Semiconductor devices and power converters

Abstract

To provide a semiconductor device and a power conversion system that stably cool semiconductor packages.SOLUTION: A semiconductor device 1 has a semiconductor package 1, a cooler 20 that cools the semiconductor package 11, a sealing member 30 that is sandwiched between the semiconductor package 11 and the cooler 20 and has an opening that penetrates between the semiconductor package 11 and the cooler 20, and a heat-conductive member 41 made of a metal having flowability that is filled into the opening.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a semiconductor device and a power converter. [Background Art]

[0002] Patent Literature 1 discloses an electronic device including a semiconductor chip, a heat radiator disposed above the semiconductor chip, and a thermally conductive material provided between the heat radiator and the semiconductor chip. Patent Literature 1 also discloses that the electronic device includes a seal member surrounding the thermally conductive material. Further, Patent Literature 1 discloses that the thermally conductive material has conductivity and exhibits fluidity at least during operation of the semiconductor chip.

[0003] Patent Literature 2 discloses a cooling device that cools heat generated by a semiconductor chip. Patent Literature 2 also discloses that the semiconductor chip is joined to a holding frame, and a heat receiving member of the cooling device is detachably coupled to the holding frame via a seal member. Further, Patent Literature 2 discloses that a sealed space is formed by the heat transfer surface of the semiconductor chip, the holding frame, and the heat receiving member, liquid metal is accommodated in the sealed space, and heat generated by the semiconductor chip is transferred to the heat receiving member by the liquid metal. [Prior Art Literature] [Patent Literature]

[0004] [Patent Literature 1] International Publication No. 2020 / 162417 [Patent Literature 2] Japanese Unexamined Patent Publication No. 2010-212539 [Summary of Invention] [Problem to be Solved by Invention]

[0005] When cooling a semiconductor package containing a semiconductor chip, a fluid metal is sometimes used as a heat transfer material between the semiconductor package and the cooler to establish a thermal connection. However, when a fluid metal is used to establish a thermal connection between the semiconductor package and the cooler, the fluid metal may flow out from between the semiconductor package and the cooler, impairing the thermal connection. If the thermal connection between the semiconductor package and the cooler is impaired, the semiconductor chip contained in the semiconductor package may become overheated, potentially causing malfunctions.

[0006] This disclosure provides a semiconductor device and a power converter that stably cool semiconductor packages. [Means for solving the problem]

[0007] According to one aspect of this disclosure, 1 Semiconductor packages , second semiconductor package and third semiconductor package And, as stated above 1 Semiconductor packages , the second semiconductor package and the third semiconductor package respectively A cooler for cooling the above 1 Semiconductor packages , the second semiconductor package and the third semiconductor package respectively It is provided sandwiched between the cooler and the 1 Penetrating between the semiconductor package and the cooler 1 opening The second opening penetrates between the second semiconductor package and the cooler, and the third opening penetrates between the third semiconductor package and the cooler, A sealing member having the above 1 opening , the second opening and the third opening The present invention provides a semiconductor device comprising a heat conductive member made of a fluid metal that is filled into a space. [Effects of the Invention]

[0008] The semiconductor device and power converter of this disclosure enable stable cooling of semiconductor packages. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a perspective view of a semiconductor device according to the first embodiment. [Figure 2]FIG. 2 is an exploded perspective view of the semiconductor device according to the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view of the semiconductor device according to the first embodiment. [Figure 4] FIG. 4 is a top view of a semiconductor package included in the semiconductor device according to the first embodiment. [Figure 5] FIG. 5 is a bottom view of a semiconductor package included in the semiconductor device according to the first embodiment. [Figure 6] FIG. 6 is a top view showing the internal configuration of a semiconductor package included in the semiconductor device according to the first embodiment. [Figure 7] FIG. 7 is a bottom view showing the internal configuration of a semiconductor package included in the semiconductor device according to the first embodiment. [Figure 8] FIG. 8 is a diagram illustrating assembly of the semiconductor device according to the first embodiment. [Figure 9] FIG. 9 is a diagram illustrating assembly of the semiconductor device according to the second embodiment. [Figure 10] FIG. 10 is a diagram illustrating assembly of the semiconductor device according to the third embodiment. [Figure 11] FIG. 11 is an exploded perspective view of the semiconductor device according to the fourth embodiment. [Figure 12] FIG. 12 is an exploded perspective view of the semiconductor device according to the fifth embodiment. [Figure 13] FIG. 13 is an exploded perspective view of the semiconductor device according to the sixth embodiment. [Figure 14] FIG. 14 is an exploded perspective view of the semiconductor device according to the seventh embodiment. [Figure 15] FIG. 15 is a perspective view of a modified example of a semiconductor package included in the semiconductor device according to the seventh embodiment. MODE FOR CARRYING OUT THE INVENTION

[0010] Hereinafter, each embodiment of the present invention will be described with reference to the accompanying drawings. Regarding the description in the specification and drawings of each embodiment, components having substantially the same or corresponding functional configurations may be denoted by the same or corresponding reference numerals, and duplicate description thereof may be omitted. In addition, for ease of understanding, the scale of each part in the drawings may differ from the actual scale.

[0011] Directions such as parallel, right angle, orthogonal, horizontal, vertical, up-down, and left-right allow deviations that do not impair the effects of the embodiments. The shape of a corner is not limited to a right angle, and may be rounded in an arcuate shape. The terms parallel, right angle, orthogonal, horizontal, and vertical may include substantially parallel, substantially right angle, substantially orthogonal, substantially horizontal, and substantially vertical.

[0012] For example, substantially parallel means that even if two lines or two surfaces are not completely parallel to each other, they can be treated as parallel to each other within a manufacturing allowable range. For each of other terms including substantially right angle, substantially orthogonal, substantially horizontal, and substantially vertical, similarly to substantially parallel, it is intended that the mutual positional relationship between two lines or two surfaces falls within the manufacturing allowable range.

[0013] <<First Embodiment>> The semiconductor device 1 is a power conversion device that converts DC power into AC power. FIG. 1 is a perspective view of the semiconductor device 1 according to the first embodiment. FIG. 2 is an exploded perspective view of the semiconductor device 1 according to the first embodiment. FIG. 3 is a cross-sectional view of the semiconductor device 1 according to the first embodiment. In FIG. 2, illustration of the heat conductive member 41, the heat conductive member 42, and the heat conductive member 43 is omitted. In addition, in FIG. 3, the internal configurations of the semiconductor package 11, the semiconductor package 12, the semiconductor package 13, and the cooler 20 are omitted from illustration.

[0014] For ease of explanation, drawings may sometimes include a virtual three-dimensional coordinate system (XYZ Cartesian coordinate system) consisting of mutually orthogonal X, Y, and Z axes (XYZ axes). For example, for coordinate axes perpendicular to the plane of the drawing, a black circle inside a circle on the axis indicates that the area in front of the plane is the positive region of the coordinate axis. Conversely, an "X" inside a circle on the axis indicates that the area in front of the plane is the negative region of the coordinate axis.

[0015] However, this coordinate system is defined for illustrative purposes only and is not limited to the orientation of the semiconductor device, etc., according to this embodiment.

[0016] In this disclosure, unless otherwise specified, the X-axis and Y-axis directions are parallel to the cooling surface 20S of the cooler 20, and the Z-axis direction is perpendicular to the cooling surface 20S of the cooler 20. The Y-axis direction is the direction in which semiconductor packages 11, 12, and 13 are aligned.

[0017] The semiconductor device 1 includes semiconductor packages 11, 12, and 13 that convert DC power to AC power. When it is not necessary to distinguish between semiconductor packages 11, 12, and 13, they may be collectively referred to as semiconductor package 10. Furthermore, the semiconductor device 1 includes a cooler 20 for cooling semiconductor packages 11, 12, and 13.

[0018] Furthermore, the semiconductor device 1 includes a sealing member 30 that is sandwiched between each of the semiconductor packages 11, 12, and 13 and the cooler 20. The sealing member 30 has openings 30h1, 30h2, and 30h3. When the sealing member 30 is sandwiched between the semiconductor package 11 and the cooler 20, a closed space SP1 is formed in opening 30h1. Similarly, when the sealing member 30 is sandwiched between the semiconductor package 12 and the cooler 20, a closed space SP2 is formed in opening 30h2. When the sealing member 30 is sandwiched between the semiconductor package 13 and the cooler 20, a closed space SP3 is formed in opening 30h3.

[0019] Furthermore, the semiconductor device 1 includes a heat conductive member 41 in the enclosed space SP1. Similarly, the semiconductor device 1 includes a heat conductive member 42 in the enclosed space SP2 and a heat conductive member 43 in the enclosed space SP3.

[0020] Furthermore, the semiconductor device 1 includes semiconductor packages 11, 12, and 13, a cooler 20, and a fixing member 50 for fixing them.

[0021] [Semiconductor package 10] The semiconductor packages 11, 12, and 13 will be described in relation to semiconductor package 10. Figure 4 is a top view of the semiconductor package 10 provided in the semiconductor device 1 according to the first embodiment. Figure 5 is a bottom view of the semiconductor package 10 provided in the semiconductor device 1 according to the first embodiment. Figure 6 is a top view showing the internal configuration of the semiconductor package 10 provided in the semiconductor device 1 according to the first embodiment. Figure 7 is a bottom view showing the internal configuration of the semiconductor package 10 provided in the semiconductor device 1 according to the first embodiment. In Figures 6 and 7, case 10P is shown by a dotted line.

[0022] The semiconductor package 10 is a so-called 2-in-1 semiconductor package, for example, containing two semiconductor elements that constitute the upper and lower arms of one phase. Furthermore, the semiconductor package 10 is a so-called single-sided cooled semiconductor package. Inside the semiconductor package 10 are semiconductor elements such as power transistors, including IGBTs (Insulated Gate Bipolar Transistors) and FETs (Field-Effect Transistors).

[0023] The embedded semiconductor element may be a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) or an FWD (Free Wheeling Diode), etc. Furthermore, the mounted semiconductor element may be an RB-IGBT (Reverse Blocking-Insulated Gate Bipolar Transistor), which integrates the aforementioned IGBT or FWD onto a single chip. Additionally, the mounted semiconductor element may be an RC-IGBT (Reverse Conducting-Insulated Gate Bipolar Transistor), which also integrates the aforementioned IGBT or FWD onto a single chip.

[0024] The semiconductor package 10 comprises a case 10P made of a resin, such as epoxy resin, which has a substantially rectangular parallelepiped shape.

[0025] The semiconductor package 10 has current terminals 10a, 10b, and 10c on the side of the case 10P. Each of the current terminals 10a, 10b, and 10c is provided protruding from the side of the case 10P of the semiconductor package 10. The semiconductor package 10 has four control terminals 10d on the top surface 10S1 of the case 10P. Each of the four control terminals 10d is provided protruding from the top surface 10S1 of the case 10P of the semiconductor package 10.

[0026] Each of the current terminals 10a, 10b, and 10c is, for example, a terminal for supplying current to a load. Each of the current terminals 10a, 10b, and 10c is made of a conductive material. Each of the four control terminals 10d is a terminal for controlling the current supplied to the load. Each of the four control terminals 10d is made of a conductive material.

[0027] Furthermore, the semiconductor package 10 has a heat sink 10E. The heat sink 10E is formed of, for example, copper foil. Power transistors, for example, which are built into the semiconductor package 10, are heat-generating elements and therefore need to be cooled. The heat sink 10E is provided to dissipate heat from these heat-generating elements. The heat sink 10E is made of a material with high thermal conductivity, such as a metal like copper. The heat sink 10E is thermally connected to the heat-generating elements. The heat sink 10E is provided on the lower surface 10S2 of the case 10P.

[0028] The semiconductor package 10 includes semiconductor elements 10A and 10B inside a case 10P. The semiconductor package 10 also includes a wiring board 10C and an insulating board 10D inside the case 10P. Each of the semiconductor elements 10A and 10B is mounted on the wiring board 10C. The wiring board 10C is formed, for example, from copper foil. Wiring (not shown) is formed on the wiring board 10C for connecting the semiconductor element 10A or 10B to the current terminals 10a, 10b, and 10c, and to the four control terminals 10d. The insulating board 10D is formed, for example, from ceramics. A heat sink 10E is provided on the -Z side of the insulating board 10D.

[0029] Each of the semiconductor elements 11a and 11b generates heat. The heat generated from each of the semiconductor elements 11a and 11b is dissipated from the heat sink 10E.

[0030] [Cooler 20] The cooler 20 cools the semiconductor package 10. A coolant flows through the inside of the cooler 20. The cooler 20 cools the semiconductor package 10 by exchanging heat between the coolant (e.g., cooling water) flowing through it and the semiconductor package 10. Note that the coolant is not limited to water; it may also be a liquid containing antifreeze.

[0031] The cooler 20 has a refrigerant inlet 20a and a refrigerant inlet 20b. Cooled refrigerant is supplied from an external refrigerant supply source through either the refrigerant inlet 20a or the refrigerant inlet 20b. The supplied refrigerant passes through the inside of the cooler 20. As the refrigerant passes through the cooler 20, it exchanges heat with the semiconductor package 10. The refrigerant that has passed through the inside of the cooler 20 is heated. The heated refrigerant, whose temperature has risen, is then discharged from the other of the refrigerant inlet 20a and refrigerant inlet 20b.

[0032] The cooler 20 has a surface 20S on the +Z side that exchanges heat with the object to be cooled. The cooler 20 exchanges heat with the object to be cooled via surface 20S. The semiconductor device 1 has a semiconductor package 10 on surface 20S of the cooler 20 via a heat conductive member. The semiconductor package 10 is cooled by the cooler 20. A sealing member 30 is in contact with surface 20S of the cooler 20. That is, surface 20S is the surface that contacts the sealing member 30.

[0033] The cooler 20 is formed of, for example, copper, copper alloy, aluminum, or aluminum alloy. If each of the heat conduction members 41, 42, and 43 contains gallium, the cooler 20, which is made of aluminum or aluminum alloy, may be corroded by the heat conduction members. To prevent corrosion of the cooler 20 by the heat conduction members, at least the surface 20S may have a layer (film) formed of copper, copper alloy, nickel, or nickel alloy. In other words, the cooler 20 may have a layer (film) formed of copper, copper alloy, nickel, or nickel alloy on its surface. Furthermore, to prevent corrosion of the cooler 20 by the heat conduction members, at least the surface 20S may have a layer of aluminum oxide. In other words, the cooler 20 may have a layer of aluminum oxide on its surface.

[0034] In this embodiment, the cooler 20 is a cooler through which a refrigerant flows, but the cooler 20 can be any cooler capable of cooling the semiconductor package 10. For example, the cooler 20 may be a heat sink with multiple fins for heat dissipation.

[0035] [Sealing member 30] The sealing member 30 holds the heat conductive member between the semiconductor package 10 and the cooler 20. The sealing member 30 is sandwiched between the semiconductor package 10 and the cooler 20. The sealing member 30 is provided in close contact with both the semiconductor package 10 and the cooler 20.

[0036] The sealing member 30 is a member having a predetermined thickness in the Z-axis direction and a plate-like outer shape extending in the X-axis and Y-axis directions. The sealing member 30 also has openings 30h1, 30h2, and 30h3 that penetrate in the Z-axis direction. That is, when assembled, the sealing member 30 has openings 30h1, 30h2, and 30h3 that penetrate between the semiconductor packages 11, 12, and 13 and the cooler 20. The sealing member 30 is made of, for example, silicone rubber. When viewed from the -Z side in the Z-axis direction, the openings 31h, 32h, and 30h3 have shapes that follow the heat sinks 10E of the semiconductor packages 11, 12, and 13, respectively.

[0037] A sealing member 30 is placed on the surface 20S of the cooler 20, and semiconductor packages 11, 12, and 13 are placed on top of the sealing member 30. By stacking the cooler 20, the sealing member 30, and the semiconductor packages 11, 12, and 13, closed spaces are formed at the openings 30h1, 30h2, and 30h3 of the sealing member 30, respectively.

[0038] Specifically, at the opening 30h1 of the sealing member 30, a closed space SP1 is formed between the semiconductor package 11 and the cooler 20, enclosed by the semiconductor package 11, the cooler 20, and the sealing member 30. Similarly, at the opening 30h2 of the sealing member 30, a closed space SP2 is formed between the semiconductor package 12 and the cooler 20, enclosed by the semiconductor package 12, the cooler 20, and the sealing member 30. Furthermore, at the opening 30h3 of the sealing member 30, a closed space SP3 is formed between the semiconductor package 13 and the cooler 20, enclosed by the semiconductor package 13, the cooler 20, and the sealing member 30.

[0039] The semiconductor device 1 is equipped with heat conductive members 41, 42, and 43 in openings 30h1, 30h2, and 30h3, respectively. In other words, the semiconductor device 1 is equipped with heat conductive members 41, 42, and 43 in enclosed spaces SP1, SP2, and SP3, respectively. The heat conductive members 41, 42, and 43 are filled into openings 30h1, 30h2, and 30h3, respectively. The heat conductive members 41, 42, and 43 are filled into enclosed spaces SP1, SP2, and SP3, respectively, so as not to contain air bubbles or the like.

[0040] The shape of the sealing member 30 is not limited to the shape shown in the figure. For example, the cross-section along the Z-axis may be trapezoidal, circular, elliptical, or rounded rectangular instead of rectangular.

[0041] [Heat conductive member 41, heat conductive member 42, and heat conductive member 43] Each of the heat conduction members 41, 42, and 43 conducts heat from the semiconductor package 10 to the cooler 20. Each of the heat conduction members 41, 42, and 43 is made of a metal that is fluid in its operating state, for example, with gallium as the main component.

[0042] The semiconductor device 1 is equipped with heat conductive members 41, 42, and 43 in the enclosed spaces SP1, SP2, and SP3, respectively. The heat conductive members 41, 42, and 43 fill the enclosed spaces SP1, SP2, and SP3, respectively. The filled heat conductive members 41, 42, and 43 transfer heat from the semiconductor packages 11, 12, and 13 to the cooler 20, respectively.

[0043] In the semiconductor device 1, the heat conductive member 41 is filled into the enclosed space SP1, allowing the heat conductive member 41 to be in close contact with both the semiconductor package 11 and the cooler 20. The opening 30h1 allows the heat conductive member 41 to be in close contact with both the semiconductor package 11 and the cooler 20, thereby promoting heat transfer from the semiconductor package 11 to the cooler 20. In particular, since the opening 30h1 has a shape that follows the heat sink 10E of the semiconductor package 11 when viewed in a plan view from the -Z side in the Z-axis direction, heat transfer from the heat sink 10E of the semiconductor package 11 to the cooler 20 can be promoted. Similarly, by allowing the heat conductive member 42 to be in close contact with both the semiconductor package 12 and the cooler 20, heat transfer from the semiconductor package 12 to the cooler 20 can be promoted. The same applies to the heat conductive member 43.

[0044] [Fixing member 50] The fixing member 50 presses and fixes each of the semiconductor packages 11, 12, and 13 toward the cooler 20. As the fixing member 50 presses each of the semiconductor packages 11, 12, and 13 toward the cooler 20, the sealing member 30 is compressed. By compressing the sealing member 30, airtightness can be ensured in each of the enclosed spaces SP1, SP2, and SP3.

[0045] The fixing member 50 comprises a retaining plate 51, a retaining plate 52, bolts 53a and 53b, and nuts 54a and 54b.

[0046] The retaining plate 51 is provided on the side opposite to the surface 20S of the cooler 20 (the -Z side in the Z-axis direction). The retaining plate 51 is provided on the side opposite to the cooler 20 (the +Z side in the Z-axis direction) of each of the semiconductor packages 11, 12, and 13.

[0047] Bolts 53a and 53b each pass through through holes in the retaining plates 51 and 52. Nuts 54a and 54b are attached to bolts 53a and 53b, respectively. By tightening nuts 54a and 54b, the retaining plates 51 and 52 fasten the semiconductor packages 11, 12, and 13 to the cooler 20. As the retaining plates 51 and 52 fasten the semiconductor packages 11, 12, and 13 to the cooler 20, the semiconductor packages 11, 12, and 13 are pushed toward the cooler 20.

[0048] The semiconductor device 1 is assembled by pressing the semiconductor packages 11, 12, and 13 toward the cooler 20 using the fixing member 50. The fixing member 50 presses the semiconductor packages 11, 12, and 13 toward the cooler 20. The configuration of the fixing member 50 is not limited to the above, and the fastening method using bolts and nuts may be changed as appropriate. The shape of the retaining plate is also not limited to the above, and may be changed as appropriate.

[0049] <Assembly of semiconductor device 1> The assembly of the semiconductor device 1 will be explained in more detail. Figure 8 is a diagram illustrating the manufacturing method of the semiconductor device 1 according to the first embodiment.

[0050] First, the sealing member 30 is placed on the cooler 20, more specifically, on the surface 20S of the cooler 20 (Figure 8(a)). Note that in Figures 8(a), 8(b), and 8(c), the sealing member 30 is shown in cross-sectional view.

[0051] Next, the openings 30h1, 30h2, and 30h3 of the sealing member 30 are filled with heat conductive members 41, 42, and 43, respectively (Figure 8(b)). Then, the semiconductor packages 11, 12, and 13 are placed on top of the sealing member 30 (Figure 8(c)).

[0052] Then, the semiconductor package 11, semiconductor package 12, and semiconductor package 13 and the cooler 20 are fixed using the fixing member 50 (Figure 8(d)). The semiconductor package 11, semiconductor package 12, and semiconductor package 13 and the cooler 20 are fixed using the fixing member 50, completing the assembly of the semiconductor device 1.

[0053] According to the semiconductor device 1 of the first embodiment, by providing fluid heat conductive members 41, 42, and 43, the semiconductor packages 11, 12, and 13 can be stably cooled. Because the heat conductive members 41, 42, and 43 are fluid, in other words, not in a solid state, they do not peel off or crack during operation. Furthermore, since the semiconductor device 1 is equipped with heat conductive members 41, 42, and 43 in enclosed spaces SP1, SP2, and SP3, respectively, it is possible to prevent each of the heat conductive members 41, 42, and 43 from spreading out of the enclosed spaces. Therefore, the semiconductor device 1 can stably cool the semiconductor packages 11, 12, and 13. In addition, the semiconductor device 1 can provide a semiconductor device with high reliability.

[0054] For example, when solder or a metal powder sintered body is used to connect a semiconductor package and a cooler, it is necessary to raise the temperature when joining them using solder or a metal powder sintered body. When the semiconductor package and cooler are heated, there is a possibility that they may be damaged by thermal stress. Also, when using a metal powder sintered body, it is necessary to apply pressure to obtain sufficient bonding strength. When the semiconductor package and cooler are pressurized, there is a possibility that they may be damaged by the pressure.

[0055] According to the semiconductor device 1 of the first embodiment, the semiconductor packages 11, 12, and 13 and the cooler 20 can be connected by the fluid heat conductive members 41, 42, and 43 without raising the temperature or pressurizing. Therefore, the semiconductor device 1 can prevent damage to the semiconductor packages 11, 12, 13, and the cooler 20 during assembly.

[0056] Furthermore, for example, when solder or metal powder sintered bodies are used to connect a semiconductor package to a cooler, the solid solder or metal powder sintered bodies may be damaged by thermal stress during the operation of the semiconductor equipment. Also, for example, when solder or metal powder sintered bodies are used to connect a semiconductor package to a cooler, if used in an electric vehicle, the solid solder or metal powder sintered bodies may be damaged by vibrations during vehicle operation. When the solid solder or metal powder sintered bodies are damaged, their heat-conducting and bonding functions are impaired. In particular, semiconductor devices for electric vehicles require that their heat-conducting and fixing functions be maintained even when vibrations occur.

[0057] According to the semiconductor device 1 of the first embodiment, by using fluid heat conductive members 41, 42, and 43, it is possible to prevent damage due to vibration or the like, and thus prevent deterioration of function.

[0058] ≪Second Embodiment≫ Next, a semiconductor device according to the second embodiment will be described. The semiconductor device according to the second embodiment differs from the semiconductor device 1 according to the first embodiment in the means of fixing the semiconductor package. In the semiconductor device according to the second embodiment, the semiconductor package is fixed by an adhesive.

[0059] Figure 9 is a diagram illustrating the assembly of the semiconductor device 2 according to the second embodiment. Figures 9(a), 9(b), and 9(c) are the same as Figures 8(a), 8(b), and 8(c), respectively, so their explanations are omitted. The process from Figure 9(d) onwards will be explained.

[0060] After placing the semiconductor packages 11, 12, and 13 on the sealing member 30, the semiconductor packages 11, 12, 13, and the cooler 20 are fixed in place using the fixing jig 150 (Figure 9(d)).

[0061] Next, adhesive 60 is applied to the joints between semiconductor packages 11, 12, and 13 and the sealing member 30 (Figure 9(e)). Adhesive 60 is also applied between semiconductor package 11 and semiconductor package 12, and between semiconductor package 12 and semiconductor package 13. Then, it is left for a certain period of time until the adhesive 60 hardens.

[0062] Then, after the adhesive 60 has hardened, the fixing jig 150 is removed (Figure 9(f)). The assembly of the semiconductor device 2 is completed.

[0063] According to the semiconductor device 2 of the second embodiment, the semiconductor packages 11, 12, and 13 can be cooled stably, similar to the semiconductor device 1 of the first embodiment. Furthermore, the semiconductor device 2 of the second embodiment can be made more compact.

[0064] ≪Third Embodiment≫ Next, a semiconductor device according to the third embodiment will be described. The semiconductor device according to the third embodiment differs from the semiconductor device 1 according to the first embodiment in the means of fixing the semiconductor package. In the semiconductor device according to the third embodiment, the semiconductor package is fixed by a sealing resin.

[0065] Figure 10 is a diagram illustrating the assembly of the semiconductor device 3 according to the third embodiment. Figures 10(a), 10(b), and 10(c) are the same as Figures 8(a), 8(b), and 8(c), respectively, so their explanations are omitted. The process from Figure 10(d) onwards will be explained. Note that in Figures 10(d) and 10(e), the mold 270 is shown in a cross-sectional view.

[0066] After placing the semiconductor packages 11, 12, and 13 on the sealing member 30, they are placed in the mold 270 and fixed with the fixing jig 250 (Figure 10(d)).

[0067] Next, the sealing resin 80 is filled into the mold 270 (Figure 10(e)). Then, it is left for a certain period of time until the sealing resin 80 hardens. After the sealing resin 80 has hardened, the fixing jig 250 is removed (Figure 10(f)). Then, the assembly of the semiconductor device 3 is completed.

[0068] The assembled semiconductor device 3 includes a sealing resin 80. The sealing resin 80 seals the semiconductor package 11, semiconductor package 12, and semiconductor package 13, the cooler 20, and the sealing member 30.

[0069] According to the semiconductor device 3 of the third embodiment, the semiconductor package 11, semiconductor package 12, and semiconductor package 13 can be cooled stably, similar to the semiconductor device 1 of the first embodiment. Furthermore, according to the semiconductor device 3 of the third embodiment, by including a sealing resin 80, the influence of the external environment can be suppressed and environmental resistance can be improved.

[0070] ≪Fourth Embodiment≫ Next, a semiconductor device according to the fourth embodiment will be described. Figure 11 is an exploded perspective view of the semiconductor device 4 according to the fourth embodiment. Note that the heat conductive member is not shown in Figure 11. The semiconductor device 4 according to the fourth embodiment includes a sealing member 330 in place of the sealing member 30 in the semiconductor device 1 according to the first embodiment.

[0071] The sealing member 330 holds the heat conductive member between the semiconductor package 10 and the cooler 20. The sealing member 330 is sandwiched between the semiconductor package 10 and the cooler 20. The sealing member 330 is provided in close contact with both the semiconductor package 10 and the cooler 20.

[0072] The sealing member 330 is a member having a predetermined thickness in the Z-axis direction and a plate-like outer shape extending in the X-axis and Y-axis directions. The sealing member 330 also has an opening 330h that penetrates in the Z-axis direction. That is, when assembled, the sealing member 330 has an opening 330h that penetrates between the semiconductor packages 11, 12, and 13 and the cooler 20. The sealing member 30 is formed, for example, from silicone rubber.

[0073] A sealing member 330 is placed on the surface 20S of the cooler 20, and semiconductor packages 11, 12, and 13 are placed on top of the sealing member 330. By stacking the cooler 20, the sealing member 330, and the semiconductor packages 11, 12, and 13, a closed, sealed space is formed at the opening 330h of the sealing member 330.

[0074] The semiconductor device 4 is provided with a heat conductive member in the opening 330h. The heat conductive member fills the opening 330h.

[0075] According to the semiconductor device 4 of the fourth embodiment, the semiconductor packages 11, 12, and 13 can be stably cooled, similar to the semiconductor device 1 of the first embodiment.

[0076] ≪Fifth Embodiment≫ Next, a semiconductor device according to the fifth embodiment will be described. Figure 12 is an exploded perspective view of the semiconductor device 5 according to the fifth embodiment. Note that the heat conductive member is not shown in Figure 12. The semiconductor device 5 according to the fifth embodiment includes a sealing member 431, a sealing member 432, and a sealing member 433 in place of the sealing member 30 in the semiconductor device 1 according to the first embodiment.

[0077] The sealing members 431, 432, and 433 hold the heat conductive member between the semiconductor package 10 and the cooler 20. The sealing members 431, 432, and 433 are sandwiched between the semiconductor package 10 and the cooler 20. The sealing members 431, 432, and 433 are provided in close contact with the semiconductor package 10 and the cooler 20, respectively.

[0078] The sealing members 431, 432, and 433 are members having a predetermined thickness in the Z-axis direction and a plate-like outer shape extending in the X-axis and Y-axis directions. Furthermore, the sealing members 431, 432, and 433 each have openings 431h, 432h, and 433h that penetrate in the Z-axis direction. Specifically, when assembled, the sealing member 431 has an opening 431h that penetrates between the semiconductor package 11 and the cooler 20. The sealing member 432, when assembled, has an opening 432h that penetrates between the semiconductor package 12 and the cooler 20. The sealing member 433, when assembled, has an opening 433h that penetrates between the semiconductor package 13 and the cooler 20. The sealing members 431, 432, and 433 are formed from, for example, silicone rubber.

[0079] The sealing members 431, 432, and 433 are placed on the surface 20S of the cooler 20, and the semiconductor packages 11, 12, and 13 are placed on top of the sealing members 431, 432, and 433. By stacking the cooler 20, the sealing members 431, the semiconductor packages 11 and 12, a closed space is formed at the opening 431h of the sealing member 431. Similarly, by stacking the cooler 20, the sealing members 432 and 433, the semiconductor packages 12 and 13, closed spaces are formed at the openings 432h and 433h, respectively.

[0080] The semiconductor device 5 is provided with heat conductive members in openings 431h, 432h, and 433h. These heat conductive members are filled into openings 431h, 432h, and 433h, respectively.

[0081] According to the semiconductor device 5 of the fifth embodiment, the semiconductor package 11, semiconductor package 12, and semiconductor package 13 can be stably cooled, similar to the semiconductor device 1 of the first embodiment.

[0082] ≪Sixth Embodiment≫ Next, a semiconductor device according to the sixth embodiment will be described. Figure 13 is an exploded perspective view of the semiconductor device 6 according to the sixth embodiment. Note that the heat conductive member is not shown in Figure 13. The semiconductor device 6 according to the sixth embodiment is equipped with a cooler 520 instead of the cooler 20 in the semiconductor device 1 according to the first embodiment.

[0083] The cooler 520 has a groove 520g on its +Z side surface 520S that conforms to the shape of the sealing member 30 when viewed from the +Z side in the Z-axis direction. When the sealing member 30 is placed on the cooler 520, the sealing member 30 is inserted into the groove 520g. By inserting the sealing member 30 into the groove 520g, the sealing member 30 can be positioned relative to the cooler 520 when it is placed on the cooler 520.

[0084] According to the semiconductor device 6 of the sixth embodiment, the semiconductor packages 11, 12, and 13 can be stably cooled, similar to the semiconductor device 1 of the first embodiment. Furthermore, according to the semiconductor device 6 of the sixth embodiment, the assembly of the semiconductor device 6 can be easily performed.

[0085] Note that groove 520g is an example of the first groove.

[0086] ≪Seventh Embodiment≫ Next, a semiconductor device according to the seventh embodiment will be described. Figure 14 is an exploded perspective view of the semiconductor device 7 according to the seventh embodiment. Note that the heat conductive member is not shown in Figure 14. The semiconductor device 7 according to the seventh embodiment is equipped with a cooler 620 in place of the cooler 20 in the semiconductor device 4 according to the fourth embodiment.

[0087] The cooler 620 has grooves 620g1, 620g2, and 620g3 on its +Z side surface 620S, respectively, whose shapes conform to those of the sealing members 431, 432, and 433 when viewed from the +Z side in the Z-axis direction. When the sealing member 431 is placed on the cooler 620, the sealing member 431 is inserted into groove 620g1. By inserting the sealing member 431 into groove 620g1, the sealing member 431 can be positioned relative to the cooler 620 when it is placed on the cooler 620. Similarly, when the sealing members 432 and 433 are placed on the cooler 620, the sealing members 432 and 433 are inserted into grooves 620g2 and 620g3, respectively.

[0088] According to the semiconductor device 7 of the seventh embodiment, the semiconductor packages 11, 12, and 13 can be cooled stably, similar to the semiconductor device 1 of the first embodiment. Furthermore, according to the semiconductor device 7 of the seventh embodiment, the assembly of the semiconductor device 7 can be easily performed.

[0089] Furthermore, the semiconductor package 10 may be provided with a groove for inserting a sealing member. Figure 15 is a perspective view of a semiconductor package 110, which is a modified example of the semiconductor package provided in the semiconductor device 7 according to the seventh embodiment. In the semiconductor device 7, the semiconductor package 110 may be used instead of semiconductor package 11, semiconductor package 12, and semiconductor package 13, respectively.

[0090] The semiconductor package 110 has grooves 110g on its lower surface 110S2 in the case 110P, each groove 110g that conforms to the shape of the sealing members 431, 432, and 433 when viewed in a plan view from the +Z side in the Z-axis direction. When the semiconductor package 110 is placed on each of the sealing members 431, 432, and 433, the semiconductor package 110 can be positioned relative to each of the sealing members 431, 432, and 433.

[0091] Furthermore, the semiconductor package 110 may be applied to any of the semiconductor packages 11, 12, and 13 of the semiconductor device 4 according to the fourth embodiment.

[0092] Grooves 620g1, 620g2, and 620g3 are examples of the first groove, while groove 110g is an example of the second groove.

[0093] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the attached claims. [Explanation of Symbols]

[0094] 1, 2, 3, 4, 5, 6, 7 Semiconductor equipment 10, 11, 12, 13 Semiconductor packages 20 Cooler 20S side 30 sealing member 30h1, 30h2, 30h3 opening 41, 42, 43 Heat conductive material 50 Fixing member 60 Adhesives 80 Sealing resin 110 Semiconductor Packages 110g groove 110S2 Bottom 330 sealing member 330h opening 431, 432, 433 sealing members 431h, 432h, 433h opening 520 Cooler 520g groove 520S side 620 Cooler 620g1, 620g2, 620g3 groove 620S surface

Claims

1. A first semiconductor package, a second semiconductor package, and a third semiconductor package, Coolers for cooling the first semiconductor package, the second semiconductor package, and the third semiconductor package, A sealing member is provided sandwiched between each of the first semiconductor package, the second semiconductor package, and the third semiconductor package and the cooler, and has a first opening that penetrates between the first semiconductor package and the cooler, a second opening that penetrates between the second semiconductor package and the cooler, and a third opening that penetrates between the third semiconductor package and the cooler. A heat conductive member made of a fluid metal is filled into each of the first, second, and third openings, A semiconductor device equipped with a semiconductor device.

2. A semiconductor package having a heat sink provided on the bottom surface of the case, A cooler for cooling the aforementioned semiconductor package, A sealing member is provided sandwiched between the semiconductor package and the cooler, passing through the space between the semiconductor package and the cooler, and having an opening that conforms to the shape of the heat sink plate, A heat conductive member made of a fluid metal that is filled into the opening, A semiconductor device equipped with a semiconductor device.

3. The cooler has a first groove into which the sealing member is inserted on the surface that contacts the sealing member. A semiconductor device according to either claim 1 or claim 2.

4. The semiconductor package has a second groove into which the sealing member is inserted on the surface that contacts the sealing member. The semiconductor device according to claim 2.

5. The cooler has a first groove into which the sealing member is inserted on the surface that contacts the sealing member, The semiconductor package has a second groove into which the sealing member is inserted on the surface that contacts the sealing member. The semiconductor device according to claim 2.

6. The cooler is made of copper or a copper alloy. A semiconductor device according to either claim 1 or claim 2.

7. The cooler is made of aluminum or an aluminum alloy. A semiconductor device according to either claim 1 or claim 2.

8. The cooler has a layer formed on its surface of copper, copper alloy, nickel, or nickel alloy. The semiconductor device according to claim 7.

9. The cooler has a layer of aluminum oxide on its surface. The semiconductor device according to claim 7.

10. The semiconductor package is provided with a fixing member that presses it against the cooler. A semiconductor device according to either claim 1 or claim 2.

11. The fixing member includes a first pressing plate and a second pressing plate, The semiconductor package and the cooler are provided between the first and second retaining plates. The semiconductor device according to claim 10.

12. Each of the first and second retaining plates is fixed at both ends and is longer than the surface on which the semiconductor package is placed in the cooler. The semiconductor device according to claim 11.

13. The semiconductor package and the sealing member are provided with an adhesive for fixing them together. A semiconductor device according to either claim 1 or claim 2.

14. The semiconductor package, the sealing member, and the cooling unit are sealed with a sealing resin. A semiconductor device according to either claim 1 or claim 2.

15. A power conversion device comprising a semiconductor device according to claim 1 or claim 2.

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