Single immersion device

Abstract

The objective is to improve the manufacturing yield of circuit boards by moving individual substrates easily and quickly without generating large waves in the immersion liquid. [Solution] A standalone immersion device is provided, comprising a structure 1 equipped with a path guidance module and an electronic control module; a transfer mechanism 2 provided on the path guidance module 11 and electrically connected to the electronic control module; an immersion mechanism 3 provided on the structure and located on one side of the transfer mechanism and electrically connected to the electronic control module; a cleaning mechanism 4 provided on the structure and located on one side of the immersion mechanism and electrically connected to the electronic control module; and a drying mechanism 5 provided on the structure and located on one side of the cleaning mechanism and electrically connected to the electronic control module, wherein the path guidance module is provided on the top of the structure, and the electronic control module is installed on the structure and electrically connected to the path guidance module.

Description

Technical Field

[0001] The present invention relates to a single-substrate immersion apparatus, and more particularly to a single-substrate immersion apparatus that improves the manufacturing yield of circuit boards by simply and quickly moving a single substrate without generating large waves in the immersion liquid.

[0002] In a conventional immersion apparatus for circuit boards, a plurality of circuit boards are placed in a basket, and the entire basket is moved to the immersion apparatus to perform a coating process on the boards.

Background Art

[0003] When moving the entire basket to the immersion apparatus, if large waves are generated due to movement or immersion in the immersion liquid, the basket may be distorted or deformed due to the impact of the liquid. Therefore, the circuit board may be damaged by the distorted or deformed basket, and it may be difficult to remove the board from the basket. As a result, in the coating process of the circuit board, the work efficiency is not improved and the defect rate becomes high.

[0004] An object of the present invention is to improve the conventional immersion apparatus by providing a single-substrate immersion apparatus that improves the manufacturing yield of circuit boards by simply and quickly moving a single substrate without generating large waves in the immersion liquid.

Summary of the Invention

Problems to be Solved by the Invention

[0005] As a result of intensive studies by the inventors to solve the above-mentioned drawbacks in the prior art, a single-substrate immersion apparatus has been developed that improves the manufacturing yield of circuit boards by simply and quickly moving a single substrate without generating large waves in the immersion liquid.

Means for Solving the Problems

[0006] To solve the above problems, one aspect of the present invention provides a standalone immersion device comprising: a structure comprising a path guidance module and an electronic control module; at least one transfer mechanism provided on the path guidance module and electrically connected to the electronic control module; an immersion mechanism provided on the structure, located on one side of the transfer mechanism and electrically connected to the electronic control module; a cleaning mechanism provided on the structure, located on one side of the immersion mechanism and electrically connected to the electronic control module; and a drying mechanism provided on the structure, located on one side of the cleaning mechanism and electrically connected to the electronic control module, wherein the path guidance module is provided on the top of the structure, and the electronic control module is installed on the structure and electrically connected to the path guidance module.

[0007] In the above embodiment, the path guidance module may guide the transfer mechanism to correspond to the immersion mechanism, the washing mechanism, and the drying mechanism.

[0008] Furthermore, in the above embodiment, the transfer mechanism may further include a lifting module installed on the path guidance module and at least one clamping device installed on the lifting module.

[0009] Furthermore, in the above embodiment, the transfer mechanism may further include a plate material suction module disposed on one side of the clamping device.

[0010] Furthermore, in the above embodiment, the immersion mechanism further comprises a liquid tank, a clean module, and a first gas induction module, wherein the liquid tank may have the clean module on one side and the first gas induction module on the other side.

[0011] Furthermore, in the above embodiment, the liquid tank may be provided with a plurality of first racks and a plurality of drainage holes.

[0012] Furthermore, in the above embodiment, the cleaning mechanism further comprises a water washing tank and a second gas induction module, and the second gas induction module may be located on one side of the water washing tank.

[0013] Furthermore, in the above embodiment, the washing tank may be provided with a plurality of second racks.

[0014] Furthermore, in the above embodiment, the drying mechanism further comprises a drying tank and a cover, the cover may be movably installed on the upper part of the drying tank.

[0015] Furthermore, in the above embodiment, the drying tank may be provided with a plurality of third racks. [Effects of the Invention]

[0016] As a result, the present invention allows for the transfer mechanism to move circuit boards one by one to the immersion mechanism, cleaning mechanism, and drying mechanism, enabling immersion, cleaning, and drying of the circuit boards. Furthermore, by moving individual boards easily and quickly without generating large waves in the immersion liquid, the manufacturing yield of circuit boards can be improved. [Brief explanation of the drawing]

[0017] [Figure 1] This is a perspective view 1 showing a preferred embodiment of the present invention. [Figure 2] This is a perspective view 2 showing a preferred embodiment of the present invention. [Figure 3] This is a perspective view 1 showing a preferred embodiment of the transfer mechanism according to the present invention. [Figure 4] This is a perspective view 2 showing a preferred embodiment of the transfer mechanism according to the present invention. [Figure 5] This is a perspective view 1 showing a preferred embodiment of the immersion mechanism according to the present invention. [Figure 6] This is a perspective view 2 showing a preferred embodiment of the immersion mechanism according to the present invention. [Figure 7] This is a perspective view 1 showing a preferred embodiment of the cleaning mechanism according to the present invention. [Figure 8] It is perspective view 2 showing a preferred embodiment of the cleaning mechanism according to the present invention. [Figure 9] It is perspective view 1 showing a preferred embodiment of the drying mechanism according to the present invention. [Figure 10] It is perspective view 2 showing a preferred embodiment of the drying mechanism according to the present invention. [Figure 11] It is perspective view 3 showing a preferred embodiment of the drying mechanism according to the present invention. [Figure 12] It is a perspective view showing a preferred embodiment of the supply mechanism according to the present invention. [Figure 13] It is a perspective view showing a preferred embodiment of the receiving mechanism according to the present invention.

Mode for Carrying Out the Invention

[0018] In order to fully understand the object, features, and effects of the present invention, the present invention will be described in detail below with reference to specific examples and the accompanying drawings.

[0019] Please refer to FIGS. 1 to 4. As shown in the drawings, the single immersion device according to the present invention includes a structure 1, at least one transfer mechanism 2, an immersion mechanism 3, a cleaning mechanism 4, and a drying mechanism 5.

[0020] The structure 1 includes a path guiding module 11 and an electronic control module 12. The path guiding module 11 is provided at the top of the structure 1. The electronic control module 12 is installed in the structure 1 and is electrically connected to the path guiding module 11. The path guiding module 11 may be a conveyor belt or a rail. The electronic control module 12 may be a computer, a server, or a programmable controller. With this configuration, automatic control can be performed on the operation flows of the immersion mechanism 3, the cleaning mechanism 4, and the drying mechanism 5 according to the setting of the transfer mechanism 2.

[0021] The transfer mechanism 2 is provided in the path guidance module 11 and is electrically connected to the electronic control module 12.

[0022] The immersion mechanism 3 is provided in the structure 1, located on one side of the transfer mechanism 2, and is electrically connected to the electronic control module 12.

[0023] The cleaning mechanism 4 is provided in the structure 1, located on one side of the immersion mechanism 3, and is electrically connected to the electronic control module 12.

[0024] The drying mechanism 5 is provided in the structure 1, located on one side of the washing mechanism 4, and is electrically connected to the electronic control module 12.

[0025] In one embodiment of the present invention, the path guidance module 11 guides the transfer mechanism 2 to correspond to the immersion mechanism 3, the washing mechanism 4, and the drying mechanism 5. Furthermore, a supply mechanism 6 and a receiving mechanism 7 may be provided at the leading edge (near the immersion mechanism 3) and the trailing edge (near the drying mechanism 5) of the structure 1, respectively. This allows for efficient post-processing of each circuit board 8 by placing multiple circuit boards 8 to be processed in the supply mechanism 6 and the processed circuit boards 8 in the receiving mechanism 7.

[0026] In this invention, the transfer mechanism 2 allows the circuit boards 8 to be moved one by one from the supply mechanism 6 to the immersion mechanism 3. Specifically, one circuit board is transported to the immersion mechanism 3 approximately every 30 seconds. By introducing the circuit boards 8 individually, it is possible to effectively prevent large waves from occurring in the immersion liquid within the immersion mechanism 3. Once a predetermined number of circuit boards 8 are placed in the immersion mechanism 3, the immersion mechanism 3 can perform coating on each circuit board 8. At this time, the moved transfer mechanism 2 may be returned to its original position in order to continue gripping and moving the next circuit board 8. Each circuit board 8 that has been coated in the immersion mechanism 3 is transported one by one to the cleaning mechanism 4 by the transfer mechanism 2, where the surface of the circuit board 8 is cleaned. After that, the cleaned circuit boards 8 are moved one by one to the drying mechanism 5 by the transfer mechanism 2, where they undergo drying. Then, the dried circuit boards 8 are moved one by one from the drying mechanism 5 to the receiving mechanism 7 by the transfer mechanism 2. This completes the coating process for each circuit board 8. As described above, the embodiment allows circuit boards 8 to be sequentially moved one by one by the transfer mechanism 2 to the immersion mechanism 3, the cleaning mechanism 4, and the drying mechanism 5, thereby enabling immersion, cleaning, and drying of each circuit board 8. This improves the manufacturing yield of circuit boards by allowing for the simple and rapid movement of individual boards without generating large waves in the immersion liquid.

[0027] In another embodiment of the present invention, in contrast to the embodiment described above, the transfer mechanism 2 further comprises a lifting module 21 and at least one clamping device 22. The lifting module 21 is installed on the path guidance module 11, and the clamping device 22 is installed on the lifting module 21. The transfer mechanism 2 further comprises a plate material suction module 23 located on one side of the clamping device 22.

[0028] According to the embodiment described above, when arranging each circuit board 8, the circuit board 8 may be placed horizontally in the supply mechanism 6. When the transfer mechanism 2 grasps the circuit board 8 from the supply mechanism 6, the plate material suction module 23 suctions the individual circuit board 8 in a horizontal position, rotates it to a vertical (upright) position, and then the lifting module 21 and clamping device 22 of the transfer mechanism 2 move each circuit board 8 to the immersion mechanism 3. By introducing the circuit board 8 individually in this way, it is possible to effectively prevent large waves from occurring in the immersion liquid within the immersion mechanism 3. Then, once a predetermined number of circuit boards 8 are placed in the immersion mechanism 3, the immersion mechanism 3 performs a coating process on each circuit board 8. At this time, one of the gripping devices 22 of the transfer mechanism 2 may, after moving, return to its original position (for example, at the supply mechanism 6) in cooperation with the lifting module 21 and the path guidance module 11 in order to grip and continue moving the next circuit board 8. Furthermore, each circuit board 8 coated in the immersion mechanism 3 is transported one by one to the cleaning mechanism 4 through the cooperation of the other clamping device 22 of the transfer mechanism 2, the lifting module 21, and the path guidance module 11, where the surface of the circuit board 8 is cleaned. Subsequently, the cleaned circuit boards 8 are moved one by one to the drying mechanism 5 by the cooperation of the other clamping device 22 of the transfer mechanism 2, the lifting module 21, and the path guidance module 11, where they undergo a post-cleaning drying process. Then, the dried circuit boards 8 are moved one by one from the drying mechanism 5 to the receiving mechanism 7 by the cooperation of the other clamping device 22, the lifting module 21, and the path guidance module 11. This completes the coating process for each circuit board 8. As described above, according to the embodiments, the present invention allows the circuit boards 8 to be moved one by one by the transfer mechanism 2 to the immersion mechanism 3, the cleaning mechanism 4, and the drying mechanism 5, thereby enabling immersion, cleaning, and drying of the circuit boards 8. Furthermore, by moving individual boards easily and quickly without generating large waves in the immersion liquid, the manufacturing yield of circuit boards can be improved.

[0029] In another embodiment of the present invention, unlike the embodiment described above, the immersion mechanism 3 further comprises a liquid tank 31, a clean module 32, and a first gas induction module 33 (for example, a blower, fan, or air knife). The liquid tank 31 has the clean module 32 on one side and the first gas induction module 33 on the other side. The liquid tank 31 is also provided with a plurality of first racks 311 and a plurality of drainage holes 312.

[0030] According to the embodiment described above, the lifting module 21 and clamping device 22 of the transfer mechanism 2 work together to move each circuit board 8 to the first rack 311 of the liquid tank 31 provided in the immersion mechanism 3. By placing the circuit boards 8 individually on the first rack 311, it is possible to effectively prevent large waves from occurring in the immersion liquid in the liquid tank 31 provided in the immersion mechanism 3. Once a predetermined number of circuit boards 8 are placed on the first rack 311 of the immersion mechanism 3, the liquid tank 31 of the immersion mechanism 3 performs a coating process on each circuit board 8. Waste materials and residues generated during the coating process are discharged from the immersion mechanism 3 through the drain hole 312 of the liquid tank 31. This prevents the immersion mechanism 3 from being affected during the coating process. At this time, in order to continue gripping and moving the next circuit board 8, one of the gripping devices 22 of the transfer mechanism 2 may be returned to its original position (for example, at the supply mechanism 6) through the cooperation of the lifting module 21 and the path guidance module 11 after being cleaned by the clean module 32 and dried by the first gas induction module 33. Furthermore, each circuit board 8 coated in the immersion mechanism 3 is transported one by one to the cleaning mechanism 4 by the cooperation of the other clamping device 22 of the transfer mechanism 2, the lifting module 21, and the path guidance module 11, where the surface of the circuit board 8 is cleaned. At this time, the liquid in the liquid tank 31 adhering to the other clamping device 22 may be dried by the first gas guidance module 33. Subsequently, the cleaned circuit boards 8 are moved one by one to the drying mechanism 5 by the cooperation of the other clamping device 22 of the transfer mechanism 2, the lifting module 21, and the path guidance module 11, where they undergo a post-cleaning drying process. Then, the dried circuit boards 8 are moved one by one from the drying mechanism 5 to the receiving mechanism 7 by the cooperation of the other clamping device 22, the lifting module 21, and the path guidance module 11. This completes the coating process for each circuit board 8. As described above, according to the embodiments, the present invention allows the circuit boards 8 to be moved one by one by the transfer mechanism 2 to the immersion mechanism 3, the cleaning mechanism 4, and the drying mechanism 5, thereby enabling immersion, cleaning, and drying of the circuit boards 8. Furthermore, by moving individual boards easily and quickly without generating large waves in the immersion liquid, the manufacturing yield of circuit boards can be improved.

[0031] In another embodiment of the present invention, in contrast to the embodiment described above, the cleaning mechanism 4 further comprises a water washing tank 41 and a second gas induction module 42 (for example, a blower, fan, or air knife). The second gas induction module 42 is located on one side of the water washing tank 41. The water washing tank 41 is provided with a plurality of second racks 411.

[0032] According to the embodiment described above, each circuit board 8 coated in the immersion mechanism 3 is transported one by one to the second rack 411 of the washing tank 41 installed in the washing mechanism 4 by the cooperation of the other clamping device 22 of the transfer mechanism 2, the lifting module 21, and the path guidance module 11, and the surface of the circuit board 8 is washed in the washing tank 41 of the washing mechanism 4. Then, each circuit board 8 is dried by the second gas guidance module 42. Subsequently, the cleaned circuit boards 8 are moved one by one to the drying mechanism 5 through the cooperation of the other clamping device 22 of the transfer mechanism 2, the lifting module 21, and the path guidance module 11, where they undergo a post-cleaning drying process. Then, the dried circuit boards 8 are moved one by one from the drying mechanism 5 to the receiving mechanism 7 through the cooperation of the other clamping device 22 of the transfer mechanism 2, the lifting module 21, and the path guidance module 11. This completes the coating process for each circuit board 8. As described above, according to the embodiments, the present invention allows the circuit boards 8 to be moved one by one by the transfer mechanism 2 to the immersion mechanism 3, the cleaning mechanism 4, and the drying mechanism 5, thereby enabling immersion, cleaning, and drying of the circuit boards 8. Furthermore, by moving individual boards easily and quickly without generating large waves in the immersion liquid, the manufacturing yield of circuit boards can be improved.

[0033] In another embodiment of the present invention, unlike the embodiment described above, the drying mechanism 5 further comprises a drying tank 51 and a cover 52. The cover 52 is movably installed on the top of the drying tank 51. The drying tank 51 is provided with a plurality of third racks 511. The cover 52 may be composed of a plurality of doors or blinds.

[0034] According to the embodiment described above, after cleaning each circuit board 8 in the cleaning mechanism 4, the cover 52 of the drying mechanism 5 is opened, and the other clamping device 22 of the transfer mechanism 2, the lifting module 21, and the path guidance module 11 cooperate to transport the circuit boards 8 one by one to the third rack 511 of the drying tank 51 installed in the drying mechanism 5, where the cleaned circuit boards 8 are dried in the drying tank 51. Subsequently, the dried circuit boards 8 are moved one by one from the drying mechanism 5 to the receiving mechanism 7 by the cooperation of the other clamping device 22 of the transfer mechanism 2, the lifting module 21, and the path guidance module 11. This completes the coating process for each circuit board 8. As described above, according to the embodiments, the present invention allows the circuit boards 8 to be moved one by one by the transfer mechanism 2 to the immersion mechanism 3, the cleaning mechanism 4, and the drying mechanism 5, thereby enabling immersion, cleaning, and drying of the circuit boards 8. Furthermore, by moving individual boards easily and quickly without generating large waves in the immersion liquid, the manufacturing yield of circuit boards can be improved.

[0035] Although the present invention has been disclosed by the preferred embodiments described above, those skilled in the art will understand that these embodiments are solely for the purpose of illustrating the present invention in detail and do not limit it. Furthermore, various modifications are possible within the scope of the claims, and configurations obtained by appropriately combining the technical means disclosed in the embodiments are also included within the technical scope of the present invention; therefore, the scope of the present invention is defined by the claims. [Explanation of Symbols]

[0036] 1 structure 11. Path guidance module 12 Electronic control modules 2 Transfer mechanism 21 Lifting Module 22 Clamping tool 23. Plate material adsorption module 3 Immersion mechanism 31 Liquid tank 311 Rack 1 312 Drain hole 32 Clean Modules 33. First Gas Induction Module 4. Cleaning mechanism 41 Wash tank 411 Rack 2 42. Second Gas Induction Module 5 Drying mechanism 51 Drying tank 511 Rack 3 52 Cover 6 Supply mechanism 7 Receiving organization 8 Circuit boards

Claims

1. A structure comprising a path guidance module and an electronic control module, The route guidance module is provided with at least one transfer mechanism that is electrically connected to the electronic control module, An immersion mechanism provided in the structure, located on one side of the transfer mechanism, and electrically connected to the electronic control module, A cleaning mechanism provided in the structure, located on one side of the immersion mechanism, and electrically connected to the electronic control module, The structure includes a drying mechanism provided on the aforementioned structure, located on one side of the washing mechanism, and electrically connected to the electronic control module, The route guidance module is provided at the top of the structure, The electronic control module is installed in the structure and electrically connected to the path guidance module. The transfer mechanism further comprises a lifting module installed on the path guidance module and at least one clamping device installed on the lifting module. The immersion mechanism comprises a liquid tank provided with a plurality of first racks and a plurality of drainage holes, a clean module located on one side of the liquid tank, and a first gas induction module located on the other side of the liquid tank. The cleaning mechanism is characterized by comprising a washing tank provided with a plurality of second racks, and a second gas induction module arranged on one side of the washing tank, as a standalone immersion device.

2. The standalone immersion apparatus according to claim 1, characterized in that the path guidance module guides the transfer mechanism to correspond to the immersion mechanism, the washing mechanism, and the drying mechanism.

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