Manufacturing method for semiconductor devices

Abstract

The purpose of the present invention is to provide a technique for suppressing outflow of molten solder during reflow and for suppressing an increase in semiconductor device manufacturing costs. This method for manufacturing a semiconductor device comprises the steps for: mounting, on a base plate, a semiconductor mounting substrate-positioning jig which is frame-shaped in a top view; arranging plate solder in a semiconductor mounting substrate arrangement position where a semiconductor mounting substrate is to be disposed in the frame of the semiconductor mounting substrate-positioning jig mounted on the base plate; arranging the semiconductor mounting substrate on the plate solder; mounting a frame-shaped solder flow-prevention jig so as to surround the sides of the semiconductor mounting substrate in the frame of the semiconductor mounting substrate-positioning jig mounted on the base plate; and bonding, by means of reflow, the base plate and the semiconductor mounting substrate.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a semiconductor device.

Background Art

[0002] Conventionally, as a method for soldering a semiconductor device, for example, there is a method disclosed in Patent Document 1. In Patent Document 1, an insulating substrate is disposed on a base plate via solder, and a technique capable of suppressing voids in the solder by pressing the solder and the insulating substrate disposed on the base plate with a pressing member is proposed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the technique described in Patent Document 1, there is a possibility that the melted solder flows out from the periphery of the pressing portion by pressing with the pressing member, and furthermore, since a separate pressing member is required, there is a problem that the manufacturing cost of the semiconductor device increases.

[0005] Therefore, an object of the present disclosure is to provide a technique for suppressing the outflow of the melted solder during reflow and suppressing an increase in the manufacturing cost of the semiconductor device.

Means for Solving the Problems

[0006] A method for manufacturing a semiconductor device according to this disclosure is a method for manufacturing a semiconductor device in which a semiconductor mounting substrate, on which semiconductor elements are mounted on an insulating substrate, is joined to a base plate, comprising the steps of: attaching a frame-shaped semiconductor mounting substrate positioning jig to the base plate in a top view; placing a solder sheet at a semiconductor mounting substrate position, which is the position in which the semiconductor mounting substrate is placed within the frame of the semiconductor mounting substrate positioning jig attached to the base plate; placing the semiconductor mounting substrate on the solder sheet; attaching a frame-shaped solder flow prevention jig to surround the sides of the semiconductor mounting substrate within the frame of the semiconductor mounting substrate positioning jig attached to the base plate; and joining the base plate and the semiconductor mounting substrate by reflow soldering. The width and depth of the solder flow prevention jig are 100 mm or less, and the height is 20 mm or less, and the solder flow prevention jig has a clearance of 3 mm or less from the insulating substrate of the semiconductor mounting substrate. . [Effects of the Invention]

[0007] According to this disclosure, since the sides of the semiconductor mounting substrate are surrounded by a solder flow prevention jig, the outflow of molten solder during reflow can be suppressed. Furthermore, since there is no need to provide a separate pressing member, the increase in the manufacturing cost of semiconductor devices can be suppressed.

[0008] The purpose, features, aspects, and benefits of this disclosure will become clearer from the following detailed description and accompanying drawings. [Brief explanation of the drawing]

[0009] [Figure 1] This is a top view showing a semiconductor mounting substrate positioning jig used in the semiconductor device manufacturing method according to Embodiment 1, with a solder flow prevention jig attached. [Figure 2] This is an exploded perspective view showing the arrangement of a semiconductor mounting substrate and a solder flow prevention jig with respect to a semiconductor mounting substrate positioning jig used in the semiconductor device manufacturing method according to Embodiment 1. [Figure 3] This is a flowchart showing the method for manufacturing a semiconductor device according to Embodiment 1. [Figure 4]It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 5] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 6] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 7] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 8] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 9] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 10] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 11] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 12] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 13] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 14] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 1. [Figure 15] It is a top view showing a state where a semiconductor element positioning jig is attached to an insulating substrate positioning jig used in a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 16] It is a flowchart showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 17] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 18] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 19] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 20] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 21]It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 22] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 23] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 24] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 25] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 26] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2. [Figure 27] It is a cross-sectional view showing a method for manufacturing a semiconductor device according to Embodiment 2.

Mode for Carrying Out the Invention

[0010] <Embodiment 1> <Overall Configuration> Embodiment 1 will be described below with reference to the drawings. FIG. 1 is a top view showing a state in which a solder flow prevention jig 30 is attached to a semiconductor mounting substrate positioning jig 20 used in the method for manufacturing a semiconductor device according to Embodiment 1. FIG. 2 is an exploded perspective exploded perspective exploded view showing the arrangement of the semiconductor mounting substrate 10 and the solder flow prevention jig 30 with respect to the semiconductor mounting substrate positioning jig 20.

[0011] As shown in FIGS. 1 and 2, the method for manufacturing a semiconductor device according to Embodiment 1 is a method of bonding a semiconductor mounting substrate 10 on which semiconductor elements are mounted onto an insulating substrate on a base plate 1. First, the semiconductor mounting substrate positioning jig 20 and the solder flow prevention jig 30 used in the method for manufacturing a semiconductor device according to Embodiment 1 will be described.

[0012] As shown in Figures 1 and 2, the semiconductor mounting substrate positioning jig 20 is mounted on the base plate 1 and is a jig for positioning the semiconductor mounting substrate 10 on the base plate 1. The semiconductor mounting substrate positioning jig 20 is formed in the shape of a rectangular frame using a material that does not have solder wettability, such as carbon, and an opening 20a is formed within the frame of the semiconductor mounting substrate positioning jig 20. Holes 20b are provided at the four corners of the semiconductor mounting substrate positioning jig 20. The four holes 20b correspond to the holes 1a provided at the four corners of the base plate 1, and the semiconductor mounting substrate positioning jig 20 is mounted on the base plate 1 by metal rods (not shown) inserted through the four holes 20b of the semiconductor mounting substrate positioning jig 20 and the four holes 1a of the base plate 1, respectively. In addition, four protrusions 20c projecting inward are provided on the inner circumferential surface of each long side of the semiconductor mounting substrate positioning jig 20.

[0013] The solder flow prevention jig 30 is mounted within the frame of the semiconductor substrate positioning jig 20, which is attached to the base plate 1. The jig is used to suppress the flow of molten solder during reflow from the periphery of the semiconductor substrate 10 located within the frame of the solder flow prevention jig 30. The solder flow prevention jig 30 is formed in the shape of a rectangular frame, and an opening 30a is formed within the frame of the solder flow prevention jig 30. The solder flow prevention jig 30 is sized to allow two (four in total) to be placed along the long side and short side of the semiconductor substrate positioning jig 20 within the frame of the semiconductor substrate positioning jig 20.

[0014] Furthermore, the number of solder flow prevention fixtures 30 placed within the frame of the semiconductor substrate positioning fixture 20 is not limited to four, but can be changed according to the number of semiconductor substrates 10 mounted on the base plate 1. In this case, the size of the opening 20a of the semiconductor substrate positioning fixture 20 is determined according to the number of solder flow prevention fixtures 30.

[0015] Two recesses 30b are provided on the outer circumferential surface of one of the two long sides of the solder flow prevention jig 30. The recesses 30b are formed to be recessed toward the inner circumference and can be fitted with the protrusions 20c of the semiconductor mounting substrate positioning jig 20. Furthermore, since the area below the recesses 30b is open, the solder flow prevention jig 30 can be fitted onto the semiconductor mounting substrate positioning jig 20 from above.

[0016] Furthermore, since the protrusion 20c of the semiconductor substrate positioning jig 20 and the recess 30b of the solder flow prevention jig 30 only need to be able to fit together at least one point, the number of protrusions 20c and recesses 30b only needs to be one or more.

[0017] The outer circumferential surface of the other long side of the solder flow prevention jig 30 is provided with a step 30c that protrudes outward. The steps 30c of the two solder flow prevention jigs 30, which are arranged along the short side of the semiconductor mounting substrate positioning jig 20, can engage with each other, and the position of the two solder flow prevention jigs 30 in the width direction is fixed by the engagement of the steps 30c of the two solder flow prevention jigs 30 within the frame of the semiconductor mounting substrate positioning jig 20. In addition, the position of the two solder flow prevention jigs 30 in the depth direction is fixed by the contact of their ends in the depth direction with each other.

[0018] The solder flow prevention jig 30 has a width and depth of 100 mm or less, and a height of 20 mm or less. Furthermore, the solder flow prevention jig 30 has a clearance of 3 mm or less from the insulating substrate 4 (see Figure 10) of the semiconductor mounting substrate 10. These structures make it possible to suppress solder splatter during reflow soldering.

[0019] <Manufacturing method for semiconductor devices> Next, a method for manufacturing a semiconductor device will be described. Figure 3 is a flowchart showing the method for manufacturing a semiconductor device according to Embodiment 1. Figures 4 to 14 are cross-sectional views showing the method for manufacturing a semiconductor device according to Embodiment 1. Figure 12 is a cross-sectional view taken along line AA in Figure 1.

[0020] First, as shown in Figures 3 and 4, a base plate 1 made of, for example, ceramic is prepared (step S1). Holes 1a (see Figure 2) for attaching the semiconductor mounting substrate positioning jig 20 are formed in the four corners of the base plate 1.

[0021] Next, as shown in Figures 3 and 5, wire bumps 2 are formed on the base plate 1 (step S2). As shown in Figures 3 and 6, the semiconductor mounting substrate positioning jig 20 is attached to the base plate 1 (step S3). As shown in Figure 2, the two are attached by inserting a metal rod (not shown) through the hole 1a in the base plate 1 and the hole 20b in the semiconductor mounting substrate positioning jig 20.

[0022] Next, as shown in Figures 3 and 7, the solder sheet 3 is placed at the semiconductor mounting substrate placement position (step S4). Here, the semiconductor mounting substrate placement position is the position where the semiconductor mounting substrate 10 (see Figure 10) is placed within the frame of the semiconductor mounting substrate positioning jig 20 attached to the base plate 1.

[0023] Next, as shown in Figure 3, a semiconductor mounting substrate 10 is prepared (step S5). Now, the manufacturing method of the semiconductor mounting substrate 10 will be described. First, as shown in Figure 8, an insulating substrate 4 is prepared with metal patterns 12 and 13 formed on the upper and lower surfaces of a ceramic plate 11, respectively, and as shown in Figure 9, a metal paste 14 is applied onto the metal pattern 12. As shown in Figure 10, after placing the semiconductor element 15 on the metal paste 14, the metal pattern 12 and the semiconductor element 15 are metal-bonded by reflow. Through these steps, the semiconductor mounting substrate 10, in which the insulating substrate 4 and the semiconductor element 15 are integrated, is completed.

[0024] The semiconductor element 15 may be made of Si, or it may be a wide-bandgap semiconductor such as silicon carbide, gallium nitride, gallium oxide, or diamond. Furthermore, the process in step S5 may be carried out in parallel with the processes in steps S1 to S4.

[0025] Next, as shown in Figures 3 and 11, the semiconductor mounting substrate 10 is placed on the solder plate 3 (step S6). Then, as shown in Figures 3 and 12, the solder flow prevention jig 30 is attached within the frame of the semiconductor mounting substrate positioning jig 20 so as to surround the sides of the semiconductor mounting substrate 10 (step S7). At this time, the solder flow prevention jig 30 is fitted onto the semiconductor mounting substrate positioning jig 20 from above. By fitting the solder flow prevention jig 30 onto the semiconductor mounting substrate positioning jig 20, misalignment between the semiconductor mounting substrate 10 and the solder flow prevention jig 30 is prevented.

[0026] Finally, as shown in Figures 3 and 13, the base plate 1 and the semiconductor mounting substrate 10 are joined by reflow soldering (step S8). After that, as shown in Figure 14, the solder flow prevention jig 30 and the semiconductor mounting substrate positioning jig 20 are removed from the base plate 1.

[0027] <Effects> As described above, the method for manufacturing a semiconductor device according to Embodiment 1 comprises the steps of: attaching a frame-shaped semiconductor mounting substrate positioning jig 20 to a base plate 1 in a top view; placing a solder sheet 3 at a semiconductor mounting substrate position, which is the position where the semiconductor mounting substrate 10 will be placed within the frame of the semiconductor mounting substrate positioning jig 20 attached to the base plate 1; placing the semiconductor mounting substrate 10 on the solder sheet 3; attaching a frame-shaped solder flow prevention jig 30 to surround the sides of the semiconductor mounting substrate 10 within the frame of the semiconductor mounting substrate positioning jig 20 attached to the base plate 1; and joining the base plate 1 and the semiconductor mounting substrate 10 by reflow soldering.

[0028] Therefore, since the sides of the semiconductor mounting substrate 10 are surrounded by the solder flow prevention jig 30, the outflow of molten solder during reflow can be suppressed. Furthermore, since there is no need to provide a separate pressing member, the increase in the manufacturing cost of semiconductor devices can be suppressed.

[0029] Furthermore, the width and depth of the solder flow prevention jig 30 are 100 mm or less, and the height is 20 mm or less, and the solder flow prevention jig 30 has a clearance of 3 mm or less from the insulating substrate 4 of the semiconductor mounting substrate 10.

[0030] Therefore, since the scattering of molten solder during reflow can be suppressed, it is possible to improve the yield of semiconductor devices.

[0031] Furthermore, the inner circumferential surface of the semiconductor mounting substrate positioning jig 20 has a protrusion 20c that projects inward. The outer circumferential surface of the solder flow prevention jig 30 has a recess 30b that is open at the bottom and recessed inward, and is capable of fitting with the protrusion 20c. In the process of attaching the solder flow prevention jig 30, the solder flow prevention jig 30 is fitted onto the semiconductor mounting substrate positioning jig 20 from above.

[0032] Therefore, misalignment between the semiconductor substrate 10 and the solder flow prevention jig 30 can be prevented.

[0033] <Embodiment 2> <Overall Structure> Next, a method for manufacturing a semiconductor device according to Embodiment 2 will be described. Figure 15 is a top view showing a semiconductor element positioning jig 50 attached to an insulating substrate positioning jig 40 used in the method for manufacturing a semiconductor device according to Embodiment 2. In Embodiment 2, the same reference numerals are used for components that are the same as those described in Embodiment 1, and their descriptions are omitted.

[0034] As shown in Figure 15, the semiconductor device manufacturing method according to Embodiment 2 is a method of bonding semiconductor elements to a base plate via an insulating substrate 4. First, the insulating substrate positioning jig 40 and the semiconductor element positioning jig 50 used in the semiconductor device manufacturing method according to Embodiment 2 will be described.

[0035] The insulating substrate positioning jig 40 is a jig corresponding to the semiconductor mounting substrate positioning jig 20 of Embodiment 1, and has the same structure as the semiconductor mounting substrate positioning jig 20. The semiconductor element positioning jig 50 is a jig corresponding to the solder flow prevention jig 30 of Embodiment 1, and has a substantially similar structure, although there are some differences from the solder flow prevention jig 30.

[0036] The insulating substrate positioning jig 40 is mounted on the base plate 1 and is a jig for positioning the insulating substrate 4 on the base plate 1. The insulating substrate positioning jig 40 is formed in the shape of a rectangular frame using a material that does not have solder wettability, such as carbon material, and an opening 40a (see Figure 19) is formed inside the frame of the insulating substrate positioning jig 40. Holes 40b are provided at the four corners of the insulating substrate positioning jig 40. The four holes 40b correspond to the holes 1a provided at the four corners of the base plate 1 shown in Figure 2, and the insulating substrate positioning jig 40 is mounted on the base plate 1 by a metal rod (not shown) inserted through the four holes 40b of the insulating substrate positioning jig 40 and the four holes 1a of the base plate 1. In addition, four protrusions 40c (see Figure 19) are provided on the inner circumferential surface of each long side of the insulating substrate positioning jig 40, projecting inward.

[0037] The semiconductor element positioning jig 50 is mounted within the frame of the insulating substrate positioning jig 40, which is mounted on the base plate 1, and is a jig for positioning semiconductor elements 6 (see Figure 25) located within the frame of the semiconductor element positioning jig 50. The semiconductor element positioning jig 50 is formed in the shape of a rectangular frame, and an opening is formed within the frame of the semiconductor element positioning jig 50. The semiconductor element positioning jig 50 is sized to allow two of them (four in total) to be placed along the long side and short side of the insulating substrate positioning jig 40 within the frame of the insulating substrate positioning jig 40.

[0038] Furthermore, the number of semiconductor element positioning jigs 50 placed within the frame of the insulating substrate positioning jig 40 is not limited to four, but can be changed to match the number of insulating substrates 4 mounted on the base plate 1. In this case, the size of the opening 40a of the insulating substrate positioning jig 40 is determined according to the number of semiconductor element positioning jigs 50.

[0039] Two recesses 50b (see Figure 22) are provided on the outer circumferential surface of one of the two long sides of the semiconductor element positioning jig 50. The recesses 50b are formed to be recessed toward the inner circumference and can be fitted with the protrusions 40c of the insulating substrate positioning jig 40. Furthermore, since the area below the recesses 50b is open, the semiconductor element positioning jig 50 can be fitted onto the insulating substrate positioning jig 40 from above.

[0040] The outer circumferential surface of the other long side of the semiconductor element positioning jig 50 is provided with a step (not shown) that protrudes outward. The steps of the two semiconductor element positioning jigs 50, which are arranged along the short side of the insulating substrate positioning jig 40, can engage with each other, and the position of the two semiconductor element positioning jigs 50 in the width direction is fixed by the engagement of the steps of the two semiconductor element positioning jigs 50 within the frame of the insulating substrate positioning jig 40. In addition, the position of the two semiconductor element positioning jigs 50 in the depth direction is fixed by the contact of their depth-direction ends, which are arranged along the long side of the insulating substrate positioning jig 40.

[0041] The semiconductor element positioning jig 50 has a width and depth of 100 mm or less, and a height of 20 mm or less. Furthermore, the semiconductor element positioning jig 50 has a clearance of 3 mm or less from the insulating substrate 4. These structures make it possible to suppress solder splatter during reflow soldering.

[0042] Furthermore, the semiconductor element positioning jig 50 is provided with a partition 51 at the top that divides the inside of the frame of the semiconductor element positioning jig 50 according to the placement position of the semiconductor element 6 (see Figure 25). The presence of the partition 51 is a difference from the solder flow prevention jig 30.

[0043] <Manufacturing method for semiconductor devices> Next, a method for manufacturing a semiconductor device will be described. Figure 16 is a flowchart showing the method for manufacturing a semiconductor device according to Embodiment 2. Figures 17 to 27 are cross-sectional views showing the method for manufacturing a semiconductor device according to Embodiment 2. Figure 22 is a cross-sectional view along line BB of Figure 15, and Figure 23 is a cross-sectional view along line CC of Figure 15.

[0044] First, as shown in Figures 16 and 17, a base plate 1 made of, for example, ceramic is prepared (step S11). Holes 1a (see Figure 2) for attaching the insulating substrate positioning jig 40 are formed in the four corners of the base plate 1.

[0045] Next, as shown in Figures 16 and 18, wire bumps 2 are formed on the base plate 1 (step S12). As shown in Figures 16 and 19, the insulating substrate positioning jig 40 is attached to the base plate 1 (step S13). The two are attached by inserting a metal rod (not shown) through the hole 1a in the base plate 1 and the hole 40b in the insulating substrate positioning jig 40.

[0046] Next, as shown in Figures 16 and 20, the solder sheet 3 is placed at the insulating substrate placement position (step S14). Here, the insulating substrate placement position is the position where the insulating substrate 4 (see Figure 21) is placed within the frame of the insulating substrate positioning jig 40 mounted on the base plate 1. Also, the solder sheet 3 corresponds to the first solder sheet.

[0047] Next, as shown in Figures 16 and 21, the insulating substrate 4 is placed on the solder plate 3 (step S15). Then, as shown in Figures 16, 22 and 23, the semiconductor element positioning jig 50 is attached within the frame of the insulating substrate positioning jig 40 so as to surround the sides of the insulating substrate 4 (step S16). At this time, the semiconductor element positioning jig 50 is fitted onto the insulating substrate positioning jig 40 from above. The semiconductor element positioning jig 50 prevents misalignment between the insulating substrate 4 and the semiconductor element positioning jig 50 by fitting onto the insulating substrate positioning jig 40.

[0048] Next, as shown in Figure 24, a solder sheet 5 is placed on the insulating substrate 4. Here, the solder sheet 5 corresponds to the second solder sheet. As shown in Figures 16 and 25, a semiconductor element 6 is placed on the insulating substrate 4 via the solder sheet 5 (step S17).

[0049] The semiconductor element 6 may be made of Si, or it may be a wide-bandgap semiconductor such as silicon carbide, gallium nitride, gallium oxide, or diamond.

[0050] Finally, as shown in Figures 16 and 26, the base plate 1 and the insulating substrate 4 are joined by reflow soldering, and the insulating substrate 4 and the semiconductor element 6 are joined (step S18). After that, as shown in Figure 27, the semiconductor element positioning jig 50 and the insulating substrate positioning jig 40 are removed from the base plate 1.

[0051] <Effects> As described above, the method for manufacturing a semiconductor device according to Embodiment 2 comprises the steps of: attaching a frame-shaped insulating substrate positioning jig 40 to a base plate 1 in a top view; placing a solder sheet 3 at an insulating substrate position, which is the position where the insulating substrate 4 will be placed within the frame of the insulating substrate positioning jig 40 attached to the base plate 1; placing the insulating substrate 4 on the solder sheet 3; attaching a frame-shaped semiconductor element positioning jig 50 to surround the sides of the insulating substrate 4 within the frame of the insulating substrate positioning jig 40 attached to the base plate 1; placing a semiconductor element 6 on the insulating substrate 4 via a solder sheet 5; and joining the base plate 1 and the insulating substrate 4 by reflow soldering, and joining the insulating substrate 4 and the semiconductor element 6.

[0052] Therefore, since the sides of the insulating substrate 4 are surrounded by the semiconductor element positioning jig 50, the solder plates 5 and 3, which are positioned above and below the insulating substrate 4 respectively, can be prevented from melting and flowing out during reflow soldering. In addition, since there is no need to provide a separate pressing member, an increase in the manufacturing cost of the semiconductor device can be suppressed. Furthermore, since the semiconductor element 6, insulating substrate 4, and base plate 1 can be joined together in one go, the manufacturing cost of the semiconductor device can be further reduced.

[0053] Furthermore, the semiconductor element positioning jig 50 has a width and depth of 100 mm or less, and a height of 20 mm or less, and the semiconductor element positioning jig 50 has a clearance of 3 mm or less from the insulating substrate 4.

[0054] Therefore, since the scattering of molten solder during reflow can be suppressed, it is possible to improve the yield of semiconductor devices.

[0055] Furthermore, the inner circumferential surface of the insulating substrate positioning jig 40 has a protrusion 40c that projects inward, and the outer circumferential surface of the semiconductor element positioning jig 50 has a recess 50b that is open at the bottom and recessed inward, and can be fitted with the protrusion 40c. In the process of attaching the semiconductor element positioning jig 50, the semiconductor element positioning jig 50 is fitted onto the insulating substrate positioning jig 40 from above.

[0056] Therefore, misalignment between the insulating substrate 4 and the semiconductor element positioning jig 50 can be prevented.

[0057] Although this disclosure has been described in detail, the above description is illustrative and not limiting in all respects. It is understood that countless variations not illustrated are conceivable.

[0058] Furthermore, it is possible to freely combine each embodiment, or to modify or omit each embodiment as appropriate. [Explanation of Symbols]

[0059] 1 Base plate, 3 Solder plate, 4 Insulating substrate, 5 Solder plate, 6 Semiconductor element, 10 Semiconductor mounting substrate, 15 Semiconductor element, 20 Semiconductor mounting substrate positioning jig, 20c protrusion, 30 Solder flow prevention jig, 30b recess, 40 Insulating substrate positioning jig, 40c protrusion, 50 Semiconductor element positioning jig, 50b recess.

Claims

1. A method for manufacturing a semiconductor device, comprising bonding a semiconductor-mounted substrate, on which semiconductor elements are mounted, to a base plate, A step of attaching a frame-shaped semiconductor mounting substrate positioning jig to the base plate in a top view, A step of placing solder on a sheet metal at the semiconductor mounting substrate placement position, which is the position where the semiconductor mounting substrate is placed within the frame of the semiconductor mounting substrate positioning jig attached to the base plate, A step of placing the semiconductor mounting substrate on the solder plate, A step of attaching a frame-shaped solder flow prevention jig to surround the side of the semiconductor mounting substrate within the frame of the semiconductor mounting substrate positioning jig mounted on the base plate, A step of joining the base plate and the semiconductor mounting substrate by reflow, Equipped with, The width and depth of the solder flow prevention jig are 100 mm or less, and the height is 20 mm or less. The solder flow prevention jig has a clearance of 3 mm or less between the semiconductor mounting substrate and the insulating substrate, in a method for manufacturing a semiconductor device.

2. A method for manufacturing a semiconductor device, comprising bonding a semiconductor mounting substrate, on which semiconductor elements are mounted on an insulating substrate, to a base plate, A step of attaching a frame-shaped semiconductor mounting substrate positioning jig to the base plate in a top view, A step of placing solder on a sheet metal at the semiconductor mounting substrate placement position, which is the position where the semiconductor mounting substrate is placed within the frame of the semiconductor mounting substrate positioning jig attached to the base plate, A step of placing the semiconductor mounting substrate on the solder plate, A step of attaching a frame-shaped solder flow prevention jig to surround the side of the semiconductor mounting substrate within the frame of the semiconductor mounting substrate positioning jig mounted on the base plate, A step of joining the base plate and the semiconductor mounting substrate by reflow, Equipped with, The inner circumferential surface of the semiconductor mounting substrate positioning jig has a protrusion that extends inward. The outer surface of the solder flow prevention jig has a recess formed therein that is open at the bottom and recessed inward, and which can be fitted with the convex portion. A method for manufacturing a semiconductor device, wherein in the step of attaching the solder flow prevention jig, the solder flow prevention jig is fitted onto the semiconductor mounting substrate positioning jig from above.

3. A method for manufacturing a semiconductor device, in which a semiconductor element is bonded to a base plate via an insulating substrate, A step of attaching a frame-shaped insulating substrate positioning jig to the base plate in a top view, A step of placing a first solder board at the insulating substrate placement position, which is the position where the insulating substrate is placed within the frame of the insulating substrate positioning jig mounted on the base plate, The steps include: placing the insulating substrate on the first solder board; A step of attaching a frame-shaped semiconductor element positioning jig to the base plate within the frame of the insulating substrate positioning jig so as to surround the sides of the insulating substrate, A step of placing the semiconductor element on the insulating substrate via a second solder plate, A step of joining the base plate and the insulating substrate by reflow, and joining the insulating substrate and the semiconductor element, A method for manufacturing a semiconductor device, comprising the features described above.

4. The width and depth of the semiconductor element positioning jig are 100 mm or less, and the height is 20 mm or less. The method for manufacturing a semiconductor device according to claim 3, wherein the semiconductor element positioning jig has a clearance of 3 mm or less from the insulating substrate.

5. The inner circumferential surface of the insulating substrate positioning jig has a protrusion that extends inward. The outer circumferential surface of the semiconductor element positioning jig has a recess formed therein that is open at the bottom and recessed inward, and which can be fitted with the convex portion. The method for manufacturing a semiconductor device according to claim 3 or claim 4, wherein in the step of attaching the semiconductor element positioning jig, the semiconductor element positioning jig is fitted onto the insulating substrate positioning jig from above.

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