Processing system, processing method, computer program, recording medium, and control device

Abstract

To provide a molding system which performs processing at an appropriate position.SOLUTION: A processing system includes a support device capable of supporting a processing object, a processing device which irradiates a processed region on the processing object with an energy beam, supplies a material to a region irradiated with the energy beam and performs addition processing, and a position changing device which changes a physical relationship between the support device and the irradiation region with the energy beam from the processing device, performs the addition processing on at least one of a first region that is a part of the support device and a second region that is a part of the processing object and forms a reference molded article, and controls at least one of the processing device and the position changing device using the information on the reference molded article.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to the technical field of, for example, a processing system for performing additive processing on a workpiece, a processing method, a computer program, a recording medium, and a control device.

Background Art

[0002] Patent Document 1 describes a processing system that performs additive processing by melting a powdery material with an energy beam and then solidifying the melted material. In such a processing system, performing processing at an appropriate position is a technical problem.

Prior Art Literature

Patent Literature

[0003]

Patent Document 1

Summary of Invention

[0004] According to a first aspect, there is provided a processing system including: a support device capable of supporting a workpiece; a processing device that performs processing by irradiating a region to be processed on the workpiece with an energy beam; a position changing device that changes a relative positional relationship between the support device and an irradiation region of the energy beam; and a control device that controls the position changing device based on position information of a reference formed by processing at least one of the support device and the workpiece with the processing device.

[0005] According to a second embodiment, a processing system is provided comprising: a support device capable of supporting a workpiece; a processing device that irradiates a workpiece region with an energy beam and supplies material to the region irradiated with the energy beam to perform additional processing; and a position changing device that changes the positional relationship between the support device and the region irradiated with the energy beam from the processing device, wherein additional processing is performed on at least one of a first region which is part of the support device and a second region which is part of the workpiece to form a reference molded object, and at least one of the processing device and the position changing device is controlled using information about the reference molded object.

[0006] According to a third aspect, a processing method is provided for performing additional processing on a workpiece by irradiating it with an energy beam from a processing apparatus, the method comprising: supporting the workpiece with a support device; performing additional processing on at least one of a first region which is part of the support device and a second region which is part of the workpiece to form a reference molded object; measuring the reference molded object; and changing the positional relationship between the support device and the irradiation area of ​​the energy beam from the processing apparatus based on the measured information about the reference molded object.

[0007] According to a fourth embodiment, a processing system is provided comprising: a support device capable of supporting a workpiece; a processing device that irradiates a workpiece region on the workpiece with an energy beam and supplies material to the region irradiated with the energy beam to perform additional processing; a position changing device that changes the positional relationship between the support device and the region irradiated with the energy beam from the processing device; and a receiving device that controls at least one of the support device, the processing device, and the position changing device to perform additional processing on at least one of a first region which is part of the support device and a second region which is part of the workpiece to form a reference molded object, and receives a control signal that controls at least one of the processing device and the position changing device using information about the reference molded object.

[0008] According to a fifth aspect, a computer program is provided to be executed by a computer that controls a molding system comprising a support device capable of supporting a workpiece, a processing device that irradiates a workpiece area with an energy beam and supplies material to the area irradiated by the energy beam to perform additional processing, and a position changing device that changes the positional relationship between the support device and the area irradiated by the energy beam from the processing device, the computer program causing the computer to execute a process of performing additional processing on at least one of a first area which is part of the support device and a second area which is part of the workpiece to form a reference molded object, and a process of controlling at least one of the processing device and the position changing device using information about the reference molded object.

[0009] According to the sixth aspect, a recording medium on which a computer program provided in the fourth aspect described above is recorded is provided.

[0010] According to a seventh aspect, a control device is provided for controlling a molding system comprising a support device capable of supporting a workpiece, a processing device that irradiates a workpiece region with an energy beam and supplies material to the region irradiated with the energy beam to perform additional processing, and a position changing device that changes the positional relationship between the support device and the region irradiated with the energy beam from the processing device, wherein the control device performs a process of forming a reference molded object by performing additional processing on at least one of a first region which is part of the support device and a second region which is part of the workpiece, and a process of controlling at least one of the processing device and the position changing device using information about the reference molded object.

[0011] The effects and other benefits of the present invention will be revealed from the embodiments described below. [Brief explanation of the drawing]

[0012] [Figure 1] Figure 1 is a cross-sectional view showing the structure of the molding system of this embodiment. [Figure 2]Figure 2 is a top view and a side view showing the top surface 131 and side view of the stage 13, respectively. [Figure 3] Figures 3(a) to 3(c) are cross-sectional views showing the conditions when light is irradiated and molding material is supplied to a certain area on the workpiece, respectively. [Figure 4] Figures 4(a) to 4(c) are cross-sectional views illustrating the process of forming a three-dimensional structure. [Figure 5] Figure 5 is a flowchart showing the flow of the initial setup operation during the alignment process. [Figure 6] Figure 6 is a flowchart showing the flow of the head movement operation during the alignment process. [Figure 7] Figure 7 is a plan view showing the relationship between the position of the test mark in the stage coordinate system and the start position of the build process, as well as the relationship between the position of the build head in the head coordinate system and the start position of the build process. [Figure 8] Figure 8 is a flowchart showing a portion of the head movement operation in the first modified example. [Figure 9] Figure 9 is a flowchart showing some of the other parts of the head movement operation in the first modified example. [Figure 10] Figure 10 is a flowchart showing the flow of other parts of the head movement operation in the first modified example. [Figure 11] Figure 11 is a plan view showing an example of a test mark used in the first modified example. [Figure 12] Figure 12 is a plan view showing the relationship between the position of the test mark in the stage coordinate system and the start position of the build process, as well as the relationship between the position of the build head in the head coordinate system and the start position of the build process. [Figure 13] Figure 13(a) is a plan view showing the shape formed on a workpiece when the workpiece is not undergoing thermal expansion, and Figure 13(b) is a plan view showing the shape formed on a workpiece when the workpiece is undergoing thermal expansion. [Figure 14] Figure 14 is a cross-sectional view showing the structure of the third modified fabrication system. [Figure 15]FIG. 15 is a cross-sectional view illustrating a structure of a modeling system according to a fourth modification. DETAILED DESCRIPTION OF EMBODIMENTS

[0013] Hereinafter, embodiments of a processing system, a processing method, a computer program, a recording medium, and a control device will be described with reference to the drawings. In the following description, embodiments of the processing system, the processing method, the computer program, the recording medium, and the control device will be described using a modeling system 1 capable of forming a modeled object by performing additive processing using a modeling material M by laser cladding deposition (LMD: Laser Metal Deposition). Laser metal deposition (LMD) may also be referred to as direct metal deposition, directed energy deposition, laser cladding, laser engineered net shaping, direct light fabrication, laser consolidation, shape deposition manufacturing, wire-feed laser deposition, gas through wire, laser powder fusion, laser metal forming, selective laser powder remelting, laser direct casting, laser powder deposition, laser additive manufacturing, or laser rapid forming.

[0014] In addition, in the following description, the positional relationship of various components constituting the modeling system 1 will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. For convenience of explanation, in the following description, it is assumed that each of the X-axis direction and the Y-axis direction is a horizontal direction (that is, a predetermined direction in a horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane, which is substantially the vertical direction or the direction of gravity). The rotational directions about the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. The XY plane may be a horizontal plane.

[0015] (1) Overall structure of the molding system 1 First, the overall structure of the modeling system 1 of the present embodiment will be described with reference to Fig. 1. Fig. 1 is a cross-sectional view showing an example of the structure of the modeling system 1 of the present embodiment.

[0016] The modeling system 1 is capable of forming a three-dimensional structure ST (that is, a three-dimensional object having a size in any of the three-dimensional directions, which is a three-dimensional object, in other words, an object having a size in the X, Y and Z directions). The modeling system 1 is capable of forming the three-dimensional structure ST on a workpiece W serving as a base (that is, a base material) for forming the three-dimensional structure ST. The modeling system 1 is capable of forming the three-dimensional structure ST by performing additive processing on the workpiece W. When the workpiece W is a stage 13 described later, the modeling system 1 can form the three-dimensional structure ST on the stage 13. When the workpiece W is an existing structure held by the stage 13, the modeling system 1 can form the three-dimensional structure ST on the existing structure. In this case, the modeling system 1 may form the three-dimensional structure ST integrated with the existing structure. The operation of forming the three-dimensional structure ST integrated with the existing structure is equivalent to the operation of adding a new structure to the existing structure. Alternatively, the modeling system 1 may form the three-dimensional structure ST separable from the existing structure. Fig. 1 shows an example in which the workpiece W is an existing structure held by the stage 13. Further, the following description will proceed with an example in which the workpiece W is an existing structure held by the stage 13.

[0017] As described above, the modeling system 1 is capable of forming a modeled object by a laser cladding welding method. In other words, the modeling system 1 can also be said to be a 3D printer that forms an object using additive manufacturing technology. Note that additive manufacturing technology is also referred to as Rapid Prototyping, Rapid Manufacturing, or Additive Manufacturing.

[0018] The molding system 1 forms an object by processing the molding material M with optical EL. As such optical EL, at least one of infrared light, visible light, and ultraviolet light can be used, but other types of light may also be used. Optical EL is laser light. Furthermore, the molding material M is a material that can be melted by irradiation with optical EL of a predetermined intensity or higher. As such molding material M, at least one of metallic materials and resinous materials can be used. However, other materials different from metallic materials and resinous materials may also be used as the molding material M. The molding material M is a powder or granular material. In other words, the molding material M is a powder or granular material. However, the molding material M does not have to be a powder or granular material; for example, a wire-shaped molding material or a gaseous molding material may be used. The molding system 1 may also form an object by processing the molding material M with an energy beam such as a charged particle beam.

[0019] To process the molding material M, the molding apparatus 4 comprises a molding head 11, a head drive system 12, a stage 13, a measuring device 14, and a control device 15. The molding apparatus 4 may house the molding head 11, the head drive system 12, the stage 13, and the measuring device 14 in a chamber not shown. The chamber may be purged with an inert gas such as nitrogen or argon. Furthermore, the molding head 11 includes an irradiation system 111 and a material nozzle (i.e., a supply system for supplying the molding material M) 112.

[0020] The illumination system 111 is an optical system (e.g., a focusing optical system) for emitting light-emitting diodes (EL) from the emission unit 113. Specifically, the illumination system 111 is optically connected to a light source (not shown) that emits EL, via an optical transmission member (not shown) such as an optical fiber. The illumination system 111 emits EL that propagates from the light source via the optical transmission member. The illumination system 111 irradiates EL downward (i.e., towards the -Z side). A stage 13 is located below the illumination system 111. When a workpiece W is mounted on the stage 13, the illumination system 111 can irradiate EL towards the workpiece W. Specifically, the illumination system 111 irradiates EL into an irradiation area EA of a predetermined shape set on the workpiece W as the area where the EL is irradiated (typically, focused). Furthermore, the state of the illumination system 111 can be switched between a state in which EL is irradiated into the irradiation area EA and a state in which EL is not irradiated into the irradiation area EA, under the control of the control device 15. Furthermore, the direction of the light EL emitted from the irradiation system 111 is not limited to directly downwards (i.e., in the direction coinciding with the Z-axis), but may be, for example, in a direction tilted by a predetermined angle with respect to the Z-axis.

[0021] The material nozzle 112 has a supply outlet (i.e., a supply port) 114 for supplying the molding material M. The material nozzle 112 supplies (specifically, sprays, ejects, or injects) the molding material M from the supply outlet 114. The material nozzle 112 is physically connected to a material supply device (not shown), which is the source of the molding material M, via a powder transmission member such as a pipe (not shown). The material nozzle 112 supplies the molding material M supplied from the material supply device via the powder transmission member. In Figure 1, the material nozzle 112 is depicted as a tube, but the shape of the material nozzle 112 is not limited to this shape. The material nozzle 112 supplies the molding material M downward (i.e., towards the -Z side). A stage 13 is located below the material nozzle 112. When a workpiece W is mounted on the stage 13, the material nozzle 112 supplies the molding material M towards the workpiece W. The direction of travel of the molding material M supplied from the material nozzle 112 is inclined at a predetermined angle (for example, an acute angle) with respect to the Z axis, but it may also be directly downwards (i.e., in the direction that coincides with the Z axis). Furthermore, multiple material nozzles 112 may be provided.

[0022] In this embodiment, the material nozzle 112 is positioned relative to the irradiation system 111 so as to supply the molding material M toward the irradiation area EA where the irradiation system 111 irradiates with light EL. In other words, the material nozzle 112 and the irradiation system 111 are positioned so that the supply area MA, which is set on the workpiece W as the area to which the material nozzle 112 supplies the molding material M, coincides with (or at least partially overlaps with) the irradiation area EA. Alternatively, the material nozzle 112 may be positioned so as to supply the molding material M to the molten pool MP formed in the workpiece W by the light EL emitted from the irradiation system 111. Furthermore, the material nozzle 112 may be positioned so as to partially overlap the supply area MA to which the material nozzle 112 supplies the molding material M with the area of ​​the molten pool MP.

[0023] The head drive system 12 moves the build head 11. The head drive system 12 moves the build head 11 along the X, Y, and Z axes, respectively. In addition to the X, Y, and Z axes, the head drive system 12 may also move the build head 11 along at least one of the θX, θY, and θZ directions. The head drive system 12 includes, for example, a motor. When the head drive system 12 moves the build head 11, the irradiation area EA also moves relative to the workpiece W. Therefore, the head drive system 12 can change the positional relationship between the workpiece W and the irradiation area EA (in other words, the positional relationship between the stage 13 that holds the workpiece W and the irradiation area EA) by moving the build head 11. The head drive system 12 can also change the positional relationship between the workpiece W and the supply area MA (in other words, the positional relationship between the stage 13 that holds the workpiece W and the supply area MA) by moving the build head 11.

[0024] Furthermore, the head drive system 12 may move the irradiation system 111 and the material nozzle 112 separately. Specifically, for example, the head drive system 12 may be able to adjust at least one of the following: the position of the injection unit 113, the orientation of the injection unit 113, the position of the supply outlet 114, and the orientation of the supply outlet 114. In this case, the irradiation area EA, where the irradiation optical system 111 irradiates light EL, and the supply area MA, where the material nozzle 112 supplies the molding material M, can be controlled separately.

[0025] Stage 13 is capable of holding the workpiece W. Stage 13 is also capable of releasing the held workpiece W. The illumination system 111 described above irradiates light EL for at least a portion of the time that Stage 13 is holding the workpiece W. Furthermore, the material nozzle 112 described above supplies the molding material M for at least a portion of the time that Stage 13 is holding the workpiece W. Note that some of the molding material M supplied by the material nozzle 112 may scatter or spill from the surface of the workpiece W to the outside of the workpiece W (for example, around Stage 13). For this reason, the molding system 1 may be equipped with a recovery device around Stage 13 to collect the scattered or spilled molding material M.

[0026] Stage 13 is provided with an upper surface (the +Z side surface in the example shown in Figure 1) 131 that can face the build head 11 in order to hold the workpiece W. The upper surface 131 includes a holding area 132 and a non-holding area 133, as shown in Figure 2, which includes a plan view showing the upper surface 131 of Stage 13 and a side view showing the side of Stage 13. The holding area 132 is a part of the upper surface 131. The holding area 132 may also be the entirety of the upper surface 131. The holding area 132 is an area (e.g., a surface) capable of holding the workpiece W. The holding area 132 may also be called a holding surface or a support surface. The holding area 132 is an area set on the upper surface 131 for holding the workpiece W. The holding area 132 may be held using at least one of the following: a mechanical chuck, a vacuum suction chuck, an electromagnetic suction chuck, and an electrostatic suction chuck. The holding area 132 is a rectangular area in plan view, but may be an area of ​​other shape. The non-holding area 133 is part of the upper surface 131. The non-holding area 133 is an area (e.g., a surface) that does not hold the workpiece W. The non-holding area 133 is a different area from the holding area 132. The non-holding area 133 is a rectangular frame-shaped area in plan view, but it may be an area of ​​other shape. The non-holding area 133 may be located at the same height as the holding area 132 (i.e., along the Z-axis), or it may be located at a different height.

[0027] Multiple mark regions 134 are set in the non-retaining region 133. In the example shown in Figure 2, three mark regions 134 (specifically, mark region 134#1, mark region 134#2, and mark region 134#3) are set in the non-retaining region 133. The multiple mark regions 134 are set at predetermined positions within the non-retaining region 133. The multiple mark regions 134 are discretely distributed on the upper surface 131. The multiple mark regions 134 are evenly distributed on the upper surface 131. The multiple mark regions 134 are distributed so as to surround the retaining region 132. The multiple mark regions 134 are distributed on the upper surface 131 such that the retaining region 132 is located between at least two mark regions 134. In addition, at least a part of the retaining region 132 may be located in the region enclosed by multiple line segments connecting two of the at least three mark regions 134. In the example shown in Figure 2, mark region 134#1 is located on the -Y and +X side of the holding region 132, mark region 134#2 is located on the -X side of the holding region 132, and mark region 134#3 is located on the +Y and +X side of the holding region 132. However, the distribution of the multiple mark regions 134 is not limited to the distribution described above.

[0028] At least one of the multiple mark regions 134 may be located in the same plane as the non-retaining region 133. That is, the height of at least one of the multiple mark regions 134 may be the same as the height of the non-retaining region 133. Also, at least one of the multiple mark regions 134 may be located in the same plane as the retaining region 132. At least one of the multiple mark regions 134 may be located in a different plane from the non-retaining region 133. That is, the height of at least one of the multiple mark regions 134 may be different from the height of the non-retaining region 133. Also, the height of at least one of the multiple mark regions 134 may be different from the height of the retaining region 132. At least one of the multiple mark regions 134 may be located in a different plane from at least one of the multiple mark regions 134. That is, the height of at least one of the multiple mark regions 134 may be different from the height of at least one of the multiple mark regions 134. In the example shown in Figure 2, mark regions 134#1 and 134#2 are located in the same plane as the non-retaining region 133, while mark region 134#3 is located in a different plane from mark regions 134#1 and 134#2. In other words, in the example shown in Figure 2, mark regions 134#1 and 134#2 are located in the same plane as the retaining region 132, while mark region 134#3 is located in a different plane from the retaining region 132.

[0029] Each of the multiple mark regions 134 is used for alignment operations to align the workpiece W with the build head 11. The details of the alignment operation will be described in detail later, but here is a brief overview. When the alignment operation is performed, a mark member FM is placed in each of the multiple mark regions 134. Each of the multiple mark regions 134 holds the mark member FM. Subsequently, the build system 1 performs additional processing on the mark member FM to form a test mark TM, which corresponds to a three-dimensional object, on the mark member FM. Then, the build system 1 measures the state of the formed test mark TM using a measuring device 14. After that, the build system 1 aligns the workpiece W with the build head 11 using the measurement result of the state of the test mark TM.

[0030] Again in Figure 1, the measuring device 14 measures the state of the object to be measured. In this embodiment, the object to be measured is an object on the stage 13. Therefore, the object to be measured may include at least a part of the workpiece W, the marking member FM, the test mark TM, and any other arbitrary object. As an example of the state of the object to be measured, the measuring device 14 measures the position of the object to be measured on the stage 13. For example, the measuring device 14 may measure the absolute position of the object to be measured (e.g., the test mark TM) on the stage 13. For example, the measuring device 14 may measure the relative position of one part of the object to be measured (e.g., the test mark TM) to one part of the object to be measured (e.g., the workpiece W) on the stage 13.

[0031] To measure the position of the object to be measured (particularly the position of the surface of the object), the measuring device 14 may measure at least one of the shape and dimensions of the object using any measuring method. Examples of measuring methods include at least one of the pattern projection method, light section method, time-of-flight method, moiré topography method (specifically, grating projection method or grating projection method), holographic interferometry, autocollimation method, stereo method, astigmatism method, critical angle method, and knife-edge method. Once at least one of the position, shape, and dimensions of the object to be measured on the stage 13 is determined by the measurement of the measuring device 14, the location of each part of the object to be measured (for example, at least one of the workpiece W and the test mark TM) on the stage 13 can be determined. As a result, the position of the object to be measured on the stage 13 can be calculated from at least one of the position, shape, and dimensions of the object to be measured.

[0032] The control device 15 controls the operation of the molding system 1. The control device 15 may include, for example, an arithmetic unit such as at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit), and a storage device such as memory. The control device 15 functions as a device that controls the operation of the molding system 1 by having the arithmetic unit execute a computer program. This computer program is a computer program that causes the control device 15 (e.g., the arithmetic unit) to perform (i.e., execute) the operations that the control device 15 should perform, as described later. In other words, this computer program is a computer program that causes the control device 15 to function in such a way that the molding system 1 performs the operations described later. The computer program executed by the arithmetic unit may be recorded in a storage device (i.e., a recording medium) provided by the control device 15, or it may be recorded in any storage medium (e.g., a hard disk or semiconductor memory) that is built into or can be attached to the control device 15. Alternatively, the arithmetic unit may download the computer program to be executed from an external device of the control device 15 via a network interface. Furthermore, recording media for storing computer programs executed by the arithmetic unit may include magnetic media such as CD-ROMs, CD-Rs, CD-RWs, flexible disks, MOs, DVD-ROMs, DVD-RAMs, DVD-Rs, DVD+Rs, DVD-RWs, Blu-ray®, and Blu-ray® magnetic disks and tapes, optical disks, magneto-optical disks, semiconductor memory such as USB memory, and other media capable of storing programs. In addition to programs stored and distributed on the above recording media, programs may also be distributed via download through network lines such as the Internet. Moreover, recording media may include devices capable of recording programs, such as general-purpose or dedicated devices on which the above programs are implemented in an executable state in the form of software or firmware.Furthermore, each process and function included in the program may be executed by program software that can be run on a computer, or each part of the processing may be implemented in a form that combines hardware such as a predetermined gate array (FPGA, ASIC), or partial hardware modules that realize some elements of program software and hardware.

[0033] In particular, in this embodiment, the control device 15 controls the emission mode of the photoelectric light (EL) by the irradiation system 111. The emission mode includes, for example, at least one of the intensity of the photoelectric light and the emission timing of the photoelectric light. If the photoelectric light is pulsed light, the emission mode may include, for example, at least one of the length of the emission time of the pulsed light and the ratio of the emission time of the pulsed light to the extinction time (so-called duty cycle). Furthermore, the control device 15 controls the movement mode of the build head 11 by the head drive system 12. The movement mode includes, for example, at least one of the amount of movement, the speed of movement, the direction of movement, and the timing of movement. Furthermore, the control device 15 controls the supply mode of the build material M by the material nozzle 112. The supply mode includes, for example, the amount of supply (in particular, the amount of supply per unit time).

[0034] The control device 15 does not necessarily have to be located inside the molding system 1; for example, it may be located outside the molding system 1 as a server or the like. In this case, the control device 15 and the molding system 1 may be connected by a wired, wireless, or other communication line or network. When physically connecting using a wired connection, it may be a serial connection such as IEEE1394, RS-232x, RS-422, RS-423, RS-485, USB, or a parallel connection, or an electrical connection via a network such as 10BASE-T, 100BASE-TX, or 1000BASE-T. When connecting using a wireless connection, it may utilize wireless LAN such as IEEE802.1x or OFDM, radio waves such as Bluetooth®, infrared, or optical communication. In this case, the control device 15 and the molding system 1 may be configured to enable the transmission and reception of various types of information via the communication line or network. Furthermore, the control device 15 may be capable of transmitting information such as commands and control parameters to the molding system 1 via the above-mentioned communication line or network. The molding system 1 may also include a receiving device that receives information such as commands and control parameters from the control device 15 via the communication line or network.

[0035] (2) Operation of the molding system 1 Next, the operation of the molding system 1 will be described. In this embodiment, as described above, the molding system 1 performs a molding operation to form a three-dimensional structure ST. Furthermore, before performing the molding operation, the molding system 1 performs an alignment operation to align the workpiece W with the molding head 11. Therefore, the molding operation and the alignment operation to align the workpiece W with the molding head 11 will be described in order below.

[0036] (2-1) Modeling process First, the fabrication process will be explained. As described above, fabrication system 1 forms a three-dimensional structure ST by laser cladding welding. Therefore, fabrication system 1 may form the three-dimensional structure ST by performing existing fabrication operations that conform to the laser cladding welding method. Below, an example of the fabrication operation for a three-dimensional structure ST by laser cladding welding will be briefly explained.

[0037] The molding system 1 forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (e.g., CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. The three-dimensional model data includes data representing the shape (particularly the three-dimensional shape) of the three-dimensional structure ST. Measurement data of a three-dimensional object measured by a measuring device 14 provided within the molding system 1 may be used as the three-dimensional model data. Measurement data of a three-dimensional shape measuring machine provided separately from the molding system 1 may also be used as the three-dimensional model data. An example of such a three-dimensional shape measuring machine is at least one of a contact-type three-dimensional measuring machine and a non-contact-type three-dimensional measuring machine, both of which have a probe that is movable relative to the workpiece W and capable of contacting the workpiece W. Examples of non-contact 3D measuring machines include at least one of the following: pattern projection type 3D measuring machines, light section type 3D measuring machines, time-of-flight type 3D measuring machines, moiré topography type 3D measuring machines, holographic interferometry type 3D measuring machines, CT (Computed Tomography) type 3D measuring machines, and MRI (Magnetic Resonance Imaging) type 3D measuring machines. Design data of a 3D structure ST may be used as the 3D model data.

[0038] The fabrication system 1 sequentially forms multiple layered substructures (hereinafter referred to as "structural layers") SL aligned along the Z-axis, for example, to form a three-dimensional structure ST. For example, the fabrication system 1 sequentially forms multiple structural layers SL obtained by slicing the three-dimensional structure ST along the Z-axis, one layer at a time. As a result, a three-dimensional structure ST, which is a laminated structure in which multiple structural layers SL are stacked, is formed. The following describes the flow of operations for forming the three-dimensional structure ST by sequentially forming multiple structural layers SL one layer at a time.

[0039] First, the operation of forming each structural layer SL will be described. Under the control of the control device 15, the molding system 1 sets an irradiation area EA in a desired area on the molding surface MS corresponding to the surface of the workpiece W or the surface of the already formed structural layer SL, and irradiates the irradiation area EA with light EL from the irradiation system 111. The area occupied on the molding surface MS by the light EL irradiated from the irradiation system 111 may also be called the irradiation area EA. In this embodiment, the focus position of the light EL (i.e., the focusing position, in other words, the position where the light EL is most concentrated in the Z-axis direction or the direction of propagation of the light EL) coincides with the molding surface MS. The focus position of the light EL may be set to a position shifted in the Z-axis direction from the molding surface MS. As a result, as shown in Figure 3(a), a molten pool (i.e., a pool of liquid metal or resin, etc., melted by the light EL) MP is formed in a desired area on the molding surface MS by the light EL ejected from the irradiation system 111. Furthermore, under the control of the control device 15, the molding system 1 sets a supply area MA in a desired area on the molding surface MS and supplies the molding material M from the material nozzle 112 to the supply area MA. Here, as described above, the irradiation area EA and the supply area MA coincide, so the supply area MA is set in the area where the molten pool MP is formed. Therefore, as shown in Figure 3(b), the molding system 1 supplies the molding material M from the material nozzle 112 to the molten pool MP. As a result, the molding material M supplied to the molten pool MP melts. As the molding head 11 moves, the light EL is no longer irradiated onto the molten pool MP, and the molten molding material M in the molten pool MP cools and solidifies (i.e., solidifies). As a result, as shown in Figure 3(c), the solidified molding material M is deposited on the molding surface MS. In other words, a molded object is formed by the deposit of solidified molding material M. That is, a molded object is formed by an additive process that adds a deposit of molding material M to the molding surface MS.

[0040] A series of fabrication processes, including the formation of a molten pool MP by light irradiation EL, the supply of fabrication material M to the molten pool MP, the melting of the supplied fabrication material M, and the solidification of the molten fabrication material M, are repeated while the build head 11 is moved along the XY plane relative to the build surface MS. As the build head 11 moves relative to the build surface MS, the irradiation area EA also moves relative to the build surface MS. Therefore, the series of fabrication processes are repeated while the irradiation area EA is moved along the XY plane relative to the build surface MS. In this process, the light EL is selectively irradiated onto the irradiation area EA set in the area where the fabricated object is to be formed, while selectively not irradiated onto the irradiation area EA set in the area where the fabricated object is not to be formed. It can also be said that no irradiation area EA is set in the area where the fabricated object is not to be formed. In other words, the fabrication system 1 moves the irradiation area EA along a predetermined movement trajectory on the build surface MS and irradiates the build surface MS with light EL at timings corresponding to the distribution of the area where the fabricated object is to be formed (i.e., the pattern of the structural layer SL). As a result, a structural layer SL, which corresponds to an aggregate of solidified molding material M, is formed on the molding surface MS. In the above description, the irradiation area EA was moved relative to the molding surface MS, but the molding surface MS may be moved relative to the irradiation area EA.

[0041] The molding system 1 repeatedly performs operations to form such structural layers SL based on 3D model data under the control of the control device 15. Specifically, first, the control device 15 slices the 3D model data at the layering pitch to create slice data. The control device 15 may modify the slice data at least partially depending on the characteristics of the molding system 1. Under the control of the control device 15, the molding system 1 performs operations to form the first structural layer SL#1 on the molding surface MS corresponding to the surface of the workpiece W based on 3D model data corresponding to structural layer SL#1 (i.e., slice data corresponding to structural layer SL#1). As a result, structural layer SL#1 is formed on the molding surface MS as shown in Figure 4(a). Subsequently, the molding system 1 sets the surface (i.e., top surface) of structural layer SL#1 as a new molding surface MS and forms the second structural layer SL#2 on this new molding surface MS. To form structural layer SL#2, the control device 15 first controls the head drive system 12 so that the molding head 11 moves along the Z axis. Specifically, the control device 15 controls the head drive system 12 to move the build head 11 toward the +Z side so that the irradiation area EA and the supply area MA are set on the surface of structural layer SL#1 (i.e., the new build surface MS). This causes the focus position of the optical EL to coincide with the new build surface MS. Subsequently, under the control of the control device 15, the build system 1 forms structural layer SL#2 on structural layer SL#1 based on slice data corresponding to structural layer SL#2, in an operation similar to the operation of forming structural layer SL#1. As a result, structural layer SL#2 is formed as shown in Figure 4(b). Thereafter, the same operation is repeated until all structural layers SL that constitute the three-dimensional structure to be formed on the workpiece W are formed. As a result, as shown in Figure 4(c), the three-dimensional structure ST is formed by a laminated structure in which multiple structural layers SL are stacked along the Z axis (i.e., along the direction from the bottom to the top of the molten pool MP).

[0042] Furthermore, after at least one structural layer SL has been formed but before all structural layers SL have been formed, the measuring device 14 may measure the shape of the structure including the formed structural layers SL (for example, the shape of its surface). In this case, the control device 15 may modify at least a portion of the slice data used to form the subsequent structural layers SL based on the measurement results of the measuring device 14.

[0043] (2-2) Alignment operation Next, the alignment operation will be explained. As described above, the alignment operation is an operation to align the workpiece W with the build head 11. More specifically, the alignment operation is an operation to align the workpiece W with the build head 11 so that a desired three-dimensional structure ST can be formed with relatively high accuracy (that is, a three-dimensional structure ST can be formed with relatively small shape errors compared to the ideal three-dimensional structure ST shown by the three-dimensional model data). Alignment of the workpiece W with the build head 11 may mean, for example, controlling (in other words, adjusting or setting) the relative positional relationship between the workpiece W and the build head 11. Alternatively, alignment of the workpiece W with the build head 11 may mean, for example, controlling (in other words, adjusting or setting) the relative positional relationship between the workpiece W and the build position. Furthermore, the alignment of the workpiece W and the build head 11 may mean, for example, controlling (in other words, adjusting or setting) the relative positional relationship between the workpiece W and the molten pool, controlling (in other words, adjusting or setting) the relative positional relationship between the workpiece W and the irradiation area EA, or controlling (in other words, adjusting or setting) the relative positional relationship between the workpiece W and the supply area MA.

[0044] In this embodiment, the alignment operation includes a head movement operation that moves the build head 11 to the build start position Ch_start in the head coordinate system Ch. The head coordinate system Ch is a three-dimensional coordinate system that indicates the position of the build head 11. The position within the head coordinate system Ch is determined using the coordinate Xh along the X-axis of the head coordinate system Ch, the coordinate Yh along the Y-axis of the head coordinate system Ch, and the coordinate Zh along the Z-axis of the head coordinate system Ch. In other words, the position within the head coordinate system Ch is determined by the coordinates (Xh, Yh, Zh). Such a head coordinate system Ch is mainly used by the control device 15 that controls the head drive system 12 when the head drive system 12 moves the build head 11 to determine (in other words, represent) the position of the build head 11.

[0045] The molding start position Ch_start is the position of the build head 11 that allows light EL to be irradiated onto the molding start position Cs_start on the molding surface MS, which corresponds to the surface of the workpiece W, where molding (i.e., additional processing) should begin. In the following explanation, the molding surface MS, which corresponds to the surface of the workpiece W, will be referred to as the "workwork molding surface MSW" to distinguish it from the molding surface MS, which corresponds to the surface of the structural layer SL. In other words, the molding start position Ch_start is the position of the build head 11 that allows the irradiation area EA to be set at the molding start position Cs_start on the workwork molding surface MSW (in other words, to form a molten pool MP or perform additional processing). The molding start position Ch_start may also be the position of the build head 11 that allows the supply area MA to be set at the molding start position Cs_start on the workwork molding surface MSW.

[0046] The starting position Cs_start is the position in the stage coordinate system Cs, which is based on the stage 23 that holds the workpiece W. The stage coordinate system Cs is a three-dimensional coordinate system based on the stage 13. Therefore, the position within the stage coordinate system Cs is determined using the coordinates Xs along the X-axis of the stage coordinate system Cs, Ys along the Y-axis of the stage coordinate system Cs, and Zs along the Z-axis of the stage coordinate system Cs. In other words, the position within the stage coordinate system Cs is determined by the coordinates (Xs, Ys, Zs). The stage coordinate system Cs is primarily used by the measuring device 14 (and furthermore, the control device 15 that processes the measurement results of the measuring device 14) to determine (in other words, represent) the position of the object to be measured on the stage 13 when the measuring device 14 measures the characteristics of the object to be measured on the stage 13.

[0047] Here, we will explain the technical reasons for performing this alignment operation. First, let's consider a scenario where additional machining is performed on a workpiece W. In this case, the control device 15 can determine the position of the workpiece W within the stage coordinate system Cs from the measurement results of the measuring device 14. As a result, the control device 15 can determine the starting position Cs_start on the workpiece molding surface MSW within the stage coordinate system Cs. On the other hand, the control device 15 may not be able to determine the starting position Ch_start with relative high accuracy based on the starting position Cs_start. This is because the relationship between the head coordinate system Ch and the stage coordinate system Cs is not always an ideal relationship. Here, the ideal relationship may mean, for example, that the positional relationship between the origin of the head coordinate system Ch and the origin of the stage coordinate system Cs never changes, that the scale of the head coordinate system Ch and the scale of the stage coordinate system Cs are always the same, and that the X, Y, and Z axes of the head coordinate system Ch are always parallel to the X, Y, and Z axes of the stage coordinate system Cs, respectively. In other words, the ideal relationship referred to here may mean, for example, that the stage coordinate system Cs does not translate relative to the head coordinate system Ch, does not expand or contract relative to the head coordinate system Ch, and does not rotate relative to the head coordinate system Ch. If there exists an ideal printing system in which the relationship between the head coordinate system Ch and the stage coordinate system Cs is always ideal, then the control device 15 can determine the printing start position Ch_start from the printing start position Cs_start with relatively high accuracy based on the ideal relationship between the head coordinate system Ch and the stage coordinate system Cs. However, in reality, the relationship between the head coordinate system Ch and the stage coordinate system Cs may fluctuate. For example, if at least one of the following occurs: mounting error of the printing head 11, fluctuation in the mounting position of the printing head 11 (e.g., looseness), or deterioration in the performance of the printing head 11, the relationship between the head coordinate system Ch and the stage coordinate system Cs may fluctuate.In particular, if at least one of the following occurs, the relationship between the head coordinate system Ch and the stage coordinate system Cs may change: mounting error of the irradiation system 111, variation in the mounting position of the irradiation system 111 (e.g., looseness), deterioration of the performance of the irradiation system 111, mounting error of the material nozzle 112, variation in the mounting position of the material nozzle 111 (e.g., looseness), damage to the material nozzle 112, or deterioration of the performance of the material nozzle 112. Furthermore, if at least one of the following occurs, for example, mounting error of the stage 13, variation in the mounting position of the stage 13 (e.g., looseness), or change in the shape of the stage 13, the relationship between the head coordinate system Ch and the stage coordinate system Cs may change. Furthermore, if, for example, the head drive system 12 is reset (i.e., restarted), the relationship between the head coordinate system Ch and the stage coordinate system Cs may change. When the relationship between the head coordinate system Ch and the stage coordinate system Cs deviates from its ideal relationship, the light EL from the build head 11 located at a certain position in the head coordinate system Ch may not necessarily irradiate the same position in the stage coordinate system Cs, compared to when the relationship between the head coordinate system Ch and the stage coordinate system Cs is ideal. Therefore, even if the control device 15 identifies the build start position Cs_start within the stage coordinate system Cs, it may not be able to relatively accurately identify the build start position Ch_start, which is the position of the build head 11 capable of irradiating the build start position Cs_start with light EL, based on the identified build start position Cs_start. In other words, even if the control device 15 identifies the build start position Cs_start within the stage coordinate system Cs, it may not be able to appropriately move the build head 11 to the build start position Ch_start corresponding to the identified build start position Cs_start within the head coordinate system Ch. Specifically, for example, even if the control device 15 identifies a printing start position Cs_start within the stage coordinate system Cs, it may move the printing head 11 to a position in the head coordinate system Ch that is different from the printing start position Ch_start corresponding to the identified printing start position Cs_start. As a result, the shape accuracy of the formed three-dimensional structure ST may deteriorate.

[0048] Therefore, in this embodiment, the molding system 1 performs a positioning operation under the control of the control device 15 with the aim of appropriately moving the molding head 11 to the molding start position Ch_start, which corresponds to the molding start position Cs_start. After that, the molding system 1 starts additional machining on the workpiece W after the molding head 11 is positioned at the molding start position Ch_start. For this reason, the molding system 1 performs a positioning operation before starting the molding operation to perform additional machining on the workpiece W.

[0049] In this embodiment, the alignment operation includes not only the head movement operation described above, but also an initial setup operation that corresponds to the preparatory operation for performing the head movement operation described above. For this reason, the initial setup operation and the head movement operation will be described in order below.

[0050] (2-2-1) Initial Setup Operation First, the initial setup operation, which is part of the alignment operation, will be explained. The initial setup operation includes the operation of associating (in other words, linking) the head coordinate system Ch and the stage coordinate system Cs. Specifically, the initial setup operation includes the operation of associating the position in the head coordinate system Ch with the position in the stage coordinate system Cs. As an example, the initial setup operation may include the operation of associating the position of the build head 11 in the head coordinate system Ch with the position of the build object formed on the stage 13 by the build head 11 in the stage coordinate system Cs.

[0051] In this embodiment, the operation of associating the head coordinate system Ch with the stage coordinate system Cs may include the operation of calculating a transformation matrix T that can convert a position in the head coordinate system Ch, specified by coordinates (Xh, Yh, Zh), to a position in the stage coordinate system Cs, specified by coordinates (Xs, Ys, Zs), and / or convert a position in the stage coordinate system Cs to a position in the head coordinate system Ch. In other words, the operation of associating the head coordinate system Ch with the stage coordinate system Cs is (Xh, Yh, Zh) = T × (Xs, Ys, Zs) and (Xs, Ys, Zs) = T -1The process may include calculating a transformation matrix T that satisfies the relationship ×(Xh, Yh, Zh). The transformation matrix T includes a scaling matrix that enlarges or reduces either the position in the head coordinate system Ch or the position in the stage coordinate system Cs to transform it into the other position in the head coordinate system Ch or the position in the stage coordinate system Cs. However, the transformation matrix T may include, in addition to or instead of the scaling matrix, a translation matrix that translates either the position in the head coordinate system Ch or the position in the stage coordinate system Cs to transform it into the other position in the head coordinate system Ch or the position in the stage coordinate system Cs. The transformation matrix T may include, in addition to or instead of the scaling matrix, a rotation matrix that rotates either the position in the head coordinate system Ch or the position in the stage coordinate system Cs to transform it into the other position in the head coordinate system Ch or the position in the stage coordinate system Cs. Furthermore, the transformation matrix T may include, in addition to or instead of the matrices for at least one of scaling, translation, and rotation, a matrix for orthogonality. The process of calculating the transformation matrix T will be described below with reference to Figure 5.

[0052] As shown in Figure 5, first, mark members FM are placed in each of the multiple mark regions 134 of stage 13 (step S111). Mark members FM are materials that can be melted in at least part by irradiation with light EL. Mark members FM are materials that can form a molten pool MP in at least part by irradiation with light EL. Mark members FM are materials that can form a molded object in at least part by irradiation with light EL. Mark members FM are, for example, plate-shaped materials, but may be materials of any other shape. The size of the mark members FM may be the same as the size of the mark region 134, or it may be smaller or larger. During the initial setup operation, a workpiece W may or may not be placed on stage 13.

[0053] Subsequently, the control device 15 designates one of the multiple mark regions 134 as the designated mark region 134d, where the mark member FM for forming the test mark TM is located (step S121). The control device 15 may designate all of the multiple mark regions 134 as the designated mark region 134d, or it may designate some of the multiple mark regions 134 as the designated mark region 134d. Subsequently, the control device 15 identifies the position Chfm of the build head 11 in the head coordinate system Ch where additional processing can be performed on the mark member FM located in the designated mark region 134d (step S122). Specifically, the multiple mark regions 134 are set at predetermined positions (i.e., known positions) on the upper surface 131 of the stage 13. In other words, the designated mark region 134d is also set at a predetermined position (i.e., a known position) on the upper surface 131 of the stage 13. Therefore, the position Csfm of the designated mark area 134d within the stage coordinate system Cs (for example, the position Csfm of the center, edge, or any other arbitrary part of the designated mark area 134d) is known information to the control device 15. On the other hand, as described above, because the relationship between the head coordinate system Ch and the stage coordinate system Cs changes in the molding system 1, it is not easy for the control device 15 to relatively accurately determine the position Chfm of the molding head 11 that can perform additional processing on the mark member FM placed in the designated mark area 134d based on the position Csfm of the designated mark area 134d. However, in the initial setup operation, it is sufficient for the molding system 1 to be able to form a test mark TM somewhere on the mark member FM (for example, any position on the upper surface of the mark member FM). In other words, the molding system 1 does not need to control the formation position of the test mark TM on the mark member FM with relatively high precision. Therefore, the control device 15 assumes that the relationship between the head coordinate system Ch and the stage coordinate system Cs is ideal, and based on the position Csfm of the designated mark area 134d, it can determine (in this case, essentially estimate) the position Chfm of the build head 11 that can perform additional processing on the mark member FM placed in the designated mark area 134d.

[0054] However, if the relationship between the head coordinate system Ch and the stage coordinate system Cs is not ideal (in particular, if it deviates significantly from the ideal relationship), the printing system 1 may not be able to form a test mark TM on the mark member FM. In other words, the printing system 1 may form the test mark TM at a location far from the mark member FM. Therefore, the size of the mark area 134 (in particular, the size along the XY plane) may be set to be large enough so that the printing head 11 located at position Chfm can form a test mark TM on the mark member FM placed in the designated mark area 134d, even if the relationship between the head coordinate system Ch and the stage coordinate system Cs deviates from the ideal relationship (in particular, if it deviates to an extent that may occur in the actual printing system 1, the same applies hereafter). Similarly, the size of the mark member FM (in particular, the size along the XY plane) may be set to be large enough so that the printing head 11 located at position Chfm can form a test mark TM on the mark member FM placed in the designated mark area 134d, even if the relationship between the head coordinate system Ch and the stage coordinate system Cs deviates from the ideal relationship.

[0055] Furthermore, if the position Csfm of the designated mark area 134d is known information, then the position Chfm of the build head 11 capable of performing additional processing on the mark member FM placed in the designated mark area 134d may also be known information. For this reason, the control device 15 may store information regarding the position Csfm of the mark area 134 and the position Chfm of the build head 11 corresponding to the position Csfm of the mark area 134. In this case, instead of identifying the position Chfm of the build head 11 in step S122, the control device 15 may identify the position Chfm of the build head 11 from the stored information.

[0056] Subsequently, the control device 15 controls the head drive system 12 to move the build head 11 to the position Chfm identified in step S122 (step S123). After the build head 11 reaches position Chfm, the build system 1, under the control of the control device 15, forms a test mark TM on the mark member FM located in the designated mark area 134d (step S124). The build system 1 forms the test mark TM using a method similar to the method for forming at least one of the above-described build objects, structural layers SL, and three-dimensional structures ST (for example, the method shown in Figures 3(a) to 4(c)). In other words, the test mark TM may be a structure similar to the above-described build object, a structure similar to the above-described aggregate of build objects, a structure similar to the above-described structural layer SL, or a structure similar to the above-described three-dimensional structure ST formed by stacking multiple structural layers SL. However, when identifying the position of the test mark TM in steps S131 to S132 described later, the mark may have at least one of a specific shape and dimensions so that the test mark TM can be uniquely identified from the object to be measured indicated by the measurement result of the measuring device 14.

[0057] Subsequently, the control device 15 determines whether or not test marks TM have been formed on all of the multiple mark members FM that are each placed in the multiple mark regions ME set on the stage 13 (step S125). If the determination in step S125 determines that no test marks TM have been formed on any of the mark members FM (step S125: No), the control device 15 repeats the process from step S121 onwards. That is, the control device 15 designates one of the multiple mark regions 134 that has not yet been designated as a designated mark region 134d as the new designated mark region 134d (step S121). Subsequently, the control device 15 performs the process of forming test marks TM on the newly designated designated mark region 134d (steps S122 to S124).

[0058] On the other hand, if the determination in step S125 determines that test marks TM have been formed on all mark members FM (step S125: Yes), the measuring device 14 measures the state of the object on the stage 13 (specifically, the object to be measured, including the test marks TM) (step S131). The measurement results of the measuring device 14 (i.e., information regarding the state of the object to be measured, including the test marks TM) are output to the control device 15. Note that instead of determining that test marks TM have been formed on all mark members FM, the process may proceed to the next step (step S131) ​​if it is determined that test marks TM have been formed on some of the mark members FM among the multiple mark members FM.

[0059] Subsequently, the control device 15 identifies the position Cstm of the formed test mark TM within the stage coordinate system Cs based on the measurement results of the measuring device 14 (step S132). Specifically, since the test mark TM is formed under the control of the control device 15, at least one of the position, shape, and dimensions of the test mark TM is known information to the control device 15. Therefore, the control device 15 can identify the test mark TM from the object being measured based on information about the state of the object being measured (in particular, at least one of the position, shape, and dimensions) measured by the measuring device 14. For example, the control device 15 can identify the test mark TM from the object being measured using a pattern matching method or the like. Subsequently, the control device 15 identifies the position Cstm of the identified test mark TM within the stage coordinate system Cs.

[0060] Subsequently, the control device 15 calculates a transformation matrix T that shows the relationship between the head coordinate system Ch and the stage coordinate system Cs based on the position Cstm of the test mark TM identified in step S132 and the position Chfm of the build head 11 when the test mark TM was formed (i.e., the position Chfm of the build head 11 identified in step S122) (step S141). Specifically, since multiple test marks TM are formed, multiple positions Cstm are identified in step S132. Similarly, multiple positions Chfm are identified in step S122. The position Cstm1=(Xstm1, Ystm1, Zstm1) of the first test mark TM among the multiple positions Cstm corresponds to the position Chfm1=(Xhfm1, Yhfm1, Zhfm1) of the build head 11 when the first test mark TM was formed among the multiple positions Chfm. In other words, the relationship (Xhfm1, Yhfm1, Zhfm1) = T × (Xstm1, Ystm1, Zstm1) holds. Similarly, the position Cstm2 = (Xstm2, Ystm2, Zstm2) of the second test mark TM among the multiple positions Cstm corresponds to the position Chfm2 = (Xhfm2, Yhfm2, Zhfm2) of the build head 11 when the second test mark TM was formed among the multiple positions Chfm. In other words, the relationship (Xhfm2, Yhfm2, Zhfm2) = T × (Xstm2, Ystm2, Zstm2) holds. Similarly, the position Cstm3=(Xstm3, Ystm3, Zstm3) of the third test mark TM among the multiple positions Cstm corresponds to the position Chfm3=(Xhfm3, Yhfm3, Zhfm3) of the build head 11 when the third test mark TM is formed among the multiple positions Chfm. In other words, the relationship (Xhfm3, Yhfm3, Zhfm3)=T×(Xstm3, Ystm3, Zstm3) holds. Therefore, the control device 15 can calculate the transformation matrix T by solving the system of equations that hold between these multiple positions Cstm and multiple positions Chfm.

[0061] Since the head coordinate system Ch and the stage coordinate system Cs are both three-dimensional coordinate systems, the printing system 1 may form at least three test marks TM in order to calculate the transformation matrix T. That is, the stage 13 may have at least three mark regions 134. In this case, the at least three mark regions 134 may include two mark regions 134 that are positioned differently along the X-axis of the stage coordinate system Cs. That is, the printing system 1 may form at least two test marks TM that are positioned differently along the X-axis of the stage coordinate system Cs. The at least three mark regions 134 may include two mark regions 134 that are positioned differently along the Y-axis. That is, the printing system 1 may form at least two test marks TM that are positioned differently along the Y-axis of the stage coordinate system Cs. The at least three mark regions 134 may include two mark regions 134 that are positioned differently along the Z-axis. That is, the printing system 1 may form at least two test marks TM that are positioned differently along the Z-axis of the stage coordinate system Cs. In the example shown in Figure 2 above, stage 13 has three mark areas 134#1 to 134#3. Furthermore, in the example shown in Figure 2, stage 13 has two mark areas 134#1 and 134#2 (or two mark areas 134#2 and 134#3) that are positioned differently along the X-axis, three mark areas 134#1 to 134#3 that are positioned differently along the Y-axis, and two mark areas 134#1 and 134#3 (or two mark areas 134#2 and 134#3) that are positioned differently along the Z-axis.

[0062] Once the transformation matrix T is calculated, the control device 15 can transform the position (Xh, Yh, Zh) in the head coordinate system Ch to the corresponding position (Xs, Ys, Zs) in the stage coordinate system Cs. Similarly, the control device 15 can transform the position (Xs, Ys, Zs) in the stage coordinate system Cs to the corresponding position (Xh, Yh, Zh) in the head coordinate system Ch. Furthermore, the transformation matrix T is calculated based on the test marks TM formed by the actual additional processing performed by the molding system 1 on the stage 13. In other words, the transformation matrix T is calculated based on the actual position Chfm of the molding head 11 in the head coordinate system Ch and the actual position Cstm of the test marks TM in the stage coordinate system Cs. Therefore, the transformation matrix T reflects the actual relationship between the head coordinate system Ch and the stage coordinate system Cs. In other words, even if the actual relationship between the head coordinate system Ch and the stage coordinate system Cs differs from the ideal relationship, the transformation matrix T reflects the actual relationship between the position of the build head 11 in the head coordinate system Ch and the position of the object on the stage 13 in the stage coordinate system Cs. Therefore, the control device 15 can use the transformation matrix T to perform relatively high-precision mutual conversion between the position in the head coordinate system Ch and the position in the stage coordinate system Cs.

[0063] After the transformation matrix T is calculated (or after the state of the test mark TM is measured), the mark member FM is removed from the mark area 134 (step S151). In other words, the mark member FM is a member that can be replaced each time an initial setup operation is performed. Note that the mark member FM may remain in the mark area 134 until the next initial setup operation is performed. Also, the same mark member FM may be used for multiple initial setup operations.

[0064] The control device 15 performs such initial setup operations at a desired timing. For example, the control device 15 may perform an initial setup operation each time the molding system 1 starts operating (for example, when the power to the molding system 1 is turned on). For example, the control device 15 may perform an initial setup operation each time a workpiece W is placed on the stage 13. For example, the control device 15 may perform an initial setup operation before or after the workpiece W is placed on the stage 13. For example, the control device 15 may perform an initial setup operation each time additional processing is completed on one or more workpieces W. For example, the control device 15 may perform an initial setup operation each time a certain amount of time has elapsed since the molding system 1 started operating. For example, the control device 15 may perform an initial setup operation each time an instruction to perform an initial setup operation is input from the operator of the molding system 1.

[0065] (2-2-2) Head movement Next, we will explain the head movement operation, which is part of the alignment process. As mentioned above, the head movement operation is the operation to move the build head 11 to the build start position Ch_start. The head movement operation will be explained below with reference to Figure 6.

[0066] As shown in Figure 6, first, the workpiece W to be subjected to additional processing is placed on the stage 13 (step S211). The stage 13 holds the workpiece W via the holding area 132.

[0067] Subsequently, the control device 15 designates one of the multiple mark regions 134 as the designated mark region 134d where the mark member FM for forming the test mark TM should be placed (step S221). The control device 15 may designate all of the multiple mark regions 134 as the designated mark region 134d, or it may designate some of the multiple mark regions 134 as the designated mark region 134d. After that, the mark member FM is placed in the designated mark region 134d.

[0068] Subsequently, the control device 15 identifies the position Chfm of the build head 11 capable of performing additional processing on the mark member FM located in the designated mark area 134d within the head coordinate system Ch (step S222). Specifically, even during head movement, the control device 15 identifies the position Chfm of the build head 11 using the method used in the initial setup operation described above. In other words, the control device 15 identifies (estimates) the position Chfm of the build head 11 capable of performing additional processing on the mark member FM located in the designated mark area 134d based on the position Csfm of the designated mark area 134d, by assuming that the relationship between the head coordinate system Ch and the stage coordinate system Cs is an ideal relationship. However, the control device 15 may also identify the position Chfm of the build head 11 capable of performing additional processing on the mark member FM located in the designated mark area 134d by transforming the known information, the position Csfm of the designated mark area 134d, using the transformation matrix T calculated in the initial setup operation.

[0069] Subsequently, the control device 15 controls the head drive system 12 to move the build head 11 to the position Chfm identified in step S222 (step S223). After the build head 11 reaches position Chfm, the build system 1, under the control of the control device 15, forms a test mark TM on the mark member FM located in the designated mark area 134d (step S224). The test mark TM formed during the head movement operation may be the same as or different from the test mark TM formed during the initial setup operation described above.

[0070] Subsequently, the measuring device 14 measures the state of the object on the stage 13 (specifically, the object to be measured, including the test mark TM and the workpiece W) (step S231). The measurement results from the measuring device 14 (i.e., information regarding the state of the object to be measured, including the test mark TM and the workpiece W) are output to the control device 15.

[0071] Subsequently, the control device 15 determines the position Cstm of the formed test mark TM within the stage coordinate system Cs based on the measurement results of the measuring device 14 (step S232). Specifically, the control device 15 determines the position Cstm of the test mark TM using the method used in the initial setup operation described above.

[0072] Furthermore, based on the measurement results of the measuring device 14, the control device 15 identifies the printing start position Cs_start where printing should begin on the workpiece printing surface MSW within the stage coordinate system Cs (step S232). Specifically, the control device 15 can identify the position of the workpiece W within the stage coordinate system Cs from the measurement results of the measuring device 14. Furthermore, based on the 3D model data of the 3D structure ST to be formed, the control device 15 can identify how to form the 3D structure ST on the workpiece W. Once it is determined how to form the 3D structure ST on the workpiece W, the position where the first object should be formed to form the 3D structure ST (for example, the position where the first object should be formed to form the first structural layer SL#1) can be identified. The position where the first object should be formed to form the 3D structure ST corresponds to the printing start position Cs_start.

[0073] Subsequently, the control device 15 moves the build head 11 to the build start position Ch_start based on the position Cstm of the test mark TM identified in step S232, the position Chfm of the build head 11 when the test mark TM was formed (i.e., the position Chfm of the build head 11 identified in step S222), and the build start position Cs_start identified in step S232 (step S241). The operation of moving the build head 11 to the build start position Ch_start based on the position Cstm of the test mark TM, the position Chfm of the build head 11, and the build start position Cs_start will be described in more detail below with reference to Figure 7.

[0074] The upper part of Figure 7 is a plan view showing the relationship between the position of the test mark TM in the stage coordinate system Cs, Cstm=(Xstm, Ystm, Zstm), and the printing start position Cs_start=(Xs_start, Ys_start, Zs_start). On the other hand, the lower part of Figure 7 is a plan view showing the relationship between the position of the build head 11 in the head coordinate system Ch, Chfm=(Xhfm, Yhfm, Zhfm), and the printing start position Ch_start=(Xh_start, Yh_start, Zh_start).

[0075] As shown in Figure 7, a test mark TM is formed at position Cstm in the stage coordinate system Cs by light EL from the build head 11 located at position Chfm in the head coordinate system Ch. Therefore, the illumination area EA of the light EL from the build head 11 located at position Chfm in the head coordinate system Ch is set to position Cstm in the stage coordinate system Cs. In this case, if the build head 11 moves in the head coordinate system Ch such that the illumination area EA moves from position Cstm to the build start position Cs_start in the stage coordinate system Cs, the build head 11 will be located at the build start position Cs_start.

[0076] Specifically, in the stage coordinate system Cs, the build start position Cs_start is located at a distance of (Xs_start-Xstm) along the X-axis from the position Cstm of the test mark TM. In the stage coordinate system Cs, the build start position Cs_start is located at a distance of (Ys_start-Ystm) along the Y-axis from the position Cstm of the test mark TM. In the stage coordinate system Cs, the build start position Cs_start is located at a distance of (Zs_start-Zstm) along the Z-axis from the position Cstm of the test mark TM. Therefore, if the build head 11, which was located at position Chfm in the head coordinate system Ch, moves within the stage coordinate system Cs such that the irradiation area EA moves a distance of (Xs_start-Xstm) along the X axis, a distance of (Ys_start-Ystm) along the Y axis, and a distance of (Zs_start-Zstm) along the Z axis, then the build head 11 will be located at the build start position Cs_start.

[0077] Here, if the build head 11 moves a distance of (Xs_start-Xstm) along the X-axis, a distance of (Ys_start-Ystm) along the Y-axis, and a distance of (Zs_start-Zstm) along the Z-axis within the head coordinate system Ch, then there is a possibility that the illumination area EA will move from position Cstm to the build start position Cs_start within the stage coordinate system Cs. However, as mentioned above, the relationship between the head coordinate system Ch and the stage coordinate system Cs is not always ideal. Therefore, even if the build head 11 moves a distance of (Xs_start-Xstm) along the X-axis within the head coordinate system Ch, it does not necessarily mean that the illumination area EA will move a distance of (Xs_start-Xstm) along the X-axis within the stage coordinate system Cs. Similarly, even if the build head 11 moves along the Y-axis by a distance of (Ys_start-Ystm) in the head coordinate system Ch, the illumination area EA does not necessarily move along the Y-axis by the same distance in the stage coordinate system Cs. Similarly, even if the build head 11 moves along the Z-axis by a distance of (Zs_start-Zstm) in the head coordinate system Ch, the illumination area EA does not necessarily move along the Z-axis by the same distance in the stage coordinate system Cs. Therefore, the control device 15 uses a transformation matrix T to convert the amount and direction of movement of the illumination area EA, which moves from the position Cstm of the test mark TM to the build start position Cs_start in the stage coordinate system Cs, into the amount and direction of movement of the build head 11 in the head coordinate system Ch. After that, the control device 15 moves the build head 11, which is located at position Chfm in the head coordinate system Ch, in the direction of movement obtained by the transformation by the amount of movement obtained by the transformation. As a result, the build head 11 will be positioned at the build start position Ch_start, which allows the irradiation area EA to be set to the build start position Cs_start.

[0078] Thus, in this embodiment, the control device 15 can appropriately move the build head 11 to the build start position Ch_start. In other words, the control device 15 can move the build head 11 so that the position of the build head 11 in the head coordinate system Ch after the move coincides with (or approaches) the build start position Ch_start. To put it another way, the control device 15 can move the build head 11 so that the irradiation area EA, to which the light EL from the build head 11 after the move is irradiated, is set to the build start position Cs_start. The control device 15 may also move the build head 11 so that the molten pool MP formed by the light EL from the build head 11 after the move is set to the build start position Cs_start, or it may move the build head 11 so that the supply position MA from the build head 11 after the move is set to the build start position Cs_start.

[0079] The control device 15 performs such head movement operations at desired timings. For example, the control device 15 may perform a head movement operation each time a workpiece W is placed on the stage 13. For example, the control device 15 may perform a head movement operation each time additional processing is completed on one or more workpieces W. For example, the control device 15 may perform a head movement operation each time a certain amount of time has elapsed since the molding system 1 was activated. For example, the control device 15 may perform a head movement operation each time an instruction to perform a head movement operation is received from the operator of the molding system 1. For example, the control device 15 may perform a head movement operation each time an initial setup operation is performed. In other words, the control device 15 may perform a head movement operation at the same frequency as the initial setup operation is performed. For example, the control device 15 may perform a head movement operation at a less frequent frequency than the initial setup operation is performed. For example, the control device 15 may perform a head movement operation at a more frequent frequency than the initial setup operation is performed.

[0080] Furthermore, the control device 15 may use a transformation matrix T to transform the printing start position Cs_start in the stage coordinate system Cs into the printing start position Ch_start in the head coordinate system Ch, and then move the printing head 11 to the printing start position Ch_start obtained by this transformation. In particular, if the transformation matrix T includes all of the above-mentioned translation matrix, scaling matrix, and rotation matrix, the control device 15 may use the transformation matrix T to identify the printing start position Ch_start and then move the printing head 11 to the identified printing start position Ch_start. Even in this case, the control device 15 can move the printing head 11 to the printing start position Ch_start appropriately.

[0081] (3) Variant Next, we will describe a modified version of the molding system 1.

[0082] (3-1) First variation First, the first modified example will be described. In the first modified example, the head movement operation differs from the head movement operation described above. Specifically, the head movement operation in the first modified example is the operation to move the build head 11 to the build start position Ch_start, similar to the head movement operation described above. However, the head movement operation in the first modified example differs from the head movement operation described above in that it forms multiple types of test marks TM and moves the build head 11 to the build start position Ch_start based on the position Cstm of any one of these multiple types of test marks TM. The head movement operation in the first modified example will be described below with reference to Figures 8 to 10. Note that for processes that are the same as the head movement operation described above, the same step number will be used and a detailed explanation will be omitted.

[0083] As shown in Figure 8, first, the workpiece W to be subjected to additional processing is placed on the stage 13 (step S211). Furthermore, the control device 15 designates one of the multiple mark regions 134 as the designated mark region 134d where the mark member FM for forming the test mark TM should be placed (step S221). The control device 15 may designate all of the multiple mark regions 134 as the designated mark region 134d, or it may designate some of the multiple mark regions 134 as the designated mark region 134d. In this case, the mark member FM is placed in the designated mark region 134d.

[0084] As described above, in the first modified example, multiple types of test marks TM are formed on the mark member FM located in the designated mark area 134d. Specifically, multiple test marks TM are formed with different movement directions of the build head 11 (particularly the movement direction along the XY plane of the head coordinate system Ch) during the period in which the test marks TM are formed. For example, a test mark TM formed by the build head 11 moving in a first direction and a test mark TM formed by the build head 11 moving in a second direction different from the first direction (for example, intersecting the first direction or moving in the opposite direction to the first direction) are formed. For example, a test mark TM formed by the build head 11 moving in a first direction, a test mark TM formed by the build head 11 moving in a second direction, and a test mark TM formed by the build head 11 moving in a third direction different from the first and second directions (for example, intersecting at least one of the first and second directions or moving in the opposite direction to at least one of the first and second directions) are formed. For example, a test mark TM is formed by a build head 11 moving in a first direction, a test mark TM is formed by a build head 11 moving in a second direction, a test mark TM is formed by a build head 11 moving in a third direction, and a test mark TM is formed by a build head 11 moving in a fourth direction that is different from the first to third directions (for example, intersecting at least one of the first to third directions, or opposite to at least one of the first to third directions).

[0085] The test mark TM formed by the build head 11 moving in the first direction is a linear test mark TM extending along the workpiece build surface MSW in the first direction (or the fifth direction in the stage coordinate system Cs, corresponding to the first direction in the head coordinate system Ch). The test mark TM formed by the build head 11 moving in the second direction is a linear test mark TM extending along the workpiece build surface MSW in the second direction (or the sixth direction in the stage coordinate system Cs, corresponding to the second direction in the head coordinate system Ch). The test mark TM formed by the build head 11 moving in the third direction is a linear test mark TM extending along the workpiece build surface MSW in the third direction (or the seventh direction in the stage coordinate system Cs, corresponding to the third direction in the head coordinate system Ch). The test marks TM formed by the build head 11 moving in the fourth direction are linear test marks TM that extend along the workpiece build surface MSW in the fourth direction (or the eighth direction in the stage coordinate system Cs, which corresponds to the fourth direction in the head coordinate system Ch). Therefore, in the first modified example, it can be said that multiple test marks TM with different extension directions along the workpiece build surface MSW are formed. Note that the extension directions of the multiple test marks TM do not have to be along the workpiece build surface MSW.

[0086] As an example, Figure 11 shows an example in which test marks TM(+X), test mark TM(-X), test mark TM(+Y), and test mark TM(-Y) are formed. Test mark TM(+X) is a test mark TM formed by the build head 11 moving along the X axis of the head coordinate system Ch and toward the +X side of the head coordinate system Ch. Test mark TM(-X) is a test mark TM formed by the build head 11 moving along the X axis of the head coordinate system Ch and toward the -X side of the head coordinate system Ch. Test mark TM(+Y) is a test mark TM formed by the build head 11 moving along the Y axis of the head coordinate system Ch and toward the +Y side of the head coordinate system Ch. Test mark TM(-Y) is a test mark TM formed by the build head 11 moving along the Y axis of the head coordinate system Ch and toward the -Y side of the head coordinate system Ch. In the following explanation, for the sake of clarity, we will describe the head movement that forms the four types of test marks TM shown in Figure 11 (i.e., test mark TM(+X), test mark TM(-X), test mark TM(+Y), and test mark TM(-Y)). However, during the head movement, a different number of test marks TM of different shapes and / or extending in different directions may be formed than the four types of test marks TM shown in Figure 11.

[0087] Again in Figure 8, after specifying the designated mark area 134d, the control device 15 determines the position Chfm(+X) of the build head 11 when it begins to form the test mark TM(+X) on the mark member FM located in the designated mark area 134d within the head coordinate system Ch (step S3221). Note that the method for determining the position Chfm(+X) in step S3221 may be the same as the method for determining the position Chfm in step S222 of Figure 6 described above. In other words, the control device 15 may determine the position Chfm(+X) of the build head 11 when it begins to form the test mark TM(+X) based on the position Csfm(+X) when it begins to form the test mark TM(+X) within the designated mark area 134d, by assuming that the relationship between the head coordinate system Ch and the stage coordinate system Cs is an ideal relationship. The same applies to the methods for determining the position Chfm(-X) in step S3222, the method for determining the position Chfm(+Y) in step S3223, and the method for determining the position Chfm(-Y) in step S3224, which will be described later.

[0088] Subsequently, the control device 15 controls the head drive system 12 to move the build head 11 to the position Chfm(+X) identified in step S3221 (step S3231). After the build head 11 reaches position Chfm(+X), the build system 1, under the control of the control device 15, moves the build head 11 along the X axis of the head coordinate system Ch and toward the +X side of the head coordinate system Ch, forming a test mark TM(+X) on the mark member FM located in the designated mark area 134d (step S3241).

[0089] Furthermore, as shown in Figure 8, before or after the process for forming the test mark TM(+X), the control device 15 determines the position Chfm(-X) of the build head 11 in the head coordinate system Ch when it begins to form the test mark TM(-X) on the mark member FM located in the designated mark area 134d (step S3222). Subsequently, the control device 15 controls the head drive system 12 to move the build head 11 to the position Chfm(-X) determined in step S3222 (step S3232). After the build head 11 reaches position Chfm(-X), the build system 1, under the control of the control device 15, forms the test mark TM(-X) on the mark member FM located in the designated mark area 134d while moving the build head 11 along the X axis of the head coordinate system Ch and toward the -X side of the head coordinate system Ch (step S3242).

[0090] Furthermore, as shown in Figure 9, before or after the process for forming at least one of the test mark TM(+X) and test mark TM(-X), the control device 15 determines the position Chfm(+Y) of the build head 11 in the head coordinate system Ch when it begins to form the test mark TM(+Y) on the mark member FM located in the designated mark area 134d (step S3223). Subsequently, the control device 15 controls the head drive system 12 to move the build head 11 to the position Chfm(+Y) determined in step S3223 (step S3233). After the build head 11 reaches position Chfm(+Y), the build system 1, under the control of the control device 15, forms the test mark TM(+Y) on the mark member FM located in the designated mark area 134d while moving the build head 11 along the Y axis of the head coordinate system Ch and toward the +Y side of the head coordinate system Ch (step S3243).

[0091] Furthermore, as shown in Figure 9, before or after the process for forming at least one of the test marks TM(+X), test mark TM(-X), and test mark TM(+Y), the control device 15 determines the position Chfm(-Y) of the build head 11 in the head coordinate system Ch when it begins to form the test mark TM(-Y) on the mark member FM located in the designated mark area 134d (step S3224). Subsequently, the control device 15 controls the head drive system 12 to move the build head 11 to the position Chfm(-Y) determined in step S3224 (step S3234). After the build head 11 reaches position Chfm(-Y), the build system 1, under the control of the control device 15, forms the test mark TM(-Y) on the mark member FM located in the designated mark area 134d while moving the build head 11 along the Y axis of the head coordinate system Ch and toward the -Y side of the head coordinate system Ch (step S3244).

[0092] Subsequently, as shown in Figure 10, the measuring device 14 measures the state of the object on the stage 13 (specifically, the object to be measured, including the four types of test marks TM and the workpiece W) (step S331). The measurement results from the measuring device 14 (i.e., information regarding the state of the object to be measured, including the four types of test marks TM and the workpiece W) are output to the control device 15.

[0093] Subsequently, the control device 15 identifies the positions Cstm of the four types of test marks TM formed within the stage coordinate system Cs based on the measurement results of the measuring device 14 (step S332). In particular, the control device 15 identifies the position of the end of each test mark TM (especially the end corresponding to the first part of each test mark TM to be formed) as position Cstm. Alternatively, the control device 15 may identify the centroid or center position of each test mark TM as position Cstm.

[0094] Specifically, as shown in Figure 11, the test mark TM(+X) is formed by an additive manufacturing process that adds material from the -X end of the test mark TM(+X) toward the +X end. Therefore, the control device 15 identifies the position of the -X end of the test mark TM(+X) as position Cstm(+X). Similarly, the test mark TM(-X) is formed by an additive manufacturing process that adds material from the +X end of the test mark TM(-X) toward the -X end. Therefore, the control device 15 identifies the position of the +X end of the test mark TM(-X) as position Cstm(-X). Similarly, the test mark TM(+Y) is formed by an additive manufacturing process that adds material from the -Y end of the test mark TM(+Y) toward the +Y end. Therefore, the control device 15 identifies the position of the -Y end of the test mark TM(+Y) as position Cstm(+Y). Similarly, the test mark TM(-Y) is formed by an additive manufacturing process that adds material from the +Y end of the test mark TM(-Y) toward the -Y end. For this reason, the control device 15 identifies the position of the +Y end of the test mark TM(-Y) as position Cstm(-Y).

[0095] Furthermore, the control device 15 identifies the printing start position Cs_start on the workpiece printing surface MSW within the stage coordinate system Cs based on the measurement results of the measuring device 14 (step S332). Note that the method for identifying the printing start position Cs_start in step S332 may be the same as the method for identifying the printing start position Cs_start in step S232 of Figure 6 described above.

[0096] Subsequently, the control device 15 moves the build head 11 to the build start position Ch_start (steps S3411 to S3414). In particular in the first modified example, the control device 15 moves the build head 11 to the build start position Ch_start based on the position Cstm of the test mark TM formed by the build head 11, which has moved in the same direction as the movement direction of the build head 11 when the build head 11 starts moving in conjunction with the start of additional machining on the workpiece W. For example, if the build head 11 starts moving along the X axis and toward the +X side in conjunction with the start of additional machining, the control device 15 moves the build head 11 to the build start position Ch_start based on the position Cstm(+X) of the test mark TM(+X). For example, if the build head 11 starts moving along the X axis and toward the -X side in conjunction with the start of additional machining, the control device 15 moves the build head 11 to the build start position Ch_start based on the position Cstm(-X) of the test mark TM(-X). For example, when additive processing begins, the build head 11 starts moving along the X-axis toward the +Y side, the control device 15 moves the build head 11 to the build start position Ch_start based on the position Cstm(+Y) of the test mark TM(+Y). For example, when additive processing begins, the build head 11 starts moving along the X-axis toward the -Y side, the control device 15 moves the build head 11 to the build start position Ch_start based on the position Cstm(-Y) of the test mark TM(-Y).

[0097] In order to move the build head 11 in this manner, the control device 15 first determines in which direction the build head 11 will start moving when the additional processing begins (step S35). The control device 15 determines the direction of movement of the build head 11 when it starts moving when the additional processing begins (step S35). The control device 15 determines in which direction the build head 11, which is located at the build start position Ch_start, will start moving when the additional processing begins (step S35). Specifically, the control device 15 can identify the position of the workpiece W in the stage coordinate system Cs from the measurement results of the measuring device 14. Furthermore, the control device 15 can identify how to form the 3D structure ST on the workpiece W based on the 3D model data of the 3D structure ST to be formed. Once it is determined how the three-dimensional structure ST will be formed on the workpiece W, the movement trajectory of the build head 11 for forming the three-dimensional structure ST (for example, the movement trajectory of the build head 11 for forming the first structural layer SL#1) can be determined. Once the movement trajectory of the build head 11 is determined, the direction of movement of the build head 11 when starting additional processing on the workpiece W can also be determined.

[0098] In step S35, if it is determined that the build head 11 has started moving along the X-axis and toward the +X side, the control device 15 moves the build head 11 to the build start position Ch_start based on the position Cstm(+X) of the test mark TM(+X) identified in step S332, the position Chfm(+X) of the build head 11 when the test mark TM(+X) was formed (i.e., the position Chfm(+X) of the build head 11 identified in step S3221), and the build start position Cs_start identified in step S332 (step S3411). Furthermore, the operation in step S3411 to move the build head 11 to the build start position Ch_start based on the position Cstm(+X) of the test mark TM(+X), the position Chfm(+X) of the build head 11, and the build start position Cs_start may be the same as the operation in step S241 of Figure 6 to move the build head 11 to the build start position Ch_start based on the position Cstm of the test mark TM, the position Chfm of the build head 11, and the build start position Cs_start. For this reason, a detailed explanation will be omitted, but a brief overview will be given below. For example, as shown in Figure 12, the control device 15 determines the amount and direction of movement of the irradiation area EA moving from the position Cstm(+X)=(Xstm(+X), Ystm(+X), Zstm(+X)) of the test mark TM(+X) to the build start position Cs_start. Subsequently, the control device 15 uses the transformation matrix T to convert the amount and direction of movement of the irradiation area EA, which was identified in the stage coordinate system Cs, into the amount and direction of movement of the build head 11 in the head coordinate system Ch. Then, the control device 15 moves the build head 11, which is located at position Chfm(+X) in the head coordinate system Ch, by the amount of movement obtained by the transformation in the direction of movement obtained by the transformation. As a result, the build head 11 is located at the build start position Ch_start.

[0099] In step S35, if it is determined that the build head 11 has started moving along the X-axis and toward the -X side, the control device 15 moves the build head 11 to the build start position Ch_start based on the position Cstm(-X) of the test mark TM(-X) identified in step S332, the position Chfm(-X) of the build head 11 when the test mark TM(-X) was formed (i.e., the position Chfm(-X) of the build head 11 identified in step S3222), and the build start position Cs_start identified in step S332 (step S3412). The operation in step S3412 to move the build head 11 to the build start position Ch_start based on the position Cstm(-X) of the test mark TM(-X), the position Chfm(-X) of the build head 11, and the build start position Cs_start may be the same as the operation in step S241 of Figure 6 described above to move the build head 11 to the build start position Ch_start based on the position Cstm of the test mark TM, the position Chfm of the build head 11, and the build start position Cs_start. The same applies to steps S3413 and S3414 described later.

[0100] In step S35, if it is determined that the build head 11 has started moving along the Y axis and toward the +Y side, the control device 15 moves the build head 11 to the build start position Ch_start based on the position Cstm(+Y) of the test mark TM(+Y) identified in step S332, the position Chfm(+Y) of the build head 11 when the test mark TM(+Y) was formed (i.e., the position Chfm(+Y) of the build head 11 identified in step S3223), and the build start position Cs_start identified in step S332 (step S3413).

[0101] In step S35, if it is determined that the build head 11 has started moving along the Y axis and toward the -Y side, the control device 15 moves the build head 11 to the build start position Ch_start based on the position Cstm(-Y) of the test mark TM(-Y) identified in step S332, the position Chfm(-Y) of the build head 11 when the test mark TM(-Y) was formed (i.e., the position Chfm(-Y) of the build head 11 identified in step S3224), and the build start position Cs_start identified in step S332 (step S3414).

[0102] Thus, in the first modified example, as described above, the control device 15 can appropriately move the build head 11 to the build start position Ch_start. In other words, the control device 15 can move the build head 11 so that its position in the head coordinate system Ch after the move coincides with (or approaches) the build start position Ch_start. To put it another way, the control device 15 can move the build head 11 so that the illumination area EA, to which the light EL from the build head 11 after the move is irradiated, is set to the build start position Cs_start.

[0103] In the first modified example, even if the position of the printed object on the workpiece W changes due to differences in the direction of movement of the build head 11, the build head 11 can be appropriately moved to the build start position Ch_start so that the printed object can be formed in an appropriate position on the workpiece W. Specifically, depending on the characteristics of the head drive system 12, the relative positional relationship between the position of the build head 11 in the head coordinate system Ch and the position of the printed object formed by the build head 11 in the stage coordinate system Cs may change depending on the direction of movement of the build head 11. For example, the relative positional relationship between the position of the build head 11 in the head coordinate system Ch and the position of the printed object formed by the build head 11 in the stage coordinate system Cs when the build head 11 is moving in a first direction may be different from the relative positional relationship between the position of the build head 11 in the head coordinate system Ch and the position of the printed object formed by the build head 11 in the stage coordinate system Cs when the build head 11 is moving in a second direction. In this case, the position in the stage coordinate system Cs of the object formed by the build head 11, which starts moving in a first direction from a certain position in the head coordinate system Ch (in particular, the position in the stage coordinate system Cs of the end portion of the object corresponding to the starting part of the build), may not match the position in the stage coordinate system Cs of the object formed by the build head 11, which starts moving in a second direction from the same position in the head coordinate system Ch. As a result, the shape accuracy of the three-dimensional structure ST, which is an assembly of the built objects, may deteriorate. However, in the first modified example, the control device 15 moves the build head 11 to the build start position Ch_start based on the positions of multiple test marks TM each formed by the build head 11 moving in multiple different directions. Therefore, even if the relative positional relationship between the position of the build head 11 in the head coordinate system Ch and the position of the object formed by the build head 11 in the stage coordinate system Cs changes depending on the direction of movement of the build head 11, the build head 11 can still form an appropriate object from the build start position Cs_start in the stage coordinate system Cs. As a result, deterioration of the shape accuracy of the 3D structure ST is appropriately suppressed.

[0104] Furthermore, in the first modified example, the position Cstm of the test mark TM formed by the build head 11, which has moved in a direction different from the direction of movement of the build head 11 when the build head 11 starts moving in conjunction with the start of additional processing on the workpiece W, may be used. For example, when the build head 11 starts moving along a direction 45 degrees with respect to the X and Y axes and toward the +X and +Y sides in conjunction with the start of additional processing, the control device 15 may move the build head 11 to the build start position Ch_start based on the position Cstm(+X) of the test mark TM(+X) and the position Cstm(+Y) of the test mark TM(+Y). When the build head 11 starts moving along a 45-degree direction with respect to the X and Y axes and toward the +X and +Y sides as additive processing begins, the average values ​​of the positions Cstm(+X) of the test mark TM(+X) and Cstm(+Y) of the test mark TM(+Y) may be used. If the direction is not 45 degrees, the weighted average of the positions Cstm(+X) and Cstm(+Y) of the test mark TM(+Y) may be used. In this way, statistics of the positions Cstm of multiple test marks TM may be used.

[0105] In the above description, multiple types of test marks TM are formed on the same mark member 134 located in the designated mark area 134d. However, some of the multiple types of test marks TM may be formed on a first mark member FM-1 located in the first designated mark area 134d-1, and other parts of the multiple types of test marks TM may be formed on a second mark member FM-2 located in a second designated mark area 134d-2, which is different from the first designated mark area 134d-1.

[0106] Furthermore, in the above explanation, the shapes of each test mark TM(+X), TM(-X), TM(+Y), and TM(-Y) were straight lines, but the shape of the test marks does not have to be straight lines; for example, they may be curved or hooked.

[0107] (3-2) Second variation During the printing process, the light-emitting diode (EL) is shone onto the printing surface MS, which corresponds to the surface of the workpiece W (or the surface of the structural layer SL formed on the workpiece W). As a result, heat may be transferred from the EL to the workpiece W via the printing surface CS (and further, via the structural layer SL). When heat is transferred to the workpiece W, it may expand due to thermal stress. On the other hand, once the printing process is complete, the EL is no longer shone onto the printing surface MS, and therefore heat is no longer transferred from the EL to the workpiece W. As a result, the thermally expanded workpiece W may contract.

[0108] Considering that the workpiece W may expand and contract due to thermal expansion, the molded object (or structural layer SL or 3D structure ST) formed on the workpiece W while it is thermally expanded may shrink along with the contraction of the workpiece W. As a result, the shape accuracy of the 3D structure ST may deteriorate.

[0109] Therefore, in the second modified example, the molding system 1 controls the size of the object to be formed by additive processing based on the shape of the workpiece W during the molding period. Specifically, the measuring device 14 measures the shape of the workpiece W before the molding operation starts. As a result, the control device 15 can obtain first shape information regarding the original shape of the workpiece W (i.e., the design shape) from the measuring device 14. Alternatively, the control device 15 may obtain first shape information regarding the original shape of the workpiece W by obtaining the design data of the workpiece W. Furthermore, the measuring device 14 measures the shape of the workpiece W at a desired timing during the molding period. As a result, the control device 15 can obtain second shape information regarding the current shape of the workpiece W from the measuring device 14. Subsequently, the control device 15 determines whether the actual shape of the workpiece W differs from the original shape of the workpiece W based on the acquired first and second shape information. If it is determined that the actual shape of the workpiece W differs from the original shape of the workpiece W, it is presumed that the workpiece W is deformed (typically due to thermal expansion) by the heat transmitted from the EL light.

[0110] When the workpiece W is undergoing thermal expansion, the control device 15 controls the size of the object formed on the workpiece W based on the amount of deviation between the actual shape of the workpiece W and its original shape, while forming the object. Here, the deviation between the actual shape of the workpiece W and its original shape due to thermal expansion includes a scaling deviation, meaning that the actual shape of the workpiece W is enlarged or reduced relative to its original shape. Specifically, for example, Figure 13(a) is a plan view showing the object formed on the workpiece W when the workpiece W is not undergoing thermal expansion. On the other hand, Figure 13(b) is a plan view showing the object formed on the workpiece W when the workpiece W is undergoing thermal expansion. As shown in Figures 13(a) and 13(b), a workpiece W that is undergoing thermal expansion has an enlarged shape compared to a workpiece W that has its original shape (i.e., one that is not undergoing thermal expansion). In this case, when the workpiece W is undergoing thermal expansion, the control device 15 may form the object while controlling the size of the object formed on the workpiece W so that the size of the object formed on the workpiece W is also larger compared to when the workpiece W is not undergoing thermal expansion. For example, the control device 15 may identify correlation information that defines the relationship between the original shape of the workpiece W and the actual shape of the workpiece W, and control the size of the molded object based on this correlation information. An example of such correlation information is a matrix (for example, a scaling matrix) that defines the relationship between the coordinates in the stage coordinate system Cs that represent a certain position of the original workpiece W (for example, a workpiece W that has not undergone thermal expansion) and the coordinates in the stage coordinate system Cs that represent the same position of the actual workpiece W (for example, a workpiece W that has undergone thermal expansion).

[0111] The control device 15 may control the size of the printed object so that the difference between the ratio of the size of the printed object to the size of the workpiece W when the workpiece W is thermally expanding and the ratio of the size of the printed object to the size of the workpiece W when the workpiece W is not thermally expanding becomes small. In particular, the control device 15 may control the size of the printed object so that the ratio of the size of the printed object to the size of the workpiece W when the workpiece W is thermally expanding matches the ratio of the size of the printed object to the size of the workpiece W when the workpiece W is not thermally expanding.

[0112] According to this second modification, even if the object (or structural layer SL or 3D structure ST) formed on the workpiece W while the workpiece W is thermally expanding shrinks along with the contraction of the workpiece W, the size of the shrunk object will not deviate significantly from the size of the object formed on the workpiece W that was not thermally expanding (and therefore not contracting) in the first place (i.e., the size of the object that should have been formed). In some cases, the size of the shrunk object may even match the size of the object formed on the workpiece W that was not thermally expanding in the first place (i.e., the size of the object that should have been formed). As a result, the deterioration of the shape accuracy of the 3D structure ST is appropriately suppressed.

[0113] Furthermore, in the above explanation, the operation of measuring the current shape of workpiece W and acquiring second shape information regarding the current shape of workpiece W is performed during the printing period in which the printing operation is taking place. However, the operation of measuring the current shape of workpiece W and acquiring second shape information regarding the current shape of workpiece W may also be performed before the printing operation starts. This is because even if the printing operation has not started (i.e., the EL light is not irradiating the printing surface MS), there is a possibility that workpiece W is undergoing thermal expansion due to some factor.

[0114] The above explanation describes an example where the deviation of the actual shape of the workpiece W from its original shape is caused by heat transmitted from the light EL. However, the deviation of the actual shape of the workpiece W from its original shape may be caused by factors other than heat transmitted from the light EL. Even in this case, the control device 15 may form the object while controlling the size of the object formed on the workpiece W based on the amount of deviation of the actual shape of the workpiece W from its original shape. As a result, deterioration of the shape accuracy of the three-dimensional structure ST is suppressed.

[0115] In the above explanation, the deviation of the actual shape of the workpiece W from its original shape due to thermal expansion of the workpiece W includes a scaling deviation, where the actual shape of the workpiece W is enlarged or reduced relative to its original shape. However, the deviation of the actual shape of the workpiece W from its original shape due to thermal expansion of the workpiece W may also include a translation deviation, where the actual workpiece W is translated relative to the original workpiece W (for example, translated along the XY plane). The deviation of the actual shape of the workpiece W from its original shape due to thermal expansion of the workpiece W may also include a rotation deviation, where the actual workpiece W is rotated relative to the original workpiece W (for example, rotated around the Z axis). In this case as well, the control device 15 may form the object on the workpiece W while controlling the size of the object to be formed (or other arbitrary characteristics such as the formation position) in order to prevent deterioration of the shape accuracy of the three-dimensional structure ST (for example, reducing or matching the difference between the shape of the three-dimensional structure ST formed when a deviation occurs and the shape of the three-dimensional structure ST formed when no deviation occurs), based on the amount of deviation of the actual shape of the workpiece W from the original shape of the workpiece W.

[0116] (3-3) Third Variation Next, a third modification will be described. In the third modification, some parts of the structure of the molding system 1c differ from the structure of the molding system 1 described above. The structure of the molding system 1c in the third modification will be described below with reference to Figure 14. Note that parts of the structure that are the same as those of the molding system 1 described above are given the same reference numerals and their detailed explanation is omitted.

[0117] As shown in Figure 14, the 3D printing system 1c differs from the 3D printing system 1 described above in that it has a 3D printing head 11c instead of the 3D printing head 11. The 3D printing head 11c differs from the 3D printing head 11 described above in that, in addition to the irradiation system 111 and the material nozzle 112, it further has a material nozzle 112c. The other structures of the 3D printing system 1c may be the same as the other structures of the 3D printing system 1.

[0118] The material nozzle 112c has a supply outlet (i.e., a supply port) 114c for supplying the molding material M. The material nozzle 112c supplies (specifically, sprays) the molding material M from the supply outlet 114c. The material nozzle 112c is physically connected to a material supply device (not shown), which is the source of the molding material M, via a powder transmission member such as a pipe (not shown). The material nozzle 112c supplies the molding material M supplied from the material supply device via the powder transmission member. In Figure 14, the material nozzle 112c is depicted as a tube, but the shape of the material nozzle 112c is not limited to this shape.

[0119] The material nozzle 112c supplies the molding material M downward (i.e., towards the -Z side). Below the material nozzle 112c is the stage 13. When a workpiece W is mounted on the stage 13, the material nozzle 112c supplies the molding material M towards the workpiece W.

[0120] The material nozzle 112c is positioned relative to the irradiation system 111 so as to supply the molding material M towards the irradiation area EA where the irradiation system 111 irradiates with light EL. In other words, the material nozzle 112c and the irradiation system 111 are positioned such that the supply area MAc set on the workpiece W as the area to which the material nozzle 112c supplies the molding material M coincides with (or at least partially overlaps with) the irradiation area EA. That is, the supply area MAc set on the workpiece W as the area to which the material nozzle 112c supplies the molding material M coincides with (or at least partially overlaps with) the supply area MA set on the workpiece W as the area to which the material nozzle 112 supplies the molding material M. However, the supply area MAc set on the workpiece W as the area to which the material nozzle 112c supplies the molding material M does not have to overlap with the supply area MA set on the workpiece W as the area to which the material nozzle 112 supplies the molding material M.

[0121] In the third modification, the direction of travel of the molding material M supplied from the material nozzle 112c is different from the direction of travel of the molding material M supplied from the material nozzle 112. The direction of supply of the molding material M from the material nozzle 112c is different from the direction of supply of the molding material M from the material nozzle 112. In other words, in the third modification, the molding system 1c can supply the molding material M to the workpiece W or the upper surface 131 of the stage 13 (particularly the mark area 134 or mark member FM) from multiple different directions. In this case, for example, the molding system 1c may perform additional processing on the mark member FM while supplying the molding material M from the material nozzle 112 to form a first test mark TM on the mark member FM, and then perform additional processing on the mark member FM while supplying the molding material M from the material nozzle 112c to form a second test mark TM different from the first test mark TM on the mark member FM. Furthermore, the direction of travel of the molding material M supplied from the material nozzle 112c is inclined at a predetermined angle (for example, an acute angle) with respect to the Z axis, but it may also be directly downwards (i.e., in the direction that coincides with the Z axis).

[0122] In the above description, the 3D printing system 1c is provided with a single printing head 11c that includes an irradiation system 111 and a material nozzle 112, in addition to a material nozzle 112c. However, the 3D printing system 1c may also include a separate printing head 11c-1 equipped with a material nozzle 112c, in addition to the printing head 11 that includes the irradiation system 111 and the material nozzle 112. In this case, the head drive system 12 may move the printing head 11c-1 independently of the printing head 11.

[0123] (3-4) Fourth variation Next, we will describe the fourth modified example. In the fourth modified example, some parts of the structure of the molding system 1d differ from the structure of the molding system 1 described above. The structure of the molding system 1d in the fourth modified example will be described below with reference to Figure 15. Note that parts of the structure that are the same as those of the molding system 1 described above are given the same reference numerals and their detailed explanation is omitted.

[0124] As shown in Figure 15, the 3D printing system differs from the 3D printing system described above in that it has a printing head 11d instead of the printing head 11. The printing head 11d differs from the 3D printing system described above in that, in addition to the irradiation system 111 and material nozzle 112, it also has an irradiation system 111d. The other structures of the 3D printing system may be the same as the other structures of the 3D printing system 1.

[0125] The illumination system 111d is an optical system (e.g., a focusing optical system) for emitting electroluminescent (EL) light from the emission unit 113d. Specifically, the illumination system 111d is optically connected to a light source (not shown) that emits EL light via an optical transmission member (not shown), such as an optical fiber. The illumination system 111d emits EL light propagating from the light source via the optical transmission member. The illumination system 111d irradiates EL light downward (i.e., towards the -Z side). A stage 13 is located below the illumination system 111d. When a workpiece W is mounted on the stage 13, the illumination system 111d can irradiate EL light toward the workpiece W. Specifically, the illumination system 111d irradiates EL light toward an irradiation area EAd of a predetermined shape set on the workpiece W as the area where the EL light is irradiated (typically focused). Furthermore, the state of the irradiation system 111d can be switched between a state in which photoelectric light (EL) is irradiated onto the irradiation area EAd and a state in which photoelectric light (EL) is not irradiated onto the irradiation area EAd, under the control of the control device 15. The irradiation area EAd irradiated by the irradiation system 111d may coincide with the irradiation area EA irradiated by the irradiation system 111. The irradiation area EAd irradiated by the irradiation system 111d may at least partially overlap with the irradiation area EA irradiated by the irradiation system 111. The irradiation area EAd irradiated by the irradiation system 111d may not overlap with the irradiation area EA irradiated by the irradiation system 111.

[0126] In the fourth modification, the direction of propagation of the light EL emitted from the illumination system 111d is different from the direction of propagation of the light EL emitted from the illumination system 111. The direction of illumination of the light EL from the illumination system 111d is different from the direction of illumination of the light EL from the illumination system 111. In other words, in the fourth modification, the molding system 1d can illuminate the workpiece W or the upper surface 131 of the stage 13 (particularly the mark area 134 or the mark member FM) with light EL from multiple different directions. In this case, for example, the molding system 1d may perform additional processing on the mark member FM with the light EL emitted from the illumination system 111 to form a first test mark TM on the mark member FM, and then perform additional processing on the mark member FM with the light EL emitted from the illumination system 111d to form a second test mark TM different from the first test mark TM on the mark member FM. Furthermore, the direction of travel of the molding material M supplied from the material nozzle 112c is directly downward (i.e., in the direction coinciding with the Z-axis), but it may also be in a direction tilted by a predetermined angle (for example, an acute angle) with respect to the Z-axis.

[0127] In the above description, the 3D printing system 1d includes a single printing head 11d that includes an irradiation system 111d in addition to the irradiation system 111 and material nozzle 112. However, the 3D printing system 1d may also include a separate printing head 11d-1 that includes an irradiation system 111d, in addition to the printing head 11 that includes the irradiation system 111 and material nozzle 112. In this case, the head drive system 12 may move the printing head 11d-1 independently of the printing head 11.

[0128] Furthermore, in the fourth modified example, similar to the third modified example, the build head 11d may also be equipped with a material nozzle 112c. In this case, the material nozzle 112 may supply the build material M to the irradiation area EA irradiated by the irradiation system 111 with light-emitting diodes (EL), and the material nozzle 112c may supply the build material M to the irradiation area EAd irradiated by the irradiation system 111d with light-emitting diodes (EL). Alternatively, the build system 1d may include a build head 11d-2 equipped with an irradiation system 111d and a material nozzle 112c, separate from the build head 11 equipped with the irradiation system 111 and the material nozzle 112.

[0129] (3-5) Other variations In the above description, the mark member FM is placed in the mark area 134. However, the mark member FM does not have to be placed in the mark area 134. In this case, the molding system 1 may form a test mark TM in the mark area 134 instead of the mark member FM.

[0130] In the above description, the molding system 1 forms a test mark TM on a mark member FM located in the mark area 134. However, the molding system 1 may form a test mark TM on a mark member FM located in a different area from the mark area 134. For example, the molding system 1 may form a test mark TM on a mark member FM located at any position in the non-holding area 133 of the stage 13. The molding system 1 may form a test mark TM on a mark member FM located at any position in the holding area 132 of the stage 13. The molding system 1 may form a test mark TM on a mark member FM located at any position on the workpiece W held by the stage 13.

[0131] In the above description, the molding system 1 forms a test mark TM on a mark member FM. However, the molding system 1 may form the test mark TM on a member other than the mark member FM. For example, the molding system 1 may form the test mark TM at any position in the non-holding area 133 of the stage 13. For example, the molding system 1 may form the test mark TM at any position in the holding area 132 of the stage 13. The molding system 1 may form the test mark TM at any position on the workpiece W held by the stage 13. When forming a test mark TM on a workpiece W held by the stage 13, the position where the test mark TM is formed may be different from the area where the molded object is formed.

[0132] In the above description, during the initial setup operation, multiple mark members FM are placed in multiple mark regions 134. However, it is not necessary for mark members FM to be placed in some of the multiple mark regions 134, while mark members FM are not placed in the remaining parts of the multiple mark regions 134. For example, it is not necessary for mark members FM to be placed in the number of mark regions 134 necessary to calculate the transformation matrix T, while mark members FM are not placed in the remaining parts of the multiple mark regions 134. In the example above, in order to calculate the transformation matrix T, test marks TM are formed on each of the at least three mark members FM placed in at least three mark regions 134. In this case, if there are four or more mark regions 134 set in stage 13, for example, at least three mark members FM may be placed in three mark regions 134, while mark members FM are not placed in one or more of the remaining mark regions 134.

[0133] In the above description, the molding system 1 performs a positioning operation before starting the molding operation to perform additional processing on the workpiece W. However, the molding system 1 may perform a positioning operation at other times. For example, the molding system 1 may perform a positioning operation (in particular, an initial setup operation) in preparation for the next molding operation after completing the molding operation (i.e., after forming the three-dimensional structure ST). For example, the molding system 1 may temporarily interrupt the molding operation in the middle of it and then perform a positioning operation. In this case, the molding system 1 resumes the interrupted molding operation after the positioning operation is completed. As an example, the molding system 1 may temporarily interrupt the molding operation each time a structural layer SL is formed, before forming the next structural layer SL, and then perform a positioning operation.

[0134] In the above description, the head movement operation is an operation to move the build head 11 to the build start position Ch_start. However, the head movement operation may also include an operation to move the build head 11 to any position Ch_any within the head coordinate system Ch. The control device 15 may move the build head 11 to any position Ch_any within the head coordinate system Ch by performing the same operation as when moving the build head 11 to the build start position Ch_start. In other words, the control device 15 may identify an arbitrary position Cs_any within the stage coordinate system Cs instead of the build start position Cs_start described above, and move the build head 11 to the position Ch_any corresponding to position Cs_any in the head coordinate system Ch based on the position Cstm of the test mark, the position Chfm of the build head 11, and the position Cs_any.

[0135] In the above description, the printing system 1 includes a head drive system 12 for moving the printing head 11. However, the printing system 1 may also include a stage drive system for moving the stage 13 in addition to or instead of the head drive system 12. The stage drive system may move the stage 13 in at least one of the following directions: X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. The movement of the stage 13 by the stage drive system changes the relative positional relationship between the stage 13 and the printing head 11 (i.e., the relative positional relationship between the workpiece W and the irradiation area EA), similar to the movement of the printing head 11 by the head drive system 12.

[0136] In the above description, the printing system 1 moves the illumination area EA relative to the printing surface MS by moving the printing head 11. However, the printing system 1 may move the illumination area EA relative to the printing surface MS by deflecting the light EL in addition to or instead of moving the printing head 11. In this case, the illumination system 111 may include, for example, an optical system (e.g., a galvanometer mirror) capable of deflecting the light EL.

[0137] In the above description, the alignment operation is the operation of moving the build head 11 relative to the workpiece W (i.e., relative to the stage 13) to align the workpiece W with the build head 11. The purpose of aligning the workpiece W with the build head 11 is to set the irradiation area EA at a desired position on the workpiece W (for example, the build start position Cs_start) by changing the position of the irradiation area EA by moving the build head 11. In this case, the alignment operation is essentially equivalent to the operation of moving the irradiation area EA relative to the workpiece W (i.e., relative to the stage 13) in order to align the workpiece W with the irradiation area EA. In this case, the build system 1 may move the irradiation area EA relative to the workpiece W (i.e., relative to the stage 13) by moving the stage 13 using the stage drive system described above, in addition to or instead of moving the build head 11 using the head drive system 12 in order to perform the alignment operation. For example, the printing system 1 may move the stage 13 within the stage coordinate system Cs so that the illumination area EA is set to a desired position within the stage coordinate system Cs, either while keeping the position of the printing head 11 fixed or in conjunction with the movement of the printing head 11. Alternatively, in addition to or instead of moving at least one of the printing head 11 and the stage 13 to perform the alignment operation, the printing system 1 may move the illumination area EA relative to the workpiece W (i.e., relative to the stage 13) by using an optical system capable of deflecting the light EL (e.g., a galvanometer mirror, etc.) as described above. For example, the printing system 1 may move the illumination area EA within the head coordinate system Ch so that the illumination area EA is set to a desired position within the stage coordinate system Cs (see Figure 7), either while keeping the position of the printing head 11 fixed or in conjunction with the movement of the printing head 11. In any case, the above-described alignment operation makes it possible to set the illumination area EA at a desired position on the workpiece W (e.g., the printing start position Cs_start).

[0138] In the above description, the fabrication system 1 melts the fabrication material M by irradiating it with light (EL). However, the fabrication system 1 may also melt the fabrication material M by irradiating it with any energy beam. In this case, the fabrication system 1 may be equipped with a beam irradiation device capable of irradiating any energy beam in addition to or instead of the irradiation system 111. Any energy beam is not limited to but includes charged particle beams such as electron beams and ion beams or electromagnetic waves.

[0139] As described above, the fabrication system 1 is capable of forming a three-dimensional structure ST by laser cladding welding. However, the fabrication system 1 may also form the three-dimensional structure ST from the fabrication material M by other methods capable of forming the three-dimensional structure ST. Other methods include, for example, powder bed fusion methods such as Selective Laser Sintering (SLS), binder jetting, or laser metal fusion (LMF).

[0140] In the above description, the molding system 1 forms a three-dimensional structure ST by supplying molding material M from the material nozzle 112 to the irradiation area EA where the irradiation system 111 irradiates with light EL. However, the molding system 1 may also form the three-dimensional structure ST by supplying molding material M from the material nozzle 112 without irradiating with light EL from the irradiation system 111. For example, the molding system 1 may form the three-dimensional structure ST by blowing the molding material M onto the molding surface MS from the material nozzle 112, thereby melting the molding material M on the molding surface MS and solidifying the molten molding material M. For example, the molding system 1 may form the three-dimensional structure ST by blowing a gas containing the molding material M onto the molding surface MS from the material nozzle 112 at ultra-high speed, thereby melting the molding material M on the molding surface MS and solidifying the molten molding material M. For example, the molding system 1 may form a three-dimensional structure ST by blowing heated molding material M onto the molding surface MS from a material nozzle 112, thereby melting the molding material M on the molding surface MS and solidifying the molten molding material M. In this case, when forming a three-dimensional structure ST without irradiating with light EL from an irradiation system 111, the molding system 1 (especially the molding head 11) does not need to be equipped with an irradiation system 111.

[0141] In the above description, the molding system 1 is capable of additive processing. However, the molding system 1 may also be capable of subtractive processing. In this case, the test mark TM may be formed by subtractive processing.

[0142] (4) Note The following additional information is disclosed regarding the embodiments described above. [Note 1] A support device capable of supporting the workpiece, A processing apparatus that irradiates a workpiece region on the workpiece with an energy beam and performs processing, A position changing device that changes the relative positional relationship between the support device and the energy beam irradiation area, A control device that controls the position change device based on reference position information formed by processing at least one of the support device and the workpiece using the processing apparatus. A processing system equipped with the following features. [Note 2] The device further comprises a measuring device capable of measuring the relative positional relationship between the workpiece and the reference. The processing system described in Appendix 1. [Note 3] The device further comprises a measuring device capable of measuring the relative positional relationship between a part of the workpiece and a reference formed at a location different from the part. The processing system described in Appendix 1 or 2. [Note 4] The control device controls the processing device so that a first reference extending in a first direction and a second reference extending in a second direction intersecting the first direction are formed on at least one of the support device and the workpiece. A processing system as described in any one of the items 1 to 3 of the appendix. [Note 5] The control device calculates the positional relationship between the irradiation area and the reference, and uses the calculation result to control the position changing device. A processing system as described in any one of the items 1 to 4 of the appendix. [Note 6] A support device capable of supporting the workpiece, A processing apparatus that irradiates a workpiece region on the workpiece with an energy beam and supplies material to the region irradiated with the energy beam to perform additional processing, A position changing device that changes the positional relationship between the support device and the irradiation area of ​​the energy beam from the processing device. Equipped with, A standard molded object is formed by performing additional processing on at least one of the first region, which is part of the support device, and the second region, which is part of the workpiece. The processing apparatus and the position changing apparatus are controlled using information about the standard molded object. Processing system. [Note 7] Using the information relating to the aforementioned standard molded object, the position change device is controlled so that additional processing is performed on a desired portion of the object to be processed. The processing system described in Appendix 6. [Note 8] Using the information relating to the aforementioned reference molded object, the position change device is controlled so that additional processing begins from a desired portion of the workpiece. The processing system described in Appendix 6 or 7. [Note 9] Before the processing apparatus begins additional processing on the workpiece, the processing apparatus and the position changing device are controlled to perform additional processing on at least one of the first region and the second region to form the standard molded object. After forming the reference molded object, the position change device is controlled using the information relating to the reference molded object. After controlling the position change device using the information relating to the reference molded object, the processing device is controlled to start additional processing on the workpiece. A processing system as described in any one of the items 6 to 8 of the appendix. [Note 10] Before the processing apparatus begins additional processing on the workpiece, the processing apparatus and the position changing device are controlled to perform additional processing on at least one of the first region and the second region to form the standard molded object. After forming the reference molded object, the position change device is controlled using the information relating to the reference molded object so that the irradiation area is set to the starting portion of the workpiece where additional processing should begin. After the irradiation area is set at the processing start portion, the processing device is controlled to start additional processing on the workpiece. A processing system as described in any one of the items 6 to 9 of the appendix. [Note 11] The position changing device is controlled so that the irradiation area moves relative to the support device in a direction calculated based on the information relating to the reference object, using the position of the irradiation area relative to the support device when the reference object is formed in at least one of the first and second regions as a starting point. A processing system as described in any one of the appendices 6 to 10. [Note 12] The position changing device is controlled such that the position of the irradiation area relative to the support device is changed by a distance calculated based on the information relating to the reference object, using the position of the irradiation area relative to the support device as a starting point when the reference object is formed in at least one of the first and second regions. A processing system as described in any one of the items 6 to 11 of the appendices. [Note 13] The position changing device moves the processing device relative to the support device to change the positional relationship between the support device and the irradiation area. A processing system as described in any one of the appendices 6 to 12. [Note 14] Before the processing apparatus begins additional processing on the workpiece, the processing apparatus and the position changing device are controlled to perform additional processing on at least one of the first region and the second region to form the standard molded object. After forming the reference molded object, the position change device is controlled using the information relating to the reference molded object so that the processing device is positioned at a processing start position where additional processing can be performed on the processing start portion of the workpiece to be processed. After the processing device is positioned at the processing start position, the processing device is controlled to start additional processing on the workpiece. The processing system described in Appendix 13. [Note 15] The position change device is controlled so that the processing device moves relative to the support device in a direction of movement calculated based on the information relating to the reference object, using the position of the processing device relative to the support device when the reference object is formed in at least one of the first and second regions as a starting point. The processing system described in Appendix 13 or 14. [Note 16] The position changing device is controlled such that, starting from the position of the processing device relative to the support device when the reference molded object is formed in at least one of the first and second regions, the position of the processing device relative to the support device is changed by a distance calculated based on the information relating to the reference molded object. A processing system as described in any one of the appendices 13 to 15. [Note 17] The information relating to the standard molded object includes information relating to the state of the standard molded object. A processing system as described in any one of the appendices 6 to 16. [Note 18] The information relating to the aforementioned reference molded object includes first positional information relating to the relative positional relationship between the workpiece and the reference molded object. A processing system as described in any one of the appendices 6 to 17. [Note 19] The first position information includes information regarding the relative positional relationship between the starting portion of the workpiece to be processed and the reference molded object. The processing system described in Appendix 18. [Note 20] The first position information includes information relating to at least one of the following: the relative position of the workpiece and the reference molded object along a first direction; the relative position of the workpiece and the reference molded object along a second direction intersecting the first direction; and the relative position of the workpiece and the reference molded object along a third direction intersecting the first and second directions. The processing system described in Appendix 18 or 19. [Note 21] In addition to the information relating to the reference molded object, the position change device is controlled using second position information relating to the relative positional relationship between the support device and the processing device when the reference molded object is formed in at least one of the first and second regions. A processing system as described in any one of the items 6 to 20 of the appendix. [Note 22] The processing device and the position-changing device are controlled to perform additional processing on the first region while changing the positional relationship between the support device and the processing device along the fourth direction, thereby forming the first molded object as the reference molded object. A processing system as described in any one of the items 6 to 21 of the appendix. [Note 23] The information relating to the standard molded object includes first information relating to the first molded object. The processing system described in Appendix 22. [Note 24] When the processing device starts additional processing on the workpiece while moving along the fourth direction relative to the support device, the position change device is controlled using the first information. The processing system described in Appendix 23. [Note 25] Using the first information, the position change device is controlled so that the processing device is positioned at a processing start position where additional processing can be performed on the processing start portion of the workpiece to be processed, and then the processing device is controlled to start additional processing on the workpiece while the processing device moves along the fourth direction relative to the support device. The processing system described in Appendix 23 or 24. [Note 26] The processing device and the position change device are controlled so that the processing device moves along a fifth direction different from the fourth direction relative to the support device, and additional processing is performed on at least one of the first and second regions to form the second molded object as the reference molded object. A processing system as described in any one of the appendices 22 to 25. [Note 27] The information relating to the standard molded object includes the second information relating to the second molded object. The processing system described in Appendix 26. [Note 28] When the processing device starts additional processing on the workpiece while moving along the fifth direction relative to the support device, the position change device is controlled using the second information. The processing system described in Appendix 27. [Note 29] Using the second information, the position change device is controlled so that the processing device is positioned at a processing start position where additional processing can be performed on the processing start portion of the workpiece to be processed, and then the processing device is controlled to start additional processing on the workpiece while the processing device moves along the fifth direction relative to the support device. The processing system described in Appendix 27 or 28. [Note 30] The fifth direction is the opposite direction to the fourth direction. A processing system as described in any one of the items 26 to 29 of the appendix. [Note 31] The processing device and the position change device are controlled so that the processing device moves along a sixth direction different from the fourth direction relative to the support device, and additional processing is performed on at least one of the first and second regions to form the third molded object as the reference molded object. A processing system as described in any one of the appendices 22 to 30. [Note 32] The information relating to the standard molded object includes the third information relating to the third molded object. The processing system described in Appendix 31. [Note 33] When the processing device starts additional processing on the workpiece while moving along the sixth direction relative to the support device, the position change device is controlled using the third information. The processing system described in Appendix 32. [Note 34] Using the third information, the position change device is controlled so that the processing device is positioned at a processing start position where additional processing can be performed on the processing start portion of the workpiece in which additional processing should be started, and then the processing device is controlled to start additional processing on the workpiece while the processing device moves along the sixth direction relative to the support device. The processing system described in Appendix 32 or 33. [Note 35] The sixth direction is a direction that intersects the fourth direction. A processing system as described in any one of the appendices 32 to 34. [Note 36] The processing device and the position change device are controlled so that the processing device moves along a seventh direction different from the fourth and sixth directions relative to the support device, and additional processing is performed on at least one of the first and second regions to form the fourth molded object as the reference molded object. A processing system as described in any one of the appendices 32 to 35. [Note 37] The information relating to the aforementioned standard molded object includes the fourth information relating to the fourth molded object. The processing system described in Appendix 36. [Note 38] When the processing device starts additional processing on the workpiece while moving along the seventh direction relative to the support device, the position changing device is controlled using the fourth information. The processing system described in Appendix 37. [Note 39] Using the fourth information, the position change device is controlled so that the processing device is positioned at a processing start position where additional processing can be performed on the processing start portion of the workpiece to be processed, and then the processing device is controlled to start additional processing on the workpiece while the processing device moves along the seventh direction relative to the support device. The processing system described in Appendix 37 or 38. [Note 40] The seventh direction is a direction that intersects the fourth direction and is opposite to the sixth direction. A processing system as described in any one of the items 37 to 39 of the appendix. [Note 41] Information regarding the aforementioned standard molded object is measured by a measuring device. A processing system as described in any one of the items 6 to 40 of the appendix. [Note 42] The aforementioned measuring device further comprises The processing system described in Appendix 41. [Note 43] The measuring device is capable of measuring the relative positional relationship between the workpiece and the reference molded object. The processing system described in Appendix 41 or 42. [Note 44] The processing apparatus and the position changing apparatus are controlled to perform additional processing on a first portion of at least one of the first region and the second region to form the fifth molded object as the reference molded object, to perform additional processing on a second portion of at least one of the first region and the second region that is different from the first portion to form the sixth molded object as the reference molded object, and to perform additional processing on a third portion of at least one of the first region and the second region that is different from the first and second portions to form the seventh molded object as the reference molded object. The information relating to the standard molded object includes the fifth information relating to the fifth molded object to the seventh molded object, Using the fifth piece of information, a first coordinate system representing the position of the processing device is associated with a second coordinate system representing the relative positional relationship between the workpiece and the reference molded object as measured by the measuring device. The processing system described in Appendix 43. [Note 45] At least one height of the first to third parts is different from at least one other height of the first to third parts. The processing system described in Appendix 44. [Note 46] Between at least two of the first to third portions, a support region of the support device capable of supporting the workpiece is positioned. The processing system described in Appendix 44 or 45. [Note 47] Based on the deviation information relating to the difference between the actual shape of the workpiece and the designed shape of the workpiece, control at least one of the processing apparatus and the position changing apparatus. A processing system as described in any one of the items 6 to 46 of the appendix. [Note 48] Based on the displacement information, control at least one of the processing apparatus and the position changing apparatus so that an additional molded object of a desired shape is added to a desired portion of the workpiece by the additional processing. The processing system described in Appendix 47. [Note 49] Based on the displacement information, control at least one of the processing apparatus and the position changing apparatus so that the shape of the add-on increases as the actual shape of the workpiece increases compared to the design shape of the workpiece. The processing system described in Appendix 48. [Note 50] The information relating to the standard molded object includes dimensional information relating to the dimensions of the standard molded object. A processing system as described in any one of the items 6 to 49 of the appendix. [Note 51] The information relating to the standard molded object includes shape information relating to the shape of the standard molded object. A processing system as described in any one of the appendices 6 to 50. [Note 52] While supplying the material from the eighth direction to the region irradiated by the energy beam, additional processing is performed on at least one of the first region and the second region to form the eighth structure as the reference structure. The ninth fabricated object, which serves as the reference fabricated object, is formed by supplying the material from a ninth direction different from the eighth direction to the region irradiated by the energy beam, and performing additional processing on at least one of the first and second regions. A processing system as described in any one of the items 6 to 51 of the appendix. [Note 53] The processing apparatus comprises a first supply port for supplying the material and a second supply port for supplying the material. While supplying the material from the first supply port to the region irradiated with the energy beam, additional processing is performed on at least one of the first region and the second region to form the eighth molded object as the reference molded object. While supplying material from the second supply port to the region irradiated by the energy beam, additional processing is performed on at least one of the first and second regions to form the ninth molded object, which serves as the reference molded object. A processing system as described in any one of the appendices 6 to 52. [Note 54] While irradiating the workpiece with the energy beam from the tenth direction, additional processing is performed on at least one of the first region and the second region to form the tenth fabricated object as the reference fabricated object. The 11th fabricated object, which serves as the reference fabricated object, is formed by irradiating the workpiece with the energy beam from an 11th direction different from the 10th direction, and performing additional processing on at least one of the first and second regions. A processing system as described in any one of the items 6 to 53 of the appendix. [Note 55] A processing method that performs additional processing on a workpiece by irradiating it with an energy beam from a processing device, The aforementioned workpiece is supported by a support device, The process involves performing additional processing on at least one of the first region, which is part of the support device, and the second region, which is part of the workpiece, to form a standard molded object. To measure the aforementioned standard molded object, Based on the measured information regarding the reference molded object, the positional relationship between the support device and the irradiation area of ​​the energy beam from the processing device is changed. A processing method that includes this. [Note 56] A processing method for performing additional processing on the workpiece using a processing system described in any one of the appendices 1 to 55. [Note 57] A support device capable of supporting the workpiece, A processing apparatus that irradiates a workpiece region on the workpiece with an energy beam and supplies material to the region irradiated with the energy beam to perform additional processing, A position changing device that changes the positional relationship between the support device and the irradiation area of ​​the energy beam from the processing device, A receiving device that controls at least one of the support device, the processing device, and the position changing device to perform additional processing on at least one of the first region, which is part of the support device, and the second region, which is part of the workpiece, in order to form a reference molded object, and receives a control signal that controls at least one of the processing device and the position changing device using information about the reference molded object. A processing system equipped with the following features. [Note 58] A computer program to be executed by a computer that controls a molding system comprising: a support device capable of supporting a workpiece; a processing device that irradiates a workpiece area with an energy beam and supplies material to the area irradiated by the energy beam to perform additional processing; and a position changing device that changes the positional relationship between the support device and the area irradiated by the energy beam from the processing device, A computer program that causes the computer to perform a process of forming a standard molded object by performing additional processing on at least one of a first region which is part of the support device and a second region which is part of the workpiece, and a process of controlling at least one of the processing device and the position changing device using information about the standard molded object. [Note 59] A recording medium on which the computer program described in Appendix 58 is stored. [Note 60] A control device for controlling a molding system comprising: a support device capable of supporting a workpiece; a processing device that irradiates a workpiece area with an energy beam and supplies material to the area irradiated by the energy beam to perform additional processing; and a position changing device that changes the positional relationship between the support device and the area irradiated by the energy beam from the processing device, A control device that performs additional processing on at least one of a first region which is part of the support device and a second region which is part of the workpiece to form a reference molded object, and performs processing to control at least one of the processing device and the position changing device using information about the reference molded object.

[0143] At least some of the constituent elements of each embodiment described above can be appropriately combined with at least some other constituent elements of each embodiment described above. Some of the constituent elements of each embodiment described above may not be used. Furthermore, to the extent permitted by law, all of the published patents and U.S. patent disclosures cited in each embodiment described above shall be incorporated into the text.

[0144] The present invention is not limited to the embodiments described above, and can be modified as appropriate without contradicting the gist or idea of ​​the invention as can be read from the claims and specification as a whole. Processing systems and processing methods involving such modifications are also included within the technical scope of the present invention. [Explanation of Symbols]

[0145] 1. Molding System 11 Modeling Head 111 Irradiation system 112 Material Nozzle 13 stages 131 Top surface 132 Holding area 133 Non-retention area 134 Mark Area 14 Measuring devices Double job M Build material LS structure layer ST 3D structure FM mark component TM Test Mark

Claims

1. A processing method that involves irradiating a workpiece area on a workpiece with an energy beam using a processing device, Supporting the workpiece with a support device, To form a reference on a member that is different from the support device and the workpiece and is placed on the support device, by irradiating the energy beam with the processing device, To measure the reference position formed on the member, To measure the shape of the workpiece placed on the support device, Using information regarding the position of the support device, the measurement result of the reference position, and the measurement result of the shape of the workpiece, the workpiece is processed. A processing method that includes this.

2. In the processing method described in claim 1, Forming the aforementioned criteria includes forming the aforementioned criteria on the first member and on a second member that is different from the first member, Measuring the aforementioned reference position includes measuring the reference position formed on the first member and the reference position formed on the second member.

3. In the processing method described in claim 2, Supporting the workpiece includes supporting the workpiece with a support surface, The first member and the second member are provided at different positions in the direction along the support surface.

4. In the processing method described in claim 2 or 3, Supporting the workpiece includes supporting the workpiece with a support surface, The support surface is located between the line segment connecting the position of the first member and the position of the second member.

5. In the processing method described in claim 2 or 3, Forming the aforementioned criteria includes forming the criteria on a third member that is different from the first and second members, Measuring the aforementioned reference position includes measuring the reference position formed on the first member, the reference position formed on the second member, and the reference position formed on the third member.

6. In the processing method described in claim 5, Supporting the workpiece includes supporting the workpiece with a support surface, The first, second, and third members are arranged to surround the support surface.

7. In the processing method described in claim 5, Supporting the workpiece includes supporting the workpiece with a support surface, At least a portion of the support surface is located within the region enclosed by a first line segment connecting the position of the first member and the position of the second member, a second line segment connecting the position of the second member and the position of the third member, and a third line segment connecting the position of the third member and the position of the first member.

8. In the processing method according to claim 1 or 2, Supporting the workpiece includes chucking the workpiece using the support device.

9. In the processing method according to claim 1 or 2, Measuring the shape of the workpiece includes measuring the surface of the workpiece.

10. In the processing method according to claim 1 or 2, Processing the workpiece includes aligning the workpiece with the area on the workpiece that is irradiated with an energy beam, based on the measurement results.

11. In the processing method according to claim 1 or 2, The process of processing the workpiece includes forming a three-dimensional structure on the workpiece based on three-dimensional model data of the three-dimensional structure to be formed.

12. In the processing method described in claim 11, Forming the three-dimensional structure includes forming the three-dimensional structure using measurement data from a three-dimensional shape measuring machine.

13. In the processing method described in claim 12, The aforementioned three-dimensional shape measuring machine includes a non-contact type three-dimensional measuring machine.

14. In the processing method of claim 11, Processing the workpiece includes moving the area on the workpiece to which the energy beam is irradiated, based on the three-dimensional model data.

15. In the processing method of claim 14, Processing the object to be processed includes moving the area irradiated by the energy beam along a movement trajectory.

16. In the processing method according to claim 1 or 2, The method further includes placing the member on the support device.

17. In the processing method described in claim 16, The method further includes measuring the reference position formed on the member, and then removing the member from the support device.

18. In the processing method according to claim 1 or 2, The aforementioned processing includes irradiating the workpiece with an energy beam.

19. In the processing method described in claim 18, The aforementioned processing includes moving the irradiation position of the energy beam on the workpiece using a galvanometer mirror.

20. In the processing method described in claim 19, The aforementioned processing includes irradiating the workpiece with multiple energy beams from different directions.

21. In the processing method described in claim 18, The aforementioned processing includes forming a three-dimensional structure using a powder bed fusion method.

22. In the processing method according to claim 1 or 2, The object to be processed includes an existing structure, The aforementioned processing includes forming a three-dimensional structure that is integrated with the existing structure.

23. In the processing method described in claim 1 or 2 The aforementioned processing apparatus is a PBF-type additive processing apparatus. Processing method.

24. A computer program that causes a computer to execute the processing method according to claim 1 or 2.

25. A recording medium on which the computer program described in claim 24 is recorded.

26. A machining system that performs machining by irradiating a workpiece area on the workpiece with an energy beam, A support device for supporting the workpiece, A processing device that irradiates the energy beam onto the support device and the workpiece, respectively, a member different from the support device and placed on the support device, and the workpiece area. A measuring device for measuring a reference position formed on the member by the energy beam irradiated from the processing apparatus, A control device that controls the processing apparatus and processes the workpiece using information regarding the position of the support device, the measurement result of the reference position, and the measurement result of the shape of the workpiece placed on the support device. A processing system equipped with the following features.

27. In the processing system described in claim 26, The system includes a chamber that houses the measuring device and the processing device.

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