Component mounting apparatus and component mounting method

Abstract

To provide a component mount device and a component mount method that can determine whether a positional relation between a terminal and a hole part of a substrate is normal, while suppressing cost increase.SOLUTION: A component mount device includes a holding part, a supporting part, a pressing part, and a controller. The holding part holds a substrate including a hole part through which a terminal can be inserted. The supporting part supports the terminal at a position corresponding to the hole part of the substrate. The pressing part is disposed facing the substrate and configured to be able to insert the terminal into the hole part while pressing the substrate. The controller controls movement of at least one of the holding part and the pressing part so that the substrate and the pressing part get close to or away from each other. The controller brings the substrate and the pressing part close to each other until the holding part comes to a predetermined reference position relative to the pressing part, and measures a load the substrate operates on the pressing part when the holding part is at the reference position. If the load is a specified value or less, it is determined that a positional relation between the terminal supported by the supporting part and the hole part of the substrate is normal.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a component mounting apparatus and a component mounting method.

Background Art

[0002] Conventionally, various apparatuses have been proposed for mounting components by inserting terminals such as connectors into holes of a substrate such as through holes (see, for example, Patent Document 1). In the prior art, processing is also performed to determine whether the terminals are normally inserted into the holes.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0004] By the way, when the aforementioned terminal is, for example, a press-fit terminal, and the terminal is press-fitted into the hole of the substrate, the tip of the terminal is temporarily inserted into the hole before the press-fitting of the terminal is performed. If this temporary insertion is not performed normally, the press-fitting of the terminal will not be performed normally either, so processing for determining whether the positional relationship between the terminal and the hole of the substrate is normal is executed before press-fitting. In the prior art, such determination processing is performed by analyzing an image captured by a camera, so the provision of a camera and the like increases the number of components, leading to higher costs of the component mounting apparatus.

[0005] The present invention has been made in view of the above, and an object of the present invention is to provide a component mounting apparatus and a component mounting method that can determine whether the positional relationship between a terminal and a hole of a substrate is normal while suppressing an increase in cost.

Means for Solving the Problem

[0006] To solve the above problems and achieve the objective, the present invention provides a component mounting apparatus comprising a holding part, a support part, a pressing part, and a controller. The holding part holds a substrate having a hole into which a terminal can be inserted. The support part supports the terminal at a position corresponding to the hole in the substrate held by the holding part. The pressing part is positioned opposite the substrate held by the holding part and is configured to press the substrate so that the terminal can be inserted into the hole. The controller controls the movement of at least one of the holding part and the pressing part so that the substrate and the pressing part move closer together or further apart. The controller brings the substrate and the pressing part closer together until the holding part holding the substrate is at a preset reference position relative to the pressing part, and measures the load that the substrate exerts on the pressing part when the holding part holding the substrate is at the reference position. Furthermore, if the measured load is less than or equal to a preset specified value, the controller determines that the positional relationship between the terminal supported by the support part and the hole in the substrate is normal. [Effects of the Invention]

[0007] According to the present invention, when measuring the load acting on the pressing portion, it becomes possible to use existing load sensors used in the terminal press-fitting process. This allows for the determination of whether the positional relationship between the terminal and the hole in the substrate is normal, while suppressing the high cost associated with providing cameras or the like. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view of a component mounting apparatus according to an embodiment. [Figure 2] Figure 2 is a cross-sectional view taken along line II-II in Figure 1. [Figure 3] Figure 3 is an enlarged perspective view of the substrate and terminals. [Figure 4A] Figure 4A is a cross-sectional view illustrating the temporary insertion of the terminals. [Figure 4B] Figure 4B is a cross-sectional view illustrating the temporary insertion of the terminals. [Figure 5]Figure 5 is a block diagram showing an example configuration of a control device and the like. [Figure 6] Figure 6 is a diagram illustrating each process when the positional relationship between the terminal and the hole in the substrate is normal before press-fitting. [Figure 7] Figure 7 illustrates the various procedures to be performed when the positional relationship between the terminal and the hole in the substrate before press-fitting is abnormal. [Figure 8] Figure 8 is a flowchart showing the processing steps performed by the component mounting device. [Modes for carrying out the invention]

[0009] The embodiments of the component mounting apparatus and component mounting method disclosed herein will be described in detail below with reference to the attached drawings. However, the present invention is not limited to the embodiments described below.

[0010] Figure 1 is a perspective view of a component mounting apparatus according to an embodiment. Figure 2 is a cross-sectional view taken along line II-II in Figure 1. Note that Figures 1 and 2, as well as Figures 3 to 4B, 6 and 7 described later, are all schematic diagrams. In Figures 1 and 2, for the sake of explanation, a three-dimensional Cartesian coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis directions is shown. Such a Cartesian coordinate system may also be shown in other drawings used in the explanation later.

[0011] As shown in Figures 1 and 2, the component mounting apparatus 100 is a device for mounting a connector C, which has terminals B (not visible in Figure 1), onto a circuit board A. Although Figures 1 and 2 show an example in which connector C is mounted on circuit board A, the apparatus is not limited to this, and other types of components may be mounted as long as they have terminals B.

[0012] The substrate A has a hole A1 into which terminal B can be inserted. Terminal B is a press-fit terminal that is press-fitted into the hole A1 of the substrate A. In other words, connector C is mounted on substrate A by press-fitting terminal B into the hole A1 of substrate A and making an electrical connection.

[0013] Incidentally, in the component mounting step described above, a temporary insertion operation of temporarily inserting the tip end of terminal B into hole A1 is performed before press-fitting of terminal B is performed. Here, the hole A1 of substrate A, terminal B, and the temporary insertion of terminal B will be described with reference to FIGS. 3, 4A and 4B.

[0014] FIG. 3 is an enlarged perspective view of substrate A, terminal B and the like. FIGS. 4A and 4B are cross-sectional views for explaining the temporary insertion of terminal B. For convenience of understanding, FIG. 3 shows a state before terminal B is temporarily inserted into substrate A, in which terminal B and substrate A are separated from each other. 4A shows a case where the temporary insertion state of terminal B is a normal state; in other words, it shows a case where the positional relationship between terminal B before press-fitting and the hole A1 of substrate A is normal. 4B shows a case where the temporary insertion state of terminal B is an abnormal state; in other words, it shows a case where the positional relationship between terminal B before press-fitting and the hole A1 of substrate A is abnormal.

[0015] As shown in FIG. 3, a plurality of holes A1 are formed in substrate A. The hole A1 is, for example, a through hole. Connector C includes a plurality of terminals B. Then, after the plurality of terminals B are each temporarily inserted into the corresponding hole A1 (see FIG. 4A), they are press-fitted and electrically connected. The temporary insertion of the plurality of terminals B is performed in a state where they are aligned and supported by a support portion (alignment jig) 14 described later.

[0016] Here, before proceeding to the description of temporary insertion, terminal B will be described in detail with reference to FIG. 4A. Terminal B is a press-fit terminal as described above, and specifically includes a base end portion B1, a tip end portion B2, and a fit portion B3.

[0017] The base end portion B1 is a portion on the base end side of terminal B, and is a portion extending from the case portion of connector C. The tip end portion B2 is a portion on the tip end side of terminal B, and is a portion inserted into the hole A1 of substrate A during temporary insertion (see FIG. 4A).

[0018] The fitting portion B3 is formed between the base end portion B1 and the distal end portion B2, and is a portion wider than the distal end portion B2. Further, a hole B4 is formed in the fitting portion B3. When the terminal B is press-fitted, the fitting portion B3 is elastically deformed while narrowing the hole B4 and inserted into the hole portion A1, and due to the restoring force of the elastic deformation, the terminal B and the hole portion A1 come into contact with each other and are electrically connected. Since the terminal B is a press-fit terminal as described above, the terminal B can be reliably brought into contact with and electrically connected to the hole portion A1 of the substrate A by press-fitting.

[0019] The temporary insertion of the terminal B performed before the press-fitting will be described. As shown in FIG. 4A, the distal end portion B2 of the terminal B is temporarily inserted into the hole portion A1 of the substrate A. More specifically, the terminal B is supported by the support portion 14 at a position corresponding to the hole portion A1 of the substrate A, and is temporarily inserted into the hole portion A1 of the substrate A from below. Therefore, the position corresponding to the hole portion A1 of the substrate A described above can also be said to be the position where the terminal B is temporarily inserted into the hole portion A1. The state in which the distal end portion B2 of the terminal B is temporarily inserted into the hole portion A1 of the substrate A is the normal state. In other words, the positional relationship between the terminal B before press-fitting and the hole portion A1 of the substrate A shown in FIG. 4A is the positional relationship that allows subsequent press-fitting of the terminal B to be performed normally, that is, a normal positional relationship.

[0020] Here, as shown in FIG. 4B, there are cases where the above-described temporary insertion of the terminal B is not performed normally, in other words, the temporary insertion state of the terminal B may become an abnormal state. For example, the distal end portion B2 of the terminal B is not inserted into the hole portion A1 of the substrate A, resulting in a state where the substrate A is lifted. More specifically, the substrate A is lifted by a height D compared to when the temporary insertion state is the normal state. In FIG. 4B, the substrate A in the case where the temporary insertion state is the normal state is shown by imaginary lines. That is, the positional relationship between the terminal B before press-fitting and the hole portion A1 of the substrate A shown in FIG. 4B is a positional relationship that does not allow subsequent press-fitting of the terminal B to be performed normally, that is, an abnormal positional relationship.

[0021] Thus, if the temporary insertion state of terminal B is abnormal, the press-fitting of terminal B described above will not be performed properly. Therefore, a process is executed to determine whether the positional relationship between terminal B and hole A1 in substrate A is normal before press-fitting.

[0022] In conventional technology, this determination process is performed by analyzing camera images, which increases the number of components required, such as cameras, leading to higher costs for component mounting equipment. Therefore, the component mounting equipment 100 according to this embodiment is configured to determine whether the positional relationship between terminal B and hole A1 of substrate A is normal, while suppressing the increase in costs.

[0023] To explain in more detail, as shown in Figures 1 and 2, the component mounting apparatus 100 according to this embodiment comprises a holding device 10, a pressing device 20, a die set 30, a lifting unit 40, a pressing receiving unit 50, a sliding device 60, and a control device 70.

[0024] The holding device 10 is a device for holding substrate A. Specifically, the holding device 10 comprises a base portion 11, a connecting portion 12 (not visible in Figure 2), a holding portion 13, a support portion (alignment jig) 14 (see Figure 3), and a bottom portion 15.

[0025] The base portion 11 is, for example, a flat plate-shaped member that supports the holding portion 13, which will be described later. The connecting portion 12 is a member that connects the base portion 11 and the holding portion 13.

[0026] The holding part 13 holds the substrate A. More specifically, the holding part 13 holds the substrate A with terminal B temporarily inserted into the hole A1 from below. More specifically, with the connector C set in the component mounting device 100, the substrate A is placed on the holding part 13 so that terminal B of the connector C is inserted into the hole A1, thereby holding the substrate A in the holding part 13.

[0027] As described above, the support portion 14 (see Figures 3 and 4A) is a member (jig) that aligns the multiple terminals B and supports the terminals B at positions corresponding to the holes A1 in the substrate A (in other words, positions where they are temporarily inserted into the holes A1). Specifically, the support portion 14 is a comb-shaped member that clamps and aligns the multiple terminals B, and is attached to the base portion 11. When the connector C is set in the component mounting device 100, the terminals B are clamped into the support portion 14 and aligned, and then the substrate A is placed on the holding portion 13 and held, so that the terminals B are supported at positions corresponding to the holes A1 in the substrate A.

[0028] The bottom portion 15 is a component provided on the lower side of the base portion 11. Therefore, the bottom portion 15 is configured to be integrated with the holding portion 13 via the base portion 11 and the connecting portion 12. The bottom portion 15 comes into contact with the pressure receiving portion 50, which will be described later, when the terminal B is pressed in.

[0029] The pressing device 20 is a device that presses the substrate A to press-fit the terminal B into the hole A1. More specifically, the pressing device 20 presses the substrate A, into which the terminal B has been temporarily inserted, to press-fit the terminal B into the hole A1.

[0030] Specifically, the pressing device 20 comprises an upper surface portion 21, a pressing portion 22, a drive portion 23, and a load sensor 24 (see Figure 2). The upper surface portion 21 is, for example, a flat plate-shaped member and is a member provided on the upper part of the component mounting device 100.

[0031] The pressing portion 22 is a member that presses the substrate A and is provided on the lower side of the upper surface portion 21. Specifically, the pressing portion 22 is positioned above the substrate A held by the holding portion 13 and is positioned opposite to the substrate A. The pressing portion 22 can then press the substrate A with the pressing surface 22a (see Figure 2) on its lower side to insert the terminal B into the hole A1, or more precisely, press-fit it.

[0032] The drive unit 23 is connected to the upper surface portion 21 and drives (moves) the upper surface portion 21 and the pressing portion 22. Specifically, the drive unit 23 is configured to allow the upper surface portion 21 and the pressing portion 22 to move up and down. For example, by moving the pressing portion 22 downward and bringing it into contact with the substrate A, the substrate A is pressed by the pressing portion 22, thereby press-fitting the terminal B. A servo press machine (servo motor) can be used as the drive unit 23, but it is not limited to this.

[0033] The load sensor 24 (see Figure 2) detects the load acting on the pressing part 22. More specifically, the load sensor 24 detects the load acting on the pressing surface 22a of the pressing part 22. The load sensor 24 is used in the press-fitting process of terminal B, which will be described later. That is, in the press-fitting process of terminal B, the pressing part 22 presses against the substrate A until the load of the pressing part 22 detected by the load sensor 24 reaches a predetermined value necessary for press-fitting terminal B, thereby press-fitting terminal B. In this embodiment, it is possible to determine whether the positional relationship between terminal B and the hole A1 in the substrate A before press-fitting is normal based on the load acting on the pressing part 22, but this will be described later.

[0034] The die set 30 is a device that guides the vertical movement of the upper surface portion 21 of the pressing device 20 described above.

[0035] The lifting unit 40 can raise and lower the holding unit 13. Specifically, the lifting unit 40 can move (raise and lower) the holding unit 13 so that the substrate A and the pressing unit 22 move closer together or further apart (see arrow E). Note that the lifting unit 40 is an example of a moving unit.

[0036] Specifically, the lifting unit 40 is connected to the base portion 11 of the holding device 10, and raises and lowers the holding unit 13 via the base portion 11 and the connecting portion 12. An air cylinder can be used as the lifting unit 40.

[0037] More specifically, the lifting section 40 is equipped with an air intake and a spring (not shown), and when air is supplied to the air intake, the holding section 13 can be raised, and the spring is extended at this time. Furthermore, the lifting section 40 can lower the holding section 13 when the air supply is stopped, and it can also be lowered quickly due to the elastic force of the spring.

[0038] The spring described above is just one example of an elastic member. While a coil spring can be used, it is not limited to this, and other types such as leaf springs or disc springs may also be used. Furthermore, the elastic member is not limited to the spring described above, and other types such as rubber may also be used.

[0039] The pressure receiving portion 50 is a member that receives the pressing force from the pressing portion 22. Specifically, the pressure receiving portion 50 is a member that comes into contact with the holding portion 13 (more precisely, the bottom portion 15 which is integrated with the holding portion 13 via the connecting portion 12 and the base portion 11) when the substrate A held by the holding portion 13 is pressed by the pressing portion 22, and receives the pressing force from the pressing portion 22.

[0040] More specifically, the pressure receiving portion 50 is, for example, a flat plate-shaped member, positioned below the holding portion 13 and the bottom portion 15, and facing the lower surface of the bottom portion 15. In addition, a gap is formed between the pressure receiving portion 50 and the holding portion 13 (more precisely, the bottom portion 15) before pressing. When the substrate A is pressed by the pressure portion 22, the pressure receiving portion 50 comes into contact with the holding portion 13 (more precisely, the bottom portion 15) and receives the pressing force from the pressure portion 22.

[0041] In this way, since the pressure receiving portion 50 is configured to receive the pressure from the pressure portion 22, it is possible to suppress the pressure from acting on other members, such as the rail portion 61 which will be described later.

[0042] In other words, for example, if the configuration were not to include the pressure receiving portion 50, the pressing force from the pressing portion 22 would act on other components such as the rail portion 61 via the holding device 10 and the lifting portion 40. In such a case, the rail portion 61 and other components would have to be made larger, for example, in order to have durability against the pressing force from the pressing portion 22. In contrast, in this embodiment, the above-described pressure receiving portion 50 is provided to receive the pressing force from the pressing portion 22, so that the pressing force acting on other components such as the rail portion 61 can be suppressed, and thus the enlargement of other components can be avoided.

[0043] The sliding device 60 is a device that slides the holding device 10 and the lifting unit 40. Specifically, the sliding device 60 is equipped with a rail section 61 and slides the holding device 10 and the lifting unit 40 along the rail section 61 in the Y-axis direction. In addition, the sliding device 60 moves the position of the holding device 10 and the other components between a "press-fit position" and a "set position" by sliding them.

[0044] The "press-fit position" is the state in which the holding device 10, etc., is positioned below the pressing portion 22 of the pressing device 20, as shown in Figures 1 and 2, and is the position in which terminal B is pressed in. Furthermore, as will be described later, the "press-fit position" is also the position in which a process is executed to determine whether the positional relationship between terminal B and the hole A1 of the substrate A is normal or not. In other words, it is the position in which a process is executed to determine whether the temporary insertion state of terminal B is normal or abnormal.

[0045] Although not shown in the diagram, the "set position" is the position where the substrate A and connector C are set in the component mounting device 100, and where the holding device 10 etc. are pulled out in the negative Y-axis direction from the position below the pressing part 22.

[0046] Thus, in this embodiment, by providing the sliding device 60, the holding device 10, for example, can be pulled outwards from a position below the pressing portion 22 (i.e., in the "set position"), and thus the substrate A and connector C can be easily set.

[0047] The control device 70 is a device that controls the entire component mounting device 100. The configuration of the control device 70 will now be explained with reference to Figure 5. Figure 5 is a block diagram showing an example configuration of the control device 70 and other components.

[0048] As shown in Figure 5, the load sensor 24 described above is connected to the control device 70, and a signal indicating the load acting on the pressing unit 22 is input to it. The pressing device 20, lifting unit 40, sliding device 60, etc., are also connected to the control device 70, and the control device 70 controls the operation of the pressing device 20, lifting unit 40, etc.

[0049] The control device 70 comprises a controller (control unit) 80 and a storage unit 90. The storage unit 90 is a storage unit composed of storage devices such as non-volatile memory or data flash. Various data and various programs are stored in this storage unit 90.

[0050] The controller 80 performs various controls, such as controlling the movement of the holding unit 13 and the pressing unit 22. Specifically, the controller 80 includes an inspection unit 81 and a press-fitting control unit 82, and includes a computer and various circuits, such as a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and input / output ports.

[0051] The computer's CPU functions as the inspection unit 81 and press-fitting control unit 82 of the controller 80, for example, by reading and executing a program stored in ROM. Alternatively, at least one part or all of the inspection unit 81 and press-fitting control unit 82 of the controller 80 can be configured with hardware such as an ASIC (Application Specific Integrated Circuit) or FPGA (Field Programmable Gate Array).

[0052] The inspection unit 81 of the controller 80 performs processes such as inspecting the temporary insertion state of terminal B before press-fitting terminal B. Specifically, the inspection unit 81 performs processes such as determining whether the positional relationship between terminal B and hole A1 of substrate A before press-fitting is normal, or more specifically, determining whether the temporary insertion state of terminal B is normal (whether it is normal or abnormal). The press-fitting control unit 82 performs press-fitting processes to control the press-fitting of terminal B when the positional relationship between terminal B and hole A1 of substrate A before press-fitting is normal, that is, when the temporary insertion state of terminal B is normal.

[0053] Here, the inspection process, including the judgment process described above, and the press-fitting process will be explained with reference to Figures 6 and 7. Figure 6 is a diagram illustrating each process when the positional relationship between terminal B and hole A1 in substrate A before press-fitting is normal (i.e., when the temporary insertion state of terminal B is normal). Figure 7 is a diagram illustrating each process when the positional relationship between terminal B and hole A1 in substrate A before press-fitting is abnormal (i.e., when the temporary insertion state of terminal B is abnormal).

[0054] First, regarding Figure 6, as shown in the upper left diagram, the substrate A and connector C are set in the component mounting device 100. More specifically, a temporary insertion operation is performed in which terminal B is temporarily inserted into hole A1 of substrate A. In other words, substrate A, after the temporary insertion process of terminal B has been performed, is held by the holding unit 13.

[0055] Furthermore, the inspection unit 81 may perform a temporary insertion of terminal B when the holding device 10 etc. is in the "set position," and then control the sliding device 60 to set the holding device 10 etc. to the "press-fit position." Also, the temporary insertion operation described above may be performed by a machine (e.g., a robot) or by an operator.

[0056] Next, as shown in the upper center diagram, the inspection unit 81 lowers the pressing unit 22 to the inspection preparation position (see arrow G1). Specifically, the inspection unit 81 controls the pressing device 20 (more precisely, the drive unit 23) to lower the pressing unit 22 to the preparation position and stop it. The preparation position is, for example, a position where the pressing surface 22a of the pressing unit 22 is near the substrate A, but does not come into contact with the substrate A.

[0057] Next, as shown in the upper right figure, the inspection unit 81 controls the lifting unit 40 to raise the holding unit 13 so that the substrate A and the pressing unit 22 are brought closer together (see arrow G2). Specifically, the inspection unit 81 brings the substrate A and the pressing unit 22 closer together until the holding unit 13, which holds the substrate A, is in a reference position relative to the pressing unit 22. This reference position is a preset position, for example, a position in which the substrate A and the pressing unit 22 are not in contact when the temporary insertion state of terminal B is normal, while the substrate A and the pressing unit 22 are in contact when the temporary insertion state is abnormal.

[0058] More specifically, as shown in Figure 4B, if the temporary insertion state of terminal B is abnormal, in other words, if the tip B2 of terminal B is not properly inserted into the hole A1, the substrate A will be floating relative to the holding part 13 (in other words, the substrate A will float). In this embodiment, this floating of the substrate A is detected based on the load acting on the pressing part 22.

[0059] Specifically, the inspection unit 81 raises the holding unit 13 that holds the substrate A to the reference position described above. At this time, if the temporary insertion state of terminal B is normal (i.e., the positional relationship between terminal B and hole A1 of substrate A is normal), no lifting occurs in substrate A, and as a result, substrate A and the pressing unit 22 are not in contact (in other words, they do not make contact). On the other hand, if the temporary insertion state of terminal B is abnormal (i.e., the positional relationship between terminal B and hole A1 of substrate A is abnormal), lifting occurs in substrate A, and substrate A and the pressing unit 22 come into contact. This will be described later with reference to Figure 7.

[0060] Next, the inspection unit 81 raises the holding unit 13 that holds the substrate A to a reference position and measures the load that the substrate A exerts on the pressing unit 22. In other words, the inspection unit 81 measures the load that the substrate A exerts on the pressing unit 22 when the holding unit 13 is in the reference position using a load sensor 24 (see Figure 5).

[0061] The inspection unit 81 then determines, based on the measured load, whether the positional relationship between terminal B before press-fitting and hole A1 in substrate A is normal. More specifically, if the load is below a specified value, the inspection unit 81 determines that the positional relationship between terminal B supported by the support unit 14 and hole A1 in substrate A is normal, that is, that the temporary insertion state is normal. More specifically, if the state in which the load is below a specified value continues for a specified value or longer, the inspection unit 81 determines that the positional relationship between terminal B and hole A1 in substrate A is normal.

[0062] The specified value mentioned above is a preset value, and is set to a value that indicates, for example, that substrate A and the pressing part 22 are not in contact (for example, 0 (zero)), but is not limited to this and can be set to any value. Similarly, the specified time mentioned above is a preset value, and is set to a value that allows for the determination that substrate A and the pressing part 22 are not in contact (for example, 1 second), but is not limited to this and can be set to any value.

[0063] In the example shown in Figure 6, since the substrate A and the pressing part 22 are not in contact, the state in which the load is below the specified value continues for a specified time or longer, and therefore the inspection unit 81 determines that the positional relationship between the terminal B before press-fitting and the hole A1 of the substrate A is normal. Then, as shown in the lower right figure, the inspection unit 81 controls the lifting unit 40 to lower the holding unit 13 to separate the substrate A and the pressing part 22, and returns it to its original position (see arrow G3), and then stops the holding unit 13.

[0064] Since the positional relationship between terminal B and hole A1 in substrate A before press-fitting is normal (i.e., the temporary insertion state of terminal B is normal), the press-fitting control unit 82 press-fits terminal B as shown in the lower center diagram. Specifically, the press-fitting control unit 82 controls the drive unit 23 to lower the pressing unit 22 and bring it into contact with substrate A (see arrow G4). The press-fitting control unit 82 then presses substrate A with the pressing unit 22 until the load of the pressing unit 22 detected by the load sensor 24 reaches a predetermined value required for press-fitting terminal B. As a result, substrate A is pressed towards terminal B by the pressing unit 22, and thus terminal B is press-fitted into hole A1.

[0065] At this time, the press-fitting control unit 82 uses the pressing unit 22 to press the substrate A, which is held by the stopped holding unit 13, into the hole A1. As a result, the pressing force from the pressing unit 22 acts efficiently on the substrate A, and thus the press-fitting of the terminal B can be reliably performed.

[0066] Furthermore, when terminal B is pressed in, the pressure receiving portion 50 comes into contact with the holding portion 13 and receives the pressing force from the pressing portion 22, as described above. As previously stated, this prevents the pressing force from acting on other members such as the rail portion 61.

[0067] Then, once the press-fitting of terminal B is complete, the press-fitting control unit 82 raises the pressing unit 22 back to its original position, as shown in the lower left diagram (see arrow G5).

[0068] In the above example, the temporary insertion state of terminal B is shown as normal, and the substrate A and the pressing portion 22 are not in contact. However, the method is not limited to this example. That is, for example, when the temporary insertion state of terminal B is normal, the substrate A and the pressing portion 22 may be in slight contact. In such a case, by setting the specified value to the value at which the substrate A and the pressing portion 22 are in slight contact, it is possible to determine whether the positional relationship between terminal B and the hole A1 in the substrate A before press-fitting is normal.

[0069] Next, referring to Figure 7, we will explain the processes when the positional relationship between terminal B and hole A1 in substrate A before press-fitting is abnormal (i.e., when the temporary insertion state of terminal B is abnormal). As shown in the upper left diagram of Figure 7, substrate A, on which the temporary insertion work of temporarily inserting terminal B into hole A1 in substrate A has been performed, is held by the holding part 13.

[0070] Next, as shown in the upper center diagram, the inspection unit 81 lowers the pressing unit 22 to the inspection preparation position and stops it (see arrow H1). Then, as shown in the upper right diagram, the inspection unit 81 controls the lifting unit 40 to raise the holding unit 13, bringing the substrate A and the pressing unit 22 closer together (see arrow H2). Finally, as shown in the lower right diagram, the inspection unit 81 raises the holding unit 13 until the holding unit 13, which holds the substrate A, is in a reference position relative to the pressing unit 22 (see arrow H3).

[0071] The inspection unit 81 raises the holding unit 13 that holds the substrate A to a reference position and measures the load that the substrate A exerts on the pressing unit 22. At this time, the positional relationship between the terminal B and the hole A1 of the substrate A is abnormal (the temporary insertion state of the terminal B is abnormal), causing the substrate A to lift (see Figure 4B), and thus the substrate A comes into contact with the pressing unit 22 (more precisely, the pressing surface 22a).

[0072] Therefore, if the measured load exceeds a specified value, the inspection unit 81 determines that the positional relationship between the terminal B before press-fitting and the hole A1 in the substrate A is abnormal; in other words, it determines that the temporary insertion state is abnormal. That is, in this embodiment, when the substrate A and the pressing unit 22 come into contact, the load acting on the pressing unit 22 is detected, and at the time such load is detected, in other words, when the load exceeds a specified value, it is possible to determine early that the positional relationship between the terminal B before press-fitting and the hole A1 in the substrate A is abnormal.

[0073] Next, because the positional relationship between terminal B before press-fitting and hole A1 in substrate A is abnormal, the inspection unit 81 performs a separation process to separate the pressing unit 22 and substrate A. Specifically, as shown in the lower center diagram, the inspection unit 81 controls the lifting unit 40 to separate the pressing unit 22 and substrate A, and more specifically lowers the holding unit 13 (see arrow H4). The inspection unit 81 also raises the pressing unit 22 back to its original position (see arrow H5).

[0074] Thus, in this embodiment, if it is determined that the positional relationship between terminal B and hole A1 of substrate A is abnormal, the pressing part 22 and substrate A are separated. This prevents the pressing force from the pressing part 22 from acting on terminal B, for example, terminal B that is not inserted into hole A1, and deforming terminal B.

[0075] Furthermore, since the lifting section 40 is equipped with a spring as described above, the holding section 13 can be lowered early using the elastic force of the spring, that is, the pressing section 22 and the substrate A can be separated early, making it difficult for the pressing force from the pressing section 22 to act on the terminal B.

[0076] In this embodiment, the holding portion 13 that holds the substrate A is raised to a reference position, the load acting from the substrate A onto the pressing portion 22 is measured, and if the measured load is less than or equal to a specified value, it is determined that the positional relationship between the terminal B and the hole A1 of the substrate A is normal. As a result, in this embodiment, it is possible to reliably detect, for example, that the floating of the substrate A as described above has not occurred, and thus it is possible to accurately determine whether or not the positional relationship between the terminal B and the hole A1 of the substrate A is normal.

[0077] Furthermore, in this embodiment, when measuring the load acting on the pressing portion 22, it is possible to use the existing load sensor 24 used in the press-fitting process of terminal B. This makes it possible to determine whether the positional relationship between terminal B and the hole A1 of substrate A is normal while suppressing the high cost of providing a camera or the like.

[0078] Furthermore, in this embodiment, the load acting on the pressing part 22 is measured when the pressing part 22 is stopped. This makes it possible to measure the load acting on the pressing part 22 without factors such as friction in the die set 30 or resistance of the jig affecting the load sensor 24, and as a result, it becomes possible to accurately measure the load acting on the pressing part 22 when the substrate A and the pressing part 22 are in contact.

[0079] Furthermore, in this embodiment, even if there are multiple terminals B and multiple holes A1, as described above, it is possible to determine whether the positional relationship between the multiple terminals B and the multiple holes A1 of the substrate A is normal by measuring the load that the substrate A exerts on the pressing portion 22 when the holding portion 13 that holds the substrate A is in the reference position.

[0080] In the above description, the lifting unit 40, which functions as a moving unit, moves the holding unit 13 so that the substrate A and the pressing unit 22 move closer together or further apart. However, the system is not limited to this, and the pressing unit 22 may be configured to move instead. That is, the drive unit 23 may function as a moving unit, and the drive unit 23 may move the pressing unit 22 so that the substrate A and the pressing unit 22 move closer together or further apart. In other words, the controller 80 only needs to be configured to control the movement of at least one of the holding unit 13 and the pressing unit 22. Furthermore, when the drive unit 23 functions as a moving unit, the drive unit 23 may be equipped with an elastic member such as a spring, and the elastic force of the elastic member may be used to move the pressing unit 22, thereby separating the substrate A and the pressing unit 22.

[0081] <Control processing of a component mounting device according to an embodiment> Next, the specific processing procedure in the component mounting device 100 will be explained using Figure 8. Figure 8 is a flowchart showing the processing procedure performed by the component mounting device 100.

[0082] As shown in Figure 8, the component mounting device 100 temporarily inserts the terminal B into the hole A1 of the substrate A (step S10). Next, the component mounting device 100 lowers the pressing unit 22 to the preparation position (step S11).

[0083] Next, the component mounting device 100 controls the lifting unit 40 to raise the holding unit 13 to the reference position (step S12). Then, the component mounting device 100 measures the load acting from the substrate A onto the pressing unit 22 when the holding unit 13 is in the reference position (step S13).

[0084] Next, the component mounting device 100 determines whether the measured load has remained below a specified value for a specified time or longer (step S14). If the component mounting device 100 determines that the load has remained below a specified value for a specified time or longer (step S14, Yes), it determines that the temporary insertion state is normal (step S15), that is, it determines that the positional relationship between the terminal B before press-fitting and the hole A1 in the substrate A is normal. Then, the component mounting device 100 performs a press-fitting process to press-fit the terminal B into the hole A1 (step S16).

[0085] On the other hand, if the component mounting device 100 determines that the state in which the load is below a specified value has continued for a specified value period of time or longer (step S14, No), more specifically, if it determines that the load has exceeded a specified value, it determines that the insertion state is abnormal (step S17), that is, it determines that the positional relationship between the terminal B before press-fitting and the hole A1 of the substrate A is abnormal. Then, the component mounting device 100 performs a separation process to separate the pressing part 22 and the substrate A (step S18).

[0086] As described above, the component mounting apparatus 100 according to the embodiment comprises a holding part 13, a support part 14, a pressing part 22, and a controller 80. The holding part 13 holds a substrate A having a hole A1 into which a terminal B can be inserted. The support part 14 supports the terminal B at a position corresponding to the hole A1 of the substrate A held by the holding part 13. The pressing part 22 is positioned opposite the substrate A held by the holding part 13 and is configured to press the substrate A so that the terminal B can be inserted into the hole A1. The controller 80 controls the movement of at least one of the holding part 13 and the pressing part 22 so that the substrate A and the pressing part 22 move closer together or further apart. The controller 80 brings the substrate A and the pressing part 22 closer together until the holding part 13 holding the substrate A is at a preset reference position relative to the pressing part 22, and measures the load that the substrate A acts on the pressing part 22 when the holding part 13 holding the substrate A is at the reference position. Furthermore, the controller 80 determines that the positional relationship between terminal B, supported by the support part 14, and hole A1 in substrate A is normal if the measured load is below a preset value. This makes it possible to determine whether the positional relationship between terminal B and hole A1 in substrate A is normal while suppressing cost increases.

[0087] In the above embodiment, an air cylinder was used as the lifting section 40, but the invention is not limited to this, and other types of devices may be used, such as a device that controls the on / off state of an electromagnet to raise and lower the holding section 13.

[0088] Further effects and modifications can be readily derived by those skilled in the art. Therefore, broader aspects of the present invention are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and their equivalents. [Explanation of Symbols]

[0089] 13 Holding part 14 Support part 22 Pressing part 40 Lifting section 80 Controllers 100 component mounting equipment A substrate A1 hole B terminal

Claims

1. A holding part for holding a substrate having a hole, A support portion that supports the terminal inserted into the aforementioned hole, A pressing unit that presses the substrate with the terminal temporarily inserted into the hole to insert the terminal into the hole, Controller and A component mounting device having, The aforementioned controller, If the temporary insertion is successful, the substrate and the pressing portion are in a non-contact state, and if the temporary insertion is abnormal, at least one of the holding portion and the pressing portion is moved to a reference position where the substrate and the pressing portion are in contact. Based on the measurement results of the load acting on the pressing portion by the temporarily inserted substrate, it is determined whether the temporary insertion is normal or abnormal. Component mounting equipment.

2. The aforementioned controller, If the temporary insertion is determined to be normal, the substrate and the pressing part are separated, and then the movement of at least one of the holding part and the pressing part is stopped. The substrate held in the holding portion is pressed using the pressing portion, and the terminal is inserted into the hole. The component mounting apparatus according to claim 1.

3. A pressure receiving portion that contacts the holding portion and receives the pressing force from the pressing portion when the substrate held in the holding portion is pressed by the pressing portion. The component mounting apparatus according to claim 2, comprising:

4. The aforementioned controller, If the measurement result is below a specified value corresponding to a non-contact state between the substrate and the pressing portion, the temporary insertion is determined to be normal. If the measurement result exceeds the specified value, it is determined that the temporary insertion is abnormal. The component mounting apparatus according to claim 1.

5. The aforementioned controller, If the aforementioned temporary insertion is determined to be abnormal, the substrate and the pressing portion are separated. The component mounting apparatus according to claim 4.

6. A moving part that includes an elastic member and uses the elastic force of the elastic member to move at least one of the holding part and the pressing part, thereby separating the substrate and the pressing part. The component mounting apparatus according to claim 5, comprising:

7. The aforementioned controller, When the pressing part is stopped, the load acting on the pressing part is measured. The component mounting apparatus according to claim 1.

8. The terminals and holes are each a plurality. The component mounting apparatus according to claim 1.

9. The aforementioned terminal is This is a press-fit terminal that elastically deforms upon press-fitting into the aforementioned hole, and contacts the hole due to the restoring force of the elastic deformation. The component mounting apparatus according to claim 1.

10. A substrate having a hole is held using a holding part, The terminal inserted into the aforementioned hole is supported by the support portion, With the terminal temporarily inserted into the hole, the substrate is pressed to insert the terminal into the hole. If the temporary insertion is successful, the substrate and the pressing portion are in a non-contact state, and if the temporary insertion is abnormal, at least one of the holding portion and the pressing portion is moved to a reference position where the substrate and the pressing portion are in contact. Based on the measurement results of the load acting on the pressing portion by the temporarily inserted substrate, it is determined whether the temporary insertion is normal or abnormal. Component mounting method.

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