Substrate processing equipment

Abstract

To provide a substrate processing apparatus capable of preventing bad effects due to liquid leakage.SOLUTION: A substrate processing apparatus comprises a nozzle 310, wiring pipes 311 and 312, a protection pipe 391, a nozzle driving part 400, and a liquid leakage sensor. The nozzle 310 discharges processing liquid to a substrate of a processing object. The wiring pipes 311 and 312 are connected to the nozzle 310. The protection pipe 391 surrounds outer peripheries of the wiring pipes 311 and 312. The nozzle driving part 400 moves the nozzle 310. The liquid sensor detects liquid leakage from the wiring pipes 311 and 312.SELECTED DRAWING: Figure 9

Description

Technical Field

[0005] ,

[0001] The present invention relates to a substrate processing apparatus that performs processing on a substrate using a processing liquid.

Background Art

[0002] Conventionally, in order to perform a predetermined process using a processing liquid on various substrates such as a substrate for a FPD (Flat Panel Display) used in a liquid crystal display device or an organic EL (Electro Luminescence) display device, a semiconductor substrate, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell, a substrate processing apparatus is used. As such a substrate processing apparatus, there is a developing apparatus that performs a developing process on a photosensitive film using a developing solution.

[0003] For example, Patent Document 1 describes a developing apparatus having a plurality of nozzles. The plurality of nozzles are held by an arm that is movably provided on a rail by a moving mechanism. During a period when the developing process is not performed, the plurality of nozzles wait at a standby position outside the wafer. During a period when the developing process is performed, the plurality of nozzles move above the wafer and then descend to supply a developing processing liquid to the surface of the rotating wafer.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] A pipe for supplying the processing liquid is connected to the nozzle. If the nozzle is movable, the pipe is also configured to be movable. However, when the pipe is configured to be movable, repeated deformation such as expansion, contraction, bending, or twisting occurs in the movable part of the pipe, making the pipe more susceptible to damage. In particular, when multiple nozzles are arranged in close proximity, as in Patent Document 1, the pipes rub against each other, making the pipes even more prone to damage.

[0006] If the piping is damaged, the circuit board processing cannot be performed properly. Furthermore, if the processing fluid spills from the damaged piping, the circuit board processing equipment may become contaminated or damaged. Therefore, it is necessary to prevent problems caused by fluid leakage.

[0007] The objective of the present invention is to provide a substrate processing apparatus capable of preventing problems caused by liquid leakage. [Means for solving the problem]

[0008] This invention First A substrate processing device that conforms to the curved surface, held by a substrate holding device A nozzle for discharging a processing liquid onto the substrate to be processed, a pipe connected to the nozzle, and a surrounding element on the outer circumference of the pipe The inner surface is firm. A protective tube, a nozzle drive unit for moving the nozzle, Located below the substrate holding device, From the aforementioned piping The liquid that leaked was caught by the inner surface of the protective tube, guided downward by gravity, and then discharged from the protective tube. It is equipped with a leak sensor that detects leaks. A substrate processing apparatus according to a second aspect of the present invention comprises a nozzle for discharging a processing liquid onto a substrate to be processed, a pipe connected to the nozzle, a protective pipe surrounding the outer circumference of the pipe, a nozzle drive unit for moving the nozzle, a leak sensor for detecting leaks from the pipe, and a unit base having a groove and positioned below the protective pipe, wherein a drain hole is formed in the groove that penetrates the unit base vertically, and the leak sensor detects leaks from the pipe that have passed through the drain hole. A substrate processing apparatus according to a third aspect of the present invention comprises a nozzle for discharging a processing liquid onto a substrate to be processed, a pipe connected to the nozzle, a protective pipe surrounding the outer circumference of the pipe, a nozzle drive unit for moving the nozzle, and a leak sensor for detecting liquid leakage from the pipe, wherein the protective pipe has a bellows shape. A substrate processing apparatus according to a fourth aspect of the present invention comprises a nozzle for discharging a processing liquid onto a substrate to be processed, piping connected to the nozzle, a protective tube surrounding the outer circumference of the piping, a nozzle drive unit for moving the nozzle, a leak sensor for detecting leakage from the piping, and a nozzle head to which a plurality of the nozzles are attached and which is moved by the nozzle drive unit, wherein the protective tube surrounds the outer circumference of a plurality of pipes, each connected to a plurality of the nozzles. [Effects of the Invention]

[0009] According to the present invention, it is possible to prevent problems caused by liquid leakage in substrate processing equipment. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic perspective view illustrating the general configuration of a developing apparatus according to one embodiment of the present invention. [Figure 2] It is a partially exploded perspective view for explaining the configuration of the liquid processing unit of FIG. 1. [Figure 3] It is a schematic plan view for explaining a part of the configuration of the liquid processing unit of FIG. 2. [Figure 4] It is a schematic longitudinal sectional view for explaining a part of the configuration of the liquid processing unit of FIG. 2. [Figure 5] It is a perspective view of the nozzle arm unit of FIG. 2. [Figure 6] It is a longitudinal sectional view obtained by cutting the nozzle arm unit in a predetermined vertical plane. [Figure 7] It is an external perspective view of the partition plate and the cylindrical member of FIG. 2. [Figure 8] It is a plan view of the partition plate and the cylindrical member of FIG. 2. [Figure 9] It is a diagram for explaining the operation of the nozzle arm unit when a plurality of nozzles move between the standby position and the processing position. [Figure 10] It is a diagram for explaining the operation of the nozzle arm unit when a plurality of nozzles move between the standby position and the processing position. [Figure 11] It is a diagram for explaining the operation of the nozzle arm unit when a plurality of nozzles move between the standby position and the processing position. <, [Figure 12] It is a diagram for explaining the operation of the nozzle arm unit when a plurality of nozzles move between the standby position and the processing position. [Figure 13] It is a schematic sectional view for explaining the configuration of the protective tube. [Figure 14] It is a perspective view of the unit base. [Figure 15] It is a plan view of the unit base of FIG. 14. [Figure 16] It is a schematic cross section of the developing device. [Figure 17] It is a schematic longitudinal sectional view of the developing device when the cup of the liquid processing unit is in the second state. [Figure 18] It is a schematic longitudinal sectional view of the developing device during the development process of the substrate. [Figure 19]Figure 1 is a block diagram showing the configuration of the control unit of the developing apparatus. [Figure 20] This flowchart shows the basic operation during the developing process of a circuit board using a developing device. [Modes for carrying out the invention]

[0011] Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description, "substrate" refers to a substrate for a Flat Panel Display (FPD), semiconductor substrate, optical disk substrate, magnetic disk substrate, magneto-optical disk substrate, photomask substrate, ceramic substrate, or solar cell substrate used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, etc.

[0012] As an example of a substrate processing apparatus, a developing apparatus will be described. In this embodiment, the substrate to be developed has a main surface and a back surface. In the developing apparatus according to this embodiment, the back surface (bottom surface) of the substrate is held with the main surface of the substrate facing upwards and the back surface facing downwards, and the developing process is performed on the main surface (top surface) of the substrate.

[0013] A photosensitive film is formed on at least the central part of the main surface of the substrate after exposure treatment. This photosensitive film is, for example, a negative-type photosensitive polyimide film. An organic solvent containing cyclohexanone or cyclopentanone is used as a developer to dissolve the exposed negative-type photosensitive polyimide film. An organic solvent containing isopropyl alcohol or propylene glycol monomethyl ether acetate (PGMEA) is used as a rinse solution.

[0014] In this embodiment, "substrate development treatment" means dissolving a portion of the photosensitive film formed on the main surface of the substrate after exposure treatment by supplying a developing solution to the photosensitive film.

[0015] 1. Configuration of the developing device Figure 1 is a schematic perspective view illustrating the general configuration of a developing apparatus according to one embodiment of the present invention. As shown in Figure 1, the developing apparatus 1 basically has a configuration in which two liquid processing units LPA and LPB are housed within a housing CA. In Figure 1, the general shapes of the two liquid processing units LPA and LPB are shown by dotted lines. Details of the configuration of the liquid processing units LPA and LPB will be described later.

[0016] The enclosure CA has a roughly rectangular box shape extending in one direction in the horizontal plane. Specifically, the enclosure CA is formed by attaching a first side wall plate 1w, a second side wall plate 2w, a third side wall plate 3w, a fourth side wall plate 4w, a floor plate 5w, and a ceiling plate 6w to a frame (not shown). In the following description, the direction parallel to the direction in which the enclosure CA extends in the horizontal plane will be appropriately referred to as the first direction D1, and the direction perpendicular to the first direction D1 in the horizontal plane will be appropriately referred to as the second direction D2. The two liquid processing units LPA and LPB are arranged on a unit base, which will be described later, so as to be aligned in the first direction D1 within the enclosure CA.

[0017] The first side wall plate 1w and the second side wall plate 2w have a rectangular plate shape and are arranged parallel to each other in the vertical direction and the first direction D1. The third side wall plate 3w and the fourth side wall plate 4w have a rectangular plate shape and are arranged parallel to each other in the vertical direction and the second direction D2.

[0018] The second side wall plate 2w has two loading / unloading ports ph for transporting substrates between the inside and outside of the housing CA. The two loading / unloading ports ph are formed in two parts of the second side wall plate 2w that face the liquid processing units LPA and LPB in the second direction D2. The ceiling plate 6w has two openings op1 arranged in the first direction D1. The opening ratio of the two openings op1 in the ceiling plate 6w is set to be sufficiently large, to the same extent as when the entire upper end of the housing CA is open upwards.

[0019] Two filters FL are provided above the ceiling panel 6w so as to close the two openings op1 in the ceiling panel 6w. Alternatively, the two filters FL may be provided directly below the ceiling panel 6w. In Figure 1, the two filters FL are shown by thick dashed lines. The two filters FL are, for example, ULPA (Ultra Low Penetration Air) filters and are attached to a frame (not shown) or the ceiling panel 6w that constitutes the housing CA. An air guide AG is provided on the ceiling panel 6w of the housing CA, surrounding the two filters FL. In Figure 1, the air guide AG is shown by a double-dash line.

[0020] A gas supply unit 10 is provided on the outside of the housing CA. The gas supply unit 10 is, for example, an air control unit, which adjusts the air conditions, such as temperature and humidity, to meet predetermined conditions while the power supply of the developing device 1 is turned on. The gas supply unit 10 also supplies the adjusted air to the air guide AG through the air supply duct DU. In this case, the air guide AG guides the air supplied from the gas supply unit 10 through two filters FL to two openings op1 in the ceiling panel 6w. As a result, clean air with adjusted temperature and humidity is supplied into the housing CA, and a downward airflow is generated throughout the internal space SP of the housing CA.

[0021] Two additional fluid supply units 11 are provided on the outside of the housing CA. Each fluid supply unit 11 includes a developer supply source, a rinse solution supply source, a gas supply source, and various fluid-related equipment, and supplies developer, rinse solution, and gas to the liquid processing units LPA and LPB through the fluid supply path 12. In Figure 1, the fluid supply path 12 is shown by a dashed line. In this embodiment, the fluid supply path 12 is composed of one or more pipes and valves, etc.

[0022] The developing apparatus 1 further includes a control unit 90. The control unit 90 includes, for example, a CPU (central processing unit) and memory, or a microcomputer, and controls the liquid processing units LPA, LPB and the two fluid supply units 11. Details of the control unit 90 will be described later.

[0023] 2. Configuration of the liquid processing unit (1) Outline of the liquid treatment unit configuration The two liquid treatment units LPA and LPB in Figure 1 have essentially the same configuration, except that some of their components are arranged symmetrically with respect to a plane (vertical plane) perpendicular to the first direction D1. Below, the configuration of liquid treatment unit LPA will be described as representative of the two liquid treatment units LPA and LPB. Figure 2 is a partially exploded perspective view illustrating the configuration of liquid treatment unit LPA in Figure 1. Figure 3 is a schematic plan view illustrating some of the configurations of liquid treatment unit LPA in Figure 2. Figure 4 is a schematic longitudinal cross-sectional view illustrating some of the configurations of liquid treatment unit LPA in Figure 2. In Figures 2 to 4, the substrate W to be treated is shown by a dotted line.

[0024] As shown in Figure 2, the liquid treatment unit LPA includes a partition plate 100, a cylindrical member 200, a nozzle arm unit 300, a nozzle drive unit 400, and a standby pod 500. The liquid treatment unit LPA further includes a cup 40, a lifting drive unit 49, a container 50, an exhaust pipe 61, a drain pipe 62, a substrate holding device 70, and a suction device 78. In Figure 2, some of the components of the liquid treatment unit LPA are shown separated vertically from the others in order to facilitate understanding of the structure of the multiple components.

[0025] Specifically, Figure 2 shows some components, including the partition plate 100, cylindrical member 200, nozzle arm unit 300, nozzle drive unit 400, and standby pod 500, and other components, including the cup 40, container 50, and substrate holder 70, separated vertically. Figures 3 and 4 show schematic plan views and schematic vertical cross-sectional views, respectively, of the cup 40, container 50, and substrate holder 70 as some components of the liquid processing unit LPA.

[0026] (2) Cups and containers Within the housing CA in Figure 1, the housing 50 is fixed on a unit base, which will be described later. As shown in Figure 2, the housing 50 includes a side wall 51 and a bottom 52. The side wall 51 has an annular horizontal cross-section and is formed to extend vertically with a constant inner diameter and a constant outer diameter. The bottom 52 is formed to close the lower end of the side wall 51.

[0027] Three through-holes are formed in the bottom portion 52. Two of the three through-holes face each other, with the substrate holding device 70 in between. Exhaust pipes 61 are connected to the portions of these two through-holes. Each exhaust pipe 61 guides the atmosphere inside the housing CA to an exhaust device (not shown) located outside the housing CA. In the housing 50, the end (open end) of each exhaust pipe 61 is located above the bottom portion 52.

[0028] Furthermore, a drain pipe 62 is connected to the remaining through-hole formation portion in the bottom 52. The drain pipe 62 guides the liquid (developer and rinse solution) that flows from the cup 40 to the bottom of the container 50 during the substrate W development process to a drainage device (not shown) located outside the housing CA. In the container 50, the end (open end) of the drain pipe 62 is located lower than the end of each exhaust pipe 61.

[0029] At least the lower part of the substrate holding device 70 is housed within the housing 50. Specifically, the substrate holding device 70 includes a suction holding section 71, a spin motor 72, and a motor cover 79 (Figure 4). The motor cover 79 is not shown in Figures 2 and 3. As shown in Figure 3, the spin motor 72 is fixed to the bottom 52 so as to be located in the center of the housing 50 in a plan view. In this example, the lower part of the spin motor 72 protrudes below the bottom 52. As shown in Figure 4, the spin motor 72 is provided with a rotating shaft 73 that extends upward. A suction holding section 71 is provided at the upper end of the rotating shaft 73. The suction holding section 71 protrudes above the upper end of the housing 50.

[0030] As shown in Figure 2, a suction device 78 is provided on the outside of the housing 50. The suction holding unit 71 is configured to be able to suction the center of the back surface of the substrate W when the suction device 78 is in operation. When the suction holding unit 71 suctions the center of the back surface of the substrate W, the substrate W is held in a horizontal position above the housing 50. Furthermore, when the spin motor 72 is operated while the substrate W is held by the suction holding unit 71, the substrate W rotates in a horizontal position.

[0031] As shown in Figure 4, the motor cover 79 has a roughly bowl shape and is fixed to the housing 50 with its open, large-diameter portion facing downwards. A through hole is formed in the center of the upper end of the motor cover 79 into which the rotating shaft 73 can be inserted. With the rotating shaft 73 inserted into the through hole in the center of the upper end of the motor cover 79, the motor cover 79 covers the upper end portion of the spin motor 72 excluding the rotating shaft 73 and a space of a certain width surrounding the spin motor 72 in the horizontal plane from above. A gap of a certain width is formed between the outer peripheral end of the motor cover 79 and the inner peripheral surface of the side wall portion 51.

[0032] Here, the ends of each exhaust pipe 61 are located below the motor cover 79. This prevents liquids (developer and rinse solution) falling from above the housing 50 during the substrate W development process from entering the interior of each exhaust pipe 61.

[0033] As shown in Figure 2, the lower part of the substrate holder 70, as well as at least the lower end of the cup 40, are housed in the container 50. Here, the cup 40 is configured to be movable vertically within the container 50. The cup 40 also includes a cylindrical wall portion 41 and a liquid receiving portion 42. Each of the cylindrical wall portion 41 and the liquid receiving portion 42 has an annular horizontal cross-section and is provided to extend at least vertically. As shown in Figure 3, the cup 40 is configured to surround the substrate holder 70 in a plan view.

[0034] As shown in Figure 4, the outer and inner diameters of the liquid receiving portion 42 gradually increase as they move downward from the upper end of the liquid receiving portion 42. The outer diameter of the lower end of the liquid receiving portion 42 (the maximum outer diameter of the liquid receiving portion 42) is smaller than the inner diameter of the side wall portion 51 of the container 50. Therefore, a gap of a certain width is formed between the outer peripheral end of the liquid receiving portion 42 and the inner peripheral surface of the side wall portion 51. The cylindrical wall portion 41 is formed to extend upward from the upper end of the liquid receiving portion 42 with a constant inner and outer diameter.

[0035] As shown in Figure 2, a lifting drive unit 49 is provided near the container 50 within the housing CA of Figure 1. The lifting drive unit 49 includes a drive mechanism such as a motor or air cylinder, and supports the cup 40 and moves the cup 40 up and down, thereby transitioning the cup 40 between a first state and a second state. The first and second states of the cup 40 will be described later.

[0036] (3) Nozzle drive unit and standby pod In the housing CA of Figure 1, the nozzle drive unit 400 is provided adjacent to the housing 50 in a first direction D1. The nozzle drive unit 400 includes a motor having a rotating shaft 401 and an actuator. The actuator includes an air cylinder, a hydraulic cylinder, or a motor, and supports the motor having the rotating shaft 401 on a unit base so that the motor can move in the vertical direction. The rotating shaft 401 is located at the upper end of the nozzle drive unit 400.

[0037] Within the housing CA in Figure 1, a standby pod 500 is further provided on the unit base. The nozzle drive unit 400 and the standby pod 500 are spaced apart and arranged in a second direction D2 at a position to the side of the housing 50. The standby pod 500 has a box shape that extends for a certain length in the second direction D2. Multiple standby holes are formed on the upper surface of the standby pod 500 for housing the injection parts of the multiple nozzles 310, which will be described later.

[0038] The standby pod 500 is connected to a drain pipe (not shown) that discharges liquid sprayed from or dripped from the multiple nozzles 310 to the outside of the housing CA when the multiple nozzles 310 are in standby mode. The standby pod 500 is also connected to an exhaust pipe (not shown) that discharges the atmosphere inside the standby pod 500 to the outside of the housing CA.

[0039] (4) Nozzle arm unit A nozzle arm unit 300 is attached to the upper end of the rotating shaft 401. The nozzle arm unit 300 has a longitudinal shape that extends linearly in a direction different from that of the rotating shaft 401 when attached to the upper end of the rotating shaft 401. The nozzle arm unit 300 includes a nozzle head 300H which consists of a plurality (six in this example) of nozzles 310, a support 320, and a cover member 330.

[0040] Figure 5 is a perspective view of the nozzle arm unit 300 shown in Figure 2. Figure 6 is a longitudinal cross-sectional view of the nozzle arm unit 300 cut along a predetermined vertical plane. In Figure 5, the cover member 330 is shown separated from the other components to facilitate understanding of the internal structure of the nozzle arm unit 300.

[0041] The support 320 is manufactured, for example, by appropriately bending a single metal plate that has been cut or laser-cut into a predetermined shape. Alternatively, it is manufactured by connecting multiple metal plates that have been processed into a predetermined shape by screwing or welding. The support 320 is formed to extend in one direction and has one end 321 and the other end 322. The support 320 also has three nozzle fixing parts 323 that are spaced apart from the vicinity of the one end 321 toward the other end 322. Two nozzles 310 are attached to each of the three nozzle fixing parts 323. Furthermore, the support 320 has a pipe fixing part 324 and two cover mounting parts 325. The pipe fixing part 324 is located near the other end 322. The pipe fixing part 324 and the cover mounting parts 325 will be described later.

[0042] One of the two nozzles 310 provided in each nozzle fixing section 323 is used to supply developer to the substrate W. The other of the two nozzles 310 provided in each nozzle fixing section 323 is used to supply rinse solution to the substrate W. Furthermore, each of the nozzles 310 in this embodiment is a soft-spray type two-fluid nozzle capable of spraying a mixed fluid of liquid and gas. Therefore, each nozzle 310 has two fluid introduction sections 310a and 310b for introducing liquid and gas into the nozzle 310, and a spray section 310c for spraying the mixed fluid.

[0043] Each nozzle 310 is fixed to the support 320 with the injection section 310c facing downwards. In this state, a fluid introduction section 310a for introducing liquid into the nozzle 310 is provided at the upper end of each nozzle 310. Additionally, a fluid introduction section 310b for introducing gas into the nozzle 310 is provided on the side of each nozzle 310.

[0044] One end of a pipe 311 for supplying liquid (in this example, developer or rinse solution) to the nozzle 310 is connected to the fluid inlet 310a of each nozzle 310. Another end of a pipe 312 for supplying gas (in this example, nitrogen gas) to the nozzle 310 is connected to the fluid inlet 310b of each nozzle 310. The pipes 311 and 312 are made of a flexible resin material. Examples of such resin materials include PTFE (polytetrafluoroethylene), PVC (polyvinyl chloride), PPS (polyphenylene sulfide), and PFA (tetrafluoroethylene perfluoroalkyl vinyl ether copolymer).

[0045] The other end 322 of the support body 320 is attached to the upper end of the rotating shaft 401 of the nozzle drive unit 400. In this state, a horizontal and flat support surface SS is formed approximately in the center of the support body 320 in the longitudinal direction. A portion of each of the multiple pipes 311, 312 is provided on the support surface SS so as to extend from the nozzle 310 to which the pipe is connected toward the pipe fixing part 324.

[0046] The pipe fixing section 324 is formed from a part of the support surface SS. Multiple pipes 311 and 312 are bundled together in the pipe fixing section 324. In this state, a pipe fixing piece 329 having an inverted U shape is screwed onto the support surface SS that constitutes the pipe fixing section 324. This fixes the multiple pipes 311 and 312 near the other end 322 of the support body 320. The portions of the multiple pipes 311 and 312 that extend outward from the pipe fixing section 324 to the support body 320 are housed inside a protective tube 391 while bundled together. The protective tube 391 is made of, for example, rubber or resin and is flexible.

[0047] The cover member 330 has a box shape with an open bottom. Specifically, the cover member 330 in this example consists of a top surface portion 331, one end surface portion 332, the other end surface portion 333, one side surface portion 334, and the other side surface portion 335. The top surface portion 331 has a rectangular shape that is larger than the nozzle opening of the partition plate 100, which will be described later, when viewed from above. The one end surface portion 332, the other end surface portion 333, the one side surface portion 334, and the other side surface portion 335 each extend downward from the four sides of the outer edge of the top surface portion 331. The one end surface portion 332 and the other end surface portion 333 face each other, and the one side surface portion 334 and the other side surface portion 335 face each other. A notch 333N is formed in the other end surface portion 333.

[0048] As described above, the support 320 has two cover mounting portions 325. The two cover mounting portions 325 are located at the upper end of the support 320. Screw holes are formed in each cover mounting portion 325. In the upper surface portion 331 of the cover member 330, through holes 331h are formed in two parts corresponding to the two cover mounting portions 325 of the support 320.

[0049] With multiple nozzles 310 attached to the support 320, multiple pipes 311 and 312 connected to the multiple nozzles 310, and the multiple pipes 311 and 312 fixed in place, a cover member 330 is attached to the support 320. Specifically, the two through holes 331h of the cover member 330 are positioned on the two cover mounting portions 325 of the support 320, and the cover member 330 is screwed to the support 320.

[0050] As a result, the portion of the support 320 from one end 321 to the vicinity of the other end 322 is covered from above and from the side by the cover member 330. Meanwhile, the remaining portion of the support 320 is pulled out through a notch 333N formed in the other end face 333 of the cover member 330. In this way, a portion of the support 320 is housed within the cover member 330. Furthermore, a portion of the multiple nozzles 310 supported by the support 320 is housed within the cover member 330. In addition, a portion of the multiple pipes 311, 312 supported by the support 320 is housed within the cover member 330. In Figure 5, the state of the cover member 330 when attached to the support 320 is shown by a dashed line.

[0051] Here, in the support 320, the pipe fixing portion 324 is located between the other end 322 of the support 320 and the other end face 333 of the cover member 330. The pipe fixing piece 329 bundles the multiple pipes 311 and 312 that extend from the cover member 330 and fixes them to the pipe fixing portion 324 so that they do not come into contact with the inner edge of the notch 333N of the other end face 333. As shown in Figure 6, with the cover member 330 attached to the support 320, most of each nozzle 310, excluding the fluid introduction portion 310a, protrudes downward from the cover member 330.

[0052] (5) Partition plate and cylindrical member Figure 7 is an external perspective view of the partition plate 100 and cylindrical member 200 of Figure 2. Figure 8 is a plan view of the partition plate 100 and cylindrical member 200 of Figure 2. As shown in Figures 7 and 8, the cylindrical member 200 has a cylindrical shape and is fixed to a part of the housing CA (Figure 1) via a bracket (not shown). The inner diameter of the cylindrical member 200 is larger than the outer diameter of the cylindrical wall portion 41 (Figure 3) of the cup 40. Furthermore, the cylindrical member 200 is positioned such that, in a plan view, the central axis of the cylindrical member 200 substantially coincides with the central axis of the cup 40. This allows, for example, when the cup 40 rises, the upper end of the cup 40 to be inserted into the cylindrical member 200 while preventing contact between the cup 40 and the cylindrical member 200.

[0053] The partition plate 100 has a substantially disc shape and is attached to the cylindrical member 200 near the upper end of the cylindrical member 200 and in contact with the entire inner circumferential surface of the cylindrical member 200. A rectangular nozzle opening 110 extending in a first direction D1 is formed in the approximate center of the partition plate 100. The nozzle opening 110 faces the central portion of the substrate W that is held by the substrate holding device 70 during the substrate W development process. As shown in Figure 7, a wall portion 111 is formed in the portion of the partition plate 100 where the nozzle opening 110 is formed, extending upward for a certain length (for example, about 5 mm to 10 mm) from the inner edge of the nozzle opening 110.

[0054] Furthermore, as shown in Figure 8, multiple through-holes H are formed in the partition plate 100 so as to be distributed throughout the entire partition plate 100, excluding the nozzle opening 110. The number and size of the multiple through-holes H formed in the partition plate 100 are determined considering the pressure relationship between the processing space and the non-processing space, which will be described later.

[0055] Regarding the arrangement of the multiple through-holes H, specifically, as shown by the dotted lines in Figure 8, concentric circles (multiple virtual circles vc1) with a predetermined pitch are defined with respect to the center 100C of the partition plate in a plan view. In this case, the multiple through-holes H are formed in a distributed manner so as to be arranged at equal intervals on each virtual circle vc1. Furthermore, the number of through-holes H formed on the largest virtual circle vc1 is greater than the number of through-holes H formed on the other virtual circles vc1. Also, in this example, only the largest virtual circle vc1 surrounds the entire nozzle opening 110. Therefore, the largest virtual circle vc1 has multiple through-holes H formed so as to be arranged at a constant interval across its entirety.

[0056] Furthermore, as shown by the thick dashed line in Figure 8, a virtual circle vc2 is defined with a radius of half the radius of the partition plate 100, centered at the partition plate center 100C. Here, if the area inside the virtual circle vc2 is defined as the central region A1 and the area outside the virtual circle vc2 is defined as the outer peripheral region A2, the number of through holes H formed in the outer peripheral region A2 is greater than the number of through holes H formed in the central region A1.

[0057] (6) Operation of the nozzle arm unit As described above, the nozzle arm unit 300 is attached to the rotation axis 401 of the nozzle drive unit 400. Therefore, when the motor of the nozzle drive unit 400 moves in the vertical direction, the nozzle arm unit 300 also moves in the vertical direction. Furthermore, when the motor of the nozzle drive unit 400 operates, the nozzle arm unit 300 rotates in the horizontal plane around the rotation axis 401. As a result, the multiple nozzles 310 of the nozzle arm unit 300 are held at a standby position P1 to the side of the substrate W, which is held by the substrate holding device 70, while development processing is not being performed on the substrate W. The multiple nozzles 310 are also held at a processing position P2 above the substrate W, which is held by the substrate holding device 70, while development processing is being performed on the substrate W. In Figure 2, the standby position P1 and the processing position P2 are indicated by white arrows, respectively.

[0058] Figures 9 to 12 illustrate the operation of the nozzle arm unit 300 when multiple nozzles 310 move between a standby position P1 and a processing position P2. In Figures 9 to 12, the state of the nozzle arm unit 300 and its surrounding components when multiple nozzles 310 move from the standby position P1 to the processing position P2 is shown in chronological order in external perspective views. Note that, as in the example in Figure 2, the illustration of the partition plate 100 shown in Figures 9 to 12 omits the depiction of multiple through holes H.

[0059] First, as shown in Figure 9, with the multiple nozzles 310 in standby position P1, the nozzle arm unit 300 is positioned to the side of the partition plate 100 and the cylindrical member 200 and held in a state extending parallel to the second direction D2. At this time, the nozzle arm unit 300 is positioned so that the injection portions 310c (Figure 6) of the multiple nozzles 310 are housed within the multiple standby holes 510 (Figure 10) of the standby pod 500.

[0060] When the nozzle drive unit 400 starts operating in the state shown in Figure 9, the nozzle arm unit 300 rises together with the rotation axis 401 to a height above the cylindrical member 200, as shown by the thick solid arrow in Figure 10. As a result, the jet portions 310c (Figure 6) of the multiple nozzles 310 are pulled out from the multiple standby holes 510 of the standby pod 500.

[0061] Next, the rotation axis 401 of the nozzle drive unit 400 rotates by a predetermined angle (90° in this example). As a result, the nozzle arm unit 300 rotates around the rotation axis 401, as shown by the thick solid arrow in Figure 11. This holds the nozzle arm unit 300 in a state where it extends parallel to the first direction D1. At this time, the nozzle arm unit 300 is positioned so that, in a plan view, the cover member 330 overlaps the nozzle opening 110 of the partition plate 100.

[0062] Next, the rotation shaft 401 of the nozzle drive unit 400 descends. As a result, the cover member 330 descends, as shown by the thick solid arrow in Figure 12. At this time, the height position of the nozzle arm unit 300 is adjusted so that the cover member 330 does not come into contact with the partition plate 100 but is close enough. This reduces the flow of gas through the nozzle opening 110. In this way, the nozzle opening 110 of the partition plate 100 is covered by the cover member 330, and the multiple nozzles 310 are held in the processing position P2.

[0063] (7) Protection tube The portions of the multiple pipes 311 and 312 extending outward from the nozzle arm unit 300 are movable parts that can be deformed in the form of expansion and contraction, bending or twisting in accordance with the movement or rotation of the nozzle arm unit 300. The movable portions of the multiple pipes 311 and 312 are covered by a protective tube 391. As shown in Figures 9 to 12, a holding portion 392 is provided inside the housing CA of Figure 1 for holding a portion of the protective tube 391 on a part of the housing CA (e.g., the unit base). The holding portion 392 fixes a portion of the protective tube 391 extending from the nozzle arm unit 300 to the housing CA.

[0064] Figure 13 is a schematic cross-sectional view illustrating the structure of the protective tube 391. As shown in Figure 13, the protective tube 391 has a bellows shape. The holding portion 392 is, for example, a clamp, which holds the valleys of the bellows on the outer circumferential surface of the protective tube 391. In this case, the protective tube 391 can be held while maintaining its flexibility.

[0065] In this example, the nozzle arm unit 300 in Figure 6 has six nozzles 310, and two pipes 311 and 312 are connected to each nozzle 310. Therefore, in this example, twelve pipes 311 and 312 are inserted inside the protective tube 391. Inside the protective tube 391, a gap is provided between the inner surface of the protective tube 391 and the pipes 311 and 312. In this case, each pipe 311 and 312 can be easily deformed.

[0066] According to the above configuration, the multiple pipes 311 and 312 located between the nozzle arm unit 300 and the holding part 392 are bundled together in a deformable manner by the protective tube 391. Therefore, the handling of the multiple pipes 311 and 312 inside the housing CA in Figure 1 is improved. In addition, since the protective tube 391 is flexible, the degree of freedom of movement and rotation of the nozzle arm unit 300 is not restricted by the protective tube 391. The multiple pipes 311 and 312 bundled by the protective tube 391 are pulled out from the protective tube 391 near the holding part 392 and connected to the fluid supply path 12 of the fluid supply unit 11 in Figure 1.

[0067] Here, the movable parts of pipes 311 and 312 may be damaged by repeated deformation or friction. However, even if a leak occurs from a damaged point in either pipe 311, since pipe 311 is covered by the protective pipe 391, the leaked liquid is caught by the inner surface of the protective pipe 391 and guided downward by gravity. This prevents the leaked liquid from splashing. The leaked liquid guided downward is discharged from the lower end of the protective pipe 391 and detected by a leak sensor. Further details will be described later.

[0068] In this example, the protective tube 391 is made of polyamide. In this case, the protective tube 391 has high chemical resistance. This prevents corrosion of the protective tube 391 even if liquids such as developer or rinsing solution come into contact with it. The protective tube 391 may be made of other rubber or resins, as long as it has chemical resistance.

[0069] (8) Unit base Figure 14 is a perspective view of the unit base. Figure 15 is a plan view of the unit base of Figure 14. As shown in Figures 14 and 15, the unit base 600 includes a base plate 610 having a substantially rectangular shape. Two unit placement areas 620 are provided in the approximate center of the base plate 610, aligned in a first direction D1. The liquid processing units LPA and LPB of Figure 1 are respectively placed in the two unit placement areas 620.

[0070] As described above, in each liquid processing unit LPA and LPB, the lower part of the spin motor 72 protrudes below the bottom 52 of the housing 50 (Figure 4). Therefore, a circular opening 621 is formed in each unit placement area 620. When each liquid processing unit LPA and LPB is placed in the corresponding unit placement area 620, the lower part of the spin motor 72 is housed within the opening 621. This prevents interference between the spin motor 72 and the base plate 610.

[0071] Each unit placement area 620 is provided with an exhaust duct connected to the exhaust pipe 61 shown in Figure 4. Through this exhaust duct, the exhaust from the exhaust pipe 61 is guided to an exhaust device (not shown). In addition, each unit placement area 620 is provided with a pipeline connected to the drain pipe 62 shown in Figure 4. Through this pipeline, the drainage from the drain pipe 62 is guided to a drainage device (not shown).

[0072] A holding portion 392 corresponding to the liquid treatment unit LPA is provided near one corner of the base plate 610. A holding portion 392 corresponding to the liquid treatment unit LPB is provided near the other corner of the base plate 610. In Figures 14 and 15, only the holding portion 392 corresponding to the liquid treatment unit LPB is shown, and the holding portion 392 corresponding to the liquid treatment unit LPA is omitted. Also, only the protective tube 391 held by one of the holding portions 392 is shown, and the multiple pipes 311, 312 (Figure 13) bundled by the protective tube 391 are omitted.

[0073] Grooves 630 are formed around and between the two unit placement areas 620 on the base plate 610. The lower ends of the protective pipes 391, which are held by each holding part 392, are housed within the grooves 630. The downstream portions of the multiple pipes 311 and 312 bundled by the protective pipes 391 are connected to the multiple nozzles 310 shown in Figure 6. The upstream portions of the multiple pipes 311 and 312 are drawn out from the protective pipes 391 and, while housed within the grooves 630, are connected to the fluid supply path 12 of the fluid supply unit 11 shown in Figure 1.

[0074] Multiple drainage holes 631 to 636 (six in this example) are formed in the groove 630, penetrating the base plate 610 vertically. Drainage holes 631 and 634 are arranged in a second direction D2, with one unit placement area 620 in between. Drainage holes 633 and 636 are arranged in a second direction D2, with the other unit placement area 620 in between. Drainage hole 632 is located approximately midway between drainage holes 631 and 633 in the first direction D1. Drainage hole 635 is located approximately midway between drainage holes 634 and 636 in the first direction D1.

[0075] With the above configuration, even if a leak occurs due to damage to the movable part of the pipe 311 covered by the protective pipe 391, the leaked liquid is discharged from the protective pipe 391 and guided into the groove 630. The leaked liquid guided into the groove 630 then falls through one of the drainage holes 631 to 636. Here, the leaked liquid that falls through the drainage holes 631 to 636 is caught by a bat, which will be described later.

[0076] (9) Bat Figure 16 is a schematic cross-section of the developing apparatus 1. As shown in Figure 16, a bat 700 is positioned below the unit base 600 within the housing CA. The bat 700 has a box shape with an open top. Specifically, the bat 700 consists of a bottom portion 710, one end portion 720, the other end portion 730, one side portion 740, and the other side portion 750.

[0077] The lower surface portion 710 has a rectangular shape, in plan view, that is approximately the same size as the base plate 610 of the unit base 600 (Figure 16). One end surface portion 720, the other end surface portion 730, one side surface portion 740, and the other side surface portion 750 extend upward from the four sides of the outer edge of the lower surface portion 710. The one end surface portion 720 and the other end surface portion 730 face each other, and the one side surface portion 740 and the other side surface portion 750 face each other.

[0078] The upper surface of the lower portion 710 is tapered. This creates a lowest point on the upper surface of the lower portion 710. A through hole 711 is formed in the lowest point on the upper surface of the lower portion 710. The through hole 711 is connected to a drainage device. A leak sensor 760 is also positioned near the through hole 711.

[0079] In this example, the height of the upper surface of the lower portion 710 gradually increases from the center outward. Therefore, the center of the upper surface of the lower portion 710 is the lowest point, and the leak sensor 760 is positioned in the center of the lower portion 710. However, the embodiment is not limited to this. The lowest point on the upper surface of the lower portion 710 may be located at a position different from the center.

[0080] According to the above configuration, leaked liquid falling from the drainage holes 631-636 of the unit base 600 in Figure 15 is received by the lower surface portion 710 of the bat 700. The received leaked liquid is guided along the inclined upper surface of the lower surface portion 710 to the lowest part and discharged to the drainage device through the through hole 711. In addition, the leaked liquid received by the lower surface portion 710 comes into contact with the leak sensor 760 near the through hole 711, thereby detecting that a leak has occurred. This makes it possible to take appropriate measures, such as stopping the developing device 1.

[0081] (10) Cup operation In the developing apparatus 1, the cup 40 is maintained in a first state when substrates W are loaded into and unloaded from the liquid processing units LPA and LPB. On the other hand, the cup 40 is maintained in a second state when the substrates W held by the substrate holding device 70 are being developed. The first and second states of the cup 40 will be described below.

[0082] Figure 17 is a schematic longitudinal cross-sectional view of the developing apparatus 1 when the cups 40 of the liquid processing units LPA and LPB are in the second state. Figure 16 is a schematic longitudinal cross-sectional view of the developing apparatus 1 when the cups 40 of the liquid processing units LPA and LPB are in the first state. In Figures 16 and 17, the nozzle arm unit 300 in standby position P1 is shown by a dotted line. Also, in Figures 16 and 17, some of the components of the liquid processing units LPA and LPB are not shown.

[0083] As shown in Figure 16, when the cup 40 is in the first state, it is located inside the container 50. That is, when the cup 40 is in the first state, it overlaps the container 50 in a side view and is separated from the cylindrical member 200. Therefore, when the cup 40 is in the first state, it is possible to access the substrate holding device 70 from the side of the cup 40 and the container 50. This allows the substrate W, which is brought in from outside the developing apparatus 1, to be placed on the adsorption holding section 71 of the liquid processing units LPA and LPB. Furthermore, the substrate W placed on the adsorption holding section 71 of the liquid processing units LPA and LPB can be removed and transported outside the developing apparatus 1.

[0084] The height (vertical dimension) of the cup 40 is set to be greater than the distance between the cylindrical member 200 and the container 50 in the vertical direction. As shown in Figure 17, when in the second state, the cup 40 overlaps the lower end of the cylindrical member 200 and the upper end of the container 50 in a side view. At this time, the upper end of the cup 40 and the inner circumferential surface near the lower end of the cylindrical member 200 are in close proximity. Also, the lower end of the cup 40 and the inner circumferential surface near the upper end of the container 50 are in close proximity.

[0085] (11) Processing space and unprocessed space During the development process of the substrate W, the cup 40 is held in a second state, and the multiple nozzles 310 of the nozzle arm unit 300 are positioned at the processing position P2. Figure 18 is a schematic longitudinal cross-sectional view of the development apparatus 1 during the development process of the substrate W. As shown in Figure 18, during the development process of the substrate W, the multiple nozzles 310 of each of the liquid processing units LPA and LPB are positioned at the processing position P2 (Figure 12), and the cover member 330 covers the nozzle opening 110 of the partition plate 100. As a result, the internal space SP of the housing CA is divided into a processing space SPa and a non-processing space SPb by the partition plate 100, cylindrical member 200, cover member 330, cup 40, and container 50 of the liquid processing units LPA and LPB. The processing space SPa is the space containing the substrate W held by the substrate holding device 70, and the non-processing space SPb is the space surrounding the processing space SPa.

[0086] As shown by the white arrows in Figure 18, clean air is continuously supplied from above to the untreated space SPb. In addition, a portion of the clean air supplied to the untreated space SPb is supplied to the treated space SPa through multiple through-holes H (Figure 8) in the partition plate 100. As a result, clean downward airflows are formed in the two treated spaces SPa and the untreated space SPb within the enclosure CA.

[0087] The inner surface of the liquid receiving portion 42 of the cup 40 that forms each processing space SPa surrounds the substrate W held by the substrate holding device 70 in a horizontal plane. As a result, most of the developer and rinse solution supplied to the substrate W from the multiple nozzles 310 during the substrate W development process is received by the inner surface of the liquid receiving portion 42 and guided to the container 50. On the other hand, splashes of developer or rinse solution that are not received by the liquid receiving portion 42 and scatter around the substrate W are guided to the container 50 by the downward airflow formed in the processing space SPa.

[0088] When the substrate W rotates within the processing space SPa by the substrate holding device 70, an upward airflow (upward airflow) may occur near the periphery of the substrate W, along the inner surface of the cup 40 and the cylindrical member 200. In this case, if the atmosphere containing splashes of developer or rinse solution rises within the processing space SPa, these splashes may adhere to the lower surface of the partition plate 100 and the inner surface of the cylindrical member 200. Furthermore, these splashes may re-adhere to the substrate W.

[0089] Therefore, as explained with reference to Figure 8, the partition plate 100 is manufactured such that, when concentric circles are defined on the substrate W, the number of through holes H formed on the largest virtual circle vc1 is greater than the number of through holes H formed on other virtual circles vc1. Furthermore, the partition plate 100 is manufactured such that multiple through holes H are distributed at regular intervals across the entire largest virtual circle vc1 surrounding the nozzle opening 110. Alternatively, when a central region A1 and an outer peripheral region A2 are defined on the partition plate 100, the number of through holes H formed in the outer peripheral region A2 is greater than the number of through holes H formed in the central region A1.

[0090] With the above configuration of the partition plate 100, in the processing space SPa, the amount of downdraft directed to the vicinity of the inner surface of the cup 40 can be made larger than the amount of downdraft directed to the central part of the substrate W. In particular, when multiple through holes H are distributed at regular intervals across the entire largest virtual circle vc1 surrounding the nozzle opening 110, a downdraft can be formed near the inner surface of the cup 40 over its entire circumference. As a result, the generation of an upward airflow near the inner surface of the cup 40 when the substrate W rotates is suppressed. Therefore, in the processing space SPa, the scattering of developer or rinse solution supplied to the substrate W upward near the outer edge of the substrate W is suppressed. As a result, the adhesion of developer or rinse solution droplets to the lower surface of the partition plate 100 and the inner surface of the cylindrical member 200 is suppressed. Furthermore, the re-adhesion of developer or rinse solution to the substrate W is suppressed.

[0091] 3. Configuration of the control unit of the developing device Figure 19 is a block diagram showing the configuration of the control unit 90 of the developing apparatus 1 in Figure 1. As shown in Figure 19, the control unit 90 includes a first lifting control unit 91, a fluid control unit 92, a first rotation control unit 93, a suction control unit 94, a second lifting control unit 95, a second rotation control unit 96, and a leak detection unit 97. The functions of each part of the control unit 90 in Figure 19 are realized, for example, by the CPU executing a predetermined program stored in memory.

[0092] The first lifting control unit 91 controls the operation of the lifting drive unit 49 of the liquid processing units LPA and LPB. As a result, the cups 40 of each liquid processing unit LPA and LPB transition between the first state and the second state. The fluid control unit 92 controls the operation of the two fluid supply units 11 shown in Figure 1. As a result, a mixed fluid of developer and gas is sprayed from some of the multiple nozzles 310 in each liquid processing unit LPA and LPB, and a mixed fluid of rinsing solution and gas is sprayed from the other nozzles 310. In addition, the fluid control unit 92 controls the operation of the fluid supply unit 11 to stop the fluid supply when a leak signal, as described later, is provided by the leak detection unit 97.

[0093] The first rotation control unit 93 controls the operation of the spin motor 72 of the liquid processing units LPA and LPB in Figure 1. The suction control unit 94 controls the operation of the suction device 78 of the liquid processing units LPA and LPB in Figure 1. As a result, the substrate W is held in a horizontal position by suction in each substrate holding device 70 and rotated.

[0094] The second lifting control unit 95 and the second rotation control unit 96 control the operation of the nozzle drive unit 400 of the liquid processing units LPA and LPB in Figure 1. Specifically, the second lifting control unit 95 controls the operation of the actuator of each nozzle drive unit 400. The second rotation control unit 96 controls the operation of the motor having the rotation shaft 401 of each nozzle drive unit 400. The leak detection unit 97 determines whether or not a leak has been detected by the leak sensor 760. If it is determined that a leak has been detected, the leak detection unit 97 provides a leak signal to the fluid control unit 92 indicating that a leak has been detected.

[0095] 4. Basic operation of the developing machine The basic operation of the developing apparatus 1 will now be explained. Figure 20 is a flowchart showing the basic operation of the developing apparatus 1 during the developing process of the substrate W. In the initial state, air with adjusted temperature and humidity is supplied to the developing apparatus 1 from the gas supply unit 10. In addition, the atmosphere inside the housing CA is guided from the exhaust pipe 61 of the liquid processing units LPA and LPB to an exhaust device (not shown). A clean downward airflow is formed inside the housing CA. Furthermore, in the initial state, the cup 40 is assumed to be held in the first state. In addition, the multiple nozzles 310 are assumed to be held in the standby position P1.

[0096] Before the development process of the substrate W begins, the substrate W to be processed is first brought into the liquid processing units LPA and LPB. Also, as shown in Figure 16, the substrate W is placed on the suction holding section 71 of the substrate holding device 70. When the development process of the substrate W begins, the suction control unit 94 in Figure 19 controls the suction device 78 of the liquid processing units LPA and LPB so that the substrate W is adsorbed by the suction holding section 71 of the substrate holding device 70 (step S11).

[0097] Next, the first lifting control unit 91 in Figure 19 controls the lifting drive unit 49 of the liquid processing units LPA and LPB so that the cup 40 transitions from the first state to the second state (step S12).

[0098] Next, the second lifting control unit 95 and the second rotation control unit 96 in Figure 19 control the nozzle drive unit 400 of the liquid processing units LPA and LPB so that the multiple nozzles 310 move from the standby position P1 to the processing position P2 (step S13).

[0099] Next, the first rotation control unit 93 in Figure 19 controls the spin motors 72 of the liquid processing units LPA and LPB so that the substrate W rotates around the rotation axis 73 (step S14).

[0100] Next, the fluid control unit 92 in Figure 19 controls the fluid supply unit 11 of the liquid processing units LPA and LPB so that developer solution is supplied to the substrate W from some of the nozzles 310 for a predetermined time (step S15). Also, the fluid control unit 92 in Figure 19 controls the fluid supply unit 11 of the liquid processing units LPA and LPB so that rinse solution is supplied to the substrate W from the other nozzles 310 for a predetermined time (step S16).

[0101] If damage occurs in multiple pipes 311, the leak sensor 760 will detect the leak. Therefore, the leak detection unit 97 in Figure 19 determines whether or not a leak has been detected by the leak sensor 760 (step S 17 Step S 17 This may be executed simultaneously in parallel with steps S15 and S16.

[0102] If no leakage is detected, the first rotation control unit 93 in Figure 19 dries the substrate W by continuing to rotate it until a certain time has elapsed since the rinsing liquid supply was stopped. The first rotation control unit 93 in Figure 19 also controls the spin motors 72 of the liquid treatment units LPA and LPB so that the rotation of the substrate W stops after a certain time has elapsed since the rinsing liquid supply was stopped (step S18).

[0103] Next, the second lifting control unit 95 and the second rotation control unit 96 in Figure 19 control the nozzle drive unit 400 of the liquid processing units LPA and LPB so that the multiple nozzles 310 move from the processing position P2 to the standby position P1 (step S19).

[0104] Next, the first lifting control unit 91 in Figure 19 controls the lifting drive unit 49 of the liquid processing units LPA and LPB so that the cup 40 transitions from the second state to the first state (step S20).

[0105] Finally, the suction control unit 94 in Figure 19 controls the suction device 78 of the liquid processing units LPA and LPB so that the suction of the substrate W by the suction holding unit 71 of the substrate holding device 70 is released (step S21). This completes the development process of the substrate W. The substrate W after development is then removed from the liquid processing units LPA and LPB.

[0106] On the other hand, if a leak is detected in step S17, the leak detection unit 97 in Figure 19 sends a leak signal to the fluid control unit 92. As a result, the fluid control unit 92 controls the fluid supply unit 11 of the liquid processing units LPA and LPB to stop supplying the developer and rinse solution (step S22). After that, the developing process is completed.

[0107] If a leak is detected in step S17, the leak detection unit 97 may notify the user of the developing device 1 that a leak has occurred. As an example of notification by the leak detection unit 97, if the developing device 1 includes a display device, a string of characters indicating that an abnormality has occurred may be displayed. If the developing device 1 includes an audio output device, an audio message indicating the same content may be output, or a warning sound such as a buzzer may be output. If the developing device 1 includes an indicator light such as a lamp, the indicator light may be turned on, turned off, or blinked in a manner corresponding to the content of the warning.

[0108] Furthermore, if the above notification is given, the user of the developing device 1 will be able to recognize that a liquid leak has occurred and take appropriate action. Therefore, step S22 does not need to be performed.

[0109] 5. Effects In the developing apparatus 1 according to this embodiment, the nozzle drive unit 400 moves the nozzle head 300H from the standby position P1 to the processing position P2. In this state, processing liquid and gas are discharged from multiple nozzles 310 of the nozzle head 300H onto the substrate W through multiple pipes 311 and 312. In this case, the substrate W can be processed in a short period of time by the multiple nozzles 310.

[0110] Here, the movement of the nozzle head 300H causes deformation in the pipes 311 and 312. If the pipes 311 and 312 are repeatedly deformed, they may break and leak. Therefore, the outer circumference of the pipes 311 and 312 is surrounded by the protective pipe 391.

[0111] With this configuration, even if either pipe 311 or 312 is damaged, the leaked liquid will be contained by the inner surface of the protective pipe 391. This prevents the leaked liquid from splashing. In addition, leaks from pipes 311 and 312 are detected by the leak sensor 760, allowing appropriate measures to be taken. As a result, damage caused by liquid leakage can be prevented.

[0112] Specifically, a unit base 600 having a groove 630 is positioned below the protective pipe 391. A drain hole 631 is formed in the groove 630, penetrating the unit base 600 vertically. Leakage from pipes 311 and 312 that has passed through the drain hole 631 is detected by a leak sensor 760. In this case, leakage from pipes 311 and 312 can be detected with a simple configuration.

[0113] In this example, a portion of the piping 311 and 312 is housed within the groove 630 of the unit base 600. Therefore, any leaks from the piping 311 and 312 are guided along the piping 311 and 312 into the groove 630 and pass through the drain hole 631. This allows for more reliable detection of leaks from the piping 311 and 312.

[0114] Furthermore, a bat 700 is positioned below the unit base 600. Leaks from pipes 311 and 312 that pass through the drainage hole 631 of the unit base 600 are received by the bat 700. A leak sensor 760 is provided on the bat 700. Therefore, leaks from pipes 311 and 312 can be easily detected in the bat 700. In particular, since the bat 700 has a tapered shape and the leak sensor 760 is provided at the lowest position in the tapered portion of the bat 700, leaks from pipes 311 and 312 can be detected more reliably.

[0115] The protective tube 391 has a bellows shape. In this case, the protective tube 391 has high flexibility, so the degree of freedom of deformation of the pipes 311 and 312 is not restricted by the protective tube 391. This allows the nozzle head 300H to move more smoothly. In addition, the valleys of the bellows of the protective tube 391 are held by the holding part 392. In this case, the protective tube 391 can be easily held while maintaining its flexibility.

[0116] 6. Other Embodiments (1) In the above embodiment, the nozzle arm unit 300 includes a plurality of nozzles 310, but the embodiment is not limited thereto. The nozzle arm unit 300 may include one nozzle 310. In this case, the one nozzle 310 may be configured to be movable by the nozzle drive unit 400. Also, pipes 311 and 312 are connected to the nozzle 310, but the embodiment is not limited thereto. Only pipe 311 may be connected to the nozzle 310. That is, the nozzle arm unit 300 may be provided with only one pipe 311.

[0117] (2) In the above embodiment, the protective tube 391 has a bellows shape, but is not limited to this embodiment. The protective tube 391 only needs to be flexible and does not need to have a bellows shape. Therefore, the holding part 392 may hold any part of the protective tube 391.

[0118] (3) In the above embodiment, the bat 700 has a tapered shape, and the leak sensor 760 is provided at the lowest position in the tapered portion of the bat 700, but the embodiment is not limited thereto. The leak sensor 760 may be provided at a position other than the lowest position in the tapered portion of the bat 700, as long as it can detect leaks. Also, the bat 700 does not have to have a tapered shape. Alternatively, the developing apparatus 1 does not have to include the bat 700.

[0119] (4) In the above embodiment, the lower end of the protective tube 391 and the upstream portions of the pipes 311 and 312 are housed in the groove 630 of the unit base 600, but the embodiment is not limited thereto. As long as the leak sensor 760 can detect leaks, the lower end of the protective tube 391 and the upstream portions of the pipes 311 and 312 do not need to be housed in the groove 630 of the unit base 600. Alternatively, the developing device 1 does not need to include the unit base 600.

[0120] 7. Correspondence between each component of the claim and each part of the embodiment The following describes examples of the correspondence between each component of the claims and each part of the embodiments, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can be used as each component of the claims.

[0121] In the above embodiment, substrate W is an example of a substrate, nozzle 310 is an example of a nozzle, piping 311 and 312 are examples of piping, and protective tube 391 is an example of a protective tube. Nozzle drive unit 400 is an example of a nozzle drive unit, leak sensor 760 is an example of a leak sensor, developing device 1 is an example of a substrate processing device, and groove 630 is an example of a groove. Unit base 600 is an example of a unit base, drain hole 631 is an example of a drain hole, butt 700 is an example of a butt, holding part 392 is an example of a holding part, and nozzle head 300H is an example of a nozzle head.

[0122] 8. Summary of Embodiments (Paragraph 1) The substrate processing apparatus relating to Paragraph 1 is: A nozzle that dispenses the processing liquid onto the substrate to be processed, The piping connected to the nozzle, A protective pipe surrounding the outer circumference of the aforementioned piping, A nozzle drive unit for moving the aforementioned nozzle, The system includes a leak sensor that detects liquid leakage from the aforementioned piping.

[0123] In this substrate processing apparatus, a nozzle is moved by a nozzle drive unit, and processing liquid is discharged from the nozzle onto the substrate to be processed through piping. However, the movement of the nozzle causes deformation in the piping. If deformation occurs repeatedly in the piping, the piping may break and liquid leakage may occur. Therefore, the outer circumference of the piping is surrounded by a protective tube.

[0124] With this configuration, even if the piping is damaged, the leaked liquid is contained by the inner surface of the protective pipe. This prevents the leaked liquid from splashing. In addition, leaks from the piping are detected by a leak sensor, allowing for appropriate measures to be taken. As a result, damage caused by liquid leaks can be prevented.

[0125] (Paragraph 2) The substrate processing apparatus described in Paragraph 1 is The unit further comprises a grooved section and a unit base positioned below the protective tube, The groove portion has drainage holes that penetrate the unit base vertically. The leak sensor may detect leaks from the piping that have passed through the drain hole.

[0126] In this case, leaks from the piping can be detected with a simple configuration.

[0127] (3) In the substrate processing apparatus described in paragraph 2, A portion of the piping may be housed within the groove of the unit base.

[0128] In this case, leaks from the piping are guided along the pipe into the groove and pass through the drain hole. This allows for more reliable detection of leaks from the piping.

[0129] (Article 4) The substrate processing apparatus described in Article 2 or Article 3 is: The unit further comprises a bat positioned below the unit base to receive leaks from the piping that have passed through the drainage hole, The leak sensor may be provided in the tub.

[0130] In this case, leaks from the piping can be easily detected in the bat.

[0131] (Item 5) In the substrate processing apparatus described in Item 4, The aforementioned bat has a tapered shape, The leak sensor may be located at the lowest position in the tapered portion of the butt.

[0132] In this case, the leak from the piping can be detected more reliably in the bat.

[0133] (Article 6) In the substrate processing apparatus described in any one of paragraphs 1 to 5, The protective tube may have a bellows shape.

[0134] In this case, the degree of freedom of deformation of the piping is not restricted by the protective tube. This allows the nozzle to move more smoothly.

[0135] (Section 7) The substrate processing apparatus described in Section 6 is The protective tube may further be provided with a retaining part for holding the valleys of the bellows.

[0136] In this case, the protective tube can be easily held while maintaining its flexibility.

[0137] (Paragraph 8) The substrate processing apparatus described in any one of paragraphs 1 to 7 is: The device further comprises a nozzle head to which multiple nozzles are attached and which is moved by the nozzle drive unit, The protective tube may surround the outer circumference of the multiple pipes, each connected to one of the multiple nozzles.

[0138] In this case, substrates can be processed in a short period of time using multiple nozzles. Even if one of the pipes is damaged due to friction with another pipe and a leak occurs, the leaked liquid is contained by the inner surface of the protective pipe, preventing splashing. Furthermore, since the leak is detected by a leak sensor, appropriate measures can be taken. Therefore, even when multiple pipes are provided in the substrate processing device, problems caused by liquid leaks can be prevented. [Explanation of Symbols]

[0139] 1…Developing device, 1w…First side wall plate, 2w…Second side wall plate, 3w…Third side wall plate, 4w…Fourth side wall plate, 5w…Floor plate, 6w…Ceiling plate, 10…Gas supply unit, 11…Fluid supply unit, 12…Fluid supply path, 40…Cup, 41…Cylindrical wall section, 42…Liquid receiving section, 49…Lifting drive unit, 50…Container, 51…Side wall section, 52…Bottom section, 61…Exhaust pipe, 62…Drainage pipe, 70…Substrate holding device, 71…Suction holding unit, 72…Spin motor, 73, 401…Rotating shaft, 78…Suction device, 79…Motor car Bar, 90... Control unit, 91... First lifting control unit, 92... Fluid control unit, 93... First rotation control unit, 94... Suction control unit, 95... Second lifting control unit, 96... Second rotation control unit, 97... Leak detection unit, 100... Partition plate, 100C... Center of partition plate, 110... Nozzle opening, 200... Cylindrical member, 300... Nozzle arm unit, 300H... Nozzle head, 310... Nozzle, 310a, 310b... Fluid introduction unit, 310c... Injection unit, 311, 312... Piping, 320... Support unit, 321... One end, 3 22...Other end, 323...Nozzle fixing part, 324...Pipe fixing part, 325...Cover mounting part, 329...Pipe fixing piece, 330...Cover member, 331...Top surface, 331h, H, 711...Through hole, 332, 720...One end surface, 333, 730...Other end surface, 333N...Notch, 334, 740...One side surface, 335, 750...Other side surface, 391...Protective tube, 392...Holding part, 400...Nozzle driving part, 500...Standby pod, 510...Standby hole, 600...Unit base, 61 0…Base plate, 620…Unit placement area, 621, op1…Opening, 630…Groove, 631~636…Drainage hole, 700…Bat, 710…Bottom surface, 760…Leak sensor, A1…Central area, A2…Outer periphery area, AG…Air guide, CA…Housing, DU…Air supply duct, FL…Filter, LPA, LPB…Liquid processing unit, P1…Standby position, ph…Input / Output port, SP…Internal space, SPa…Processing space, SPb…Non-processing space, SS…Support surface, vc1, vc2…Virtual circle, W…Substrate

Claims

1. A nozzle for discharging a processing liquid onto a substrate to be processed, which is held by a substrate holding device, The piping connected to the nozzle, A protective pipe having an inner surface surrounding the outer circumference of the aforementioned piping, A nozzle drive unit for moving the aforementioned nozzle, A substrate processing apparatus comprising: a leak sensor provided below the substrate holding device, which detects leaked liquid that is received by the inner surface of the protective tube due to liquid leakage from the piping, guided downward by gravity, and then discharged from the protective tube.

2. The unit further comprises a grooved section and a unit base positioned below the protective tube, The groove portion has drainage holes that penetrate the unit base vertically. The substrate processing apparatus according to claim 1, wherein the leak sensor detects leaks from the piping that have passed through the drain hole.

3. A portion of the piping is housed within the groove of the unit base, as described in claim 2.

4. The unit further comprises a bat positioned below the unit base to receive leaks from the piping that have passed through the drainage hole, The substrate processing apparatus according to claim 2 or 3, wherein the leak sensor is provided in the vat.

5. The aforementioned bat has a tapered shape, The substrate processing apparatus according to claim 4, wherein the leak sensor is provided at the lowest position in the tapered portion of the butt.

6. The substrate processing apparatus according to any one of claims 1 to 3, wherein the protective tube has a bellows shape.

7. The substrate processing apparatus according to claim 6, further comprising a holding portion for holding the valley portion of the bellows of the protective tube.

8. The device further comprises a nozzle head to which multiple nozzles are attached and which is moved by the nozzle drive unit, The substrate processing apparatus according to any one of claims 1 to 3, wherein the protective tube surrounds the outer circumference of the plurality of pipes connected to each of the plurality of nozzles.

9. A nozzle for discharging a processing liquid onto a substrate to be processed, The piping connected to the nozzle, A protective pipe surrounding the outer circumference of the aforementioned piping, A nozzle drive unit for moving the aforementioned nozzle, A leak sensor for detecting leaks from the aforementioned piping, It comprises a unit base having a groove and positioned below the protective tube, The groove portion has drainage holes that penetrate the unit base vertically. The aforementioned leak sensor is a substrate processing apparatus that detects leaks from the piping that have passed through the drain hole.

10. A nozzle for discharging a processing liquid onto a substrate to be processed, The piping connected to the nozzle, A protective pipe surrounding the outer circumference of the aforementioned piping, A nozzle drive unit for moving the aforementioned nozzle, The system includes a leak sensor that detects leaks from the aforementioned piping, The aforementioned protective tube has a bellows shape, and is a substrate processing apparatus.

11. A nozzle for discharging a processing liquid onto a substrate to be processed, The piping connected to the nozzle, A protective pipe surrounding the outer circumference of the aforementioned piping, A nozzle drive unit for moving the aforementioned nozzle, A leak sensor for detecting leaks from the aforementioned piping, The device comprises a nozzle head to which multiple nozzles are attached and which is moved by the nozzle drive unit, The protective tube surrounds the outer circumference of the multiple pipes, each connected to one of the multiple nozzles, in a substrate processing apparatus.

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