Electronic components

Abstract

This electronic component comprises: a first resonance circuit that is configured to include a first inductor and a first capacitor; and a second resonance circuit that is configured to include a second inductor, which is magnetically coupled to the first inductor, and a second capacitor. The first resonance circuit includes a third inductor that is electrically series-connected to the first inductor. The third inductor is arranged to be magnetically coupled to the second inductor.

Description

Technical Field

[0001] This disclosure relates to electronic components. This application claims priority based on Japanese Application No. 2022-116233 filed on July 21, 2022, and incorporates by reference all the descriptions set forth in the Japanese application.

Background Art

[0002] As an electronic component, there is known one including a first resonator configured to include a first inductor and a first capacitor, and a second resonator configured to include a second inductor and a second capacitor, wherein the first inductor and the second inductor are magnetically coupled (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In this disclosure, an electronic component capable of improving frequency characteristics is described,

Means for Solving the Problems

[0005] An electronic component according to one aspect of this disclosure includes a first resonance circuit configured to include a first inductor and a first capacitor, and a second resonance circuit configured to include a second inductor magnetically coupled to the first inductor and a second capacitor, wherein the first resonance circuit includes a third inductor electrically connected in series with the first inductor, and the third inductor is arranged to be magnetically coupled to the second inductor.

Effects of the Invention

[0006] Each aspect and embodiment of this disclosure provides an electronic component with improved frequency characteristics. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a perspective view of an electronic component according to the first embodiment. [Figure 2] Figure 2 shows the electronic component shown in Figure 1, viewed from the insulator side. [Figure 3] Figure 3 is a side view of the electronic component shown in Figure 1. [Figure 4] Figure 4 is an end view of the electronic component shown in Figure 1. [Figure 5] Figure 5 shows the conductor pattern that constitutes the LC filter section of the electronic component shown in Figure 1. [Figure 6] Figure 6 shows a conductor pattern. [Figure 7] Figure 7 is the equivalent circuit diagram of the electronic component shown in Figure 1. [Figure 8] Figure 8 is a perspective view of an electronic component according to the second embodiment. [Figure 9] Figure 9 shows the electronic component shown in Figure 8, viewed from the insulator side. [Figure 10] Figure 10 is a side view of the electronic component shown in Figure 8. [Figure 11] Figure 11 is an end view of the electronic component shown in Figure 8. [Figure 12] Figure 12 shows the conductor pattern that constitutes the LC filter section of the electronic component shown in Figure 8. [Figure 13] Figure 13 shows a conductor pattern. [Figure 14] Figure 14 is an equivalent circuit diagram of the electronic component shown in Figure 8. [Figure 15] Figure 15 is a perspective view of an electronic component according to the third embodiment. [Figure 16] Figure 16 is a view of the electronic component shown in Figure 15 from the insulator side. [Figure 17] Figure 17 is a side view of the electronic component shown in Figure 15. [Figure 18] Figure 18 is an end view of the electronic component shown in Figure 15. [Figure 19] Figure 19 is a diagram showing a conductor pattern that constitutes an LC filter section provided in the electronic component shown in Figure 15. [Figure 20] Figure 20 is a diagram showing a conductor pattern. [Figure 21] Figure 21 is an equivalent circuit diagram of the electronic component shown in Figure 15. [Figure 22] Figure 22 is a perspective view of an electronic component according to the fourth embodiment. [Figure 23] Figure 23 is a view of the electronic component shown in Figure 22 as seen from the insulator side. [Figure 24] Figure 24 is a side view of the electronic component shown in Figure 22. [Figure 25] Figure 25 is an end view of the electronic component shown in Figure 22. [Figure 26] Figure 26 is a diagram showing a conductor pattern that constitutes an LC filter section provided in the electronic component shown in Figure 22. [Figure 27] Figure 27 is an equivalent circuit diagram of the electronic component shown in Figure 22. [Figure 28] Figure 28 is a diagram showing the filter characteristics of an electronic component. [Figure 29] Figure 29 is a diagram showing an enlarged part of the filter characteristics shown in Figure 28. [Figure 30] Figure 30 is a perspective view of an electronic component according to the fifth embodiment. [Figure 31] Figure 31 is a view of the electronic component shown in Figure 30 as seen from the insulator side. [Figure 32] Figure 32 is a side view of the electronic component shown in Figure 30. [Figure 33] Figure 33 is an end view of the electronic component shown in Figure 30. [Figure 34] Figure 34 is a diagram showing a conductor pattern that constitutes an LC filter section provided in the electronic component shown in Figure 30. [Figure 35] Figure 35 is a diagram showing a conductor pattern. [Figure 36]Figure 36 is an equivalent circuit diagram of the electronic component shown in Figure 30. [Figure 37] Figure 37 shows the filter characteristics of an electronic component. [Figure 38] Figure 38 is a magnified view of a portion of the filter characteristics shown in Figure 37. [Figure 39] Figure 39 is a perspective view of an electronic component according to the sixth embodiment. [Figure 40] Figure 40 shows the electronic component shown in Figure 39, viewed from the insulator side. [Figure 41] Figure 41 is a side view of the electronic component shown in Figure 39. [Figure 42] Figure 42 is an end view of the electronic component shown in Figure 39. [Figure 43] Figure 43 shows the conductor pattern that constitutes the LC filter section of the electronic component shown in Figure 39. [Figure 44] Figure 44 shows a conductor pattern. [Figure 45] Figure 45 is an equivalent circuit diagram of the electronic component shown in Figure 39. [Figure 46] Figure 46 shows the filter characteristics of an electronic component. [Figure 47] Figure 47 is a magnified view of a portion of the filter characteristics shown in Figure 46. [Figure 48] Figure 48 shows an electronic component according to another embodiment, viewed from the insulator side. [Modes for carrying out the invention]

[0008] [1] Overview of the embodiment (1) An electronic component relating to one aspect of the present disclosure comprises a first resonant circuit comprising a first inductor and a first capacitor, and a second resonant circuit comprising a second inductor and a second capacitor that are magnetically coupled to the first inductor, wherein the first resonant circuit includes a third inductor electrically connected in series with the first inductor, and the third inductor is arranged to be magnetically coupled with the second inductor.

[0009] In one aspect of the present disclosure, the electronic component includes a first resonant circuit, which includes a third inductor electrically connected in series with a first inductor. The third inductor is arranged to be magnetically coupled with a second inductor. In this way, the frequency characteristics of the electronic component can be adjusted by arranging the third inductor so that it is magnetically coupled with the second inductor of the first resonant circuit. Specifically, such an electronic component can, for example, increase (improve) the attenuation in the high-frequency band. Therefore, the frequency characteristics can be improved by such an electronic component.

[0010] (2) The electronic component described in (1), wherein the second resonant circuit includes a fourth inductor electrically connected in series with the second inductor, and the fourth inductor is arranged to be magnetically coupled with the first and third inductors. In this configuration, the frequency characteristics can be further adjusted by the magnetic coupling of the fourth inductor of the second resonant circuit with the first and third inductors. Specifically, such an electronic component can, for example, increase the attenuation in the high-frequency band. Thus, the frequency characteristics can be further improved by such an electronic component.

[0011] (3) The electronic component described in (1) or (2), wherein the first inductor pattern constituting the first inductor and the second inductor pattern constituting the second inductor are arranged side by side, and the distance between the first inductor pattern and the second inductor pattern is shorter than the radius of the first inductor pattern and the second inductor pattern, respectively. In this configuration, the magnetic coupling between the first inductor and the second inductor can be strengthened.

[0012] (4) The electronic component described in (1), wherein the first inductor pattern constituting the first inductor and the second inductor pattern constituting the second inductor are arranged side by side, the third inductor pattern constituting the third inductor and the fourth inductor pattern constituting the fourth inductor are arranged side by side, and the distance between the first inductor pattern and the second inductor pattern is shorter than the distance between the first inductor pattern and the third inductor pattern, and the distance between the second inductor pattern and the fourth inductor pattern. In this configuration, the degree of coupling can be adjusted while strengthening the magnetic coupling between the first inductor and the second inductor.

[0013] (5) The electronic component described in (4), wherein the distance between the third inductor pattern and the fourth inductor pattern is shorter than the radius of the third inductor pattern and the fourth inductor pattern, respectively. In this configuration, the magnetic coupling between the third inductor and the fourth inductor can be strengthened.

[0014] (6) The electronic component described in (1), wherein the first inductor pattern constituting the first inductor and the second inductor pattern constituting the second inductor are arranged side by side, and the distance between the first inductor pattern and the second inductor pattern is shorter than the radius of the third inductor pattern constituting the third inductor. In this configuration, the magnetic coupling between the first inductor and the second inductor can be strengthened.

[0015] (7) The electronic component as described in (6), wherein the second resonant circuit includes a fourth inductor electrically connected in series with the second inductor, the fourth inductor being arranged to be magnetically coupled with the first and third inductors, the third inductor pattern and the fourth inductor pattern constituting the fourth inductor are arranged side by side, and the distance between the first inductor pattern and the second inductor pattern is equal to the distance between the third inductor pattern and the fourth inductor pattern. In this configuration, the magnetic coupling between the first inductor and the second inductor, and between the third inductor and the fourth inductor can be strengthened.

[0016] (8) The electronic component according to (6) or (7), wherein the distance between the first inductor pattern and the second inductor pattern is equal to the distance between the first inductor pattern and the third inductor pattern. In this configuration, the magnetic coupling of the first inductor, the second inductor, the third inductor and the fourth inductor can be strengthened.

[0017] (9) The electronic component described in (2), wherein the radius of the third inductor pattern constituting the third inductor and the radius of the fourth inductor pattern constituting the fourth inductor are different. In this configuration, the degree of magnetic coupling can be adjusted by making the radii of the inductor patterns different.

[0018] (10) The electronic component described in (1), wherein the first inductor pattern constituting the first inductor and the third inductor pattern constituting the third inductor are connected and formed as a single unit. In this configuration, the first inductor pattern and the third inductor pattern are integrated. Therefore, in the electronic component, the areas of the first inductor pattern and the third inductor pattern can be made larger compared to the case where the first inductor pattern and the third inductor pattern are provided separately. Consequently, the Q value of the inductor can be improved in such an electronic component. When the Q value of the inductor is improved, the Q value of the resonator including the inductor is also improved, and thereby the frequency characteristics of the resonant circuit can be improved.

[0019] (11) The electronic component described in (10), wherein the first capacitor pattern constituting the first capacitor is connected to the portion where the first inductor pattern and the third inductor pattern are connected. In this configuration, the frequency characteristics can be adjusted by adjusting the connection position of the first capacitor. Specifically, such an electronic component can, for example, adjust the amount of attenuation in the high-frequency band. Therefore, the frequency characteristics can be improved by such an electronic component.

[0020] (12) The electronic component according to (11), wherein the second resonant circuit includes a fourth inductor electrically connected in series with the second inductor, the fourth inductor being arranged to be magnetically coupled with the first and third inductors. In this configuration, the frequency characteristics can be further adjusted by the magnetic coupling of the fourth inductor of the second resonant circuit with the first and third inductors. Specifically, such an electronic component can, for example, increase the attenuation in the high-frequency band. Thus, the frequency characteristics can be further improved by such an electronic component.

[0021] (13) The electronic component described in (12), wherein the second inductor pattern constituting the second inductor and the fourth inductor pattern constituting the fourth inductor are connected and formed as a single unit. In this configuration, the second inductor pattern and the fourth inductor pattern are integrated. Therefore, in the electronic component, the areas of the second inductor pattern and the fourth inductor pattern can be made larger compared to the case where the second inductor pattern and the fourth inductor pattern are provided separately. Consequently, the Q value of the inductor can be improved in the electronic component. When the Q value of the inductor is improved, the Q value of the resonator including the inductor is also improved, and thereby the frequency characteristics of the resonant circuit can be improved.

[0022] (14) The electronic component described in (13), wherein the second capacitor pattern constituting the second capacitor is connected to the portion where the second inductor pattern and the fourth inductor pattern are connected. In this configuration, the frequency characteristics can be adjusted by adjusting the connection position of the second capacitor. Specifically, such an electronic component can, for example, adjust the amount of attenuation in the high-frequency band. Therefore, the frequency characteristics can be improved by such an electronic component.

[0023] [2] Examples of embodiments Embodiments of this disclosure will be described in detail below with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant descriptions are omitted.

[0024] (First Embodiment) Figure 1 is a perspective view of an electronic component according to the first embodiment. Figure 2 is a view of the electronic component shown in Figure 1 from the insulator side. Figure 3 is a side view of the electronic component shown in Figure 1. Figure 4 is an end view of the electronic component shown in Figure 1.

[0025] The electronic component 1 shown in Figure 1 is an LC filter. Electronic component 1 is a so-called thin-film LC filter. An LC filter can be a bandpass filter. As shown in Figures 1 and 2, electronic component 1 comprises a substrate 2, an insulator 3, and first terminal electrode 4, second terminal electrode 5, third terminal electrode 6, fourth terminal electrode 7, fifth terminal electrode 8, sixth terminal electrode 9, seventh terminal electrode 10, and eighth terminal electrode 11 arranged on the insulator 3.

[0026] The substrate 2 has, for example, a rectangular parallelepiped shape. The rectangular parallelepiped shape may include a rectangular parallelepiped shape in which the corners and edges are chamfered, and a rectangular parallelepiped shape in which the corners and edges are rounded. As shown in Figures 1, 3, and 4, the substrate 2 has as its outer surface a pair of opposing end faces 2a, 2b, a pair of opposing main faces 2c, 2d, and a pair of opposing side faces 2e, 2f.

[0027] The direction in which a pair of end faces 2a and 2b face each other is the first direction D1. The direction in which a pair of main faces 2c and 2d face each other is the second direction D2. The direction in which a pair of side faces 2e and 2f face each other is the third direction D3. In this embodiment, the first direction D1 is the longitudinal direction of the substrate 2. The second direction D2 is the height direction of the substrate 2 and is perpendicular to the first direction D1. The third direction D3 is the width direction of the substrate 2 and is perpendicular to both the first direction D1 and the second direction D2. Viewing from the second direction D2 corresponds to a plan view.

[0028] A pair of end faces 2a and 2b extend in a second direction D2 to connect a pair of main faces 2c and 2d. The pair of end faces 2a and 2b also extend in a third direction D3. A pair of side surfaces 2e and 2f extend in a second direction D2 to connect a pair of main faces 2c and 2d. The pair of side surfaces 2e and 2f also extend in a first direction D1.

[0029] The substrate 2 can be formed from a material that is chemically and thermally stable, generates little stress, and maintains surface smoothness. While not particularly limited, this material can include silicon single crystals, alumina, sapphire, aluminum nitride, MgO single crystals, SrTiO3 single crystals, surface silicon oxide, glass, quartz, ferrite, and others.

[0030] The insulator 3 has, for example, a rectangular parallelepiped shape. As shown in Figures 1 to 4, the insulator 3 has, as its outer surface, a pair of opposing end faces 3a, 3b, a pair of opposing main faces 3c, 3d, and a pair of opposing side faces 3e, 3f. The pair of end faces 3a, 3b face each other in the first direction D1. The pair of main faces 3c, 3d face each other in the second direction D2. The pair of side faces 3e, 3f face each other in the third direction D3.

[0031] A pair of end faces 3a and 3b extend in a second direction D2 to connect a pair of main faces 3c and 3d. The pair of end faces 3a and 3b also extend in a third direction D3. A pair of side faces 3e and 3f extend in a second direction D2 to connect a pair of main faces 3c and 3d. The pair of side faces 3e and 3f also extend in a first direction D1. The dimension of the insulator 3 in the first direction D1 is equivalent to the dimension of the substrate 2 in the first direction D1. The dimension of the insulator 3 in the third direction D3 is equivalent to the dimension of the substrate 2 in the third direction D3.

[0032] In this embodiment, "equivalent" means not only being equal, but also including slight differences or manufacturing tolerances within a predetermined range. For example, if multiple values ​​fall within ±5% of the average of those multiple values, then those multiple values ​​are defined as equivalent.

[0033] The insulator 3 is constructed by laminating multiple insulating layers. The insulating layers may be made of organic insulating materials such as polyimide. The insulating layers are laminated in the second direction D2. That is, the second direction D2 is the lamination direction. In the actual insulator 3, the multiple insulating layers are integrated to such an extent that the boundaries between the layers are not visible.

[0034] The substrate 2 and the insulator 3 are integrally formed. The substrate 2 and the insulator 3 are arranged so that their main surfaces 2c and 3d face each other. A planarization layer 12 is placed between the substrate 2 and the insulator 3. The planarization layer 12 is placed between the main surface 2c of the substrate 2 and the main surface 3d of the insulator 3. Alumina, silicon oxide, and the like can be used as the planarization layer 12.

[0035] As shown in Figures 1 and 2, the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, the sixth terminal electrode 9, the seventh terminal electrode 10, and the eighth terminal electrode 11 are arranged on the main surface 3c of the insulator 3. The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the sixth terminal electrode 9, the seventh terminal electrode 10, and the eighth terminal electrode 11 may be ground terminals. The fourth terminal electrode 7 may be a signal input terminal. The fifth terminal electrode 8 may be a signal output terminal.

[0036] The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, the sixth terminal electrode 9, the seventh terminal electrode 10, and the eighth terminal electrode 11 are circular in shape when viewed from above. The circular shape may include a perfect circle or an ellipse.

[0037] The first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are positioned near the end face 3a. The fourth terminal electrode 7 and the fifth terminal electrode 8 are positioned near the side surface 3f. The sixth terminal electrode 9, the seventh terminal electrode 10, and the eighth terminal electrode 11 are positioned near the end face 3b. The fourth terminal electrode 7 and the fifth terminal electrode 8 are positioned with a predetermined distance between them in the first direction D1. The positions of the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, the sixth terminal electrode 9, the seventh terminal electrode 10, and the eighth terminal electrode 11 can be appropriately set in accordance with the arrangement of the conductor pattern described later.

[0038] The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, the fourth terminal electrode 7, the fifth terminal electrode 8, the sixth terminal electrode 9, the seventh terminal electrode 10, and the eighth terminal electrode 11 can be made of, for example, gold, nickel, copper, silver, or the like.

[0039] In electronic component 1, the LC filter section 13 is located within the insulator 3. Figure 5 shows the conductor patterns (connecting conductors) that constitute the LC filter section 13 of the electronic component 1 shown in Figure 1. In electronic component 1, the conductor patterns are arranged in the order shown in layers F, E, D, C, B, and A in Figure 5, starting from the substrate 2 side (the main surface 3d side of the insulator 3). The conductor patterns may include inductor patterns, capacitor patterns, and via patterns. The conductor patterns can be formed from, for example, copper.

[0040] As shown in layer F of Figure 5, the LC filter section 13 includes an inductor pattern (first inductor pattern) 15, an inductor pattern (second inductor pattern) 16, an inductor pattern (third inductor pattern) 17, an inductor pattern (fourth inductor pattern) 18, a capacitor pattern 19, and a capacitor pattern 20. The inductor patterns 15, 16, 17, 18, 19, and 20 are arranged on the planarization layer 12 (Figures 3 and 4).

[0041] As shown in layer E of Figure 5, the LC filter section 13 has capacitor patterns 22, 23, and 24. Each of the capacitor patterns 22, 23, and 24 is, for example, rectangular in shape.

[0042] As shown in layer D of Figure 5, the LC filter section 13 has via patterns 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, and 38. In this embodiment, via patterns 25 and 26 are, for example, circular in shape. In this embodiment, via patterns 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, and 38 are, for example, rectangular in shape.

[0043] As shown in layer C of Figure 5, the LC filter section 13 has conductor patterns 39, 40, 41, 42, 43, and 44.

[0044] Conductor pattern 39 includes an inductor pattern 39A and a capacitor pattern 39B. Conductor pattern 40 includes an inductor pattern 40A and a capacitor pattern 40B. Conductor pattern 43 includes a capacitor pattern 43A.

[0045] As shown in layer B of Figure 5, the LC filter section 13 has via patterns 45, 46, 47, 48, 49, 50, 51, and 52. In this embodiment, via patterns 45, 46, 47, 48, 49, 50, 51, and 52 are, for example, circular in shape.

[0046] As shown in layer A of Figure 5, the electronic component 1 has a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11.

[0047] As shown in layer D of Figure 5, via pattern 25 connects capacitor pattern 19 and conductor pattern 41. Via pattern 26 connects capacitor pattern 20 and conductor pattern 42. Via pattern 27 connects inductor pattern 15 and conductor pattern 41. Via pattern 28 connects inductor pattern 15 and inductor pattern 39A. Via pattern 29 connects inductor pattern 16 and inductor pattern 40A. Via pattern 30 connects inductor pattern 16 and conductor pattern 42.

[0048] Via pattern 31 connects inductor pattern 17 and conductor pattern 43. Via pattern 32 connects inductor pattern 17 and conductor pattern 39. Via pattern 33 connects capacitor pattern 21 and conductor pattern 44. Via pattern 34 connects inductor pattern 18 and conductor pattern 40. Via pattern 35 connects inductor pattern 18 and conductor pattern 44.

[0049] Via pattern 36 connects capacitor pattern 22 and capacitor pattern 39B. Via pattern 37 connects capacitor pattern 23 and capacitor pattern 40B. Via pattern 38 connects capacitor pattern 24 and capacitor pattern 43A.

[0050] As shown in layer B of Figure 5, via pattern 45 connects conductor pattern 41 to the first terminal electrode 4. Via pattern 46 connects conductor pattern 41 to the second terminal electrode 5. Via pattern 47 connects conductor pattern 41 to the third terminal electrode 6. Via pattern 48 connects conductor pattern 43 to the fourth terminal electrode 7. Via pattern 49 connects conductor pattern 44 to the fifth terminal electrode 8. Via pattern 50 connects conductor pattern 42 to the sixth terminal electrode 9. Via pattern 51 connects conductor pattern 42 to the seventh terminal electrode 10. Via pattern 52 connects conductor pattern 42 to the eighth terminal electrode 11.

[0051] A dielectric layer (not shown) is placed between capacitor pattern 19 and capacitor pattern 22. A dielectric layer (not shown) is placed between capacitor pattern 20 and capacitor pattern 23. A dielectric layer (not shown) is placed between capacitor pattern 21 and capacitor pattern 24. The dielectric layer can be formed from an inorganic insulating material such as a paraelectric material such as silicon nitride or silicon oxide, or a ferroelectric material.

[0052] As shown in Figure 6, inductor pattern 15 and inductor pattern 16 are arranged side by side in the first direction D1 in a plan view. "Arranged side by side" means that when viewed from the first direction D1, at least a portion of inductor pattern 15 and inductor pattern 16 overlap. In this embodiment, the shapes of inductor pattern 15 and inductor pattern 16 have line symmetry with respect to a line along the third direction D3.

[0053] Inductor pattern 17 and inductor pattern 18 are arranged side by side in the first direction D1 in a plan view. In this embodiment, the shapes of inductor pattern 17 and inductor pattern 18 have line symmetry with respect to a line along the third direction D3. Inductor pattern 15 and inductor pattern 17 are arranged side by side in the third direction D3 in a plan view. Inductor pattern 16 and inductor pattern 18 are arranged side by side in the third direction D3 in a plan view.

[0054] In this embodiment, the distance K1 between inductor pattern 15 and inductor pattern 16 in the first direction D1 is shorter than the distance K2 between inductor pattern 17 and inductor pattern 18 in the first direction D1 (distance K1 < distance K2). That is, the distance between inductor pattern 15 and inductor pattern 16 in the first direction D1 is closer than the distance between inductor pattern 17 and inductor pattern 18 in the first direction D1. For example, the shortest distance (minimum distance) between inductor pattern 15 and inductor pattern 16 can be used as distance K1. For example, the shortest distance between inductor pattern 17 and inductor pattern 18 can be used as distance K2.

[0055] The distance K3 between inductor pattern 15 and inductor pattern 17 in the third direction D3 is longer than the distance K1 (K3 > K1). In other words, distance K1 is shorter than distance K3. For example, the shortest distance between inductor pattern 15 and inductor pattern 17 can be used as distance K3. The distance K4 between inductor pattern 16 and inductor pattern 18 in the third direction D3 is longer than the distance K1 (K4 > K1). In other words, distance K1 is shorter than distance K4. For distance K4, the shortest distance between inductor pattern 16 and inductor pattern 18 can be used. Distance K2 is longer than distances K3 and K4 (K2 > K3, K4). In other words, distances K3 and K4 are shorter than distance K2.

[0056] The distance K1 is shorter than the radii of inductor patterns 15 and 16. In this embodiment, the radius of inductor pattern 15 can be defined by half the length of the shorter side K5 of a rectangular imaginary line (shown as a dashed line in Figure 6) that encloses (encloses) the area of ​​inductor pattern 15 (in this embodiment, specifically the portion that forms a coil in inductor pattern 15) (K5 / 2). The length of the shorter side K5 may correspond to the size of the area of ​​inductor pattern 15 (in this embodiment, specifically the coil size). Similarly, the radius of inductor pattern 16 can be defined by half the length of the shorter side K6 of a rectangular imaginary line that encloses the area of ​​inductor pattern 16 (K6 / 2). The length of the shorter side K6 may correspond to the size of the area of ​​inductor pattern 16 (in this embodiment, specifically the coil size). Inductor patterns 15 and 16 may be formed, for example, so that their radii are equivalent (or approximately equivalent).

[0057] The distance K2 is longer than the radii of inductor patterns 17 and 18. In this embodiment, the radius of inductor pattern 17 may be defined by half the length of the shorter side K7 of the imaginary rectangle encompassing the area of ​​inductor pattern 17 (K7 / 2). Similarly, the radius of inductor pattern 18 may be defined by half the length of the shorter side K8 of the imaginary rectangle encompassing the area of ​​inductor pattern 18 (K8 / 2). Inductor patterns 17 and 18 may be formed, for example, so that their radii are equivalent (or approximately equivalent).

[0058] The radius of inductor pattern 15 may be greater than or equal to the radii of inductor patterns 17 and 18. The radius of inductor pattern 16 may be greater than or equal to the radii of inductor patterns 17 and 18.

[0059] Furthermore, as described above, the radius of an inductor pattern can be defined as half the length of the shorter side of the imaginary rectangle that encloses the rectangular inductor pattern if the outer shape of the inductor pattern is approximately rectangular. The radius of an inductor pattern can be defined as half the length of the diameter of the circular inductor pattern if the outer shape of the inductor pattern is circular (perfectly circular). The radius of an inductor pattern can be defined as half the length of the shorter side of the imaginary rectangle that encloses the elliptical inductor pattern if the outer shape of the inductor pattern is elliptical. The radius of an inductor pattern can be defined as half the length of the shorter side of the imaginary rectangle that encloses the elliptical inductor pattern if the outer shape of the inductor pattern is irregular.

[0060] Inductor pattern 15 and inductor pattern 16 are arranged to be magnetically coupled. Inductor pattern 17 and inductor pattern 18 are arranged to be magnetically coupled. Inductor pattern 17 is arranged to be magnetically coupled with inductor pattern 16. Inductor pattern 18 is arranged to be magnetically coupled with inductor pattern 15.

[0061] Figure 7 is an equivalent circuit diagram of electronic component 1 shown in Figure 1. As shown in Figure 7, electronic component 1 comprises a first inductor L1, a second inductor L2, a third inductor L3, a fourth inductor L4, a first capacitor C1, a second capacitor C2, and a third capacitor C3. Electronic component 1 constitutes a two-stage resonant bandpass filter circuit.

[0062] The first inductor L1 is composed of inductor pattern 15 and inductor pattern 39A. The second inductor L2 is composed of inductor pattern 16 and inductor pattern 40A. The third inductor L3 is composed of inductor pattern 17. The fourth inductor L4 is composed of inductor pattern 18.

[0063] The first capacitor C1 is composed of capacitor patterns 19, 22, and 39B. The second capacitor C2 is composed of capacitor patterns 20, 23, and 40B. The third capacitor C3 is composed of capacitor patterns 21, 24, and 43A.

[0064] The first inductor L1, the third inductor L3, and the first capacitor C1 constitute the first LC resonator (first resonant circuit) RC1. A resonator can also be called a resonant circuit. The first inductor L1 and the third inductor L3 are electrically connected in series. The second inductor L2, the fourth inductor L4, and the second capacitor C2 constitute the second LC resonator (second resonant circuit) RC2. The second inductor L2 and the fourth inductor L4 are electrically connected in series. The first inductor L1, the second inductor L2, and the fourth inductor L4 are magnetically coupled. The second inductor L2, the first inductor L1, and the third inductor L3 are magnetically coupled.

[0065] As described above, in the electronic component 1 according to this embodiment, the first LC resonator RC1 includes a third inductor L3 that is electrically connected in series with the first inductor L1. The third inductor L3 is arranged to be magnetically coupled with the second inductor L2. In this way, in the electronic component 1, by arranging the third inductor L3 of the first LC resonator RC1 so that it is magnetically coupled with the second inductor L2, the attenuation in the high-frequency band can be increased (improved). Therefore, the electronic component 1 can achieve improvements in frequency characteristics, such as improved characteristics in the high-frequency band.

[0066] In the electronic component 1 according to this embodiment, the second LC resonator RC2 includes a fourth inductor L4 that is electrically connected in series with the second inductor L2. The fourth inductor L4 is arranged to be magnetically coupled with the first inductor L1 and the third inductor L3. In this configuration, the magnetic coupling between the fourth inductor L4 of the second LC resonator RC2 and the first inductor L1 and the third inductor L3 can increase the attenuation in the high-frequency band. Therefore, the electronic component 1 can improve its frequency characteristics, such as improving the characteristics in the high-frequency band.

[0067] In the electronic component 1 according to this embodiment, the distance K1 between the inductor pattern 15 and the inductor pattern 16 in the first direction D1 is shorter than the radius of the inductor pattern 15 and the inductor pattern 16. In this way, by making the distance K1 shorter than the radius of the inductor pattern 15 and the inductor pattern 16 (in this embodiment, specifically half the coil size), the magnetic coupling between the first inductor L1, which includes the inductor pattern 15, and the second inductor L2, which includes the inductor pattern 16, can be strengthened. Therefore, the frequency characteristics of the electronic component 1 can be adjusted, such as obtaining attenuation in the high-frequency band.

[0068] (Second embodiment) Next, a second embodiment will be described. Figure 8 is a perspective view of an electronic component according to the second embodiment. Figure 9 is a view of the electronic component shown in Figure 8 from the insulator side. Figure 10 is a side view of the electronic component shown in Figure 8. Figure 11 is an end view of the electronic component shown in Figure 8.

[0069] As shown in Figures 8 to 11, the electronic component 1A comprises a substrate 2, an insulator 3, and a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11 arranged on the insulator 3.

[0070] In electronic component 1A, the LC filter section 13A is located within the insulator 3. Figure 12 shows the conductor pattern constituting the LC filter section 13A of electronic component 1A shown in Figure 8. In electronic component 1A, the conductor patterns are arranged in the order shown in layers F, E, D, C, B, and A in Figure 12, starting from the substrate 2 side (the main surface 3d side of the insulator 3). The conductor pattern may include inductor patterns, capacitor patterns, and via patterns. The conductor pattern can be formed from, for example, copper.

[0071] As shown in layer F of Figure 12, the LC filter section 13A has an inductor pattern 15, an inductor pattern 16, an inductor pattern 17, a capacitor pattern 19, a capacitor pattern 20, and a conductor pattern 53. The inductor patterns 15, 16, 17, 19, 20, and 53 are arranged on the planarization layer 12 (Figures 10 and 11). The conductor pattern 53 includes an inductor pattern (fourth inductor pattern) 50A and a capacitor pattern 53B.

[0072] As shown in layer E of Figure 12, the LC filter section 13A has capacitor patterns 22, 23, and 24. Each of the capacitor patterns 22, 23, and 24 is, for example, rectangular in shape.

[0073] As shown in layer D of Figure 12, the LC filter section 13A has via patterns 25, 26, 27, 28, 29, 30, 31, 32, 34, 35, 36, 37, and 38. In this embodiment, via patterns 25 and 26 are, for example, circular in shape. In this embodiment, via patterns 27, 28, 29, 30, 31, 32, 34, 35, 36, 37, and 38 are, for example, rectangular in shape.

[0074] As shown in layer C of Figure 12, the LC filter section 13A has conductor patterns 54, 55, 56, 57, 58, and 59.

[0075] Conductor pattern 54 includes an inductor pattern 54A and a capacitor pattern 54B. Conductor pattern 55 includes an inductor pattern 55A and a capacitor pattern 55B. Conductor pattern 58 includes a capacitor pattern 58A.

[0076] As shown in layer B of Figure 12, the LC filter section 13A has via patterns 45, 46, 47, 48, 49, 50, 51, and 52. In this embodiment, via patterns 45, 46, 47, 48, 49, 50, 51, and 52 are, for example, circular in shape.

[0077] As shown in layer A of Figure 12, electronic component 1A has a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11.

[0078] As shown in layer D of Figure 12, via pattern 25 connects capacitor pattern 19 and conductor pattern 56. Via pattern 26 connects capacitor pattern 20 and conductor pattern 57. Via pattern 27 connects inductor pattern 15 and conductor pattern 56. Via pattern 28 connects inductor pattern 15 and inductor pattern 54A. Via pattern 29 connects inductor pattern 16 and inductor pattern 55A. Via pattern 30 connects inductor pattern 16 and conductor pattern 57.

[0079] Via pattern 31 connects inductor pattern 17 and conductor pattern 58. Via pattern 32 connects inductor pattern 17 and conductor pattern 54. Via pattern 34 connects inductor pattern 53A and conductor pattern 55. Via pattern 35 connects conductor pattern 53 and conductor pattern 59.

[0080] Via pattern 36 connects capacitor pattern 22 and capacitor pattern 54B. Via pattern 37 connects capacitor pattern 23 and capacitor pattern 55B. Via pattern 38 connects capacitor pattern 24 and capacitor pattern 58A.

[0081] As shown in layer B of Figure 12, via pattern 45 connects conductor pattern 56 to the first terminal electrode 4. Via pattern 46 connects conductor pattern 56 to the second terminal electrode 5. Via pattern 47 connects conductor pattern 56 to the third terminal electrode 6. Via pattern 48 connects conductor pattern 58 to the fourth terminal electrode 7. Via pattern 49 connects conductor pattern 59 to the fifth terminal electrode 8. Via pattern 50 connects conductor pattern 57 to the sixth terminal electrode 9. Via pattern 51 connects conductor pattern 57 to the seventh terminal electrode 10. Via pattern 52 connects conductor pattern 57 to the eighth terminal electrode 11.

[0082] A dielectric layer (not shown) is placed between capacitor pattern 19 and capacitor pattern 22. A dielectric layer (not shown) is placed between capacitor pattern 20 and capacitor pattern 23. A dielectric layer (not shown) is placed between capacitor pattern 53B and capacitor pattern 24. The dielectric layer can be formed from an inorganic insulating material such as a paraelectric material such as silicon nitride or silicon oxide, or a ferroelectric material.

[0083] As shown in Figure 13, inductor pattern 15 and inductor pattern 16 are arranged side by side in the first direction D1 in a plan view. In this embodiment, the shapes of inductor pattern 15 and inductor pattern 16 have line symmetry with respect to a line along the third direction D3. Inductor pattern 17 and inductor pattern 53A are arranged side by side in the first direction D1 in a plan view. Inductor pattern 15 and inductor pattern 17 are arranged side by side in the third direction D3 in a plan view. Inductor pattern 16 and inductor pattern 18 are arranged side by side in the third direction D3 in a plan view.

[0084] In this embodiment, the distance K1 between the inductor pattern 15 and the inductor pattern 16 in the first direction D1 is longer than the distance K2 between the inductor pattern 17 and the inductor pattern 53A in the first direction D1 (distance K1 > distance K2). In other words, the distance K2 is shorter than the distance K1.

[0085] The distance K3 between the inductor pattern 15 and the inductor pattern 17 in the third direction D3 is longer than the distance K1 (K3 > K1). In other words, the distance K1 is shorter than the distance K3. The distance K4 between the inductor pattern 16 and the inductor pattern 53A in the third direction D3 is longer than the distance K1 (K4 > K1). In other words, the distance K1 is shorter than the distance K4. The distance K2 is shorter than the distances K3 and K4 (K2 < K3, K4). In other words, the distances K3 and K4 are longer than the distance K2.

[0086] The distance K1 is shorter than the radii of the inductor pattern 15 and the inductor pattern 16. In this embodiment, the radius of the inductor pattern 15 can be defined as half the length (K5 / 2) of the short side of a rectangular virtual line (shown by a dashed line in FIG. 13) that encloses the region of the inductor pattern 15 (as a specific example in this embodiment, the portion forming the coil in the inductor pattern 15). Similarly, the radius of the inductor pattern 16 can be defined as half the length (K6 / 2) of the short side of a rectangular virtual line that encloses the region of the inductor pattern 16. The inductor pattern 15 and the inductor pattern 16 may be formed, for example, such that their radii are equal (or substantially equal).

[0087] The distance K2 is shorter than the radii of inductor patterns 17 and 53A. In this embodiment, the radius of inductor pattern 17 may be defined by half the length of the shorter side K7 of the imaginary rectangle encompassing the area of ​​inductor pattern 17 (K7 / 2). Similarly, the radius of inductor pattern 53A may be defined by half the length of the shorter side K8 of the imaginary rectangle encompassing the area of ​​inductor pattern 53A (K8 / 2). Inductor patterns 17 and 53A may be formed, for example, so that their radii are equivalent (or approximately equivalent).

[0088] The radius of inductor pattern 15 may be greater than or equal to the radii of inductor pattern 17 and inductor pattern 53A. The radius of inductor pattern 16 may be greater than or equal to the radii of inductor pattern 17 and inductor pattern 53A.

[0089] Inductor pattern 15 and inductor pattern 16 are arranged to be magnetically coupled. Inductor pattern 17 and inductor pattern 53A are arranged to be magnetically coupled. Inductor pattern 17 is arranged to be magnetically coupled with inductor pattern 16. Inductor pattern 53A is arranged to be magnetically coupled with inductor pattern 15.

[0090] Figure 14 is an equivalent circuit diagram of electronic component 1A shown in Figure 8. As shown in Figure 14, electronic component 1A comprises a first inductor L11, a second inductor L12, a third inductor L13, a fourth inductor L14, a first capacitor C11, a second capacitor C12, and a third capacitor C13. Electronic component 1A constitutes a two-stage resonant bandpass filter circuit.

[0091] The first inductor L11 is composed of inductor pattern 15 and inductor pattern 54A. The second inductor L12 is composed of inductor pattern 16 and inductor pattern 55A. The third inductor L13 is composed of inductor pattern 17. The fourth inductor L14 is composed of inductor pattern 53A.

[0092] The first capacitor C11 is composed of capacitor patterns 19, 22, and 54B. The second capacitor C12 is composed of capacitor patterns 20, 23, and 55B. The third capacitor C13 is composed of capacitor patterns 53B, 24, and 58A.

[0093] The first inductor L11, the third inductor L13, and the first capacitor C11 constitute the first LC resonator (first resonant circuit) RC11. The first inductor L11 and the third inductor L13 are electrically connected in series. The second inductor L12, the fourth inductor L14, and the second capacitor C12 constitute the second LC resonator (second resonant circuit) RC12. The second inductor L12 and the fourth inductor L14 are electrically connected in series. The first inductor L11, the second inductor L12, and the fourth inductor L14 are magnetically coupled. The second inductor L12, the first inductor L11, and the third inductor L13 are magnetically coupled.

[0094] As described above, in the electronic component 1A according to this embodiment, the first LC resonator RC11 includes a third inductor L13 electrically connected in series with the first inductor L11. The second LC resonator RC12 includes a fourth inductor L14 electrically connected in series with the second inductor L12. The third inductor L13 is arranged to be magnetically coupled with the second inductor L12. The fourth inductor L14 is arranged to be magnetically coupled with the first inductor L11. As a result, the electronic component 1A can increase the attenuation in the high-frequency band. Therefore, the electronic component 1A can improve frequency characteristics, such as improving performance in the high-frequency band.

[0095] In the electronic component 1A according to this embodiment, the distance K2 between the inductor pattern 17 and the inductor pattern 53A in the first direction D1 is shorter than the distance K3 between the inductor pattern 15 and the inductor pattern 17 in the third direction D3, and shorter than the distance K4 between the inductor pattern 16 and the inductor pattern 53A in the third direction D3. In this configuration, the magnetic coupling between the third inductor L13, which includes the inductor pattern 17, and the fourth inductor L14, which includes the inductor pattern 53A, can be strengthened. Therefore, the frequency characteristics of the electronic component 1A can be adjusted, such as obtaining attenuation in the high-frequency band.

[0096] In the electronic component 1A according to this embodiment, the distance K2 between the inductor pattern 17 and the inductor pattern 53A in the first direction D1 is shorter than the radius of the inductor pattern 17 and the inductor pattern 53A. In this way, by making the distance K2 shorter than the radius of the inductor pattern 17 and the inductor pattern 53A (in this embodiment, specifically half the coil size), the magnetic coupling between the third inductor L13, which includes the inductor pattern 17, and the fourth inductor L14, which includes the inductor pattern 53A, can be strengthened. Therefore, the frequency characteristics of the electronic component 1A can be adjusted, such as obtaining attenuation in the high-frequency band.

[0097] (Third embodiment) Next, a third embodiment will be described. Figure 15 is a perspective view of an electronic component according to the third embodiment. Figure 16 is a view of the electronic component shown in Figure 15 from the insulator side. Figure 17 is a side view of the electronic component shown in Figure 15. Figure 18 is an end view of the electronic component shown in Figure 15.

[0098] As shown in Figures 15 to 18, the electronic component 1B comprises a substrate 2, an insulator 3, and a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11 arranged on the insulator 3.

[0099] In electronic component 1B, the LC filter section 13B is located within the insulator 3. Figure 19 shows the conductor pattern constituting the LC filter section 13B of electronic component 1B shown in Figure 15. In electronic component 1B, the conductor patterns are arranged in the order shown in layers F, E, D, C, B, and A of Figure 19, starting from the substrate 2 side (the main surface 3d side of the insulator 3). The conductor pattern may include inductor patterns, capacitor patterns, and via patterns. The conductor pattern can be formed from, for example, copper.

[0100] As shown in layer F of Figure 19, the LC filter section 13B includes an inductor pattern 15, an inductor pattern 16, a capacitor pattern 19, a capacitor pattern 20, an inductor pattern (third inductor pattern) 60, and a conductor pattern 61. The inductor patterns 15, 16, 19, 20, 60, and 61 are arranged on the planarization layer 12 (Figures 17 and 18). The conductor pattern 61 includes an inductor pattern (fourth inductor pattern) 59A and a capacitor pattern 61B.

[0101] As shown in layer E of Figure 19, the LC filter section 13B has capacitor patterns 22, 23, and 24. Each of the capacitor patterns 22, 23, and 24 is, for example, rectangular in shape.

[0102] As shown in layer D of Figure 19, the LC filter section 13B has via patterns 25, 26, 27, 28, 29, 30, 31, 32, 34, 35, 36, 37, and 38. In this embodiment, via patterns 25 and 26 are, for example, circular in shape. In this embodiment, via patterns 27, 28, 29, 30, 31, 32, 34, 35, 36, 37, and 38 are, for example, rectangular in shape.

[0103] As shown in layer C of Figure 19, the LC filter section 13B has conductor patterns 56, 57, 58, 59, 62, and 63.

[0104] Conductor pattern 58 includes capacitor pattern 58A. Conductor pattern 62 includes inductor pattern 62A and capacitor pattern 62B. Conductor pattern 63 includes inductor pattern 63A and capacitor pattern 63B.

[0105] As shown in layer B of Figure 19, the LC filter section 13B has via patterns 45, 46, 47, 48, 49, 50, 51, and 52. In this embodiment, via patterns 45, 46, 47, 48, 49, 50, 51, and 52 are, for example, circular in shape.

[0106] As shown in layer A of Figure 19, electronic component 1B has a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11.

[0107] As shown in layer D of Figure 19, via pattern 25 connects capacitor pattern 19 and conductor pattern 56. Via pattern 26 connects capacitor pattern 20 and conductor pattern 57. Via pattern 27 connects inductor pattern 15 and conductor pattern 56. Via pattern 28 connects inductor pattern 15 and inductor pattern 62A. Via pattern 29 connects inductor pattern 16 and inductor pattern 63A. Via pattern 30 connects inductor pattern 16 and conductor pattern 57.

[0108] Via pattern 31 connects inductor pattern 60 and conductor pattern 58. Via pattern 32 connects inductor pattern 60 and conductor pattern 62. Via pattern 34 connects inductor pattern 61A and conductor pattern 63. Via pattern 35 connects conductor pattern 61 and conductor pattern 59.

[0109] Via pattern 36 connects capacitor pattern 22 and capacitor pattern 62B. Via pattern 37 connects capacitor pattern 23 and capacitor pattern 63B. Via pattern 38 connects capacitor pattern 24 and capacitor pattern 58A.

[0110] As shown in layer B of Figure 19, via pattern 45 connects conductor pattern 56 to the first terminal electrode 4. Via pattern 46 connects conductor pattern 56 to the second terminal electrode 5. Via pattern 47 connects conductor pattern 56 to the third terminal electrode 6. Via pattern 48 connects conductor pattern 58 to the fourth terminal electrode 7. Via pattern 49 connects conductor pattern 59 to the fifth terminal electrode 8. Via pattern 50 connects conductor pattern 57 to the sixth terminal electrode 9. Via pattern 51 connects conductor pattern 57 to the seventh terminal electrode 10. Via pattern 52 connects conductor pattern 57 to the eighth terminal electrode 11.

[0111] A dielectric layer (not shown) is placed between capacitor pattern 19 and capacitor pattern 22. A dielectric layer (not shown) is placed between capacitor pattern 20 and capacitor pattern 23. A dielectric layer (not shown) is placed between capacitor pattern 53B and capacitor pattern 24. The dielectric layer can be formed from an inorganic insulating material such as a paraelectric material such as silicon nitride or silicon oxide, or a ferroelectric material.

[0112] As shown in Figure 20, inductor pattern 15 and inductor pattern 16 are arranged side by side in the first direction D1 in a plan view. In this embodiment, the shapes of inductor pattern 15 and inductor pattern 16 have line symmetry with respect to a line along the third direction D3. Inductor pattern 60 and inductor pattern 61A are arranged side by side in the first direction D1 in a plan view. Inductor pattern 15 and inductor pattern 60 are arranged side by side in the third direction D3 in a plan view. Inductor pattern 16 and inductor pattern 61A are arranged side by side in the third direction D3 in a plan view.

[0113] In this embodiment, the distance K1 between inductor pattern 15 and inductor pattern 16 in the first direction D1 is equivalent to the distance K2 between inductor pattern 17 and inductor pattern 53A in the first direction D1 (distance K1 = distance K2).

[0114] The distance K3 between inductor pattern 15 and inductor pattern 60 in the third direction D3 is equivalent to the distance K1 (K3=K1). The distance K4 between inductor pattern 16 and inductor pattern 61A in the third direction D3 is equivalent to the distance K1 (K4=K1). The distance K2 is equivalent to the distances K3 and K4 (K2=K3,K4).

[0115] Distances K1, K2, K3, and K4 are shorter than the radii of inductor patterns 15 and 16. In this embodiment, the radius of inductor pattern 15 may be defined by half the length of the shorter side K5 of the rectangular imaginary line (shown as a dashed line in Figure 20) that encloses (encloses) the area of ​​inductor pattern 15 (in this embodiment, specifically the portion that forms a coil in inductor pattern 15) (K5 / 2). Similarly, the radius of inductor pattern 16 may be defined by half the length of the shorter side K6 of the rectangular imaginary line that encloses the area of ​​inductor pattern 16 (K6 / 2). Inductor patterns 15 and 16 may be formed, for example, so that their radii are equivalent (or approximately equivalent).

[0116] Distances K1, K2, K3, and K4 are shorter than the radii of inductor patterns 60 and 61A. In this embodiment, the radius of inductor pattern 60 may be defined by half the length of the shorter side K7 of the imaginary rectangle encompassing the area of ​​inductor pattern 60 (K7 / 2). Similarly, the radius of inductor pattern 61A may be defined by half the length of the shorter side K8 of the imaginary rectangle encompassing the area of ​​inductor pattern 61A (K8 / 2). Inductor patterns 60 and 61A may be formed, for example, so that their radii are equivalent (or approximately equivalent).

[0117] The radius of inductor pattern 15 may be greater than or equal to the radii of inductor pattern 60 and inductor pattern 61A. The radius of inductor pattern 16 may be greater than or equal to the radii of inductor pattern 60 and inductor pattern 61A.

[0118] Inductor pattern 15 and inductor pattern 16 are arranged to be magnetically coupled. Inductor pattern 60 and inductor pattern 61A are arranged to be magnetically coupled. Inductor pattern 60 is arranged to be magnetically coupled with inductor pattern 16. Inductor pattern 61A is arranged to be magnetically coupled with inductor pattern 15.

[0119] Figure 21 is an equivalent circuit diagram of electronic component 1A shown in Figure 15. As shown in Figure 21, electronic component 1B comprises a first inductor L21, a second inductor L22, a third inductor L23, a fourth inductor L24, a first capacitor C21, a second capacitor C22, and a third capacitor C23. Electronic component 1B constitutes a two-stage resonant bandpass filter circuit.

[0120] The first inductor L21 is composed of inductor pattern 15 and inductor pattern 62A. The second inductor L22 is composed of inductor pattern 16 and inductor pattern 63A. The third inductor L23 is composed of inductor pattern 60. The fourth inductor L24 is composed of inductor pattern 61A.

[0121] The first capacitor C21 is composed of capacitor patterns 19, 22, and 62B. The second capacitor C22 is composed of capacitor patterns 20, 23, and 63B. The third capacitor C23 is composed of capacitor patterns 61B, 24, and 58A.

[0122] The first inductor L21, the third inductor L23, and the first capacitor C21 constitute the first LC resonator (first resonant circuit) RC21. The first inductor L21 and the third inductor L23 are electrically connected in series. The second inductor L22, the fourth inductor L24, and the second capacitor C22 constitute the second LC resonator (second resonant circuit) RC22. The second inductor L22 and the fourth inductor L24 are electrically connected in series. The first inductor L21, the second inductor L22, and the fourth inductor L24 are magnetically coupled. The second inductor L22, the first inductor L21, and the third inductor L23 are magnetically coupled.

[0123] As described above, in the electronic component 1B according to this embodiment, the first LC resonator RC21 includes a third inductor L23 that is electrically connected in series with the first inductor L21. The second LC resonator RC22 includes a fourth inductor L24 that is electrically connected in series with the second inductor L22. The third inductor L23 is arranged to be magnetically coupled with the second inductor L22. The fourth inductor L24 is arranged to be magnetically coupled with the first inductor L21. As a result, the electronic component 1B can increase the attenuation in the high-frequency band. Therefore, the electronic component 1B can improve frequency characteristics, such as improving the characteristics in the high-frequency band.

[0124] In the electronic component 1B according to this embodiment, the distance K3 between inductor pattern 15 and inductor pattern 60 in the third direction D3, and the distance K4 between inductor pattern 16 and inductor pattern 61A in the third direction D3, are shorter than the radii of inductor pattern 60 and inductor pattern 61A. In this way, by making the distances K3 and K4 shorter than the radii of inductor pattern 60 and inductor pattern 61A (in this embodiment, specifically half the coil size), the magnetic coupling between the third inductor L23 and the second inductor L22, which include inductor pattern 60, and the fourth inductor L24 and the first inductor L21, which include inductor pattern 61A, can be strengthened. Therefore, the frequency characteristics of the electronic component 1B can be adjusted, such as obtaining attenuation in the high-frequency band.

[0125] In the electronic component 1B according to this embodiment, the distance K1 between inductor pattern 15 and inductor pattern 16 in the first direction D1 is equivalent to the distance K3 between inductor pattern 15 and inductor pattern 60 in the third direction D3, and the distance K4 between inductor pattern 16 and inductor pattern 61A in the third direction D3. As a result, the magnetic coupling between the third inductor L23 and the second inductor L22 and the fourth inductor L24 can be strengthened in the electronic component 1B, as well as the magnetic coupling between the fourth inductor L24 and the first inductor L21 and the third inductor L23. Therefore, the frequency characteristics of the electronic component 1B can be adjusted, such as obtaining attenuation in the high-frequency band.

[0126] (Fourth embodiment) Next, a fourth embodiment will be described. Figure 22 is a perspective view of an electronic component according to the fourth embodiment. Figure 23 is a view of the electronic component shown in Figure 22 from the insulator side. Figure 24 is a side view of the electronic component shown in Figure 22. Figure 25 is an end view of the electronic component shown in Figure 22.

[0127] As shown in Figures 22 to 25, the electronic component 1C comprises a substrate 2, an insulator 3, and a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11 arranged on the insulator 3.

[0128] In electronic component 1C, the LC filter section 13C is located within the insulator 3. Figure 26 shows the conductor pattern constituting the LC filter section 13C of electronic component 1C shown in Figure 22. In electronic component 1C, the conductor patterns are arranged in the order shown in layers F, E, D, C, B, and A of Figure 26, starting from the substrate 2 side (the main surface 3d side of the insulator 3). The conductor pattern may include inductor patterns, capacitor patterns, and via patterns. The conductor pattern can be formed from, for example, copper.

[0129] As shown in layer F of Figure 26, the LC filter section 13C has an inductor pattern (first inductor pattern) 64, an inductor pattern (second inductor pattern) 65, a capacitor pattern 66, a capacitor pattern 67, and a capacitor pattern 68. The inductor patterns 64, 65, 66, 67, and 68 are arranged on the planarization layer 12 (Figures 24 and 25).

[0130] As shown in layer E of Figure 26, the LC filter section 13C has capacitor patterns 22, 23, and 24. Each of the capacitor patterns 22, 23, and 24 is, for example, rectangular in shape.

[0131] As shown in layer D of Figure 26, the LC filter section 13C has via patterns 25, 26, 27, 28, 29, 30, 35, 36, 37, and 38. In this embodiment, via patterns 25 and 26 are, for example, circular in shape. In this embodiment, via patterns 27, 28, 29, 30, 35, 36, 37, and 38 are, for example, rectangular in shape.

[0132] As shown in layer C of Figure 26, the LC filter section 13C has conductor patterns 56, 57, 69, and 70.

[0133] As shown in layer B of Figure 26, the LC filter section 13C has via patterns 45, 46, 47, 48, 49, 50, 51, and 52. In this embodiment, via patterns 45, 46, 47, 48, 49, 50, 51, and 52 are, for example, circular in shape.

[0134] As shown in layer A of Figure 26, electronic component 1C has a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11.

[0135] As shown in layer D of Figure 26, via pattern 25 connects capacitor pattern 66 and conductor pattern 56. Via pattern 26 connects capacitor pattern 67 and conductor pattern 57. Via pattern 27 connects inductor pattern 64 and conductor pattern 56. Via pattern 28 connects inductor pattern 64 and inductor pattern 69A. Via pattern 29 connects inductor pattern 65 and inductor pattern 70A. Via pattern 30 connects inductor pattern 65 and conductor pattern 57. Via pattern 35 connects capacitor pattern 68 and conductor pattern 70.

[0136] Via pattern 36 connects capacitor pattern 22 and capacitor pattern 69B. Via pattern 37 connects capacitor pattern 23 and capacitor pattern 70B. Via pattern 38 connects capacitor pattern 24 and capacitor pattern 69C.

[0137] As shown in layer B of Figure 26, via pattern 45 connects conductor pattern 56 to the first terminal electrode 4. Via pattern 46 connects conductor pattern 56 to the second terminal electrode 5. Via pattern 47 connects conductor pattern 56 to the third terminal electrode 6. Via pattern 48 connects conductor pattern 69 to the fourth terminal electrode 7. Via pattern 49 connects conductor pattern 70 to the fifth terminal electrode 8. Via pattern 50 connects conductor pattern 57 to the sixth terminal electrode 9. Via pattern 51 connects conductor pattern 57 to the seventh terminal electrode 10. Via pattern 52 connects conductor pattern 57 to the eighth terminal electrode 11.

[0138] A dielectric layer (not shown) is placed between capacitor pattern 66 and capacitor pattern 22. A dielectric layer (not shown) is placed between capacitor pattern 67 and capacitor pattern 23. A dielectric layer (not shown) is placed between capacitor pattern 68 and capacitor pattern 24. The dielectric layer can be formed from an inorganic insulating material such as a paraelectric material such as silicon nitride or silicon oxide, or a ferroelectric material.

[0139] As shown in Figure 23, the conductor pattern 69 includes an inductor pattern 69A, a capacitor pattern (first capacitor pattern) 67B, a capacitor pattern 69C, and a connection pattern 69D.

[0140] The inductor pattern 69A has a first end 67Aa and a second end 67Ab. The inductor pattern 69A includes a first inductor section (third inductor pattern) 67Ac, a second inductor section (first inductor pattern) 67Ad, and a connecting section 67Ae.

[0141] The first inductor section 67Ac and the second inductor section 67Ad are integrally formed so as to be connected between the first end 67Aa and the second end 67Ab in the inductor pattern 69A. The first inductor section 67Ac is formed between the first end 67Aa and the connecting section 67Ae in the inductor pattern 69A. The second inductor section 67Ad is formed between the connecting section 67Ae and the second end 67Ab in the inductor pattern 69A.

[0142] The connection portion 67Ae is provided between the first end portion 67Aa and the second end portion 67Ab. The connection portion 67Ae is provided between the end of the first inductor portion 67Ac (the end opposite to the first end portion 67Aa) and the end of the second inductor portion 67Ad (the end opposite to the second end portion 67Ab). The connection portion 67Ae connects the first inductor portion 67Ac and the second inductor portion 67Ad. The first inductor portion 67Ac and the second inductor portion 67Ad are connected via the connection portion 67Ae. In other words, in the inductor pattern 69A, the first inductor portion 67Ac and the second inductor portion 67Ad are divided into two parts with the connection portion 67Ae as the boundary.

[0143] The capacitor pattern 69B has a rectangular shape. The capacitor pattern 69B is connected to the connection part 67Ae of the inductor pattern 69A via the connection pattern 69D. One end of the connection pattern 69D is connected to the inductor pattern 69A, and the other end of the connection pattern 69D is connected to the capacitor pattern 69B.

[0144] The conductor pattern 70 includes an inductor pattern 70A, a capacitor pattern (second capacitor pattern) 68B, and a connection pattern 70C.

[0145] The inductor pattern 70A has a first end 68Aa and a second end 68Ab. The inductor pattern 70A includes a first inductor section (fourth inductor pattern) 68Ac, a second inductor section (second inductor pattern) 68Ad, and a connecting section 68Ae.

[0146] The first inductor section 68Ac and the second inductor section 68Ad are integrally formed so as to be connected between the first end 68Aa and the second end 68Ab in the inductor pattern 70A. The first inductor section 68Ac is formed in the inductor pattern 70A between the first end 68Aa and the connecting section 68Ae. The second inductor section 68Ad is formed in the inductor pattern 70A between the connecting section 68Ae and the second end 68Ab.

[0147] The connection section 68Ae is provided between the first end 68Aa and the second end 68Ab. The connection section 68Ae is provided between the end of the first inductor section 68Ac (the end opposite to the first end 68Aa) and the end of the second inductor section 68Ad (the end opposite to the second end 68Ab). The connection section 68Ae connects the first inductor section 68Ac and the second inductor section 68Ad. The first inductor section 68Ac and the second inductor section 68Ad are connected via the connection section 68Ae. In other words, in the inductor pattern 70A, the first inductor section 68Ac and the second inductor section 68Ad are divided into two parts with the connection section 68Ae as the boundary.

[0148] The capacitor pattern 70B has a rectangular shape. The capacitor pattern 70B is connected to the connection point 68Ae of the inductor pattern 70A via the connection pattern 70C. One end of the connection pattern 70C is connected to the inductor pattern 70A, and the other end of the connection pattern 70C is connected to the capacitor pattern 70B.

[0149] Inductor pattern 64 and inductor pattern 65 are arranged to be magnetically coupled. The second inductor portion 67ad of inductor pattern 69A and the second inductor portion 68Ad of inductor pattern 70A are arranged to be magnetically coupled. The second inductor portion 67ad of inductor pattern 69A is arranged to be magnetically coupled with inductor pattern 65. The second inductor portion 68Ad of inductor pattern 70A is arranged to be magnetically coupled with inductor pattern 64.

[0150] Figure 27 is an equivalent circuit diagram of electronic component 1C shown in Figure 22. As shown in Figure 27, electronic component 1C comprises a first inductor L31, a second inductor L32, a first capacitor C31, a second capacitor C32, and a third capacitor C33. Electronic component 1C constitutes a two-stage resonant bandpass filter circuit.

[0151] The first inductor L31 is composed of inductor pattern 64 and inductor pattern 69A. In the first inductor L31, the inductor composed of inductor pattern 64 and the second inductor section 67Ad of inductor pattern 69A is electrically connected in series with the inductor composed of the first inductor section 67Ac of inductor pattern 69A. The second inductor L32 is composed of inductor pattern 65 and inductor pattern 70A. In the second inductor L32, the inductor composed of inductor pattern 65 and the second inductor section 68Ad of inductor pattern 70A is electrically connected in series with the inductor composed of the first inductor section 68Ac of inductor pattern 70A.

[0152] The first capacitor C31 is composed of capacitor pattern 66, capacitor pattern 22, and capacitor pattern 69B. The second capacitor C32 is composed of capacitor pattern 67, capacitor pattern 23, and capacitor pattern 70B. The third capacitor C3 is composed of capacitor pattern 68, capacitor pattern 24, and capacitor pattern 69C.

[0153] The first inductor L31 and the first capacitor C31 constitute the first LC resonator (first resonant circuit) RC31. The second inductor L32 and the second capacitor C32 constitute the second LC resonator (second resonant circuit) RC32. The first inductor L31 and the second inductor L32 are magnetically coupled.

[0154] Figure 28 shows the filter characteristics of an electronic component. Figure 29 is an enlarged view of a part of the filter characteristics shown in Figure 28. Figures 28 and 29 show the filter characteristics (frequency characteristics of attenuation) when a signal is input from the fourth terminal electrode 7 and output from the fifth terminal electrode 8. In other words, Figures 28 and 29 show the frequency characteristics of the transmission coefficient from the fourth terminal electrode 7 to the fifth terminal electrode 8. In Figures 28 and 29, the horizontal axis represents frequency [GHz] and the vertical axis represents attenuation [dB]. In Figures 28 and 29, the characteristics of electronic component 1 are shown by a solid line (thick line), the characteristics of electronic component 1A are shown by a solid line (thin line), the characteristics of electronic component 1B are shown by a dashed line (smallly spaced dashed line), the characteristics of electronic component 1C are shown by a dashed line (largely spaced dashed line), and the characteristics of the electronic component related to the comparative example are shown by a dashed line. The electronic component related to the comparative example does not have a third inductor and a fourth inductor. In other words, the electronic component in the comparative example has a configuration that includes only a first inductor and a second inductor. The characteristic diagrams illustrated in Figures 28 and 29 represent the results obtained from simulations.

[0155] As shown in Figures 28 and 29, electronic components 1, 1A, 1B, and 1C show improved attenuation in the high-frequency band (for example, above 5 GHz in the case of the characteristics shown in Figure 28) compared to the electronic components of the comparative example. As shown in Figure 28, electronic components 1, 1A, 1B, and 1C show increased attenuation in the high-frequency band (in the case of the characteristics exemplified in Figure 28, the absolute value of the attenuation increases) compared to the electronic components of the comparative example. In the example shown in Figure 28, electronic component 1B shows the greatest attenuation in the high-frequency band, followed by electronic component 1A, electronic component 1, and electronic component 1C in that order. Electronic component 1B has the highest degree of magnetic coupling of the inductor, followed by electronic component 1A, electronic component 1, and electronic component 1C in that order. In other words, configurations with a high degree of magnetic coupling (configurations where the distance between inductor patterns is close) show better attenuation in the high-frequency band.

[0156] Furthermore, as illustrated in Figure 29, the loss characteristics of electronic components 1, 1A, 1B, and 1C in a specific frequency band can be improved compared to the comparative electronic components. In the case of the characteristics illustrated in Figure 29, the absolute value of the attenuation of electronic components 1, 1A, 1B, and 1C in a specific frequency band (for example, from approximately 2.5 GHz to 4 GHz) is reduced compared to the absolute value of the attenuation of the comparative electronic components. In other words, electronic components 1, 1A, 1B, and 1C can improve the insertion loss in the filter's passband.

[0157] As described above, in the electronic component 1C according to this embodiment, the first LC resonator RC31 has two inductors electrically connected in series in the first inductor L31. The second LC resonator RC32 has two inductors electrically connected in series in the second inductor L32. The first inductor L31 and the second inductor L2 are arranged to be magnetically coupled. As a result, the electronic component 1C can increase the attenuation in the high-frequency band. Therefore, the electronic component 1C can improve frequency characteristics, such as improving the characteristics in the high-frequency band.

[0158] In the electronic component 1C according to this embodiment, the first inductor section 67Ac and the second inductor section 67Ad are connected in the inductor pattern 69A. That is, the first inductor section 67Ac and the second inductor section 67Ad are integrated. Also, in the inductor pattern 70A, the first inductor section 68Ac and the second inductor section 68Ad are connected. That is, the first inductor section 68Ac and the second inductor section 68Ad are integrated. Therefore, in the electronic component 1C, the diameters of the inductor patterns 69A and 68A can be increased compared to the case where the first inductor sections 67Ac and 68Ac and the second inductor sections 67Ad and 68Ad are provided separately. Consequently, in the electronic component 1C, the characteristics of the inductor, such as improving the Q value, can be adjusted.

[0159] In the electronic component 1C according to this embodiment, the capacitor pattern 69B is connected to the portion where the first inductor section 67Ac and the second inductor section 67Ad are connected. The capacitor pattern 70B is connected to the portion where the first inductor section 68Ac and the second inductor section 68Ad are connected. As a result, in the electronic component 1, the amount of attenuation in the high-frequency band can be adjusted by adjusting the connection position of the capacitor patterns 70B and 68B to the inductor patterns 69A and 68A. Therefore, the frequency characteristics of the electronic component 1C can be adjusted, such as adjusting the amount of attenuation in the high-frequency band.

[0160] (Fifth embodiment) Next, a fifth embodiment will be described. Figure 30 is a perspective view of an electronic component according to the fifth embodiment. Figure 31 is a view of the electronic component shown in Figure 30 from the insulator side. Figure 32 is a side view of the electronic component shown in Figure 30. Figure 33 is an end view of the electronic component shown in Figure 30.

[0161] As shown in Figures 30 to 33, the electronic component 1D comprises a substrate 2, an insulator 3, and a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11 arranged on the insulator 3.

[0162] In electronic component 1D, the LC filter section 13D is located within the insulator 3. Figure 34 shows the conductor patterns constituting the LC filter section 13D of the electronic component 1D shown in Figure 30. In electronic component 1D, the conductor patterns are arranged in the order shown in layers F, E, D, C, B, and A of Figure 34, starting from the substrate 2 side (the main surface 3d side of the insulator 3). The conductor patterns may include inductor patterns, capacitor patterns, and via patterns. The conductor patterns can be formed from, for example, copper.

[0163] As shown in layer F of Figure 34, the LC filter section 13D has inductor pattern 15, inductor pattern 16, capacitor pattern 19, capacitor pattern 20, capacitor pattern 21, and inductor pattern 60. Inductor pattern 15, inductor pattern 16, capacitor pattern 19, capacitor pattern 20, capacitor pattern 21, and inductor pattern 60 are arranged on the planarization layer 12 (Figures 32 and 33).

[0164] As shown in layer E of Figure 34, the LC filter section 13D has capacitor patterns 22, 23, and 24. Each of the capacitor patterns 22, 23, and 24 is, for example, rectangular in shape.

[0165] As shown in layer D of Figure 34, the LC filter section 13D has via patterns 25, 26, 27, 28, 29, 30, 31, 32, 33, 36, 37, and 38. In this embodiment, via patterns 25 and 26 are, for example, circular in shape. In this embodiment, via patterns 27, 28, 29, 30, 31, 32, 33, 36, 37, and 38 are, for example, rectangular in shape.

[0166] As shown in layer C of Figure 34, the LC filter section 13D has conductor patterns 56, 57, 58, 62, and 71. Conductor pattern 71 includes an inductor pattern 71A and a capacitor pattern 71B.

[0167] As shown in layer B of Figure 34, the LC filter section 13D has via patterns 45, 46, 47, 48, 49, 50, 51, and 52. In this embodiment, via patterns 45, 46, 47, 48, 49, 50, 51, and 52 are, for example, circular in shape.

[0168] As shown in layer A of Figure 34, the electronic component 1D has a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11.

[0169] As shown in layer D of Figure 34, via pattern 25 connects capacitor pattern 19 and conductor pattern 56. Via pattern 26 connects capacitor pattern 20 and conductor pattern 57. Via pattern 27 connects inductor pattern 15 and conductor pattern 56. Via pattern 28 connects inductor pattern 15 and inductor pattern 62A. Via pattern 29 connects inductor pattern 16 and inductor pattern 71A. Via pattern 30 connects inductor pattern 16 and conductor pattern 57.

[0170] Via pattern 31 connects inductor pattern 60 and conductor pattern 58. Via pattern 32 connects inductor pattern 60 and conductor pattern 62. Via pattern 33 connects capacitor pattern 21 and conductor pattern 71. Via pattern 36 connects capacitor pattern 22 and capacitor pattern 62B. Via pattern 37 connects capacitor pattern 23 and capacitor pattern 71B. Via pattern 38 connects capacitor pattern 24 and capacitor pattern 58A.

[0171] As shown in layer B of Figure 34, via pattern 45 connects conductor pattern 56 to the first terminal electrode 4. Via pattern 46 connects conductor pattern 56 to the second terminal electrode 5. Via pattern 47 connects conductor pattern 56 to the third terminal electrode 6. Via pattern 48 connects conductor pattern 58 to the fourth terminal electrode 7. Via pattern 49 connects conductor pattern 71 to the fifth terminal electrode 8. Via pattern 50 connects conductor pattern 57 to the sixth terminal electrode 9. Via pattern 51 connects conductor pattern 57 to the seventh terminal electrode 10. Via pattern 52 connects conductor pattern 57 to the eighth terminal electrode 11.

[0172] A dielectric layer (not shown) is placed between capacitor pattern 19 and capacitor pattern 22. A dielectric layer (not shown) is placed between capacitor pattern 20 and capacitor pattern 23. A dielectric layer (not shown) is placed between capacitor pattern 21 and capacitor pattern 24. The dielectric layer can be formed from an inorganic insulating material such as a paraelectric material such as silicon nitride or silicon oxide, or a ferroelectric material.

[0173] As shown in Figure 35, inductor pattern 15 and inductor pattern 16 are arranged side by side in the first direction D1 in a plan view. In this embodiment, the shapes of inductor pattern 15 and inductor pattern 16 have line symmetry with respect to a line along the third direction D3. Inductor pattern 15 and inductor pattern 60 are arranged side by side in the third direction D3 in a plan view.

[0174] In this embodiment, the distance K1 between inductor pattern 15 and inductor pattern 16 in the first direction D1 is equivalent to the distance K3 between inductor pattern 15 and inductor pattern 60 in the third direction D3 (distance K1 = distance K3).

[0175] Distances K1 and K3 are shorter than the radii of inductor patterns 15 and 16. In this embodiment, the radius of inductor pattern 15 may be defined by half the length of the shorter side K5 of the rectangular imaginary line (shown as a dashed line in Figure 35) that encloses (encloses) the area of ​​inductor pattern 15 (in this embodiment, specifically the portion that forms a coil in inductor pattern 15) (K5 / 2). Similarly, the radius of inductor pattern 16 may be defined by half the length of the shorter side K6 of the rectangular imaginary line that encloses the area of ​​inductor pattern 16 (K6 / 2). Inductor patterns 15 and 16 may be formed, for example, so that their radii are equivalent (or approximately equivalent).

[0176] Distances K1 and K3 are shorter than the radius of the inductor pattern 60. In this embodiment, the radius of the inductor pattern 60 can be defined by half the length of the shorter side K7 of the imaginary rectangle enclosing the inductor pattern 60 (K7 / 2).

[0177] The radius of inductor pattern 15 may be greater than or equal to the radius of inductor pattern 60. The radius of inductor pattern 16 may be greater than or equal to the radius of inductor pattern 60.

[0178] Inductor pattern 15 and inductor pattern 16 are arranged to be magnetically coupled. Inductor pattern 60 is arranged to be magnetically coupled with inductor pattern 16.

[0179] Figure 36 is an equivalent circuit diagram of the electronic component 1D shown in Figure 30. As shown in Figure 36, the electronic component 1D comprises a first inductor L41, a second inductor L42, a third inductor L43, a first capacitor C41, a second capacitor C42, and a third capacitor C43. The electronic component 1D constitutes a two-stage resonant bandpass filter circuit.

[0180] The first inductor L41 is composed of inductor pattern 15 and inductor pattern 62A. The second inductor L42 is composed of inductor pattern 16 and inductor pattern 71A. The third inductor L23 is composed of inductor pattern 60.

[0181] The first capacitor C21 is composed of capacitor pattern 19, capacitor pattern 22, and capacitor pattern 62B. The second capacitor C22 is composed of capacitor pattern 20, capacitor pattern 23, and capacitor pattern 71B. The third capacitor C23 is composed of capacitor pattern 21, capacitor pattern 24, and capacitor pattern 58A.

[0182] The first inductor L41, the third inductor L43, and the first capacitor C41 constitute the first LC resonator (first resonant circuit) RC41. The first inductor L41 and the third inductor L43 are electrically connected in series. The second inductor L42 and the second capacitor C42 constitute the second LC resonator (second resonant circuit) RC42. The first inductor L41 and the second inductor L42 are magnetically coupled. The third inductor L43 and the second inductor L42 are magnetically coupled.

[0183] Figure 37 shows the filter characteristics of an electronic component. Figure 38 is an enlarged view of a portion of the filter characteristics shown in Figure 37. Figures 37 and 38 show the filter characteristics (frequency characteristics of attenuation) when a signal is input from the fourth terminal electrode 7 and output from the fifth terminal electrode 8. In other words, Figures 37 and 38 show the frequency characteristics of the transmission coefficient from the fourth terminal electrode 7 to the fifth terminal electrode 8. In Figures 37 and 38, the horizontal axis represents frequency [GHz] and the vertical axis represents attenuation [dB]. In Figures 37 and 38, the characteristics of electronic component 1D are shown by a solid line, and the characteristics of the electronic component related to the comparative example are shown by a dashed line. The electronic component related to the comparative example does not have a third inductor. That is, the electronic component related to the comparative example has a configuration that includes only the first inductor and the second inductor. Note that the characteristic diagrams illustrated in Figures 37 and 38 represent the results obtained by simulation.

[0184] As shown in Figures 37 and 38, electronic component 1D shows improved attenuation in the high-frequency band (for example, above 5 GHz in the case of the characteristics shown in Figure 37) compared to the electronic component in the comparative example. As shown in Figure 37, electronic component 1D shows increased attenuation in the high-frequency band (in the case of the characteristics illustrated in Figure 37, the absolute value of the attenuation increases) compared to the electronic component in the comparative example.

[0185] Furthermore, as illustrated in Figure 38, the loss characteristics of electronic component 1D in a specific frequency band can be improved compared to the comparative electronic component. In the case of the characteristics illustrated in Figure 38, in a specific frequency band (approximately 2.5 GHz to 4 GHz), the absolute value of the attenuation of electronic component 1D is reduced compared to the absolute value of the attenuation of the comparative electronic component. In other words, electronic component 1D can improve the insertion loss in the passband of the filter.

[0186] As described above, in the electronic component 1D according to this embodiment, the first LC resonator RC41 includes a third inductor L43 that is electrically connected in series with the first inductor L41. The third inductor L43 is arranged to be magnetically coupled with the second inductor L42. In this way, in the electronic component 1D, by arranging the third inductor L43 of the first LC resonator RC41 so as to be magnetically coupled with the second inductor L42, the attenuation in the high-frequency band can be increased (improved). Therefore, the frequency characteristics of the electronic component 1D can be improved, such as by improving the characteristics in the high-frequency band.

[0187] (Sixth Embodiment) Next, the sixth embodiment will be described. Figure 39 is a perspective view of an electronic component according to the sixth embodiment. Figure 40 is a view of the electronic component shown in Figure 39 from the insulator side. Figure 41 is a side view of the electronic component shown in Figure 39. Figure 42 is an end view of the electronic component shown in Figure 39.

[0188] As shown in Figures 39 to 42, the electronic component 1E comprises a substrate 2, an insulator 3, and a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11 arranged on the insulator 3.

[0189] In electronic component 1E, the LC filter section 13E is located within the insulator 3. Figure 43 shows the conductor pattern constituting the LC filter section 13E of electronic component 1E shown in Figure 39. In electronic component 1E, the conductor patterns are arranged in the order shown in layers F, E, D, C, B, and A in Figure 43, starting from the substrate 2 side (the main surface 3d side of the insulator 3). The conductor pattern may include inductor patterns, capacitor patterns, and via patterns. The conductor pattern can be formed from, for example, copper.

[0190] As shown in layer F of Figure 43, the LC filter section 13E has an inductor pattern 15, an inductor pattern 16, a capacitor pattern 19, a capacitor pattern 20, an inductor pattern (third inductor pattern) 72, and a conductor pattern 73. The inductor patterns 15, 16, 19, 20, 72, and 73 are arranged on the planarization layer 12 (Figures 41 and 42). The conductor pattern 73 includes an inductor pattern (fourth inductor pattern) 73A and a capacitor pattern 73B.

[0191] As shown in layer E of Figure 43, the LC filter section 13E has capacitor patterns 22, 23, and 24. Each of the capacitor patterns 22, 23, and 24 is, for example, rectangular in shape.

[0192] As shown in layer D of Figure 43, the LC filter section 13E has via patterns 25, 26, 27, 28, 29, 30, 31, 32, 34, 35, 36, 37, and 38. In this embodiment, via patterns 25 and 26 are, for example, circular in shape. In this embodiment, via patterns 27, 28, 29, 30, 31, 32, 34, 35, 36, 37, and 38 are, for example, rectangular in shape.

[0193] As shown in layer C of Figure 43, the LC filter section 13E has conductor patterns 56, 57, 58, 59, 74, and 75.

[0194] Conductor pattern 74 includes an inductor pattern 74A and a capacitor pattern 74B. Conductor pattern 75 includes an inductor pattern 75A and a capacitor pattern 75B.

[0195] As shown in layer B of Figure 43, the LC filter section 13E has via patterns 45, 46, 47, 48, 49, 50, 51, and 52. In this embodiment, via patterns 45, 46, 47, 48, 49, 50, 51, and 52 are, for example, circular in shape.

[0196] As shown in layer A of Figure 43, the electronic component 1E has a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7, a fifth terminal electrode 8, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11.

[0197] As shown in layer D of Figure 43, via pattern 25 connects capacitor pattern 19 and conductor pattern 56. Via pattern 26 connects capacitor pattern 20 and conductor pattern 57. Via pattern 27 connects inductor pattern 15 and conductor pattern 56. Via pattern 28 connects inductor pattern 15 and inductor pattern 74A. Via pattern 29 connects inductor pattern 16 and inductor pattern 75A. Via pattern 30 connects inductor pattern 16 and conductor pattern 57.

[0198] Via pattern 31 connects inductor pattern 72 and conductor pattern 58. Via pattern 32 connects inductor pattern 72 and conductor pattern 74. Via pattern 34 connects inductor pattern 73A and conductor pattern 75. Via pattern 35 connects conductor pattern 73 and conductor pattern 59.

[0199] Via pattern 36 connects capacitor pattern 22 and capacitor pattern 74B. Via pattern 37 connects capacitor pattern 23 and capacitor pattern 75B. Via pattern 38 connects capacitor pattern 24 and capacitor pattern 58A.

[0200] As shown in layer B of Figure 43, via pattern 45 connects conductor pattern 56 to the first terminal electrode 4. Via pattern 46 connects conductor pattern 56 to the second terminal electrode 5. Via pattern 47 connects conductor pattern 56 to the third terminal electrode 6. Via pattern 48 connects conductor pattern 58 to the fourth terminal electrode 7. Via pattern 49 connects conductor pattern 59 to the fifth terminal electrode 8. Via pattern 50 connects conductor pattern 57 to the sixth terminal electrode 9. Via pattern 51 connects conductor pattern 57 to the seventh terminal electrode 10. Via pattern 52 connects conductor pattern 57 to the eighth terminal electrode 11.

[0201] A dielectric layer (not shown) is placed between capacitor pattern 19 and capacitor pattern 22. A dielectric layer (not shown) is placed between capacitor pattern 20 and capacitor pattern 23. A dielectric layer (not shown) is placed between capacitor pattern 73B and capacitor pattern 24. The dielectric layer can be formed from an inorganic insulating material such as a paraelectric material such as silicon nitride or silicon oxide, or a ferroelectric material.

[0202] As shown in Figure 44, inductor pattern 15 and inductor pattern 16 are arranged side by side in the first direction D1 in a plan view. In this embodiment, the shapes of inductor pattern 15 and inductor pattern 16 have line symmetry with respect to a line along the third direction D3. Inductor pattern 72 and inductor pattern 73A are arranged side by side in the first direction D1 in a plan view. Inductor pattern 15 and inductor pattern 72 are arranged side by side in the third direction D3 in a plan view. Inductor pattern 16 and inductor pattern 73A are arranged side by side in the third direction D3 in a plan view.

[0203] In this embodiment, the distance K1 between inductor pattern 15 and inductor pattern 16 in the first direction D1 is longer than the distance K2 between inductor pattern 17 and inductor pattern 53A in the first direction D1 (distance K1 > distance K2). In other words, distance K2 is shorter than distance K1.

[0204] The distance K3 between inductor pattern 15 and inductor pattern 60 in the third direction D3 is equivalent to the distance K1 (K3=K1). The distance K4 between inductor pattern 16 and inductor pattern 61A in the third direction D3 is equivalent to the distance K1 (K4=K1). The distance K2 is shorter than the distances K3 and K4 (K2 <K3,K4)。

[0205] Distances K1, K2, K3, and K4 are shorter than the radii of inductor patterns 15 and 16. In this embodiment, the radius of inductor pattern 15 may be defined by half the length of the shorter side K5 of the rectangular imaginary line (shown as a dashed line in Figure 20) that encloses (encloses) the area of ​​inductor pattern 15 (in this embodiment, specifically the portion that forms a coil in inductor pattern 15) (K5 / 2). Similarly, the radius of inductor pattern 16 may be defined by half the length of the shorter side K6 of the rectangular imaginary line that encloses the area of ​​inductor pattern 16 (K6 / 2). Inductor patterns 15 and 16 may be formed, for example, so that their radii are equivalent (or approximately equivalent).

[0206] Distances K1, K2, K3, and K4 are shorter than the radii of inductor patterns 72 and 73A. In this embodiment, the radius of inductor pattern 72 may be defined by half the length of the shorter side K7 of the imaginary rectangle encompassing the inductor pattern 72 (K7 / 2). Similarly, the radius of inductor pattern 73A may be defined by half the length of the shorter side K8 of the imaginary rectangle encompassing the inductor pattern 73A (K8 / 2).

[0207] The radius of inductor pattern 72 is smaller than the radius of inductor pattern 73A. In other words, the radius of inductor pattern 73A is larger than the radius of inductor pattern 72. The radius of inductor pattern 15 may be greater than or equal to the radii of inductor patterns 72 and 73A. The radius of inductor pattern 16 may be greater than or equal to the radii of inductor patterns 72 and 73A.

[0208] Inductor pattern 15 and inductor pattern 16 are arranged to be magnetically coupled. Inductor pattern 72 and inductor pattern 73A are arranged to be magnetically coupled. Inductor pattern 72 is arranged to be magnetically coupled with inductor pattern 16. Inductor pattern 73A is arranged to be magnetically coupled with inductor pattern 15.

[0209] Figure 45 is an equivalent circuit diagram of electronic component 1A shown in Figure 39. As shown in Figure 45, electronic component 1E comprises a first inductor L51, a second inductor L52, a third inductor L53, a fourth inductor L54, a first capacitor C51, a second capacitor C52, and a third capacitor C53. Electronic component 1E constitutes a two-stage resonant bandpass filter circuit.

[0210] The first inductor L51 is composed of inductor pattern 15 and inductor pattern 74A. The second inductor L52 is composed of inductor pattern 16 and inductor pattern 75A. The third inductor L33 is composed of inductor pattern 72. The fourth inductor L54 is composed of inductor pattern 73A.

[0211] The first capacitor C51 is composed of capacitor patterns 19, 22, and 74B. The second capacitor C52 is composed of capacitor patterns 20, 23, and 75B. The third capacitor C53 is composed of capacitor patterns 73B, 24, and 58A.

[0212] The first inductor L51, the third inductor L53, and the first capacitor C51 constitute the first LC resonator (first resonant circuit) RC51. The first inductor L51 and the third inductor L53 are electrically connected in series. The second inductor L52, the fourth inductor L54, and the second capacitor C52 constitute the second LC resonator (second resonant circuit) RC52. The second inductor L52 and the fourth inductor L54 are electrically connected in series. The first inductor L51, the second inductor L52, and the fourth inductor L54 are magnetically coupled. The second inductor L52, the first inductor L51, and the third inductor L53 are magnetically coupled.

[0213] Figure 46 shows the filter characteristics of an electronic component. Figure 47 is an enlarged view of a part of the filter characteristics shown in Figure 46. Figures 46 and 47 show the filter characteristics (frequency characteristics of attenuation) when a signal is input from the fourth terminal electrode 7 and output from the fifth terminal electrode 8. In other words, Figures 46 and 47 show the frequency characteristics of the transmission coefficient from the fourth terminal electrode 7 to the fifth terminal electrode 8. In Figures 46 and 47, the horizontal axis represents frequency [GHz] and the vertical axis represents attenuation [dB]. In Figures 46 and 47, the characteristics of electronic component 1B are shown with a dashed line, the characteristics of electronic component 1E are shown with a solid line, and the characteristics of the electronic component related to the comparative example are shown with a dashed line. The electronic component related to the comparative example does not have a third inductor and a fourth inductor. That is, the electronic component related to the comparative example has a configuration that includes only a first inductor and a second inductor. Note that the characteristic diagrams illustrated in Figures 46 and 47 represent the results obtained by simulation.

[0214] As shown in Figures 46 and 47, electronic components 1B and 1E show improved attenuation in the high-frequency band (for example, above 5 GHz in the case of the characteristics shown in Figure 46) compared to the electronic component in the comparative example. As shown in Figure 46, electronic components 1B and 1E show increased attenuation in the high-frequency band compared to the electronic component in the comparative example. The inductor pattern 61A of electronic component 1B (see Figure 20) and the inductor pattern 73A of electronic component 1E (see Figure 44) differ in the size of the inductor pattern area (specifically, the coil size in this embodiment). The inductor pattern 73A of electronic component 1E is larger in size (diameter) than the inductor pattern 61A of electronic component 1B. As a result, electronic component 1E has different characteristics from electronic component 1B. Specifically, electronic component 1E has a two-stage attenuation characteristic in the high-frequency band.

[0215] Furthermore, as illustrated in Figure 47, the loss characteristics of electronic components 1B and 1E in a specific frequency band can be improved compared to the comparative electronic component. In the case of the characteristics illustrated in Figure 47, the absolute value of the attenuation of electronic components 1B and 1E in a specific frequency band (for example, from approximately 2.5 GHz to 4 GHz) is reduced compared to the absolute value of the attenuation of the comparative electronic component. In other words, electronic components 1B and 1E can improve the insertion loss in the filter's passband.

[0216] As described above, in the electronic component 1E according to this embodiment, the first LC resonator RC51 includes a third inductor L53 electrically connected in series with the first inductor L51. The second LC resonator RC52 includes a fourth inductor L54 electrically connected in series with the second inductor L52. The third inductor L53 is arranged to be magnetically coupled with the second inductor L52. The fourth inductor L54 is arranged to be magnetically coupled with the first inductor L51. As a result, the electronic component 1E can increase the attenuation in the high-frequency band. Therefore, the electronic component 1E can improve frequency characteristics, such as improving the characteristics in the high-frequency band.

[0217] In the electronic component 1E according to this embodiment, the inductor pattern 72 constituting the third inductor L53 and the inductor pattern 73A constituting the fourth inductor L54 have different inductor pattern area sizes (specifically, coil size in this embodiment) (radius). In this way, in the electronic component 1E, by changing the inductor pattern area size in the third inductor L53 and the fourth inductor L54, the frequency characteristics can be adjusted, such as adjusting the attenuation in the high-frequency band to a desired amount.

[0218] While embodiments of this disclosure have been described above, this disclosure is not necessarily limited to the embodiments described above, and various modifications are possible without departing from its essence.

[0219] In the above embodiment, an example was described in which electronic components 1, 1A, 1B, 1C, 1D, and 1E are provided with a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a sixth terminal electrode 9, a seventh terminal electrode 10, and an eighth terminal electrode 11 as ground electrodes, and the ground electrodes are shared. However, as shown in Figure 48, electronic component 1F may also be provided with a first terminal electrode 4, a third terminal electrode 6, a sixth terminal electrode 9, and an eighth terminal electrode 11 as ground electrodes.

[0220] In the above embodiment, an example was described in which the electronic components 1, 1A, 1B, 1C, 1D, 1E, and 1F are chip components. However, the form of the electronic components is not limited to this. For example, an electronic component may be one element included in an assembly containing multiple electronic components. Specifically, for example, when multiple electronic components are produced in large quantities using an assembly substrate (wafer) during the manufacturing process of the electronic component, the electronic component may be included in an assembly of multiple electronic components before they are separated into individual electronic components.

[0221] Any reference to elements using designations such as “First” and “Second” as used in this disclosure does not limit the number or order of those elements. These designations may be used in this disclosure as a convenient way to distinguish between two or more elements. Therefore, references to the First and Second elements do not imply that only two elements may be adopted, nor that the First element must precede the Second element in any way. Where the First element is used in this disclosure, it does not presuppose the existence of two or more elements. [Explanation of Symbols]

[0222] 1,1A,1B,1C,1D,1E,1F…Electronic components, 15,64…Inductor pattern (first inductor pattern), 16,65…Inductor pattern (second inductor pattern), 17,60,72…Inductor pattern (third inductor pattern), 18,50A,59A,73A…Inductor pattern (fourth inductor pattern), 67Ac…First inductor section (third inductor pattern), 67Ad…Second inductor section (first inductor pattern), 67B…Capacitor pattern (first capacitor pattern), 68Ac…First inductor section (fourth inductor pattern), 68Ad…Second inductor section (second inductor pattern), 68B…Capacitor pattern C1, C11, C21, C31, C41, C51... First capacitor, C2, C12, C22, C32, C42, C52... Second capacitor, K1, K2, K3, K4... Distance, L1, L11, L21, L31, L41, L51... First inductor, L2, L12, L22, L32, L42, L52... Second inductor, L3, L13, L23, L33, L43, L53... Third inductor, L4, L14, L24, L54... Fourth inductor, RC1, RC11, RC21, RC31, RC41, RC51... First LC resonator (first resonant circuit), RC2, RC12, RC22, RC32, RC42, RC52... Second LC resonator (second resonant circuit).

Claims

1. A first resonant circuit comprising a first inductor and a first capacitor, The circuit comprises a second resonant circuit which includes a second inductor and a second capacitor that are magnetically coupled to the first inductor, The first resonant circuit includes a third inductor electrically connected in series with the first inductor. The third inductor is arranged to be magnetically coupled with the second inductor, The first inductor pattern constituting the first inductor and the second inductor pattern constituting the second inductor are arranged side by side. An electronic component in which the distance between the first inductor pattern and the second inductor pattern is shorter than the radius of the first inductor pattern and the second inductor pattern, respectively.

2. The second resonant circuit includes a fourth inductor electrically connected in series with the second inductor. The electronic component according to claim 1, wherein the fourth inductor is arranged to be magnetically coupled with the first inductor and the third inductor.

3. The third inductor pattern constituting the third inductor and the fourth inductor pattern constituting the fourth inductor are arranged side by side. The electronic component according to claim 2, wherein the distance between the first inductor pattern and the second inductor pattern is shorter than the distance between the first inductor pattern and the third inductor pattern, and the distance between the second inductor pattern and the fourth inductor pattern.

4. The electronic component according to claim 3, wherein the distance between the third inductor pattern and the fourth inductor pattern is shorter than the radius of the third inductor pattern and the fourth inductor pattern, respectively.

5. A first resonant circuit comprising a first inductor and a first capacitor, The circuit comprises a second resonant circuit which includes a second inductor and a second capacitor that are magnetically coupled to the first inductor, The first resonant circuit includes a third inductor electrically connected in series with the first inductor. The third inductor is arranged to be magnetically coupled with the second inductor, The first inductor pattern constituting the first inductor and the second inductor pattern constituting the second inductor are arranged side by side. An electronic component in which the distance between the first inductor pattern and the second inductor pattern is shorter than the radius of the third inductor pattern that constitutes the third inductor.

6. The second resonant circuit includes a fourth inductor electrically connected in series with the second inductor. The fourth inductor is arranged to be magnetically coupled with the first inductor and the third inductor. The third inductor pattern and the fourth inductor pattern constituting the fourth inductor are arranged side by side. The electronic component according to claim 5, wherein the distance between the first inductor pattern and the second inductor pattern is equal to the distance between the third inductor pattern and the fourth inductor pattern.

7. The electronic component according to claim 5 or 6, wherein the distance between the first inductor pattern and the second inductor pattern is equal to the distance between the first inductor pattern and the third inductor pattern.

8. A first resonant circuit comprising a first inductor and a first capacitor, The circuit comprises a second resonant circuit which includes a second inductor and a second capacitor that are magnetically coupled to the first inductor, The first resonant circuit includes a third inductor electrically connected in series with the first inductor. The second resonant circuit includes a fourth inductor electrically connected in series with the second inductor. The third inductor is arranged to be magnetically coupled with the second inductor, The fourth inductor is arranged to be magnetically coupled with the first inductor and the third inductor. An electronic component in which the radius of the third inductor pattern constituting the third inductor is different from the radius of the fourth inductor pattern constituting the fourth inductor.

9. The electronic component according to claim 1, wherein the first inductor pattern constituting the first inductor and the third inductor pattern constituting the third inductor are formed as a single continuous conductor pattern in the same layer.

10. The electronic component according to claim 9, wherein the first capacitor pattern constituting the first capacitor is connected to the portion where the first inductor pattern and the third inductor pattern are connected.

11. The second resonant circuit includes a fourth inductor electrically connected in series with the second inductor. The electronic component according to claim 10, wherein the fourth inductor is arranged to be magnetically coupled with the first inductor and the third inductor.

12. The electronic component according to claim 11, wherein the second inductor pattern constituting the second inductor and the fourth inductor pattern constituting the fourth inductor are formed as a single continuous conductor pattern in the same layer.

13. The electronic component according to claim 12, wherein the second capacitor pattern constituting the second capacitor is connected to the portion where the second inductor pattern and the fourth inductor pattern are connected.

14. At least a portion of the first inductor pattern and the second inductor pattern are arranged in the same layer, At least a portion of the third inductor pattern constituting the third inductor and the fourth inductor pattern constituting the fourth inductor are formed in the same layer. The axial directions of the first inductor, the second inductor, the third inductor, and the fourth inductor are parallel to each other. The electronic component according to claim 2, wherein, in a plan view, the first inductor pattern, the second inductor pattern, the third inductor pattern, and the fourth inductor pattern are arranged so as not to overlap each other.

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