FPC manufacturing method with components

Abstract

To provide a manufacturing method for FPC with a component that can mount a circuit component at a predetermined position branched off from the FPC body.SOLUTION: A manufacturing method 1 for an FPC with a component is a method for manufacturing a component-equipped FPC 10 in which a circuit component 2 is solder-bonded to an FPC 3, and includes an FPC formation step S1 for forming an FPC 3 integrally including an FPC body 31, an FPC arm portion 32 branching off from the FPC body 31, a component mounting portion 33 provided at an end of the FPC arm portion 32 on which the circuit component 2 is mounted, and a bridge 34 connecting the component mounting portion 33 and the FPC body 31, a component mounting step S2 for mounting the circuit component on the component mounting portion via solder 4, and a mounting step S4 for heating the FPC to melt the solder and mount the circuit component on the component mounting portion.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an FPC with components.

Background Art

[0002] Conventionally, when mounting chip components on a flexible substrate, a technique is known in which the flexible substrate is placed on a tray, the chip components are placed on the flexible substrate, and the chip components are mounted on the flexible substrate by reflow vapor deposition (see, for example, Patent Document 1).

[0003] As an example of the technique of mounting chip components on a flexible substrate by reflow vapor deposition, in order to prevent warping of the flexible substrate, a plate with an opening is placed so that the chip components installed on the flexible substrate are exposed from the opening, and after pressing the flexible substrate with the plate, there is a technique of mounting the chip components on the flexible substrate by reflow vapor deposition.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the conventional method of mounting chip components on a flexible substrate, as shown in FIGS. 11 and 12, when mounting the chip component 102 on the portion exposed from the opening 152a of the plate 152, that is, the portion 103A branched from the flexible substrate (FPC) 103 during reflow vapor deposition, there is a concern that the portion 103A where the chip component 102 is installed warps, and the chip component (circuit component) 102 is mounted in a displaced state, that is, there is a risk of mounting failure.

[0006] The present invention aims to provide a method for manufacturing a component-equipped FPC (Flexible Printed Circuit) that allows circuit components to be mounted at predetermined locations branched off from the FPC body. [Means for solving the problem]

[0007] In order to solve the aforementioned problems and achieve the objective, the first invention described in the present invention is derived from the circuit component body multiple In a circuit component with an extended connection portion, multiple A method for manufacturing an FPC with components, wherein the connection portion is soldered to the FPC, comprising: an FPC body; an FPC arm branched from the FPC body; and a connection portion provided at the end of the FPC arm for the circuit component. multiple Connection part One of them is the first connection part A component installation section where the component is installed, and a connection between the component installation section and the FPC body. A part, and the dimension in the direction intersecting the connection direction in that part is , the above 1 Connection part The dimension in the direction intersecting the extension direction from the component installation portion. An FPC forming step to form the FPC which integrally includes a bridge smaller than the circuit component 1 A component installation step involves installing the connection part to the component installation part via solder, and heating the FPC to melt the solder and the circuit component 1 The connection part is mounted on the component mounting part. In addition, the second connection portion, other than the first connection portion, among the plurality of connection portions, is electrically connected to the circuit formed in the FPC at a predetermined position in the FPC. This is a method for manufacturing an FPC with components, characterized by comprising an assembly process.

[0008] The second invention described in this invention is derived from the circuit component body. multiple In a circuit component with an extended connection portion, multiple A method for manufacturing an FPC with components, wherein the connection portion is soldered to the FPC, comprising: an FPC body; an FPC arm branched from the FPC body; and a connection portion provided at the end of the FPC arm for the circuit component. multiple Connection part One of them is the first connection part A component mounting section where the component is installed, and extending from the edge of the component mounting section A part, wherein the dimension in the direction along the edge of the part is , the above 1 Connection part The dimension in the direction intersecting the extension direction from the component installation portion. An FPC forming step of forming the FPC which integrally includes an extension portion smaller than the FPC, and the circuit component 1A component installation step involves installing the connection portion to the component installation portion via solder; a plate installation step involves installing a plate so that the component installation portion is exposed while covering at least a part of the extension portion; and heating the FPC to melt the solder and connect the circuit components. 1 The connection part is mounted on the component mounting part. In addition, the second connection portion, other than the first connection portion, among the plurality of connection portions, is electrically connected to the circuit formed in the FPC at a predetermined position in the FPC. This is a method for manufacturing an FPC with components, characterized by comprising an assembly process. [Effects of the Invention]

[0009] According to the present invention, circuit components can be mounted at predetermined locations branched off from the FPC body. [Brief explanation of the drawing]

[0010] [Figure 1] This is a plan view showing a component-attached FPC manufactured by the component-attached FPC manufacturing method according to the first embodiment of the present invention. [Figure 2] This is a schematic diagram illustrating the procedure for manufacturing the FPC with components described above. [Figure 3] This diagram illustrates the manufacturing process for producing the aforementioned FPC with components attached, and shows the FPC in a state where circuit components have been installed. [Figure 4] This diagram shows the process after Figure 3, and illustrates the state in which the plate has been installed on the FPC. [Figure 5] This diagram shows the process after Figure 4, illustrating the cutting of the bridge provided on the FPC. [Figure 6] This diagram shows the subsequent process after Figure 5, and is a plan view showing the completed FPC with components attached. [Figure 7] This is a plan view showing a modified example of a component-attached FPC manufactured by the component-attached FPC manufacturing method described above. [Figure 8] This is a plan view showing an FPC with components according to a second embodiment of the present invention. [Figure 9] This is a schematic diagram illustrating the procedure for manufacturing the FPC with components described above. [Figure 10]It is a diagram for explaining the manufacturing procedure for manufacturing the FPC with components, and it is a diagram showing a state where a plate is installed on the FPC. [Figure 11] It is a diagram for explaining the problems of the present invention, and it is a plan view showing a flexible printed circuit board with chip components manufactured by a conventional method for mounting a flexible substrate. [Figure 12] It is a cross-sectional view showing the flexible printed circuit board with chip components shown in FIG. 11.

Mode for Carrying Out the Invention

[0011] (First Embodiment) Hereinafter, the FPC manufacturing method 1 with components according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 6. FIG. 1 is a plan view showing an FPC 10 with components manufactured by the FPC manufacturing method 1 with components according to the first embodiment of the present invention.

[0012] As shown in FIG. 1, the FPC 10 with components manufactured by the FPC manufacturing method 1 with components includes a circuit component 2 and an FPC 3 (Flexible Printed Circuits) to which the circuit component 2 is soldered. In the present embodiment, the arrows X, Y, and Z are in directions orthogonal to each other. The arrow XY is the planar direction in which the FPC 3 extends, and the arrow Z is the direction in which the circuit component 2 is installed with respect to the FPC 3.

[0013] ; Circuit component 2 is soldered to the component mounting section 33 of the FPC 3, which will be described later, and is electrically connected to the circuit formed on the FPC 3. Here, it is an element that performs various functions. Examples of circuit component 2 include connectors, capacitors, relays, resistors, transistors, IPS (Intelligent Power Switch), and electronic control units including microcontrollers. As shown in Figure 1, circuit component 2 comprises a circuit component body (not shown) and a plurality of connection parts 22 extending from both ends of the circuit component body (in the figure, only one of the plurality of connection parts 22 is shown, and the others are omitted). Hereafter, one of the plurality of connection parts 22 may be referred to as the "first connection part" and the others as the "second connection part".

[0014] In this embodiment, the first connecting portion 22 is composed of a rectangular plate-shaped conductive metal tab. Furthermore, the first connecting portion 22 is installed such that a part of it extends from the component mounting portion 33 provided on the FPC 3, which will be described later.

[0015] As shown in Figures 1 and 3, the FPC3 integrally comprises a rectangular FPC body 31, an FPC arm 32 branching from the FPC body 31, a component mounting section 33 on which the first connection portion 22 of the circuit component 2 of the FPC arm 32 is installed, and a bridge 34 connecting the component mounting section 33 and the FPC body 31.

[0016] As shown in Figure 3, the FPC body 31 is formed in a rectangular shape. The FPC body 31 is composed of a pair of first sides 31a, 31a that form both ends in the left-right direction X and extend in the front-back direction Y, and a second side 31b that is continuous with the pair of first sides 31a, 31a and extends in the left-right direction X.

[0017] As shown in Figure 3, the FPC arm portion 32 comprises a strip-shaped FPC arm portion body 321 extending forward Y1 from the second side 31b of the FPC body 31, and a strip-shaped FPC extension portion 322 that bends at a right angle at the end of the FPC arm portion body 321 away from the FPC body 31 and extends in the left-right direction X. One end 32L of the FPC arm portion 32 is continuous with the second side 31b of the FPC body 31, and the other end 32R is provided continuous with the first edge 33a of the component mounting portion 33, which will be described later.

[0018] As shown in Figure 3, the component mounting section 33 is formed in a rectangular shape. This component mounting section 33 has a first edge 33a and a second edge 33b extending in the front-rear direction Y, and a third edge 33c and a fourth edge 33d extending in the left-right direction X. The component mounting section 33 is also provided at the end opposite to the FPC arm body 321, with the FPC extension 322 in between, in the left-right direction X. Solder printing is applied to the upper surface of this component mounting section 33. Hereafter, solder will be denoted by the numeral 4. The component mounting section 33 is configured so that the first connection portion 22 of the circuit component 2 is electrically connected via the solder 4. That is, the circuit component 2 is mounted on the component mounting section 33.

[0019] As shown in Figure 3, the bridge 34 is formed in the shape of a strip. This bridge 34 is located between the FPC body 31 and the component mounting section 33, and is provided continuously between them. The bridge 34 also extends in the front-rear direction Y, with one end continuous with the second side 31b of the FPC body 31 and the other end continuous with the third end edge 33c of the component mounting section 33.

[0020] Next, the manufacturing equipment 5 used in manufacturing the FPC 10 with components will be explained with reference to Figure 4.

[0021] As shown in Figures 3 and 4, the manufacturing apparatus 5 includes a tray 51 on which the FPC 3 is placed, a reflow oven (not shown) for melting the solder 4 by heating, and a plate 52 (shown in Figure 4) for covering and pressing the FPC 3.

[0022] As shown in Figure 4, the tray 51 is configured to accommodate the FPC 3 and circuit components 2. This tray 51 is formed in a flat shape and has a larger surface area than the FPC 10 with components attached.

[0023] As shown in Figure 4, the plate 52 comprises a plate body 521 configured to be large enough to cover a portion of the FPC body 31 and FPC arm portion 32 of the FPC 3, and a rectangular opening 522 provided in the plate body 521. The opening 522 is configured to be large enough to expose the component mounting portion 33, the portion of the FPC arm portion 32 including the other end 32R, and the first connection portion 22 of the circuit component 2.

[0024] Next, the method for manufacturing the FPC 10 with components attached using the manufacturing apparatus 5 (FPC manufacturing method with components attached 1) will be explained with reference to Figures 2 to 6.

[0025] First, as shown in Figures 2 and 3, an FPC 3 is formed, which integrally includes an FPC body 31, an FPC arm 32 branched from the FPC body 31, a component mounting section 33 provided on the FPC arm 32 where circuit components 2 are installed, and a bridge 34 connecting the component mounting section 33 and the FPC body 31 (FPC forming process S1). After this, solder printing is applied to the upper surface of the component mounting section 33. After this, the FPC 3 is placed on a tray 51.

[0026] Next, as shown in Figure 4, the first connection portion 22 of the circuit component 2 is installed in the component installation section 33 (component installation step S2). The rear portion of the first connection portion 22 is installed in the component installation section 33, and the front portion Y1 is installed so as to straddle the fourth end edge 33d of the component installation section 33.

[0027] Next, as shown in Figure 4, the plate 52 is placed on the FPC 3 (plate placement step S3). The plate 52 is installed such that the plate body 521 covers part of the FPC body 31 and the FPC arm portion 32, while the portion including the other end 32R of the FPC arm portion 32, the component placement portion 33, the first connection portion 22 of the circuit component 2, and the bridge 34 are exposed through the opening 522. Hereafter, as shown in Figure 4, the state in which the FPC 3 and circuit component 2 are placed on the tray 51 and the plate 52 is placed in the predetermined position on the FPC 3 may be referred to as "component set 6". Note that the plate 52 may be omitted if there is no risk of the FPC body 31 warping.

[0028] Next, the component set 6 is placed into the reflow oven. This heats the FPC 3 and melts the solder 4. At this time, the component mounting section 33 is supported by the FPC body 31 by the bridge 34, and warping of the component mounting section 33 is suppressed.

[0029] Subsequently, the first connection portion 22 of the circuit component 2 is electrically connected to the circuit formed in the component mounting portion 33 of the FPC 3 via solder 4. The second connection portion of the circuit component 2 is also electrically connected to the circuit at a predetermined position. As a result, the circuit component 2 is mounted on the component mounting portion 33 (mounting process S4). At this time, because the warping of the component mounting portion 33 is suppressed, the circuit component 2 is positioned in the predetermined position on the component mounting portion 33.

[0030] Next, the component set 6 is removed from the reflow oven and the plate 52 is removed. Then, as shown in Figure 5, the bridge 34 is cut at the boundary position L1 between the bridge 34 and the FPC body 31, and at the boundary position L2 between the bridge 34 and the component mounting section 33 (bridge cutting step S5). In this way, the FPC 10 with components attached is completed, as shown in Figure 6.

[0031] According to the embodiment described above, the component-attached FPC manufacturing method 1 for manufacturing a component-attached FPC 10 in which a circuit component 2 is soldered to an FPC 3 comprises an FPC forming step S1 for forming an FPC 3 which integrally includes an FPC body 31, an FPC arm portion 32 branched from the FPC body 31, a component mounting portion 33 provided at the end of the FPC arm portion 32 on which the circuit component 2 is installed, and a bridge 34 connecting the component mounting portion 33 and the FPC body 31. As a result, when the FPC 3 is heated, the component mounting portion 33 is supported by the FPC body 31 by the bridge 34, and as the FPC 3 is heated in a reflow oven, warping of the component mounting portion 33 is suppressed. With this, the circuit component 2 can be mounted in a predetermined shape at a predetermined position (component mounting portion 33) branched from the FPC body 31.

[0032] Furthermore, the system includes a plate installation step S3 in which a plate 52 is installed so as to cover a part of the FPC body 31 and a part of the FPC arm 32, while exposing the component installation section 33. This suppresses warping of the FPC body 31.

[0033] The process also includes a bridge cutting step S5 for cutting the bridge 34, and the bridge cutting step S5 is performed after the mounting step S4. This allows for the production of a lightweight FPC 10 with components by cutting off the unnecessary parts.

[0034] It should be noted that the present invention is not limited to the embodiments described above, and includes other configurations that can achieve the objectives of the present invention, and the following modifications are also included in the present invention.

[0035] In the above embodiment, the circuit components 2 are installed in the component installation section 33 of the FPC3 in the component installation step S2, and then the plate 52 is installed on the FPC3 in the plate installation step S3. However, the present invention is not limited to this. The circuit components 2 may be installed in the component installation section 33 of the FPC3 after the plate 52 has been installed on the FPC3. That is, the component installation step S2 may be performed after the plate installation step S3.

[0036] Furthermore, in the above embodiment, the bridge 34 is cut at the boundary position L1 between the bridge 34 and the FPC body 31, and at the boundary position L2 between the bridge 34 and the component mounting section 33, in the bridge cutting step S5, but the present invention is not limited thereto. The bridge 34 may be cut at an intermediate position L3 in the front-rear direction Y, as shown in Figure 7, or the bridge cutting step S5 may not be performed, and the component mounting section 33 and the FPC body 31 may remain connected, i.e., the state in which the bridge 34 is present may be considered the completed form. Alternatively, perforations may be made in advance at at least one of positions L1 to L3.

[0037] (Second Embodiment) Hereinafter, a component-attached FPC manufacturing method 1A according to the second embodiment of the present invention will be described with reference to Figures 8 to 10. Figure 8 is a plan view showing a component-attached FPC 10A according to the second embodiment of the present invention. Figure 9 is a schematic diagram for illustrating the procedure according to the component-attached FPC manufacturing method 1A. Figure 10 is a diagram for illustrating the manufacturing procedure for manufacturing a component-attached FPC 10A, showing the state in which the plate 52 is installed on the FPC 3A. The component-attached FPC manufacturing method 1A of the second embodiment and the component-attached FPC manufacturing method 1 of the first embodiment differ in the configuration of the FPC 3A(3). Hereinafter, in the second embodiment, parts having the same configuration as in the first embodiment are given the same reference numerals and detailed descriptions are omitted.

[0038] As shown in Figure 8, the component-attached FPC 10A manufactured by the component-attached FPC manufacturing method 1A comprises a circuit component 2 and an FPC 3A (Flexible Printed Circuits) to which the circuit component 2 is soldered.

[0039] As shown in Figure 8, the FPC3A integrally comprises an FPC body 31, an FPC arm 32 branched from the FPC body 31, a component mounting section 33 provided at the end of the FPC arm 32 on which the first connection section 22 of the circuit component 2 is installed, and an extension section 35 extending from the component mounting section 33.

[0040] As shown in Figures 8 and 10, the extension portion 35 is configured to extend away from the FPC arm portion 32 at the front end of the second edge 33b of the component mounting portion 33 (the end away from the FPC body 31 in the front-rear direction Y). This extension portion 35 is the part that extends from the second edge 33b of the component mounting portion 33.

[0041] Next, the method for manufacturing the component-attached FPC 10A using the manufacturing apparatus 5 (component-attached FPC manufacturing method 1A) will be explained with reference to Figures 8 to 10.

[0042] First, as shown in Figures 8 and 9, an FPC 3A is formed, which integrally includes an FPC body 31, an FPC arm 32 branched from the FPC body 31, a component mounting section 33 provided at the end of the FPC arm 32 where circuit components 2 are installed, and an extension 35 extending from the component mounting section 33 (FPC forming process S1A). After this, solder printing is applied to the upper surface of the component mounting section 33.

[0043] Next, the FPC 3A is placed on the tray 51. Then, the first connection portion 22 of the circuit component 2 is placed on the component placement section 33 (component placement process S2). The rear portion of the first connection portion 22 is placed on the component placement section 33, and the front portion Y1 is placed so as to straddle the fourth edge 33d of the component placement section 33. In this way, the circuit component 2 is placed on the component placement section 33 via solder 4.

[0044] Next, as shown in Figure 10, the plate 52 is placed on the FPC 3A (plate placement step S3). The plate 52 is installed such that the plate body 521 covers part of the FPC body 31 and the FPC arm portion 32, while the portion including the other end 32R of the FPC arm portion 32, the component placement portion 33, the first connection portion 22 of the circuit component 2, and the base of the extension portion 35 are exposed through the opening 522. Hereafter, as shown in Figure 10, the state in which the FPC 3A and circuit component 2 are placed on the tray 51 and the plate 52 is placed in a predetermined position on the FPC 3A may be referred to as "component set 16".

[0045] Next, the component set 16 is placed into the reflow oven. This heats the FPC 3A and melts the solder 4. At this time, the component mounting section 33 is pressed by the plate 52 via the extension section 35, suppressing the warping of the component mounting section 33.

[0046] Subsequently, the first connection portion 22 of the circuit component 2 is electrically connected to the circuit formed in the component mounting portion 33 of the FPC 3A via solder 4. The second connection portion of the circuit component 2 is also electrically connected to the circuit at a predetermined position. As a result, the circuit component 2 is mounted on the component mounting portion 33 (mounting process S4). At this time, because the warping of the component mounting portion 33 is suppressed, the circuit component 2 is positioned in the predetermined position on the component mounting portion 33.

[0047] Next, the component set 6 is removed from the reflow oven, and the plate 52 is removed. In this way, the FPC 10A with components attached is completed, as shown in Figure 8.

[0048] According to the embodiment described above, the component-attached FPC manufacturing method 1A for manufacturing a component-attached FPC 10 in which a circuit component 2 is soldered to an FPC 3A comprises an FPC forming step S1A which integrally includes an FPC body 31, an FPC arm portion 32 branched from the FPC body 31, a component mounting portion 33 provided at the end of the FPC arm portion 32 on which the circuit component 2 is installed, and an extension portion 35 extending from the edge of the component mounting portion 33, and a plate installation step S3 which installs a plate 52 so as to cover at least a part of the extension portion 35 while exposing the component mounting portion 33. As a result, when the FPC 3A is heated, the extension portion 35 is pressed by the plate 52, and the FPC 3A is heated in a reflow oven, thereby suppressing the warping of the component mounting portion 33. With this, the circuit component 2 can be mounted in a predetermined shape at a predetermined position (component mounting portion 33) branched from the FPC body 31.

[0049] In the above embodiment, as shown in Figure 8, the first connection portion 22 of the circuit component 2 is installed in the component mounting portion 33 with its rear portion, and the front portion Y1 is provided straddling the fourth end edge 33d of the component mounting portion 33. The extension portion 35 is configured to extend away from the FPC arm portion 32 in the left-right direction X at the front end of the second end edge 33b of the component mounting portion 33, but the present invention is not limited thereto. The first connection portion 22 of the circuit component 2 may be installed in the component mounting portion 33 with a portion of it, and the other portion may be provided straddling the second end edge 33b of the component mounting portion 33. In that case, the extension portion may be configured to extend away from the FPC body 31 in the front-rear direction Y at the fourth end edge 33d of the component mounting portion 33.

[0050] Furthermore, in the above embodiment, in the plate installation step S3, the plate 52 is installed such that the base of the extension portion 35 is exposed from the opening 522 of the plate 52, but the present invention is not limited thereto. In the plate installation step S3, the plate 52 may be installed such that the entire extension portion 35 is covered by the plate 52.

[0051] Furthermore, while the best configurations and methods for carrying out the present invention are disclosed in the above description, the present invention is not limited thereto. That is, although the present invention is particularly illustrated and described with respect to specific embodiments, those skilled in the art can make various modifications to the embodiments described above in terms of shape, material, quantity, and other detailed configurations without departing from the scope of the technical idea and objectives of the present invention. Therefore, the limiting descriptions of shape, material, etc. disclosed above are provided as examples to facilitate understanding of the present invention and do not limit the present invention. Accordingly, descriptions of components with some or all of these limitations removed are included in the present invention. [Explanation of Symbols]

[0052] 1. 1A FPC Manufacturing Method with Components 2 Circuit components 3, 3A FPC 10, 10A FPC with components 31 FPC main unit 32 FPC arm 33. Parts installation section 34 Bridge 35 Extension 52 plates S1, S1A FPC formation process S2 Parts installation process S3 Plate Installation Process S4 Implementation Process S5 Bridge cutting process

Claims

1. A method for manufacturing a component-attached FPC, wherein a component has multiple connection parts extending from a circuit component body, and these multiple connection parts are soldered to the FPC, the FPC being manufactured in which the component-attached FPC is, An FPC forming step for forming an FPC that integrally comprises an FPC body, an FPC arm branched from the FPC body, a component mounting section provided at the end of the FPC arm where a first connection section, which is one of the plurality of connection sections of the circuit component, is installed, and a bridge connecting the component mounting section and the FPC body, wherein the dimension of the portion in the direction intersecting the connection direction is smaller than the dimension of the first connection section in the direction intersecting the extension direction from the component mounting section. A component installation step of installing the first connection portion of the circuit component to the component installation portion via solder, A method for manufacturing a component-attached FPC, comprising: heating the FPC and melting the solder to mount the first connection portion of the circuit component to the component mounting portion; and electrically connecting the second connection portion, other than the first connection portion, among the plurality of connection portions to the circuit formed on the FPC at a predetermined position on the FPC.

2. The method for manufacturing a component-attached FPC according to claim 1, further comprising a plate installation step of installing a plate so as to expose the component installation portion while covering a part of the FPC body and a part of the FPC arm.

3. The process includes a bridge cutting step for cutting the aforementioned bridge, The method for manufacturing a component-equipped FPC according to claim 1 or 2, characterized in that the bridge cutting step is performed after the mounting step.

4. A method for manufacturing a component-attached FPC, wherein a component has multiple connection parts extending from a circuit component body, and these multiple connection parts are soldered to the FPC, the FPC being manufactured in which the component-attached FPC is, An FPC forming step for forming an FPC that integrally comprises an FPC body, an FPC arm branched from the FPC body, a component mounting portion provided at the end of the FPC arm and on which a first connection portion, which is one of the plurality of connection portions of the circuit component, is installed, and an extension portion extending from the edge of the component mounting portion, wherein the dimension of the portion in the direction along the edge is smaller than the dimension of the first connection portion in the direction intersecting the extension direction from the component mounting portion, A component installation step of installing the first connection portion of the circuit component to the component installation portion via solder, A plate installation step involves installing a plate so that it covers at least a portion of the extension while exposing the component installation portion. A method for manufacturing a component-attached FPC, comprising: heating the FPC and melting the solder to mount the first connection portion of the circuit component to the component mounting portion; and electrically connecting the second connection portion, other than the first connection portion, among the plurality of connection portions to the circuit formed on the FPC at a predetermined position on the FPC.

Images