Connectors and connector pairs

Abstract

To provide a connector and a connector pair, which, without forming a solder barrier, moderately maintain solder wettability, and can reduce contact resistance at a contact point part while improving the connection strength of a board connection part, the connector and the connector pair being simple in structure, low in costs and high in reliability.SOLUTION: A shield includes a body part, a board connection part located on one end side of the body part, and a contact point part located on the other end side of the body part, the shield surrounding a periphery of the connector. The body part, the board connection part, and the contact point part each include an exposed surface exposed from a housing. The board connection part is formed around the entire periphery of the connector. The body part, the board connection part, and the contact point part each include a metal base material and first to third plating layers formed on the metal base material. The first layer is a nickel or nickel alloy plating layer, the second layer is a platinum group metal or platinum group metal alloy plating layer, and the third layer is a gold or gold alloy plating layer, the third layer having a thickness of 0.2-15 [nm].SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a connector and a pair of connectors.

Background Art

[0002] Conventionally, a board-to-board connector has been used to electrically connect a pair of parallel circuit boards. Such a connector includes a plurality of terminals, each of which is a conductive member. The board connection portion of each terminal is connected to a wiring pattern or the like formed on a circuit board by soldering. When the connectors are fitted together and the contact portions of the corresponding terminals contact each other, the corresponding wiring patterns of the pair of circuit boards are electrically connected to each other. And a solder barrier is formed on each terminal to prevent the melted solder from climbing up from the board connection portion to the contact portion (see, for example, Patent Document 1).

[0003] FIG. 16 is a diagram showing a conventional terminal, where (a) is a side view and (b) is a cross-sectional view.

[0004] In the figure, reference numeral 861 denotes a terminal attached to a housing of a connector (not shown), which is a member formed by bending an elongated strip-shaped conductive metal plate, and includes an elongated main body portion 861c, a contact portion 861a formed at one end side of the main body portion 861c and contacting a counterpart terminal, and a board connection portion 861b formed at the other end side of the main body portion 861c and connected to a wiring pattern or the like formed on a circuit board (not shown) by soldering.

[0005] Furthermore, in the contact portion 861a and the substrate connection portion 861b, multiple plating layers are formed as shown in Figure 16(b). In the figure, 862 is a metal substrate, consisting of a copper alloy such as beryllium copper. 863a is a nickel plating layer formed on the metal substrate 862 as an underlayer, with a thickness of approximately 2 μm. 863b is a palladium plating layer formed on the nickel plating layer 863a, consisting of a palladium alloy such as a Pd-Ni alloy, and its thickness is preferably 0.1 μm or more. 863c is a gold plating layer formed on the palladium plating layer 863b, consisting of a gold alloy such as an Au-Co alloy, and its thickness is preferably 0.3 μm or more.

[0006] As a result, the electrical resistance of the contact portion 861a can be reduced, and its hardness and wear resistance can be improved, thereby achieving good contact reliability. Furthermore, the hardness and wear resistance of the substrate connection portion 861b can be improved while maintaining good corrosion resistance and solder wettability. In addition, although the main body portion 861c has a nickel plating layer 863a and a palladium plating layer 863b on the nickel plating layer 863a, the gold plating layer 863c is absent.

[0007] Thus, since a palladium plating layer 863b, which has worse solder wettability than the gold plating layer 863c, is formed on the surface, the main body portion 861c functions as a solder barrier, preventing molten solder from creeping up from the substrate connection portion 861b to the contact portion 861a. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2006-294420 [Overview of the project] [Problems that the invention aims to solve]

[0009] However, in the conventional connector described above, it is necessary to form a solder barrier between the board connection portion 861b and the contact portion 861a. Moreover, in order to reliably prevent solder from creeping up from the board connection portion 861b to the contact portion 861a, it is necessary to form the solder barrier over a wide area. However, this increases the distance from the board connection portion 861b to the contact portion 861a, resulting in a larger terminal 861. In recent years, in particular, board-to-board connectors have become smaller and lower in profile, making it difficult to increase the distance from the board connection portion 861b to the contact portion 861a by making the terminal 861 larger. In fact, since the terminal 861 has also become smaller along with the miniaturization and lower profile of board-to-board connectors, it is extremely difficult to form a solder barrier between the board connection portion 861b and the contact portion 861a.

[0010] The objective here is to solve the aforementioned conventional problems and provide a connector and connector pair that can maintain appropriate solder wettability without forming a solder barrier, improve the connection strength of the board connection part, reduce contact resistance at the contact part, have a simple structure, low cost, and high reliability. [Means for solving the problem]

[0011] To that end, the connector comprises a housing and a shield, wherein the shield includes a main body, a substrate connection portion located at one end of the main body, and a contact portion located at the other end of the main body, and in a plan view, surrounds the periphery of the connector and housing, the main body, the substrate connection portion and the contact portion each include an exposed surface exposed from the housing, the substrate connection portion is formed around the entire circumference of the connector, the main body extends from the contact portion to the substrate connection portion, the main body, the substrate connection portion and the contact portion each include a metal substrate and first to third plating layers formed on the metal substrate, the first layer being a nickel or nickel alloy plating layer, and the second layer preventing mutual diffusion between the metal of the first layer and the metal of the third layer. A plating layer comprising a palladium-nickel alloy (PdNi) containing 50% or more palladium. The third layer is a plating layer of gold or a gold alloy, and the thickness of the third layer is 0.2 to 15 nm.

[0012] In other connectors, the housing is further molded integrally with the shield.

[0013] Furthermore, in other connectors, the board connection portion is soldered to the board all the way around.

[0014] Furthermore, in other connectors, the board connection portion is a flange that extends continuously around the entire circumference.

[0015] Furthermore, in other connectors, the contact portions can be formed on all four sides of the shield.

[0016] Furthermore, in other connectors, a curved portion can be formed at the upper end of the shield, which curves inward toward the inside of the connector.

[0017] Furthermore, in other connectors, the plating layer is formed over the entire shield.

[0018] Furthermore, in other connectors, the thickness of the third layer is 0.5 to 8 nm.

[0019] In still other connectors, further, the foregoing Record number The thickness of the two layers is 2 to 200 [nm].

[0020] In a connector pair, it has the connector of the present disclosure and a mating connector that mates with the connector.

[0021] In other connector pairs, further, the mating connector includes a housing and a shield, the shield includes a main body portion, a substrate connection portion located on one end side of the main body portion, and a contact portion located on the other end side of the main body portion. In a plan view, it surrounds the periphery of the mating connector and the housing. The main body portion, the substrate connection portion, and the contact portion each include an exposed surface exposed from the housing. The substrate connection portion is formed over the entire circumference of the mating connector. The main body portion is in the range from the contact portion to the substrate connection portion. The main body portion, the substrate connection portion, and the contact portion each include a metal base material and first to third plating layers formed on the metal base material. The first layer is a plating layer of nickel or a nickel alloy. The second layer is a plating layer that prevents mutual diffusion between the metal of the first layer and the metal of the third layer. A plating layer comprising a palladium-nickel alloy (PdNi) containing 50% or more palladium. is a plating layer, the third layer is a plating layer of gold or a gold alloy, and the thickness of the third layer is 0.2 to 15 [nm].

Advantages of the Invention

[0022] According to the present disclosure, the connector can maintain appropriate solder wettability without forming solder burrs, improve the connection strength of the substrate connection portion, and reduce the contact resistance at the contact portion. In addition, the structure can be simplified, the cost can be reduced, and the reliability can be improved.

Brief Description of the Drawings

[0023] [Figure 1] It is an exploded view of the first connector in the present embodiment. [Figure 2]A two - dimensional view of the first connector in this embodiment, where (a) is a top view and (b) is a cross - sectional view taken along the A - A arrow in (a). [Figure 3] A two - dimensional view of the first shield in this embodiment, where (a) is a top view and (b) is a cross - sectional view taken along the B - B arrow in (a). [Figure 4] A perspective view of the second connector in this embodiment, where (a) is a view from obliquely above and (b) is a view from obliquely below. [Figure 5] A three - dimensional view of the second connector in this embodiment, where (a) is a top view, (b) is a side view, and (c) is a front view. [Figure 6] A bottom view of the second connector in this embodiment. [Figure 7] A plan view of the state at the initial stage of fitting between the first connector and the second connector in this embodiment. [Figure 8] A cross - sectional view of the state at the initial stage of fitting between the first connector and the second connector in this embodiment, where (a) is a cross - sectional view taken along the C - C arrow in FIG. 7 and (b) is a cross - sectional view taken along the D - D arrow in FIG. 7. [Figure 9] A perspective view of the state where the fitting between the first connector and the second connector in this embodiment is completed. [Figure 10] A plan view of the state where the fitting between the first connector and the second connector in this embodiment is completed. [Figure 11] A side cross - sectional view of the state where the fitting between the first connector and the second connector in this embodiment is completed, where (a) is a cross - sectional view taken along the E - E arrow in FIG. 10 and (b) is a cross - sectional view taken along the F - F arrow in FIG. 10. [Figure 12] A cross - sectional view of the state where the fitting between the first connector and the second connector in this embodiment is completed, where (a) is a cross - sectional view taken along the G - G arrow in FIG. 10 and (b) is a cross - sectional view taken along the H - H arrow in FIG. 10. [Figure 13] A schematic cross - sectional view near the surface of a conductive member showing the structure of the plating layer in this embodiment. [Figure 14] A figure showing the result of the solder wetting spread experiment in this embodiment. [Figure 15] This table shows the results of experiments in which the thickness of the second and third layers in this embodiment was varied. [Figure 16] This diagram shows a conventional terminal, where (a) is a side view and (b) is a cross-sectional view. [Modes for carrying out the invention]

[0024] The embodiments will be described in detail below with reference to the drawings.

[0025] Figure 1 is an exploded view of the first connector in this embodiment, Figure 2 is a two-view drawing of the first connector in this embodiment, and Figure 3 is a two-view drawing of the first shield in this embodiment. In Figure 2, (a) is a top view and (b) is a cross-sectional view of (a) taken along arrow AA, and in Figure 3, (a) is a top view and (b) is a cross-sectional view of (a) taken along arrow BB.

[0026] In the figure, 10 is a connector in this embodiment, and is a first connector as one of a pair of board-to-board connectors that form a connector pair. The first connector 10 is a surface-mount type receptacle connector mounted on the surface of a first board, which is a board not shown as a mounting member, and is mated with a second connector 101, which will be described later as a mating connector. The second connector 101 is the other of the pair of board-to-board connectors, and is a surface-mount type plug connector mounted on the surface of a second board, which is a board not shown as a mounting member.

[0027] In this embodiment, the first connector 10 and the second connector 101 of the connector pair are preferably used to electrically connect the first substrate and the second substrate as substrates, but they can also be used to electrically connect other components. The first substrate and the second substrate are, for example, printed circuit boards used in electronic devices, flexible flat cables (FFCs), flexible printed circuits (FPCs), etc., but any type of substrate may be used.

[0028] Furthermore, in this embodiment, the expressions indicating directions such as up, down, left, right, front, and back, used to describe the configuration and operation of each part of the connector pair, the first connector 10 and the second connector 101, are relative rather than absolute. They are appropriate when each part of the first connector 10 and the second connector 101 is in the position shown in the figure, but should be modified and interpreted accordingly if the position changes.

[0029] The first connector 10 includes a first outer shield 50, which is a shield formed by punching, drawing, or other processing on a conductive metal plate, and a first housing 11, which is a housing integrally formed from an insulating material such as synthetic resin. The first housing 11 includes a flat bottom plate 18, a first protrusion 13 that protrudes upward from the upper surface of the bottom plate 18, and corners 17 that protrude upward from the four corners of the bottom plate 18.

[0030] The corner portion 17 is the part that connects to the first shield 50 when the first shield 50 is integrated with the first housing 11 by overmolding or insert molding. In this embodiment, the first housing 11 is integrally molded with the first shield 50. That is, the first housing 11 is molded by filling an insulating material such as synthetic resin into the cavity of a mold in which the first shield 50 has been set beforehand, and is integrally connected with the first shield 50 at the corner portion 17. Therefore, the first housing 11 and the first shield 50 do not exist separately, but in Figure 1, for the sake of explanation, the first housing 11 and the first shield 50 are shown as existing separately.

[0031] As shown in Figure 1, each corner 17 has a shape like one of four divisions of a cylindrical wall, and in plan view it includes an upper wall portion 17a having a circular arc shape with a central angle of approximately 90 degrees, a cylindrical surface outer wall portion 17b extending downward (in the negative Z-axis direction) from the outer edge of the upper wall portion 17a, a cylindrical surface inner wall portion 17c extending downward from the inner edge of the upper wall portion 17a, and a pair of planar side wall portions 17d extending downward from the edges of the upper wall portion 17a corresponding to both ends of the circular arc with a central angle of approximately 90 degrees. In the example shown in Figure 1, each side wall portion 17d has a recessed portion 17d1 formed except for the periphery, but the recessed portion 17d1 can be omitted and the side wall portion 17d can be made planar.

[0032] Furthermore, the inner wall portion 17c has a shield housing portion 17e recessed to accommodate the inner wall 51 at the corner portion 50c included in the fitting positioning portion 51b of the first shield 50. The lower end of the shield housing portion 17e is formed to be substantially parallel to the upper surface of the connection portion 18a of the bottom plate 18. And, as shown in Figures 1 and 2(b), it is desirable that a locking projection 17h protruding inward from the housing portion 50d is formed in at least a part of the vicinity of the lower end of the shield housing portion 17e.

[0033] Furthermore, the corner portion 50c included in the fitting positioning portion 51b of the first shield 50 is formed such that its lower end is substantially parallel to the upper surface of the flange portion 54. The area near the upper end of the fitting positioning portion 51b, including the corner portion 50c, is a gently sloping surface portion 51h that is gently inclined downward and inward toward the housing portion 50d.

[0034] Furthermore, the fitting positioning portion 51b includes a positioning lower portion 51j that extends almost vertically downward from the lower end of the gently sloping surface portion 51h. And, as shown in Figure 3(b), it is desirable that a locking recess 51k is formed in at least a portion of the inner wall surface of the positioning lower portion 51j, that is, near the lower end of the wall surface facing the outer wall 52, so as to be recessed inward into the housing portion 50d.

[0035] As a result, when the first shield 50 is integrated with the first housing 11 by overmolding or insert molding, as shown in Figure 2(b), a portion of the constituent material of the first housing 11 filled on the back side of the corner portion 50c enters the locking recess 51k, forming a locking projection 17h, and the locking projection 17h and the locking recess 51k engage. Therefore, the corner portion 50c and the corner portion 17 are reliably integrated and cannot be separated. The outer wall surface of the positioning lower portion 51j, that is, the wall surface facing inward of the housing portion 50d, and the inner wall portion 17c of the corner portion 17 are substantially the same plane extending in the vertical direction.

[0036] The first protrusion 13 is a roughly rectangular parallelepiped member extending in the longitudinal direction (X-axis direction) of the first connector 10, and includes a pair of outer protrusions 13a extending in the longitudinal direction of the first connector 10 on both sides in the width direction (Y-axis direction) of the first connector 10, an inner protrusion 13b extending in the longitudinal direction of the first connector 10 at the center in the width direction, and a pair of lateral protrusions 13c extending in the width direction and connecting the longitudinal ends of the outer protrusions 13a and the inner protrusions 13b. Between the outer protrusions 13a on both the left and right sides of the inner protrusion 13b, a pair of inner grooves 12a are formed as part of the first recess 12, which are recesses extending in the longitudinal direction of the first connector 10.

[0037] Here, a first signal terminal housing cavity 15 is formed from the left and right sides of the inner protrusion 13b, through the bottom surface of the inner groove 12a, to the side surface of the outer protrusion 13a. In the example shown in the figure, the first signal terminal housing cavity 15 is formed so as to penetrate the bottom plate 18 in the plate thickness direction (Z axis direction). Of the first signal terminal housing cavity 15, the groove-shaped portions formed on the left and right sides of the inner protrusion 13b are referred to as the first signal terminal housing inner cavity 15a, and the groove-shaped portion formed on the side of the outer protrusion 13a facing the inner protrusion 13b is referred to as the first signal terminal housing outer cavity 15b.

[0038] Multiple first signal terminal housing cavities 15 are formed in a row (three in the example shown in the figure) along the longitudinal direction at a predetermined pitch (for example, 0.35 mm). The pitch and number of the first signal terminal housing cavities 15 can be changed as appropriate. Multiple first terminals 61, which are housed in each of the first signal terminal housing cavities 15 and attached to the first housing 11, are also arranged on both sides of each first protrusion 13 at a similar pitch. That is, multiple first terminals 61 are arranged along each internal groove 12a, forming a pair of parallel terminal groups.

[0039] Furthermore, on the outer ends of both longitudinal sides of the first protrusion 13, that is, on the outer sides of the lateral protrusion 13c, second shield housing slits 13d are formed, which serve as slits into which the inner wall 151 of the second shield 150 of the second connector 101, described later, enters. In the example shown in the figure, the second shield housing slits 13d are formed to penetrate the bottom plate 18 in the thickness direction, but it is not necessarily required that they penetrate the bottom plate 18 in the thickness direction.

[0040] A side recess 18b is formed in the base plate 18 on the widthwise outer side of the first connector 10 at the first protrusion 13, so that the base plate 18 has a smaller width dimension of the first connector 10, i.e., it is formed to be narrow. In addition, end recesses 18c are formed at both ends of the base plate 18 in the longitudinal direction of the first connector 10, so that the base plate 18 has a smaller length dimension of the first connector 10, i.e., it is formed to be short.

[0041] Furthermore, on the longitudinal side of the first connector 10, outside the first protrusion 13, a pair of support parts, the first high-frequency terminal support parts 16, are formed, projecting upward from the upper surface of the base plate 18. The shape of the first high-frequency terminal support parts 16, when viewed from above, is a roughly U-shaped columnar member as shown in Figure 2(a), and has a first high-frequency terminal housing groove 16a that extends in the vertical direction. The first high-frequency terminal support parts 16 are arranged such that the openings of their respective first high-frequency terminal housing grooves 16a face in opposite directions, and as shown in Figure 2(a), when viewed from above, that is, in a plan view, they are point-symmetrical with respect to the center of the first connector 10, and are spaced apart from the center in the width direction of the first connector 10 and offset outward in the width direction. The first high-frequency terminal 71 is housed in the first high-frequency terminal housing groove 16a. Furthermore, below and in front of the first high-frequency terminal housing groove 16a, a first high-frequency terminal housing opening 16b is formed as an opening that penetrates the bottom plate 18 in the thickness direction.

[0042] The first shield 50 is a component integrally formed from a conductive metal plate by punching, drawing, and other processes, and is a curved component that extends in the mating direction of the first connector 10; therefore, its surface can be said to be an extended surface. Furthermore, as shown in Figure 2(a), the first shield 50 is a roughly rectangular frame-shaped component when viewed from above, that is, in a plan view, surrounding the periphery of the first connector 10 and encircling the periphery of the first housing 11. The first shield 50 includes an inclined surface portion 51d and a gently inclined surface portion 51h, which are inclined portions that extend diagonally downward formed on the inner peripheral edge at its upper end. Furthermore, the first shield 50 includes a plurality of long side portions 50a (a pair in the example shown) as linear portions extending linearly in the longitudinal direction of the first connector 10, a plurality of short side portions 50b (a pair in the example shown) as linear portions extending linearly in the width direction of the first connector 10, and a plurality of corner portions 50c (four in the example shown) as curved portions curved at approximately 90 degrees, connecting one end of the long side portion 50a and one end of the short side portion 50b.

[0043] Furthermore, the first shield 50 includes an outer wall 52, an inner wall 51 that is substantially parallel to the outer wall 52 on the inside of the outer wall 52, and a connecting portion 53 that connects and integrates the upper end of the outer wall 52 and the upper end of the inner wall 51. The connecting portion 53 is a curved portion that curves toward the inside of the first connector 10 at the upper end of the first shield 50. While the outer wall 52 is a continuous wall around its entire circumference, the inner wall 51 is separated into a fitting spring portion 51a and a fitting positioning portion 51b by slit portions 53a formed in the long side portion 50a and the short side portion 50b in the portions close to the corner portion 50c. The space surrounded by the portions of the inner wall 51 corresponding to the long side portion 50a, the short side portion 50b and the corner portion 50c is a housing portion 50d into which the mating connector, the second connector 101, is inserted and housed.

[0044] The mating spring portion 51a is a linearly extending portion included within the range of each long side portion 50a and each short side portion 50b, and functions as a ground spring that maintains electrical conductivity between the first shield 50 and the second shield 150 by elastically contacting the outer wall 152 of the second shield 150 of the second connector 101 (described later) when the first connector 10 and the second connector 101 are mated. The mating positioning portion 51b is a portion to which a part of the long side portion 50a and a part of the short side portion 50b are connected on both sides of the curved corner portion 50c, and guides the second connector 101 when it is inserted into the housing portion 50d when the first connector 10 and the second connector 101 are mated. Specifically, the second connector 101 is inserted into the housing portion 50d with the outer wall 152 of its second shield 150 in contact with the mating positioning portion 51b, thereby positioning the second connector 101 relative to the first connector 10.

[0045] The fitting spring portion 51a includes an inclined surface portion 51d whose upper end is connected to the lower end of the connecting portion 53 and which extends diagonally downward inward from the housing portion 50d, an engaging projection 51c formed at the lower end of the inclined surface portion 51d and projecting inward from the housing portion 50d, and a lower inner wall portion 51e extending substantially vertically downward from the lower end of the engaging projection 51c. The engaging projection 51c is the portion that engages with and contacts the outer wall 152 of the second shield 150 of the second connector 101, or the engaging projection 152c formed on the outer wall 152 as described later, when the first connector 10 and the second connector 101 are fitted together, and functions as a contact portion. The engaging projection 51c extends linearly in the longitudinal or widthwise direction of the first connector 10. Each fitting spring portion 51a is not connected to the first housing 11, and both ends are separated from the other parts by the slit portion 53a, so it is relatively flexible and can be elastically deformed in the direction of moving closer to or away from the outer wall 52.

[0046] Furthermore, the area near the upper end of the mating positioning portion 51b is the connection portion with the upper end of the inner wall 51 of the connecting portion 53, and is a gently sloping surface portion 51h that is gently inclined downward and inward of the housing portion 50d. Therefore, when viewed in the longitudinal and width directions of the first connector 10, the inclination angle of the gently sloping surface portion 51h, i.e., the taper angle, is gentler than the taper angle of the inclined surface portion 51d of the mating spring portion 51a. When the first connector 10 and the second connector 101 are mated, the gently sloping surface portion 51h comes into contact with the second connector 101 which is inserted into the housing portion 50d, and then the inclined surface portion 51d comes into contact with it. This reduces the damage that the mating spring portion 51a receives when the first connector 10 and the second connector 101 are mated.

[0047] Furthermore, the corner portion 50c included in the fitting positioning portion 51b is the portion that connects to the first housing 11 when the first shield 50 is integrated with the first housing 11 by overmolding or insert molding, and specifically, it is the portion that is integrated with the corner portion 17. Note that the other parts of the first shield 50 are separated from the first housing 11. Therefore, when the first shield 50 and the first housing 11 are integrated, the outer wall 52 and connecting portion 53 of the corner portion 50c cover the outer wall portion 17b and upper wall portion 17a of the corner portion 17. In addition, the inner wall 51 of the corner portion 50c is housed in the shield housing portion 17e formed in the inner wall portion 17c of the corner portion 17.

[0048] As a result, the corner portion 50c and the corner portion 17 are securely integrated and cannot be separated. Furthermore, the corner portion 50c is integrated with the corner portion 17 of the first housing 11, and at least the space defined by the outer wall 52, inner wall 51 and connecting portion 53 is filled with the insulating material that constitutes the first housing 11. In other words, the corner portion 50c is robust because the constituent material of the first housing 11 is filled on its back side. Moreover, because the mating positioning portion 51b including the corner portion 50c is highly robust, it will not deform or break even if the portion near the mating surface 101a of the second shield 150 of the second connector 101, which will be described later, comes into contact with it.

[0049] A flange portion 54, which is a flat portion extending outward, is connected to the lower end of the outer wall 52 via a curved portion 52a that is curved at approximately 90 degrees. The curved portion 52a and the flange portion 54 are continuously connected to the lower end of the outer wall 52 around its entire circumference. In the example shown in the figure, several small notches 54a are formed in the flange portion 54, but these notches 54a can be omitted as appropriate.

[0050] The flange portion 54 functions as a substrate connection portion, with its lower surface parallel to the surface of the first substrate, and is connected to the connection pad on the surface by soldering. When describing the range from the location where the engaging projection 51c as a contact point is formed on the inner wall 51, to the flange portion 54 as a substrate connection portion, including the connecting portion 53 and the outer wall 52, it will be described as the main body portion. The connection pad is typically connected to the ground line. Furthermore, the outer wall 52 is a continuous wall around its entire circumference, and its upper end is connected to a portion that is continuous with the connecting portion 53 and extends in a direction perpendicular to the outer wall 52 in a cross-section, and its lower end is connected to a member that is a continuous member like the flange portion 54 and extends in a direction perpendicular to the outer wall 52 in a cross-section, so it is relatively rigid and resistant to deformation.

[0051] When the first housing 11 is connected to the first shield 50 within the housing portion 50d, a first recess 12 is formed within the housing portion 50d, which is a recess surrounded by an inner wall 51 and defined below by a bottom plate 18, and which engages with the second connector 101. As described above, an inner groove portion 12a, which is an elongated recess extending in the longitudinal direction of the first connector 10, is formed between the outer protrusions 13a on both the left and right sides of the inner protrusion 13b, as part of the first recess 12. Furthermore, an outer groove portion 12c, which is an elongated recess extending in the longitudinal direction of the first connector 10, is formed between each outer protrusion 13a and the inner wall 51, as part of the first recess 12. Furthermore, fitting recesses 12b are formed as part of the first recess 12 on the outer ends of the first protrusion 13 in the longitudinal direction of the first connector 10.

[0052] The first terminal 61 is a component integrally formed by punching, bending, and other processes on a conductive metal plate, and comprises a retained portion 63, a tail portion 62 as a substrate connection portion connected to the lower end of the retained portion 63, an outer connection portion 65 connected to the upper end of the retained portion 63, and a lower connection portion 64 having a substantially U-shaped side profile connected to the lower end of the outer connection portion 65, wherein a contact portion 65a is formed near the lower end of the outer connection portion 65 that bulges inward in the width direction of the first connector 10, and further comprises an inner connection portion 66 connected to the tip of the lower connection portion 64. The inner connection portion 66 is bent and connected to the lower connection portion 64, extends upward (in the positive Z-axis direction), and near its upper end, a contact portion 66a is formed that bulges outward in the width direction of the first connector 10. The contact portion 66a, like the contact portion 65a of the outer connection portion 65, is a portion that contacts the second terminal 161 of the second connector 101, which will be described later. In other words, the first terminal 61 in this embodiment is configured to have contact portions 65a of the outer connection portion 65 and contact portions 66a of the inner connection portion 66 that face each other, and to make two-point contact with the second terminal 161. When the first terminal 61 is attached to the first housing 11, the contact portions 65a of the outer connection portion 65 and the contact portions 66a of the inner connection portion 66 protrude into the inner recessed groove portion 12a and face each other.

[0053] The first terminal 61 is then press-fitted into the first signal terminal housing cavity 15 from the mounting surface 10b side, which is the lower surface (negative Z-axis direction surface) of the first connector 10, and the retained portion 63 is held in place from both sides by the inner sides of the first signal terminal housing outer cavity 15b, thereby fixing it to the first housing 11. Note that the first terminal 61 is not necessarily attached to the first housing 11 by press-fitting, but may be integrated with the first housing 11 by overmolding or insert molding. However, for the sake of explanation, the case in which the retained portion 63 is press-fitted into and held in the first signal terminal housing outer cavity 15b will be described here.

[0054] Furthermore, the tail portion 62 is bent and connected to the retained portion 63, extending outward in the left-right direction (Y-axis direction), that is, in the width direction of the first connector 10, and is connected to a connection pad connected to a conductive trace on the first substrate by soldering or the like. The conductive trace may be a power line that supplies power, but is typically a signal line. Furthermore, this explanation assumes that the signal line does not transmit high-frequency signals, but rather transmits signals of a normal frequency lower than high-frequency signals (for example, a frequency of less than 10 [GHz]). The tail portion 62 is visible when viewed from the mating direction of the first connector 10, that is, when viewed from the mating surface 10a side.

[0055] The first high-frequency terminal 71 is a component integrally formed by punching, bending, or other processing on a conductive metal plate, and comprises a retained portion 73, a tail portion 72 which serves as a substrate connection portion connected to the lower end of the retained portion 73, and an upper connection portion 75 which is connected to the upper end of the retained portion 73.

[0056] The retained portion 73 extends in the vertical direction (Z-axis direction) and is the portion that is press-fitted into and held within the first high-frequency terminal housing groove 16a. As described above, the first high-frequency terminal support portions 16 are arranged so that the openings of their respective first high-frequency terminal housing grooves 16a face in opposite directions, so the first high-frequency terminals 71 whose retained portions 73 are held within the first high-frequency terminal housing grooves 16a also face in opposite directions. The first high-frequency terminals 71 are not necessarily attached to the first housing 11 by press-fitting, but may be integrated with the first housing 11 by overmolding or insert molding. However, for the sake of explanation, the case in which the retained portion 73 is press-fitted into and held within the first high-frequency terminal housing groove 16a will be described here.

[0057] Furthermore, the tail portion 72 is bent and connected to the retained portion 73, extending in the left-right direction (Y-axis direction), that is, toward the center of the width direction of the first connector 10, and is connected to a connection pad connected to a conductive trace on the first substrate by soldering or the like. The conductive trace is a signal line, and is typically described as transmitting a high-frequency signal with a high frequency (for example, a frequency of 10 GHz or higher), such as an RF signal.

[0058] Furthermore, the upper connecting portion 75 is curved in a roughly S-shape when viewed from the longitudinal direction of the first connector 10, and the portion that curves outward toward the center in the width direction of the first connector 10 functions as a contact portion 75a. This contact portion 75a is the portion that contacts the second high-frequency terminal 171 of the second connector 101, which will be described later.

[0059] The first high-frequency terminal 71 is press-fitted from the mounting surface 10b side into the first high-frequency terminal housing groove 16a of the first high-frequency terminal support portion 16 located within the mating recess 12b, and the retained portion 73 is held from both sides by the inner sides of the first high-frequency terminal housing groove 16a, thereby fixing it to the first housing 11. In this state, that is, with the first high-frequency terminal 71 loaded into the first housing 11, the contact portions 75a of the pair of first high-frequency terminals 71 face in opposite directions.

[0060] The first connector 10 is then mounted on the surface of the first substrate by applying a first solder sheet (not shown) as a solder sheet to the mounting surface 10b side of the connector 10, and by heating and melting the first solder sheet in a heating furnace or the like, it is fixed and mounted on the surface of the first substrate. The means for connecting the first shield 50, the first terminal 61, the first high-frequency terminal 71, etc. to the connection pads of the first substrate are not necessarily limited to the application of a solder sheet, but may also be the application of solder paste, transfer of solder paste, dipping, jet soldering, etc. However, for the sake of explanation, the case in which a solder sheet is used will be described here.

[0061] The first solder sheet includes a pair of elongated strip-shaped long side portions that extend linearly and continuously in the longitudinal direction of the first connector 10, a pair of elongated strip-shaped short side portions that extend linearly and continuously in the width direction of the first connector 10, and a plurality of rectangular short portions whose long side extends in the width direction of the first connector 10 and whose short side extends in the longitudinal direction of the first connector 10. It is desirable that both ends of each short side portion are connected to the long side portions. Furthermore, the long side portions and short side portions do not necessarily have to extend continuously, and may be intermittent, but here they will be described as extending continuously.

[0062] The pair of long sides are attached to the lower surface of the flange portion 54 corresponding to the long side portion 50a of the first shield 50, and the pair of short sides are attached to the lower surface of the flange portion 54 corresponding to the short side portion 50b of the first shield 50. In addition, each short portion is attached to the lower surface of the tail portion 62 of each first terminal 61 and the lower surface of the tail portion 72 of each first high-frequency terminal 71, respectively.

[0063] When the first solder sheet applied in this manner is heated and melted, and the first connector 10 is mounted on the surface of the first substrate, the flange portion 54, which is continuously connected around the entire circumference of the first shield 50, is connected to the connection pad on the surface of the first substrate without any gaps to the lower end of the outer wall 52, which is continuous around the entire circumference of the first shield 50. Therefore, the strength of the first shield 50 connected to the connection pad on the surface of the first substrate is high, and consequently, the strength of the entire first connector 10, whose outer circumference is surrounded by the first shield 50, is high. Furthermore, the electromagnetic shielding effect exhibited by the first shield 50, which is connected to the connection pad on the surface of the first substrate without any gaps, is very high, and the first connector 10, whose outer circumference is surrounded by the first shield 50, is very effectively electromagnetically shielded. In particular, because the lower surface of the flange portion 54 is very smooth, the strength of the first shield 50 connected to the connection pad on the surface of the first substrate can be made extremely high, and since there is no gap between it and the connection pad on the surface of the first substrate, the electromagnetic shielding effect can also be made extremely high.

[0064] Thus, because the first connector 10 has high strength and high electromagnetic shielding effect, it can transmit high-frequency signals even when miniaturized and low-profile. For example, even if the dimensions of the first connector 10 in the longitudinal, width, and height directions are set to 3.3 mm or less, 2.3 mm or less, and 0.7 mm or less, the first high-frequency terminal 71 can transmit high-frequency signals of about 60 GHz.

[0065] Next, the configuration of the second connector 101 will be described.

[0066] Figure 4 is a perspective view of the second connector in this embodiment, Figure 5 is a three-view drawing of the second connector in this embodiment, and Figure 6 is a bottom view of the second connector in this embodiment. In Figure 4, (a) is a view from diagonally above, and (b) is a view from diagonally below. In Figure 5, (a) is a top view, (b) is a side view, and (c) is a front view.

[0067] The second connector 101 in this embodiment has a second outer shield 150, which is a shield formed by punching, drawing, or other processing on a conductive metal plate, and a second housing 111, which is a housing integrally formed from an insulating material such as synthetic resin. The second housing 111 has a flat bottom plate 118, a second protrusion 112 which is a convex portion that protrudes upward from the upper surface of the bottom plate 118 at the longitudinal center of the second connector 101, and a pair of protruding ends 122 which protrude upward from the upper surface of the bottom plate 118 at both ends in the longitudinal direction (X-axis direction) of the second connector 101. The second protrusion 112 is narrower than the protruding ends 122 and is located inward in the width direction (Y-axis direction) of the second connector 101 than both ends of the protruding ends 122.

[0068] The second protrusion 112 is a roughly rectangular parallelepiped member extending in the longitudinal direction of the second connector 101. A groove-shaped central groove 112b is formed in the center in the width direction, recessing downward from the upper surface. The left and right sides of the central groove 112b form terminal support walls 112a that support the second terminal 161 as the mating terminal. The second terminals 161 are arranged in a number corresponding to the pitch of the first terminals 61, such that at least a portion of them is exposed on the surface of the terminal support walls 112a. In other words, multiple second terminals 161 are arranged along each terminal support wall 112a, forming a pair of parallel terminal groups (mating terminal groups).

[0069] Each protruding end 122 includes an outer wall surface facing outward in the longitudinal direction and both sides in the width direction of the second connector 101, an upper surface 122b facing the mating surface 101a side of the second connector 101, and an inner wall surface 122c facing inward in the longitudinal direction of the second connector 101. Each protruding end 122 is spaced apart from both ends of the second protrusion 112 in the longitudinal direction. A second high-frequency terminal support portion 116 is formed on each protruding end 122 as a support portion. The second high-frequency terminal support portion 116 has a second high-frequency terminal housing groove 116a that extends in the vertical direction and has a roughly U-shape when viewed from above. Furthermore, the second high-frequency terminal support portions 116 are arranged such that the openings of their respective second high-frequency terminal housing grooves 116a face in opposite directions. Moreover, as shown in Figure 5(a), when viewed from above, that is, in a plan view, they are arranged to be point-symmetric with respect to the center of the second connector 101, and are offset outward in the width direction, spaced apart from the center in the width direction of the second connector 101. The second high-frequency terminal 171 is housed in the second high-frequency terminal housing groove 116a. Below and in front of the second high-frequency terminal housing groove 116a, a second high-frequency terminal housing opening 116b is formed, which penetrates the bottom plate 118 in the thickness direction. Furthermore, at each protruding end 122, a first high-frequency terminal housing recess 116c is formed in front of the second high-frequency terminal housing groove 116a, extending from the second high-frequency terminal housing opening 116b to the upper surface 122b and opening to the upper surface 122b, serving as a mating terminal housing recess.

[0070] The second shield 150 is a component integrally formed from a conductive metal plate by processes such as punching and drawing, and is a curved component that extends in the mating direction of the second connector 101; therefore, its surface can be said to be an extended surface. Furthermore, in plan view, the second shield 150 is a roughly rectangular frame-shaped component that surrounds the periphery of the second connector 101 and encircles the periphery of the second housing 111. The second shield 150 includes a pair of long sides 150a that extend linearly in the longitudinal direction of the second connector 101, a pair of short sides 150b that extend linearly in the width direction of the second connector 101, and four corner portions 150c that are curved at approximately 90 degrees, connecting one end of the long sides 150a and one end of the short sides 150b.

[0071] Furthermore, the second shield 150 includes an outer wall 152, an inner wall 151 as a second inner shield, and an upper wall 153. The outer wall 152 is a continuous wall around its entire circumference. The upper wall 153 is connected to the upper end of the outer wall 152 near each short side portion 150b, the corner portions 150c at both ends of the short side portions 150b, and near both ends of each long side portion 150a, and is formed to cover at least a portion, preferably more than half, of the upper surface 122b of the protruding end portion 122. The upper wall 153 has a first high-frequency terminal housing opening 153a formed therein, which corresponds to the first high-frequency terminal housing recess 116c. Furthermore, the inner wall 151 extends downward, with its upper end connected to the longitudinal inner end of the second connector 101 on the upper wall 153, and is formed to cover at least a portion, preferably almost the entire, of the inner wall surface 122c of the protruding end 122. A curved upper wall connection portion 151a is formed at the upper end of the inner wall 151, which is connected to the upper wall 153, and a tail portion 151b, which serves as a substrate connection portion and is curved so that its tip faces inward in the longitudinal direction of the second connector 101, is connected at the lower end of the inner wall 151. The tail portion 151b has a lower surface parallel to the surface of the second substrate and is connected to a connection pad on the surface by soldering or the like. The connection pad is typically connected to the ground line. The space surrounded by the outer wall 152 and the inner wall 151 corresponding to the pair of long sides 150a becomes a second recess 113 into which the first protrusion 13 of the first connector 10 is inserted and accommodated.

[0072] A flange portion 154, which is a flat portion, is connected to the lower end of the outer wall 152 via a curved portion 152a that is curved at approximately 90 degrees. The curved portion 152a and the flange portion 154 are continuously connected to the lower end of the outer wall 152 around its entire circumference. In the example shown in the figure, several small notches 154a are formed in the flange portion 154, but these notches 154a can be omitted as appropriate.

[0073] The flange portion 154 functions as a substrate connection portion, with its lower surface parallel to the surface of the second substrate, and is connected to a connection pad on the surface by soldering. The connection pad is typically connected to the ground line. Furthermore, the outer wall 152 is a continuous wall around its entire circumference, and its lower end is a continuous member like the flange portion 154, and in cross-section it is connected to a member extending in a direction perpendicular to the outer wall 152, so it is relatively rigid and resistant to deformation. In this embodiment, an example is shown where the flange portion 154 is continuously connected to the lower end of the outer wall 152 around its entire circumference, but if relatively high rigidity is not required, it may be connected to only a part of it.

[0074] Furthermore, the outer wall 152 corresponding to the long side portion 150a and the short side portion 150b may have an outwardly projecting engaging projection 152c. The engaging projection 152c is the portion that engages with and contacts an engaging projection 51c formed on the inner wall 51 of the first shield 50 provided by the first connector 10 when the first connector 10 and the second connector 101 are fitted together, and functions as a contact portion, extending linearly in the longitudinal and width directions of the second connector 101. When describing the range from the location where the engaging projection 152c as a contact portion is formed on the outer wall 152 to the flange portion 154 as a substrate connection portion, it is described as the main body portion.

[0075] The second shield 150 is integrated with the second housing 111 by overmolding or insert molding. In this embodiment, the second housing 111 is integrally molded with the second shield 150. That is, the second housing 111 is molded by filling an insulating material such as synthetic resin into the cavity of a mold in which the second shield 150 has been pre-set, and is integrally connected with the second shield 150 at the protruding end 122.

[0076] The second terminal 161 is a component integrally formed by punching, bending, and other processes on a conductive metal plate, and comprises an outer connecting portion 165 extending in the vertical direction (Z-axis direction), a tail portion 162 as a substrate connecting portion connected to the lower end of the outer connecting portion 165, an upper connecting portion 164 connected to the upper end of the outer connecting portion 165, and an inner connecting portion 166 connected to the lower end of the upper connecting portion 164 and facing the outer connecting portion 165. The second terminal 161 is then integrated with the second housing 111 by overmolding or insert molding. That is, the second housing 111 is molded by filling the cavity of a mold, in which the second terminal 161 is pre-set, with an insulating material such as synthetic resin.

[0077] As a result, the second terminal 161 is integrally attached to the terminal support wall 112a such that at least a portion of it is embedded within the terminal support wall 112a of the second protrusion 112 in the second housing 111, and at least a portion of the surfaces of the outer connection portion 165, the upper connection portion 164, and the inner connection portion 166 are exposed on the outer, upper, and inner surfaces of the terminal support wall 112a. The surfaces of the outer connection portion 165 and the inner connection portion 166 function as contact portions and make contact with the first terminal 61 provided on the first connector 10. The tail portion 162 extends outward in the width direction of the second housing 111 from the terminal support wall 112a and is connected to a connection pad connected to a conductive trace on the second substrate by soldering or the like. The tail portion 162 is positioned to overlap with the tail portion 151b of the inner wall 151 when viewed from the longitudinal direction (X-axis direction) of the second connector 101. The conductive trace may be a power line supplying power, but is typically a signal line. Furthermore, this explanation assumes that the signal line does not transmit high-frequency signals, but rather signals of a normal frequency lower than high-frequency signals (for example, a frequency of less than 10 GHz).

[0078] Furthermore, the second terminal 161 does not necessarily have to be integrated with the second housing 111 by overmolding or insert molding; it may also be attached to the second housing 111 by press-fitting or the like. However, for the sake of explanation, the case in which it is integrated with the second housing 111 by overmolding or insert molding will be described here.

[0079] The second high-frequency terminal 171 is a component integrally formed by punching, bending, or other processing on a conductive metal plate, and comprises a retained portion 173, a tail portion 172 which serves as a substrate connection portion connected to the lower end of the retained portion 173, and an upper connection portion 175 which is connected to the upper end of the retained portion 173.

[0080] The retained portion 173 extends in the vertical direction and is press-fitted into the second high-frequency terminal housing groove 116a for retention. As described above, the second high-frequency terminal support portions 116 are arranged so that the openings of their respective second high-frequency terminal housing grooves 116a face in opposite directions. Therefore, the second high-frequency terminals 171, with the retained portion 173 held within the second high-frequency terminal housing groove 116a, also face opposite directions. The second high-frequency terminals 171 are not necessarily attached to the second housing 111 by press-fitting; they may be integrated with the second housing 111 by overmolding or insert molding. However, for the sake of explanation, the case in which the retained portion 173 is press-fitted into the second high-frequency terminal housing groove 116a for retention will be described here.

[0081] Furthermore, the tail portion 172 is bent and connected to the retained portion 173, extending in the left-right direction (Y-axis direction), that is, toward the center of the width direction of the second connector 101, and is connected to a connection pad connected to a conductive trace on the second substrate by soldering or the like. The conductive trace is a signal line, and is typically described as transmitting a high-frequency signal with a high frequency (for example, a frequency of 10 GHz or higher), such as an RF signal.

[0082] Furthermore, the upper connecting portion 175 is curved in a roughly S-shape when viewed from the longitudinal direction of the second connector 101, and the portion that curves outward toward the center in the width direction of the second connector 101 functions as a contact portion 175a. This contact portion 175a is the portion that contacts the first high-frequency terminal 71 provided on the first connector 10.

[0083] The second high-frequency terminal 171 is press-fitted from the mounting surface 101b side into the second high-frequency terminal housing groove 116a of the second high-frequency terminal support portion 116 located at the protruding end portion 122, and the retained portion 173 is held from both sides by the inner sides of the second high-frequency terminal housing groove 116a, thereby fixing it to the second housing 111. In this state, that is, with the second high-frequency terminal 171 loaded into the second housing 111, the contact portions 175a of the pair of second high-frequency terminals 171 face in opposite directions.

[0084] In the example shown in the figure, the second high-frequency terminal 171 is formed to have the same dimensions and shape as the first high-frequency terminal 71. Therefore, the first high-frequency terminal 71 can be used as the second high-frequency terminal 171.

[0085] The second connector 101 is then mounted on the surface of the second substrate by applying a second solder sheet (not shown) as a solder sheet to the mounting surface 101b side of the second connector 101, and by heating and melting the second solder sheet using a heating furnace or the like, it is fixed and mounted on the surface of the second substrate. The means for connecting the second shield 150, second terminal 161, second high-frequency terminal 171, etc. to the connection pads of the second substrate are not necessarily limited to the application of a solder sheet, but may also be the application of solder paste, transfer of solder paste, dipping, jet soldering, etc. However, for the sake of explanation, the case in which a second solder sheet is used will be described here.

[0086] The second solder sheet includes a pair of elongated strip-shaped long side portions extending linearly and continuously in the longitudinal direction of the second connector 101, a plurality of elongated strip-shaped short side portions extending linearly and continuously in the width direction of the second connector 101, and a plurality of rectangular short portions whose long side extends in the width direction of the second connector 101 and whose short side extends in the longitudinal direction of the second connector 101. It is desirable that both ends of each short side portion are connected to the long side portions. Furthermore, the long side portions and short side portions do not necessarily have to extend continuously and may be intermittent, but here they will be described as extending continuously.

[0087] The pair of long sides are attached to the lower surface of the flange portion 154 corresponding to the long side portion 150a of the second shield 150, the pair of short sides are attached to the lower surface of the flange portion 154 corresponding to the short side portion 150b of the second shield 150, and the other pair of short sides are attached to the lower surface of the tail portion 151b of the inner wall 151. In addition, each short portion is attached to the lower surface of the tail portion 162 of each second terminal 161 and the lower surface of the tail portion 172 of each second high-frequency terminal 171, respectively.

[0088] When the second solder sheet applied in this manner is heated and melted, and the second connector 101 is mounted on the surface of the second substrate, the curved portion 152a and flange portion 154, which are continuously connected around the entire circumference of the second shield 150, are connected to the connection pads on the surface of the second substrate without any gaps to the lower end of the outer wall 152, which is continuous around the entire circumference. Therefore, the strength of the second shield 150 connected to the connection pads on the surface of the second substrate becomes high, and consequently, the overall strength of the second connector 101, whose outer circumference is surrounded by the second shield 150, becomes high. Furthermore, the electromagnetic shielding effect exerted by the second shield 150, which is connected to the connection pads on the surface of the second substrate without any gaps, becomes very high, and the second connector 101, whose outer circumference is surrounded by the second shield 150, is electromagnetically shielded very effectively. In particular, because the lower surface of the flange portion 154 is highly smooth, the strength of the second shield 150 connected to the connection pad on the surface of the second substrate can be made extremely high, and since no gap is created between it and the connection pad on the surface of the second substrate, the electromagnetic shielding effect can also be made extremely high.

[0089] Furthermore, each of the protruding ends 122 at both longitudinal ends of the second connector 101 is covered by the outer wall 152 of the second shield 150 on the outer wall surfaces facing outward in the longitudinal direction and on both sides in the width direction of the second connector 101, the upper surface 122b facing the mating surface 101a of the second connector 101 is covered by the upper wall 153 of the second shield 150, and the inner wall surface 122c facing inward in the longitudinal direction of the second connector 101 is covered by the inner wall 151 of the second shield 150, so that the entire perimeter is shielded. As a result, the second high-frequency terminal 171, which is supported by the second high-frequency terminal support portion 116 formed on the protruding end 122, is very effectively electromagnetically shielded.

[0090] Thus, because the second connector 101 has high strength and high electromagnetic shielding effect, it can transmit high-frequency signals even when miniaturized and low-profile. For example, even if the dimensions of the second connector 101 in the longitudinal, width, and height directions are set to 2.9 mm or less, 1.9 mm or less, and 0.7 mm or less, the second high-frequency terminal 171 can transmit high-frequency signals of about 60 GHz.

[0091] Next, the operation of mating the first connector 10 and the second connector 101 of the above configuration will be described.

[0092] Figure 7 is a plan view of the initial mating state of the first connector and the second connector in this embodiment, Figure 8 is a cross-sectional view of the initial mating state of the first connector and the second connector in this embodiment, Figure 9 is a perspective view of the completed mating state of the first connector and the second connector in this embodiment, Figure 10 is a plan view of the completed mating state of the first connector and the second connector in this embodiment, Figure 11 is a side cross-sectional view of the completed mating state of the first connector and the second connector in this embodiment, and Figure 12 is a cross-sectional view of the completed mating state of the first connector and the second connector in this embodiment. Note that in Figure 8, (a) is a cross-sectional view taken along the CC arrow in Figure 7, and (b) is a cross-sectional view taken along the DD arrow in Figure 7; in Figure 11, (a) is a cross-sectional view taken along the EE arrow in Figure 10, and (b) is a cross-sectional view taken along the FF arrow in Figure 10; in Figure 12, (a) is a cross-sectional view taken along the GG arrow in Figure 10, and (b) is a cross-sectional view taken along the HH arrow in Figure 10.

[0093] When mating the first connector 10 and the second connector 101, first the operator positions the mating surface 10a of the first connector 10 and the mating surface 101a of the second connector 101 facing each other. When the position of the first protrusion 13 of the first connector 10 aligns with the position of the second recess 113 of the second connector 101, and the position of the protruding end 122 of the second connector 101 aligns with the position of the corresponding mating recess 12b of the first connector 10, the alignment of the first connector 10 and the second connector 101 is completed.

[0094] In this state, when the first connector 10 and / or the second connector 101 are moved toward the mating side, i.e., in the mating direction, the second shield 150 of the second connector 101 is inserted into the housing portion 50d of the first shield 50 of the first connector 10, the first protrusion 13 of the first connector 10 is inserted into the second recess 113 of the second connector 101, and the protruding end 122 of the second connector 101 is inserted into the mating recess 12b of the first connector 10.

[0095] Furthermore, since the mating surface 10a of the first connector 10 has a connecting portion 53 of the first shield 50 surrounding it, and the mating surface 101a of the second connector 101 has an outer wall 152 and an upper wall 153 of the second shield 150, even if the mating surface 10a of the first connector 10 and the mating surface 101a of the second connector 101 come into contact during mating, they will not be damaged or broken.

[0096] Furthermore, in the initial mating state shown in Figures 7 and 8, that is, when the portion near the mating surface 101a of the second shield 150 of the second connector 101 has slightly entered the housing portion 50d of the first shield 50 of the first connector 10, as shown in Figures 8(a) and (b), the portion of the outer wall 152 near the mating surface 101a at the corner portion 150c of the second shield 150 abuts against the gently sloping surface portion 51h near the upper end (near the mating surface 10a) of the mating positioning portion 51b at the corner portion 50c of the first shield 50, and is inserted into the housing portion 50d while being guided by contact with the gently sloping surface portion 51h. This positions the second connector 101 relative to the first connector 10. Note that the corner portion 50c included in the mating positioning portion 51b is integrated with the corner portion 17 of the first housing 11, and the insulating material constituting the first housing 11 is filled on the back side, making it robust. Therefore, because the mating positioning portion 51b is highly robust, it will not deform or break even if it comes into contact with the mating surface 101a of the second shield 150 of the second connector 101.

[0097] Furthermore, the portion of the outer wall 152 near the fitting surface 101a at the corner portion 150c of the second shield 150 comes into contact with the gently sloping surface portion 51h, and then comes into contact with the inclined surface portion 51d of the fitting spring portion 51a of the first shield 50. This reduces the damage that the fitting spring portion 51a receives.

[0098] Next, as shown in Figures 9-12, once the mating of the first connector 10 and the second connector 101 is complete, the first terminal 61 and the second terminal 161 become electrically connected, and the first high-frequency terminal 71 and the second high-frequency terminal 171 become electrically connected.

[0099] Specifically, the pair of terminal support walls 112a of the second protrusion 112 of the second housing 111 are inserted into the pair of internal recessed grooves 12a of the first housing 11, and as shown in Figure 12(a), the contact portion 65a of the outer connection portion 65 and the contact portion 66a of the inner connection portion 66 of the first terminal 61, which protrude into the internal recessed grooves 12a and face each other, come into contact with the outer connection portion 165 and the inner connection portion 166 of the second terminal 161, which are exposed on the outer and inner surfaces of the terminal support wall 112a.

[0100] In this case, the lower connection portion 64 of the first terminal 61 and its vicinity have a roughly U-shaped form and are elastically deformable, so the distance between the contact portion 65a of the outer connection portion 65 and the contact portion 66a of the inner connection portion 66, which face each other, can be elastically expanded. As a result, the distance between the contact portion 65a of the outer connection portion 65 and the contact portion 66a of the inner connection portion 66 is elastically widened by the second terminal 161 inserted between them, and in reaction, the second terminal 161 is elastically sandwiched from both sides by the contact portion 65a of the outer connection portion 65 and the contact portion 66a of the inner connection portion 66. As a result, the contact portion 65a of the outer connection portion 65 of the first terminal 61 and the outer connection portion 165 of the second terminal 161, as well as the contact portion 66a of the inner connection portion 66 of the first terminal 61 and the inner connection portion 166 of the second terminal 161, maintain contact and do not separate even when subjected to shock or vibration, thus maintaining a stable conductive state. Furthermore, the corresponding first terminal 61 and second terminal 161 are in a so-called two-point contact state, and even if contact at one point is lost, contact at the other point is maintained, thus stably maintaining the contact state.

[0101] Furthermore, the first high-frequency terminal support portion 16 located within the mating recess 12b is inserted into the first high-frequency terminal housing recess 116c of the protruding end portion 122, and as shown in Figure 12(b), the contact portion 75a of the first high-frequency terminal 71 and the contact portion 175a of the second high-frequency terminal 171 come into contact. At this time, the contact portions 75a and 175a of the first high-frequency terminal 71 and the second high-frequency terminal 171 are elastically deformable, so the curved upper connecting portions 75 and 175 themselves can be elastically displaced in the width direction of the first connector 10 and the second connector 101. As a result, the contact portions 75a of the first high-frequency terminal 71 and the contact portion 175a of the second high-frequency terminal 171, which are relative to each other, maintain contact and do not separate even when subjected to shock or vibration, thus maintaining a stable conductive state. Furthermore, the corresponding first high-frequency terminal 71 and second high-frequency terminal 171 are in contact at only one point, resulting in a so-called single-contact state. This prevents the formation of unintended stubs or divided circuits in the signal transmission line from the tail portion 72 of the first high-frequency terminal 71 to the tail portion 172 of the second high-frequency terminal 171. Consequently, the impedance of the transmission line is stable, and good SI characteristics can be obtained.

[0102] In this way, the first high-frequency terminal 71 and the second high-frequency terminal 171, which are in contact with each other, are continuously surrounded all around by the inner wall 51 and outer wall 52 of the first shield 50 and the inner wall 151 and outer wall 152 of the second shield 150, thus providing extremely effective shielding. Therefore, the impedance of the signal transmission line from the tail portion 72 of the first high-frequency terminal 71 to the tail portion 172 of the second high-frequency terminal 171 is stabilized, and good SI characteristics can be obtained.

[0103] Furthermore, when the second shield 150 of the second connector 101 is inserted into the housing portion 50d of the first shield 50 of the first connector 10, the outer surface of the outer wall 152 of the second shield 150 comes into contact with or close to the inner surface of the inner wall 51 of the first shield 50, and as shown in Figures 11(a) and 12(a), the outer wall 152 of the second shield 150, or the engaging projection 152c formed on the outer wall 152, engages with the engaging projection 51c formed on the inner wall 51 of the first shield 50, and they come into contact. Note that the fitting spring portion 51a of the inner wall 51 on which the engaging projection 51c is formed has both ends separated from the other parts by the slit portion 53a and is relatively flexible, so the engagement state with the engaging projection 152c of the outer wall 152 of the second shield 150 can be reliably maintained. This locks the first shield 50 and the second shield 150, preventing the mating state between the first connector 10 and the second connector 101 from being released. Furthermore, since the first shield 50 and the second shield 150 are in contact with each other and conduct electricity, becoming equipotential, the electromagnetic shielding performance is improved. The engaging projection 51c is the part that engages with and contacts the engaging projection 152c, but even if the outer wall 152 does not have the engaging projection 152c, and the surface of the outer wall 152 functions as the contact point with the engaging projection 152c, similar improvements in electromagnetic shielding performance can be achieved.

[0104] Next, the configuration of the plating layer formed on the stretched surface, which is the surface of the first shield 50 and the second shield 150, which are conductive members in this embodiment, will be described.

[0105] Figure 13 is a schematic cross-sectional view of the vicinity of the surface of the conductive member showing the configuration of the plating layer in this embodiment, Figure 14 is a diagram showing the results of a solder wetting spread experiment in this embodiment, and Figure 15 is a table showing the results of experiments in which the thickness of the second and third layers in this embodiment was varied.

[0106] In this embodiment, the surface vicinity of the first shield 50 and the second shield 150, which are conductive members, has a layered structure as shown in Figure 13.

[0107] In the figure, 91 is a conductive metal substrate that constitutes the first shield 50 and the second shield 150, which are conductive members, and is made of, for example, copper (Cu) or a copper alloy.

[0108] Furthermore, 92 is a plating layer formed on the surface of the metal substrate 91, and includes a first layer 92a, a second layer 92b, and a third layer 92c.

[0109] The first layer 92a is a nickel (Ni) or nickel alloy plating layer, and its thickness is preferably 1 to 3 μm. The first layer 92a has the function of preventing the diffusion of copper from the metal substrate 91 to the second layer 92b and the third layer 92c.

[0110] The second layer 92b is a plating layer of a platinum group metal or a platinum group metal alloy, and its thickness is preferably 2 nm or more. However, considering cost and other factors, it is preferable that the thickness be 200 nm or less, so it can be said that its thickness is preferably between 2 and 200 nm. Furthermore, from the viewpoint of sufficiently preventing interdiffusion between the metal of the first layer 92a and the metal of the third layer 92c, its thickness is more preferably between 5 and 25 nm. In addition, as the platinum group metal, any of the ruthenium (Ru), rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir), and platinum (Pt) belonging to the platinum group can be selected, but palladium is the most preferable. Furthermore, the platinum group metal alloy is an alloy containing 50% or more of any of ruthenium, rhodium, palladium, osmium, iridium, and platinum, but more preferably a palladium alloy containing 50% or more palladium (e.g., PdNi).

[0111] The third layer 92c is a gold or gold alloy plating layer, and its thickness is preferably 0.2 to 15 nm, and more preferably 0.5 to 8 nm. The gold alloy is a gold alloy containing 90% or more gold (e.g., AuCo, AuCu, AuNi, AuFe, etc.), but in the case of an alloy of gold and a platinum group metal, a gold alloy containing 20% ​​or more gold (e.g., AuPd, AuPt, etc.) is acceptable.

[0112] In this embodiment, the numerical ranges for the thicknesses of the second layer 92b and the third layer 92c are set based on experimental results (test results) as shown in the table in Figure 15. In Figure 15, the horizontal axis shows the numerical value [nm] for the thickness of the second layer 92b, and the vertical axis shows the numerical value [nm] for the thickness of the third layer 92c. In addition, each cell (square) in the table shows the evaluation of the test results for the contact resistance test, soldering strength test, and solder wettability test, indicated by the symbols ○, △, and ×. The symbol ○ means good, the symbol △ means somewhat good, and the symbol × means poor.

[0113] In the experiment, first, a plating layer 92 was formed on the surface of each test piece of a predetermined size made of a metal substrate 91, such that the thicknesses of the second layer 92b and the third layer 92c corresponded to values ​​for each cell. Then, contact resistance tests, mounting strength tests, and solder wetting spread tests were performed using each test piece. As shown in Figure 15, the thickness of the second layer 92b was varied in the range of 0 to 200 [nm], and the thickness of the third layer 92c was varied in the range of 0 to 20 [nm].

[0114] In the contact resistance test, the magnitude of the contact resistance on the surface of the plating layer 92 of each test piece was measured. Test pieces with a contact resistance below the first threshold were evaluated as good, those with a contact resistance greater than the first threshold but less than the second threshold were evaluated as somewhat good, and those with a contact resistance greater than or equal to the second threshold were evaluated as poor.

[0115] Furthermore, in the mounting strength test, another test piece was soldered to the surface of the plating layer 92 of each test piece, and a tensile force was applied to the other test piece. The magnitude of the tensile force at which the soldered portion broke was measured, and those with a tensile force of 1 or more than the first threshold were evaluated as good, those with a tensile force of 2 or more than the first threshold were evaluated as somewhat good, and those with a tensile force of less than the second threshold were evaluated as poor.

[0116] Furthermore, in the solder wetting and spreading test, as shown in Figure 14, several solder balls (e.g., particle size 0.6 mm) were placed on the surface of the plating layer 92 of each test piece, and the spreading diameter of the solder was measured after heating using a heating device (e.g., a solder reflow oven). A spreading diameter below the first threshold was evaluated as good, a spreading diameter greater than the first threshold but less than the second threshold was evaluated as somewhat good, and a spreading diameter greater than or equal to the second threshold was evaluated as poor.

[0117] As shown in Figure 15, the experimental results showed that if the thickness of the second layer 92b is within the range of 2 to 200 nm and the thickness of the third layer 92c is within the range of 0.2 to 15 nm, no defects are included in the evaluation of the test results, and therefore it is possible to use it as the conductive material, the second terminal 161. Furthermore, it was found that if the thickness of the third layer 92c is limited to the range of 0.5 to 8 nm, neither defects nor slightly good results are included in the evaluation of the test results, meaning that all test results are evaluated as good, which is more desirable. Although it can be inferred from Figure 15 that all test results would be evaluated as good even if the thickness of the second layer 92b is greater than 200 nm, considering costs and other factors, it is not practical to use a value greater than 200 nm, so the upper limit of the thickness of the second layer 92b was set to 200 nm here.

[0118] As shown in Figure 14, if the thickness of the third layer 92c, which is a gold or gold alloy plating layer, is thin, the solder spread diameter is small and the solder wettability decreases, that is, the solder does not spread easily, so solder rise can be suppressed and solder cannot crawl up to the engaging projection 51c, which is the contact part of the first shield 50 and the outer wall 152, which is the contact part of the second shield 150, or to the engaging projection 152c formed on the outer wall 152. On the other hand, if the solder wettability decreases, soldering the flange portion 54, which is the substrate connection part of the first shield 50 and the flange portion 154, which is the substrate connection part of the second shield 150, becomes difficult, the strength of the soldered part decreases, and the mounting strength of the flange portion 54 on the first substrate surface and the mounting strength of the flange portion 154 on the second substrate surface decreases. In addition, if the thickness of the third layer 92c, which is a gold or gold alloy plating layer, is thin, the contact resistance increases and the third layer 92c becomes more prone to wear. However, by forming a second layer 92b, which is a plating layer of a platinum group metal or platinum group metal alloy, with a thickness greater than a predetermined value beneath the third layer 92c, the contact resistance of the third layer 92c can be reduced, and wear can be prevented.

[0119] In this way, by setting the thickness of the third layer 92c to 0.2 to 15 nm and the thickness of the second layer 92b below the third layer 92c to 200 nm, it is possible to maintain appropriate solder wettability, improve the connection strength between the flange portion 54 of the first shield 50 and the flange portion 154 of the second shield 150, suppress solder rise without forming a solder barrier, and reduce the contact resistance of the engaging projection 51c of the first shield 50 and the engaging projection 152c of the second shield 150.

[0120] In this embodiment, the thicknesses of the second layer 92b and the third layer 92c were measured using X-ray electron spectroscopy, commonly known as XPS. XPS is a method for measuring the surface layer components of a sample, and can generally measure substances at a depth of about 0.2 to 6 nm from the surface. The surface layer of the sample is also removed by ion sputtering (sputter etching using ions). Ion sputtering can remove about 0.2 to 1 nm. The amount of removal is adjustable.

[0121] In this embodiment, the measurement was performed by repeatedly measuring the surface material of the sample using XPS, removing the surface layer of the sample by ion sputtering, and measuring the surface material of the sample using XPS. For example, if the third layer 92c, which is the surface layer, is measured using XPS to detect gold or a gold alloy, and then the third layer 92c, which is the surface layer, is removed by 0.2 nm using ion sputtering, and subsequently measured using XPS to detect gold or a gold alloy, then it can be determined that the thickness of the third layer 92c, which is made of gold or a gold alloy, is 0.2 nm or more.

[0122] Thus, in this embodiment, the first connector 10 comprises a first housing 11 and a first shield 50. The first shield 50 includes a main body portion that extends from the location where the engaging projection 51c as a contact portion is formed on the inner wall 51, including the connecting portion 53 and the outer wall 52, to the flange portion 54 which serves as a substrate connection portion, a flange portion 54 located at one end of the main body portion, and an engaging projection 51c located at the other end of the main body portion, surrounding the periphery of the first connector 10, and the main body portion, flange portion 54 and engaging projection 51c each include an exposed surface that is exposed from the first housing 11, and the flange portion The 54 is formed around the entire circumference of the first connector 10, and the main body portion, flange portion 54 and engaging projection portion 51c each include a metal substrate 91 and a first layer 92a, a second layer 92b, and a third layer 92c formed on the metal substrate 91, respectively. The first layer 92a is a nickel or nickel alloy plating layer, the second layer 92b is a platinum group metal or platinum group metal alloy plating layer, and the third layer 92c is a gold or gold alloy plating layer, with a thickness of 0.2 to 15 nm.

[0123] Furthermore, in this embodiment, the second connector 101 comprises a second housing 111 and a second shield 150. The second shield 150 includes a main body portion extending from the location where the engaging projection 152c as a contact portion is formed on the outer wall 152 to the flange portion 154 as a substrate connection portion, a flange portion 154 located at one end of the main body portion, and an engaging projection 152c located at the other end of the main body portion, surrounding the periphery of the second connector 101, and the main body portion, flange portion 154 and engaging projection 152c each include an exposed surface that is exposed from the second housing 111, and the flange portion 154 is The connector 101 is formed around its entire circumference, and the main body, flange portion 154, and engaging projection 152c each include a metal substrate 91 and a first layer 92a, a second layer 92b, and a third layer 92c formed on the metal substrate 91, respectively. The first layer 92a is a nickel or nickel alloy plating layer, the second layer 92b is a platinum group metal or platinum group metal alloy plating layer, and the third layer 92c is a gold or gold alloy plating layer, with a thickness of 0.2 to 15 nm.

[0124] This allows for maintaining adequate solder wettability and improving the connection strength of the flange portions 54 and 154, while preventing solder creep and reducing contact resistance at the engaging protrusions 51c and 152c without forming a solder barrier between the flange portions 54 and 154 and the engaging protrusions 51c and 152c. Therefore, since it is not necessary to form a solder barrier on the minute-sized first shield 50 and second shield 150 used in the extremely small and low-profile first connector 10 and second connector 101, the structure of the first connector 10 and second connector 101 can be simplified, costs can be reduced, and reliability can be improved.

[0125] Furthermore, the first housing 11 is integrally molded with the first shield 50, and the second housing 111 is integrally molded with the first shield 150. Furthermore, the flange portions 54 and 154 are soldered to the first and second substrates around their entire circumference. Furthermore, the flange portions 54 and 154 are continuous around their entire circumference. Furthermore, engaging protrusions 51c and 152c may be formed on the four sides of the first shield 50 and the second shield 150. Furthermore, a connecting portion 53 that curves toward the inside of the first connector 10 may be formed at the upper end of the first shield 50. Furthermore, the plating layer 92 is formed over the entire first shield 50 and the second shield 150. Furthermore, the thickness of the third layer 92c is more preferably 0.5 to 8 [nm]. Furthermore, the platinum group metal is preferably palladium or a palladium alloy, and the thickness of the second layer 92b is 2 to 200 [nm].

[0126] This specification describes features relating to preferred and exemplary embodiments. Various other embodiments, modifications, and variations within the scope and spirit of the claims attached herein will be readily apparent to those skilled in the art by reviewing this specification. [Industrial applicability]

[0127] This disclosure can be applied to connectors and connector pairs. [Explanation of Symbols]

[0128] 10. First connector 10a, 101a mating surface 10b, 101b Implementation side 11 Housing 1 12 First recess 12a Inner groove 12b Fitting recess 12c Outer groove 13. First protrusion 13a Outside convex part 13b Inner protrusion 13c Lateral convex part 13d Second Shield Housing Slit 15. Cavity housing the first signal terminal 15a Inner cavity housing the first signal terminal 15b Outer cavity housing the first signal terminal 16 1st high frequency terminal support part 16a First high-frequency terminal housing groove 16b, 153a First high-frequency terminal housing aperture 17 Corner 17a Upper wall 17b Exterior wall 17c Inner wall 17d Side wall part 17d1 Recessed part 17e Shield housing 17h Locking protrusion 18, 118 bottom plate 18a Connection part 18b side recess 18c End recess 50 Shield 1 50a, 150a Long side 50b, 150b Short side 50c, 150c corner section 50d Storage area 51, 151 Inner wall 51a Mating spring section 51b Mating positioning section 51c, 152c Engagement protrusion 51d Slope section 51e Lower inner wall 51h Gentle slope section 51j Positioning lower part 51k locking recess 52, 152 Exterior wall 52a, 152a Curved section 53 Connecting part 53a Slit section 54, 154 Flange section 54a, 154a Notch 61 1st terminal 62, 72, 151b, 162, 172 Tail section 63, 73, 173 Retained part 64 Lower connection part 65, 165 Outer connection 65a, 66a, 75a, 175a contact part 66, 166 Inner connection part 71 1st high frequency terminal 75, 164, 175 Upper connection part 91, 862 Metal base material 92 Plating layer 92a 1st layer 92b 2nd layer 92c 3rd layer 101 Second connector 111 Second Housing 112 Second protrusion 112a Terminal support wall 112b Central groove 113 Second recess 116 2nd high frequency terminal support part 116a Second high-frequency terminal housing groove 116b Second high-frequency terminal housing aperture 116c First high-frequency terminal housing recess 122 Protruding end 122b Top surface 122c Inner wall surface 150 2nd Shield 151a Upper wall connection 153 Upper wall 161 2nd terminal 171 2nd high frequency terminal 861 terminal 861a Contact part 861b PCB connection section 861c Main Unit 863a Nickel plating layer 863b Palladium plating layer 863c Gold plating layer

Claims

1. (a) A connector comprising a housing and a shield, (b) The shield includes a main body, a substrate connection portion located at one end of the main body, and a contact portion located at the other end of the main body, and in a plan view, surrounds the periphery of the connector and housing. (c) The main body, the board connection portion and the contact portion each include an exposed surface exposed from the housing, (d) The substrate connection portion is formed around the entire circumference of the connector, (e) The main body portion extends from the contact portion to the substrate connection portion, and the main body portion, the substrate connection portion, and the contact portion each include a metal substrate and first to third plating layers formed on the metal substrate. (f) A connector characterized in that the first layer is a nickel or nickel alloy plating layer, the second layer is a plating layer that prevents interdiffusion between the metal of the first layer and the metal of the third layer, and is a palladium nickel alloy (PdNi) plating layer containing 50% or more palladium, and the third layer is a gold or gold alloy plating layer, and the thickness of the third layer is 0.2 to 15 nm.

2. The connector according to claim 1, wherein the housing is integrally molded with the shield.

3. The connector according to claim 1, wherein the board connection portion is soldered to the board around its entire circumference.

4. The connector according to claim 1, wherein the substrate connection portion is a flange that is continuous around the entire circumference.

5. The connector according to claim 1, wherein the contact portion can be formed on all four sides of the shield.

6. The connector according to claim 1, wherein a curved portion can be formed at the upper end of the shield, which curves toward the inside of the connector.

7. The connector according to claim 1, wherein the plating layer is formed over the entire shield.

8. The connector according to claim 1, wherein the thickness of the third layer is 0.5 to 8 nm.

9. The connector according to claim 1, wherein the thickness of the second layer is 2 to 200 nm.

10. A pair of connectors comprising a connector according to any one of claims 1 to 9 and a mating connector that mates with the connector.

11. (a) The mating connector comprises a housing and a shield, (b) The shield includes a main body, a substrate connection portion located at one end of the main body, and a contact portion located at the other end of the main body, and in a plan view, surrounds the periphery of the mating connector and housing, (c) The main body, the board connection portion and the contact portion each include an exposed surface exposed from the housing, (d) The substrate connection portion is formed around the entire circumference of the mating connector, (e) The main body portion extends from the contact portion to the substrate connection portion, and the main body portion, the substrate connection portion, and the contact portion each include a metal substrate and first to third plating layers formed on the metal substrate. (f) The connector pair according to claim 10, wherein the first layer is a nickel or nickel alloy plating layer, the second layer is a plating layer that prevents interdiffusion between the metal of the first layer and the metal of the third layer, and is a palladium-nickel alloy (PdNi) plating layer containing 50% or more palladium, and the third layer is a gold or gold alloy plating layer, and the thickness of the third layer is 0.2 to 15 nm.

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