermore, the resin material transport mechanism 12 may be configured as a resin material loading mechanism (loader) that transports the film holding frame 8 to which the resin material J has been supplied, and a film unloading mechanism (unloader) that transports the used release film F. In this configuration, it is conceivable to provide the film unloading mechanism (unloader), which enters between the upper mold 3 and the lower mold 4 immediately after mold opening, with a gas suction function similar to that of the above embodiment.

[0094] Furthermore, the configuration of the above embodiment was such that partition walls 13 were provided to cover the front, back, left, and right sides of the upper mold 3 and lower mold 4. However, the configuration of the above embodiment is not limited to a configuration that covers all four sides of the upper mold 3 and lower mold 4; it may cover at least one of them, or it may not cover all four sides, that is, it may be a configuration without partition walls 13.

[0095] Furthermore, the configuration for supplying the resin material J to the cavity 4C of the lower mold 4 is not limited to the configuration using a film holding frame 8 to which the resin material J is supplied, as in the above embodiment. The configuration for supplying the resin material J to the cavity 4C may be one in which the resin material supply unit 10 is moved to the lower mold 4 to supply the resin material J to the cavity 4C of the lower mold 4, or it may be a configuration that performs other types of compression molding. In addition, the resin molding apparatus 100 may also perform transfer molding in which the resin material J is contained in a pot provided in the lower mold 4 and the resin material J is extruded by a plunger.

[0096] In the above embodiment, one resin molding module B is connected between the substrate supply / storage module A and the resin material supply module D, but a configuration in which two or more resin molding modules B are connected is also possible. Alternatively, the substrate supply / storage module A, the film cutting module C, and the resin material supply module D may be combined into a single module, and the resin molding modules B may be connected to that module. Alternatively, the film cutting module C and the resin material supply module D may be combined into a single module, and the substrate supply / storage module A and the resin molding modules B may be connected to that module. Furthermore, the resin molding apparatus does not have to be modularized into individual modules as in the above embodiment.

[0097] Furthermore, it goes without saying that the present invention is not limited to the embodiments described above, and various modifications are possible without departing from its spirit. [Explanation of Symbols]

[0098] 100...Resin molding equipment W... Molding object P... Resin molded product (conveyed item) 3...Top mold 4...Lower mold 5-type clamping mechanism 6. Circuit board transport mechanism 60...Main body 60a...Front side in the direction of entry 6x...Front suction port 6y...Upper suction port 6z...Lower suction port 61...Holding body 62...Front suction component 63, 64... Side suction members 65, 66... ​​Piping components 13. Partition wall 14. Opening and closing shutter

Claims

1. A conveying mechanism for conveying objects from an open upper or lower mold, The main body portion enters the space between the opened upper and lower molds, A suction port for drawing in gas is formed on the leading edge of the main body in the direction of entry. The main body is, A holding body for holding the conveyed object, The holding body has a front suction member provided at the end in the entry direction, and the suction port is formed therein. The holding body has a rectangular shape in plan view, and the front suction member is provided on its front edge. A transport mechanism comprising a side suction member having a suction port for drawing in gas, provided on at least one of the left and right sides of the holding body.

2. The transport mechanism according to claim 1, wherein a suction port for drawing in gas is formed on the upper surface of the main body facing the upper mold or on the lower surface facing the lower mold.

3. The suction port and the flow path connected to the suction port are composed of multiple components, The transport mechanism according to claim 1, wherein the plurality of components are configured to be divisible and removable.

4. The transport mechanism according to claim 1, wherein the front suction member and the side suction member are connected to each other by a piping member.

5. The transport mechanism according to claim 1, wherein the amount of gas drawn in from the suction port is configured to be adjustable.

6. A molding die having an upper mold and a lower mold, A mold clamping mechanism for clamping the upper and lower molds, A resin molding apparatus comprising a transport mechanism according to any one of claims 1 to 5.

7. The resin molding apparatus according to claim 6, wherein the front, back and sides of the molding die are covered with walls, and opening and closing shutters are provided for the transport mechanism to enter.

8. The resin molding apparatus according to claim 6, wherein the transport mechanism starts the suction operation by the suction port before it enters the space between the opened upper and lower molds.

9. A method for manufacturing a resin molded product using the resin molding apparatus described in claim 6, A resin molding process in which resin molding is performed on an object to be molded, A method for manufacturing a resin molded product, comprising a discharge step of dischargeing the resin-molded product from the mold using the conveying mechanism.

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