Photocurable components

Abstract

In one embodiment, the photocurable composition may include a polymerizable material and a photopolymerization initiator, and when R1 includes a carbon-carbon double bond and R2 is a substituted or unsubstituted alkyl, aryl, or alkylaryl, the polymerizable material includes an isocyanate group-containing compound of formula (1): R1-R2-N=C=O(1). An amount of 1wt% to 10wt% of the isocyanate group-containing compound causes strong adhesion strength of the photocurable composition to the silicon substrate after curing, and an adhesion layer between the substrate and the photocurable layer can be omitted.

Description

Technical Field

[0001] The present disclosure relates to a photocurable composition adapted for use in nanoimprint lithography (NIL) or inkjet adapted planarization (IAP) processes. The photocurable composition includes a polymeric material containing an isocyanate group-containing compound.

Background Art

[0002] Inkjet adapted planarization (IAP) uses a fluid liquid (resist) to fill trenches, gaps, or other topographical variations on a substrate. The applied liquid resist is then contacted by a superstrate and cured under the superstrate to form a planar layer. In nanoimprint lithography (NIL), a template is filled with a liquid resist and, after curing and further processing, the pattern of the template is transferred to the underlying substrate. During IAP and NIL processes, typically an adhesion layer is applied between the substrate and the resist to enhance the adhesion of the resist to the substrate.

[0003] There is a need to develop a photocurable composition that can be applied directly onto a substrate and has strong adhesion to the substrate so that an adhesion layer between the substrate and the resist is not required. If the adhesion layer between the substrate and the resist can be omitted, the processing time and cost can be reduced, and the product quality can be further improved.

Summary of the Invention

[0004] In one embodiment, the photocurable composition may include a polymerizable material and a photopolymerization initiator, wherein the polymerizable material includes at least one first monomer and at least one second monomer, where R1 contains a carbon-carbon double bond and R2 is a substituted or unsubstituted alkyl, aryl, or alkylaryl, the at least one first monomer includes an isocyanate group-containing compound of formula (1): R1-R2-N=C=O(1), and the amount of the isocyanate group-containing compound may be 1 wt% or more and 10 wt% or less based on the total weight of the photocurable composition.

[0005] In one embodiment of the photocurable resin, R1 in formula (1) may be selected from an acrylate group, a methacrylate group, or a vinyl group.

[0006] In another embodiment, R2 in formula (1) is phenyl, or C1-C 10 It can be alkyl or (C1-C6-alkyl)phenyl.

[0007] In certain embodiments of the photocurable composition, the isocyanate group-containing compound of formula (1) may be selected from 2-isocyanatoethyl acrylate, 3-isopropenyl-α,α-dimethylbenzyl isocyanate, 2-isocyanatoethyl methacrylate, allyl isocyanate, or any combination thereof.

[0008] In certain embodiments, the isocyanate group-containing compound may be selected from 2-isocyanatoethyl acrylate or 3-isopropenyl-α,α-dimethylbenzyl isocyanate.

[0009] In a further embodiment of the photocurable composition, the amount of the polymerizable material may be 90 wt% or more based on the total weight of the photocurable composition.

[0010] In another embodiment of the photocurable composition, the at least one second monomer of the polymerizable material may include an acrylate monomer, a maleimide monomer, an epoxide monomer, or a vinylbenzene.

[0011] In yet another embodiment, at least one second monomer of the photocurable composition may comprise at least one monofunctional acrylate monomer and at least one polyfunctional acrylate monomer. In a particular embodiment, the amount of the polyfunctional acrylate monomer may be 20 wt% or more based on the total weight of the photocurable composition. In a particular embodiment, the amount of the polyfunctional acrylate monomer may be 40 wt% or more based on the total weight of the photocurable composition.

[0012] In another embodiment, the viscosity of the photocurable composition at 23°C may be 30 mPa·s or less. In a particular embodiment, the viscosity of the curable composition at 23°C may be 15 mPa·s or less.

[0013] In a further embodiment, the photocurable composition may be essentially solvent-free.

[0014] In one embodiment, the laminate includes a substrate and a photocurable layer directly superimposed on the substrate, wherein the photocurable layer may be formed from the photocurable composition described in claim 1.

[0015] In one embodiment of the laminate, the adhesion strength of the photocured layer according to ASTM D 4541 may be 6.5 MPa or higher.

[0016] In another embodiment, a method for forming a photocurable layer on a substrate may include the steps of: directly coating a layer of a photocurable composition onto the substrate, wherein the photocurable composition comprises a polymerizable material and a photopolymerization initiator, the polymerizable material comprising at least one first monomer and at least one second monomer, where R1 comprises a carbon-carbon double bond and R2 is a substituted or unsubstituted alkyl, aryl, or alkylaryl, and the at least one first monomer comprises 1 wt% to 10 wt% of an isocyanate group-containing compound of formula (1): R1-R2-N=C=O(1); contacting the photocurable composition with an imprint template or superstraight; irradiating the photocurable composition with light to form a photocurable layer; and removing the imprint template or superstraight from the photocurable layer.

[0017] In one embodiment of the above method, the isocyanate group-containing compound of formula (1) may be selected from 2-isocyanatoethyl acrylate, 3-isopropenyl-α,α-dimethylbenzyl isocyanate, 2-isocyanatoethyl methacrylate, allyl isocyanate, or any combination thereof.

[0018] In another embodiment of the method described above, the at least one second monomer of the polymerizable material may comprise at least one monofunctional acrylate monomer and at least one polyfunctional acrylate monomer.

[0019] In a further embodiment of the above method, the amount of the polymerizable material may be 90 wt% or more based on the total weight of the curable composition.

[0020] In another embodiment, the method for manufacturing an article may include the steps of: coating a layer of a photocurable composition onto a substrate, wherein the photocurable composition comprises a polymerizable material and a photopolymerization initiator, the polymerizable material comprises at least one first monomer and at least one second monomer, where R1 comprises a carbon-carbon double bond and R2 is a substituted or unsubstituted alkyl, aryl, or alkylaryl, and the at least one first monomer comprises 1 wt% to 10 wt% of an isocyanate group-containing compound of formula (1): R1-R2-N=C=O(1); contacting the photocurable composition with an imprint template or superstraight; irradiating the photocurable composition with light to form at least a partially photocured layer; removing the imprint template or superstraight from the at least partially photocured layer; forming a pattern on the substrate; processing the substrate on which the pattern was formed in the forming step; and manufacturing an article from the substrate processed in the processing step. [Brief explanation of the drawing]

[0021] The embodiments are shown as examples only and are not limited to the attached drawings.

[0022] [Figure 1] Figure 1 includes a diagram showing a laminate according to one embodiment. [Modes for carrying out the invention]

[0023] The following description is provided to help understand the teachings disclosed herein and focuses on specific implementations and embodiments of the teachings. This focus is provided to help illustrate the teachings and should not be construed as a limitation on the scope or applicability of the teachings.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The materials, methods, and examples are illustrative only and not intended to be limiting. Many details regarding specific materials and processing acts not described herein are conventional and can be found in textbooks and other sources on imprint and lithography techniques.

[0025] As used herein, the terms "comprises," "comprising," "includes," "including," "has," "having," or any other variation thereof are intended to cover non-exclusive inclusion. For example, a process, method, article, or apparatus that comprises a list of features is not necessarily limited to only those features but may include other features not expressly listed or inherent to such process, method, article, or apparatus.

[0026] Also, as used herein, unless explicitly stated to the contrary, "or" refers to an inclusive OR and not an exclusive OR. For example, condition A or B is satisfied if either A is true (or present) and B is false (or absent), A is false (or absent) and B is true (or present), or both A and B are true (or present).

[0027] Furthermore, the use of "a" or "an" is employed to describe elements and components described herein. This is done merely for convenience and to indicate a general sense of the scope of the invention. The specification should be read to include one or at least one, and the singular form includes the plural form unless it is obvious that the intention is not to include more than one.

[0028] This disclosure relates to a photocurable composition comprising a polymerizable material and a photopolymerization initiator, wherein the polymerizable material may comprise at least one first monomer and at least one second monomer. When R1 comprises a carbon-carbon double bond and R2 is a substituted or unsubstituted alkyl, aryl, or alkylaryl group, the at least one first monomer comprises an isocyanate group-containing compound of formula (1): R1-R2-N=C=O(1). The amount of the isocyanate group-containing compound may be 1 wt% or more and 10 wt% or less based on the total weight of the photocurable composition.

[0029] In one embodiment, R1 in formula (1) may be selected from an acrylate group, a methacrylate group, or a vinyl group. In a further embodiment, R2 in formula (1) may be phenyl, or C1-C 10 It may be alkyl or (C1-C6 alkyl)-phenyl. As used herein, the term "alkyl(alkyl)" may include linear or branched alkyl structures.

[0030] In a further embodiment, the isocyanate group-containing compound of formula (1) may be a small molecule having a molecular weight of 1000 g / mol or less, for example, 500 g / mol or less, 400 g / mol or less, 300 g / mol or less, or 200 g / mol or less.

[0031] In one embodiment, the isocyanate group-containing compound of formula (1) is i) 2-isocyanatoethyl acrylate (ICA): TIFF0007912017000001.tif3596; ii) 3-Isopropenyl-α,α-dimethylbenzyl isocyanate (IDI): TIFF0007912017000002.tif8382; iii) 2-isocyanatoethyl methacrylate (ICM): TIFF0007912017000003.tif7765; iv) Isocyanate allyl (AIC): TIFF0007912017000004.tif2370; or any combination thereof, It can be selected from the following.

[0032] In a particular embodiment, the isocyanate group-containing compound may be 2-isocyanatoethyl acrylate (ICA). In another particular embodiment, the isocyanate group-containing compound may be 3-isopropenyl-α,α-dimethylbenzyl isocyanate (IDI).

[0033] At least one second monomer of the polymerizable material may be different from at least one first monomer, or may be polymerized together with at least one first monomer. Non-limiting examples of at least one second monomer may be acrylate monomers, maleimide monomers, epoxide monomers, vinylbenzenes (e.g., divinylbenzene), or any combination thereof.

[0034] In certain embodiments, at least one second monomer may comprise at least one acrylate monomer. In one embodiment, at least one acrylate monomer may be a combination of at least one monofunctional acrylate monomer and at least one polyfunctional acrylate monomer. As used herein, the term acrylate monomer relates to any monomer structure comprising acrylate units or substituted acrylate units, such as methacrylate units.

[0035] The amount of monofunctional acrylate monomer may be 20 wt% or more, 30 wt% or more, 40 wt% or more, or 50 wt% or more, based on the total weight of the photocurable composition. In another embodiment, the amount of monofunctional acrylate monomer may be 70 wt% or less, 60 wt% or less, 50 wt% or less, or 45 wt% or less.

[0036] In one embodiment, the polyfunctional acrylate monomer may be a difunctional acrylate monomer. In another embodiment, the polyfunctional acrylate monomer may be a trifunctional or tetrafunctional acrylate monomer. The amount of the polyfunctional acrylate monomer may be 10 wt% or more, or 15 wt% or more, or 20 wt% or more, or 30 wt% or more, or 40 wt% or more, or 50 wt% or more, based on the total weight of the photocurable composition. In yet another embodiment, the amount of the polyfunctional acrylate monomer may be 70 wt% or less, or 60 wt% or less, or 50 wt% or less, or 40 wt% or less.

[0037] In certain embodiments, the polymerizable material may comprise at least two monofunctional acrylate monomers and at least one difunctional acrylate monomer.

[0038] Non-limiting examples of acrylate monomers may include benzyl acrylate (BA), 1-naphthyl acrylate (1-NA), isobornyl acrylate (IBOA), benzyl methacrylate (BMA), 1-naphthyl methacrylate (1-NMA), tetrahydrofurfuryl acrylate, isobornyl acrylate (IBOA), dicyclopentanyl acrylate, pentafluorobenzyl acrylate, 1-adamantyl methacrylate, 2-adamantyl acrylate, trimethylcyclohexyl acrylate, or neopentyl glycol diacrylate, or bisphenol A dimethacrylate (BPADMA).

[0039] In further embodiments, the amount of polymerizable material contained in the photocurable composition may be 60 wt% or more, for example, 70 wt% or more, 80 wt% or more, 85 wt% or more, 90 wt% or more, or 95 wt% or more, based on the total weight of the photocurable composition. In another embodiment, the amount of polymerizable material may be 99.5 wt% or less, for example, 99 wt% or less, or 98 wt% or less, or 97 wt% or less, or 95 wt% or less, or 93 wt% or less, or 90 wt% or less. Furthermore, the amount of polymerizable material may be within a range that includes either of the above minimum and maximum values. In a particular embodiment, the amount of polymerizable material may be 85 wt% or more and 98 wt% or less, based on the total weight of the photocurable composition.

[0040] In further embodiments, the photocurable compositions of the present disclosure may be solvent-free. As used herein, the term “solvent,” unless otherwise specified, refers to a liquid compound in which polymerizable materials can be dissolved, but which itself is not polymerizable.

[0041] In one embodiment, the selection of monomers contained in the polymerizable material may be made so as to obtain a low viscosity of the curable composition before curing. In one embodiment, the viscosity of the photocurable composition may be 30 mPa·s or less, or 25 mPa·s or less, or 20 mPa·s or less, or 15 mPa·s or less, or 12 mPa·s or less, or 10 mPa·s or less, or 8 mPa·s or less. In another embodiment, the viscosity may be 2 mPa·s or more, for example, 3 mPa·s or more, or 4 mPa·s or more, or 5 mPa·s or more. In a particular embodiment, the curable composition may have a viscosity of 10 mPa·s or less. When used herein, all viscosity values ​​relate to viscosity measured at a temperature of 23°C using the Brookfield method.

[0042] One or more photopolymerization initiators can be included in the photocurable composition to initiate photocuring of the composition when exposed to light.

[0043] In another specific embodiment, curing can be carried out by a combination of photocuring and thermal curing, and thermal stability can be improved by additional thermal curing. In a particular embodiment, thermal curing after photocuring may be carried out at a temperature of 60°C to 250°C. In a particular embodiment, thermal curing may be carried out at a temperature of 190°C to 230°C.

[0044] In a further embodiment, the photocurable composition may contain at least one optional additive. Non-limiting examples of the optional additive may be surfactants, dispersants, stabilizers, cosolvents, initiators, inhibitors, dyes, or any combination thereof.

[0045] Surprisingly, it was discovered that by selecting a specific combination of the isocyanate group-containing compound of formula (1) and at least one second monomer, a photocurable composition can be prepared that has strong adhesion to the underlying substrate after curing, without the presence of an adhesion layer, and which may be usable for IAP or NIL treatment. Although not bound by theory, it is hypothesized that the isocyanate group of the isocyanate group-containing compound can react with functional groups present on the substrate surface, such as hydroxyl groups, amine groups, or carboxyl groups, thereby forming covalent bonds that contribute to the strong adhesion strength of the photocured layer to the substrate. Furthermore, the isocyanate group-containing compound may participate in polymerization and crosslinking reactions via carbon-carbon double bonds during photocuring and be covalently incorporated into the polymer matrix formed during photocuring.

[0046] In one embodiment, the photocurable layer formed from the photocurable composition of the present disclosure is part of a laminate (10), the laminate (10) may include a substrate (11) and a photocurable layer (12) directly superimposed on the substrate (11) (see Figure 1).

[0047] There are no limitations on the material of the substrate of the laminate. Non-limiting examples of substrates include ceramics, silicon, metals, metal alloys, polycarbonates, or organic polymers such as polyimides, polyurethanes, PTFE, PVDF, or polyamides.

[0048] In one embodiment, the adhesion strength (also referred to herein as the detachment strength) of the photocured layer to the silicon substrate at 23°C according to ASTM D 4541 may be 6.5 MPa or higher, for example, 7.0 MPa or higher, 7.5 MPa or higher, 8.0 MPa or higher, or 8.5 MPa or higher. In another embodiment, the adhesion strength may be 20 MPa or lower, for example, 15 MPa or lower, or 10 MPa or lower. Although not bound by theory, it is assumed that the outer surface of the silicon substrate contains a thin silicon oxide layer that generates hydroxyl groups when exposed to moisture in the air, and that the isocyanate groups of the isocyanate group-containing compound react with hydroxyl groups on the substrate surface to form covalent bonds.

[0049] In certain embodiments, the photocurable compositions of the present disclosure are adapted to be liquid resist compositions for use in IAP and NIL processes to form a photocurable resist layer.

[0050] This disclosure further relates to a method for forming a photocurable layer. The method may include the steps of: directly applying the above-mentioned photocurable composition to the outer surface of a substrate; bringing the photocurable composition into contact with a superstraight; irradiating the photocurable composition with light to form a photocurable layer; and removing the superstraight from the photocurable layer. In this specification, the term photocurable layer means that the photocurable composition is converted from a liquid stage to a solid stage, and the solid stage means that the photocurable composition is at least partially cured or completely cured.

[0051] In one embodiment, the light irradiation may be carried out with light having a wavelength of 250 nm to 760 nm. In a preferred embodiment, the light irradiation may be carried out with light having a wavelength of 320 nm to 450 nm.

[0052] The substrate and the solidified (cured) layer may be subjected to additional processing to form a desired article, for example, by an etching process to transfer an image corresponding to a pattern onto the substrate in one or both of the solidified layer and / or the pattern layer beneath the solidified layer. The substrate may be further subjected to known steps and processes for device (article) manufacturing, including, for example, curing, oxidation, layering, deposition, doping, planarization, etching, moldable material removal, dicing, bonding, and packaging. In one embodiment, the substrate may be processed to manufacture multiple articles (devices).

[0053] The cured layer may be further used as an interlayer insulating film in semiconductor devices such as LSIs, system LSIs, DRAMs, SDRAMs, RDRAMs, and D-RDRAMs, or as a resist film used in semiconductor manufacturing processes.

[0054] example

[0055] The following non-limiting embodiments illustrate the concepts described herein.

[0056] Example 1

[0057] Preparation of photocurable resist compositions

[0058] A photocurable base composition containing the following components was prepared: 10 wt% isobornyl acrylate (IBOA), 35 wt% benzyl acrylate (BA), 50 wt% neopentyl glycol diacrylate (SR247), 2 wt% photopolymerization initiator Irgacure® TPO 4265, BASF (diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide), and 3 wt% photopolymerization initiator Irgacure® 4265, BASF (a 50:50 blend of 2-hydroxy-2-methyl-1-phenyl-1-propanone and diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide). All wt% amounts refer to the total weight of the photocurable base composition. The photocurable base composition is referred to as Sample C2 below.

[0059] Various photocurable compositions (S1-S6) were prepared by adding an isocyanate group-containing compound in an amount of 1 wt% to 10 wt% based on the total weight of the photocurable composition to a base composition. 2-Isocyanatoethyl acrylate and 3-Isopropenyl-α,α-dimethylbenzyl isocyanate were used as the isocyanate group-containing compounds, both of which contain a carbon-carbon double bond in the form of either an acrylate group or a vinyl group, in addition to the isocyanate group.

[0060] Table 1 provides an overview of all photocurable compositions.

[0061] [Table 1]

[0062] The comparative photocurable composition (C1) was prepared by adding 3-chlorophenyl isocyanate, a compound containing an isocyanate group but no carbon-carbon double bond, to the base composition.

[0063] It was found that neither the addition of the selected isocyanate group-containing compound to the photocurable base composition nor the addition of the isocyanate group-containing compound in an amount of 10 wt% resulted in an increase in viscosity. All samples had a viscosity of less than 10 mPa·s and were suitable for NIL or IAP treatment.

[0064] Laminate preparation and adhesion strength testing

[0065] To measure the adhesion strength of photocurable resist to silicon wafers, the following assembly was constructed and tested.

[0066] A virgin-grade silicon wafer (double-sided polished, manufactured by Advantive Technologies) with a diameter of 200 mm was cut into 25 mm x 25 mm square pieces. 2 μl of liquid resist sample was dropped into the center of each 25 mm x 25 mm silicon wafer piece using a pipette. A glass rod with a diameter of 5 mm and a length of 10 mm was placed at one end within the liquid resist, positioned perpendicular to the wafer surface (x and y) in the z direction. The glass rod contained a solid adhesion layer coating fabricated from TranSpin BT20-10 (see also U.S. Patent Application Publication No. 2007 / 0212494). The adhesion layer of the glass rod was selected to ensure stronger adhesion of the glass rod to the photocurable resist than the adhesion strength of the photocurable resist to the silicon wafer.

[0067] At room temperature (23°C), 16 mW / cm² 2 By exposing the silicon wafer to ultraviolet light for 18.8 seconds, photocuring was performed on the liquid resist placed on the silicon wafer, which corresponds to a curing energy of 300 mJ.

[0068] After photocuring, an aluminum plate was attached to the back side (uncoated side) of the silicon wafer using an epoxy adhesive (Gorilla Epoxy Adhesive Clear from Gorilla Glue Company, not shown). The aluminum plate measured 25 mm x 50 mm and was 1 / 8 inch thick, covering the finished silicon wafer. The epoxy adhesive was selected so that the adhesion strength of the aluminum plate to the silicon wafer was stronger than the adhesion strength of the photocured resist layer to the silicon wafer.

[0069] The actual adhesion test (measurement of tensile strength 9) was performed using an Instron Model 5542 tensile testing machine in accordance with ASTM D 4541. A silicon wafer containing a glass rod, mounted on an aluminum plate and one end fixed to a silicon substrate via a photocured resist, was placed in a fixed position in the tensile testing machine. The moving head from the Instron tensile testing machine was adjusted so that it moved toward the glass rod at a speed of 0.5 mm per minute, and on its side, struck the glass rod 1.5 mm away from the end of the glass rod attached to the resist, and the force was recorded, at which point the glass rod with the attached resist layer was separated from the silicon substrate. The adhesion strength (i.e., the tensile strength of the resist relative to the silicon wafer) was measured in pounds, and the force was measured in pounds / mm 2 Normalized to (19.62 mm at the end of the glass rod) 2 The values ​​were further converted to units of MPa by dividing by the surface area and multiplying by a coefficient of 0.2248. In the prepared test setup, the weakest interface was the interface between the silicon wafer and the cured resist layer, and the force required to separate the resist layer from the silicon wafer via the glass rod was measured.

[0070] For each sample, the test was repeated eight times, and the average value was calculated.

[0071] As a further comparative sample (C3), a silicon substrate containing an adhesion promoter layer coated with the above-mentioned photocurable base composition consisting of acrylicoxymethyltrimethoxysilane and not containing an isocyanate group compound was used.

[0072] Table 1 summarizes the results of the adhesion strength test. It can be seen that the base composition (C2) applied directly to the silicon wafer without an adhesion layer between the silicon substrate and the base layer had almost no adhesion. When only 1 wt% of the isocyanate group-containing compound 2-isocyanatoethyl acrylate (ICA) (see S1) or 3-isopropenyl-α,α-dimethylbenzyl isocyanate (IDI) (see S4) was added, the adhesion strength increased significantly, from 0.95 MPa (C2) to 8.1 MPa (S1) and from 0.95 MPa (C2) to 7.0 MPa (S4). When the amount of isocyanate group-containing compound was further increased from 1 wt% to 10 wt%, the adhesion strength of compound ICA increased further from 8.1 MPa (S1) to 8.96 MPa (S3), but only a slight further increase in the separation strength of compound IDI was observed, from 7.0 MPa (S4) to 7.37 MPa (S6).

[0073] When an isocyanate group-containing compound containing only isocyanate groups and no carbon-carbon double bonds (see C1) was added to the base composition, an increase in peel strength was observed compared to the photocurable base composition (C2). However, this peel strength was far lower than the peel strength required to remove the photocured layer prepared with a composition containing an isocyanate group-containing compound that includes a carbon-carbon double bond and corresponds to formula (1) above. The adhesion strength of photocured samples S1 to S6 was equivalent to the adhesion strength obtained when the base composition was attached to the substrate with a typical adhesion layer (see comparative sample C3).

[0074] The results of the adhesion strength test show that by directly adding an isocyanate group-containing compound corresponding to formula (1) to the photocurable resist composition, nearly the same adhesion strength (measured as peel strength) as when an additional adhesion layer is used can be obtained. The experimental data demonstrate that the photocurable composition of this disclosure is suitable for use in NIL or IAP processing without the inclusion of an additional adhesion layer.

[0075] The viscosity of the samples was measured using a Brookfield Viscometer LVDV-II + Pro at 200 rpm, spindle size #18, and 23°C. For viscosity testing, approximately 6–7 mL of sample liquid was added to the sample chamber in an amount sufficient to cover the spindle head. At least three measurements were performed for each viscosity test, and the average value was calculated.

[0076] The specifications and descriptions of the embodiments described herein are intended to provide a general understanding of the structures of various embodiments. The specifications and descriptions do not exhaustively or comprehensively describe all elements and features of apparatuses and systems that use the structures or methods described herein. A single embodiment may be provided in combination with another embodiment, and conversely, for the sake of brevity, various features described in the context of a single embodiment may be provided separately or in any subcombination. Furthermore, references to values ​​described in ranges include each and all values ​​within that range. Many other embodiments may be apparent to those skilled in the art only after reading this specification. Other embodiments may be used and derived from this disclosure so that structural substitutions, logical substitutions, or other modifications may be made without departing from the scope of this disclosure. Therefore, this disclosure should be considered illustrative rather than restrictive.

Claims

1. A photocurable composition adapted for use in nanoimprint lithography (NIL) or inkjet adaptive planarization (IAP) processes, which is cured by irradiation with light while in contact with an imprint template or superstraight, The aforementioned photocurable composition comprises a polymerizable material and a photopolymerization initiator. The polymerizable material comprises at least one first monomer and at least one second monomer, wherein the second monomer is a monomer different from the first monomer, R 1 Let R contain a carbon-carbon double bond. 2 When is a substituted or unsubstituted alkyl, aryl, or alkylaryl, the at least one first monomer is of formula (1):R 1 -R 2 It contains an isocyanate group-containing compound of -N=C=O(1), The amount of the isocyanate group-containing compound is 1 wt% or more and 10 wt% or less, based on the total weight of the photocurable composition. A photocurable composition characterized by the following features.

2. R in equation (1) above 1 The photocurable composition according to claim 1, characterized in that the group is selected from an acrylate group, a methacrylate group, or a vinyl group.

3. R 2 is phenyl, or C 1 -C 10 alkyl, or C 1 -C 6 alkyl-phenyl, and the photocurable composition according to claim 1, characterized in that.

4. The photocurable composition according to claim 1, characterized in that the isocyanate group-containing compound of formula (1) is selected from 2-isocyanatoethyl acrylate, 3-isopropenyl-α,α-dimethylbenzyl isocyanate, 2-isocyanatoethyl methacrylate, allyl isocyanate, or any combination thereof.

5. The photocurable composition according to claim 1, characterized in that the isocyanate group-containing compound of formula (1) is selected from 2-isocyanatoethyl acrylate or 3-isopropenyl-α,α-dimethylbenzyl isocyanate.

6. The photocurable composition according to claim 1, characterized in that the amount of the polymerizable material is 90 wt% or more based on the total weight of the photocurable composition.

7. The photocurable composition according to claim 1, characterized in that the at least one second monomer of the polymerizable material includes an acrylate monomer, a maleimide monomer, an epoxide monomer, a vinylbenzene, or any combination thereof.

8. The photocurable composition according to claim 1, characterized in that the at least one second monomer comprises at least one monofunctional acrylate monomer and at least one polyfunctional acrylate monomer.

9. The photocurable composition according to claim 8, characterized in that the amount of the polyfunctional acrylate monomer is 20 wt% or more based on the total weight of the photocurable composition.

10. The photocurable composition according to claim 8, characterized in that the amount of the polyfunctional acrylate monomer is 40 wt% or more based on the total weight of the photocurable composition.

11. The photocurable composition according to claim 1, characterized in that the viscosity of the photocurable composition at 23°C is 30 mPa·s or less.

12. The photocurable composition according to claim 7, characterized in that the viscosity of the photocurable composition at 23°C is 15 mPa·s or less.

13. The photocurable composition according to claim 1, characterized in that the photocurable composition does not contain a solvent.

14. A laminate comprising a substrate and a photocurable layer directly superimposed on the substrate, wherein the photocurable layer is formed from the photocurable composition described in claim 1.

15. The laminate according to claim 14, characterized in that the adhesion strength of the photocured layer to the silicon substrate at 23°C according to ASTM D 4541 is 6.5 MPa or more.

16. A method for forming a photocurable layer on a substrate, A step of directly coating a layer of a photocurable composition onto the substrate, wherein the photocurable composition comprises a polymerizable material and a photopolymerization initiator, the polymerizable material comprises at least one first monomer and at least one second monomer, the second monomer being a monomer different from the first monomer, R 1 Let R contain a carbon-carbon double bond. 2 When is a substituted or unsubstituted alkyl, aryl, or alkylaryl, the at least one first monomer is 1 wt% to 10 wt% of formula (1): R 1 -R 2 It contains an isocyanate group-containing compound of -N=C=O(1), The steps include bringing the photocurable composition into contact with an imprint template or superstraight, The process involves irradiating the photocurable composition with light to form a photocurable layer, A step of removing the photocured layer, the imprint template or the superstraight, A method characterized by having the following:

17. The method according to 16, characterized in that the isocyanate group-containing compound of formula (1) is selected from 2-isocyanatoethyl acrylate, 3-isopropenyl-α,α-dimethylbenzyl isocyanate, 2-isocyanatoethyl methacrylate, allyl isocyanate, or any combination thereof.

18. The method according to claim 16, wherein the at least one second monomer of the polymerizable material comprises at least one monofunctional acrylate monomer and at least one polyfunctional acrylate monomer.

19. The method according to 16, characterized in that the amount of the polymerizable material is 90 wt% or more based on the total weight of the photocurable composition.

20. A step of coating a layer of a photocurable composition onto a substrate, wherein the photocurable composition comprises a polymerizable material and a photopolymerization initiator, the polymerizable material comprises at least one first monomer and at least one second monomer, the second monomer being a monomer different from the first monomer, R 1 Let R contain a carbon-carbon double bond. 2 When is a substituted or unsubstituted alkyl, aryl, or alkylaryl, the at least one first monomer is 1 wt% to 10 wt% of formula (1): R 1 -R 2 It contains an isocyanate group-containing compound of -N=C=O(1), The steps include bringing the photocurable composition into contact with an imprint template or superstraight, A step of irradiating the photocurable composition with light to form at least a partially photocured layer, A step of removing the imprint template or the superstraight from the at least partially photocured layer, A step of forming a pattern on the substrate, A step of processing the substrate on which the pattern has been formed in the above forming step, A step of manufacturing an article from the substrate processed in the above-mentioned processing step, A method for manufacturing articles, characterized by having the following features.

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