PCB transport device

JP7912075B2Active Publication Date: 2026-08-27FUJI CORP
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Patent Information

Application Number
JP2024553990
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-11-01
Publication Date
2026-08-27
Estimated Expiration
2042-11-01

AI Technical Summary

Benefits of technology

【0008】 このような構成によると、ローラの外周面に基板が接触した際の衝撃が緩和されるので、基板の搬入時における基板の変形等を防止することができる。

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Abstract

This substrate conveying device comprises: a pair of guide rails that guide both ends in the lateral direction of a substrate conveyed in a conveyance direction; a plurality of rollers provided so as to be able to rotate about the center axis thereof in the vertical direction at a carry-in position where the pair of guide rails carry in the substrate, the plurality of rollers introducing the conveyed substrate between the pair of guide rails; and a shock dampening section that dampens a shock when the substrate comes into contact with the outer circumferential surfaces of the rollers.
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Description

Technical Field

[0006] , , ,

[0005] , ,

[0001] The present invention relates to a substrate transfer device.

Background Art

[0002] A substrate transfer device is applied to a substrate processing machine and is used for transferring substrates in a production line. Patent Document 1 discloses a configuration in which both ends in the width direction of a substrate to be transferred are guided by a pair of guide rails, and the substrate is moved in the transfer direction by the rotation of a conveyor belt disposed below the pair of guide rails.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In such a substrate transfer device, when a substrate is carried in from the upstream side in the transfer direction of the substrate, the front end of the substrate may collide with the guide rail due to a positional deviation in the width direction of the substrate. When a substrate with low strength is applied to the substrate processing, there is a concern that the substrate may be deformed due to the collision with the guide rail. <00,00027> This specification aims to provide a substrate transfer device that alleviates the impact applied to the substrate during loading and prevents deformation of the substrate due to transfer.

Means for Solving the Problems

[0006] This specification discloses a substrate transport device comprising: a pair of guide rails that guide both ends of a substrate in the width direction as it is transported in the transport direction; a plurality of rollers that are rotatably mounted around a vertical central axis at a loading position where the substrate is loaded onto the pair of guide rails, and which introduce the transported substrate between the pair of guide rails; and a cushioning portion that mitigates the impact when the substrate comes into contact with the outer circumferential surface of the rollers.

[0007] This specification also discloses the technical idea of ​​changing "the substrate transport device described in any one of claims 1-4" to "the substrate transport device described in any one of claims 1-5" in claim 6 of the original application, the technical idea of ​​changing "the substrate transport device described in any one of claims 1-4" to "the substrate transport device described in any one of claims 1-7" in claim 8 of the original application, and the technical idea of ​​changing "the substrate transport device described in any one of claims 1-4" to "the substrate transport device described in any one of claims 1-9" in claim 10 of the original application. [Effects of the Invention]

[0008] With this configuration, the impact when the substrate comes into contact with the outer surface of the roller is mitigated, thus preventing deformation of the substrate during loading. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram showing the configuration of a component mounting machine to which a substrate transport device is applied. [Figure 2] This is a perspective view of the main components of the substrate transport device. [Figure 3] This is a side view of the substrate transport device. [Figure 4] This is a plan view of the buffer section as seen from direction IV in Figure 3. [Figure 5] Figure 4 is a side view taken from the V direction. [Figure 6] This is a perspective view showing the buffer portion in a deformed state. [Modes for carrying out the invention]

[0010] The substrate transport device will be described with reference to the drawings. In this embodiment, an example is given in which the substrate transport device is applied to a component mounting machine, which is a substrate handling machine. However, the substrate handling machine to which the substrate transport device can be applied is not limited to a component mounting machine; various other machines that perform predetermined substrate handling operations on a substrate can be used, such as a solder printing machine or a substrate inspection machine.

[0011] 1. Configuration of the parts mounting machine 10 The component mounting machine 10, together with several other types of board-to-board work machines, including other component mounting machines 10, constitutes a production line for producing board products. The board-to-board work machines that constitute the above production line may include solder printing machines, board inspection machines, reflow ovens, and the like.

[0012] 1-1. Substrate transport device 11 As shown in Figure 1, the component mounting machine 10 includes a substrate transport device 11. The substrate transport device 11 sequentially transports the substrates 91 in the transport direction and positions the substrates 91 at predetermined positions within the machine. The detailed configuration of the substrate transport device 11 will be described later.

[0013] 1-2. Parts supply device 12 The component mounting machine 10 includes a component supply device 12. The component supply device 12 supplies components to be mounted on the circuit board 91. The component supply device 12 has feeders 122 set in each of the multiple slots 121. For example, a tape feeder is used for the feeders 122, which feeds and moves a carrier tape containing a large number of components to supply components in a way that makes them easy to pick up.

[0014] 1-3. Parts transfer device 13 The component mounting machine 10 includes a component transfer device 13. The component transfer device 13 transfers the components supplied by the component supply device 12 to a predetermined mounting position on the substrate 91. The component transfer device 13 includes a head drive device 131, a moving stage 132, a mounting head 133, and a suction nozzle 134. The head drive device 131 moves the moving stage 132 in the horizontal directions (X direction and Y direction) by a linear motion mechanism. The mounting head 133 is detachably fixed to the moving stage 132 by a clamping member (not shown) and is provided so as to be movable horizontally inside the machine.

[0015] The mounting head 133 supports a plurality of suction nozzles 134 so as to be rotatable and vertically movable. The suction nozzle 134 is a holding member that picks up and holds the components supplied by the feeder 122. The suction nozzle 134 sucks the components supplied by the feeder 122 by the supplied negative pressure air. As a holding member attached to the mounting head 133, a chuck that holds the component by gripping it may be employed.

[0016] 1-4. Component camera 14, substrate camera 15 The component mounting machine 10 includes a component camera 14 and a substrate camera 15. The component camera 14 and the substrate camera 15 are digital imaging devices having an imaging element such as a CMOS. The component camera 14 and the substrate camera 15 perform imaging based on a control signal and send out the image data acquired by the imaging. The component camera 14 is configured to be able to image the component held by the suction nozzle 134 from below. The substrate camera 15 is provided on the moving stage 132 so as to be movable horizontally integrally with the mounting head 133. The substrate camera 15 is configured to be able to image the substrate 91 from above.

[0017] 1-5. Control device 16 The component mounting machine 10 includes a control device 16. The control device 16 is mainly composed of a CPU, various memories, and control circuits. Various data such as control programs used for controlling the mounting process are stored in the control device 16. The control program is data indicating the mounting positions, mounting angles, and component types of the components to be mounted on the substrate 91 in the planned mounting order.

[0018] In the mounting process, the control device 16 controls the operation of the mounting head 133 based on information output from various sensors, the results of image processing, the control program, etc. Thereby, the positions and angles of the plurality of suction nozzles 134 supported by the mounting head 133 are controlled. As a result, the components held by the suction nozzles 134 are mounted at a predetermined mounting position and a predetermined mounting angle as instructed by the control program.

[0019] 2. Configuration of the substrate transfer device 11 The substrate transfer device 11 transfers the substrate 91 carried into the upstream end of the transfer path by a substrate loading device or an external transfer device along the transfer path to a predetermined stop position. The predetermined stop position of the substrate 91 is set, for example, at the center in the transfer direction of the transfer path. For the substrate 91 positioned at the stop position, the component mounting process by the component transfer device 13 is performed. After the mounting process is completed, the substrate transfer device 11 transfers the substrate 91 from the stop position to the downstream end (the right end in FIG. 1) and unloads it outside the machine.

[0020] 2-1. Guide rail 20 The substrate transport device 11 includes a pair of guide rails 20 that form a transport path for the substrate 91. The pair of guide rails 20 guide both ends of the substrate 91 in the width direction (direction perpendicular to the transport direction, vertical direction in Figure 1, front-back direction in Figure 3) as it is transported in the transport direction (direction from lower left to upper right in Figure 2, left-right direction in Figure 3). The pair of guide rails 20 are installed above each of a pair of support plates 25 that rise from the upper surface of the base 19 and are arranged parallel to each other at a distance from each other. The distance between the pair of guide rails 20 is set to correspond to the width dimension of the substrate 91. This distance is made variable by sliding one of the support plates 25 along the upper surface of the base 19.

[0021] 2-2. Drive unit 30 The substrate transport device 11 includes a drive unit 30 for transporting the substrate 91 in the transport direction. The drive unit 30 has a pair of conveyor belts 31, a plurality of pulleys, and a drive motor 37. The conveyor belts 31 are formed in an endless annular shape and are arranged along the guide rails 20. The conveyor belts 31 are guided on the upper surface of the belt guides 21 that extend in the transport direction on the inside of the pair of guide rails 20 facing each other. Two sides of the substrate 91 in the transport direction are placed on the upper surface of the pair of conveyor belts 31.

[0022] As shown in Figure 3, the conveyor belt 31 is engaged with a pair of front and rear transport guide pulleys 32, a number of auxiliary pulleys 33, a drive pulley 34, and a tensioner pulley 35. The tensioner pulley 35 applies tension to the conveyor belt 31 to prevent slack. The drive pulley 34 is supported so as to rotate integrally with the drive shaft 36. The drive shaft 36 extends perpendicular to the transport direction and is fixed to the center of each of the pair of drive pulleys 34. The drive shaft 36 is rotationally driven by a drive motor 37 via a gear mechanism.

[0023] The drive motor 37 is, for example, a pulse motor controlled by input drive pulses. The drive motor 37 rotates the drive shaft 36, causing a pair of conveyor belts 31 to rotate via a pair of drive pulleys 34. As a result, the pair of conveyor belts 31 rotate synchronously, holding and transporting the substrate 91 placed on their upper surfaces. The drive motor 37 rotates forward by a predetermined angle in response to a positive pulse (a drive pulse of positive polarity) input, and reverses by a predetermined angle in response to a negative pulse (a drive pulse of negative polarity) input. The forward or reverse rotation of the drive motor 37 by a predetermined angle causes the conveyor belts 31 to rotate forward or backward by a predetermined unit distance.

[0024] 2-3. Backup device 40 The substrate transport device 11 includes a backup device 40. The backup device 40 is positioned below the stopping position of the substrate 91 and supports the substrate 91 from below with a plurality of backup pins 41. The plurality of backup pins 41 are mounted upright on the upper surface of a rectangular plate-shaped backup plate 42. The type, number used, and placement of the plurality of backup pins 41 are appropriately adjusted according to the type of substrate 91 to be transported. The backup plate 42 is configured to be vertically movable relative to the base 19. The backup plate 42 is driven to move up and down by an actuator 43 such as a fluid pressure cylinder.

[0025] The backup device 40 operates after the substrate 91 has been transported to the stopping position and has come to a stop. Specifically, the backup device 40 raises the backup plate 42 by the operation of the actuator 43. As the backup plate 42 rises, the backup pins 41 push the substrate 91 upward. As a result, the substrate 91 is clamped and positioned between the upper part of the guide rail 20 and the backup pins 41. In this way, the backup device 40 functions as a clamping device in the substrate transport device 11.

[0026] After the component mounting process is complete, the backup device 40 lowers the backup plate 42 by the operation of the actuator 43. As the backup plate 42 lowers, the backup pins 41 move downward away from the substrate 91. As a result, the substrate 91 is released from the clamped state and placed back on the conveyor belt 31. The substrate 91 is then ready for transport to the downstream end of the transport path and for removal from the machine.

[0027] 2-4. Circuit board sensors 381-383 The substrate transport device 11 is equipped with a plurality of substrate sensors 381-383, which are arranged at different positions in the transport direction to detect the presence or absence of substrates 91 in the transport path. The first substrate sensor 381 is positioned so that its detection position is the upstream end of the transport path in which the conveyor belt 31 performs its transport function. The second substrate sensor 382 is positioned so that its detection position is the stop position set in the center of the transport path. The third substrate sensor 383 is positioned so that its detection position is the downstream end of the transport path. The substrate sensors 381-383 have the same configuration and can be photoelectric sensors, for example, consisting of a light-emitting unit and a light-receiving unit.

[0028] 2-5. Buffer unit 50 The substrate transport device 11 forms a transport path for the substrates 91 that constitute the production line with the configuration described above, and transports and positions the substrates 91 along the transport path. The substrate transport device 11 transports the substrates 91 in cooperation with an external transport device adjacent to the upstream side. At this time, when the substrates 91 are brought in from the upstream side, the front end of the substrate 91 may collide with the guide rail 20 due to a misalignment in the width direction of the substrate 91. If a substrate 91 with low strength is used in the mounting process, there is a concern that the substrate may be deformed or otherwise damaged due to the collision with the guide rail 20.

[0029] In this case, depending on the type of mounting process, the substrate 91 may be a glass substrate with a thickness Ns of 1 mm or less. When transporting such a substrate 91, it is necessary to control the transport to prevent damage to the outer edge due to impact applied to the substrate 91. One possible solution is to significantly reduce the transport speed, but such transport control would reduce the overall production efficiency.

[0030] Therefore, the substrate transport device 11 of this embodiment employs a configuration that can mitigate the impact applied to the substrate 91 when it is being transported. Specifically, the substrate transport device 11 includes a buffer unit 50 positioned at the upstream end of the guide rail 20. This prevents deformation or damage to the substrate 91 during transport. In this embodiment, the buffer unit 50 is composed of members that are symmetrical in a direction perpendicular to the transport direction when viewed from above, so in Figures 4-6, only one of the members is shown in an enlarged view.

[0031] 3. Detailed configuration of the buffer unit 50 3-1. Multiple rollers 51 As shown in Figure 2, the buffer unit 50 is equipped with a plurality of rollers 51. As shown in Figures 4 and 5, the rollers 51 are rotatable around a vertical central axis Ar at the loading position P1 where a pair of guide rails 20 load the substrate 91. When a roller 51 comes into contact with the substrate 91 being transported, it receives an external force from the substrate 91 and rotates around the central axis Ar. Then, as shown by the thick arrow in Figure 4, the rollers 51 move the substrate 91 along the outer circumferential surface 511 of the roller 51 toward the center of the transport path in the width direction (lower side in Figure 4), introducing the substrate 91 between the pair of guide rails 20.

[0032] The roller 51 has an outer ring 52 and an inner ring 53. The outer ring 52 has an outer circumferential surface 511 that contacts the substrate 91. In this embodiment, the outer ring 52 constitutes a cushioning portion that mitigates the impact when the substrate 91 contacts the outer circumferential surface 511 of the roller 51. The outer ring 52, as a cushioning portion, is made of a material with lower hardness than the substrate 91. When the substrate 91 is a glass substrate as described above, the outer ring 52 is made of resin or rubber. The inner ring 53 is concentric with the outer ring 52 and is fitted to the inner circumferential surface of the outer ring 52 so that it can rotate integrally. The inner ring 53 is formed in a cylindrical shape and is made of a material such as metal with higher hardness than the outer ring 52.

[0033] 3-2. Pair of arms 54 As shown in Figure 2, the buffer unit 50 comprises a pair of arms 54. The arms 54 are fixed to the loading position P1 of the guide rail 20 and are formed to extend upstream (left and right in the direction of transport of the substrate 91). The arms 54 rotatably support the roller 51, which has the above configuration, around a central axis Ar. In detail, the arms 54 have a pivot support portion 541 that supports the roller 51 by fastening mounting bolts that pass through the inner ring 53 of the roller 51 to the arm body. With this configuration, the roller 51 can be replaced depending on the type of substrate 91. The arms 54 are detachably fixed to the upper surface of the guide rail 20 by two fixing bolts 55.

[0034] 3-3. Position and cushioning effect of roller 51 As described above, the roller 51, which has an outer ring 52 as a buffer, is positioned as follows when the arm 54 is installed at a predetermined position on the guide rail 20. Specifically, as shown in Figure 5, the roller 51 is positioned such that the entire thickness Ns of the conveyed substrate 91 fits within the vertical width of the roller 51 in the vertical direction. With this configuration, the contact area between the roller 51 and the substrate 91 can be increased, and as a result, the impact applied to the substrate 91 can be further mitigated.

[0035] Furthermore, as shown in Figure 5, the roller 51 is positioned upstream of the upstream end Eb of the conveyor belt 31 in the transport direction of the substrate 91. This allows the buffer unit 50 to correct the orientation of the substrate 91 (correct the widthwise displacement) before the substrate 91 is placed on the conveyor belt 31. Also, by positioning the roller 51 upstream of the upstream end Eb, it is possible to set the installation height of the roller 51 while preventing interference with the conveyor belt 31, thereby improving the degree of freedom in installation.

[0036] As shown in Figure 5, the roller 51 is positioned such that the portion 31A of the conveyor belt 31 that supports the substrate 91 fits within the vertical width of the roller 51. The "portion 31A that supports the substrate 91" refers to the section of the rotating conveyor belt 31 that supports the substrate 91, that is, the portion located in the section that extends in the conveying direction and is supported by the pair of transport guide pulleys 32. The roller 51 is positioned such that the entire thickness Nb of this portion 31A fits within the vertical width of the roller 51.

[0037] With this configuration, the lower end of the roller 51 is positioned below the upper surface of the portion 31A of the conveyor belt 31 that supports the substrate 91. This prevents the substrate 91 from getting caught between the roller 51 and the conveyor belt 31, compared to a configuration where, for example, the lower end of the roller 51 is positioned above the upper surface of the conveyor belt 31 and there is a gap between the roller 51 and the conveyor belt 31, thereby making the conveying process of the substrate 91 more stable.

[0038] 4. Modified embodiments of the embodiment 4-1. About the buffer unit 50 In one embodiment, the cushioning unit 50 comprises a roller 51 and an arm 54, with the roller 51 having a soft outer ring 52 as a cushioning part. In contrast, the substrate transport device 11 may employ a configuration that mitigates the impact applied to the substrate 91 by making the roller 51 movable.

[0039] Specifically, as shown in Figure 6, the cushioning unit 150 includes a roller 51 and an arm 54, as well as a swivel mechanism 60 positioned between the arm 54 and the guide rail 20. The swivel mechanism 60 includes a bracket 61 fixed to the guide rail 20. The bracket 61 supports the arm 54 so that it can rotate around a swivel axis At, which is the vertical axis. The bracket 61 restricts the swivel of the arm 54 by a stopper (not shown) so that the arm 54 swivels within a predetermined angular range Ra.

[0040] Furthermore, the swivel mechanism 60 uses a spring (not shown) to return the arm 54 to its initial angle when unloaded. The elastic force applied by this spring to the arm 54 is set to such an extent that the arm 54 swivels when the substrate 91 contacts the roller 51. In this way, the swivel mechanism 60 constitutes a buffer that mitigates the impact applied to the substrate 91 by retracting the roller 51 in response to the impact when the substrate 91 contacts the outer surface 511 of the roller 51.

[0041] With this configuration, when the substrate 91 comes into contact with the roller 51, the external force received by the roller 51 causes the arm 54 to pivot against the elastic force of the spring, and the roller 51 temporarily moves in opposition. This mitigates the impact applied to the substrate 91. Subsequently, as the substrate 91 is transported downstream in the transport direction, the external force received by the roller 51 from the substrate 91 decreases, and it gradually returns to its initial angle. As a result, the posture of the substrate 91 can be corrected (the misalignment in the width direction is corrected), and the substrate 91 can be introduced to the upstream end of the guide rail 20.

[0042] Furthermore, in a buffer unit 150 equipped with such a pivoting mechanism 60, a soft outer ring 52 may be used for the outer ring 52 of the roller 51 to provide further buffering. In the above embodiment, the arm 54 is pivoted around the pivot axis At to retract the roller 51 to the outside of the guide rail 20 (outside in the width direction of the substrate 91). In contrast, the buffering part only needs to mitigate the impact by retracting the roller 51 in a direction intersecting the central axis Ar. For example, the roller 51 that has come into contact with the substrate 91 may be temporarily retracted to the downstream side in the transport direction.

[0043] 4-2. Others In one embodiment, one roller 51 is positioned on the arm 54. Alternatively, multiple rollers 51 may be positioned on each of a pair of arms 54 along the extension direction of the arm 54. This allows multiple rollers to contact the outer edge of the substrate 91 during the period when the orientation of the substrate 91 is corrected, thereby reducing the individual external forces applied to the substrate 91 by the multiple rollers 51.

[0044] Furthermore, in the embodiment, the substrate 91 was exemplified as a glass substrate. However, the substrate 91 may be harder than a glass substrate and have a thickness of 1 mm or more. Since the substrate transport device 11 is equipped with rollers 51, arms 54, and buffer parts (outer ring 52, swivel mechanism 60), the substrate 91 can be protected, and the posture of the substrate 91 can be corrected without reducing the transport speed. Therefore, it is useful to apply the buffer units 50, 150 when transporting various substrates 91.

[0045] In this embodiment, the substrate handling machine to which the substrate transport device 11 is applied is a component mounting machine. However, the substrate transport device 11 can be applied to various types of substrate handling machines. Similar effects can be achieved in such configurations as well. [Explanation of Symbols]

[0046] 10: Component mounting machine, 11: PCB transport device, 20: Guide rail, 21: Belt guide, 30: Drive unit, 31: Conveyor belt, 50, 150: Cushioning unit, 51: Roller, 511: Outer surface, 52: Outer ring (cushioning part), 53: Inner ring, 54: Arm, 60: Swivel mechanism (cushioning part), 61: Bracket, 91: PCB, Ar: Central axis, At: Swivel axis, Eb: Upstream end, Nb: Thickness (of conveyor belt), Ns: Thickness (of PCB), P1: Loading position

Claims

1. A pair of guide rails that guide both ends in the width direction of the substrate being transported in the transport direction, The pair of guide rails are rotatably mounted around a vertical central axis at the loading position where the substrate is loaded, and a plurality of rollers are provided to guide the substrate to be transported between the pair of guide rails. A cushioning portion that mitigates the impact when the substrate comes into contact with the outer surface of the roller, Equipped with, The aforementioned buffer section mitigates the impact when the substrate comes into contact with the outer surface of the roller by retracting the roller in a direction intersecting the central axis.

2. A pair of guide rails that guide both ends in the width direction of the substrate being transported in the transport direction, The pair of guide rails are rotatably mounted around a vertical central axis at the loading position where the substrate is loaded, and a plurality of rollers are provided to guide the substrate to be transported between the pair of guide rails. A cushioning portion that mitigates the impact when the substrate comes into contact with the outer surface of the roller, Equipped with, A substrate transport device wherein the rollers are arranged such that the entire thickness of the substrate being transported fits within the vertical width of the rollers in the vertical direction.

3. A pair of guide rails that guide both ends in the width direction of the substrate being transported in the transport direction, The pair of guide rails are rotatably mounted around a vertical central axis at the loading position where the substrate is loaded, and a plurality of rollers are provided to guide the substrate to be transported between the pair of guide rails. A cushioning portion that mitigates the impact when the substrate comes into contact with the outer surface of the roller, A conveyor belt that transports the substrate in the transport direction by rotating along the pair of guide rails with the substrate placed on it, Equipped with, A substrate transport device wherein the roller is positioned upstream of the upstream end of the conveyor belt in the transport direction of the substrate.

4. The substrate transport device according to claim 3, wherein the roller is arranged such that, in the vertical direction, the portion of the conveyor belt that supports the substrate fits within the vertical width of the roller.

5. A pair of guide rails that guide both ends in the width direction of the substrate being transported in the transport direction, The pair of guide rails are rotatably mounted around a vertical central axis at the loading position where the substrate is loaded, and a plurality of rollers are provided to guide the substrate to be transported between the pair of guide rails. A cushioning portion that mitigates the impact when the substrate comes into contact with the outer surface of the roller, A pair of arms are fixed to the loading positions of the pair of guide rails and extend upstream in the transport direction of the substrate, Equipped with, A substrate transport device in which a plurality of the rollers are each rotatably supported by the pair of arms.

6. The substrate transport device according to claim 5, wherein each of the pair of arms has a plurality of rollers arranged along the extension direction of the arm.

7. The substrate transport apparatus according to any one of claims 2-6, wherein the buffer portion constitutes the outer circumferential surface of the roller and is formed of a material with lower hardness than the substrate.

8. The substrate transport apparatus according to claim 7, wherein the buffer portion is formed from resin or rubber.

9. The substrate transport apparatus according to any one of claims 1 to 6, wherein the substrate is a glass substrate with a thickness of 1 mm or less.

Citation Information

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