Component mounting system

Abstract

A component mounting system comprising: a pickup unit which picks up a component to be mounted; a horizontal movement unit which moves the pickup unit horizontally; a lifting unit which raises and lowers the pickup unit; a determination unit which determines any of a plurality of operating conditions for determining an operation path that combines the lowering and horizontal movement of the pickup unit at the time of mounting the component to be mounted to a mounting position on a substrate, the operating conditions including a first operating condition for determining the operation path such that the component to be mounted will not interfere with another member, which includes a pre-mounted component that is mounted to the substrate prior to the component to be mounted, on the basis of the height of the other member and the distance from the mounting position to the position of the other member and a second operating condition for determining the operation path such that the component to be mounted will not interfere with the other member on the basis of the height of the other member regardless of the distance from the mounting position to the position of the other member; and a mounting control unit which controls the horizontal movement unit and the lifting unit such that the pickup unit operates according to the operation path based on the operating condition determined by the determination unit to thereby mount the component to be mounted to the mounting position.

Description

Technical Field

[0001] This specification discloses a component mounting system.

Background Art

[0002] Conventionally, in a component mounter that mounts components at mounting positions on a substrate, there is a nozzle capable of descending and horizontally moving. After picking up (adsorbing) a component with the nozzle, the descent of the nozzle is started in front of the mounting position, and the nozzle is moved to the mounting position while descending to mount the component at the mounting position. For example, in Patent Document 1, within a determination area centered on the mounting position of the component to be mounted, among the preliminary components mounted prior to the component to be mounted, the shortest route among the routes that do not interfere with the preliminary components is selected based on the height of the highest component, and the nozzle is moved along the selected route.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

[0004] By the way, in such a component mounter, there are cases where the preliminary components are mounted at positions deviated from the planned mounting positions, or components with large dimensional tolerances are mounted. In such cases, if the nozzle is moved along the shortest route described above, there is a risk that the nozzle or the component adsorbed by the nozzle may interfere with the preliminary components.

[0005] The main object of the present disclosure is to shorten the time required for mounting while avoiding interference with other members including preliminary components when mounting a component to be mounted on a substrate.

[0006] The component mounting system of the present disclosure is a component mounting system for mounting components on a substrate, a picking unit for picking up a component to be mounted, A horizontal movement unit for moving the sampling unit horizontally, A lifting mechanism for raising and lowering the sampling mechanism, A determination unit that determines one of a plurality of operation conditions, including, as an operation condition for determining the operation trajectory of the sampling unit when mounting the component to be mounted to the mounting position on the substrate, the operation condition for determining the operation trajectory of the component to be mounted so as not to interfere with the other component, based on the height of other components including pre-mounted components mounted on the substrate before the component to be mounted and the distance from the mounting position to the position of the other components, and a second operation condition for determining the operation trajectory of the component to be mounted so as not to interfere with the other components, based on the height of the other components, regardless of the distance from the mounting position to the position of the other components, An mounting control unit that determines an operating trajectory based on the operating conditions determined by the determination unit, and performs mounting operations by controlling the horizontal movement unit and the lifting unit so that the sampling unit operates according to the determined operating trajectory and the component to be mounted is mounted at the mounting position, The gist of it is that it is equipped with the following features.

[0007] This component mounting system determines the most suitable operating conditions from among multiple operating conditions, including a first operating condition and a second operating condition, depending on the situation. This makes it possible to reduce the time required for mounting components onto a circuit board while avoiding interference with other components, including pre-mounted components. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic diagram of component mounting system 1. [Figure 2] This is a schematic diagram of the component mounting machine 10. [Figure 3] This is a schematic diagram of the head 40. [Figure 4] Block diagram showing the electrical connection relationships of component mounting system 1. [Figure 5A] This is a flowchart illustrating an example of a component mounting process. [Figure 5B]This is a flowchart illustrating an example of a component mounting process. [Figure 5C] A flowchart illustrating an example of component mounting processing. [Figure 6] This is an explanatory diagram showing an example of production data 103A. [Figure 7] This is a flowchart showing an example of an adsorption state inspection process. [Figure 8] This is an explanatory diagram showing an example of the first motion trajectory determination table 103B. [Figure 9] This is an explanatory diagram showing an example of the second motion trajectory determination table 103C. [Figure 10] This is a flowchart showing an example of the process for determining operating conditions. [Modes for carrying out the invention]

[0009] Next, embodiments for implementing this disclosure will be described with reference to the drawings. Figure 1 is a schematic diagram of the component mounting system 1. Figure 2 is a schematic diagram of the component mounting machine 10. Figure 3 is a schematic diagram of the head 40. Figure 4 is a block diagram showing the electrical connection relationships of the component mounting system 1. Note that in Figure 1, the left-right direction is the X-axis direction, the front (front) and back (back) directions are the Y-axis direction, and the up-down direction is the Z-axis direction.

[0010] As shown in Figure 1, the component mounting system 1 comprises a plurality of component mounting machines 10 (component mounting machines 10A to 10E in this embodiment) arranged along the transport direction of the substrate 12, and a management device 100. As shown in Figure 2, the component mounting machine 10 comprises a component supply device 20 that supplies components P to component supply positions, a substrate transport device 25 that transports the substrate 12, a head 40 that picks up the components P supplied to the component supply positions and mounts them on the substrate 12, and an XY robot 30 that moves the head 40 in the XY axis direction. The component mounting machine 10 also includes a parts camera 28 for imaging the orientation of components P attracted to the head 40, a mark camera 29 for imaging marks on the substrate 12 and components P mounted on the substrate 12, an operation display unit 80, and a control device 90 (see Figure 4) that controls the entire device.

[0011] As shown in Figure 2, multiple component supply devices 20 are provided in front of the component mounting machine 10, arranged in a left-right direction (X-axis direction). These component supply devices 20 are configured as tape feeders that supply components P to component supply positions by pulling out tapes 22 containing components P from a reel 21 at predetermined intervals.

[0012] As shown in Figure 2, the substrate transport device 25 has a pair of conveyor belts 26, 26 (only one is shown in Figure 2) that are spaced apart front to back and span the left to right direction. The substrate 12 is transported by these conveyor belts 26, 26. Once the substrate 12 is transported, it is supported by numerous support pins 27 erected on its back side.

[0013] As shown in Figure 2, the XY robot 30 includes a pair of left and right Y-axis guide rails 33, 33 provided along the front-to-back direction (Y-axis direction), and a Y-axis slider 34 stretched across the pair of left and right Y-axis guide rails 33, 33. The XY robot 30 also includes X-axis guide rails 31, 31 provided along the left-to-right direction (X-axis direction) in front of the Y-axis slider 34, and an X-axis slider 32 attached to the X-axis guide rails 31, 31. The X-axis slider 32 is movable in the X-axis direction by the drive of an X-axis motor 36 (see Figure 4), and the Y-axis slider 34 is movable in the Y-axis direction by the drive of a Y-axis motor 38 (see Figure 4). The position of the X-axis slider 32 in the X-axis direction is detected by an X-axis position sensor 37 (see Figure 4), and the position of the Y-axis slider 34 in the Y-axis direction is detected by a Y-axis position sensor 39 (see Figure 4). A head 40 is attached to the X-axis slider 32. The head 40 is moved to any position on the XY plane by driving and controlling the XY robot 30.

[0014] As shown in FIG. 3, the head 40 includes a head body 41, a nozzle holder 42, and a nozzle 44. The head body 41 is a disk-shaped rotating body. A plurality (here, eight) of nozzle holders 42 are provided at predetermined intervals in the circumferential direction of the head body 41. The nozzle 44 is detachably attached to the tip of each nozzle holder 42. The head 40 also includes an R-axis drive device 50, a Q-axis drive device 60, and Z-axis drive devices 70, 70. In FIG. 3, for the sake of convenience, two nozzle holders 42 located at positions engaging with the Z-axis drive devices 70, 70 are shown by solid lines, and the remaining nozzle holders 42 are shown by dashed lines.

[0015] The R-axis drive device 50 includes an R-axis 51, an R-axis motor 54, and an R-axis position sensor 55 (see FIG. 4). The R-axis 51 extends in the vertical direction, and its lower end is attached to the central axis of the head body 41. The R-axis motor 54 rotationally drives a gear 53 that meshes with an R-axis gear 52 provided at the upper end of the R-axis 51. The R-axis position sensor 55 detects the rotational position of the R-axis motor 54. The R-axis drive device 50 rotationally drives the R-axis 51 via the gears 53 and R-axis gear 52 by the R-axis motor 54, thereby causing the plurality of nozzle holders (42) supported by the head body 41 to revolve in the circumferential direction together with the plurality of nozzles 44. That is, the nozzles 44 rotate intermittently at predetermined intervals.

[0016] The Q-axis drive device 60 includes upper and lower two-stage Q-axis gears 61, 62, gears 63, 64, a Q-axis motor 65, and a Q-axis position sensor 66 (see FIG. 4). The upper and lower two-stage Q-axis gears 61, 62 are inserted coaxially and rotatably relative to the R-axis 51. The gear 63 is provided at the upper part of each nozzle holder 42 and meshes slidably in the vertical direction with the lower-stage Q-axis gear 61. The Q-axis motor 65 rotationally drives a gear 64 that meshes with the upper-stage Q-axis gear 62. The Q-axis position sensor 66 detects the rotational position of the Q-axis motor 65. The Q-axis drive device 60 rotationally drives the Q-axis gears 61, 62 by the Q-axis motor 65, thereby rotating the gear 63 that meshes with the Q-axis gear 61 and rotating each nozzle holder 42 about its central axis in the same rotational direction and with the same amount of rotation. Accordingly, the nozzles 44 also rotate (spin).

[0017] The Z-axis drive devices 70, 70 are provided at two locations on the turning (revolving) orbit of the nozzle holder 42 and are configured to be able to individually raise and lower the nozzle holder 42 at the two locations. In the present embodiment, the Z-axis drive devices 70, 70 are provided so as to face each other left and right across the center of the head body 41. The Z-axis drive device 70 includes a Z-axis slider 71, a Z-axis motor 73, and a Z-axis position sensor 74 (see FIG. 4). The Z-axis slider 71 is attached to a ball screw 72 extending in the vertical direction so as to be able to move up and down. The Z-axis slider 71 includes a clamping portion 71a that clamps an engagement piece 42a extending laterally from the nozzle holder 42. The Z-axis motor 73 raises and lowers the Z-axis slider 71 by rotating the ball screw 72. The Z-axis position sensor 74 detects the raising and lowering position of the Z-axis slider 71. The Z-axis drive device 70 drives the Z-axis motor 73 to raise and lower the Z-axis slider 71 along the ball screw 72, thereby raising and lowering the nozzle holder 42 and the nozzle 44 integrated with the Z-axis slider 71. When the nozzle holder 42 rotates together with the head body 41 and stops at the location where the Z-axis drive device 70 is arranged, the engagement piece 42a of the nozzle holder 42 is clamped by the clamping portion 71a of the Z-axis slider 71. Further, when the nozzle holder 42 moves away from the location where the Z-axis drive device 70 is arranged, the engagement piece 42a of the nozzle holder 42 comes out of the clamping portion 71a of the Z-axis slider 71.

[0018] The nozzle 44 is selectively connected to a negative pressure source 47 (see FIG. 4) such as a vacuum pump and a positive pressure source 48 (see FIG. 4) such as a compressor via a solenoid valve 46 (see FIG. 4). By operating the solenoid valve 46 so that the nozzle 44 is connected to the negative pressure source 47, a negative pressure is applied to the nozzle 44, and the component P can be adsorbed (collected). Further, by operating the solenoid valve 46 so that the nozzle 44 is connected to the positive pressure source 48, the component P adsorbed to the nozzle 44 can be mounted on the substrate 12.

[0019] As shown in Figure 2, the parts camera 28 is a camera with an imaging range that extends upward. The parts camera 28 is installed between the parts supply device 20 and the substrate transport device 25. When the nozzle 44 that has picked up a part P passes above the parts camera 28, the parts camera 28 captures an image of the part P picked up by the nozzle 44 and outputs the image to the control device 90 (see Figure 4).

[0020] The mark camera 29 is a camera with an imaging range that extends downwards. The mark camera 29 is mounted on the X-axis slider 32. The mark camera 29 captures images of reference marks on the component supply device 20, reference marks on the circuit board 12, and components P mounted on the circuit board 12, and outputs the images to the control device 90 (see Figure 4).

[0021] The operation display unit 80 is a touch panel display that displays various information such as operation information and error information of the component mounting machine 10, and receives operator input and outputs operation signals to the control device 90. In this embodiment, the operation display unit 80 can also edit information related to the components P mounted by the component mounting machine 10 based on the operator's input.

[0022] As shown in Figure 4, the control device 90 is configured as a computer centered around the CPU 91, and in addition to the CPU 91, it includes ROM 92, storage (HDD or SSD) 93, RAM 94, etc. The control device 90 receives detection signals from the X-axis position sensor 37, Y-axis position sensor 39, R-axis position sensor 55, Q-axis position sensor 66, and Z-axis position sensors 74, 74, as well as image signals from the parts camera 28 and mark camera 29, and signals from the operation display unit 80. The control device 90 also outputs control signals to the parts supply device 20, the board transport device 25, the X-axis motor 36, the Y-axis motor 38, the R-axis motor 54, the Q-axis motor 65, the Z-axis motors 73, 73, the parts camera 28, the mark camera 29, etc., and images to be displayed on the operation display unit 80.

[0023] As shown in Figure 4, the management device 100 is configured as a computer centered around a CPU 101, and in addition to the CPU 101, it is equipped with ROM 102, storage (HDD or SSD) 103, RAM 104, etc. The management device 100 stores various information necessary for the production of the circuit board 12, such as production data 103A. As shown in Figure 6, the production data 103A includes a production schedule for which types of components P to be mounted, in what order (mounting order), at what position (mounting position) on the circuit board 12, how many circuit boards 12 with components P mounted in that manner will be produced, and shape data related to the dimensions of the components P to be mounted. Here, the mounting position includes the X-axis coordinate values ​​and Y-axis coordinate values ​​when the mounting surface of the circuit board 12 is the XY plane. The dimensions of the component P include the length in the X-axis direction, the length in the Y-axis direction, and the height in the Z-axis direction. The management device 100 optimizes the mounting order based on the predetermined mounting positions and shape data, and determines the operating conditions based on the optimized mounting order. The operating conditions are the conditions for determining the operating trajectory of the nozzle 44 when mounting component P onto the substrate 12. The control device 100 is also connected to each control device 90 of the component mounting machines 10A to 10E in a communicative manner. The control device 100 creates a job including production data 103A and transmits it to each control device 90 of the component mounting machines 10A to 10E, thereby instructing each component mounting machine 10A to 10E to produce the substrate 12.

[0024] Next, the operation of the component mounting system 1 configured in this way will be explained. First, the component mounting process performed by the component mounting machines 10 (component mounting machines 10A to 10E) will be explained using Figures 5A to 5C and Figures 6 to 9. In the component mounting process, each component mounting machine 10A to 10E receives a job from the management device 100, stores the production data 103A included in the received job in the storage 93, and then executes the process using the CPU 91. In this embodiment, the operation from when one or more of the multiple nozzles 44 of a single head 40 pick up a component P, until all of the components P picked up by the head 40 are mounted on the substrate 12, is called a "cycle." The production data 103A stored in the storage 93 may be edited at a predetermined timing after the component P to be mounted by the machine has been mounted, by the operator operating the operation display unit 80 to modify the mounting position and dimensions of the specified component P. This is to fine-tune the mounting position of the component P if misalignment or other issues occur in the component P mounted on the substrate 12. Details will be described later.

[0025] When this process is started, the CPU 91 obtains the number of mounted components i, which is the number of components P mounted on a single substrate 12 by a component mounting machine 10 located upstream of its own machine (the component mounting machine 10 that executes this process) in the substrate transport direction, based on the production data 103A as shown in Figure 6 (S100). Note that if the component mounting process is executed by the component mounting machine 10A located at the very top of the stream, the number of mounted components i is 0. Next, the CPU 91 sets the mounting order s1 of the component P to be mounted this time out of the multiple (n) components P to be mounted on a single substrate 12 by the entire component mounting system 1 by adding 1 to the number of mounted components i (S102). Then, the CPU 91 sets the number of mounted components i to the mounting count value num, which is the number of components P mounted on a single substrate 12 by the entire component mounting system 1, including its own machine (S104). Finally, the CPU 91 sets the value of the nozzle number k to 1 (S106).

[0026] Next, the CPU 81 determines the part P to be picked up by the k-th nozzle 44 in the current cycle as the part to be picked up (S108). Subsequently, the CPU 91 obtains the part type of the part to be picked up from the production data 103A (S110). Then, the CPU 91 moves the nozzle 44 above the part supply position in the part supply device 20 that supplies the part to be picked up (S112). Specifically, the CPU 91 controls the R-axis motor 54 so that the k-th nozzle 44 moves to a position where it engages with the Z-axis drive device 70. Next, the CPU 91 controls the X-axis motor 36 and the Y-axis motor 38 so that the nozzle 44 moves above the part supply position, while determining the position of the nozzle 44 based on the input signals from the X-axis position sensor 37 and the Y-axis position sensor 39.

[0027] Next, the CPU 91 uses the k-th nozzle 44 to pick up the object to be picked up (S114). Specifically, the CPU 91 controls the Z-axis motor 73 so that the nozzle 44 descends, and controls the solenoid valve 46 so that a negative pressure source 47 is connected to the nozzle 44 and negative pressure is applied to the nozzle 44. When the nozzle 44 descends and contacts the upper surface of the object to be picked up, the nozzle 44 picks up the object to be picked up due to the negative pressure. Subsequently, the CPU 91 determines whether the value of the nozzle number k matches the number of parts to be picked up in the current cycle (S116). If the CPU 91 determines in S116 that the value of the nozzle number k is less than the number of parts to be picked up in the current cycle, the CPU 91 increments the value of the nozzle number k by 1 (S118). After S118, the CPU 91 returns to S108 and determines the next part P to be picked up by the nozzle 44 as the object to be picked up, and repeats the picking operation. If in S116 the CPU determines that the value of nozzle number k matches the number of parts to be picked up in the current cycle, the CPU 91 determines that all parts P to be picked up in the current cycle have been picked up and executes the pick-up state inspection process shown in Figure 7.

[0028] When the suction state inspection process is started, the CPU 91 sets the value of nozzle number j to 1 (S200). Next, the CPU 91 uses the parts camera 28 to image the tip of the j-th nozzle 44 (S202). Specifically, the CPU 91 controls the X-axis motor 36 and the Y-axis motor 38 so that the j-th nozzle 44 moves above the parts camera 28, and then controls the parts camera 28 so that an image of the tip of the j-th nozzle 44 is captured. The parts camera 28 may capture images of multiple nozzles 44 at once. Subsequently, the CPU 91 performs predetermined image processing on the image captured in S202 (S204). Then, the CPU 91 determines whether or not a suction error has occurred (S206). This process is performed, for example, as follows: The CPU 91 recognizes the part P from the captured image and performs a process to determine the position of the part P. If component P is visible in the image and the misalignment of component P is within the acceptable range, the CPU 91 determines that no suction error has occurred. If component P is not visible in the image, or if component P is visible in the image but the misalignment of component P exceeds the acceptable range, the CPU 91 determines that an suction error has occurred. If the CPU 91 determines in S206 that no suction error has occurred, the process proceeds to S214.

[0029] If the CPU 91 determines in S206 that an adsorption error has occurred, it stores the j-th nozzle 44 in storage 93 as the nozzle 44 that caused the adsorption error (S208). Next, the CPU 91 obtains the part type and mounting order s1 of the part P that was the target of the adsorption error from the production data 103A and stores it in storage 93 (S210). Subsequently, the CPU 91 decides to skip mounting the part P that was scheduled to be mounted according to the mounting order s1 obtained in S210 (S212). Then, the CPU 91 increments the value of nozzle number j by 1 (S214).

[0030] Next, the CPU 91 determines whether the value of nozzle number j is greater than the value of nozzle number k (S216). Here, nozzle number k is the number of parts picked up in the current cycle, as its initial value is 1 and is incremented by 1 each time the pick-up operation is performed in S108 to S118. If the CPU 91 determines that the value of nozzle number j is less than or equal to the value of nozzle number k, it determines that there are still nozzles 44 for which the presence or absence of a pick-up error must be checked, and returns to S200 to image the tip of the next nozzle 44 with the part camera 28. If the CPU 91 determines in S216 that the value of nozzle number j is greater than the value of nozzle number k, it determines that it has checked for the presence or absence of a pick-up error for all nozzles 44 that picked up parts P in the current cycle, and terminates this process, proceeding to S122 of the part mounting process shown in Figure 5A.

[0031] Next, the CPU 91 determines whether the s1st mounting order is a mounting order that will be skipped (S122). Specifically, the CPU 91 determines whether the s1st mounting order is a mounting order that was determined to be skipped in the suction state inspection process S210 and S212. If the CPU 91 determines in S122 that the s1st mounting order is a mounting order that will be skipped, the CPU 91 proceeds to S140. On the other hand, if the CPU 91 determines that the s1st mounting order is not a mounting order that will be skipped, the CPU 91 obtains the operating conditions for the mounting operation of the component P to be mounted in the s1st mounting order from the management device 100 (S124). The operating trajectory of the nozzle 44, which is determined based on the obtained operating conditions, is determined by a combination of the raising and lowering of the nozzle 44 driven by the Z-axis motor 73 and the horizontal movement of the nozzle 44 driven by the X-axis motor 36 and the Y-axis motor 38. For example, the operation trajectory may include a trajectory in which the nozzle 44 is moved horizontally directly above the mounting position, and then the nozzle 44 is lowered so that the component P contacts the substrate 12 at the mounting position, or a trajectory in which the nozzle 44 starts descending just before the mounting position and moves to the mounting position while descending the nozzle 44.

[0032] Now, we will temporarily suspend the explanation of the component mounting process and use Figure 10 to describe the operation condition determination process performed by the CPU 101 of the management device 100. This process is executed by the CPU 101 of the management device 100 when a new job (production data 103A) is created or when information is received from the control device 90 of each component mounting machine 10 indicating that on-machine editing has been performed on any of the component P.

[0033] When this process is started, the CPU 101 first obtains the total number of components n to be mounted on one board 12 by the entire component mounting system 1, based on the production data 103A shown in Figure 6 (S300). Next, the CPU 101 sets the value of mounting order q to 1 (S302). Subsequently, the CPU 101 determines whether the editing history of the component P to be mounted q-th is ON or OFF (S304).

[0034] Here, the editing history is the history of on-machine editing performed by the operator (worker) on the operation display unit 80 of the component mounting machine 10. On-machine editing is a process to make minor adjustments to the mounting position (values ​​of the X-axis coordinate and Y-axis coordinate) and dimensions (length in the X-axis, Y-axis, and Z-axis directions) of the component P so that the component P is mounted in the planned mounting position or so that the component P is mounted to the specified dimensions. After the production of the circuit board 12 is completed, an appearance inspection device (not shown) and a mark camera 29 of the component mounting machine 10 inspect whether each component P is mounted in the planned mounting position and whether the dimensions of each component P are to the specified dimensions. In this inspection, if for any reason each component P is mounted in a position deviating from the planned position, or if the dimensional tolerance is large and the dimensions of each component P differ from the specified dimensions, the CPU 91 receives input from the operator via the operation display unit 80 and edits the production data 103A on-machine. When on-machine editing is performed, the CPU 91 sets the editing history to ON and transmits the contents of the on-machine editing to the management device 100. Upon receiving the contents of the on-machine editing, the CPU 101 of the management device 100 temporarily updates the production data 103A. For parts P with the editing history set to ON, the editing history remains ON until the management device 100 accepts the operator's input and performs optimization of the mounting order again on the temporarily updated production data 103A, or until the management device 100 discards the temporarily updated production data 103A and returns to the original production data 103A.

[0035] If S304 determines that the editing history is OFF and not ON, the CPU 101 increments the implementation order q by 1 (S306), and then determines whether the value of implementation order q is greater than the total number of parts n (S308). If S308 determines that the value of implementation order q is less than or equal to the total number of parts n, the CPU 101 returns to S304 and repeats the process of checking the editing history of the part P to be implemented in the next implementation order. On the other hand, if S308 determines that the value of implementation order q is greater than the total number of parts n, the CPU 91 determines that the editing history of part P is OFF for all implementation orders and sets the operating condition for part P to be implemented in all implementation orders (1st to nth) as the first operating condition (S310).

[0036] In the repetition process from S304 to S308, if in S304 the CPU determines that the editing history is ON for the q-th implementation order, the CPU 101 determines the operating conditions for the 1st to (q-1)th component P to be implemented out of the total number of components n as the first operating conditions (S312), and determines the operating conditions for the qth to nth component P to be implemented as the second operating conditions (S314). After S310 or after S314, the CPU 101 stores the determined operating conditions in the storage 103 (S316) and terminates this process. In this way, when the editing history is ON, the CPU 101 determines the operating conditions for the component P implemented before the first component to be implemented among the components to be edited on the machine as the first operating conditions, and determines the operating conditions for the component P implemented after the first component to be edited as the second operating conditions.

[0037] Let's return to the explanation of the component mounting process. After S124, the CPU 91 determines whether the operating condition for the component P to be mounted s1st, as obtained in S124, is the first operating condition (S126), as shown in Figure 5A. Here, the components P to be mounted 1 to (s1-1)th are pre-mounted components that were mounted on the substrate 12 before the component P to be mounted s1st. The first operating condition is an operating condition for determining the operating trajectory of the nozzle 44 that adsorbed the component to be mounted, based on the height of the pre-mounted component and the distance from the mounting position of the component P to be mounted s1st (the component to be mounted this time) to the pre-mounted component. If the CPU 91 determines in S126 that the operating condition is the first operating condition, it obtains the height H of the tallest pre-mounted component among the pre-mounted components mounted 1 to (s1-1)th, and the distance L from the mounting position of the component to be mounted s1st to the tallest pre-mounted component (S128). Then, the CPU 91 refers to the first motion trajectory determination table 103B, as shown in Figure 8, to determine the motion trajectory of the nozzle 44 that has attracted the component to be mounted (S130). Specifically, the CPU 101 determines the motion trajectory corresponding to the height H and distance L obtained in S128 from the first motion trajectory determination table 103B as the motion trajectory of the nozzle 44 when mounting the component to be mounted. Here, the first motion trajectory determination table 103B stores the motion trajectory of the nozzle 44 for each combination of height H and distance L. The first motion trajectory determination table 103B stores motion trajectories such that when the height H is low, the nozzle 44 starts descending at a position further away from the mounting position of the component to be mounted than when the height H is high. Also, the first motion trajectory determination table 103B stores motion trajectories such that when the distance L is short, the nozzle 44 starts descending at a position further away from the mounting position of the component to be mounted than when the distance L is long. The higher the height H and the shorter the distance L, the more likely the nozzle 44 is to interfere with the pre-installed component when it starts descending before reaching the mounting position. By starting the descent of the nozzle 44 before reaching the mounting position within the range where it does not interfere with the pre-installed component, it is possible to shorten the travel distance of the nozzle 44 while avoiding interference with the pre-installed component, thereby shortening the cycle time.

[0038] Here, an example of the movement trajectory of the nozzle 44 determined based on the first operating condition will be described. In FIG. 8, Hα, Hβ, and Hγ are height thresholds, and Hα < Hβ < Hγ. Lα, Lβ, and Lγ are distance thresholds, and Lα < Lβ < Lγ. First, the case where the height H is greater than or equal to the height Hβ and less than the height Hγ will be described. If the distance L from the mounting position of the component to be mounted to the highest pre-attached component is less than the distance Lα, the CPU 91 determines the movement trajectory of the nozzle 44 as the first movement trajectory O1. The first movement trajectory O1 is a movement trajectory in which the nozzle 44 moves horizontally to directly above the mounting position and then descends. If the distance L is greater than or equal to the distance Lα and less than the distance Lβ, the CPU 91 determines the movement trajectory of the nozzle 44 as the second movement trajectory O2. The second movement trajectory O2 is a movement trajectory in which the nozzle 44 starts to descend from a position farther from the mounting position than the first movement trajectory O1. If the distance L is greater than or equal to the distance Lβ and less than the distance Lγ, the CPU 91 determines the movement trajectory of the nozzle 44 as the third movement trajectory O3. The third movement trajectory O3 is a movement trajectory in which the nozzle 44 starts to descend from a position even farther from the mounting position than the second movement trajectory O2. Next, the case where the height H is greater than or equal to the height Hα and less than the height Hβ will be described. If the distance L is less than the distance Lα, the CPU 91 determines the movement trajectory of the nozzle 44 as the second movement trajectory O2. If the distance L is greater than or equal to the distance Lα and less than the distance Lβ, the CPU 91 determines the movement trajectory of the nozzle 44 as the fourth movement trajectory O4. The fourth movement trajectory O4 is a movement trajectory in which the nozzle 44 starts to descend from a position even farther from the mounting position than the third movement trajectory O3. If the distance L is greater than or equal to the distance Lβ and less than the distance Lγ, the CPU 91 determines the movement trajectory of the nozzle 44 as the fourth movement trajectory O4. And when the height H is less than the height Hα, the CPU 91 determines the movement trajectory of the nozzle 44 as the fifth movement trajectory O5. The fifth movement trajectory O5 is a movement trajectory in which the nozzle 44 starts to descend from a position even farther from the mounting position than the fourth movement trajectory O4.

[0039] If in S126 the CPU determines that the operating condition is not the first operating condition (but is the second operating condition), the CPU 91 obtains the height H of the highest pre-attached component (S132). The second operating condition is the operating condition that determines the operating trajectory of the nozzle 44 based on the height H of the highest pre-attached component. Next, the CPU 101 refers to the second operating trajectory determination table 103C, as shown in Figure 9, to determine the operating trajectory of the nozzle 44 that will pick up the target component (S134). Specifically, the CPU 101 determines the operating trajectory corresponding to the height H obtained in S132 from the second operating trajectory determination table 103C as the operating trajectory of the nozzle 44 when mounting the target component. The second operating trajectory determination table 103C stores the same operating trajectory as in the first operating trajectory determination table 103B when the distance L is less than the distance Lα, regardless of the distance L from the mounting position of the target component to the highest pre-attached component. If height H is greater than or equal to height Hβ and less than height Hγ, the CPU 91 determines the trajectory of the nozzle 44 to be the first trajectory O1. If height H is greater than or equal to height Hα and less than height Hβ, the CPU 91 determines the trajectory of the nozzle 44 to be the second trajectory O2. If height H is less than Hα, the CPU 91 determines the trajectory of the nozzle 44 to be the fifth trajectory O5.

[0040] As described above, the operation trajectory stored in the first operation trajectory determination table 103B is such that the nozzle 44 starts descending closer to the mounting position when the distance L from the mounting position of the component to be mounted is shorter than when it is longer. This is to ensure that interference with the pre-mounted component is avoided. In addition, a component P with editing history turned ON may be mounted at a position different from the mounting position initially determined in the production data 103A, and the distance to the pre-mounted component may be shorter than initially planned. In this case, if the distance L is set to the distance originally planned and the operation trajectory of the nozzle 44 is determined based on the first operation trajectory determination table 103B, there is a risk that the nozzle 44 and the component P attracted to the nozzle 44 may interfere with the pre-mounted component. However, in this embodiment, if editing history is turned ON, the same operation trajectory as when the distance L is less than the distance Lα is determined, so that even in such cases, the nozzle 44 and the component P attracted to the nozzle 44 do not interfere with the pre-mounted component. Therefore, the second motion trajectory determination table 103C stores the same motion trajectory as in the first motion trajectory determination table 103B when the distance L is less than the distance Lα, regardless of the actual distance L.

[0041] After S130 or S134, the CPU 91 moves the nozzle 44 that has picked up the component to be mounted along the operation trajectory determined in S130 or S134 to mount the component P of mounting order s1 onto the substrate 12 (S136). Specifically, the CPU 91 controls the R-axis motor 54 so that the nozzle holder 42 that holds the nozzle 44 that has picked up the component to be mounted moves to a position where it engages with the Z-axis drive unit 70. Next, the CPU 91 determines the position of the nozzle 44 that has picked up the component to be mounted based on input signals from the X-axis position sensor 37 and the Y-axis position sensor 39 and Z-axis position sensor 74, and controls the X-axis motor 36, Y-axis motor 38 and Z-axis motor 73 so that the nozzle 44 moves along the operation trajectory determined in S130 or S134. Then, after confirming that the component to be mounted has made contact with the substrate 12, the CPU 91 controls the solenoid valve 46 so that the positive pressure source 48 is connected to the nozzle 44. As a result, positive pressure is applied to the nozzle 44, releasing the suction of component P by the nozzle 44 and mounting component P onto the substrate 12. Next, the CPU 91 increments the value of the mounting count num by 1, as shown in Figure 5B (S138).

[0042] After determining in S122 that s1 is an implementation order for skipping implementation, or after S138, the CPU 91 increments the value of implementation order s1 by 1 (S140) and decrements the value of nozzle number k by 1 (S142). Next, the CPU 91 determines whether the value of nozzle number k is 0 or not (S144). If the CPU 91 determines in S144 that the value of nozzle number k is not 0, the CPU 91 determines that there is still a nozzle 44 that has picked up a component P to be processed (implemented or skipped), and returns to S122 to determine whether the implementation order s1 of the next component P is an implementation order for skipping implementation. If the CPU 91 determines in S144 that the value of nozzle number k is 0, the CPU 91 determines that the current cycle has ended and determines whether the value of implementation order s1 is greater than the value of the implementation order in which the last component P is implemented on the machine (S146). The implementation order in which the last component P is implemented on the machine can be determined by referring to production data 103A. If in S146 the CPU determines that the value of the implementation order s1 is less than or equal to the value of the last implementation order on the machine, the CPU 91 determines that there are still parts P that need to be processed on the machine, returns to S106, and starts the next cycle.

[0043] In component mounting system 1, the operating conditions are determined based on whether or not there is a history of on-machine editing. As a result, the operating conditions are set to the first operating condition in the mounting sequence up to the point where on-machine editing is performed. That is, up to the mounting sequence in which the component P that is the subject of on-machine editing is mounted, the operating trajectory of the nozzle 44 when mounting the component P is determined based on the first operating condition. Therefore, the operating trajectory of the nozzle 44 when mounting those components P onto the substrate 12 can be sufficiently shortened. Furthermore, in component mounting machine 10, in the mounting sequence after the mounting sequence in which the component P that is the subject of on-machine editing is mounted, the operating trajectory of the nozzle 44 when mounting the component P is determined based on the second operating condition. That is, after the mounting sequence in which on-machine editing is performed, the operating trajectory when mounting the component P is determined based on the second operating condition. Therefore, even if the mounting position of component P is changed to a different position from the original production data 103A due to on-machine editing, or if the dimensions of component P are changed, interference between the nozzle 44 and the component P attracted to the nozzle 44 and pre-mounted components can be more reliably avoided.

[0044] If in S146 the CPU determines that the value of the mounting order s1 is greater than the value of the mounting order to be last mounted by the machine, the CPU 91 determines that all components P that should be processed by the machine have been processed and determines whether or not a mounting skip occurred due to a suction error (S148). If in S148 the CPU determines that no mounting skip occurred, the CPU 91 terminates this process. On the other hand, if in S148 the CPU determines that a mounting skip has occurred, the CPU 91 performs a retry operation to re-suction a component P of the same type as the component P that failed to suction and mount it on the substrate 12. In the retry operation, the CPU 91 first sets the operating conditions for performing the retry operation as the second operating conditions (S150). Next, the CPU 91 sets the reprocessing order s2, which is the order in which components P that were the target of a suction error in the suction state inspection process executed in S120 are mounted in the mounting count value num plus a value of 1 (S152). As described above, the mounting count value num is incremented by 1 when a component P is mounted, but not when the mounting of component P is skipped. Therefore, the reprocessing order s2 represents the actual mounting order of the components P to be reattached. Next, the CPU 91 sets the nozzle number k to 1 (S154).

[0045] Next, the CPU 91 determines that one of the components P that has resulted in a suction error and requires a retry operation will be the component to be re-suctioned (S156). Subsequently, the CPU 91 obtains the type of the component to be re-suctioned (S158). The component to be re-suctioned is of the same type as the component P that was the target of the suction error, and the CPU 91 determines the component to be re-suctioned by referring to the storage 93. Subsequently, the CPU 91 moves the k-th nozzle 44 above the component supply position of the component supply device 20 that supplies the component to be re-suctioned, similar to S112 (S160). Then, the CPU 91 suctions the component to be re-suctioned with the k-th nozzle 44, similar to S114 (S162).

[0046] Next, the CPU 91 determines whether the value of nozzle number k matches the number of parts that should be reattached in the current cycle (S164). If S164 determines that the value of nozzle number k is less than or equal to the number of parts that should be reattached in the current cycle, the CPU 91 increments the value of nozzle number k by 1 (S166), returns to S156, determines the next part to be reattached, and repeats the reattachment process. If S164 determines that the value of nozzle number k matches the number of parts that should be reattached in the current cycle, the CPU 91 executes the suction state inspection process (S168). The suction state inspection process is as described above. Subsequently, the CPU 91 determines whether an suction error has occurred in the suction state inspection process (S170). If S170 determines that an suction error has occurred, the CPU 91 interrupts the subsequent mounting process, notifies the error by displaying an error message on the operation display unit 80, and terminates this process. Upon seeing the error message, the operator checks the status of the corresponding component mounting machine 10, performs the necessary maintenance, and then operates the operation display unit 80 to clear the error. Once the error is cleared, the CPU 91 resumes the mounting process.

[0047] If the CPU 91 determines in S170 that no suction error has occurred, it includes the num (count value of the number of components already mounted) that have already been mounted on the substrate 12 as pre-mounted components. If the suction of component P fails and the mounting of component P is skipped, and a component P of the same type as component P is re-suctioned and mounted on the substrate 12, the pre-mounted components include not only the component P mounted on the substrate 12 before the mounting skip occurred, but also the component P mounted on the substrate 12 from the time the mounting skip occurred until the component P re-suctioned in the retry operation was mounted on the substrate 12. Specifically, the mounting order s1 is incremented by 1 in S140 regardless of whether component P is mounted or skipped, so the pre-mounted components are those component P from the 1st to s1st position, excluding the component P that was skipped. Next, as shown in Figure 5C, the CPU 91 refers to the second operation trajectory determination table 103C shown in Figure 9 to determine the operation trajectory of the nozzle 44 that suctioned the component to be re-suctioned (S174). This is the same process as in S134. Then, the CPU 91 moves along the operation trajectory determined in S174, similar to S136, and mounts the component P of reprocessing order s2 onto the circuit board 12 (S176).

[0048] Next, the CPU 91 increments the value of the mounting count num by 1 (S178), increments the value of the reprocessing order s2 by 1 (S180), and decrements the value of the nozzle number k by 1 (S182). Subsequently, the CPU 91 determines whether the value of the nozzle number k is 0 or not (S184). If it is determined in S184 that the value of the nozzle number k is not 0, the CPU 91 determines that there is still a nozzle 44 that has re-adsorbed the component P to be mounted on the substrate 12, and returns to S172. If it is determined in S184 that the value of the nozzle number k is 0, the CPU 91 determines that all the component P that was re-adsorbed in the current cycle has been mounted on the substrate 12, and determines whether the value of the reprocessing order s2 is greater than the value of the mounting order to be last mounted on the machine (S186). If in S186 the CPU determines that the value of the reprocessing order S2 is less than or equal to the value of the last component to be implemented on the machine, the CPU 91 determines that there are still components P that need to be reattached, returns to S154, and starts the next cycle. On the other hand, if in S186 the CPU determines that the value of the reprocessing order s2 is greater than the value of the last component to be implemented on the machine, the CPU 91 determines that all components P that need to be implemented on the machine have been implemented, and terminates this process.

[0049] In this component mounting machine 10, when a suction error occurs, the retry operation is performed by first processing all components P that should be processed by the machine, and then re-suctioning a component P of the same type as the component P that caused the suction error and mounting it to the substrate 12. Therefore, if the suction error had not occurred, a component P that would have been mounted later may be mounted on the substrate 12 before the component P that caused the suction error, because the mounting of the component P that caused the suction error is skipped. In this case, if only the component P mounted on the substrate 12 before the mounting skip is considered a pre-mounted component, and the operating trajectory of the nozzle 44 is determined for the component P that was re-suctioned by the retry operation, there is a risk that the nozzle 44 and the component P that is suctioned to the nozzle 44 may interfere with the pre-mounted component because a component P that should not have been mounted is mounted on the substrate 12 first. In contrast, in the component mounting machine 10 of this embodiment, the CPU 91 includes the components P mounted on the substrate 12 from the time a mounting skip occurs until the component P re-attached in the retry operation is mounted on the substrate 12 as pre-attached components and determines the operating trajectory of the nozzle 44 based on the second operating condition. Therefore, interference between the nozzle 44 and pre-attached components can be more reliably avoided when mounting the component P re-attached in the retry operation. Note that the retry operation may be performed by mounting all components to be mounted in the current cycle when a suction error occurs, and then re-attaching a component P of the same type as the component P that was the target of the suction error and mounting it on the substrate 12.

[0050] Here, the correspondence between the main elements of the embodiment and the main elements of the present disclosure as described in the claims will be explained. Specifically, the component mounting system 1 of this embodiment corresponds to the component mounting system of the present disclosure, the XY robot 30 corresponds to the horizontal movement unit, the Z-axis drive unit 70 corresponds to the lifting unit, the CPU 101 that performs the motion trajectory determination process corresponds to the determination unit, and the CPU 91 that performs the component mounting process corresponds to the mounting control unit. The operation display unit 80 corresponds to the editing unit. The head 40 corresponds to the head, and the part camera 28 and the CPU 91 that performs the suction state inspection process correspond to the detection unit.

[0051] It goes without saying that this disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure.

[0052] In the embodiment described above, the management device 100 determines the operating conditions, and the control device 90 obtains the operating conditions from the management device 100 and determines the operating trajectory. However, the control device 100 may determine the operating trajectory based on the operating conditions it has determined, and the control device 90 may obtain the operating trajectory from the management device 100. Alternatively, the control device 90 may determine the operating conditions and also determine the operating trajectory based on the determined operating conditions.

[0053] In the embodiment described above, the operating trajectory of the nozzle 44 when mounting the component P that was the target of the suction error was determined based on the second operating condition. However, the operating trajectory of the nozzle 44 when mounting the component P that was the target of the suction error may also be determined based on the first operating condition.

[0054] In the embodiment described above, the determination of whether the operating condition is the first operating condition or the second operating condition was made based on the presence or absence of an on-board editing history. However, the operating condition may be arbitrarily determined by the operator.

[0055] In the above-described embodiment, during the component mounting process, if the CPU 91 determines that a suction error has occurred in S170 even after a retry operation, it terminates the component mounting process. However, the CPU 91 may repeatedly execute the retry operation up to two or more predetermined times.

[0056] In the embodiment described above, the threshold for the distance L from the mounting position of the component to be mounted to the pre-mounted component was divided into three stages in the first motion trajectory determination table 103B: less than Lα, Lα or greater and less than Lβ, and Lβ or greater and less than Lγ. However, it may be divided into two stages, or into four or more stages. Also, in the first motion trajectory determination table 103B, the threshold for the height of the pre-mounted component was divided into three stages: less than Hα, Hα or greater and less than Hβ, and Hβ or greater and less than Hγ. However, it may be divided into two stages, or into four or more stages.

[0057] In the embodiment described above, the CPU 91 of the control device 90 determines the operating trajectory of the nozzle 44 based on the operating conditions acquired in S126 during the component mounting process. However, the CPU 91 may acquire production data 103A from the management device 100 and the operating trajectory determined based on the first operating conditions, and only if the operating conditions acquired in S126 are the second operating conditions, it may re-determine the operating trajectory based on the second operating conditions.

[0058] In the embodiment described above, the CPU 91 of the control device 90 determined the operating trajectory of the nozzle 44 by considering the distance from the mounting position of the component to be mounted to the pre-mounted component and the height of the pre-mounted component as first operating conditions. However, the CPU 91 may also determine the operating trajectory of the nozzle 44 by considering the distance from the mounting position of the component to be mounted to any interfering objects other than the pre-mounted component (for example, unevenness on the substrate 12) and the height of the interfering objects. In this case, the operator may be able to input the position and height of the interfering objects on the substrate 12 to the management device 100.

[0059] In the embodiment described above, the component mounting machine 10 may have a side camera on the head 40 that captures images of the nozzle 44 and the state of the component P being attached to the nozzle 44 from the side. In this case, the CPU 91 may use the image captured by the side camera to determine whether or not an attachment error has occurred.

[0060] In the embodiment described above, the production data 103A is edited on-machine after receiving input from the operator via the operation display unit 80. However, the editing of the production data 103A may also be performed by remotely operating a management device 100 or a PC, tablet, etc. (not shown) connected to the control device 60.

[0061] In the component mounting system of this disclosure, the mounting control unit can control the horizontal movement unit and the lifting unit so that the sampling unit starts descending before the mounting position and moves to the mounting position while descending the sampling unit, and the first operating condition is a condition for determining the operating trajectory such that when the distance is less than a predetermined distance, the sampling unit starts descending from a position closer to the mounting position than when the distance is greater than or equal to the predetermined distance, and when the height of the other member is greater than or equal to a predetermined height, the sampling unit starts descending from a position closer to the mounting position than when the height is less than the predetermined height, and the second operating condition may be the same condition as the first operating condition when the distance is less than a predetermined distance, and when the height of the other member is greater than or equal to a predetermined height, the sampling unit starts descending from a position closer to the mounting position than when the height is less than the predetermined height. If the motion trajectory is determined based on the first operating condition, a motion trajectory that shortens the travel distance can be determined by considering the distance from the mounting position to other components and the height to other components. If the motion trajectory is determined based on the second operating condition, a motion trajectory that does not interfere with other components can be set even when the reliability of the distance to other components is low.

[0062] In the component mounting system of this disclosure, an editing unit is provided that can edit the mounting position or component size for each component based on the operator's operation. The determination unit may determine the operating conditions of the sampling unit to the first operating conditions until editing is performed by the editing unit, and after editing is performed by the editing unit, the operating conditions of the sampling unit for components to be mounted on the substrate after the edited component to be edited may be determined to the second operating conditions. If the operating trajectory of the sampling unit that has picked up a component edited by the editing unit or a component to be mounted on the substrate thereafter is determined based on the first operating conditions, there is a risk of interference between the sampling unit and other components. This is because, due to the editing of the mounting position or component size, the component is mounted in a position different from the intended position, and the distance to other components becomes different from the intended distance. Therefore, when editing is performed by the editing unit, it is significant to determine the operating trajectory of the sampling unit based on the second operating conditions.

[0063] Furthermore, in the component mounting system of this disclosure, the system comprises a head having a plurality of sampling units, and a detection unit capable of detecting a sampling error of the component in each of the plurality of sampling units, wherein the horizontal movement unit is capable of moving the head horizontally, and the lifting unit is capable of individually lifting and lowering the plurality of sampling units, and the mounting control unit sequentially performs the mounting operation by sampling the components to be mounted in each of the plurality of sampling units, and may skip the mounting operation of the sampling unit in which a sampling error has been detected and perform the mounting operation of the sampling unit in which no sampling error has been detected, and at a predetermined timing, may re-sample a component of the same type as the component that could not be mounted due to the sampling error as the component to be mounted, and may determine the operation trajectory by including the components mounted on the substrate between the time the mounting operation was skipped and the mounting operation of the re-sampled component as the pre-mounted components and perform the mounting operation. Even when the mounting operation is skipped due to a sampling error and a component of the same type is re-sampled and mounted later, the movement distance of the sampling unit can be shortened while avoiding interference with other members.

[0064] In that case, the determination unit may determine the operating conditions of the sampling units among the plurality of sampling units for which no sampling error has been detected as the first operating conditions, and the operating conditions of the sampling units among the plurality of sampling units for which a sampling error was detected and the component to be mounted was re-sampled as the second operating conditions. When a sampling unit that has detected a sampling error and re-sampled the component to be mounted is mounted on the substrate, if the operating trajectory of the sampling unit that picked up those components is determined based on the first operating conditions, there is a risk of interference with other components. This is because when mounting the component that was the subject of the sampling error, there are pre-installed components on the substrate that would not be there if the components were mounted in the original order. Therefore, it is very important to determine the operating trajectory of the sampling unit based on the second operating conditions when mounting the component that was the subject of the sampling error. [Industrial applicability]

[0065] This disclosure can be used in industries such as the manufacturing of component mounting systems. [Explanation of Symbols]

[0066] 1 Component mounting system, 10, 10A~10E Component mounting machine, 12 PCB, 20 Component supply device, 21 Reel, 22 Tape, 25 PCB transport device, 26 Conveyor belt, 27 Support pin, 28 Part camera, 29 Mark camera, 30 XY robot, 31 Axis guide rail, 32 X-axis slider, 33 Axis guide rail, 34 Y-axis slider, 36 X-axis motor, 37 X-axis position sensor, 38 Y-axis motor, 39 Y-axis position sensor, 40 Head, 41 Head body, 42 Nozzle holder, 42a Engaging piece, 44 Nozzle, 46 Solenoid valve, 47 Negative pressure source, 48 Positive pressure source, 50 R-axis drive device, 51 R-axis, 52 R-axis gear, 53 Gear, 54 R-axis motor, 55 R-axis position sensor, 60 Q-axis drive device, 61 Q-axis gear, 62 Q-axis gear, 63 gear, 64 gear, 65 Q-axis motor, 66 Q-axis position sensor, 70 Z-axis drive unit, 71 Z-axis slider, 71a clamping part, 72 ball screw, 73 Z-axis motor, 74 Z-axis position sensor, 80 operation display unit, 81 CPU, 90 control unit, 91 CPU, 92 ROM, 93 storage, 94 RAM, 100 management unit, 101 CPU, 102 ROM, 103A production data, 103B first motion trajectory determination table, 103C second motion trajectory determination table, 104 RAM, H,Hα,Hβ,Hγ height, L,Lα,Lβ,Lγ distance, O1 first motion trajectory, O2 second motion trajectory, O3 third motion trajectory, O4 fourth motion trajectory, O5 fifth motion trajectory, P part.

Claims

1. A component mounting system for mounting components onto a circuit board, A sampling unit for sampling the components to be mounted, A horizontal movement unit for moving the sampling unit horizontally, A lifting mechanism for raising and lowering the sampling mechanism, A determination unit that determines one of a plurality of operation conditions, including: a first operation condition that determines the operation trajectory of the sampling unit, which combines the downward movement and horizontal movement when mounting the component to be mounted to the mounting position on the substrate, based on the height of other members, including pre-mounted components that are mounted on the substrate before the component to be mounted, and the distance from the mounting position to the position of the other members, so that the component to be mounted does not interfere with the other members; and a second operation condition that determines the operation trajectory of the component to be mounted, based on the height of the other members, so that the component to be mounted does not interfere with the other members, regardless of the distance from the mounting position to the position of the other members; An mounting control unit that determines an operating trajectory based on the operating conditions determined by the determination unit, and performs mounting operations by controlling the horizontal movement unit and the lifting unit so that the sampling unit operates according to the determined operating trajectory and the component to be mounted is mounted at the mounting position, A component mounting system equipped with the following features.

2. A component mounting system according to claim 1, The aforementioned operation trajectory includes an operation trajectory in which the sampling unit starts descending before reaching the mounting position and moves to the mounting position while descending the sampling unit. The first operating condition is a condition for determining the operating trajectory such that, if the distance is less than a predetermined distance, the sampling unit starts descending from a position closer to the mounting position than when the distance is greater than or equal to the predetermined distance, and if the height of the other member is greater than or equal to a predetermined height, the sampling unit starts descending from a position closer to the mounting position than when the height is less than the predetermined height. The second operating condition is the same as the first operating condition when the distance is less than a predetermined distance, and when the height of the other member is greater than or equal to a predetermined height, the operating trajectory is determined such that the descent of the sampling unit starts from a position closer to the mounting position than when the height is less than the predetermined height. Component mounting system.

3. A component mounting system according to claim 1 or 2, It features an editing unit that allows the user to edit the mounting position or size of each component based on the operator's actions. The determination unit determines the operating conditions of the sampling unit to the first operating conditions until editing is performed by the editing unit, and after editing is performed by the editing unit, it determines the operating conditions of the sampling unit to the second operating conditions for mounting target components that are mounted on the substrate after the editing target component that was edited. Component mounting system.

4. A component mounting system according to claim 1 or 2, A head having multiple sampling sections, Each of the multiple sampling units includes a detection unit capable of detecting errors in sampling the parts, Equipped with, The horizontal movement unit is capable of moving the head horizontally. The lifting unit is capable of individually raising and lowering multiple sampling units. The mounting control unit collects components to be mounted from each of the multiple sampling units and sequentially performs the mounting operation. It skips the mounting operation of the sampling unit where a sampling error is detected and performs the mounting operation of the sampling unit where no sampling error is detected. At a predetermined timing, it re-collects a component of the same type as the component that could not be mounted due to the sampling error as a component to be mounted. It then determines the operation trajectory by including the components mounted on the substrate between the time the mounting operation was skipped and the mounting operation of the re-collected component as pre-mounted components, and performs the mounting operation. Component mounting system.

5. A component mounting system according to claim 4, The determination unit determines the operating conditions of the sampling unit in which no sampling error has been detected among the plurality of sampling units as the first operating conditions, and determines the operating conditions of the sampling unit in which a sampling error has been detected and the component to be mounted has been re-sampled as the second operating conditions. Component mounting system.

Images