Conveyor nozzle

Abstract

To provide a transportation nozzle that can be downsized and maintain a high adsorption performance for a transportation object.SOLUTION: A transportation nozzle includes a porous body part formed with sintered metal particles. The body part 11 includes a first surface 12a with air permeability and a second surface 12b continuous with the first surface 12a and surrounding the first surface 12a. On the second surface 12b, a low-air-permeable layer 12f which has a lower air permeability than the first surface 12a is formed in a low-air-permeable region contiguous with the first surface 12a. When air is sucked from the first surface 12a, a transportation object M can be adsorbed on the first surface 12a. Moreover, since the low-air-permeable region with the low-air-permeable layer 12f surrounding the first surface 12a is provided, the air suction force from the first surface 12a can be made greater.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a transfer nozzle. More specifically, it relates to a transfer nozzle used for transferring an IC chip or the like.

Background Art

[0002] For transferring a semiconductor IC chip, a nozzle that adsorbs and holds the semiconductor IC chip (hereinafter sometimes referred to as a transfer nozzle) is used. Among such transfer nozzles, those having a through-hole with an opening at the tip are used, and the semiconductor IC chip is transferred by the transfer nozzle by the following method (see FIG. 4).

[0003] First, the transfer nozzle N is placed at the position of the semiconductor IC chips M arranged on a tray T1 or the like (see FIG. 4(A)). When the tip of the transfer nozzle N is brought close to (or in contact with) the semiconductor IC chip M, air is sucked from the opening a at the tip through the through-hole h. Then, the semiconductor IC chip M can be adsorbed to the transfer nozzle N (see FIG. 4(B)). When the transfer nozzle 1 adsorbs the semiconductor IC chip M, the transfer nozzle N is moved to a tray T2 or the like where the semiconductor IC chip M is to be placed in the next step (see FIG. 4(C)). Then, when the tip of the transfer nozzle N (that is, the semiconductor IC chip M) is placed at the position where the semiconductor IC chip M is to be placed on the tray T2 or the like, the suction of air is stopped. Then, the semiconductor IC chip M is detached from the transfer nozzle N, and the semiconductor IC chip M is placed at a predetermined position on the tray T2 or the like (see FIG. 4(D)).

[0004] In the case of the above-described transfer nozzle N, in order to appropriately hold the semiconductor IC chip M, it is necessary to place the opening a at the tip of the transfer nozzle 1 at a desired position of the semiconductor IC chip M and suck air.

[0005] If the semiconductor IC chip M is of a certain size (for example, about 1.0 mm x 0.5 mm square), the semiconductor IC chip M can be properly held by the transport nozzle 1 even if the position of the opening a at the tip of the transport nozzle 1 is slightly off from the predetermined position (for example, off by about 0.25 mm).

[0006] In recent years, semiconductor IC chips M have become smaller, and the tolerance for misalignment of the opening a at the tip of the transport nozzle N has decreased. For example, for a semiconductor IC chip M measuring 0.2 mm x 0.1 mm, the misalignment of the opening a at the tip of the transport nozzle N from its predetermined position when the tip of the transport nozzle N is brought close to the semiconductor IC chip M must be 0.05 mm or less; otherwise, the semiconductor IC chip M cannot be properly held by the tip of the transport nozzle N. If the opening a at the tip of the transport nozzle N is misaligned from its predetermined position, the semiconductor IC chip M may be attracted at an angle, potentially causing transport failures of the semiconductor IC chip M in the next process.

[0007] To solve this problem, the technologies disclosed in Patent Documents 1 and 2 have been developed. Patent Documents 1 and 2 disclose a technology in which the surface for adsorbing parts and other objects in a transport nozzle is formed of a porous material, thereby increasing the surface area for air suction. With this configuration, air can be drawn in from the entire porous portion at the tip surface of the transport nozzle, so even if the position of the tip of the transport nozzle is slightly misaligned, a semiconductor IC chip can be properly adsorbed and held at the tip of the transport nozzle. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2019-111639 [Patent Document 2] Japanese Patent Publication No. 2007-283445 [Overview of the project] [Problems that the invention aims to solve]

[0009] Incidentally, as semiconductor IC chips become smaller, the space and location for transporting them also becomes smaller. In order to transport semiconductor IC chips into such narrow spaces, it is necessary to miniaturize the transport nozzle itself while maintaining suction performance. For this reason, the transport nozzle has a narrow tip, for example, an outer diameter of 100 μm or less, and a large suction surface area, for example, a suction surface area of ​​7850 μm. 2 The above is what is required.

[0010] In the transport nozzles described in Patent Documents 1 and 2, the porous material is placed in the through-holes of the transport nozzle so that when air is drawn in through the porous material, air is not drawn in from areas other than the suction surface that adsorbs objects. Specifically, the transport nozzle is made of a material with low permeability, and the porous material is placed in the through-holes of this transport nozzle so that areas other than the suction surface are covered (not exposed). In such a structure, in order to make the transport nozzle itself thin while increasing the suction surface, the thickness of the transport nozzle (the thickness of the part covering areas other than the suction surface) must be made as thin as possible.

[0011] However, in the method of inserting a porous material into a through-hole of a conveying nozzle formed from another material, as in the technology of Patent Document 2, reducing the thickness of the conveying nozzle wall reduces its strength, and it is also difficult to manufacture conveying nozzles with thin walls (for example, with a wall thickness of 0.025 mm or less). Therefore, it is difficult to manufacture conveying nozzles with an outer diameter of 100 μm or less at the tip using the technology of Patent Document 2.

[0012] On the other hand, if the transport nozzle is also formed from a porous material, as in the technology described in Patent Document 1, it may be possible to manufacture a transport nozzle with a relatively thin wall (for example, a wall thickness of about 10 μm). However, if the transport nozzle is made of a porous ceramic material, as in the technology described in Patent Document 1, the thinner the nozzle, the higher the air permeability of the wall, so the wall needs to be made to a certain thickness. Consequently, the thinner the transport nozzle, the larger the ratio of the wall thickness to the cross-sectional area of ​​the transport nozzle must be. Therefore, with the technology described in Patent Document 1, even if a transport nozzle with an outer diameter of 100 μm or less at the tip can be manufactured, the area of ​​the adsorption surface is 7850 μm. 2 The above items are difficult to manufacture.

[0013] In view of the above circumstances, the present invention aims to provide a conveying nozzle that can be miniaturized while maintaining high performance in adsorbing conveyed objects. [Means for solving the problem]

[0014] The conveying nozzle of the first invention has a porous body formed by sintering metal particles, the body having a first surface that is permeable and a second surface that is continuous with and surrounds the first surface, and a low-permeability layer is formed on the second surface in a low-permeability region continuous with the first surface that has lower permeability than the first surface. Furthermore, the low-permeability layer on the second surface is formed to be an integral structure with the main body by a non-permeable treatment that seals the pores on the surface of the second surface, which is achieved by surface polishing, strong acid immersion, or a combination of these treatments. The permeability of the low-permeability layer is 50% or less of that of the first surface of the main body, and is formed to have a permeability that does not reduce the adsorption performance of the first surface. It is characterized by the following: Second Invention The transport nozzle in the first invention is characterized in that the main body portion has a hollow portion that is recessed from the third surface located opposite to the first surface toward the first surface. Third Invention The transport nozzle, in the first invention, is characterized in that the first surface of the main body is provided with a recessed portion that is recessed from the first surface. [Effects of the Invention]

[0015] According to the first invention, if air is sucked from the first surface, an object can be adsorbed on the first surface. Moreover, since a low-airflow region having a low-airflow layer is provided so as to surround the first surface, the force for sucking air from the first surface can be strengthened. Also, The low-permeability layer is formed to become an integral part of the main body through a non-permeable treatment that seals the pores on the surface of the second surface by surface polishing, strong acid immersion, or a combination of these treatments. Therefore, the formation of the low-permeability layer becomes easier, which simplifies the manufacturing of the conveying nozzle itself, and the low-permeability layer can be made thinner, making it easier to miniaturize the conveying nozzle. Second Invention According to this, it becomes easier to stably hold the object adsorbed on the first surface. Third Invention According to this, it becomes easier to stably hold an object on the first surface.

Brief Description of the Drawings

[0016] [Figure 1] (A) is a schematic perspective view of the transport nozzle 10 of the present embodiment, and (B) is a schematic perspective cross-sectional view of the transport nozzle 10 of the present embodiment. [Figure 2] (A) is a schematic perspective view of the state where the transport nozzle 10 of the present embodiment is attached to the nozzle attachment portion P, and (B) is a schematic perspective cross-sectional view of the state where the transport nozzle 10 of the present embodiment is attached to the nozzle attachment portion P. [Figure 3] It is a schematic longitudinal cross-sectional view of the state where the transport nozzle 10 of the present embodiment is attached to the nozzle attachment portion P. [Figure 4] It is a schematic explanatory view of the operation of transporting the transported object M by the conventional transport nozzle N. [Figure 5] (A) is a schematic perspective cross-sectional view of the transport nozzle 10 of the present embodiment that does not have the hollow portion 12h, and (B) is a schematic explanatory view of the transport nozzle 10 having the recessed portion 12d on the first surface 12a. [Figure 6] (A) is a schematic perspective view of the transport nozzle 10B of another embodiment, and (B) is a schematic perspective cross-sectional view of the transport nozzle 10B of the present embodiment. [Figure 7] (A) is a schematic perspective view of the state where the transport nozzle 10B of another embodiment is attached to the nozzle attachment portion P, and (B) is a schematic perspective cross-sectional view of the state where the transport nozzle 10B of another embodiment is attached to the nozzle attachment portion P. [Figure 8]This is a schematic longitudinal cross-sectional view showing the transport nozzle 10B of another embodiment attached to the nozzle mounting portion P. [Modes for carrying out the invention]

[0017] The transport nozzle of this embodiment is used when transporting small components such as IC chips, and is characterized by its ability to stably hold even small components.

[0018] The equipment in which the conveying nozzle of this embodiment is employed is not particularly limited. The size and type of conveyed objects conveyed by the conveying nozzle of this embodiment are not particularly limited, but for example, it is suitable as a conveying nozzle used when conveying objects with a size of 1000 μm × 500 μm or less, or as a conveying nozzle used for removing contaminants and foreign matter of 1000 μm × 500 μm or less.

[0019] <Conveying nozzle 10 of this embodiment> As shown in Figure 2, the conveying nozzle 10 of this embodiment is used by being attached to the nozzle mounting portion P of a device that holds and conveys an object (hereinafter referred to as the conveying device). The nozzle mounting portion P of the conveying device is, for example, a hollow pipe and is connected to a device that sucks in air (for example, a vacuum pump), and is provided so that air can be sucked in from its tip. The nozzle mounting portion P is formed so that air cannot pass through its walls.

[0020] The conveying nozzle 10 of this embodiment is used by attaching it to the nozzle mounting section P of the conveying device. When the conveying nozzle 10 is attached to the nozzle mounting section P (see Figure 2), if air is drawn in from the tip of the nozzle mounting section P of the conveying device, the air can be drawn in through the main body section 11 of the conveying nozzle 10, and from the tip of the main body section 11 of the conveying nozzle 10, that is, from the first surface 12a.

[0021] As shown in Figures 1 to 3, the main body 11 of the transport nozzle 10 in this embodiment has a tip portion 12 and a mounting portion 15, and the tip portion 12 and the mounting portion 15 are integrally formed.

[0022] The mounting portion 15 of the main body 11 is the part that is attached to the nozzle mounting portion P of the conveying device. Specifically, the mounting portion 15 is the part that is attached to the nozzle mounting portion P such that there is an airtight seal between its outer surface 15a and the inner surface of the nozzle mounting portion P. An airtight seal between the outer surface 15a of the mounting portion 15 and the inner surface of the nozzle mounting portion P means that air is not drawn into the nozzle mounting portion P through the space between the outer surface 15a of the mounting portion 15 and the inner surface of the nozzle mounting portion P. Furthermore, the situation in which air is not drawn into the nozzle mounting portion P through the space between the outer surface 15a of the mounting portion 15 and the inner surface of the nozzle mounting portion P includes both cases: when there is a complete airtight seal between the two (no airflow between them at all), and when the airtightness is maintained to the extent that it does not obstruct the suction of air from the first surface 12a of the main body 11 of the conveying nozzle 10 (in other words, when the conveyed object M can be stably adsorbed onto the first surface 12a of the main body 11) (i.e., when there is some airflow).

[0023] The main body 11 includes a tip portion 12 that is continuous with the tip side of the mounting portion 15, that is, the end opposite to the end of the mounting portion 15 that is attached to the nozzle mounting portion P. The tip portion 12 is formed such that its outer diameter decreases from the end (base end) that is continuous with the mounting portion 15 toward the tip. In other words, the tip portion 12 is formed such that its cross-sectional area decreases from the base end toward the tip. For example, if the mounting portion 15 is cylindrical, the tip portion 12 is formed in a conical shape with a vertex at the tip. The tip portion 12 may maintain the same cross-sectional shape and cross-sectional area as the mounting portion 15 for a certain range, and then its cross-sectional area may decrease toward the tip.

[0024] The main body portion 11 (i.e., the tip portion 12 and the mounting portion 15) is a porous structure formed by sintering metal particles. Specifically, the main body portion 11 is formed by sintering metal particles m having a particle size of approximately 1 to 150 μm, and is a porous structure in which continuous pores s are formed between the sintered metal particles m (see Figure 1(B)).

[0025] The tip surface of the tip portion 12 and the base end surface of the attachment portion 15 of the main body portion 11 (i.e., the first surface 12a and the third surface 15c of the main body portion 11) are processed to be almost flat while maintaining their porous structure. In other words, the first surface 12a and the third surface 15c of the main body portion 11 are processed to be almost flat while maintaining the air permeability inherent in the porous structure. On the other hand, a low-air permeability layer 12f is formed on the side surface of the main body portion 11 (i.e., the second surface 12b of the main body portion 11), more specifically, on the second surface 12b which is continuous with the first surface 12a and surrounds the periphery of the first surface 12a (see Figure 3). This low-air permeability layer 12f is a layer with lower air permeability than the first surface 12a, and is formed to have a thickness of about 1 to 150 μm. For example, since the main body 11 is formed of metal particles, the low-permeability layer 12f can be formed by surface polishing, plastic coating, industrial plating, strong acid immersion, or a combination of these processes. In other words, the low-permeability layer 12f is formed to have lower permeability than the first surface 12a by performing a process that closes some or all of the pores. By performing such a process, the low-permeability layer 12f, which has the above-mentioned thickness and low permeability, can be formed.

[0026] Furthermore, the main body portion 11 has a hollow portion 12h that is recessed from the third surface 15c of the mounting portion 15 toward the first surface 12a of the tip portion 12. This hollow portion 12h is a hole formed such that its central axis is coaxial with the central axis CS of the main body portion 11 (see Figure 3), with its opening formed on the third surface 15c and its inner bottom surface located near the first surface 12a. Although this hollow portion 12h is formed so that its central axis is approximately coaxial with the central axis CS of the main body portion 11, the central axes of the two may be slightly misaligned.

[0027] Since the conveying nozzle 10 of this embodiment has the structure described above, when the mounting portion 15 is attached to the nozzle mounting portion P and air is drawn in from the tip of the nozzle mounting portion P of the conveying device, air can be drawn in from the first surface 12a. In other words, since the tip portion 12 of the main body portion 11 and the mounting portion 15 of the conveying nozzle 10 have a porous structure with continuous pores s, air can be drawn in from the first surface 12a through the pores s in the main body portion 11. Then, if the first surface 12a of the main body portion 11 is placed near the conveyed object M, the conveyed object M can be attracted to the first surface 12a.

[0028] Furthermore, since a low-airflow layer 12f is formed on the second surface 12b of the main body 11, air is drawn in only from the first surface 12a of the main body 11. This strengthens the suction force that adheres the conveyed object M to the first surface 12a, allowing the conveying nozzle 10 to hold the conveyed object M. Moreover, because the low-airflow layer 12f is thin and a hollow section 12h is formed inside the main body 11, the force that draws air into the first surface 12a can be strengthened, allowing the conveyed object M to be adhered to the first surface 12a in a more stable state.

[0029] Furthermore, the first surface 12a of the main body 11 is processed to be almost flat while maintaining the inherent air permeability of the porous structure. Moreover, since the thickness of the low-air permeability layer 12f of the second surface 12b is thin, almost the entire first surface 12a can be used as an adsorption surface for adsorbing the conveyed material M. As a result, even if there is a slight misalignment between the conveying nozzle 10 and the conveyed material M, the conveyed material M can be stably adsorbed onto the first surface 12a.

[0030] <Regarding the metal particles m in the main body 11> The metal particles m that form the main body 11 are, for example, particles of stainless steel, titanium, cemented carbide, copper, silver, etc., but any particles made of metal are acceptable, and the metal used as the material for the particles is not particularly limited. Furthermore, the particle size of the metal particles m is not particularly limited; it should be large enough to form pores s on the first surface 12a that can exhibit adsorption performance when it becomes a porous structure. For example, the average particle size of the metal particles m is preferably 1 to 150 μm, but more preferably 5 to 30 μm.

[0031] <Regarding the porosity of the main body 11> The porosity of the main body 11 is not particularly limited. It is sufficient that when the conveying nozzle 10 is attached to the tip of the nozzle mounting part P of the conveying device and air is drawn in from the tip of the nozzle mounting part P, the main body 11 is formed in such a way that it can generate a suction force capable of adsorbing the conveyed object M onto its first surface 12a. For example, the porosity of the main body 11 (excluding the low-permeability layer 12f mentioned above) is preferably 98% or less, more preferably 50% or less, and even more preferably 40% or less.

[0032] <Regarding the pore diameter of the pores s in the main body 11> The pore diameter of the pores s on the main body 11, specifically the pore diameter of the pores s on the first surface 12a, is not particularly limited. It should be large enough to adsorb the transported material M in a stable position. For example, if the size of the transported material M is about 1.0 mm × 0.5 mm square, the average pore diameter of the first surface 12a of the main body 11 is more preferably 100 μm or less, even more preferably 50 μm, and even more preferably 25 μm or less. Furthermore, even if the average pore diameter of the first surface 12a of the main body 11 is within the above range, if there are some pores with very large diameters, the adsorption performance may decrease or the transported material M may not be able to be held in a stable position. Therefore, the maximum pore diameter on the first surface 12a of the main body 11 is preferably 1.0 mm or less, more preferably 100 μm or less, even more preferably 50 μm, and even more preferably 25 μm or less.

[0033] <Regarding the low-ventilation layer 12f of the second surface 12b> The low-permeability layer 12f on the second surface 12b of the main body 11 only needs to be a layer with lower permeability than the first surface 12a, and the permeability of the low-permeability layer 12f is not particularly limited. The low-permeability layer 12f may have a structure that prevents almost no air from passing through, or it may have permeability to the extent that the adsorption performance of the first surface 12a does not decrease. For example, the permeability of the low-permeability layer 12f should be 50% or less of the permeability of the first surface 12a of the main body 11, more preferably 25% or less, and even more preferably 10% or less.

[0034] In this invention, the permeability of the low-permeability layer is determined by observing the areas where the surface pores are closed and those where they are not, for example, by a closing treatment, using a magnifying glass, and calculating the ratio of the two. For example, when a low-permeability layer 12f is formed by a surface polishing treatment, 95% of the pores in the low-permeability layer 12f are closed. In other words, when a low-permeability layer 12f is formed by a surface polishing treatment, 95% of the pores in the low-permeability layer 12f are closed compared to the case where all (100%) of the pores are present on the first surface 12a. In this state, the permeability of the low-permeability layer 12f is 5% of the permeability of the first surface 12a.

[0035] The thickness of the low-permeability layer 12f is not particularly limited, but if the thickness of the low-permeability layer 12f is reduced, the tip of the main body 11 can be made narrower, and the effect of adsorbing the conveyed material M onto the first surface 12a due to the influence of airflow near the first surface 12a of the main body 11 can be enhanced. Therefore, a thinner low-permeability layer 12f is preferable. Since the main body 11 of this embodiment is made of metal particles m, it is possible to form a thin low-permeability layer 12f by surface polishing, plastic coating, industrial plating, strong acid immersion processing, or a combination of these processing. In particular, if the pores of the low-permeability layer 12f are blocked by surface polishing, strong acid immersion processing, or blocking with powder of the same material, the low-permeability layer 12f and the main body 11 can be formed as an integrated structure, so a thin low-permeability layer 12f can be formed in a simpler way. This makes it easier to manufacture a small transport nozzle 10 with a large surface area on the first surface 12a, low permeability on the second surface 12b, and high adsorption performance. The occlusion treatment with powder of the same material refers to a process in which the pores are reduced in size or occluded by, for example, layering or coating the surface of the manufactured porous body with powder and then heat-treating it.

[0036] The low-ventilation layer may be formed only on the second surface 12b of the main body 11, but as shown in Figure 3, it may also be formed on the outer surface 15a of the mounting portion 15. For example, as shown in Figures 2 and 3, if the entire outer surface 15a of the mounting portion 15 is not inserted into the nozzle mounting portion P, air may be drawn in from the portion of the outer surface 15a of the mounting portion 15 that is not inserted into the nozzle mounting portion P. Therefore, in this case, it is necessary to provide a low-ventilation layer on the outer surface 15a of the mounting portion 15. By providing a low-ventilation layer on the outer surface 15a of the mounting portion 15, it is possible to prevent air from being drawn in from the portion of the outer surface 15a of the mounting portion 15 that is not inserted into the nozzle mounting portion P. Of course, if the entire outer surface 15a of the mounting portion 15 is inserted into the nozzle mounting portion P and the entire outer surface 15a of the mounting portion 15 is kept airtight from the outside, it is not necessary to provide a low-ventilation layer on the outer surface 15a of the mounting portion 15.

[0037] <Regarding the cross-sectional shape of the main body 11> Figures 1 to 3 show the case where both the tip portion 12 and the mounting portion 15 of the main body 11 have a circular cross-section. However, the cross-sections of the tip portion 12 and the mounting portion 15 are not limited to a circular cross-section; they may also be triangular, rectangular, or regular polygonal. Furthermore, the cross-sections of the tip portion 12 and the mounting portion 15 do not have to be similar; they may have different cross-sectional shapes. For example, the tip portion 12 may have a circular cross-section while the mounting portion 15 has a rectangular or regular polygonal cross-section, or the mounting portion 15 may have a circular cross-section while the tip portion 12 has a rectangular or regular polygonal cross-section.

[0038] Furthermore, while Figures 1 to 3 show the case where the cross-sectional area of ​​the tip portion 12 of the main body portion 11 continuously decreases from the base to the tip, the cross-sectional area of ​​the tip portion 12 may be the same from the base to the tip, or the cross-sectional area may change in a step-like manner.

[0039] <Regarding the processing of the tip of the main body 11> The tip of the tip portion 12 of the main body portion 11, that is, the portion of the first surface 12a and the second surface 12b near the first surface 12a, may be subjected to diamond vapor deposition to increase its strength. When diamond vapor deposition is performed, the diamond vapor deposition is carried out in such a way that the first surface 12a maintains the pore diameter (maximum pore diameter and average pore diameter) as described above after the diamond vapor deposition.

[0040] <Regarding the hollow section 12h of the main body 11> The hollow portion 12h in the main body 11 only needs to be formed so as to be approximately coaxial with the central axis CS of the main body 11, and to be recessed from the third surface 12b toward the first surface 12a; its depth and cross-sectional shape are not particularly limited. However, as shown in Figures 1 to 3, if the hollow portion 12h of the main body 11 is formed such that the cross-sectional area decreases as it approaches the first surface 12a from the third surface 12b, the effect of attracting the conveyed object M toward the first surface 12a can be enhanced.

[0041] The above-mentioned effects can be obtained by providing a hollow section 12h in the main body 11, but the hollow section 12h is not necessarily required (see Figure 5(A)). In this case, the manufacturing of the main body 11 becomes easier.

[0042] <Regarding recessed area 12d> The first surface 12a of the main body 11 may be a flat surface, but a recessed portion 12d may be provided that is recessed from the first surface 12a (see Figure 5(B)). For example, if a recessed portion 12d is provided that is large enough to accommodate the object to be carried by suction, the object to be carried by suction can be carried while contained within the recessed portion 12d, so that the object to be carried by suction can be carried in a stable state. In particular, if the cross-sectional shape of the recessed portion 12 is approximately the same as the cross-sectional shape of the object to be carried by M (approximately similar shape), the object to be carried by M can be held in a predetermined position, making it easier to supply the object to the next process in an appropriate position.

[0043] <Transport nozzle 10B of another embodiment> As shown in Figures 6 and 7, the mounting portion 15B of the conveying nozzle 10B may have a flange portion 15f between it and the tip portion 12B. For example, the flange portion 15f may be formed integrally with the mounting portion 15B and the tip portion 12B by sintering metal particles m, or the flange portion 15f may be formed by attaching a metal plate or the like to the outer surface 15a of the mounting portion 15 of the conveying nozzle 10.

[0044] When such a flange portion 15f is provided, it is desirable to form the flange portion 15f so that when the conveying nozzle 10B is attached to the nozzle mounting portion P, the upper surface of the flange portion 15f and the tip surface of the nozzle mounting portion P are in surface contact (see Figures 7 and 8). Then, when the mounting portion 15B of the conveying nozzle 10B is attached to the nozzle mounting portion P, the tip opening of the nozzle mounting portion P can be closed by the upper surface of the flange portion 15f. In this case, if the upper surface of the flange portion 15f is not permeable, it becomes possible to airtightly seal the space between the tip opening of the nozzle mounting portion P and the outside with the flange portion 15f. Then, compared to the case where the outer surface 15a of the mounting portion 15B and the inner surface of the nozzle mounting portion P are in surface contact and airtightly connected between them, the machining accuracy of the mounting portion 15B can be reduced, making it easier to manufacture the conveying nozzle 10B.

[0045] A condition in which the upper surface of the flange portion 15f does not have breathability can be described, for example, when the flange portion 15f is formed from a material that does not have breathability, such as a metal plate. Furthermore, if metal particles m are sintered to form the flange portion 15f integrally with the mounting portion 15B and the tip portion 12B, the upper surface of the flange portion 15f can be made non-permeable by providing a low-permeability layer on the upper surface of the flange portion 15f. In this case, it is necessary to provide a low-permeability layer on the upper surface, lower surface, and sides of the flange portion 15f to prevent air from being drawn in from the lower surface and sides of the flange portion 15f. [Industrial applicability]

[0046] The conveying nozzle of the present invention is suitable for use when conveying small electronic components such as IC chips and capacitors. In addition, the conveying nozzle of the present invention can be used in equipment for conveying powder materials such as carbon powder, ceramic powder, metal powder, and pharmaceutical raw material powder, as well as in conveying devices that hold and convey the conveyed material in equipment for removing foreign matter and contaminants contained in powder materials. [Explanation of Symbols]

[0047] 10 Conveying nozzles 11 Main unit 12 Tip 12a Front page 12b Second side 12c Third side 12d Recessed area 12h Hollow part 12p aperture 12f Low ventilation layer 15 Mounting part 15f flange section M Transported items P Nozzle mounting section

Claims

1. It has a porous body formed by sintering metal particles, The main body is, The first surface has breathability, It comprises a second surface that is continuous with the first surface and surrounds the first surface, In the second surface, in the low-ventilation area continuous with the first surface, A low-permeability layer is formed, which has lower breathability than the first surface. The low-ventilation layer on the second surface is, The second surface is formed to be an integral part of the main body by a surface polishing treatment, a strong acid immersion treatment, or a non-permeable treatment that seals the pores on the surface of the second surface by a combination of these treatments. The breathability of the low-permeability layer is The first surface of the main body is less than 50% of the surface area, and is formed to have an air permeability such that the adsorption performance of the first surface does not decrease. A conveying nozzle characterized by the following features.

2. The main body is, It has a hollow portion that is recessed toward the first surface from the third surface located on the opposite side of the first surface. The conveying nozzle according to claim 1, characterized by its features.

3. On the first surface of the main body, A recessed portion is provided in the first surface. The conveying nozzle according to claim 1, characterized by its features.

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