Thin film circuit substrate

Abstract

To provide a thin film circuit board.SOLUTION: A thin film circuit board 100 includes a substrate and a heat dissipation sheet 120. The heat dissipation sheet 120 is attached to the substrate, and includes: a first heat dissipation part 121; a second heat dissipation part 122; and a third heat dissipation part 123. Since the contour of the heat dissipation sheet 120 has a non-rectangular polygonal shape, a stress generated by the heat dissipation sheet 120 and the substrate may be reduced, thereby preventing wrapping of the thin film circuit board 100. A first chip shadow 200a is formed on the first heat dissipation part 121. An imaginary line Y passes through the first heat dissipation part 121, the second heat dissipation part 122, and the third heat dissipation part 123. A third width W3 of the third heat dissipation part 123 is not smaller than a first width W1 of the first heat dissipation part 121 and a second width W2 of the second heat dissipation part 122. The heat dissipation sheet 120 includes a first notch part 124 located at the first heat dissipation portion 121 and exposing the substrate, and the first chip shadow 200a is located between the first notch part 124 and the third heat dissipation part 123.SELECTED DRAWING: Figure 9

Description

Technical Field

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[0001] The present invention relates to a thin film circuit board, and more particularly to a thin film circuit board provided with a non-rectangular polygonal heat dissipation sheet.

Background Art

[0002] The conventional thin film flip chip package process adopts a roll-to-roll transport method to perform various processes (for example, heat dissipation sheet attachment and flip chip bonding processes), cuts a circuit board tape into a plurality of thin film flip chip packages, sandwiches each of the thin film flip chip packages with a jig, and bonds each of the thin film flip chip packages to an electronic element (for example, a display panel or a circuit board).

Summary of the Invention

Problems to be Solved by the Invention

[0003] The conventional thin film circuit board 10 includes a substrate 11 and a heat dissipation sheet 12 (see FIGS. 1 and 2). The heat dissipation sheet 12 is attached to the surface 11a of the substrate 11 by an adhesive 13, the chip 20 is coupled to the other surface 11b of the substrate 11, and the heat dissipation sheet 12 is used to reduce the temperature during the operation of the chip 20. However, since the material properties (for example, plasticity, ductility, thermal expansion coefficient, etc.) of the substrate 11, the heat dissipation sheet 12, and the adhesive 13 are different, when the substrate 11, the heat dissipation sheet 12, and the adhesive 13 are affected by the process environment temperature or are sandwiched by a jig, warpage or bending occurs in the thin film circuit board 10, and the thin film circuit board 10 cannot be accurately bonded to an electronic element.

[0004] The inventor of the present invention considered that the above drawbacks can be improved, and as a result of intensive studies, the present invention was proposed to effectively improve the above problems with a reasonable design.

[0005] As a result of diligent research, the inventors of the present invention have found that the above objective can be achieved by adopting a thin-film circuit board configuration that prevents warping and bending of the thin-film circuit board by attaching a non-rectangular, polygonal heat dissipation sheet to the substrate, and have completed the present invention. [Means for solving the problem]

[0006] To solve the above problems, a thin-film circuit board according to one aspect of the present invention comprises a substrate and a heat dissipation sheet. The substrate has a first surface and a second surface, the second surface being used to bond a first chip and a second chip. The heat dissipation sheet is attached to the first surface of the substrate, and the outline of the heat dissipation sheet is a non-rectangular polygon. The heat dissipation sheet has a first heat dissipation portion, a second heat dissipation portion and a third heat dissipation portion, the third heat dissipation portion being located between the first heat dissipation portion and the second heat dissipation portion, and the third heat dissipation portion being connected to the first heat dissipation portion and the second heat dissipation portion. The first chip and the second chip are placed on the heat dissipation sheet, forming a first chip shadow and a second chip shadow, respectively. The first chip is installed in the first region of the second surface, and the second chip is installed in the second region of the second surface. The first and second chips are arranged alternately on the second surface, and a third region located between the first and second regions is exposed. The first chip is located directly above the first heat dissipation section and forms a first chip shadow on the first heat dissipation section. The second chip is located directly above the second heat dissipation section and forms a second chip shadow on the second heat dissipation section. The third region is located above the third heat dissipation section. The imaginary line passes through the first heat dissipation section, the second heat dissipation section, and the third heat dissipation section. Along the direction perpendicular to the imaginary line, the third width of the third heat dissipation section is not smaller than the first width of the first heat dissipation section and the second width of the second heat dissipation section. The heat dissipation sheet is located in the first heat dissipation section and has a first notch that exposes the substrate, and the first chip shadow is located between the first notch and the third heat dissipation section. [Effects of the Invention]

[0007] The heat dissipation sheet according to the present invention has a non-rectangular polygonal contour, and the third heat dissipation section is connected to the first and second heat dissipation sections. This increases the bending resistance strength of the substrate, reduces the stress generated in the heat dissipation sheet and the substrate, prevents warping and bending of the thin-film circuit board, and simultaneously increases the area of ​​the heat dissipation sheet to enhance the heat dissipation effect.

[0008] The following information will become clear from the description in the specification and drawings described later. [Brief explanation of the drawing]

[0009] [Figure 1] This is a bottom view showing one embodiment of a conventional thin-film circuit board. [Figure 2] This is a cross-sectional view showing one embodiment of a conventional thin-film circuit board. [Figure 3] This is a bottom view showing a circuit board tape according to the first embodiment of the present invention. [Figure 4] This is a bottom view showing a thin-film circuit board according to the first embodiment of the present invention. [Figure 5] This is a cross-sectional view along the CC line in Figure 4. [Figure 6] This is a cross-sectional view showing a thin-film circuit board being held by a jig. [Figure 7] This is a bottom view showing a thin-film circuit board according to a second embodiment of the present invention. [Figure 8] This is a bottom view showing a thin-film circuit board according to a third embodiment of the present invention. [Figure 9] This is a bottom view showing a thin-film circuit board according to a fourth embodiment of the present invention. [Modes for carrying out the invention]

[0010] The embodiments of the thin-film circuit board of the present invention will be described below with reference to the drawings. The present invention is not limited to these embodiments, and the components, materials, etc. described below can be modified in various ways within the scope of the spirit of the present invention. The fourth embodiment corresponds to an embodiment for carrying out the invention described in the claims.

[0011] (First embodiment) The configuration of the first embodiment of the present invention is shown in Figures 3 to 5. The circuit board tape 100A has a plurality of thin-film circuit boards 100, each of which has a substrate 110 and a heat dissipation sheet 120. The contour of the heat dissipation sheet 120 is a non-rectangular polygon, and the heat dissipation sheet 120 is attached to the first surface 110a of the substrate 110 by an adhesive 130. Each of the thin-film circuit boards 100 is used to bond a first chip 200 and a second chip 300. In the cutting process, the thin-film circuit boards 100 are separated into solids, and each thin-film circuit board 100, the first chip 200, and the second chip 300 are formed as a thin-film flip-chip package.

[0012] As shown in Figures 4 and 5, the first chip 200 and the second chip 300 are installed on the second surface 110b of the substrate 110 and are arranged alternately in different regions of the second surface 110b. In this embodiment, the first chip 200 is installed in the first region 110b1 of the second surface 110b, and the second chip 300 is installed in the second region 110b2 of the second surface 110b, with the third region 110b3 located between the first region 110b1 and the second region 110b2 exposed.

[0013] As shown in Figures 4 and 5, in this embodiment, the contour of the heat dissipation sheet 120 approximates an inverted A shape. The heat dissipation sheet 120 has a first heat dissipation section 121, a second heat dissipation section 122, and a third heat dissipation section 123. The third heat dissipation section 123 is located between the first heat dissipation section 121 and the second heat dissipation section 122, and the third heat dissipation section 123 is connected to the first heat dissipation section 121 and the second heat dissipation section 122. The first chip 200 is located directly above the first heat dissipation section 121 and forms a first chip shadow 200a on the first heat dissipation section 121. The second chip 300 is located directly above the second heat dissipation section 122 and forms a second chip shadow 300a on the second heat dissipation section 122. The third region 110b3 is located directly above the third heat dissipation section 123.

[0014] As shown in Figures 3 and 4, along the direction in which the circuit board tape 100A is transported, the virtual line Y passes through the first heat dissipation section 121, the second heat dissipation section 122, and the third heat dissipation section 123. Along the direction perpendicular to the virtual line Y, the first heat dissipation section 121 has a first corner A1 and a first side surface 121a connected to the first corner A1, and the second heat dissipation section 122 has a second corner B1 and a second side surface 122a connected to the second corner B1.

[0015] As shown in Figures 3 and 4, the third heat dissipation section 123 is connected to the first corner A1 and the second corner B1, and the third heat dissipation section 123 has its first side surface 121a and second side surface 122a exposed. In this embodiment, along the direction perpendicular to the virtual line Y, the third width W3 of the third heat dissipation section 123 is smaller than the first width W1 of the first heat dissipation section 121 and the second width W2 of the second heat dissipation section 122. Preferably, the third heat dissipation section 123 has a third side surface 123a, and the first virtual line Y1 extending outward along the third side surface 123a passes through the first chip shadow 200a, increasing the warp resistance and bending resistance strength of the third heat dissipation section 123.

[0016] Referring to FIG. 4, the heat dissipation sheet 120 has a first notch portion 124 located on one side of the third heat dissipation portion 123. In this embodiment, the first side surface 121a, the second side surface 122a, and the third side surface 123a are also the side surfaces of the first notch portion 124. The first notch portion 124 exposes the first surface 110a of the substrate 110. When the substrate 110, the heat dissipation sheet 120, and the adhesive 130 generate stress due to differences in material properties (e.g., plasticity, ductility, or coefficient of thermal expansion), the first notch portion 124 is used to release the stress, preventing the warping of the circuit board tape 100A.

[0017] In this embodiment, the heat dissipation sheet 120 further includes a fourth heat dissipation portion 125 located between the first heat dissipation portion 121 and the second heat dissipation portion 122. The third region 110b3 is located directly above the first notch portion 124 and the fourth heat dissipation portion 125 (see FIG. 4). The fourth heat dissipation portion 125 is connected to the third corner portion A2 of the first heat dissipation portion 121 and the fourth corner portion B2 of the second heat dissipation portion 122, and the fourth heat dissipation portion 125 exposes the first side surface 121a and the second side surface 122a. The first notch portion 124 is located between the third heat dissipation portion 123 and the fourth heat dissipation portion 125, and the first notch portion 124 is a closed notch portion. Preferably, the fourth heat dissipation portion 125 has a fourth side surface 125a, and the second virtual line Y2 extending outward along the fourth side surface 125a passes through the second chip shadow 300a, enhancing the warping resistance and bending resistance strength of the fourth heat dissipation portion 125.

[0018] In this embodiment, the heat dissipation sheet 120 further has a second notch portion 126 located on the first heat dissipation portion 121. The second notch portion 126 exposes the first surface 110a of the substrate 110. The second notch portion 126 is an open notch portion and is used to release stress, preventing the warping of the circuit board tape 100A (see FIG. 4). The first chip shadow 200a is located between the first notch portion 124 and the second notch portion 126.

[0019] As shown in FIGS. 4 and 6, the first heat dissipation part 121 and the second heat dissipation part 122 are integrally connected by the third heat dissipation part 123 and / or the fourth heat dissipation part 125, thereby increasing the bending resistance strength of the substrate 110 and preventing the bending of the thin film circuit board 100. When the jig 400 sandwiches the first portion 111 of the thin film circuit board 100, the second portion 112 of the thin film circuit board 100 can be accurately joined to the electronic element 500 (for example, a display panel or a circuit board), which solves the problem that a conventional thin film circuit board is bent under the influence of gravity and cannot be accurately joined to the electronic element.

[0020] (Second Embodiment) The configuration of the second embodiment of the present invention is shown in FIG. 7. Regarding the difference between this embodiment and the first embodiment, along the direction perpendicular to the virtual line Y, the third heat dissipation part 123 is located between the first notch part 124 and the second notch part 126, and the first notch part 124 and the second notch part 126 are open notch parts. In this embodiment, the contour of the heat dissipation sheet 120 approximates a Z shape, the third heat dissipation part 123 is connected to the first corner part A and the second corner part B, and the first side surface 121a and the second side surface 122a are exposed. The first side surface 121a is also the side surface of the first notch part 124, and the second side surface 122a is also the side surface of the second notch part 126. Similarly, the third width W3 is smaller than the first width W1 and the second width W2.

[0021] (Third Embodiment) The configuration of the third embodiment of the present invention is shown in FIG. 8. Regarding the difference between this embodiment and the first embodiment, the contour of the heat dissipation sheet 120 approximates an inverted H shape, along the direction perpendicular to the virtual line Y, the third heat dissipation part 123 is located between the first notch part 124 and the second notch part 126, and the first notch part 124 and the second notch part 126 are open notch parts. Along the direction perpendicular to the virtual line Y, the third virtual line X1 passes through the first chip shadow 200a, the fourth virtual line X2 passes through the second chip shadow 300a, and the third heat dissipation part 123 is located between the third virtual line X1 and the fourth virtual line X2. Similarly, the third width W3 is smaller than the first width W1 and the second width W2.

[0022] (Fourth Embodiment) Figure 9 shows the configuration of the fourth embodiment of the present invention. The differences between this embodiment and the first embodiment are that the outline of the heat dissipation sheet 120 approximates an H shape, the third width W3 is not smaller than the first width W1 and the second width W2, the first notch 124 and the second notch 126 are located in the first heat dissipation section 121 and the second heat dissipation section 122 respectively, and the first notch 124 and the second notch 126 expose the substrate 110. Along the direction perpendicular to the virtual line Y, the first chip shadow 200a is located between the first notch 124 and the third heat dissipation section 123, the second chip shadow 300a is located between the second notch 126 and the third heat dissipation section 123, and the first chip shadow 200a and the second chip shadow 300a are located between the first notch 124 and the second notch 126.

[0023] The heat dissipation sheet 120 has a non-rectangular polygonal contour, and the first notch 124 and / or the second notch 126 reduce or release stress caused by differences in material properties. The first heat dissipation section 121 and the second heat dissipation section 122 are integrally connected by the third heat dissipation section 123 and / or the fourth heat dissipation section 125, thereby increasing the heat dissipation area of ​​the heat dissipation sheet 120 and enhancing the heat dissipation effect, as well as increasing the bending resistance strength of the substrate 110 and preventing warping and bending of the thin-film circuit board 100.

[0024] The present invention is not limited to the embodiments described above, and can be implemented in various forms without departing from its spirit. [Explanation of Symbols]

[0025] 10 Thin film circuit board 100 thin film circuit board 11 circuit boards 110 circuit boards 11a surface 11b Surface 12 Heat dissipation sheets 120 Heat Dissipation Sheet 13 Adhesive 130 Adhesive 20 chips 100A Circuit Board Tape 110a 1st page 110b 2nd side 110b1 1st area 110b2 2nd area 110b3 Third area 111 Part 1 112 Part 2 121 1st heat dissipation section 121a 1st side 122 Second heat dissipation section 122a 2nd side 123 Third heat dissipation section 123a 3rd side 124 1st notch 125 4th heat dissipation section 125a 4th side 126 Second notch 200 First chip 200a First Chip Shadow 300 Second chip 300a Second Chip Shadow 400 jigs 500 Electronic Components A1 First corner A2 3rd corner B1 Second corner B2 4th corner X1 Third Virtual Line X2 4th virtual line Y virtual line Y1 First virtual line Y2 Second Virtual Line W1 1st width W2, 2nd width W3 3rd width

Claims

1. A substrate (110) having a first surface (110a) and a second surface (110b), wherein the second surface is a substrate used to bond a first chip (200) and a second chip (300), A heat dissipation sheet (120) is attached to the first surface of the substrate, the contour of the heat dissipation sheet is a non-rectangular polygon, and the heat dissipation sheet has a first heat dissipation section (121), a second heat dissipation section (122), and a third heat dissipation section (123), the third heat dissipation section is located between the first heat dissipation section and the second heat dissipation section, the third heat dissipation section is connected to the first heat dissipation section and the second heat dissipation section, and the first chip and the second chip are placed directly above the heat dissipation sheet and the heat dissipation sheet is used to form a first chip shadow (200a) and a second chip shadow (300a), respectively. The first chip is installed in the first region (110b1) of the second surface, the second chip is installed in the second region (110b2) of the second surface, the first chip and the second chip are arranged alternately on the second surface and expose a third region (110b3) located between the first region and the second region, the first chip is located directly above the first heat dissipation section and forms a first chip shadow on the first heat dissipation section, the second chip is located directly above the second heat dissipation section and forms a second chip shadow on the second heat dissipation section, and the third region is located above the third heat dissipation section. The imaginary line (Y) passes through the first heat dissipation section, the second heat dissipation section, and the third heat dissipation section, and along the direction perpendicular to the imaginary line, the third width (W3) of the third heat dissipation section is not smaller than the first width (W1) of the first heat dissipation section and the second width (W2) of the second heat dissipation section. The thin-film circuit board is characterized in that the heat dissipation sheet has a first notch (124) located in the first heat dissipation portion and exposing the substrate, and the first chip shadow is located between the first notch and the third heat dissipation portion.

2. The thin-film circuit board according to claim 1, characterized in that the heat dissipation sheet has a second notch (126) located in the second heat dissipation portion and exposing the substrate, and the second chip shadow is located between the second notch and the third heat dissipation portion.

3. The thin-film circuit board according to claim 2, characterized in that the first chip shadow and the second chip shadow are located between the first notch and the second notch.

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