Substrate cooling method, semiconductor device manufacturing method, substrate cooling system, substrate processing apparatus, and program

Abstract

To provide a technology that can control the cooling of a substrate appropriately.SOLUTION: A method has the steps for conveying a substrate from a processing chamber to a conveyance chamber after processing the substrate placed in the processing chamber while detecting the temperature with a temperature sensor attached to a substrate support fixture that supports the substrate and cooling the substrate so that the temperature detected by the temperature sensor is less than or equal to a set temperature in a state where the substrate support fixture is placed in a predetermined position.SELECTED DRAWING: Figure 9

Description

Technical Field

[0001] The present disclosure relates to a substrate cooling method, a method for manufacturing a semiconductor device, a substrate cooling system, a substrate processing apparatus, and a program.

Background Art

[0002] As one step in the manufacturing process of a semiconductor device, a predetermined process is performed on a wafer (hereinafter also referred to as a substrate) (see, for example, Patent Documents 1 and 2). In particular, Patent Document 1 describes a technique for controlling the temperature of a processing chamber using the temperature detected by a temperature sensor attached to a boat (hereinafter also referred to as a holder). However, it may not be possible to appropriately control the cooling of the substrate after substrate processing.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of appropriately controlling the cooling of a substrate.

Means for Solving the Problems

[0005] According to one aspect of the present disclosure, while detecting the temperature by a temperature sensor attached to a substrate support for supporting the substrate, after processing the substrate disposed in the processing chamber, a step of transporting the substrate from the processing chamber to a transfer chamber; a step of cooling the substrate so that the temperature detected by the temperature sensor becomes equal to or lower than a set temperature in a state where the substrate support is disposed at a predetermined position, is provided.

Effects of the Invention

[0006] According to this disclosure, the cooling of the substrate can be properly controlled. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a front cross-sectional view of a substrate processing apparatus according to one embodiment of the present disclosure. [Figure 2] Figure 2 is a schematic diagram showing the state of a substrate processing apparatus according to one embodiment of this disclosure when it is being boated. [Figure 3] Figure 3 is a longitudinal cross-sectional view showing the configuration of a transfer chamber according to one embodiment of this disclosure. [Figure 4] Figure 4 is a cross-sectional view showing the configuration of a transfer chamber according to one embodiment of this disclosure. [Figure 5] Figure 5 shows the hardware configuration of the controller in a substrate processing apparatus according to one embodiment of the present disclosure. [Figure 6] Figure 6 shows the hardware configuration of a temperature controller in a substrate processing apparatus according to one embodiment of the present disclosure. [Figure 7] Figure 7 is a control block diagram of a temperature controller in a substrate processing apparatus according to one embodiment of the present disclosure. [Figure 8] Figure 8(a) is a diagram illustrating a substrate processing sequence performed in a substrate processing apparatus according to one embodiment of the present disclosure, and is a flowchart of the substrate processing sequence. Figure 8(b) is a diagram illustrating a substrate processing sequence performed in a substrate processing apparatus according to one embodiment of the present disclosure, and is a graph showing the temperature at each step of the substrate processing sequence. [Figure 9] Figure 9(a) is a control block diagram showing a method for controlling the cooling when the boat and substrate are located in the processing chamber. Figure 9(a) is a control block diagram showing a method for controlling the cooling when the boat and substrate are located in the transfer chamber. [Figure 10]Figure 10 is a diagram illustrating the control of the temperature controller, gas flow controller, and drive controller at each step of the substrate processing sequence. [Modes for carrying out the invention]

[0008] Hereinafter, one embodiment of the present disclosure will be described, mainly with reference to Figures 1 to 10. Note that the drawings used in the following description are all schematic, and the dimensional relationships and ratios of the elements shown in the drawings do not necessarily correspond to reality. Furthermore, the dimensional relationships and ratios of the elements do not necessarily correspond between multiple drawings. Also, substantially identical elements are denoted by the same reference numerals across multiple drawings, and each element is described in the drawing in which it first appears, with subsequent descriptions omitted unless particularly necessary. Unless otherwise specified in the specification, each element is not limited to one, and there may be multiple elements.

[0009] As shown in Figure 1, the substrate processing apparatus 10 is equipped with a supported vertical reaction tube (process tube) 11, which consists of an outer tube 12 and an inner tube 13 arranged concentrically with respect to each other. The outer tube 12 is made of quartz (SiO2) and is integrally molded into a cylindrical shape with a closed upper end and an open lower end. The inner tube 13 is formed into a cylindrical shape with open upper and lower ends. The hollow part of the inner tube 13 forms a processing chamber 14 into which a boat 31 serving as a substrate support (substrate holder, holder) is brought, and the lower end side (open space) of the inner tube 13 constitutes a furnace opening 15 for inserting and removing the boat 31.

[0010] The lower end between the outer tube 12 and the inner tube 13 is hermetically sealed by a manifold 16, which is a furnace mouth flange section constructed in a substantially cylindrical shape. The manifold 16 is detachably attached to the outer tube 12 and the inner tube 13, respectively, for purposes such as replacing the outer tube 12 and the inner tube 13. The reaction tube 11 is installed vertically because the manifold 16 is supported by the housing 2 of the substrate processing apparatus 10.

[0011] The gap between the outer pipe 12 and the inner pipe 13 forms the exhaust passage 17, which has a circular ring shape with a constant width in cross-section. As shown in Figure 1, one end of the exhaust pipe 18 is connected to the upper part of the side wall of the manifold 16, and the exhaust pipe 18 leads to the lowest end of the exhaust passage 17. An exhaust device 19 controlled by a pressure controller 21 is connected to the other end of the exhaust pipe 18, and a pressure sensor 20 is connected in the middle of the exhaust pipe 18. The pressure controller 21 is configured to provide feedback control to the exhaust device 19 based on the measurement results from the pressure sensor 20.

[0012] A cover (seal cap) 25 that closes the lower end opening of the manifold 16 is in contact with the manifold 16 from the vertically downward side. The cover 25 is constructed in a disc shape that is approximately equal to the outer diameter of the manifold 16 and is configured to be raised and lowered vertically by a lifting mechanism (boat elevator) 26 protected by a boat cover 37 installed in the transfer chamber (hereinafter also called the transport chamber) 3 of the housing 2. This makes it possible for the boat 31 to move between the processing chamber 14 and the transfer chamber 3 which is located below and adjacent to the processing chamber 14. The lifting mechanism 26 is composed of a motor-driven feed screw shaft device and bellows, and the motor 27 of the lifting mechanism 26 is configured to be controlled by a drive controller 28. A rotating shaft 30 is positioned on the center line of the cover 25 and is rotatably supported. The rotating shaft 30 is configured to be rotationally driven by a motor 29 controlled by the drive controller 28. The boat 31 is vertically supported at the upper end of the rotating shaft 30. In this embodiment, the rotating mechanism is composed of a rotating shaft 30 and a motor 29.

[0013] A lid body 25 positioned below the manifold 16 is provided with a gas introduction pipe 22 arranged so as to communicate with the furnace mouth portion 15 of the inner pipe 13. A raw material gas supply device, a reaction gas supply device, and an inert gas supply device (hereinafter collectively referred to as the gas supply device 23) are connected to the gas introduction pipe 22. The gas supply device 23 is configured to be controlled by a gas flow controller 24. The gas introduced from the gas introduction pipe 22 into the furnace mouth portion 15 flows through the processing chamber 14 of the inner pipe 13 and is exhausted through the exhaust passage 17 by an exhaust pipe 18.

[0014] The boat 31 includes a pair of end plates 32 and 33 at the top and bottom, and columns (pillars) 34 as three holding members vertically installed therebetween. A number of holding grooves 35 are engraved at equal intervals in the longitudinal direction on the three columns 34. The holding grooves 35 engraved at the same stage on the three columns 34 are arranged to open facing each other. The boat 31 is configured to hold a plurality of substrates 1 horizontally and aligned with each other by inserting the substrate 1 between the holding grooves 35 at the same stage of the three columns 34. Also, a plurality of heat insulating plates 120 are held horizontally and aligned with each other by inserting the heat insulating plate 120 between the holding grooves 39 at the same stage of the three columns 34.

[0015] That is, the boat 31 is configured to distinguish between a substrate processing region between the end plates 32 and 38 where a plurality of substrates 1 are held, and a heat insulating plate region between the end plates 38 and 33 where a plurality of heat insulating plates 120 are held, and is configured such that the heat insulating plate region is arranged below the substrate processing region. A heat insulating portion 36 is formed by the heat insulating plate 120 held between the end plate 38 and the end plate 33.

[0016] The rotating shaft 30 is configured to support the boat 31 in a state of being lifted from the upper surface of the lid body 25. The heat insulating portion 36 is provided at the furnace mouth portion 15 and is configured to insulate the furnace mouth portion 15. Also, there is a motor 29 for rotating the boat 31 under the lid body 25, and the motor 29 has a hollow motor structure, and the rotating shaft 30 penetrates through the motor 29.

[0017] Outside the reaction tube 11, a heater unit 40 as a heating part is arranged concentrically and installed in a state of being supported by the housing 2. Near the heater unit 40, a heater thermocouple 65 as a temperature sensor is provided, and the temperature controller 64 is configured to perform feedback control on the heater unit 40 based on the measurement result from the heater thermocouple 65. Thereby, the heater unit 40 is configured to heat the substrate 1 within the substrate processing area held by the boat 31. Details regarding the heater thermocouple 65 will be described later. Further, the heater unit 40 includes a case 41. The case 41 is formed in a cylindrical shape with the upper end closed and the lower end open using stainless steel (SUS), preferably a cylindrical shape. The inner diameter and the total length of the case 41 are set to be larger than the outer diameter and the total length of the outer tube 12.

[0018] An insulation structure 42 is installed inside the case 41. The insulation structure 42 includes an outer layer arranged on the outside and an inner layer arranged on the inside, and is formed in a cylindrical shape, and the side wall portion 43 of the cylindrical body is formed in a multi-layer structure.

[0019] And the cooling air 90 flows through a gas supply flow path provided inside the inner layer and is configured to be supplied to the space 75 through the gas supply flow path.

[0020] As shown in FIG. 1, on the upper end side of the side wall portion 43 of the insulation structure 42, a ceiling wall portion 80 as a ceiling portion covers the space 75. An exhaust hole 81 as a part of an exhaust path for exhausting the atmosphere of the space 75 is formed in an annular shape on the ceiling wall portion 80, and the lower end, which is the upstream end of the exhaust hole 81, communicates with the inner space 75. The downstream end of the exhaust hole 81 is connected to an exhaust duct 82. And the cooling air 90 blown into the space 75 is configured to be exhausted by the exhaust hole 81 and the exhaust duct 82.

[0021] As shown in Figure 2, the heater unit 40 is configured with multiple heaters stacked on top of each other, as each zone is equipped with a heater so that it can be divided and controlled in multiple zones in the vertical direction. In Figure 2, the heater unit 40 is divided into 5 zones. A heater thermocouple 65 for measuring the heater temperature is installed in each zone. In Figure 2, the processing board is labeled "1" and its illustration is omitted.

[0022] Inside the outer tube 12, a furnace thermocouple 66 is installed as a temperature sensor to measure the temperature inside the tube. This furnace thermocouple 66 has a structure in which a number of thermocouples corresponding to the number of zones are housed in a single quartz tube. The temperature measurement points are located opposite each zone.

[0023] A substrate thermocouple 211, which acts as a temperature sensor for measuring the temperature of the substrate 1, is mounted on the boat 31 and is configured to rotate together with the substrate 1 when the boat 31 rotates and the substrate 1 rotates. The substrate thermocouple 211 consists of a temperature measuring section 211b for measuring the temperature of the substrate 1 and a cable 211c that encloses the strands constituting the temperature measuring section.

[0024] The heater thermocouple 65, substrate thermocouple 211, and furnace thermocouple 66 are examples of temperature sensors. Note that any temperature sensor capable of measuring temperature as an electrical signal is acceptable, and it is not limited to thermocouples; other sensors such as resistance thermometers may also be used.

[0025] The rotating shaft 30 has a hole through which the cable 211c passes, and the structure allows the cable 211c to be routed to the transmitter 221 on the outside of the processing chamber 14 (for example, below the rotating shaft 30) while using a hermetic seal or the like to create a vacuum seal. The cable 211c is connected to the transmitter 221 located under the cover 25.

[0026] The transmitter 221 is fixed to the rotating shaft 30 and is structured to move together with the rotating shaft 30. The transmitter 221 digitally converts the electrical signal (voltage) from the substrate thermocouple 211, which is input via cable 211c, and transmits it wirelessly via radio waves.

[0027] A receiver 222 is fixed to the housing 2 of the transfer chamber 3 below the cover 25. The receiver 222 receives signals from the transmitter 221 and has a terminal (output terminal) 222a that outputs the received digital signal via serial communication, or a terminal (output terminal) 222b that converts the received digital signal into an analog signal, such as 4-20mA, and outputs it. A cable 223 connects this digital or analog signal output terminal to a temperature indicator (not shown) or a temperature controller 64, and the temperature data is input to the temperature controller 64. The receiver 222 is located in the transfer chamber 3, but is not limited to this configuration. It may be located outside the transfer chamber 3, or at a location away from the substrate processing device 10.

[0028] Next, the configuration of the transfer chamber 3 in this embodiment will be described using Figures 3, 4, 9(a), and 9(b).

[0029] As shown in Figures 3 and 4, the transfer chamber 3 is configured in a multifaceted polygonal shape by the ceiling, floor, and side walls surrounding it on all four sides, for example, as a rectangular shape in plan. A clean unit 62 is installed on one side of the transfer chamber 3. Clean air gas is supplied to the transfer chamber 3 from the clean unit 62. In addition, a circulation path 74 for circulating the gas is formed in the space located around the transfer chamber 3. The gas supplied to the transfer chamber 3 is exhausted from the exhaust section 72 and supplied back to the transfer chamber 3 from the clean unit 62 via the circulation path 74. A radiator (not shown) is installed in the middle of the circulation path 74, and the gas is cooled by passing through the radiator.

[0030] The clean unit 62 is arranged such that the upper clean unit 62a and the lower clean unit 62b are adjacent to each other vertically. The upper clean unit 62a is configured to supply gas mainly to the substrate processing area of ​​the boat 31 when the boat 31 is in the transfer chamber 3. The lower clean unit 62b is configured to supply gas mainly to the heat insulating portion 36 of the heat insulating plate area of ​​the boat 31 when the boat 31 is in the transfer chamber 3. Hereinafter, when the clean unit 62 is referred to, it includes cases where it refers to the upper clean unit 62a, the lower clean unit 62b, or both.

[0031] The clean unit 62 has, in order from upstream, a fan 69, a buffer area 67, a filter section 68, and a gas supply port 70. The buffer area 67 is a diffusion space for evenly blowing gas from the entire surface of the gas supply port 70. The filter section 68 is configured to remove particles contained in the gas.

[0032] A side exhaust section 72a and a lifting mechanism 26 are installed on one side opposite the clean unit 62. The gas supplied from the upper clean unit 62a to the transfer chamber 3 is mainly exhausted by the side exhaust section 72a and then supplied again to the transfer chamber 3 from the clean unit 62 via the circulation path 74. As a result, a gas flow is formed in the upper region of the transfer chamber 3 (the region where the substrate 1 is located) that is generally horizontal and parallel to the substrate 1.

[0033] As shown in Figure 4, a pair of floor exhaust sections 72b are provided on the floor of the transfer chamber 3, flanking the boat 31. The floor exhaust sections 72b are formed in a rectangular shape along one side of the transfer chamber 3. The gas supplied to the transfer chamber 3 from the lower clean unit 62b is mainly exhausted from the bottom exhaust sections 72b and then supplied back to the transfer chamber 3 from the clean unit 62 via the circulation path 74. As a result, a gas flow is formed in a generally vertical downward direction in the lower region of the transfer chamber 3 (the region where the heat-insulating section 36 is located).

[0034] As shown in Figures 3 and 4, a nozzle 76, acting as a cooling unit, is installed above the floor exhaust section 72b, near the boundary between the upper clean unit 62a and the lower clean unit 62b. The nozzle 76 extends horizontally and has multiple supply holes 76a, supplying cooling gas as a refrigerant near the boundary between the substrate processing area and the insulation plate area of ​​the boat 31.

[0035] The nozzle 76 is connected to a cooling gas supply device 231 for supplying cooling gas to the transfer chamber 3. The cooling gas supply device 231 includes a supply pipe 231a connected to the nozzle 76, a mass flow controller (MFC) 231b, and a valve 231c. The nozzle 76 and the cooling gas supply device 231 constitute a cooling mechanism.

[0036] As shown in Figures 9(a) and 9(b), the clean unit 62 is divided vertically and configured to eject gas from multiple supply holes 70a provided in the gas supply port 70. The clean unit 62 is configured so that each of the multiple supply holes 70a can be independently turned ON / OFF and the gas flow rate adjusted according to multiple instructions output from the gas flow controller 24. As shown in Figure 9(b), the clean unit 62 has supply holes 70a at positions opposite the temperature sensing part 211b of the substrate thermocouple 211 provided in the boat 31 and at positions in the heat insulating part 36, and supplies cooling gas as a refrigerant. The clean unit 62 is also called a cooling unit and constitutes a cooling mechanism.

[0037] As shown in Figure 9(b), a substrate transfer machine 56 is located in the transfer chamber 3. The substrate transfer machine 56 has an arm (tweezers) that can take out, for example, five substrates 1. The substrate transfer machine 56 is configured to transport the substrates 1 between the pod 60 and the boat 31 by rotating the tweezers up and down using a drive mechanism (not shown).

[0038] As shown in Figure 5, the controller 200, which is a control computer acting as a control unit, includes a computer main body 203 containing a CPU (Central Processing Unit) 201 and memory 202, a communication interface (IF) 204 as a communication unit, a storage device 205 as a memory unit, and a display / input device 206 as an operation unit. In other words, the controller 200 includes the components of a typical computer.

[0039] The CPU 201 constitutes the central control unit, executing control programs stored in the memory device 205 and executing recipes (e.g., process recipes) recorded in the memory device 205 according to instructions from the display / input device 206. The memory 202, which serves as a temporary storage unit, functions as the work area for the CPU 201.

[0040] Furthermore, the means for supplying a program to the computer are not limited to supplying it via the storage device 205. For example, the program may be supplied without going through the storage device 205 by using communication means such as the internet or a dedicated line. The memory 202 and the storage device 205 are configured as computer-readable recording media. Hereinafter, these will be collectively referred to simply as recording media. In this specification, when the term recording media is used, it may include only the memory 202, only the storage device 205, or both.

[0041] The communication IF204 is electrically connected to the pressure controller 21, gas flow controller 24, drive controller 28, and temperature controller 64 (these are sometimes collectively referred to as subcontrollers) via a communication path. The controller 200 can exchange data regarding the operation of each component with the subcontrollers via this communication IF204.

[0042] As shown in Figure 6, the temperature controller 64 includes a control unit 64a, a communication IF 64b, a thermocouple input unit 64c, and a control output unit 64d.

[0043] The control unit 64a has a hardware configuration similar to that of a general computer, including a CPU and memory. By executing a control program, the control unit 64a uses the information acquired by the communication IF 64b and the thermocouple input unit 64c to perform control calculations according to the temperature control algorithm described later, and outputs the calculation results to the control output unit 64d.

[0044] The communication IF64b has a wired IF for connecting to a higher-level controller such as the controller 200, and a receiver 222 which is a wireless IF for connecting to the transmitter 221 fixed to the boat 31.

[0045] Communication IF64b receives information such as target temperature and control parameters from the controller 200, and transmits control calculation results and temperature information. Communication IF64b also receives boat position information from the drive controller 28 of the lifting mechanism 26. Furthermore, communication IF64b receives the temperature of the substrate thermocouple 211 via the transmitter 221 and receiver 222.

[0046] The thermocouple input unit 64c receives electrical signals corresponding to temperature from the heater thermocouple 65 and the furnace thermocouple 66, converts them into digital signals, and outputs them to the control unit 64a.

[0047] The control output unit 64d outputs a heater control signal for controlling the temperature of the heater unit 40 based on the calculation result received from the control unit 64a.

[0048] In the following explanation, the temperature detected by the heater thermocouple 65 will be referred to as the heater temperature, and temperature control using the heater thermocouple 65 will be referred to as heater temperature control. Similarly, the temperature detected by the substrate thermocouple 211 will be referred to as the substrate temperature, and temperature control using the substrate thermocouple 211 will be referred to as substrate temperature control. Furthermore, the temperature detected by the furnace thermocouple 66 will be referred to as the furnace temperature, and temperature control using the furnace thermocouple 66 will be referred to as furnace temperature control.

[0049] The controller 200 can obtain the measured temperature of the substrate thermocouple 211 as information via the temperature controller 64 or directly from the substrate thermocouple 211. The controller 200 can then use the measured temperature as input for displaying the status, error handling, and recipe operation management.

[0050] Next, an example of the control block of the temperature controller 64 in this embodiment will be described using Figure 7.

[0051] The control block has two modes: one in which the correction unit 641, PID calculation unit 642, switching unit 643, and PID calculation unit 644 are connected in that order, and another in which the correction unit 645, switching unit 643, and PID calculation unit 644 are connected in that order. Boat position information is input to the PID calculation unit 642, PID calculation unit 644, and switching unit 643. The controlled object is a heat treatment furnace, which consists of a reaction tube 11 and a heater unit 40, and includes a heater thermocouple 65 and a substrate thermocouple 211.

[0052] The temperature controller 64 selects the input terminal of the switching unit 643 according to the boat position information.

[0053] When the boat 31 is in the closed position (inside the processing chamber 14), the temperature controller 64 selects input terminal "A" of the switching unit 643 and performs PID control with the substrate temperature and heater temperature as the controlled variables.

[0054] The control when the input terminal of the switching unit 643 is set to "A" is an example of the second control mode in the technology of this disclosure. The second control mode is a control mode in which control is performed using at least the substrate thermocouple 211 of the heater thermocouple 65 and the substrate thermocouple 211.

[0055] If the boat 31 is located in a position other than the closed position (for example, inside the transfer chamber 3), the temperature controller 64 selects input terminal "B" of the switching unit 643 and performs PID control with only the heater temperature as the controlled variable.

[0056] The control when the input terminal of the switching unit 643 is set to "B" is an example of the first control mode in the technology of this disclosure. The first control mode is a control mode in which only the heater thermocouple 65 is used for control among the heater thermocouple 65 and the substrate thermocouple 211.

[0057] The correction units 641 and 645 correct the target temperature according to the difference between the target temperature and the heater temperature and substrate temperature when controlling the temperature inside the processing chamber 14 to the same temperature.

[0058] When the switching unit 643 is switched, the output of the switching unit 643 jumps and discontinuous values ​​are generated. Therefore, the boat position information is also input to the PID calculation unit 642 and PID calculation unit 644, and so-called bumpless processing and integration stop processing are performed to enable smooth control before and after the switching.

[0059] Next, an example of a substrate processing sequence performed in the substrate processing apparatus 10 will be described using Figures 8(a), 8(b), 9(a), 9(b), and 10.

[0060] (Waiting process (transfer process): Step S101) The waiting process is a process in which the temperature inside the processing chamber 14 (also called the furnace) is stabilized to the target temperature T0, which is the waiting temperature (preparation temperature). The substrate 1 has not yet been placed inside the processing chamber 14. That is, the boat 31 is in the state shown in Figure 9(b), and the lower end opening of the processing chamber 14 (manifold 16 shown in Figure 1) is closed by a shutter (not shown).

[0061] The temperature controller 64 controls the heater unit 40 by inputting the temperature detected by the in-furnace thermocouple 66 or the heater thermocouple 65 in order to set the processing chamber 14 to the preparation temperature.

[0062] The gas flow controller 24 supplies inert gas into the processing chamber 14 via a gas supply device and nozzles (not shown). In parallel, the gas flow controller 24 supplies cooling gas to the transfer chamber 3 from supply holes 76a via nozzles 76 using a cooling gas supply device 231, and also supplies cooling gas to the transfer chamber 3 from each supply hole 70a via a clean unit 62.

[0063] The drive controller 28 transfers (charges) the substrate 1 from the pod 60 to the boat 31 using the substrate transfer machine 56. Step S101 is also referred to as the transfer process.

[0064] (Loading process: Step S102) The loading process involves loading the substrate 1, held in the boat 31, into the processing chamber 14 (boat loading). The lower end opening of the processing chamber 14 is opened, and the drive controller 28 raises the boat 31 using the lifting mechanism 26 to load it into the processing chamber 14. Once the loading of the boat 31 is complete, the lower end opening of the processing chamber 14 is closed by the cover 25, and the boat 31 is positioned in a predetermined location within the processing chamber 14, as shown in Figure 9(a).

[0065] During the loading process, following the transfer process, the gas flow controller 24 continues to supply inert gas to the processing chamber 14 and cooling gas to the transfer chamber 3.

[0066] Before being brought into the processing chamber 14, the temperatures of the boat 31 and the substrate 1 are lower than the temperature inside the processing chamber 14 (i.e., T0). Furthermore, when the substrate 1 is placed inside the processing chamber 14, the ambient temperature from outside the processing chamber 14 (room temperature) is introduced into the chamber. For these reasons, as shown in Figure 8(b), the temperature inside the processing chamber 14 temporarily drops below T0. Subsequently, the temperature inside the processing chamber 14 stabilizes back to T0 after a short period of time due to control by the temperature controller 64. In Figure 8(b), the target temperature after the substrate is placed inside the processing chamber 14, and the target temperature for the next step S103, are shown to be the same as in step S101; however, the target temperature after placement may differ depending on the requirements (processing temperature) for step S103.

[0067] (Processing step: Step S103) The processing step involves maintaining and stabilizing the temperature inside the processing chamber 14 at a target processing temperature T0 in order to perform a predetermined process (e.g., film deposition) on the substrate 1. The temperature controller 64 controls the heater unit 40 so that the measured temperature of the substrate thermocouple 211 approaches the target temperature T0. In this specification, processing temperature refers to the temperature of the substrate 1 or the temperature inside the processing chamber 14.

[0068] The gas flow controller 24 supplies raw material gas, reaction gas, or inert gas (collectively referred to as process gas) into the processing chamber 14 via the gas introduction pipe 22 using the gas supply device 23. The drive controller 28 rotates the boat 31 using a rotating mechanism. When multiple types of process gas are supplied, multiple processing temperatures are set corresponding to the supplied process gases.

[0069] In the processing step, after the predetermined processing of the substrate 1 is completed, there is a process to lower the temperature of the processing chamber 14 to a predetermined temperature (furnace cooling). This process is a substep of step S103 and is called the cooling process (step S103a). After that, the process transitions to the unloading process (step S104).

[0070] Furthermore, when using the temperature detected by the in-furnace thermocouple 66 or the heater thermocouple 65 as a monitoring temperature to control the cooling time, there is a large discrepancy between the temperature detected by the substrate thermocouple 211 and the temperature of the substrate 1. This can result in unnecessarily long cooling times or heat damage to the transfer chamber 3.

[0071] In this embodiment, since the substrate thermocouple 211 can accurately measure the temperature of the substrate 1, the cooling process can be continued while monitoring this temperature until it cools down to a predetermined temperature, and the unloading process can be started after the temperature has cooled, thereby controlling the optimal cooling time. As a result, even if there are variations in the temperature of the substrate 1, the cooling time can always be controlled in the shortest time and without damaging the surrounding area. Here, the predetermined temperature is the temperature at which the boat 31 can be unloaded, and is below the heat resistance temperature of the transfer chamber 3.

[0072] More specifically, the temperature controller 64 receives the temperature detected by the substrate thermocouple 211 as input and performs feedback control. The gas flow controller 24 supplies inert gas into the processing chamber 14, similar to the standby process. The drive controller 28 rotates the boat 31 and the substrate thermocouple 211 by the rotating shaft 30.

[0073] On the other hand, the controller 200 similarly inputs and monitors the temperature detected by the substrate thermocouple 211. The controller 200 then continues the cooling process until all detected temperatures have cooled to a predetermined temperature or below. In other words, the determination unit of the controller 200 determines whether the substrate has cooled down and proceeds to the next process (unloading process). The determination unit may also determine that the substrate has cooled down when it has remained at a predetermined temperature or below for a predetermined time.

[0074] The temperature detected by the substrate thermocouple 211, which is closer to the substrate 1 than the furnace thermocouple 66, can be compared with a predetermined temperature (set temperature) for determination, making it possible to properly manage the timing of the unloading process.

[0075] (Removal process: Step S104) The unloading process involves removing the processed substrate 1, along with the boat 31 and substrate thermocouple 211, from the processing chamber 14 (boat unloading). The drive controller 28 lowers the boat 31 and substrate thermocouple 211 using the lifting mechanism 26 and unloads (transports) them to the transfer chamber 3. As the boat 31 descends, the lower end opening of the processing chamber 14 opens. After that, the boat 31 is positioned in a predetermined location as shown in Figure 9(b). The lower end opening of the processing chamber 14 is then closed.

[0076] In the unloading process, following the cooling process, the gas flow controller 24 continues to supply inert gas to the processing chamber 14. In parallel with this, the gas flow controller 24 supplies cooling gas to the transfer chamber 3, similar to the standby process.

[0077] The temperature controller 64 controls the heater unit 40 by receiving the temperature detected by the furnace thermocouple 66, which has been switched from the substrate thermocouple 211, or the temperature detected by the heater thermocouple 65, in order to set the processing chamber 14 to the preparation temperature. In the cooling process and transfer process described later, the temperature controller 64 also sets the processing chamber 14 to the preparation temperature based on the temperature detected by the furnace thermocouple 66 or the temperature detected by the heater thermocouple 65.

[0078] After the unloading process, the boat 31 is placed in a predetermined position within the transfer chamber 3 as shown in Figure 9(b), and a cooling process (step S105) is performed to cool the substrate 1, followed by a transfer process (step S106).

[0079] (Cooling process: Step S105) In the cooling process, following the unloading process, the gas flow controller 24 continues to supply cooling gas to the transfer chamber 3, and the substrate 1 is cooled in the transfer chamber 3 until the temperature detected by the substrate thermocouple 211 reaches a predetermined temperature.

[0080] If a fixed time is set for the cooling time, variations in the temperature of the substrate 1 may result in unnecessarily long cooling times. Alternatively, the transfer process, which is the next step, may start before the substrate 1 has cooled to the predetermined temperature, potentially damaging the substrate transfer machine 56 or pod 60 due to heat.

[0081] In this embodiment, even in the transfer chamber 3, the substrate thermocouple 211 accurately measures the temperature of the substrate 1. By monitoring this temperature and continuing the cooling process until the temperature drops to a predetermined temperature (below the set temperature), and then starting the transfer process after the temperature has dropped, the optimal cooling time can be controlled. Therefore, even if there are variations in the temperature of the substrate 1, the cooling time can always be controlled in the shortest possible time and without damaging the surrounding area. Here, the predetermined temperature is the temperature at which the substrate 1 can be transferred, and is below the heat resistance temperature of the substrate transfer machine 56 or pod 60 that transports the substrate 1 between the boat 31 and the pod 60.

[0082] Furthermore, in this embodiment, the substrate thermocouple 211, which is used in the processing step to process the substrate placed in the processing chamber 14 by controlling the heater unit 40, is also used in the cooling step to measure the temperature of the substrate 1 located in the transfer chamber 3. Therefore, there is no need to newly install a component in the transfer chamber 3 to measure the temperature of the substrate 1.

[0083] More specifically, the temperature controller 64, similar to the standby process, loading process, and unloading process described above, receives the temperature detected by the furnace thermocouple 66 or heater thermocouple 65 and performs feedback control.

[0084] On the other hand, the controller 200 instructs the gas flow controller 24 to supply cooling gas from the clean unit 62 to the transfer chamber 3 from the unloading process to the cooling process. The controller 200 can adjust the flow rate of the cooling gas from the clean unit 62. The controller 200 then receives the detected temperature of the substrate thermocouple 211 as input and monitors the detected temperature of the substrate thermocouple 211 in all zones. The controller 200 then continues the cooling process until all detected temperatures have cooled to a predetermined temperature or below. In other words, the determination unit of the controller 200 determines whether the cooling of the substrate is complete and proceeds to the next process (transfer process). The determination unit may also determine that the cooling of the substrate is complete when the temperature remains below the predetermined temperature for a predetermined time. The control target of the substrate thermocouple 211 is the clean unit 62, which acts as a cooling mechanism.

[0085] During the cooling process, the controller 200 may be controlled as follows:

[0086] The controller 200 instructs the gas flow controller 24 to supply cooling gas to the clean unit 62 from the unloading process to the cooling process. The controller 200 then inputs and monitors the temperature detected by the temperature sensing section 211b of the multiple substrate thermocouples 211 arranged vertically. The controller 200 then continues to supply cooling gas to the supply port 70a of the clean unit 62 at the position corresponding to the substrate thermocouple 211 until the temperature detected by the temperature sensing section 211b of the substrate thermocouple 211 located in a particular zone has cooled to a temperature below a predetermined temperature. After that, the controller 200 stops supplying cooling gas to the supply port 70a of the clean unit 62 at the position corresponding to the temperature sensing section 211b of the substrate thermocouple 211 located in that particular zone. The controller 200 continues the cooling process until the supply of cooling gas to the supply holes 70a of all clean units 62 is stopped, that is, until all the temperatures detected by the temperature sensing section 211b of the substrate thermocouple 211 have cooled to a temperature below a predetermined temperature. In other words, the determination unit of the controller 200 determines whether the substrate has cooled and proceeds to the next process (transfer process). The determination unit may also determine that the substrate has cooled when it has remained at a temperature below a predetermined temperature for a predetermined time.

[0087] If a particular zone is, for example, the zone where the most heat accumulates, then cooling that particular zone will take longer than cooling other zones. Therefore, if the temperature detected by the substrate thermocouple 211 located in the particular zone is below a predetermined temperature, it can be determined that the substrate has finished cooling.

[0088] Furthermore, during the cooling process, the controller 200 and the gas flow controller 24 may be controlled as follows.

[0089] The gas flow controller 24 can obtain the temperature detected by the substrate thermocouple 211 from the controller 200, and provides feedback control to the gas discharge flow rate of the clean unit 62 corresponding to the placement position of the substrate thermocouple 211, targeting a predetermined cooling temperature also obtained from the controller 200.

[0090] The controller 200 instructs the gas flow controller 24 to set a predetermined cooling temperature for each substrate thermocouple 211 corresponding to each supply port 70a of the clean unit 62, from the unloading process to the cooling process. In parallel, the controller 200 also outputs the temperature detected by the substrate thermocouple 211 to the gas flow controller 24.

[0091] The gas flow controller 24 receives and feedback-controls the temperature detected by the temperature sensing section 211b of multiple substrate thermocouples 211 arranged vertically. The gas flow controller 24 continues to supply cooling gas to the supply port 70a of the clean unit 62 at the position corresponding to the substrate thermocouple 211 until the temperature detected by the temperature sensing section 211b of a substrate thermocouple 211 in a particular zone has cooled to a predetermined temperature or lower. After that, the gas flow controller 24 stops supplying cooling gas to the supply port 70a of the clean unit 62 at the position corresponding to the temperature sensing section 211b of the substrate thermocouple 211 in that particular zone. The gas flow controller 24 continues the cooling process until the temperature detected by the temperature sensing section 211b of all substrate thermocouples 211 has cooled to a predetermined temperature or lower. In other words, the gas flow controller 24 determines whether the substrate has cooled completely and proceeds to the next process (transfer process). The gas flow controller 24 may determine that the cooling of the substrate is complete when the temperature remains below a predetermined temperature for a predetermined period of time.

[0092] (Transfer process: Step S106) After step S105, the drive controller 28 transfers the circuit board 1 from the boat 31 to the pod 60 using the circuit board transfer machine 56 (discharge step).

[0093] If there are any untreated substrates 1 that need to be processed, the series of processes in steps S101 to S106 are repeated. Steps S101 to S106 are configured to be performed after a stable state has been achieved in which the temperature inside the processing chamber 14 is within a predetermined minute temperature range relative to the target temperature and this state continues for a predetermined time or longer.

[0094] According to this embodiment, one or more of the following effects can be obtained.

[0095] (a) The substrate 1 is cooled until the temperature detected by the substrate thermocouple 211 provided on the boat 31 reaches the set temperature. This allows the substrate 1 to be cooled simply by monitoring the temperature of the substrate thermocouple 211 provided on the boat 31 to fall below a predetermined temperature (set temperature). Furthermore, even if there is a temperature variation in the substrate 1 between the substrates 1 supported on the boat 31, the temperature can be detected by the substrate thermocouple 211 provided on the boat 31, so the temperature of the substrate 1 can be cooled to below a predetermined temperature (set temperature) with high accuracy.

[0096] (b) The substrate 1 is cooled until the temperature detected by the temperature sensing section 211b of each substrate thermocouple 211 provided on the boat 31 reaches the set temperature. This allows the substrate 1 to be cooled simply by monitoring the temperature of the substrate thermocouple 211 provided on the boat 31 to fall below a predetermined temperature (set temperature).

[0097] (c) Cooling is performed until the temperature detected by the temperature sensing part 211b of the substrate thermocouple 211 located in a specific zone reaches the set temperature. As a result, if the temperature detected by the temperature sensing part 211b of the substrate thermocouple 211 located in a specific zone reaches the set temperature, it can be determined that the cooling of the substrate 1 located on the boat 31 is complete.

[0098] (d) When the temperature detected by the substrate thermocouple 211 provided on the boat 31 remains below the set temperature for a predetermined period of time, it is determined that the cooling of the substrate 1 is complete. By monitoring the temperature changes detected by the substrate thermocouple 211 provided on the boat 31, the substrate can be cooled so that the temperature of the substrate 1 becomes below the predetermined temperature (below the set temperature).

[0099] (e) In the cooling process (step S105), the control target of the substrate thermocouple 211 provided on the boat 31 is the cooling mechanism that cools the substrate 1. This allows the cooling mechanism to be driven based on the temperature detected by the substrate thermocouple 211 provided on the boat 31, thereby cooling the substrate 1.

[0100] (f) In each of the cooling process (step S105) and the processing process (step S103), the processing of the substrate 1 and the cooling of the substrate 1 can be controlled based on the temperature detected by the substrate thermocouple 211 provided on the boat 31. As a result, temperature controllability is greatly improved, enabling highly accurate temperature control. Furthermore, there is no need to install any new components in the transfer chamber 3 to measure the temperature of the substrate 1.

[0101] (g) The transfer chamber 3 is provided with a clean unit 62 that supplies cooling gas. This allows the transfer chamber 3 to be cooled by the clean unit 62, so that the substrate 1 can be cooled in a short time.

[0102] (h) The clean unit 62 is equipped with a supply hole 70a that supplies cooling gas at a position opposite the substrate thermocouple 211. This allows the transfer chamber 3 to be cooled by the clean unit 62, so that the substrate 1 can be cooled in a short time.

[0103] (i) The clean unit 62, which serves as a cooling mechanism, is configured to allow the flow rate of the refrigerant to be changed for each supply hole 70a. This allows the transfer chamber 3 to be cooled by the clean unit 62, so that the substrate 1 can be cooled in a short time.

[0104] (j) The controller 200 has a determination unit which determines whether the cooling of the substrate 1 is complete and is configured to proceed to the next process (transfer process). As a result, when it is determined that the cooling of the substrate 1 is complete, the process proceeds to the next step, allowing the substrate 1 to be sufficiently cooled and preventing damage to the tweezers and pods 60 of the substrate transfer machine 56 in the next transfer process.

[0105] (k) The determination unit determines that the cooling of the substrate 1 is complete if the temperature detected by the temperature measuring section 211b of all (each zone) substrate thermocouples 211 is the set temperature. As a result, when it is determined that the cooling of the substrate 1 is complete, the process can proceed to the next step, allowing the substrate 1 to be sufficiently cooled and preventing damage to the tweezers and pods 60 of the substrate transfer machine 56 in the next transfer process.

[0106] (l) The determination unit determines that the cooling of the substrate 1 is complete if the temperature detected by the temperature measuring unit 211b of the substrate thermocouple 211 located in a specific area (for example, the zone where the most heat accumulates) is the set temperature. As a result, once it is determined that the cooling of the substrate 1 is complete, the process can proceed to the next step, allowing the substrate 1 to be sufficiently cooled and preventing damage to the tweezers and pods 60 of the substrate transfer machine 56 in the next transfer process.

[0107] (m) The determination unit determines that the cooling of the substrate 1 is complete when the temperature detected by the substrate thermocouple 211 remains below the set temperature for a predetermined period of time. As a result, when it is determined that the cooling of the substrate 1 is complete, the process can proceed to the next step, allowing the substrate 1 to be sufficiently cooled and preventing damage to the tweezers and pods 60 of the substrate transfer machine 56 in the next transfer process.

[0108] (n) The transport mechanism is configured to allow the boat 31 to move between the processing chamber 14 and the transfer chamber 3. As a result, the substrate thermocouple 211 is provided on the boat 31 so that it can move together with the boat 31, so that the temperature of the substrate 1 can be detected in both the processing chamber 14 and the transfer chamber 3, and temperature controllability is greatly improved, enabling highly accurate temperature control.

[0109] (o) The transfer chamber 3 is configured to be adjacent to the processing chamber 14, for example, by being located below the processing chamber 14. This allows the substrate thermocouple 211 to be provided on the boat 31 so that it can move together with the boat 31, so that the temperature of the substrate 1 can be detected in both the processing chamber 14 and the transfer chamber 3, which greatly improves temperature controllability and enables highly accurate temperature control.

[0110] The embodiments of this disclosure have been described in detail above. However, this disclosure is not limited to the embodiments described above, and can be modified in various ways without departing from its essence.

[0111] Although the above embodiment describes one zone, in reality there are multiple zones, and moving average parameters can be set for each zone. Furthermore, moving average parameters can also be set for each temperature (or temperature range).

[0112] As a substrate processing device, it can be applied not only to semiconductor manufacturing equipment but also to equipment that processes glass substrates, such as LCD equipment. Furthermore, the process is not particularly limited and can be anything. For film deposition processes, for example, there are no particular limitations on the type of film, such as CVD, PVD, oxide film, nitride film, or processes that form both, or processes that form metal-containing films. In addition, processes other than film deposition, such as annealing, oxidation, nitriding, and diffusion, are also acceptable. [Explanation of Symbols]

[0113] 3. Transfer Room (Transport Room) 14. Processing Room 31...Boat (substrate support) 211... Circuit board thermocouple (temperature sensor)

Claims

1. The process involves processing the substrate placed in the processing chamber while detecting its temperature using a temperature sensor attached to a substrate support that holds the substrate, and then transporting the substrate from the processing chamber to a transport chamber. With the substrate support positioned in a predetermined location in the transport chamber, the substrate is cooled by supplying a refrigerant from a position opposite the temperature sensor so that the temperature detected by the temperature sensor falls below a set temperature. It has, A substrate cooling method that includes lowering the temperature of the processing chamber by supplying an inert gas to the processing chamber based on the temperature detected by the temperature sensor.

2. The substrate cooling method according to claim 1, wherein the temperature sensor is configured to operate together with the substrate support.

3. The temperature sensor has multiple temperature measuring units, The substrate cooling method according to claim 1, wherein in the step of cooling the substrate, the substrate is cooled until the temperature detected by each of the temperature measuring units reaches the set temperature.

4. The substrate cooling method according to claim 3, wherein the substrate is cooled until the temperature detected by the temperature measuring unit located at a specific position among the plurality of temperature measuring units reaches the set temperature.

5. The substrate cooling method according to claim 1, wherein in the step of cooling the substrate, it is determined that the cooling of the substrate is complete when the temperature detected by the temperature sensor remains at or below the set temperature for a predetermined time.

6. In the step of cooling the substrate, The substrate cooling method according to claim 1, wherein the object controlled by the temperature sensor is a cooling mechanism for cooling the substrate.

7. Furthermore, it includes a process for processing the substrate, A method for manufacturing a semiconductor device, wherein in each of the steps of cooling the substrate and processing the substrate, the temperature of the substrate is controlled based on the temperature detected by the temperature sensor described in claim 1.

8. A temperature sensor attached to a substrate support that supports the substrate, and a transport chamber in which the substrate is transported from the processing chamber after processing the substrate which is placed in the processing chamber while detecting the temperature with the temperature sensor, The system includes a control unit configured to cause the cooling mechanism to cool the substrate so that the temperature detected by the temperature sensor falls below a set temperature, while the substrate support is positioned in a predetermined location in the transport chamber. The processing of the substrate includes lowering the temperature of the processing chamber by supplying an inert gas to the processing chamber based on the temperature detected by the temperature sensor. The cooling mechanism includes a clean unit that supplies refrigerant to the transport chamber. The clean unit is a substrate cooling system that includes a supply port for supplying the refrigerant at a position opposite the temperature sensor.

9. The substrate cooling system according to claim 8, wherein the control unit is configured to adjust the flow rate of the refrigerant from the clean unit.

10. The substrate cooling system according to claim 9, wherein the cooling mechanism is configured to change the flow rate of the refrigerant for each of the supply holes.

11. Furthermore, the control unit has a determination unit, The substrate cooling system according to claim 8, wherein the determination unit is configured to determine whether the cooling of the substrate is complete and to proceed to the next step.

12. Furthermore, the temperature sensor has multiple temperature measuring units, The substrate cooling system according to claim 11, wherein the determination unit determines that the cooling of the substrate is complete if the temperature detected by the plurality of temperature measuring units is below a set temperature.

13. The substrate cooling system according to claim 12, wherein the determination unit determines that the cooling of the substrate is complete if the temperature detected by a temperature measuring unit located at a specific location among the plurality of temperature measuring units is below a set temperature.

14. The substrate cooling system according to claim 11, wherein the determination unit determines that the cooling of the substrate is complete when the temperature detected by the temperature sensor remains below a set temperature for a predetermined period of time.

15. Furthermore, the substrate cooling system according to claim 8, further comprising a transport mechanism configured to allow the substrate support to be moved between the processing chamber and the transport chamber.

16. The substrate cooling system according to claim 15, wherein the transport chamber is configured to be adjacent to the processing chamber.

17. The substrate cooling system according to claim 15, wherein the transport chamber is configured to be located below the processing chamber.

18. A temperature sensor attached to a substrate support that supports a substrate, and a transport chamber in which the substrate is transported from the processing chamber after processing the substrate placed in the processing chamber while detecting the temperature with the temperature sensor, The system includes a control unit configured to cause the cooling mechanism to cool the substrate so that the temperature detected by the temperature sensor falls below a set temperature, while the substrate support is positioned in a predetermined location in the transport chamber. The processing of the substrate includes lowering the temperature of the processing chamber by supplying an inert gas to the processing chamber based on the temperature detected by the temperature sensor. The cooling mechanism includes a clean unit that supplies refrigerant to the transport chamber. The clean unit is a substrate processing apparatus that includes a supply hole for supplying the refrigerant at a position opposite to the temperature sensor.

19. A program that causes a substrate processing device to execute the following steps: a procedure for processing a substrate placed in a processing chamber while detecting its temperature using a temperature sensor attached to a substrate support that supports the substrate; a procedure for transporting the substrate from the processing chamber to a transport chamber; a procedure for cooling the substrate by supplying a refrigerant from a position opposite the temperature sensor so that the temperature detected by the temperature sensor falls below a set temperature, while the substrate support is positioned in a predetermined position in the transport chamber; and a procedure between the procedure for processing the substrate and the procedure for transporting the substrate to the transport chamber, lowering the temperature of the processing chamber by supplying an inert gas into the processing chamber based on the temperature detected by the temperature sensor.

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