Semiconductor modules and semiconductor devices

Abstract

To obtain a semiconductor module and a semiconductor device that make it easy to check product information.SOLUTION: A semiconductor module according to the present disclosure includes a package, a main terminal protruding from the package, a control terminal protruding from the package, and at least one identification terminal protruding from the package, and product information can be determined from the electrical characteristics, appearance or shape of the identification terminal.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a semiconductor module and a semiconductor device.

Background Art

[0002] Patent Document 1 discloses a semiconductor device including a semiconductor module, a mounting substrate, and heat dissipation fins, which can identify a product. The semiconductor module has a module body having first and second main surfaces facing each other, and terminals protruding from a side surface of the module body and bent toward the first main surface side. The mounting substrate is disposed on the first main surface side and connected to the terminals. The heat dissipation fins are disposed on the second main surface side. Screws attach the attachment portion of the module body from the first main surface side to the heat dissipation fins. An opening is provided in a portion of the mounting substrate facing the attachment portion. The type of the product is printed on the first main surface and exposed through the opening of the mounting substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In Patent Document 1, the product is identified by checking the printing through the opening of the mounting substrate. At this time, depending on the structure of the mounting substrate, it may be difficult to check the printing.

[0005] The present disclosure has been made to solve the above problems, and an object thereof is to obtain a semiconductor module and a semiconductor device in which product information can be easily confirmed.

Means for Solving the Problems

[0006] FirstThe semiconductor module disclosed comprises a package, a main terminal protruding from the package, a control terminal protruding from the package, and at least one identification terminal protruding from the package, wherein the identification terminal Outside Product information can be determined from its appearance or shape. The semiconductor module according to the second disclosure comprises a package, a main terminal protruding from the package, a control terminal protruding from the package, and three or more identification terminals protruding from the package, wherein product information can be determined from the electrical characteristics, appearance or shape of the identification terminals, and product information can be determined by measuring the resistance value between pairs formed by two of the three or more identification terminals for two or more different pairs. The semiconductor module relating to the third disclosure comprises a package, a main terminal protruding from the package, a control terminal protruding from the package, and a plurality of identification terminals protruding from the package, wherein product information can be determined from the electrical characteristics, appearance, or shape of the identification terminals, and at least one of the plurality of identification terminals is electrically connected to the main terminal within the package. The semiconductor module relating to the fourth disclosure comprises a package, a main terminal protruding from the package, a control terminal protruding from the package, and a plurality of identification terminals protruding from the package, wherein product information can be determined from the electrical characteristics, appearance or shape of the identification terminals, and the plurality of identification terminals include identification terminals that are plated and identification terminals that are not plated. The semiconductor module relating to the fifth disclosure comprises a package, a main terminal protruding from the package, a control terminal protruding from the package, and a plurality of identification terminals protruding from the package, wherein product information can be determined from the electrical characteristics, appearance, or shape of the identification terminals, and the plurality of identification terminals include identification terminals that have different shapes from each other. The semiconductor module relating to the sixth disclosure comprises a package, a main terminal protruding from the package, a control terminal protruding from the package, at least one identification terminal protruding from the package, and a short lead protruding from the package and connected to the control terminal inside the package, wherein product information can be determined from the electrical characteristics, appearance or shape of the identification terminal. The semiconductor module relating to the seventh disclosure comprises a package, a main terminal protruding from the package, a control terminal protruding from the package, and at least one identification terminal protruding from the package, wherein product information can be determined from the electrical characteristics, appearance or shape of the identification terminal, and a recess is formed on the side surface of the package, and the identification terminal is provided in the recess. [Effects of the Invention]

[0007] The semiconductor module described herein allows for the identification of product information from the electrical characteristics, appearance, or shape of its identification terminals. Therefore, there is no need to check printed markings, making it easy to verify product information. [Brief explanation of the drawing]

[0008] [Figure 1] This is a plan view of a semiconductor module according to Embodiment 1. [Figure 2] This is an enlarged view of the semiconductor module according to Embodiment 1. [Figure 3] This is a cross-sectional view of the semiconductor device according to Embodiment 1. [Figure 4] This is a diagram illustrating the short lead according to Embodiment 1. [Figure 5A] This diagram illustrates the connection state of the identification terminal according to Embodiment 1. [Figure 5B] This diagram illustrates the connection state of the identification terminal according to Embodiment 1. [Figure 5C] This diagram illustrates the connection state of the identification terminal according to Embodiment 1. [Figure 5D] This diagram illustrates the connection state of the identification terminal according to Embodiment 1. [Figure 5E] This diagram illustrates the connection state of the identification terminal according to Embodiment 1. [Figure 6A]Front view of the semiconductor device according to Embodiment 1. [Figure 6B] Side view of the semiconductor device according to Embodiment 1. [Figure 6C] Plan view of the semiconductor device according to Embodiment 1. [Figure 7A] Diagram for explaining the connection state of the identification terminal according to Embodiment 2. [Figure 7B] Diagram for explaining the connection state of the identification terminal according to Embodiment 2. [Figure 7C] Diagram for explaining the connection state of the identification terminal according to Embodiment 2. [Figure 7D] Diagram for explaining the connection state of the identification terminal according to Embodiment 2. [Figure 8A] Diagram for explaining the connection state of the identification terminal according to Embodiment 3. [Figure 8B] Diagram for explaining the connection state of the identification terminal according to Embodiment 3. [Figure 8C] Diagram for explaining the connection state of the identification terminal according to Embodiment 3. [Figure 8D] Diagram for explaining the connection state of the identification terminal according to Embodiment 3. [Figure 9] Plan view of the semiconductor device according to a modified example of Embodiment 3. [Figure 10] Enlarged view of the semiconductor module according to Embodiment 4.

Mode for Carrying Out the Invention

[0009] The semiconductor modules and semiconductor devices according to each embodiment will be described with reference to the drawings. The same or corresponding components may be denoted by the same reference numerals, and repeated descriptions may be omitted.

[0010] Embodiment 1. Figure 1 is a plan view of a semiconductor module 10 according to Embodiment 1. The semiconductor module 10 comprises a package 20 and a main terminal 16 and a control terminal 18 protruding from the package 20. The package 20 is formed from, for example, an insulating sealing resin. The main terminal 16 is a terminal through which the main current of the semiconductor chip 22, which will be described later and housed in the package 20, flows. The control terminal 18 is a terminal for controlling the on / off state of the semiconductor chip 22. The main terminal 16 and the control terminal 18 protrude from a pair of opposing sides 11 and 12 of the package 20, respectively.

[0011] The semiconductor module 10 includes a plurality of identification terminals 30 protruding from the package 20. Figure 2 is an enlarged view of the semiconductor module 10 according to Embodiment 1. The semiconductor module 10 includes, for example, three identification terminals 31, 32, and 33 as identification terminals 30. The identification terminals 31, 32, and 33 protrude from a side of the package 20 other than the side 11 from which the main terminal 16 protrudes and the side 12 from which the control terminal 18 protrudes. Specifically, the identification terminals 31, 32, and 33 protrude from one side 13 of a pair of side 13 and 14 of the package 20 that connect side 11 and 12. A recess 23 is formed in side 13. The identification terminals 31, 32, and 33 are provided in the recess 23.

[0012] According to the semiconductor module 10 of this embodiment, as described later, product information of the semiconductor module 10 can be determined from the electrical characteristics of the identification terminals 31, 32, and 33. Product information is, for example, the product's rated value.

[0013] Figure 3 is a cross-sectional view of a semiconductor device 100 according to Embodiment 1. The semiconductor device 100 comprises a semiconductor module 10 and a substrate 50 connected to the main terminal 16 or control terminal 18 and provided to cover the package 20. The semiconductor device 100 may also be provided with heat dissipation fins 52 below the semiconductor module 10. A semiconductor chip 22 is housed in the package 20. The semiconductor chip 22 is electrically connected to the main terminal 16 and the control terminal 18, for example, via wires 26.

[0014] The substrate 50 is, for example, a control board for controlling the semiconductor module 10. The substrate 50 is connected to the main terminals 16 and control terminals 18, for example, by solder. The main terminals 16 and control terminals 18 are bent upward so that they can be connected to the substrate 50. Note that in Figure 1, only the base portions of the main terminals 16 and control terminals 18 are shown.

[0015] Figure 4 illustrates the short lead 40 according to Embodiment 1. The semiconductor module 10 includes a short lead 40 protruding from the package 20. The short lead 40 protrudes, for example, from the side surface 14 of the package 20. A recess 24 is formed in the side surface 14. The short lead 40 is provided in the recess 24. Inside the package 20, the short lead 40 is electrically connected to the control terminal 18 via the semiconductor chip 22. The short lead 40 is a dummy terminal that does not fit inside the side surface 12 and is not intended for use. The configuration in which terminals protrude from the four sides of the sealing resin is rare in the power semiconductor field. Note that the identification terminals 31, 32, and 33 are not connected to the control terminal 18 inside the package 20.

[0016] Next, a method for determining product information using the identification terminals 30 will be described. In this embodiment, as an example, product information is determined from the resistance values ​​between multiple identification terminals 30. There may be two or more identification terminals 30, and it is preferable to have three or more. Here, an example in which three identification terminals 31, 32, and 33 are provided will be described.

[0017] Figures 5A to 5E illustrate the connection state of the identification terminals 31, 32, and 33 according to Embodiment 1. In the state shown in Figure 5A, the identification terminals 31, 32, and 33 are not connected to each other. In the state shown in Figure 5B, the identification terminals 31 and 32 are electrically connected by a conductor 35 such as a wire. In the state shown in Figure 5C, the identification terminals 31 and 33 are electrically connected by a conductor 35. In the state shown in Figure 5D, the identification terminals 32 and 33 are electrically connected by a conductor 35. In the state shown in Figure 5E, the identification terminals 31, 32, and 33 are electrically connected to each other by a conductor 35.

[0018] In this embodiment, the rated value is identified by the combination of electrical continuity between pairs of identification terminals 30. In other words, the rated value is assigned to one of the five states shown in Figures 5A to 5E. The operator can determine the rated value by measuring the resistance values ​​between identification terminals 31 and 32, between identification terminals 32 and 33, and between identification terminals 31 and 33. Thus, in this embodiment, product information can be determined by measuring the resistance values ​​between pairs formed by two or more identification terminals 30 out of the three or more identification terminals 30 for two or more different pairs. At this time, at least two of the three or more identification terminals 30 may be electrically connected within the package 20, or all identification terminals 30 may be in an open state.

[0019] Figure 6A is a front view of the semiconductor device 100 according to Embodiment 1. Figure 6B is a side view of the semiconductor device 100 according to Embodiment 1. Figure 6C is a top view of the semiconductor device 100 according to Embodiment 1. The semiconductor module 10 is attached to the heat dissipation fin 52 from the top side by screws 56. Washers 54 are provided between the screws 56 and the top surface of the package 20. An opening 50a is formed in the substrate 50 in the portion facing the screws 56. Product rating markings are provided on the top surface of the package 20. The rating value can be determined by checking the product rating markings. However, depending on the size of the opening 50a in the substrate 50, it may be difficult to check the markings.

[0020] In contrast, in this embodiment, product information can be determined from the electrical characteristics of the multiple identification terminals 30. Therefore, it is not necessary to check the printing from above the substrate 50 through the opening 50a, making it easier to check the product information. For example, with the heat sink 52 and substrate 50 attached to the semiconductor module 10, the worker can check the product information by measuring the electrical characteristics of the identification terminals 30 from the side of the semiconductor module 10. Therefore, it is not necessary to remove the semiconductor module 10 from the heat sink 52 or substrate 50 in order to check the product information. Also, it is not necessary to enlarge the opening 50a of the substrate 50 in order to visually check the printing.

[0021] Furthermore, the identification terminal 30 is not attached to the circuit board 50. Therefore, there is no need to bend the identification terminal 30 like the main terminal 16 and control terminal 18. Moreover, since the identification terminal 30 is not connected to the circuit board 50, it can be short. This helps to suppress short circuits between the identification terminal 30 and peripheral devices. Also, as shown in Figure 2, it is preferable that the length of the portion of the identification terminal 30 that protrudes from the package 20 is less than or equal to the depth of the recess 23. This improves insulation and further suppresses short circuits.

[0022] In this embodiment, an example of determining the rated value using the identification terminal 30 has been described. However, the product information that can be determined by the identification terminal 30 may be any information about the product, such as the presence or absence of a short-circuit protection function, the presence or absence of a bootstrap diode, the presence or absence of a control power supply voltage drop protection circuit, the presence or absence of an overheat protection function, and the presence or absence of a brake circuit.

[0023] Furthermore, in this embodiment, product information was determined from the resistance values ​​between multiple identification terminals. However, product information may also be determined from electrical characteristics other than resistance values.

[0024] The structures of the semiconductor module 10 and semiconductor device 100 described in this embodiment are examples only and are not limited. For example, each terminal of the semiconductor module 10 may be provided on any side of the package 20. For example, the main terminal 16 and the control terminal 18 may protrude from one side.

[0025] The package 20 may have a semiconductor chip 22 formed of a wide-bandgap semiconductor. The wide-bandgap semiconductor is, for example, silicon carbide, gallium nitride-based material, or diamond.

[0026] In this embodiment, product information was determined from the electrical characteristics between multiple identification terminals 30. However, as shown in the following embodiments, product information can also be determined from the electrical characteristics, appearance, or shape of one or more identification terminals 30.

[0027] The modifications described above can be appropriately applied to the semiconductor modules and semiconductor devices according to the following embodiments. Since the semiconductor modules and semiconductor devices according to the following embodiments have many similarities with Embodiment 1, the explanation will focus on the differences from Embodiment 1.

[0028] Embodiment 2. In this embodiment, the method for determining product information using the identification terminals 30 differs from that of Embodiment 1. In this embodiment, product information is identified by a combination of the presence or absence of electrical continuity between a plurality of identification terminals 30 and the main terminal 16. The semiconductor module 210 of this embodiment includes, for example, three identification terminals 31, 32, and 33 as the plurality of identification terminals 30.

[0029] Figures 7A to 7D illustrate the connection state of the identification terminals 31, 32, and 33 according to Embodiment 2. In the state shown in Figure 7A, none of the identification terminals 31, 32, and 33 are electrically connected to the main terminal 16. In the state shown in Figure 7B, the identification terminal 31 and the main terminal 16 are electrically connected within the package 20 by a conductor 35 such as a wire. In the state shown in Figure 7C, the identification terminal 32 and the main terminal 16 are electrically connected within the package 20 by a conductor 35. In the state shown in Figure 7D, the identification terminal 33 and the main terminal 16 are electrically connected within the package 20 by a conductor 35. Thus, at least one of the multiple identification terminals 31, 32, and 33 may be electrically connected to the main terminal 16 within the package 20, and all of the identification terminals 31, 32, and 33 may be in an open state.

[0030] The operator can determine the rated value by measuring the resistance between each of the identification terminals 31, 32, and 33 and the main terminal 16. Figures 7A to 7D show four connection states, but by assigning rated values ​​to the presence or absence of continuity between the identification terminals 31, 32, and 33 and the main terminal 16, it is possible to identify, for example, eight different rated values. These eight rated values ​​are, for example, 5A, 10A, 15A, 20A, 25A, 30A, 50A, and 75A. Furthermore, the number of product information items that can be identified can be increased or decreased depending on the number of identification terminals 30. For example, if only one identification terminal 30 is provided, two types of information can be identified depending on the presence or absence of electrical continuity with the main terminal 16.

[0031] Embodiment 3. Figures 8A to 8D illustrate the connection state of the identification terminals 30 according to Embodiment 3. The semiconductor module 310 of this embodiment differs from the semiconductor module 210 of Embodiment 2 in that, among the multiple identification terminals 30, the identification terminals 30 that are electrically connected to the main terminal 16 and at the same potential are plated. The other configurations are the same as those of Embodiment 2.

[0032] The identification terminals 31, 32, and 33 shown in Figures 8A to 8D are not electrically connected to the main terminal 16 and are not plated. The identification terminals 31a, 32a, and 33a shown in Figures 8B, 8C, and 8D are electrically connected to the main terminal 16 and are plated. Thus, the multiple identification terminals 30 may include identification terminals 30 with plating and identification terminals 30 without plating, all identification terminals 30 may be plated, or none of identification terminals 30 may be plated.

[0033] In this embodiment, product information can also be determined by visually checking for the presence or absence of plating. In this case, the presence or absence of plating can be visually checked from the side of the semiconductor module 310 without removing the heat dissipation fins 52 and the substrate 50.

[0034] Figure 9 is a plan view of a semiconductor device 300 according to a modified example of Embodiment 3. A substrate 350 is provided above the semiconductor module 310. The opening 350a of the substrate 350 may be enlarged to directly above the identification terminal 30 as an opening for identifying the identification terminal. This further improves visibility. It also improves the insulation between the identification terminal 30 and the substrate 350.

[0035] In this embodiment, the electrical connection between the identification terminal 30 and the main terminal 16 is combined with the application of plating. However, the invention is not limited to this; product information may also be determined solely from the presence or absence of plating on each identification terminal 30. In other words, product information may be determined solely from the appearance of multiple identification terminals 30. Furthermore, Embodiment 1 and this embodiment may be combined.

[0036] Embodiment 4. Figure 10 is an enlarged view of a semiconductor module 410 according to Embodiment 4. This embodiment differs from Embodiment 1 in that product information is determined from the shapes of multiple identification terminals 30. The semiconductor module 410 includes, for example, three identification terminals 431, 432, and 433 as multiple identification terminals 30. The shape of each of the identification terminals 431, 432, and 433 is selected from two shapes according to the rated value. The shape of each of the identification terminals 431, 432, and 433 is selected from, for example, a triangle and a square. In the example in Figure 10, identification terminals 431 and 433 are triangular in plan view, and identification terminal 432 is a square in plan view.

[0037] In this embodiment, product information such as rated values ​​can be identified by the combination of shapes of the identification terminals 431, 432, and 433. The multiple identification terminals 431, 432, and 433 may include identification terminals with different shapes from each other, or all identification terminals may have the same shape.

[0038] In this embodiment, product information can be determined from the appearance of the multiple identification terminals 30. However, this is not limited to this, and a combination of Embodiment 1 or 2 and this embodiment may be used to determine product information from the electrical characteristics and appearance of the multiple identification terminals 30.

[0039] The shape of each of the multiple identification terminals 431, 432, and 433 may be selected from three or more shapes. This allows for the identification of information on a wider variety of products from the multiple identification terminals 431, 432, and 433. Furthermore, the number of multiple identification terminals 30 only needs to be one or more. Even if only one identification terminal 30 is provided, product information can be identified from the shape of the identification terminal 30.

[0040] The technical features described in this embodiment may be used in combination as appropriate.

[0041] The various aspects of this disclosure are summarized below as an appendix. (Note 1) The package and The main terminal protruding from the aforementioned package, The control terminals protruding from the aforementioned package, At least one identification terminal protruding from the package, Equipped with, A semiconductor module characterized in that product information can be determined from the electrical characteristics, appearance, or shape of the aforementioned identification terminal. (Note 2) The semiconductor module described in Appendix 1, characterized in that the information of the product is the rated value of the product. (Note 3) The semiconductor module according to Appendix 1 or 2, characterized by having a plurality of the aforementioned identification terminals. (Note 4) The semiconductor module according to Appendix 3, characterized in that it is possible to determine information about the product from the resistance values ​​between the plurality of identification terminals. (Note 5) The system includes three or more of the aforementioned identification terminals, The semiconductor module according to Appendix 3, characterized in that information about the product can be determined by measuring the resistance value between pairs formed by two of the three or more identification terminals for two or more different pairs. (Note 6) The semiconductor module according to Appendix 5, characterized in that at least two of the three or more identification terminals are electrically connected within the package. (Note 7) The semiconductor module according to Appendix 3, characterized in that at least one of the plurality of identification terminals is electrically connected to the main terminal within the package. (Note 8) The semiconductor module according to Appendix 3, characterized in that the plurality of identification terminals include identification terminals that are plated and identification terminals that are not plated. (Note 9) The semiconductor module according to Appendix 3, characterized in that the plurality of identification terminals include identification terminals that have different shapes from each other. (Note 10) The semiconductor module according to any one of the appendices 1 to 9, characterized in that the identification terminal protrudes from a side of the package other than the side from which the main terminal protrudes and the side from which the control terminal protrudes. (Note 11) A semiconductor module according to any one of the appendices 1 to 10, characterized by comprising short leads protruding from the package and connected to the control terminals inside the package. (Note 12) The side of the package has a recess, The semiconductor module according to any one of the appendices 1 to 11, characterized in that the identification terminal is provided in the recess. (Note 1) 3 ) The package is characterized by having a semiconductor chip formed of a wide-bandgap semiconductor, as described in Appendix 1 to 1. 2 A semiconductor module as described in any one of the following items. (Note 1) 4 ) The wide-bandgap semiconductor is characterized by being silicon carbide, gallium nitride-based material, or diamond (see Appendix 1). 3 The semiconductor module described above. (Note 1) 5 ) Appendix 1 to 1 4 A semiconductor module as described in any one of the following items, A substrate connected to the main terminal or the control terminal and provided to cover the package, A semiconductor device characterized by comprising the following features. [Explanation of Symbols]

[0042] 10 Semiconductor module, 11, 12, 13, 14 Side view, 16 Main terminal, 18 Control terminal, 20 Package, 22 Semiconductor chip, 23, 24 Recess, 26 Wire, 30, 31, 31a, 32, 32a, 33, 33a Identification terminal, 35 Conductor, 40 Short lead, 50 Substrate, 50a Aperture, 52 Heat sink fin, 54 Washer, 56 Screw, 100 Semiconductor device, 210 Semiconductor module, 300 Semiconductor device, 310 Semiconductor module, 350 Substrate, 350a Aperture, 410 Semiconductor module, 431, 432, 433 Identification terminal

Claims

1. The package and The main terminal protruding from the aforementioned package, The control terminals protruding from the aforementioned package, At least one identification terminal protruding from the package, Equipped with, A semiconductor module characterized in that product information can be determined from the appearance or shape of the aforementioned identification terminal.

2. The semiconductor module according to claim 1, characterized in that the information of the product is the rated value of the product.

3. The semiconductor module according to claim 1 or 2, characterized by having a plurality of the aforementioned identification terminals.

4. Package and The main terminal protruding from the aforementioned package, The control terminals protruding from the aforementioned package, The package comprises three or more identification terminals protruding from it, Equipped with, Product information can be determined from the electrical characteristics, appearance, or shape of the aforementioned identification terminal. A semiconductor module characterized in that it is possible to determine information about the product by measuring the resistance value between pairs formed by two of the three or more identification terminals for two or more different pairs.

5. The semiconductor module according to claim 4, characterized in that at least two of the three or more identification terminals are electrically connected within the package.

6. Package and The main terminal protruding from the aforementioned package, The control terminals protruding from the aforementioned package, Multiple identification terminals protruding from the aforementioned package, Equipped with, Product information can be determined from the electrical characteristics, appearance, or shape of the aforementioned identification terminal. A semiconductor module characterized in that at least one of the plurality of identification terminals is electrically connected to the main terminal within the package.

7. Package and The main terminal protruding from the aforementioned package, The control terminals protruding from the aforementioned package, Multiple identification terminals protruding from the aforementioned package, Equipped with, Product information can be determined from the electrical characteristics, appearance, or shape of the aforementioned identification terminal. The semiconductor module is characterized in that the plurality of identification terminals include identification terminals that are plated and identification terminals that are not plated.

8. Package and The main terminal protruding from the aforementioned package, The control terminals protruding from the aforementioned package, Multiple identification terminals protruding from the aforementioned package, Equipped with, Product information can be determined from the electrical characteristics, appearance, or shape of the aforementioned identification terminal. The semiconductor module is characterized in that the plurality of identification terminals include identification terminals that have different shapes from each other.

9. The semiconductor module according to any one of claims 1, 2, 4, 5, 6, 7, or 8, characterized in that the identification terminal protrudes from a side of the package other than the side from which the main terminal protrudes and the side from which the control terminal protrudes.

10. Package and The main terminal protruding from the aforementioned package, The control terminals protruding from the aforementioned package, At least one identification terminal protruding from the package, A short lead protruding from the package and connected to the control terminal inside the package, Equipped with, A semiconductor module characterized in that product information can be determined from the electrical characteristics, appearance, or shape of the aforementioned identification terminal.

11. Package and The main terminal protruding from the aforementioned package, The control terminals protruding from the aforementioned package, At least one identification terminal protruding from the package, Equipped with, Product information can be determined from the electrical characteristics, appearance, or shape of the aforementioned identification terminal. The side of the package has a recess, The semiconductor module is characterized in that the identification terminal is provided in the recess.

12. The semiconductor module according to any one of claims 1, 2, 4, 5, 6, 7, 8, 10, or 11, characterized in that the package has a semiconductor chip formed of a wide-bandgap semiconductor.

13. The semiconductor module according to claim 12, characterized in that the wide-bandgap semiconductor is a silicon carbide, gallium nitride-based material, or diamond.

14. A semiconductor module according to any one of claims 1, 2, 4, 5, 6, 7, 8, 10, or 11, A substrate connected to the main terminal or the control terminal and provided to cover the package, A semiconductor device characterized by comprising the following features.

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