Liquid discharge head and liquid discharge device

Abstract

To reduce deterioration of a discharge characteristic resulting from an adhesive.SOLUTION: A liquid discharge head comprises: a pressure chamber substrate having a pressure chamber storing a liquid; a driver element giving a pressure fluctuation to the liquid in the pressure chamber; a communication substrate having a supply communication channel communicating with the pressure chamber, and a nozzle communication channel communicating with the pressure chamber at a position different from the supply communication channel and communicating with a liquid-discharging nozzle; and a connection substrate having a feed opening arranged between the pressure chamber substrate and communication substrate and located between the pressure chamber and supply communication channel, and a drain hole located between the pressure chamber and nozzle communication channel. The channel cross sectional area of the feed opening is smaller than the channel cross sectional area of the supply communication channel, and the connection substrate is configured by a photosensitive resist film.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection apparatus. [Background Art]

[0002] A liquid ejection apparatus represented by an inkjet printer generally includes a liquid ejection head that ejects liquid such as ink. For example, Patent Document 1 describes a head having a configuration in which a pressure chamber plate, a communication port plate, a supply port plate, and a reservoir plate are stacked and bonded in this order. Here, the pressure plate defines a pressure chamber. A third communication port and a supply-side communication port are formed in the communication port plate. A supply port and a second communication port are formed in the supply port plate. A reservoir and a first communication port are formed in the reservoir plate. The third communication port communicates with the pressure chamber, and forms a series with the first communication port and the second communication port, functioning as a nozzle communication port that communicates with a nozzle. The supply-side communication port communicates with the pressure chamber, and functions together with the supply port as an ink supply port that supplies ink from the reservoir to the pressure chamber. [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2008-149617 [Summary of the Invention] [Problem to be Solved by the Invention]

[0004] In the head described in Patent Document 1, since the respective plates are joined with an adhesive, the adhesive may intrude into the flow path, causing ejection failure. Here, since the opening area of the supply port is extremely small, there is a high possibility that the supply port is blocked by the adhesive. [Means for Solving the Problem]

[0005] To solve the above problems, a liquid discharge head according to a preferred embodiment of the present disclosure comprises: a pressure chamber substrate having a pressure chamber for containing liquid; a drive element for inducing pressure fluctuations in the liquid in the pressure chamber; a supply communication channel communicating with the pressure chamber; a nozzle communication channel communicating with the pressure chamber at a position different from the supply communication channel and communicating with a nozzle for discharging liquid; and a connecting substrate disposed between the pressure chamber substrate and the communication substrate, having a supply port located between the pressure chamber and the supply communication channel, and an outlet located between the pressure chamber and the nozzle communication channel, wherein the cross-sectional area of ​​the supply port is smaller than the cross-sectional area of ​​the supply communication channel, and the connecting substrate is made of a photosensitive resist film.

[0006] A liquid dispensing device according to a preferred embodiment of the present disclosure comprises a liquid dispensing head as described above and a liquid container for storing the liquid supplied to the liquid dispensing head. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic diagram showing an example of the configuration of a liquid dispensing device according to the first embodiment. [Figure 2] This is an exploded perspective view of the liquid dispensing head according to the first embodiment. [Figure 3] This is a cross-sectional view of the head tip of the liquid dispensing head according to the first embodiment. [Figure 4] Figure 2 is a partially enlarged cross-sectional view of the head tip. [Figure 5] This is a plan view of the interconnecting circuit board. [Figure 6] This is a partially enlarged cross-sectional view of the head tip of the liquid discharge head according to the second embodiment. [Figure 7] This is a partially enlarged cross-sectional view of the head tip of the liquid dispensing head according to the third embodiment. [Figure 8] This is a partially enlarged cross-sectional view of the head tip of the liquid dispensing head according to the fourth embodiment. [Modes for carrying out the invention]

[0008] Preferred embodiments of the present disclosure will be described below with reference to the attached drawings. Note that the dimensions and scale of parts in the drawings may differ from actual dimensions as appropriate, and some parts are shown schematically for ease of understanding. Furthermore, the scope of the present disclosure is not limited to these embodiments unless otherwise stated in the following description.

[0009] For convenience, the following explanation will use the X, Y, and Z axes, which intersect with each other, as appropriate. The direction along the X axis is the X1 direction, and the direction opposite to the X1 direction is the X2 direction. Similarly, the opposite directions along the Y axis are the Y1 and Y2 directions. Also, the opposite directions along the Z axis are the Z1 and Z2 directions.

[0010] Here, typically, the Z-axis is the vertical axis, and the Z2 direction corresponds to the downward direction in the vertical. However, the Z-axis does not have to be the vertical axis; it may be inclined relative to the vertical axis. Also, the X, Y, and Z axes are typically orthogonal to each other, but are not limited to this; for example, they may intersect at an angle within the range of 80° to 100°. In the following, viewing along the Z-axis may be referred to as a "planar view."

[0011] 1. First Embodiment 1-1.Liquid discharge device Figure 1 is a schematic diagram showing an example configuration of a liquid ejection device 100 according to the first embodiment. The liquid ejection device 100 is an inkjet printing device that ejects ink, which is an example of a liquid, as droplets onto a medium M. The liquid ejection device 100 of this embodiment is a so-called line-type printing device in which a plurality of nozzles that eject ink are distributed over the entire width of the medium M. The medium M is typically printing paper. However, the medium M is not limited to printing paper and may be any material to be printed on, for example, a resin film or a cloth.

[0012] As shown in Figure 1, the liquid dispensing device 100 includes a liquid container 110, a control unit 120, a transport mechanism 130, a liquid dispensing module 140, and a circulation mechanism 160. Here, the liquid dispensing module 140 includes a plurality of liquid dispensing heads 150.

[0013] The liquid container 110 is a container for storing ink. Specific examples of the liquid container 110 include a cartridge that can be attached to or detached from the liquid dispensing device 100, a bag-shaped ink pack made of a flexible film, and an ink tank that can be refilled with ink. The type of ink stored in the liquid container 110 is arbitrary.

[0014] The liquid container 110 of this embodiment, although not shown, includes a first liquid container and a second liquid container. The first liquid container stores a first ink. The second liquid container stores a second ink of a different type from the first ink. For example, the first ink and the second ink are inks of different colors. However, the first ink and the second ink may be the same type of ink.

[0015] The control unit 120 controls the operation of each element of the liquid dispensing device 100. The control unit 120 includes, for example, one or more processing circuits such as a CPU (Central Processing Unit) or FPGA (Field Programmable Gate Array), and one or more storage circuits such as semiconductor memory. Various programs and various data are stored in the storage circuits. The processing circuits realize various controls by executing the programs and using the data as appropriate.

[0016] The conveying mechanism 130 conveys the medium M in the direction DM under the control of the control unit 120. The direction DM in the present embodiment is the Y2 direction. In the example shown in FIG. 1, the conveying mechanism 130 includes a conveying roller elongated along the X-axis, and a motor that rotates the conveying roller. Note that the configuration of the conveying mechanism 130 is not limited to that using conveying rollers, and for example, a configuration using a drum or an endless belt that conveys the medium M in a state of being adsorbed to the outer peripheral surface by electrostatic force or the like may be adopted.

[0017] The liquid ejection module 140 ejects ink supplied from the liquid container 110 via the circulation mechanism 160 onto the medium M in the Z2 direction from each of a plurality of nozzles under the control of the control unit 120. The liquid ejection module 140 is a line head having a plurality of liquid ejection heads 150 arranged such that the plurality of nozzles are distributed over the entire range of the medium M in the X-axis direction. The plurality of liquid ejection heads 150 are collectively supported by a support body (not shown), and their mutual positional relationships are fixed.

[0018] Ink ejection from the plurality of liquid ejection heads 150 is performed in parallel with the conveyance of the medium M by the conveyance mechanism 130, whereby an image formed of ink is formed on the surface of the medium M. Note that the plurality of nozzles of one liquid ejection head 150 may be arranged so as to be distributed over the entire range of the medium M in the direction along the X-axis. In this case, for example, the liquid ejection module 140 is configured by said one liquid ejection head 150. Furthermore, the number of liquid ejection heads 150 included in the liquid ejection module 140 is not limited to the example shown in FIG. 1, and may be any number.

[0019] A liquid container 110 is connected to the liquid ejection module 140 via a circulation mechanism 160. The circulation mechanism 160 is a mechanism that supplies ink to the liquid ejection module 140 under the control of the control unit 120, and collects ink discharged from the liquid ejection module 140 for resupply to the liquid ejection module 140. The circulation mechanism 160 includes, for example, a sub-tank for storing ink, a supply flow path for supplying ink from the sub-tank to the liquid ejection module 140, a recovery flow path for recovering ink from the liquid ejection module to the sub-tank, and a pump for appropriately flowing ink. These are provided for each of the aforementioned first liquid container and second liquid container. The operation of the circulation mechanism 160 described above can suppress an increase in ink viscosity and reduce retention of air bubbles in the ink.

[0020] 1-2. Liquid Ejection Head FIG. 2 is an exploded perspective view of the liquid ejection head 150 according to the first embodiment. As shown in FIG. 2, the liquid ejection head 150 includes a flow path structure 151, a wiring substrate 152, a holder 153, a plurality of head chips 10, a fixing plate 154, and a base 155. These are arranged in the order of the base 155, the flow path structure 151, the wiring substrate 152, the holder 153, the plurality of head chips 10, and the fixing plate 154 in the Z2 direction. Hereinafter, each part of the liquid ejection head 150 will be sequentially described. Among the constituent elements shown in FIG. 2, the constituent elements other than the head chip 10 are not particularly limited, are provided as necessary, and may be appropriately omitted or modified.

[0021] The flow path structure 151 is a structure in which a flow path for flowing ink between the circulation mechanism 160 and the plurality of head chips 10 is provided internally. As shown in FIG. 2, the flow path structure 151 is provided with a connection pipe 151a, a connection pipe 151b, a connection pipe 151c, a connection pipe 151d, and a hole 151e.

[0022] Here, although not shown in Figure 2, the flow channel structure 151 is provided with flow channels such as a first supply flow channel, a second supply flow channel, a first discharge flow channel, and a second discharge flow channel. The first supply flow channel is a flow channel for supplying the first ink to multiple head chips 10. The second supply flow channel is a flow channel for supplying the second ink to multiple head chips 10. Filters are installed in the middle of each of these supply flow channels to capture foreign matter, etc. The first discharge flow channel is a flow channel for discharging the first ink from the multiple head chips 10. The second discharge flow channel is a flow channel for discharging the second ink from the multiple head chips 10.

[0023] Each of the connecting pipes 151a, 151b, 151c, and 151d is a tubular body that protrudes in the Z1 direction and is connected to the circulation mechanism 160. Here, connecting pipe 151a is a tubular body that constitutes a flow path for supplying the first ink to the first supply flow path. Connecting pipe 151b is a tubular body that constitutes a flow path for supplying the second ink to the second supply flow path. On the other hand, connecting pipe 151c is a tubular body that constitutes a flow path for discharging the first ink from the first discharge flow path. Connecting pipe 151d is a tubular body that constitutes a flow path for discharging the second ink from the second discharge flow path. Hole 151e is a hole for inserting the connector 152c, which will be described later.

[0024] The wiring board 152 is a mounting component for electrically connecting multiple head chips 10 and the assembly board 155b described later. The wiring board 152 is, for example, a rigid wiring board. The wiring board 152 is positioned between the flow channel structure 151 and the holder 153, and a connector 152c is installed on the surface of the wiring board 152 facing the flow channel structure 151. The connector 152c is a connecting component that is connected to the assembly board 155b described later. The wiring board 152 is also provided with multiple holes 152a and multiple openings 152b. Each hole 152a is a hole that allows connection between the flow channel structure 151 and the holder 153. Each opening 152b is a hole through which the wiring board 18 of the head chip 10 described later passes. The wiring board 18 is connected to the surface of the wiring board 152 facing the Z1 direction.

[0025] The holder 153 is a structure that houses and supports multiple head chips 10. The holder 153 is made of, for example, a resin material or a metal material. The holder 153 is plate-shaped and extends in a direction perpendicular to the Z axis. The holder 153 is also provided with connecting tubes 153a, 153b, multiple connecting tubes 153c, multiple connecting tubes 153d, and multiple wiring holes 153e. Although not shown, the surface of the holder 153 facing the Z2 direction is provided with multiple recesses for housing multiple head chips 10.

[0026] In the example shown in Figure 2, the holder 153 holds six head tips 10. These head tips 10 are arranged in the X2 direction so as to be alternately offset along the Y axis. Here, these head tips 10 have overlapping portions when viewed in the X1 or X2 direction. Also, the arrangement direction DN of the multiple nozzles N of these head tips 10, which will be described later, are parallel to each other. Furthermore, each of these head tips 10 is positioned such that its arrangement direction DN is inclined with respect to the direction DM, which is the transport direction of the medium M.

[0027] Here, although not shown in Figure 2, the holder 153 is provided with a first distribution and supply channel, a second distribution and supply channel, multiple first individual discharge channels, multiple second individual discharge channels, and multiple bypass channels. The first distribution and supply channel is a channel with branches for supplying first ink to multiple head chips 10. The second distribution and supply channel is a channel with branches for supplying second ink to multiple head chips 10. The first individual discharge channel is provided for each head chip 10 that discharges first ink, and is a channel for introducing the first ink discharged from the head chip 10 into the first discharge channel of the channel structure 151. The second individual discharge channel is provided for each head chip 10 that discharges second ink, and is a channel for introducing the second ink discharged from the head chip 10 into the second discharge channel of the channel structure 151. Two bypass channels are provided for each head chip 10, and are bypass channels that connect the common liquid chamber R1 and the common liquid chamber R2, which will be described later. Note that bypass channels may be provided as needed and may be omitted.

[0028] In the example shown in Figure 2, of the six head chips 10, the first ink is supplied to three head chips 10, and the second ink is supplied to the remaining three head chips 10.

[0029] The connecting tubes 153a, 153b, 153c, and 153d are tubular projections that protrude in the Z1 direction. More specifically, the connecting tube 153a is a tube that constitutes a channel for supplying the first ink to the first distribution supply channel and communicates with the first supply channel of the channel structure 151. The connecting tube 153b is a tube that constitutes a channel for supplying the second ink to the second distribution supply channel and communicates with the second supply channel of the channel structure 151. On the other hand, the connecting tube 153c is a tube that constitutes a channel for discharging the first ink from the first individual discharge channel and communicates with the first discharge channel of the channel structure 151. The connecting tube 153d is a tube that constitutes a channel for discharging the second ink from the second individual discharge channel and communicates with the second discharge channel of the channel structure 151. The wiring hole 153e is a hole through which the wiring board 18 of the head chip 10 passes.

[0030] Each head tip 10 ejects ink. Although not shown in Figure 2, each head tip 10 has a plurality of nozzles for ejecting first ink and a plurality of nozzles for ejecting second ink. These nozzles are provided on the nozzle surface FN, which is the surface of each head tip 10 facing the Z2 direction. Details of the head tip 10 will be explained later based on Figure 3.

[0031] The fixing plate 154 is a plate member for fixing multiple head tips 10 to the holder 153. Specifically, the fixing plate 154 is positioned between the holder 153 and the multiple head tips 10, and is fixed to the holder 153 with adhesive. The fixing plate 154 is made of, for example, a metal material. The fixing plate 154 is provided with multiple openings 154a for exposing the nozzles of the multiple head tips 10. In the example shown in Figure 2, the multiple openings 154a are provided individually for each head tip 10. Note that the openings 154a may be shared by two or more head tips 10.

[0032] The base 155 is a component for holding the flow channel structure 151, the wiring board 152, the holder 153, the multiple head chips 10, and the fixing plate 154 together. The base 155 has a main body 155a, a composite board 155b, and a cover 155c.

[0033] The main body 155a is fixed to the holder 153 by screws or the like, thereby holding the flow channel structure 151 and the wiring board 152 which are placed between the base 155 and the holder 153. The main body 155a is made of, for example, a resin material. The main body 155a has a plate-shaped portion that faces the plate-shaped portion of the aforementioned flow channel structure 151, and this plate-shaped portion is provided with a plurality of holes 155d into which the aforementioned connecting pipes 151a, 151b, 151c, and 151d are inserted. The main body 155a also has a portion that extends in the Z2 direction from the plate-shaped portion, and a flange 155e for fixing to a support (not shown) is provided at the tip of this portion.

[0034] The assembly board 155b is a mounting component for electrically connecting the control unit 120 and the aforementioned wiring board 152. The assembly board 155b is, for example, a rigid wiring board. The cover 155c is a plate-shaped member that protects the assembly board 155b and fixes the assembly board 155b to the main body 155a. The cover 155c is made of, for example, a resin material and is fixed to the main body 155a by screws or the like.

[0035] 1-3. Head Tip Figure 3 is a cross-sectional view of the head tip 10 of the liquid discharge head 150 according to the first embodiment. For convenience, the following explanation will use the V axis and W axis as appropriate, in addition to the X axis, Y axis and Z axis. The direction along the V axis is the V1 direction, and the direction opposite to the V1 direction is the V2 direction. Similarly, the directions along the W axis that are opposite to each other are the W1 direction and the W2 direction. Figure 5 shows a cross-section of the head tip 10 cut by a plane including the W axis and the Z axis.

[0036] Here, the V-axis is an axis that aligns with the arrangement direction of the multiple nozzles N described later, and is the axis obtained by rotating the Y-axis around the Z-axis by a predetermined angle. The W-axis is the axis obtained by rotating the X-axis around the Z-axis by the same predetermined angle. Therefore, the V-axis and W-axis are typically orthogonal to each other, but are not limited to this, and may intersect at an angle within the range of 80° to 100°. Furthermore, the predetermined angle, i.e., the angle between the V-axis and the Y-axis, or the angle between the W-axis and the X-axis, is, for example, within the range of 40° to 60°.

[0037] First, let's describe the flow channels provided in the head tip 10. As shown in Figure 3, the head tip 10 is provided with multiple nozzles N, multiple individual flow channels P, a common liquid chamber R1, and a common liquid chamber R2. Here, the common liquid chamber R1 and the common liquid chamber R2 are connected via the multiple individual flow channels P.

[0038] The print head 10 has a surface facing the medium M, and a plurality of nozzles N are provided on this surface. The plurality of nozzles N are arranged along the V axis. Each of the plurality of nozzles N ejects ink in the Z2 direction. Here, the plurality of nozzles N are arranged at equal intervals with a predetermined pitch.

[0039] Each of the multiple nozzles N is connected to an individual channel P. Each of the multiple individual channel P extends along the W axis and connects to a different nozzle N. The multiple individual channel P are arranged along the V axis.

[0040] Each individual flow path P has a pressure chamber Ca, a pressure chamber Cb, a nozzle flow path Nf, a supply communication flow path Ra1, a supply communication flow path Ra2, a nozzle communication flow path Na1, a nozzle communication flow path Na2, supply ports Sa1 and Sa2, and discharge ports Ve1 and Ve2.

[0041] Each pressure chamber Ca and pressure chamber Cb in each individual flow path P extends along the W axis and is a space where ink ejected from a nozzle N communicating with the individual flow path P is stored. In the example shown in Figure 3, multiple pressure chambers Ca are arranged along the V axis. Similarly, multiple pressure chambers Cb are arranged along the V axis. In each individual flow path P, the positions of pressure chambers Ca and pressure chamber Cb along the V axis are the same in the example shown in Figure 4, but they may be different. In the following, when pressure chambers Ca and pressure chamber Cb are not specifically distinguished, they may each be referred to as "pressure chamber C".

[0042] In each individual channel P, the pressure chamber Ca communicates with the nozzle channel Nf via the outlet Ve1 and the nozzle communication channel Na1. On the other hand, the pressure chamber Cb communicates with the nozzle channel Nf via the outlet Ve2 and the nozzle communication channel Na2. In the following, when the nozzle communication channels Na1 and Na2 are not specifically distinguished, they may each be referred to as "nozzle communication channel Na". Similarly, when the outlets Ve1 and Ve2 are not specifically distinguished, they may each be referred to as "outlet Ve".

[0043] In each individual flow path P, the nozzle flow path Nf is a space extending along the W axis. Multiple nozzle flow paths Nf are arranged along the V axis with intervals between them. Each nozzle flow path Nf is provided with a nozzle N. In each nozzle flow path Nf, ink is ejected from the nozzle N as the pressure in the aforementioned pressure chambers Ca and Cb changes.

[0044] Multiple individual flow paths P are connected to common liquid chambers R1 and R2. Here, pressure chamber Ca is connected to common liquid chamber R1 via supply port Sa1 and supply communication flow path Ra1. Pressure chamber Cb is connected to common liquid chamber R2 via supply port Sa2 and supply communication flow path Ra2. In the following, when supply communication flow paths Ra1 and Ra2 are not specifically distinguished, they may each be referred to as "supply communication flow path Ra". Similarly, when supply ports Sa1 and Sa2 are not specifically distinguished, they may each be referred to as "supply port Sa".

[0045] Common liquid chambers R1 and R2 are spaces that extend along the V-axis over the entire area where multiple nozzles N are distributed. Here, common liquid chamber R1 is connected to the end of each individual flow path P in the W2 direction. Common liquid chamber R1 stores ink for supply to each individual flow path P. On the other hand, common liquid chamber R2 is connected to the end of each individual flow path P in the W1 direction. Common liquid chamber R2 stores ink that is discharged from each individual flow path P without being used for ejection.

[0046] A supply port IO1 is provided in the common liquid chamber R1. The supply port IO1 is a conduit for introducing ink from the first distribution supply channel or the second distribution supply channel of the holder 153 into the common liquid chamber R1. On the other hand, a discharge port IO2 is provided in the common liquid chamber R2. The discharge port IO2 is a conduit for discharging ink from the common liquid chamber R2 to the first individual discharge channel or the second individual discharge channel of the holder 153. In the following, when the common liquid chambers R1 and R2 are not specifically distinguished, they may each be referred to as "common liquid chamber R".

[0047] As shown in Figure 3, the head chip 10 having the above-described flow path includes a nozzle substrate 11, a communication substrate 12, a pressure chamber substrate 13, a diaphragm 14, a plurality of drive elements 15, a case 16, a protective plate 17, a wiring substrate 18, a drive circuit 19, a vibration absorber 20, and a connecting substrate 21.

[0048] The nozzle substrate 11, communication substrate 12, connecting substrate 21, pressure chamber substrate 13, and diaphragm 14 are stacked in this order in the Z1 direction. Each of these components extends along the V axis and is manufactured, for example, by processing a silicon single crystal substrate using semiconductor processing technology. These components are joined to each other by adhesive or the like. A layer or substrate, such as an adhesive layer, may be appropriately interposed between two adjacent components.

[0049] The nozzle substrate 11 is provided with a plurality of nozzles N. Each of the plurality of nozzles N is a hole that penetrates the nozzle substrate 11.

[0050] The communication substrate 12 is provided with a portion of each of the common liquid chambers R1 and R2, a nozzle channel Nf, a nozzle communication channel Na1 and Na2, a supply communication channel Ra1 and Ra2. The portions of each of the common liquid chambers R1 and R2 are spaces that penetrate the communication substrate 12. A vibration absorber 20 is installed on the surface of the communication substrate 12 facing the Z2 direction to close the opening created by these spaces.

[0051] The vibration absorber 20 is a layered member made of an elastic material. The vibration absorber 20 forms part of the wall surface of both the common liquid chamber R1 and the common liquid chamber R2, and absorbs pressure fluctuations in the common liquid chamber R1 and the common liquid chamber R2.

[0052] The nozzle channel Nf is a space within a groove provided on the surface of the communication substrate 12 facing the Z2 direction. Here, the nozzle substrate 11 constitutes a part of the wall surface of the nozzle channel Nf.

[0053] Each of the nozzle communication channels Na1 and Na2 is a space that penetrates the communication substrate 12.

[0054] Each of the supply communication channels Ra1 and Ra2 is a space that penetrates the communication substrate 12. Here, one end of the supply communication channel Ra1 opens to the surface of the communication substrate 12 facing in the Z1 direction. On the other hand, the other end of the supply communication channel Ra1 is the upstream end of the individual channel P in the direction of ink flow by the circulation mechanism 160, and opens to the wall surface of the common liquid chamber R1 in the communication substrate 12. In contrast, one end of the supply communication channel Ra2 opens to the surface of the communication substrate 12 facing in the Z1 direction. On the other hand, the other end of the supply communication channel Ra2 is the downstream end of the individual channel P in the direction of ink flow by the circulation mechanism 160, and opens to the wall surface of the common liquid chamber R2 in the communication substrate 12.

[0055] The pressure chamber substrate 13 is provided with multiple individual flow channels P, which form pressure chambers Ca and Cb. Each of the pressure chambers Ca and Cb penetrates the pressure chamber substrate 13 and forms the gap between the communication substrate 12 and the diaphragm 14.

[0056] Here, a connecting substrate 21 is interposed between the pressure chamber substrate 13 and the communication substrate 12. The connecting substrate 21 is provided with supply ports Sa1 and Sa2 and discharge ports Ve1 and Ve2 as holes that penetrate in the thickness direction. The connecting substrate 21 and related matters will be described in detail later with reference to Figure 4.

[0057] The diaphragm 14 is an elastically vibrating plate-shaped member. The diaphragm 14 is a laminate comprising, for example, a first layer made of silicon oxide (SiO2) and a second layer made of zirconium oxide (ZrO2). Here, other layers, such as metal oxides, may be interposed between the first and second layers. Part or all of the diaphragm 14 may be integrally formed from the same material as the pressure chamber substrate 13. For example, the diaphragm 14 and the pressure chamber substrate 13 can be integrally formed by selectively removing a portion in the thickness direction of the region corresponding to the pressure chamber C in a plate-shaped member of a predetermined thickness. Alternatively, the diaphragm 14 may be composed of layers of a single material.

[0058] Multiple drive elements 15 corresponding to different pressure chambers C are installed on the surface of the diaphragm 14 facing the Z1 direction. Each drive element 15 is a piezoelectric element, and is composed of, for example, a laminate of a first electrode and a second electrode facing each other and a piezoelectric layer placed between the two electrodes. Each drive element 15 causes the ink in the pressure chamber C to be ejected from the nozzle N by changing the pressure of the ink in the pressure chamber C. When a drive signal Com is supplied, the drive element 15 vibrates the diaphragm 14 as it deforms. As a result of this vibration, the pressure chamber C expands and contracts, causing the pressure of the ink in the pressure chamber C to change. Alternatively, the drive element 15 may be a heating element that changes the ink pressure by generating bubbles inside the pressure chamber C due to heat.

[0059] Case 16 is a case for storing ink. Case 16 is provided with spaces that constitute the remaining portion of each of the common liquid chamber R1 and common liquid chamber R2, excluding a portion provided on the communication substrate 12.

[0060] The protective plate 17 is a plate-shaped member installed on the surface of the diaphragm 14 facing the Z1 direction, protecting the multiple drive elements 15 and reinforcing the mechanical strength of the diaphragm 14. Here, a space for accommodating the multiple drive elements 15 is formed between the protective plate 17 and the diaphragm 14.

[0061] The wiring board 18 is mounted on the surface of the diaphragm 14 facing the Z1 direction and is a mounting component for electrically connecting the control unit 120 and the head chip 10. For example, a flexible wiring board 18 such as an FPC (Flexible Printed Circuit) or FFC (Flexible Flat Cable) is preferably used. The aforementioned drive circuit 19 is mounted on the wiring board 18.

[0062] In the head chip 10 with the above configuration, the operation of the aforementioned circulation mechanism 160 causes the ink to flow in the following order: common liquid chamber R1, supply communication channel Ra1, supply port Sa1, pressure chamber Ca, outlet Ve1, nozzle communication channel Na1, nozzle channel Nf, nozzle communication channel Na2, outlet Ve2, pressure chamber Cb, supply port Sa2, supply communication channel Ra2, and common liquid chamber R2.

[0063] Furthermore, the drive signal from the drive circuit 19 simultaneously drives the drive elements 15 corresponding to both pressure chamber Ca and pressure chamber Cb, thereby fluctuating the pressure in pressure chamber Ca and pressure chamber Cb, and ink is ejected from the nozzle N in accordance with this pressure fluctuation.

[0064] 1-4. Connection board Figure 4 is a partially enlarged cross-sectional view of the head chip 10 shown in Figure 2. Figure 5 is a plan view of the communication substrate 12. As shown in Figures 4 and 5, the connecting substrate 21 is interposed between the communication substrate 12 and the pressure chamber substrate 13. As described above, the connecting substrate 21 is provided with a supply port Sa and an outlet port Ve. The supply port Sa and the outlet port Ve are holes that penetrate the connecting substrate 21.

[0065] As shown in Figure 5, the supply port Sa overlaps with both the opening of the supply communication channel Ra and the pressure chamber C in a plan view. The pressure chamber C communicates with the supply communication channel Ra via the supply port Sa. On the other hand, the discharge port Ve overlaps with both the opening of the nozzle communication channel Na and the pressure chamber C in a plan view. The pressure chamber C communicates with the nozzle communication channel Na via the discharge port Ve.

[0066] The opening area of ​​the supply port Sa is smaller than the opening area of ​​the discharge port Ve. Therefore, the flow resistance of the supply port Sa is higher than that of the discharge port Ve, so the ink in the pressure chamber C flows more easily into the discharge port Ve than into the supply port Sa. As a result, the pressure fluctuation of the ink in the pressure chamber C caused by the drive of the drive element 15 allows the ink to be efficiently ejected from the nozzle N.

[0067] Here, from the viewpoint of efficiently ejecting ink from nozzle N, the width of the supply port Sa is preferably within the range of 0.1 to 0.5 times the width of the discharge port Ve. Specifically, the width of the supply port Sa is within the range of 5 μm to 50 μm, preferably within the range of 10 μm to 40 μm, but these dimensions may be adjusted depending on the viscosity of the ink, etc.

[0068] In the example shown in Figure 5, the plan view shape of the supply port Sa is circular, and the plan view shape of the discharge port Ve is rectangular. Here, the plan view shapes of the openings of the nozzle communication channel Na and the supply communication channel Ra are rectangular. Therefore, the plan view shapes of the opening of the supply communication channel Ra and the supply port Sa are different from each other. On the other hand, the plan view shapes of the opening of the nozzle communication channel Na and the discharge port Ve are identical or approximate to each other. Note that these plan view shapes are not limited to the example shown in Figure 5 and are arbitrary. For example, when processing the communication substrate 12 by anisotropic etching, the plan view shapes of the openings of the nozzle communication channel Na and the supply communication channel Ra are parallelograms.

[0069] Furthermore, while the opening area of ​​the discharge port Ve is approximately the same as the opening area of ​​the nozzle communication channel Na, the opening area of ​​the supply port Sa is smaller than the opening area of ​​the supply communication channel Ra. Therefore, compared to a configuration in which the opening area of ​​the supply communication channel Ra is approximately the same as the opening area of ​​the supply port Sa, the manufacturing process of the communication substrate 12 can be simplified. In other words, when forming a smaller opening area for the supply communication channel Ra, more precise pre-drilling is required, but this is no longer necessary, and low-cost manufacturing becomes possible.

[0070] Furthermore, the thickness t3 of the connecting substrate 21 is thinner than the thickness t1 of the communication substrate 12 and the thickness t2 of the pressure chamber substrate 13. Therefore, the supply port Sa and discharge port Ve can be provided on the connecting substrate 21 with high precision. As a result, variations in the discharge characteristics of the liquid discharge head 150 for each nozzle N can be reduced. Discharge characteristics refer to the volume and velocity of the droplets discharged from the nozzle N, the timing of the droplet discharge from the nozzle N, etc., when pressure fluctuations are applied to the ink in the pressure chamber C by driving the drive element 15. Here, from the viewpoint of improving the dimensional accuracy of the supply port Sa and discharge port Ve, the thickness t3 is preferably 10 μm or more and 50 μm or less.

[0071] The connecting substrate 21 is made of a photosensitive resist film. The photosensitive resist film is a film made of photoresist material and is generally also called a "dry film" or "photosensitive film". The photosensitive film used for the connecting substrate 21 may be either a positive type or a negative type, but the negative type is preferably used. Furthermore, the material of the photosensitive resist film used for the connecting substrate 21 is not particularly limited, but it is preferably made of an epoxy resin from the viewpoint of liquid resistance to ink or adhesive strength.

[0072] If the connecting substrate 21 is made of a photosensitive resist film, then regardless of the constituent materials of the communication substrate 12 and the pressure chamber substrate 13, the connecting substrate 21 can be bonded to both or one of the communication substrate 12 and the pressure chamber substrate 13 by the adhesive force of the photosensitive resist film without using a coating-type adhesive. Therefore, adhesive can be eliminated between the communication substrate 12 and the connecting substrate 21, and between the connecting substrate 21 and the pressure chamber substrate 13, preventing the problem of the supply port Sa, etc., being blocked by the adhesive.

[0073] To form the connecting substrate 21 using a photosensitive resist film, for example, the photosensitive resist film is bonded to one of the communication substrate 12 and the pressure chamber substrate 13 before exposure, then exposed and developed to form a supply port Sa and an outlet port Ve, and then the other of the communication substrate 12 and the pressure chamber substrate 13 is bonded to the photosensitive resist film, thereby obtaining a laminate in which the connecting substrate 21 and the pressure chamber substrate 13 are bonded to each other via the semi-cured connecting substrate 21. Then, by heat treatment of this laminate, the connecting substrate 21 is fully cured, and the communication substrate 12 and the pressure chamber substrate 13 are bonded to the connecting substrate 21, respectively.

[0074] Here, the pressure chamber substrate 13, which is joined to the Z1-facing surface of the connecting substrate 21, has a partition wall 13a that divides the pressure chamber C. The partition wall 13a surrounds the pressure chamber C in a plan view and is a portion of the pressure chamber substrate 13 that extends over the entire thickness direction of the pressure chamber substrate 13. The Z2-facing surface of the partition wall 13a is connected to the connecting substrate 21.

[0075] On the other hand, the connecting substrate 12, which is joined to the Z2-facing surface of the connecting substrate 21, is joined to the connecting substrate 21 over a wide area in the circumferential direction of the supply port Sa near the supply port Sa. Therefore, when joining the pressure chamber substrate 13 to the connecting substrate 21, the deformation of the connecting substrate 21 can be reduced by the load during joining. Consequently, the decrease in discharge characteristics due to such deformation can be reduced.

[0076] As described above, the liquid discharge head 150 comprises a pressure chamber substrate 13, a drive element 15, a communication substrate 12, and a connecting substrate 21. The pressure chamber substrate 13 has a pressure chamber C that contains ink, which is an example of a "liquid". The drive element 15 applies pressure fluctuations to the ink in the pressure chamber C. The communication substrate 12 has a supply communication channel Ra that communicates with the pressure chamber C, and a nozzle communication channel Na that communicates with the pressure chamber C at a position different from the supply communication channel Ra and also communicates with a nozzle N that discharges ink. The connecting substrate 21 is positioned between the pressure chamber substrate 13 and the communication substrate 12 in the direction along the Z axis, and has a supply port Sa located between the pressure chamber C and the supply communication channel Ra in the direction along the Z axis, and an outlet Ve located between the pressure chamber C and the nozzle communication channel Na in the direction along the Z axis.

[0077] Here, the cross-sectional area of ​​the supply port Sa is smaller than the cross-sectional area of ​​the supply communication channel Ra. The connecting substrate 21 is made of a photosensitive resist film.

[0078] In the liquid discharge head 150 described above, since the connecting substrate 21 is made of a photosensitive resist film, the pressure chamber substrate 13 and the communication substrate 12 can be joined to each other via the connecting substrate 21 without using a coating-type adhesive. Therefore, discharge failures caused by the coating-type adhesive blocking the supply port Sa can be prevented.

[0079] As mentioned above, the thickness t3 of the connecting substrate 21 is thinner than the thickness t2 of the pressure chamber substrate 13 or the thickness t1 of the communication substrate 12. A thinner connecting substrate 21 has the advantage of making it easier to reduce the opening area of ​​the supply port Sa. Furthermore, by reducing the opening area of ​​the supply port Sa, the pressure applied to the ink in the pressure chamber C is less likely to escape from the supply port Sa and is efficiently transmitted to the discharge port Ve.

[0080] Furthermore, as mentioned above, since the photosensitive resist film used for the connecting substrate 21 is made of epoxy resin, the supply port Sa and the discharge port Ve can be formed with high precision. In addition, strong adhesion of the connecting substrate 21 to the pressure chamber substrate 13 and the communication substrate 12 can be expected.

[0081] 2. Second Embodiment The following describes a second embodiment of this disclosure. For elements whose operation and function are the same as in the first embodiment in the embodiments described below, the reference numerals used in the description of the first embodiment will be reused, and detailed descriptions of each will be omitted as appropriate.

[0082] Figure 6 is a partially enlarged cross-sectional view of the head tip 10A of the liquid discharge head according to the second embodiment. The head tip 10A is configured the same as the head tip 10 of the first embodiment described above, except that it is equipped with a communication substrate 12A instead of the communication substrate 12. The communication substrate 12A is configured the same as the communication substrate 12, except that the shape of the supply communication channel Ra is different.

[0083] The communication substrate 12A has a tapered portion 12a on the inner wall surface of the supply communication channel Ra that slopes toward the supply port Sa. As a result, the cross-sectional area of ​​the supply communication channel Ra decreases toward the supply port Sa.

[0084] In the example shown in Figure 6, the tapered portion 12a is composed of a plane. Here, if the communication substrate 12A is composed of a silicon single crystal substrate, the plane can be formed using the silicon crystal plane. More specifically, after forming a pilot hole penetrating the silicon single crystal substrate in the depth direction of the supply communication channel Ra by laser or dry etching, anisotropic etching is performed to obtain a tapered portion 12a composed of a (111) plane. Note that the shape of the tapered portion 12a is not limited to the example shown in Figure 6, and may be, for example, stepped, concave, or convex. Furthermore, the method for forming the supply communication channel Ra is not limited to the method using anisotropic etching and is arbitrary.

[0085] The second embodiment described above also reduces the decrease in discharge characteristics due to deformation of the connecting substrate 21. In this embodiment, as mentioned above, the inner wall surface of the supply communication channel Ra has a tapered portion 12a that slopes toward the supply port Sa. Therefore, the accumulation of air bubbles near the supply port Sa can be reduced, and the decrease or fluctuation of discharge characteristics can be suppressed. In addition, the area of ​​the portion in which the connecting substrate 21 is arranged as a single layer can be reduced. As a result, even if the connecting substrate 21 is formed from a material with a small Young's modulus, it does not act as an unintended compliance with respect to the pressure generated in the pressure chamber C, thus avoiding a decrease in discharge characteristics and further improving the reliability of the head chip 10.

[0086] 3. Third Embodiment A third embodiment of this disclosure will be described below. For elements whose operation and function are the same as in the first embodiment in the embodiments described below, the reference numerals used in the description of the first embodiment will be reused, and detailed descriptions of each will be omitted as appropriate.

[0087] Figure 7 is a partially enlarged cross-sectional view of the head tip 10B of the liquid discharge head according to the third embodiment. The head tip 10B is configured the same as the head tip 10 of the first embodiment described above, except that it is equipped with a communication substrate 12B instead of the communication substrate 12. The communication substrate 12B is configured the same as the communication substrate 12, except that the shape of the supply communication channel Ra is different.

[0088] In the communication substrate 12B, the end of the supply communication channel Ra in the Z1 direction widens in the W1 direction toward the pressure chamber C, and near the end of the supply communication channel Ra in the W1 direction, the supply communication channel Ra and the pressure chamber C communicate with each other via the supply port Sa. Here, the inner wall surface of the supply communication channel Ra has a tapered portion 12b that slopes toward the supply port Sa.

[0089] The third embodiment described above also makes it possible to reduce the decrease in ejection characteristics due to deformation of the connecting substrate 21.

[0090] 4. Fourth Embodiment A fourth embodiment of this disclosure will now be described. For elements whose operation and function are the same as in the first embodiment in the embodiments described below, the reference numerals used in the description of the first embodiment will be reused, and detailed descriptions of each will be omitted as appropriate.

[0091] Figure 8 is a partially enlarged cross-sectional view of the head tip 10C of the liquid discharge head according to the fourth embodiment. The head tip 10C is configured the same as the head tip 10 of the first embodiment described above, except that it is equipped with a connecting substrate 21C instead of the connecting substrate 21. However, the supply communication channel Ra is positioned so as not to overlap with the pressure chamber C in a plan view. The connecting substrate 21C is configured the same as the connecting substrate 21, except that the opening area of ​​the supply port Sa is different.

[0092] In the connecting substrate 21C, the supply port Sa has a shape that extends from a position overlapping the supply communication channel Ra in a plan view to a position overlapping the pressure chamber C. As a result, the supply communication channel Ra and the pressure chamber C communicate with each other via the supply port Sa. More specifically, the supply communication channel Ra and the pressure chamber C communicate with each other through the gap formed between the communication substrate 12 and the pressure chamber substrate 13 by the supply port Sa. Furthermore, since the cross-sectional area of ​​the flow path due to the supply port Sa is determined by the thickness of the connecting substrate 21C, the flow resistance of the supply port Sa can be made higher than the flow resistance of the discharge port Ve.

[0093] The fourth embodiment described above also reduces the deterioration of discharge characteristics due to deformation of the connecting substrate 21C. In this embodiment, as described above, the supply communication channel Ra and the pressure chamber C communicate with each other through the gap formed between the communication substrate 12 and the pressure chamber substrate 13 by the supply port Sa, so that there is no portion of the connecting substrate 21C that exists as a single layer near the supply port Sa. For this reason, the deterioration of discharge characteristics due to the connecting substrate 21C is effectively prevented.

[0094] More specifically, the connecting substrate 21 has a first surface F1 and a second surface F2 facing in the opposite direction to the first surface F1. The region of the first surface F1 that is not joined to the pressure chamber substrate 13 and the region of the second surface F2 that is not joined to the communication substrate 12 do not overlap when viewed in the thickness direction of the pressure chamber substrate 13. The rigidity of the photosensitive resist film is generally lower than the rigidity of film materials made of other materials such as silicon or stainless steel. Therefore, by ensuring that the regions of the connecting substrate 21 that are not joined to either the communication substrate 12 or the pressure chamber substrate 13 do not overlap when viewed in the thickness direction of the pressure chamber substrate 13, the portion of the connecting substrate 21 that exists as a single layer is eliminated, and damage due to insufficient rigidity of the connecting substrate 21 can be prevented. As a result, the reliability of the liquid discharge head can be improved.

[0095] In this embodiment, the supply port Sa has a first portion PA1, a second portion PA2, and a third portion PA3. The first portion PA1 overlaps the pressure chamber C but does not overlap the supply communication channel Ra when viewed in the thickness direction of the pressure chamber substrate 13. The second portion PA2 overlaps the supply communication channel Ra but does not overlap the pressure chamber C when viewed in the thickness direction of the pressure chamber substrate 13. The third portion PA3 is located between the first portion PA1 and the second portion PA2 when viewed in the thickness direction of the pressure chamber substrate 13, and does not overlap either the pressure chamber C or the supply communication channel Ra. With the first portion PA1, second portion PA2, and third portion PA3 arranged in this way, the accumulation of bubbles near the supply port Sa can be reduced. In addition, the area of ​​the portion in which the connecting substrate 21 is arranged as a single layer can be reduced. As a result, the reliability of the liquid discharge head can be improved.

[0096] 5. Variations The forms exemplified above can be modified in various ways. Specific examples of modifications that can be applied to the aforementioned forms are given below. Two or more forms arbitrarily selected from the following examples can be merged as appropriate, provided they do not contradict each other.

[0097] 5-1. Variation 1 The aforementioned configuration exemplifies a setup in which ink is circulated both inside and outside the print head, but it is not limited to this configuration; for example, a configuration in which ink is circulated within the print head may also be used. Furthermore, the ink circulation configuration is adopted as needed and is not mandatory.

[0098] 5-2. Variation 2 In the aforementioned configuration, an example is given in which a first ink and a second ink of different types are used. However, the configuration is not limited to this example, and the number of ink types used in the liquid ejection head 150 may be one or three or more.

[0099] 5-3. Modification Example 3 The shape and other characteristics of each part of the ink flow path within the liquid ejection head 150 are not limited to the above-described configuration and may be appropriately changed, for example, depending on the arrangement of the head tip 10. Furthermore, the holders 153 of each part constituting the flow path and the flow path structure 151 may be integrated into a single unit.

[0100] 5-6. Variation 3 The liquid dispensing devices 100 exemplified in each of the above-described embodiments can be used in various devices such as facsimile machines or photocopiers, in addition to equipment dedicated to printing. However, the applications of the liquid dispensing devices of this disclosure are not limited to printing. For example, a liquid dispensing device that dispenses a colorant solution can be used as a manufacturing device for forming color filters for liquid crystal display devices. Also, a liquid dispensing device that dispenses a conductive material solution can be used as a manufacturing device for forming wiring or electrodes on a wiring board. [Explanation of Symbols]

[0101] 10...Head chip, 10A...Head chip, 10B...Head chip, 10C...Head chip, 11...Nozzle substrate, 12...Communication substrate, 12A...Communication substrate, 12B...Communication substrate, 12a...Tapered section, 12b...Tapered section, 13...Pressure chamber substrate, 13a...Partition wall, 14...Diaphragm, 15...Drive element, 16...Case, 17...Protective plate, 18...Wiring board, 19...Drive circuit, 20...Vibration absorber, 21...Connection substrate, 21C...Connection substrate, 100...Liquid Discharge device, 110…Liquid container, 120…Control unit, 130…Transport mechanism, 140…Liquid discharge module, 150…Liquid discharge head, 151…Flow path structure, 151a…Connecting pipe, 151b…Connecting pipe, 151c…Connecting pipe, 151d…Connecting pipe, 151e…Hole, 152…Wiring board, 152a…Hole, 152b…Opening, 152c…Connector, 153…Holder, 153a…Connecting pipe, 153b…Connecting pipe, 153c…Connecting pipe, 153d… Connecting pipe, 153e...wiring hole, 154...fixing plate, 154a...opening, 155...base, 155a...main body, 155b...assembly board, 155c...cover, 155d...hole, 155e...flange, 160...circulation mechanism, C...pressure chamber, Ca...pressure chamber, Cb...pressure chamber, Com...drive signal, DM...direction, DN...arrangement direction, F1...first surface, F2...second surface, FN...nozzle surface, IO1...supply port, IO2...discharge port, M...medium, N...nozzle, Na...nozzle linkage Passage channel, Na1... Nozzle communication channel, Na2... Nozzle communication channel, Nf... Nozzle channel, P... Individual channel, PA1... First part, PA2... Second part, PA3... Third part, R... Common liquid chamber, R1... Common liquid chamber, R2... Common liquid chamber, Ra... Supply communication channel, Ra1... Supply communication channel, Ra2... Supply communication channel, Sa... Supply port, Sa1... Supply port, Sa2... Supply port, Ve... Discharge port, Ve1... Discharge port, Ve2... Discharge port, t1... Thickness, t2... Thickness, t3... Thickness.

Claims

1. A pressure chamber substrate made of silicon, having a pressure chamber for containing a liquid, A driving element that imparts pressure fluctuations to the liquid in the pressure chamber, A substrate made of silicon, having a supply communication channel that communicates with the pressure chamber, and a nozzle communication channel that communicates with the pressure chamber at a position different from the supply communication channel and also communicates with a nozzle for discharging liquid, The connecting substrate is disposed between the pressure chamber substrate and the communication substrate and has a supply port located between the pressure chamber and the supply communication channel, and a discharge port located between the pressure chamber and the nozzle communication channel, The cross-sectional area of ​​the flow path at the supply port is smaller than the cross-sectional area of ​​the flow path of the supply communication flow path. The aforementioned connecting substrate is made of a photosensitive resist film. A liquid dispensing head characterized by the following features.

2. The thickness of the connecting substrate is thinner than the thickness of the pressure chamber substrate. The liquid dispensing head according to feature 1.

3. The thickness of the connecting substrate is thinner than the thickness of the communication substrate. A liquid dispensing head according to feature 1 or 2.

4. The connecting substrate has a first surface and a second surface facing in the opposite direction to the first surface. The region of the first surface that is not joined to the pressure chamber substrate and the region of the second surface that is not joined to the communication substrate do not overlap with each other when viewed in the thickness direction of the pressure chamber substrate. A liquid dispensing head according to any one of claims 1 to 3.

5. A pressure chamber substrate having a pressure chamber for containing a liquid, A driving element that imparts pressure fluctuations to the liquid in the pressure chamber, A communication substrate having a supply communication channel that communicates with the pressure chamber, and a nozzle communication channel that communicates with the pressure chamber at a position different from the supply communication channel and also communicates with a nozzle for discharging liquid, The connecting substrate is disposed between the pressure chamber substrate and the communication substrate and has a supply port located between the pressure chamber and the supply communication channel, and a discharge port located between the pressure chamber and the nozzle communication channel, The cross-sectional area of ​​the flow path at the supply port is smaller than the cross-sectional area of ​​the flow path of the supply communication flow path. The aforementioned connecting substrate is composed of a photosensitive resist film. The aforementioned supply port is Viewed in the thickness direction of the pressure chamber substrate, there is a first portion that does not overlap with the supply communication channel but overlaps with the pressure chamber, Viewed in the thickness direction of the pressure chamber substrate, the second portion does not overlap with the pressure chamber but overlaps with the supply communication channel, The pressure chamber substrate has a third portion located between the first portion and the second portion when viewed in the thickness direction, and which does not overlap with either the pressure chamber or the supply communication channel. A liquid dispensing head characterized by the following features.

6. The pressure chamber substrate and the connecting substrate are joined to each other without using a coating-type adhesive. A liquid dispensing head according to any one of claims 1 to 5.

7. The communication substrate and the connecting substrate are joined to each other without using a coating-type adhesive. A liquid dispensing head according to any one of claims 1 to 6.

8. The photosensitive resist film is composed of an epoxy resin. A liquid dispensing head according to any one of claims 1 to 7.

9. A liquid dispensing head according to any one of claims 1 to 8, The system includes a liquid container for storing the liquid supplied to the liquid discharge head, A liquid dispensing device characterized by the following features.

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