Deposition mask for OLED pixel deposition

Abstract

An evaporation mask according to an embodiment includes a metal plate having an evaporation region and a non-evaporation region, the evaporation region includes at least one effective region and an ineffective region, the effective region includes a plurality of through holes, the through holes including a small-area hole formed on a first surface of the metal plate, a large-area hole formed on a second surface of the metal plate, and a communication portion connecting the small-area hole and the large-area hole, and the ineffective region includes a plurality of grooves.

Description

Technical Field

[0001] The embodiments relate to a deposition mask for OLED pixel deposition.

Background Art

[0002] Display devices are applied to various devices. For example, the display device is applied to small devices such as smartphones or tablet PCs. Alternatively, the display device is applied to large devices such as TVs, monitors, or public displays (PDs). Recently, the demand for ultra-high definition (UHD) with a resolution of 500 pixels per inch (PPI) or more has been increasing. Accordingly, display devices having high resolution are applied to small devices and large devices.

[0003] Display devices are classified into liquid crystal displays (LCDs) and organic light emitting diodes (OLEDs) according to the driving method.

[0004] The LCD is a display device driven using liquid crystal. Also, the OLED is a display device driven using an organic substance.

[0005] The OLED can exhibit an infinite contrast ratio, has a response speed more than 1000 times faster than that of the LCD, and has an excellent viewing angle. Accordingly, the OELD has attracted attention as a display device that can replace the LCD.

[0006] The OLED includes an emissive layer. The emissive layer includes an organic material. The organic material is deposited onto a substrate using a deposition mask. The deposition mask may be an open mask (OM) or a fine metal mask (FMM). A deposition pattern corresponding to the pattern formed on the deposition mask is formed on the substrate. This allows the deposition pattern to function as a pixel.

[0007] The open mask is a thin plate used in the manufacturing of OLEDs to form a deposition pattern only at specific locations. The open mask is used in the deposition process to form the light-emitting layer on the backplane after the backplane has been completed during the display manufacturing process. In other words, the open mask is a mask that has no obstructing areas within the range in which the display operates in order to deposit material over the entire surface of the display. Therefore, the open mask is used when depositing a light-emitting layer with a single color of light-emitting material.

[0008] On the other hand, fine metal masks are used to give subpixels in the light-emitting layer different colors. Therefore, the fine metal masks contain ultrafine holes. The process using the fine metal masks requires many stages of deposition. Therefore, the process requires precise alignment. As a result, the process using the fine metal masks is more difficult than the process using open masks.

[0009] When the light-emitting layer of the OLED is deposited using an open mask, only one color light-emitting layer is formed. Therefore, a separate color filter (C / F) is required to realize a variety of colors. On the other hand, when the fine metal mask is used, an RGB light-emitting layer can be formed. Therefore, a separate color filter is not required. In other words, the technology using the fine metal mask is difficult. However, compared to the method using an open mask, it does not require a filter to block light, so the light efficiency is better.

[0010] The fine metal mask is generally manufactured from an Invar alloy metal sheet containing iron (Fe) and nickel (Ni). Through-holes are formed on one and the other surface of the metal sheet, penetrating both surfaces. These through-holes are formed at positions corresponding to the pixel pattern. As a result, red, green, and blue organic materials are deposited onto the substrate through the through-holes in the metal sheet. This forms a pixel pattern on the substrate.

[0011] On the other hand, the fine metal mask includes small-area holes formed on one side of the metal plate and large-area holes formed on the other side of the metal plate. The small-area holes and the large-area holes are connected by a connecting portion, thereby forming the through-hole.

[0012] The fine metal mask is formed in a stick shape. Multiple fine metal masks are fixed to the deposition substrate via a frame.

[0013] At this time, the fine metal mask is stretched in the length direction. This can cause a stress difference due to tensile force in the width direction of the mask. This stress difference can cause the fine metal mask to warp. Therefore, the deposition efficiency of the TKIDRL fine metal mask decreases.

[0014] Therefore, there is a need for a new structure of vapor deposition mask and a method for manufacturing the same that can solve the above-mentioned problems. [Overview of the project] [Problems that the invention aims to solve]

[0015] The example provides a deposition mask for OLED pixel deposition having improved deposition efficiency. [Means for solving the problem]

[0016] The deposition mask according to the embodiment includes a metal plate including a deposition region and a non-deposition region, the deposition region includes at least one effective region and a non-effective region, the effective region includes a plurality of through holes, the through holes include small area holes formed on the first surface of the metal plate, large area holes formed on the second surface of the metal plate, and a communication portion connecting the small area hole and the large area hole, and the non-effective region includes a plurality of grooves. [Effects of the Invention]

[0017] The deposition mask according to the embodiment includes an effective region and an ineffective region. A pattern is formed in the effective region and the ineffective region. The pattern is formed by holes or grooves.

[0018] Therefore, the stress difference generated when the deposition mask is stretched is reduced. When the deposition mask is stretched, tensile stress is generated. This stress exists as residual stress inside the deposition mask. The central region in the width direction of the deposition mask is the effective region where through holes are formed. Also, through holes are not formed in the outer edge region in the width direction (the end region in the width direction of the deposition mask). As a result, the stress difference of the deposition mask mainly occurs in the width direction of the deposition mask.

[0019] The deposition mask includes grooves formed in the non-effective region. This reduces the magnitude of residual stress in the non-effective region. Therefore, the difference in residual stress between the effective region and the non-effective region is reduced.

[0020] This prevents the evaporation mask from warping due to the difference in residual stress.

[0021] Furthermore, the difference in strength between the first and second surfaces of the deposition mask is reduced. Specifically, grooves are additionally formed on the ineffective region of the first surface where small-area pores are formed. As a result, the difference between the aperture ratio of the first surface and the aperture ratio of the second surface is reduced.

[0022] Therefore, the intensity difference between the first surface and the second surface is reduced. Therefore, it is possible to prevent the evaporation mask from warping due to the intensity difference.

Brief Description of Drawings

[0023] [Figure 1] FIG. 1 is a drawing illustrating the connection of an evaporation mask and a frame according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view of an organic matter evaporation apparatus including an evaporation mask according to an embodiment. [Figure 3] FIG. 3 is a drawing illustrating that an evaporation pattern is formed on an evaporation substrate through through-holes of an evaporation mask according to an embodiment. [Figure 4] FIG. 4 is a drawing illustrating that an evaporation mask according to an embodiment is stretched to be fixed on a mask frame. [Figure 5] FIG. 5 is a plan view of an evaporation mask according to an embodiment. [Figure 6] FIG. 6 is an enlarged view of region A in FIG. 5. [Figure 7] FIG. 7 is an enlarged view of region A in FIG. 5. [Figure 8] FIG. 8 is an enlarged view of region B in FIG. 7.

Embodiments for Carrying Out the Invention

[0024] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Note that the technical idea of the present invention is not limited to some of the described embodiments, but can be embodied in various forms. Within the scope of the technical idea of the present invention, components between embodiments can be selectively combined or replaced for use. Also, terms (including technical and scientific terms) used in the embodiments of the present invention are to be construed as having a meaning generally understood by those having ordinary knowledge in the technical field to which the present invention pertains, unless specifically defined and described. Terms generally used like those defined in a dictionary will be construed in consideration of the meaning in the context of the relevant technology.

[0025] Furthermore, the terms used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the invention. In this specification, singular forms may also include plural forms unless otherwise specified, and when it is written as "at least one of A and B, C (or one or more)", it may include one or more of all possible combinations of A, B, and C.

[0026] Furthermore, in describing the components of the embodiments of the present invention, terms such as 1st, 2nd, A, B, (a), (b), etc., may be used. Such terms are used to distinguish a component from other components, and the terms do not limit the essence or order of the component.

[0027] When it is stated that one component is “linked,” “joined,” or “connected” to another component, this includes both cases where the component is directly linked or connected to the other component, and cases where other components are further “linked,” “joined,” or “connected” between each component.

[0028] Furthermore, when it is stated that a component is formed or positioned "above or below" each component, "above or below" includes not only cases where the two components are in direct contact, but also cases where one or more other components are formed or positioned between the two components.

[0029] Furthermore, when expressed as "up or down," it can include not only an upward direction but also a downward direction, based on a single component.

[0030] The following describes a vapor deposition mask according to an example, with reference to the drawings.

[0031] The deposition mask described below is a fine metal mask (FMM) capable of depositing red, green, and blue organic materials onto a deposition substrate to form an RGB pixel pattern on the substrate. The following description does not apply to open masks (OMs).

[0032] Figures 1 to 3 are diagrams illustrating the process of depositing an organic substance onto a deposition substrate 300 using a deposition mask 100 according to the embodiment.

[0033] Figure 1 is a diagram illustrating the connection of the deposition mask and frame according to the embodiment. Figure 2 is a cross-sectional view of the organic deposition apparatus including the deposition mask according to the embodiment. Figure 3 is a diagram illustrating that a deposition pattern is formed on the deposition substrate by through holes in the deposition mask.

[0034] Referring to Figures 1 and 2, the organic material deposition apparatus includes a deposition mask 100, a mask frame 200, a deposition substrate 300, an organic material deposition container 400, and a vacuum chamber 500.

[0035] The deposition mask 100 contains a metal. For example, the deposition mask contains iron (Fe) and nickel (Ni). More specifically, the deposition mask contains an Invar alloy containing iron (Fe) and nickel (Ni).

[0036] The deposition mask 100 includes a plurality of through-holes TH. The through-holes are arranged in the effective area. The through-holes are arranged to correspond to the pixel pattern formed on the deposition substrate. The deposition mask 100 includes non-effective areas other than the effective area which includes the deposition region.

[0037] The mask frame 200 includes an opening 205. The plurality of through holes are positioned on regions corresponding to the opening 205. This allows the organic material supplied from the organic material deposition container 400 to be deposited onto the deposition substrate 300. The deposition mask 100 is positioned and fixed on the mask frame 200. For example, the deposition mask 100 is subjected to a constant tensile force. Alternatively, the deposition mask 100 may be welded and fixed to the mask frame 200.

[0038] For example, the ineffective portion of the vapor deposition mask 100 is welded. This fixes the vapor deposition mask 100 onto the mask frame 200. Subsequently, any portion of the mask frame 200 that protrudes outside is cut off and removed.

[0039] The mask frame 200 contains a highly rigid metal. This reduces deformation of the mask frame during the welding process.

[0040] The deposition substrate 300 is a substrate used when manufacturing a display device. For example, an OLED pixel pattern is formed on the deposition substrate 300. Red, green, and blue organic patterns are formed on the deposition substrate 300 to form pixels, which are the three primary colors of light. In other words, an RGB pattern is formed on the deposition substrate 300.

[0041] The organic material deposition container 400 is a crucible. An organic substance is placed inside the crucible. The organic material deposition container 400 moves within the vacuum chamber 500. That is, the organic material deposition container 400 moves in one direction within the vacuum chamber 500. For example, the organic material deposition container 400 moves in the width direction of the deposition mask 100 within the vacuum chamber 500.

[0042] A heat source and / or electric current are supplied to the organic material deposition container 400. As a result, the organic material is deposited onto the deposition substrate 300.

[0043] Referring to Figure 3, the deposition mask 100 includes a metal plate 10. The metal plate includes a first surface 101 and a second surface 102. The first surface 101 and the second surface 102 are opposite to each other.

[0044] The first surface 101 includes small area holes V1. The second surface 102 includes large area holes V2. For example, the first surface 101 and the second surface 102 each have a plurality of small area holes V1 and a plurality of large area holes V2 formed on them.

[0045] Furthermore, the deposition mask 100 includes through-holes TH. The through-holes TH are formed by connecting portions CA to which the boundaries of the small-area holes V1 and the large-area holes V2 are connected.

[0046] The width of the large-area pore V2 is greater than the width of the small-area pore V1. The width of the small-area pore V1 is measured on the first surface 101 of the deposition mask 100. The width of the large-area pore V2 is measured on the second surface 102 of the deposition mask 100.

[0047] Furthermore, the width of the connecting portion CA has a set size. Specifically, the width of the connecting portion CA can be 15 μm to 33 μm. More specifically, the width of the connecting portion CA can be 19 μm to 33 μm. Even more specifically, the width of the connecting portion CA can be 20 μm to 27 μm. If the width of the connecting portion CA exceeds 33 μm, it becomes difficult to achieve a resolution of 500 PPI or higher. Also, if the width of the connecting portion CA is less than 15 μm, defects may occur during the deposition process.

[0048] The small area pore V1 faces the deposition substrate 300. The small area pore V1 is positioned close to the deposition substrate 300. As a result, the small area pore V1 has a shape that corresponds to the deposition pattern DP.

[0049] The large-area pore V2 faces the organic material deposition container 400. As a result, the organic material supplied from the organic material deposition container 400 is contained over a wide area by the large-area pore V2. Furthermore, a fine pattern can be quickly formed on the deposition substrate 300 through the small-area pore V1.

[0050] As a result, the organic material contained in the large-area pores V1 is deposited onto the deposition substrate 300 through the small-area pores V1. This forms one of the following pixel patterns on the deposition substrate 300: red, green, or blue. Subsequently, the above process is repeated. This forms all of the red, green, or blue pixel patterns on the deposition substrate 300.

[0051] On the other hand, referring to Figure 4, the deposition mask 100 is pulled in one direction. More specifically, when fixing the deposition mask 100 to the mask frame 200, the deposition mask 100 is pulled in the first direction 1D. More specifically, the deposition mask 100 is pulled in the length direction.

[0052] Therefore, stress generated by tensile forces remains inside the deposition mask 100. The deposition mask 100 includes regions where through-holes are formed and regions where through-holes are not formed. Therefore, the residual stress in the region where through-holes are formed and the residual stress in the region where through-holes are not formed are different.

[0053] Therefore, a stress difference occurs between the region where the through-holes are formed and the region where the through-holes are not formed. As a result, the deposition mask warps at the boundary region between the region where the through-holes are formed and the region where the through-holes are not formed.

[0054] Therefore, the deposition efficiency of the deposition mask decreases.

[0055] The following describes a vapor deposition mask that can resolve the stress differences described above.

[0056] Figure 5 is a plan view of the deposition mask 100 according to the embodiment.

[0057] Referring to Figure 5, the deposition mask 100 includes a deposition region DA and a non-deposition region NDA.

[0058] The deposition region DA is a region for forming a deposition pattern. The deposition region DA can be defined as the region in the longitudinal direction of the deposition mask 100 from the point where a through hole or hole first begins to the point where it ends.

[0059] The deposition region DA includes an effective region AA and an ineffective region UA. The effective region AA is the region where through-holes TH and island portions IS are formed. The ineffective region UA ​​is the region where through-holes TH and island portions IS are not formed. The ineffective region UA ​​is the region where grooves G are formed. The island portions IS are the region where the metal plate 10 is not etched.

[0060] Furthermore, the deposition region DA includes multiple effective regions.

[0061] The deposition region DA includes multiple separation regions IA1 and IA2. The separation regions IA1 and IA2 are positioned between adjacent effective regions. The separation regions IA1 and IA2 are separation regions between the multiple effective regions. The separation regions IA1 and IA2 allow adjacent effective regions to be distinguished from each other. Furthermore, one deposition mask 100 can support multiple effective regions.

[0062] The non-deposition region NDA is a region that does not participate in vapor deposition. The non-deposition region NDA includes frame fixing regions FA1 and FA2. The frame fixing regions FA1 and FA2 are regions for fixing the vapor deposition mask 100 to the mask frame 200. The non-deposition region NDA may also include half-etched sections HF1 and HF2 and open sections.

[0063] The aforementioned half-etched sections HF1 and HF2 can distribute the stress generated when the deposition mask 100 is stretched.

[0064] Furthermore, the open portion can distribute the stress generated when the deposition mask 100 is stretched. This reduces deformation of the deposition mask.

[0065] Figures 6 and 7 are enlarged views of area A in Figure 5. More specifically, Figures 6 and 7 are enlarged views of the deposition region DA. Figure 6 is a drawing of the deposition region DA before through holes and grooves are formed. Figure 7 is a drawing of the deposition region DA after through holes and grooves are formed.

[0066] Referring to Figure 6, the deposition region DA includes an effective region AA, an ineffective region UA, and a separation region IA.

[0067] The effective region AA is the region in which through-holes TH are formed. More specifically, multiple through-holes TH are formed in the effective region AA.

[0068] The effective region AA includes a first effective region AA1 and a second effective region AA2. The second effective region AA surrounds the first effective region AA1. Furthermore, the area of ​​the first effective region AA1 is greater than the area of ​​the second effective region AA.

[0069] The separation region IA is a region that separates a plurality of effective regions AA. Adjacent effective regions AA are separated by the separation region IA. Specifically, effective regions AA adjacent in the first direction 1D are separated by the separation region IA. Specifically, effective regions AA adjacent in the longitudinal direction of the deposition mask 100 are separated by the separation region IA.

[0070] The non-effective region UA ​​is a region in which the through-hole TH is not formed. The non-effective region UA ​​is located above and below the effective region AA. The deposition mask 100 includes a first termination E1 and a second termination E2 in the second direction 2D. The first termination E1 and the second termination E2 face each other in the width direction of the deposition mask 100.

[0071] The non-effective region UA ​​is located between at least one of the following: the effective region AA and the first termination E1, and the effective region AA and the second termination E2.

[0072] The widths of the effective area AA and the non-effective area UA are different. Specifically, the width W1 of the effective area AA in the second direction and the width W2 of the non-effective area UA in the second direction are different.

[0073] More specifically, the width W1 of the effective area AA is greater than the width W2 of the non-effective area UA. For example, the width W1 of the effective area AA may be 90% or more but less than 100% of the width of the metal plate 100. More specifically, the width W1 of the effective area AA may be 93% or more but less than 100% of the width of the metal plate 100. More specifically, the width W1 of the effective area AA may be 95% or more but 98% of the width of the metal plate 100.

[0074] Furthermore, the width W2 of the non-effective area UA may be more than 0% or less than 10% of the width of the metal plate 100. More specifically, the width W2 of the non-effective area UA may be more than 0% or 5% of the width of the metal plate 100. More specifically, the width W2 of the non-effective area UA may be more than 0% or 3% of the width of the metal plate 100.

[0075] Since the width of the effective region AA and the ineffective region UA ​​is set within the range, the spacing and size of the through-holes formed inside the effective region AA are formed within the range set to match the deposition efficiency. Furthermore, it is possible to prevent the size of the deposition mask from increasing due to the ineffective region UA. In addition, it is possible to improve the stress difference caused by the ineffective region UA.

[0076] Referring to Figure 7, multiple through-holes are formed in the effective region AA. Specifically, a first through-hole TH1 is formed in the first effective region AA1. The deposition pattern can be deposited on the deposition substrate 300 through the first through-hole TH1.

[0077] A second through-hole TH2 is formed in the second effective region AA2. The second through-hole TH2 is formed to have the same or similar shape as the first through-hole TH1. Furthermore, the second through-hole TH2 is formed to have the same or similar size as the first through-hole TH1.

[0078] The organic material can flow into the second through-hole TH2. However, the organic material that flows into the second through-hole TH2 is not deposited on the deposition substrate 300.

[0079] The second through-hole TH2 can prevent etching defects in the first through-hole TH1. Specifically, the second through-hole TH2 ensures that the size and / or spacing of the first through-holes TH located in the first effective region AA1 are uniform.

[0080] In the separation region IA, the surface of the metal plate is exposed. No through holes or grooves are formed in the separation region IA. In other words, the separation region IA is the region where the first surface 1S is exposed. That is, the opening ratio of the separation region IA is 0%.

[0081] Therefore, the deposition mask 100 can maintain its strength through the separation region IA.

[0082] Grooves G are formed in the non-effective region UA. More specifically, multiple grooves G are formed in the non-effective region UA. The grooves G are formed by etching any one surface of the metal plate 10. More specifically, the grooves G are formed by partially etching the first surface 1S. As a result, the grooves G penetrate the first surface 1S but not the second surface 2S.

[0083] The groove G may be formed with the same shape as at least one of the first through-holes TH1 and the second through-hole TH. Alternatively, the groove G may be formed with a different shape from at least one of the first through-holes TH1 and the second through-hole TH2.

[0084] The size of the groove G may differ from the size of at least one of the first through-holes TH1 and the second through-hole TH. For example, the size of the groove G may be smaller than the size of at least one of the first through-holes TH1 and the second through-hole TH.

[0085] The pitch of the groove G may differ from the pitch of at least one of the first through-holes TH1 and the second through-hole TH. For example, the pitch of the groove G may be smaller than the pitch of at least one of the first through-holes TH1 and the second through-hole TH.

[0086] This allows for efficient adjustment of stress distribution even when grooves are formed in the non-effective region instead of through holes.

[0087] The aperture ratio of the effective region AA and the aperture ratio of the non-effective region UA ​​are different. More specifically, the aperture ratio of the effective region AA is greater than the aperture ratio of the non-effective region UA. Here, the aperture ratio of the effective region AA is defined by the aperture ratio of the small area holes V1 formed on the first surface 1S. The aperture ratio of the non-effective region UA ​​is defined by the aperture ratio of the grooves G formed on the first surface 1S.

[0088] The aperture ratio of the effective region AA may be five times or more the aperture ratio of the non-effective region UA. More specifically, the aperture ratio of the effective region AA may be seven times or more the aperture ratio of the non-effective region UA. More specifically, the aperture ratio of the effective region AA may be ten times or more the aperture ratio of the non-effective region UA. More specifically, the aperture ratio of the effective region AA may be five to fifteen times the aperture ratio of the non-effective region UA.

[0089] Alternatively, the aperture ratio of the effective region AA may be 20% or more of the deposition region DA area of ​​the metal plate. More specifically, the aperture ratio of the effective region AA may be 25% or more of the deposition region DA area of ​​the metal plate. More specifically, the aperture ratio of the effective region AA may be 20% to 40% of the deposition region DA area of ​​the metal plate.

[0090] Alternatively, the aperture ratio of the non-effective region UA ​​may be 10% or less of the deposition region DA area of ​​the metal plate. More specifically, the aperture ratio of the non-effective region UA ​​may be 5% or less of the deposition region DA area of ​​the metal plate. More specifically, the aperture ratio of the non-effective region UA ​​may be 2% to 4% of the deposition region DA area of ​​the metal plate.

[0091] Since the aperture ratios of the effective region AA and the non-effective region UA ​​are set within the range described above, the organic material is stably deposited onto the deposition substrate 300 by the effective region AA.

[0092] Furthermore, warping of the non-effective region UA ​​can be prevented.

[0093] The deposition mask includes holes or grooves formed in the effective region AA and the non-effective region UA. Therefore, the stress difference generated when the deposition mask 100 is stretched is reduced. That is, when the deposition mask 100 is stretched, tensile stress is generated. This stress exists in the deposition mask as residual stress.

[0094] The deposition mask 100 includes grooves formed in the non-effective region UA. Therefore, the magnitude of residual stress in the non-effective region is reduced. Consequently, the difference in residual stress between the effective region AA and the non-effective region UA ​​is reduced.

[0095] This prevents the deposition mask from warping due to differences in residual stress.

[0096] Furthermore, the difference in strength between the first and second surfaces of the deposition mask is reduced. Specifically, grooves are additionally formed on the ineffective region of the first surface where small-area pores are formed. As a result, the difference between the aperture ratio of the first surface and the aperture ratio of the second surface is reduced.

[0097] Therefore, the difference in strength between the first and second surfaces is reduced. As a result, the vapor deposition mask can be prevented from warping due to the difference in strength.

[0098] Figure 8 is a diagram illustrating the size and spacing of the through-holes TH1 and TH2 and groove G of the deposition mask according to the embodiment.

[0099] Referring to Figure 8, the pitch P1 of the through holes TH1 and TH2 can be 50 μm to 200 μm. The width W1 of the through holes TH1 and TH2 can be 10 μm to 200 μm. The height H1 of the through holes TH1 and TH2 can be 10 μm to 200 μm.

[0100] Furthermore, the pitch P2 of the groove G may be less than 50% of the pitch P1 of the through holes TH1 and TH2. Also, the width W2 of the groove G may be less than 50% of the width W1 of the through holes TH1 and TH2. Furthermore, the height H2 of the groove G may be less than 50% of the height H1 of the through holes TH1 and TH2.

[0101] Furthermore, the distance D between the through-holes TH1 and TH2 and the groove G may be 50% or more of the pitch P1 of the through-holes TH1 and TH2. The distance between the through-holes TH1 and TH2 and the groove G may also be the distance in the longitudinal direction of the deposition mask 100.

[0102] The size and spacing of the through-holes TH1 and TH2 and the grooves G are formed within a set range. As a result, the evaporation efficiency of the evaporation mask can be improved by the through-holes. In addition, the grooves can prevent the evaporation mask from warping.

[0103] The features, structures, and effects described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to one embodiment. Furthermore, the features, structures, and effects exemplified in each embodiment can be combined or modified for implementation in other embodiments by a person with ordinary skill in the art to which the embodiment belongs. Therefore, such combinations and modifications should be interpreted as being included within the scope of the present invention.

[0104] Furthermore, although the above description has focused on embodiments, these are merely examples and do not limit the present invention. Anyone with ordinary skill in the art to which the present invention belongs can make various modifications and applications not exemplified above, without departing from the essential characteristics of these embodiments. For example, each component specifically presented in the embodiments can be modified and implemented. Such differences resulting from modifications and applications should be interpreted as being within the scope of the present invention as defined in the appended claims.

Claims

1. A metal plate including a vapor-deposited region and a non-vapor-deposited region, The deposition region includes a plurality of effective regions spaced apart from each other in the length direction and an ineffective region that overlaps with the plurality of effective regions along the width direction perpendicular to the length direction. Each of the aforementioned multiple effective regions includes a plurality of through holes, Each of the plurality of through holes includes a small area hole formed on the first surface of the metal plate, a large area hole formed on the second surface of the metal plate, and a communication portion connecting the small area hole and the large area hole. The non-effective region includes a plurality of grooves formed on the first or second surface that do not penetrate the metal plate, The groove is formed on the first surface as a vapor deposition mask.

2. The metal plate includes a first end and a second end facing each other in the width direction of the metal plate, The vapor deposition mask according to claim 1, wherein the non-effective region is located between the effective region and the first end and between the effective region and the second end, at least one of these locations.

3. At least one of the plurality of effective regions includes a first effective region and a second effective region arranged surrounding the first effective region. A first through-hole is provided in the first effective region. The vapor deposition mask according to claim 2, wherein a second through-hole is arranged in the second effective region.

4. The deposition mask according to claim 3, wherein the size of the groove is smaller than the size of at least one of the first and second through-holes.

5. The deposition mask according to claim 3, wherein the pitch of the grooves is smaller than the pitch of at least one of the first and second through holes.

6. The vapor deposition mask according to claim 1, wherein the width in the width direction of the metal plate in the non-effective region is greater than 0% to 10% of the width of the metal plate.

7. The vapor deposition mask according to claim 1, wherein the aperture ratio of the effective region is 5 to 15 times that of the non-effective region.

8. The vapor deposition mask according to claim 1, wherein the aperture ratio of the non-effective region is 2% to 4% of the area of ​​the vapor deposition region of the metal plate.

9. A separation region is arranged between adjacent effective regions in the longitudinal direction of the metal plate. The deposition mask according to claim 1, wherein the separation region exposes the first surface of the metal plate.

10. The deposition mask according to claim 1, wherein each of the plurality of grooves does not overlap with the plurality of through holes along the longitudinal direction.

11. The deposition mask according to claim 9, wherein the through-holes and grooves are not formed in the separation region.

12. The separation region comprises the first portion that overlaps the through-hole of the effective region in the longitudinal direction, The vapor deposition mask according to claim 11, comprising the groove in the non-effective region and a second portion overlapping in the longitudinal direction.

13. The deposition mask according to claim 3, wherein the size of the groove is smaller than the size of the small area pore of the first through hole and the size of the small area pore of the second through hole.

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