Adhesive films, dicing die bond films, and optoelectronic devices

Abstract

To provide an adhesive film capable of preventing erroneous detection in an optical semiconductor device.SOLUTION: An adhesive film is used while being bonded to an optical semiconductor element, and contains a thermoplastic resin, a thermosetting resin, a first inorganic filler and a second inorganic filler, wherein the first inorganic filler exhibits a white or pale color, the second inorganic filler exhibits a dark or black color, and a ratio CR(C1 / C2) of a content C1 of the first inorganic filler to a content C2 of the second inorganic filler satisfies a relation of 0<CR≤20.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This invention relates to adhesive films, dicing die bond films, and optoelectronic devices. More specifically, the present invention relates to an adhesive film used by adhering it to an optical semiconductor element, a dicing die bond film comprising the adhesive film, and an optical semiconductor device comprising the optical semiconductor element adhering to a substrate via the adhesive film. [Background technology]

[0002] Conventionally, an optoelectronic device is known that comprises a substrate having a mounting area for an optoelectronic semiconductor element (for example, an optical sensor chip), and an optoelectronic semiconductor element mounted on the mounting area of ​​the substrate (for example, Patent Document 1 below).

[0003] Patent Document 1 below discloses an optoelectronic device comprising multiple optical sensors, which are optical semiconductor elements, on a TFT layer, which is a substrate. Furthermore, Patent Document 1 below describes an optoelectronic device used as a smartphone, which, in addition to the substrate and multiple optical sensors described above, comprises a display panel and a light-emitting unit having a light-emitting surface, wherein the light-emitting surface is arranged to face one surface (inner surface) of the display panel. In the optical semiconductor device described in Patent Document 1 below, the substrate and the plurality of optical sensors are provided on the same side as the light-emitting unit (one surface side of the display panel). Each of the multiple optical sensors receives light (reflected light) that is irradiated from the light-emitting surface and reflected by the display panel.

[0004] Furthermore, Patent Document 1 below describes that in the optical semiconductor device, when a person's finger touches the other surface (outer surface) of the display panel, the fingerprint of the person's finger is detected by the intensity of the light received by each of the multiple optical sensors provided in the optical semiconductor device.

[0005] The detection of a human finger fingerprint by the optical semiconductor device will be described in more detail below. A human finger fingerprint is formed by unevenness on the skin surface of a fingertip. When a human finger is brought into contact with the other surface (outer surface) of the display panel, a portion corresponding to the convex portions of the skin surface (contact portion) and a portion corresponding to the concave portions of the skin surface (non-contact portion) are formed on the other surface (outer surface) of the display panel. In the contact portion, the influence of moisture (sweat) from the skin surface is easily exerted, so that when light from the light irradiation surface reaches the contact portion, diffuse reflection is likely to occur in the contact portion. Therefore, the intensity of light detected by the optical sensor decreases for the contact portion. On the other hand, in the non-contact portion, the influence of moisture (sweat) from the skin surface is less likely to be exerted, so that when light from the light irradiation surface reaches the non-contact portion, diffuse reflection is less likely to occur in the non-contact portion. Accordingly, the intensity of light detected by the optical sensor increases for the non-contact portion. In this way, a human finger fingerprint is detected based on the intensity of light received by the optical sensor.

Prior Art Document

Patent Document

[0006]

Patent Document 1

Summary of the Invention

Problem to be Solved by the Invention

[0007] Incidentally, in an optical semiconductor device such as that described in Patent Document 1 above, the optical semiconductor device may sometimes be mounted on the mounting region of the optical semiconductor element on the substrate via an adhesive film or the like.

[0008] When the optical semiconductor device comprises the optical semiconductor element mounted as described above, the optical semiconductor device may sometimes fail to accurately detect the fingerprint of a human finger touching the other surface (outer surface) of the display panel. For example, the optical sensor may misrecognize a convex portion of a human finger in contact with the other surface (outer surface) of the display panel as a concave portion of a human finger not in contact with the other surface (outer surface) of the display panel, that is, misrecognize a convex portion of a human finger as a portion with high light intensity, which may result in detection of a fingerprint of a human finger in an incorrect pattern.

[0009] However, it cannot be said that sufficient studies have been conducted to prevent erroneous detection in said optical semiconductor device.

[0010] Therefore, an object of the present invention is to provide an adhesive film capable of preventing erroneous detection in said optical semiconductor device. Another object of the present invention is to provide a dicing die-bonding film including the adhesive film as described above, and an optical semiconductor device including the optical semiconductor element bonded to a substrate via the adhesive film as described above. [Means for Solving the Problem]

[0011] As a result of intensive studies by the present inventors, an adhesive film used by being bonded to an optical semiconductor element is caused to contain a thermoplastic resin, a thermosetting resin, a first inorganic filler, and a second inorganic filler, wherein the first inorganic filler is a white to light-colored filler, the second inorganic filler is a dark to black filler, and the ratio C of the content C1 of the first inorganic filler to the content C2 of the second inorganic filler R (C1 / C2) satisfies 0 < C R ≦ 20, and it has been found that the adhesive film can prevent erroneous detection in an optical semiconductor device.

[0012] That is, the adhesive film according to the present invention is An adhesive film used by adhering it to an optical semiconductor device, It comprises a thermoplastic resin, a thermosetting resin, a first inorganic filler, and a second inorganic filler. The first inorganic filler is white or light in color, The second inorganic filler exhibits a dark color or black color. The ratio of the content C1 of the first inorganic filler to the content C2 of the second inorganic filler is C R (C1 / C2) is 0 <C R The relationship ≤ 20 is satisfied.

[0013] With this configuration, when the adhesive film is used in an optoelectronic device, false detections in the optoelectronic device can be prevented.

[0014] The dicing die bond film according to the present invention is A dicing tape having an adhesive layer laminated on a base layer, The dicing tape comprises an adhesive layer laminated on the adhesive layer, The adhesive layer is an adhesive film configured as described above.

[0015] The optical semiconductor device according to the present invention is A substrate having a mounting area for an optoelectronic semiconductor device, The substrate comprises an optical semiconductor element mounted in the mounting area for the optical semiconductor element, The optical semiconductor element is mounted on the substrate in the mounting area for the optical semiconductor element via an adhesive layer. The adhesive layer is an adhesive film configured as described above. [Effects of the Invention]

[0016] According to the present invention, an adhesive film can be provided that can prevent false detection in optoelectronic devices. Furthermore, according to the present invention, it is possible to provide a dicing die bond film comprising the adhesive film described above, and an optoelectronic device comprising the optoelectronic semiconductor element bonded to a substrate via the adhesive film described above. [Brief explanation of the drawing]

[0017] [Figure 1] A perspective view showing the structure of an adhesive film according to one embodiment of the present invention. [Figure 2] A cross-sectional view showing the structure of a dicing die bond film according to one embodiment of the present invention. [Figure 3] A schematic cross-sectional view illustrating the mounting process in the manufacturing method of an integrated circuit for optical semiconductors. [Figure 4] A schematic cross-sectional view illustrating the dicing process in the manufacturing method of optical semiconductor integrated circuits. [Figure 5] A schematic cross-sectional view illustrating the pickup process in the manufacturing method of an integrated circuit for optical semiconductors. [Figure 6] A schematic cross-sectional view illustrating how an optical semiconductor element is bonded to a substrate via an adhesive layer. [Figure 7] A cross-sectional view showing the configuration of an optoelectronic semiconductor device according to one embodiment of the present invention. [Modes for carrying out the invention]

[0018] The following describes one embodiment of the present invention.

[0019] [Adhesive film] As shown in Figure 1, the adhesive film 10 according to this embodiment is configured as a long, strip-shaped sheet. The adhesive film 10 according to this embodiment is an adhesive film used by adhering it to an optical semiconductor element. The adhesive film 10 according to this embodiment includes a thermoplastic resin, a thermosetting resin, a first inorganic filler, and a second inorganic filler. In the adhesive film 10 according to this embodiment, the first inorganic filler is white or light in color, and the second inorganic filler is dark or black in color. In the adhesive film 10 according to this embodiment, the ratio of the content C1 of the first inorganic filler to the content C2 of the second inorganic filler is C R (C1 / C2) is 0 <C R The relationship ≤ 20 is satisfied.

[0020] The aforementioned optical semiconductor element is a light-receiving sensor. The light receiving sensor receives light emitted from the light-emitting unit and converts it into an electrical signal. The light receiving sensor generates an electrical signal according to the intensity of the light it receives. For example, the light receiving sensor generates a large electrical signal when the intensity of the received light is high, and generates a small electrical signal when the intensity of the received light is low. Preferably, the light receiving sensor is a sensor that receives light emitted from the light-emitting unit and reflected by a reflective material such as a glass plate. In other words, it is preferable that the light-emitting part and the optical semiconductor element (light-receiving sensor) are combined to form a reflective type photoelectric sensor.

[0021] Examples of the thermoplastic resins include acrylic resins, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resins such as polyamide 6 and polyamide 6,6, phenoxy resin, acrylic polymers, saturated polyester resins such as PET and PBT, polyamide-imide resin, and fluororesin. The thermoplastic resin may be of one type only, or two or more types may be used in combination. It is preferable to use the acrylic resin as the thermoplastic resin. The aforementioned acrylic resin has the characteristics of having few ionic impurities and high heat resistance, thermoplastic resinWhen the aforementioned acrylic resin is used, it becomes easier to ensure the reliability of the connection of the adhesive film 10 to the substrate, such as the optical semiconductor element or the optical semiconductor wafer used to obtain the optical semiconductor element.

[0022] The acrylic resin preferably has organic functional groups within its molecular structure. Examples of the aforementioned organic functional groups include carboxyl groups, hydroxyl groups, epoxy groups, and amide groups. Having the aforementioned organic functional groups allows the curing reaction to proceed within the acrylic resin. Commercially available acrylic resins containing organic functional groups include "ND-27" and "ND-94" from Negami Kogyo Co., Ltd., and "Teisan Resin SG-N30" from Nagase Chemitex Co., Ltd. Furthermore, "Teisan Resin SG-N30" is commercially available in a state in which the acrylic resin is suspended and dissolved in an organic solvent to achieve a predetermined solid content concentration.

[0023] The adhesive film 10 preferably contains 20% by mass or more of the thermoplastic resin, more preferably 30% by mass or more, and even more preferably 40% by mass or more. Furthermore, the adhesive film 10 preferably contains 70% by mass or less of the thermoplastic resin, more preferably 60% by mass or less, and even more preferably 50% by mass or less.

[0024] Examples of the thermosetting resin include epoxy resins, phenolic resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, and thermosetting polyimide resins. Among these, phenolic resins are preferred.

[0025] Examples of phenolic resins include novolac-type phenolic resins, aralkyl-type phenolic resins, resol-type phenolic resins, and polyoxystyrenes such as polyparaoxystyrene. Furthermore, if an acrylic resin having organic functional groups is used as the thermoplastic resin, the phenolic resin may act as a curing agent for the acrylic resin having organic functional groups. Examples of commercially available phenolic resins include "MEHC-7851SS" manufactured by Meiwa Kasei Co., Ltd. Furthermore, "MEHC-7851SS" is an aralkyl-type phenolic resin.

[0026] The adhesive film 10 preferably contains 3% by mass or more of the thermosetting resin, more preferably 4% by mass or more, and even more preferably 5% by mass or more. Furthermore, the adhesive film 10 preferably contains 20% by mass or less of the thermosetting resin, more preferably 10% by mass or less, and even more preferably 8% by mass or less.

[0027] The adhesive film 10 may contain a thermosetting catalyst (curing accelerator) from the viewpoint of sufficiently advancing the curing reaction of the acrylic resin having the organic functional group or the various thermosetting resins, or increasing the curing reaction rate of the acrylic resin having the organic functional group or the various thermosetting resins. Examples of thermosetting catalysts include imidazole compounds, phosphorus compounds, amine compounds, and trihalogen borane compounds.

[0028] Examples of the imidazole-based compounds include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole.

[0029] Examples of the phosphorus-based compounds include triphenylphosphine (TPP), tri(p-tolyl)phosphine (TPTP), tetraphenylphosphonium tetraphenylborate (TPP-K), tetrabutylphosphonium laurate (TBPLA), and tetrabutylphosphonium hydrogen hexahydronaphthalate (TBS-3S).

[0030] The adhesive film 10 may contain the thermosetting catalyst in an amount of 0.1% by mass or more, or 0.5% by mass or more. Further, the adhesive film 10 may contain the thermosetting catalyst in an amount of 3% by mass or less, or 1% by mass or less.

[0031] As described above, as the first inorganic filler, one exhibiting a white to pale color is used. The pale color refers to L * a * b *L defined by the color system * This refers to colors whose value is above 60 and below 80, and white is L * a * b * L defined by the color system * This refers to colors whose values ​​are above 80 and below 100. L * a * b * L defined by the color system * The value can be measured using a spectrophotometer (product name "CM-26dG", manufactured by Konica Minolta). Note L * a * b * The color system is a color space recommended by the International Commission on Illumination (CIE) in 1976, CIE1976(L * a * b * This refers to a color space known as a color system. Also, L * a * b * The color system is defined in JIS Z 8729 of the Japanese Industrial Standards.

[0032] Examples of the first inorganic filler include fillers (silica fillers) containing aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, silica such as crystalline silica and amorphous silica. Among these, it is preferable to use the silica filler as the first inorganic filler. Examples of commercially available silica fillers include "SE-2050MCV" and "S38" manufactured by Admatex Co., Ltd.

[0033] The average particle size of the first inorganic filler is preferably 0.005 μm (5 nm) or more and 10 μm (10000 nm) or less, and more preferably 0.005 μm (5 nm) or more and 1 μm (1000 nm) or less. By having an average particle size of 0.005 μm or more, the wettability and adhesion to the substrate, such as the optical semiconductor element or the optical semiconductor wafer used to obtain the optical semiconductor element, can be further improved. Furthermore, by having an average particle size of 10 μm or less, the properties of the filler contained in the adhesive film 10 can be more fully exhibited, and the heat resistance of the adhesive film 10 can be further enhanced. The average particle size of the first inorganic filler can be determined, for example, using a photometric particle size analyzer (e.g., product name "LA-910," manufactured by Horiba, Ltd.).

[0034] The adhesive film 10 may contain 10% by mass or more of the first inorganic filler, or 20% by mass or more, or 30% by mass or more. Furthermore, the adhesive film 10 may contain 60% by mass or less of the first inorganic filler, 50% by mass or less, or 45% by mass or less. By changing the content of the first inorganic filler in the adhesive film 10, the elasticity and viscosity of the adhesive film 10 can be more easily adjusted. Furthermore, the physical properties of the adhesive film 10, such as conductivity, thermal conductivity, and elastic modulus (hardness), can be adjusted.

[0035] As described above, the second inorganic filler used is one that exhibits a dark color or black color. Dark color means L * a * b * L defined by the color system * This refers to colors whose value is above 35 and below 60, and black is L * a * b * L defined by the color system * This refers to colors whose values ​​are between 0 and 35. Examples of dark colors include navy blue and dark green. Note L * a* b * L defined by the color system * The value can be measured using a spectrophotometer (product name "CM-26dG", manufactured by Konica Minolta Corporation), as described above.

[0036] As the second inorganic filler, a black coloring agent and various dark coloring agents such as blue and red can be used. Examples of the aforementioned black coloring agent and dark coloring agent include dyes and pigments. In addition, dyes are substances that dissolve in organic solvents, while pigments are substances that do not dissolve in organic solvents. The second inorganic filler may be used alone or in combination of multiple types. As the aforementioned dyes, acid dyes, reactive dyes, direct dyes, disperse dyes, cationic dyes, and the like can be used. Various known pigments can be used as the aforementioned pigment. In the adhesive film 10 according to this embodiment, a black coloring agent can be used as the second inorganic filler. By using a black coloring agent as the second inorganic filler, the light absorption of the adhesive film 10 can be further enhanced. In other words, the reflection of light from the adhesive film 10 can be further suppressed.

[0037] Examples of the aforementioned black colorants include zirconium nitride filler, carbon black (furnace black, channel black, acetylene black, thermal black, lamp black, etc.), graphite, copper oxide, manganese dioxide, azo pigments (azomethine azo black, etc.), aniline black, perylene black, titanium black, cyanine black, activated carbon, ferrite (non-magnetic ferrite, magnetic ferrite, etc.), magnetite, chromium oxide, iron oxide, molybdenum disulfide, chromium complexes, complex oxide-based black pigments, and anthraquine-based organic black pigments.

[0038] In addition, as the aforementioned black coloring agent, black dyes such as CI Solvent Black 3, 7, 22, 27, 29, 34, 70, CI Direct Black 17, 19, 22, 32, 38, 51, 71, CI Acid Black 1, 2, 24, 26, 31, 48, 52, 107, 109, 110, 119, 154, CI Disperse Black 1, 3, 10, 24, and other black pigments such as CI Pigment Black 1 and 7 can also be used.

[0039] Among the various black colorants mentioned above, it is preferable to use the zirconium nitride filler and the carbon black.

[0040] Examples of the aforementioned dark-colored colorants include cyan-based colorants, magenta-based colorants, and yellow-based colorants.

[0041] Examples of the aforementioned cyan-based colorants include cyan dyes such as CI Solvent Blue 25, 36, 60, 70, 93, and 95; CI Acid Blue 6 and 45; CI Pigment Blue 1, 2, 3, 15, 15:1, 15:2, 15:3, 15:5, 15:6, 16, 17, 17:1, 18, 22, 25, 56, 60, 63, 65, and 66; CI Bud Blue 4 and 60; and cyan pigments such as CI Pigment Green.

[0042] In the aforementioned magenta-based colorants, examples of magenta-based dyes include CI Solvent Red 1, 3, 8, 23-25, 27, 30, 49, 52, 58, 63, 81-84, 100, 109, 111, 121, 122; CI Disperse Red 9; CI Solvent Violet 8, 13, 14, 21, 27; CI Disperse Violet 1; CI Basic Red 1, 2, 9, 12-15, 17, 18, 22-24, 27, 29, 32, 34-40; CI Basic Violet 1, 3, 7, 10, 14, 15, 21, 25, 26-28, and the like.

[0043] In the aforementioned magenta-based colorants, the magenta pigments include CI Pigment Red 1, 2-23, 30-32, 37-42, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 50-58, 60, 60:1, 63, 63:1, 63:2, 64, 64:1, 67, 68, 81, 83, 87-90, 92, 101, 104-106, 108, 112, 114, 122, 123, 139, 144, and 1. Examples include 46, 147, 149-151, 163, 166, 168, 170-172, 175-179, 184, 185, 187, 190, 193, 202, 206, 207, 209, 219, 222, 224, 238, 245; CI Pigment Violet 3, 9, 19, 23, 32, 33, 36, 38, 43, 50; CI Bat Red 1, 2, 10, 13, 15, 23, 29, 35, and others.

[0044] The aforementioned yellow colorants include yellow dyes such as CI Solvent Yellow 19, 44, 77, 79, 81, 82, 93, 98, 103, 104, 112, and 162; CI Pigment Orange 31 and 43; CI Pigment Yellow 1-7, 10-17, 23, 24, 34, 35, 37, 42, 53, 55, 65, 73-75, 81, and 83. Examples include yellow pigments such as 93-95, 97, 98, 100, 101, 104, 108-110, 113, 114, 116, 117, 120, 128, 129, 133, 138, 139, 147, 150, 151, 153-156, 167, 172, 173, 180, 185, 195; and CI Bat Yellow 1, 3, 20.

[0045] As explained above, although the zirconium nitride filler and the carbon black are particularly preferred as black colorants, they have a very strong tendency to aggregate when in powder form. In this embodiment, the adhesive film 10 is produced by dissolving and suspending the thermoplastic resin, the thermosetting resin, the first inorganic filler, and the second inorganic filler in an organic solvent such as methyl ethyl ketone (MEK), and then applying the adhesive composition to a release film (for example, a polyethylene terephthalate (PET) film having a silicone release surface) and drying it. Furthermore, when the zirconium nitride filler and the carbon black are included in the adhesive composition in powder form, it is difficult to sufficiently disperse the zirconium nitride filler and the carbon black in the adhesive composition. In adhesive films 10 made using such adhesive compositions, the zirconium nitride filler and carbon black are unevenly distributed, which is undesirable. Therefore, it is preferable that the zirconium nitride filler and the carbon black be dispersed in various dispersants, that is, included in the adhesive composition as a dispersion of the zirconium nitride filler and a dispersion of the carbon black.

[0046] Examples of the aforementioned dispersants include polymers such as vinyl polymers, acrylic polymers, and polyester polymers. Furthermore, examples of vinyl polymers include polyvinyl alcohol, polyvinyl acetal, polyvinyl butyral, polyvinyl formal, and polyvinyl alcohol-polyvinylpyrrolidone graft polymers.

[0047] A commercially available dispersion containing the aforementioned zirconium nitride filler is the product "9260 BLCK" manufactured by Tokushiki Co., Ltd. Furthermore, an example of a commercially available dispersion containing the aforementioned carbon black is "9511 BLACK," manufactured by Tokushiki Co., Ltd.

[0048] The average particle size of the second inorganic filler is preferably 0.01 μm (10 nm) or more and 1 μm (1000 nm) or less, and more preferably 0.01 μm (10 nm) or more and 0.5 μm (500 nm) or less. Since the average particle size of the second inorganic filler is 0.01 μm (10 nm) or more, the second inorganic filler is easily dispersed in the adhesive composition for obtaining the adhesive film 10, so that the adhesive composition can have an appropriate viscosity. This makes it easier to produce the adhesive film 10 using the adhesive composition. Furthermore, by having an average particle size of 1 μm (100 nm) or less of the second inorganic filler, the adhesive film 10 obtained using the adhesive composition can be made thinner. In particular, when the average particle size of the second inorganic filler is 0.5 μm (500 nm) or less, it contributes even more to making the adhesive film 10 thinner. The average particle size of the second inorganic filler can be measured in the same manner as the first inorganic filler.

[0049] The adhesive film 10 may contain 2.5% by mass or more of the second inorganic filler, or more preferably 3.5% by mass or more, and more preferably 4.5% by mass or more. Furthermore, the adhesive film 10 may contain 15% by mass or less of the second inorganic filler, 12% by mass or less, or 10% by mass or less.

[0050] The ratio of the content C1 of the first inorganic filler to the content C2 of the second inorganic filler is C R (C1 / C2) may be 1 or greater, 2 or greater, or 3 or greater. Also, the C R It may be 19 or younger, 17 or younger, or 15 or younger.

[0051] The adhesive film 10 may contain various additives. Examples of additives include flame retardants, coupling agents, and ion trapping agents.

[0052] The adhesive film 10 preferably contains a coupling agent among the various additives mentioned above. If the adhesive film 10 contains silica filler as the first inorganic filler, the coupling agent is preferably a silane coupling agent. Examples of commercially available silane coupling agents include "KBM-303" manufactured by Shin-Etsu Chemical Co., Ltd.

[0053] The adhesive film 10 may contain 1% by mass or more of the coupling agent, or 2% by mass or more. Furthermore, the adhesive film 10 may contain 8% by mass or less of the coupling agent, 6% by mass or less, or 4% by mass or less.

[0054] The adhesive film 10 preferably has a transmittance of 5% or less for light with a wavelength of 850 nm. The transmittance is more preferably 3% or less, and more preferably 1% or less. The lower limit of the aforementioned transmittance is usually 0%. By having the above configuration, the adhesive film 10 can absorb light more effectively, especially in the near-infrared region (wavelengths between 800 nm and 2500 nm). In other words, the adhesive film 10 can suppress light reflection in the near-infrared region more effectively.

[0055] The aforementioned transmittance can be determined by measuring the total light transmittance spectrum in the wavelength range of 300 nm to 1500 nm for an adhesive film 10 with a thickness of 20 μm using the integrating sphere unit of an ultraviolet-visible-near-infrared spectrophotometer.

[0056] The adhesive film 10 preferably has a light reflectance of 10% or less in the wavelength range of 360 nm to 740 nm. The reflectance is more preferably 7% or less, and more preferably 5% or less. The lower limit of the reflectance is typically 0.1%. By having the above configuration, the adhesive film 10 can sufficiently suppress light reflection, especially in the visible light region (wavelengths of 380 nm or more and less than 800 nm).

[0057] The reflectance can be measured by using a spectrophotometer (product name "CM-26dG", manufactured by Konica Minolta) to measure the reflectance of a 20 μm thick adhesive film 10 in the wavelength range of 360 nm to 740 nm. Furthermore, the reflectance can also be measured using an ultraviolet-visible-near-infrared spectrophotometer (product name "V-670", manufactured by JASCO Corporation). Furthermore, the measurement of the reflectance using the ultraviolet-visible-near-infrared spectrophotometer can be performed in the same way as when using the spectrophotometer, by measuring the reflectance of the 20 μm thick adhesive film 10 in the wavelength range of 360 nm to 740 nm.

[0058] The adhesive film 10 preferably has a storage modulus of 3.0 MPa or more and 8.0 MPa or less at 50°C before curing. By having the above configuration, the adhesive film 10 can be made to have an appropriate degree of rigidity. As a result, when an adhesive film 10 is used in an optoelectronic device in which an optoelectronic semiconductor element is electrically connected to a substrate by bonding wires as described later, it is possible to suppress the retention of voids in the molding resin (for example, epoxy resin) when the optoelectronic device is subjected to molding treatment using the molding resin.

[0059] The storage modulus can be measured using a dynamic viscoelasticity measuring device. Specifically, it can be measured according to the following procedure. (1) Multiple adhesive films 10 are stacked in the thickness direction to produce a laminate of adhesive films 10 with a thickness of 200 μm (hereinafter simply referred to as a film laminate). (2) After cutting a test piece with dimensions of 10 mm in width and 50 mm in length from the film laminate, the test piece is heated at 150°C for 1 hour to cure it. (3) The storage modulus at 50°C is measured for the thermoset specimens using the following measurement conditions. Measurement conditions Initial chuck distance: 22.5mm • Measurement mode: Tensile mode • Measurement temperature range: -10℃ to 150℃ • Frequency: 1Hz • Dynamic strain: 0.05% • Heating rate: 10℃ / min

[0060] It is preferable that the adhesive film 10 has a peel force of 1.0 N (1.0 N / 10 mm) or more from the silicon bare wafer before curing. Furthermore, the peeling force may be 2.0 N (2.0 N / 10 mm) or more, 3.0 N (3.0 N / 10 mm) or more, 4.0 N (4.0 N / 10 mm) or more, 5.0 N (5.0 N / 10 mm) or more, or 6.0 N (6.0 N / 10 mm) or more. The upper limit of the aforementioned peeling force is typically 10.0 N (10.0 N / 10 mm). By having the above configuration, sufficient adhesion to optical semiconductor wafers made of silicon can be ensured. Therefore, when the optical semiconductor wafer to which the adhesive film 10 is attached is cut to obtain multiple optical semiconductor elements with individual adhesive films 10 attached, it is possible to suppress the peeling of the adhesive film 10 from the optical semiconductor elements in the multiple optical semiconductor elements with individual adhesive films 10 attached.

[0061] The aforementioned peeling force can be measured according to the following procedure. (1) A backing tape is attached to one side of the adhesive film 10 to obtain an adhesive film 10 with backing tape. (2) Cut out a test piece from the adhesive film 10 with backing tape to dimensions of 10 mm wide x 150 mm long. (3) Place the silicon bare wafer on a hot plate and heat the silicon bare wafer so that the surface temperature of the exposed side reaches 50°C. (4) With the heated silicon bare wafer and the adhesive film 10 portion of the test piece superimposed on the exposed surface, a 2kg hand roller is passed back and forth once to bond the adhesive film 10 to the exposed surface of the silicon bare wafer. This obtains a laminate of the silicon bare wafer and the adhesive film 10 (hereinafter simply referred to as the laminate). (5) After leaving the laminate on the heated hot plate for 2 minutes, remove the laminate from the hot plate and leave it at room temperature (23±2℃) for 20 minutes. (6) Using a tensile testing machine, the test piece is peeled from the silicon bare wafer with respect to the laminate under conditions of a peel angle of 180° and a peel speed of 30 mm / min. The value of the force applied during peeling is then determined.

[0062] [Dicing die bond film] As shown in Figure 2, the dicing die bond film 200 according to this embodiment comprises a dicing tape 100 in which an adhesive layer 2 is laminated on a base layer 1, and an adhesive layer 3 laminated on the adhesive layer 2 of the dicing tape 100. In the dicing die bond film 200 according to this embodiment, the adhesive layer 3 is composed of the adhesive film 10 described above. In other words, the adhesive film 10 contains a thermoplastic resin, a thermosetting resin, a first inorganic filler, and a second inorganic filler. Furthermore, in the adhesive film 10, the first inorganic filler is white or light in color, and the second inorganic filler is dark or black in color. Furthermore, in the adhesive film 10, the ratio of the content C1 of the first inorganic filler to the content C2 of the second inorganic filler is C R (C1 / C2) is 0 <C R The relationship ≤ 20 is satisfied.

[0063] In the dicing die bond film 200 according to this embodiment, the adhesive layer 3 can be provided on the adhesive layer 2 by, for example, laminating an adhesive film 10 (hereinafter referred to as "adhesive film 10 with release film") which is laminated on a release film onto the adhesive layer 2, and then peeling off the release liner from the adhesive film 10 with release film.

[0064] In the dicing die bond film 200 according to this embodiment, an optical semiconductor wafer for forming an optical semiconductor element is attached to the adhesive layer 3. As described later, the dicing die bond film 200 according to this embodiment is used to obtain a plurality of optical semiconductor elements by cleaving an optical semiconductor wafer attached to the adhesive layer 3 and separating it into individual pieces. In the cleavage of an optical semiconductor wafer using the dicing die bond film 200, the adhesive layer 3 is also cleaved along with the optical semiconductor wafer. This makes it possible to obtain an optical semiconductor element with multiple adhesive layers 3 attached. The adhesive layer 3 is cut into pieces corresponding to the size of the multiple individualized optical semiconductor elements.

[0065] In the dicing die bond film 200 according to this embodiment, the adhesive layer 2 is tacky and holds the adhesive layer 3 by adhering it to it.

[0066] The adhesive layer 2 contains an adhesive. Examples of the aforementioned adhesives include those that can reduce the adhesive strength of the dicing die bond film 200 through external action during the usage process (hereinafter referred to as adhesive-reducing adhesives).

[0067] When using a tack-reducing adhesive as the adhesive, the dicing die bond film 200 can be used in a state where the adhesive layer 2 exhibits relatively high tackiness (hereinafter referred to as the high-tack state) and a state where it exhibits relatively low tackiness (hereinafter referred to as the low-tack state). For example, when the adhesive layer 3 laminated on the adhesive layer 2 of the dicing die bond film 200 is cleaved and separated into individual pieces together with the optical semiconductor wafer attached to the adhesive layer 3, the high-tack state is used to suppress the separation of the individual pieces of adhesive layer 3 from lifting or peeling off from the adhesive layer 2. In contrast, by cutting the adhesive layer 3 together with the optical semiconductor wafer to create individual pieces, as described above, after obtaining multiple optical semiconductor elements with adhesive layers 3 attached, a low-tack state is utilized to facilitate picking up the multiple optical semiconductor elements with adhesive layers 3 attached.

[0068] Examples of the tack-reducing adhesive include an adhesive that can be cured by irradiation with active energy rays during the use of the dicing die bond film 200 (hereinafter referred to as an active energy ray curing adhesive).

[0069] Examples of the active energy ray curing adhesive include adhesives that harden upon irradiation with electron beams, ultraviolet rays, alpha rays, beta rays, gamma rays, or X-rays. Among these, it is preferable to use an adhesive that hardens upon irradiation with ultraviolet rays (ultraviolet curing adhesive).

[0070] Examples of the active energy ray curing adhesive include additive-type active energy ray curing adhesives that contain a base polymer such as an acrylic resin and an active energy ray polymerizable monomer component or an active energy ray polymerizable oligomer component having a functional group such as an active energy ray polymerizable carbon-carbon double bond.

[0071] Examples of the acrylic resin include those containing monomer units derived from (meth)acrylic acid esters. Examples of (meth)acrylic acid esters include alkyl (meth)acrylates, cycloalkyl (meth)acrylates, and aryl (meth)acrylates.

[0072] The adhesive layer 2 may contain an external crosslinking agent. Any external crosslinking agent can be used as long as it can react with the acrylic resin, which is the base polymer, to form a crosslinked structure. Examples of such external crosslinking agents include polyisocyanate compounds, epoxy compounds, polyol compounds, aziridine compounds, and melamine-based crosslinking agents.

[0073] Examples of the active energy ray polymerizable monomer component include urethane (meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and 1,4-butanediol di(meth)acrylate. Examples of the active energy ray polymerizable oligomer component include various oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based oligomers. The content ratio of the active energy ray polymerizable monomer component and the active energy ray polymerizable oligomer component in the active energy ray curing adhesive is selected within a range that appropriately reduces the tackiness of the adhesive layer 2.

[0074] The active energy ray curing adhesive may contain a photopolymerization initiator. Examples of photopolymerization initiators include α-ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, camphorquinone, halogenated ketones, acylphosphinoxides, and acylphosphonates.

[0075] The adhesive layer 2 may contain other components besides those described above. Other components mentioned above include crosslinking accelerators, tackifiers, plasticizers, fillers, anti-aging agents, antioxidants, UV absorbers, light stabilizers, heat stabilizers, antistatic agents, surfactants, light release agents, and colorants such as pigments or dyes.

[0076] The thickness of the adhesive layer 2 is preferably 1 μm or more and 50 μm or less, more preferably 2 μm or more and 30 μm or less, and even more preferably 5 μm or more and 25 μm or less. The thickness of the adhesive layer 2 can be determined, for example, by measuring the thickness of five randomly selected points using a dial gauge (PEACOCK, model R-205) and taking the arithmetic mean of these thicknesses.

[0077] The adhesive layer 2 can be obtained by applying an adhesive composition containing the above-mentioned components to the surface of a substrate layer 1, such as a resin film, using an applicator, and then drying the applied adhesive composition.

[0078] The base layer 1 supports the adhesive layer 2. The base layer 1 is made using metal foil, fiber sheet, rubber sheet, or resin film, etc. The base layer 1 is preferably made using a resin film. The base layer 1 may have a single-layer structure or a laminated structure.

[0079] Examples of the aforementioned fiber sheet include those made of paper, woven fabric, or nonwoven fabric.

[0080] Examples of resin film materials include polyolefins such as polyethylene, polypropylene, and ethylene-propylene copolymer; ethylene copolymers such as ethylene-vinyl acetate copolymer, ionomer resin, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester random copolymer, and ethylene-(meth)acrylic acid ester alternating copolymer; polyesters such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate; polyacrylate; polyvinyl chloride (PVC); polyurethane; polycarbonate; polyphenylene sulfide; polyamides such as aliphatic polyamides and fully aromatic polyamides (aramids); polyether ether ketones; polyimides; polyetherimides; polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose or cellulose derivatives; silicone-containing polymers; and fluorine-containing polymers. These may be used individually or in combination of two or more types.

[0081] If the base layer 1 is made of a resin film, the base layer 1 may be obtained by non-stretch molding or by stretch molding, but it is preferable to obtain it by stretch molding.

[0082] The surface of the base material layer 1 on which the adhesive layer 2 is laminated (hereinafter simply referred to as the surface) may be surface-treated to improve adhesion with the adhesive layer 2. Surface treatments may include oxidation treatments using chemical or physical methods such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, and ionizing radiation treatment. Furthermore, surface treatment may be applied using coating agents such as anchor coating agents, primers, and adhesives.

[0083] The side of the base material layer 1 on which the adhesive layer 2 is not laminated (hereinafter also simply referred to as the back surface) may be coated with a release agent such as silicone resin or fluororesin to improve release properties.

[0084] The thickness of the base layer 1 is preferably 55 μm to 195 μm, more preferably 55 μm to 190 μm, even more preferably 55 μm to 170 μm, and optimally 60 μm to 160 μm. By setting the thickness of the base layer 1 within the above range, the dicing tape 100 can be manufactured efficiently. Furthermore, in the dicing die bond film 200, the adhesive layer 3 (adhesive film 10 in this embodiment) can be efficiently cut. The thickness of the base layer 1 can be determined, for example, by measuring the thickness of five randomly selected points using a dial gauge (PEACOCK, model R-205) and taking the arithmetic mean of these thicknesses.

[0085] The dicing die bond film 200 according to this embodiment is used, for example, as an auxiliary tool for manufacturing integrated circuits of optoelectronic semiconductors. Specific examples of the use of the dicing die bond film 200 are described below. The following describes an example using a dicing die bond film 200 in which the base layer 1 has a single-layer structure.

[0086] A method for manufacturing an integrated circuit of an optical semiconductor comprises a mounting step of attaching an optical semiconductor wafer to the adhesive layer 3 of a dicing die bond film 200 to fix the optical semiconductor wafer to the dicing die bond film 200; a dicing step of dicing the optical semiconductor wafer fixed to the dicing die bond film 200 to obtain a plurality of optical semiconductor elements (dies); a pick-up step of peeling the adhesive layer 3 and the adhesive layer 2 apart to remove the optical semiconductor elements (dies) with the adhesive layer 3 attached; and a die bonding step of bonding the optical semiconductor elements (dies) with the adhesive layer 3 attached to a substrate. In this embodiment, the dicing die bond film 200 is used as a manufacturing aid when carrying out each of these processes.

[0087] In the mounting process, as shown in Figure 3, the optical semiconductor wafer W is fixed to the dicing die bond film 200 placed on the table T of the dicing apparatus. More specifically, the dicing die bond film 200 is placed on the table T so that the substrate layer 1 is in contact with it, and then the optical semiconductor wafer W is attached to the adhesive layer 3 of the dicing die bond film 200.

[0088] In the dicing process, as shown in Figure 4, the optical semiconductor wafer W is diced into multiple optical semiconductor elements C having predetermined dimensions using the dicing blade DB of the dicing apparatus. More specifically, a dicing blade DB is used to dice a photo-semiconductor wafer W into a matrix so that multiple photo-semiconductor elements C having substantially the same dimensions in a plan view are obtained. Furthermore, after the dicing process but before the pickup process, a cleaning process may be performed to clean the optical semiconductor element C side using a cleaning solution such as water.

[0089] In the pickup process, as shown in Figure 5, the optical semiconductor element with the adhesive layer 3 attached is peeled off from the adhesive layer 2 of the dicing die bond film 200. Specifically, the pin member P is raised to push up the optical semiconductor element C to be picked up through the dicing die bond film 200. The pushed-up optical semiconductor element C is held by the suction jig J. Furthermore, if the adhesive layer 2 contains an active energy ray curing adhesive, it is preferable to irradiate it with active energy rays such as radiation. The intensity of the irradiated active energy rays is appropriately selected depending on the type of active energy ray curing adhesive. This makes it possible to relatively low the affinity between the adhesive layer 2 and the adhesive layer 3, making it easier to recover the optical semiconductor device C with the adhesive layer 3 attached. The picking process is carried out, for example, using a die bonder. In Figure 5, the component indicated by the symbol U is the push-up member of the die bonder, the component indicated by the symbol R is the dicing ring, and the component indicated by the symbol H is the holder of the die bonder.

[0090] In the die bonding process, as shown in Figure 6, the optoelectronic semiconductor element C with the adhesive layer 3 attached is bonded to the substrate A using a suction jig J. Specifically, the die bonding process is carried out by first applying the adhesive layer 3 to the adherend A, and then pressing the optical semiconductor element C from above with a suction jig J. Furthermore, when the optical semiconductor element C is attached to the adherend via the adhesive layer 3, the planar dimensions of the adhesive layer 3 are approximately the same as the planar dimensions of the optical semiconductor element C when viewed from above (see Figure 6). The die bonding process is also carried out, for example, using a die bonder.

[0091] [Optical Semiconductor Equipment] As shown in Figure 7, the optical semiconductor device 300 according to this embodiment comprises a substrate 301 having a mounting area R for an optical semiconductor device, and an optical semiconductor device C mounted in the mounting area R of the substrate 301. In the optoelectronic semiconductor device 300 according to this embodiment, the optoelectronic semiconductor element C is bonded to the mounting area R of the optoelectronic semiconductor element on the substrate 301 via an adhesive layer 3. In the optical semiconductor device 300 according to this embodiment, the adhesive layer 3 is composed of the adhesive film 10 described above. In other words, the adhesive layer 3 comprises a thermoplastic resin, a thermosetting resin, a first inorganic filler, and a second inorganic filler, wherein the first inorganic filler is white or light in color, and the second inorganic filler is dark or black in color, and the ratio of the content C1 of the first inorganic filler to the content C2 of the second inorganic filler is C R (C1 / C2) is 0 <C R The relationship ≤ 20 is satisfied. The substrate 301 is, for example, a circuit board on which circuits are formed on the surface of the substrate.

[0092] As shown in Figure 7, the optical semiconductor device 300 according to this embodiment includes a display panel 302 and a light-emitting unit 303 in addition to the substrate 301 and the optical semiconductor element C. In this embodiment, the optical semiconductor device 300 has a substrate 301 and a display panel 302 bonded together at both ends via a sealing material 304. In the optical semiconductor device 300 according to this embodiment, as shown in Figure 7, the display panel 302 is arranged such that one surface 302S faces the mounting area R of the optical semiconductor element on the substrate 301. In the optical semiconductor device 300 according to this embodiment, as shown in Figure 7, the light-emitting unit 303 has a light-emitting surface 303S, and the light-emitting surface 303S is arranged to face one surface 302S of the display panel 302. In the optoelectronic device 300 according to this embodiment, as shown in Figure 7, the optoelectronic semiconductor element C and the substrate 301 are electrically connected by bonding wires BW.

[0093] Examples of such optoelectronic devices 300 include smartphones.

[0094] Figure 7 shows an example in which the substrate 301 has mounting areas R for multiple optical semiconductor elements, and optical semiconductor elements C are mounted in each of the mounting areas R for optical semiconductor elements. In other words, Figure 7 shows an example in which the optical semiconductor device 300 comprises multiple optical semiconductor elements C. In the optical semiconductor device 300 according to this embodiment, the space S defined by the substrate 301 and the display panel 302 may be filled with a molding resin such as epoxy resin.

[0095] In the optical semiconductor device 300 according to this embodiment, the optical semiconductor element C mainly receives light (reflected light) that is irradiated from the light irradiation surface 303S of the light-emitting unit 303 and reflected by the display panel 302 as incident light IL1 (see Figure 7). The light emitted from the light-emitting surface 303S of the light-emitting unit 303 may be visible light (light belonging to the region with a wavelength of 380 nm or more and less than 800 nm) or near-infrared light (light belonging to the region with a wavelength of 800 nm or more and 2500 nm or less).

[0096] Here, the incident light IL1 that reaches one of the optical semiconductor elements C (the rightmost optical semiconductor element C in Figure 7) is partially reflected by the surface of the optical semiconductor element C, resulting in reflected light (hereinafter referred to as primary reflected light RL1), which then heads toward the display panel 302.

[0097] Next, the primary reflected light RL1 that reaches the display panel 302 is partially reflected by the surface of the display panel 302, resulting in further reflected light (hereinafter referred to as secondary reflected light RL2), which then heads toward the sealing material 304.

[0098] Next, the secondary reflected light RL2 that reaches the sealant 304 is partially reflected by the surface of the sealant 304, resulting in further reflected light (hereinafter referred to as tertiary reflected light RL3), which then heads toward the adhesive layer 3.

[0099] Next, the third reflected light RL3 that reaches the adhesive layer 3 is partially reflected by the side surface of the adhesive layer 3, resulting in further reflected light (hereinafter referred to as fourth reflected light RL4), which then heads toward the substrate 301.

[0100] Next, the fourth-order reflected light RL4 that reaches the substrate 301 is partially reflected by the surface of the substrate 301, resulting in further reflected light (hereinafter referred to as fifth-order reflected light RL5), which then returns to the sealing material 304.

[0101] Next, the fifth-order reflected light RL5 that reaches the sealing material 304 is partially reflected by the surface of the sealing material 304, resulting in further reflected light (hereinafter referred to as sixth-order reflected light RL6), which then returns to the display panel 302.

[0102] Next, the sixth-order reflected light RL6 that reaches the display panel 302 is partially reflected by the display panel 302, resulting in the generation of further reflected light (hereinafter referred to as the seventh-order reflected light RL7).

[0103] Then, this seventh reflected light RL7, as a separate incident light from the incident light IL1, reaches the other optical semiconductor element C adjacent to the first optical semiconductor element C (the second optical semiconductor element C from the right in Figure 7).

[0104] In this way, a portion of the incident light IL1 reflected from the surface of one optical semiconductor element C is incident on the other optical semiconductor element C after undergoing multiple reflections. Furthermore, if the intensity of an incident light other than the incident light IL1 (the seventh reflected light RL7 in Figure 7) is high, the light received by the other optical semiconductor element C will be excessively amplified.

[0105] However, the adhesive film 10 according to this embodiment contains a first inorganic filler that is white or light in color and a second inorganic filler that is dark or black in color, in such a way that their respective contents satisfy a predetermined relationship, and is therefore capable of absorbing light sufficiently. Therefore, when the adhesive film 10 according to this embodiment is used as the adhesive layer 3 in the optoelectronic device 300, the light that reaches the adhesive layer 3 (third reflected light RL3 in Figure 7) can be sufficiently absorbed. This prevents the light received by the other optical semiconductor element C from being excessively amplified. As a result, false detections in the optoelectronic device 300 can be prevented.

[0106] The matters disclosed herein include the following:

[0107] (1) An adhesive film used by adhering it to an optical semiconductor device, A thermoplastic resin, a thermosetting resin, a first inorganic filler, and a second inorganic filler are included. The first inorganic filler is white or light in color, The second inorganic filler exhibits a dark color or black color. The ratio of the content C1 of the first inorganic filler to the content C2 of the second inorganic filler is C R (C1 / C2) is 0 <C R The relationship ≤ 20 is satisfied. Adhesive film.

[0108] (2) The transmittance of light with a wavelength of 850 nm is 5% or less. The adhesive film described in (1) above.

[0109] (3) The reflectance of light in the wavelength range of 360 nm to 740 nm is 10% or less. The adhesive film described in (1) or (2) above.

[0110] (4) Before curing, the storage modulus at 50°C is between 3.0 MPa and 8.0 MPa. The adhesive film described in any of (1) to (3) above.

[0111] (5) Before curing, the peel force to the silicon bare wafer is 1.0 N or greater. The adhesive film described in any of (1) to (4) above.

[0112] (6) A dicing tape having an adhesive layer laminated on a base layer, The dicing tape comprises an adhesive layer laminated on the adhesive layer, The adhesive layer is composed of any of the adhesive films described in (1) to (5) above. Dicing die bond film.

[0113] (7) A substrate having a mounting area for an optoelectronic semiconductor device, The substrate comprises an optical semiconductor element mounted in the mounting area for the optical semiconductor element, The optical semiconductor element is bonded to the mounting area of ​​the optical semiconductor element on the substrate via an adhesive layer. The adhesive layer is composed of any of the adhesive films described in (1) to (5) above. Optical semiconductor equipment.

[0114] The adhesive film, dicing die bond film, and optoelectronic device according to the present invention are not limited to the embodiments described above. Furthermore, the adhesive film, dicing die bond film, and optoelectronic device according to the present invention are not limited to the effects described above. Furthermore, the adhesive film, dicing die bond film, and optoelectronic device according to the present invention can be modified in various ways without departing from the spirit of the present invention. [Examples]

[0115] Next, the present invention will be described in more detail with reference to examples. The following examples are provided to further illustrate the present invention and do not limit its scope.

[0116] [Example 1] <Preparation of adhesive film> A thermoplastic resin, acrylic resin A (manufactured by Negami Kogyo Co., Ltd., trade name "ND-27"; mass-average molecular weight: 1.3 million, glass transition temperature: 4°C), a thermosetting resin, phenolic resin A (manufactured by Meiwa Kasei Co., Ltd., trade name "MEHC-7851SS"), a first inorganic filler, silica filler A (manufactured by Admatex Co., Ltd., trade name "SE-2050MCV"), a coupling agent, silane coupling agent A (manufactured by Shin-Etsu Chemical Co., Ltd., trade name "KBM-303"), and a dispersion containing a second inorganic filler, zirconium nitride filler A (manufactured by Tokushiki Co., Ltd., trade name "9260 BLACK") were added to methyl ethyl ketone (MEK) in the proportions shown in Table 1 below to obtain the adhesive composition according to Example 1. In the adhesive composition according to Example 1, the solid content concentration was 20% by mass. Note that in Table 1 below, "dispersion containing zirconium nitride filler A" is simply referred to as "zirconium nitride filler A". Furthermore, silica filler A is a white inorganic filler, while zirconium nitride filler A is a black inorganic filler. Next, the adhesive composition according to Example 1 was applied to the silicone release surface of a polyethylene terephthalate (PET) film (manufactured by Mitsubishi Chemical Corporation, product name "Diafoil MRF") having a silicone release surface, using an applicator, so that the thickness after solvent removal was 20 μm. Then, the polyethylene terephthalate film coated with the adhesive composition according to Example 1 was dried at 130°C for 2 minutes to remove the solvent from the adhesive composition according to Example 1, thereby producing an adhesive film with a thickness of 20 μm (adhesive film according to Example 1) on the polyethylene terephthalate.

[0117] [Example 2] <Preparation of adhesive film> An adhesive film (20 μm thick) according to Example 2 was prepared in the same manner as in Example 1, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing zirconium nitride filler A (manufactured by Tokushiki, trade name "9260 BLACK"), was changed as shown in Table 1 below.

[0118] [Example 3] <Preparation of adhesive film> An adhesive film (20 μm thick) according to Example 3 was prepared in the same manner as in Example 1, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing zirconium nitride filler A (manufactured by Tokushiki, trade name "9260 BLACK"), was changed as shown in Table 1 below.

[0119] [Example 4] <Preparation of adhesive film> An adhesive film (20 μm thick) according to Example 4 was prepared in the same manner as in Example 1, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing zirconium nitride filler A (manufactured by Tokushiki, trade name "9260 BLACK"), was changed as shown in Table 1 below.

[0120] [Example 5] <Preparation of adhesive film> An adhesive film (20 μm thick) according to Example 5 was prepared in the same manner as in Example 1, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing zirconium nitride filler A (manufactured by Tokushiki, trade name "9260 BLACK"), was changed as shown in Table 1 below.

[0121] [Example 6] <Preparation of adhesive film> An adhesive film (20 μm thick) according to Example 6 was prepared in the same manner as in Example 1, except that a dispersion containing carbon black A (manufactured by Tokushiki Co., Ltd., product name "9511 BLACK") was used as the second inorganic filler. In Table 1 below, "dispersion containing carbon black A" is simply referred to as "carbon black A". Furthermore, carbon black A is an inorganic filler that exhibits a black color.

[0122] [Example 7] <Preparation of adhesive film> An adhesive film (20 μm thick) according to Example 7 was prepared in the same manner as in Example 6, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing carbon black A (manufactured by Tokushiki, trade name "9511 BLACK"), was changed as shown in Table 1 below.

[0123] [Example 8] <Preparation of adhesive film> An adhesive film (20 μm thick) according to Example 8 was prepared in the same manner as in Example 6, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing carbon black A (manufactured by Tokushiki, trade name "9511 BLACK"), was changed as shown in Table 1 below.

[0124] <Preparation of adhesive film> [Example 9] An adhesive film (20 μm thick) according to Example 9 was prepared in the same manner as in Example 6, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing carbon black A (manufactured by Tokushiki, trade name "9511 BLACK"), was changed as shown in Table 1 below.

[0125] <Preparation of adhesive film> [Example 10] An adhesive film (20 μm thick) according to Example 10 was prepared in the same manner as in Example 6, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing carbon black A (manufactured by Tokushiki, trade name "9511 BLACK"), was changed as shown in Table 1 below.

[0126] <Preparation of adhesive film> [Example 11] An adhesive film (20 μm thick) according to Example 11 was prepared in the same manner as in Example 6, except that acrylic resin B (manufactured by Negami Kogyo Co., Ltd., product name "ND-94"; mass-average molecular weight: 800,000 to 1,200,000; glass transition temperature: 16°C) was used as the thermoplastic resin, and the mixing ratio of silica filler A (manufactured by Admatex Co., Ltd., product name "SE-2050MCV") as the first inorganic filler and a dispersion containing carbon black A (manufactured by Tokushiki Co., Ltd., product name "9511 BLACK") as the second inorganic filler was changed as shown in Table 1 below.

[0127] <Preparation of adhesive film> [Example 12] An adhesive film (20 μm thick) according to Example 12 was prepared in the same manner as in Example 6, except that acrylic resin C (manufactured by Nagase ChemteX, trade name "SG-N30"; mass-average molecular weight 800,000, glass transition temperature: 15°C) was used as the thermoplastic resin, and the mixing ratio of silica filler A (manufactured by Admatex, trade name "SE-2050MCV") as the first inorganic filler and a dispersion containing carbon black A (manufactured by Tokushiki, trade name "9511 BLACK") as the second inorganic filler was changed as shown in Table 1 below.

[0128] <Preparation of adhesive film> [Example 13] An adhesive film (20 μm thick) according to Example 13 was prepared in the same manner as in Example 6, except that silica filler B (manufactured by Admatex, trade name "S38") was used as the first inorganic filler, and the mixing ratio of silica filler B, the first inorganic filler, and a dispersion containing carbon black A, the second inorganic filler (manufactured by Tokushiki, trade name "9511 BLACK") was changed as shown in Table 1 below. Silica filler B is a white inorganic filler.

[0129] [Comparative Example 1] <Preparation of adhesive film> An adhesive film (20 μm thick) according to Comparative Example 1 was prepared in the same manner as in Example 6, except that the second inorganic filler was not used and the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), was changed as shown in Table 1 below.

[0130] [Comparative Example 2] <Preparation of adhesive film> A bonding film (20 μm thick) according to Comparative Example 2 was prepared in the same manner as in Example 1, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing zirconium nitride A (manufactured by Tokushiki, trade name "9260 BLACK"), was changed as shown in Table 1 below.

[0131] [Comparative Example 3] <Preparation of adhesive film> A bonding film (20 μm thick) according to Comparative Example 3 was prepared in the same manner as in Example 1, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing zirconium nitride A (manufactured by Tokushiki, trade name "9260 BLACK"), was changed as shown in Table 1 below.

[0132] [Comparative Example 4] <Preparation of adhesive film> An adhesive film (20 μm thick) according to Comparative Example 4 was prepared in the same manner as in Example 6, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing carbon black A (manufactured by Tokushiki, trade name "9511 BLACK"), was changed as shown in Table 1 below.

[0133] [Comparative Example 5] <Preparation of adhesive film> An adhesive film (20 μm thick) according to Comparative Example 5 was prepared in the same manner as in Example 6, except that the mixing ratio of the first inorganic filler, silica filler A (manufactured by Admatex, trade name "SE-2050MCV"), and the second inorganic filler, a dispersion containing carbon black A (manufactured by Tokushiki, trade name "9511 BLACK"), was changed as shown in Table 1 below.

[0134] [Table 1]

[0135] Table 1 above shows the ratio of the amount of the first inorganic filler to the amount of the second inorganic filler for each example of adhesive film, i.e., the ratio of the content of the first inorganic filler C1 to the content of the second inorganic filler C2. R This shows (C1 / C2). Furthermore, Table 1 above also shows the mass percentage of the amount of the second inorganic filler relative to the total amount ("Second Inorganic Filler Content (%)" in Table 1).

[0136] (transmittance) The transmittance of light at a wavelength of 850 nm was measured for each example of the adhesive film according to the procedure described in the section on embodiments above. The results are shown in Table 2 below.

[0137] (reflectance) Following the procedure described in the section on embodiments above, the reflectance of light in the wavelength range of 360 nm to 740 nm was measured for the adhesive film according to each example. The results are shown in Table 2 below.

[0138] (Storage modulus) The storage modulus at 50°C was measured for each example of adhesive film according to the procedure described in the section on embodiments above. The results are shown in Table 2 below.

[0139] (Peeling force) The peeling force of the adhesive film for each example was measured against the silicon bare wafer according to the procedure described in the section on embodiments above. The results are shown in Table 2 below.

[0140] (Evaluation of optical properties) The optical properties of the adhesive films in each example were evaluated according to the following criteria. Excellent: The transmittance of light at a wavelength of 850 nm is 5% or less, and the reflectance of light in the wavelength range of 360 nm to 740 nm is 10% or less. Unacceptable: The transmittance of light at a wavelength of 850 nm is higher than 5%, or the reflectance of light in the wavelength range of 360 nm to 740 nm is higher than 10%. The results are shown in Table 2 below.

[0141] (Evaluation of wire bonding properties) For each example, the adhesive film was evaluated for its wire bonding properties according to the following criteria. Excellent: The storage modulus at 50°C is between 3.0 MPa and 8.0 MPa. Unacceptable: Storage modulus at 50°C is less than 3.0 MPa or higher than 8.0 MPa. The results are shown in Table 2 below.

[0142] (Evaluation of adhesive properties) The adhesive properties of the adhesive films in each example were evaluated according to the following criteria. Excellent: The peeling force on a silicon bare wafer is 1.0 N or higher. Unacceptable: The peeling force on the silicon bare wafer is less than 1.0 N. The results are shown in Table 2 below.

[0143] [Table 2]

[0144] Table 2 shows that the adhesive films in each example received an "excellent" rating for their optical properties, while the adhesive films in each comparative example received a "poor" rating for their optical properties. Here, although the adhesive films according to each embodiment contain a white silica filler as the first inorganic filler and a black zirconium nitride filler or carbon black as the second inorganic filler, it is expected that similar results can be obtained with adhesive films containing a white first inorganic filler and a dark second inorganic filler, adhesive films containing a light first inorganic filler and a black second inorganic filler, and adhesive films containing a light first inorganic filler and a dark second inorganic filler. In other words, even in adhesive films containing a white or light-colored first inorganic filler and a dark or black second inorganic filler, the optical properties are expected to be rated as "excellent." [Explanation of Symbols]

[0145] 1 Base material layer 2. Adhesive layer 3 Adhesive layer 10 Adhesive film 100 dicing tapes 200 Dicing Die Bond Film 300 Optoelectronic devices C Optoelectronic semiconductor device H Holder J Suction jig T Table U-shaped thrusting member W Optoelectronic semiconductor wafer DB Dicing Blade

Claims

1. An adhesive film used by adhering it to an optical semiconductor device, It comprises a thermoplastic resin, a thermosetting resin, a first inorganic filler, and a second inorganic filler. The first inorganic filler is white or light in color, The second inorganic filler exhibits a dark color or black color. The C2 content of the second inorganic filler is 3% by mass or more. Content C of the second inorganic filler ２ Content C of the first inorganic filler １ ratio C Ｒ (C １ / C ２ ) is 0 < C Ｒ The relationship ≤ 20 is satisfied. Adhesive film.

2. The transmittance of light with a wavelength of 850 nm is 5% or less. The adhesive film according to claim 1.

3. The reflectance of light in the wavelength range of 360 nm to 740 nm is 10% or less. The adhesive film according to claim 1 or 2.

4. Before curing, the storage modulus at 50°C is 3.0 MPa or more and 8.0 MPa or less. The adhesive film according to claim 1 or 2.

5. Before curing, the peel force to the silicon bare wafer is 1.0 N or greater. The adhesive film according to claim 1 or 2.

6. A dicing tape having an adhesive layer laminated on a base layer, The dicing tape comprises an adhesive layer laminated on the adhesive layer, The adhesive layer is composed of the adhesive film described in claim 1 or 2. Dicing die bond film.

7. A substrate having a mounting area for an optoelectronic semiconductor device, The substrate comprises an optical semiconductor element mounted in the mounting area for the optical semiconductor element, The optical semiconductor element is bonded to the mounting area of ​​the optical semiconductor element on the substrate via an adhesive layer. The adhesive layer is composed of the adhesive film described in claim 1 or 2. Optical semiconductor equipment.

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